EBD5000 Product Specification 2-December-2021

Rev: 1.5 Page 1 of 18

DRIVER BOARD EBD5000

Product Specification Document

Revision: 1.5
Date: 2-December-2021
Confidentiality: None

Prepared by: Tim von Niederhäusern

(Project Manager)

Checked by: Jean Dahdah

(Product Engineering Manager)

Approved by: Philipp Vorreau

(Quality Manager)

Authorized by: Marcus Duelk

(CTO)
 EBD5000 Product Specification 2-December-2021
Rev: 1.5 Page 2 of 18

CONTENTS

1 SCOPE .................................................................................................................3
1.1 Purpose ................................................................................................................................... 3
1.2 Board Revision ........................................................................................................................ 3
1.3 Responsibility .......................................................................................................................... 3
2 LASER SAFETY ..................................................................................................3
3 PRODUCT DESCRIPTION ..................................................................................4
3.1 Architecture ............................................................................................................................. 4
3.2 Features .................................................................................................................................. 4
3.3 Operating Range ..................................................................................................................... 4
3.4 RoHS Compliance ................................................................................................................... 4
4 EBD5000 DRIVER BOARD .................................................................................5
4.1 Printed Circuit Board (PCB) .................................................................................................... 5
4.2 Electrical User Interfaces ........................................................................................................ 6
4.3 Operating Conditions .............................................................................................................. 9
4.4 Performance Characteristics ................................................................................................... 9
5 ADAPTER BOARD (EBA) ................................................................................. 11
6 DISPLAY BOARD (DIB) .................................................................................... 13
7 OPERATING INSTRUCTIONS .......................................................................... 15
7.1 Ambient Temperature ...........................................................................................................15
7.2 Supply Voltage ......................................................................................................................15
7.3 Protective Earth (PE) ............................................................................................................15
7.4 Temperature Controller (TEC) ..............................................................................................15
7.5 Enabling the SLED ................................................................................................................15
7.6 Adjusting the Drive Current ...................................................................................................15
7.7 On-Off Modulation .................................................................................................................16
7.8 Analog Current Modulation ...................................................................................................16
7.9 Open-Collector Outputs ........................................................................................................17
7.10 Disabling the SLED ...............................................................................................................17
7.11 Hot-Plugging the Supply Voltage ..........................................................................................17
7.12 Warm-up Time.......................................................................................................................17
7.13 Temperature Alarm ...............................................................................................................17
8 REVISION HISTORY.......................................................................................... 18
 EBD5000 Product Specification 2-December-2021
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1 SCOPE

1.1 PURPOSE
The purpose of this document is to describe the set of functional features, the performance and the
user interfaces of EXALOS’ analog driver board EBD5000 for SLEDs (Super-Luminescent Emitting
Diodes) and pin-compatible laser diodes. The EBD5000 features a multi-pin connector, which is used to
connect an adapter board that is specific to the module type of the SLED.

1.2 BOARD REVISION

This product specification is based on the EBD5000 production series, revision V3.1.

1.3 RESPONSIBILITY
EXALOS is responsible for establishing, implementing and maintaining this specification. The quality
representative shall ensure that a timely Engineering Change Notice (ECN) is issued in accordance with
EXALOS’ procedure for any changes.

2 LASER SAFETY
This driver board in combination with a SLED is an OEM, low-voltage, DC-powered laser component
specifically designed for incorporation or integration into other equipment that is then sold as end
product, i.e., as laser system that includes a power supply. As such, this component DOES NOT MEET
the full requirements for a stand-alone laser system as defined by 21 CRF 1040.10 and IEC/EN 60825-
1:2014.
During installation it is vital that the laser hazard is fully managed. In particular, the laser integrator
(i.e., the manufacturer of the laser system as end product) is required to provision the engineering
requirements detailed in Clause 4.0 of IEC/EN 60825-1, classify the end product (the laser system) and
assure compliance with all clauses of IEC/EN 60825-1.

