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Huaqiu DFM User Manual

Shenzhen Huaqiu Electronics
Co.,Ltd.

catalogs
Chapter I. Overview .......................................................................................................................... 2
1.1 What is DFM? ..................................................................................................................... 2
1.2 DFM in the electronics industry .......................................................................................... 3
1.3 DFM Software Installation .................................................................................................... 3
1.4 Files supported by the software and how to open them ............................................ 6
1.5 DFM Software Shortcuts ...................................................................................................... 6
1.6 Mouse commands.............................................................................................................. 9
1.7 Chapter Summary............................................................................................................. 9

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Software Technical Support ..................................................................................................... 9
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Chapter 2 DFM Software Interface..................................................................................................... 9
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2.1 Software main interface................................................................................................. 10
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2.2 Menu bar ......................................................................................................................... 10

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2.3 Toolbar Introduction....................................................................................................... 29

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2.4 Layer manipulation area ............................................................................................... 30

2.5 Detection Display Interface............................................................................................ 34
2.6 Chapter Summary........................................................................................................... 37
Software Technical Support ................................................................................................... 37
Chapter 3 Basic Tool Handling Skills .......................................................................................... 37
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3.1 Document Comparison................................................................................................... 37

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3.2 Continuous collodion...................................................................................................... 40

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3.3 Calculation of gong stroke............................................................................................... 42

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3.4 Calculated Utilization ..................................................................................................... 43

3.5 Solder Joint Statistics...................................................................................................... 44
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3.6 BOM Comparison .................................................................................................................. 45

3.7 Component Search ........................................................................................................ 46
3.8 Open Short Circuit Analysis ........................................................................................... 47
3.9 Character On-Pad Detection.......................................................................................... 48
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3.10 Copper Area Calculation .............................................................................................. 48

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3.11 Chapter Summary......................................................................................................... 49

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Software Technical Support ................................................................................................... 49

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Chapter 4 Assembly Analysis (DFA) ............................................................................................ 49

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4.1 What is DFA? ................................................................................................................... 49

4.2 Data File Preparation...................................................................................................... 50
4.3 Assembly Analysis PCBA............................................................................................... 52
4.4 Load Coordinates............................................................................................................. 53
4.5 Importing Bom............................................................................................................... 58
4.6 Matching Component Library ....................................................................................... 63
 4.7 Component Classification............................................................................................... 69
4.8 Parameter setting ........................................................................................................... 69
4.9 Chapter Summary ........................................................................................................... 69
Software Technical Support .................................................................................................. 70
Chapter 5 DFM Use Cases ............................................................................................................... 70
5.1 Example of a DFM m a n u f a c t u r a b i l i t y check ......................................... 70
5.2 Example of DFA Assemblability Check............................................................................ 81
5.3 Risk composite rating.................................................................................................... 87
5.4 Chapter Summary .......................................................................................................... 88
Software Technical Support .................................................................................................. 88

Chapter I. Overview

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1.1 What is DFM
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DFM means design for manufacturability, design for manufacturability, design for
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manufacturability means that the product design needs to meet the process requirements
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of product manufacturing, with good manufacturability, so that the product can be

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manufactured at the lowest cost, the shortest time, the highest quality.
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DFM is the core technology for inspection engineering design, because design and
manufacturing are the two most important parts of the product life cycle, and factors such as
manufacturability and assemblability should be considered at the beginning of design to
improve the production cycle and cost control.

PCB design, as the most important process of design from logical to physical realization,
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DFM design is an important aspect that can not be avoided. In PCB design, what we call DFM
mainly includes: PCB bare board manufacturability check, PCBA assembly assemblability
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check, from the PCB circuit board manufacturing end of the details of the design and so
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on.
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1.1.1 Reducing costs and improving product competitiveness

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Low cost and high output is the eternal goal of all companies. Through the
implementation of DFM specification, the company's resources can be effectively utilized
to manufacture products with low cost, high quality and high efficiency. If the design of the
product is not in line with the company's production characteristics, poor manufacturability,
that is to say, it is necessary to spend more human, material and financial resources to
achieve the purpose. At the same time, we have to pay the heavy price of delayed delivery,
or even lose the market.

1.1.2 Optimize production processes and increase production efficiency

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DFM connects the design department and production department organically to

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achieve the purpose of information delivery, so that the design and development and
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production preparation can be coordinated and. Unified standards, easy to realize

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automation, improve production efficiency. At the same time, it can also realize the
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standardization of production test equipment and reduce the duplication of investment in

production test equipment.

1.1.3 Fostering technology transfer and strengthening corporate collaboration

 Nowadays, many enterprises are limited by the production scale, and a large amount of
work needs to be carried out by external processing. Through the implementation of DFM,
manufacturing technology can be smoothly transferred between the processing unit and
the unit that needs to be processed, and production can be quickly organized. The
universality of design for manufacturability can enable enterprises to realize global
production of products.

1.1.4 The basis for new product development and testing

 There is no proper DFM specification to control the product design, in the late stage
of product development, or even in the stage of mass production only to find this or that
assembly problems, at this time want to amend through the design changes, will
undoubtedly increase the cost of development and extend the product production cycle.
Therefore, in addition to focusing on function first, DFM is also very important for new
product development.

1.1.5 New technology suitable for electronic assembly process

Nowadays, the development of new technology of electronic assembly process is
becoming more and more complicated. In order to seize the market and reduce the cost,
the company development must use the newest and fastest assembly process
technology to keep up with its development through DFM standardization.

1.2 DFM in the electronics industry

1.2.1 With the rapid development of the PCB industry, PCB is gradually moving towards
the development of high-precision fine lines,small aperture trend, such as cell phone
boards. HDI blind hole, buried hole board is mainly used for high-density, small microvia
board production, the purpose is to save line space, so as to reduce the
volume of PCB. The purpose
is to save line space and thus reduce the PCB volume. For example, HDI board, HDI refers

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to high-density interconnect board. The emergence of HDI technology has adapted and

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advanced the development of the PCB industry. HDI technology has adapted and
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advanced the PCB industry by allowing more dense BGAs, QFPs, etc. to be arranged in
HDI boards.
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1.2.2 At present, SMT equipment has reached a fairly high level of precision, but some of
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the use of high-precision equipment companies, the quality of its products did not meet
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expectations in addition to materials, assembly welding and other issues, the PCB surface
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assembly of the manufacturability of the design is also one of the main reasons. Therefore, it can
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be seen on the PCB designers have a very high calculation requirements, DFM audit check is a
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must part.

1.2.3 PCB design specifications and plate instructions, all need to be accurate, such as
the design is not standardized plate instructions are not clear will bring great trouble to
the production, if the production did not find abnormalities in the production of the board
does not meet the requirements or directly scrapped, put forward anomalies to
communicate the problem also need to be costly, delaying the production cycle of the
product.

SMT production is fully automated, high speed features, are dependent on the
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1.2.4
equipment to complete, so the production equipment on the pcb size, shape, process edge
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reference point and component layout and so on have requirements.

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1.2.5 Design errors are fatal to the product, a small error can bring great losses, in the
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absence of scrap, rework is a great cost. Production errors bring only part of the product
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problems, design errors is the whole batch of products have problems, so the design is
extremely important.

1.2.6 Poor design in SMT production will cause a decline in the quality of product assembly,
but also cause mounting difficulties, frequent downtime, affecting production efficiency to
increase the rework rate, and in serious cases, will cause the PCB board scrap and other quality
accidents; poor design quality problems brought about by the production process is very difficult
or even impossible to solve, especially in the mass production may result in a waste of
materials and man-hours, and even have greater losses.

Huaqiu DFM starts from the conception of the product and considers manufacturability,
assemblability and testability, so that design and manufacturing are closely connected and
interact with each other from design to manufacturing in one go. It can shorten the time to
market, reduce cost and increase production. Good design helps to introduce the design into
production smoothly.

1.3 DFM Software Installation

1.3.1 Recommended environment for software installation: Operating system, Windows 7,
Windows 10, Windows 11, disk space required 1 . 12GB.
 1) Double click to execute the software installation program "HQDFMPRO.exe",th
default
e installation
path is C:\Program Files\HQDFM_PRO, the path can be customized.

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Figure 1-1; Program Installation Path

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2) Click [Next] to complete the selection of the software shortcut path.

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Figure 1-2; Shortcut Creation Location

3) Click [Next] to choose whether to create a desktop shortcut icon and a quick start bar icon.
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Figure 1-3; Creating Shortcut Key Icons
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4) Click [Install] to enter the software installation process.

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Figure 1-4; Installation Program

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5) After successful installation, click [Finish] and exit the installation wizard.
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Figure 1-5; Completing the Installation
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1.4 Files supported by the software and how to open them

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1.4.1 File formats supported by DFM software

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1) CAD data: Gerber274X and Excellon, ODB++

2) BOM file: Excel xls, xlsx, csv
3) Coordinate files: xls, xlsx, csv, and txt f o r Excel.
1.4.2 How the file is opened iu
1) Manual click to load method: Importing files through the "Open" method under the File
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menu;
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2) Drag and drop file loading: Select the Gerber file and drag and drop the file onto the DFM
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software interface to finish loading.

