am26lv32
am26lv32
am26lv32
AM26LV32, AM26LV32I
SLLS202G – MAY 1995 – REVISED OCTOBER 2017
2
1A
3 1Y
1
1B
6
2A
5
2Y
7
2B
10
3A
11
3Y
9
3B
14
4A
13 4Y
15
4B
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
AM26LV32, AM26LV32I
SLLS202G – MAY 1995 – REVISED OCTOBER 2017 www.ti.com
Table of Contents
1 Features .................................................................. 1 8.3 Feature Description................................................... 9
2 Applications ........................................................... 1 8.4 Device Functional Modes........................................ 10
3 Description ............................................................. 1 9 Application and Implementation ........................ 17
4 Revision History..................................................... 2 9.1 Application Information............................................ 17
9.2 Typical Application .................................................. 17
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 4 10 Power Supply Recommendations ..................... 19
6.1 Absolute Maximum Ratings ...................................... 4 11 Layout................................................................... 19
6.2 ESD Ratings.............................................................. 4 11.1 Layout Guidelines ................................................. 19
6.3 Recommended Operating Conditions....................... 4 11.2 Layout Example .................................................... 19
6.4 Thermal Information .................................................. 4 12 Device and Documentation Support ................. 20
6.5 Electrical Characteristics........................................... 5 12.1 Receiving Notification of Documentation Updates 20
6.6 Switching Characteristics .......................................... 5 12.2 Community Resources.......................................... 20
6.7 Typical Characteristics .............................................. 6 12.3 Trademarks ........................................................... 20
7 Parameter Measurement Information .................. 7 12.4 Electrostatic Discharge Caution ............................ 20
12.5 Glossary ................................................................ 20
8 Detailed Description .............................................. 9
8.1 Overview ................................................................... 9 13 Mechanical, Packaging, and Orderable
8.2 Functional Block Diagram ......................................... 9
Information ........................................................... 20
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
• Changed the MAX value of tsk(p) From: 6 ns To: 14 ns in the Switching Characteristics table .............................................. 5
• Changed the MAX value of tsk(o) From: 6 ns To: 14 ns in the Switching Characteristics table .............................................. 5
• Added ESD Ratings table, Thermal Information table, Feature Description section, Device Functional Modes,
Application and Implementation section, Power Supply Recommendations section, Layout section, Device and
Documentation Support section, and Mechanical, Packaging, and Orderable Information section....................................... 1
• Deleted MB570 from Features list .......................................................................................................................................... 1
• Deleted Ordering Information table; see Mechanical, Packaging, and Orderable Information at the end of the data sheet. 1
• Deleted Lead temperature (260°C maximum) from Absolute Maximum Ratings table.......................................................... 4
• Changed Package thermal impedance, RθJA, values in Thermal Information table From: 73°C To: 72.9°C (D) and
From: 64°C To: 74°C (NS) ..................................................................................................................................................... 4
D and NS Package
16-Pin SOIC and SO
Top View
1B 1 16 VCC
1A 2 15 4B
1Y 3 14 4A
G 4 13 4Y
2Y 5 12 G
2A 6 11 3Y
2B 7 10 3A
GND 8 9 3B
Not to scale
Pin Functions
PIN
I/O DESCRIPTION
NAME NO.
1A 2 I RS422, RS485 differential input (noninverting)
1B 1 I RS422, RS485 differential input (inverting)
1Y 3 O Logic level output
2A 6 I RS422, RS485 differential input (noninverting)
2B 7 I RS422, RS485 differential input (inverting)
2Y 5 O Logic level output
3A 10 I RS422, RS485 differential input (noninverting)
3B 9 I RS422, RS485 differential input (inverting)
3Y 11 O Logic level output
4A 14 I RS422, RS485 differential input (noninverting)
4B 15 I RS422, RS485 differential input (inverting)
4Y 13 O Logic level output
G 12 I Active-low select
G 4 I Active-high select
GND 8 — Ground
VCC 16 — Power supply
6 Specifications
6.1 Absolute Maximum Ratings
Over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
Supply voltage, VCC (2) –0.3 6 V
Input voltage, VI –4 8 V
Differential input voltage, VID (3) ±12 V
Enable input voltage –0.3 6 V
Output voltage, VO –0.3 6 V
Maximum output current, IO ±25 mA
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to the GND terminal.
(3) Differential input voltage is measured at the noninverting input with respect to the corresponding inverting input.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
(2) The package thermal impedance is calculated in accordance with JESD 51.
