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Springer Theses
Recognizing Outstanding Ph.D. Research
Guilei Wang
Investigation on SiGe
Selective Epitaxy for
Source and Drain
Engineering in 22 nm
CMOS Technology
Node and Beyond
Springer Theses
The series “Springer Theses” brings together a selection of the very best Ph.D.
theses from around the world and across the physical sciences. Nominated and
endorsed by two recognized specialists, each published volume has been selected
for its scientific excellence and the high impact of its contents for the pertinent field
of research. For greater accessibility to non-specialists, the published versions
include an extended introduction, as well as a foreword by the student’s supervisor
explaining the special relevance of the work for the field. As a whole, the series will
provide a valuable resource both for newcomers to the research fields described,
and for other scientists seeking detailed background information on special
questions. Finally, it provides an accredited documentation of the valuable
contributions made by today’s younger generation of scientists.
Investigation on SiGe
Selective Epitaxy for Source
and Drain Engineering
in 22 nm CMOS Technology
Node and Beyond
Doctoral Thesis accepted by
Chinese Academy of Sciences, Beijing, China
123
Author Supervisors
Dr. Guilei Wang Prof. Henry H. Radamson
Key Laboratory of Microelectronics Institute of Microelectronics
Devices and Integrated Technology Chinese Academy of Sciences
Institute of Microelectronics Beijing, China
Chinese Academy of Sciences
Beijing, China Prof. Chao Zhao
Institute of Microelectronics
University of Chinese Academy of Sciences
Chinese Academy of Sciences
Beijing, China
Beijing, China
This Springer imprint is published by the registered company Springer Nature Singapore Pte Ltd.
The registered company address is: 152 Beach Road, #21-01/04 Gateway East, Singapore 189721,
Singapore
Supervisors’ Foreword
After five decades, CMOS has been constantly downscaled following the technology
road map, and by crossing to sub-10-nm node, we further approach to the end of road
map in few years. During this period of time, the IC manufacturer has solved many
problems and technical problems, and today’s transistor structure is totally different
than original one manufactured in the Bell Labs. The most important key points for
improving the transistor performance are strain engineering, new high-k & metal
gate, junction formations, and transition from 2D to 3D structure. By considering
these designs, the carrier mobility increased significantly, and short-channel effect
could be decreased in the ultra-small transistor sizes.
Many efforts have been spent to introduce new processing, specially the selec-
tive deposition of SiGe layers in the source/drain regions. The SiGe material has
been used as stressor material to create uniaxial strain in the channel. One major
problem for such design is pattern dependency of the growth where the profile of
SiGe layer varies due to the variation of the chip layout.
This thesis presents research in field of microelectronics which carried out
during four years in Chinese Academy of Science in Institute of Microelectronics.
This work presents integration, growth, and strain engineering of SiGe in source/
drain in 22- and 16-nm node CMOS. The transistor processing has been paid
attention, the steps such as in situ and ex situ cleaning of recess in S/D regions and
surface of the Si fins have been studied, and their impact on the shape of the recess
in S/D and Si fins and quality of SiGe epitaxy have been investigated. This research
provides valuable information about how to measure strain by XRD and TEM
techniques. Another focus has been spent on establishing a kinetic model to predict
the layer profile of SiGe and the pattern dependency behavior of the growth. The
quality of research is excellent, and it contains very important scientific content;
many parts of work have been even awarded in important conferences (EMRS).
v
Abstract
vii
viii Abstract
bottom layer, the middle layer with high Ge content (Si0.65Ge0.35 or Si0.60
Ge0.40), was intended as stressor material to fill the recess and a cap layer with
low Ge content (Si0.75Ge0.25 or Si0.80Ge0.20) as a sacrificial material for the
Ni-silicidation process. The purpose of the cap layer was to avoid strain
reduction in the channel region when the layer is consumed. The characteristics
of transistors were measured, and the results were explained in terms of growth
conditions.
(4) A kinetic gas model was developed to evaluate the pattern dependency of the
SiGe SEG process and to predict the layer profile within transistor arrays in a
chip and over different locations on a wafer. The input parameters include
growth temperature, partial pressures of reactant gases, and chip layout. By
using this model, the number of test wafers for epitaxy experiments can be
decreased significantly when the chips are located with a distance from the edge
of the 200-mm wafer. SiGe layers with poor epi-quality were obtained when the
coverage of exposed Si of the chip was below 1%. In such chips, high Ge
content with layer thicknesses above the critical thickness was observed. When
the epitaxy process parameters can be predicted by the model for a desired
epi-profile in an advanced chip design, fast and cost-effective process devel-
opment can be achieved in the mass production.
