Esp32-Wroom-Da Datasheet en

ESP32-WROOM-DA
Datasheet Preliminary v0.7
2.4 GHz Wi-Fi + Bluetooth® + Bluetooth LE module

Built around ESP32 series of SoCs, Xtensa® dual-core 32-bit LX6 microprocessor
8 MB flash
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24 GPIOs, rich set of peripherals
On-board dual PCB antennas
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ESP32-WROOM-DA
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www.espressif.com
1 Module Overview
1 Module Overview
Note:
Check the link or the QR code to make sure that you use the latest version of this document:
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1.1 Features
CPU and On-Chip Memory Peripherals

• ESP32-D0WD-V3 embedded, Xtensa ®
• SD card, UART, SPI, SDIO, I2C, LED PWM, Motor
dual-core 32-bit LX6 microprocessor, up to 240 PWM, I2S, IR, pulse counter, GPIO, capacitive
MHz touch sensor, ADC, DAC, TWAI® ( compatible
with ISO 11898-1, i.e. CAN Specification 2.0)
• 448 KB ROM for booting and core functions
• 520 KB SRAM for data and instructions

Integrated Components on Module
• 16 KB SRAM in RTC • 40 MHz crystal oscillator
• 8 MB SPI flash
Wi-Fi
• 802.11b/g/n
Antenna Options
• Bit rate: 802.11n up to 150 Mbps • On-board dual PCB antennas
• A-MPDU and A-MSDU aggregation

Operation Conditions
• 0.4 µs guard interval support
• Operating voltage/Power supply: 3.0 ~ 3.6 V
• Center frequency range of operating channel:
• Operating ambient temperature: –40 ~ 85 °C
2412 ~ 2484 MHz
Certification
Bluetooth
• Bluetooth V4.2 BR/EDR and Bluetooth LE • RF certification: See Certificates
specification
• Green certification: REACH/RoHS
• Class-1, class-2 and class-3 transmitter
• AFH Test
• CVSD and SBC • Reliability: HTOL/HTSL/uHAST/TCT/ESD
1.2 Description
ESP32-WROOM-DA is a powerful Wi-Fi + Bluetooth + Bluetooth LE MCU module, with two complementary PCB
antennas in different directions. This module has the same layout of pins as ESP32-WROOM-32E except
some pins are not led out, facilitating quick and easy migration between these two modules. With two unique
antennas design on one single module, ESP32-WROOM-DA can be used to develop IoT applications that
need stable connectivity over a broad spectrum, or to deploy Wi-Fi in challenging and hazardous
environments, or to overcome communication problems in Wi-Fi-dead spots. This module is an ideal choice
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Espressif Systems 2 ESP32-WROOM-DA Datasheet v0.7
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1 Module Overview
for indoor and outdoor devices for smart home, industrial control, consumer electronics, etc.
The ordering information of this module is listed as follows:
Table 1: Ordering Information
Module Ordering Code Chip Embedded 3 Flash 1, 2

Module Dimensions (mm)
ESP32-WROOM-DA ESP32-WROOM-DA-N8 ESP32-D0WD-V3 8 MB 35.6 x 34.4 x 3.5
Notes:
1. The module can be shipped with different flash sizes.
2. The integrated flash supports:
- More than 100,000 program/erase cycles
- More than 20 years data retention time
3. For details on the part numbers of the ESP32 series of chips, please refer to ESP32 Series Datasheet.
At the core of the module is the ESP32-D0WD-V3 chip. The chip embedded is designed to be scalable and
adaptive. There are two CPU cores that can be individually controlled, and the CPU clock frequency is
adjustable from 80 MHz to 240 MHz. The chip also has a low-power coprocessor that can be used instead of
the CPU to save power while performing tasks that do not require much computing power, such as monitoring
of peripherals.
ESP32-D0WD-V3 integrates a rich set of peripherals, ranging from capacitive touch sensors, SD card interface,
Ethernet, high-speed SPI, UART, I2S, and I2C.
1.3 Applications
• Generic Low-power IoT Sensor Hub • Smart Building
• Generic Low-power IoT Data Loggers • Industrial Automation
• Cameras for Video Streaming • Smart Agriculture
• Over-the-top (OTT) Devices • Audio Applications
• Speech Recognition • Health Care Applications
• Image Recognition • Wi-Fi-enabled Toys
• Mesh Network • Wearable Electronics
• Home Automation • Retail & Catering Applications
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Contents
Contents
1 Module Overview 2
1.1 Features 2
1.2 Description 2
1.3 Applications 3
2 Block Diagram 8
3 Pin Definitions 9
3.1 Pin Layout 9
3.2 Pin Description 9
3.3 Strapping Pins 11
4 Electrical Characteristics 14
4.1 Absolute Maximum Ratings 14
4.2 Recommended Operating Conditions 14
4.3 DC Characteristics (3.3 V, 25 °C) 14
4.4 Current Consumption Characteristics 15
4.5 Wi-Fi RF Characteristics 17
4.5.1 Wi-Fi RF Standards 17
4.5.2 Transmitter Characteristics 17
4.5.3 Receiver Characteristics 18
4.6 Bluetooth Radio 19
4.6.1 Receiver – Basic Data Rate 19
4.6.2 Transmitter – Basic Data Rate 20
4.6.3 Receiver – Enhanced Data Rate 20
4.6.4 Transmitter – Enhanced Data Rate 21
4.7 Bluetooth LE Radio 21
4.7.1 Receiver 21
4.7.2 Transmitter 22
5 Module Schematics 23
6 Peripheral Schematics 24
7 Physical Dimensions and PCB Land Pattern 25