0.6 10
0.4 8
0.0 4
±0.2 2
±0.4 0
±0.6 ±2
±0.8 ±4
±1.0 ±6
A Disabled
±1.2 ±8
B Power Off
±1.4 ±10
±4 ±2 0 2 4 6 8 ±1 0 1 2 3 4 5 6
Common Mode Voltage (V) C002 Output Voltage (V) C003
Figure 1. RS422 Port Current vs Common-Mode Voltage Figure 2. Output Y Leakage Current vs Output Y Voltage
3.6
3.2
Output Drive Voltage (V)
2.8
2.4
2.0
VOL
1.6 VOH
1.2
0.8
0.4
0.0
0 5 10 15 20 25 30
Output Current (mA) C004
VOH
90% 90%
VCC Output 50% 50%
10% 10% V
OL
G G tr tf
(see Note C)
A. CL includes probe and jig capacitance.
B. The input pulse is supplied by a generator having the following characteristics: ZO = 50 Ω, PRR = 10 MHz, tr and tf
(10% to 90%) ≤ 2 ns, 50% duty cycle.
C. To test the active-low enable G, ground G and apply an inverted waveform G.
A Y
VID = 1 V VO
B
RL = 2 kΩ CL = 15 pF
(see Note A)
G
Generator G
(see Note B) 50 Ω
VCC
(see Note C)
VCC
Input 50% 50%
0V
t PZH t PHZ
VOH
VOH − 0.3 V
Output
Voff ≈ 0
A. CL includes probe and jig capacitance.
B. The input pulse is supplied by a generator having the following characteristics: ZO = 50 Ω, PRR = 10 MHz, tr and tf
(10% to 90%) ≤ 2 ns, 50% duty cycle.
C. To test the active-low enable G, ground G and apply an inverted waveform G.
RL = 2 kΩ
A Y
VID = 1 V VO
B
CL = 15 pF
G (see Note A)
Generator G
(see Note B) 50 Ω
VCC
(see Note C)
VCC
Input 50% 50%
0V
t PZL t PLZ
Voff ≈ VCC
Output VOL + 0.3 V
VOL
A. CL includes probe and jig capacitance.
B. The input pulse is supplied by a generator having the following characteristics: ZO = 50 Ω, PRR = 10 MHz, tr and tf
(10% to 90%) ≤ 2 ns, 50% duty cycle.
C. To test the active-low enable G, ground G and apply an inverted waveform G.
8 Detailed Description
8.1 Overview
The AM26LV32 device is a quadruple differential line receiver that meets the necessary requirements for NSI
TIA/EIA-422-B, TIA/EIA-423-B, and ITU Recommendation V.10 and V.11. This device allows a low-power or low-
voltage MCU to interface with heavy machinery, subsystems, and other devices through long wires of up to
1000 m, giving any design a reliable and easy-to-use connection. As with any RS422 interface, the AM26LV32
works in a differential voltage range, which enables very good signal integrity.
G 4
12
G
2
1A
3 1Y
1
1B
6
2A
5
2Y
7
2B
10
3A
11
3Y
9
3B
14
4A
13 4Y
15
4B
Equivalent of Each Input (A, B) Equivalent of Each Enable Input (G, G) Typical of All Outputs (Y)
V CC VCC VCC
7.2 kΩ
1.5 kΩ 100 Ω
Enable Y
A, B G, G
15 kΩ
1.5 kΩ
7.2 kΩ
(1) H = high level, L = low level, X = irrelevant, Z = high impedance (off), ? = indeterminate
(2) See Application and Implementation section
0V
Figure 9. Waveform 1
VIC = 1 V
VIL = 600 mV
0V
VIL = 0 V
0V
VIC = 400 mV
In most applications, having a common-mode input close to ground and a differential voltage larger than 2 V is
not customary. Because the common-mode input voltage is typically around 1.5 V, a 2-V VID would result in a VIL
of 0.5 V, thus satisfying the recommended VIL level of greater than 0.4 V.
Figure 13 plots seven different input threshold curves from a variety of production lots and shows how the fail-
safe circuitry behaves with the input common-mode voltage levels. These input threshold curves are
representative samples of production devices. The curves specifically illustrate a typical range of input threshold
variation. The AM26LV32 is specified with ±200 mV of input sensitivity to account for the variance in input
threshold. Each data point represents the input’s ability to produce a known state at the output for a given VIC
and VID. Applying a differential voltage at or above a certain point on a curve would produce a known state at the
Copyright © 1995–2017, Texas Instruments Incorporated Submit Documentation Feedback 11
Product Folder Links: AM26LV32
AM26LV32, AM26LV32I
SLLS202G – MAY 1995 – REVISED OCTOBER 2017 www.ti.com
output. Applying a differential voltage less than a certain point on a curve would activate the fail-safe circuit and
the output would be in a high state. For example, inspecting the top input threshold curve reveals that for a VIC
that is approximately 1.6 V, VID yields around 87 mV. Applying 90 mV of differential voltage to this particular
production lot generates a known receiver output voltage. Applying a VID of 80 mV activates the input fail-safe
circuitry and the receiver output is placed in the high state. Texas Instruments specifies the input threshold at
±200 mV, because normal process variations affect this parameter. Note that at common-mode input voltages
around 0.2 V, the input differential voltages are low compared to their respective data points. This phenomenon
points to the fact that the inputs are very sensitive to small differential voltages around 0.2 V VIC. TI recommends
that VIC levels be kept greater than 0.5 V to avoid this increased sensitivity at VIC ≈ 0.2 V. In most applications,
because VIC typically is 1.5 V, the fail-safe circuitry functions properly to provide a high state at the receiver
output.
