AS1117

800mA Low Dropout Regulator

SCSI-II Active Terminator

FEATURES APPLICATIONS
• Guaranteed 800mA Output • SCSI-II Active Terminator
• Three Terminal Adjustable Or Fixed 1.5V, 2.5V, 3V, 3.3V & 5V • Portable/ Palm Top / Notebook Computers
• Very Low Quiescent Current • Battery Chargers
• Low Dropout Voltage Of 1.2 Volts At Full Load • Disk Drives
• Extremely Tight Load And Line Regulation • Portable Consumer Equipment
• Very Low Temperature Coefficient • Portable Instrumentation
• Logic-Controlled Electronic Shutdown • SMPS Post-Regulator
• Internal Overcurrent Limiting & Thermal Overload Protection
• Surface Mount Package SOT-223, TO-252, TO-220, SOT-89, TO-263, & SO-8

PRODUCT DESCRIPTION
The AS1117 is a low power positive-voltage regulator designed to meet 800mA output current and comply with SCSI-II specifications
with a fixed output voltage of 2.85V. This device is an excellent choice for use in battery-powered applications, as active terminators
for the SCSI bus, and portable computers. The AS1117 features very low quiescent current and very low dropout voltage of 1.2V at a
full load and lower as output current decreases. AS1117 is available as an adjustable or fixed 1.5V, 2.5V, 3.0V, 3.3V, and 5.0V output
voltages.

The AS1117 is offered in a 3-pin surface mount package SOT-223, TO-252, TO-220 and TO-263. The output capacitor of 10µF or
larger is needed for output stability of AS1117 as required by most of the other regulator circuits.

ORDERING INFORMATION
TO-220 TO-263 SOT-223 PLASTIC TO-252 Oper. Temp.
3-PIN 3-PIN 3-PIN SOIC 8 PIN DPAK Range
AS1117U AS1117T AS1117M3 AS1117S AS1117R -40°C to +85°C
AS1117U-X AS1117T-X AS1117M3-X AS1117S-X AS1117R-X -40°C to +85°C
X= Output Voltage (X = 1.5V, 2.5V, 3.0V, 3.3V, 5.0, or Blank for Adjustable)
PIN CONNECTIONS
8-Pin Surface Mount (S) TO-220-3 (U) SOT-223 (M3) TO-263-3 (T) TO-252 (R)

GND 1 8 VIN
AS1117 AS1117
N/C 2 7 VIN AS1117
AS1117 AS1117 1 2 3 1 2 3
VOUT 3 6 VIN 1 2 3
1 2 3
VOUT 4 5 N/C ADJ/GND VOUT V
IN
ADJ/GND V
Top View OUT VIN

Top View ADJ/GND V

OUT VIN

Top View Front View

ADJ/GND VOUT V
IN

Front View

Rev. 10/6/00
 AS1117
ABSOLUTE MAXIMUM RATINGS
Power Dissipation..........................................Internally Limited Input Supply Voltage ......................................-20V to +20V
Lead Temp. (Soldering, 5 Seconds) ................................ 260°C ESD Rating ............................................................2KV Min
Storage Temperature Range ............................ -65° to +150°C
Operating Junction Temperature Range
AS1117 .................................................. -40C° to +125°C

ELECTRICAL CHARACTERISTICS at VIN = VOUT +1, Ta=25°C, CL =3.3µf, unless otherwise specified. Limits in
Boldface apply over the full operating temperature range.
AS1117
Parameter Conditions Typ Min Max Units
1.5V Version
Output Voltage IOUT = 10mA, VIN = 4.85V 1.500 1.485 1.515 V
0≤IOUT≤800mA, 4.25≤VIN≤10V 1.470 1.530
2.5V Version
Output Voltage IOUT = 10mA, VIN = 4.85V 2.500 2.475 2.525 V
0≤IOUT≤800mA, 4.25≤VIN≤10V 2.450 2.550
3.0V Version
Output Voltage IOUT = 10mA, VIN = 4.85V 3.000 2.970 3.030 V
0≤IOUT≤800mA, 4.75≤VIN≤10V 2.940 3.060
3.3V Version
Output Voltage IOUT = 10mA, VIN = 5.0V 3.300 3.267 3.333 V
0≤IOUT≤800mA, 4.75≤VIN≤10V 3.234 3.366
5.0V Version
Output Voltage IOUT = 10mA, VIN = 7.0V 5.000 4.950 5.050 V
0≤IOUT≤800mA, 6.50≤VIN≤12V 4.900 5.100
All Output Options
Reference Voltage IOUT = 10mA, (VIN – VOUT) = 2V 1.250 1.238 1.262 V
10≤ IOUT≤800mA, 1.4≤(VIN -VIN) ≤10V 1.225 1.270
Output Voltage (Note 1) 0.05 %
Temperature Stability
Line Regulation 4.50V ≤VIN≤12V, VOUT = 3.00, IOUT = 0 1.00 7.00 mV
4.80V ≤VIN≤12V, VOUT = 3.30, IOUT = 0 1.00 7.00
6.50V ≤VIN≤15V, VOUT = 5.00, IOUT = 0 1.00 10.00
Load Regulation 0≤IOUT≤800mA, VIN = 4.50V, VOUT = 3.00 1.00 12.00 mV
0≤IOUT≤800mA, VIN = 4.80V, VOUT = 3.30 1.00 12.00
0≤IOUT≤800mA, VIN = 6.50V, VOUT = 5.00 1.00 15.00
Dropout Voltage IL = 100mA 1.00 1.10 V
( Note 2) IL = 500mA 1.05 1.15
IL = 800mA 1.10 1.20
Quiescent Current 4.25V ≤VIN≤6.5V 5.00 10.00 mA
Current Limit (VIN-VOUT) = 5V 1000 1200 mA
Thermal Regulation 25°C,30mS Pulse 0.01 0.1 %/W
Ripple Rejection fRIPPLE = 120Hz, (Vin-VOUT) = 3V, 60 75 dB
VRIPPLE = 1Vp-p
Long Term Stability 125°C, 1000Hrs 0.03 %
RMS Output Noise % of Vout, 10Hz≤f≤10kHz 0.003 %
Thermal Resistance Junction to case, at tab 15 °C/W°
Note 1: Output temperature coefficient is defined as the worst case voltage change divided by the total temperature range
Note 2: Dropout voltage is defined as the input to output differential at which the output voltage drops 100mV below its nominal value measured at 1V differential at very low values of
programmed output voltage, the minimum input supply voltage of 2V ( 2.3V over temperature) must be taken into account.
Note 3: Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied. excluding load or line regulation effect.

