Android Auto Release Notes
Android Auto Release Notes
Document information
Information Content
Keywords Android, i.MX, Automotive, automotive-14.0.0_2.1.0, RN00227
Abstract The i.MX Android automotive-14.0.0_2.1.0 release is an Android Automotive GA (RFP) release on
NXP's i.MX 8QuadXPlus/8QuadMax MEK board and platform and Alpha (EAR) release on NXP's
i.MX 95 EVK board and platform. The release is based on Android 14.
NXP Semiconductors
RN00227
Android Automotive Release Notes
1 Release Description
The i.MX Android automotive-14.0.0_2.1.0 release is an Android Automotive GA (RFP) release on NXP's i.MX
8QuadXPlus/8QuadMax MEK board and platform and also an Alpha (EAR) release on NXP's i.MX 95 EVK
board and platform. The release is based on Android 14. It supports the device type in-vehicle infotainment
defined in https://source.android.com/devices/automotive/.
i.MX Android automotive-14.0.0_2.1.0 release includes all necessary code, documents, and tools to assist
users in building and running Android Automotive on the i.MX 8QuadXPlus/8QuadMax MEK board and i.MX 95
EVK board from scratch. Pre-built images are also included for a quick trial on the following platforms:
• i.MX 8QuadXPlus/8QuadMax MEK Board and Platform
• i.MX 95 EVK Board and Platform
This release includes all portings and enhancements based on the Android open source code.
Most of the deliveries in this release are provided in the source code except for some proprietary modules/
libraries from third parties.
4 Features
This section describes the features in this package.
Table 2. Features
Feature i.MX 8QuadXPlus/ i.MX 95 EVK Remarks
8QuadMax MEK
Google Android 14 release Y Y Based on android-14.0.0_r34 release.
Linux 6.6.30 kernel (merged Y Y Based on Linux OS BSP LF6.6.23_2.0.0 release.
with the AOSP kernel)
Generic Kernel Image (6.6. Y Y Based on AOSP android15-6.6
30)
U-Boot Y Y v2024.04
Trusty OS Y Y -
Graphics-HW Y Y VeriSilicon GC7000L GPU for i.MX 8QuadXPlus,
GC7000XSVX GPU for i.MX 8QuadMax with 6.4.11.
p2 driver, Mali-G310 GPU with r47p0-01eac0 driver
for i.MX 95.
Graphics-HW 3D Y Y OpenGL ES 1.1/2.0/3.1 through GC7000L for i.MX
acceleration 8QuadXPlus, OpenGL ES 1.1/2.0/3.1/3.2 through
GC7000XSVX for i.MX 8QuadMax, OpenGL ES1.1/2.
0/3.2 through Mali-G310 for i.MX 95.
Graphics-HW accelerated UI Y Y OpenGL ES 3.1 through GC7000L for i.MX 8Quad
surface composition XPlus, OpenGL ES 3.2 through GC7000XSVX for
i.MX 8QuadMax, OpenGL ES3.2 through Mali-G310
for i.MX 95.
SCFW Y N Version 1.16.0
SECO firmware Y N Version 3.8.5 for i.MX 8QuadMax B0, i.MX 8Quad
XPlus B0, and i.MX 8QuadXPlus C0.
Boot source eMMC eMMC -
Splash Screen Y Y Supports USB mouse.
UI (input) Y Y -
UI (display) HDMI display Y Supports LVDS-to-HDMI display.
RN00227 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved.
Table 2. Features...continued
Feature i.MX 8QuadXPlus/ i.MX 95 EVK Remarks
8QuadMax MEK
UI (brightness control) N N -
Storage - External Media Y Y -
Connectivity - Ethernet Y Y Atheros AR8031
Connectivity - Bluetooth Y Y PCIE9098 (Murata LBEE5ZZ1XL) for i.MX 8QuadMax
wireless technology and 8QuadXPlus. PCIE9098 (U-Blox JODY-W3) for
i.MX 95.
Profiles: A2DP Sink, AVRCP, BLE Host, HFP,
PBAPClient, MAPMCE, PAN.
Connectivity - Wi-Fi Y Y PCIE9098 (Murata LBEE5ZZ1XL) for i.MX 8QuadMax
and 8QuadXPlus. PCIE9098 (U-Blox JODY-W3) for
i.MX 95.