7.1 Physical Dimensions 25
7.2 Recommended PCB Land Pattern 26
8 Product Handling 27
8.1 Storage Conditions 27
8.2 Electrostatic Discharge (ESD) 27
8.3 Reflow Profile 27
8.4 Ultrasonic Vibration 28
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Contents
Related Documentation and Resources 29
Revision History 30
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List of Tables
List of Tables
1 Ordering Information 3
2 Pin Definitions 9
3 Select Working Antenna 11
4 Strapping Pins 12
5 Parameter Descriptions of Setup and Hold Times for the Strapping Pins 13
6 Absolute Maximum Ratings 14
7 Recommended Operating Conditions 14
8 DC Characteristics (3.3 V, 25 °C) 14
9 Current Consumption Depending on RF Modes 15
10 Current Consumption Depending on Work Modes 15
11 Wi-Fi RF Standards 17
12 TX Power Characteristics 18
13 RX Sensitivity Characteristics 18
14 RX Maximum Input Level 19
15 Adjacent Channel Rejection 19
16 Receiver Characteristics – Basic Data Rate 19
17 Transmitter Characteristics – Basic Data Rate 20
18 Receiver Characteristics – Enhanced Data Rate 20
19 Transmitter Characteristics – Enhanced Data Rate 21
20 Receiver Characteristics – BLE 22
21 Transmitter Characteristics – BLE 22
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List of Figures
List of Figures
1 ESP32-WROOM-DA Block Diagram 8
2 Pin Layout (Top View) 9
3 Setup and Hold Times for the Strapping Pins 12
4 ESP32-WROOM-DA Schematics 23
5 Peripheral Schematics 24
6 Physical Dimensions 25
7 Recommended PCB Land Pattern 26
8 Reflow Profile 27
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2 Block Diagram
2 Block Diagram
Antenna Antenna
40 MHz
RF Matching
RF Matching
3V3 Crystal
EN
GPIOs
Wi-Fi/BT Chip
RF Switch
VDD_SDIO ESP32-D0WD-V3 Control
SPI CS
NOR flash SPI
S M RF Matching
Figure 1: ESP32-WROOM-DA Block Diagram
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3 Pin Definitions
3 Pin Definitions
3.1 Pin Layout

The pin diagram below shows the approximate location of pins on the module. For the actual diagram drawn to
scale, please refer to Figure 7.1 Physical Dimensions.
1
a
An
n
en
t en
t
An
an
41 IO25
2
GND 1 40 GND
42 IO2
3V3 2 39 IO23
EN 3 38 IO22
SENSOR_VP 4 37 U0TXD
SENSOR_VN 5 36 U0RXD
GND GND GND
IO34 6 35 IO21
43
GND GND
IO35 7 GND 34 NC
GND GND GND

IO32 8 33 IO19
IO33 9 32 IO18
NC 10 31 IO5
IO26 11 30 IO17
IO27 12 29 IO16
IO14 13 28 IO4
21
22
20
23
24
26
25
16
17
18
19
15
IO12 14 27 IO0
GND
IO13
NC
NC
NC
NC
NC
NC
NC
IO15
NC
NC
Figure 2: Pin Layout (Top View)
Top View
3.2 Pin Description
The module has 41 pins and two test points. See pin definitions in Table 2.
Table 2: Pin Definitions
Name No. Type Function2

GND 1 P Ground
3V3 2 P Power supply
Cont’d on next page
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3 Pin Definitions
Table 2 – cont’d from previous page

High: On; enables the chip
EN 3 I Low: Off; the chip shuts down
Note: Do not leave the pin floating.
SENSOR_VP 4 I GPIO36, ADC1_CH0, RTC_GPIO0
SENSOR_VN 5 I GPIO39, ADC1_CH3, RTC_GPIO3
IO34 6 I GPIO34, ADC1_CH6, RTC_GPIO4
IO35 7 I GPIO35, ADC1_CH7, RTC_GPIO5
GPIO32, XTAL_32K_P (32.768 kHz crystal oscillator input), ADC1_CH4,
IO32 8 I/O
TOUCH9, RTC_GPIO9
GPIO33, XTAL_32K_N (32.768 kHz crystal oscillator output),
IO33 9 I/O
ADC1_CH5, TOUCH8, RTC_GPIO8
NC 10 — —
IO26 11 I/O GPIO26, DAC_2, ADC2_CH9, RTC_GPIO7, EMAC_RXD1
IO27 12 I/O GPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17, EMAC_RX_DV
GPIO14, ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK,
IO14 13 I/O
HS2_CLK, SD_CLK, EMAC_TXD2
GPIO12, ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ, HS2_DATA2,
IO12 14 I/O
SD_DATA2, EMAC_TXD3
NC 15 — —
GND 16 P Ground
GPIO13, ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID, HS2_DATA3,
IO13 17 I/O
SD_DATA3, EMAC_RX_ER
NC 18 — —
NC 19 — —
NC 20 — —
NC 21 — —
NC 22 — —
NC 23 — —
GPIO15, ADC2_CH3, TOUCH3, MTDO, HSPICS0, RTC_GPIO13,
IO15 24 I/O
HS2_CMD, SD_CMD, EMAC_RXD3
NC 25 — —
NC 26 — —
IO0 27 I/O GPIO0, ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1, EMAC_TX_CLK
GPIO4, ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1,
IO4 28 I/O
SD_DATA1, EMAC_TX_ER
IO16 29 I/O GPIO16, HS1_DATA4, U2RXD, EMAC_CLK_OUT
IO17 30 I/O GPIO17, HS1_DATA5, U2TXD, EMAC_CLK_OUT_180
IO5 31 I/O GPIO5, VSPICS0, HS1_DATA6, EMAC_RX_CLK
IO18 32 I/O GPIO18, VSPICLK, HS1_DATA7
IO19 33 I/O GPIO19, VSPIQ, U0CTS, EMAC_TXD0
NC 34 — —
IO21 35 I/O GPIO21, VSPIHD, EMAC_TX_EN
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3 Pin Definitions