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1.5 DFM Software Shortcuts

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typol name (of a thing) Menu-based Functional note

ogy shortcuts Shortcuts
file Alt + F
show (a ticket) Alt + F → O
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newly built Alt + F → N

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cloture Alt + F → C
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Exporting Project Alt + F → H

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men Documentation
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u Output assembly Alt + F → M

drawings
output report Alt + F → R
E x p o r t PDF Alt + F → P
Recently Viewed No need for
Documents shortcuts
abort Alt + F → X Ctrl + X
compiler Alt + E
increase Alt + E → A Ctrl + A
removing Alt + E → D Delete
Motion Alignment Alt + E → M Ctrl + D
revolve Alt + E → R
mirroring Alt + E → I
view Alt + V
Graphics Mode Alt + V → F F
Negative View Alt + V → N N
component display Alt + V → Y Y
Component List Alt + V → I I
rendering mode Alt + V → D D+S No need for
shortcuts
manipulate Alt + O
Regional zoom Alt + O → R
tap Alt + O → F
frame Alt + O → E
peer-to-peer network Alt + O → S
electrical network Alt + O → N
polyline Alt + O → T
surveying Alt + O → M Ctrl + M
artifact Alt + T
Document Comparison Alt + T → C
montage Alt + T → P
calculation of the Alt + T → R
distance between
gongs
Calculate utilization Alt + T → U
Solder joint statistics Alt + T → S
BOM Comparison Alt + T → B
Component Search Alt + T → D
Open Short Circuit Alt + T → N
Analysis
Pad on Character Alt + T → H
 Copper Area Alt + T → O
Calculation
Component Library Alt + T → W
Management
Creating component
libraries
set up Alt + S
Unit settings
Basic settings Alt + S + J
Object Capture Alt + S → O
Shortcut Key Setting Alt + S →
Rules management Alt + S →C
hand Alt + H No need for

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shortcuts

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About Huaqiu DFM
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DFM Public

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Online Customer Alt + C

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Service
DFM Technical Customer
Service
Tutorials
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Documentation
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Tutorials
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O n e T o u c h DFM left mouse button

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Analysis
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C a l c u l a t i n g PCB left mouse button

Dimensions
Additional left mouse button
documents
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hierarchical left mouse button

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management
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View to the left ←

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View to the right →

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View Up ↑
View Down ↓
centering Home
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zoom in PageUp/+
 pulat downsize PageDown/-
e undo (computing) Ctrl + Z
redo Ctrl + U
Close all affected layers A+G
Affects all layers A+R
Impact Plate Property A+B
Layer
Open them all. Alt + A layer region

Close all Shift + A

Display settings (no
shortcuts)
D Code List right mouse button
Drilling format right mouse button

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output layer right mouse button

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Measurement point to M+P
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point
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Measurement entity to M+O

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entity
Measurement Network M+N
to Network
alignment line X
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Switching Working D+A
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Layers
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 1.6 mouse command

1.6.1 The Mouse function provides flexible and convenient mouse commands, which allow you to zoom
in and out or move around with the mouse, thus improving your work efficiency.
1) Left click: click to select, double click to select similar elements, click in the margin to
deselect.
2) Middle button: Scroll the graph up and down by scrolling back and forth, press and hold
to move back and forth to zoom in and out of the graph.
3) Right-click: Click to call out the operation command menu, right-click and hold to move
the layer display.

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Figure 1-6; Mouse Commands

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1.7 Summary of the chapter

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This chapter introduces the reader to the role of DFM in the electronics industry, and also
introduces the reader to the software installation method, as well as the process of using the
software, and all the file formats required for the use of the software.
By the end of this chapter, the reader should be able to independently install DFM software
and have a preliminary understanding of DFM software within the electronics industry.
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Software Technical Support

Chapter 2 DFM Software Interface

 2.1 Main interface of the software

2.1.1 Double-click the desktop icon to enter the DFM main interface. The interface consists
of a menu bar, a toolbar, an operation area, a layer display, a work area, and an analysis
result display area. In the lower right corner of the software interface, there is a unit
MIL/MM switching button and an element capture function option, which can capture
elements in the center, edge, raster, intersection and other ways.

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Figure 2-1; Operation Interface

2.2 menu bar
2.2.1 Introduction to the DFM software menu function items.
menu file compiler view manipulate artifact
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show (a ticket) increase Graphics Mode Regional zoom Document

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Comparison
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newly built removing Negative View tap montage

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cloture mobility component display frame calculation of the

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distance between
functio gongs
Exporting Project revolve Component List peer-to-peer Calculate utilization
nality
Documentation network
Output assembly drawings mirroring rendering mode electrical network Solder joint statistics
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output report polyline BOM Comparison

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Export PDF surveying Component Search

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Table 2-1; Menu Bar Functions

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Recently Viewed Open Short Circuit

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Documents Analysis
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abort Character On-Pad

menu Component set up hand Online Tutorials
Detection
Library Customer Copper Area
Management Service Calculation

Creating component Unit settings About Huaqiu DFM Technical Customer Tutorials
libraries DFM Service

Basic settings DFM Public

 functio Object Capture

nality Shortcut Key Setting

Rules management

Table 2-2; Menu Bar Functions

2.2.2 Explanation of the operation of the File menu functions.

Figure 2-2; File Menu Class

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1) Open: Opens a Gerber file or an ODB++ file;
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2) New: The New JOB window allows you to load different files in different JOBs to improve
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work efficiency; H
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Figure 2-3; New JOB

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3) Close: Closes the file in the current JOB window;

4) Output Project File: Editing operations saved in the DFM software;
5) Output assembly drawings: provide technical basis for product assembly, inspection and use. The
output file is a PDF document format, open the PDF document of the assembly drawing, in
the search bar can be directly searched for the component bit number, directly find the location of the
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component.
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Figure 2-4; Output Assembly Diagram

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6) Output Report: Output the manufacturability analysis report and save it as a PDF
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document for local archiving.

7) Export PDF: This function provides for the production of each layer of drawings that
need to be used. Output drawing skills, according to the demand for the output effect
to make a choice, the functions are merged layers, suitable for the page, whether or
not mirroring, 1:1 ratio, output black and white, merge a page. According to the
choice of function, the output of the drawing effect is not the same.
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Figure 2-5; Output PDF Drawing Page

8) The "Recently Viewed Documents" saves 10 recently opened files, so you can
directly find the recently opened files in Recently Viewed Documents during the
process of using, without having to go to the local area to find the files, which is
convenient for the users to use.
9) "Exit" directly exits the software operation.
 2.2.3 Edit menu function: You can add or delete objects, move, rotate and mirror for graphic

editing operations.
Figure 2-6; Edit Menu
Category 2.2.3.1 "Add" Function Contains Line, Pad,
Arc, Copper Foil, and Text.

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Figure 2-7; Add Object Operation Interface

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1） Lines: Drawing lines can be positive or negative. Line widths can be entered manually
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or you can use the "hand" icon to grab the size of an existing element in
the file. There are two types of lines: line segments and rectangles. Lines can be drawn at
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arbitrary, 45-degree, 90-degree and customized angles.

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Figure 2-8; Adding Lines
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2） Pad: The properties of the pads can be selected as positive or negative. Types are

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Circle, Square, Rectangle, Oval, and angles are 45 degrees, 90 degrees, 180 degrees, 270
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degrees, or customized. The pads can be added using the array method by entering the
number in "Nx" "Yx" and the spacing in "Dx" "Dy". Dx" "Dy" input spacing.

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Figure 2-9; Adding Pad

3） There are 24 shapes available for adding pad types, so you can select the shape you want
and enter the corresponding parameters.
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Figure 2-10; Symbol Types

4） Add Arc: The attributes of the arc can be selected as positive or negative. The types of
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arcs are arcs, whole circles, and the methods can be added by any two points, any center,
and radius.
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Figure 2-11; Adding an Arc
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5） Copper skin: you can choose to add positive or negative, and the drawing types are
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arbitrary shapes as well as rectangles.

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Figure 2-12; Adding Copper Skin

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6） Characters: No support for Chinese input for the time being, positive or negative
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attributes can be selected. Character height and width ratio can be added according to
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the need, the recommended aspect ratio is 1.5:1. added characters can be rotated 90
degrees, 180 degrees, 270 degrees and mirrored.
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Figure 2-13; Adding Text
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"To delete an element, select it and click Delete or press the Delete keypad;

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2.2.3.2
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unselected elements will be deleted by default.

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2.2.3.3 "Move Alignment" Move Alignment can be categorized into three types, single-layer
alignment, multi-layer alignment, and local alignment.
1) Single-layer alignment: In case the layers are not aligned, find the common point where
the two layers are not aligned, open the Grab Center, right-click or choose Move
Alignment in the menu bar, and overlap the two common points.
2) Multi-layer alignment: Based on the operation of single-layer alignment, you need to open
the influence layer of the layer list and align the multi-layer influences together.
3) Local alignment: you need to first box to align the part, find the common point of local
alignment, open the center of the grasp to move the two common points overlap the
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local alignment.
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 Figure 2-14; Layer Alignment Operation Diagram
2.2.3.4 "Rotate" first selected elements (not selected default for the entire layer), in
the click on the application or determine the implementation of the command, this
function can be in accordance with the center, upper-left, lower-left, upper-right, lower-
right, customized datum rotation, you can also choose to rotate counterclockwise.

Figure 2-15; Rotation Operation Window

2.2.3.5 "Mirror" first selected elements (not selected the default for the entire layer), in
the click on the application or determine the implementation of the command, this
function can be in accordance with the center, upper-left, lower-left, upper-right, lower-right,
customized datum mirroring, but also provides X-direction mirroring and Y-direction

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mirroring.

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Figure 2-16; Mirror Operation Window

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2.2.4 "View" graphic mode

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menu:
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Figure 2-17; View Menu Class

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1) Graphic Mode: You can switch the three modes to view the graphic: regular, skeleton,
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and sketch, and press the "F" shortcut key to switch.