WARNING: If the OEM driver board is sold with an EXALOS SLED mounted, the
laser class of the laser system as end product can be as high as Class 3B per IEC
60825-1:2014 depending on the SLED type. Refer to EXALOS’ SLED specification
documents for detailed information. For the safe use of the laser system,
appropriate laser safety measures including protective equipment such as laser
safety glasses may be required depending on SLED type mounted. Also follow
the legal regulations on occupational safety in your country.
 EBD5000 Product Specification 2-December-2021
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3 PRODUCT DESCRIPTION

3.1 ARCHITECTURE
The EBD5000 is a high-performance analog driver board that consists of a multi-layer PCB board with a
multi-pin connector to which adapter boards can be connected supporting various types of optical
modules, for example 14-pin butterfly (BTF), 14-pin dual-in-line (DIL), transmit optical sub-assembly
(TOSA) or others. The multi-layer PCB design with shielding ground layers allows for the co-existence of
a highly efficient switched-mode temperature controller (TEC) with a low-noise linear SLED drive
current controller in a compact form factor with the size of a credit card. Furthermore, the multi-layer
PCB design features a sophisticated heat-spreading thermal design that reduces hot spots, which is the
basis for stable operation at high ambient temperatures.

3.2 FEATURES
The main characteristics of the EBD5000 are:
• High-efficiency switched-mode TEC supporting high-power SLEDs at high ambient temperatures
• Generation of an ultra-stable, ultra-low noise SLED drive current
• Adjustment of the SLED drive current either through an external analog control voltage
(0-2.5V) or through the on-board potentiometer
• SLED enable either through a mechanical code switch or through an electrical TTL signal
• Digital on-off modulation with TTL signals
• Noise and spike filter network and brown-out detector for input supply voltage
The EBD5000 features a stabilization feedback loop for the SLED drive current (automatic current
control, ACC) but not for the SLED output power (automatic power control, APC). If required, APC
would have to be realized through external control loops, for example using either the monitor
photodiode (MPD) signal of the JP2 connector or using any external MPD in conjunction with control of
the SLED drive current through an analog control signal at JP3.

3.3 OPERATING RANGE

The EBD5000 has been designed for operation over a wide temperature range. Only industrial-grade
components have been selected that are qualified for operating temperatures from -40 °C to +85 °C.
The standard temperature operating range of the EBD5000 is -20 °C to +65 °C.
The EBD5000 is designed to ensure proper operation in environments with electro-magnetic
interference (EMI) by using a star-like ground concept and various levels of analog grounds throughout
the design.
The EBD5000 requires a stable +5V power supply in the range of 4.90 V to 5.20 V. Supply voltages
outside this range may result in improper operation or elevated power dissipation of the electronics.
Spiky and unstable supply voltages may activate the on-board spike and brown-out detector, resulting
in a controlled shut-off followed by a ramp-up of the SLED current. The required supply current is
composed of the SLED drive current and the Peltier current. The maximum supply current is 3 A for a
maximum SLED drive current of 1000 mA and a maximum Peltier current of 1800 mA. Typical supply
current under operation might be significantly lower, depending on the SLED and ambient temperature.

3.4 ROHS COMPLIANCE

Based on the information obtained from our suppliers, the EBD5000 is compliant with the Restriction of
Hazardous Substances (RoHS) directive 2011/65/EU and subsequent amendments thereof (including
2015/863/EU).
 EBD5000 Product Specification 2-December-2021
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4 EBD5000 DRIVER BOARD

4.1 PRINTED CIRCUIT BOARD (PCB)

The EBD5000 board has a size of 70 mm (L) x 55 mm (W). Fig. 1 shows pictures of the front side of the
EBD5000 board. Fig. 2 shows a schematic top view of the board and the names of connectors,
switches, potentiometers and LED indicators.