Keywords CMOS Planar transistors FinFET Strain SiGe
Selective epitaxial growth RPCVD Pattern dependency
Acknowledgements
ix
x Acknowledgements
May 2016
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Contents
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 Development Status and Challenges of Integrated Circuit . . . . . . . 1
1.2 Major Research Works in This Thesis . . . . . . . . . . . . . . . . . . . . . 5
1.3 Thesis Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.4 Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2 Strained Silicon Technology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.2 Physics of Strained Silicon Technology . . . . . . . . . . . . . . . . . . . . 10
2.2.1 Effect of Strain on Electron Mobility . . . . . . . . . . . . . . . . 10
2.2.2 Effect of Strain on Hole Mobility . . . . . . . . . . . . . . . . . . . 11
2.2.3 Effect of Strain Direction on Mobility Improvement . . . . . 13
2.3 Classification of Strain Techniques . . . . . . . . . . . . . . . . . . . . . . . 14
2.3.1 Substrate-Induced Strain . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.3.2 Process-Induced Strain . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.4 Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3 Epitaxial Growth of SiGe Thin Films . . . . . . . . . . . . . . . . . . . . . . . . 23
3.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.1.1 SiGe Crystal Structure and Strain . . . . . . . . . . . . . . . . . . . 24
3.1.2 Critical Thickness . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.1.3 Epitaxy and Its Main Growth Techniques . . . . . . . . . . . . . 26
3.1.4 Non-selective Epitaxy and Selective Epitaxy . . . . . . . . . . . 28
3.2 SiGe Selective Epitaxy Using RPCVD Technology . . . . . . . . . . . 28
3.2.1 RPCVD Equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
3.2.2 Epitaxial Growth of SiGe Films . . . . . . . . . . . . . . . . . . . . 29
xi
xii Contents
xv
xvi Abbreviations
Currently, we are living in the modern time and era of information technology. As
the foundation of information industry, the development of integrate circuit (IC) is
inseparable from our daily life. The emergence of new electronic applications are
commonly in used smart phones, computers, drones, and unmanned vehicle which is
all attributed to great advances and innovations of IC technology. The development
history of IC in recent decades is not only the result of the combination of technology
promotion and market demand, but also the history of the transformation of techno-
logical innovation into productivity [1]. In addition, the progressive development of
integrated circuit has always been considered as the key to promote the development
of information technology, and the technology node and production scale. Therefore,
the level of IC development are important metrics for evaluating the overall national
strength and level of economic growth.
On December 16, 1947, the first transistor was invented at Bell Laboratories by
William Shockley, John Bardeen and Walter Brattain. This was perhaps the most
important electronics event of the 20th century, as it later made possible the inte-
grated circuit and microprocessor that are the basis of modern electronics [2]. On
September 12, 1958, Jack Kilby of Texas Instruments built the first monolithic inte-
grated circuit using germanium mesa. Although the proposed IC comprises just one
transistor, it still marks the arrival of IC era for the world. In 1960, the first planar
integrated circuit is fabricated at Fairchild Semiconductor in the United States. Later
in 1963, Frank Wanlass of the Fairchild R&D Laboratory showed that logic circuits
combining p-channel and n-channel MOS transistors in a complementary symmetry
circuit configuration CMOS, which has still been used today owing to its superior
performance. In 1965, Gorden Moore proposed the famous “Moore’s Law”, which is
© Springer Nature Singapore Pte Ltd. 2019 1
G. Wang, Investigation on SiGe Selective Epitaxy for Source and Drain Engineering
in 22 nm CMOS Technology Node and Beyond, Springer Theses,
https://doi.org/10.1007/978-981-15-0046-6_1
2 1 Introduction
the observation that the number of transistors per unit area the degree of integration
would double every 18 months. In each technology generation, transistor dimension
is scaled by 30% (0.7x) and the chip performance is doubled [3]. In 1968, Intel was
founded by Robert Noyce, Gorden Moore, and Andrew Grove, indicating the start
of large-scale commercialization of LSI CMOS technology.
In the past decades, semiconductor technology has developed continuously in
accordance with the device scaling theory proposed by Dennard et al. [4, 5], which
has stimulated the increment of integration scale and improvement of performance
for integrated circuit. With the development of CMOS IC technology over the past
decade, it gradually becomes difficult to improve IC performance just through con-
tinuous scaling-down of device dimensions. Some of the fabrications techniques
that have been used for a long time become hard to maintain the scaling-down trend.
Thus, new process modules, new materials, and new device structures should be
developed in time to overcome these upcoming challenges and to continue Moore’s
Law. Figure 1.1 shows the key technology roadmap for CMOS integrated circuit.
The last 20 years have seen an aggressive scaling-down of silicon CMOS technol-
ogy from 1 μm planar structure to advanced 20 nm 3D FinFETs. Especially, when
entering the 45 nm technology node and below, the reduction of the physical gate
length brings more technical challenges to nanoscale CMOS devices [6, 7]. The main
technical challenges are listed as follows:
1. Gate electrode: The polysilicon depletion effect (PDE) induced by the traditional
polysilicon gate results in an increase of equivalent gate oxide thickness, reduced
gate control and occurrence of short channel effects (SCE) particularly in small-
size MOSFETs. Therefore, traditional polysilicon can’t meet the requirements
of gate control for small-size MOSFETs.
2. Gate dielectric: As the device size continues shrinking, the gate oxide thickness
needs to be continuously thinned down to improve short channel effects immu-
nity and gate controllability. However, using ultra-thin gate oxide exponentially
increases the tunneling leakage current, followed by increasing of power con-
sumption. Thus, the device reliability issues become more prominent. The dis-
tributed defects and traps in interfacial oxide cause significant interfacial and
Coulomb’s scattering, resulting in serious degradation of carrier mobility.
3. Channel/substrate: the reduction of gate length leads to serious short channel
effects, drain-induced barrier lowering (DIBL), deterioration of the sub-threshold
characteristics, etc. Due to the existence of parasitic effects, device drive current
no longer increases linearly. Hence, carrier mobility of the channel needs to be
further improved to boost device performance.
4. Source/drain (S/D) regions: In order to enhance the channel carrier mobility,
strain engineering by selective epitaxial growth of heterojunction materials in
S/D regions has been widely employed to induce uniaxial strain in channel region
and to boost carrier mobility. Besides, parasitic S/D series resistance is difficult
to scale down proportionally with the shrinkage of device size, which becomes
a more important contributor to the total resistance of a transistor and inevitably
impacts the drive current. Thus, suitable silicide processes corresponding to dif-
ferent S/D materials should be implemented to reduce the parasitic resistance.
