7th Gen Core Family Mobile U y Processor Lines Datasheet Vol1 Rev008

7th Generation Intel® Processor
Families for U/Y Platforms and 8th

Generation Intel® Processor Family
for U Quad-Core and Y Dual Core
Platforms
Datasheet, Volume 1 of 2
Supporting 7th Generation Intel® Core™ Processor Families, Intel®

Pentium® Processors, Intel® Celeron® Processors for U/Y Platforms
and8th Generation Intel® Processor Family for U Quad Core formerly
known as Kaby Lake Refresh and 8th Generation Intel® Processor Family
for Y Dual Core formerly known as Amber Lake 2-Core
February 2022
Revision 008
Document Number: 334661-008

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2 Datasheet, Volume 1 of 2
Contents
1 Introduction ............................................................................................................ 11
1.1 Supported Technologies ..................................................................................... 13
1.2 Power Management Support ............................................................................... 13
1.2.1 Processor Core Power Management........................................................... 13
1.2.2 System Power Management ..................................................................... 13
1.2.3 Memory Controller Power Management...................................................... 13
1.2.4 Processor Graphics Power Management ..................................................... 14
1.2.4.1 Memory Power Savings Technologies ........................................... 14
1.2.4.2 Display Power Savings Technologies ............................................ 14
1.2.4.3 Graphics Core Power Savings Technologies................................... 14
1.3 Thermal Management Support ............................................................................ 14
1.4 Package Support ............................................................................................... 15
1.5 Processor Testability .......................................................................................... 15
1.6 Operating Systems Support ................................................................................ 15
1.7 Terminology ..................................................................................................... 15
1.8 Related Documents ........................................................................................... 17
2 Interfaces................................................................................................................ 20
2.1 System Memory Interface .................................................................................. 20
2.1.1 System Memory Technology Supported ..................................................... 20
2.1.1.1 DDR3L/-RS Supported Memory Modules and Devices ..................... 21
2.1.1.2 DDR4 Supported Memory Modules and Devices............................. 22
2.1.2 System Memory Timing Support............................................................... 23
2.1.3 System Memory Organization Modes......................................................... 24
2.1.4 System Memory Frequency...................................................................... 25
2.1.5 Technology Enhancements of Intel® Fast Memory Access (Intel® FMA).......... 25
2.1.6 Data Scrambling .................................................................................... 26
2.1.7 DDR I/O Interleaving .............................................................................. 26
2.1.8 Data Swapping ...................................................................................... 27
2.1.9 DRAM Clock Generation........................................................................... 27
2.1.10 DRAM Reference Voltage Generation ......................................................... 27
2.1.11 Data Swizzling ....................................................................................... 27
2.2 PCI Express* Graphics Interface (PEG)................................................................. 27
2.2.1 PCI Express* Support ............................................................................. 27
2.2.2 PCI Express* Architecture ....................................................................... 29
2.2.3 PCI Express* Configuration Mechanism ..................................................... 30
2.2.4 PCI Express* Equalization Methodology ..................................................... 30
2.3 Direct Media Interface (DMI)............................................................................... 31
2.3.1 DMI Error Flow....................................................................................... 31
2.3.2 DMI Link Down ...................................................................................... 31
2.4 Processor Graphics ............................................................................................ 31
2.4.1 API Support (Windows*) ......................................................................... 32
2.4.2 Media Support (Intel® QuickSync and Clear Video Technology HD) .............. 32
2.4.2.1 Hardware Accelerated Video Decode ............................................ 32
2.4.2.2 Hardware Accelerated Video Encode ............................................ 33
2.4.2.3 Hardware Accelerated Video Processing ....................................... 34
2.4.2.4 Hardware Accelerated Transcoding .............................................. 34
2.4.3 Camera Pipe Support .............................................................................. 34
2.4.4 Switchable/Hybrid Graphics ..................................................................... 35
2.4.5 Gen 9 LP Video Analytics ......................................................................... 35
2.4.6 Gen 9 LP (9th Generation Low Power) Block Diagram .................................. 36
3
2.4.7 GT2 Graphic Frequency ...........................................................................36
2.5 Display Interfaces ..............................................................................................37
2.5.1 DisplayPort* ..........................................................................................40
2.5.2 High-Definition Multimedia Interface (HDMI*).............................................41
2.5.3 Digital Video Interface (DVI) ....................................................................42
2.5.4 embedded DisplayPort* (eDP*) ................................................................42
2.5.5 Integrated Audio ....................................................................................42
2.5.6 Multiple Display Configurations (Dual Channel DDR) ....................................43
2.5.7 Multiple Display Configurations (Single Channel DDR) ..................................44
2.5.8 High-bandwidth Digital Content Protection (HDCP) ......................................44
2.5.9 Display Link Data Rate Support ................................................................45
2.5.10 Display Bit Per Pixel (BPP) Support............................................................46
2.5.11 Display Resolution per Link Width .............................................................46
2.6 Platform Environmental Control Interface (PECI) ....................................................46
2.6.1 PECI Bus Architecture..............................................................................46
3 Technologies............................................................................................................49
3.1 Intel® Virtualization Technology (Intel® VT) ..........................................................49
3.1.1 Intel® Virtualization Technology (Intel® VT) for IA-32, Intel® 64 and Intel®
Architecture (Intel® VT-X)........................................................................49
3.1.2 Intel® Virtualization Technology (Intel® VT) for Directed I/O (Intel® VT-d).....51
3.2 Security Technologies.........................................................................................54
3.2.1 Intel® Trusted Execution Technology (Intel® TXT) .......................................54
3.2.2 Intel® Advanced Encryption Standard New Instructions (Intel® AES-NI) .........55
3.2.3 PCLMULQDQ (Perform Carry-Less Multiplication Quad word) Instruction .........55
3.2.4 Intel® Secure Key ...................................................................................55
3.2.5 Execute Disable Bit .................................................................................56
3.2.6 Boot Guard Technology ...........................................................................56
3.2.7 Intel® Supervisor Mode Execution Protection (SMEP) ...................................56
3.2.8 Intel® Supervisor Mode Access Protection (SMAP) .......................................56
3.2.9 Intel® Memory Protection Extensions (Intel® MPX)......................................57
3.2.10 Intel® Software Guard Extensions (Intel® SGX) ..........................................57
3.2.11 Intel® Virtualization Technology (Intel® VT) for Directed I/O (Intel® VT-d).....58
3.3 Power and Performance Technologies ...................................................................58
3.3.1 Intel® Hyper-Threading Technology (Intel® HT Technology) .........................58
3.3.2 Intel® Turbo Boost Technology 2.0............................................................58
3.3.2.1 Intel® Turbo Boost Technology 2.0 Frequency ...............................58
3.3.3 Intel® Advanced Vector Extensions 2 (Intel® AVX2) ....................................59
3.3.4 Intel® 64 Architecture x2APIC ..................................................................59
3.3.5 Power Aware Interrupt Routing (PAIR).......................................................60
3.3.6 Intel® Transactional Synchronization Extensions (Intel® TSX-NI) ..................61
3.4 Debug Technologies ...........................................................................................61
3.4.1 Intel® Processor Trace ............................................................................61
4 Power Management .................................................................................................62
4.1 Advanced Configuration and Power Interface (ACPI) States Supported ......................64
4.2 Processor IA Core Power Management ..................................................................66
4.2.1 OS/HW controlled P-states .......................................................................66
4.2.1.1 Enhanced Intel® SpeedStep® Technology .....................................66
4.2.1.2 Intel® Speed Shift Technology ....................................................67
4.2.2 Low-Power Idle States.............................................................................67
4.2.3 Requesting Low-Power Idle States ............................................................68
4.2.4 Processor IA Core C-State Rules ...............................................................68
4.2.5 Package C-States ...................................................................................70
4.2.6 Package C-States and Display Resolutions..................................................72
4.3 Integrated Memory Controller (IMC) Power Management.........................................74
4.3.1 Disabling Unused System Memory Outputs ................................................ 74
4.3.2 DRAM Power Management and Initialization ............................................... 74
4.3.2.1 Initialization Role of CKE ............................................................ 75
4.3.2.2 Conditional Self-Refresh............................................................. 75
4.3.2.3 Dynamic Power-Down................................................................ 76
4.3.2.4 DRAM I/O Power Management .................................................... 76
4.3.3 DDR Electrical Power Gating (EPG) ........................................................... 76
4.3.4 Power Training....................................................................................... 77
4.4 PCI Express* Power Management ........................................................................ 77
4.5 Direct Media Interface (DMI) Power Management .................................................. 77
4.6 Processor Graphics Power Management ................................................................ 78
4.6.1 Memory Power Savings Technologies ........................................................ 78
4.6.1.1 Intel® Rapid Memory Power Management (Intel® RMPM) ............... 78
4.6.1.2 Intel® Smart 2D Display Technology (Intel® S2DDT) ..................... 78
4.6.2 Display Power Savings Technologies ......................................................... 78
4.6.2.1 Intel® (Seamless & Static) Display Refresh Rate
Switching (DRRS) with eDP* Port ................................................ 78
4.6.2.2 Intel® Automatic Display Brightness ............................................ 78
4.6.2.3 Smooth Brightness.................................................................... 79
4.6.2.4 Intel® Display Power Saving Technology (Intel® DPST) 6.0 ............ 79
4.6.2.5 Panel Self-Refresh 2 (PSR 2) ...................................................... 79
4.6.2.6 Low-Power Single Pipe (LPSP) .................................................... 79
4.6.3 Processor Graphics Core Power Savings Technologies .................................. 80
4.6.3.1 Intel® Graphics Dynamic Frequency ............................................ 80
4.6.3.2 Intel® Graphics Render Standby Technology (Intel® GRST) ............ 80
4.6.3.3 Dynamic FPS (DFPS) ................................................................. 80
4.7 Voltage Optimization.......................................................................................... 80
5 Thermal Management .............................................................................................. 81
5.1 Processor Thermal Management .......................................................................... 81
5.1.1 Thermal Considerations........................................................................... 81
5.1.2 Intel® Turbo Boost Technology 2.0 Power Monitoring .................................. 82
5.1.3 Intel® Turbo Boost Technology 2.0 Power Control ....................................... 82
5.1.3.1 Package Power Control .............................................................. 82
5.1.3.2 Platform Power Control .............................................................. 83
5.1.3.3 Turbo Time Parameter (Tau) ...................................................... 84
5.1.4 Configurable TDP (cTDP) and Low-Power Mode........................................... 84
5.1.4.1 Configurable TDP ...................................................................... 84
5.1.4.2 Low-Power Mode ...................................................................... 85
5.1.5 Thermal Management Features ................................................................ 85
5.1.5.1 Adaptive Thermal Monitor .......................................................... 85
5.1.5.2 Digital Thermal Sensor .............................................................. 87
5.1.5.3 PROCHOT# Signal..................................................................... 88
5.1.5.4 Bi-Directional PROCHOT# .......................................................... 89
5.1.5.5 Voltage Regulator Protection using PROCHOT# ............................. 89
5.1.5.6 Thermal Solution Design and PROCHOT# Behavior ........................ 89
5.1.5.7 Low-Power States and PROCHOT# Behavior ................................. 90
5.1.5.8 THERMTRIP# Signal .................................................................. 90
5.1.5.9 Critical Temperature Detection ................................................... 90
5.1.5.10 On-Demand Mode ..................................................................... 90
5.1.5.11 MSR Based On-Demand Mode..................................................... 90
5.1.5.12 I/O Emulation-Based On-Demand Mode ....................................... 91
5.1.6 Intel® Memory Thermal Management ........................................................ 91
5.1.7 Scenario Design Power (SDP)................................................................... 91
5.2 Thermal and Power Specifications........................................................................ 92
5.2.1 S-Processor Line Thermal and Power Specifications..................................... 93
5.2.1.1 Thermal Profile for PCG 2015D Processor ..................................... 96
5.2.1.2 Thermal Profile for PCG 2015C Processor ..................................... 97
5
5.2.1.3 Thermal Profile for PCG 2015B Processor ......................................98
5.2.1.4 Thermal Profile for PCG 2015A Processor ......................................99
5.2.1.5 Thermal Metrology ........................................................................ 100
5.2.1.6 Fan Speed Control Scheme with Digital Thermal Sensor (DTS) 1.1 . 100
5.2.1.7 Fan Speed Control Scheme with Digital Thermal Sensor (DTS) 2.0 . 102
5.3 ..................................................................................................................... 103
6 Signal Description .................................................................................................. 105
6.1 System Memory Interface ................................................................................. 105
6.2 PCI Express* Graphics (PEG) Signals.................................................................. 108
6.3 Direct Media Interface (DMI) Signals .................................................................. 108
6.4 Reset and Miscellaneous Signals ........................................................................ 109
6.5 embedded DisplayPort* (eDP*) Signals............................................................... 109
6.6 Display Interface Signals .................................................................................. 110
6.7 Processor Clocking Signals ................................................................................ 110
6.8 Testability Signals............................................................................................ 111
6.9 Error and Thermal Protection Signals.................................................................. 111
6.10 Power Sequencing Signals................................................................................. 112
6.11 Processor Power Rails....................................................................................... 113
6.12 Ground, Reserved and Non-Critical to Function (NCTF) Signals............................... 114
6.13 Processor Internal Pull-Up / Pull-Down Terminations............................................. 114
7 Electrical Specifications ......................................................................................... 115
7.1 Processor Power Rails....................................................................................... 115
7.1.1 Power and Ground Pins.......................................................................... 115
7.1.2 VCC Voltage Identification (VID).............................................................. 115
7.2 DC Specifications ............................................................................................. 116
7.2.1 Processor Power Rails DC Specifications ................................................... 116
7.2.1.1 Vcc DC Specifications............................................................... 116
7.2.1.2 VccGT DC Specifications............................................................ 118
7.2.1.3 VDDQ DC Specifications ........................................................... 120
7.2.1.4 VccSA DC Specifications ........................................................... 120
7.2.1.5 VccIO DC Specifications ........................................................... 121
7.2.1.6 VccST DC Specifications ........................................................... 121
7.2.1.7 VccPLL DC Specifications .......................................................... 121
7.2.2 Processor Interfaces DC Specifications..................................................... 122
7.2.2.1 DDR3L/-RS DC Specifications.................................................... 122
7.2.2.2 DDR4 DC Specifications............................................................ 124
7.2.2.3 PCI Express* Graphics (PEG) DC Specifications ........................... 124
7.2.2.4 Digital Display Interface (DDI) DC Specifications ......................... 126
7.2.2.5 embedded DisplayPort* (eDP*) DC Specification.......................... 126
7.2.2.6 CMOS DC Specifications ........................................................... 126
7.2.2.7 GTL and OD DC Specifications ................................................... 127
7.2.2.8 PECI DC Characteristics............................................................ 127
8 Package Mechanical Specifications......................................................................... 130
8.1 Package Mechanical Attributes ........................................................................... 130
8.2 Package Storage Specifications.......................................................................... 130
Figures
1-1 S-Processor Line Platforms ...................................................................................... 12
2-1 Intel® Flex Memory Technology Operations ............................................................... 24
2-2 Interleave (IL) and Non-Interleave (NIL) Modes Mapping............................................. 27
2-3 PCI Express* Related Register Structures in the Processor ........................................... 30
2-4 Video Analytics Common Use Cases .......................................................................... 35
2-5 Gen 9 LP Block Diagram .......................................................................................... 36
2-6 Processor Display Architecture (with 3 DDI ports as an example) .................................. 40
2-7 DisplayPort* Overview ............................................................................................ 41
2-8 HDMI* Overview .................................................................................................... 42
2-9 Example for PECI Host-Clients Connection ................................................................. 47
2-10 Example for PECI EC Connection .............................................................................. 48
3-1 Device to Domain Mapping Structures ....................................................................... 52
4-1 Processor Power States ........................................................................................... 63
4-2 Processor Package and IA Core C-States ................................................................... 64
4-3 Idle Power Management Breakdown of the Processor IA Cores ..................................... 67
4-4 Package C-State Entry and Exit ................................................................................ 71
5-1 Package Power Control............................................................................................ 83
5-2 Thermal Test Vehicle Thermal Profile for PCG 2015D Processor..................................... 96
5-3 Thermal Test Vehicle Thermal Profile for PCG 2015C Processor ..................................... 97
5-4 Thermal Test Vehicle Thermal Profile for PCG 2015B Processor ..................................... 98
5-5 Thermal Test Vehicle Thermal Profile for PCG 2015A Processor ..................................... 99
5-6 Thermal Test Vehicle (TTV) Case Temperature (TCASE) Measurement Location ............ 100
5-7 Digital Thermal Sensor (DTS) 1.1 Definition Points.................................................... 101
5-8 Digital Thermal Sensor (DTS) 1.1 Definition Points.................................................... 103
7-1 Input Device Hysteresis ........................................................................................ 128
Tables
1-1 Processor Lines ...................................................................................................... 11
1-2 Terminology .......................................................................................................... 15
1-3 Related Documents ................................................................................................ 17
2-1 Processor DRAM Support Matrix ............................................................................... 20
2-2 Supported DDR3L/-RS Non-ECC UDIMM Module Configurations
(S-Processor Line).................................................................................................. 21
2-3 Supported DDR3L/-RS ECC UDIMM Module Configurations
(S-Processor Line).................................................................................................. 21
2-4 Supported DDR3L/-RS Non-ECC SO-DIMM Module Configurations
(S-Processor Lines) ................................................................................................ 21
2-5 Supported DDR4 Non-ECC UDIMM Module Configurations
2-6 Supported DDR4 ECC UDIMM Module Configurations
2-7 Supported DDR4 Non-ECC SODIMM Module Configurations
2-8 Supported DDR4 ECC SODIMM Module Configurations
2-9 DRAM System Memory Timing Support ..................................................................... 23
2-10 Interleave (IL) and Non-Interleave (NIL) Modes Pin Mapping........................................ 26
2-11 PCI Express* Bifurcation and Lane Reversal Mapping .................................................. 28
2-12 PCI Express* Maximum Transfer Rates and Theoretical Bandwidth ................................ 29
2-13 Hardware Accelerated Video Decoding....................................................................... 33
2-14 Hardware Accelerated Video Encode ......................................................................... 33
7
2-15 Switchable/Hybrid Graphics Support..........................................................................35
2-16 GT2 Graphics Frequency (S-Processor Line) ...............................................................36
2-17 VGA and Embedded DisplayPort* (eDP*) Bifurcation Summary .....................................37
2-18 Embedded DisplayPort (eDP*)/DDI Ports Availability ...................................................37
2-19 Display Technologies Support ...................................................................................38
2-20 Display Resolutions and Link Bandwidth for Multi-Stream Transport Calculations ............38
2-21 Processor Supported Audio Formats over HDMI and DisplayPort* ..................................43
2-22 Maximum Display Resolution ....................................................................................43
2-23 S-Processor Line Display Resolution Configuration ......................................................44
2-24 S-Processor Line Display Resolution Configuration (DP@30 Hz) ....................................44
2-25 HDCP Display supported Implications Table ................................................................44
2-26 Display Link Data Rate Support ................................................................................45
2-27 Display Resolution and Link Rate Support ..................................................................45
2-28 Display Bit Per Pixel (BPP) Support...........................................................................46
2-29 Supported Resolutions1 for HBR (2.7 Gbps) by Link Width ..........................................46
2-30 Supported Resolutions1 for HBR2 (5.4 Gbps) by Link Width.........................................46
4-1 System States........................................................................................................64
4-2 Processor IA Core / Package State Support ................................................................65
4-3 Integrated Memory Controller (IMC) States ................................................................65
4-4 PCI Express* Link States .........................................................................................65
4-5 Direct Media Interface (DMI) States ..........................................................................65
4-6 G, S, and C Interface State Combinations ..................................................................66
4-7 Deepest Package C-State Available ...........................................................................73
4-8 Targeted Memory State Conditions............................................................................76
4-9 Package C-States with PCIe* Link States dependencies ...............................................77
5-1 Configurable TDP Modes ..........................................................................................84
5-2 TDP Specifications (S-Processor Line) ........................................................................93
5-3 Package Turbo Specifications (S-Processor Line) .........................................................93
5-4 Low Power and TTV Specifications (S-Processor Line) ..................................................94
5-5 TCONTROL Offset Configuration (S-Processor Line) ........................................................95
5-6 Thermal Test Vehicle Thermal Profile for PCG 2015D Processor .....................................96
5-7 Thermal Test Vehicle Thermal Profile for PCG 2015C Processor .....................................97
5-8 Thermal Test Vehicle Thermal Profile for PCG 2015B Processor .....................................98
5-9 Thermal Test Vehicle Thermal Profile for PCG 2015A Processor .....................................99
5-10 Digital Thermal Sensor (DTS) 1.1 Thermal Solution Performance Above TCONTROL .......... 102
5-11 Thermal Margin Slope ........................................................................................... 103
6-1 Signal Tables Terminology ..................................................................................... 105
6-2 DDR3L/-RS Memory Interface ................................................................................ 105
6-3 DDR4 Memory Interface ........................................................................................ 107
6-4 System Memory Reference and Compensation Signals ............................................... 108
6-5 PCI Express* Interface .......................................................................................... 108
6-6 DMI Interface Signals............................................................................................ 108
6-7 Reset and Miscellaneous Signals ............................................................................. 109
6-8 embedded DisplayPort* Signals .............................................................................. 109
6-9 Display Interface Signals ....................................................................................... 110
6-10 Processor Clocking Signals ..................................................................................... 110
6-11 Testability Signals................................................................................................. 111
6-12 Error and Thermal Protection Signals....................................................................... 111
6-13 Power Sequencing Signals ..................................................................................... 112
6-14 Processor Power Rails Signals................................................................................. 113
6-15 GND, RSVD, and NCTF Signals ............................................................................... 114
6-16 Processor Internal Pull-Up / Pull-Down Terminations.................................................. 114
7-1 Processor Power Rails............................................................................................ 115
7-2 Processor IA core (Vcc) Active and Idle Mode DC Voltage and Current Specifications...... 116
7-3 Processor Graphics (VccGT) Supply DC Voltage and Current Specifications .................... 118
7-4 Memory Controller (VDDQ) Supply DC Voltage and Current Specifications .................... 120
7-5 System Agent (VccSA) Supply DC Voltage and Current Specifications .......................... 120
7-6 Processor I/O (VccIO) Supply DC Voltage and Current Specifications ........................... 121
7-7 Vcc Sustain (VccST) Supply DC Voltage and Current Specifications ............................. 121
7-8 Processor PLL (VccPLL) Supply DC Voltage and Current Specifications ......................... 121
7-9 Processor PLL_OC (VccPLL_OC) Supply DC Voltage and Current Specifications.............. 122
7-10 DDR3L/-RS Signal Group DC Specifications .............................................................. 122
7-11 DDR4 Signal Group DC Specifications...................................................................... 124
7-12 PCI Express* Graphics (PEG) Group DC Specifications ............................................... 124
7-13 Digital Display Interface Group DC Specifications (DP/HDMI)...................................... 126
7-14 embedded DisplayPort* (eDP*) Group DC Specifications............................................ 126
7-15 CMOS Signal Group DC Specifications ..................................................................... 126
7-16 GTL Signal Group and Open Drain Signal Group DC Specifications............................... 127
7-17 PECI DC Electrical Limits ....................................................................................... 127
8-1 Package Mechanical Attributes ............................................................................... 130
8-2 Package Storage Specifications .............................................................................. 130
9
Revision History
Revision
Description Revision Date
Number
001 • Initial release August 2016

• Minor updates throughout for clarity
• Added support for the following processors
— 7th Generation Intel® Core™ processors i7-7600U, i5-7300U, i7-7Y75, i5 -7Y57, i7-
7660U, i7-7567U, i7-7560U, i5-7360U, i5-7287U, i5-7267U, i5-7260U, i3-7167U
— Intel® Celeron® processors 3965U, 3865U
— Intel® Pentium® processors 4415U, 4410Y
• Supporting new processor SKUs, added support for on-package cache, GT3
• Updated table 2-24, “HDCP Display supported Implications” maximum resolutions for
HDMI2.0 changed from 4K@30 to 4K@60.
002 • Updated Section 5.1, “Processor Thermal Management”. January 2017
• Updated Section 5.1.1-”Thermal Considerations”.
• Updated Section 5.1.5.1.1, “TCC Activation Offset”.
• Updated table 5-2, “TDP Specifications (U/Y-Processor Line)”.
• Updated table 5-3, “Package Turbo Specifications (U/Y-Processor Line)” + Added note.
• Updated Table 7-2, “Processor IA core (Vcc) Active and Idle Mode DC Voltage and Current
Specifications”.
• Updated Table 7-3, “Processor Graphics (VccGT and VccGTX) Supply DC Voltage and Current
Specifications”.
• Updated table 7-5, “System Agent (VccSA) Supply DC Voltage and Current Specifications”.
• Added support for 8th Generation Intel® Processor Family for U Quad Core Platforms
• Updated Table 2-18, “Display Resolutions and Link Bandwidth for Multi-Stream Transport
Calculations”.
• Updated TOB parameter in Chapter 7.
003 • Updated Table 7-2, “Processor IA core (Vcc) Active and Idle Mode DC Voltage and Current August 2017
Specifications”, Note 14.
• Updated Table 7-3, “Processor Graphics (VccGT and VccGTX) Supply DC Voltage and Current
Specifications”, Note 10.
• Updated Table 7-5, “System Agent (VccSA) Supply DC Voltage and Current Specifications“.
Added Note 8.
004 • Added Section 1.6,”Operating Systems Support” September 2018
005 • Updated document title December 2018
006 • Updated Section 1.6,”Operating Systems Support” January 2019
007 • Updated Section 7.1.2,”VCC Voltage Identification (VID)” August 2020
008 • Added note in Section 1.6,”Operating Systems Support” February 2022
1 Introduction
Processor Volatility statement:
Intel® Kaby Lake processor families does not retain any end user data when powered
down and/or when the processor is physically removed.
Note: Power down refers to state which all processor power rails are off.
The 7th Generation Intel® Core™ processor, Intel® Pentium® processor, Intel®
Celeron® processor families and 8th Generation Intel® Processor Family for U 4-Core
and Y-2 Core family are 64-bit, multi-core processors built on 14-nanometer process
technology.
The U-Processor Line and Y-Processor Line are offered in a 1-Chip Platform that
includes the 7th Generation Intel® processor families I/O Platform Controller Hub
(PCH) die on the same package as the processor die. See the following figure.
Some of the processor SKUs are offered with On-Package Cache.
The following table describes the processor lines covered in this document.
Table 1-1. Processor Lines

Processor Graphics On-Package Platform
Processor Line1 Package Base TDP
IA Cores Configuration Cache Type
KBL Y-Processor Line BGA1515 4.5W 2 GT2 N/A 1-Chip
KBL Y-Processor Line

BGA1515 4.5W 2 GT2 N/A 1-Chip
With Integrated HDCP2.2
KBL Y-Pentium/Celeron
BGA1515 6W 2 GT2 N/A 1-Chip
Processor Line
AML-Y Processor Line (2-

Cores)
KBL U-Processor Line BGA1356 15W 2 GT2 N/A 1-Chip
KBL U-Processor Line 15W 2 GT2 N/A 1-Chip

BGA1356
With Integrated HDCP2.2 15W, 28W 2 GT3 64 MB 1-Chip
KBL U-Pentium/Celeron
Processor Line
Throughout this document, the 7th Generation Intel® Core™ processor, Intel®
Pentium® processor, Intel® Celeron® processor, and 8th Generation Intel® Processor
Family for U 4-Core family (known as KBL-U Refresh) and Y 2-Core (named Amber
Lake)may be referred to simply as “processor”. The 7th Generation Intel® processor
families I/O and 8th Generation Intel® Processor Family for U 4-Core and Y 2-Core
family I/O Platform Controller Hub (PCH) may be referred to simply as “PCH”.
This document is for the following U/Y-Processor SKUs:

• 7th Generation Intel® Core™ processor family U-Processors
11
— i7-7500U, i5-7200U, i3-7100U, i7-7600U, i5-7300U, i7-7660U, i7-7567U,
i7-7560U, i5-7360U, i5-7287U, i5-7267U, i5-7260U, i3-7167U
• 7th Generation Intel® Core™ processor family Y-Processors
— i7-7Y75, i5-7Y54, m3-7Y30, i7-7Y75 with vPro™ support, i5-7Y57
• Intel® Pentium® processors
— 4415U, 4410Y
• Intel® Celeron® processors
— 3965U, 3865U
• 8th Generation Intel® Processor Family for U Quad Core family
— i7-8550U, i5-8250U
Refer to the processor Specification Update for additional SKU details.
Figure 1-1. KBL Y/U/U 4-Core and AML-Y22 Processor Line Platforms
Digital Display DDIx2 DDR Ch.A
Interface x 2 DDR Ch.B System Memory
embedded eDP*
DisplayPort*
PCIE/SATA
CSI2 SSD Drive
Cameras
USB 2.0/3.0
SPI USB 2.0/3.0 Ports
BIOS/FW Flash
HDA
SPI
HD Audio Codec
TPM
PECI/MBus
SPI/ I2C/ USB2 EC
Touch Screen eSPI
PCI Express* 3.0 x12
USB 2.0
USB 2.0
SMBus 2.0
PCIE
Fingerprint Sensor
I 2C/UART/ USB BT/3G/4G Wi-Fi

Gyro
Gigabit Network
NFC
Connection
GPS
SD Slot
Magnetometer
Sensors Hub
GPIO
Touch Pad
Accelometer
Ambient Light
Sensor
1.1 Supported Technologies
• Intel® Virtualization Technology (Intel® VT)
• Intel® Active Management Technology 11.0 (Intel® AMT 11.0)
• Intel® Trusted Execution Technology (Intel® TXT)
• Intel® Streaming SIMD Extensions 4.2 (Intel® SSE4.2)
• Intel® Hyper-Threading Technology (Intel® HT Technology)
• Intel® 64 Architecture
• Execute Disable Bit
• Intel® Turbo Boost Technology 2.0
• Intel® Advanced Vector Extensions 2 (Intel® AVX2)
• Intel® Advanced Encryption Standard New Instructions (Intel® AES-NI)
• PCLMULQDQ (Perform Carry-Less Multiplication Quad word) Instruction
• Intel® Secure Key
• Intel® Transactional Synchronization Extensions (Intel® TSX-NI)
• PAIR – Power Aware Interrupt Routing
• SMEP – Supervisor Mode Execution Protection
• Intel® Boot Guard
• On-package Cache Memory
• Intel® Software Guard Extensions (Intel® SGX)
• Intel® Memory Protection Extensions (Intel® MPX)
• GMM Scoring Accelerator
• Intel® Image Signal Processor (Intel® ISP)
• Intel® Processor Trace
• High-bandwidth Digital Content Protection (HDCP)
Note: The availability of the features may vary between processor SKUs.
Refer to Chapter 3, “Technologies” for more information.
1.2 Power Management Support

1.2.1 Processor Core Power Management
• Full support of ACPI C-states as implemented by the following processor C-states:
— C0, C1, C1E, C3, C6, C7, C8, C9, C10
• Enhanced Intel SpeedStep® Technology
Refer to Section 4.2, “Processor IA Core Power Management” for more information.
13
1.2.2 System Power Management
• S0/S0ix, S3, S4, S5
Refer to Chapter 4, “Power Management” for more information.
1.2.3 Memory Controller Power Management

• Disabling Unused System Memory Outputs
• DRAM Power Management and Initialization
• Initialization Role of CKE
• Conditional Self-Refresh
• Dynamic Power Down
• DRAM I/O Power Management
• DDR Electrical Power Gating (EPG)
• Power training
Refer to Section 4.3, “Integrated Memory Controller (IMC) Power Management” for
more information.
1.2.4 Processor Graphics Power Management

1.2.4.1 Memory Power Savings Technologies
• Intel Rapid Memory Power Management (Intel RMPM)
• Intel Smart 2D Display Technology (Intel S2DDT)
1.2.4.2 Display Power Savings Technologies

• Intel (Seamless & Static) Display Refresh Rate Switching (DRRS) with eDP port
• Intel Automatic Display Brightness
• Smooth Brightness
• Intel Display Power Saving Technology (Intel DPST 6)
• Panel Self-Refresh 2 (PSR 2)
• Low Power Single Pipe (LPSP)
1.2.4.3 Graphics Core Power Savings Technologies

• Intel Graphics Dynamic Frequency
• Intel Graphics Render Standby Technology (Intel GRST)
• Dynamic FPS (Intel DFPS)
Refer to Section 4.4, “Processor Graphics Power Management” for more information.
1.3 Thermal Management Support
• Digital Thermal Sensor
• Intel Adaptive Thermal Monitor
• THERMTRIP# and PROCHOT# support
• On-Demand Mode
• Memory Open and Closed Loop Throttling
• Memory Thermal Throttling
• External Thermal Sensor (TS-on-DIMM and TS-on-Board)
• Render Thermal Throttling
• Fan speed control with DTS
• Intel Turbo Boost Technology 2.0 Power Control
Refer to Chapter 5, “Thermal Management” for more information.
1.4 Package Support