Fig. 1 Top view of the EBD5000 board

Fig. 2 Schematic top view of the EBD5000 indicating the user interfaces
 EBD5000 Product Specification 2-December-2021
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4.2 ELECTRICAL USER INTERFACES

Different to the EBD5200, EBD5800 or similar OEM boards, the EBD5000 is not intended to be
packaged in a metal case. Therefore, in principle, more connectors or status signals are available, for
example the LED indicators or the JP2 connector to which a display board (DIB) can be connected.
Table 1 provides a list of all electrical connectors that belong to the user interface.

Name Connector on Function Mating connector for

EBD5000 board cable assembly

JP1 MOLEX “Micro-Fit 3.0”; +5V power supply, GND, PE MOLEX “Micro-Fit 3.0”;
43650-0300 43645-0300
Header (male) Receptacle (female)

JP2 Tyco “Micro-MaTch”; On-board diagnostics Tyco “Micro-MaTch”;

1-215079-0 (for EXALOS use only) 8-215083-0
female-on-board male-on-wire

JP3 MOLEX “Milli-Grid”; SLED enable & on-off modulation, MOLEX “Milli-Grid”;
87833-1620 analog and digital input & output 51110-1651
Header (male) signals Crimp Housing

Table 1 List of electrical connectors (user interface)

Fig. 3 shows the front view of the connector JP1 and JP3. The corresponding pinout information is
listed in Table 2 and Table 3, respectively.

Fig. 3 Front view of header JP3 and JP1 with pin indication.
The green bar indicates the PCB of the EBD5000.
 EBD5000 Product Specification 2-December-2021
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Pin Name Function Description /Comment

1 PE Input Protective Earth, to ground the metal case

2 GND Input External electrical Ground (3A)

3 +5Vext Input External 5V power supply (4.90-5.20 V, 3A)

Table 2 Pinout of header JP1

Pin Name Function Description / Comment

1 Modulation Input 5V TTL digital modulation signal

2 +5Vin Output 5V supply voltage from JP1, for configuration purposes only,
e.g., enable the SLED through short to pin3

3 SLEDenable Input 5V TTL digital signal to enable/disable the SLED

4 GNDext Output GND reference for Modulation or SLEDenable when realized

with open-collector outputs, preferably not be used otherwise
to avoid GND loops (use instead pin2 of JP1 as GND
reference for Modulation and SLEDenable if possible)

5 n/c None Not connected

6 n/c None Not connected

7 SLED_enabled Output Open-collector output indicating SLED is on

8 AIN_enabled Output Open-collector output indicating that SLED current is

controlled through pin15/pin16

9 AIN_alarm Output Open-collector output indicating excessive analog input

voltage at pin15/pin16 is applied and limited to +2.5V

10 TEC_alarm Output Open-collector output indicating the read temperature of the

SLED being either 1.5°C above or below the set temperature

11 GNDext Output GND reference for pin7, pin8, pin9, pin10

12 GNDext Output GND reference for pin7, pin8, pin9, pin10

13 AINenable Input Enable SLED current control through pin15/pin16

14 +5Vin Output 5V supply voltage from JP1, for configuration purposes only,
e.g., enable analog control through short to pin13

15 +AINextern Input Analog input voltage (0-2.5V) to control SLED current

16 -AINextern Input GND reference of analog input signal (pin 15)

Table 3 Pinout of header JP3

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Pin7 to pin10 of connector JP3 contain digital alarm or status signals that are decoupled from the rest
of the electronics through opto-couplers. They are open-collector outputs with a common ground
“GNDext” that is on pin11 and pin12 of JP3. These alarm signals are also logically connected to the four
LEDs that are found on the board. As shown in Table 4, the pinout sequence of JP3 matches the
configuration sequence of the LED indicators (except for power indicator LED0).