U0RXD 36 I/O GPIO3, U0RXD, CLK_OUT2
U0TXD 37 I/O GPIO1, U0TXD, CLK_OUT3, EMAC_RXD2
IO22 38 I/O GPIO22, VSPIWP, U0RTS, EMAC_TXD1
IO23 39 I/O GPIO23, VSPID, HS1_STROBE
GND 40 P Ground
NC 3 41 — —
NC 3 42 — —
GND 43 P Ground
1 For peripheral pin configurations, please refer to ESP32 Series Datasheet.
2 GPIO2 and GPIO25 on the ESP32-D0WD-V3 chip are designed as test points to control RF Switch
(See Figure 4 ESP32-WROOM-DA Schematics). The two pins are not led out to the module. To select
the working antenna, (Antenna 1 or Antenna 2), configure GPIO2 and GPIO25 as follows:
Table 3: Select Working Antenna
Working Antenna GPIO2 GPIO25

Antenna 1 High Low
Antenna 2 (by default) Low High
3.3 Strapping Pins

Note:
The content below is excerpted from Section Strapping Pins in ESP32 Series Datasheet. For the strapping pin mapping
between the chip and modules, please refer to Chapter 5 Module Schematics.
ESP32 has five strapping pins:
• MTDI
• GPIO0
• GPIO2
• MTDO
• GPIO5
Software can read the values of these five bits from register ”GPIO_STRAPPING”.
During the chip’s system reset release (power-on-reset, RTC watchdog reset and brownout reset), the latches
of the strapping pins sample the voltage level as strapping bits of ”0” or ”1”, and hold these bits until the chip
is powered down or shut down. The strapping bits configure the device’s boot mode, the operating voltage of
VDD_SDIO and other initial system settings.
Each strapping pin is connected to its internal pull-up/pull-down during the chip reset. Consequently, if a
strapping pin is unconnected or the connected external circuit is high-impedance, the internal weak
pull-up/pull-down will determine the default input level of the strapping pins.
To change the strapping bit values, users can apply the external pull-down/pull-up resistances, or use the
host MCU’s GPIOs to control the voltage level of these pins when powering on ESP32.
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3 Pin Definitions
After reset release, the strapping pins work as normal-function pins.
Refer to Table 4 for a detailed boot-mode configuration by strapping pins.
Table 4: Strapping Pins
Voltage of Internal LDO (VDD_SDIO)

Pin Default 3.3 V 1.8 V
MTDI Pull-down 0 1
Booting Mode
Pin Default SPI Boot Download Boot
GPIO0 Pull-up 1 0
GPIO2 Pull-down Don’t-care 0
Enabling/Disabling Debugging Log Print over U0TXD During Booting
Pin Default U0TXD Active U0TXD Silent
MTDO Pull-up 1 0
Timing of SDIO Slave
FE Sampling FE Sampling RE Sampling RE Sampling
Pin Default FE Output RE Output FE Output RE Output
MTDO Pull-up 0 0 1 1
GPIO5 Pull-up 0 1 0 1
* FE: falling-edge, RE: rising-edge
* Firmware can configure register bits to change the settings of ”Voltage of Internal
LDO (VDD_SDIO)” and ”Timing of SDIO Slave”, after booting.
* The module integrates a 3.3 V SPI flash, so the pin MTDI cannot be set to 1 when
the module is powered up.
The illustration below shows the setup and hold times for the strapping pins before and after the CHIP_PU
signal goes high. Details about the parameters are listed in Table 5.
t0 t1
VIL_nRST
CHIP_PU
VIH
Strapping pin
Figure 3: Setup and Hold Times for the Strapping Pins
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3 Pin Definitions
Table 5: Parameter Descriptions of Setup and Hold Times for the Strapping Pins
Parameters Description Min. Unit

t0 Setup time before CHIP_PU goes from low to high 0 ms
t1 Hold time after CHIP_PU goes high 1 ms
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4 Electrical Characteristics
4.1 Absolute Maximum Ratings

Stresses beyond the absolute maximum ratings listed in the table below may cause permanent damage to the
device. These are stress ratings only, and do not refer to the functional operation of the device that should
follow the recommended operating conditions.
Table 6: Absolute Maximum Ratings
Symbol Parameter Min Max Unit

VDD33 Power supply voltage –0.3 3.6 V
TST ORE Storage temperature –40 105 °C
* Please see Appendix IO_MUX of
ESP32 Series Datasheet for IO’s power domain.
4.2 Recommended Operating Conditions
Table 7: Recommended Operating Conditions
Symbol Parameter Min Typ Max Unit

VDD33 Power supply voltage 3.0 3.3 3.6 V
IV DD Current delivered by external power supply 0.5 — — A
T Operating ambient temperature -40 — 85 °C
4.3 DC Characteristics (3.3 V, 25 °C)
Table 8: DC Characteristics (3.3 V, 25 °C)

CIN Pin capacitance — 2 — pF
VIH High-level input voltage 0.75 × VDD1 — VDD1 + 0.3 V
VIL Low-level input voltage –0.3 — 0.25 × VDD1 V
IIH High-level input current — — 50 nA
IIL Low-level input current — — 50 nA
VOH High-level output voltage 0.8 × VDD1 — — V
VOL Low-level output voltage — — 0.1 × VDD1 V
VDD3P3_CPU
High-level source current — 40 — mA
power domain
(VDD1 = 3.3 V, 1, 2
IOH VOH >= 2.64 V,
VDD3P3_RTC
output drive strength set — 40 — mA
power domain
to the maximum) 1, 2
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VDD_SDIO power
— 20 — mA
domain 1, 3
Low-level sink current
IOL (VDD1 = 3.3 V, VOL = 0.495 V, — 28 — mA
output drive strength set to the maximum)
RP U Resistance of internal pull-up resistor — 45 — kΩ
RP D Resistance of internal pull-down resistor — 45 — kΩ
Low-level input voltage of CHIP_PU
VIL_nRST — — 0.6 V
to shut down the chip
1 Please see Appendix IO_MUX of ESP32 Series Datasheet for IO’s power domain. VDD is the I/O
voltage for a particular power domain of pins.
2 For VDD3P3_CPU and VDD3P3_RTC power domain, per-pin current sourced in the same domain is
gradually reduced from around 40 mA to around 29 mA, VOH >=2.64 V, as the number of current-
source pins increases.
3 Pins occupied by flash and/or PSRAM in the VDD_SDIO power domain were excluded from the test.
4.4 Current Consumption Characteristics