In an effort to overcome the above-mentioned technical challenges, new tech-
nologies have been employed into each product generation to continue the trend of
Moore’s Law. For example, strained silicon technology has been utilized to improve
the current drive capability of transistors through enhancing the carrier mobility of
channel. To mitigate the impact of S/D parasitic series resistance and capacitance
on device performance, Schottky-barrier silicide S/D has been proposed to replace
the ion-implanted S/D in conventional CMOS process. In order to improve the short
channel effects, ultra-shallow and halo implantation techniques are applied in S/D
regions [8]. And in order to restrain hot-carrier injection effect (HCI), lightly-doped-
drain (LDD) implantation and other techniques are also suggested [9].
Later, dozens of new semiconductor materials are introduced to resolve the process
problems and improve the performance of the device. In 2007, Intel introduced high-
κ dielectric and metal gate in 45 nm planar technology node to reduce the device’s
equivalent oxide thickness (EOT) and to enhance gate control capability [10]. In
2009, Intel unveiled the second generation of HKMG process in its 32 nm technology
node, for the purpose of further EOT scaling and device performance improvement
[11]. When CMOS process enters 10 nm node and below, new channel materials
4 1 Introduction
with higher carrier mobility than silicon, such as Ge, III–V compounds and so on,
are likely to be introduced to further promote the development of CMOS integrated
circuit technology [12].
With respect to novel device structures, several new types of MOSFETs have been
reported, such as silicon on insulator (SOI) MOS devices [13–15], planar double-gate
(DG) MOSFETs [16], fin field-effect transistor (FinFETs) [17], gate and multi-gate
MOSFETs [18], tunnel field-effect transistor (TFET) [19] and so on. Among these
new device structures, the 22 nm FinFET product proposed by Intel in 2011 is the most
attractive one. FinFET devices differ from planar structure counterparts by the three-
dimensional Fin structure, which leads to further improvement of device performance
and integration density of IC [20]. In 2013, Intel developed FinFET technology to
16 nm node [21], and optimized the Fin structure through further reduction of Fin
pitch to increase integration density. At present, research and development (R&D)
of Intel’s 10 nm technology is in progress.
In brief, the development of CMOS IC technology and the extension of Moore’s
Law are inseparable from the breakthrough of new process modules, new materials
and new device structures. In each technology node, technical schemes always follow
the previous technology roadmap with minor changes. If technical changes are too
significant, mass production would become more challenging and the manufacturing
cost would rise simultaneously. Thus, industries always give priority to technology
solutions adapted for large-scale production instead of those with major changes.
For example, strained silicon technology is one of the technical solutions suitable for
large-scale production [22]. As shown in Fig. 1.2, strain has had tremendous impact
in advancing the transistor scaling roadmap for generations after the 130 nm node
(90, 65, 45, 32 nm) [23]. One way to carry out strain engineering in the transistor
structure is using SiGe alloy as stressor material in S/D areas. Epitaxial growth
of SiGe in S/D can generate compressive strain in PMOS channel region which can
enhance to hole mobility, leading to performance enhancement of CMOS transistors.
Integration of highly strained SiGe in S/D presents excellent compatibility with
current CMOS technology and plays an increasingly important role in advanced
manufacturing processes.
In this paper, integration of strained SiGe in S/D for 22 nm planar and 16 nm FinFET
devices has been systematically investigated to meet the requirements of the “Na-
tional S&T Major Project 02”. This research focuses on selective epitaxial growth
of high-quality strained SiGe thin films and its process integration and industrial-
relevant applications. The research content in the work is closely relevant to practical
issues in industry. The major research works are listed as follows:
1. Epitaxial growth of high-quality, defect-free strained SiGe thin films on an 8-inch
process platform using reduced pressure chemical vapor deposition (RPCVD)
and its process optimization for high epitaxial quality. Key factors that affects
the high-quality selective epitaxial growth of SiGe films are analyzed to promote
the applications of strained SiGe technology.
2. Key technical issues for selective epitaxial growth of SiGe film on S/D are studied.
The research contents include the influence of cleaning process prior to epitaxy
and prebake during epitaxial growth on the surface morphology of SiGe film in
S/D.
3. The influence of the DBOE rinse time and the amount of HCl vapor on the
selectivity of SiGe epitaxial growth are studied.
4. Electrical characteristics for 22 nm planar and 16 nm FinFET devices with SiGe
S/D are systematically analyzed. High-resolution X-ray diffraction (HRXRD)
detection technique and Technology Computer Aided Design (TCAD) simu-
lations are performed to analyze strain variation during SiGe epitaxial growth
on S/D. During the source-drain epitaxial process, SiGe films with several Ge
concentration gradients are experimentally grown as the strained S/D.
5. The reaction kinetics and growth mechanisms of SiGe selective epitaxy are stud-
ied. Meanwhile, the microscopic and macroscopic effects of the pattern density
during selective epitaxial growth are explained in detail. By studying the diffu-
sion kinetics of the reaction gas and the established calculation model, the causes
for the dissimilarity of the properties of selective epitaxial grown SiGe films in
different regions are also explained. The results of the calculation model are
verified by the film growth rate and Ge composition distribution obtained from
experimental test. This could establish a design for manufacturability (DFM)
reference for SiGe selective epitaxial growth integration and layout design to
resolve some practical issues for the application of SiGe technology.
According to the main research contents, the chapters in this thesis are arranged as
follows:
This chapter presents the background of the thesis, the significance of the work,
the main research contents and the organization of the thesis.