LED Name Description / Comment

LED0 Power Indicating supply voltage with correct polarity after the fuse
(green) and brown-out and spike detector

LED1 SLED_enabled Open-collector output indicating SLED is on

(green)

LED2 AIN_enabled Open-collector output indicating that SLED current is

(orange) controlled through pin15/pin16

LED3 AIN_alarm Open-collector output indicating excessive analog input

(orange) voltage at pin15/pin16 is applied and limited to +2.5V

LED4 TEC_alarm Open-collector output indicating the read temperature of the

(red) SLED being either 1.5°C above or below the set temperature

Table 4 Configuration of LED indicators

The left side of connector JP3 contains pins for analog control of the SLED drive current and hence of
the optical output power. The analog input pins shall be handled with care as they are not decoupled
through opto-couplers, which may, in cases of false connectivity, result in unwanted GND loops. Pin15
and pin16 allow for applying an analog control voltage (0 to +2.5V) in order to control the SLED current
and to use the EBD5000 as part of an analog control loop. The analog control input voltage at +AINext
and –AINext are fed into an instrumentation amplifier of high accuracy, low offset voltage and low drift.

Position AINenable SLEDenable TECenable

0 Off Off On

1 Off On On

2 On Off On

3 On On On

4 Off Off Off

5 Off On Off

6 On Off Off

7 On On Off

Table 5 Configuration table for code switch S1

 EBD5000 Product Specification 2-December-2021
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Table 5 shows possible configurations of the EBD5000 that can be selected through the code switch S1.
The default configuration of S1 is ‘0’, i.e. the temperature controller (TEC) is enabled but the SLED and
the current control through an analog input signal is disabled. This means that the TEC is working as
soon as a supply voltage is applied. The SLED is turned off and can be turned on through an active-
HIGH (5V) signal on pin3 of JP3 or by switching the code switch S1 to ‘1’. The SLED current can be
adjusted through the potentiometer P1.

Still, even in configuration ‘1’ the SLED current can be adjusted electronically through pin15 and pin16
of JP3. In order to enable the control through an external analog signal an active-HIGH (5V) signal
needs to be applied to pin13 of JP3, for example by shortening pin13 and pin14. In this case the setting
of potentiometer P1 is ignored.

The TEC shall only be disabled for SLED modules not featuring a Peltier element. For standard BTF or
DIL modules with an internal Peltier element the default configuration of S1 has the TEC enabled as it
cannot be enabled electronically.

4.3 OPERATING CONDITIONS

Table 6 shows the typical, minimum and maximum operating conditions of the EBD5000 driver board.

Parameter Min. Typ. Max.

Supply Voltage 4.9 V 5.0 V 5.2 V

Supply current, SLED disabled, TEC enabled (1)

0.3 A 2.0 A

Supple current, SLED enabled, TEC enabled (2)

0.8 A 3.0 A

Ambient operating temperature (3)

-20 °C 65 °C

Ambient storage temperature -40 °C 85 °C

(1)
: Typical value at room temperature. Larger than typical supply currents can occur during power-up of the board or at extreme
ambient temperatures.
(2)
: Typical value at room temperature and SLEDs up to 500 mA. Larger than typical supply currents can occur during power-up
of the board or at extreme ambient temperatures.
(3)
: Extended temperature range from -40°C to +85°C available upon request.

