Dell PowerEdge R770 CSP Edition

Technical Guide

Part Number: E111S

Regulatory Type: E111S001
July 2024
Rev. A00
Notes, cautions, and warnings

NOTE: A NOTE indicates important information that helps you make better use of your product.

CAUTION: A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoid
the problem.

WARNING: A WARNING indicates a potential for property damage, personal injury, or death.

© 2024 Dell Inc. or its subsidiaries. All rights reserved. Dell Technologies, Dell, and other trademarks are trademarks of Dell Inc. or its
subsidiaries. Other trademarks may be trademarks of their respective owners.
 Contents

Chapter 1: PowerEdge R770 CSP Edition system configurations and features............................... 5

Key workloads...................................................................................................................................................................... 5
New technologies................................................................................................................................................................ 5

Chapter 2: Product comparison..................................................................................................... 7

Chapter 3: Chassis views and features.........................................................................................10

System configurations - front view for PowerEdge R770 CSP Edition system.................................................10
System configurations - rear view for PowerEdge R770 CSP Edition system................................................... 13
System configurations - inside view for PowerEdge R770 system....................................................................... 15
Quick Resource Locator for PowerEdge R770 system.............................................................................................17
Chassis configurations...................................................................................................................................................... 17

Chapter 4: Processor................................................................................................................... 18
Processor features ........................................................................................................................................................... 18
Supported processors................................................................................................................................................. 18

Chapter 5: Memory subsystem.................................................................................................... 19

Supported memory............................................................................................................................................................ 19
System memory guidelines.............................................................................................................................................. 19

Chapter 6: Storage...................................................................................................................... 21
Storage controllers............................................................................................................................................................ 21
Supported Drives............................................................................................................................................................... 21
Internal storage configuration.........................................................................................................................................21

Chapter 7: Networking................................................................................................................ 22
Overview............................................................................................................................................................................. 22
OCP 3.0 support................................................................................................................................................................22
Supported OCP cards................................................................................................................................................ 22
OCP NIC 3.0 vs 2.0.....................................................................................................................................................23

Chapter 8: PCIe subsystem......................................................................................................... 24

PCIe risers........................................................................................................................................................................... 24

Chapter 9: Power, thermal, and acoustics................................................................................... 28

Power................................................................................................................................................................................... 28
Power Supply Units.....................................................................................................................................................28
Thermal................................................................................................................................................................................ 29
Thermal design............................................................................................................................................................. 29
Acoustics............................................................................................................................................................................. 30
Acoustical configurations of R770 CSP Edition................................................................................................... 30

Contents 3
 Chapter 10: Rack, rails, and cable management........................................................................... 32
Rails and cable management information....................................................................................................................32

Chapter 11: Operating Systems and Virtualization........................................................................44

Supported operating systems........................................................................................................................................ 44

Chapter 12: Dell Systems Management........................................................................................ 45

Getting started with Dell Open Server Manager (OSM).........................................................................................45
Open Server Manager (OSM) introduction.......................................................................................................... 45
What is OpenBMC? ................................................................................................................................................... 45
Why Dell Open Server Manager? ...........................................................................................................................45
Why choose Dell Open Server Manager built on OpenBMC? ......................................................................... 46
Dell Open Server Manager Capabilities .................................................................................................................46

Chapter 13: Appendix A: Additional specifications........................................................................47

Chassis dimensions .......................................................................................................................................................... 47
System weight................................................................................................................................................................... 48
NIC port specifications.................................................................................................................................................... 48
Video specifications.......................................................................................................................................................... 48
USB Ports........................................................................................................................................................................... 49
PSU rating...........................................................................................................................................................................50
Environmental specifications.......................................................................................................................................... 51
Thermal restriction matrix......................................................................................................................................... 52

Chapter 14: Appendix B. Standards compliance........................................................................... 54

Chapter 15: Appendix C: Additional resources............................................................................. 55

Chapter 16: Appendix D: Services................................................................................................ 56

Why attach service contracts .......................................................................................................................................56
ProSupport Infrastructure Suite....................................................................................................................................56
Specialty Support Services.............................................................................................................................................58
ProDeploy Infrastructure Suite...................................................................................................................................... 59
Supplemental Deployment Services.............................................................................................................................. 61
Unique Deployment Scenarios..................................................................................................................................62
DAY 2 - Automation Services with Ansible........................................................................................................... 63
Consulting Services.......................................................................................................................................................... 63
Resources........................................................................................................................................................................... 65

4 Contents
 1
PowerEdge R770 CSP Edition system
configurations and features
The PowerEdge R770 CSP Edition system is a 2U server that supports:
● Two Intel Xeon 6 processors with up to 144 cores
● 32 DIMM slots
● Two AC or DC power supply units
● Up to 16 x EDSFF E3.S NVMe (SSD) drives.
NOTE: For more information about how to hot swap NVMe PCIe SSD device, see the Dell Express Flash NVMe PCIe SSD
User's Guide at Dell Support page > Browse all products > Infrastructure > Data Center Infrastructure > Storage
Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Select This Product > Documentation
> Manuals and Documents.

CAUTION: Do not install GPUs, network cards, or other PCIe devices on your system that are not validated
and tested by Dell. Damage caused by unauthorized and invalidated hardware installation will null and void the
system warranty.

Topics:
• Key workloads
• New technologies

Key workloads
The Dell PowerEdge R770 CSP Edition offers powerful performance in a purpose-built, cyber resilient, mainstream server. Ideal
for:
● Max virtualization, Hyper converged, & Cloud Native
● Big Data & Analytics
● Software Defined Storage
● Dense GPU support

New technologies
Table 1. New technologies
Technology Detailed Description
Intel Xeon 6 processors Core count: Up to 144 core processor
UPI speed: 16 GT/s, 20 GT/s, 24 GT/s
Maximum number of PCIe lanes per CPU: Integrated 88 PCIe
5.0 lanes
Speeds up to 2.4 GHz
Maximum TDP: 330 W
6400 MT/s DDR5 Memory Max 16 DIMMs per processor and 32 DIMMs per system
Supports RDIMM, DDR5 with ECC up to 6400 MT/s
PCIe Gen Gen5 @32 GT/s

PowerEdge R770 CSP Edition system configurations and features 5

Table 1. New technologies (continued)
Technology Detailed Description
PCIe Slot Up to four PCIe Slots with x16 lanes in total
Flex I/O OCP NIC card 3.0 : 2 slots on the front (for front
I/O configuration) or 2 slots on the rear (for Rear I/O
configuration)
Rear I/O with:
● 1 x Dedicated BMC Ethernet port
● 2 x USB 3.1
● 1 x VGA
Serial Port Option for front I/O configuration
Front I/O with:
● 1 x USB 2.0 Type C port
● 1 x USB 2.0 (optional)
● 1 x Mini-DisplayPort (optional)
● 1 x DB9 Serial (with front I/O configuration)
● 1 x Dedicated BMC Ethernet port (with front I/O
configuration)
Data Center Secured Control Module (DC-SCM) For BMC/FPGA/BIOS & RJ-45 dedicated for BMC
M-PESTI Half-duplex protocol between MCU and CPLD, like 1wire for
Cordoba protocol
Dedicated PERC N/A
Software RAID N/A
Power Supplies 60 mm dimension is the new PSU form factor on a 17G design
Titanium 1500 W AC/HVDC
Platinum 1100 W AC/HVDC
Platinum 800 W AC/HVDC

6 PowerEdge R770 CSP Edition system configurations and features

 2
Product comparison
Table 2. Comparison of PowerEdge R770 CSP Edition and R760
Feature PowerEdge R770 CSP Edition PowerEdge R760
Processor Two Intel Xeon 6 processors, with up to 1. Up to two 4 th Generation Intel®
144 cores per processor Xeon® Scalable or Intel® Xeon®
Max processors, with up to 56 cores
per processor
2. Up to two 5 th Generation Intel®
Xeon® Scalable processors, with up
to 64 cores per processor
Chipset N/A Intel C620 series chipset
Accelerators Up to four single width 75 W Up to two double width 350 W, or six
accelerators single width 75 W accelerators
Memory
DIMM speed Up to 6400 MT/s Up to 5600 MT/s
Memory type RDIMM RDIMM
Memory module slots 32 DDR5 DIMM slots 32 DDR5 DIMM slots

NOTE: Supports registered ECC NOTE: Supports registered ECC

DDR5 DIMMs only. DDR5 DIMMs only.

Storage
Front bays Up to 8 x EDSFF E3.S NVMe(SSD) Up to 12 x 3.5-inch SAS/SATA (HDD/
SSD)
Up to 8 x 2.5-inch SAS/SATA/NVMe
(HDD/SSD)
Up to 16 x 2.5-inch SAS/SATA/NVMe
(HDD/SSD)
Up to 16 x EDSFF E3.S NVMe(SSD) Up to 16 x EDSFF E3.S Gen5 NVMe
(SSD)
Up to 24 x 2.5-inch SAS/SATA/NVMe
(HDD/SSD)
Rear bays N/A Up to 2 x 2.5-inch SAS/SATA/NVMe
(HDD/SSD)
Up to 4 x 2.5-inch SAS/SATA/NVMe
(HDD/SSD)
Up to 4 x EDSFF E3.S Gen5 NVMe
(SSD)
Storage controllers
Internal controllers N/A PERC H965i
PERC H755i
PERC H755N
PERC H355

Product comparison 7
Table 2. Comparison of PowerEdge R770 CSP Edition and R760 (continued)
Feature PowerEdge R770 CSP Edition PowerEdge R760
HBA355e
External controllers N/A H840P
PERC H965e
Software RAID N/A S160
Internal boot Boot Optimized Storage Subsystem Boot Optimized Storage Subsystem
(BOSS-N1 DC-MHS): HWRAID 1, 2 x M.2 (BOSS-N1): HW RAID 1, 2 x M.2 NVMe
NVMe SSDs 480 GB or 960 GB SSDs 480 GB or 960 GB
Internal USB Internal USB
System management Open Server Manager (OSM) built on iDRAC with Lifecycle Controller, Quick
OpenBMC Sync 2.0, iDRAC Direct, OpenManage
Enterprise
Power supply 1500 W Titanium 100—240 VAC or 240 3200 W Titanium 277 VAC or 336 VDC
VDC
1100 W Platinum 100—240 VAC or 240 2800 W Titanium 200-240 HLAC or 240
VDC VDC
800 W Platinum 100—240 VAC or 240 2400 W Platinum 100-240 VAC or 240
VDC VDC
1800 W Titanium 200-240 HLAC or 240
VDC
1400 W Platinum 100-240 VAC or 240
VDC
1400 W Titanium 277 VAC or 336 VDC
1100 W Titanium 100-240 VAC or 240
VDC
1100 W -(48-60) VDC
800 W Platinum 100-240 VAC or 240
VDC
700 W Titanium 200-240 HLAC or 240
VDC
Ports
Network options OCP NIC card 3.0 : Up to 2 slots on 2 x 1GbE LOM card (optional)
the front (for front I/O configuration)
or 2 slots on the rear (for rear I/O 1 x OCP NIC card 3.0 (optional)
configuration)
Front ports 1 x USB 2.0 Type C port (supports Host 1 x Dedicated iDRAC Direct USB
mode)
1 x USB 2.0 (optional) 2 x USB 2.0
1 x Mini-DisplayPort (optional) 1 x VGA
1 x DB9 Serial (with front I/O
configuration)
1 x Dedicated BMC Ethernet port (with
front I/O configuration)
Rear ports 1 x Dedicated BMC Ethernet port 1 x Dedicated iDRAC Ethernet port
1 x VGA 1 x USB 2.0

8 Product comparison
Table 2. Comparison of PowerEdge R770 CSP Edition and R760 (continued)
Feature PowerEdge R770 CSP Edition PowerEdge R760
2 x USB 3.1 1 x USB 3.0
1 x Serial (optional)
1 x VGA (optional for Direct Liquid
Cooling configuration)
Internal ports 1 x USB 3.1 (optional) 1 x USB 3.0 (optional)
Slots
PCIe Up to 4 x16 Gen5 PCIe slots Up to 8 x PCIe Gen4/Gen5 slots
Form factor 2U rack server 2U rack server
Dimensions and weight
Height 86.8 mm (3.41 inches) 86.8 mm (3.41 inches)
Width 482.0 mm (18.97 inches) 482.0 mm (18.97 inches)
Depth For cold aisle (front I/O configuration): 772.13 mm (30.39 inches) with bezel
814.52 mm (32.07 inches) without bezel 758.29 mm (29.85 inches) without bezel
NOTE: The front I/O configuration
does not support the bezel.

For hot aisle (rear I/O configuration):

802.40 mm (31.59 inches) with bezel

801.51 mm (31.56 inches) without bezel

Weight 28.53 kg (62.89 lbs) 36.1 kg (79.58 lbs)

Product comparison 9
 3
Chassis views and features
Topics:
• System configurations - front view for PowerEdge R770 CSP Edition system
• System configurations - rear view for PowerEdge R770 CSP Edition system
• System configurations - inside view for PowerEdge R770 system
• Quick Resource Locator for PowerEdge R770 system
• Chassis configurations

System configurations - front view for PowerEdge

R770 CSP Edition system

Figure 1. Front view of 8 x EDSFF E3.S drive system with front I/O configuration

Table 3. Front view of 8 x EDSFF E3.S drive system with front I/O configuration
Item Ports, panels, and Icon Description
slots
1 Left control panel N/A Contains the USB port and Mini-Displayport.
NOTE: KVM module is optional, and LCP blank is default in the left
control panel.

2 PCIe front expansion N/A The expansion card riser enables you to connect PCI Express expansion
card riser 1 (slot 31, cards.
slot 32 and slot 33)
3 Drive N/A Enables you to install drives that are supported on your system.
4 PCIe front expansion N/A The expansion card riser enables you to connect PCI Express expansion
card riser 3 (slot 35, cards.
slot 36 and slot 37)
5 Right control panel N/A Contains the system health LED, system ID, power button, Type-C USB
port, and the host status LED.
6 Primary OCP NIC N/A The OCP NIC slot supports OCP 3.0 complaint networking card . The
(slot 38 in front riser NIC ports are integrated on the OCP card which is connected to the
4) system board.
NOTE: The primary OCP NIC card shares a NIC port with the BMC.

10 Chassis views and features

Table 3. Front view of 8 x EDSFF E3.S drive system with front I/O configuration (continued)
Item Ports, panels, and Icon Description
slots
7 Dedicated BMC N/A Enables you to access Open Server Manager (OSM).
Ethernet port (part of
front riser 4)
8 Drive blank N/A Drive blank is available in eight drive configuration and should not be
removed.
9 Serial COM port (part Enables you to connect a serial device to the system.
of front riser 2)
10 OCP NIC or BOSS-N1 N/A Enables you to install secondary OCP or BOSS-N1 DC-MHS controller,
DC-MHS (Slot 34 in based on riser configuration.
front riser 2) NOTE: Secondary OCP does not support the shared NIC feature.

Figure 2. Front view of 16 x EDSFF E3.S drive system with front I/O configuration

Table 4. Front view of 16 x EDSFF E3.S drive system with front I/O configuration
Item Ports, panels, and Icon Description
slots
1 Left control panel N/A Contains the USB port and Mini-Displayport.
NOTE: KVM module is optional, and LCP blank is default in the left
control panel.

2 PCIe front expansion N/A The expansion card riser enables you to connect PCI Express expansion
card riser 1 (slot 31, cards.
slot 32 and slot 33)
3 Drive N/A Enables you to install drives that are supported on your system.
4 PCIe front expansion N/A The expansion card riser enables you to connect PCI Express expansion
card riser 3 (slot 35, cards.
slot 36 and slot 37)
5 Right control panel N/A Contains the system health LED, system ID, power button, Type-C USB
port, and the host status LED.
6 Primary OCP NIC N/A The OCP NIC slot supports OCP 3.0 complaint networking card . The
(slot 38 in front riser NIC ports are integrated on the OCP card which is connected to the
4) system board.
NOTE: The primary OCP NIC card shares a NIC port with the BMC.

7 Dedicated BMC N/A Enables you to access Open Server Manager (OSM).
Ethernet port (part of
front riser 4)
8 Serial COM port (part Enables you to connect a serial device to the system.
of front riser 2)

Chassis views and features 11

Table 4. Front view of 16 x EDSFF E3.S drive system with front I/O configuration (continued)
Item Ports, panels, and Icon Description
slots
9 OCP NIC or BOSS-N1 N/A Enables you to install secondary OCP or BOSS-N1 DC-MHS controller,
DC-MHS (Slot 34 in based on riser configuration.
front riser 2) NOTE: Secondary OCP does not support the shared NIC feature.

Figure 3. Front view of 16 x EDSFF E3.S drive system with rear I/O configuration

Table 5. Front view of 16 x EDSFF E3.S drive system with rear I/O configuration
Item Ports, panels, and Icon Description
slots
1 Left control panel N/A Left control panel blank.
NOTE: KVM module is optional, and LCP blank is default in the left
control panel.

2 PCIe front expansion N/A In the rear I/O configuration, the riser blank is installed in the expansion
card riser 1 blank card riser bay.
3 Drive N/A Enables you to install drives that are supported on your system.
4 PCIe front expansion N/A In the rear I/O configuration, the riser blank is installed in the expansion
card riser 3 blank card riser bay.
5 Right control panel N/A Contains the system health LED, system ID, power button, Type-C USB
port, and the host status LED.
6 PCIe front expansion N/A In the rear I/O configuration, the riser blank is installed in the expansion
card riser 4 blank card riser bay.
7 Express Service Tag N/A The Express Service Tag is a slide-out label panel that contains system
information such as Service Tag, NIC, MAC address, and so on.
8 PCIe front expansion N/A In the rear I/O configuration, the riser blank is installed in the expansion
card riser 2 blank card riser bay.

12 Chassis views and features

System configurations - rear view for PowerEdge
R770 CSP Edition system

Figure 4. Rear view of the system with front I/O configuration

Table 6. Rear view of the system with front I/O configuration

Item Ports, panels, or slots Icon Description
1 PCIe expansion card riser N/A In front I/O configuration, the riser blank is installed in the expansion
1 blank card riser bay.
2 PCIe expansion card riser N/A
3 blank
3 PCIe expansion card riser N/A
5 blank
4 Power supply unit PSU2 is the secondary PSU of the system.
(PSU2)
5 OCP NIC card filler N/A In the front I/O configuration, an OCP filler bracket is installed in the
bracket OCP NIC card bay.
6 BOSS filler bracket N/A In the front I/O configuration, the BOSS file bracket is installed in
BOSS-N1 DC-MHS bay.
7 BMC dedicated port Enables you to remotely access Open Server Manager. When the
front BMC port is connected to the network, the rear BMC port is
automatically disabled.
8 USB 3.0 port The USB port is 9-pin and 3.0-compliant. This port enables you to
connect USB devices to the system.
9 VGA port Enables you to connect a display device to the system.

10 Power supply unit (PSU1) PSU1 is the primary PSU of the system.

Figure 5. Rear view of the system with rear I/O configuration

Chassis views and features 13

Table 7. Rear view of the system with rear I/O configuration
Item Ports, panels, or Icon Description
slots
1 PCIe front expansion N/A The expansion card riser enables you to connect PCI Express expansion cards.
card riser 1 (slot 1 and
slot 2)
2 PCIe front expansion N/A The expansion card riser enables you to connect PCI Express expansion cards.
card riser 3 (slot 4 and
slot 5)
3 PCIe front expansion N/A The expansion card riser enables you to connect PCI Express expansion cards.
card riser 5 (slot 7 and
slot 8)
4 Power supply unit PSU2 is the secondary PSU of the system.
(PSU2)
5 OCP NIC card N/A The OCP NIC card supports OCP 3.0. The NIC ports are integrated on the OCP card
which is connected to the system board and also supports BMC shared NIC feature.
6 PCIe front expansion N/A The expansion card riser enables you to connect PCI Express expansion cards.
card riser 4 (slot 9)
7 BOSS-N1 DC-MHS N/A BOSS module for internal system boot.
module
8 PCIe front expansion N/A The expansion card riser enables you to connect PCI Express expansion cards.
card riser 2 (slot 3)
9 BMC dedicated port Enables you to remotely access Open Server Manager. When the front BMC port is
connected to the network, the rear BMC port is automatically disabled.
10 USB 3.0 port The USB port is 9-pin and 3.0-compliant. This port enables you to connect USB
devices to the system.
11 VGA port Enables you to connect a display device to the system.

12 Power supply unit PSU1 is the primary PSU of the system.

(PSU1)

14 Chassis views and features

System configurations - inside view for PowerEdge
R770 system

Figure 6. Inside the system with front I/O configuration

1. System handle 2. Rear riser 1 blank
3. Rear riser 3 blank 4. Power supply unit (PSU1)
5. System board or Host Processor Module (HPM) 6. Dust cover for processor 1
7. Memory module slots (DIMM) 8. Cooling cage cable holder
9. Cooling fan 10. Front riser 3
11. Express Service Tag 12. Front riser 1
13. E3.S backplane module 14. Cooling fan cage
15. Dust cover for processor 0 16. Power supply unit (PSU2)
17. Rear riser 2 and riser 4 blank 18. Rear riser 5 blank

Chassis views and features 15

Figure 7. Inside the system with rear I/O configuration
1. System handle 2. Rear riser 2
3. Rear riser 1 4. Power supply unit (PSU1)
5. System board or Host Processor Module (HPM) 6. Processor heat sink module for processor 1
7. Memory module slots (DIMM) 8. Cooling cage cable holder
9. Cooling fan 10. Express Service Tag
11. E3.S backplane module 12. Cooling fan cage
13. Processor heat sink module for processor 0 14. Power supply unit (PSU2)
15. Rear riser 3 16. Rear riser 5

16 Chassis views and features

Quick Resource Locator for PowerEdge R770 system

Figure 8. Quick Resource Locator for PowerEdge R770 system

Chassis configurations
The PowerEdge™ R770 CSP Edition system supports:
● Up to 16 x EDSFF E3.S Gen5 NVMe drives
● Up to 8 x EDSFF E3.S Gen5 NVMe drives

Chassis views and features 17

 4
Processor
Topics:
• Processor features

Processor features
The Intel® Xeon® 6 series processor stack is comprised entirely of efficiency cores (E-Cores) providing ultra-high core counts
optimized for Cloud Service Providers and HPC server applications. Intel® Xeon® 6700E offers improved performance per
watt, boosted performance per rack, upgraded memory speeds, enhanced I/O, expanded UPI speeds and added software
extension security.
The following lists the features and functions that are in the Intel® Xeon® 6700E Processor offering:
● High core counts with up to 144 cores with up to 330 W TDP
● Enhanced DDR5 memory with speed up to 6400 MT/s in one DIMM per channel (1DPC) and 5200 MT/s in two DIMM per
channel (2DPC)
● Faster UPI 2.0 with up to four Intel Ultra Path Interconnect (Intel® UPI) at up to 24 GT/s, increasing multi-socket
bandwidth
● PCIe 5.0 with up to 88 lanes
● Security features leveraging Software Guard Extensions (SGX) for Application Isolation

Supported processors
The following table shows the Intel Xeon 6 processors SKUs that are supported on the R770.

Table 8. Intel Xeon 6 processors supported in R770

Processor Clock Cache UPI Cores Threads Turbo Memory Memory TDP
Speed (M) (GT/s) Speed Capacity
(GHz) (MT/s)
6780E 2.2 108 24 144 144 Turbo 6400 1 TB 330 W
6766E 1.9 108 24 144 144 Turbo 6400 1 TB 250 W
6756E 1.8 96 24 128 128 Turbo 6400 1 TB 225 W
6746E 2 96 24 112 112 Turbo 6400 1 TB 250 W
6740E 2.4 96 24 96 96 Turbo 6400 1 TB 250 W
6710E 2.4 96 24 64 64 Turbo 6400 1 TB 205 W

NOTE: Mixing the processors is not supported.

18 Processor
 5
Memory subsystem
Topics:
• Supported memory
• System memory guidelines

Supported memory
Table 9. Memory technology
Feature PowerEdge R770 (DDR5)
DIMM type RDIMM
Transfer speed 6400 MT/s(1DPC) and 5200 MT/s (2DPC)
NOTE: Maximum DIMM transfer speed support
dependent on CPU SKU and DIMM population

Voltage 1.1 V

Table 10. Supported DIMMs

DIMM type Rated DIMM DIMM Type DIMM Ranks per Data Width DIMM Volts
Speed (MT/s) Capacity (GB) DIMM (V)
RDIMM 6400 RDIMM 32 2 x8 1.1
6400 RDIMM 64 2 x4 1.1

System memory guidelines

The PowerEdge R770 CSP Edition system supports DDR5 registered DIMMs (RDIMMs).
Your system memory is organized into eight channels per processor (two memory sockets per channel), 16 memory sockets per
processor and 32 memory sockets per system.

Memory subsystem 19
Figure 9. Memory channels

Memory channels are organized as follows:

Table 11. Memory channels

Processor Channel Channel B Channel C Channel D Channel E Channel F Channel G Channel H
A
Processor Slots A1 Slots A5 Slots A3 Slots A7 and Slots A2 and Slots A6 Slots A4 and Slots A8 and
0 and A9 and A13 and A11 A15 A10 and A14 A12 A16
Processor Slots B1 Slots B5 Slots B3 Slots B7 and Slots B2 and Slots B6 Slots B4 and Slots B8 and
1 and B9 and B13 and B11 B15 B10 and B14 B12 B16

Table 12. Supported memory matrix

DIMM type Rank Capacity DIMM rated voltage and Operating Speed
speed
1 DIMM per channel 2 DIMM per channel
(DPC) (DPC)
RDIMM 2R 32 GB DDR5 (1.1 V), 6400 MT/s Up to 6400 MT/s N/A
2R 64 GB DDR5 (1.1 V), 6400 MT/s Up to 6400 MT/s Up to 5200 MT/s

NOTE: The processor may reduce the performance of the rated DIMM speed.

NOTE: 32 GB is only supported in one DIMM per channel.

20 Memory subsystem
 6
Storage
Topics:
• Storage controllers
• Supported Drives
• Internal storage configuration

Storage controllers
Storage controllers are not supported in this RTS.

Supported Drives
The table that is shown below lists the internal drives that are supported in R770 CSP Edition. See Agile for the latest SDL.

Table 13. Supported drives

Form Factor Type Speed Rotational Capacities
Speed
EDSFF E3.S DC NVMe Gen5 SSD 1.6 TB, 3.2 TB, 1.92 TB, 3.84 TB
EDSFF E3.S NVMe Gen5 SSD 3.2 TB, 6.4 TB, 3.84 TB, 7.68 TB, 15.36 TB

Internal storage configuration

R770 available internal storage configurations:
● 16 x EDSFF E3.S (Gen5 NVMe Direct)
● 8 x EDSFF E3.S (Gen5 NVMe Direct)

Storage 21
 7
Networking
Topics:
• Overview
• OCP 3.0 support

Overview
PowerEdge offers a wide variety of options to get information moving to and from our servers. Industry best technologies are
chosen and these adapters are rigorously validated for worry-free, fully supported use in Dell servers.

OCP 3.0 support

Table 14. OCP 3.0 feature list
Feature OCP 3.0
Form factor SFF
PCIe Gen Gen5
Max PCIe width x8, x16 (For Rear I/O configuration additional OCP cable is
required)
Max number of ports 4
Port type SFP28/QSFP56
Max port speed 25 GbE, 100 GbE (For Rear I/O configuration additional OCP
cable is required)
NC-SI Yes
SNAPI Yes
WoL Yes
Power consumption 15 W–35 W

OCP is also supported in front of the system for some configurations, called the Floating OCP Paddle Card (FLOP). Additionally,
the Front I/O OCP supports both internal latch and thumbscrew versions, providing flexibility in installation and maintenance.

Supported OCP cards

Table 15. Supported OCP cards

Form factor Vendor Port type Port speed Port count
OCP 3.0 Mellanox QSFP56 25 GbE 2
Broadcom QSFP56 25 GbE 4
Mellanox QSFP56 100 GbE 2
Broadcom QSFP56 100 GbE 2

22 Networking
OCP NIC 3.0 vs 2.0
Table 16. OCP 3.0 and 2.0 NIC comparison
Form Factor OCP 2.0 (LOM Mezz) OCP 3.0 Notes
PCIe Gen Gen3 Gen5 Supported OCP3 is SFF (small
form factor).
Max PCIe Lanes Up to x16 Up to x16 See server slot priority matrix.
Shared LOM Yes Yes Only OCP on slot 10 (rear IO)
and slot 38 (front IO) can
support BMC port redirect as
shared NIC.
Aux Power Yes Yes Used for Shared LOM

Networking 23
 8
PCIe subsystem
Topics:
• PCIe risers

PCIe risers
Shown below are the riser offerings for the platform.

Figure 10. Riser connector location on system board

1. Front riser RF2a or rear riser 5

2. Front riser RF1a or rear riser 4
3. Front riser RF4a or rear riser 2
4. Rear riser 3
5. Front riser RF3a or rear riser 1
NOTE: The system can have front or rear risers, but not both at the same time.

24 PCIe subsystem
Figure 11. Riser 1b
1. Slot 2

Figure 12. Riser 2b

1. Slot 3

Figure 13. Riser 3e

1. Slot 4

PCIe subsystem 25
Figure 14. Riser 4b
1. Slot 9

Figure 15. Riser 5b

1. Slot 7

Figure 16. Riser RF1a

1. Slot 31

26 PCIe subsystem
Figure 17. Riser RF3a
1. Slot 36

Figure 18. Riser RF4a

1. Slot 38

Figure 19. Riser RF2a

1. Slot 34

Table 17. PCIe Riser Configurations

Config No. Riser configuration No. of PERC type supported Rear storage possible
Processors
1 RF1a+RF3a+RF4a 2 N/A No
2 RF1a+RF2a+RF3a+RF4a 2 N/A No
6-1 R1b+R2b+R3e+R4b+ R5b 2 N/A No

PCIe subsystem 27
 9
Power, thermal, and acoustics
PowerEdge servers have an extensive collection of sensors that automatically track thermal activity, which helps to regulate
temperature by reducing server noise and power consumption. The table below lists the tools and technologies Dell offers to
lower power consumption and increase energy efficiency.
Topics:
• Power
• Thermal
• Acoustics

Power
Table 18. Power tools and technologies
Feature Description
Power Supply Units(PSU) Dell's PSU portfolio includes intelligent features such as dynamically optimizing efficiency while
portfolio maintaining availability and redundancy. Find additional information in the Power supply units
section.
Tools for right sizing Enterprise Infrastructure Planning Tool (EIPT) is a tool that can help you determine the most
efficient configuration possible. With Dell's EIPT, you can calculate the power consumption of
your hardware, power infrastructure, and storage at a given workload. Learn more at Dell EIPT.
Industry Compliance Dell's servers are compliant with all relevant industry certifications and guide lines, including 80
PLUS, Climate Savers and ENERGY STAR.
Power monitoring accuracy PSU power monitoring improvements include:

● Dell's power monitoring accuracy is currently 1%, whereas the industry standard is 5%
● More accurate reporting of power
Rack infrastructure Dell offers some of the industry's highest-efficiency power infrastructure solutions, including:
● Power distribution units (PDUs)
● Uninterruptible power supplies (UPSs)
● Energy Smart containment rack enclosures
● AC Blind Mate
Find additional information at: Power and Cooling

Power Supply Units

Energy Smart power supplies have intelligent features, such as the ability to dynamically optimize efficiency while maintaining
availability and redundancy. Also featured are enhanced power-consumption reduction technologies, such as high-efficiency
power conversion and advanced thermal-management techniques, and embedded power-management features, including high-
accuracy power monitoring. The table below shows the power supply unit options that are available for the R770.

28 Power, thermal, and acoustics

Table 19. R770 CSP Edition PSU specifications
PSU Class Heat Frequen AC Voltage DC Voltage Current
dissipation cy (Hz) (A)
(maximum) 200— 100— 277 V 240 V - (48— 336 V
(BTU/hr) 240 V 120 V 60) V

800 W Platinum 3000 50/60 800 W 800 W N/A N/A N/A N/A 9.2—4.5
mixed mode
N/A 3000 N/A N/A N/A N/A 800 W N/A N/A 3.7
1100 W Platinum 4100 50/60 1100 W 1050 W N/A N/A N/A N/A 12—6.1
mixed mode
N/A 4100 N/A N/A N/A N/A 1100 W N/A N/A 5.1
1500 W Titanium 5625 50/60 1500 W 1050 W N/A N/A N/A N/A 12—8.2
mixed mode
N/A 5625 N/A N/A N/A N/A 1500 W N/A N/A 6.8

NOTE: When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system
power consumption with the Enterprise Infrastructure Planning Tool available at calc.

Figure 20. PSU power cords

Table 20. PSU power cords

Form factor Output Power cord
60 mm 800 W Mixed Mode C13
1100 W Mixed Mode C13
1500 W Mixed Mode C13

Thermal
PowerEdge servers have an extensive collection of sensors that automatically track thermal activity, which helps regulate
temperature thereby reducing server noise and power consumption.

Thermal design
Thermal management of the platform helps deliver high performance with the right amount of cooling to components, while
maintaining the lowest fan speeds possible. This is done across a wide range of ambient temperatures from 10°C to 35°C (50°F
to 95°F) and to extended ambient temperature ranges.

Power, thermal, and acoustics 29

Figure 21. Thermal design characteristics

The thermal design of the PowerEdge R770 reflects the following:

● Optimized thermal design: The system layout is architected for optimum thermal design.
● System component placement and layout are designed to provide maximum airflow coverage to critical components with
minimum expense of fan power.
● Comprehensive thermal management: The thermal control system regulates the fan speed based on several different
responses from all system-component temperature sensors, and inventory for system configurations. Temperature
monitoring includes components such as processors, DIMMs, chipset, the inlet air ambient, hard disk drives, and OCP.
● Open and closed loop thermal fan speed control: Open loop thermal control uses system configuration to determine
fan speed based on inlet air ambient temperature. Closed loop thermal control method uses feedback temperatures to
dynamically determine proper fan speeds.
● User-configurable settings: With the understanding and realization that every customer has unique set of circumstances
or expectations from the system. For more information, see the Dell PowerEdge R770 CSP Edition Installation and Service
Manual at PowerEdge Manuals and “Advanced Thermal Control: Optimizing across Environments and Power Goals” on
Dell.com.
● Cooling redundancy: The R770 allows N+1 fan redundancy, allowing continuous operation with one fan failure in the system.
● Environmental Specifications: The optimized thermal management makes the R770 reliable under a wide range of operating
environments.

Acoustics
Acoustical configurations of R770 CSP Edition
Dell PowerEdge R770 is a rack-mount server appropriate for attended data center environment. However, lower acoustical
output is attainable with proper hardware or software configurations.

Table 21. Configurations tested for acoustical experience

Configuration Front I/O configuration
Fan Type High Performance Silver
CPU TDP 2 x Intel SRFSP 250 W
RDIMM Memory 16 x 32 GB DDR5
Backplane Type 8 (2) x E3.S BP
HDD/SSD Type 8 x E3.S
PERC None
BOSS 17G BOSS
Flash Drives Hynix 480G
OCP None
PSU Type 2 x 1100 W

30 Power, thermal, and acoustics

Table 21. Configurations tested for acoustical experience (continued)
Configuration Front I/O configuration
Bezel None
PCI 1 X
PCI 2 X
PCI 3 X
PCI 4 X
PCI 5 X
PCI 6 X
PCI 7 X
PCI 8 X

Table 22. Acoustical experience of R770 CSP Edition configurations

Configuration Front I/O configuration
Acoustical Performance: Idle/ Operating @ 25°C Ambient
L wA,m (B) Idle (4) 7.0
Operating/Customer usage operating (5)(6) 7.0
K (B) Idle (4) 0.4
v

Operating/Customer usage operating (5)(6) 0.4

L pA,m (dB) Idle (4) 50
Operating/Customer usage operating (5)(6) 50
Prominent discrete tones (3) Prominence ratio ≤ 15 dB
Acoustical Performance: Idle @ 28°C Ambient
L (1) (B) 7.3
wA,m

K v (B) 0.4
L (2) (dB) 53
pA,m

Acoustical Performance: Max. loading @ 35°C Ambient

L (1) (B) 7.8
wA,m

K v (B) 0.4
L (2) (dB) 58
pA,m

(1) LwA,m: The declared mean A-weighted sound power level (LwA) is calculated per section 5.2 of ISO 9296 (2017) with data
collected using the methods that are described in ISO 7779 (2010). Engineering data presented here may not be fully compliant
with the ISO 7779 declaration requirement.
(2) LpA,
m: The declared mean A-weighted emission sound pressure level is at the bystander position per section 5.3 of ISO 9296
(2017) and measured using methods that are described in ISO 7779 (2010). The system is placed in a 24U rack enclosure, 25 cm
above a reflective floor. Engineering data presented here may not be fully compliant with the ISO 7779 declaration requirement.
(3) Prominent tones: Criteria of Annex D of ECMA-74 and the Prominence Ratio method of ECMA-418 are followed to determine
if discrete tones are prominent and to report them, if so.
(4) Idle mode: The steady-state condition in which the server is energized but not operating any intended function.
(5) Operatingmode: The maximum of the steady state acoustical output at 50% of CPU TDP or active storage drives for the
respective sections of Annex C of ECMA-74.
(6)Customer Usage Operating mode: The operating mode is represented by the maximum of the steady state acoustical output
at 25%~30% of CPU TDP, 2.5%~10% IOPs load, and >80% GPU load as the components showed in the above configurations.

Power, thermal, and acoustics 31

 10
Rack, rails, and cable management
Topics:
• Rails and cable management information

Rails and cable management information

The rail offerings for the PowerEdge R770 CSP Edition consist of two general types: sliding and static. The cable management
offerings consist of an optional cable management arm (CMA) and an optional strain relief bar (SRB).
See the Enterprise Systems Rail Sizing and Rack Compatibility Matrix available at rail-rack matrix for information regarding:
● Specific details about rail types.
● Rail adjustability ranges for various rack mounting flange types.
● Rail depth with and without cable management accessories.
● Rack types that are supported for various rack mounting flange types.
Key factors governing proper rail selection include the following:
● Spacing between the front and rear mounting flanges of the rack.
● Type and location of any equipment that is mounted in the back of the rack such as power distribution units (PDUs).
● Overall depth of the rack.

Sliding rails features summary

The sliding rails allow the system to be fully extended out of the rack for service. There are two types of sliding rails available,
ReadyRails II sliding rails and Stab-in/Drop-in sliding rails. The sliding rails are available with or without the optional cable
management arm (CMA) or strain relief bar (SRB).
B21 ReadyRails sliding rails for 4-post racks
● Supports drop-in installation of the chassis to the rails.
● Support for tool-less installation in 19" EIA-310-E compliant square or unthreaded round hole 4-post racks including all
generations of the Dell racks.
● Support for tooled installation in 19" EIA-310-E compliant threaded hole 4-post racks.
● Support full extension of the system out of the rack to allow serviceability of key internal components.
● Support for optional strain relief bar (SRB).
● Support for an optional cable management arm (CMA).
NOTE: For situations where CMA support is not required, the outer CMA mounting brackets can be uninstalled from the
sliding rails. This reduces the overall length of the rails and eliminates the potential interference with rear-mounted PDUs
or the rear rack door.

32 Rack, rails, and cable management

Figure 22. Sliding rails with optional CMA

Figure 23. Sliding rails with optional SRB

B22 Stab-in/Drop-in sliding rails for 4-post racks

● Supports drop-in or stab-in installation of the chassis to the rails.
● Support for tool-less installation in 19" EIA-310-E compliant square, unthreaded round hole racks including all generations of
the Dell racks. Also supports tool-less installation in threaded round hole 4-post racks.
● Support for tool-less installation in Dell EMC Titan or Titan-D racks.
● Support full extension of the system out of the rack to allow serviceability of key internal components.
● Support for an optional cable management arm (CMA).
● Support for optional strain relief bar (SRB).
NOTE: For situations where CMA support is not required, the outer CMA mounting brackets can be uninstalled from the
sliding rails. This reduces the overall length of the rails and eliminates the potential interference with rear-mounted PDUs
or the rear rack door.
Scan the QRL code for the documentation and trouble-shooting information regarding the installation procedures for Drop-in/
Stab-in rail types.

Rack, rails, and cable management 33

Figure 24. Quick resource locator for combo rails

B20 static rails summary

The static rails offer a greater adjustability range and a smaller overall mounting footprint than the sliding rails because of their
reduced complexity and lack of need for CMA support. The static rails support a wider variety of racks than the sliding rails.
However, they do not support serviceability in the rack and are thus not compatible with the CMA. The static rails are also not
compatible with SRB.

Figure 25. Static rails

Static rails features summary

Static rails for 4-post and 2-post racks:
● Supports Stab-in installation of the chassis to the rails.
● Support tool-less installation in 19" EIA-310-E compliant square or unthreaded round hole 4-post racks including all
generations of Dell racks.
● Support tooled installation in 19" EIA-310-E compliant threaded hole 4-post and 2-post racks.
● Support for tooled installation in Dell EMC Titan or Titan-D rack.
NOTE:
● Screws are not included with the static rail kit since racks are offered with various thread types. The screws are
provided for mounting static rails in racks with threaded mounting flanges.
● Screw head diameter should be 10 mm or less.
2-Post racks installation
If installing to 2-Post (Telco) racks, the ReadyRails II static rails (B4) must be used. Sliding rails support mounting in 4-post
racks only.

34 Rack, rails, and cable management

Figure 26. Static rails in 2-post center mount configuration

Installation in the Dell EMC Titan or Titan-D racks

For tool-less installation in Titan or Titan-D racks, the Stab-in/Drop-in sliding rails (B22) must be used. This rail collapses
down sufficiently to fit in the rack with mounting flanges that are spaced about 24 inches apart from front to back. The
Stab-in/Drop-in sliding rail allows bezels of the servers and storage systems to be aligned when installed in these racks. For
tooled installation, Stab-in Static rails (B20) must be used for bezel alignment with storage systems.

Rack Installation
Drop-in design means that the system is installed vertically into the rails by inserting the standoffs on the sides of the system
into the J-slots in the inner rail members with the rails in the fully extended position. The recommended method of installation
is to first insert the rear standoffs on the system into the rear J-slots on the rails to free up a hand and then rotate the system
down into the remaining J-slots while using the free hand to hold the rail against the side of the system.
Stab-in design means that the inner (chassis) rail members must first be attached to the sides of the system and then inserted
into the outer (cabinet) members installed in the rack.

Installing the system into the rack (option A: Drop-In)

1. Pull the inner rails out of the rack until they lock into place.

Figure 27. Pull out inner rail

2. Locate the rear rail standoff on each side of the system and lower them into the rear J-slots on the slide assemblies.
3. Rotate the system downward until all the rail standoffs are seated in the J-slots.

Rack, rails, and cable management 35

 Figure 28. Rail standoffs seated in J-slots
4. Push the system inward until the lock levers click into place.
5. Pull the blue side release lock tabs forward or backward on both rails and slide the system into the rack until the system is in
the rack.

Figure 29. Slide system into the rack

Installing the system into the rack (option B: Stab-In)

1. Pull the intermediate rails out of the rack until they lock into place.
2. Release the inner rail lock by pulling forward on the white tabs and sliding the inner rail out of the intermediate rails.

36 Rack, rails, and cable management

 Figure 30. Pull out the intermediate rail

Table 23. Rail component label

Number Component
1 Intermediate rail
2 Inner rail
3. Attach the inner rails to the sides of the system by aligning the J-slots on the rail with the standoffs on the system and
sliding forward on the system until they lock into place.

Figure 31. Attach the inner rails to the system

4. With the intermediate rails extended, install the system into the extended rails.

Rack, rails, and cable management 37

 Figure 32. Install system into the extended rails
5. Pull blue slide release lock tabs forward or backward on both rails, and slide the system into the rack.

Figure 33. Slide system into the rack

B35 Blind Mate Power Rail features summary

These rails are compatible with the R770 CSP Cold-Aisle-Service (front I/O) Configuration.
The Blind mate Power Rails are Static Rail which includes extra power pass-thru, bracket assemblies to allow for the ability
to connect power, and then remove/service the R770 CSP, without needing Hot-Aisle access. These rails do not allow for
hot-swapping of internal components or in-rack serviceability, and are not compatible with SRB.
● Supports Stab-in installation of the chassis to the rails
● Supports tool-less installation in 19-inch EIA-310-E compliant square or unthreaded round hole 4-post racks including all
generations of Dell racks
● Supports tooled installation in 19-inch EIA-310-E compliant threaded hole 4-post
● Supports tooled installation in Dell Titan or Titan-D rack
NOTE:
● Screws are not included with the static rail kit since racks are offered with various thread types.
● Screw head diameter should be 10 mm or less.

38 Rack, rails, and cable management

Figure 34. Blind Mate Rails, Rack cabinet members setup

B35 Blind Mate Power Rail Power Pass-Thru Setup

The Blind Mate Power Rails require extra setup to enable the blind mate ability and cold-aisle serviceability, by installing 2 power
pass-thru brackets.
The "inner" bracket is installed behind the rear of the server, which is attached to the rail chassis members, and the cable
sub-assembly will be plugged into the server PSUs as shown below:

Figure 35. Attaching bracket to rails

Rack, rails, and cable management 39

Figure 36. Connecting power cable to system

The "outer" bracket will be installed to the rail cabinet members in the rack, after the individual cabinet members have been
installed. Users plug live power cable to the rear cable assembly, just as they would to the server in the standard setups, as
shown below:

Figure 37. Connecting rear bracket

40 Rack, rails, and cable management

Figure 38. Connecting live power cable to bracket

Figure 39. Sliding system to rear bracket

Installation of the server will follow the traditional Stab-in process, where the pass-thru brackets and connectors will mate as
the server rack ears meet the front rack flange. Visual Indicators are present to identify Blind Mate Power setups from the Cold
Aisle.
WARNING: Whenever you need to lift the system, get others to assist you. To avoid injury, do not attempt to lift
the system by yourself. Get others to assist you or use a mechanical lift.

NOTE: Begin installing the rails in the allotted space that is closest to the bottom of the rack enclosure.

Cable management arm (CMA)

The optional cable management arm (CMA) organizes and secures the cords and cables exiting the back of the systems. It
unfolds to allow the systems to extend out of the rack without having to detach the cables. Some key features of the CMA
include:
● Large U-shaped baskets to support dense cable loads.
● Open vent pattern for optimal airflow.

Rack, rails, and cable management 41

● Ability to mount on either side by swinging the spring-loaded brackets from one side to the other.
● Utilizes hook-and-loop straps rather than plastic tie wraps to eliminate the risk of cable damage during cycling.
● Includes a low-profile fixed tray to both support and retain the CMA in its fully closed position.
● Both the CMA and the tray mount without the use of tools by simple and intuitive snap-in designs.
The CMA can be mounted to either side of the sliding rails without the use of tools or the need for conversion. For systems
with one power supply unit (PSU), it is recommended to mount on the side opposite to that of the power supply to allow easier
access to it and the rear drives (if applicable) for service or replacement.

Figure 40. Sliding rails with CMA

Figure 41. CMA Cabling

Strain Relief Bar (SRB)

The optional strain relief bar (SRB) for the PowerEdge R770 organizes and supports cable connections at the rear end of the
server to avoid damage from bending.

42 Rack, rails, and cable management

Figure 42. Cabled strain relief bar

● Tool-less attachment to the rails

● Two depth positions to accommodate various cable loads and rack depths
● Supports cable loads and controls stresses on server connectors
● Cables can be segregated into discrete purpose-specific bundles

Rack, rails, and cable management 43

 11
Operating Systems and Virtualization
Topics:
• Supported operating systems

Supported operating systems

The PowerEdge R770 CSP Edition system supports the following operating systems:
● Canonical Ubuntu Server LTS
● Red Hat Enterprise Linux
● SUSE Linux Enterprise Server
For specifications and interoperability details, see OS support.

44 Operating Systems and Virtualization

 12
Dell Systems Management
Dell delivers management solutions that help IT administrators effectively deploy, update, monitor, and manage IT assets. Dell
solutions and tools enable you to quickly respond to problems by helping them to manage Dell servers efficiently; in physical,
virtual, local, and remote environments; all without the need to install an agent in the operating system.
Topics:
• Getting started with Dell Open Server Manager (OSM)

Getting started with Dell Open Server Manager

(OSM)
Open Server Manager (OSM) introduction
Cloud service and hosting providers managing large-scale data centers face many challenges accelerating their infrastructure
and managing multiple systems across different vendors. Updating firmware can be challenging, even across many generations
of hardware from a single vendor. The simplicity of a single, open embedded system management stack allows for scalable
operations, and easier migration paths across different or newer infrastructure.
Dell Open Server Manager built on OpenBMC enables open, embedded systems management on select Dell PowerEdge cloud
scale servers. Explicitly designed for Cloud Server Providers managing large-scale data centers, Dell Open Server Manager is
designed, tested, and validated to securely run on select Dell PowerEdge platforms and configurations. We offer a cohesive
migration path for our customers looking to adopt OpenBMC for their environments while optimizing operations and minimizing
management with choices you can count on.

What is OpenBMC?
OpenBMC is an open-source BMC firmware stack that is designed to run on various infrastructures. It is a Linux Foundation
project with the backing of Intel®, IBM®, Microsoft®, and Google™. OpenBMC™ aims to run the same embedded management
software on all of your systems to bring consistent management across your environment. Dell Open Server Manager is Dell's
implementation of OpenBMC. More information about Open Server Manager (OSM) can be found at open-server-manager.

Why Dell Open Server Manager?

Dell Open Server Manager that is built on OpenBMC includes pure OpenBMC plus the security, manageability, and support that
customer's expect from PowerEdge servers:

Table 24. Dell Open Server Manager

Proven Security Lifecycle Management Global Services & Support
Dell-signed firmware with silicon root-of- BIOS configuration via Redfish™ API Standard Dell standard support and
trust (RoT) warranties
Root shell access disabled by default Firmware update support via Dell Update Ability to convert to/from Open Server
Packages (DUP) for BIOS, backplane, Manager and iDRAC(future release)
BMC & power supplies (future release)
Improved User Experience

Dell Systems Management 45

Why choose Dell Open Server Manager built on OpenBMC?
OpenBMC is designed to provide consistent systems management software across heterogeneous infrastructure. Based on
upstream OpenBMC, Dell Open Server Manager enables OpenBMC to run securely on select PowerEdge servers. In doing
so, this added silicon Root-of-Trust ensures that only the Dell version of OpenBMC - thoroughly tested and validated - runs
seamlessly on PowerEdge servers, giving our customers the security, support, and manageability they expect.
Ensuring malicious OpenBMC firmware does not make its way onto your servers, Dell lifecycle management is also enabled to
install Dell-signed firmware update packages from within Dell Open Server Manager for the BIOS, backplane, power supplies
(future release), and BMC. Additionally, the ability to export OpenBMC logs into a log package for SupportAssist allows Dell to
provide a full warranty and support.

Dell Open Server Manager Capabilities

Dell Open Server Manager provides many core systems management capabilities through multiple interfaces, including
Redfish™, IPMI, and a web-based user interface.
● Get an overview of the system
● View event and POST code logs
● Observe hardware status and inventory, including channel firmware devices
● Access the virtual KVM with virtual media capability
● Update firmware
● Perform server power operations and configure power consumption
● Configure settings such as the date, time, network, users, sessions, and policies
Everything visible in the GUI - except for the virtual KVM and media - is accessible through Redfish.
Redfish allows you to manage the server through a RESTful API programmatically. This feature is vital for autonomous systems
management.

Configuring Dell Open Server Manager

Provisioning a new server consists of three activities
● Configure the hardware
● Install an operating system
● Deploy applications and workloads
Firmware updates for other devices must be done through the operating system or with device-specific vendor tools. Dell Open
Server Manager accepts the same Dell firmware update packages used by iDRAC or for the operating system; and can be
downloaded from dell.com
An operating system can be installed using the virtual KVM and virtual media capability, or the server can be configured to PXE
boot to deploy the operating system and applications over the network.

46 Dell Systems Management

 13
Appendix A: Additional specifications
Topics:
• Chassis dimensions
• System weight
• NIC port specifications
• Video specifications
• USB Ports
• PSU rating
• Environmental specifications

Chassis dimensions

Figure 43. Chassis dimensions

Appendix A: Additional specifications 47

Table 25. PowerEdge R770 CSP Edition chassis dimensions
Drives Xa Xb Y Za Zb Zc
8 drives and 16 482.0 mm (18.97 434.0 mm 86.8 mm (3.41 42.9 mm (1.68 700.7 mm 771.62 mm
drives (front I/O) inches) (17.08 inches) inches) inches) (27.58 inches) (30.37 inches)
configuration Without bezel Ear to rear wall Ear to PSU
handle

NOTE: Zb is the nominal rear wall external surface where the system board I/O connectors reside.

System weight
Table 26. PowerEdge R770 CSP Edition system weight
System configuration Maximum weight (with all drives/SSDs)
8 x EDSFF E3.S 25.89 kg (57.07 pound)
16 x EDSFF E3.S 28.53 kg (62.89 pound)

Table 27. PowerEdge R770 CSP Edition weight handling recommendations

Chassis weight Description
40–70 pounds Recommend two people to lift
70–120 pounds Recommend three people to lift
≥ 121 pounds Recommend to use a server-lift

NIC port specifications

The PowerEdge R770 CSP Edition system supports Network Interface Controller (NIC) ports that are embedded on the Open
Compute Project (OCP) NIC cards.

Table 28. NIC port specification for the system

Feature Specifications
OCP NIC 3.0 card 25 GbE x 2, 25 GbE x 4, 100 GbE x 2

NOTE: The OCP NIC card can be installed in front or rear of the system, depending on the system I/O configuration.

Video specifications
The PowerEdge R770 CSP Edition system supports integrated Matrox G200 graphics controller with 16 MB of video frame
buffer.

Table 29. Supported video resolution options

Resolution Refresh rate (Hz) Color depth (bits)
1024 x 768 60 8, 16, 32
1280 x 800 60 8, 16, 32
1280 x 1024 60 8, 16, 32
1360 x 768 60 8, 16, 32
1440 x 900 60 8, 16, 32

48 Appendix A: Additional specifications

Table 29. Supported video resolution options (continued)
Resolution Refresh rate (Hz) Color depth (bits)
1600 x 900 60 8, 16, 32
1600 x 1200 60 8, 16, 32
1680 x 1050 60 8, 16, 32
1920 x 1080 60 8, 16, 32
1920 x 1200 60 8, 16, 32

USB Ports
The front USB 2.0 port only supports output current up to 0.5 A and cannot support high-power consumption devices such as
CD-ROM.

Figure 44. Front USB Port

The bottom port of the rear USB connector can support USB3.1 to supply output current up to 0.9 A.

Figure 45. Rear USB Port

An internal USB Type-A vertical connector on the motherboard can support a small USB key. The maximum allowable height of
the USB key body is specified per configuration:

Appendix A: Additional specifications 49

Figure 46. Internal USB Port

Table 30. USB key length

Configuration Key length limit (including connector)
2U 31.32 mm

NOTE: Internal USB design is USB Key restriction, not for cable.

Table 31. PowerEdge R770 CSP Edition USB Specifications

Front Rear Internal (Optional)
USB port type No. of ports USB port type No. of ports USB port type No. of ports
USB 2.0- One (optional) USB 3.1- Two Internal USB 3.1- One (optional)
compliant port compliant ports compliant port
USB 2.0 Type C One
port

PSU rating
Below table lists the power capacity of the PSUs in high/low line operation mode.

Table 32. PSUs highline and lowline ratings

PSU 800 W Platinum 1100 W Platinum 1500 W Titanium
Peak Power (Highline) 1240 W 1705 W 2325 W
Highline 800 W 1100 W 1500 W
Peak Power (Lowline) 1240 W 1627 W 1627 W
Lowline 800 W 1050 W 1050 W
Highline 240 VDC 800 W 1100 W 1500 W
Highline 380 VDC N/A N/A N/A

50 Appendix A: Additional specifications

Table 32. PSUs highline and lowline ratings (continued)
PSU 800 W Platinum 1100 W Platinum 1500 W Titanium
DC-(48—60) V N/A N/A N/A

The PowerEdge R770 CSP Edition supports up to two AC power supplies with 1+0 or 2+0 non-redundancy, autosensing, and
auto switching capability.
Dell PSUs have achieved Platinum and Titanium efficiency levels as shown in the table below.

Table 33. PSU efficiency level

Efficiency Targets by Load
Form factor Output Class 10% 20% 50% 100%
Redundant 60 mm 800 W Mixed mode Platinum N/A 90.00% 94.00% 91.00%
1100 W Mixed mode Platinum N/A 90.00% 94.00% 91.00%
1500 W Mixed mode Titanium 90.00% 94.00% 96.00% 91.00%

Environmental specifications
NOTE: For additional information about environmental certifications, refer to the Product Environmental Datasheet
located with the Manuals & Documents on Dell Support.

Table 34. Continuous Operation Specifications for ASHRAE A2

Temperature Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 10–35°C (50–95°F) with no direct sunlight on the equipment
2953 ft)
Humidity percent range (non-condensing at all 8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F)
times) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/300 m (1.8°F/984 Ft) above 900
m (2953 Ft)

Table 35. Common Environmental Specifications for ASHRAE A2, A3, A4 and Rugged environment
Temperature Allowable continuous operations
Maximum temperature gradient (applies to both 20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (41°F in 15
operation and non-operation) minutes), 5°C in an hour* (41°F in an hour) for tape
NOTE: * - Per ASHRAE thermal guidelines for tape hardware, these are
not instantaneous rates of temperature change.

Non-operational temperature limits -40 to 65°C (-104 to 149°F)

Non-operational humidity limits 5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude 12,000 meters (39,370 feet)
Maximum operational altitude 3,048 meters (10,000 feet)

Table 36. Maximum vibration specifications

Maximum vibration Specifications
Operating 0.21 G rms at 5 Hz to 500 Hz (all operation orientations)
Storage 1.38 G rms at 7 Hz to 250 Hz for 15 minutes (all six sides tested)

Appendix A: Additional specifications 51

Table 37. Maximum shock pulse specifications
Maximum shock pulse Specifications
Operating Six consecutively executed shock pulses in the positive and negative x, y,
and z axis of 6 G for up to 11 ms.
Storage Six consecutively executed shock pulses in the positive and negative x, y,
and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.

Thermal restriction matrix

Table 38. Label reference
Label Description
STD Standard
HPR (Silver) High performance Silver (HPR SLVR) fan
HPR (Gold) High performance Gold (HPR GOLD) fan
HSK Heat sink
LP Low profile
FH Full height
EXT Extend

Table 39. Processor and heat sink matrix

Heat sink Processor TDP
2U EXT HSK ≥ 200 W (For all configurations without rear GPU)
NOTE: Front I/O configuration with RC1/2 require 2U EXT HSK.

1U EXT HSK ≤ 250 W (GPU shroud should be installed with rear GPU/FGPA/long PCIe cards)
L-type HSK > 250 W (GPU shroud should be installed with rear GPU/FGPA/long PCIe cards)

NOTE: The configuration's ambient temperature is dictated by its critical component. For example, if the processor's
ambient temperature is 35°C, the DIMM is 35°C, and the GPU is 30°C, the configuration's ambient temperature can only
be 30°C.

Table 40. Thermal restriction matrix (non-GPU)

Configuration 8 x EDSFF E3.S NVMe 16 x EDSFF E3.S NVMe
Storage configuration number C01-01 C02-01
Ambient
Riser configuration RC2 RC1/2/6-1 temperature
Air shroud type Regular Regular
Processor TDP Cores Fan
6710E 205 W 64 HPR SLVR HPR SLVR 35°C
6756E 225 W 128 HPR SLVR HPR SLVR 35°C
6740E 250 W 96 HPR SLVR HPR SLVR 35°C
6746E 250 W 112 HPR SLVR HPR SLVR 35°C
6766E 250 W 144 HPR SLVR HPR SLVR 35°C
6780E 330 W 144 HPR SLVR HPR SLVR 35°C
RDIMM 1 DPC power 2 DPC DIMM configuration
power

52 Appendix A: Additional specifications

Table 40. Thermal restriction matrix (non-GPU) (continued)
Configuration 8 x EDSFF E3.S NVMe 16 x EDSFF E3.S NVMe
Storage configuration number C01-01 C02-01
Ambient
Riser configuration RC2 RC1/2/6-1 temperature
Air shroud type Regular Regular
Processor TDP Cores Fan
32 GB 8W N/A 35°C 35°C N/A
64 GB 13 W 10 W 35°C 35°C N/A

NOTE: RC 6-1 will be supported in the future release.

NOTE: Both Front I/O and Rear I/O configurations are supported, using the same chassis.

Table 41. Thermal restriction matrix (GPU)

Configuration 8 x EDSFF E3.S NVMe 16 x EDSFF E3.S NVMe
Storage configuration number C01-01 C02-01
Riser configuration RC2 RC1/2 RC 6-1 Ambient
temperature
Air shroud type Regular Regular GPU
Processo TDP Cores Fan
r
6710E 205 W 64 HPR GOLD HPR GOLD HPR GOLD 35°C
6756E 225 W 128 HPR GOLD HPR GOLD HPR GOLD 35°C
6740E 250 W 96 HPR GOLD HPR GOLD HPR GOLD 35°C
6746E 250 W 112 HPR GOLD HPR GOLD HPR GOLD 35°C
6766E 250 W 144 HPR GOLD HPR GOLD HPR GOLD 35°C
6780E 330 W 144 HPR GOLD HPR GOLD HPR GOLD 35°C
RDIMM 1 DPC 2 DPC DIMM ambient temperature
power power
32 GB 8W N/A 35°C 35°C 35°C N/A
64 GB 13 W 10 W 35°C 35°C 35°C N/A
GPU TDP GPU ambient temperature
L4 24 GB 72 W 35°C 35°C 30°C N/A

NOTE: In front I/O configuration, RC 1/2 use regular air shroud and 2U EXT HSK, regardless of GPU presence.

NOTE: RC 6-1 will be supported in the future release.

Appendix A: Additional specifications 53

 14
Appendix B. Standards compliance
The system conforms to the following industry standards.

Table 42. Industry standard documents

Standard URL for information and specifications
ACPIAdvance Configuration and Power Interface ACPI
Specification, v6.4
Ethernet IEEE Std 802.3-2022 IEEE Standards
MSFT WHQL Microsoft Windows Hardware Quality Labs Windows Hardware Compatibility Program
IPMI Intelligent Platform Management Interface, v2.0 IPMI
DDR5 Memory DDR5 SDRAM Specification DDR5 SDRAM
PCI Express PCI Express Base Specification, v5.0 PCIe specifications
PMBus Power System Management Protocol Specification, PMBus specifications
v1.2
SAS Serial Attached SCSI, 3 (SAS-3) (T10/INCITS 519) SCSI storage interfaces
SATA Serial ATA Rev. 3.3 SATA IO
SMBIOS System Management BIOS Reference Specification, DMTF SMBIOS
v3.3.0
TPM Trusted Platform Module Specification, v2.0 TPM specifications
UEFI Unified Extensible Firmware Interface Specification, v2.7 UEFI specifications
PI Platform Initialization Specification, v1.7
USB Universal Serial Bus v2.0 and SuperSpeed v3.0 (USB 3.1 USB document library
Gen1)
NVMe Express Base Specification. Revision 2.0c NVMe specifications
NVMe Command Set Specifications
1. NVM Express NVM Command Set Specification. Revision
1.1c
2. NVM Express Zoned Namespaces Command Set. Revision
1.0c
3. NVM Express® Key Value Command Set. Revision 1.0c
NVMe Transport Specifications
1. NVM Express over PCIe Transport. Revision 1.0c
2. NVM Express RDMA Transport Revision. 1.0b
3. NVM Express TCP Transport. Revision 1.0c
NVMe NVM Express Management Interface. Revision 1.2c
NVMe NVMe Boot Specification. Revision 1.0

54 Appendix B. Standards compliance

 15
Appendix C: Additional resources
Table 43. Additional resources
Resource Description of contents Location
Installation and Service Manual This manual, available in PDF format, Dell.com/Support/Manuals
provides the following information:

● Chassis features
● System Setup program
● System indicator codes
● System BIOS
● Remove and replace procedures
● Diagnostics
● Jumpers and connectors
Getting Started Guide This guide ships with the system, and is Dell.com/Support/Manuals
also available in PDF format. This guide
provides the following information:

● Initial setup steps

Rack Installation Guide This document ships with the rack kits, Dell.com/Support/Manuals
and provides instructions for installing a
server in a rack.
System Information Label The system information label documents Inside the system chassis cover
the system board layout and system
jumper settings. Text is minimized due
to space limitations and translation
considerations. The label size is
standardized across platforms.
Quick Resource Locator (QRL) This code on the chassis can be scanned Inside the system chassis cover
by a phone application to access
additional information and resources for
the server, including videos, reference
materials, service tag information, and
Dell contact information.
Enterprise Infrastructure Planning Tool The Dell online EIPT enables easier Dell.com/calc
(EIPT) and more meaningful estimates to
help you determine the most efficient
configuration possible. Use EIPT to
calculate the power consumption of
your hardware, power infrastructure, and
storage.

Appendix C: Additional resources 55

 16
Appendix D: Services
Topics:
• Why attach service contracts
• ProSupport Infrastructure Suite
• Specialty Support Services
• ProDeploy Infrastructure Suite
• Supplemental Deployment Services
• Consulting Services
• Resources

Why attach service contracts

Dell PowerEdge servers include a standard hardware warranty that highlights our commitment to product quality by
guaranteeing repair or replacement of defective components. While industry-leading, our warranties are limited to 1 or 3 years,
depending on model, and do not cover software assistance. Call records show that failure rates for servers are roughly 1% and
more commonly, customers seek Dell technical support for software related issues like configuration guidance, troubleshooting,
upgrade assistance or performance tuning. Encourage customers to purchase ProSupport service contracts to supplement
warranty coverage and ensure optimal support for both hardware and software. ProSupport provides a complete hardware
guarantee beyond the original warranty period (up to 12 years: including seven years standard support and an additional five
years of Post-Standard Support). Details of the ProSupport Suite and benefits are listed below.

ProSupport Infrastructure Suite

ProSupport Infrastructure Suite is a set of support services that enable customers to build the solution that is right for their
organization. It is an industry-leading, enterprise-class support that aligns with the criticality of your systems, the complexity of
your environment, and the allocation of your IT resources.

56 Appendix D: Services
Figure 47. ProSupport infrastructure Suite

ProSupport Plus for Infrastructure

ProSupport Plus (PSP) for Infrastructure is the ultimate solution for customers seeking preventative maintenance and
optimal performance on their business-critical assets. The service caters to customers who require proactive, predictive,
and personalized support for systems that manage critical business applications and workloads. When customers purchase
PowerEdge servers, we recommend ProSupport Plus, our proactive and preventative support service for business-critical
systems. ProSupport Plus provides all the benefits of ProSupport, including the following "Top five reasons to buy PSP".
1. Service Account Manager- a customer's #1 support advocate, ensuring they get the best possible proactive and predictive
support experience
2. Priority access to specialized support experts - immediate, advanced troubleshooting from an engineer that
understands Dell infrastructure solutions
3. Proactive systems maintenance- on a semi-annual basis, we will keep a customer's ProSupport Plus system(s) up to date
by installing the latest firmware, BIOS, and driver updates to improve performance and availability
4. Enhanced Mission Critical Support - when critical (Severity 1) support issues happen, the customer is assured that we
will do all we can to get them back up and running as quickly as possible
5. 3rd party software support - Dell is a customer’s single point of accountability for any eligible 3rd party software installed
on their ProSupport Plus system, whether they purchased the software from us or not.

ProSupport for Infrastructure

Comprehensive 24x7 support for hardware and software - best for production, but not critical, workloads and applications. The
ProSupport service offers highly trained experts around the clock and around the globe to address IT needs. We help minimize
disruptions and maximize availability of PowerEdge server workloads with:
● 24x7 support through phone, chat and online
● A central point of accountability for all hardware and software issues
● Hypervisor, operating system and application support
● Dell security advisories
● Onsite response service levels 4 hour or Next Business Day options
● Proactive issue detection with automated case creation
● Predictive hardware anomaly detection

Appendix D: Services 57
● Incident Manager assigned for Severity 1 cases
● Collaborative third-party support
● Access to AIOps Platforms - (MyService360, TechDirect, and APEX AIOps Infrastructure Observability)
● Consistent experience regardless of where customers are located or what language they speak.

Basic Hardware Support

Provides reactive hardware support during normal business hours, excluding local national holidays. No software support or
software related guidance. For improved levels of support choose ProSupport or ProSupport Plus.

Specialty Support Services

Optional specialty support services complement the ProSupport Infrastructure Suite to provide additional proficiencies that are
critical for modern data center operations.

Hardware coverage add-ons to ProSupport

● Keep Your Hard Drive (KYHD) and Keep Your Component (KYC): Normally if a device fails under warranty, Dell replaces
it using a one-for-one exchange process. KYHD / KYC gives you the option to retain your device. It provides full control
of sensitive data and minimizes security risk by letting you retain possession of failed drives / components when receiving
replacement parts without incurring additional cost.
● Onsite Diagnosis Service: Ideal for sites with non-technical staff. Dell field technician performs initial troubleshooting
diagnosis onsite and transfers to Dell remote engineers to resolve the issue.
● ProSupport Add-on for HPC: Sold as an add-on to a ProSupport service contract, the ProSupport Add-on for HPC
provides solution-aware support to cover the additional requirements that are required to maintain an HPC environment such
as:
○ Access to senior HPC experts
○ Advanced HPC cluster assistance: performance, interoperability, and configuration
○ Enhanced HPC solution level end-to-end support
○ Remote pre-support engagement with HPC Specialists during ProDeploy implementation
● ProSupport Add-on for Telco (Respond & Restore): An add-on service designed for the top 31 TELCO customers
globally, Respond & Restore provides direct access to Dell solution experts who specialize in TELCO carrier-grade support.
This add-on also provides a hardware uptime guarantee, meaning if a system fails, Dell will have it installed and operational
within 4 hours for Severity 1 issues. Dell incurs penalties and fees if SLAs are not met.

Supplemental Site-wide Expertise

● Multivendor Support Service: Support your 3rd party devices as one service plan for servers, storage and networking
(includes coverage for: Broadcom, Cisco, Fujitsu, HPE, Hitachi, Huawei, IBM, Lenovo, NetApp, Oracle, Quanta, SuperMicro &
others).
● Technical Account Manager: Designated technology lead who monitors and manages performance and configuration of
specific technology sets.
● Designated Remote Support: Personalized support expert who manages all troubleshooting and resolution of IT assets

Services for large enterprises

● ProSupport One for Data Center: ProSupport One for Data Center offers flexible site-wide support for large and
distributed data centers with more than 1,000 assets (combined total of server, storage, networking, etc.). This offering
is built on standard ProSupport features that leverage our global scale and are tailored to specific customer needs. While
not for everyone, this service option offers a truly unique solution for our largest customers with the most complex
environments.
○ Team of assigned Services Account Managers with remote or onsite options
○ Assigned technical and field engineers who are trained on the customer’s environment and configurations
○ On-demand reporting and recommendations enabled by ProSupport AIOps tools (MyService360, TechDirect & CloudIQ)
○ Flexible onsite support and parts options that fit their operational model

58 Appendix D: Services
 ○ A tailored support plan and training for their operations staff
● Logistics Online Inventory Solution (LOIS):Ideal for large organizations that have their own staff to support their
data center. Dell offers a service called Logistics Online Inventory Solution which is an onsite parts locker that provides
self-maintainers with a local inventory of common replacement components. Having access to these parts lockers allows
the self-maintainer to replace a failed component immediately without delay. Each replacement part would automatically
initiate a replenishment of the parts inventory that is shipped next day or delivered onsite by Dell during a regular scheduled
visit (called Scheduled Onsite Service). As part of the LOIS system, customers can integrate their systems directly to Dell
TechDirect using APIs to help streamline the support management process.

End-of-Life Services
● Post Standard Support (PSS): Extend service life beyond the initial seven years of ProSupport, adding up to five more
additional years of hardware coverage
● Data Sanitization & Data Destruction: Renders data unrecoverable on repurposed or retired products, ensuring security
of sensitive data and enabling compliance and provides NIST compliant certification.
● Asset Recovery Services:Recycle, resale, and disposal of hardware. Helps you securely and responsibly retire IT assets
that are no longer needed while protecting both your business and the planet.