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6 1 Introduction
1.4 Summary
References
5. Frank DJ, Dennard RH, Nowak E, Solomon PM, Taur Y, Wong H-SP (2001) Device scaling
limits of Si MOSFETs and their application dependencies. Proc IEEE 89:259–288
6. Taur Y (1999) CMOS scaling beyond 0.1 μm: how far can it go? In: International symposium
on VLSI technology, systems, and applications, 1999, pp 6–9
7. Kubicek S, de Meyer K (2002) CMOS scaling to 25 nm gate lengths. In: The fourth international
conference on advanced semiconductor devices and microsystems, 2002, pp 259–270
8. Ogura S, Codella CF, Rovedo N, Shepard JF, Riseman J (1982) A half micron MOSFET using
double implanted LDD. In: 1982 international electron devices meeting, 1982, pp 718–721
9. Ogura S, Tsang PJ, Walker WW, Critchlow DL, Shepard JF (1980) Design and characteristics
of the lightly doped drain-source (LDD) insulated gate field-effect transistor. IEEE Trans Electr
Dev 27:1359–1367
10. Auth C, Cappellani A, Chun JS, Dalis A, Davis A, Ghani T et al (2008) 45 nm high-k+ metal
gate strain-enhanced transistors. In: 2008 symposium on VLSI technology, pp 128–129
11. Packan P, Akbar S, Armstrong M, Bergstrom D, Brazier M, Deshpande H et al (2009) High
performance 32 nm logic technology featuring 2nd generation high-k+ metal gate transistors.
In: 2009 IEEE international electron devices meeting (IEDM), pp 1–4
12. Del Alamo JA (2011) Nanometre-scale electronics with III-V compound semiconductors.
Nature 479:317–323
13. Lam H, Tasch A Jr, Holloway T (1980) Characteristics of MOSFETs fabricated in laser-
recrystallized polysilicon islands with a retaining wall structure on an insulating substrate.
IEEE Electron Dev Lett 1:206–208
14. Chen CL, Chen CK, Vitale SA (2011) SOI circuits powered by embedded solar cell. In: 2011
IEEE international SOI conference (SOI), 2011, pp 1-2
15. Chen JH, Helmi SR, Mohammadi S (2011) Millimeter-wave power amplifiers in 45 nm CMOS
SOI technology. In: 2011 IEEE international SOI conference (SOI), 2011, pp 1–2
16. Shruti K, Thomas DM, Samuel PC, Kumar V (2011) Analysis of single halo double gate MOS-
FETs using high-k dielectrics. In: 2011 3rd international conference on electronics computer
technology (ICECT), 2011, pp 26–30
17. Hisamoto D, Lee W-C, Kedzierski J, Anderson E, Takeuchi H, Asano K et al (1998) A folded-
channel MOSFET for deep-sub-tenth micron era. IEDM Tech Dig 1998:1032–1034
18. Abraham D, Poehler T (1965) Double-gate thin-film transistor. Electron Lett 1:49
19. Ionescu AM, Riel H (2011) Tunnel field-effect transistors as energy-efficient electronic
switches. Nature 479:329–337
20. Auth C, Allen C, Blattner A, Bergstrom D, Brazier M, Bost M et al (2012) A 22 nm high
performance and low-power CMOS technology featuring fully-depleted tri-gate transistors,
self-aligned contacts and high density MIM capacitors. In: 2012 symposium on VLSI technol-
ogy (VLSIT), pp 131–132
21. Natarajan S, Agostinelli M, Akbar S, Bost M, Bowonder A, Chikarmane V et al (2014) A 14 nm
logic technology featuring 2nd-generation FinFET, air-gapped interconnects, self-aligned dou-
ble patterning and a 0.0588 μm 2 SRAM cell size. In: 2014 IEEE international electron devices
meeting (IEDM), pp 3.7. 1–3.7. 3
22. Mohta N, Thompson SE (2005) Mobility enhancement. IEEE Circuits Dev Mag 21:18–23
23. Kuhn KJ, Liu MY, Kennel H (2010) Technology options for 22 nm and beyond. In: Proceeding
of the 10th international workshop on junction technology (IWJT-2010), 2010, pp 10–11
Chapter 2
Strained Silicon Technology
2.1 Introduction
With transistor dimension shrinking into nanoscale regime as described in the pre-
vious chapter, conventional gate oxide thickness has been scaled near the thickness
limit of 1 nm. This scaling trend brings issues about power consumption, transistor
density and off-leakage current, together with carrier mobility degradation. Further-
more, the continuous scaling-down of device dimensions and further performance
enhancement are facing more and more severe challenges. Therefore, to overcome
these challenges occurred during technology development, various technical solu-
tions can be implemented to improve device performance. One of the important and
simple technical solutions is strained silicon technology. For device driving capability
improvement, strained silicon technology is applied to enhance the carrier mobility
on channel to compensate the mobility degradation caused by the scaling-down of
device dimensions [1–4].
In 2002, Intel unveiled its microprocessors using strained silicon technology at the
90 nm process node [5]. This is the first process in the industry to implement strained
silicon in production. Since then, each process node has adopted different strained
silicon technologies to improve device performance. For example, since 65 nm tech-
nology node, semiconductor industry has applied strained silicon technology into
CMOS production [5], including strained SiGe on source/drain and silicon nitride
capping layer. In addition, metal gate-induced strain is introduced in 45 nm process
node [6]. Among the current approaches for transistor performance improvement,
the mobility enhancement via strained silicon technology has had tremendous impact
in device performance enhancement and has become one of the important techniques
to extend Moore’s Law [7].
