Data sheet acquired from Harris Semiconductor

SCHS015C – Revised August 2003

The CD4001B, CD4002B, and CD4025B

types are supplied in 14-lead hermetic
dual-in-line ceramic packages (F3A
suffix), 14-lead dual-in-line plastic
packages (E suffix), 14-lead small-outline
packages (M, MT, M96, and NSR suffixes),
and 14-lead thin shrink small-outline
packages (PW and PWR suffixes).

Copyright © 2003, Texas Instruments Incorporated

 PACKAGE OPTION ADDENDUM

www.ti.com 29-Sep-2024

PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)

7704403CA ACTIVE CDIP J 14 25 Non-RoHS SNPB N / A for Pkg Type -55 to 125 7704403CA Samples
& Green CD4002BF3A
CD4001BE ACTIVE PDIP N 14 25 RoHS & Green NIPDAU N / A for Pkg Type -55 to 125 CD4001BE Samples

CD4001BEE4 ACTIVE PDIP N 14 25 RoHS & Green NIPDAU N / A for Pkg Type -55 to 125 CD4001BE Samples

CD4001BF ACTIVE CDIP J 14 25 Non-RoHS SNPB N / A for Pkg Type -55 to 125 CD4001BF Samples
& Green
CD4001BF3A ACTIVE CDIP J 14 25 Non-RoHS SNPB N / A for Pkg Type -55 to 125 CD4001BF3A Samples
& Green
CD4001BM ACTIVE SOIC D 14 50 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD4001BM Samples

CD4001BM96 ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD4001BM Samples

CD4001BM96E4 ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD4001BM Samples

CD4001BM96G4 ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD4001BM Samples

CD4001BMT OBSOLETE SOIC D 14 TBD Call TI Call TI -55 to 125 CD4001BM

CD4001BNSR ACTIVE SO NS 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD4001B Samples

CD4001BNSRG4 ACTIVE SO NS 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD4001B Samples

CD4001BPW OBSOLETE TSSOP PW 14 TBD Call TI Call TI -55 to 125 CM001B

CD4001BPWR ACTIVE TSSOP PW 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CM001B Samples

CD4002BE ACTIVE PDIP N 14 25 RoHS & Green NIPDAU N / A for Pkg Type -55 to 125 CD4002BE Samples

CD4002BF ACTIVE CDIP J 14 25 Non-RoHS SNPB N / A for Pkg Type -55 to 125 CD4002BF Samples
& Green
CD4002BF3A ACTIVE CDIP J 14 25 Non-RoHS SNPB N / A for Pkg Type -55 to 125 7704403CA Samples
& Green CD4002BF3A
CD4002BM OBSOLETE SOIC D 14 TBD Call TI Call TI -55 to 125 CD4002BM
CD4002BM96 ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD4002BM Samples

CD4002BNSR ACTIVE SO NS 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD4002B Samples

Addendum-Page 1
 PACKAGE OPTION ADDENDUM

www.ti.com 29-Sep-2024

Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)

CD4002BPW OBSOLETE TSSOP PW 14 TBD Call TI Call TI -55 to 125 CM002B

CD4002BPWR ACTIVE TSSOP PW 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CM002B Samples

CD4025BE ACTIVE PDIP N 14 25 RoHS & Green NIPDAU N / A for Pkg Type -55 to 125 CD4025BE Samples

CD4025BEE4 ACTIVE PDIP N 14 25 RoHS & Green NIPDAU N / A for Pkg Type -55 to 125 CD4025BE Samples

CD4025BF ACTIVE CDIP J 14 25 Non-RoHS SNPB N / A for Pkg Type -55 to 125 CD4025BF Samples
& Green
CD4025BF3A ACTIVE CDIP J 14 25 Non-RoHS SNPB N / A for Pkg Type -55 to 125 CD4025BF3A Samples
& Green
CD4025BM OBSOLETE SOIC D 14 TBD Call TI Call TI -55 to 125 CD4025BM
CD4025BM96 ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD4025BM Samples

CD4025BMT OBSOLETE SOIC D 14 TBD Call TI Call TI -55 to 125 CD4025BM

CD4025BNSR ACTIVE SO NS 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD4025B Samples

CD4025BPW ACTIVE TSSOP PW 14 90 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CM025B Samples

CD4025BPWE4 ACTIVE TSSOP PW 14 90 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CM025B Samples