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Figure 2-18; Graphical View Mode

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2) Negative View: Press the "N" key to toggle the display of the negative element or not.
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Figure 2-19; Graphical View Negativity Mode

3) Component display: display the component layer graphics, according to the device layer
data type to do the selection of the display, to enhance the efficiency of the user's work.
⚫ Type of display: name, component, pin, size.
⚫ Name: Bit Number, PCB Package, if none of them are shown, just tap No Show.
⚫ Component display: EDA body, EDA pins, GML body, GML pins, just tap to display or not to
display.
⚫ Pin display: Component pins have pin orientation, assembly method, network name, pin
name, geometry, 1-pin labeling, etc.
 Remember, just tap to show or not to show.
⚫ The size of the device and the size of the display characters: overflow component box
to select yes or no to choose to display and not display, the size of the characters
according to the number to adjust. After all display adjustments, check the box to set as
the default display, every time you open the file for the set display content.

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Figure 2-20; Component Display

4) Component List: Display the parameters of the components used in the whole product,
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specification value, package, bit number, after opening the component list, you can
search the specific location of the component design in the board according to the
specification value, package, bit number.
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Figure 2-21; Component List
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5) Display device parameters: Press "Q" and then click on the device to display the
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parameters with the mouse, a pop-up window will display the device information, if
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you need to end the display device information, press "Q" again. If you need to end

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the information of the display device, press "Q" again. The information includes Face,
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Bit, Package, Pins, Pitch, Size, Height, Angle, Assembly, Brand, Model.

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Figure 2-22; Display Component Parameters

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6) Rendering mode: you can switch between the simulation and the design of the two
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displays, the simulation can define the PCB process and color can simulate the physical
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board style.
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 Figure 2-23; Simulation and Design Diagram Patterns
2.2.5 "Operation" menu function.

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Figure 2-24; Operation Menu Class

1) Area Zoom: Mouse to select the area to be zoomed in to zoom in to view the view;
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2) Point and click: left mouse button click function, mainly used to select elements;
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3) Box Selection: Left mouse button box selection function, mainly used for selecting
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elements;
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4) Sibling Network: All elements connected in the same layer can be selected;
5) Electrical network: you can select the elements of each layer of the same network in the
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board;
6) Polylines: Similar to same-layer networks, only polylines that are connected in the same
layer are selected (pads are not included);
7) Measurements: There are point-to-point, contour-to-profile, network-to-network, weld-
ring measurement widths, element center-to-center measurements, and more.
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 Figure 2-25; Measurement
2.2.6 "Tools" menu function:

Figure 2-26; Tools Menu Category

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1) File Comparison: You can compare the differences between two different versions of A\B,
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and you can click on the differences to see the exact location;
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2) Patchwork: Provides the function of single-piece patchwork SET, and the patchwork
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method can be customized;

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3) Calculation of gong stroke: automatic production of the length of the required gong off
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position, easy to account for production costs;

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4) Utilization Calculation: Calculates the optimal production utilization of a PCB size based on
the size of the bulk material;
5) Solder Joints Statistics: Calculates the number of component types and solder joints in a
file, mainly for SMT quotes;
6) BOM Comparison: When updating and modifying the components of the electronic product
iteration, you can compare the differences between A\B and two different versions;
7) Component Search: It is very convenient to search the location of the device on the board
and view the bit number and package name of the device;
8) Analysis of open and short circuits: Check the electrical network tables in the design
documents for open and short circuits present in the documents;
9) Character on Pad Detection: Detect the character above the pad, and move away the
character that exists to affect soldering;
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10) Copper Area Calculation: Calculate the percentage of copper area in each layer of the
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board;
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2.2.7 "Settings" menu function:

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Figure 2-27; Setup Menu Class

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1) Unit Setting: Set the unit used by the software, the default unit is mils you can switch
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between millimeter and mil units.

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2) Basic settings: the analysis method can be set to automatically analyze PCB/PCBA or
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not automatically analyze, the system settings can change the cache path, and at the
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same time you can set the number of days to clear the cache, you can also set to close
the window to continue to run the software, the language can be switched between
English and Chinese, and you can set to start the software when you turn on the
computer.
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Figure 2-28; Software Basic Settings
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3) Object Capture: Capture the focus of an element, such as the center point or the edge

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as needed when measuring, for accurate measurement data.

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Figure 2-29; Snap Switch

4) Shortcut key settings: shortcut settings for each function point of the software, you can
customize the shortcut key settings according to your personal habits.
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Figure 2-30; Shortcut Key Setting

5) Rule Management: It is used to manage various analysis rules, users can modify, delete,
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maintain and other operations of the rules, you can also export the configured rules to
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share with others to facilitate the synchronization of the software checking rules of
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multiple computers.
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Figure 2-31; Rule Management

 ⚫ Menu bar "File" menu, you can import or save as a rule file; "Operation" single can reset
the rule parameters.

Figure 2-32; Rule Management Menu

⚫ shortcut icon
Open the rules file

Saving Setup Items

Reset Rule Parameters

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Responsible for the rules file, which can be customized with a name
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after copying

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Deleting the rules file

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⚫ The rule configuration items are arranged in a tree menu, which is mainly composed of
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two main categories: Bare Board Analysis and Assembly Analysis, with different
subcategories corresponding to the analyzed items under the major categories.
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Figure 2-33; Analytical items

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⚫ Click on "Analyze Item" to configure whether each item needs to be detected and
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analyzed, and uncheck the box if it does not need to be analyzed.

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 Figure 2-34; Analysis Configuration
⚫ Click on "Variables" to configure the analysis range values for the variable.

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Figure 2-35; Variable Configuration

⚫ Click "Scope" to configure the detection range of the analyzed item, and report red,
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yellow and green warning colors according to the corresponding configured
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parameter segments. For example, "Minimum line width" 3, 5, 6 units mil, less
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than 3mil reported red, 3 to 5mil reported yellow, greater than or equal to 5mil
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reported green.
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Figure 2-36; Range Configuration

2.2.8 help menu
1) About Huaqiu DFM: Learn about the company that developed the DFM software and view the
DFM software version;
2) DFM Public No.: Follow DFM Public No. to read electronics-related technical articles, and
you can also open and view PCB files online on your cell phone;
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Figure 2-37; Help Menu List

2.2.9 Online customer service: sweep the code to add the technical customer service
WeChat, to provide users with manual service, to solve some of the software use of
technical advice.
 Figure 2-38; Software Manual Service Window

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2.2.10 Tutorials: Provide users with a clear, concise, systematic software operation
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manual to help users understand the use of Huaqiu DFM software, click on the tutorial

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document can be read to view.
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Figure 2-39; Tutorial Documentation

2.3 Toolbar Introduction M q iu
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Figure 2-40; Toolbar

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2.3.1 Toolbar Features:

DFM edits and saves the file after the operation.

Open PCB source text, Gerber files, ODB++

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Convert images to PDF documents

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Select area view to zoom in

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Mouse click to select an element, double click to select all similar elements

Mouse boxed area selected

Same network elements all selected

 Power or ground, same as network selected

Select only line segments of the same network

Point-to-Point Measurement, Profile-to-Profile Measurement, Network-

to-Network Measurement, Weld Ring Measurement, Center-to-Center
surveying

Segmented Tabs (SET)

Counting smt pads and THT pads for SMD placement

Comparison Design IPC Networks Detecting Open and Short Circuits

View Up

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View Down

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View to the left

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View to the right

Enlarge the graphic

Reducing graphics
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center a graphic (computing)
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Withdrawal of previous action

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Redo all operations.

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2.4 Layer Operation Area

2.4.1 Analyze the setup area:
1) Assembly analysis setup: The assembly analysis file is preset to require coordinate
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information and BOM list corresponding to the design file, and the setup process
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includes various checks for coordinates and BOM;

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2) One-Click DFM Analysis: Manufacturability analysis is performed on the file, without

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"Assembly Analysis Setup", the bare board analysis is the main focus;
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Figure 2-41; DFM/DFA One-Button Analysis

3) Design/Simulation Diagram: Switch between design diagram and simulation diagram
viewing modes;
4) Calculate PCB size: This function can be used to define the size of PCB board frame when
some non-standard files cannot recognize the board frame automatically. The method is
as follows: select the board border elements to be calculated by net or box, click
"Limit Rectangle" to define the size of the board frame, do not select the "Limit
Rectangle".
 The whole layer of "Limit Rectangle" is used as the size of the frame, and two
intelligent ways of defining the frame can be used, "Algorithm 1" and "Algorithm
2", note that the working layer must be the layer to be defined as the frame. Note that
the working layer must be the layer where the frame is to be defined.

Figure 2-42; Calculating PCB Dimensions

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2.4.2 Layer Area:
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1) Append file: In the case of an imported file, click "Append file" to import the file again,
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this function is used to compare the graphics before and after the modification of the
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same file, and the appended file is named "****_1".