As we all know, the relationship between the drive current and the mobility of MOS-
FETs is shown in the following equation [8]:
For electron transport in bulk Si at room temperature, the conduction band is com-
prised of six degenerate valleys, as shown in Fig. 2.1a. These valleys are of equal
energy, as shown by 6 in Fig. 2.1c. The degeneracy reflects the cubic symmetry of
the Si lattice. The effective mass for any direction is the reciprocal of the curvature
of the electron energy function in that direction. Consequently, the effective mass
of each ellipsoid is anisotropic, with the transverse mass (perpendicular to the axis)
2.2 Physics of Strained Silicon Technology 11
Fig. 2.1 Electron conduction band valleys for a relaxed silicon, b strained silicon with biaxial
tensile strain. c Energy level at the bottom of the six conduction band valleys. Application of
advantageous strain splits the energy level as shown, removing the degeneracy (i.e., the equivalence
in energy) between the 2 and 4 valleys
given by mt = 0.19 mo being significantly smaller than the longitudinal mass (paral-
lel to the axis) given by ml = 0.98 mo , where mo is the free electron mass [14]. For
unstressed bulk Si, the total electron conductivity mass, m*, is obtained by adding
the contributions of the six degenerate valleys and is given by
−1
1 2 4
m∗ = +
6 ml mt
For holes, the valence-band structure of Si is more complex than the conduction-band.
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resource, I sent it to Longmans, whose reader, Andrew Lang, liked it
and advised its acceptance. It was to “Andrew of the brindled hair,”
as Stevenson called him, that I owe my first real opening, and I
have never forgotten it. The book duly appeared in February, 1889,
and though it was not a boom book it had extraordinarily good
reviews, including one special one all to itself by Mr. Prothero in the
“Nineteenth Century,” and it has sold without intermission from that
day to this. It was the first solid corner-stone laid for some sort of
literary reputation.
British literature had a considerable vogue in the United States at
this time for the simple reason that there was no copyright and they
had not to pay for it. It was hard on British authors, but far harder
on American ones, since they were exposed to this devastating
competition. Like all national sins it brought its own punishment not
only to American authors, who were guiltless, but to the publishers
themselves, for what belongs to everyone belongs practically to no
one, and they could not bring out a decent edition without being at
once undersold. I have seen some of my early American editions
which might have been printed on the paper that shopmen use for
parcels. One good result, however, from my point of view was that a
British author, if he had anything in him, soon won recognition in
America, and afterwards, when the Copyright Act was passed, he
had his audience all ready for him. My Holmes book had met with
some American success and presently I learned that an agent of
Lippincott’s was in London and that he wished to see me, to arrange
for a book. Needless to say that I gave my patients a rest for a day
and eagerly kept the appointment.
Once only before had I touched the edge of literary society. That
was when “Cornhill” was turned into a fully illustrated journal, an
experiment which failed for it was quickly abandoned. The change
was celebrated by a dinner at the Ship, at Greenwich, to which I was
invited on the strength of my short contributions. All the authors and
artists were there, and I remember the reverence with which I
approached James Payn, who was to me the warden of the sacred
gate. I was among the first arrivals, and was greeted by Mr. Smith,
the head of the firm, who introduced me to Payn. I loved much of
his work and waited in awe for the first weighty remark which should
fall from his lips. It was that there was a crack in the window and he
wondered how the devil it had got there. Let me add, however, that
my future experience was to show that there was no wittier or more
delightful companion in the world. I sat next to Anstey that night,
who had just made a most deserved hit with his “Vice Versa,” and I
was introduced to other celebrities, so that I came back walking on
air.
Now for the second time I was in London on literary business.
Stoddart, the American, proved to be an excellent fellow, and had
two others to dinner. They were Gill, a very entertaining Irish M.P.,
and Oscar Wilde, who was already famous as the champion of
æstheticism. It was indeed a golden evening for me. Wilde to my
surprise had read “Micah Clarke” and was enthusiastic about it, so
that I did not feel a complete outsider. His conversation left an
indelible impression upon my mind. He towered above us all, and yet
had the art of seeming to be interested in all that we could say. He
had delicacy of feeling and tact, for the monologue man, however
clever, can never be a gentleman at heart. He took as well as gave,
but what he gave was unique. He had a curious precision of
statement, a delicate flavour of humour, and a trick of small gestures
to illustrate his meaning, which were peculiar to himself. The effect
cannot be reproduced, but I remember how in discussing the wars
of the future he said: “A chemist on each side will approach the
frontier with a bottle”—his upraised hand and precise face conjuring
up a vivid and grotesque picture. His anecdotes, too, were happy
and curious. We were discussing the cynical maxim that the good
fortune of our friends made us discontented. “The devil,” said Wilde,
“was once crossing the Libyan Desert, and he came upon a spot
where a number of small fiends were tormenting a holy hermit. The
sainted man easily shook off their evil suggestions. The devil
watched their failure and then he stepped forward to give them a
lesson. ‘What you do is too crude,’ said he. ‘Permit me for one
moment.’ With that he whispered to the holy man, ‘Your brother has
just been made Bishop of Alexandria.’ A scowl of malignant jealousy
at once clouded the serene face of the hermit. ‘That,’ said the devil
to his imps, ‘is the sort of thing which I should recommend.’”
The result of the evening was that both Wilde and I promised to
write books for “Lippincott’s Magazine”—Wilde’s contribution was
“The Picture of Dorian Grey,” a book which is surely upon a high
moral plane, while I wrote “The Sign of Four,” in which Holmes made
his second appearance. I should add that never in Wilde’s
conversation did I observe one trace of coarseness of thought, nor
could one at that time associate him with such an idea. Only once
again did I see him, many years afterwards, and then he gave me
the impression of being mad. He asked me, I remember, if I had
seen some play of his which was running. I answered that I had not.
He said: “Ah, you must go. It is wonderful. It is genius!” All this with
the gravest face. Nothing could have been more different from his
early gentlemanly instincts. I thought at the time, and still think, that
the monstrous development which ruined him was pathological, and
that a hospital rather than a police court was the place for its
consideration.