The processor is available in the following packages:
• A 20.5 mm x 16.5 mm BGA package (BGA1515) for Y/ AML- Y22 Processor Line
• A 42 mm x 24 mm BGA package (BGA1356) for U/U-4 Core Processor Line
1.5 Processor Testability

An XDP on-board connector is warmly recommended to enable full debug capabilities.
For the processor SKUs, a merged XDP connector is highly recommended to enable
lower C-state debug.
Note: When separate XDP connectors will be used at C8–C10 states, the processor will need
to be waked up using the PCH.
The processor includes boundary-scan for board and system level testability.
15
1.6 Operating Systems Support
(7th Gen)
Windows* 10
Processor Line OS X Linux* OS Chrome* OS
64-bit
U-processor line Yes Yes Yes Yes

Y-processor line Yes Yes Yes Yes
(8th Gen)
Windows* 10
Processor Line OS X Linux* OS Chrome* OS
64-bit
U-processor line Yes Yes Yes Yes

Y-processor line Yes Yes Yes Yes
Note: Refer to OS Vendor site for more information regarding latest OS revision support.
1.7 Terminology
Table 1-2. Terminology
Term Description
4K Ultra High Definition (UHD)
AES Advanced Encryption Standard
AGC Adaptive Gain Control
BLT Block Level Transfer
BPP Bits per pixel
CDR Clock and Data Recovery
CTLE Continuous Time Linear Equalizer
DDI Digital Display Interface for DP or HDMI/DVI
DDR3 Third-generation Double Data Rate SDRAM memory technology
DDR3L/RS DDR3 Low Voltage Reduced Standby Power
Fourth-Generation Double Data Rate SDRAM Memory Technology

DDR4/DDR4-RS
RS - Reduced Standby Power
DFE decision feedback equalizer
DMA Direct Memory Access
DMI Direct Media Interface
DP DisplayPort*
DTS Digital Thermal Sensor
eDP* embedded DisplayPort*
EU Execution Unit in the Processor Graphics
GSA Graphics in System Agent
HDCP High-bandwidth Digital Content Protection
HDMI* High Definition Multimedia Interface
IMC Integrated Memory Controller
Intel® 64 Technology 64-bit memory extensions to the IA-32 architecture
Intel® DPST Intel Display Power Saving Technology

®
Intel PTT Intel Platform Trust Technology
Intel® TSX-NI Intel Transactional Synchronization Extensions
Intel® TXT Intel Trusted Execution Technology
Intel Virtualization Technology. Processor virtualization, when used in conjunction

Intel® VT with Virtual Machine Monitor software, enables multiple, robust independent
software environments inside a single platform.
Intel Virtualization Technology (Intel VT) for Directed I/O. Intel VT-d is a hardware
assist, under system software (Virtual Machine Manager or OS) control, for enabling
Intel® VT-d
I/O device virtualization. Intel VT-d also brings robust security by providing
protection from errant DMAs by using DMA remapping, a key feature of Intel VT-d.
IOV I/O Virtualization
ISP Image Signal Processor
Low Frequency Mode. corresponding to the Enhanced Intel SpeedStep®

LFM
Technology’s lowest voltage/frequency pair. It can be read at MSR CEh [47:40].
LLC Last Level Cache
LPDDR3 Low Power Third-generation Double Data Rate SDRAM memory technology
17
Term Description
Low-Power Mode.The LPM Frequency is less than or equal to the LFM Frequency. The
LPM LPM TDP is lower than the LFM TDP as the LPM configuration limits the processor to
single thread operation
LPSP Low-Power Single Pipe
Lowest Supported Frequency.This frequency is the lowest frequency where

LSF
manufacturing confirms logical functionality under the set of operating conditions.
Multi Chip Package - includes the processor and the PCH. In some SKUs it might
MCP
have additional On-Package Cache.
Minimum Frequency Mode. MFM is the minimum ratio supported by the processor
MFM
and can be read from MSR CEh [55:48].
MLC Mid-Level Cache
Non-Critical to Function. NCTF locations are typically redundant ground or non-

NCTF critical reserved balls/lands, so the loss of the solder joint continuity at end of life
conditions will not affect the overall product functionality.
OPC On-Package Cache
PAG Platform Power Architecture Guide (formerly PDDG)
Platform Controller Hub. The chipset with centralized platform capabilities including
the main I/O interfaces along with display connectivity, audio features, power
PCH
management, manageability, security, and storage features. The PCH may also be
referred as “chipset”.
PECI Platform Environment Control Interface
PEG PCI Express Graphics
PL1, PL2, PL3 Power Limit 1, Power Limit 2, Power Limit 3
Processor The 64-bit multi-core component (package)
The term “processor core” refers to Si die itself, which can contain multiple
Processor Core execution cores. Each execution core has an instruction cache, data cache, and 256-
KB L2 cache. All execution cores share the LLC.
Processor Graphics Intel Processor Graphics
PSR Panel Self-Refresh
A unit of DRAM corresponding to four to eight devices in parallel, ignoring ECC.

Rank
These devices are usually, but not always, mounted on a single side of a SODIMM.
SCI System Control Interrupt. SCI is used in the ACPI protocol.
SDP Scenario Design Power
SGX Software Guard Extension
SHA Secure Hash Algorithm
SSC Spread Spectrum Clock
A non-operational state. The processor may be installed in a platform, in a tray, or

loose. Processors may be sealed in packaging or exposed to free air. Under these
conditions, processor landings should not be connected to any supply voltages, have
Storage Conditions any I/Os biased, or receive any clocks. Upon exposure to “free air” (that is, unsealed
packaging or a device removed from packaging material), the processor should be
handled in accordance with moisture sensitivity labeling (MSL) as indicated on the
packaging material.
STR Suspend to RAM
TAC Thermal Averaging Constant
TCC Thermal Control Circuit
TDP Thermal Design Power
TOB Tolerance Budget
TTV TDP Thermal Test Vehicle TDP
VCC Processor core power supply
Term Description
VCCGT Processor Graphics Power Supply
VCCIO I/O Power Supply
VCCSA System Agent Power Supply
VCCST Vcc Sustain Power Supply
VDDQ DDR Power Supply
VLD Variable Length Decoding
VPID Virtual Processor ID
VSS Processor Ground
1.8 Related Documents

Table 1-3. Related Documents
Document Document Number / Location
®
7th Generation Intel Processor Families for U/Y-Platforms Datasheet
334662
Volume 2 of 2
7th Generation Intel® Processor Families Specification Update 334663
7th Generation Intel® Processor Families I/O Platform Datasheet Volume 1

334658
of 2
7th Generation Intel® Processor Families I/O Platform Datasheet Volume 2

334659
of 2
Advanced Configuration and Power Interface 3.0 http://www.acpi.info/
DDR3L SDRAM Specification http://www.jedec.org
LPDDR3 Specification http://www.jedec.org
DDR4 Specification http://www.jedec.org
High Definition Multimedia Interface specification revision 1.4 http://www.hdmi.org/manufac-

turer/specification.aspx
Embedded DisplayPort* Specification revision 1.4 http://www.vesa.org/

vesa.standards/
DisplayPort* Specification revision 1.2 http://www.vesa.org/

vesa.standards/
PCI Express* Base Specification Revision 3.0 http://www.pcisig.com/specifi-

cations
Intel® 64 and IA-32 Architectures Software Developer's Manuals http://www.intel.com/products/

processor/manuals/index.htm
19
2 Interfaces
2.1 System Memory Interface

• Two channels of DDR3L/-RS, LPDDR3 and DDR4 memory with a maximum of two
DIMMs per channel. DDR technologies, number of DIMMs per channel, number of
ranks per channel are SKU dependent.
• UDIMM, SO-DIMM, and Memory Down support (based on SKU)
• Single-channel and dual-channel memory organization modes
• Data burst length of eight for all memory organization modes
• DDR3L/-RS I/O Voltage of 1.35V - based on Processor Line
• LPDDR3 I/O voltage of 1.2V
• DDR4 I/O Voltage of 1.2V
• 64-bit wide channels
• Non-ECC UDIMM and SODIMM DDR4/DDR3L/-RS support (based on SKU)
• Theoretical maximum memory bandwidth of:
— 20.8 GB/s in dual-channel mode assuming 1333 MT/s
Note: Memory down of all technologies (DDR3L/DDR4/LPDDR3) should be implemented

homogeneously, which means that all DRAM devices should be from the same vendor
and have the same part number. Implementing a mix of DRAM devices may cause
serious signal integrity and functional issues.
2.1.1 System Memory Technology Supported

The Integrated Memory Controller (IMC) supports DDR3L/-RS, LPDDR3 andDDR4
protocols with two independent, 64-bit wide channels.
Table 2-1. Processor DRAM Support Matrix

Processor Line DPC1 DDR3L/-RS [MT/s] DDR4 [MT/s] LPDDR3 [MT/s]
U-Processor Line 1 1333/1600 1866/2133 1600/1866
Y/AML-Y22 Processor
1 N/A N/A 1600/1866
Line
Notes:
1. DPC = DIMM Per Channel
2. N/A
3. N/A
21
• DDR3L/-RS Data Transfer Rates:
— 1333 MT/s (PC3-10600)
— 1600 MT/s (PC3-12800)
• DDR4 Data Transfer Rates:
— 1866 MT/s (PC4-1866)
— 2133 MT/s (PC4-2133)
• LPDDR3 Data Transfer Rates:
— 1600 MT/s
— 1866 MT/s
• SODIMM Modules:
DDR3L/-RS SODIMM/UDIMM Modules:
— Standard 4-Gb technology and addressing are supported for x8 and x16
devices.
DDR4 SODIMM/UDIMM Modules:
— Standard 4-Gb and 8-Gb technologies and addressing are supported for x8 and
x16 devices.
There is no support for memory modules with different technologies or capacities
on opposite sides of the same memory module. If one side of a memory module is
populated, the other side is either identical or empty.
• DDR3L/-RS Memory Down: Single and dual rank x8, x16 (based on SKU)
• DDR4 Memory Down: Single rank x8, x16 (based on SKU)
• LPDDR3 Memory Down: Single and Dual Rank x32/x64 (based on SKU)
2.1.1.1 DDR3L/-RS Supported Memory Modules and Devices
Table 2-2. Supported DDR3L/-RS Non-ECC SO-DIMM Module Configurations

(U-Processor Line)
# of # of
Raw DRAM # of
DIMM DRAM # of Row/Col Banks Page
Card Device DRAM
Capacity Organization Ranks Address Inside Size
Version Technology Devices
Bits DRAM
A 4GB 4Gb 256M x 16 8 2 15/10 8 8K
B 4GB 4Gb 512M x 8 8 1 16/10 8 8K
C 2GB 4Gb 256M x 16 4 1 15/10 8 8K
F 8GB 4Gb 512M x 8 16 2 16/10 8 8K
Table 2-3. Supported DDR3L/-RS Memory Down Module Configurations

(U-Processor Line)
# of
PKG Type Max DRAM # of
DRAM Die Dies Per PKGs per Banks Page
(Dies bits x System Device DRAM
Organization Density Channel channel Inside Size
PKG bits) Capacity Technology Ranks
DRAM
SDP 8x8 16GB 4Gb 512M x 8 4 Gb 16 16 1 16 8K
SDP 16x16 8GB 4Gb 256M x 16 4 Gb 8 8 1 16 8K
DDP 16x16 8GB 8Gb 256M x 16 4 Gb 8 4 2 16 8K
Note: Maximum system capacity is referred to 2 channels populated with 2 ranks per channel.
2.1.1.2 DDR4 Supported Memory Modules and Devices
Table 2-4. Supported DDR4 Non-ECC SODIMM Module Configurations

(U/U-4 Core Processor Line)
# of # of
Raw DRAM # of
DIMM DRAM # of Row/Col Banks Page
Card Device DRAM
Capacity Organization Ranks Address Inside Size
Version Technology Devices
Bits DRAM
A 4GB 4Gb 512M x 8 8 1 15/10 16 8K
A 8GB 8Gb 1024M x 8 8 1 16/10 16 8K
B 8GB 4Gb 512M x 8 16 2 15/10 16 8K
B 16GB 8Gb 1024M x 8 16 2 16/10 16 8K
C 2GB 4Gb 256M x 16 4 1 15/10 8 8K
C 4GB 8Gb 512M x 16 4 1 16/10 8 8K

E 8GB 4Gb 512M x 8 16 2 15/10 16 8K
E 16GB 8Gb 1024M x 8 16 2 16/10 16 8K
Table 2-5. Supported DDR4 Memory Down Device Configurations

(U/U-4 Core Processor Line)
PKG Type
Max DRAM Rank PKGs Physical Banks
(Die bits PKG Die Die Per Page
System Organization Per Per Device Inside
x PKG Density Density Channel Size
Capacity / PKG Type Channel channel Rank DRAM
bits)
16GB SDP 8x8 512M x 8 4Gb 4Gb 16 2 16 1 16 8K
32GB SDP 8x8 1024M x 8 8Gb 8Gb 16 2 16 1 16 8K
4GB SDP 16x16 256M x 16 4Gb 4Gb 4 1 4 1 8 8K
8GB SDP 16x16 512M x 16 8Gb 8Gb 4 1 4 1 8 8K
16GB DDP 8x16 1024M x 16 16Gb 8Gb 8 1 4 1 16 8K
Notes:
1. The maximum system capacity for x8 devices refers to 2 channels, 2 ranks systems
2. The maximum system capacity for x16 devices refers to 2 channels, 1 rank systems
2.1.1.3 LPDDR3 Supported Memory Devices
Table 2-6. Supported LPDDR3 x32 DRAMs Configurations

(KBL Y/H/U/U-4 Core and AML-Y22 Processor Lines) (Sheet 1 of 2)
PKG Type
Max DRAM Physical Banks
(Dies bits Die PKG Dies Per PKGs Per Page
System Organization Device Inside
x PKG Density Density Channel Channel Size
Capacity / PKG Type Rank DRAM
bits)
2 GB SDP 32x32 128Mx32 4 Gb 4Gb 2 2 1 8 8K
4 GB DDP 32x32 256Mx32 4 Gb 8Gb 4 2 2 8 8K
8 GB QDP 16x32 512Mx32 4 Gb 16Gb 8 2 2 8 8K
4 GB SDP 32x32 256Mx32 8 Gb 8Gb 2 2 1 8 8K
8 GB DDP 32x32 512Mx32 8 Gb 16Gb 4 2 2 8 8K
16 GB QDP 16x32 1024Mx32 8 Gb 32Gb 8 2 2 8 8K
23
(KBL Y/H/U/U-4 Core and AML-Y22 Processor Lines) (Sheet 2 of 2)
PKG Type
bits)
Notes:
1. x32 devices are 178 balls.
2. SDP = Single Die Package, DDP = Dual Die Package, QDP = 4 Die Package

(KBL Y/U and AML-Y22 Processor Lines)
PKG Type
bits)
2 GB DDP 32x64 128Mx64 4 Gb 8 Gb 2 1 1 8 8K
4 GB QDP 32x64 256Mx64 4 Gb 16 Gb 4 1 2 8 8K
4 GB DDP 32x64 256Mx64 8 Gb 16 Gb 2 1 1 8 8K
8 GB QDP 32x64 512Mx64 8 Gb 32 Gb 4 1 2 8 8K
Notes:
1. x64 devices are 253 balls.
2. SDP = Single Die Package, DDP = Dual Die Package, QDP = 4 Die Package
2.1.2 System Memory Timing Support

The IMC supports the following DDR Speed Bin, CAS Write Latency (CWL), and
command signal mode timings on the main memory interface:
• tCL = CAS Latency
• tRCD = Activate Command to READ or WRITE Command delay
• tRP = PRECHARGE Command Period
• CWL = CAS Write Latency
• Command Signal modes:
— 1N indicates a new DDR3L/DDR4 command may be issued every clock
— 2N indicates a new DDR3L/DDR4 command may be issued every 2 clocks
Table 2-8. DRAM System Memory Timing Support

DPC
DRAM Transfer tRCD CMD
tCL (tCK) tRP (tCK) CWL (tCK) (SODIMM
Device Rate (MT/s) (tCK) Mode
Only)
1333 8/9 8/9 8/9 7 1 or 2 1N/2N

DDR3L/-RS
1600 10/11 10/11 10/11 8 1 or 2 1N/2N
DDR4 1866 13/14 12/13/14 13/14 10/12/12 1 or 2 1N/2N
DDR4 2133 15/16 14/15/16 15/16 11/14/14 1 or 2 1N/2N
Table 2-9. DRAM System Memory Timing Support (LPDDR3)
DRAM Transfer tRPpb1 tRPab2
tCL (tCK) tRCD (tCK) CWL (tCK)
Device Rate (MT/s) (tCK) (tCK)
LPDDR3 1600 12 15 15 18 9
LPDDR3 1866 14 17 17 20 11
Notes:
1. tRPpb = Row Precharge typical time (single bank)
2. tRPab = Row Precharge typical time (all banks)
2.1.3 System Memory Organization Modes

The IMC supports two memory organization modes, single-channel and dual-channel.
Depending upon how the DDR Schema and DIMM Modules are populated in each
memory channel, a number of different configurations can exist.
Single-Channel Mode
In this mode, all memory cycles are directed to a single channel. Single-Channel mode
is used when either the Channel A or Channel B DIMM connectors are populated in any
order, but not both.
Dual-Channel Mode – Intel® Flex Memory Technology Mode
The IMC supports Intel Flex Memory Technology Mode. Memory is divided into a
symmetric and asymmetric zone. The symmetric zone starts at the lowest address in
each channel and is contiguous until the asymmetric zone begins or until the top
address of the channel with the smaller capacity is reached. In this mode, the system
runs with one zone of dual-channel mode and one zone of single-channel mode,
simultaneously, across the whole memory array.
Note: Channels A and B can be mapped for physical channel 0 and 1 respectively or vice
versa. However, channel A size should be greater or equal to channel B size.
25
Figure 2-1. Intel® Flex Memory Technology Operations
TOM
C Non interleaved
access
B
C
Dual channel
interleaved access
B B
B
CH A CH B
CH A and CH B can be configured to be physical channels 0 or 1

B – The largest physical memory amount of the smaller size memory module
C – The remaining physical memory amount of the larger size memory module
Dual-Channel Symmetric Mode (Interleaved Mode)

Dual-Channel Symmetric mode, also known as interleaved mode, provides maximum
performance on real world applications. Addresses are ping-ponged between the
channels after each cache line (64-byte boundary). If there are two requests, and the
second request is to an address on the opposite channel from the first, that request can
be sent before data from the first request has returned. If two consecutive cache lines
are requested, both may be retrieved simultaneously, since they are ensured to be on
opposite channels. Use Dual-Channel Symmetric mode when both Channel A and
Channel B DIMM connectors are populated in any order, with the total amount of
memory in each channel being the same.
When both channels are populated with the same memory capacity and the boundary
between the dual channel zone and the single channel zone is the top of memory, IMC
operates completely in Dual-Channel Symmetric mode.
Note: The DRAM device technology and width may vary from one channel to the other.
2.1.4 System Memory Frequency

In all modes, the frequency of system memory is the lowest frequency of all memory
modules placed in the system, as determined through the SPD registers on the
memory modules. The system memory controller supports up to two DIMM connectors
per channel. If DIMMs with different latency are populated across the channels, the
BIOS will use the slower of the two latencies for both channels. For Dual-Channel
modes both channels should have a DIMM connector populated. For Single-Channel
mode, only a single channel can have a DIMM connector populated.
2.1.5 Technology Enhancements of Intel® Fast Memory Access
(Intel® FMA)
The following sections describe the Just-in-Time Scheduling, Command Overlap, and
Out-of-Order Scheduling Intel FMA technology enhancements.
Just-in-Time Command Scheduling
The memory controller has an advanced command scheduler where all pending
requests are examined simultaneously to determine the most efficient request to be
issued next. The most efficient request is picked from all pending requests and issued
to system memory Just-in-Time to make optimal use of Command Overlapping. Thus,
instead of having all memory access requests go individually through an arbitration
mechanism forcing requests to be executed one at a time, they can be started without
interfering with the current request allowing for concurrent issuing of requests. This
allows for optimized bandwidth and reduced latency while maintaining appropriate
command spacing to meet system memory protocol.
Command Overlap
Command Overlap allows the insertion of the DRAM commands between the Activate,
Pre-charge, and Read/Write commands normally used, as long as the inserted
commands do not affect the currently executing command. Multiple commands can be
issued in an overlapping manner, increasing the efficiency of system memory protocol.
Out-of-Order Scheduling
While leveraging the Just-in-Time Scheduling and Command Overlap enhancements,
the IMC continuously monitors pending requests to system memory for the best use of
bandwidth and reduction of latency. If there are multiple requests to the same open
page, these requests would be launched in a back to back manner to make optimum
use of the open memory page. This ability to reorder requests on the fly allows the IMC
to further reduce latency and increase bandwidth efficiency.
2.1.6 Data Scrambling

The system memory controller incorporates a Data Scrambling feature to minimize the
impact of excessive di/dt on the platform system memory VRs due to successive 1s and
0s on the data bus. Past experience has demonstrated that traffic on the data bus is not
random and can have energy concentrated at specific spectral harmonics creating high
di/dt which is generally limited by data patterns that excite resonance between the
package inductance and on die capacitances. As a result, the system memory controller
uses a data scrambling feature to create pseudo-random patterns on the system
memory data bus to reduce the impact of any excessive di/dt.
2.1.7 DDR I/O Interleaving

The processor supports I/O interleaving, which has the ability to swap DDR bytes for
routing considerations. BIOS configures the I/O interleaving mode before DDR training.
Note: The KBL Y and AML-Y22 Processor Lines package is optimized only for Non-Interleaving
(NIL) mode.
There are 2 supported modes:

• Interleave (IL)
27
• Non-Interleave (NIL)
The following table and figure describe the pin mapping between the IL and NIL modes.
Table 2-10. Interleave (IL) and Non-Interleave (NIL) Modes Pin Mapping
IL NIL
Channel Byte Channel Byte
DDR0 Byte0 DDR0 Byte0
Figure 2-2. Interleave (IL) and Non-Interleave (NIL) Modes Mapping
Interleave back to back Non-Interleave side by side
Ch B Ch B Ch B Ch B
DQ/DQS CMD/CTRL DQ/DQS CMD/CTRL
Ch A Ch B
DQ/DQS DQ/DQS
Ch A Ch A Ch A Ch A
DQ/DQS CMD/CTRL DQ/DQS CMD/CTRL
Ch A SoDIMM Ch A SoDIMM Ch B SoDIMM
Ch B SoDIMM
2.1.8 Data Swapping

By default, the processor supports on-board data swapping in two manners (for all
segments and DRAM technologies):
• byte (DQ+DQS) swapping between bytes in the same channel.
• bit swapping within specific byte.
2.1.9 DRAM Clock Generation
Every supported rank has a differential clock pair. There are a total of four clock pairs
driven directly by the processor to DRAM.
2.1.10 DRAM Reference Voltage Generation

The memory controller has the capability of generating the DDR3L/-RS, LPDDR3 and
DDR4 Reference Voltage (VREF) internally for both read and write operations. The
generated VREF can be changed in small steps, and an optimum VREF value is
determined for both during a cold boot through advanced training procedures in order
to provide the best voltage to achieve the best signal margins.
2.1.11 Data Swizzling

All Processor Lines does not have die-to-package DDR swizzling.
2.2 Processor Graphics

Note: Processor graphics is not supported on the X-Processor.
The processor graphics is based on Gen 9 LP (generation 9 Low Power) graphics core
architecture that enables substantial gains in performance and lower-power
consumption over prior generations. Gen 9 LP architecture supports up to 72 Execution
Units (EUs) with On-Package Cache depending on the processor SKU.
The processor graphics architecture delivers high dynamic range of scaling to address
segments spanning low power to high power, increased performance per watt, support
for next generation of APIs. Gen 9 LP scalable architecture is partitioned by usage
domains along Render/Geometry, Media, and Display. The architecture also delivers
very low-power video playback and next generation analytic and filters for imaging-
related applications. The new Graphics Architecture includes 3D compute elements,
Multi-format HW assisted decode/encode pipeline, and Mid-Level Cache (MLC) for
superior high definition playback, video quality, and improved 3D performance and
media.
The Display Engine handles delivering the pixels to the screen. GSA (Graphics in
System Agent) is the primary channel interface for display memory accesses and PCI-
like traffic in and out.
The display engine supports the latest display standards such as eDP* 1.4, DP* 1.2,
HDMI* 1.4, HW support for blend, scale, rotate, compress, high PPI support, and
advanced SRD2 display power management.
2.2.1 Operating Systems Support

Windows* 10 x64,OS X, Linux* OS, Chrome* OS.
Note: The processor supports only 64-bit operating systems.
29
2.2.2 API Support (Windows*)
• Direct3D* 2015, Direct3D 11.2, Direct3D 11.1, Direct3D 9, Direct3D 10, Direct2D
• OpenGL* 4.4
• OpenCL* 2.1, OpenCL 2.0, OpenCL 1.2
DirectX* extensions:
• PixelSync, InstantAccess, Conservative Rasterization, Render Target Reads,
Floating-point De-norms, Shared Virtual memory, Floating Point atomics, MSAA
sample-indexing, Fast Sampling (Coarse LOD), Quilted Textures, GPU Enqueue
Kernels, GPU Signals processing unit. Other enhancements include color
compression.
Gen 9 LP architecture delivers hardware acceleration of Direct X* 11 Render pipeline

comprising of the following stages: Vertex Fetch, Vertex Shader, Hull Shader,
Tesselation, Domain Shader, Geometry Shader, Rasterizer, Pixel Shader, Pixel Output.
2.2.3 Media Support (Intel® QuickSync & Clear Video

Technology HD)
Gen 9 LP implements multiple media video codecs in hardware as well as a rich set of
image processing algorithms.
Note: All supported media codecs operate on 8 bpc, YCbCr 4:2:0 video profiles.
2.2.3.1 Hardware Accelerated Video Decode

Gen 9 LP implements a high-performance and low-power HW acceleration for video
decoding operations for multiple video codecs.
The HW decode is exposed by the graphics driver using the following APIs:
• Direct3D* 9 Video API (DXVA2)
• Direct3D11 Video API
• Intel Media SDK
• MFT (Media Foundation Transform) filters.
Gen 9 LP supports full HW accelerated video decoding for AVC/VC1/MPEG2/HEVC/VP8/

JPEG.
Table 2-11. Hardware Accelerated Video Decoding (Sheet 1 of 2)

Codec Profile Level Maximum Resolution
Main
MPEG2 Main 1080p
High
Advanced L3
VC1/WMV9
Main High 3840x3840
Simple Simple
High
AVC/H264 Main L5.1 2160p(4K)
MVC & stereo
Table 2-11. Hardware Accelerated Video Decoding (Sheet 2 of 2)
VP8 0 Unified level 1080p
JPEG/MJPEG Baseline Unified level 16k x16k
HEVC/H265 (8 bits) Main L5.1 2160(4K)
HEVC/H265 (10 Main

L5.1 2160(4K)
bits) BT2020, isolate Dec
VP9 0 (4:2:0 Chroma 8-10bit) Unified level 2160(4K)
Expected performance:
• More than 16 simultaneous decode streams @ 1080p.
Note: Actual performance depends on the processor SKU, content bit rate, and memory
frequency. Hardware decode for H264 SVC is not supported.
2.2.3.2 Hardware Accelerated Video Encode

Gen 9 LP implements a high-performance and low-power HW acceleration for video
decoding operations for multiple video codecs.
The HW encode is exposed by the graphics driver using the following APIs:
• Intel Media SDK
• MFT (Media Foundation Transform) filters
Gen 9 LP supports full HW accelerated video encoding for AVC/MPEG2/HEVC/VP8/JPEG.
Table 2-12. Hardware Accelerated Video Encode

MPEG2 Main High 1080p

High
AVC/H264 L5.1 2160p(4K)
Main
VP8 Unified profile Unified level —
JPEG Baseline — 16Kx16K
HEVC/H265 Main L5.1 2160p(4K)
Support 8 bits 4:2:0 BT2020
VP9 may be obtained the pre/post — —
processing
Note: Hardware encode for H264 SVC is not supported.
2.2.3.3 Hardware Accelerated Video Processing

There is hardware support for image processing functions such as De-interlacing, Film
cadence detection, Advanced Video Scaler (AVS), detail enhancement, image
stabilization, gamut compression, HD adaptive contrast enhancement, skin tone
enhancement, total color control, Chroma de-noise, SFC pipe (Scalar and Format
Conversion), memory compression, Localized Adaptive Contrast Enhancement (LACE),
spatial de-noise, Out-Of-Loop De-blocking (from AVC decoder), 16 bpc support for de-
noise/de-mosaic.
31
There is support for Hardware assisted Motion Estimation engine for AVC/MPEG2
encode, True Motion, and Image stabilization applications.
The HW video processing is exposed by the graphics driver using the following APIs:
• Direct3D* 9 Video API (DXVA2).
• Direct3D 11 Video API.
• Intel Media SDK.
• MFT (Media Foundation Transform) filters.
• Intel CUI SDK.
Note: Not all features are supported by all the above APIs. Refer to the relevant
documentation for more details.
2.2.3.4 Hardware Accelerated Transcoding

Transcoding is a combination of decode video processing (optional) and encode. Using
the above hardware capabilities can accomplish a high-performance transcode pipeline.
There is not a dedicated API for transcoding.
The processor graphics supports the following transcoding features:

• Low-power and low-latency AVC encoder for video conferencing and Wireless
Display applications.
• Lossless memory compression for media engine to reduce media power.
• HW assisted Advanced Video Scaler.
• Low power Scaler and Format Converter.
Expected performance:
• KBL Y and AML-Y22 Processor Lines: 10x 1080p30 RT (previous generation is 5x
1080p30 RT).
• U/U 4 Core Processor Line: 12x 1080p30 RT (same as previous generation).
Note: Actual performance depends on the processor Line, video processing algorithms used,
content bit rate, and memory frequency.
2.2.4 Camera Pipe Support

Camera pipe functions such as de-mosaic, white balance, defect pixel correction, black
level correction, gamma correction, LGCA, vignette control, Front end Color Space
Converter (CSC), Image Enhancement Color Processing (IECP).
2.2.5 Switchable/Hybrid Graphics

The processor supports Switchable/Hybrid graphics.
Switchable graphics: The Switchable Graphics feature allows you to switch between
using the Intel integrated graphics and a discrete graphics card. The Intel Integrated
Graphics driver will control the switching between the modes. In most cases it will
operate as follows: when connected to AC power - Discrete graphic card; when
connected to DC (battery) - Intel integrated GFX.
Hybrid graphics: Intel integrated graphics and a discrete graphics card work
cooperatively to achieve enhanced power and performance.
Table 2-13. Switchable/Hybrid Graphics Support
Operating System Hybrid Graphics Switchable Graphics2
Windows* 10 (64 bit) Yes1 N/A
Note:
1. Contact your graphics vendor to check for support.
2. Intel does not validate any SG configurations on Windows* 8.1 or Windows* 10.
2.2.6 Gen 9 LP Video Analytics

There is HW assist for video analytics filters such as scaling, convolve 2D/1D, minmax,
1P filter, erode, dilate, centroid, motion estimation, flood fill, cross correlation, Local
Binary Pattern (LBP).
Figure 2-3. Video Analytics Common Use Cases
33
2.2.7 Gen 9 LP (9th Generation Low Power) Block Diagram
Figure 2-4. Gen 9 LP Block Diagram
Scheduler State Management Power Management
Video Video
Video
Encode Video
Decode
Encode Decode
3D Pipeline
General Purpose Pipeline
Global Thread Dispatch
Local Thread Dispatch Local Thread Dispatch
Setup, Rasterization, Z Complex, Color Setup, Rasterization, Z Complex, Color
EU Array EU Array EU Array EU Array
EU EU EU EU EU EU EU EU EU EU EU EU
EU EU EU EU EU EU EU EU
EU EU EU EU
Sampler Sampler Sampler Sampler
Load/Store/Scatter/Gather Load/Store/Scatter/Gather Load/Store/Scatter/Gather Load/Store/Scatter/Gather
Local Memory Local Memory Local Memory Local Memory
L3 Cache L3 Cache
Cache/Memory Interface
LLC
eDRAM
System Memory
2.2.8 GT2/3 Graphic Frequency
Table 2-14. GT2/3 Graphics Frequency (KBL U/Y and AML-Y22 Processor Line)
GT Unslice + GT Unslice +
Segment GT Unslice
1 GT Slice 2 GT Slice
Y-Processor Line and AML Y-