With the use of advanced power-management technologies, ESP32 can switch between different power
modes.
For details on ESP32’s power consumption in different power modes, please refer to section ”RTC and
Low-Power Management” in ESP32 Series Datasheet.
Table 9: Current Consumption Depending on RF Modes
Work mode Description Peak (mA)

802.11b, 20 MHz, 1 Mbps, @19.5 dBm 379
802.11g, 20 MHz, 54 Mbps, @15 dBm 276
TX
802.11n, 20 MHz, MCS7, @13 dBm 258
Active (RF working)
802.11n, 40 MHz, MCS7, @13 dBm 211
802.11b/g/n, 20 MHz 112
RX
802.11n, 40 MHz 118
* The current consumption measurements are taken with a 3.3 V supply at 25 °C of ambient
temperature at the RF port. All transmitters’ measurements are based on a 100% duty cycle.
* The current consumption figures for in RX mode are for cases when the peripherals are
disabled and the CPU idle.
Table 10: Current Consumption Depending on Work Modes
Work mode Description Current consumption (Typ)

240 MHz 30 ~ 68 mA
1, 2
The CPU is
Modem-sleep 160 MHz 27 ~ 44 mA
powered up 3
Normal speed: 80 MHz 20 ~ 31 mA
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Light-sleep — 0.8 mA
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The ULP coprocessor is powered up 4 150 µA
ULP sensor-monitored pattern 5 100 µA @1% duty
Deep-sleep
RTC timer + RTC memory 10 µA
RTC timer only 5 µA
Power off CHIP_PU is set to low level, the chip is powered down 1 µA
1 The current consumption figures in Modem-sleep mode are for cases where the CPU is powered up and the
cache idle.
2 When Wi-Fi is enabled, the chip switches between Active and Modem-sleep modes. Therefore, current
consumption changes accordingly.
3 In Modem-sleep mode, the CPU frequency changes automatically. The frequency depends on the CPU load
and the peripherals used.
4 During Deep-sleep, when the ULP coprocessor is powered on, peripherals such as GPIO and RTC I2C are
able to operate.
5 The ”ULP sensor-monitored pattern” refers to the mode where the ULP coprocessor or the sensor works
periodically. When ADC works with a duty cycle of 1%, the typical current consumption is 100 µA.
4.5 Wi-Fi RF Characteristics

4.5.1 Wi-Fi RF Standards
Table 11: Wi-Fi RF Standards
Name Description
Center frequency range of operating channel* 2412 ~ 2484 MHz
Wi-Fi wireless standard IEEE 802.11b/g/n
11b: 1, 2, 5.5 and 11 Mbps
20 MHz 11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
Data rate
11n: MCS0-7, 72.2 Mbps (Max)
40 MHz 11n: MCS0-7, 150 Mbps (Max)
Antenna type PCB antenna
* Device should operate in the center frequency range allocated by regional regulatory authorities. Target
center frequency range is configurable by software.
4.5.2 Transmitter Characteristics

Target TX power is configurable based on device or certification requirements. The default characteristics are
provided in Table 12.
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Table 12: TX Power Characteristics
Rate Typ (dBm)

11b, 1 Mbps 19.5
11b, 11 Mbps 19.5
11g, 6 Mbps 18
11g, 54 Mbps 14
11n, HT20, MCS0 18
11n, HT20, MCS7 13
11n, HT40, MCS0 18
11n, HT40, MCS7 13
4.5.3 Receiver Characteristics
Table 13: RX Sensitivity Characteristics
Rate Typ (dBm)

1 Mbps –97
2 Mbps –94
5.5 Mbps –92
11 Mbps –88
6 Mbps –93
9 Mbps –91
12 Mbps –89
18 Mbps –87
24 Mbps –84
36 Mbps –80
48 Mbps –77
54 Mbps –75
11n, HT20, MCS0 –92
11n, HT20, MCS1 –88
11n, HT20, MCS2 –86
11n, HT20, MCS3 –83
11n, HT20, MCS4 –80
11n, HT20, MCS5 –76
11n, HT20, MCS6 –74
11n, HT20, MCS7 –72
11n, HT40, MCS0 –89
11n, HT40, MCS1 –85
11n, HT40, MCS2 –83
11n, HT40, MCS3 –80
11n, HT40, MCS4 –76
11n, HT40, MCS5 –72
11n, HT40, MCS6 –71
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Rate Typ (dBm)
11n, HT40, MCS7 –69
Table 14: RX Maximum Input Level
Rate Typ (dBm)

11b, 1 Mbps 5
11b, 11 Mbps 5
11g, 6 Mbps 0
11g, 54 Mbps –8
11n, HT20, MCS0 0
11n, HT20, MCS7 –8
11n, HT40, MCS0 0
11n, HT40, MCS7 –8
Table 15: Adjacent Channel Rejection
Rate Typ (dB)

11b, 11 Mbps 35
11g, 6 Mbps 27
11g, 54 Mbps 13
11n, HT20, MCS0 27
11n, HT20, MCS7 12
11n, HT40, MCS0 16
11n, HT40, MCS7 7
4.6 Bluetooth Radio

4.6.1 Receiver – Basic Data Rate
Table 16: Receiver Characteristics – Basic Data Rate
Parameter Conditions Min Typ Max Unit