When his little book came out I wrote to say what I thought of it. His
letter is worth reproducing, as showing the true Wilde. I omit the
early part in which he comments on my own work in too generous
terms.
“Between me and life there is a mist of words always. I throw
probability out of the window for the sake of a phrase, and the
chance of an epigram makes me desert truth. Still I do aim at
making a work of art, and I am really delighted that you think my
treatment subtle and artistically good. The newspapers seem to me
to be written by the prurient for the Philistine. I cannot understand
how they can treat ‘Dorian Grey’ as immoral. My difficulty was to
keep the inherent moral subordinate to the artistic and dramatic
effect, and it still seems to me that the moral is too obvious.”
Encouraged by the kind reception which “Micah Clarke” had received
from the critics, I now determined upon an even bolder and more
ambitious flight. It seemed to me that the days of Edward III
constituted the greatest epoch in English History—an epoch when
both the French and the Scottish Kings were prisoners in London.
This result had been brought about mainly by the powers of a body
of men who were renowned through Europe but who had never
been drawn in British literature, for though Scott treated in his
inimitable way the English archer, it was as an outlaw rather than as
a soldier that he drew him. I had some views of my own, too, about
the Middle Ages which I was anxious to set forth. I was familiar with
Froissart and Chaucer and I was aware that the famous knights of
old were by no means the athletic heroes of Scott, but were often of
a very different type. Hence came my two books “The White
Company,” written in 1889, and “Sir Nigel,” written fourteen years
later. Of the two I consider the latter the better book, but I have no
hesitation in saying that the two of them taken together did
thoroughly achieve my purpose, that they made an accurate picture
of that great age, and that as a single piece of work they form the
most complete, satisfying and ambitious thing that I have ever done.
All things find their level, but I believe that if I had never touched
Holmes, who has tended to obscure my higher work, my position in
literature would at the present moment be a more commanding one.
The work needed much research and I have still got my notebooks
full of all sorts of lore. I cultivate a simple style and avoid long words
so far as possible, and it may be that this surface of ease has
sometimes caused the reader to underrate the amount of real
research which lies in all my historical novels. It is not a matter
which troubles me, however, for I have always felt that justice is
done in the end, and that the real merit of any work is never
permanently lost.
I remember that as I wrote the last words of “The White Company” I
felt a wave of exultation and with a cry of “That’s done it!” I hurled
my inky pen across the room, where it left a black smudge upon the
duck’s-egg wall-paper. I knew in my heart that the book would live
and that it would illuminate our national traditions. Now that it has
passed through fifty editions I suppose I may say with all modesty
that my forecast has proved to be correct. This was the last book
which I wrote in my days of doctoring at Southsea, and marks an
epoch in my life, so I can now hark back to some other phases of
my last years at Bush Villa before I broke away into a new existence.
I will only add that “The White Company” was accepted by
“Cornhill,” in spite of James Payn’s opinion of historical novels, and
that I fulfilled another ambition by having a serial in that famous
magazine.
A new phase of medical experience came to me about this time, for
I suddenly found myself a unit in the British Army. The operations in
the East had drained the Medical Service, and it had therefore been
determined that local civilian doctors should be enrolled for
temporary duty of some hours a day. The terms were a guinea a
day, and a number of us were tempted to volunteer where there
were only a few vacancies. When I was called before the Board of
Selection a savage-looking old army doctor who presided barked out,
“And you, sir—what are you prepared to do?” To which I answered,
“Anything.” It seems that the others had all been making bargains
and reservations, so my wholehearted reply won the job.
It brought me into closer contact with the savage-looking medico,
who proved to be Sir Anthony Home, V.C.—an honour which he had
won in the Indian Mutiny. He was in supreme charge, and as he was
as fierce in speech and in act as in appearance, everyone was
terrified of him. On one occasion I had told the orderly to draw a
man’s tooth, knowing that he was a very much more skilful dentist
than I. I was on my way home when I was overtaken by an excited
soldier who told me that Sergeant Jones was being court-martialled
and would certainly lose his stripes because he had done a minor
operation. I hurried back and on entering the room found Sir
Anthony glaring at the unhappy man, while several other orderlies
stood round awaiting their own turn. Sir Anthony’s glare was
transferred to me when I said that whatever the Sergeant had done
was by my express order. He grunted, banged the book he was
holding, and broke up the meeting. He seemed a most disagreeable
old man, and yet when I was married shortly afterwards he sent me
a most charming message wishing me good fortune. Up to then I
had never had anything from him save a scowl from his thick
eyebrows, so I was most agreeably surprised. Soon afterwards the
pressure ceased and we civilians were all dismissed.
CHAPTER IX
PULLING UP THE ANCHOR
Psychic Studies—Experiments in Telepathy—My First Séances—A Curious Test
—General Drayson—Opinion on Theosophy—A. P. Sinnett—W. T. Stead—
Journey to Berlin—Koch’s Treatment—Brutality of Bergmann—Malcolm Morris
—Literary Society—Political Work—Arthur Balfour—Our Departure.
We set forth upon a bitter winter day at the close of 1890 with every
chance of being snowed up on our long trek. We got through all
right, however, and found ourselves in Vienna, arriving on a deadly
cold night, with deep snow under foot and a cutting blizzard in the
air. As we looked from the station the electric lights threw out the
shining silver drift of snow flakes against the absolute darkness of
the sky. It was a gloomy, ominous reception, but half an hour
afterwards when we were in the warm cosy crowded tobacco-laden
restaurant attached to our hotel we took a more cheerful view of our
surroundings.