JM38510/05252BCA ACTIVE CDIP J 14 25 Non-RoHS SNPB N / A for Pkg Type -55 to 125 JM38510/ Samples
& Green 05252BCA
JM38510/05254BCA ACTIVE CDIP J 14 25 Non-RoHS SNPB N / A for Pkg Type -55 to 125 JM38510/ Samples
& Green 05254BCA
M38510/05252BCA ACTIVE CDIP J 14 25 Non-RoHS SNPB N / A for Pkg Type -55 to 125 JM38510/ Samples
& Green 05252BCA
M38510/05254BCA ACTIVE CDIP J 14 25 Non-RoHS SNPB N / A for Pkg Type -55 to 125 JM38510/ Samples
& Green 05254BCA

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

Addendum-Page 2
 PACKAGE OPTION ADDENDUM

www.ti.com 29-Sep-2024

(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF CD4001B, CD4001B-MIL, CD4002B, CD4002B-MIL, CD4025B, CD4025B-MIL :

• Catalog : CD4001B, CD4002B, CD4025B

• Military : CD4001B-MIL, CD4002B-MIL, CD4025B-MIL

NOTE: Qualified Version Definitions:

• Catalog - TI's standard catalog product

• Military - QML certified for Military and Defense Applications

Addendum-Page 3
 PACKAGE MATERIALS INFORMATION

www.ti.com 16-Apr-2024

TAPE AND REEL INFORMATION

REEL DIMENSIONS TAPE DIMENSIONS

K0 P1

B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers

Reel Width (W1)

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE

Sprocket Holes

Q1 Q2 Q1 Q2

Q3 Q4 Q3 Q4 User Direction of Feed

Pocket Quadrants

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
CD4001BM96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
CD4001BNSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
CD4001BPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
CD4002BM96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
CD4002BNSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
CD4002BPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
CD4025BM96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
CD4025BNSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 16-Apr-2024

TAPE AND REEL BOX DIMENSIONS

Width (mm)
H
W

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
CD4001BM96 SOIC D 14 2500 356.0 356.0 35.0
CD4001BNSR SO NS 14 2000 356.0 356.0 35.0
CD4001BPWR TSSOP PW 14 2000 356.0 356.0 35.0
CD4002BM96 SOIC D 14 2500 356.0 356.0 35.0
CD4002BNSR SO NS 14 2000 356.0 356.0 35.0
CD4002BPWR TSSOP PW 14 2000 356.0 356.0 35.0
CD4025BM96 SOIC D 14 2500 356.0 356.0 35.0
CD4025BNSR SO NS 14 2000 356.0 356.0 35.0

Pack Materials-Page 2
 PACKAGE MATERIALS INFORMATION

www.ti.com 16-Apr-2024

TUBE

T - Tube
height L - Tube length

W - Tube
width

B - Alignment groove width

*All dimensions are nominal

Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm)
CD4001BE N PDIP 14 25 506 13.97 11230 4.32
CD4001BE N PDIP 14 25 506 13.97 11230 4.32
CD4001BEE4 N PDIP 14 25 506 13.97 11230 4.32
CD4001BEE4 N PDIP 14 25 506 13.97 11230 4.32
CD4001BM D SOIC 14 50 506.6 8 3940 4.32
CD4002BE N PDIP 14 25 506 13.97 11230 4.32
CD4002BE N PDIP 14 25 506 13.97 11230 4.32
CD4025BE N PDIP 14 25 506 13.97 11230 4.32
CD4025BE N PDIP 14 25 506 13.97 11230 4.32
CD4025BEE4 N PDIP 14 25 506 13.97 11230 4.32
CD4025BEE4 N PDIP 14 25 506 13.97 11230 4.32
CD4025BPW PW TSSOP 14 90 530 10.2 3600 3.5
CD4025BPWE4 PW TSSOP 14 90 530 10.2 3600 3.5

Pack Materials-Page 3
 PACKAGE OUTLINE
D0014A SCALE 1.800
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT

C
6.2
TYP SEATING PLANE
5.8

A PIN 1 ID 0.1 C
AREA
12X 1.27
14
1

8.75 2X
8.55 7.62
NOTE 3

7
8
0.51
14X
4.0 0.31
B 1.75 MAX
3.8 0.25 C A B
NOTE 4

0.25
TYP
0.13
SEE DETAIL A
0.25
GAGE PLANE

0.25
0 -8 1.27 0.10
0.40

DETAIL A
TYPICAL

4220718/A 09/2016

NOTES:

1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm, per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm, per side.
5. Reference JEDEC registration MS-012, variation AB.

www.ti.com
 EXAMPLE BOARD LAYOUT
D0014A SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT

14X (1.55) SYMM

1
14

14X (0.6)