Rev. 10/6/00
 AS1117
APPLICATION NOTES EXTERNAL Maximum Junction Temperature range:
CAPACITOR
To ensure the stability of the AS1117 an output capacitor of TJ = Tambient (max) + PD* thermal resistance (Junction-to-
ambient)
at least 10µF (tantalum)or 50µF (aluminum) is required. The
value may change based on the application requirements on Maximum Junction temperature must not exceed the 125°C.
the output load or temperature range. The capacitor
equivalent series resistance (ESR) will effect the AS1117
stability. The value of ESR can vary from the type of
50 X 50 mm
capacitor used in the applications. The recommended value
for ESR is 0.5Ω. The output capacitance could increase in
size to above the minimum value. The larger value of output
capacitance as high as 100µF can improve the load transient 35 X 17 mm
response.

SOLDERING METHODS
The AS1117 SOT-223 package is designed to be compatible
16 X 10 mm
with infrared reflow or vapor-phase reflow soldering
techniques. During soldering the non-active or mildly active
fluxes may be used. The AS1117 die is attached to the
heatsink lead which exits opposite the input, output, and
ground pins.
Hand soldering and wave soldering should be avoided since Fig. 1. Substrate Layout for SOT-223
these methods can cause damage to the device with excessive
thermal gradients on the package. The SOT-223
recommended soldering method are as follows: vapor phase
reflow and infrared reflow with the component preheated to
within 65°C of the soldering temperature range.

THERMAL CHARACTERISTICS
The thermal resistance of AS1117 is 15°C/W from junction
to tab and 31 °C/W from tab to ambient for a total of 46
°C/W from junction to ambient. The AS1117 features the
internal thermal limiting to protect the device during
overload conditions. Special care needs to be taken during
continuos load conditions the maximum junction temperature
does not exceed 125 °C.
Taking the FR-4 printed circuit board and 1/16 thick with 1
ounce copper foil as an experiment (fig.1 & fig.2), the PCB
material is effective at transmitting heat with the tab attached
to the pad area and a ground plane layer on the backside of
the substrate. Refer to table 1 for the results of the
experiment.
The thermal interaction from other components in the
application can effect the thermal resistance of the AS1117.
The actual thermal resistance can be determined with
experimentation. AS1117 power dissipation is calculated as
follows:
PD = (VIN - VOUT)(IOUT)

Rev. 10/6/00
 AS1117
Table 1.
TOTAL PC BOARD AREA TOPDIDE COPPER AREA BACKSIDE COPPER AREA THERMAL RESISTANCE
JUNCTION TO AMBIENT
2500mm 2500mm 2500mm 46°C/W°°
2500mm 1250mm 2500mm 47°C/W°°
2500mm 950mm 2500mm 49°C/W°°
2500mm 2500mm 0 51°C/W°°
2500mm 1800mm 0 53°C/W°°
1600mm 600mm 1600mm 55°C/W°°
2500mm 1250mm 0 58°C/W°°
2500mm 915mm 0 59°C/W°°
1600mm 600mm 0
67°C/W°°
900mm 240mm 900mm
72°C/W°°
900mm 240mm 0
85°C/W°°