Table 6 Operating conditions of the EBD5000

4.4 PERFORMANCE CHARACTERISTICS

Table 7 shows the typical performance of an EBD5000 driver board that was assessed with various
short-wavelength and long-wavelength SLED modules from EXALOS. Furthermore, spectral noise
measurements were performed with a high-precision electrical resistor and compared to optical relative
intensity noise (RIN) measurements carried out with SLED modules.
During mid-term (up to 24 hours) experiments in an environmental chamber, measurements of the
SLED current were performed every 6 seconds. The time-related drift was extracted through adjacent-
averaging smoothing with a 1-hour window size (sliding-window averaging); the drift is not cumulative,
i.e. drift over 24 hours can be zero. During mid-term and long-term (up to 1000 hours) experiments in
a module test system, measurements of the SLED current and temperature were performed every 1
second and averaged over five minutes (300 samples) in order to record long-term trends.
 EBD5000 Product Specification 2-December-2021
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Parameter Maximum
(ptp=peak-to-peak, rms=root mean square) Typical Conditions/Comments
Rating
Extended current range up to
Drive current 600 mA
1000 mA upon request
Compliance voltage 3.0 V
Extended TEC currents up to
TEC current 1.8 A
3.0 A upon request
TEC temperature stability ptp 24h ±0.002 °C ±0.01 °C Equivalent to ±100 ppm @ 20 °C

TEC temperature drift 1000h ±0.07 ppm/h ±0.1 ppm/h Linear interpolation over 1000 h
Ambient temperature constant
Current stability ptp 24h ±75 ppm ±100 ppm
within ±0.5 °C
Ambient temperature constant
Current stability rms 24h ±20 ppm ±30 ppm
within ±0.5 °C
Ambient temperature constant
Current stability ptp 1h ±75 ppm ±100 ppm
within ±0.5 °C
Ambient temperature constant
Current stability rms 1h ±20 ppm ±30 ppm
within ±0.5 °C
Mid-term current drift 24h ±9 ppm/h ±12 ppm/h 1h sliding window

Long-term current drift 1000h ±0.5 ppm/h ±0.8 ppm/h Linear interpolation over 1000 h
Average value, not including
Temperature-related current change (1) ±10 A/°C ±15 A/°C
warm-up
Extracted from spectral noise
Current noise 1.3 Arms 1.5 Arms
measurements (1 kHz – 10 MHz)
Turn-on delay for SLED enable (2) 100 ms

Turn-on delay on-off modulation (2) 10 ms

10:90 rise time on-off modulation (2) 1 ms

Max. on-off modulation frequency (3) 50 Hz

Max. analog modulation frequency (3) 3 Hz

(1): Typically a change of 1.0 mA or less in drive current is measured over temperature range from -40°C to +85°C.
(2): The EBD5000 features a built-in safety circuitry that powers down the electronic driver stage of the SLED whenever the SLED
is disabled. This guarantees that under no circumstances the driver board can generate any light output from the SLED as long as
the SLED is disabled. Furthermore, this turn-on delay also guarantees a controlled power-up behavior of the board in case the
supply voltage is cycled while the SLED is enabled.
(3): The default configuration of the EBD5000 board is optimized for lowest possible noise performance with modulation rates of
a few Hertz. The modulation switch on the board supports modulation rates up to 10 MHz and the default OpAmps support
modulation rates up to 30 kHz. Upon request customized versions of the EBD5000 can be realized that support faster modulation
rates, for example up to 10 kHz, at the expense of higher current noise.

Table 7 Typical performance characteristics of the EBD5000

 EBD5000 Product Specification 2-December-2021
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5 ADAPTER BOARD (EBA)

The EBD5000 belongs to the EBD5x00 OEM driver board family and shares the design concept and
most of the components. However, the EBD5000 features a multi-pin connector that allows for
supporting various types of SLED modules through module-specific adapter boards (EBAs). The whole
assembly of EBD5000 driver board and module-specific adapter board is called EBD50y0 (the y specifies
the package type of the optical module and hence the type of EBA).

As the EBD50y0 assembly is not packaged into a metal case like the other EBD5x00 OEM boards, the
on-board diagnostic connector JP2 is easily accessible. An optional alphanumeric display board (DIB,
see section 6) can be connected to JP2 that informs about various SLED parameters. The following
pictures show such driver board assemblies for BTF modules (EBD5020, Fig. 4), for DIL modules
(EBD5010 or EBD50F0, Fig. 5) or for TOSA modules (EBD5080, Fig. 6), respectively.