Most
Applications
100
90
80
VID − Differential Voltage − mV
70
60
Not
50 Recommended
40
30
20
10
Increased Receiver Input Sensitivity
0
−1 −0.8 −0.6 −0.4 −0.2 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.4
Figure 14 represents a typical application where two receivers are not used. In this case, there is no need to
worry about the output voltages of the unused receivers because these are not connected in the system
architecture.
Connector AM26LV32
RT
System
RT
Unused Circuit
Figure 15 shows a common application where one or more drivers are either disabled or powered down. To
ensure the inactive receiver outputs are in a high state, the active receiver inputs must have VIL > 0.4 V and
VIC > 0.5 V.
Driver
Connector Connector AM26LV32
RT
Enable
RT
Cable
System
RT
Disable or
Power Off
RT
Figure 15. Typical Application Where Two or More Drivers Are Disabled
Figure 16 is an alternative application design to replace the application in Figure 15. This design uses two
AM26LV32 devices instead of one. However, this design does not require the input levels be monitored to ensure
the outputs are in the correct state, only that they comply to the RS-232 standard.
Driver
Connector Connector AM26LV32
RT
Enable
RT
Cable
Unused Circuit
Disable or
Power Off
System
AM26LV32
RT
RT
Unused Circuit
Figure 17 and Figure 18 show typical applications where a disconnected cable occurs. Figure 17 illustrates a
typical application where a cable is disconnected. Similar to Figure 15, the active input levels must be monitored
to make sure the inactive receiver outputs are in a high state. An alternative solution is shown in Figure 18.
Driver
Connector Connector AM26LV32
RT
Cable
RT
System
Unplugged RT
Cable
RT
Figure 17. Typical Application Where Two or More Drivers Are Disconnected
Figure 18 is an alternative solution so the receiver inputs do not have to be monitored. This solution also requires
the use of two AM26LV32 devices instead of one.
Driver
Connector Connector AM26LV32
RT
Cable
RT
Unused Circuit
System
AM26LV32
Unplugged
RT
Cable
RT
Unused Circuit
When designing a system using the AM26LV32, the device provides a robust solution where fail-safe and fault
conditions are of concern. The RS422-like inputs accept common-mode input levels from −0.3 V to 5.5 V with a
specified sensitivity of ±200mV. As previously shown, take care with active input levels because this can affect
the outputs of unused or inactive bits. However, most applications meet or exceed the requirements to allow the
device to perform properly.
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
AM26LV31E AM26LV32E
(One Driver) (One Reciever)
RT
DIN ROUT
D D
11 Layout
1 1B VCC 16
0.1 F
2 1A 4B 15
Termination Resistor
3 1Y 4A 14
5 2Y G 12
6 2A 3Y 11
7 2B 3A 10
8 3B 9
12.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 29-Jul-2023
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 29-Jul-2023
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 12-Aug-2022
B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers
Sprocket Holes
Q1 Q2 Q1 Q2
Pocket Quadrants
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 12-Aug-2022
Width (mm)
H
W
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 12-Aug-2022
TUBE
T - Tube
height L - Tube length
W - Tube
width
Pack Materials-Page 3
PACKAGE OUTLINE
NS0016A SCALE 1.500
SOP - 2.00 mm max height
SOP
10.4 2X
10.0 8.89
NOTE 3
8
9
0.51
16X
5.4 0.35
B 0.25 C A B 2.00 MAX
5.2
NOTE 4
0.15 TYP
SEE DETAIL A
0.25 0.3
GAGE PLANE 0.1
0 - 10
1.05
0.55 DETAIL A
TYPICAL
(1.25)
4220735/A 12/2021
NOTES:
1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm, per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm, per side.
www.ti.com
EXAMPLE BOARD LAYOUT
NS0016A SOP - 2.00 mm max height
SOP
1 16
16X (0.6)
SYMM
14X (1.27)
8 9
(R0.05) TYP
(7)
4220735/A 12/2021
NOTES: (continued)
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EXAMPLE STENCIL DESIGN
NS0016A SOP - 2.00 mm max height
SOP
1 16
16X (0.6)
SYMM
14X (1.27)
8 9
4220735/A 12/2021
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.
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