[GT Unslice only] -
Processor Line- 2 Core with GT Max Dynamic frequency —
(1or2)BIN
GT2
U-Processor Line- 2 Core with [GT Unslice only] -
GT Max Dynamic frequency —
GT2 (1or2)BIN
U-Processor Line- 2 Core with [GT Unslice only] - [GT Unslice + 1
GT Max Dynamic frequency
GT3 and OPC (1or2)BIN Slice] - (1or2)BIN
2.3 Display Interfaces
The processor supports single eDP* interface and 2 DDI interfaces (depends on
segment):
• DDI interface can be configured as DisplayPort* or HDMI*.
• Each DDI can support dual mode (DP++).
• Each DDI can support DVI (DVI max resolution is 1920x1200 @ 60 Hz).
• The DisplayPort* can be configured to use 1, 2, or 4 lanes depending on the
bandwidth requirements and link data rate.
• DDI ports notated as: DDI B, C, D.
• Y-Processor /AML-Y22 ProcessorU/ support eDP and up to 2 DDI supporting DP/
HDMI.
• AUX/DDC signals are valid for each DDI Port. (Two for U/YProcessors)
• Total Five dedicated HPD (Hot plug detect signals) are valid for all processor SKUs.
Note: SSC is supported in eDP*/DP for all Processor Lines.
Note: The processor platform supports DP Type-C implementation with additional discrete
components.
Table 2-15. VGA and Embedded DisplayPort* (eDP*) Bifurcation Summary

Port U/Y-Processor Line
eDP - DDIA
N/A
(eDP lower x2 lanes, [1:0])
VGA - DDIE2
N/A
(DP upper x2 lanes, [3:2])
Notes:
1. N/A
2. DP-to-VGA converter on the processor ports is supported using external dongle only, display driver
software for VGA dongles which configures the VGA port as a DP branch device.
The technologies supported by the processor are listed in the following table.
Table 2-16. Embedded DisplayPort (eDP*)/DDI Ports Availability (Sheet 1 of 2)

Ports Port Name in VBT U/U-Quad Core/Y-Processor Line2,3
DDI0 - eDP Port A Yes
DDI1 Port B Yes
DDI2 Port C Yes
DDI3 Port D No4
DDI4 - eDP/VGA Port E No
35
Table 2-16. Embedded DisplayPort (eDP*)/DDI Ports Availability (Sheet 2 of 2)
Ports Port Name in VBT U/U-Quad Core/Y-Processor Line2,3
Notes:
1. Port E is bifurcated from eDP, when VGA is used need to use available AUX (if HDMI is in used).
a. For example, DT can use eDP_AUX for VGA converter which is available as free Design but HPD
should be used as DDPE_HPD3.
2. 3xDDC (DDPB, DDPC, DDPD) are valid for all the processor SKUs (for U/YProcessor Line DDC signals
description, refer to the PCH Datasheet) (See Related Document section).
3. 5xHPD (PCH) inputs (eDP_HPD, DDPB_HPD0, DDPC_HPD1, DDPD_HPD2, DDPE_HPD3) are valid for all
processor SKUs.
4. No Port D for Y/U-Processor Line. DDI3_AUX are exists as reserved.
5. VBT provides a configuration option to select the four AUX channels A/B/C/D for a given port, based on
how the aux channel lines are connected physically on the board.
Table 2-17. Display Technologies Support

Technology Standard
eDP* 1.4 VESA* Embedded DisplayPort* Standard 1.4
VESA DisplayPort* Standard 1.2

DisplayPort* 1.2 VESA DisplayPort* PHY Compliance Test Specification 1.2
VESA DisplayPort* Link Layer Compliance Test Specification 1.2
HDMI* 1.41 High-Definition Multimedia Interface Specification Version 1.4
Notes:
1. HDMI* 2.0/2.0a support is possible using LS-Pcon converter chip connected to the DP port. The LS-Pcon
supports 2 modes:
a. Level shifter for HDMI 1.4 resolutions.
b. DP-HDMI 2.0 protocol converter for HDMI 2.0 resolutions.
• The HDMI* interface supports HDMI with 3D, 4Kx2K @ 24 Hz, Deep Color, and
x.v.Color.
• The processor supports High-bandwidth Digital Content Protection (HDCP) for high
definition content playback over digital interfaces. HDCP is not supported for eDP.
• The processor supports eDP display authentication: Alternate Scrambler Seed
Reset (ASSR).
• The processor supports Multi-Stream Transport (MST), enabling multiple monitors
to be used via a single DisplayPort connector.
The maximum MST DP supported resolution for U/Y-Processors is shown in the

following table.
Table 2-18. Display Resolutions and Link Bandwidth for Multi-Stream Transport
Calculations (Sheet 1 of 2)
Refresh Pixel Clock Link Bandwidth
Pixels per line Lines
Rate [Hz] [MHz] [Gbps]
640 480 60 25.2 0.76

800 600 60 40 1.20
1024 768 60 65 1.95
1280 720 60 74.25 2.23
1280 768 60 68.25 2.05
1360 768 60 85.5 2.57
1280 1024 60 108 3.24
1400 1050 60 101 3.03
1680 1050 60 119 3.57
Table 2-18. Display Resolutions and Link Bandwidth for Multi-Stream Transport
Calculations (Sheet 2 of 2)
Refresh Pixel Clock Link Bandwidth
Pixels per line Lines
Rate [Hz] [MHz] [Gbps]
1920 1080 60 148.5 4.46

1920 1200 60 154 4.62
2048 1152 60 156.75 4.70
2048 1280 60 174.25 5.23
2048 1536 60 209.25 6.28
2304 1440 60 218.75 6.56
2560 1440 60 241.5 7.25
3840 2160 30 262.75 7.88
2560 1600 60 268.5 8.06
2880 1800 60 337.5 10.13
3200 2400 60 497.75 14.93
3840 2160 60 533.25 16.00
4096 2160 60 556.75 16.70
4096 2304 60 605 18.15
Notes:
1. All above is related to bit depth of 24.
2. The data rate for a given video mode can be calculated as: Data Rate = Pixel Frequency * Bit
Depth.
3. The bandwidth requirements for a given video mode can be calculated as:
Bandwidth = Data Rate * 1.25 (for 8B/10B coding overhead).
4. The Table above is partial List of the common Display resolutions, just for example.
The Link Bandwidth depends if the standards is Reduced Blanking or not.
If the Standard is Not reduced blanking, the expected Bandwidth will be higher.
For more details, refer to VESA and Industry Standards and Guidelines for Computer Display
Monitor Timing (DMT), Version 1.0, Rev. 13 February 8, 2013
5. To calculate the resolutions that can be supported in MST configurations, follow the below
guidelines:
a. Identify what is the Link Bandwidth (column right) according the requested Display
resolution.
b. Summarize the Bandwidth for Two of three Displays accordingly, and make sure the final
result is below 21.6Gbps. (for HBR2, four lanes)
c. For special cases when x2 lanes are used or HBR or RBR used, refer to the tables in
Section 2.3.11, “Display Resolution per Link Width” accordingly.
For examples:
a. Docking Two displays: 3840x2160 @ 60 Hz + 1920x1200 @ 60 Hz = 16 + 4.62 =
20.62 Gbps [Supported]
b. Docking Three Displays: 3840x2160 @ 30 Hz + 3840x2160 @ 30 Hz +
1920x1080 @ 60 Hz = 7.88 + 7.88 + 4.16 = 19.92 Gbps [Supported]
6. Consider also the supported resolutions as mentioned in Section 2.3.6, “Multiple Display
Configurations (Dual Channel DDR)” and Section 2.3.7, “Multiple Display Configurations (Single
Channel DDR)”.
• The processor supports only 3 streaming independent and simultaneous display

combinations of DisplayPort*/eDP*/HDMI/DVI monitors. In the case where 4
monitors are plugged in, the software policy will determine which 3 will be used.
• Three High Definition Audio streams over the digital display interfaces are
supported.
• For display resolutions driving capability, see Maximum Display Resolution table.
• DisplayPort* Aux CH supported by the processor, while DDC channel, Panel power
sequencing, and HPD are supported through the PCH.
37
Figure 2-5. Processor Display Architecture (with 3 DDI ports as an example)
eDP
Processor AUX
X2 eDP
eDP
Transcoder
eDP x4 eDP
DP encoder X2 DDI E Or
eDP DP Timing, x2 eDP + x2 DP
Mux VDIP MUX
DPT,SRID
Transcoder A
Display
DP/HDMI/DVI
Pipe A
Timing,VDIP
X4 DDI B DDI B
(X4 DP/HDMI/DVI)
X4 DDI C DDI C
Transcoder B DDI
Display Ports ports: (X4 DP/HDMI/DVI)
DP/HDMI/DVI X4 DDI D
Pipe B Mux B,C,D DDI D
Timing,VDIP (X4 DP/HDMI/DVI)
Memory
Interface
Transcoder C
Display
DP/HDMI/DVI
Pipe C
Timing,VDIP
X3 DP’s
AUX
Audio
PCH
Codec
Interrupt HPD
Back light
modulation
Note: U/Y Processors only have two DDI ports.
Display is the presentation stage of graphics. This involves:

• Pulling rendered data from memory
• Converting raw data into pixels
• Blending surfaces into a frame
• Organizing pixels into frames
• Optionally scaling the image to the desired size
• Re-timing data for the intended target
• Formatting data according to the port output standard
2.3.1 DisplayPort*
The DisplayPort* is a digital communication interface that uses differential signaling to
achieve a high-bandwidth bus interface designed to support connections between PCs
and monitors, projectors, and TV displays.
A DisplayPort* consists of a Main Link, Auxiliary channel, and a Hot-Plug Detect signal.
The Main Link is a unidirectional, high-bandwidth, and low-latency channel used for
transport of isochronous data streams such as uncompressed video and audio. The
Auxiliary Channel (AUX CH) is a half-duplex bidirectional channel used for link
management and device control. The Hot-Plug Detect (HPD) signal serves as an
interrupt request for the sink device.
The processor is designed in accordance to VESA* DisplayPort* specification. Refer to

Table 2-17, “Display Technologies Support”.
Figure 2-6. DisplayPort* Overview
Source Device Main Link Sink Device

(Isochronous Streams)
DisplayPort Tx DisplayPort Rx
(Processor)
AUX CH
(Link/Device Managemet)
Hot-Plug Detect
(Interrupt Request)
2.3.2 High-Definition Multimedia Interface (HDMI*)

The High-Definition Multimedia Interface (HDMI*) is provided for transmitting
uncompressed digital audio and video signals from DVD players, set-top boxes, and
other audio-visual sources to television sets, projectors, and other video displays. It
can carry high-quality multi-channel audio data and all standard and high-definition
consumer electronics video formats. The HDMI display interface connecting the
processor and display devices uses transition minimized differential signaling (TMDS) to
carry audiovisual information through the same HDMI cable.
HDMI includes three separate communications channels: TMDS, DDC, and the optional
CEC (consumer electronics control). CEC is not supported on the processor. As shown in
the following figure, the HDMI cable carries four differential pairs that make up the
TMDS data and clock channels. These channels are used to carry video, audio, and
auxiliary data. In addition, HDMI carries a VESA DDC. The DDC is used by an HDMI
Source to determine the capabilities and characteristics of the Sink.
Audio, video, and auxiliary (control/status) data is transmitted across the three TMDS
data channels. The video pixel clock is transmitted on the TMDS clock channel and is
used by the receiver for data recovery on the three data channels. The digital display
data signals driven natively through the PCH are AC coupled and needs level shifting to
convert the AC coupled signals to the HDMI compliant digital signals.
The processor HDMI interface is designed in accordance with the High-Definition

Multimedia Interface.
39
Figure 2-7. HDMI* Overview
HDMI Source HDMI Sink

HDMI Tx HDMI Rx
(Processor) TMDS Data Channel 0
TMDS Data Channel 1
TMDS Data Channel 2
TMDS Clock Channel
Hot-Plug Detect
Display Data Channel (DDC)
CEC Line (optional)
2.3.3 Digital Video Interface (DVI)

The processor Digital Ports can be configured to drive DVI-D. DVI uses TMDS for
transmitting data from the transmitter to the receiver, which is similar to the HDMI
protocol except for the audio and CEC. Refer to the HDMI section for more information
on the signals and data transmission. The digital display data signals driven natively
through the processor are AC coupled and need level shifting to convert the AC coupled
signals to the HDMI compliant digital signals.
2.3.4 embedded DisplayPort* (eDP*)

The embedded DisplayPort* (eDP*) is an embedded version of the DisplayPort
standard oriented towards applications, such as notebook and All-In-One PCs. Like
DisplayPort, embedded DisplayPort* also consists of a Main Link, Auxiliary channel, and
an optional Hot-Plug Detect signal.
2.3.5 Integrated Audio

• HDMI* and display port interfaces carry audio along with video.
• The processor supports 3 High Definition audio streams on 3 digital ports
simultaneously (the DMA controllers are in the PCH).
• The integrated audio processing (DSP) is performed by the PCH, and delivered to
the processor using the AUDIO_SDI and AUDIO_CLK inputs pins.
• AUDIO_SDO output pin is used to carry responses back to the PCH.
• Supports only the internal HDMI and DP CODECs.
Table 2-19. Processor Supported Audio Formats over HDMI and DisplayPort*
Audio Formats HDMI* DisplayPort*
AC-3 Dolby* Digital Yes Yes
Dolby Digital Plus Yes Yes
DTS-HD* Yes Yes
LPCM, 192 kHz/24 bit, 8 Channel Yes Yes
Dolby TrueHD, DTS-HD Master Audio*

Yes Yes
(Lossless Blu-Ray Disc* Audio Format)
The processor will continue to support Silent stream. Silent stream is an integrated
audio feature that enables short audio streams, such as system events to be heard
over the HDMI* and DisplayPort* monitors. The processor supports silent streams over
the HDMI and DisplayPort interfaces at 44.1 kHz, 48 kHz, 88.2 kHz, 96 kHz, 176.4 kHz,
and 192 kHz sampling rates.
2.3.6 Multiple Display Configurations (Dual Channel DDR)

The following multiple display configuration modes are supported (with appropriate
driver software):
• Single Display is a mode with one display port activated to display the output to
one display device.
• Intel Display Clone is a mode with up to three display ports activated to drive the
display content of same color depth setting but potentially different refresh rate
and resolution settings to all the active display devices connected.
• Extended Desktop is a mode with up to three display ports activated to drive the
content with potentially different color depth, refresh rate, and resolution settings
on each of the active display devices connected.
The digital ports on the processor can be configured to support DisplayPort/HDMI/DVI.

The following table shows examples of valid three display configurations through the
processor.
Table 2-20. Maximum Display Resolution (Sheet 1 of 2)

U/U-Quad Core
Standard Y-Processor Line Notes
Processor Line
2880x1800 @ 60Hz, 24bpp 3840x2160 @ 60Hz, 24bpp4

eDP* Or Or 1,2,3,7
3840x2160 @ 60Hz, 24bpp4 4096x2304 @ 60Hz, 24bpp4
2880x1800 @ 60Hz, 24bpp 3840x2160 @ 60Hz, 24bpp4

DP* Or Or 1,2,3,7
3840x2160 @ 60Hz, 24bpp4 4096x2304 @ 60Hz, 24bpp4
HDMI* 1.4 4096x2160 @ 30 Hz, 4096x2160 @ 30 Hz,

1,2,3
(native) 24bpp4 24bpp4
2880x1800 @ 60Hz, 24bpp 3840x2160 @ 60Hz, 24bpp4

HDMI 2.0/2.0a
Or Or 1,2,3,6
(Via LS-Pcon)
3840x2160 @ 60Hz, 24bpp4 4096x2160 @ 60Hz, 24bpp4
41
Table 2-20. Maximum Display Resolution (Sheet 2 of 2)
U/U-Quad Core
Standard Y-Processor Line Notes
Processor Line
Notes:
1. Maximum resolution is based on implementation of 4 lanes with HBR2 link data rate.
2. bpp - bit per pixel.
3. N/A
4. N/A
5. In the case of connecting more than one active display port, the processor frequency may
be lower than base frequency at thermally limited scenario.
6. HDMI2.0 implemented using LSPCON device. Only one LSPCON with HDCP2.2 support is
supported per platform.
7. Display resolution of 5120x2880@60Hz can be supported with 5K panels displays which
have two ports. (with the GFX driver accordingly).
2.3.7 Multiple Display Configurations (Single Channel DDR)
Table 2-21. Y/AML Y22-Processor Lines Display Resolution Configuration

Maximum Resolution (Clone/ Extended mode)
Minimum DDR speed [MT/s]
eDP @ 60 Hz DP @ 60 Hz / HDMI DP @ 60 Hz / HDMI
(Primary) @ 30 Hz (Secondary 1) @ 30 Hz (Secondary 2)
2880 x 1800 Not Connected Not Connected
1333 2880 x 1800 2880 x 1800 Not Connected
2880 x 1800 2880 x 1800 2880 x 1800
Note: This resolution is limited by power.
Table 2-22. U/ Lines Display Resolution Configuration

eDP @ 60 Hz DP @ 60 Hz / HDMI DP @ 60 Hz / HDMI
(Primary) @ 30 Hz (Secondary 1) @ 30 Hz (Secondary 2)

1333
3200 x 1800 3840 x 2160 Not Connected
3840 x 2160 3840 x 2160 Not Connected
1600
2560 x 1440 3840 x 2160 3840 x 2160
1866 3200 x 1800 3840 x 2160 3840 x 2160
2133 3840 x 2160 3840 x 2160 3840 x 2160
2400 3840 x 2160 3840 x 2160 3840 x 2160
Table 2-23. U/U- 4 CoreProcessor Lines Display Resolution Configuration (DP @ 30 Hz)
(Sheet 1 of 2)
eDP @ 60 Hz DP @ 30 Hz DP @ 30 Hz
(Primary) (Secondary 1) (Secondary 2)
1333 3840 x 2160 3840 x 2160 Not Connected
3200 x 1800 3840 x 2160 3840 x 2160

1
1600 3840 x 2160 3840 x 2160 3840 x 2160
Table 2-23. U/U- 4 CoreProcessor Lines Display Resolution Configuration (DP @ 30 Hz)
(Sheet 2 of 2)
eDP @ 60 Hz DP @ 30 Hz DP @ 30 Hz
(Primary) (Secondary 1) (Secondary 2)
Note:
1. eDP with 3840x2160 @ 60 Hz resolution is very close to maximum limit and may not be supported for U/U-4 Core
Processor Line.
2.3.8 High-bandwidth Digital Content Protection (HDCP)

HDCP is the technology for protecting high-definition content against unauthorized
copy or unreceptive between a source (computer, digital set top boxes, and so on) and
the sink (panels, monitor, and TVs). The processor supports HDCP 2.2 for 4k Premium
content protection over wired displays (HDMI*, DVI, and DisplayPort*).
The HDCP 2.2 keys are integrated into the processor and customers are not required to
physically configure or handle the keys. HDCP2.2 for HDMI2.0 is covered by the
LSPCON platform device.
Some minor difference will be between Integrated HDCP2.2 over HDMI1.4 compared to
the HDCP2.2 over LSPCON in HDMI1.4 Mode. Also, LSPCON is needed for HDMI 2.0a
which defines HDR over HDMI.
The HDCP 1.4 keys are integrated into the processor and customers are not required to
physically configure or handle the keys.
Table 2-24. HDCP Display supported Implications Table

HDCP Maximum HDCP
Topic HDR1 BPC3 Comments
Revision Resolution Solution2
HDCP1.4 4K@60 No iHDCP 10 bit Legacy Integrated for HDCP1.4

DP
HDCP2.2 4K@60 Yes iHDCP 10 bit New Integrated for HDCP2.2
HDCP1.4 4K@30 No iHDCP 8 bit Legacy Integrated for HDCP1.4
HDMI1.4 HDCP2.2 4K@30 No LSPCON 8 bit LSPCON HDCP2.2 required
HDCP2.2 4K@30 No iHDCP4 8 bit New Integrated for HDCP2.2
HDMI2.0 HDCP2.2 4K@60 No LSPCON 12 bit (YUV 420) LSPCON HDCP2.2 required
HDMI2.0a HDCP2.2 4K@60 Yes LSPCON 12 bit (YUV 420) LSPCON HDCP2.2 required
Notes:
1. HDR - High Dynamic Range feature expands the range of both contrast and color significantly, HDR will be supported on DP
and HDMI2.0a configuration only.
2. HDCP Solutions:
a. iHDCP - Intel Silicon Integrated HDCP
b. LSPCon - 3rd Party motherboard soldered down solution
3. BPC - Bits Per Channel.
4. HDMI1.4 with the Integrated HDCP2.2 solution will replace the LSPCON Solution at a later time.
5. HDCP2.2 is supported by KBL U/Y and AML Y22-Processors with integrated HDCP2.2 and by U-Processors 2+3e. HDCP2.2 is
not supported by Y/U-Processors without integrated HDCP2.2.
43
2.3.9 Display Link Data Rate Support
Table 2-25. Display Link Data Rate Support

Technology Link Data Rate
RBR (1.62 GT/s)

2.16 GT/s
2.43 GT/s
eDP* HBR (2.7 GT/s)
3.24 GT/s
4.32 GT/s
HBR2 (5.4 GT/s)
RBR (1.62 GT/s)

DisplayPort* HBR (2.7 GT/s)
HBR2 (5.4 GT/s)
1.65 Gb/s
HDMI*
2.97 Gb/s
Table 2-26. Display Resolution and Link Rate Support

Link Rate
Resolution High Definition
Support
4096x2304 5.4 (HBR2) UHD (4K)
3840x2160 5.4 (HBR2) UHD (4K)
3200x2000 5.4 (HBR2) QHD+
3200x1800 5.4 (HBR2) QHD+
2880x1800 2.7 (HBR) QHD
2880x1620 2.7 (HBR) QHD
2560x1600 2.7 (HBR) QHD
2560x1440 2.7 (HBR) QHD
1920x1080 1.62 (RBR) FHD
2.3.10 Display Bit Per Pixel (BPP) Support
Table 2-27. Display Bit Per Pixel (BPP) Support

Technology Bit Per Pixel (bpp)
eDP* 24,30,36
DisplayPort* 24,30,36
HDMI* 24,36
2.3.11 Display Resolution per Link Width
Table 2-28. Supported Resolutions1 for HBR (2.7 Gbps) by Link Width (Sheet 1 of 2)
Max Link Bandwidth Max Pixel Clock
Link Width U/Y-Processor Lines
[Gbps] (theoretical) [MHz]
4 lanes 10.8 360 2880x1800 @ 60 Hz, 24bpp
2 lanes 5.4 180 2048x1280 @ 60 Hz, 24bpp
Table 2-28. Supported Resolutions1 for HBR (2.7 Gbps) by Link Width (Sheet 2 of 2)
1 lane 2.7 90 1280x960 @ 60 Hz, 24bpp
Notes:
1. The examples assumed 60 Hz refresh rate and 24 bpp.
Table 2-29. Supported Resolutions1 for HBR2 (5.4 Gbps) by Link Width
See “Maximum Display

4 lanes 21.6 720
Resolutions” table
2 lanes 10.8 360 2880x1800 @ 60 Hz, 24bpp
1 lane 5.4 180 2048x1280 @ 60 Hz, 24bpp
Notes:
1. The examples assumed 60 Hz refresh rate and 24 bpp.
2.
2.4 Platform Environmental Control Interface (PECI)

PECI is an Intel proprietary interface that provides a communication channel between
Intel processors and external components like Super IO (SIO) and Embedded
Controllers (EC) to provide processor temperature, Turbo, Configurable TDP, and
memory throttling control mechanisms and many other services. PECI is used for
platform thermal management and real time control and configuration of processor
features and performance.
2.4.1 PECI Bus Architecture

The PECI architecture is based on a wired OR bus that the clients (as processor PECI)
can pull up (with strong drive).
The idle state on the bus is near zero.
The following figures demonstrates PECI design and connectivity:

• PECI Host-Clients Connection: While the host/originator can be third party PECI
host and one of the PECI client is a processor PECI device.
• PECI EC Connection.
45
Figure 2-8. Example for PECI Host-Clients Connection
VTT
VTT
Q3
nX
Q1
nX
PECI
Q2
1X
CPECI
<10pF/Node
Host / Originator PECI Client
Additional
PECI Clients
Figure 2-9. Example for PECI EC Connection
47
3 Technologies
This chapter provides a high-level description of Intel technologies implemented in the

processor.
The implementation of the features may vary between the processor SKUs.
Details on the different technologies of Intel processors and other relevant external
notes are located at the Intel technology web site: http://www.intel.com/technology/
3.1 Intel® Virtualization Technology (Intel® VT)

Intel® Virtualization Technology (Intel® VT) makes a single system appear as multiple
independent systems to software. This allows multiple, independent operating systems
to run simultaneously on a single system. Intel VT comprises technology components
to support virtualization of platforms based on Intel architecture microprocessors and
chipsets.
Intel Virtualization Technology (Intel VT) for IA-32, Intel 64 and Intel Architecture (Intel
VT-x) added hardware support in the processor to improve the virtualization
performance and robustness. Intel Virtualization Technology for Directed I/O (Intel VT-
d) extends Intel VT-x by adding hardware assisted support to improve I/O device
virtualization performance.
Intel VT-x specifications and functional descriptions are included in the Intel 64 and IA-
32 Architectures Software Developer’s Manual, Volume 3. Available at:
http://www.intel.com/products/processor/manuals/index.htm
The Intel VT-d specification and other VT documents can be referenced at:
http://www.intel.com/technology/virtualization/index.htm
https://sharedspaces.intel.com/sites/PCDC/SitePages/Ingredients/
ingredient.aspx?ing=VT
3.1.1 Intel® Virtualization Technology (Intel® VT) for IA-32,

Intel® 64 and Intel® Architecture (Intel® VT-X)
Intel® VT-x Objectives
Intel VT-x provides hardware acceleration for virtualization of IA platforms. Virtual
Machine Monitor (VMM) can use Intel VT-x features to provide an improved reliable
virtualized platform. By using Intel VT-x, a VMM is:
• Robust: VMMs no longer need to use para-virtualization or binary translation. This
means that VMMs will be able to run off-the-shelf operating systems and
applications without any special steps.
• Enhanced: Intel VT enables VMMs to run 64-bit guest operating systems on IA x86
processors.
• More reliable: Due to the hardware support, VMMs can now be smaller, less
complex, and more efficient. This improves reliability and availability and reduces
the potential for software conflicts.
49
• More secure: The use of hardware transitions in the VMM strengthens the isolation
of VMs and further prevents corruption of one VM from affecting others on the
same system.
Intel® VT-x Key Features
The processor supports the following added new Intel VT-x features:
• Extended Page Table (EPT) Accessed and Dirty Bits
— EPT A/D bits enabled VMMs to efficiently implement memory management and
page classification algorithms to optimize VM memory operations, such as de-
fragmentation, paging, live migration, and check-pointing. Without hardware
support for EPT A/D bits, VMMs may need to emulate A/D bits by marking EPT
paging-structures as not-present or read-only, and incur the overhead of EPT
page-fault VM exits and associated software processing.
• EPTP (EPT pointer) switching
— EPTP switching is a specific VM function. EPTP switching allows guest software
(in VMX non-root operation, supported by EPT) to request a different EPT
paging-structure hierarchy. This is a feature by which software in VMX non-root
operation can request a change of EPTP without a VM exit. Software will be able
to choose among a set of potential EPTP values determined in advance by
software in VMX root operation.
• Pause loop exiting
— Support VMM schedulers seeking to determine when a virtual processor of a
multiprocessor virtual machine is not performing useful work. This situation
may occur when not all virtual processors of the virtual machine are currently
scheduled and when the virtual processor in question is in a loop involving the
PAUSE instruction. The new feature allows detection of such loops and is thus
called PAUSE-loop exiting.
The processor IA core supports the following Intel VT-x features:

• Mode based (XU/XS) EPT execute control - New Feature for this processor
— A new mode of EPT operation which enables different controls for executability
of GPA based on Guest specified mode (User/Supervisor) of linear address
translating to the GPA. When the mode is enabled, the executability of a GPA is
defined by two bits in EPT entry. One bit for accesses to user pages and other
one for accesses to supervisor pages.
— The new mode requires changes in VMCS, and EPT entries. VMCS includes a bit
“mode based EPT execute control” which is used to enable/disable the mode.
An additional bit in EPT entry is defined as “supervisor-execute access”; the
original execute control bit is considered as “user-execute access”. If the “mode
based EPT execute control” is disabled the additional bit is ignored and the
system works with one bit execute control for both user pages and supervisor
pages.
— Behavioral changes - Behavioral changes are across three areas:
• Access to GPA- If the “mode-based EPT execute control” VM-execution
control is 1, treatment of guest-physical accesses by instruction fetches
depends on the linear address from which an instruction is being fetched
1.If the translation of the linear address specifies user mode (the U/S bit
was set in every paging structure entry used to translate the linear
address), the resulting guest-physical address is executable under
EPT only if the XU bit (at position 2) is set in every EPT paging-
structure entry used to translate the guest-physical address.
2.If the translation of the linear address specifies supervisor mode (the
U/S bit was clear in at least one of the paging-structure entries used
to translate the linear address), the resulting guest-physical address
is executable under EPT only if the XS bit is set in every EPT paging-
structure entry used to translate the guest-physical address
—The XU and XS bits are used only when translating linear
addresses for guest code fetches. They do not apply to guest
page walks, data accesses, or A/D-bit updates
• VMEntry - If the “activate secondary controls” and “mode-based EPT
execute control” VM-execution controls are both 1, VM entries ensure that
the “enable EPT” VM-execution control is 1. VM entry fails if this check
fails. When such a failure occurs, control is passed to the next instruction,
• VMExit - The exit qualification due to EPT violation reports clearly
whether the violation was due to User mode access or supervisor mode
access.
— Capability Querying: IA32_VMX_PROCBASED_CTLS2 has bit to indicate the
capability, RDMSR can be used to read and query whether the processor
supports the capability or not.
• Extended Page Tables (EPT)
— EPT is hardware assisted page table virtualization
— It eliminates VM exits from guest OS to the VMM for shadow page-table
maintenance
• Virtual Processor IDs (VPID)
— Ability to assign a VM ID to tag processor IA core hardware structures (such as
TLBs)
— This avoids flushes on VM transitions to give a lower-cost VM transition time
and an overall reduction in virtualization overhead.
• Guest Preemption Timer
— Mechanism for a VMM to preempt the execution of a guest OS after an amount
of time specified by the VMM. The VMM sets a timer value before entering a
guest
— The feature aids VMM developers in flexibility and Quality of Service (QoS)
guarantees
• Descriptor-Table Exiting
— Descriptor-table exiting allows a VMM to protect a guest OS from internal
(malicious software based) attack by preventing relocation of key system data
structures like IDT (interrupt descriptor table), GDT (global descriptor table),
LDT (local descriptor table), and TSS (task segment selector).
— A VMM using this feature can intercept (by a VM exit) attempts to relocate
these data structures and prevent them from being tampered by malicious
software.
3.1.2 Intel® Virtualization Technology (Intel® VT) for Directed

I/O (Intel® VT-d)
Intel® VT-d Objectives
The key Intel VT-d objectives are domain-based isolation and hardware-based
virtualization. A domain can be abstractly defined as an isolated environment in a
platform to which a subset of host physical memory is allocated. Intel VT-d provides
accelerated I/O performance for a virtualized platform and provides software with the
following capabilities:
• I/O device assignment and security: for flexibly assigning I/O devices to VMs and
extending the protection and isolation properties of VMs for I/O operations.
51
• DMA remapping: for supporting independent address translations for Direct
Memory Accesses (DMA) from devices.
• Interrupt remapping: for supporting isolation and routing of interrupts from devices
and external interrupt controllers to appropriate VMs.
• Reliability: for recording and reporting to system software DMA and interrupt errors
that may otherwise corrupt memory or impact VM isolation.
Intel VT-d accomplishes address translation by associating transaction from a given I/O
device to a translation table associated with the Guest to which the device is assigned.
It does this by means of the data structure in the following illustration. This table
creates an association between the device's PCI Express* Bus/Device/Function (B/D/F)
number and the base address of a translation table. This data structure is populated by
a VMM to map devices to translation tables in accordance with the device assignment
restrictions above, and to include a multi-level translation table (VT-d Table) that
contains Guest specific address translations.
Figure 3-1. Device to Domain Mapping Structures
(Dev 31, Func 7) Context entry 255
(Dev 0, Func 1)
(Dev 0, Func 0) Context entry 0
Context entry Table Address Translation

