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Reflow Soldering
Apparatus and Heat Transfer Processes
Reflow Soldering
Apparatus and Heat Transfer Processes
Balázs Illés
Department of Electronics Technology, Budapest University of
Technology and Economics, Budapest, Hungary
Olivér Krammer
Department of Electronics Technology, Budapest University of
Technology and Economics, Budapest, Hungary
Attila Géczy
Department of Electronics Technology, Budapest University of
Technology and Economics, Budapest, Hungary
Elsevier
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Copyright © 2020 Elsevier Inc. All rights reserved.
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Publisher (other than as may be noted herein).
Notices
Knowledge and best practice in this field are constantly changing. As new research and
experience broaden our understanding, changes in research methods, professional practices, or
medical treatment may become necessary.
Practitioners and researchers must always rely on their own experience and knowledge in
evaluating and using any information, methods, compounds, or experiments described herein.
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assume any liability for any injury and/or damage to persons or property as a matter of
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British Library Cataloguing-in-Publication Data
A catalogue record for this book is available from the British Library
Library of Congress Cataloging-in-Publication Data
A catalog record for this book is available from the Library of Congress
ISBN: 978-0-12-818505-6
v
vi Contents
Index 281
Chapter 1
Introduction to surface-mount
technology
1.1 Electronic components
Today electronic circuits consist of almost solely surface-mounted compo-
nents (B90%) and potentially only some through-hole components for real-
izing plug connectors or high power devices. Surface-mounted components
and surface-mount technology are evolving since the mid-1960s [1].
Nowadays, the pitch dimensions reduced down to 0.3 mm or to even lower
by the interest of portable device manufacturers, for example. Nevertheless,
surface-mounted components never can supersede the through-hole devices
entirely; therefore the assembly of both types of components should be done
by the comprehensive soldering technology, which is reflow soldering.
The electronic components can be classified from many points of view,
for example, they can be passive or active components or electromechanical
components like switches, connectors, or relays. From the assembly point of
view, the components can be through-hole (Fig. 1.1) or surface-mounted
(Fig. 1.2). From the packaging point of view, they can be discrete compo-
nents (one function is realized by one component—e.g., a resistor), they can
be packaged as series of alike components (e.g., resistor array), or can be
integrated components, in which many functions are realized by one
component.
FIGURE 1.1 Through-hole integrated circuit—dual inline package (DIP). Reproduced with
permission from G. Harsányi, Elektronikai Technológia e´s Anyagismeret, University lecture
notes, BME-ETT, 2019, ISBN: 978-963-421-791-6 [2].
FIGURE 1.3 Schematic of a soldered through-hole component; formation of solder joint in the
case of not-plated through-holes (left side) and plated through-holes (right side). Reproduced
with permission from G. Harsányi, Elektronikai Technológia e´s Anyagismeret, University lecture
notes, BME-ETT, 2019, ISBN: 978-963-421-791-6 [2].
The most widely used passive components are the thick-film surface-
mounted resistors and the ceramic (layer) capacitors. A size code describes
the size of the components—designation, for example, 1206—which indi-
cates the length and the width of the component by the following rule (down
to 0402): 12 3 10 5 120 mil; 06 3 10 5 60 mil, where the mil is milliinch,
the thousandth of an inch (0.001v, 25.4 μm). Regular size codes are collected
in Table 1.1. The surface-mounted passive components are stored in paper-
or plastic tapes.
The active and integrated surface-mounted components can be classified
according to the arrangement of the leads similar to the through-hole compo-
nents. Integrated component packages with perimeter style leads include
SOT (small outline transistor), SOIC (small outline integrated circuit—
Fig. 1.5), QFP (quad flat pack), and PLCC (plastic leaded chip carrier)
packages. Both the QFP and PLCC packages have leads on all four sides of
the component.
The difference between them is that QFP packages have gull-wing-
shaped lead (Fig. 1.6), while the leads of PLCC packages are bent back in
“J” shape. Similarly to these package types, the QFN (quad flat no-lead)
packages do not have leads, but terminals in the form of solderable metalli-
zation on the four sides of the package.
In surface-mounted components, the lead arrangement of grid array style
materializes in BGA (ball grid array) and LGA (land grid array) packages.
The leads of BGA type packages have a ball shape (Fig. 1.7—Bump),
whereas there are no leads in LGA type packages, but metalized terminals
on the bottom side of the package.
The small size, surface-mounted integrated package types are stored in
plastic tapes or plastic sticks. The QFP, PLCC, QFN, BGA, and LGA type
packages are stored in plastic trays for the automatic placement of the
components.
The surface-mount technology has many advantages over the THT. The
size of the surface-mounted components is smaller than that of the through-
hole ones while having the same function. Therefore higher integration,
more functions per area unit can be achieved, resulting in smaller parasitic
effects on the interconnection lines (e.g., leads, traces on the PWB) and in
Introduction to surface-mount technology Chapter | 1 5
Source: Data from G. Harsányi, Elektronikai Technológia és Anyagismeret, University lecture
notes, BME-ETT, 2019, ISBN: 978-963-421-791-6 [2].
FIGURE 1.5 Schematic of a small outline (SO-type) integrated circuit. Reproduced with per-
mission from G. Harsányi, Elektronikai Technológia e´s Anyagismeret, University lecture notes,
BME-ETT, 2019, ISBN: 978-963-421-791-6 [2].
FIGURE 1.7 Schematic of a ball grid array package. Reproduced with permission from
G. Harsányi, Elektronikai Technológia e´s Anyagismeret, University lecture notes, BME-ETT,
2019, ISBN: 978-963-421-791-6 [2].
CHAPTER X
CHAPTER XI