Fig. 4 Top view of an EBD5020 with an adapter board for 14-pin BTF modules

Fig. 5 Top view of an EBD5010 with an adapter board for 14-pin DIL modules.
The EBD50F0 will feature an adapter board for floating 14-pin DIL modules.
 EBD5000 Product Specification 2-December-2021
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Fig. 6 Top view of an EBD5080 with an adapter board for TOSA modules.

The dimensions of the EBD5000 and of the EBAs are 70 mm (L) x 55 mm (W), respectively. The
dimensions of the EBD50y0 assembly are therefore 140 mm (L) x 55 mm (W). The driver board
assembly is mounted on metal stands (typically 30 mm) such that heat sinks below the EBA can be
mounted, for example for BTF or TOSA modules.
The metal case of the SLED module is, except for the EBD5010, connected to pin1 of JP1, which shall
be connected to protective earth (PE).
The EBA adapter boards do not require a separate external power supply unit but receive the supply
voltage through the EBD5000 driver board.
 EBD5000 Product Specification 2-December-2021
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6 DISPLAY BOARD (DIB)

The display board of the EBD5000 series features a 2-line illuminated alphanumeric display that is
operated by a microcontroller, two control buttons (up/down) and a serial UART interface for data
logging through an external PC. The DIB is powered by the 5V supply voltage of the EBD5000 driver
board that is provided through the JP2 connector.
During the power-up of the DIB the display shows the firmware version for one second. After this boot
screen the DIB displays the SLED drive current (mode 1), as shown in Fig. 7. The lower button allows
for incrementing the display mode by one, the upper button allows for decrementing the display mode
by one. The supported modes are:
• mode 1 = SLED drive current (Fig. 7)
• mode 2 = SLED forward voltage (Fig. 8)
• mode 3 = SLED temperature (Fig. 9)
• mode 4 = TEC current (Fig. 10)
• mode 0 = all four parameters displayed at the same time (Fig. 11)
Repeated pressing of either the up or down button will cycle through all modes, i.e. incrementing the
mode 4 by one will result in mode 0 and decrementing mode 0 by one will result in mode 4.

Fig. 7 Display-Board DIB5000 in default display mode 1 (SLED drive current)

Fig. 8 Display-Board DIB5000 in display mode 2 (SLED forward voltage)

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Fig. 9 Display-Board DIB5000 in display mode 3 (SLED temperature)

Fig. 10 Display-Board DIB5000 in display mode 4 (TEC current)

Fig. 11 Display-Board DIB5000 in display mode 0 (all four parameters)

As mentioned above, the DIB also features an UART interface at which the current four parameter
readings are transmitted at a rate of 10 Hz. Using an UART-to-RS-232 adapter the DIB can be
connected to a serial port of a PC for data monitoring or data logging. EXALOS can provide, upon
request, software tools that read out and display these signals.
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7 OPERATING INSTRUCTIONS

7.1 AMBIENT TEMPERATURE

Make sure the ambient operating temperature is within -20 °C to +65 °C, unless specified differently by
EXALOS.

7.2 SUPPLY VOLTAGE

Make sure a stable supply voltage within 4.90 V to 5.20 V is applied with the correct polarity. Polarity
inversion will not harm the SLED but might eventually result in damage of the on-board supply voltage
filter network. For first testing it might be therefore useful to set the current limit to 1.5-2.0 A and
monitor the LED0 indicator. The on-board 3A fuse has a current- and temperature-dependent pre-
arcing time, i.e. lower current limits will result in longer pre-arcing times and hence more time for the
user to react to accidental polarity inversion. The EBD5000 is not sensitive to noise of the supply
voltage as it features various filter networks and ground decoupling stages as well as a spike and
brown-out detector.

7.3 PROTECTIVE EARTH (PE)

Make sure to provide a low-impedance connection to protective earth in order to avoid unwanted and
uncontrolled electro-static discharges (ESD). A PE connection shall be realized through a short cable
connection at the power supply connector JP1 (pin 1).