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2) Click Layer Management to bring up a popup window where you can set the layer type,
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attributes, and polarity. Click and hold the mouse on the layer, and move it to change
the layer order, and move the layer to the position where you need to change. Click
the layer you want to delete, press "Delete" to delete the layer.
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Figure 2-43; Layer Management

2.4.3 Introduction to Layer Operation:
1) Double-click on a layer to open it individually and make it a working layer, and click on the
layer to open the display of the layer. The "check mark" indicates that it is a working layer.
Solid "red blocks" indicate impacted layers and "closed eyes" indicate closed
layers.
 Figure 2-44; Layer Display
2.4.4 Layer area right build menu:

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1) Open All: Displays all layers;
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2) Close All: Turns off the display of all layers;
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3) Display settings:
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⚫ Color settings: right-click the layer in the pop-up window to adjust the layer's display

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color, according to the need to have a basic variety of colors

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and custom colors;

⚫ Show Lines: show the current layer lines, Suface attribute element, unchecked, it will
not be shown;
⚫ Show Pad: Show the current layer pad element, unchecked it will not be shown.
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Figure 2-45; Color Toning Plate

4) D code list: you can view the serial number, size, type (positive, negative) and quantity
of the current layer "D code", and select the corresponding "D code" to
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highlight or de-highlight.
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Figure 2-46; D-Code Chart

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5) Drill Format: This item is valid for the drill layer, and allows you to adjust the units, zero-
saving rules, and number format of the drill file.
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Figure 2-47; Drill Hole Format

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6) Output Layer: outputs this layer separately in Gerber274X format, mainly for single layer
output after modification.

2.5 Test display interface

2.5.1 The test items include two main categories;
1) PCB bare board analysis: for PCB board in the welding device before the analysis, testing
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items are line analysis, drilling analysis, solder resist analysis, character analysis;
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2) PCBA assembly analysis: analysis of soldered devices for PCB boards, testing items
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include device analysis, pin analysis, pad analysis, optical point analysis.
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Figure 2-48; Analyzed Items

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2.5.2 Detection term anomaly ratings;

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1) "Red" represents a high-risk anomaly that cannot be produced (end-of-life issues);

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2) "Reported yellow" represents a medium risk anomaly and can be produced (there are
issues affecting the cost of production);
3) "Green" represents a low risk anomaly that passes the test, the exact level of risk can be
assessed by setting a risk value (rule management).
 Figure 2-49; Risk items
2.5.3 Review the small category window explanation:
1) Click "View" on the right side of the audit item to view the specific "analysis category",
"analysis results" and specific
The location, with a description of the "problem" and comments on the results of the

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analysis;

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2) Within the audit results, you can press ALL (so items), ! (show all analyzed data
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items), ! (show warning items) to display a list of corresponding parameters for
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regular analysis;
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3) Audit report red, yellow, green parameters are based on the report rules to determine
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the audit results, the report rule parameters from the rule management inside the
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setup parameters.
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Figure 2-50; Detection Problem Description

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2.5.4 Audit results are viewed in specific locations:

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1) To display a graph of the parameters of the analysis results, select "Auto zoom" and
then click on the analysis results, the graph of the analysis results can be positioned
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to the location of the board, and zoom in on the location of the graph.
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 Figure 2-51; View Parameter Graph Zoom
2) By selecting "Pan only" and clicking on the analyzed result, the graphic will be
positioned at the location of the analyzed result, and the graphic ratio of the analyzed

result will remain unchanged when switching files.

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Figure 2-52; Viewing Parameter Graph Positioning
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2.6 Summary of the chapter

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This chapter introduces the reader to the various interface windows of the DFM software, as well
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as the menu bar functions and toolbar functions.

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As well as the file management operation area and the inspection result display interface.
Through the introduction of this chapter, the reader should be able to master the basic
operation of the DFM software and have some familiarity with the DFM software interface.
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Software Technical Support

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Chapter 3: Basic Tool Handling Skills

3.1 Document Comparison
3.1.1 The File Compare Tool adds a strong guide to open the interface display of the
comparison file, which facilitates the initial users to use the File Compare Tool to import
files quickly.
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Figure 3-1; Comparison File Import

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3.1.2 Document Comparison Settings

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1) Comparison ranges: Detect discrepant locations by full range, within profile, and
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custom ranges.
2) Comparison Factor: The difference points can be compared according to the pixel point
size of the graphic.
3) Comparison Data: Clear the comparison results, while the Delete_1 layer check box
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allows you to clear all layers of the comparison.

Figure 3-2; File Comparison Settings
4) Comparison layer selection: check all the layer comparison, compare all the
documents, if you don't need to compare all the layers, you can check the layer you
need to compare selective comparison.
 5) Comparison Difference Display: All results can be displayed, differences can be displayed,
and differences can be prioritized.
6) Comparison Results View: Click on View to locate the location of specific differences
within the board.
7) Compare file operation: Click "Compare" to compare the difference points, and click
"Close" to close the operation window and clear the data.

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Figure 3-3; Comparison Layer Display Settings

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8) Single Layer Comparison: Select the original file layer, you can select the layer that needs
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to be compared.
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9) Add Comparison Layer: Click the plus button to add a column of selection layers.
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10) Delete comparison layer: If you need to delete the comparison layer results individually,
you can do so by clicking the Delete button.
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 Figure 3-4; Single Layer Comparison Setup
3.2 montage
3.2.1 Set up the profile layer and then fill in the corresponding piecing method according to
the piecing demand.
1) Synchronized collage layer: check the layer to be synchronized can be physical collage, to
detect whether the collage is reasonable;
2) Piecing Mode: Piecing mode supports regular piecing and inverted buckling piecing;
3) Add a craft edge: support up and down, left and right, around (up and down, left and
right are filled in as four weeks) personalized add a craft edge;
4) Add spacing: "X Spacing" "Y Spacing" can set the spacing between boards,
after setting the parameters, click "Apply" to get the corresponding board size;
5) Stamp holes: leave spacing around the collage to support the addition of stamp holes;
6) Click "Calculate Utilization" to access the "Calculate Utilization" tool;
7) After the collage is completed, click Output Collage Layer to output the collated collage to
the local area of the computer;

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Figure 3-5; Tessellation Tool

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3.2.2 Patchwork function features operation

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1) Add process edge in the middle of the plate: If the spacing between consecutive plates is more
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than 3mm, there will be a line in the middle of the plate with the spacing of the plate-making tool.
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Function, the purpose is to determine whether the spacing greater than 3mm need to
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leave the edge of the process, add a line in the middle of the "check" to leave the edge
of the process, do not check for the gongs to leave the spacing.
 Fig. 3-6; Schematic diagram of leaving spacing and process
edges for consecutive pieces of assembled plates
2) Inverted buckling puzzle: If there is a groove, in order to save costs, inverted buckling to be able
to buckle the board in the groove within the piecing method, in the piecing tool inside the
selection of a good inverted buckling position, calculate the inverted buckling into the

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groove size, in the piecing spacing column, enter "- minus" how much the negative

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number of the piecing can be realized in the desired piecing diagram.
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Figure 3-7; Schematic diagram of special inverted buckle

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piecing
3) Add stamp holes: collage add stamp holes bridge even, according to the demand to add the number
of stamp holes, size and spacing of stamp holes, the mouse cursor moves to the corresponding
position, click to add the placement of stamp holes, this function also provides an array of
add the placement of stamp holes.
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 Figure 3-8; Stamp Hole Tool
4) Interference tips: Click "Apply" to complete the layout after setting up the layout

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parameters, when the board edge components are beyond the board, and there is
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interference with other boards after the layout, the software will give you a hint and

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generate a layer of characters to show the location of the interference.
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Figure 3-9; Collage Interference Hints

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3.3 calculation of the distance between gongs

3.3.1 After setting the profile and drilling layers, the calculation tool will intelligently select and
configure the tool according to the actual file slot width size.
If there is an incorrect area in the analyzed gong groove, you can press "T" key to define the
location where the gong is not needed. Calculate the operation by clicking "Analyze" and
then "Generate", if there is incorrect area in the analyzed gong groove, you can press
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the "T" key to define the position where the gong space is not needed, then click the "T"
key to select the area where the gong space is not needed, then press the "T" key to switch
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the result of analyzing the gong process. Press "T" key again, if there is any incorrect area,
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you can press "T" key to define the location where the gong is not needed, then click
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"Generate" to switch the result of analyzing the gong process.

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3.4 Calculate utilization

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 3.4.1 Using the "Calculate Utilization" tool, you need to define the size of the external
dimensions, click on the "Calculate" button to calculate the utilization rate, based on
the size of the raw material to calculate the corresponding utilization rate of the board, this
tool can also calculate the utilization rate of the board of the FPC flexible board.

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Figure 3-11; Calculation of Utilization Rate
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3.5 Solder joint statistics

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3.5.1 Click "Calculate" to analyze the "Number of Surfaces", "Number of Top

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Pad", "Number of Bottom Pad", and "Number of Pads". " n u m b e r

If you click "View" after the relevant item, the corresponding pad will be
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highlighted in the graphic window. "If you click "View" after the relevant item, the
corresponding pads will be highlighted in the graph window.
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Figure 3-12; Weld Joint Statistics

3.6 BOM Comparison
3.6.1 The BOM Comparison Tool adds a strong guide to open the file interface display, making it
easy for the initial user to use the file comparison tool to quickly
Import the file. iu
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Figure 3-13; BOM File Importing

1) Import and Export: Import BOM files for comparison and export organized BOM files.
2) Default Sort: Comparison results are displayed by original BOM row.
 3) Difference priority: The comparison results are displayed according to the priority of the
rows with differences.
4) Empty Data: Check this button to close the BOM Comparison Tool and empty the data in the
tool.
5) Comparison results: report red to indicate that there are differences in the line, and
display the specific location of the differences.
6) File header: Header adjustment can be performed when the header is not recognized
correctly.