We found a modest pension which was within our means, and we
put in a very pleasant four months, during which I attended eye
lectures at the Krankenhaus, but could certainly have learned far
more in London, for even if one has a fair knowledge of
conversational German it is very different from following accurately a
rapid lecture filled with technical terms. No doubt “has studied in
Vienna” sounds well in a specialist’s record, but it is usually taken for
granted that he has exhausted his own country before going abroad,
which was by no means the case with me. Therefore, so far as eye
work goes, my winter was wasted, nor can I trace any particular
spiritual or intellectual advance. On the other hand I saw a little of
gay Viennese society. I received kind and welcome hospitality from
Brinsley Richards, “The Times” correspondent, and his wife, and I
had some excellent skating. I also wrote one short book, “The
Doings of Raffles Haw,” not a very notable achievement, by which I
was able to pay my current expenses without encroaching on the
very few hundred pounds which were absolutely all that I had in the
world. This money was invested on the advice of a friend, and as it
was almost all lost—like so much more that I have earned—it is just
as well that I was never driven back upon it.
With the spring my work at Vienna had finished, if it can be said to
have ever begun, and we returned via Paris, putting in a few days
there with Landolt, who was the most famous French oculist of his
time. It was great to find ourselves back in London once more with
the feeling that we were now on the real field of battle, where we
must conquer or perish, for our boats were burned behind us. It is
easy now to look back and think that the issue was clear, but it was
by no means so at the time, for I had earned little, though my
reputation was growing. It was only my own inward conviction of
the permanent merits of “The White Company,” still appearing
month by month in “Cornhill,” which sustained my confidence. I had
come through so much in the early days at Southsea that nothing
could alarm me personally, but I had a wife and child now, and the
stern simplicity of life which was possible and even pleasant in early
days was now no longer to be thought of.
We took rooms in Montague Place, and I went forth to search for
some place where I could put up my plate as an oculist. I was aware
that many of the big men do not find time to work out refractions,
which in some cases of astigmatism take a long time to adjust when
done by retinoscopy. I was capable in this work and liked it, so I
hoped that some of it might drift my way. But to get it, it was clearly
necessary that I should live among the big men so that the patient
could be easily referred to me. I searched the doctors’ quarters and
at last found suitable accommodation at 2 Devonshire Place, which is
at the top of Wimpole Street and close to the classical Harley Street.
There for £120 a year I got the use of a front room with part use of
a waiting room. I was soon to find that they were both waiting
rooms, and now I know that it was better so.
Every morning I walked from the lodgings at Montague Place,
reached my consulting room at ten and sat there until three or four,
with never a ring to disturb my serenity. Could better conditions for
reflection and work be found? It was ideal, and so long as I was
thoroughly unsuccessful in my professional venture there was every
chance of improvement in my literary prospects. Therefore when I
returned to the lodgings at tea-time I bore my little sheaves with
me, the first fruits of a considerable harvest.
A number of monthly magazines were coming out at that time,
notable among which was “The Strand,” then as now under the
editorship of Greenhough Smith. Considering these various journals
with their disconnected stories it had struck me that a single
character running through a series, if it only engaged the attention
of the reader, would bind that reader to that particular magazine. On
the other hand, it had long seemed to me that the ordinary serial
might be an impediment rather than a help to a magazine, since,
sooner or later, one missed one number and afterwards it had lost all
interest. Clearly the ideal compromise was a character which carried
through, and yet instalments which were each complete in
themselves, so that the purchaser was always sure that he could
relish the whole contents of the magazine. I believe that I was the
first to realize this and “The Strand Magazine” the first to put it into
practice.
Looking round for my central character I felt that Sherlock Holmes,
whom I had already handled in two little books, would easily lend
himself to a succession of short stories. These I began in the long
hours of waiting in my consulting room. Greenhough Smith liked
them from the first, and encouraged me to go ahead with them. My
literary affairs had been taken up by that king of agents, A. P. Watt,
who relieved me of all the hateful bargaining, and handled things so
well that any immediate anxiety for money soon disappeared. It was
as well, for not one single patient had ever crossed the threshold of
my room.
I was now once more at a crossroads of my life, and Providence,
which I recognize at every step, made me realize it in a very
energetic and unpleasant way. I was starting off for my usual trudge
one morning from our lodgings when icy shivers passed over me,
and I only got back in time to avoid a total collapse. It was a virulent
attack of influenza, at a time when influenza was in its deadly prime.
Only three years before my dear sister Annette, after spending her
whole life on the family needs, had died of it at Lisbon at the very
moment when my success would have enabled me to recall her from
her long servitude. Now it was my turn, and I very nearly followed
her. I can remember no pain or extreme discomfort, and no psychic
experiences, but for a week I was in great danger, and then found
myself as weak as a child and as emotional, but with a mind as clear
as crystal. It was then, as I surveyed my own life, that I saw how
foolish I was to waste my literary earnings in keeping up an oculist’s
room in Wimpole Street, and I determined with a wild rush of joy to
cut the painter and to trust for ever to my power of writing. I
remember in my delight taking the handkerchief which lay upon the
coverlet in my enfeebled hand, and tossing it up to the ceiling in my
exultation. I should at last be my own master. No longer would I
have to conform to professional dress or try to please any one else. I
would be free to live how I liked and where I liked. It was one of the
great moments of exultation of my life. The date was in August,
1891.
Presently I was about, hobbling on a stick and reflecting that if I
lived to be eighty I knew already exactly how it would feel. I
haunted house-agents, got lists of suburban villas, and spent some
weeks, as my strength returned, in searching for a new home.
Finally I found a suitable house, modest but comfortable, isolated
and yet one of a row. It was 12 Tennison Road, South Norwood.
There we settled down, and there I made my first effort to live
entirely by my pen. It soon became evident that I had been playing
the game well within my powers and that I should have no difficulty
in providing a sufficient income. It seemed as if I had settled into a
life which might be continuous, and I little foresaw that an
unexpected blow was about to fall upon us, and that we were not at
the end, but really at the beginning, of our wanderings.