Features: STA mode, AP mode, AP/STA Concurrency.
Connectivity - USB Tethering Y Y Supports Wi-Fi as upstream.
Power - CPU Freq Y Y -
Power - Bus Freq Y Y -
Media - Music Play Y Y i.MX 8/95: SAI+WM8960 or WM8962.
i.MX 8: ESAI+CS42888 (no support for multichannel)
i.MX 95: SAI+CS42888 (no support for multichannel)
Media - HDMI audio output N N -
Misc - ADB over USB Y Y -
Misc - Fastboot utility Y Y -
Misc - SW update and Y Y -
factory reset
File-based Encryption Y Y -
webGL Y Y -
Vulkan Y Y -
USB TYPEC PD Y Y -
OTA for A/B Y Y -
TEE backed Keymaster HAL Y Y This is based on the i.MX Trusty OS TEE firmware.
TEE backed AVB Y Y This is based on the i.MX Trusty OS TEE firmware
and secure storage of eMMC chip. In this release, the
RPMB part needs to be initialized manually.
Media rearview camera Y Y MAX9286 camera.
Car Audio Policy Y Y All sounds are played from the audio jack on the CPU
board. Rear zone audio is played to an extended
audio board (CS42888 codec). Rear zone audio is an
optional audio path.
5 Multimedia Codecs
For multimedia codecs and features, see the i.MX Android Extended Codec Release Notes (RN00202).
RN00227 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved.
6 Change Logs
Compared to the automotive-14.0.0_1.1.0 release, automotive-14.0.0_2.1.0 has the following major changes:
• Upgraded the Android code base from android-14.0.0_r17 to android-14.0.0_r34.
• Upgraded the GKI kernel from android14-6.1-2024-01_r4 to android15-6.6.
• Upgraded U-Boot from 2023.04 to 2024.04.
• Upgraded ATF from v2.8 to v2.10.
RN00227 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved.
RN00227 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved.
8 Revision History
This table provides the revision history.
RN00227 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved.
RN00227 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved.
Legal information
Definitions Suitability for use in automotive applications — This NXP product has
been qualified for use in automotive applications. If this product is used
by customer in the development of, or for incorporation into, products or
Draft — A draft status on a document indicates that the content is still services (a) used in safety critical applications or (b) in which failure could
under internal review and subject to formal approval, which may result lead to death, personal injury, or severe physical or environmental damage
in modifications or additions. NXP Semiconductors does not give any (such products and services hereinafter referred to as “Critical Applications”),
representations or warranties as to the accuracy or completeness of then customer makes the ultimate design decisions regarding its products
information included in a draft version of a document and shall have no and is solely responsible for compliance with all legal, regulatory, safety,
liability for the consequences of use of such information. and security related requirements concerning its products, regardless of
any information or support that may be provided by NXP. As such, customer
assumes all risk related to use of any products in Critical Applications and
Disclaimers NXP and its suppliers shall not be liable for any such use by customer.
Accordingly, customer will indemnify and hold NXP harmless from any
claims, liabilities, damages and associated costs and expenses (including
Limited warranty and liability — Information in this document is believed
attorneys’ fees) that NXP may incur related to customer’s incorporation of
to be accurate and reliable. However, NXP Semiconductors does not give
any product in a Critical Application.
any representations or warranties, expressed or implied, as to the accuracy
or completeness of such information and shall have no liability for the
Export control — This document as well as the item(s) described herein
consequences of use of such information. NXP Semiconductors takes no
may be subject to export control regulations. Export might require a prior
responsibility for the content in this document if provided by an information
authorization from competent authorities.
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
HTML publications — An HTML version, if available, of this document is
punitive, special or consequential damages (including - without limitation -
provided as a courtesy. Definitive information is contained in the applicable
lost profits, lost savings, business interruption, costs related to the removal
document in PDF format. If there is a discrepancy between the HTML
or replacement of any products or rework charges) whether or not such
document and the PDF document, the PDF document has priority.