12X (1.27)
SYMM

7 8

(R0.05)
TYP
(5.4)

LAND PATTERN EXAMPLE

SCALE:8X

SOLDER MASK METAL UNDER SOLDER MASK

METAL OPENING
OPENING SOLDER MASK

0.07 MAX 0.07 MIN

ALL AROUND ALL AROUND

NON SOLDER MASK SOLDER MASK

DEFINED DEFINED

SOLDER MASK DETAILS

4220718/A 09/2016
NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

www.ti.com
 EXAMPLE STENCIL DESIGN
D0014A SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT

14X (1.55) SYMM

1
14

14X (0.6)

12X (1.27)
SYMM

7 8

(5.4)

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL
SCALE:8X

4220718/A 09/2016
NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.

www.ti.com
 PACKAGE OUTLINE
J0014A SCALE 0.900
CDIP - 5.08 mm max height
CERAMIC DUAL IN LINE PACKAGE

PIN 1 ID A 4X .005 MIN

(OPTIONAL) [0.13] .015-.060 TYP
[0.38-1.52]

1
14
12X .100
[2.54] 14X .014-.026
14X .045-.065 [0.36-0.66]
[1.15-1.65]
.010 [0.25] C A B

.754-.785
[19.15-19.94]

7 8

B .245-.283 .2 MAX TYP .13 MIN TYP

[6.22-7.19] [5.08] [3.3]

C SEATING PLANE

.308-.314
[7.83-7.97]
AT GAGE PLANE

.015 GAGE PLANE

[0.38]

0 -15 14X .008-.014

TYP [0.2-0.36]

4214771/A 05/2017

NOTES:

1. All controlling linear dimensions are in inches. Dimensions in brackets are in millimeters. Any dimension in brackets or parenthesis are for
reference only. Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This package is hermitically sealed with a ceramic lid using glass frit.
4. Index point is provided on cap for terminal identification only and on press ceramic glass frit seal only.
5. Falls within MIL-STD-1835 and GDIP1-T14.

www.ti.com
 EXAMPLE BOARD LAYOUT
J0014A CDIP - 5.08 mm max height
CERAMIC DUAL IN LINE PACKAGE

(.300 ) TYP
[7.62] SEE DETAIL B
SEE DETAIL A

1 14

12X (.100 )
[2.54]

SYMM

14X ( .039)
[1]

7 8

SYMM

LAND PATTERN EXAMPLE

NON-SOLDER MASK DEFINED
SCALE: 5X

.002 MAX (.063)

[0.05] [1.6]
ALL AROUND METAL
( .063)
SOLDER MASK [1.6]
OPENING

METAL

SOLDER MASK .002 MAX

(R.002 ) TYP [0.05]
OPENING
[0.05] ALL AROUND
DETAIL A DETAIL B
SCALE: 15X 13X, SCALE: 15X

4214771/A 05/2017

www.ti.com
 PACKAGE OUTLINE
PW0014A SCALE 2.500
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE

SEATING
PLANE
6.6 C
TYP
A 6.2
0.1 C
PIN 1 INDEX AREA
12X 0.65
14
1

2X
5.1 3.9
4.9
NOTE 3

4X (0 -12 )
7
8
0.30
14X
0.17
4.5 1.2 MAX
B 0.1 C A B
4.3
NOTE 4

(0.15) TYP
SEE DETAIL A

0.25
GAGE PLANE
0.15
0.05

0.75
0.50
0 -8
DETAIL A
A 20

TYPICAL

4220202/B 12/2023

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153.

www.ti.com
 EXAMPLE BOARD LAYOUT
PW0014A TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE

14X (1.5) SYMM

(R0.05) TYP
1
14X (0.45) 14

SYMM

12X (0.65)

7 8

(5.8)

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN
SCALE: 10X

SOLDER MASK METAL UNDER SOLDER MASK

METAL SOLDER MASK OPENING
OPENING

EXPOSED METAL EXPOSED METAL

0.05 MAX 0.05 MIN

ALL AROUND ALL AROUND

NON-SOLDER MASK SOLDER MASK

DEFINED DEFINED
(PREFERRED) SOLDER MASK DETAILS
15.000

4220202/B 12/2023
NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

www.ti.com
 EXAMPLE STENCIL DESIGN
PW0014A TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE

14X (1.5) SYMM

(R0.05) TYP
1
14X (0.45) 14

SYMM

12X (0.65)

7 8

(5.8)

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL
SCALE: 10X

4220202/B 12/2023
NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.

www.ti.com
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