7.4 TEMPERATURE CONTROLLER (TEC)

For the default configuration of code switch S1 and for SLED modules featuring a Peltier element, the
TEC is working as soon as a supply voltage is applied to the board. The TEC is a high-performance
switched-mode controller that is working at an internal frequency of 1 MHz. Depending on the ambient
temperature it may take a few seconds after turn-on of the board for the TEC to stabilize the SLED
temperature. During this stabilization period the TEC may operate the Peltier element at a maximum
current of 1.8 A, resulting in a high supply current. It is recommended to enable the SLED only when
the TEC is in a stable condition, indicated through the temperature alarm (LED4 and pin10 of JP3)
being off.

7.5 ENABLING THE SLED

The SLED is enabled and the optical power is turned on either by applying a 5V signal to pin3 of JP3
(active-HIGH) or by turning the code switch S1, for example to ‘1’. When using an electronic enable
signal, e.g., 5V TTL, make sure that the voltage is relative to the GNDext on pin4 of JP3. Enabling the
SLED will first power up all OpAmps of the driver stage before the optical power is turned on after a
built-in time delay. The turn-on sequence guarantees proper operation of the driver board even when
the power supply is hot-plugged though the SLED was enabled. This means that the SLED can be
enabled with the drive current being set to the maximum level, i.e. it is not necessary to ramp up the
drive current manually. Furthermore, the driver board generates a current ramp of several milliseconds
at turn-on to avoid optical power overshoots. The time delay for the turn-on depends on the SLED drive
current. For zero drive current the SLED will not be enabled (infinite time delay) while for maximum
drive current the SLED will be enabled fastest.

7.6 ADJUSTING THE DRIVE CURRENT

The SLED current level can be either manually adjusted through the potentiometer P1 using a
screwdriver (turning the screw counterclockwise increases the drive current) or through an analog
control signal (AIN, 0 to +2.5V) applied to pin15 and pin16 of JP3. When adjusting the current level
 EBD5000 Product Specification 2-December-2021
Rev: 1.5 Page 16 of 18

electronically, make sure that the analog control is enabled (AINenable, pin13 of JP3) or that the code
switch S1 is in a position that enables the analog control, for example position ‘2’. When using a signal
for AINenable, e.g., 5V TTL, make sure that the voltage is relative to the GNDext on pin12 of JP3.
The analog input voltage is limited to 2.5V on the board to ensure safe operation. AIN voltages larger
than 2.5V are clipped and an alarm signal is enabled (LED3 and pin9 of JP3).

7.7 ON-OFF MODULATION

The SLED current can be turned on and off with a TTL modulation signal through pin1 of JP3. The logic
is inverted, i.e. an open connection at pin1 or 0V (LOW) leaves the SLED on (optical power is HIGH)
while 5V at pin1 (HIGH) turns the SLED off (optical power is LOW). When using an active modulation
signal, e.g., 5V TTL, make sure that the voltage is relative to the GNDext on pin4 of JP3. Fig. 12 shows
the modulation behavior and modulation bandwidth of the EBD5000 driver board in its standard
configuration. The maximum modulation frequency is specified in Table 7.

Fig. 12 Duty cycle of SLED current or optical output power for a TTL modulation input signal
with 50% duty cycle as a function of modulation frequency for the standard
configuration of the EBD5000. Because of the inverted logic of the modulation input
this graphs also shows the required duty cycle of the electrical modulation input
signal in order to achieve a 50% duty cycle for the optical output or SLED current.

Faster modulation frequencies may be realized upon request. However, faster current rise times can, in
principle, lead to unwanted optical power transients if the rise time of the drive current is below ten
microseconds. Therefore, EXALOS offers faster modulation rates only based on customer requests.
There is no intentional time delay or current ramp for the turn-on of the SLED under on-off modulation,
different to the procedure of enabling the SLED. Turning off the SLED through pin1 of JP3 will also not
power down the OpAmps of the driver stage.