Sensitivity @0.1% BER — –90 –89 –88 dBm
Maximum received signal @0.1% BER — 0 — — dBm
Co-channel C/I — — +7 — dB
F = F0 + 1 MHz — — –6 dB
F = F0 – 1 MHz — — –6 dB
F = F0 + 2 MHz — — –25 dB
Adjacent channel selectivity C/I
F = F0 – 2 MHz — — –33 dB
F = F0 + 3 MHz — — –25 dB
F = F0 – 3 MHz — — –45 dB
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30 MHz ~ 2000 MHz –10 — — dBm
2000 MHz ~ 2400 MHz –27 — — dBm
Out-of-band blocking performance
2500 MHz ~ 3000 MHz –27 — — dBm
3000 MHz ~ 12.5 GHz –10 — — dBm
Intermodulation — –36 — — dBm
4.6.2 Transmitter – Basic Data Rate
Table 17: Transmitter Characteristics – Basic Data Rate

RF transmit power* - - 0 - dBm
Gain control step - - 3 - dB
RF power control range - –12 - +9 dBm
+20 dB bandwidth - - 0.9 - MHz
F = F0 ± 2 MHz - –55 - dBm
Adjacent channel transmit power F = F0 ± 3 MHz - –55 - dBm
F = F0 ± > 3 MHz - –59 - dBm
∆ f 1avg - - - 155 kHz
∆ f 2max - 127 - - kHz
∆ f 2avg /∆ f 1avg - - 0.92 - -
ICFT - - –7 - kHz
Drift rate - - 0.7 - kHz/50 µs
Drift (DH1) - - 6 - kHz
Drift (DH5) - - 6 - kHz
* There are a total of eight power levels from 0 to 7, and the transmit power ranges from –12 dBm to 9
dBm. When the power level rises by 1, the transmit power increases by 3 dB. Power level 4 is used
by default and the corresponding transmit power is 0 dBm.
4.6.3 Receiver – Enhanced Data Rate
Table 18: Receiver Characteristics – Enhanced Data Rate

π/4 DQPSK
Maximum received signal @0.01% BER — — 0 — dBm
Co-channel C/I — — 11 — dB
F = F0 + 1 MHz — –7 — dB
F = F0 – 1 MHz — –7 — dB
F = F0 + 2 MHz — –25 — dB
F = F0 – 2 MHz — –35 — dB
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F = F0 + 3 MHz — –25 — dB
F = F0 – 3 MHz — –45 — dB
8DPSK
Maximum received signal @0.01% BER — — –5 — dBm
C/I c-channel — — 18 — dB
F = F0 + 1 MHz — 2 — dB
F = F0 – 1 MHz — 2 — dB
F = F0 + 2 MHz — –25 — dB
F = F0 – 2 MHz — –25 — dB
F = F0 + 3 MHz — –25 — dB
F = F0 – 3 MHz — –38 — dB
4.6.4 Transmitter – Enhanced Data Rate
Table 19: Transmitter Characteristics – Enhanced Data Rate

RF transmit power (see note under Table 17) — — 0 — dBm
Gain control step — — 3 — dB
RF power control range — –12 — +9 dBm
π/4 DQPSK max w0 — — –0.72 — kHz
π/4 DQPSK max wi — — –6 — kHz
π/4 DQPSK max |wi + w0| — — –7.42 — kHz
8DPSK max w0 — — 0.7 — kHz
8DPSK max wi — — –9.6 — kHz
8DPSK max |wi + w0| — — –10 — kHz
RMS DEVM — 4.28 — %
π/4 DQPSK modulation accuracy 99% DEVM — 100 — %
Peak DEVM — 13.3 — %
RMS DEVM — 5.8 — %
8 DPSK modulation accuracy 99% DEVM — 100 — %
Peak DEVM — 14 — %
F = F0 ± 1 MHz — –46 — dBm
F = F0 ± 2 MHz — –44 — dBm
In-band spurious emissions
F = F0 ± 3 MHz — –49 — dBm
F = F0 +/– > 3 MHz — — –53 dBm
EDR differential phase coding — — 100 — %
4.7 Bluetooth LE Radio

4.7.1 Receiver
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Table 20: Receiver Characteristics – BLE

Sensitivity @30.8% PER — –94 –93 –92 dBm
Maximum received signal @30.8% PER — 0 — — dBm
Co-channel C/I — — +10 — dB
F = F0 + 1 MHz — –5 — dB
F = F0 – 1 MHz — –5 — dB
F = F0 + 2 MHz — –25 — dB
F = F0 – 2 MHz — –35 — dB
F = F0 + 3 MHz — –25 — dB
F = F0 – 3 MHz — –45 — dB
30 MHz ~ 2000 MHz –10 — — dBm
2000 MHz ~ 2400 –27 — — dBm
Out-of-band blocking performance
MHz
2500 MHz ~ 3000 –27 — — dBm
MHz
3000 MHz ~ 12.5 GHz –10 — — dBm
Intermodulation — –36 — — dBm
4.7.2 Transmitter
Table 21: Transmitter Characteristics – BLE

RF transmit power (see note under Table — — 0 — dBm
17)
Gain control step — — 3 — dB
RF power control range — –12 — +9 dBm
F = F0 ± 2 MHz — –55 — dBm
Adjacent channel transmit power F = F0 ± 3 MHz — –57 — dBm
F = F0 ± > 3 MHz — –59 — dBm
∆ f 1avg — — — 265 kHz
∆ f 2max — 210 — — kHz
∆ f 2avg /∆ f 1avg — — +0.92 — —
ICFT — — –10 — kHz
Drift rate — — 0.7 — kHz/50 µs
Drift — — 2 — kHz
End of Life (EOL)