(Bus 255) Root entry 255 For bus N Structures for Domain A
(Bus N) Root entry N
(Bus 0) Root entry 0
Root entry table
Context entry 255
Context entry 0
Address Translation
Context entry Table Structures for Domain B
For bus 0
Intel VT-d functionality, often referred to as an Intel VT-d Engine, has typically been
implemented at or near a PCI Express* host bridge component of a computer system.
This might be in a chipset component or in the PCI Express functionality of a processor
with integrated I/O. When one such VT-d engine receives a PCI Express transaction
from a PCI Express bus, it uses the B/D/F number associated with the transaction to
search for an Intel VT-d translation table. In doing so, it uses the B/D/F number to
traverse the data structure shown in the above figure. If it finds a valid Intel VT-d table
in this data structure, it uses that table to translate the address provided on the PCI
Express bus. If it does not find a valid translation table for a given translation, this
results in an Intel VT-d fault. If Intel VT-d translation is required, the Intel VT-d engine
performs an N-level table walk.
For more information, refer to Intel Virtualization Technology for Directed I/O
Architecture Specification http://www.intel.com/content/dam/www/public/us/en/
documents/product-specifications/vt-directed-io-spec.pdf
Intel® VT-d Key Features
The processor supports the following Intel VT-d features:

• Memory controller and processor graphics comply with the Intel VT-d 2.1
Specification.
• Two Intel VT-d DMA remap engines.
— iGFX DMA remap engine
— Default DMA remap engine (covers all devices except iGFX)
• Support for root entry, context entry, and default context
• 39-bit guest physical address and host physical address widths
• Support for 4K page sizes only
• Support for register-based fault recording only (for single entry only) and support
for MSI interrupts for faults
• Support for both leaf and non-leaf caching
• Support for boot protection of default page table
• Support for non-caching of invalid page table entries
• Support for hardware based flushing of translated but pending writes and pending
reads, on IOTLB invalidation
• Support for Global, Domain specific and Page specific IOTLB invalidation
• MSI cycles (MemWr to address FEEx_xxxxh) not translated
— Translation faults result in cycle forwarding to VBIOS region (byte enables
masked for writes). Returned data may be bogus for internal agents, PEG/DMI
interfaces return unsupported request status
• Interrupt Remapping is supported
• Queued invalidation is supported
• Intel VT-d translation bypass address range is supported (Pass Through)
The processor supports the following added new Intel VT-d features:
• 4-level Intel VT-d Page walk – both default Intel VT-d engine as well as the IGD VT-
d engine are upgraded to support 4-level Intel VT-d tables (adjusted guest address
width of 48 bits)
53
• Intel VT-d superpage – support of Intel VT-d superpage (2 MB, 1 GB) for default
Intel VT-d engine (that covers all devices except IGD)
IGD Intel VT-d engine does not support superpage and BIOS should disable
superpage in default Intel VT-d engine when iGfx is enabled.
Note: Intel VT-d Technology may not be available on all SKUs.
3.2 Security Technologies

3.2.1 Intel® Trusted Execution Technology (Intel® TXT)
Intel® Trusted Execution Technology (Intel® TXT) defines platform-level enhancements
that provide the building blocks for creating trusted platforms.
The Intel TXT platform helps to provide the authenticity of the controlling environment
such that those wishing to rely on the platform can make an appropriate trust decision.
The Intel TXT platform determines the identity of the controlling environment by
accurately measuring and verifying the controlling software.
Another aspect of the trust decision is the ability of the platform to resist attempts to
change the controlling environment. The Intel TXT platform will resist attempts by
software processes to change the controlling environment or bypass the bounds set by
the controlling environment.
Intel TXT is a set of extensions designed to provide a measured and controlled launch
of system software that will then establish a protected environment for itself and any
additional software that it may execute.
These extensions enhance two areas:

• The launching of the Measured Launched Environment (MLE).
• The protection of the MLE from potential corruption.
The enhanced platform provides these launch and control interfaces using Safer Mode
Extensions (SMX).
The SMX interface includes the following functions:

• Measured/Verified launch of the MLE.
• Mechanisms to ensure the above measurement is protected and stored in a secure
location.
• Protection mechanisms that allow the MLE to control attempts to modify itself.
The processor also offers additional enhancements to System Management Mode

(SMM) architecture for enhanced security and performance. The processor provides
new MSRs to:
• Enable a second SMM range
• Enable SMM code execution range checking
• Select whether SMM Save State is to be written to legacy SMRAM or to MSRs
• Determine if a thread is going to be delayed entering SMM
• Determine if a thread is blocked from entering SMM
• Targeted SMI, enable/disable threads from responding to SMIs, both VLWs and IPI
For the above features, BIOS should test the associated capability bit before attempting
to access any of the above registers.
For more information, refer to the Intel® Trusted Execution Technology Measured
Launched Environment Programming Guide
Note: Intel TXT Technology may not be available on all SKUs.
3.2.2 Intel® Advanced Encryption Standard New Instructions

(Intel® AES-NI)
The processor supports Intel Advanced Encryption Standard New Instructions (Intel
AES-NI) that are a set of Single Instruction Multiple Data (SIMD) instructions that
enable fast and secure data encryption and decryption based on the Advanced
Encryption Standard (AES). Intel AES-NI are valuable for a wide range of cryptographic
applications, such as applications that perform bulk encryption/decryption,
authentication, random number generation, and authenticated encryption. AES is
broadly accepted as the standard for both government and industry applications, and is
widely deployed in various protocols.
Intel AES-NI consists of six Intel SSE instructions. Four instructions, AESENC,
AESENCLAST, AESDEC, and AESDELAST facilitate high performance AES encryption and
decryption. The other two, AESIMC and AESKEYGENASSIST, support the AES key
expansion procedure. Together, these instructions provide full hardware for supporting
AES; offering security, high performance, and a great deal of flexibility.
Note: Intel AES-NI Technology may not be available on all SKUs.
3.2.3 PCLMULQDQ (Perform Carry-Less Multiplication Quad

word) Instruction
The processor supports the carry-less multiplication instruction, PCLMULQDQ.
PCLMULQDQ is a Single Instruction Multiple Data (SIMD) instruction that computes the
128-bit carry-less multiplication of two 64-bit operands without generating and
propagating carries. Carry-less multiplication is an essential processing component of
several cryptographic systems and standards. Hence, accelerating carry-less
multiplication can significantly contribute to achieving high speed secure computing
and communication.
3.2.4 Intel® Secure Key

The processor supports Intel Secure Key (formerly known as Digital Random Number
Generator (DRNG)), a software visible random number generation mechanism
supported by a high quality entropy source. This capability is available to programmers
through the RDRAND instruction. The resultant random number generation capability is
designed to comply with existing industry standards in this regard (ANSI X9.82 and
NIST SP 800-90).
Some possible usages of the RDRAND instruction include cryptographic key generation
as used in a variety of applications, including communication, digital signatures, secure
storage, and so on.
55
3.2.5 Execute Disable Bit
The Execute Disable Bit allows memory to be marked as non executable when
combined with a supporting operating system. If code attempts to run in non-
executable memory, the processor raises an error to the operating system. This feature
can prevent some classes of viruses or worms that exploit buffer overrun vulnerabilities
and can, thus, help improve the overall security of the system.
See the Intel 64 and IA-32 Architectures Software Developer's Manuals for more
detailed information.
3.2.6 Boot Guard Technology

Boot Guard technology is a part of boot integrity protection technology. Boot Guard can
help protect the platform boot integrity by preventing execution of unauthorized boot
blocks. With Boot Guard, platform manufacturers can create boot policies such that
invocation of an unauthorized (or untrusted) boot block will trigger the platform
protection per the manufacturer's defined policy.
With verification based in the hardware, Boot Guard extends the trust boundary of the
platform boot process down to the hardware level.
Boot Guard accomplishes this by:

• Providing of hardware-based Static Root of Trust for Measurement (S-RTM) and the
Root of Trust for Verification (RTV) using Intel architectural components.
• Providing of architectural definition for platform manufacturer Boot Policy.
• Enforcing of manufacture provided Boot Policy using Intel architectural
components.
Benefits of this protection is that Boot Guard can help maintain platform integrity by
preventing re-purposing of the manufacturer’s hardware to run an unauthorized
software stack.
3.2.7 Intel® Supervisor Mode Execution Protection (SMEP)

Intel® Supervisor Mode Execution Protection (SMEP) is a mechanism that provides the
next level of system protection by blocking malicious software attacks from user mode
code when the system is running in the highest privilege level. This technology helps to
protect from virus attacks and unwanted code from harming the system. For more
information, refer to Intel® 64 and IA-32 Architectures Software Developer's Manual,
Volume 3A at: http://www.intel.com/Assets/PDF/manual/253668.pdf
3.2.8 Intel® Supervisor Mode Access Protection (SMAP)

Intel® Supervisor Mode Access Protection (SMAP) is a mechanism that provides next
level of system protection by blocking a malicious user from tricking the operating
system into branching off user data. This technology shuts down very popular attack
vectors against operating systems.
For more information, refer to the Intel ® 64 and IA-32 Architectures Software
Developer's Manual, Volume 3A: http://www.intel.com/Assets/PDF/manual/253668.pdf
3.2.9 Intel® Memory Protection Extensions (Intel® MPX)
Intel® MPX provides hardware accelerated mechanism for memory testing (heap and
stack) buffer boundaries in order to identify buffer overflow attacks.
An Intel MPX enabled compiler inserts new instructions that tests memory boundaries
prior to a buffer access. Other Intel MPX commands are used to modify a database of
memory regions used by the boundary checker instructions.
The Intel MPX ISA is designed for backward compatibility and will be treated as no-
operation instructions (NOPs) on older processors.
Intel MPX can be used for:

• Efficient runtime memory boundary checks for security-sensitive portions of the
application.
• As part of a memory checker tool for finding difficult memory access errors. Intel
MPX is significantly of magnitude faster than software implementations.
Intel MPX emulation (without hardware acceleration) is available with the Intel C++
Compiler 13.0 or newer.
For more information, refer to the Intel MPX documentation.
3.2.10 Intel® Software Guard Extensions (Intel® SGX)

Software Guard Extensions (SGX) is a processor enhancement designed to help protect
application integrity and confidentiality of secrets and withstands software and certain
hardware attacks.
Software Guard Extensions (SGX) creates and operates in protected regions of memory
named Enclaves.
Enclave code can be accessed using new special ISA commands that jump into per
Enclave predefined addresses. Data within an Enclave can only be accessed from that
same Enclave code.
The latter security statements hold under all privilege levels including supervisor mode
(ring-0), System Management Mode (SMM) and other Enclaves.
Software Guard Extensions (SGX) features a memory encryption engine that both
encrypt Enclave memory as well as protect it from corruption and replay attacks.
Software Guard Extensions (SGX) benefits over alternative Trusted Execution

Environments (TEEs) are:
• Enclaves are written using C/C++ using industry standard build tools.
• High processing power as they run on the processor.
• Large amount of memory are available as well as non-volatile storage (such as disk
drives).
• Simple to maintain and debug using standard IDEs (Integrated Development
Environment)
• Scalable to a larger number of applications and vendors running concurrently
For more information, refer to the Intel® SGX Website.
57
3.2.11 Intel® Virtualization Technology (Intel® VT) for Directed
I/O (Intel® VT-d)
Refer to Section 3.1.2, “Intel® Virtualization Technology (Intel® VT) for Directed I/O (Intel® VT-d)”
Intel VT-d for detail.
3.3 Power and Performance Technologies

3.3.1 Intel® Hyper-Threading Technology (Intel® HT
Technology)
The processor supports Intel® Hyper-Threading Technology (Intel® HT Technology)
that allows an execution processor IA core to function as two logical processors. While
some execution resources such as caches, execution units, and buses are shared, each
logical processor has its own architectural state with its own set of general-purpose
registers and control registers. This feature should be enabled using the BIOS and
requires operating system support.
Note: Intel HT Technology may not be available on all SKUs.
3.3.2 Intel® Turbo Boost Technology 2.0

The Intel® Turbo Boost Technology 2.0 allows the processor IA core / processor
graphics core to opportunistically and automatically run faster than the processor IA
core base frequency / processor graphics base frequency if it is operating below power,
temperature, and current limits. The Intel Turbo Boost Technology 2.0 feature is
designed to increase performance of both multi-threaded and single-threaded
workloads.
Compared with previous generation products, Intel Turbo Boost Technology 2.0 will
increase the ratio of application power towards TDP and also allows to increase power
above TDP as high as PL2 for short periods of time. Thus, thermal solutions and
platform cooling that are designed to less than thermal design guidance might
experience thermal and performance issues since more applications will tend to run at
the maximum power limit for significant periods of time.
Note: Intel Turbo Boost Technology 2.0 may not be available on all SKUs.
3.3.2.1 Intel® Turbo Boost Technology 2.0 Frequency

To determine the highest performance frequency amongst active processor IA cores,
the processor takes the following into consideration:
• The number of processor IA cores operating in the C0 state.
• The estimated processor IA core current consumption and ICCMax register settings.
• The estimated package prior and present power consumption and turbo power
limits.
• The package temperature.
• Sustained turbo residencies at high voltages and temperature.
Any of these factors can affect the maximum frequency for a given workload. If the
power, current, Voltage or thermal limit is reached, the processor will automatically
reduce the frequency to stay within the PL1 value. Turbo processor frequencies are only
active if the operating system is requesting the P0 state. If turbo frequencies are
limited the cause is logged in IA_PERF_LIMIT_REASONS register. For more information
on P-states and C-states, see Chapter 4, “Power Management”.
3.3.3 Intel® Advanced Vector Extensions 2 (Intel® AVX2)

Intel® Advanced Vector Extensions 2.0 (Intel® AVX2) is the latest expansion of the
Intel instruction set. Intel AVX2 extends the Intel Advanced Vector Extensions (Intel
AVX) with 256-bit integer instructions, floating-point fused multiply add (FMA)
instructions, and gather operations. The 256-bit integer vectors benefit math, codec,
image, and digital signal processing software. FMA improves performance in face
detection, professional imaging, and high performance computing. Gather operations
increase vectorization opportunities for many applications. In addition to the vector
extensions, this generation of Intel processors adds new bit manipulation instructions
useful in compression, encryption, and general purpose software.
For more information on Intel AVX, see http://www.intel.com/software/avx
Intel Advanced Vector Extensions (Intel AVX) are designed to achieve higher
throughput to certain integer and floating point operation. Due to varying processor
power characteristics, utilizing AVX instructions may cause a) parts to operate below
the base frequency b) some parts with Intel Turbo Boost Technology 2.0 to not achieve
any or maximum turbo frequencies. Performance varies depending on hardware,
software and system configuration and you should consult your system manufacturer
for more information. Intel Advanced Vector Extensions refers to Intel AVX, Intel AVX2
or Intel AVX-512.
For more information on Intel AVX, see http://www-ssl.intel.com/content/www/us/en/
architecture-and-technology/turbo-boost/turbo-boost-technology.html
Note: Intel AVX2 Technology may not be available on all SKUs.
3.3.4 Intel® 64 Architecture x2APIC

The x2APIC architecture extends the xAPIC architecture that provides key mechanisms
for interrupt delivery. This extension is primarily intended to increase processor
addressability.
Specifically, x2APIC:
• Retains all key elements of compatibility to the xAPIC architecture:
— Delivery modes
— Interrupt and processor priorities
— Interrupt sources
— Interrupt destination types
• Provides extensions to scale processor addressability for both the logical and
physical destination modes
• Adds new features to enhance performance of interrupt delivery
• Reduces complexity of logical destination mode interrupt delivery on link based
architectures
59
The key enhancements provided by the x2APIC architecture over xAPIC are the
following:
• Support for two modes of operation to provide backward compatibility and
extensibility for future platform innovations:
— In xAPIC compatibility mode, APIC registers are accessed through memory
mapped interface to a 4K-Byte page, identical to the xAPIC architecture.
— In x2APIC mode, APIC registers are accessed through Model Specific Register
(MSR) interfaces. In this mode, the x2APIC architecture provides significantly
increased processor addressability and some enhancements on interrupt
delivery.
• Increased range of processor addressability in x2APIC mode:
— Physical xAPIC ID field increases from 8 bits to 32 bits, allowing for interrupt
processor addressability up to 4G-1 processors in physical destination mode. A
processor implementation of x2APIC architecture can support fewer than 32-
bits in a software transparent fashion.
— Logical xAPIC ID field increases from 8 bits to 32 bits. The 32-bit logical x2APIC
ID is partitioned into two sub-fields – a 16-bit cluster ID and a 16-bit logical ID
within the cluster. Consequently, ((2^20) - 16) processors can be addressed in
logical destination mode. Processor implementations can support fewer than
16 bits in the cluster ID sub-field and logical ID sub-field in a software agnostic
fashion.
• More efficient MSR interface to access APIC registers:
— To enhance inter-processor and self-directed interrupt delivery as well as the
ability to virtualize the local APIC, the APIC register set can be accessed only
through MSR-based interfaces in x2APIC mode. The Memory Mapped IO
(MMIO) interface used by xAPIC is not supported in x2APIC mode.
• The semantics for accessing APIC registers have been revised to simplify the
programming of frequently-used APIC registers by system software. Specifically,
the software semantics for using the Interrupt Command Register (ICR) and End Of
Interrupt (EOI) registers have been modified to allow for more efficient delivery
and dispatching of interrupts.
• The x2APIC extensions are made available to system software by enabling the local
x2APIC unit in the “x2APIC” mode. To benefit from x2APIC capabilities, a new
operating system and a new BIOS are both needed, with special support for x2APIC
mode.
• The x2APIC architecture provides backward compatibility to the xAPIC architecture
and forward extendible for future Intel platform innovations.
Note: Intel x2APIC Technology may not be available on all SKUs.
For more information, see the Intel® 64 Architecture x2APIC Specification at http://
www.intel.com/products/processor/manuals/.
3.3.5 Power Aware Interrupt Routing (PAIR)

The processor includes enhanced power-performance technology that routes interrupts
to threads or processor IA cores based on their sleep states. As an example, for energy
savings, it routes the interrupt to the active processor IA cores without waking the
deep idle processor IA cores. For performance, it routes the interrupt to the idle (C1)
processor IA cores without interrupting the already heavily loaded processor IA cores.
This enhancement is mostly beneficial for high-interrupt scenarios like Gigabit LAN,
WLAN peripherals, and so on.
3.3.6 Intel® Transactional Synchronization Extensions
(Intel® TSX-NI)
Intel® Transactional Synchronization Extensions (Intel® TSX-NI) provides a set of
instruction set extensions that allow programmers to specify regions of code for
transactional synchronization. Programmers can use these extensions to achieve the
performance of fine-grain locking while actually programming using coarse-grain locks.
Details on Intel TSX-NI may be found in Intel® Architecture Instruction Set Extensions
Programming Reference.Intel TSX-NI may not be available on all SKUs.Intel® Image
Signal Processor (Intel® ISP)
Platform Imaging Infrastructure

Note: Intel TSX-NI may not be available on all SKUs.
The imaging infrastructure is based on a number of hardware components as shown in

Figure 3-3, “Platform Imaging Infrastructure”. The three major components of the
system are:
• Camera SubSystem: Located in the lid of the system and contains CMOS sensor,
flash, LED, I/O interface (MIPI* CSI-2 and I2C*), Focus control and other
components.
• Camera I/O controller: The I/O controller is located in the PCH and contains a
MIPI-CSI2 Host controller. The host controller is a PCI device (independent of the
ISP device). The CSI-2 HCI brings imaging data from an external imager into the
system and provides a command and control channel for the imager using I2C.
• Intel ISP (Image Signal Processor): The ISP processes the images captured by
Bayer sensors to be used by still or video applications (such as, JPEG, H.264, and
so on).
Figure 3-2. Processor Camera System
Camera Subsystem 1
Flash LED Privacy LED
CSI-2
Sensor Module
Camera Control Logic
PMIC
CSI-2
Interfaces
PCH
I2C (A)
Camera Subsystem 2
Processor’s 2
I C (B) Camera Subsystem 3
ISP
Camera Subsystem 4
61
Figure 3-3. Platform Imaging Infrastructure
PCH Processor
Processor IA
IA Core
CSI2 Host IACore
IA Core
Core
Controller Graphics
SystemMemory
DMA
Controller System Agent
CSI BE/FE
DPhy
Image Signal Processor
I2C Host
AFE HW Accelerators
MMU Defect Pixel Correction
Memory Shading Correction
CSI2
DMA
I2C
Statistics
White Balance Apply
Camera Subsystem CIO Demosaicing
PMIC CCM Gamma CSC
Scalar
Scalar
Scalar Vector YUV1: YEE/NR, CNR
Processors
Processors Processor
Flash LED Privacy LED Processors ISP 2500
YUV2: TM, LACE, Color Enh.
ANR
Scalar (x2)
Image Sensor
3.3.7 Intel® Image Signal Processor (Intel® ISP)

The Intel ISP is an embedded camera subsystem hardware component on the
processor, it processes video and still images at high quality with a low-power cost by
leveraging a programmable VLIW (very-long-instruction-word) SIMD vector processor,
a hardware fixed function pipe (accelerators), two scalar processor, and more. The mix
of hardware accelerators and compute capabilities allows the flexibility and patchability
that are required for late changes and allowing the unit to support future sensor
technologies while remaining in an optimized power performance point.
3.4 Debug Technologies

3.4.1 Intel® Processor Trace
Intel® Processor Trace (Intel® PT) is a new tracing capability added to Intel
Architecture, for use in software debug and profiling. Intel PT provides the capability for
more precise software control flow and timing information, with limited impact to
software execution. This provides enhanced ability to debug software crashes, hangs,
or other anomalies, as well as responsiveness and short-duration performance issues.
Intel VTune™ Amplifier for Systems and the Intel System Debugger are part of Intel
System Studio 2015, which includes updates for new debug and trace features on this
latest platform, including Intel PT and Intel Trace Hub.
4 Power Management
This chapter provides information on the following power management topics:

• Advanced Configuration and Power Interface (ACPI) States
• Processor IA Core Power Management
• Integrated Memory Controller (IMC) Power Management
• Processor Graphics Power Management
63
Figure 4-1. Processor Power States
G0 – Working
S0 – Processor powered on
C0 – Active mode
P0
Pn
C1 – Auto halt
C1E – Auto halt, low frequency, low voltage
C2 – Temporary state before C3 or deeper. Memory

path open
C3 – L1/L2 caches flush, clocks off
C6 – save core states before shutdown and PLL off
C7 – C6 + LLC may be flushed
C8 – C7 + LLC must be flushed
C9 – C8 + Most Uncore Voltages at 0V. IA, GT and SA

reduced to 0V, while VCCIO stays on
C10 – C9 + All VRs at PS4
G1 – Sleeping
S3 cold – Sleep – Suspend To Ram (STR)
S4 – Hibernate – Suspend To Disk (STD), Wakeup on PCH
G2 – Soft Off
S5 – Soft Off – no power,Wakeup on PCH
G3 – Mechanical Off
* Note: Power states availability may vary between the different SKUs
Figure 4-2. Processor Package and IA Core C-States
CORE STATE
C0 C1 C1E C3 C6 C7 C8 C9 C10
One or more cores or GT executing instructions
C0
PACKAGE STATE
(Internal state) All cores in C3 or deeper and Processor Graphics in RC6, but constraints preventing C3 or deeper,
C2 or memory access received
C3 All cores in C3 or deeper and and Processor Graphics in RC6 , LLC may be flushed and turned off, memory in self
refresh, Uncore clocks stopped (expect Display), most Uncore voltages reduced.
C6 All cores and Processor Graphics in C6 or deeper, LLC is flushed and turned off, memory in self refresh,
all Uncore clocks stopped, most Uncore voltages reduced
C7 Package C6 + LLC may be flushed
C8 Package C7 + LLC must be flushed at once, Display engine still stays on
C9 Package C8 + Most VRs reduced to 0V. VCCIO and VCCST stays on + Display PSR/OFF
C10 Package C9 + All VRs at PS4 or LPM + Display PSR/OFF
{
Core behaves the same as Core C6 state
All core clocks are stopped, core state saved and voltage reduce to 0V
Cores flush L1/L2 into LLC, all core clocks are stopped
Core halted, most core clocks stopped and voltage reduced to Pn
Core halted, most core clocks stopped
Core is executing code
Possible combination of core/package states

Impossible combination of core/package states
Note: The “core state” relates to the core which is in the HIGHEST power state in the package (most active)
Note: If the Platform does not support Modern Standby (Previously known as Connected
Standby) and does not support PS4, it is recommended to limit the package state to
package C9 (Better power).
4.1 Advanced Configuration and Power Interface

(ACPI) States Supported
This section describes the ACPI states supported by the processor.
Table 4-1. System States

State Description
G0/S0 Full On
G1/S3-Cold Suspend-to-RAM (STR). Context saved to memory (S3-Hot is not supported by the
processor).
G1/S4 Suspend-to-Disk (STD). All power lost (except wake-up on PCH).
G2/S5 Soft off. All power lost (except wake-up on PCH). Total reboot.
G3 Mechanical off. All power removed from system.
65
Table 4-2. Processor IA Core / Package State Support
State Description
C0 Active mode, processor executing code.
C1 AutoHALT processor IA core state (package C0 state).
C1E AutoHALT processor IA core state with lowest frequency and voltage operating point
(package C0 state).
C2 All processor IA cores in C3 or deeper. Memory path open. Temporary state before Package
C3 or deeper.
C3 Processor IA execution cores in C3 or deeper, flush their L1 instruction cache, L1 data cache,
and L2 cache to the LLC shared cache. LLC may be flushed. Clocks are shut off to each core.
C6 Processor IA execution cores in this state save their architectural state before removing core
voltage. BCLK is off.
C7 Processor IA execution cores in this state behave similarly to the C6 state. If all execution
cores request C7, LLC ways may be flushed until it is cleared. If the entire LLC is flushed,
voltage will be removed from the LLC.
C8 C7 plus LLC should be flushed.
C9 C8 plus most Uncore voltages at 0V. IA, GT and SA reduced to 0V, while VccIO stays on.
C10 C9 plus all VRs at PS4 or LPM. 24 MHz clock off
Table 4-3. Integrated Memory Controller (IMC) States

State Description
Power up CKE asserted. Active mode.
Pre-charge CKE de-asserted (not self-refresh) with all banks closed.

Power down
Active Power CKE de-asserted (not self-refresh) with minimum one bank active.
down
Self-Refresh CKE de-asserted using device self-refresh.
Table 4-4. PCI Express* Link States

State Description
L0 Full on – Active transfer state.
L1 Lowest Active Power Management – Longer exit latency
L3 Lowest power state (power-off) – Longest exit latency
Table 4-5. Direct Media Interface (DMI) States

State Description
L0 Full on – Active transfer state
L1 Lowest Active Power Management – Longer exit latency
L3 Lowest power state (power-off) – Longest exit latency
Table 4-6. G, S, and C Interface State Combinations
Global Processor
Sleep (S) Processor
(G) Package (C) System Clocks Description
State State
State State
G0 S0 C0 Full On On Full On
G0 S0 C1/C1E Auto-Halt On Auto-Halt
G0 S0 C3 Deep Sleep On Deep Sleep
G0 S0 C6/C7 Deep Power On Deep Power Down

Down
G0 S0 C8/C9/C10 Off On Deeper Power Down
G1 S3 Power off Off Off, except RTC Suspend to RAM
G1 S4 Power off Off Off, except RTC Suspend to Disk
G2 S5 Power off Off Off, except RTC Soft Off
G3 N/A Power off Off Power off Hard off
4.2 Processor IA Core Power Management

While executing code, Enhanced Intel SpeedStep Technology and Intel Speed
Shift® Technology optimizes the processor’s IA core frequency and voltage based on
workload. Each frequency and voltage operating point is defined by ACPI as a P-state.
When the processor is not executing code, it is idle. A low-power idle state is defined by
ACPI as a C-state. In general, deeper power C-states have longer entry and exit
latencies.
4.2.1 OS/HW controlled P-states

4.2.1.1 Enhanced Intel® SpeedStep® Technology
Enhanced Intel® SpeedStep® Technology enables OS to control and select P-state. The
following are the key features of Enhanced Intel SpeedStep Technology:
• Multiple frequency and voltage points for optimal performance and power
efficiency. These operating points are known as P-states.
• Frequency selection is software controlled by writing to processor MSRs. The
voltage is optimized based on the selected frequency and the number of active
processor IA cores.
— Once the voltage is established, the PLL locks on to the target frequency.
— All active processor IA cores share the same frequency and voltage. In a multi-
core processor, the highest frequency P-state requested among all active IA
cores is selected.
— Software-requested transitions are accepted at any time. If a previous
transition is in progress, the new transition is deferred until the previous
transition is completed.
• The processor controls voltage ramp rates internally to ensure glitch-free
transitions.
• Because there is low transition latency between P-states, a significant number of
transitions per-second are possible.
67
4.2.1.2 Intel® Speed Shift Technology
Intel Speed Shift Technology is an energy efficient method of frequency control by the
hardware rather than relying on OS control. OS is aware of available hardware P-states
and request a desired P-state or it can let Hardware determine the P-state. The OS
request is based on its workload requirements and awareness of processor capabilities.
Processor decision is based on the different system constraints for example: Workload
demand, thermal limits while taking into consideration the minimum and maximum
levels and activity window of performance requested by the operating system.
For more details, refer to the following document (see related documents section):
• Intel® 64 and IA-32 Architectures Software Developer’s Manual (SDM), volume 3B.
4.2.2 Low-Power Idle States

When the processor is idle, low-power idle states (C-states) are used to save power.
More power savings actions are taken for numerically higher C-states. However, deeper
C-states have longer exit and entry latencies. Resolution of C-states occur at the
thread, processor IA core, and processor package level. Thread-level C-states are
available if Intel Hyper-Threading Technology is enabled.
Caution: Long term reliability cannot be assured unless all the Low-Power Idle States are
enabled.
Figure 4-3. Idle Power Management Breakdown of the Processor IA Cores
Thread 0 Thread 1 Thread 0 Thread 1
Core 0 State Core N State
Processor Package State
While individual threads can request low-power C-states, power saving actions only
take place once the processor IA core C-state is resolved. processor IA core C-states
are automatically resolved by the processor. For thread and processor IA core C-states,
a transition to and from C0 state is required before entering any other C-state.
4.2.3 Requesting Low-Power Idle States
The primary software interfaces for requesting low-power idle states are through the
MWAIT instruction with sub-state hints and the HLT instruction (for C1 and C1E).
However, software may make C-state requests using the legacy method of I/O reads
from the ACPI-defined processor clock control registers, referred to as P_LVLx. This
method of requesting C-states provides legacy support for operating systems that
initiate C-state transitions using I/O reads.
For legacy operating systems, P_LVLx I/O reads are converted within the processor to
the equivalent MWAIT C-state request. Therefore, P_LVLx reads do not directly result in
I/O reads to the system. The feature, known as I/O MWAIT redirection, should be
enabled in the BIOS.
The BIOS can write to the C-state range field of the PMG_IO_CAPTURE MSR to restrict
the range of I/O addresses that are trapped and emulate MWAIT like functionality. Any
P_LVLx reads outside of this range do not cause an I/O redirection to MWAIT(Cx) like
request. They fall through like a normal I/O instruction.
When P_LVLx I/O instructions are used, MWAIT sub-states cannot be defined. The
MWAIT sub-state is always zero if I/O MWAIT redirection is used. By default,
P_LVLx I/O redirections enable the MWAIT 'break on EFLAGS.IF’ feature that triggers a
wake up on an interrupt, even if interrupts are masked by EFLAGS.IF.
4.2.4 Processor IA Core C-State Rules

The following are general rules for all processor IA core C-states, unless specified
otherwise:
• A processor IA core C-State is determined by the lowest numerical thread state
(such as Thread 0 requests C1E while Thread 1 requests C3 state, resulting in a
processor IA core C1E state). See the G, S, and C Interface State Combinations
table.
• A processor IA core transitions to C0 state when:
— An interrupt occurs
— There is an access to the monitored address if the state was entered using an
MWAIT/Timed MWAIT instruction
— The deadline corresponding to the Timed MWAIT instruction expires
• An interrupt directed toward a single thread wakes up only that thread.
• If any thread in a processor IA core is active (in C0 state), the core’s C-state will
resolve to C0.
• Any interrupt coming into the processor package may wake any processor IA core.
• A system reset re-initializes all processor IA cores.
processor IA core C0 State
The normal operating state of a processor IA core where code is being executed.
processor IA core C1/C1E State
C1/C1E is a low-power state entered when all threads within a processor IA core
execute a HLT or MWAIT(C1/C1E) instruction.
69
A System Management Interrupt (SMI) handler returns execution to either Normal
state or the C1/C1E state. See the Intel 64 and IA-32 Architectures Software
Developer’s Manual for more information.
While a processor IA core is in C1/C1E state, it processes bus snoops and snoops from
other threads. For more information on C1E, see Section 4.2.5, “Package C-States”.
Individual threads of a processor IA core can enter the C3 state by initiating a P_LVL2
I/O read to the P_BLK or an MWAIT(C3) instruction. A processor IA core in C3 state
flushes the contents of its L1 instruction cache, L1 data cache, and L2 cache to the
shared LLC, while maintaining its architectural state. All processor IA core clocks are
stopped at this point. Because the processor IA core’s caches are flushed, the processor
does not wake any processor IA core that is in the C3 state when either a snoop is
detected or when another processor IA core accesses cacheable memory.
Individual threads of a processor IA core can enter the C6 state by initiating a P_LVL3
I/O read or an MWAIT(C6) instruction. Before entering processor IA core C6 state, the
processor IA core will save its architectural state to a dedicated SRAM. Once complete,
a processor IA core will have its voltage reduced to zero volts. During exit, the
processor IA core is powered on and its architectural state is restored.
processor IA core C7-C10 States
Individual threads of a processor IA core can enter the C7, C8, C9, or C10 state by
initiating a P_LVL4, P_LVL5, P_LVL6, P_LVL7 I/O read (respectively) to the P_BLK or by
an MWAIT(C7/C8/C9/C10) instruction. The processor IA core C7-C10 state exhibits the
same behavior as the processor IA core C6 state.
C-State Auto-Demotion
In general, deeper C-states, such as C6 or C7, have long latencies and have higher
energy entry/exit costs. The resulting performance and energy penalties become
significant when the entry/exit frequency of a deeper C-state is high. Therefore,
incorrect or inefficient usage of deeper C-states have a negative impact on battery life
and idle power. To increase residency and improve battery life and idle power in deeper
C-states, the processor supports C-state auto-demotion.
There are two C-State auto-demotion options:

• C7/C6 to C3
• C7/C6/C3 To C1
The decision to demote a processor IA core from C6/C7 to C3 or C3/C6/C7 to C1 is

based on each processor IA core’s immediate residency history. Upon each processor IA
core C6/C7 request, the processor IA core C-state is demoted to C3 or C1 until a
sufficient amount of residency has been established. At that point, a processor IA core
is allowed to go into C3/C6 or C7. Each option can be run concurrently or individually. If
the interrupt rate experienced on a processor IA core is high and the processor IA core
is rarely in a deep C-state between such interrupts, the processor IA core can be
demoted to a C3 or C1 state. A higher interrupt pattern is required to demote a
processor IA core to C1 as compared to C3.
This feature is disabled by default. BIOS should enable it in the
PMG_CST_CONFIG_CONTROL register. The auto-demotion policy is also configured by
this register.
4.2.5 Package C-States

The processor supports C0, C2, C3, C6, C7, C8, C9, and C10 package states. The
following is a summary of the general rules for package C-state entry. These apply to
all package C-states, unless specified otherwise:
• A package C-state request is determined by the lowest numerical processor IA core
C-state amongst all processor IA cores.
• A package C-state is automatically resolved by the processor depending on the
processor IA core idle power states and the status of the platform components.
— Each processor IA core can be at a lower idle power state than the package if
the platform does not grant the processor permission to enter a requested
package C-state.
— The platform may allow additional power savings to be realized in the
processor.
— For package C-states, the processor is not required to enter C0 before entering
any other C-state.
— Entry into a package C-state may be subject to auto-demotion – that is, the
processor may keep the package in a deeper package C-state then requested
by the operating system if the processor determines, using heuristics, that the
deeper C-state results in better power/performance.
The processor exits a package C-state when a break event is detected. Depending on
the type of break event, the processor does the following:
• If a processor IA core break event is received, the target processor IA core is
activated and the break event message is forwarded to the target processor IA
core.
— If the break event is not masked, the target processor IA core enters the
processor IA core C0 state and the processor enters package C0.
— If the break event is masked, the processor attempts to re-enter its previous
package state.
• If the break event was due to a memory access or snoop request,
— But the platform did not request to keep the processor in a higher package C-
state, the package returns to its previous C-state.
— And the platform requests a higher power C-state, the memory access or snoop
request is serviced and the package remains in the higher power C-state.
71
Figure 4-4. Package C-State Entry and Exit
Package C0
Package
C2
Package C3 Package C6 Package C7 Package C8 Package C9 Package C10
Package C0
This is the normal operating state for the processor. The processor remains in the
normal state when at least one of its processor IA cores is in the C0 or C1 state or when
the platform has not granted permission to the processor to go into a low-power state.
Individual processor IA cores may be in deeper power idle states while the package is
in C0 state.
Package C2 State
Package C2 state is an internal processor state that cannot be explicitly requested by

software. A processor enters Package C2 state when either:
• All processor IA cores have requested a C3 or deeper power state and all graphics
processor IA cores requested are in RC6, but constraints (LTR, programmed timer
events in the near future, and so forth) prevent entry to any state deeper than C2
state.
• Or, all processor IA cores have requested a C3 or deeper power state and all
graphics processor IA cores requested are in RC6 and a memory access request is
received. Upon completion of all outstanding memory requests, the processor
transitions back into a deeper package C-state.
Package C3 State
A processor enters the package C3 low-power state when:

• At least one processor IA core is in the C3 state.
• The other processor IA cores are in a C3 or deeper power state, and the processor
has been granted permission by the platform.
• The platform has not granted a request to a package C6/C7 state or deeper state
but has allowed a package C3 state.
In package C3-state, the LLC shared cache is valid.
Package C6 State
A processor enters the package C6 low-power state when:

• At least one processor IA core is in the C6 state.
• The other processor IA cores are in a C6 or deeper power state, and the processor
has been granted permission by the platform.
• The platform has not granted a package C7 or deeper request but has allowed a C6
package state.
In package C6 state, all processor IA cores have saved their architectural state and
have had their voltages reduced to zero volts. It is possible the LLC shared cache is
flushed and turned off in package C6 state.
Package C7 State
The processor enters the package C7 low-power state when all processor IA cores are
in the C7 or deeper state and the operating system may request that the LLC will be
flushed.
processor IA core break events are handled the same way as in package C3 or C6.
Upon exit of the package C7 state, the LLC will be partially enabled once a processor IA
core wakes up if it was fully flushed, and will be fully enabled once the processor has
stayed out of C7 for a preset amount of time. Power is saved since this prevents the
LLC from being re-populated only to be immediately flushed again. Some VRs are
reduce to 0V.
Package C8 State
The processor enters C8 states when the processor IA cores lower numerical state is
C8.
The C8 state is similar to C7 state, but in addition, the LLC is flushed in a single step,
Vcc and VccGT are reduced to 0V. The display engine stays on.
Package C9 State
C9.
Package C9 state is similar to C8 state; the VRs are off, Vcc, VccGT and VccSA at 0V,
VccIO and VccST stays on.
Package C10 State
C10.
Package C10 state is similar to the package C9 state, but in addition the IMVP8 VR is in
PS4 low-power state, which is near to shut off of the IMVP8 VR. The VccIO is in low-
power mode as well.
73
InstantGo
InstantGo is a platform state. On display time out the OS requests the processor to
enter package C10 and platform devices at RTD3 (or disabled) in order to attain low
power in idle.
Dynamic LLC Sizing
When all processor IA cores request C7 or deeper C-state, internal heuristics

dynamically flushes the LLC. Once the processor IA cores enter a deep C-state,
depending on their MWAIT sub-state request, the LLC is either gradually flushed N-
ways at a time or flushed all at once. Upon the processor IA cores exiting to C0 state,
the LLC is gradually expanded based on internal heuristics.
4.2.6 Package C-States and Display Resolutions

The integrated graphics engine has the frame buffer located in system memory. When
the display is updated, the graphics engine fetches display data from system memory.
Different screen resolutions and refresh rates have different memory latency
requirements. These requirements may limit the deepest Package C-state the
processor can enter. Other elements that may affect the deepest Package C-state
available are the following:
• Display is on or off
• Single or multiple displays
• Native or non-native resolution
• Panel Self Refresh (PSR) technology
Note: Display resolution is not the only factor influencing the deepest Package C-state the
processor can get into. Device latencies, interrupt response latencies, and core C-states
are among other factors that influence the final package C-state the processor can
enter.
The following table lists display resolutions and deepest available package C-State.The
display resolutions are examples using common values for blanking and pixel rate.
Actual results will vary. The table shows the deepest possible Package C-state.System
workload, system idle, and AC or DC power also affect the deepest possible Package C-
state.
Table 4-7. Deepest Package C-State Available (Sheet 1 of 2)

Y/U Processor Line1,2
Number of PSR PSR

Resolution
Displays Enabled Disabled
800x600 60Hz Single PC10 PC8
Table 4-7. Deepest Package C-State Available (Sheet 2 of 2)
Y/U Processor Line1,2
Number of PSR PSR

Resolution
Displays Enabled Disabled
3200*2000 60Hz Single PC10 PC8
Notes:
1. All Deep states are with Display ON.
2. The deepest C-state has variance, dependent on various parameters, such software and Platform devices.
3. N/A
4.3 Integrated Memory Controller (IMC) Power

Management
The main memory is power managed during normal operation and in low-power ACPI
C-states.
4.3.1 Disabling Unused System Memory Outputs

Any system memory (SM) interface signal that goes to a memory in which it is not
connected to any actual memory devices (such as SODIMM connector is unpopulated,
or is single-sided) is tri-stated. The benefits of disabling unused SM signals are:
• Reduced power consumption.
• Reduced possible overshoot/undershoot signal quality issues seen by the processor
I/O buffer receivers caused by reflections from potentially un-terminated
transmission lines.
When a given rank is not populated, the corresponding control signals (CLK_P/CLK_N/
CKE/ODT/CS) are not driven.
At reset, all rows should be assumed to be populated, until it can be proven that they
are not populated. This is due to the fact that when CKE is tri-stated with a DRAMs
present, the DRAMs are not ensured to maintain data integrity. CKE tri-state should be
enabled by BIOS where appropriate, since at reset all rows should be assumed to be
populated.
4.3.2 DRAM Power Management and Initialization

The processor implements extensive support for power management on the memory
interface.Each channel drives 4 CKE pins, one per rank.
The CKE is one of the power-saving means. When CKE is off, the internal DDR clock is
disabled and the DDR power is reduced. The power-saving differs according to the
selected mode and the DDR type used. For more information, refer to the IDD table in
the DDR specification.
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The processor supports four different types of power-down modes in package C0 state.
The different power-down modes can be enabled through configuring PM PDWN
configuration register. The type of CKE power-down can be configured through
PDWN_mode (bits 15:12) and the idle timer can be configured through
PDWN_idle_counter (bits 11:0). The different power-down modes supported are:
• No power-down (CKE disable)
• Active power-down (APD): This mode is entered if there are open pages when
de-asserting CKE. In this mode the open pages are retained. Power-saving in this
mode is the lowest. Power consumption of DDR is defined by IDD3P. Exiting this
mode is fined by tXP – small number of cycles. For this mode, DRAM DLL should be
on.
• PPD/DLL-off: In this mode the data-in DLLs on DDR are off. Power-saving in this
mode is the best among all power modes. Power consumption is defined by IDD2P.
Exiting this mode is defined by tXP, but also tXPDLL (10–20 according to DDR type)
cycles until first data transfer is allowed. For this mode, DRAM DLL should be off.
• Precharged power-down (PPD): This mode is entered if all banks in DDR are
precharged when de-asserting CKE. Power-saving in this mode is intermediate –
better than APD, but less than DLL-off. Power consumption is defined by IDD2P.
Exiting this mode is defined by tXP. The difference from APD mode is that when
waking-up, all page-buffers are empty.) The LPDDR does not have a DLL. As a
result, the power savings are as good as PPD/DDL-off but will have lower exit
latency and higher performance.
The CKE is determined per rank, whenever it is inactive. Each rank has an idle counter.
The idle-counter starts counting as soon as the rank has no accesses, and if it expires,
the rank may enter power-down while no new transactions to the rank arrives to
queues. The idle-counter begins counting at the last incoming transaction arrival.
It is important to understand that since the power-down decision is per rank, the IMC
can find many opportunities to power down ranks, even while running memory
intensive applications; the savings are significant (may be few Watts, according to DDR
specification). This is significant when each channel is populated with more ranks.
Selection of power modes should be according to power-performance or thermal trade-

off of a given system:
• When trying to achieve maximum performance and power or thermal consideration
is not an issue: use no power-down
• In a system which tries to minimize power-consumption, try using the deepest
power-down mode possible – PPD/DLL-off with a low idle timer value
• In high-performance systems with dense packaging (that is, tricky thermal design)
the power-down mode should be considered in order to reduce the heating and
avoid DDR throttling caused by the heating.
The default value that BIOS configures in PM PDWN configuration register is 6080 –
that is, PPD/DLL-off mode with idle timer of 0x80, or 128 DCLKs. This is a balanced
setting with deep power-down mode and moderate idle timer value.
The idle timer expiration count defines the # of DCLKs that a rank is idle that causes
entry to the selected power mode. As this timer is set to a shorter time the IMC will
have more opportunities to put the DDR in power-down. There is no BIOS hook to set
this register. Customers choosing to change the value of this register can do it by
changing it in the BIOS. For experiments, this register can be modified in real time if
BIOS does not lock the IMC registers.
4.3.2.1 Initialization Role of CKE

During power-up, CKE is the only input to the SDRAM that has its level recognized
(other than the reset pin) once power is applied. It should be driven LOW by the DDR
controller to make sure the SDRAM components float DQ and DQS during power-up.
CKE signals remain LOW (while any reset is active) until the BIOS writes to a
configuration register. Using this method, CKE is ensured to remain inactive for much
longer than the specified 200 micro-seconds after power and clocks to SDRAM devices
are stable.
4.3.2.2 Conditional Self-Refresh

During S0 idle state, system memory may be conditionally placed into self-refresh state
when the processor is in package C3 or deeper power state. Refer to Section 4.4.1.1,
“Intel® Rapid Memory Power Management (Intel® RMPM)” for more details on conditional self-
refresh with Intel HD Graphics enabled.
When entering the S3 – Suspend-to-RAM (STR) state or S0 conditional self-refresh, the

processor IA core flushes pending cycles and then enters SDRAM ranks that are not
used by the processor graphics into self-refresh. The CKE signals remain LOW so the
SDRAM devices perform self-refresh.
The target behavior is to enter self-refresh for package C3 or deeper power states as
long as there are no memory requests to service.
Table 4-8. Targeted Memory State Conditions

State Memory State with Processor Graphics Memory State with External Graphics
C0, C1, C1E Dynamic memory rank power-down based on Dynamic memory rank power-down based on
idle conditions. idle conditions.
C3, C6, C7 or If the processor graphics engine is idle and If there are no memory requests, then enter
deeper there are no pending display requests, then self-refresh. Otherwise use dynamic memory
enter self-refresh. Otherwise use dynamic rank power-down based on idle conditions.
memory rank power-down based on idle
conditions.
S3 Self-Refresh Mode Self-Refresh Mode
S4 Memory power-down (contents lost) Memory power-down (contents lost)
4.3.2.3 Dynamic Power-Down

Dynamic power-down of memory is employed during normal operation. Based on idle
conditions, a given memory rank may be powered down. The IMC implements
aggressive CKE control to dynamically put the DRAM devices in a power-down state.
The processor IA core controller can be configured to put the devices in active power-
down (CKE de-assertion with open pages) or precharge power-down (CKE de-assertion
with all pages closed). Precharge power-down provides greater power savings but has
a bigger performance impact, since all pages will first be closed before putting the
devices in power-down mode.
If dynamic power-down is enabled, all ranks are powered up before doing a refresh
cycle and all ranks are powered down at the end of refresh.
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4.3.2.4 DRAM I/O Power Management
Unused signals should be disabled to save power and reduce electromagnetic
interference. This includes all signals associated with an unused memory channel.
Clocks, CKE, ODT and CS signals are controlled per DIMM rank and will be powered
down for unused ranks.
The I/O buffer for an unused signal should be tri-stated (output driver disabled), the
input receiver (differential sense-amp) should be disabled, and any DLL circuitry
related ONLY to unused signals should be disabled. The input path should be gated to
prevent spurious results due to noise on the unused signals (typically handled
automatically when input receiver is disabled).
4.3.3 DDR Electrical Power Gating (EPG)

The DDR I/O of the processor supports Electrical Power Gating (DDR-EPG) while the
processor is at C3 or deeper power state.
In C3 or deeper power state, the processor internally gates VDDQ for the majority of
the logic to reduce idle power while keeping all critical DDR pins such as CKE and VREF
in the appropriate state.
In C7 or deeper power state, the processor internally gates VCCIO for all non-critical
state to reduce idle power.
In S3 or C-state transitions, the DDR does not go through training mode and will
restore the previous training information.
4.3.4 Power Training

BIOS MRC performing Power Training steps to reduce DDR I/O power while keeping
reasonable operational margins, still ensuring platform operation. The algorithms
attempt to weaken ODT, driver strength and the related buffers parameters both on the
MC and the DRAM side and find the best possible trade-off between the total I/O power
and the operational margins using advanced mathematical models.
Note:
Note:
•
4.4 Processor Graphics Power Management

4.4.1 Memory Power Savings Technologies
4.4.1.1 Intel® Rapid Memory Power Management (Intel® RMPM)
Intel® Rapid Memory Power Management (Intel® RMPM) conditionally places memory
into self-refresh when the processor is in package C3 or deeper power state to allow
the system to remain in the deeper power states longer for memory not reserved for
graphics memory. Intel RMPM functionality depends on graphics/display state (relevant
only when processor graphics is being used), as well as memory traffic patterns
generated by other connected I/O devices.
4.4.1.2 Intel® Smart 2D Display Technology (Intel® S2DDT)
Intel S2DDT reduces display refresh memory traffic by reducing memory reads
required for display refresh. Power consumption is reduced by less accesses to the IMC.
Intel S2DDT is only enabled in single pipe mode.
Intel S2DDT is most effective with:

• Display images well suited to compression, such as text windows, slide shows, and
so on. Poor examples are 3D games.
• Static screens such as screens with significant portions of the background showing
2D applications, processor benchmarks, and so on, or conditions when the
processor is idle. Poor examples are full-screen 3D games and benchmarks that flip
the display image at or near display refresh rates.
4.4.2 Display Power Savings Technologies

4.4.2.1 Intel® (Seamless & Static) Display Refresh Rate
Switching (DRRS) with eDP* Port
Intel DRRS provides a mechanism where the monitor is placed in a slower refresh rate
(the rate at which the display is updated). The system is smart enough to know that
the user is not displaying either 3D or media like a movie where specific refresh rates
are required. The technology is very useful in an environment such as a plane where
the user is in battery mode doing E-mail, or other standard office applications. It is also
useful where the user may be viewing web pages or social media sites while in battery
mode.
4.4.2.2 Intel® Automatic Display Brightness

Intel Automatic Display Brightness feature dynamically adjusts the backlight brightness
based upon the current ambient light environment. This feature requires an additional
sensor to be on the panel front. The sensor receives the changing ambient light
conditions and sends the interrupts to the Intel Graphics driver. As per the change in
Lux, (current ambient light illuminance), the new backlight setting can be adjusted
through BLC. The converse applies for a brightly lit environment. Intel Automatic
Display Brightness increases the backlight setting.
4.4.2.3 Smooth Brightness

The Smooth Brightness feature is the ability to make fine grained changes to the screen
brightness. All Windows* 10 system that support brightness control are required to
support Smooth Brightness control and it should be supporting 101 levels of brightness
control. Apart from the Graphics driver changes, there may be few System BIOS
changes required to make this feature functional.
4.4.2.4 Intel® Display Power Saving Technology (Intel® DPST) 6.0

The Intel DPST technique achieves backlight power savings while maintaining a good
visual experience. This is accomplished by adaptively enhancing the displayed image
while decreasing the backlight brightness simultaneously. The goal of this technique is
to provide equivalent end-user-perceived image quality at a decreased backlight power
level.
1. The original (input) image produced by the operating system or application is
analyzed by the Intel DPST subsystem. An interrupt to Intel DPST software is
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generated whenever a meaningful change in the image attributes is detected. (A
meaningful change is when the Intel DPST software algorithm determines that
enough brightness, contrast, or color change has occurred to the displaying images
that the image enhancement and backlight control needs to be altered.)
2. Intel DPST subsystem applies an image-specific enhancement to increase image
contrast, brightness, and other attributes.
3. A corresponding decrease to the backlight brightness is applied simultaneously to
produce an image with similar user-perceived quality (such as brightness) as the
original image.
Intel DPST 6.0 has improved the software algorithms and has minor hardware changes
to better handle backlight phase-in and ensures the documented and validated method
to interrupt hardware phase-in.
4.4.2.5 Panel Self-Refresh 2 (PSR 2)

Panel Self-Refresh feature allows the Processor Graphics core to enter low-power state
when the frame buffer content is not changing constantly. This feature is available on
panels capable of supporting Panel Self-Refresh. Apart from being able to support, the
eDP* panel should be eDP 1.4 compliant. PSR 2 adds partial frame updates and
requires an eDP 1.4 compliant panel.
PSR2 is limited to 3200x2000@60 Maximum display resolution.
4.4.2.6 Low-Power Single Pipe (LPSP)

Low-power single pipe is a power conservation feature that helps save power by
keeping the inactive pipes powered OFF. This feature is enabled only in a single display
configuration without any scaling functionalities. This feature is supported from 4th
Generation Intel® Core™ processor family onwards. LPSP is achieved by keeping a
single pipe enabled during eDP* only with minimal display pipeline support. This
feature is panel independent and works with any eDP panel (port A) in single display
mode.
4.4.3 Processor Graphics Core Power Savings Technologies

4.4.3.1 Intel® Graphics Dynamic Frequency
Intel Turbo Boost Technology 2.0 is the ability of the processor IA cores and graphics
(Graphics Dynamic Frequency) cores to opportunistically increase frequency and/or
voltage above the guaranteed processor and graphics frequency for the given part.
Intel Graphics Dynamic Frequency is a performance feature that makes use of unused
package power and thermals to increase application performance. The increase in
frequency is determined by how much power and thermal budget is available in the
package, and the application demand for additional processor or graphics performance.
The processor IA core control is maintained by an embedded controller. The graphics
driver dynamically adjusts between P-States to maintain optimal performance, power,
and thermals. The graphics driver will always place the graphics engine in its lowest
possible P-State. Intel Graphics Dynamic Frequency requires BIOS support. Additional
power and thermal budget should be available.
4.4.3.2 Intel® Graphics Render Standby Technology (Intel® GRST)
The final power savings technology from Intel happens while the system is asleep. This
is another technology where the voltage is adjusted down. For RC6 the voltage is
adjusted very low, or very close to zero, what may reduced power by over 1000.
4.4.3.3 Dynamic FPS (DFPS)

Dynamic FPS (DFPS) or dynamic frame-rate control is a runtime feature for improving
power-efficiency for 3D workloads. Its purpose is to limit the frame-rate of full screen
3D applications without compromising on user experience. By limiting the frame rate,
the load on the graphics engine is reduced, giving an opportunity to run the Processor
Graphics at lower speeds, resulting in power savings. This feature works in both AC/DC
modes.
4.5 System Agent Enhanced Intel® Speedstep®

Technology
System Agent Enhanced Intel Speedstep Technology, a new feature for this processor,
is dynamic voltage frequency scaling of the System Agent clock based on memory
utilization. Unlike processor core and package Enhanced Intel Speedstep Technology,
System Agent Enhanced Intel Speedstep Technology has only two valid operating
points.
When workload is low and SA Enhanced Speedstep Technology is enabled, the DDR
data rate may drop temporally as follows:
• DDR3L/LPDDR3 – 1066 MT/s
• DDR4 – 1333 MT/s
Before changing the DDR data rate, the processor sets DDR to self-refresh and changes
needed parameters. The DDR voltage remains stable and unchanged.
BIOS/MRC DDR training at high and low frequencies sets I/O and timing parameters.
4.6 Voltage Optimization

Voltage Optimization opportunistically provides reduction in power consumption, that
is, a boost in performance at a given PL1. Over time the benefit is reduced. There is no
change to base frequency or turbo frequency. During system validation and tuning, this
feature should be disabled to reflect processor power and performance that is expected
over time.
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5 Thermal Management
5.1 Processor Thermal Management

The thermal solution provides both component-level and system-level thermal
management. To allow optimal operation and long-term reliability of Intel processor-
based systems, the system/processor thermal solution should be designed so that the
processor:
• Bare Die Parts: Remains below the maximum junction temperature (TjMAX)
specification at the maximum thermal design power (TDP).
• Lidded Parts: Remains below the maximum case temperature (Tcmax) specification
at the maximum thermal design power.
• Conforms to system constraints, such as system acoustics, system skin-
temperatures, and exhaust-temperature requirements.
Caution: Thermal specifications given in this chapter are on the component and package level
and apply specifically to the processor. Operating the processor outside the specified
limits may result in permanent damage to the processor and potentially other
components in the system.
5.1.1 Thermal Considerations

The processor TDP is the maximum sustained power that should be used for design of
the processor thermal solution. TDP is a power dissipation and component temperature
operating condition limit, specified in this document, that is validated during
manufacturing for the base configuration when executing a near worst case
commercially available workload as specified by Intel for the SKU segment. TDP may be
exceeded for short periods of time or if running a very high power workload.
To allow the optimal operation and long-term reliability of Intel processor-based

systems, the processor must remain within the minimum and maximum component
temperature specifications. For lidded parts, the appropriate case temperature (TCASE)
specifications is defined by the applicable thermal profile. For bare die parts, the
component temperature specification is the applicable TjMAX.
Thermal solutions not designed to provide this level of thermal capability may affect the
long-term reliability of the processor and system.
The processor integrates multiple processing IA cores, graphics cores and a PCH, or a
PCH and EDRAM, on a single package. This may result in power distribution differences
across the package and should be considered when designing the thermal solution.
Intel Turbo Boost Technology 2.0 allows processor IA cores to run faster than the base
frequency. It is invoked opportunistically and automatically as long as the processor is
conforming to its temperature, voltage, power delivery and current control limits. When
Intel Turbo Boost Technology 2.0 is enabled:
• Applications are expected to run closer to TDP more often as the processor will
attempt to maximize performance by taking advantage of estimated available
energy budget in the processor package.
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• The processor may exceed the TDP for short durations to utilize any available
thermal capacitance within the thermal solution. The duration and time of such
operation can be limited by platform runtime configurable registers within the
processor.
• Graphics peak frequency operation is based on the assumption of only one of the
graphics domains (GT/GTx) being active. This definition is similar to the IA core
Turbo concept, where peak turbo frequency can be achieved when only one IA core
is active. Depending on the workload being applied and the distribution across the
graphics domains the user may not observe peak graphics frequency for a given
workload or benchmark.
• Thermal solutions and platform cooling that are designed to less than thermal
design guidance may experience thermal and performance issues.
Note: Intel Turbo Boost Technology 2.0 availability may vary between the different SKUs.
5.1.2 Intel® Turbo Boost Technology 2.0 Power Monitoring

When operating in turbo mode, the processor monitors its own power and adjusts the
processor and graphics frequencies to maintain the average power within limits over a
thermally significant time period. The processor estimates the package power for all
components on package. In the event that a workload causes the temperature to
exceed program temperature limits, the processor will protect itself using the Adaptive
Thermal Monitor.
5.1.3 Intel® Turbo Boost Technology 2.0 Power Control

Illustration of Intel® Turbo Boost Technology 2.0 power control is shown in the
following sections and figures. Multiple controls operate simultaneously allowing
customization for multiple system thermal and power limitations. These controls allow
for turbo optimizations within system constraints and are accessible using MSR, MMIO,
or PECI interfaces (see the appropriate processor Turbo Implementation Guide for more
information).
5.1.3.1 Package Power Control

The package power control settings of PL1, PL2, PL3, PL4 and Tau allow the designer to
configure Intel Turbo Boost Technology 2.0 to match the platform power delivery and
package thermal solution limitations.
• Power Limit 1 (PL1): A threshold for average power that will not exceed -
recommend to set to equal TDP power. PL1 should not be set higher than thermal
solution cooling limits.
• Power Limit 2 (PL2): A threshold that if exceeded, the PL2 rapid power limiting
algorithms will attempt to limit the spike above PL2.
• Power Limit 3 (PL3): A threshold that if exceeded, the PL3 rapid power limiting
algorithms will attempt to limit the duty cycle of spikes above PL3 by reactively
limiting frequency. This is an optional setting
• Power Limit 4 (PL4): A limit that will not be exceeded, the PL4 power limiting
algorithms will preemptively limit frequency to prevent spikes above PL4.
• Turbo Time Parameter (Tau): An averaging constant used for PL1 exponential
weighted moving average (EWMA) power calculation.
Note: Implementation of Intel Turbo Boost Technology 2.0 only requires configuring PL1, PL1
Tau, and PL2.
Note: PL3 and PL4 are disabled by default.
Figure 5-1. Package Power Control
5.1.3.2 Platform Power Control

The processor supports Psys (Platform Power) to enhance processor power
management. The Psys signal needs to be sourced from a compatible charger circuit
and routed to the IMVP8 (voltage regulator). This signal will provide the total thermally
relevant platform power consumption (processor and rest of platform) via SVID to the
processor.
When the Psys signal is properly implemented, the system designer can utilize the
package power control settings of PsysPL1/Tau, PsysPL2 and PsysPL3 for additional
manageability to match the platform power delivery and platform thermal solution
limitations for Intel Turbo Boost Technology 2.0. The operation of the PsysPL1/tau,
PsysPL2 and PsysPL3 is analogous to the processor power limits described in Section
5.1.3.1, “Package Power Control”.
• Platform Power Limit 1 (PsysPL1): A threshold for average platform power that will
not be exceeded - recommend to set to equal platform thermal capability.
• Platform Power Limit 2 (PsysPL2): A threshold that if exceeded, the PsysPL2 rapid
power limiting algorithms will attempt to limit the spikes above PsysPL2.
• Platform Power Limit 3 (PsysPL3): A threshold that if exceeded, the PsysPL3 rapid
power limiting algorithms will attempt to limit the duty cycle of spikes above
PsysPL3 by reactively limiting frequency.
• PsysPL1 Tau: An averaging constant used for PsysPL1 exponential weighted moving
average (EWMA) power calculation.
• The Psys signal and associated power limits / Tau are optional for the system
designer and disabled by default.
• The Psys data will not include power consumption for charging.
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5.1.3.3 Turbo Time Parameter (Tau)
Turbo Time Parameter (Tau) is a mathematical parameter (units of seconds) that
controls the Intel Turbo Boost Technology 2.0 algorithm. During a maximum power
turbo event, the processor could sustain PL2 for a duration longer than the Turbo Time
Parameter. If the power value and/or Turbo Time Parameter is changed during runtime,
it may take some time based on the new Turbo Time Parameter level for the algorithm
to settle at the new control limits. The time varies depending on the magnitude of the
change, power limits, and other factors. There is an individual Turbo Time Parameter
associated with Package Power Control and Platform Power Control.
5.1.4 Configurable TDP (cTDP) and Low-Power Mode

Configurable TDP (cTDP) and Low-Power Mode (LPM) form a design option where the
processor's behavior and package TDP are dynamically adjusted to a desired system
performance and power envelope. Configurable TDP and Low-Power Mode technologies
offer opportunities to differentiate system design while running active workloads on
select processor SKUs through scalability, configuration and adaptability. The scenarios
or methods by which each technology is used are customizable but typically involve
changes to PL1 and associated frequencies for the scenario with a resultant change in
performance depending on system's usage. Either technology can be triggered by (but
are not limited to) changes in OS power policies or hardware events such as docking a
system, flipping a switch or pressing a button. cTDP and LPM are designed to be
configured dynamically and do not require an operating system reboot.
Note: Configurable TDP and Low-Power Mode technologies are not battery life improvement
technologies.
5.1.4.1 Configurable TDP
Note: Configurable TDP availability may vary between the different SKUs.
With cTDP, the processor is now capable of altering the maximum sustained power with
an alternate processor IA core base frequency. Configurable TDP allows operation in
situations where extra cooling is available or situations where a cooler and quieter
mode of operation is desired. Configurable TDP can be enabled using Intel’s DPTF driver
or through HW/EC firmware. Enabling cTDP using the DPTF driver is recommended as
Intel does not provide specific application or EC source code.
cTDP consists of three modes as shown in the following table.
Table 5-1. Configurable TDP Modes (Sheet 1 of 2)