7.8 ANALOG CURRENT MODULATION

The SLED current level and hence the optical power can be varied or modulated through pin15 and
pin16 of JP3. The maximum modulation frequency is specified in Table 7. Faster modulation frequencies
may be realized upon request.
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7.9 OPEN-COLLECTOR OUTPUTS

Status and alarm indicators at JP3 are realized as open-collector outputs that are decoupled from the
GND potentials of the EBD5000 driver board. According to Table 3, these digital outputs are
“SLED_enabled” (pin7), “AIN_enabled” (pin8), “AIN_alarm” (pin9) and “TEC_alarm” (pin10). In order,
for example, to illuminate an external LED in the presence of an alarm, a minimum load has to be
considered to limit the current through the open-collector opto-couplers on the EBD5000 board, as
shown in Fig. 13. Positive external voltages (+U) in the range of 3V to 28V are acceptable as long as
the current does not exceed 20 mA. For example, for a voltage +U=5V a minimum load R of 250 Ohms
would be required. The external voltage +U shall be relative to GNDext at pin11 or pin12 of JP3.

+U (relative to GNDext)

pin4 (JP5)
pin5 (JP5)

GNDext

Fig. 13 Example of using an open-collector alarm output of JP3 to illuminate an

external LED. The load R limits the current to max. 20 mA.

7.10 DISABLING THE SLED

In order to disable the SLED and hence the optical output apply 0V to pin3 of JP3 (active-HIGH). If the
code switch S1 was previously used to enable the SLED then S1 may be switched back to the original
position to disable the SLED while it is running, i.e. it is not required to turn down the drive current of
the SLED before disabling it. When the SLED is disabled all OpAmps of the SLED driver stage are
powered down as an additional safety feature. In case of loss of supply voltage before disabling it, the
SLED is automatically and safely powered down.

7.11 HOT-PLUGGING THE SUPPLY VOLTAGE

As mentioned earlier the supply voltage of the EBD5000 can be hot-plugged while the SLED is enabled
without harming the SLED. The SLED is safely powered up or powered down when the supply voltage is
hot-plugged.

7.12 WARM-UP TIME

As any other electronics the EBD5000 has a warm-up time until, for example, the current drift during
the turn-on phase is minimized. Typical warm-up time at 20 °C ambient temperature is 20 minutes.

7.13 TEMPERATURE ALARM

In case of a permanent temperature alarm for more than 30 seconds, the drive current is automatically
disabled in order to protect the SLED. This may happen if the heat sinking of the optical module is
insufficient or if the ambient temperature is exceeding the specified operating range, or if otherwise the
TEC is unable to control the SLED temperature.
 EBD5000 Product Specification 2-December-2021
Rev: 1.5 Page 18 of 18

8 REVISION HISTORY

Revision History
Rev. Description ECN Number Date (ECN) Released
0.1 Initial document for EBD5000 - - 06.01.2010
1.0 First full specification release - - 13.12.2010
1.1 Added information on protective earth connection 0499 29.02.2012 29.02.2012
in section 6 and on input/output connectors in
section 3.2; renamed “Temperature_alarm” in
“TEC_alarm”
1.2 Updated information on user interface connector 0515 13.04.2012 13.04.2012
due to new driver board version V3 of EBD5000
with 16-pin connector JP3 instead of JP4 and JP5
1.3 Updated Fig.1 and Fig.2 due to new driver board 0526 24.05.2012 24.05.2012
version V3.1 of EBD5000; added section 6.13
about temperature alarm shut-off
1.4 Added section 2 about laser safety 1308 18.02.2021 P. Vorreau
1.5 Updated RoHS reference in section 3.4 1368 02.12.2021 P. Vorreau