I could not know this, however, and I settled down with a stout
heart to do some literary work worthy of the name. The difficulty of
the Holmes work was that every story really needed as clear-cut and
original a plot as a longish book would do. One cannot without effort
spin plots at such a rate. They are apt to become thin or to break. I
was determined, now that I had no longer the excuse of absolute
pecuniary pressure, never again to write anything which was not as
good as I could possibly make it, and therefore I would not write a
Holmes story without a worthy plot and without a problem which
interested my own mind, for that is the first requisite before you can
interest any one else. If I have been able to sustain this character
for a long time and if the public find, as they will find, that the last
story is as good as the first, it is entirely due to the fact that I never,
or hardly ever, forced a story. Some have thought there was a falling
off in the stories, and the criticism was neatly expressed by a
Cornish boatman who said to me, “I think, sir, when Holmes fell over
that cliff, he may not have killed himself, but all the same he was
never quite the same man afterwards.” I think, however, that if the
reader began the series backwards, so that he brought a fresh mind
to the last stories, he would agree with me that, though the general
average may not be conspicuously high, still the last one is as good
as the first.
I was weary, however, of inventing plots and I set myself now to do
some work which would certainly be less remunerative but would be
more ambitious from a literary point of view. I had long been
attracted by the epoch of Louis XIV and by those Huguenots who
were the French equivalents of our Puritans. I had a good
knowledge of the memoirs of that date, and many notes already
prepared, so that it did not take me long to write “The Refugees.” It
has stood the acid test of time very well, so I may say that it was a
success. Soon after its appearance it was translated into French, and
my mother, herself a great French scholar, had the joy when she
visited Fontainebleau to hear the official guide tell the drove of
tourists that if they really wanted to know about the Court of the
great monarch, they would find the clearest and most accurate
account in an Englishman’s book, “The Refugees.” I expect the guide
would have been considerably astonished had he then and there
been kissed by an elderly English lady, but it was an experience
which he must have narrowly missed. I used in this book, also, a
great deal which was drawn from Parkman, that great but neglected
historian, who was in my opinion the greatest serious writer that
America has produced.
There was an amusing episode connected with “The Refugees,”
when it was read aloud in some strict Irish convent, the innocent
Reverend Mother having mistaken my name and imagined that I was
a canon, and therefore of course a holy man. I am told that the
reading was a tremendous success and that the good sisters rejoiced
that the mistake was not found out until the story was completed.
My first name has several times led to mistakes, as when, at a big
dinner at Chicago, I was asked to say Grace, as being the only
ecclesiastic present. I remember that at the same dinner one of the
speakers remarked that it was a most sinister fact that though I was
a doctor no living patient of mine had ever yet been seen.
During this Norwood interval, I was certainly working hard, for
besides “The Refugees” I wrote “The Great Shadow,” a booklet
which I should put near the front of my work for merit, and two
other little books on a very inferior plane—“The Parasite” and
“Beyond the City.” The latter was of a domestic type unusual for me.
It was pirated in New York just before the new Copyright Act came
into force, and the rascal publisher thinking that a portrait—any sort
of portrait—of the author would look well upon the cover, and being
quite ignorant of my identity, put a very pretty and over-dressed
young woman as my presentment. I still preserve a copy of this
most flattering representation. All these books had some decent
success, though none of it was remarkable. It was still the Sherlock
Holmes stories for which the public clamoured, and these from time
to time I endeavoured to supply. At last, after I had done two series
of them I saw that I was in danger of having my hand forced, and of
being entirely identified with what I regarded as a lower stratum of
literary achievement. Therefore as a sign of my resolution I
determined to end the life of my hero. The idea was in my mind
when I went with my wife for a short holiday in Switzerland, in the
course of which we saw there the wonderful falls of Reichenbach, a
terrible place, and one that I thought would make a worthy tomb for
poor Sherlock, even if I buried my banking account along with him.
So there I laid him, fully determined that he should stay there—as
indeed for some years he did. I was amazed at the concern
expressed by the public. They say that a man is never properly
appreciated until he is dead, and the general protest against my
summary execution of Holmes taught me how many and how
numerous were his friends. “You Brute” was the beginning of the
letter of remonstrance which one lady sent me, and I expect she
spoke for others besides herself. I heard of many who wept. I fear I
was utterly callous myself, and only glad to have a chance of
opening out into new fields of imagination, for the temptation of
high prices made it difficult to get one’s thoughts away from Holmes.
That Sherlock Holmes was anything but mythical to many is shown
by the fact that I have had many letters addressed to him with
requests that I forward them. Watson has also had a number of
letters in which he has been asked for the address or for the
autograph of his more brilliant confrère. A press-cutting agency
wrote to Watson asking whether Holmes would not wish to
subscribe. When Holmes retired several elderly ladies were ready to
keep house for him and one sought to ingratiate herself by assuring
me that she knew all about bee-keeping and could “segregate the
queen.” I had considerable offers also for Holmes if he would
examine and solve various family mysteries. Once the offer—from
Poland—was that I should myself go, and my reward was practically
left to my own judgment. I had judgment enough, however, to avoid
it altogether.
I have often been asked whether I had myself the qualities which I
depicted, or whether I was merely the Watson that I look. Of course
I am well aware that it is one thing to grapple with a practical
problem and quite another thing when you are allowed to solve it
under your own conditions. I have no delusions about that. At the
same time a man cannot spin a character out of his own inner
consciousness and make it really life-like unless he has some
possibilities of that character within him—which is a dangerous
admission for one who has drawn so many villains as I. In my poem
“The Inner Room,” describing our multiplex personality, I say: