Android-13.0.0 1.2.0 WiFi
Android-13.0.0 1.2.0 WiFi
PCIE-Wi-Fi-UART-BT-FP92-88W8997
PCIE-Wi-Fi-UART-BT-FP92-88W9098
SD-Wi-Fi-UART-BT-FP92-88W8987
SD-Wi-Fi-UART-BT-FP92-IW416
SD-Wi-Fi-UART-BT-FP99-IW612
SD-Wi-Fi-UART-BT-FP92-88W8997
SD-Wi-Fi-UART-BT-FP92-88W9098
Release Notes
NXP Semiconductors NXP-Wireless-Chipset-Release-Notes
_____________________________________________________________________________________________
Contents
List of Tables ..................................................................................................................................................................4
Revision History .............................................................................................................................................................5
1 About this document ............................................................................................................................................6
2 Downloading Wireless Driver and Firmware ........................................................................................................7
2.1 Pre-compiled Wi-Fi driver and firmware .........................................................................................................7
2.2 Wi-Fi driver source and firmware....................................................................................................................7
2.3 Wi-Fi patch ......................................................................................................................................................7
3 Feature List............................................................................................................................................................9
4 Release Notes......................................................................................................................................................19
4.1 PCIe-UART 8997 ............................................................................................................................................19
4.1.1 Package Information .....................................................................................................................19
4.1.2 Version Information ......................................................................................................................19
4.1.3 Host Platform ................................................................................................................................19
4.1.4 Wi-Fi and Bluetooth Certification .................................................................................................19
4.1.5 Wi-Fi Throughput ..........................................................................................................................20
4.1.6 EU Conformance Tests ..................................................................................................................23
4.1.7 Bug Fixes/Feature Enhancements .................................................................................................23
4.1.8 Known Issues.................................................................................................................................24
4.2 PCIe-UART 9098 ............................................................................................................................................25
4.2.1 Package Information .....................................................................................................................25
4.2.2 Version Information ......................................................................................................................25
4.2.3 Host Platform ................................................................................................................................25
4.2.4 Wi-Fi and Bluetooth Certification .................................................................................................25
4.2.5 Wi-Fi Throughput ..........................................................................................................................26
4.2.6 EU Conformance Tests ..................................................................................................................30
4.2.7 Bug Fixes/Feature Enhancements .................................................................................................30
4.2.8 Known Issues.................................................................................................................................31
4.3 SD-UART 8987 ...............................................................................................................................................32
4.3.1 Package Information .....................................................................................................................32
4.3.2 Version Information ......................................................................................................................32
4.3.3 Host Platform ................................................................................................................................32
4.3.4 Wi-Fi and Bluetooth Certification .................................................................................................32
4.3.5 Wi-Fi Throughput ..........................................................................................................................33
4.3.6 EU Conformance Tests ..................................................................................................................36
4.3.7 Bug Fixes/Feature Enhancements .................................................................................................36
4.3.8 Known Issues.................................................................................................................................37
4.4 SD-UART IW416 .............................................................................................................................................38
4.4.1 Package Information .....................................................................................................................38
4.4.2 Version Information ......................................................................................................................38
4.4.3 Host Platform ................................................................................................................................38
4.4.4 Wi-Fi and Bluetooth Certification .................................................................................................38
4.4.5 Wi-Fi Throughput ..........................................................................................................................39
4.4.6 EU Conformance Tests ..................................................................................................................41
4.4.7 Bug Fixes/Feature Enhancements .................................................................................................41
4.4.8 Known Issues.................................................................................................................................42
4.5 SD-UART 8997 ...............................................................................................................................................43
4.5.1 Package Information .....................................................................................................................43
List of Tables
Table 1: Revision history of the document ....................................................................................................................5
Table 2 Default wireless firmware support ...................................................................................................................7
Table 3: Feature List for available SoCs .........................................................................................................................9
Table 4: On-board chips and external support for Bluetooth and Wi-Fi support ........................................................63
Revision History
Table 1: Revision history of the document
Revision Date Change details
Rev. 1 4-Jan-2022 • Initial release
Rev. 2 8-Apr-2022 • Section 3
• Added new features for AP-STA
• Section 4.1.1 4.1.2 4.1.4 4.1.5 4.3.1 4.3.2 4.3.4
4.3.5 changed
• Updated package and release information
• Updated certification information
• Updated Wi-Fi throughput numbers
Rev. 3 24-July-2022 • Section 4.1.1 4.1.2 4.1.4 4.3.1 4.3.2 4.3.4 4.3.5
changed
• Updated package and release information
• Updated certification information
• Updated Wi-Fi throughput numbers
• Section 4.4
• New section for IW416
Rev. 4 17-Oct-2022 • Sections 2 3 updated
• Sections 4.1 0 4.4 5 6 updated
• New section 4.4 added
Rev. 5 30-Dec-2022 • Section 2 3 updated
• New section 4.2 and 4.6 added
• Sections 4.1 0 4.4 4.5 updated
Rev. 6 07-Apr-2023 • Section 2 3 4.1 4.2 4.3 4.4 4.5 4.6 updated
• Section 4.7 added
Note: The android-13.0.0_1.2.0 release prebuild images include the following default wireless firmware based on
the i.MX8 EVK boards. Please refer below table for the combinations available:
For non-default firmware, you need to build the BSP image from source. For example, refer to the section 5.2 and
5.3 in user manual UM11558 for 88W8987 firmware.
For example, Navigate to the user guide on 88W8997 wireless chipset documentation page as below:
Wi-Fi® + Bluetooth® > 88W8997 > Documentation
Note:
• UART driver source code is opensource and part of the Linux kernel source.
• UART driver source code used for Bluetooth is NOT part of the release package and it can be downloaded
from the kernel.org.
https://www.nxp.com/design/software/embedded-software/i-mx-software/android-os-for-i-mx-applications-
processors:IMXANDROID
3 Feature List
Table 3: Feature List for available SoCs
Wireless PCIe-UART SD-UART
Type Features List Sub Features List
Type 8997 9098 9098 IW612 8997 8987 IW416
Wi-Fi Client 802.11n - 2.4 GHz band operation
High supported channel Y Y Y Y Y Y Y
Throughput bandwidth: 20 MHz
2.4 GHz band
supported channel Y Y Y Y Y Y Y
bandwidths : 40 MHz
5 GHz band supported
channel bandwidths : Y Y Y Y Y Y Y
20 MHz
5 GHz band supported
channel bandwidths : Y Y Y Y Y Y Y
40 MHz
Short/long guard
Y Y Y Y Y Y Y
interval (400 ns/800 ns)
11n data rates – Up to
72 Mbit/s (MCS 0 to Y Y Y Y Y Y Y
MCS 7)
11n data rates – Up to
150 Mbit/s (MCS 0 to Y Y Y Y Y Y Y
MCS 7)
11n data rates - Up to
300 Mbit/s (MCS 0 to Y Y Y Y Y N N
MCS 15)
1 spatial stream (1x1) Y Y Y Y Y Y Y
2 spatial stream (2x2) Y Y Y N Y N N
HT protection
Y Y Y Y Y Y Y
mechanisms
Explicit Beamformee Y Y Y Y Y N N
Aggregated MAC
Protocol Data
Y Y Y Y Y Y Y
Unit(AMPDU) Rx
support
Aggregated MAC
Service Data
Y Y Y Y Y Y Y
Unit(AMSDU) -4k Rx
support
20/40 MHz Coexistence Y Y Y Y Y N N
Tx MCS rate adaptation
Y Y Y Y Y Y Y
(BGN)
RX and TX Space time
Y Y Y N Y N N
block coding (STBC)
Rx Low Density Parity
Y Y Y Y Y Y N
Check (LDPC)
802.11 ac - 5 GHz band supported
Very High channel bandwidths: 20 Y Y Y Y Y Y N
Throughput MHz
5 GHz band supported
channel bandwidths: 40 Y Y Y Y Y Y N
MHz
Short/Long Guard Y Y Y Y Y Y N
Interval (400ns/800ns)
WAPI Support* N Y Y Y N Y N
Opensource Hostapd Y Y Y Y Y Y Y
*Features are tested on the x86 Ubuntu 16 host platform with NXP reference board
OPP Server/Client Y Y Y Y Y Y Y
SPP Y Y Y Y Y Y Y
HID Y Y Y Y Y Y Y
GAP Y Y Y Y Y Y Y
Bluetooth Y Y Y Y Y Y Y
PCM NBS Master/Slave
Audio
PCM WBS
Features Y Y Y Y Y Y Y
Master/Slave
Dual HFP (1 WBS/1NBS)
N Y Y N N N N
PCM*
Dual HFP (2 NBS)
N Y Y N N N N
PCM)*
AAC and LDAC audio
N Y Y N N N N
codec support*
Bluetooth Generic Maximum 16 Bluetooth
LE Features Features LE connections(Central Y Y Y Y Y Y Y
role)
*Features are tested on the x86 Ubuntu 16 host platform with NXP reference board
*In-band (Independent Reset)IR can directly work with M.2 based modules on i.MX but OOB IR needs the external uSD muRata adaptor board
with M.2 module
Note: Additional Vendor Specific Command is required to support the PCM WBS for IW612.
Bluetooth LE
Extended N N N N N Y Y
Advertisement
High Duty Cycle
Y Y Y Y Y Y Y
Directed Advertising
Coex Bluetooth + BCA-TDM
STA + Bluetooth Y N N Y Y Y Y
Wi-Fi Mode
Coex
Coexistence (Shared
Antenna) STA + Bluetooth LE Y N N Y Y Y Y
Coex
STA + Bluetooth +
Y N N Y Y Y Y
Bluetooth LE Coex
AP + Bluetooth Coex Y N N Y Y Y Y
AP + Bluetooth LE
Y N N Y Y Y Y
Coex
Note:
P2P-GO and STA simultaneous mode operations
In this case, P2P-GO and STA modes are active simultaneously where STA has connected to an external AP. If the
external-AP switches channel, the P2P-GO stops in case of i.MX Android. The Wi-Fi firmware does not support Dual
Channel Radio Concurrency. It means P2P-GO and STA cannot stay on two different channels simultaneously.
In Android, there is only a single wpa_supplicant instance. It would disable the least prioritized interface (P2P) and
stop the P2P. In this wpa_supplicant behavior, the firmware does not get a chance to move the P2P-GO to the same
channel as STA.
Work-Around: The variable num_multichan_concurrent can be assigned value 2 in the function
sme_send_authentication of the file "sme.c" [filepath:
android_build/external/wpa_supplicant_8/wpa_supplicant/] in wpa_supplicant source.
After this change, supplicant will not stop the P2P-GO and allow the firmware to move P2P-GO on the same channel
as STA.
How to apply changes:
In wpa_supplicant source, the function wiphy_info_iface_comb_process at line 195 of file
src/drivers/driver_nl80211_capa.c, the num_channels variable should be set to 2.
if (combination_has_p2p && combination_has_mgd) {
- unsigned int num_channels =
- nla_get_u32(tb_comb[NL80211_IFACE_COMB_NUM_CHANNELS]);
+ unsigned int num_channels = 2;
After you have implemented the changes described above, build wpa_supplicant. Now, you can see P2P-GO on the
same channel as STA when external-AP switches the channel.
4 Release Notes
4.1 PCIe-UART 8997
4.1.1 Package Information
• Android BSP version : 13.0.0_1.2.0
• Wi-Fi and Bluetooth/Bluetooth LE Firmware version : 17.92.1.p76.2
• Driver version : MM5X16368.p2-GPL
Note:
• Download Labtool application for RF test mode, refer to the URL: 88W8997-MANUFACTURING-RELEASE-
P207
• Download Sigma tool, refer to the URL: NXP-WTS-DUT-AGENT-Release-R1-9
Note:
• Download Labtool application for RF test mode, refer to the URL: 9098 Manufacturing FW and Windows
Labtool release
• Download Sigma tool, refer to the URL: NXP-WTS-DUT-AGENT-Release-R1-9
STA Mode Throughput - AX Mode | MAC2 | 2.4 GHz Band | 20 MHz (HE)
Protocol TCP (Mbit/s) UDP (Mbit/s)
Direction Tx Rx Tx Rx
Open Security 173 172 185 184
WPA2-AES 172 171 185 184
WPA3-SAE 169 169 178 179
Mobile AP Mode Throughput - AX Mode | MAC2 | 2.4 GHz Band | 20 MHz (HE)
Protocol TCP (Mbit/s) UDP (Mbit/s)
Direction Tx Rx Tx Rx
Open Security 143 142 148 149
WPA2-AES 141 141 147 148
WPA3-SAE 141 141 148 148
Note:
• Download Labtool application for RF test mode, refer to the URL: MFG-W8987-MF- WIFI-BT- BRG-FC-
VS2013
• Download Sigma tool, refer to the URL: NXP-WTS-DUT-AGENT-Release-R1-9
Coex • Sometimes in dual A2DP mode, glitches are observed and Wi-Fi Rx throughput drops.
Note:
• Download Labtool application for RF test mode, refer to the URL: MFG-W8978-MF-WIFI-BT-BRG-FC-VS2013
• Download Sigma tool, refer to the URL: NXP-WTS-DUT-AGENT-Release-R1-9
Component Description
Wi-Fi • Fix Channel Occupancy Time (COT) for HT20/MCS0 within 6 msec
Component Description
• Once DUT PAN profile gets disconnection with remote device, then DUT reconnection fails
for successive connection trials.
Wi-Fi
• DUT Bluetooth Classic & BLE RX test mode fails to receive the packets and host is failing to
derive the various parameters.
Component Description
• DUT Bluetooth & BLE TX test mode fails to set the power continuously and there is a
Bluetooth
difference between configured and measured power.
Component Description
Wi-Fi • When ed-mac is enabled, probe responses are transmitted during interference signal.
• The ACL link with iPhone is disconnected due to error code “REMOTE DEVICE TERMINATED
CONNECTION DUE TO LOW RESOURCES”
• After disconnecting LE link, sometime disconnect complete event is delayed by 30 seconds,
so next re-connection possible only after 30 second
• Random Bluetooth security link loss in concurrent Bluetooth classic and Bluetooth LE modes
Bluetooth
with AES
• When Bluetooth A2DP streaming is ongoing with first remote device then DUT shows low
transmit throughput with second remote device.
• DUT HFP link gets disconnected with Remote phone, when it starts OPP file transfer to
Remote device.
Note:
• Download Labtool application for RF test mode, refer to the URL: 88W8997-MANUFACTURING-RELEASE-
P207
• Download Sigma tool, refer to the URL: NXP-WTS-DUT-AGENT-Release-R1-9
STA Mode Throughput - BGN Mode | 2.4 GHz Band | 20 MHz (HT)
Protocol TCP (Mbit/s) UDP (Mbit/s)
Direction Tx Rx Tx Rx
Open Security 113 109 126 114
WPA2-AES 112 116 125 124
WPA3-SAE 111 109 126 117
Component Description
• After disconnecting LE link, sometime disconnect complete event is delayed by 30
seconds, so next re-connection possible only after 30 second
Bluetooth
• DUT HFP link gets disconnected with Remote phone, when it starts OPP file transfer to
Remote device.
• DUT A2DP sink audio glitches observed when it starts Wi-Fi data traffic with Station device
on BGN 20MHz.
Coex
• DUT is not able to connect with Bluetooth device and not able to sustain LE connection,
when it starts receiving the Wi-Fi data traffic with Station/Access Point on BGN 20MHz.
Note:
• Download Labtool application for RF test mode, refer to the URL: 9098 Manufacturing FW and Windows
Labtool release
• Download Sigma tool, refer to the URL: NXP-WTS-DUT-AGENT-Release-R1-9
STA Mode Throughput - BGN Mode | 2.4 GHz Band | 20 MHz (HT)
Protocol TCP (Mbit/s) UDP (Mbit/s)
Direction Tx Rx Tx Rx
Open Security 113 112 115 113
WPA2-AES 110 110 118 113
WPA3-SAE 110 111 120 114
STA Mode Throughput - AX Mode | MAC2 | 2.4 GHz Band | 20 MHz (HE)
Protocol TCP (Mbit/s) UDP (Mbit/s)
Direction Tx Rx Tx Rx
Open Security 172 156 184 172
WPA2-AES 171 153 186 170
WPA3-SAE 174 159 180 171
Mobile AP Mode Throughput - AX Mode | MAC2 | 2.4 GHz Band | 20 MHz (HE)
Protocol TCP (Mbit/s) UDP (Mbit/s)
Direction Tx Rx Tx Rx
Open Security 141 137 148 149
WPA2-AES 141 136 147 148
WPA3-SAE 141 136 147 148
Component Description
Wi-Fi • Low throughput is observed in VHT/HE mode.
• While HFP incoming(skype) call, DUT unable to route the audio to the reference device and
ringtone is not heard on reference device.
Bluetooth
• When Bluetooth firmware is downloaded on in band reset, after that sometimes FW fails
to respond to HCI reset and not able to bring up Bluetooth interface.
Note:
• Download Labtool application for RF test mode, refer to the URL: MFG-AW-IW61X-MF-BRG-U16-WIN-X86-
1.0.0.39.1-18.80.1.p154.38
• Download Sigma tool, refer to the URL: NXP-WTS-DUT-AGENT-Release-R1-9
STA Mode Throughput - BGN Mode | 2.4 GHz Band | 20 MHz (HT)
Protocol TCP (Mbit/s) UDP (Mbit/s)
Direction Tx Rx Tx Rx
Open Security 48 55 60 58
WPA2-AES 46 55 60 57
WPA3-SAE 48 55 60 59
STA Mode Throughput - AX Mode | MAC2 | 2.4 GHz Band | 20 MHz (HE)
Protocol TCP (Mbit/s) UDP (Mbit/s)
Direction Tx Rx Tx Rx
Open Security 108 112 122 120
WPA2-AES 105 111 122 118
WPA3-SAE 103 111 118 116
Mobile AP Mode Throughput - AX Mode | MAC2 | 2.4 GHz Band | 20 MHz (HE)
Protocol TCP (Mbit/s) UDP (Mbit/s)
Direction Tx Rx Tx Rx
Open Security 107 90 113 115
WPA2-AES 113 87 117 119
WPA3-SAE 110 73 116 118
Component Description
-- NA
SoC On-board Chip PCIe M.2 card uSD card or SDIO M.2 card
NXP 88W8997
(AzureWave AW-CM276
8 QM/QXP/DX/DXL - SM/MA*) -
NXP 88W8997 (Murata
LBEE5XV1YM*)
NXP IW416 (Murata
8 ULP - -
LBEE5CJ1XK*)
NXP 88W8997
8M Plus - (AzureWave AW-CM276 -
SM/MA*)
NXP 88W8997
(AzureWave AW-CM276
8M Quad - SM/MA*) -
NXP 88W8997 (Murata
LBEE5XV1YM*)
*Tested modules with mentioned i.MX EVK.