VIN AS1117
IN OUT VIN AS1117 VOUT
IN OUT
C1
ADJ C1 C2
ADJ vREF R
R1 1
IADJ
50uA
LOAD
R2
VOUT= VREF(1+R2/R1) +IADJ R2

800mA Current output Typical Adjustable Regulator

l

Rev. 10/6/00
 AS1117
PACKAGE DRAWING
TO-263-3L (T)

0.055 (1.397) 0.176± 0.005 (4.470 ± 0.127)

0.405 ± 0.005
0.050 ± 0.002 (1.270 ± 0.051)
(10.287 ± 0.127)

0.356 ± 0.005
(9.042 ± 0.127)
0.600 +- 0.025
(15.24 ± 0.635)

0.100 ± 0.010
(2.540 ± 0.254)
0.103 BSC 0.050 (1.270) 0° 8°
(2.616) 0.032 +- 0.001 0.015 +- 0.003
(0.813 +- 0.025) (0.381 +- 0.074)

Rev. 10/6/00
 AS1117
PACKAGE DRAWING
SOT-223-3L (M3)

0.124
0.116

0.146 0.295
0.130 0.264

0.041
0.0905 NOM
0.033

0.181 NOM

0.146
0.130 16°C
0.264 10°C
0.0040 0.248 16°C 0.014
0.0008 10°C Max 0.010

0.033 16°C
0.025 10°C

Rev. 10/6/00
 AS1117
PACKAGE DRAWING
TO-220-3L (U)

0.151D ± 0.002 0.180 ± 0.005

(3.835 D ± 0.051) (4.572 ± 0.127)

0.408 ± 0.013
(10.36 ± 0.33) 0.050 ± 0.002
(1.270 ± 0.051)
0.110 ± 0.010
(2.794 ± 0.254)
0.250 ± 0.010
(6.350 ± 0.254)
Tapered 1o
2 Sides

0.340 ± 0.010
(8.636 ± 0.254) SEATING PLANE

1.020 ± 0.015
(25.910 ± 0.381)
0.150 MIN
(3.81 MIN)
7o Typ.
0.540 ± 0.015
(13.720 ± 0.381)
0.410
(10.41)

0.050 TYP 0.100 ± 0.010 0.015 ± 0.010/-0.015

(1.27 TYP) (2.540 ± 0.254) (2.667± 0.254/-0.381)
0.200 ± 0.010
0.015 ± 0.010/-0.002
(5.080 ± 0.254)
0.032 ± 0.005 (0.381± 0.254/-0.051)
(0.813 ± 0.127)

Rev. 10/6/00
 AS1117
PACKAGE DRAWING
8-PIN SOIC (S)

4.0 (0.158) 5.2 (0.205) 6.2 (0.244)

3.8 (0.150) 4.6 (0.181) 5.8 (0.228)

Pin 1

1.27 (0.50)
BSC

1.75 (0.069)
1.35 (0.053)
0.78 (0.031) 0.77 (0.030)
0.61 (0.024) 0.64 (0.025)
45°
5.0 (0.197) 0.37 (0.015) 7 °(4 PLCS)
4.8 (0.188) BSC

3°-6°

0.56 (0.022)
0.49 (0.019)
0.22 (0.009)
0.45 (0.018) 0.20 (0.008) 7 °(4 PLCS)
0.19 (0.007)
0.35 (0.014) 0.10 (0.004)

Rev. 10/6/00
 AS1117
PACKAGE DRAWING
TO-252-3L (R)

-B-
-A-
E A
A1
b2 A
L2 C1

4
SEATING
PLANE
D
L3
H
L1
1 2 3
L
-C-

b b1 c
A
3 PLCS 8
e
.010 M A M C e1
NOTES
D1 1. Refer To Applicable Symbol List.
2. Dimensions And Tolerancing Per Ansi Y14.5m - 1982.
3. Lead Dimension Uncontrolled in L 3.
4. Tab Contour Optional Within Dim. b 2 & L2 And E1 & D1
E1
TERM 4 5. D1 & E1 Establishes A Minimum Mounting Surface for Terminal 4.
6. L is the Termal Length for Soldering.
7. Controlling Dimension: Inch
8. 2 Mils Suggested For Postive Contact At Mounting.

S
Y
BACK VIEW A-A M N
B O
O INCHES MM T
L MIN MAX MIN MAX E
A 0.086 0.094 2.184 2.3876
A1 0.035 0.045 0.889 1.143
b 0.025 0.035 0.635 0.889
b1 0.300 0.045 7.620 1.143
b2 0.205 0.215 5.207 5.461 4
c 0.018 0.023 0.457 0.5842
c1 0.018 0.023 0.457 0.5842
D 0.235 0.245 5.969 6.223
D1 0.170 - 4.318 - 4,5
E 0.250 0.265 6.350 6.731
E1 0.170 - 4.318 - 4,5
e 0.098 2.489
e1 0.180 4.572
H 0.370 0.410 9.398 10.414
L 0.020 - 0.508 - 6
L1 0.025 0.040 0.635 1.016
L2 0.035 0.050 0.889 1.270 4
L3 0.045 0.060 1.143 1.524 3

Rev. 10/6/00