Technical Information

P674E
PP-based Tie-Layer Resin

Product Description

High Performance Tie-Resin for Multilayer- barrier film/sheet, blow molding and pipes

Product Overview
• Outstanding adhesion to barrier- • Excellent processability
Features: Polymers and metals • Ready-to-use
• Heat resistance, Retortable
Adherent resins: • PP; EVOH, Polyamide
Base resin: • Random-PP
Form: • Pellets
Typical process • Cast-Film • Blow- Molding
methods: • Blown- Film • Pipe-Co-Extrusion

Technical Information
1
The values below are typical values shall not to be construed as specifications.
Physical Typical Value1 Unit Test Method
Melt Flow Rate (230°C, 21.2N) 4,5 g/10min ISO 1133
Density 0.89 g/cm3 ISO 1183, Method A
Melting Point(peak) 143 °C MCC Method
DSC (Peak)
Mechanical
Vicat softening temperature 113 °C ISO 306
(10N load; 50°C/hr)
Tensile stress at yield 16 MPa ISO 527
Tensile stress at break MPa Type 1A
Nominal tensile strain at break >550 % 50mm/min
Flexural Modulus (23°C) 390 MPa ISO 178
Shore D Hardness 51 - ISO 868

MODIC™ is a registered trademark of Mitsubishi Chemical Corporation. The information contained herein is, to the best of our knowledge, true and accurate based on tests or
experience that we believe are reliable, but all recommendations or suggestions are made without any guarantee, since the conditions of use are beyond our control. There is no
warranty, express or implied, including, but not limited to, any implied warranty of merchantability or fitness for a particular purpose of our products. In submitting this information, no
liability is assumed by us and no license or other rights express or implied are given to the user with respect to any existing or pending patent, patent applications or trademarks. The
observance of all legal regulations and patents is the responsibility of the user. We shall not be liable for loss or damages, whether direct, indirect, special, incidental or consequential,
regardless of the legal theory asserted, including negligence, warranty, tort or strict liability.
© 2005 Mitsubishi Chemical Corporation. All rights reserved
 Technical Information

P674E
PP-based Tie-Layer Resin

Processing
General Process Conditions
Recommended Temperature Profile for PA6 / Modic / PP co-extrusion
C1 C2 C3 Joint Die
PA6-Cylinder 230°C 250°C 250°C 250°C
TM
Modic -Cylinder 190°C 210°C 210°C 210°C 250°C
PP-Cylinder 190°C 210°C 210°C 210°C

Recommended Temperature Profile for EVOH / Modic / PP co-extrusion

C1 C2 C3 Joint Die
EVOH-Cylinder 190°C 210°C 210°C 210°C
ModicTM-Cylinder 190°C 210°C 210°C 210°C 210°C
PP-Cylinder 190°C 210°C 210°C 210°C

Notes
2
The extrusion processing guidelines shown above just are intended to be general recommendations in terms of processing
for the MODIC™ grade but may vary based on design of the application. Some adjustments also may be required depending
upon the characteristics of extrusion equipment and neighbouring layer-polymers. We suggest, to control the MODIC-
cylinder- and melt temperature in a range between 200°C and max. 280°C.

Issue date: 22.08.2022

Rev: 07.12.2022

MODIC™ is a registered trademark of Mitsubishi Chemical Corporation. The information contained herein is, to the best of our knowledge, true and accurate based on tests or
experience that we believe are reliable, but all recommendations or suggestions are made without any guarantee, since the conditions of use are beyond our control. There is no
warranty, express or implied, including, but not limited to, any implied warranty of merchantability or fitness for a particular purpose of our products. In submitting this information, no
liability is assumed by us and no license or other rights express or implied are given to the user with respect to any existing or pending patent, patent applications or trademarks. The
observance of all legal regulations and patents is the responsibility of the user. We shall not be liable for loss or damages, whether direct, indirect, special, incidental or consequential,
regardless of the legal theory asserted, including negligence, warranty, tort or strict liability.
© 2005 Mitsubishi Chemical Corporation. All rights reserved
 Technical Information

P674E
PP-based Tie-Layer Resin

MODIC™ is a registered trademark of Mitsubishi Chemical Corporation. The information contained herein is, to the best of our knowledge, true and accurate based on tests or
experience that we believe are reliable, but all recommendations or suggestions are made without any guarantee, since the conditions of use are beyond our control. There is no
warranty, express or implied, including, but not limited to, any implied warranty of merchantability or fitness for a particular purpose of our products. In submitting this information, no
liability is assumed by us and no license or other rights express or implied are given to the user with respect to any existing or pending patent, patent applications or trademarks. The
observance of all legal regulations and patents is the responsibility of the user. We shall not be liable for loss or damages, whether direct, indirect, special, incidental or consequential,
regardless of the legal theory asserted, including negligence, warranty, tort or strict liability.
© 2005 Mitsubishi Chemical Corporation. All rights reserved