ProDeploy Infrastructure Suite

ProDeploy Infrastructure Suite provides a variety of deployment offerings to satisfy a customer's unique needs. It is made up of
five sub-offers: Configuration Services, Rack Integration, Basic Deployment, ProDeploy, and ProDeploy Plus.

Figure 48. ProDeploy Infrastructure Suite

Factory Based Services

Pre-configured systems or complete racks, customized prior to shipping to the customer's site.

ProDeploy Factory Configuration

Ideal for customers buying servers in volume and seeking pre-configuration prior to shipping such as: custom image, system
settings, and asset tagging so it arrives ready to use out of the box. Furthermore, servers are packaged and bundled to meet
specific shipping and distribution requirements for each customer location to facilitate the rollout process. Once the server is

Appendix D: Services 59
onsite , Dell can install and configure the server to the environment using any of the field-based deployment services outlined in
the next section.

ProDeploy Rack Integration

Ideal for customers seeking to build out fully integrated racks prior to shipping. These rack builds include hardware install,
cabling, and full system configuration. You can also add-on a factory stress test and an optional on-site final rack configuration
to complete the rack installation.
● STANDARD SKUs for Rack Integration is available in the USA only and requires:
○ 20 or more devices (R and C series servers, VxRail, and all Dell or non-Dell switches). Use Informational SKUs for Dell
switches or 3rd party products
○ Shipping to contiguous USA
● USE CUSTOM QUOTE for Rack Integration scenarios that require:
○ Shipment to any country or region outside USA or shipping outside contiguous USA
○ Shipping to multiple locations
○ Racks containing less than 20 servers
○ Any rack that includes Storage

Figure 49. ProDeploy Infrastructure Suite - Factory services

Field-based Services
Put PowerEdge servers to work faster with Dell field-based deployment services. Whether we are deploying one server to one
thousand – we have you covered. Dell provides versatile delivery options to fit every budget and operating model.

ProDeploy Plus
Elevate Infrastructure deployments with our most complete service from planning through onsite hardware installation and
software configuration including the implementation of cybersecurity best practices. ProDeploy Plus provides the skill and scale
needed to successfully execute demanding deployments in today's complex IT . The deployment starts with a site readiness
review and implementation plan. Certified deployment experts perform the software configuration to include set up of leading
operating systems and hypervisors. Dell will also configure PowerEdge software tools to include iDRAC (available in future
release) and OpenManage system utilities as well as support AIOps platforms: MenvironmentsyService360, TechDirect, and
CloudIQ. Unique to ProDeploy Plus, the cybersecurity implementation helps customers understand potential security risks and

60 Appendix D: Services
make recommendations for reducing product attack surfaces. The system is tested, validated prior to completion. The customer
will also receive full project documentation and knowledge transfer to complete the process.

ProDeploy
ProDeploy provides remote software configuration and choice of hardware installation (onsite or guided). ProDeploy is great for
customers who are price sensitive or willing to participate in some portion of the deployment to include providing remote access
to their network. The ProDeploy remote software implementation includes everything mentioned in ProDeploy Plus except it
does not include the added value, cybersecurity implementation and best practices.

Basic Deployment
Basic Deployment delivers worry-free professional installation by experienced technicians. This service is often sold to
Competency Enabled Partners who will have Dell do the hardware installation while they complete the software configuration.
Furthermore, Basic Deployment tends to be purchased by large enterprises who have smart technical staff. These companies
just need Dell to install the hardware and they will perform the software configuration. The last use case for Basic Deployment
is when paired with Factory Configuration services. The servers are pre-configured in the factory and the basic deployment
service will install the system into the rack to finalize the deployment.

Figure 50. ProDeploy Infrastructure Suite - Field services

Supplemental Deployment Services

Additional ways to expand scope or deploy for unique scenarios.

Two Host Adder (requires PD/PDP)

Deploying new storage, compute, or networking devices may require interconnection to other servers (also called hosts). The
Dell delivery team will set up four hosts per device as part of every ProDeploy service. For example, if the customer is buying
two storage arrays the ProDeploy service will automatically include connectivity of four hosts each (4x2=8 total hosts per
project since there are two devices). This supplemental “Two Host Adder” service provides for the configuration of additional
hosts above what is already provided as part of the ProDeploy service. In many cases, customers can work with us while we
set up the included hosts, so they may understand how to do the rest themselves. Always ask the customer how many hosts

Appendix D: Services 61
are being connected and sell the host adder depending on the customer’s technology skillset. Note this service applies to the
connectivity of Dell devices not 3rd party devices.

Additional Deployment Services (ADT) - sold with or without PD/PDP

You can expand the scope of a ProDeploy engagement leveraging Additional Deployment Time (ADT). ADT will cover additional
tasks above the normal deliverables of the ProDeploy offers. ADT can also be used as a standalone service without ProDeploy.
SKUs are available for both Project Management and Technical Resource Expertise. SKUs are sold as blocks of four hours
remote or eight hours onsite. The delivery team can assist in scoping the number of hours required for additional tasks.

Data Migration Services

Migrating data sets is no easy task. Our experts use proven tools and process to streamline data migrations and avoid
compromising data. A customer project manager works with our experienced team of experts to create a migration plan. Data
migration is part of every technology upgrade, platform change, and shift to the cloud. You can rely on Dell data migration
services to perform a seamless transition.

Residency Services
Certified technical professionals act like an extension of your IT staff to enhance internal capabilities and resources and
help you realize faster adoption and maximized ROI of new technology. Residency Services help customers transition to new
capabilities quickly by leveraging specific technology skill sets. Residency experts can provide post implementation management
and knowledge transfer that is related to a new technology acquisition or day-to-day operational management of the IT
infrastructure.
● Global experts available to serve in-person (onsite) or virtual (remote)
● Engagements starting at 2 weeks with flexibility to adjust

Unique Deployment Scenarios

Custom Deployment Services

When a deployment is beyond the scope of the ProDeploy Infrastructure Suite, you can turn to the custom deployment services
team to address complex implementation scenarios and unique customer requirements. The Dell custom deployment team is
staffed with solution architects who assist with customer scoping calls to define the project and develop the statement of
work. Custom services can handle a wide range of deployments that can be performed in the factory or onsite. All custom
engagement services are requested through SFDC.

ProDeploy FLEX
ProDeploy Flex is a new service and a powerful tool for you to attach more services and improve revenue and margins. The
ProDeploy Flex modular offer allows sales teams to build and better tailor services by mixing factory and field delivery options.
You can also select special deployment scenarios without going to the custom order desk. FLEX is ideal for unique deployments
where ProDeploy or ProDeploy Plus are not an adequate answer to the customer needs.

Key features of ProDeploy FLEX

● Build deployment quotes using modular, selectable features for both hardware and software.
● The system automatically scales pricing based on volume.
● Ideal for customers who require NativeEdge Orchestrator or edge deployments
● Ability to add deployment services to third-party networking devices

62 Appendix D: Services
Deployment of HPC
High-Performance Computing (HPC) implementations require specialists that understand advanced feature sets. Dell deploys
the world's fastest systems and understands the nuances that make them perform. HPC deployments are most often scoped as
custom service engagements, however we can do smaller HPC clusters under 300 nodes using a standard ProDeploy SKU. Any
standard SKU for HPC deployment will be sold as one base SKU per cluster (ProDeploy for HPC Base) along with one ProDeploy
for HPC Add-on for each device in the cluster (server nodes and switches).
● Scope of ProDeploy for HPC: *Available as standard SKUs in the US and Canada. Custom Service would be required for all
other regions.

Figure 51. Standard deliverables of ProDeploy for HPC

Figure 52. Visual view of HPC deployment options to include hardware and software

DAY 2 - Automation Services with Ansible

Dell solutions are built as "automation ready" with integrated APIs (Application Programming Interfaces) to allow customers
to programmatically call actions on the product through code. Although Dell has published Anisble automation use cases,
some customers need additional assistance with GitOps. By the end of the service, the customer will have the foundational
components required to accelerate automation and understand how the programming works together: Day 1 and Day 2 use case
automation scripts (ansible modules), CI/CD tool (Jenkins), and Version control (Git).

Consulting Services
Our expert consultants help customers transform faster, and quickly achieve business outcomes for the high value
workloads Dell PowerEdge systems can handle. From strategy to full-scale implementation, Dell Technologies Consulting can

Appendix D: Services 63
help determine how to perform IT, workforce, or application transformation. We use prescriptive approaches and proven
methodologies that are combined with portfolio and partner ecosystem of Dell Technologies to help achieve real business
outcomes. We are here to help guide your next transformation that could address multi-cloud environments, business
applications, DevOps, business resiliency, data center modernization, analytics, workforce collaboration, and user experiences.

Managed Services
Some customers prefer Dell to manage the complexity and risk of daily IT operations. Dell Managed Services utilizes proactive,
artificial intelligence to improve operations and modern automation. This helps customers realize desired business outcomes
from their infrastructure investments. With these technologies, our experts run, update, and fine-tune customer environments.
You decide the service level requirements and we provide oversight of the environment. There are two types of managed
service offers. First the outsourcing model, or CAPEX model, where Dell manages customer owned assets using our people and
tools. The second is the "as-a-Service" model, or OPEX model, which we call APEX. In this service, Dell owns all technology
and all the management of it. Many customers will have a blend of the two management types depending on the goals of the
organization.

Figure 53. Dell Managed Services

● Managed Detection and Response (MDR): Dell Technologies Managed Detection and Response (MDR) is powered by
Secureworks Taegis XDR software platform. MDR is a managed service that secures the customer’s IT environment against
malicious actors and provides remediation if and when a threat is identified. When a customer purchases MDR, they will
receive the following features from our team:
○ Dell badge resources
○ Agent rollout assistance to help deploy the Secureworks Endpoint Agent.
○ 24x7 threat detection and investigation
○ Up to 40 hrs per quarter of response and active remediation activities
○ If the customer experiences a breach, we will provide up to 40 hrs per year of Cyber incident response initiation.
○ Quarterly reviews with the customer to review the data

Education Services
Build the IT skills required to influence the transformational outcomes of the business. Enable talent and empower teams with
the right skills to lead and perform transformational strategy that drives competitive advantage. Leverage the training and
certification required for real transformation.
Dell Technologies Education Services offers PowerEdge server training and certifications that are designed to help customers
achieve more from their hardware investment. The curriculum delivers the information and the practical, firsthand skills that
their team must confidently install, configure, manage, and troubleshoot Dell servers.
To learn more or register for a class today, see Education.Dell.com

64 Appendix D: Services
Resources
Services Central: Services for PowerEdge
Sales Portal: Services for Server Knowledge Center

Appendix D: Services 65