Espressif Systems
5 Module Schematics
5 Module Schematics
This is the reference design of the module.
GND
3
GND U1 GND
The values of C1 and C2 vary with
GND
GND XOUT
the selection of the crystal.
C1 C2
The value of R2 varies with the actual
XIN
VDD33
ESP32-WROOM-DA(pin-out)
PCB board. TBD TBD
2
C3 C20
GND GND
100pF/50V(10%) 1uF/6.3V(20%) 40MHz(±10ppm)
VDD33
TBD
C5 R1 20K(5%)
GND GND GPIO21 U4 ESP32-WROOM-DA
10nF/6.3V(10%) C6 R3 499(1%) U0TXD
U0RXD GND 1 40 GND
C9 3.3nF/6.3V(10%) GPIO22 2 GND1 GND3 39 GPIO23
VDD33 3V3 IO23
R2
CHIP_PU 3 38 GPIO22
0.1uF/6.3V(10%) SENSOR_VP 4 EN IO22 37 U0TXD
VDD33 GND SENSOR_VP TXD0
SENSOR_VN 5 36 U0RXD
GND D1 GPIO34 6 SENSOR_VN RXD0 35 GPIO21
49
48
47
46
45
44
43
42
41
40
39
L5 2.0nH(±0.1nH) GND GPIO35 7 IO34 IO21 34
ESD IO35 NC
GPIO32 8 33 GPIO19
GND
CAP1
CAP2
VDDA
XTAL_P
XTAL_N
VDDA
GPIO21
U0TXD
U0RXD
GPIO22
C13 C11 C10 C21 GPIO33 9 IO32 IO19 32 GPIO18
10 IO33 IO18 31 GPIO5

C4 IO25 IO5
10uF/6.3V(20%) 1uF/6.3V(20%) 0.1uF/6.3V(10%) 100pF/50V(10%) VDD33 VDD_SDIO GPIO26 11 30 GPIO17
0.1uF/6.3V(10%) GND GPIO27 12 IO26 IO17 29 GPIO16
GND GND GND GND GPIO14 13 IO27 IO16 28 GPIO4
1 38 GPIO19 GPIO12 14 IO14 IO4 27 GPIO0
ESP32_ANT L4 TBD 2 VDDA GPIO19 37 IO12 IO0
LNA_IN VDD3P3_CPU
GND2
3 36 GPIO23
CMD
IO13
IO15
SD2
SD3
CLK
SD0
SD1
VDD3P3 GPIO23
IO2
C15 C14 4 35 GPIO18 SCS/CMD 1 5 SDI/SD1
NC
NC
VCC
SENSOR_VP 5 VDD3P3 GPIO18 34 GPIO5 /CS DI
TBD TBD 6 SENSOR_VP GPIO5 33 SDI/SD1 SCK/CLK 6 2 SDO/SD0
15
16
17
18
19
20
21
22
23
24
25
26
7 SENSOR_CAPP SD_DATA_1 32 SDO/SD0 CLK DO
GND
SENSOR_VN 8 SENSOR_CAPN SD_DATA_0 31 SCK/CLK SHD/SD2 7 3 SWP/SD3
GND GND CHIP_PU 9 SENSOR_VN SD_CLK 30 SCS/CMD /HOLD /WP
GPIO34 10 CHIP_PU SD_CMD 29 SWP/SD3 U3 FLASH
GPIO13
GPIO15
4
GPIO35 11 VDET_1 SD_DATA_3 28 SHD/SD2
GPIO32 12 VDET_2 SD_DATA_2 27 GPIO17
GPIO33 13 32K_XP GPIO17 26
The values of C15, L4 and C14
23
VDD3P3_RTC
GPIO25 14 32K_XN VDD_SDIO 25 GPIO16
vary with the actual PCB board. GND
GPIO25 GPIO16
GND
GPIO26
GPIO27
GPIO2
GPIO0
GPIO4
MTMS
MTDO
MTCK
NC: No component.
MTDI
C18
VDD_SDIO
1uF/6.3V(20%)
U2 ESP32-D0WD-V3
15
16
17
18
19
20
21
22
23
24
VDD33
GND
C19
GPIO26
GPIO27
GPIO14
GPIO12
GPIO13
GPIO15
GPIO2
GPIO0
GPIO4
0.1uF/6.3V(10%)
GND
RF Switch:
ANT1
L3 TBD 1
2
VDD33
C38 C37 PCB ANT
U9
U8 TBD TBD
1 6 CTL2 4 3 RF2 RF2 C43 100pF
TP1 NC1 VCC VC2 RF2
ESP32_ANT C42 100pF 5 2 GND
1 GPIO2 R14 0 CTL1 2 5 CTL1 6 RFC GND 1 RF1 RF1 C44 100pF GND GND
A NC2 C41 VC1 RF1
3 4 CTL2 0.1uF(NC)
GND Y RTC6603SP
ESP32-WROOM-DA Datasheet v0.7
R12 C46 C45

ANT2
10K SN74AUP1G04(NC) 22pF 22pF
GND L6 TBD 1
GND 2
GND GND
C40 C39 PCB ANT
GND TBD TBD
VDD33 GND GND
The values of C38, L3,C37,C40,L6 and C39

R13
10K
vary with the actual PCB board.
End of Life (EOL)
TP2
1 GPIO25 R15 0 CTL2
Figure 4: ESP32-WROOM-DA Schematics