Figure 3-14; BOM Comparison Display Settings

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7) Bit Number Duplication Alert: After importing the file, click BOM Comparison and a pop-up
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window will be displayed when there is bit number duplication.
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8) Rows and Columns Data: Displays the position of the mouse-selected rows and columns.
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9) Bit Number Details: When there is a duplicate bit number, or a missing bit number, it will
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be displayed below.
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10) Modify Parameter: Mouse select the position to be modified, click modify, you can modify the
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parameter inside the BOM file.

11) BOM Compare: Click on the BOM Compare button to compare the difference points of the
BOM files.
12) Close: Click Close to close the BOM Tool window.
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Figure 3-15; BOM Comparison Prompt Modification

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3.7 Component Search

3.7.1 Queries the location of a component bit number, searches to the location on the board
where the device is located, and views the bit number and package name of the device
Calling. Enter the bit number in the bit number field and click "Search"!
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Figure 3-16; Component Search

3.8 Open Short Circuit Analysis
3.8.1 Misuse of design files in EDA software or exporting Gerber files can cause connectivity
problems.
Problems with connectivity can be avoided by using DFM to analyze open and short circuits.
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1) Open Short Circuit Preparation: files to be prepared for open short circuit analysis,
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Gerber and IPC network files, open the files and click "One Click DFM Analysis".
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2) Open Short Circuit Test Result: Click on the Open Short Circuit Check item on the right to
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view.
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3) Short Circuit Details: Click on the short circuit item "Details" in the pop-up window to
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locate the specific location of the short circuit on the board.

4) Marker Size: Displays the size of the network identifier number font.
5) Marker type: can be displayed by identification character or by network name.
6) Other Networks: Check Other Networks to show the network of the whole board, uncheck
it to show the network with open and short circuits.
7) Analyze: You can re-analyze the DFM after analyzing it with one click, and you need
to add the IPC file and click "Analyze" to detect the result of open/short circuit if you
use the open/short circuit tool, and then click "Close" when the detection is finished.
 Figure 3-17; Network Comparison
3.9 Character On-Pad Detection
3.9.1 Characters on the pads can affect soldering, click on "Analyze" and click on the layer,
then click on the position of the characters on the pads.
Look for characters on those location pads.

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Figure 3-18; Detecting Characters on the Pad

3.10 Copper Area Calculation
3.10.1 Calculate the copper area of each layer of the line in the board, click "Calculate" to
get the copper area of each layer of the line.
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Figure 3-19; Copper Area Calculation
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3.11 Summary of the chapter

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This chapter introduces the reader to the practical functions of the DFM software, such as

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file comparison, collation, and utilization calculation,

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Open short circuit analysis, character on pad detection ......

Through the introduction of this chapter, the reader should be able to grasp the basic
operation of the use of the main functions of the DFM software and have some familiarity with
all the functions of the DFM software. iu
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Software Technical Support

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Chapter 4 Assembly Analysis (DFA)

4.1 What is DFA

DFA: It is the English abbreviation of Design for assembly, which refers to the design of
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products in the product design stage to make products with good assemblability,
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ensuring simple assembly process, high assembly efficiency, high assembly quality, low
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assembly defect rate and low assembly cost.

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The DFA function of "Huaqiu DFM" is a function to assist in organizing the component
list of EDA circuit design, and to quickly match the components of the Bill of Materials
(BOM), which can greatly improve the efficiency of the work of organizing the Bill of
Materials (BOM), but of course, it is not just a simple function of "Huaqiu DFM". Of course,
"Huaqiu DFM" is not only to organize Bill of Materials (BOM) so simple. The main
function is to provide assembly analysis, support the inspection of production
components assembly of hidden problems, analyze and check in advance to avoid
unnecessary losses in the production process.
"Huaqiu DFM" docking mainstream EDA design software, such as: Mentor PADS series
software Logic, Layout, Protel series 99se, DXP, Altium Designer series, Cadence series
Orcad, Allegro and so on. Software Transmission
 The component list can be imported and organized into a BOM file to match the BOM purchased
components for different list formats.

"Huaqiu DFM tool does not have complex operation theory, but from the practical
application of electronic product development, so that users can quickly and efficiently
improve work efficiency, shorten the development cycle. As a result, product
development costs can be reduced and product quality can be improved.

Manufacturing and assembly-oriented product design is the key to "lower development costs,
shorter development cycles, and higher product quality" for product development.

4.2 Data file preparation

4.2.1 ODB file: You need to drag the unzipped ODB++ file into the software window to
open it, or you can click "Open File" to find the path where the file is stored to open the file.

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Figure 4-1; Importing files

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4.2.2 Gerber/Drill file: Gerber/Drill i s t h e output f r o m t h e EDA software inside the

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template file, the file includes drilling layer, inner/outer layer line, soldermask layer,
silkscreen layer, board frame layer. If it is a zip file, drag it directly into the software window
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to open the file; if it is an unzipped file, select all files and drag them into the software
window to open the file.
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Figure 4-2; Gerber a n d Drill Files

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4.2.3 Coordinate/BOM file: Export the coordinate and BOM file from EDA software, open the
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Gerber file of PCB design with Huaqiu DFM, and then import the coordinate and BOM file
to do the analysis and testing of assembly solderability.
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 Figure 4-3; Coordinates and BOM Data File
4.2.4 Import File Settings: When loading a file, you can set the analysis mode in the
popup window, automatic PCBA analysis, automatic PCB analysis, and no automatic
analysis. For example, if you set automatic PCBA analysis, you can choose the path to o p en
t he BOM and coordinate file for automatic PCBA analysiswhen you drag in the Gerber file,
and if you drag in the Gerber,coordinateandBOM at the same time, you can open them for
automatic PCBA analysis directly.

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Figure 4-4; Import File Settings
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4.3 Assembly Analysis PCBA H

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4.3.1 Basic setup for assembly analysis

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1) In the software interface, click on the "assembly analysis PCBA" to enter the assembly
analysis interface for BOM table inspection,
Components are matched and assembled to analyze a series of operations.
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Figure 4-5; Assembly Analysis PCBA

2) The operation interface of assembly analysis, the main process is "load
coordinates" → "import Bom" →"matching component library" → "component
type" → "parameter setting". "->"Parameter Setting".
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3) Find Bit Number: Available on every page of the assembly analysis setup, it is convenient
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to query the information of the device corresponding to the bit number;

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4) Creating component libraries: drawing geometric models of matching BOM components;

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5) Functions of Settings: Setting for clearing the data of keywords for table header
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identification in coordinate files and BOM files, and setting for clearing the records of
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component libraries, saving the matching records to local, matching local libraries,
matching BOM parameters, and matching packages for matching component libraries.
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Figure 4-6; Settings
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6) Keyword management of table header: Coordinate files and BOM files have many types

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of content formats, so when the software recognizes the file table, there are too many
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types and you need to manage the file types. You can manage the keywords of the file
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according to the header of the file, add keywords by clicking "Add", and delete
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keywords by clicking "Delete".

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Figure 4-7; Form Keyword Management

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4.4 Load coordinates

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4.4.1 Load coordinate file

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1) Load coordinate file: Coordinate file can be dragged directly into the window to load
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and open the file, or you can "click" to load the coordinates.
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file, find the location where the coordinate file is stored and select the coordinate file to
load and open;
2) The supported formats for coordinate files are xls, xlsx, csv, and txt file formats;
3) For a standardized template of the coordinates, click on "Download Template";
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Figure 4-8; Loading a Coordinate File
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4.4.2 Coordinate file organization
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1) Re-upload and next step: after loading the coordinate file, the coordinate organizing interface
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will pop up, if you need to re-upload during the organizing process

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Upload the coordinate file, click "Re-upload", and then click "Next" when the
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coordinate file is ready to process the BOM work.

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Figure 4-9; Re-transmitting a coordinate file

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2) Automatically organize the coordinates: EDA software export coordinate file, the file
header format is more messy, you need to re-arrange the standard format of the table,
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organize the table software automatically organize, and will retain the original
coordinate file, to provide a reference to view.
 Figure 4-10; Coordinate File Auto Organizing
3) Delete rows or columns: manually organize the form can be deleted in the entire line, click
on the operation area of the "Delete" can be deleted, delete columns by clicking
the "right mouse button" operation needs to be carried out in the table
header to delete the entire line or column;
4) Add rows or columns: Click the "right mouse button" in the table to add the location of

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the pop-up window;

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Figure 4-11; Table Additions and Deletions
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5) Coordinate Table Adjustment: When the direction of the project file and the coordinate file are not
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consistent, you can rotate them. For example: after exporting the Gerber file and coordinate file,
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the Gerber file is rotated during the production process, and the direction of the
coordinate file is not consistent. Therefore, you need to rotate the coordinate file to
ensure consistency with the Gerber file;
6) Coordinate file layer identification: organize coordinate file identifiable layer names,
top layer: Top,T,A,F,no,TopLayer bottom layer: Bot,B,yes,bottom,BottomLayer,
various layer names need to be separated by commas.
7) Adjust the scale of the table: the coordinate file can be scaled and rotated in angle,
switching the unit of the table in millimeters, mils and inches, and the organized table
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can be exported to the organized coordinate file.