Mode Description
Base The average power dissipation and junction temperature operating condition limit,
specified in Table 5-2, Table 5-3 and Table 5-5 for the SKU Segment and Configuration,
for which the processor is validated during manufacturing when executing an associated
Intel-specified high-complexity workload at the processor IA core frequency
corresponding to the configuration and SKU.
TDP-Up The SKU-specific processor IA core frequency where manufacturing confirms logical
functionality within the set of operating condition limits specified for the SKU segment
and Configurable TDP-Up configuration in Table 5-2, Table 5-3 and Table 5-5. The
Configurable TDP-Up Frequency and corresponding TDP is higher than the processor IA
core Base Frequency and SKU Segment Base TDP.
Table 5-1. Configurable TDP Modes (Sheet 2 of 2)
Mode Description
TDP-Down The processor IA core frequency where manufacturing confirms logical functionality
within the set of operating condition limits specified for the SKU segment and
Configurable TDP-Down configuration in Table 5-2, Table 5-3 and Table 5-5. The
Configurable TDP-Down Frequency and corresponding TDP is lower than the processor IA
core Base Frequency and SKU Segment Base TDP.
In each mode, the Intel Turbo Boost Technology 2.0 power limits are reprogrammed
along with a new OS controlled frequency range. The DPTF driver assists in all these
operations. The cTDP mode does not change the max per-processor IA core turbo
frequency.
5.1.4.2 Low-Power Mode

Low-Power Mode (LPM) can provide cooler and quieter system operation. By combining
several active power limiting techniques, the processor can consume less power while
running at equivalent low frequencies. Active power is defined as processor power
consumed while a workload is running and does not refer to the power consumed
during idle modes of operation. LPM is only available using the Intel DPTF driver.
5.1.5 Thermal Management Features

Occasionally the processor may operate in conditions that are near to its maximum
operating temperature. This can be due to internal overheating or overheating within
the platform. In order to protect the processor and the platform from thermal failure,
several thermal management features exist to reduce package power consumption and
thereby temperature in order to remain within normal operating limits. Furthermore,
the processor supports several methods to reduce memory power.
5.1.5.1 Adaptive Thermal Monitor

The purpose of the Adaptive Thermal Monitor is to reduce processor IA core power
consumption and temperature until it operates below its maximum operating
temperature. Processor IA core power reduction is achieved by:
• Adjusting the operating frequency (using the processor IA core ratio multiplier) and
voltage.
• Modulating (starting and stopping) the internal processor IA core clocks (duty
cycle).
The Adaptive Thermal Monitor can be activated when the package temperature,
monitored by any digital thermal sensor (DTS), meets its maximum operating
temperature. The maximum operating temperature implies maximum junction
temperature TjMAX.
Reaching the maximum operating temperature activates the Thermal Control Circuit
(TCC). When activated the TCC causes both the processor IA core and graphics core to
reduce frequency and voltage adaptively. The Adaptive Thermal Monitor will remain
active as long as the package temperature remains at its specified limit. Therefore, the
Adaptive Thermal Monitor will continue to reduce the package frequency and voltage
until the TCC is de-activated.
TjMAX is factory calibrated and is not user configurable. The default value is software
visible in the TEMPERATURE_TARGET (0x1A2) MSR, bits [23:16].
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The Adaptive Thermal Monitor does not require any additional hardware, software
drivers, or interrupt handling routines. It is not intended as a mechanism to maintain
processor thermal control to PL1 = TDP. The system design should provide a thermal
solution that can maintain normal operation when PL1 = TDP within the intended usage
range.
Adaptive Thermal Monitor protection is always enabled.
5.1.5.1.1 TCC Activation Offset
TCC Activation Offset can be set as an offset from the maximum allowed component
temperature to lower the onset of TCC and Adaptive Thermal Monitor. In addition, the
processor has added an optional time window (Tau) to manage processor performance
at the TCC Activation offset value via an EWMA (Exponential Weighted Moving Average)
of temperature.
TCC Activation Offset with Tau=0
An offset (degrees Celsius) can be written to the TEMPERATURE_TARGET (0x1A2) MSR,

bits [29:24], the offset value will be subtracted from the value found in bits [23:16].
When the time window (Tau) is set to zero, there will be no averaging, the offset, will
be subtracted from the TjMAX value and used as a new max temperature set point for
Adaptive Thermal Monitoring. This will have the same behavior as in prior products to
have TCC activation and Adaptive Thermal Monitor to occur at this lower target silicon
temperature.
If enabled, the offset should be set lower than any other passive protection such as
ACPI _PSV trip points
TCC Activation Offset with Tau
To manage the processor with the EWMA (Exponential Weighted Moving Average) of
temperature, an offset (degrees Celsius) is written to the TEMPERATURE_TARGET
(0x1A2) MSR, bits [29:24], and the time window (Tau) is written to the
TEMPERATURE_TARGET (0x1A2) MSR [6:0]. The Offset value will be subtracted from
the value found in bits [23:16] and be the temperature.
The processor will manage to this average temperature by adjusting the frequency of
the various domains. The instantaneous Tj can briefly exceed the average temperature.
The magnitude and duration of the overshoot is managed by the time window value
(Tau).
This averaged temperature thermal management mechanism is in addition, and not

instead of TjMAX thermal management. That is, whether the TCC activation offset is 0 or
not, TCC Activation will occur at TjMAX.
5.1.5.1.2 Frequency / Voltage Control
Upon Adaptive Thermal Monitor activation, the processor attempts to dynamically

reduce processor temperature by lowering the frequency and voltage operating point.
The operating points are automatically calculated by the processor IA core itself and do
not require the BIOS to program them as with previous generations of Intel processors.
The processor IA core will scale the operating points such that:
• The voltage will be optimized according to the temperature, the processor IA core
bus ratio and number of processor IA cores in deep C-states.
• The processor IA core power and temperature are reduced while minimizing
performance degradation.
Once the temperature has dropped below the trigger temperature, the operating
frequency and voltage will transition back to the normal system operating point.
Once a target frequency/bus ratio is resolved, the processor IA core will transition to
the new target automatically.
• On an upward operating point transition the voltage transition precedes the
frequency transition.
• On a downward transition the frequency transition precedes the voltage transition.
• The processor continues to execute instructions. However, the processor will halt
instruction execution for frequency transitions.
If a processor load-based Enhanced Intel SpeedStep Technology/P-state transition

(through MSR write) is initiated while the Adaptive Thermal Monitor is active, there are
two possible outcomes:
• If the P-state target frequency is higher than the processor IA core optimized
target frequency, the P-state transition will be deferred until the thermal event has
been completed.
• If the P-state target frequency is lower than the processor IA core optimized target
frequency, the processor will transition to the P-state operating point.
5.1.5.1.3 Clock Modulation
If the frequency/voltage changes are unable to end an Adaptive Thermal Monitor event,
the Adaptive Thermal Monitor will utilize clock modulation. Clock modulation is done by
alternately turning the clocks off and on at a duty cycle (ratio between clock “on” time
and total time) specific to the processor. The duty cycle is factory configured to 25% on
and 75% off and cannot be modified. The period of the duty cycle is configured to 32
microseconds when the Adaptive Thermal Monitor is active. Cycle times are
independent of processor frequency. A small amount of hysteresis has been included to
prevent excessive clock modulation when the processor temperature is near its
maximum operating temperature. Once the temperature has dropped below the
maximum operating temperature, and the hysteresis timer has expired, the Adaptive
Thermal Monitor goes inactive and clock modulation ceases. Clock modulation is
automatically engaged as part of the Adaptive Thermal Monitor activation when the
frequency/voltage targets are at their minimum settings. Processor performance will be
decreased when clock modulation is active. Snooping and interrupt processing are
performed in the normal manner while the Adaptive Thermal Monitor is active.
Clock modulation will not be activated by the Package average temperature control
mechanism.
5.1.5.2 Digital Thermal Sensor

Each processor has multiple on-die Digital Thermal Sensor (DTS) that detects the
processor IA, GT and other areas of interest instantaneous temperature.
Temperature values from the DTS can be retrieved through:

• A software interface using processor Model Specific Register (MSR).
• A processor hardware interface as described in Section 2.4, “Platform
Environmental Control Interface (PECI)”.
89
When temperature is retrieved by the processor MSR, it is the instantaneous
temperature of the given DTS. When temperature is retrieved using PECI, it is the
average of the highest DTS temperature in the package over a 256 ms time window.
Intel recommends using the PECI reported temperature for platform thermal control
that benefits from averaging, such as fan speed control. The average DTS temperature
may not be a good indicator of package Adaptive Thermal Monitor activation or rapid
increases in temperature that triggers the Out of Specification status bit within the
PACKAGE_THERM_STATUS MSR 1B1h and IA32_THERM_STATUS MSR 19Ch.
Code execution is halted in C1 or deeper C- states. Package temperature can still be

monitored through PECI in lower C-states.
Unlike traditional thermal devices, the DTS outputs a temperature relative to the
maximum supported operating temperature of the processor (TjMAX), regardless of TCC
activation offset. It is the responsibility of software to convert the relative temperature
to an absolute temperature. The absolute reference temperature is readable in the
TEMPERATURE_TARGET MSR 1A2h. The temperature returned by the DTS is an implied
negative integer indicating the relative offset from TjMAX. The DTS does not report
temperatures greater than TjMAX. The DTS-relative temperature readout directly
impacts the Adaptive Thermal Monitor trigger point. When a package DTS indicates
that it has reached the TCC activation (a reading of 0x0, except when the TCC
activation offset is changed), the TCC will activate and indicate an Adaptive Thermal
Monitor event. A TCC activation will lower both processor IA core and graphics core
frequency, voltage, or both. Changes to the temperature can be detected using two
programmable thresholds located in the processor thermal MSRs. These thresholds
have the capability of generating interrupts using the processor IA core's local APIC.
Refer to the Intel 64 and IA-32 Architectures Software Developer’s Manual for specific
register and programming details.
5.1.5.2.1 Digital Thermal Sensor Accuracy (Taccuracy)
The error associated with DTS measurements will not exceed ±5 °C within the entire
operating range.
5.1.5.2.2 Fan Speed Control with Digital Thermal Sensor
Digital Thermal Sensor based fan speed control (TFAN) is a recommended feature to
achieve optimal thermal performance. At the TFAN temperature, Intel recommends full
cooling capability before the DTS reading reaches TjMAX.
5.1.5.3 PROCHOT# Signal

PROCHOT# (processor hot) is asserted by the processor when the TCC is active. Only a
single PROCHOT# pin exists at a package level. When any DTS temperature reaches
the TCC activation temperature, the PROCHOT# signal will be asserted. PROCHOT#
assertion policies are independent of Adaptive Thermal Monitor enabling.
5.1.5.4 Bi-Directional PROCHOT#
By default, the PROCHOT# signal is set to input only. When configured as an input or
bi-directional signal, PROCHOT# can be used for thermally protecting other platform
components should they overheat as well. When PROCHOT# is driven by an external
device:
• The package will immediately transition to the lowest P-State (Pn) supported by the
processor IA cores and graphics cores. This is contrary to the internally-generated
Adaptive Thermal Monitor response.
• Clock modulation is not activated.
The processor package will remain at the lowest supported P-state until the system de-
asserts PROCHOT#. The processor can be configured to generate an interrupt upon
assertion and de-assertion of the PROCHOT# signal.
When PROCHOT# is configured as a bi-directional signal and PROCHOT# is asserted by

the processor, it is impossible for the processor to detect a system assertion of
PROCHOT#. The system assertion will have to wait until the processor de-asserts
PROCHOT# before PROCHOT# action can occur due to the system assertion. While the
processor is hot and asserting PROCHOT#, the power is reduced but the reduction rate
is slower than the system PROCHOT# response of < 100 us. The processor thermal
control is staged in smaller increments over many milliseconds. This may cause several
milliseconds of delay to a system assertion of PROCHOT# while the output function is
asserted.
5.1.5.5 Voltage Regulator Protection using PROCHOT#

PROCHOT# may be used for thermal protection of voltage regulators (VR). System
designers can create a circuit to monitor the VR temperature and assert PROCHOT#
and, if enabled, activate the TCC when the temperature limit of the VR is reached.
When PROCHOT# is configured as a bi-directional or input only signal, if the system
assertion of PROCHOT# is recognized by the processor, it will result in an immediate
transition to the lowest P-State (Pn) supported by the processor IA cores and graphics
cores. Systems should still provide proper cooling for the VR and rely on bi-directional
PROCHOT# only as a backup in case of system cooling failure. Overall, the system
thermal design should allow the power delivery circuitry to operate within its
temperature specification even while the processor is operating at its TDP.
5.1.5.6 Thermal Solution Design and PROCHOT# Behavior

With a properly designed and characterized thermal solution, it is anticipated that
PROCHOT# will only be asserted for very short periods of time when running the most
power intensive applications. The processor performance impact due to these brief
periods of TCC activation is expected to be so minor that it would be immeasurable.
However, an under-designed thermal solution that is not able to prevent excessive
assertion of PROCHOT# in the anticipated ambient environment may:
• Cause a noticeable performance loss.
• Result in prolonged operation at or above the specified maximum junction
temperature and affect the long-term reliability of the processor.
• May be incapable of cooling the processor even when the TCC is active continuously
(in extreme situations).
91
5.1.5.7 Low-Power States and PROCHOT# Behavior
Depending on package power levels during package C-states, outbound PROCHOT#
may de-assert while the processor is idle as power is removed from the signal. Upon
wake up, if the processor is still hot, the PROCHOT# will re-assert. Although, typically
package idle state residency should resolve any thermal issues. The PECI interface is
fully operational during all C-states and it is expected that the platform continues to
manage processor IA core and package thermals even during idle states by regularly
polling for thermal data over PECI.
5.1.5.8 THERMTRIP# Signal

Regardless of enabling the automatic or on-demand modes, in the event of a
catastrophic cooling failure, the package will automatically shut down when the silicon
has reached an elevated temperature that risks physical damage to the product. At this
point, the THERMTRIP# signal will go active.
5.1.5.9 Critical Temperature Detection

Critical Temperature detection is performed by monitoring the package temperature.
This feature is intended for graceful shutdown before the THERMTRIP# is activated.
However, the processor execution is not guaranteed between critical temperature and
THERMTRIP#. If the Adaptive Thermal Monitor is triggered and the temperature
remains high, a critical temperature status and sticky bit are latched in the
PACKAGE_THERM_STATUS MSR 1B1h and the condition also generates a thermal
interrupt, if enabled. For more details on the interrupt mechanism, refer to the Intel®
64 and IA-32 Architectures Software Developer’s Manual ( Related Documents section).
5.1.5.10 On-Demand Mode

The processor provides an auxiliary mechanism that allows system software to force
the processor to reduce its power consumption using clock modulation. This
mechanism is referred to as “On-Demand” mode and is distinct from Adaptive Thermal
Monitor and bi-directional PROCHOT#. The processor platforms should not rely on
software usage of this mechanism to limit the processor temperature. On-Demand
Mode can be accomplished using processor MSR or chipset I/O emulation. On-Demand
Mode may be used in conjunction with the Adaptive Thermal Monitor. However, if the
system software tries to enable On-Demand mode at the same time the TCC is
engaged, the factory configured duty cycle of the TCC will override the duty cycle
selected by the On-Demand mode. If the I/O based and MSR-based On-Demand modes
are in conflict, the duty cycle selected by the I/O emulation-based On-Demand mode
will take precedence over the MSR-based On-Demand Mode.
5.1.5.11 MSR Based On-Demand Mode

If Bit 4 of the IA32_CLOCK_MODULATION MSR is set to 1, the processor will
immediately reduce its power consumption using modulation of the internal processor
IA core clock, independent of the processor temperature. The duty cycle of the clock
modulation is programmable using bits [3:1] of the same IA32_CLOCK_MODULATION
MSR. In this mode, the duty cycle can be programmed in either 12.5% or 6.25%
increments (discoverable using CPUID). Thermal throttling using this method will
modulate each processor IA core's clock independently.
5.1.5.12 I/O Emulation-Based On-Demand Mode
I/O emulation-based clock modulation provides legacy support for operating system
software that initiates clock modulation through I/O writes to ACPI defined processor
clock control registers on the chipset (PROC_CNT). Thermal throttling using this
method will modulate all processor IA cores simultaneously.
5.1.6 Intel® Memory Thermal Management

The processor provides thermal protection for system memory by throttling memory
traffic when using either DIMM modules or a memory down implementation. Two levels
of throttling are supported by the processor, either a warm threshold or hot threshold
that is customizable through memory mapped I/O registers. Throttling based on the
warm threshold should be an intermediate level of throttling. Throttling based on the
hot threshold should be the most severe. The amount of throttling is dynamically
controlled by the processor.
The on Die Thermal Sensor (ODTS) uses a physical thermal sensor on DRAM dies.
ODTS is available for DDR4 and LPDDR3. It is used to set refresh rate according to
DRAM temperature.
The memory controller reads LPDDR3 MR4 or DDR4 MR3 and configures the DDR
refresh rate accordingly.
When using ODTS, the memory controller gets a Warm/Hot/Cold indication from
DRAMs On-Die TS and throttles DDR accordingly. This is a method of Closed Loop
Thermal Management (CLTM). Refer to document 604677 for more details on closed
loop thermal management.
Memory temperature may be acquired through an on-board thermal sensor (TS-on-

Board), retrieved by an embedded controller and reported to the processor through the
PECI 3.1 interface. This methodology is known as PECI injected temperature. This is a
method of Closed Loop Thermal Management (CLTM).
5.1.7 Scenario Design Power (SDP)

SDP requires that the POWER_LIMIT_1 (PL1) to be set to the cooling level capability
(SDP level, or higher). While the SDP specification is characterized at Tj of 80 °C, the
functional limit for the product remains at TjMAX. Customers may choose to program
the TCC Offset to have TCC Activation at 80 °C, but it is not required.
The processors that have SDP specified can still exceed SDP under certain workloads,
such as TDP workloads. TDP power dissipation is still possible with the intended usage
models, and protection mechanisms to handle levels beyond cooling capabilities are
recommended. Intel recommends using such thermal control mechanisms to manage
situations where power may exceed the thermal design capability.
Note: cTDP-Down mode is required for Intel Core products in order to achieve SDP.
Note: Although SDP is defined at 80 °C, the TCC activation temperature is TjMAX.
93
5.2 Thermal and Power Specifications
The following notes apply only to Table 5.2 and Table 5-7.
Note Definition
The TDP and Configurable TDP values are the average power dissipation in junction temperature
operating condition limit, for the SKU Segment and Configuration, for which the processor is validated
1
during manufacturing when executing an associated Intel-specified high-complexity workload at the
processor IA core frequency corresponding to the configuration and SKU.
TDP workload may consist of a combination of processor IA core intensive and graphics core intensive
2
applications.
3 Can be modified at runtime by MSR writes, with MMIO and with PECI commands.
'Turbo Time Parameter' is a mathematical parameter (units of seconds) that controls the processor
4 turbo algorithm using a moving average of energy usage. Do not set the Turbo Time Parameter to a
value less than 0.1 seconds. refer to Section 5.1.3.2, “Platform Power Control” for further information.
Shown limit is a time averaged power, based upon the Turbo Time Parameter. Absolute product power
5
may exceed the set limits for short durations or under virus or uncharacterized workloads.
Processor will be controlled to specified power limit as described in Section 5.1.2, “Intel® Turbo Boost
Technology 2.0 Power Monitoring”
. If the power value and/or 'Turbo Time Parameter' is changed during
6
runtime, it may take a short period of time (approximately 3 to 5 times the 'Turbo Time Parameter')
for the algorithm to settle at the new control limits.
This is a hardware default setting and not a behavioral characteristic of the part. The reference BIOS
7
code may override the hardware default power limit values to optimize performance
8 For controllable turbo workloads, the PL2 limit may be exceeded for up to 10 ms.
Refer to Table 5-1, “Configurable TDP Modes” for the definitions of ’base’base, 'TDP-Up' and 'TDP-
9
Down'.
LPM power level is an opportunistic power and is not a guaranteed value as usages and
10
implementations may vary.
Power limits may vary depending on if the product supports the 'TDP-up' and/or 'TDP-down' modes.
11
Default power limits can be found in the PKG_PWR_SKU MSR (614h).
The processor die and OPCM die do not reach maximum sustained power simultaneously since the
12 sum of the 2 dies estimated power budget is controlled to be equal to or less than the package TDP
(PL1) limit.
cTDP down power is based on GT2 equivalent graphics configuration. cTDP down does not decrease
13 the number of active Processor Graphics EUs, but relies on Power Budget Management (PL1) to
achieve the specified power level.
14 May vary based on SKU.
16 Sustained residencies at high voltages and temperatures may temporarily limit turbo frequency.
The formula of PL2=PL1*1.25 is the hardware default but may not represent the optimum value for
processor performance.
17
By including the benefits available from power and thermal management features the recommended
value for PL2 found in the Power Map can be higher.
5.2.1 KBL U/Y Processor Line Thermal and Power
Specifications
Table 5-2. TDP Specifications (KBL U/Y/AML-Y22 Processor Line)

Processor IA
Thermal Scenario
Segment Cores, Processor IA
Graphics core Design Design
and Graphics Configuration Core Notes
Frequency Power Power
Package Configuration Frequency
(TDP) [w] (SDP) [w]
and TDP
Configurable 2.7 GHz to

25
TDP-Up 2.9 GHz
U- 2.4 GHz to 900 MHz to

2 Core GT2 Base 15 1,9,10,
Processor 2.7 GHz 1.1 GHz N/A
15W 11,16
Line BGA Configurable
800 MHz 7.5
TDP-Down / LFM
LPM 400 MHz 300 MHz ~7
Configurable
1.6 GHz 7
TDP-Up
Y- 1.0 GHz to 300 MHz to

2 Core GT2 Base 4.5 1,9,10,
Processor 1.3 GHz 1.05 GHz 3.0
4.5W 11,16,17
Line BGA Configurable
600 MHz 3.75
TDP-Down
LFM 400 MHz 100 MHz ~3.75
Y- 1.3 GHz to
Base 6
Processor 1.5 GHz 300 MHz to
Line BGA 2 Core GT2 850 MHz 1,9,10,
Configurable N/A
6W 600 MHz 4.5 11,16,17
TDP-Down
LFM 400 MHz 100 MHz ~3.75
AML-Y Configurable
1.6 GHz 7
Processor TDP-Up
Line BGA 1.1 GHz to 900 MHz to
2 Core GT2 Base 5 1,9,10,
1.5 GHz 1.05GHz N/A
5W 11,16,17
Configurable
600 MHz 3.5
TDP-Down
LFM 400 MHz 300 MHz ~3.5
Note: The ~ sign stands for approximation.
Table 5-3. Package Turbo Specifications (KBL U/Y and AML-Y22 Processor Line) (Sheet 1
of 2)
Processor IA
Segment
Cores, Graphics Hardware
and Parameter Min. Max Units Notes
Configuration Default
Package
and TDP
U- Power Limit 1 Time (PL1 Tau) 0.01 1 448 s

2-Core GT3 3,4,5,6,7,
Processor Power Limit 1 (PL1) N/A 28 N/A W
28W with OPC 8,14,17
Line BGA Power Limit 2 (PL2) N/A 1.25*28 N/A W

2- Core GT3 3,4,5,6,7,
95
Table 5-3. Package Turbo Specifications (KBL U/Y and AML-Y22 Processor Line) (Sheet 2
of 2)
Processor IA
Segment
Package
and TDP

2-Core GT2 3,4,5,6,7,
15W 8,14,17
Y- Power Limit 1 Time (PL1 Tau) 0.01 1 448 s

2-Core GT2 3,4,5,6,7,
Processor Power Limit 1 (PL1) N/A 4.5 N/A W
~4.5W 8,14,17
Line BGA Power Limit 2 (PL2) N/A 1.25*4.5 N/A W
AML-Y Power Limit 1 Time (PL1 Tau) 0.01 1 448 s

2-Core GT2 3,4,5,6,7,
5W) 8,14,17
Note: No Specifications for Min/Max PL1/PL2 values, refer PAG (Power Arch Guide) for PL1/PL2 recommendation.
Table 5-4. Junction Temperature Specifications (KBL U/Y and AML-Y22 Processor Line)
TDP Specification
Temperature Range
Package Turbo Temperature Range
Segment Symbol Units Notes
Parameter
Min Max Min Max
U/U- 4 Core Tj Junction temperature

Processor Line limit 0 100 35 100 ºC 1, 2
BGA
U-Processor Line + Tj Junction temperature

0 100 35 100 ºC 1, 2
OPC BGA limit
Y-Processor Line Tj Junction temperature

0 100 N/A 90 ºC 1, 2, 3
BGA limit
AML-Y22 Processor Tj Junction temperature

0 100 N/A 90 ºC 1, 2, 3
Line BGA limit
Notes:
1. The thermal solution needs to ensure that the processor temperature does not exceed the TDP Specification Temperature.
2. The processor junction temperature is monitored by Digital Temperature Sensors (DTS). For DTS accuracy, refer to Section
5.1.5.2.1, “Digital Thermal Sensor Accuracy (Taccuracy)”.
3. For this SKU to be specification compliance to the 90 ºC TDP specification temperature, TCC Offset = 10 and Tau value
should be programed into MSR 1A2h. The recommended TCC_Offset averaging Tau value is 5s. Refer to the Volume 2 for
additional details.
5.3
§§
5.3.1 KBL U/Y Processor Line Thermal and Power

Specifications
Note: The ~ sign stands for approximation.
Table 5-6. Package Turbo Specifications (U/Y and AML-Y22 Processor Line)
Processor IA
Segment
Package
and TDP

2-Core GT3 3,4,5,6,7,

2- Core GT3 3,4,5,6,7,

2-Core GT2 3,4,5,6,7,
15W 8,14,17
Y- Power Limit 1 Time (PL1 Tau) 0.01 1 448 s

2-Core GT2 3,4,5,6,7,
Processor Power Limit 1 (PL1) N/A 4.5 N/A W
~4.5W 8,14,17
Line BGA Power Limit 2 (PL2) N/A 1.25*4.5 N/A W
H-Y Power Limit 1 Time (PL1 Tau) 0.01 1 448 s

Quad-Core GT2 3,4,5,6,7,
5W) 8,14,17
Note: No Specifications for Min/Max PL1/PL2 values, refer PAG (Power Arch Guide) for PL1/PL2 recommendation.
Table 5-7. Junction Temperature Specifications (KBL U/Y and AML-Y22 Processor Line)
TDP Specification
Temperature Range
Package Turbo Temperature Range
Segment Symbol Units Notes
Parameter
Min Max Min Max
U/U- 4 Core Tj Junction temperature

Processor Line limit 0 100 35 100 ºC 1, 2
BGA
U-Processor Line + Tj Junction temperature

0 100 35 100 ºC 1, 2
OPC BGA limit
Y-Processor Line Tj Junction temperature

0 100 N/A 90 ºC 1, 2, 3
BGA limit
AML-Y22 Processor Tj Junction temperature

0 100 N/A 90 ºC 1, 2, 3
Line BGA limit
Notes:
1. The thermal solution needs to ensure that the processor temperature does not exceed the TDP Specification Temperature.
2. The processor junction temperature is monitored by Digital Temperature Sensors (DTS). For DTS accuracy, refer to Section
5.1.5.2.1, “Digital Thermal Sensor Accuracy (Taccuracy)”.
3. For this SKU to be specification compliance to the 90 ºC TDP specification temperature, TCC Offset = 10 and Tau value
should be programed into MSR 1A2h. The recommended TCC_Offset averaging Tau value is 5s. Refer to the Volume 2 for
additional details.
97
6 Signal Description
This chapter describes the processor signals. They are arranged in functional groups
according to their associated interface or category. The notations in the following table
are used to describe the signal type.
The signal description also includes the type of buffer used for the particular signal (see
the following table).
Table 6-1. Signal Tables Terminology

Notation Signal Type
I Input pin
O Output pin
I/O Bi-directional Input/Output pin
SE Single Ended Link
Diff Differential Link
CMOS CMOS buffers. 1.05V- tolerant
OD Open Drain buffer
DDR3L/-RS DDR3L/DDR3L-RS buffers: 1.35V-tolerant
DDR3L/-RS DDR3L/DDR3L-RS buffers: 1.35V-tolerant
LPDDR3 LPDDR3 buffers: 1.2V- tolerant
DDR4 DDR4 buffers: 1.2V-tolerant
Analog reference or output. May be used as a threshold voltage or for buffer

A
compensation
GTL Gunning Transceiver Logic signaling technology
Ref Voltage reference signal
Availability Signal Availability condition - based on segment, SKU, platform type or any other factor
Asynchronous 1 Signal has no timing relationship with any reference clock.
Note:
1. Qualifier for a buffer type.
6.1 System Memory Interface

Table 6-2. DDR3L/-RS Memory Interface (Sheet 1 of 2)
Buffer Link
Signal Name Description Dir. Availability
Type Type
DDR0_DQ[63:0] Data Buses: Data signals interface to the SDRAM

data buses. I/O DDR3L SE All Processor Lines
DDR1_DQ[63:0]
DDR0_DQSP[7:0] Data Strobes: Differential data strobe pairs. The

DDR0_DQSN[7:0] data is captured at the crossing point of DQS during
read and write transactions. I/O DDR3L Diff All Processor Lines
DDR1_DQSP[7:0]
DDR1_DQSN[7:0]
99
Table 6-2. DDR3L/-RS Memory Interface (Sheet 2 of 2)
Buffer Link
Type Type
SDRAM Differential Clock: Differential clocks

DDR0_CKN[1:0] signal pairs, pair per rank. The crossing of the [1:0] applicable for all
DDR0_CKP[1:0] positive edge of DDR0_CKP/DDR1_CKP and the
O DDR3L Diff Processor Lines.
DDR1_CKN[1:0] negative edge of their complement DDR0_CKN /
DDR1_CKP[1:0] DDR1_CKN are used to sample the command and
control signals on the SDRAM.
Clock Enable: (1 per rank). These signals are used

to:
[1:0] applicable for all
DDR0_CKE[1:0] • Initialize the SDRAMs during power-up.
O DDR3L SE Processor Lines.
DDR1_CKE[1:0] • Power-down SDRAM ranks.
• Place all SDRAM ranks into and out of self-
refresh during STR (Suspend to RAM).
Chip Select: (1 per rank). These signals are used [1:0] applicable for all
DDR0_CS#[1:0] to select particular SDRAM components during the
O DDR3L SE Processor Lines.
DDR1_CS#[1:0] active state. There is one Chip Select for each
SDRAM rank.
On Die Termination: (1 per rank). Active [0] applicable for all

SDRAM Termination Control. Processor Lines.
DDR0_ODT[1:0] [1:0] applicable for U/
O DDR3L SE U-4 Core Processor
DDR1_ODT[1:0]
Lines.
Memory Address: These signals are used to

provide the multiplexed row and column address to
the SDRAM.
• A10 is sampled during Read/Write commands
to determine whether Autoprecharge should be
performed to the accessed bank after the
Read/Write operation.
HIGH: Autoprecharge;
LOW: no Autoprecharge.
DDR0_MA[15:0]
• A10 is sampled during a Precharge command O DDR3L SE All Processor Lines
DDR1_MA[15:0]
to determine whether the Precharge applies to
one bank (A10 LOW) or all banks (A10 HIGH).
If only one bank is to be precharged, the bank
is selected by bank addresses.
• A12 is sampled during Read and Write
commands to determine if burst chop (on-the-
fly) will be performed.
HIGH: no burst chop;
LOW: burst chopped.
DDR0_BA[2:0] Bank Select: These signals define which banks are

selected within each SDRAM rank. O DDR3L SE All Processor Lines
DDR1_BA[2:0]
DDR0_CAS# CAS Control Signal: Column Address Select

command signal O DDR3L SE All Processor Lines
DDR1_CAS#
DDR0_RAS# RAS Control Signal: Row Address Select
command signal O DDR3L SE All Processor Lines
DDR1_RAS#
DDR0_WE# WE Control Signal: Write Enable command signal

O DDR3L SE All Processor Lines
DDR1_WE#
DDR0_VREF_DQ Memory Reference Voltage for DQ:

O A SE All Processor Lines
DDR1_VREF_DQ
Memory Reference Voltage for Command &

DDR_VREF_CA O A SE All Processor Lines
Address:

Table 6-3. LPDDR3 Memory Interface
Buffer Link
Type Type

data buses. I/O LPDDR3 SE All Processor Lines
DDR1_DQ[63:0]

read and write transactions. I/O LPDDR3 Diff All Processor Lines
DDR1_DQSP[7:0]
DDR1_DQSN[7:0]

DDR0_CKN[1:0] signal pairs, pair per rank. The crossing of the
O LPDDR3 Diff All Processor Lines
Clock Enable: (1 per rank) These signals are used

to:
O LPDDR3 SE All Processor Lines.
refresh during STR.
Chip Select: (1 per rank). These signals are used

O LPDDR3 SE All Processor Lines
SDRAM rank.
On Die Termination: Active Termination Control. For LPDDR3 only

ODT[0] is in use.
[0] applicable for Y-
DDR0_ODT[3:0]
O LPDDR3 SE Processor Lines.
DDR1_ODT[3:0]
[1:0] applicable for U
Processor Line.
DDR0_CAA[9:0] Command Address: These signals are used to

provide the multiplexed command and address to O LPDDR3 SE All Processor Lines
DDR1_CAA[9:0] the SDRAM.
DDR0_CAB[9:0] Command Address: These signals are used to

provide the multiplexed command and address to O LPDDR3 SE All Processor Lines
DDR1_CAB[9:0] the SDRAM.
DDR0_VREF_DQ Memory Reference Voltage for DQ:

O A SE All Processor Lines
DDR1_VREF_DQ

Address:
Table 6-4. DDR4 Memory Interface (Sheet 1 of 3)

Buffer Link
Type Type

data buses. I/O DDR4 SE All Processor Lines
DDR1_DQ[63:0]

read and write transactions. I/O DDR4 Diff All Processor Lines
DDR1_DQSP[7:0]
DDR1_DQSN[7:0]
101
Buffer Link
Type Type

DDR0_CKN[1:0] signal pairs, pair per rank. The crossing of the [1:0] applicable for All
O DDR4 Diff Processor Lines.
Clock Enable: (1 per rank). These signals are used

to:
[1:0] applicable for All
O DDR4 SE Processor Lines.
refresh during STR (Suspend to RAM).
Chip Select: (1 per rank). These signals are used [1:0] applicable for All
O DDR4 SE Processor Lines.
SDRAM rank.
On Die Termination: (1 per rank). Active SDRAM [0] applicable for Y-

Termination Control. Processor
DDR0_ODT[1:0] Lines.
O DDR4 SE
DDR1_ODT[1:0] [1:0] applicable for U
and U- 4 Core Line
processors
Address: These signals are used to provide the

multiplexed row and column address to the SDRAM.
• A[16:14] use also as command signals, see
ACT# signal description.
• A10 is sampled during Read/Write commands
to determine whether Autoprecharge should be
performed to the accessed bank after the
Read/Write operation.
HIGH: Autoprecharge;
DDR0_MA[16:0] LOW: no Autoprecharge).
O DDR4 SE All Processor Lines
DDR1_MA[16:0] • A10 is sampled during a Precharge command
to determine whether the Precharge applies to
one bank (A10 LOW) or all banks (A10 HIGH).
If only one bank is to be precharged, the bank
is selected by bank addresses.
• A12 is sampled during Read and Write
commands to determine if burst chop (on-the-
fly) will be performed.
HIGH, no burst chop;
LOW: burst chopped).
Activation Command: ACT# HIGH along with

CS# determines that the signals addresses below
DDR0_ACT# have command functionality.
A16 use as RAS# signal O DDR4 SE All Processor Lines
DDR1_ACT#
A15 use as CAS# signal
A14 use as WE# signal
Bank Group: BG[0:1] define to which bank group All processor lines
an Active, Read, Write or Precharge command is SO-DIMM, x8 DRAMs,
DDR0_BG[1:0] being applied. x16 DDP DRAMs
O DDR4 SE
DDR1_BG[1:0] BG0 also determines which mode register is to be devices use BG[1:0].
accessed during a MRS cycle. x16 SDP DRAMs
devices use BG[0]
Bank Address: BA[1:0] define to which bank an

DDR0_BA[1:0] Active, Read, Write or Precharge command is being
O DDR4 SE All Processor Lines
DDR1_BA[1:0] applied. Bank address also determines which mode
register is to be accessed during a MRS cycle.

Buffer Link
Type Type
Alert: This signal is used at command training only.

DDR0_ALERT# It is getting the Command and Address Parity error I DDR4 SE All Processor Lines
DDR1_ALERT# flag during training. CRC feature is not supported.
DDR0_PAR Command and Address Parity: These signals are

used for parity check. O DDR4 SE All Processor Lines
DDR1_PAR
Address:
Table 6-5. System Memory Reference and Compensation Signals

Buffer Link
Type Type
DDR_RCOMP[2:0] System Memory Resistance Compensation: N/A A SE All Processor Lines
On-Package Cache resistance Compensation

Processors w/ on-
OPC_RCOMP from processor: Unconnected for Processors N/A A SE
package cache
without OPC.
On-Package Cache resistance Compensation

from OPC: Unconnected for Processors without Processors w/ on-
OPCE_RCOMP OPC. N/A A SE
package cache
System Memory Power Gate Control: When

signal is high – platform memory VTT regulator is
DDR_VTT_CNTL enable, output high. O CMOS SE All Processor Lines
When signal is low - Disables the platform memory
VTT regulator in C8 and deeper and S3.
6.2 Reset and Miscellaneous Signals

Table 6-6. Reset and Miscellaneous Signals (Sheet 1 of 2)
Buffer Link
Type Type
Configuration Signals: The CFG signals have a

default value of '1' if not terminated on the board.
Intel recommends placing test points on the board
for CFG pins.
• CFG[0]: Stall reset sequence after PCU PLL
lock until de-asserted:
— 1 = (Default) Normal Operation; No
stall.
— 0 = Stall.
All Processor Lines.
CFG[19:0] • CFG[1]: Reserved configuration lane. I GTL SE
.
• CFG[2]: Reserved
• CFG[3]: Reserved configuration lane.
• CFG[4]: eDP enable:
— 1 = Disabled.
— 0 = Enabled.
• CFG[6:5]: Reserved
• CFG[7]: Reserved
• CFG[19:8]: Reserved configuration lanes.
CFG_RCOMP Configuration Resistance Compensation N/A N/A SE All Processor Lines
POPIO Resistance Compensation Y and U/U- 4 Core

PROC_POPIRCOMP N/A N/A SE
Processor Line
103
Table 6-6. Reset and Miscellaneous Signals (Sheet 2 of 2)
Buffer Link
Type Type
Processor Select: This pin is for compatibility

PROC_SELECT# with future platforms. It should be unconnected N/A All Processor Lines
for this processor.
6.3 embedded DisplayPort* (eDP*) Signals

Table 6-7. embedded DisplayPort* Signals
Buffer Link
Type Type
eDP_TXP[3:0] embedded DisplayPort Transmit: differential pair

O eDP Diff All Processor Lines
eDP_TXN[3:0]
eDP_AUXP embedded DisplayPort Auxiliary: Half-duplex,

bidirectional channel consist of one differential pair. O eDP Diff All Processor Lines
eDP_AUXN
embedded DisplayPort Utility: Output control

signal used for brightness correction of embedded
LCD displays with backlight modulation. Async
eDP_DISP_UTIL O SE All Processor Lines
CMOS
This pin will co-exist with functionality similar to
existing BKLTCTL pin on PCH
DDI IO Compensation resistor, supporting

eDP_RCOMP N/A A SE All Processor Lines
DP*, eDP* and HDMI* channels.
6.4 Display Interface Signals

Table 6-8. Display Interface Signals
Buffer Link
Signal Name Description Dir. Availability(2)
Type Type
DDI1_TXP[3:0] Digital Display Interface Transmit:

DDI1_TXN[3:0] Differential Pairs DP/
O Diff
DDI2_TXP[3:0] HDMI*
DDI2_TXN[3:0] All Processor Lines.
DDI1_AUXP Digital Display Interface Display Port
DDI1_AUXN Auxiliary: Half-duplex, bidirectional DP/
channel consist of one differential pair for O Diff
DDI2_AUXP HDMI*
each channel.
DDI2_AUXN
Note:
1. For DDC signals, refer to the PCH UY Datasheet or PCH H Datasheet (See Related Documents section).
2. DDI3_AUXN and DDI3_AUXP are valid in U/U- 4 Core Processor Line but should be considered as reserved pins.
6.5 Testability Signals

Table 6-9. Testability Signals (Sheet 1 of 2)
Buffer Link
Type Type
Breakpoint and Performance Monitor Signals:

Outputs from the processor that indicate the status
BPM#[3:0] I/O GTL SE All Processor Lines
of breakpoints and programmable counters used for
monitoring processor performance.

Table 6-9. Testability Signals (Sheet 2 of 2)
Buffer Link
Type Type
Probe Mode Ready: PROC_PRDY# is a processor

PROC_PRDY# output used by debug tools to determine processor O OD SE All Processor Lines
debug readiness.
Probe Mode Request: PROC_PREQ# is used by

PROC_PREQ# debug tools to request debug operation of the I GTL SE All Processor Lines
processor.
Test Clock: This signal provides the clock input for

the processor Test Bus (also known as the Test
PROC_TCK I GTL SE All Processor Lines
Access Port). This signal should be driven low or
allowed to float during power on Reset.
Test Data In: This signal transfers serial test data

PROC_TDI into the processor. This signal provides the serial I GTL SE All Processor Lines
input needed for JTAG specification support.
Test Data Out: This signal transfers serial test data

PROC_TDO out of the processor. This signal provides the serial O OD SE All Processor Lines
output needed for JTAG specification support.
Test Mode Select: A JTAG specification support

PROC_TMS I GTL SE All Processor Lines
signal used by debug tools.
Test Reset: Resets the Test Access Port (TAP) logic.

PROC_TRST# This signal should be driven low during power on I GTL SE All Processor Lines
Reset.
6.6 Error and Thermal Protection Signals

Table 6-10. Error and Thermal Protection Signals
Buffer Link
Type Type
Catastrophic Error: This signal indicates that the

system has experienced a catastrophic error and
cannot continue to operate. The processor will set this
signal for non-recoverable machine check errors or
CATERR# other unrecoverable internal errors. CATERR# is used O OD SE All Processor Lines
for signaling the following types of errors: Legacy
MCERRs, CATERR# is asserted for 16 BCLKs. Legacy
IERRs, CATERR# remains asserted until warm or cold
reset.
Platform Environment Control Interface: A serial

sideband interface to the processor. It is used
primarily for thermal, power, and error management.
PECI,
PECI Details regarding the PECI electrical specifications, I/O SE All Processor Lines
Async
protocols and functions can be found in the RS-
Platform Environment Control Interface (PECI)
Specification, Revision 3.0.
Processor Hot: PROCHOT# goes active when the

processor temperature monitoring sensor(s) detects
that the processor has reached its maximum safe GTL I
PROCHOT# operating temperature. This indicates that the I/O SE All Processor Lines
processor Thermal Control Circuit (TCC) has been OD O
activated, if enabled. This signal can also be driven to
the processor to activate the TCC.
Thermal Trip: The processor protects itself from

catastrophic overheating by use of an internal thermal
sensor. This sensor is set well above the normal
operating temperature to ensure that there are no
THERMTRIP# O OD SE All Processor Lines
false trips. The processor will stop all executions when
the junction temperature exceeds approximately
130 °C. This is signaled to the system by the
THERMTRIP# pin.
105
6.7 Power Sequencing Signals
Table 6-11. Power Sequencing Signals
Link
Signal Name Description Dir. Buffer Type Availability
Type
Processor Power Good: The processor

requires this input signal to be a clean
indication that the VCC and VDDQ power supplies
are stable and within specifications. This
requirement applies regardless of the S-state of
PROCPWRGD the processor. 'Clean' implies that the signal will I CMOS SE All Processor Lines
remain low (capable of sinking leakage
current), without glitches, from the time that
the power supplies are turned on until they
come within specification. The signal should
then transition monotonically to a high state.
VCCST Power Good: The processor requires

this input signal to be a clean indication that
the VCCST and VDDQ power supplies are stable
and within specifications. This signal should
have a valid level during both S0 and S3 power
VCCST_PWRGD states. 'Clean' implies that the signal will I CMOS SE All Processor Lines
remain low (capable of sinking leakage
current), without glitches, from the time that
the power supplies are turned on until they
come within specification. The signal should
then transition monotonically to a high state.
Processor Detect / Socket Occupied: Pulled

down directly (0 Ohms) on the processor
PROC_DETECT# package to the ground. There is no connection
N/A N/A SE All Processor Lines
/SKTOCC# to the processor silicon for this signal. System
board designers may use this signal to
determine if the processor is present.
VIDSOUT, VIDSCK, VIDALERT#: These

VIDSOUT signals comprise a three-signal serial I/O I:GTL/O:OD
VIDSCK synchronous interface used to transfer power O OD SE All Processor Lines
VIDALERT# management information between the I CMOS
processor and the voltage regulator controllers.
Minimum Speed Mode: Control signal to

Processors w/ on-
MSM# VccEOPIO VR (connected only in 2 VR solution O CMOS SE
package cache
for OPC).
Zero Voltage Mode: Control Signal to OPC VR, Processors w/ on-

ZVM# O CMOS SE
when low OPC VR output is 0V. package cache

6.8 Processor Power Rails
Table 6-12. Processor Power Rails Signals
Buffer Link
Type Type
Vcc Processor IA cores power rail I Power — All Processor Lines
Processor IA cores gated power rail, connects to Y-Processor Line

VCCG0/1 board capacitors for filtering. I Power — AML-Y22 Processor
Line
VccGT Processor Graphics power rail I Power — All Processor Lines
VccGTX Processor Graphics power rail (extension) I Power - Processors w/ GT3
VDDQ System Memory power rail I Power — All Processor Lines
System Memory clock power rail, feeds from VDDQ U/Y-Processor Lines
VDDQC through LP filter. I Power — AML-Y22 Processor
Line
VccSA Processor System Agent power rail I Power — All Processor Lines
Processor I/O power rail. Consists of VCCIO and

VccIO VccIO_DDR. VCCIO and VCCIO_DDR should be isolated I Power — All Processor Lines
from each other.
VccST Sustain voltage for processor standby modes I Power — All Processor Lines
Gated sustain voltage for processor standby modes KBL U/Y-Processor

Lines
VccSTG I Power —
AML-Y22 Processor
Line
VccPLL Processor PLLs power rails I Power — All Processor Lines
VccPLL_OC Processor PLLs power rails I Power — All Processor Lines
Processor OPC power rails Processors w/ on-

VccOPC I Power -
package cache

VccOPC_1p8 I Power -
package cache

VccEOPIO I Power -
package cache
Vcc_SENSE Isolated, low impedance voltage sense pins. They

can be used to sense or measure voltage near the N/A Power — All Processor Lines
Vss_SENSE silicon.
VccGT_SENSE Isolated, low impedance voltage sense pins. They

VssGT_SENSE silicon.
VccGTx_SENSE Isolated, low impedance voltage sense pins. They

can be used to sense or measure voltage near the N/A Power - Processors w/ GT3
VssGTx_SENSE silicon.
VccIO_SENSE Isolated, low impedance voltage sense pins. They

VssIO_SENSE silicon.
VccSA_SENSE Isolated, low impedance voltage sense pins. They

VssSA_SENSE silicon.
VccOPC_SENSE Isolated, low impedance voltage sense pins. They

Processors w/ on-
can be used to sense or measure voltage near the N/A Power -
VssOPC_SENSE package cache
silicon.
VccEOPIO_SENSE Isolated, low impedance voltage sense pins. They

Processors w/ on-
can be used to sense or measure voltage near the N/A Power -
VssEOPIO_SENSE package cache
silicon.
107
6.9 Ground, Reserved and Non-Critical to Function
(NCTF) Signals
The following are the general types of reserved (RSVD) signals and connection
guidelines:
• RSVD – these signals should not be connected
• RSVD_TP – these signals should be routed to a test point
• RSVD_NCTF – these signals are non-critical to function and may be left un-
connected
Arbitrary connection of these signals to VCC, VDDQ, VSS, or to any other signal
(including each other) may result in component malfunction or incompatibility with
future processors. See Table 6-13, “GND, RSVD, and NCTF Signals”.
For reliable operation, always connect unused inputs or bi-directional signals to an

appropriate signal level. Unused active high inputs should be connected through a
resistor to ground (VSS). Unused outputs may be left unconnected however, this may
interfere with some Test Access Port (TAP) functions, complicate debug probing and
prevent boundary scan testing. A resistor should be used when tying bi-directional
signals to power or ground. When tying any signal to power or ground, the resistor can
also be used for system testability.
Table 6-13. GND, RSVD, and NCTF Signals

Signal Name Description
Vss Processor ground node
Vss_NCTF Non-Critical To Function: These signals are for package

mechanical reliability.
RSVD Reserved: All signals that are RSVD should not be connected on
the board.
RSVD_NCTF RSVD_NCTF: RSVD_NCTF should not be connected on the board.
RSVD_TP RSVD_TP: Intel recommends to route each RSVD_TP to an

accessible test point. Intel may require these test points for
platform specific debug. Leaving these test points inaccessible
could delay debug by Intel.
6.10 Processor Internal Pull-Up / Pull-Down

Terminations
Table 6-14. Processor Internal Pull-Up / Pull-Down Terminations
Signal Name Pull Up/Pull Down Rail Value
BPM[3:0] Pull Up / Pull Down VccIO 16-60 ohms
PREQ# Pull Up VccST 3 kohms
PROC_TDI Pull Up VccSTG 3 kohms
PROC_TMS Pull Up VccSTG 3 kohms
PROC_TRSN# Pull Down - 3 kohms
CFG[19:0] Pull Up VccIO 3 kohms

7 Electrical Specifications
7.1 Processor Power Rails
Table 7-1. Processor Power Rails

Power Rail Description Control Availability
VCC Processor IA Cores Power Rail SVID All Processor Lines

VccGT Processor Graphics Power Rails SVID All Processor Lines
VccGTX Note 2,6 Processor Graphics Extended Power Rail SVID Processors w/ GT3
VccSA System Agent Power Rail SVID/Fixed (SKU dependent) All Processor Lines
VccIO IO Power Rail Fixed All Processor Lines
VccST Sustain Power Rail Fixed All Processor Lines
Sustain Gated Power Rail U/Y-Processor Lines
VccSTG 5 Fixed
AML-Y22 Processor Line
VccPLL Processor PLLs power Rail Fixed All Processor Lines
4
VccPLL_OC Processor PLLs OC power Rail Fixed All Processor Lines
Integrated Memory Controller Power Rail Fixed (Memory technology
VDDQ All Processor Lines
dependent)
VccOPC 3 Processor OPC power Rail Fixed Processors w/OPC
VccOPC_1P8 3 Processor OPC power Rail Fixed Processors w/OPC
3
VccEOPIO Processor EOPIO power Rail Fixed Processors w/OPC
Notes:
1. N/A
2. Rail is unconnected for Processors without GT3.
3. Rail is unconnected for Processors without OPC.
4. VccPLL_OC power rail should be sourced from the VDDQ VR. The connection can be direct or through a load switch,
depending desired power optimization. In case of direct connection (VccPLL_OC is shorted to VDDQ, no load switch), platform
should ensure that VccST is ON (high) while VccPLL_OC is ON (high).
5. VccSTG power rail should be sourced from the VR as VCCST. The connection can be direct or through a load switch,
depending desired power optimization.
6. Intel has added the option of merging the GT/GTx power rails for the U-Processor Line GT3 product family.
7.1.1 Power and Ground Pins

All power pins should be connected to their respective processor power planes, while all
VSS pins should be connected to the system ground plane. Use of multiple power and
ground planes is recommended to reduce I*R drop.
7.1.2 VCC Voltage Identification (VID)

Intel processors/chipsets are individually calibrated in the factory to operate on a
specific voltage/frequency and operating-condition curve specified for that individual
processor. In normal operation, the processor autonomously issues voltage control
requests according to this calibrated curve using the serial voltage-identifier (SVID)
interface. Altering the voltage applied at the processor/chipset causing operation
outside of this calibrated curve is considered out-of-specification operation.
109
The SVID bus consists of three open-drain signals: clock, data, and alert# to both set
voltage-levels and gather telemetry data from the voltage regulators. Voltages are
controlled per an 8-bit integer value, called a VID, that maps to an analog voltage level.
An offset field also exists that allows altering the VID table. Alert can be used to inform
the processor that a voltage-change request has been completed or to interrupt the
processor with a fault notification.
7.2 DC Specifications
The processor DC specifications in this section are defined at the processor signal pins,
unless noted otherwise.
• The DC specifications for the DDR3L/-RS/LPDDR3/DDR4 signals are listed in the
Voltage and Current Specifications section.
• The Voltage and Current Specifications section lists the DC specifications for the
processor and are valid only while meeting specifications for junction temperature,
clock frequency, and input voltages. Read all notes associated with each parameter.
• AC tolerances for all DC rails include dynamic load currents at switching frequencies
up to 1 MHz.
7.2.1 Processor Power Rails DC Specifications

7.2.1.1 Vcc DC Specifications
Table 7-2. Processor IA core (Vcc) Active and Idle Mode DC Voltage and Current
Specifications (Sheet 1 of 3)
Symbol Parameter Segment Min Typ Max Unit Note1
Voltage Range for 1, 2, 3,

Operating Processor Operating 7, 12
All — 1.52 V
Voltage Modes
Y-Processor Line (4.5W) — — 24

Y-Processor Line (6W)
— — 24
Pentium/Celeron
AML-Y22 Processor Line (5W) — — 28
U-Processor Line (15W) - 2 — — 32

Core GT2,GT1
U-Processor Line (15W) - 2

IccMAX Core GT1 — — 29
Maximum Processor
(U/Y- A 4, 6, 7,
IA Core ICC Pentium/Celeron
Processors) 11
Core GT2 (U- 4 Core)

Core GT3+OPC

Core GT3+OPC

Voltage Tolerance PS0, PS1 — — ±20

TOBVCC mV 3, 6, 8
PS2, PS3 — — ±20
IL<=0.5 0.5<IL<IccTDC IccTDC<IL<IccMAX
PS0 — — +30/-10 ±10 ±15
Ripple Ripple Tolerance PS1 — — +30/-10 ±15 ±15 mV 3, 6, 8
PS2 — — +30/-10 +30/-10 +30/-10
PS3 — — +30/-10 +30/-10 +30/-10
Y-Processor Line — — 5.9
AML-Y22 Processor Line (5W) — — 4
U-Processor Line - — — 2.4

DC_LL Loadline slope within
2 Core GT2,GT1 10, 13,
(U/Y- the VR regulation mΩ
14
Processors) loop capability U-Processor Line (U-4 Core) - 2.4
4-Core
U-Processor Line - 2.4

2 Core GT3 with OPC
AC_LL 10,13,
(Y/U- AC Loadline U-Processor Lines — — Same as Max DC_LL (up to 1MHz) mΩ
Processors) 14
• 1MHz – 2MHz: Increasing linearly with log

(frequency) from 4 to 6
AC_LL • 2MHz – 20MHz: 6 10, 13,
(Y- AC Loadline AML-Y22-Processor Line — — mΩ
Processors) • 20MHz – 30MHz: Increasing linearly with 14,15
log (frequency) from 6 to 15.5
• 30MHz – 40MHz: 15.5
• 1MHz – 2MHz: 5.9
• 2MHz – 4MHz:Increasing linearly with log
AC_LL (frequency) from 5.9 to 11.7
10, 13,
(Y- AC Loadline Y-Processor Line — — • 4MHz – 20MHz: 11.7 mΩ
Processors) 14,15
• 20MHz – 30MHz: Increasing linearly with
log (frequency) from 11.7 to 18.3
• 30MHz – 40MHz: 18.3
T_OVS_TD Max Overshoot time
P_MAX — — — 10/30 μs
TDP/virus mode
V_OVS Max Overshoot at
TDP_MAX/ TDP/virus mode — — — 70/200 mV
virus_MAX
111
Notes:
1. Unless otherwise noted, all specifications in this table are based on estimates and simulations or empirical data. These specifications will be updated
with characterized data from silicon measurements at a later date.
2. Each processor is programmed with a maximum valid voltage identification value (VID) that is set at manufacturing and cannot be altered. Individual
maximum VID values are calibrated during manufacturing such that two processors at the same frequency may have different settings within the VID
range. Note that this differs from the VID employed by the processor during a power management event (Adaptive Thermal Monitor, Enhanced Intel
SpeedStep Technology, or low-power states).
3. The voltage specification requirements are measured across Vcc_SENSE and Vss_SENSE as near as possible to the processor with an oscilloscope set
to 100-MHz bandwidth, 1.5 pF maximum probe capacitance, and 1 MΩ minimum impedance. The maximum length of ground wire on the probe
should be less than 5 mm. Ensure external noise from the system is not coupled into the oscilloscope probe.
4. Processor IA core VR to be designed to electrically support this current.
5. Processor IA core VR to be designed to thermally support this current indefinitely.
6. Long term reliability cannot be assured if tolerance, ripple, and core noise parameters are violated.
7. Long term reliability cannot be assured in conditions above or below Max/Min functional limits.
8. PSx refers to the voltage regulator power state as set by the SVID protocol.
9. N/A
10. LL measured at sense points.
11. Typ column represents IccMAX for commercial application it is NOT a specification - it is a characterization of limited samples using limited set of
benchmarks that can be exceeded.
12. Operating voltage range in steady state.
13. LL specification values should not be exceeded. If exceeded, power, performance and reliability penalty are expected.
14. Load Line (AC/DC) should be measured by the VRTT tool and programmed accordingly using the BIOS Load Line override setup options. AC/DC Load
Line BIOS programming directly affects operating voltages (AC) and power measurements (DC). A superior board design with a shallower AC Load
Line can improve on power, performance, and thermals compared to boards designed for POR impedance.
15. For more details on AML-Y22 loadline target, refer to Power Integrity Model Set Doc ID# 597383.
7.2.1.2 VccGT and VccGTX DC Specifications
Table 7-3. Processor Graphics (VccGTand VccGTX) Supply DC Voltage and Current
Active
Operating voltage 2,3,6,
All 0 — 1.52 V
voltage Range for 8
VccGT
Y-Processor Line (4.5W) — — 24
AML-Y22- Processor Line — — 24

(5W)
Y-Processor Line (6W) — —

Pentium/Celeron
Max. U-Processor Line (15W) - 2 A 6
IccMAX_GT/ — — 31
Current for Core GT2,GT1
IccMAX_GTx
Processor
(U/Y- U-Processor Line (15W) - 4
Graphics — — 31
Processors) Core GT2 (U-4 Core)
Rail
U-Processor Line (15W) - 2
Core GT1 — — 31
Pentium/Celeron
U-Processor Line Merged: 64(GT+GTx) 6,11,

(15,28W)- — —
Separate: GT-57/GTx-19 12
2 Core GT3 with OPC
VccGT PS0,PS1 — — ±20 mV 3, 4

TOBGT
Tolerance PS2,PS3 — — ±20 mV 3, 4

Table 7-3. Processor Graphics (VccGTand VccGTX) Supply DC Voltage and Current
— IL<=0.5 0.5<IL<IccTDC IccTDC<IL<IccMAX

PS0 — — +30/-10 ±10 ±15
Ripple
Ripple PS1 — — +30/-10 ±15 ±15 mV 3,4
Tolerance
PS2 — — +30/-10 +30/-10 +30/-10
PS3 — — +30/-10 +30/-10 +30/-10
Y/AML-Y22 -Processor Line — 4.2 5.7
DC_LL VccGT U- 2 Core GT2, GT1 — — 3.1 7, 9,
(UY- Loadline mΩ
U- 4 Core GT2 (U- 4 Core) — — 3.1 10
Processor) slope
U- 2 Core GT3+OPC — — 2/6.0(GTx)
AC_LL
7,9,
(Y/U- AC Loadline U-Processor Line — — Same as Max DC_LL (up to 1MHz) mΩ
10,13
Processors)
• 1MHz – 3MHz: 5.7
AC_LL
• 3MHz – 10MHz: Increasing linearly with log 7,9,
(Y- AC Loadline Y/AML-Y22 -Processor Line — — mΩ
(frequency) from 5.7 to 12.1 10,13
Processors)
• 10MHz – 40MHz: 12.1
Max —
T_OVS_MAX Overshoot — — 10 μs
time
Max —
V_OVS_MAX — — 70 mV
Overshoot
Notes:
1. Unless otherwise noted, all specifications in this table are based on estimates and simulations or empirical data. These specifications will
be updated with characterized data from silicon measurements at a later date.
2. Each processor is programmed with a maximum valid voltage identification value (VID), which is set at manufacturing and cannot be
altered. Individual maximum VID values are calibrated during manufacturing such that two processors at the same frequency may have
different settings within the VID range. This differs from the VID employed by the processor during a power or thermal management
event (Intel Adaptive Thermal Monitor, Enhanced Intel SpeedStep Technology, or low-power states).
3. The voltage specification requirements are measured across VccGT_SENSE and VssGT_SENSE as near as possible to the processor with an
oscilloscope set to 100-MHz bandwidth, 1.5 pF maximum probe capacitance, and 1 MΩ minimum impedance. The maximum length of
ground wire on the probe should be less than 5 mm. Ensure external noise from the system is not coupled into the oscilloscope probe.
5. Each processor is programmed with a maximum valid voltage identification value (VID), which is set at manufacturing and cannot be
altered. Individual maximum VID values are calibrated during manufacturing such that two processors at the same frequency may have
different settings within the VID range. This differs from the VID employed by the processor during a power or thermal management
event (Intel Adaptive Thermal Monitor, Enhanced Intel SpeedStep Technology, or low-power states).
6. N/A
8. Operating voltage range in steady state.
10. Load Line (AC/DC) should be measured by the VRTT tool and programmed accordingly using the BIOS Load Line override setup options.
AC/DC Load Line BIOS programming directly affects operating voltages (AC) and power measurements (DC). A superior board design
with a shallower AC Load Line can improve on power, performance, and thermals compared to boards designed for POR impedance.
11. N/A
12. For merged GT/GTx rails the sense point need to be taken from VccGT_SENSE/VSSGT_SENSE, the VccGTx_SENSE/VssGTx_SENSE should be
unconnected (not connected).For more details on AML-Y22 loadline target, refer to Power Integrity Model Set Doc ID# 597383..
113
7.2.1.3 VDDQ DC Specifications
Table 7-4. Memory Controller (VDDQ) Supply DC Voltage and Current Specifications
Processor I/O supply voltage for All

VDDQ (DDR3L/-RS) Typ-5% 1.35 Typ+5% V 3,4,5
DDR3L/-RS
VDDQ (LPDDR3) Typ-5% 1.20 Typ+5% V 3, 4, 5
LPDDR3
VDDQ (DDR4) Typ-5% 1.20 Typ+5% V 3, 4, 5
DDR4
TOBVDDQ VDDQ Tolerance All AC+DC:± 5 % 3, 4, 6
IccMAX_VDDQ Max Current for VDDQ Rail U — — 2

(DDR3L/-RS) A 2
(DDR3L/-RS) — — — —
Max Current for VDDQ Rail Y/AML-Y22 — — 2
IccMAX_VDDQ (LPDDR3)
U — — 2 A 2
(LPDDR3)
— — —
IccMAX_VDDQ Max Current for VDDQ Rail

U — — 2.8 A 2
(DDR4) (DDR4)
Notes:
1. Unless otherwise noted, all specifications in this table are based on estimates and simulations or empirical data. These
specifications will be updated with characterized data from silicon measurements at a later date.
2. The current supplied to the DIMM modules is not included in this specification.
3. Includes AC and DC error, where the AC noise is bandwidth limited to under 100 MHz, measured on package pins.
4. No requirement on the breakdown of AC versus DC noise.
5. The voltage specification requirements are measured as near as possible to the processor with an oscilloscope set to 100-MHz
bandwidth, 1.5 pF maximum probe capacitance, and 1 MΩ minimum impedance. The maximum length of ground wire on the
probe should be less than 5 mm. Ensure external noise from the system is not coupled into the oscilloscope probe.For Voltage
less than 1v, TOB will be 50 mv.
7.2.1.4 VccSA DC Specifications

Table 7-5. System Agent (VccSA) Supply DC Voltage and Current Specifications (Sheet 1
of 2)
Symbol Parameter Segment Min Typ Max Unit Note1,2
VccSA Voltage for Y/AML-Y22 -Processor Line 0 — 1.52

(U/Y- the System V 3, 5
Processors) Agent U-Processor Line 0 — 1.52
VccSA U/Y/AML-Y22 -Processor Lines 0 — ±20 mV 3

TOBVCCSA Tolerance - 0 — - % 3, 11
Y/AML-Y22 -Processor Line — — 4.1

Max Current U- 2 Core GT2 — — 4.5 9
ICCMAX_VCCSA for VCCSA A
Rail U- 2 Core GT3+OPC — — 5.1 10
— — 6
VccSA Y/AML-Y22-Processor Line — 14 18

DC_LL mΩ 6, 7, 8
Loadline U/U- 4 Core Processor Line — — 10.3
AC Same as Max DC_LL (up to 1MHz) 6, 7,
AC_LL U/-Processor Line — — mΩ
Loadline 8,12
• 1MHz – 2MHz: Increasing linearly with
AC log (frequency) from 18 to 42.6 6, 7,
AC_LL Y/AML-Y22 -Processor Line — — mΩ
Loadline 8,12
• 2MHz – 40MHz: 42.6