6 Peripheral Schematics
6 Peripheral Schematics
This is the typical application circuit of the module connected with peripheral components (for example,
power supply, antenna, reset button, JTAG interface, and UART interface).
U1
VDD33 43 VDD33
GND 1 P_GND 40 GND
2 GND1 GND3 39 GPIO23 JP1
EN 3 3V3 IO23 38 GPIO22 1
GPI36 SENSOR_VP 4 EN IO22 37 TXD0 2 1
GPI39 SENSOR_VN 5 SENSOR_VP TXD0 36 RXD0 3 2
C1 C2 R1
GPI34 6 SENSOR_VN RXD0 35 GPIO21 4 3
22uF 0.1uF 10K GPI35 7 IO34 IO21 34 4
GPIO32 8 IO35 NC 33 GPIO19 UART
GPIO33 9 IO32 IO19 32 GPIO18
10 IO33 IO18 31 GPIO5 GND
C3 GPIO26 11 NC IO5 30 GPIO17
1uF GPIO14 13 IO27 IO16 28 GPIO4
15 IO12 IO0 26
GND GND GND 16 NC NC 25
GPIO13 17 GND2 NC 24 GPIO15
IO13 IO15
1
2
18 23 GND
19 NC NC 22
1
2
20 NC NC 21
NC NC JP2
Boot Option
ESP32-WROOM-DA
SW1
R2 0R EN JP3
1 GPIO14 MTMS
C4 0.1uF 1 2 GPIO12 MTDI
2 3 GPIO13 MTCK
3 4 GPIO15 MTDO
4
GND JTAG
Figure 5: Peripheral Schematics
Note:
• Soldering Pad 43 to the ground of the base board is not a must. If you choose to solder it, please apply the
correct amount of soldering paste. Too much soldering paste may increase the gap between the module and
the baseboard. As a result, the adhesion between other pins and the baseboard may be poor.
• To ensure the power supply to the ESP32 chip during power-up, it is advised to add an RC delay circuit at
the EN pin. The recommended setting for the RC delay circuit is usually R = 10 kΩ and C = 1 µF. However,
specific parameters should be adjusted based on the power-up timing of the module and the power-up and
reset sequence timing of the chip. For ESP32’s power-up and reset sequence timing diagram, please refer to
Section Power Scheme in ESP32 Series Datasheet.
End of Life (EOL)

7 Physical Dimensions and PCB Land Pattern
7.1 Physical Dimensions
Unit: mm
Tolerance: +/-0.10 mm
R0
.50
0.45
34.40±0.15
3.70
24.55
0.50
0.90
23.40
16.51
19.20
1.27
3.70
0.90
0.50
10.67
1.00±0.10
0.85
1.50
1.08
3.50±0.15
11.43 10.50
13.97
15.80
18.00
27.20
35.60±0.15
Top View Side View Bottom View
Figure 6: Physical Dimensions
Note:
For information about tape, reel, and product marking, please refer to Espressif Module Package Information.
End of Life (EOL)

7.2 Recommended PCB Land Pattern

This section provides the following resources for your reference:
• Figures for recommended PCB land patterns with all the dimensions needed for PCB design. See Figure
7 Recommended PCB Land Pattern.
• Source files of recommended PCB land patterns to measure dimensions not covered in Figure 7. You
can view the source files for ESP32-WROOM-DA with Autodesk Viewer.
Unit: mm
Via for thermal pad
Copper
Antenna Area
40 x1.5
1 40
0.9
0.5
40 x0.9
34.4
16.51
3.7
1.27
0.9
3.7
1.27
10.67
7.50
1.5
0.5
15 26
1.27
13.97
17.5
18.00
Figure 7: Recommended PCB Land Pattern
End of Life (EOL)

8 Product Handling
8 Product Handling
8.1 Storage Conditions

The products sealed in moisture barrier bags (MBB) should be stored in a non-condensing atmospheric
environment of < 40 °C and 90%RH. The module is rated at the moisture sensitivity level (MSL) of 3.
After unpacking, the module must be soldered within 168 hours with the factory conditions 25 ± 5 °C and 60
%RH. If the above conditions are not met, the module needs to be baked.
8.2 Electrostatic Discharge (ESD)

• Human body model (HBM): ±2000 V
• Charged-device model (CDM): ±500 V
8.3 Reflow Profile

Solder the module in a single reflow.
Temperature (℃)
Peak Temp.
235 ~ 250 ℃
250
Preheating zone Reflow zone Cooling zone
150 ~ 200 ℃ 60 ~ 120 s 217 ℃ 60 ~ 90 s –1 ~ –5 ℃/s
217
200
Soldering time
> 30 s
Ramp-up zone
1 ~ 3 ℃/s
100
50
25
Time (sec.)
0
0 50 100 150 200 250
Ramp-up zone — Temp.: 25 ~ 150 ℃ Time: 60 ~ 90 s Ramp-up rate: 1 ~ 3 ℃/s

Preheating zone — Temp.: 150 ~ 200 ℃ Time: 60 ~ 120 s
Reflow zone — Temp.: >217 ℃ 60 ~ 90 s; Peak Temp.: 235 ~ 250 ℃ Time: 30 ~ 70 s
Cooling zone — Peak Temp. ~ 180 ℃ Ramp-down rate: –1 ~ –5 ℃/s
Solder — Sn-Ag-Cu (SAC305) lead-free solder alloy
Figure 8: Reflow Profile
End of Life (EOL)

8 Product Handling
8.4 Ultrasonic Vibration

Avoid exposing Espressif modules to vibration from ultrasonic equipment, such as ultrasonic welders or
ultrasonic cleaners. This vibration may induce resonance in the in-module crystal and lead to its malfunction or
even failure. As a consequence, the module may stop working or its performance may deteriorate.
End of Life (EOL)