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Figure 4-12; Form Adjustment Toolbar

8) Export coordinate file: When exporting file, you can select the columns to be exported,
including bit number, face, package, coordinate and angle, and the columns to be
exported can be arranged according to the order of need, and you can also combine
them to be exported arbitrarily.
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Figure 4-13; Exporting a Coordinate File

4.4.3 Aligning Component Layer Operations
1) During the process of organizing the coordinate file, a view window is displayed. In the case
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where the coordinate component layer is not aligned with the actual project file, a view
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window is displayed.
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In this case, click "re-render layer" and check whether the component layer is aligned
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with the actual project file, if not, you need to do the alignment operation.
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2) Mirror: When the coordinate file and the project file can't match, if you need to mirror to
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match, you can choose to mirror or not mirror in the mirror position.
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Figure 4-14; Adjustment Component Layer
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4.4.4 Coordinate Alignment Pad

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1) Click on "Coordinate Alignment Pad" to bring up the Alignment window to move the
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alignment. To do this, click on "Select Components".

Then select one of the devices of the graphic of the component layer;
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2) The display item can display the graphic of solder resist and character layer according
to the requirement, check "Show solder resist layer" and "Show resist
silkscreen".
3) You can check the box "Synchronize moving bottom layer", if the bottom layer is not
aligned and the coordinates are the same as the top layer, you can apply the
synchronization to the bottom layer and align it together;
4) Click "Select Pad", and then select the pad layer of the graphical common device, the
pad layer of the common device is two pads, or multiple pads, the component layer of
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the device to be in the center of the pad layer of the common device, so the pad layer
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need to select at least two pads, the method of selection is to single-select a single,
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and then hold down the keyboard Ctrl Ken successive selections Select at least two
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pads for the pad layer by singling out one and then holding down the Ctrl key to
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select all pads of the common device;

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Figure 4-15; Aligning Component Layers

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4.5 Import Bom

4.5.1 Load BOM file
1) Import Bom interface, Bom files can be dragged directly into the middle of the window to
load and open the file, but also can be "clicked" to add the file.
To load a Bom file, find the location where the Bom file is stored and select Load Bom File to
open it;
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2) Bom file formats supported are xls, xlsx, csv, txt file formats.
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Figure 4-16; Import Bom Window

4.5.2 BOM check
1) Automatically organize the Bom Table, click "BOM Check" software automatically organize
the Bom Table;
 Figure 4-17; Automatically Organized Bom Tables
2) If there is a difference between the coordinate file and the BOM file, a pop-up window will
prompt the bit number of the difference, reminding the user to do the checking, such as
no need to check can be clicked to ignore, to match the work and operation of the
component library.

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Figure 4-18; Coordinate Bit Number Comparison Window

3) The same device with different package tips, when the design of the product there is
a device with a variety of packages. For example, the package size of the 0603 device
bit number R124 is 2.9X1.4mm, and the package size of bit number R15 is 3.55X1.8mm.
For this kind of problem to make a prompt, such as prompting the information
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without adjusting, click to ignore.

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Figure 4-19; Same Device in Different Packages

3) Re-upload the BOM and follow the prompts to manually adjust any unrecognized
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information. If you need to re-upload the BOM during the process of organizing the BOM
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table, click "Re-upload"!

Figure 4-20; Bom Table Organization
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4) Bom check principle, Bom table need to check the completeness of the specification
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value, whether there is any duplication of the bit number, whether the bit number is in
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line with the dosage, and whether the Bom table has a bit number but actually no
component ...... If the check passes, you can click on the "Next" for
component matching.
Figure 4-21; Bom Check
 4.5.3 BOM collation
1) Table header organization, EDA software exported Bom file, the file header format is
more chaotic, need to re-arrange the standard format of the table, organize the table
software automatically organize, and retain the original coordinates of the file, to
provide easy to view the reference.

Figure 4-22; Original BOM

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Figure 4-23; Standard BOM

2) Bom check results, click "Bom check" in the check results column will show the
problem points, such as bit number duplication, specification value information is
incomplete, package and bit number mismatch, a device in the BOM file has a bit
number in the coordinate file does not have a bit number and other anomalies. The
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result of the check needs to be modified manually according to the display, after
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modification, re-check the display to pass without any abnormality.

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Figure 4-24; Inspection Results

3) Modify Bom table: Delete rows or columns, manually organize to delete whole rows, click
"Delete" in the operation area. In the table header column "right mouse button"
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can delete the whole column. Add rows or columns, click the "right mouse button" in
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the position where the table needs to be added to bring up the operation window,
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choose to add rows or columns.

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 Figure 4-25; Exception Handling for Inspection Results

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4) Set alternative materials, BOM file inside a component has alternative alternative
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materials can be selected, it is necessary to each alternative materials were reflected in

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the BOM file inside, for example, alternative materials for the serial number of 1,
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optional material serial number were 1.1, 1.2, 1.3 ......, if you need to set the main

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material mouse click can be set to the main material.

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Figure 4-26; Alternate Material Setup

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5) Export Bom table, when exporting the file, you can select the columns to be exported,
there are specification value, description, package, dosage, bit number, manufacturer's
material number, manufacturer, serial number, the columns to be exported can be arranged in
order as needed, or you can combine the columns to be exported at will. "When the results of
the inspection cannot be confirmed for the time being, or the components need to be
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waiting for the material, you can download the report for archiving.
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Figure 4-27; Exporting the Bom Table and Downloading the Report
4.6 Matching Component Library iu
4.6.1 Matching Component Library Operating Principles
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1) Matching component libraries is to match all MGL library files in Huaqiu Mall, and
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when the match fails, you need to adjust the position of the MGL library files to match
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the components;
2) In the lower right, there is a view window with operation buttons to provide the
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function of adjusting the component layer to match the components, provided that a
device needs to be selected in the check result list to be able to adjust the operation
of moving the component library file;
3) Component display parameter list, the left list can be used in conjunction with the
right side of the calibration results, search component list, click on the left list, the
right side of the calibration results and search component list synchronization
operation display.
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Figure 4-28; Matching Component Library Page
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4.6.2 Component Matching Adjustment
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1) Click "Next" to proceed to the component type and set the flow direction after the
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match is approved.

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2) In the absence of matching to the component library, you can click the "right
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mouse button", the pop-up window can be rechecked, delete the component
library, sorting, output unmatched components and other operations, sorting can be
divided into the original sorting, do not match the component library, the check does
not pass, does not contain the option;
3) If you need to re-match after manual adjustment, click "re-match" to complete the
re-match again, the color of the serial number column, green represents "exact
match", yellow represents "manual match". The color of the serial number
column is green for "Exact Match", yellow for "Manual Match" and red for
"Unmatched Library";
4) Disk cover pins, PCB package pads compared to the device pins, suggesting that the
device pins and pad contact size, pads larger than the device pins show included, pads
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smaller than the device pins show not included, when the display does not include the need
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to pay attention to consider the SMT mounting difficulties.

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Figure 4-29; Component Matching Screen

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5) Alternative material matching results view, click on the alternative material does not
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pass the location of the pop-up window to view the main material and alternative
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material information, and at the same time, you can view the alternative material
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matching effect and the reasons for the match does not pass the bottom left corner of the
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graphic can choose to display the line layer, soldermask layer, silkscreen, drilling.
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Figure 4-30; Alternatives View
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6) The public component library that passes the verification is added to the private library,

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and the component library that has passed the matching is added to the private self-
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built library, each company builds libraries in a different way, and it is convenient to
modify the public library to the private library for the next matching. Public libraries can
be added to private libraries in batch, and the matching effect of the libraries can be
displayed in the lower left corner of the line layer, soldermask layer, silkscreen, and
drilled holes.
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Figure 4-31; Joining a Private Library

7) The list of calibration results, there are components of the information displayed, the
list of "mobile" shows the data is not matched by the yuan!
 The data of component layer offset, "Angle" is that the component layer is not
consistent with the angle of the file in the package library. The calibration result
shows "passed","not calibrated", the material that is not calibrated needs
to be adjusted to match the component layer, the mouse clicks on the column that is
not calibrated, together with the view window to adjust the component layer.

Figure 4-32; Calibration Result Prompt

8) To search for components in the library, enter the package name, library name,
number of pins, and pin spacing in the input box to accurately find components.
Replacement components can be used according to the component size, number of

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pins and pin spacing of the package to be replaced.

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Figure 4-33; Searching Library Components

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4.6.3 Adjustment of component libraries

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1) If the calibration result shows that it does not pass, click on the column that does not pass to
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see the result displayed in the graphic window, e.g., MGL library file
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Not aligned with component, need to adjust MGL library to match.

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2) To adjust the MGL library, click on the column where the calibration result fails, the view
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window will immediately locate the position of the failed component and zoom in to
view it. In the lower right corner of the operation button to adjust the MGL library to
match the components, adjustment can be rotated by 45 degrees, up, down, left, right,
and left, and the step of the movement can be adjusted according to the needs of the
size of the unit in millimeters.
3) Graphic display, adjust the graphic display of MGL library, you can display MGL library, display
line, display solder resist, display characters, display drill holes. You can display a certain
layer by ticking the display mode, and all layers need to be ticked.
4) After manual adjustment, you need to re-match, click "re-match" to finish re-matching
again.
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Figure 4-34; Adjustment Component Layer Window
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5) Output the component list, check the correctness of the matching of component

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library, and click "Output Component List" to output the adjusted and passed list
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for archiving after the matching is passed.

Figure 4-35; Output Component List

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4.6.4 SMT Pricing Tools
1) SMT pricing page list, click "SMT pricing tool" pop-up window to view the BOM parameters,
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package, bit number, and number.

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Functions such as quantity, model, production usage, availability of component

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libraries, number of pads, total number of pads, assembly type, confirmation of

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components, and operation.