AP Access Point
BW Bandwidth
HT High Throughput
STA Station
7 Legal Information
7.1 Disclaimers
Limited warranty and liability — Information in this document is negligence), strict liability, breach of contract, breach of warranty or
believed to be accurate and reliable. However, NXP Semiconductors any other theory, even if advised of the possibility of such damages.
does not give any representations or warranties, expressed or
implied, as to the accuracy or completeness of such information and
shall have no liability for the consequences of use of such
Notwithstanding any damages that customer might incur for any
information. NXP Semiconductors takes no responsibility for the
reason whatsoever (including without limitation, all damages
content in this document if provided by an information source outside
referenced above and all direct or general damages), the entire
of NXP Semiconductors. In no event shall NXP Semiconductors be
liability of NXP Semiconductors, its affiliates and their suppliers and
liable for any indirect, incidental, punitive, special or consequential
customer’s exclusive remedy for all of the foregoing shall be limited to
damages (including - without limitation - lost profits, lost savings,
actual damages incurred by customer based on reasonable reliance
business interruption, costs related to the removal or replacement of
up to the greater of the amount actually paid by customer for the
any products or rework charges) whether or not such damages are
product or five dollars (US$5.00). The foregoing limitations,
based on tort (including negligence), warranty, breach of contract or
exclusions and disclaimers shall apply to the maximum extent
any other legal theory. Notwithstanding any damages that customer
permitted by applicable law, even if any remedy fails of its essential
might incur for any reason whatsoever, NXP Semiconductors’
purpose.
aggregate and cumulative liability towards customer for the products
described herein shall be limited in accordance with the Terms and Translations — A non-English (translated) version of a document is
conditions of commercial sale of NXP Semiconductors. for reference only. The English version shall prevail in case of any
discrepancy between the translated and English versions.
Right to make changes — NXP Semiconductors reserves the right
to make changes to information published in this document, including
without limitation specifications and product descriptions, at any time 7.2 Legal Information
and without notice. This document supersedes and replaces all
information supplied prior to the publication hereof. Notice: All referenced brands, product names, service names and
trademarks are the property of their respective owners.
Suitability for use — NXP Semiconductors products are not
designed, authorized or warranted to be suitable for use in life
support, life-critical or safety-critical systems or equipment, nor in
applications where failure or malfunction of an NXP Semiconductors
product can reasonably be expected to result in personal injury, death
or severe property or environmental damage. NXP Semiconductors
and its suppliers accept no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of
these products are for illustrative purposes only. NXP
Semiconductors makes no representation or warranty that such
applications will be suitable for the specified use without further
testing or modification. Customers are responsible for the design and
operation of their applications and products using NXP
Semiconductors products, and NXP Semiconductors accepts no
liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the
NXP Semiconductors product is suitable and fit for the customer’s
applications and products planned, as well as for the planned
application and use of customer’s third party customer(s). Customers
should provide appropriate design and operating safeguards to
minimize the risks associated with their applications and products.
NXP Semiconductors does not accept any liability related to any
default, damage, costs or problem which is based on any weakness
or default in the customer’s applications or products, or the
application or use by customer’s third party customer(s). Customer is
responsible for doing all necessary testing for the customer’s
applications and products using NXP Semiconductors products in
order to avoid a default of the applications and the products or of the
application or use by customer’s third party customer(s). NXP does
not accept any liability in this respect.
Export control — This document as well as the item(s) described
herein may be subject to export control regulations. Export might
require a prior authorization from competent authorities.
Evaluation products — This product is provided on an “as is” and
“with all faults” basis for evaluation purposes only. NXP
Semiconductors, its affiliates and their suppliers expressly disclaim all
warranties, whether express, implied or statutory, including but not
limited to the implied warranties of non-infringement, merchantability
and fitness for a particular purpose. The entire risk as to the quality,
or arising out of the use or performance, of this product remains with
customer. In no event shall NXP Semiconductors, its affiliates or their
suppliers be liable to customer for any special, indirect,
consequential, punitive or incidental damages (including without
limitation damages for loss of business, business interruption, loss of
use, loss of data or information, and the like) arising out the use of or
inability to use the product, whether or not based on tort (including