Related Documentation and Resources
Related Documentation and Resources

Related Documentation
• ESP32 Series Datasheet – Specifications of the ESP32 hardware.
• ESP32 Technical Reference Manual – Detailed information on how to use the ESP32 memory and peripherals.
• ESP32 Hardware Design Guidelines – Guidelines on how to integrate the ESP32 into your hardware product.
• ESP32 ECO and Workarounds for Bugs – Correction of ESP32 design errors.
• ESP32 Series SoC Errata – Descriptions of known errors in ESP32 series of SoCs.
• Certificates
https://espressif.com/en/support/documents/certificates
• ESP32 Product/Process Change Notifications (PCN)
https://espressif.com/en/support/documents/pcns
• ESP32 Advisories – Information on security, bugs, compatibility, component reliability.
https://espressif.com/en/support/documents/advisories
• Documentation Updates and Update Notification Subscription
https://espressif.com/en/support/download/documents
Developer Zone
• ESP-IDF Programming Guide for ESP32 – Extensive documentation for the ESP-IDF development framework.
• ESP-IDF and other development frameworks on GitHub.
https://github.com/espressif
• ESP32 BBS Forum – Engineer-to-Engineer (E2E) Community for Espressif products where you can post questions,
share knowledge, explore ideas, and help solve problems with fellow engineers.
https://esp32.com/
• The ESP Journal – Best Practices, Articles, and Notes from Espressif folks.
https://blog.espressif.com/
• See the tabs SDKs and Demos, Apps, Tools, AT Firmware.
https://espressif.com/en/support/download/sdks-demos
Products
• ESP32 Series SoCs – Browse through all ESP32 SoCs.
https://espressif.com/en/products/socs?id=ESP32
• ESP32 Series Modules – Browse through all ESP32-based modules.
https://espressif.com/en/products/modules?id=ESP32
• ESP32 Series DevKits – Browse through all ESP32-based devkits.
https://espressif.com/en/products/devkits?id=ESP32
• ESP Product Selector – Find an Espressif hardware product suitable for your needs by comparing or applying filters.
https://products.espressif.com/#/product-selector?language=en
Contact Us
• See the tabs Sales Questions, Technical Enquiries, Circuit Schematic & PCB Design Review, Get Samples
(Online stores), Become Our Supplier, Comments & Suggestions.
https://espressif.com/en/contact-us/sales-questions
End of Life (EOL)

Revision History
Revision History
Date Version Release notes
• Added the End of Life (EOL) sign

• Added notes about erase cycles and retention time for flash in Table 1
2024-09-12 v0.7
Ordering Information
• Updated note 1 in Chapter 6 Peripheral Schematics
Major updates:
• Removed contents about hall sensor according to PCN20221202
• Added Section 8.4: Ultrasonic Vibration
2023-01-17 v0.6 Other updates:
• Added strapping pin timing in Section 3.3: Strapping Pins
• Added source files of PCB land pattern in Section 7.2: Recommended
PCB Land Pattern
2021-08-19 v0.5 Preliminary release
End of Life (EOL)

Disclaimer and Copyright Notice
Information in this document, including URL references, is subject to change without notice.
ALL THIRD PARTY’S INFORMATION IN THIS DOCUMENT IS PROVIDED AS IS WITH NO WARRANTIES TO ITS AUTHENTICITY AND
ACCURACY.
NO WARRANTY IS PROVIDED TO THIS DOCUMENT FOR ITS MERCHANTABILITY, NON-INFRINGEMENT, FITNESS FOR ANY PARTICULAR
PURPOSE, NOR DOES ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE.
All liability, including liability for infringement of any proprietary rights, relating to use of information in this document is disclaimed. No
licenses express or implied, by estoppel or otherwise, to any intellectual property rights are granted herein.
The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a registered trademark of Bluetooth SIG.
All trade names, trademarks and registered trademarks mentioned in this document are property of their respective owners, and are
hereby acknowledged.
Copyright © 2024 Espressif Systems (Shanghai) Co., Ltd. All rights reserved.
www.espressif.com
End of Life (EOL)

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ESP32-WROOM-DA

Datasheet Preliminary v0.7

2.4 GHz Wi-Fi + Bluetooth® + Bluetooth LE module

CPU and On-Chip Memory Peripherals

• 520 KB SRAM for data and instructions

• A-MPDU and A-MSDU aggregation

• CVSD and SBC • Reliability: HTOL/HTSL/uHAST/TCT/ESD

End of Life (EOL)

The ordering information of this module is listed as follows:

Table 1: Ordering Information

Module Ordering Code Chip Embedded 3 Flash 1, 2

• Generic Low-power IoT Data Loggers • Industrial Automation

• Cameras for Video Streaming • Smart Agriculture

• Over-the-top (OTT) Devices • Audio Applications

• Speech Recognition • Health Care Applications

• Image Recognition • Wi-Fi-enabled Toys

• Mesh Network • Wearable Electronics

• Home Automation • Retail & Catering Applications

End of Life (EOL)

7 Physical Dimensions and PCB Land Pattern 25

Related Documentation and Resources 29

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Figure 1: ESP32-WROOM-DA Block Diagram

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3.1 Pin Layout

GND GND GND

Figure 2: Pin Layout (Top View)

Table 2: Pin Definitions

Name No. Type Function2

End of Life (EOL)

Table 2 – cont’d from previous page

End of Life (EOL)

Table 2 – cont’d from previous page

Working Antenna GPIO2 GPIO25

3.3 Strapping Pins

ESP32 has five strapping pins:

After reset release, the strapping pins work as normal-function pins.

Refer to Table 4 for a detailed boot-mode configuration by strapping pins.

Table 4: Strapping Pins

Voltage of Internal LDO (VDD_SDIO)

Figure 3: Setup and Hold Times for the Strapping Pins

End of Life (EOL)

Parameters Description Min. Unit

End of Life (EOL)

4.1 Absolute Maximum Ratings

Table 6: Absolute Maximum Ratings

Symbol Parameter Min Max Unit

4.2 Recommended Operating Conditions

Table 7: Recommended Operating Conditions

Symbol Parameter Min Typ Max Unit

4.3 DC Characteristics (3.3 V, 25 °C)

Table 8: DC Characteristics (3.3 V, 25 °C)

Symbol Parameter Min Typ Max Unit

Cont’d on next page

End of Life (EOL)

Table 8 – cont’d from previous page

4.4 Current Consumption Characteristics