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 Figure 4-36; SMT Billing Page
2) Basic operation, assembly type can be changed according to user needs, can be
changed to DIP, SMT, empty paste, unknown type, assembly type confirmed after
confirming that the component selection has been confirmed, the operation of the top and
bottom of the top and bottom of the components can be located in the top and bottom of
the specific location;

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Figure 4-37; Basic Operations
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3) The lower left corner has the position of the display device within the board, showing
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what kind of device it is;

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Figure 4-38; Device Display Window

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4) The lower right corner shows the production parameters, displaying the number of
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production, the number of patch surfaces, whether plug-in soldering, component

parameters show the type of patch device, the number of patches, the number of
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patch pads, and the type of plug-in device, the number of plug-ins, the number of
plug-in pads;
5) The total amount required for production is calculated based on all the parameters,
and also shows the board production size, tinned area, empty paste material, pads on
holes, and wire material;
6) The assembly type is shown in color, yellow for possible anomalies, green for smart
calibration/manual adjustment, and pink for empty postings.
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 Figure 4-39; Base Parameters
7) After the SMT pricing operation is completed, confirm that there is no error, you can output
the quotation list, click "Output quotation list" can be saved locally, and the quotation list
can be saved locally, and the quotation list can be saved locally.
 When all operations are complete, click Exit Billing to close the SMT Billing page;

Figure 4-40; List of Quotations

4.7 Component classification
1) Component type, support for matched component libraries in the DFA process,
automatic assignment of component types according to existing rules, class
Type can be re-selected.
2) The device package of the matched component library corresponds to an attribute
and stores the type (stored when the process is completed). The next time the same
data can be directly assigned according to this type, such as changing the material
package corresponding to the type has been modified, the storage of the last time
shall prevail.

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Figure 4-41; Component Type List

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4.8 parameterization
The direction of the SMT patch can be set up in the software, which is convenient for
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determining the direction of the patch. Then click on the "One Click Analyze" to check.
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Check for solderability anomalies in SMT assembly production.

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Figure 4-42; Parameter Settings

4.9 Summary of the chapter
 This chapter introduces the reader to the practical functional operation techniques for
organizing coordinate files and BOM tables in various file formats, as well as the functional
operation techniques for assembling and analyzing matching component libraries to
adjust matching components.
By the end of this chapter, the reader should be able to grasp the basic operations used
by the main functions of assembly analysis and have some familiarity with all the functions
of assembly analysis.

Software Technical Support

Chapter 5 DFM Use Cases

5.1 Example of a DFM m a n u f a c t u r a b i l i t y check
5.1.1 Breakwire:

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DFM check the broken line item, due to layout engineers wiring errors, leaving the broken
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line leads to the board factory need to put forward exceptions, not clear whether the

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broken line needs to be connected to other networks, if the broken line needs to have a
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network connection, need to be handled by the layout engineers wiring, the board
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factory to put forward exceptions to communicate the problem takes time, will lead to
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delays in the time and the delivery of the product. M q iu

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Figure 5-1; Header Lines

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5.1.2 Small hole ring spacing from pads:

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The DFM check hole ring to pad spacing item prevents short circuits during production, with the
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solder ring of the vias less than 3 mils from the pads of the patch.
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It will lead to production etching not open, if the hole ring is not the same network with the
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patch pad, it will lead to product short circuit can not be used.
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Figure 5-2; Small Spacing (Short Circuits)
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5.1.3 BGA pads are small:
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DFM check the minimum pad item, made of the ability to spray tin process to do small pads is
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10mil, non-sprayed board minimum pad is 8mil, such as

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If the design of the pad is smaller than the ability to make, the pad will be made very small,
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resulting in the inability to weld, if the pad spacing is sufficient, the layout engineer needs
to do the package to the pad size design is greater than the manufacturing parameters.

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Figure 5-3; BGA Size

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5.1.4 Small overbore weld ring:

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DFM checks the perforated pads item, the perforated pads are produced with a minimum of
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2mil for positive process and 3.5mil for negative process, the perforated pads are soldered
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with a minimum of 3.5mil.

Disk if you do negative process is less than 3.5 mil, may lead to line solder ring small, dry
film adhesion is not enough to break the film, etched holes without copper lead to open
circuit board scrap.
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Figure 5-4; Small Over-Hole Weld Ring
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5.1.5 Insert hole weld ring is small:
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DFM check the plug-in hole pad item, the plug-in hole minimum pad is guaranteed to be
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above 5mil to facilitate plug-in soldering. If the plug-in hole soldering

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The disk is very small, it is difficult to weld, PCB board factory production is also difficult to
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control the quality of plug-in hole damage.

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Figure 5-5; Insert Hole Solder Ring Small

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5.1.6 Hole spacing is close:

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DFM check the hole spacing item, the minimum hole spacing 6mil, regular 8mil or more, if the
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hole spacing is small close hole drilling will break the drill tip.
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Conductive vias with small hole spacing can be shifted, while plug-in holes require layout
engineers to change the package design, widen the hole spacing or reduce the hole diameter.
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Figure 5-6; hole spacing close
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5.1.7 Insufficient inner hole to line:
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DFM Check inner layer hole to line item, minimum inner layer hole to line 6 mil for 4-layer boards,
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6.5 mil for 6-layer boards, 7 mil for 8-layer boards, press-fit layer

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The distance between the number of holes and the line should be large, because there will
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be deviations in the press-fit lamination, and the plate will also be up and down. If the
distance between the holes is not enough, it will lead to short circuit after plating after
pressing and drilling. Therefore, if there is space in the design, try to design enough distance
between the holes and the line. iu
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Figure 5-7; Insufficient Inner Hole-to-Line

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5.1.8 There are no electrical connections to the SMD pads:

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DFM check SMT pads without connection, SMD pads without electrical properties connected to the
line belongs to the design anomaly, it is possible to draw the board wiring
Unfinished, or missed a patch connection, if the production are not found this abnormal,
will lead to the product open circuit, can not be used.
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Figure 5-8; No Electrical Connection to SMD Pad
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5.1.9 Dropping the line to open the road:
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DFM checks network connection entries, IPC network comparison, and during production CAM
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engineers handle the files just with modified

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The production of Gerber file is compared to the layout designed Gerber file, which is
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called network analysis. If the wires were dropped and opened during design, it would
be difficult for the board manufacturer to find out and produce the file according to the
layout design, resulting in the product being opened and unusable.
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Figure 5-9; Dropped Open Circuit

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5.1.10 Short Circuit:

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DFM checks network connection entries, IPC network comparison, and during production CAM
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engineers handle the files just with modified

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Producing a Gerber file and comparing it to a layout-designed Gerber file is called

network analysis. If two different networks are short-circuited during the design process, the
board manufacturer will not be able to detect the short-circuits, and the product will be short-
circuited and unusable if it is produced according to the layout design.
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Figure 5-10; Short Circuit
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5.1.11 The line width is too small:
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DFM check the line width item, the production capacity line width line spacing 3 mil, if the
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design is less than 3 mil, need to change the design, if it is

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The small pitch of BGA pads can't take 3mil line. It is necessary to change the package
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design of BGA to increase the pitch, or hit the hole in the disk according to the blind buried
hole program design, the line goes to the inner layer.

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Figure 5-11; Line Width Too Small

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5.1.12 The line spacing is small:

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DFM check line spacing items, design line spacing is less than 3 mil, the production can not
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produce etching will not be etched, resulting in a short circuit. Designed with
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If space is available, try to design the line spacing above 6mil to facilitate production and
increase the yield rate.
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Figure 5-12; small line spacing
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5.1.13 Insufficient pad to hole ring spacing:
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DFM checks the solder ring to pad item, when the over-hole solder ring is small and the spacing of
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the solder ring to the pad is small, the CAM engineer handles it during production.

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Production documents, will increase the over-hole welding ring, pads from the over-hole
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welding ring spacing is also small, increase the welding ring will be short-circuited, if not
detected, the production of finished products is scrapped.

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Figure 5-13; small line spacing

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5.1.14 Insufficient pad to wire spacing:

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DFM check pad to line item, minimum spacing 3 mil, pad to line spacing less than 3 mil,
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production will do etching pre-compensation.

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Ensure that the production line width is within 20% tolerance. 3mil pitch small compensation
1mil, pitch only 2mil,production etching is not open, will lead to short circuit scrap.
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Figure 5-14; Insufficient Pad-to-Wire Spacing
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5.1.15 Allegro design files short-circuit:
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DFM electrical network check item, in the DFM software, right click and select electrical network,
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found that the power supply is shorted with the ground, after the

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After checking the PCB file in Allegro. I found that the thermal ground holes of two SMD
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pads are shorted to the power supply layer, and the ground holes are not isolated in the
power supply layer, resulting in a short circuit.

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Figure 5-15; Allegro Design File Short Circuit

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5.1.16 PADS design file 2d line short:

DFM electrical network check item, in DFM software right click and select electrical network,
found that the power supply is shorted with the ground, after checking with the layout
engineer, there is a 2D line on the fifth layer, and the 2D line was not canceled when
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transferring the Gerber file, which led to checking the electrical network short circuit.
 Figure 5-16; PADS Design File 2d Line Shorting
5.1.17 Altium design file open circuit:
DFM electrical network check item, right-click inside the DFM software and select electrical network,
found that the second layer of the whole version of the ground network is not
The connection was made, and the file was opened with AD software to verify that the entire

version of the ground hole was isolated from the copper skin, thus causing the ground network
to be open.

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Figure 5-17; Altium Design File Open Circuit
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5.1.18 Altium design files short-circuit:
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DFM electrical network check item, right click inside DFM software and select electrical network,
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found that the +3.3v power supply is shorted to ground.