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Translations — A non-English (translated) version of a document, including
Notwithstanding any damages that customer might incur for any reason the legal information in that document, is for reference only. The English
whatsoever, NXP Semiconductors’ aggregate and cumulative liability version shall prevail in case of any discrepancy between the translated and
towards customer for the products described herein shall be limited in English versions.
accordance with the Terms and conditions of commercial sale of NXP
Semiconductors.
Security — Customer understands that all NXP products may be subject to
unidentified vulnerabilities or may support established security standards or
Right to make changes — NXP Semiconductors reserves the right to specifications with known limitations. Customer is responsible for the design
make changes to information published in this document, including without and operation of its applications and products throughout their lifecycles
limitation specifications and product descriptions, at any time and without to reduce the effect of these vulnerabilities on customer’s applications
notice. This document supersedes and replaces all information supplied prior and products. Customer’s responsibility also extends to other open and/or
to the publication hereof. proprietary technologies supported by NXP products for use in customer’s
applications. NXP accepts no liability for any vulnerability. Customer should
Applications — Applications that are described herein for any of these regularly check security updates from NXP and follow up appropriately.
products are for illustrative purposes only. NXP Semiconductors makes no
Customer shall select products with security features that best meet rules,
representation or warranty that such applications will be suitable for the
regulations, and standards of the intended application and make the
specified use without further testing or modification.
ultimate design decisions regarding its products and is solely responsible
Customers are responsible for the design and operation of their for compliance with all legal, regulatory, and security related requirements
applications and products using NXP Semiconductors products, and NXP concerning its products, regardless of any information or support that may be
Semiconductors accepts no liability for any assistance with applications or provided by NXP.
customer product design. It is customer’s sole responsibility to determine
NXP has a Product Security Incident Response Team (PSIRT) (reachable
whether the NXP Semiconductors product is suitable and fit for the
at [email protected]) that manages the investigation, reporting, and solution
customer’s applications and products planned, as well as for the planned
release to security vulnerabilities of NXP products.
application and use of customer’s third party customer(s). Customers should
provide appropriate design and operating safeguards to minimize the risks
associated with their applications and products. NXP B.V. — NXP B.V. is not an operating company and it does not distribute
or sell products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default
in the customer’s applications or products, or the application or use by
customer’s third party customer(s). Customer is responsible for doing all Trademarks
necessary testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications Notice: All referenced brands, product names, service names, and
and the products or of the application or use by customer’s third party trademarks are the property of their respective owners.
customer(s). NXP does not accept any liability in this respect.
NXP — wordmark and logo are trademarks of NXP B.V.
Terms and conditions of commercial sale — NXP Semiconductors AMBA, Arm, Arm7, Arm7TDMI, Arm9, Arm11, Artisan, big.LITTLE,
products are sold subject to the general terms and conditions of commercial Cordio, CoreLink, CoreSight, Cortex, DesignStart, DynamIQ, Jazelle,
sale, as published at https://www.nxp.com/profile/terms, unless otherwise Keil, Mali, Mbed, Mbed Enabled, NEON, POP, RealView, SecurCore,
agreed in a valid written individual agreement. In case an individual Socrates, Thumb, TrustZone, ULINK, ULINK2, ULINK-ME, ULINK-
agreement is concluded only the terms and conditions of the respective PLUS, ULINKpro, μVision, Versatile — are trademarks and/or registered
agreement shall apply. NXP Semiconductors hereby expressly objects to trademarks of Arm Limited (or its subsidiaries or affiliates) in the US and/or
applying the customer’s general terms and conditions with regard to the elsewhere. The related technology may be protected by any or all of patents,
purchase of NXP Semiconductors products by customer. copyrights, designs and trade secrets. All rights reserved.
Bluetooth — the Bluetooth wordmark and logos are registered trademarks
owned by Bluetooth SIG, Inc. and any use of such marks by NXP
Semiconductors is under license.
RN00227 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved.
RN00227 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved.
Contents
1 Release Description ........................................ 2
2 Supported Hardware SoC/Boards .................. 2
3 Release Package Contents ............................. 2
4 Features ............................................................ 3
5 Multimedia Codecs .......................................... 4
6 Change Logs ....................................................5
7 Known Issues and Limitations ....................... 5
8 Revision History .............................................. 7
Legal information .............................................9
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section 'Legal information'.