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After checking the PCB file in Altium. After checking the PCB file in Altium, I found that
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the +3.3v power supply holes of the two patch pads are shorted with the ground layer of
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the whole board, and the +3.3v power supply holes are not isolated in the ground layer,
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resulting in a short circuit.

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Figure 5-18; Altium Design File Short Circuit

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5.1.19 Open windows with exposed wires:

DFM soldermask open window abnormal check item, soldermask open window will expose
copper, the exposed copper will conduct electricity, when the open window is too large, resulting
in the
The wires from the different networks are also windowed, which can short out when soldering,
or short out during use of the finished product.
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Figure 5-19; Open Window Exposed Line
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5.1.20 Soldermask leaky casement windows:
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DFM Solder Resist Window Abnormal Check Item, Solder Resist is to prevent soldering, Solder
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Resist Ink is insulated and non-conductive, Solder Resist Window is to expose the solder.

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Copper in order to conduct electricity, when the place to be soldered does not have a window,
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covered with solder resist ink can not be soldered to use.

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Figure 5-20; Solder Resist Leakage Window

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5.1.21 Multi-opening windows in the patch layer:

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DFM Soldermask Open Window Abnormal Inspection Items, SMD Layer is used for SMD
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soldering and Soldermask Layer is the document used for printing soldermask.
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When the SMD layer has more windows than the soldermask layer, you need to check with
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the design engineers to see if you need to make a pad for this window. Failure to do so may
result in failure to solder when the pads are not made. If you find a problem, you have to
communicate with the design engineer, which will lead to delay and product delivery.
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Figure 5-21; Patch Layer Multiple Casement Window
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5.1.22 No used holes:
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DFM drilling check item, no electrical connection to the over-hole, the same as is useless holes,
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designed in the board waste of cost, detection

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This anomaly could also be a design error that missed the network connection for the
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overbore.

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Figure 5-22; Unwanted Perforations

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5.1.23 Electrical signals are not connected:

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DFM electrical signal check item, DFM one-click analysis, detected 178 electrical signal anomalies,
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which were verified in the AD software.

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Find the cause, found that the design documents do not lay copper, dynamic copper skin
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just draw a contour line, not laying copper leads to abnormal electrical signals throughout
the board. If the production of this board must be open circuit leading to scrap.
 Figure 5-23; No connection for electrical signals
5.2 Example of DFA assemblability check
5.2.1 The BOM does not match the package. The user's BOM table contains the model number
P6KE6.8CA, and the bit numbers D4, D5, and D8 are designed to match the package.
The PCB package is a DFN1610 SMD diode package, and the model number P6KE6.8CA in the
BOM list is actually a plug-in bi-directional diode package, so the designed package cannot be
used with the purchased components. If the PCB package is wrongly designed, there is no
way to remedy the problem if the board is not usable after production.

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Figure 5-24; BOM Table Model Number Error

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5.2.2 There is a model number in the BOM table, but there is no PCB package in reality. After PCB
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design is completed and the plate is made, the components are purchased according to the BOM
table, and it is only when assembling that we realize that there is no place to weld or patch
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the purchased components on the actual PCB board, and because we did not check the
BOM table in advance, it leads to a waste of cost for purchasing more components for this
product.
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Figure 5-25; Coordinate file without coordinates

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5.2.3 Device spacing, PCB layout did not consider whether the assembly, the production of the
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board assembly device distance is insufficient, it will lead to production difficulties, or can not be

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assembled. The spacing of the device is not enough even if it can be assembled, it is not
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convenient to repair in the future. PCB layout needs to consider the spacing between the
device and the device.

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Figure 5-26; Device Spacing Abnormal

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5.2.4 Components to the edge of the board, components to the edge of the board is not enough safe
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distance, in the assembly over the patch machine will be crashed devices on the edge of the board,
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collocation of production boards in the V-CUT machine will lead to the edge of the board
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device pads are cut small, the assembly of the device can not be patched. Therefore, PCB
design needs to leave enough devices to the edge of the board safety distance.
 Figure 5-27; Device to Board Edge Exception

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5.2.5 If the model number in the BOM table does not match the designed PCB device package,
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the purchased components do not match the pins of the devices on the board, resulting in

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the purchased components not being able to be used. When purchasing components, it is
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necessary to pay attention to whether the model number of the component is the one

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designed for the PCB package or not, so as to avoid unnecessary troubles during
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assembly in advance.

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Figure 5-28; Device and Plug-in Pinout Inconsistency

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5.2.6 The silkscreen is too far away from the device, when designing the PCB, the bit
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number of the character should be as close as possible to the PCB package of the component,
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the bit number of the character is too far away from the PCB package will lead to the
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assembly, it is impossible to recognize the corresponding PCB package of the component,

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which may lead to the wrong component.

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Figure 5-29; Silk Screen Bit Numbers Too Far Away from the
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Device
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5.2.7 Pin count mismatch, where the pin count of the SMD component does not match that
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of the PCB package, can lead to failure of SMD soldering. This problem can be caused by
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purchasing the wrong components due to the wrong component type in the BOM list, or by the
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wrong PCB package design.

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Figure 5-30; Inconsistent Patch Pin Counts

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5.2.8
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Toe distance, toe to the edge of the pad distance is not enough, there may be
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insufficient tin amount of soldering or welding risk, PCB design package production,
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need to consider the size of the pad size, to avoid the quality of the assembly of hidden
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problems.
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Figure 5-31; Device Toe Distance
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5.2.9 Toe width, device pins to the edge of the disk width distance is insufficient, there
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may be insufficient amount of tin soldering or welding risk, PCB design package
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production, need to consider the size of the size of the pad, to avoid the assembly of the

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quality of the hidden problems.

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Figure 5-32; Device Toe Width

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5.2.10 Pin contact with multiple pads, PCB packaging is done after the layout and wiring
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have been completed, the procurement of components BOM table of the wrong type,
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package name error, will lead to inconsistent pin number, device pin contact with multiple
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pads, so in the procurement of components is the BOM table must be the correct data.
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Figure 5-33; Device Pins Contacting Multiple Pads
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5.2.11 Pin contact area, drawing components in the PCB package, often encounter the
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size of the pad size is not a good grasp of the problem, because the component
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specifications is the size of itself, such as pin width, spacing, etc., but in the PCB board the

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corresponding size of the pad should be slightly larger than the size of the pins, otherwise the reliability
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of the weld will not be able to ensure that the design specifications need to be in accordance with the
design of the size of the pins.

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Figure 5-33; Device Pin Contact Area

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5.2.12 CHIP pad is too long, PCB component pad design is a key point, the quality of the
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final product is the quality of the solder joints. Therefore, whether the pad design is
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scientific and reasonable, is crucial. When the CHIP pad design is too long or the pad size
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is inconsistent, the soldering device may pull off, or lead to the device standing
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monument.
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Figure 5-35; CHIP Pad Anomaly
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5.2.13 No mark, after the board is done, components need to be mounted, nowadays the
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mounting of components is done by machines (SMT). mark is used in SMT, mark is used for
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the position identification point on the automatic mounting machine. The absence of

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marking points makes the placement of components inconvenient.

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Figure 5-36; No Marker Anomaly

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5.3 Risk composite rating

DFM inspection of the problem points, not absolutely must not be manufactured,
according to the type of problem, the importance of the problem, for the detection of each
assessment requirements defined "severity" and "likelihood" level, through the risk
assessment matrix can be automatically derived from the "comprehensive risk rating" to
effectively and objectively respond to Risk assessment matrix can be automatically
derived from the "comprehensive risk rating", so as to effectively and objectively
respond.
Table 5-1: "Reported Red" is a high risk issue, "Reported Yellow" is a medium risk
issue, and "Reported Green" is a low risk issue.
 Severity of risk occurrence Likelihood of risk
occurrence
✮ 1 margin ✮ 1 minimal
al
✮✮✮ 2 mildly ✮✮✮ 2 seldom
✮✮✮✮ 3 modera ✮✮✮✮ 3 stop (doing sth)
te
✮✮✮✮ 4 severity ✮✮✮✮ 4 likelihood
✮✮✮✮✮ 5 catastro ✮✮✮✮✮ 5 easily
phic

Severity of risk occurrence

Likelihood of risk
A (minor) B (mild) C (medium) D (severe) E (disaster)
occurrence
1 (very few) A1 B1 C1 D1 E1

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2 (rarely) A2 B2 C2 D2 E2
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3 (less) A3 B3 C3 D3 E3
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4 (possible) A4 B4 C4 D4 E4
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5 (likely) A5 B5 C5 D5 E5

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degree of Composite Comprehensive Risk composite

aggregation rating evaluations cover rating
extremely low ✮ a1, a2, a3, b1, b2, c1
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high risk
lower (one's head) ✮✮✮ A4, B3, C2
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A5, B4, B5, C3.C4, D1, D2, D3,

moderate ✮✮✮✮ medium
E1, E2
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risk
your (honorific) ✮✮✮✮ C5, D4, E3
high risk
extremely high ✮✮✮✮✮ D5, E4, E5
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5.4 Summary of the chapter

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This chapter introduces the reader to the pitfalls of EDA software design.PCB design is not
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as simple as just connecting the network wires; there are various other issues regarding the
design side, and the manufacturing side. Design determines the cost and quality of the
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product. Only by considering manufacturing can we solve the quality and efficiency
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problems that plague organizations.

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Through this chapter, the reader should be able to feel the importance of integrating
design and manufacturing. Only by synchronizing design and production can we save R&D
costs and shorten the R&D cycle.
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