Table 7-5. System Agent (VccSA) Supply DC Voltage and Current Specifications (Sheet 2
of 2)
U/Y-Processor Lines IL<=0.5 0.5<IL<IccTDC ICCTDC<IL<IccMAX

PS0 — — +30/-10 ±10 ±15
Ripple
Ripple PS1 — — +30/-10 ±15 ±15 mV 3, 4
Tolerance
PS2 — — +30/-10 +30/-10 +30/-10
PS3 — — +30/-10 +30/-10 +30/-10
Max —
T_OVS_MAX Overshoot — — 10 μs
time
Max —
V_OVS_MAX — — 70 mV
Overshoot
Notes:
1. Unless otherwise noted, all specifications in this table are based on estimates and simulations or empirical data. These specifications will be
updated with characterized data from silicon measurements at a later date.
3. The voltage specification requirements are measured across VccSA_SENSE and VssSA_SENSE as near as possible to the processor with an
oscilloscope set to 100-MHz bandwidth, 1.5 pF maximum probe capacitance, and 1 MΩ minimum impedance. The maximum length of ground
wire on the probe should be less than 5 mm. Ensure external noise from the system is not coupled into the oscilloscope probe.
5. VccSA voltage during boot (Vboot)1.05V for a duration of 2 seconds.
8. Load Line (AC/DC) should be measured by the VRTT tool and programmed accordingly using the BIOS Load Line override setup options. AC/DC
Load Line BIOS programming directly affects operating voltages (AC) and power measurements (DC). A superior board design with a shallower
AC Load Line can improve on power, performance, and thermals compared to boards designed for POR impedance.
9. IPU designs with U-Processor Line Pentium/Celeron require additional 0.5A, SA IccMAX=5A.
10. U-Processor Line GT2+OPC 28W IPU designs will require additional 2A, SA IccMAX when using IPU=7.1AFor Voltage less than 1V, TOB will be 50
mV.
11. For more details on AML-Y22 loadline target, refer to Power Integrity Model Set Doc ID# 597383.
115
7.2.1.5 VccIO DC Specifications
Table 7-6. Processor I/O (VccIO) Supply DC Voltage and Current Specifications
0.85/0.95
Y/AML-Y22 — —
Voltage for the memory controller 3, 4, 5,
VccIO V
and shared cache U — 0.95 — 6
— — — —
All +/-5 (AC + DC + Ripple) 3, 8
TOBVCCIO VccIO Tolerance %
Up to 1 MHz
Y/AML-Y22 — — 3
IccMAX_VCCIO Max Current for VCCIO Rail A
U — — 3.1
T_OVS_MAX Max Overshoot time All — — 100 μS 7
V_OVS_MAX Max Overshoot at TDP All — — 20 mV 7
Notes:
3. The voltage specification requirements are measured across VccIO_SENSE and VssIO_SENSE as near as possible to the
processor with an oscilloscope set to 100-MHz bandwidth, 1.5 pF maximum probe capacitance, and 1 MΩ minimum
impedance. The maximum length of ground wire on the probe should be less than 5 mm. Ensure external noise from the
system is not coupled into the oscilloscope probe.
4. For low BW bus connection between processor and PCH -> VccIO=0.85V.
5. For high BW bus connection between processor and PCH -> VccIO=0.95V.
6. For KBL-Y and AML Y-Processor Line, Setting VccIO to 0.95V may lead to a power penalty up to 250mW.
7. OS occurs during power on only, not during normal operation.For Voltage less than 1v, TOB will be +/-50mV (AC + DC +
Ripple) up to 1 MHz
7.2.1.6 VccOPC DC Specifications

OPC VR output voltage is fixed to 1V, the processor can drive VR to LPM (Low Power
Mode) which sets VR output to 0V using ZVM# signal as shown in the following table.
Table 7-7. VCCOPC Voltage levels
ZVM# State VCCOPC Units
0 0 V
1 1.0 V
Table 7-8. Processor OPC (VccOPC) Supply DC Voltage and Current Specifications (Sheet
1 of 2)
Voltage for the on-package Processor Line

VccOPC — 1.0 — V 3
cache w/OPC
Processor Line
TOBVCCOPC VccOPC Tolerance AC+DC:± 5 % 3, 5
w/OPC
Processor Line
IccMAX_VCCOPC Max Current for VCCOPC Rail — — 3.2 A
w/OPC
T_OVS_MAX Max Overshoot time All — — 100 μS 4
V_OVS_MAX Max Overshoot at TDP All — — 20 mV 4

Table 7-8. Processor OPC (VccOPC) Supply DC Voltage and Current Specifications (Sheet
2 of 2)
Notes:
3. The voltage specification requirements are measured across VccOPC_SENSE and VssOPC_SENSE as near as possible to the
4. OS occurs during power on only, not during normal operation.
5. For Voltage less than 1V, TOB will be 50 mV.
7.2.1.7 VccEOPIO DC Specifications

VccEOPIO may be connected to OPC VR. The processor can drive VR to LPM (Low Power
Mode) which sets VR output to 0V using ZVM# signal (as shown in Table 7-9, “VCCEOPIO
Voltage levels (separate VR)”).
Table 7-9. VCCEOPIO Voltage levels (separate VR)
ZVM# state MSM# state VCCEOPIO Units
0 X 0 V
1 1 1.0 V
Table 7-10. Processor EOPIO (VccEOPIO) Supply DC Voltage and Current Specifications
VccEOPIO Voltage for the EOPIO

— 1.0 — V 3
interface
TOBVCCEOPIO VccEOPIO Tolerance U-Processor AC+DC:± 5 % 3, 5
Line GT3 with
IccMAX_VCCEOPIO Max Current for VCCEOPIO Rail OPC — — 2 A
T_OVS_MAX Max Overshoot time — — 100 μS 4
V_OVS_MAX Max Overshoot at TDP — — 20 mV 4
Notes:
3. The voltage specification requirements are measured across VccEOPIO_SENSE and VssEOPIO_SENSE as near as possible to the
4. OS occurs during power on only, not during normal operation.
7.2.1.8 VccOPC_1p8 DC Specifications
Table 7-11. Processor OPC (VccOPC_1p8) Supply DC Voltage and Current Specifications
VccOPC_1p8 Voltage for the on-package

— 1.8 — V 3
cache U-Processor
Line GT3 with
TOBVCC_OPC_1p8 VccOPC_1p8 Tolerance AC+DC:± 5 % 3, 4
OPC
IccMAX_VCC_OPC_1p8 Max Current for VCC_OPC_1p8 Rail — — 50 mA
117
Table 7-11. Processor OPC (VccOPC_1p8) Supply DC Voltage and Current Specifications
Notes:
3. The voltage specification requirements are measured as near as possible to the processor with an oscilloscope set to 100-
MHz bandwidth, 1.5 pF maximum probe capacitance, and 1 MΩ minimum impedance. The maximum length of ground
wire on the probe should be less than 5 mm. Ensure external noise from the system is not coupled into the oscilloscope
probe.
7.2.1.9 VccST DC Specifications

Table 7-12. Vcc Sustain (VccST) Supply DC Voltage and Current Specifications
Symbol Parameter Segment Min Typ Max Units Notes 1,2
Processor Vcc Sustain

VccST All — 1.0 — V 3
supply voltage
TOBST VccST Tolerance All AC+DC:± 5 % 3, 4
Y/AML-Y22-Processor Line — —
IccMAX_ST Max Current for VccST U-Processor Line — — 60 mA
— —
Notes:
3. The voltage specification requirements are measured on package pins as near as possible to the processor with an
oscilloscope set to 100-MHz bandwidth, 1.5 pF maximum probe capacitance, and 1 MΩ minimum impedance. The maximum
length of ground wire on the probe should be less than 5 mm. Ensure external noise from the system is not coupled into the
oscilloscope probe.For Voltage less than 1V, TOB will be 50 mV.
Table 7-13. Vcc Sustain Gated (VccSTG) Supply DC Voltage and Current Specifications
Symbol Parameter Segment Min Typ Max Units Notes 1,2
Processor Vcc Sustain

VccSTG All — 1.0 — V 3
supply voltage
TOBSTG VccSTG Tolerance All AC+DC:± 5 % 3, 4
Y/AML-Y22 -Processor Line — —
IccMAX_STG Max Current for VccSTG U-Processor Line — — 20 mA
— —
Notes:

7.2.1.10 VccPLL DC Specifications
Table 7-14. Processor PLL (VccPLL) Supply DC Voltage and Current Specifications
Symbol Parameter Segment Min Typ Max Unit Notes1,2
PLL supply voltage (DC + AC

VccPLL All — 1.0 — V 3,7
specification)
TOBVCCPLL VccPLL Tolerance All VCCPLLmax > AC+DC > VCCPLLmin V 3,4,5,6,7
A low pass filter or behavior like is required,

the low pass filter requirements are 150KHz
LPF Noise Filtering for VccPLL All 5,6
cut-off frequency and -20dB/Decade
attenuation for higher frequencies.
Y/AML-Y22 -Processor
— — 100
Line
IccMAX_VCCPLL Max Current for VccPLL Rail mA
U-Processor Line — — 130
4 — — 130
Notes:
3. The voltage specification requirements are measured on package pins as near as possible to the processor with an oscilloscope
set to 100-MHz bandwidth, 1.5 pF maximum probe capacitance, and 1 MΩ minimum impedance. The maximum length of
ground wire on the probe should be less than 5 mm. Ensure external noise from the system is not coupled into the oscilloscope
probe.For Voltage less than 1v, TOB will be 50 mv.VccPLL max noise freq 0.5 MHz.
4. LPF should implement after making sure VCCPLL AC+DC are inside TOBVCCPLL limits
5. Should be measured and verified prior to LPF assembly
Table 7-15. Processor PLL_OC (VccPLL_OC) Supply DC Voltage and Current Specifications
Un
Symbol Parameter Segment Min Typ Max Notes1,2
it
PLL_OC supply All

VccPLL_OC voltage (DC + AC — VDDQ — V 3
specification)
TOBCCPLL_OC VccPLL_OC Tolerance All AC+DC:± 5 % 3,4
Y/AML-Y22 -Processor Line — — 100
Max Current for U-Processor Line - 2 Core GT2 — — 100

IccMAX_VCCPLL_OC mA
VccPLL_OC Rail — —
U-Processor Line - 2 Core GT3+OPC — — 120
Notes:
119
7.2.2 Processor Interfaces DC Specifications
7.2.2.1 DDR3L/-RS DC Specifications
Table 7-16. DDR3L/-RS Signal Group DC Specifications

Y and U-Processor Line
Symbol Parameter Units Notes1
Min Typ Max
VIL Input Low Voltage 0.43* 2, 4, 8,

— — V
VDDQ 9
VIH Input High Voltage 0.57* 3, 4, 8,
— — V
VDDQ 9
RON_UP/DN(DQ) DDR3L/-RS Data Buffer pull-up/down Resistance Trainable Ω 10
RODT(DQ) DDR3L/-RS On-die termination equivalent resistance
Trainable Ω 10
for data signals
VODT(DC) DDR3L/-RS On-die termination DC working point 0.45* 0.5* 0.55*
V 10
(driver set to receive mode) VDDQ VDDQ VDDQ
RON_UP/DN(CK) DDR3L/-RS Clock Buffer pull-up/down Resistance 0.8*Typ 26 1.2*Typ Ω 5, 10
RON_UP/DN(CMD) DDR3L/-RS Command Buffer pull-up/down Resistance 0.8*Typ 20 1.2*Typ Ω 10
RON_UP/DN(CTL) DDR3L/-RS Control Buffer pull-up/down Resistance 0.8*Typ 20 1.2*Typ Ω 5, 10
RON_UP/DN System Memory Power Gate Control Buffer Pull-Up/
down Resistance 40 — 140 Ω
(DDR_VTT_CNTL)
ILI Input Leakage Current (DQ, CK)

0V
— — 1 mA
0.2*VDDQ
0.8*VDDQ
DDR0_Vref_DQ
DDR1_Vref_DQ VREF output voltage Trainable VDDQ/2 Trainable V 9,11
DDR_Vref_CA
DDR_RCOMP[0] ODT resistance compensation Ω 6
RCOMP values are memory
DDR_RCOMP[1] Data resistance compensation Ω 6
topology dependent.
DDR_RCOMP[2] Command resistance compensation Ω 6
Notes:
1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2. VIL is defined as the maximum voltage level at a receiving agent that will be interpreted as a logical low value.
3. VIH is defined as the minimum voltage level at a receiving agent that will be interpreted as a logical high value.
4. VIH and VIL may experience excursions above VDDQ. However, input signal drivers should comply with the signal quality
specifications.
5. This is the pull up/down driver resistance after compensation. Note that BIOS power training may change these values
significantly based on margin/power trade-off.
6. For U/Y Processors DDR_RCOMP resistance should be provided on the system board with ±1% resistors. DDR_RCOMP
resistors are connected to VSS.
7. DDR_VREF is defined as VDDQ/2 for DDR3L/-RS
8. RON tolerance is preliminary and might be subject to change.
9. Processor may be damaged if VIH exceeds the maximum voltage for extended periods.
10. Final value determined by BIOS power training, values might vary between bytes and/or units.
11. The value will be set during the MRC boot training within the specified range.
12. DDR0_Vref_DQ - Not in use in DDR4, DDR1_Vref_DQ = DDR4_CA_ch1, DDR_Vref_CA = DD4_CA_ch0.

7.2.2.2 LPDDR3 DC Specifications
Table 7-17. LPDDR3 Signal Group DC Specifications

U/U- 4 Core and AML Y-
Processor Line
Symbol Parameter Unit Note
Min Typ Max
VIL Input Low Voltage — — 0.43*VDDQ V 2, 4, 8, 9

VIH Input High Voltage 0.57*VDDQ — — V 3, 4, 8, 9
RON_UP/DN(DQ) LPDDR3 Data Buffer pull-up/ down Resistance Trainable Ω 11
LPDDR3 On-die termination equivalent
RODT(DQ) Trainable Ω 11
resistance for data signals
LPDDR3 On-die termination DC working point 0.5*VDD
VODT(DC) 0.45*VDDQ 0.55*VDDQ V 9
(driver set to receive mode) Q
RON_UP/DN(CK) LPDDR3 Clock Buffer pull-up/ down Resistance 0.8*Typ 40 1.2*Typ Ω 5, 11

LPDDR3 Command Buffer pull-up/ down
RON_UP/DN(CMD) 0.8*Typ 40 1.2*Typ Ω 11
Resistance
LPDDR3 Control Buffer pull-up/ down
RON_UP/DN(CTL) 0.8*Typ 23 1.2*typ Ω 5, 11
Resistance
RON_UP/DN System Memory Power Gate Control Buffer Pull-
40 — 140 Ω -
(DDR_VTT_CNTL) Up Resistance
Input Leakage Current (DQ, CK)

0V
ILI — — 0.75 mA -
0.2* VDDQ
0.8*VDDQ
Input Leakage Current (CMD,CTL)
0V
ILI — — 0.9 mA -
0.2*VDDQ
0.8*VDDQ
DDR0_VREF_DQ
DDR1_VREF_DQ VREF output voltage Trainable VDDQ/2 Trainable V 12,13
DDR_VREF_CA
RCOMP values are memory topology
dependent.
Notes:
specifications.
significantly based on margin/power trade-off.
6. DDR_RCOMP resistance should be provided on the system board with ±1% resistors. DDR_RCOMP resistors are to VSS.
7. DDR_VREF is defined as VDDQ/2 for LPDDR3
12. VREF values determined by BIOS training, values might vary between units.
13. DDR0_Vref_DQ - Not in use in DDR4, DDR1_Vref_DQ = DDR4_CA_ch1, DDR_Vref_CA = DD4_CA_ch0.
121
7.2.2.3 DDR4 DC Specifications
Table 7-18. DDR4 Signal Group DC Specifications
U/U- 4 Core-Processor Line
Symbol Parameter Units Notes1
Min Typ Max
Input Low Voltage VREF(INT) - 2, 4, 8,

VIL — — V
0.07*VDDQ 9, 13
Input High Voltage VREF(INT)

3, 4, 8,
VIH + — — V
9, 13
0.07*VDDQ
RON_UP/DN(DQ) DDR4 Data Buffer pull-up/ down Resistance Trainable Ω 11
DDR4 On-die termination equivalent

RODT(DQ) Trainable Ω 11
resistance for data signals
DDR4 On-die termination DC working point

VODT(DC) 0.45*VDDQ 0.5*VDDQ 0.55*VDDQ V 9
(driver set to receive mode)
RON_UP/DN(CK) DDR4 Clock Buffer pull-up/ down Resistance 0.8*Typ 26 1.2*Typ Ω 5, 11
DDR4 Command Buffer pull-up/ down

RON_UP/DN(CMD) 0.8*Typ 20 1.2*Typ Ω 11
Resistance
DDR4 Control Buffer pull-up/ down

RON_UP/DN(CTL) 0.8*Typ 20 1.2*Typ Ω 5, 11
Resistance
RON_UP/DN System Memory Power Gate Control Buffer

Pull-Up/ down Resistance 40 — 140 Ω -
(DDR_VTT_CNTL)
Input Leakage Current (DQ, CK)

0V
ILI — — 1 mA -
0.2*VDDQ
0.8*VDDQ
DDR0_VREF_DQ VREF output voltage

DDR1_VREF_DQ Trainable VDDQ/2 Trainable V 12, 14
DDR_VREF_CA

RCOMP values are memory topology
dependent.
Notes:
specifications.
significantly based on margin/power trade-off. See processor I/O Buffer Models for I/V characteristics.
6. DDR_RCOMP resistance should be provided on the system board with ±1% resistors. DDR_RCOMP resistors are to VSS.
7. DDR_VREF is defined as VDDQ/2 for DDR4
12. VREF values determined by BIOS training, values might vary between units.
13. VREF(INT) is a trainable parameter whose value is determined by BIOS for margin optimization.
14. DDR0_Vref_DQ - Not in use in DDR4, DDR1_Vref_DQ = DDR4_CA_ch1, DDR_Vref_CA = DD4_CA_ch0

7.2.2.4 Digital Display Interface (DDI) DC Specifications
Table 7-19. Digital Display Interface Group DC Specifications (DP/HDMI)
Symbol Parameter Min Typ Max Units Notes1
DDIB_TXC[3:0] Output Low Voltage

VOL DDIC_TXC[3:0] Output Low Voltage — — 0.25*VCCIO V 1,2
DDID_TXC[3:0] Output Low Voltage
DDIB_TXC[3:0] Output High Voltage

VOH DDIC_TXC[3:0] Output High Voltage 0.75*VCCIO — — V 1,2
DDID_TXC[3:0] Output High Voltage
ZTX-DIFF-DC DC Differential Tx Impedance 80 100 120 Ω
Notes:
1. VccIO depends on segment.
2. VOL and VOH levels depends on the level chosen by the Platform.
7.2.2.5 embedded DisplayPort* (eDP*) DC Specification

Table 7-20. embedded DisplayPort* (eDP*) Group DC Specifications
Symbol Parameter Min Typ Max Units
VOL eDP_DISP_UTIL Output Low Voltage — — 0.1*VCCIO V
VOH eDP_DISP_UTIL Output High Voltage 0.9*VccIO — — V
RUP eDP_DISP_UTIL Internal pull-up 100 — — Ω
RDOWN eDP_DISP_UTIL Internal pull-down 100 — — Ω
eDP_RCOMP eDP resistance compensation 24.75 25 25.25 Ω
ZTX-DIFF-DC DC Differential Tx Impedance 80 100 120 Ω
Notes:
1. COMP resistance is to VCOMP_OUT.
2. eDP_RCOMP resistor should be provided on the system board.
7.2.2.6 CMOS DC Specifications

Table 7-21. CMOS Signal Group DC Specifications
Symbol Parameter Min Max Units Notes1
VIL Input Low Voltage — Vcc * 0.3 V 2, 5
VIH Input High Voltage Vcc * 0.7 — V 2, 4, 5
VOL Output Low Voltage — Vcc * 0.1 V 2
VOH Output High Voltage Vcc * 0.9 — V 2, 4
RON Buffer on Resistance 23 73 Ω -
ILI Input Leakage Current — ±150 μA 3
Notes:
2. The Vcc referred to in these specifications refers to instantaneous Vcc levels.
3. For VIN between “0” V and Vcc Measured when the driver is tri-stated.
4. VIH and VOH may experience excursions above Vcc. However, input signal drivers should comply with the
signal quality specifications.
5. N/A
123
7.2.2.7 GTL and OD DC Specifications
Table 7-22. GTL Signal Group and Open Drain Signal Group DC Specifications
Symbol Parameter Min Max Units Notes1
Input Low Voltage (TAP, except PROC_TCK,

VIL — Vcc * 0.6 V 2, 5, 6
PROC_TRST#)
Input High Voltage (TAP, except PROC_TCK,

VIH Vcc * 0.72 — V 2, 4, 5, 6
PROC_TRST#)
VIL Input Low Voltage (PROC_TCK,PROC_TRST#) — Vcc * 0.3 V 2, 5, 6
VIH Input High Voltage (PROC_TCK,PROC_TRST#) Vcc * 0.3 — V 2, 4, 5, 6
VHYSTERESIS Hysteresis Voltage Vcc * 0.2 — V -
RON Buffer on Resistance (TDO) 7 17 Ω -
VIL Input Low Voltage (other GTL) — Vcc * 0.6 V 2, 5, 6
VIH Input High Voltage (other GTL) Vcc * 0.72 — V 2, 4, 5, 6
RON Buffer on Resistance (CFG/BPM) 16 24 Ω -
RON Buffer on Resistance (other GTL) 12 28 Ω -
ILI Input Leakage Current — ±150 μA 3
Notes:
2. The VccST referred to in these specifications refers to instantaneous VccST/IO.
3. For VIN between 0 V and VccST. Measured when the driver is tri-stated.
4. VIH and VOH may experience excursions above VccST. However, input signal drivers should comply with the signal quality
specifications.
5. N/A
6. Those VIL/VIH values are based on ODT disabled (ODT Pull-up not exist).
7.2.2.8 PECI DC Characteristics

The PECI interface operates at a nominal voltage set by VccST. The set of DC electrical
specifications shown in the following table is used with devices normally operating from
a VccST interface supply.
VccST nominal levels will vary between processor families. All PECI devices will operate
at the VccST level determined by the processor installed in the system.
Table 7-23. PECI DC Electrical Limits (Sheet 1 of 2)

Symbol Definition and Conditions Min Max Units Notes1
Rup Internal pull up resistance 15 45 Ω 3
VIN Input Voltage Range -0.15 VccST + 0.15 V -
VHysteresis Hysteresis 0.15 * VccST — V -
Input Voltage Low- Edge

VIL — 0.3 * VccST V -
Threshold Voltage
Input Voltage High-Edge

VIH 0.7 * VccST — V -
Threshold Voltage
Cbus Bus Capacitance per Node N/A 10 pF -
Cpad Pad Capacitance 0.7 1.8 pF -
Ileak000 leakage current @ 0V — 0.6 mA -
Ileak025 leakage current @ 0.25* VccST — 0.4 mA -

Table 7-23. PECI DC Electrical Limits (Sheet 2 of 2)
Symbol Definition and Conditions Min Max Units Notes1
Ileak100 leakage current @ VccST — 0.10 mA -
Notes:
1. VccST supplies the PECI interface. PECI behavior does not affect VccST min/max specifications.
2. The leakage specification applies to powered devices on the PECI bus.
3. The PECI buffer internal pull up resistance measured at 0.75* VccST.
Input Device Hysteresis
The input buffers in both client and host models should use a Schmitt-triggered input
design for improved noise immunity. Use the following figure as a guide for input buffer
design.
Figure 7-1. Input Device Hysteresis
VTTD
Maximum VP PECI High Range
Minimum VP
Minimum Valid Input
Hysteresis Signal Range
Maximum VN
Minimum VN PECI Low Range
PECI Ground
§§
125
8 Package Mechanical
Specifications
8.1 Package Mechanical Attributes

The U/U-4 Core/YProcessors use a Flip Chip technology available in a Ball Grid Array
(BGA) package. The following table provides an overview of the mechanical attributes
of the package.
Table 8-1. Package Mechanical Attributes

Y-Processor U-Quad Core
U- Processor Line
Line Processor Line
Package Parameter
Dual Core Dual
Dual Core GT2 Quad Core GT2
GT3+OPC Core GT2
Package Type Flip Chip Ball Flip Chip Ball Grid Flip Chip Ball
Grid Array Array Grid Array
Interconnect Ball Grid Array Ball Grid Array Ball Grid Array
Package (BGA) (BGA) (BGA)
Technology
Lead Free Yes Yes Yes
Halogenated Flame
Yes Yes Yes
Retardant Free
Solder Ball Composition SAC1205 SAC405 SAC405
Ball/Pin Count 1515 1356 1356
Grid Array Pattern Balls Anywhere Balls Anywhere Balls Anywhere

Package
Configuration Land Side Capacitors No Yes Yes
Die Side Capacitors No No No
2 Dice Multi-Chip 3 Dice 2 Dice

Die Configuration 2 Dice MCP
Package (MCP) MCP MCP
Package Nominal Package Size 20.5x16.5 mm 42x24 mm 42x24 mm

Dimensions Min Ball/Pin pitch 0.4 mm 0.65 mm 0.65 mm
8.2 Package Loading Specifications
Table 8-2. Package Loading Specifications

Maximum Static Minimum PCB Thickness
Limit Notes
Normal Load Assumptions
Y/ AML-Y22
44.5 N (10 lbf) 0.7 mm 1, 2, 3
Processor Lines
U/U- 4 Core
67 N (15 lbf) 0.8 mm 1, 2, 3
Processor Line
127
Table 8-2. Package Loading Specifications
Maximum Static Minimum PCB Thickness
Limit Notes
Normal Load Assumptions
Notes:
1. The thermal solution attach mechanism should not induce continuous stress to the package. It may only
apply a uniform load to the die to maintain a thermal interface.
2. This specification applies to the uniform compressive load in the direction perpendicular to the dies’ top
surface. Load should be centered on processor die center.
3. This specification is based on limited testing for design characterization.
4. This load limit assumes the use of a backing plate.
8.3 Package Storage Specifications
Table 8-3. Package Storage Specifications

Parameter Description Min Max Notes
The non-operating device storage temperature.

Damage (latent or otherwise) may occur when
TABSOLUTE STORAGE subjected to this temperature for any length of -25 °C 125 °C 1, 2, 3
time in Intel Original sealed moisture barrier
bagand / or box.
The ambient storage temperature limit (in

shipping media) for the sustained period of time
TSUSTAINED STORAGE -5 °C 40 °C 1, 2, 3
as specified below in Intel Original sealed
moisture barrier bagand / or box.
The maximum device storage relative humidity

for the sustained period of time as specified
RHSUSTAINED STORAGE 60% @ 24 °C 1, 2, 3
below in Intel Original sealed moisture barrier
bagand / or box
Maximum time: associated with customer Moisture

shelf life in Intel Original sealed moisture Sensitive
Devices:
barrier bag and / or box
60 months
from bag
seal date; 1, 2, 3
TIMESUSTAINED STORAGE NA Non-
moisture
sensitive
devices:
60 months
from lot
date
Notes:
1. applies to the un-assembled component only and does not apply to the shipping media, moisture barrier
bags or desiccant. Refers to a component device that is not assembled in a board or socket that is not to
be electrically connected to a voltage reference or I/O signals.
2. Specified temperatures are based on data collected. Exceptions for surface mount re-flow are specified
by applicable JEDEC J-STD-020 and MAS documents. The JEDEC, J-STD-020 moisture level rating and
associated handling practices apply to all moisture sensitive de-vices removed from the moisture barrier
bag.
3. Post board attach storage temperature limits are not specifiedfor non-Intel branded boards. Consult your
board manufacturer for storage specifications.

9 U/U-Quad Core/Y Processor
Ball Information
9.1 U-Processor and U-Quad Core Processor Ball

Information
The U-Processors and U-Quad Core Processors are available in the BGA package
(BGA1356), Figure 9-1 through Figure 9-6 provide a top view of the Ball map.
Table 9-1 provides the Ball list.
129
Figure 9-1. U/U-Quad Core Processor Ball Map (Upper Left, Columns 71-48)
71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48
DDR0_ DDR0_ DDR0_ DDR0_ DDR0_ DDR0_ DDR1_
MA[9] / MA[1] / MA[8] /
RSVD_T RSVD_T DQ[16] DQ[23] DQ[28] DQ[26] DDR0_C DDR0_C DDR0_ DDR0_C DDR1_C
BB --- VSS VSS VccGTx / VSS / --- / VSS / --- VccGTx VSS --- VDDQ ---
P P DDR0_ DDR0_ DDR0_ DDR0_ KE[1] AA[1] / MA[4] AB[8]/ AA[3] /
DDR0_ DDR0_ DDR1_
DQ[32] DQ[39] DQ[44] DQ[42] MA[9] MA[1] MA[8]
DDR0_ DDR0_
DDR0_ DDR0_ DDR0_ DDR0_ DDR0_ DDR0_ MA[15] MA[11] DDR0_ DDR0_ DDR1_
DQSN[2 DQSP[3 MA[6] / MA[5] / MA[6] /
RSVD_T RSVD_T DDR1_V DQ[20] ]/ DQ[22] DQ[24] ]/ DQ[30] DDR0_C / / DDR0_C DDR0_C DDR0_ DDR1_C
BA VSS --- VSS / / VSS / / --- VSS DDR0_C DDR0_C VSS VSS
P P REF_DQ DDR0_ DDR0_ DDR0_ DDR0_ DDR0_ DDR0_ KE[0] AA[8]/ AA[7] / AA[2] / AA[0] / MA[3] AA[2] /
DQSN[4 DQSP[5 DDR0_ DDR0_ DDR1_
DQ[36] ] DQ[38] DQ[40] ] DQ[46] DDR0_A DDR0_ MA[6] MA[5] MA[6]
CT# MA[11]
DDR0_ DDR0_ DDR0_B DDR0_ DDR0_ DDR0_ DDR0_ DDR1_
DDR0_ DDR0_ DDR0_ DDR0_ MA[14]
DQ[21] DQSP[2 DQ[19] DQ[29] DQSN[3 DQ[31] A[2] / / MA[8] / MA[2] / MA[0] / MA[5] /
DDR0_V DDR_VR ]/ ]/ DDR0_C DDR0_C DDR0_C DDR0_C DDR0_C DDR1_C
AY VSS --- --- REF_DQ EF_CA VSS / DDR0_ / --- / DDR0_ / --- --- KE[3] AA[5]/ DDR0_C --- AA[3] / AB[5]/ AB[9]/ --- AA[0] /
DDR0_ DDR0_ DDR0_ DDR0_ AA[9]/
DQ[37] DQSP[4 DQ[35] DQ[45] DQSN[5 DQ[47] DDR0_B DDR0_B DDR0_ DDR0_ DDR0_ DDR1_
] ] G[0] MA[8] MA[2] MA[0] MA[5]
G[1]
DDR0_
DDR0_
DDR0_ DDR0_ DDR0_ DDR0_ MA[12] MA[7] /
DQ[17] DQ[18] DQ[25] DQ[27] /
AW RSVD_T RSVD_T RSVD RSVD DDR_VT VSS / VSS / VSS / VSS / --- VSS DDR0_C VSS DDR0_C VSS DDR0_C VSS DDR0_A VSS RSVD
P P T_CNTL KE[2] AA[4] / LERT#
DDR0_ DDR0_ DDR0_ DDR0_ AA[6] / DDR0_
DQ[33] DQ[34] DQ[41] DQ[43] DDR0_
MA[12] MA[7]
AV VSS VSS VSS VSS --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- ---
DDR1_ DDR1_ DDR1_ DDR1_ DDR0_B DDR0_R DDR0_C
A[0] / AS# / AS#/
DDR0_ DDR0_ DDR0_ DDR0_ DQ[17] DQ[23] DQ[25] DQ[31] DDR0_C DDR0_C DDR0_C DDR0_C DDR0_C
AU --- / / --- VccGTx --- / / --- VccGTx --- RSVD --- --- ---
DQ[10] DQ[14] DQ[15] DQ[11] DDR0_ DDR0_ DDR0_ DDR0_ KN[1] KN[0] AB[4]/ AB[3]/ AB[1]/
DDR0_B DDR0_ DDR0_
DQ[49] DQ[55] DQ[57] DQ[63] A[0] MA[16] MA[15]
DDR0_
DDR1_ DDR1_ DDR1_ DDR1_ MA[10] DDR0_B
A[1] /
DDR0_ DDR0_ DQ[16] DQ[22] DQ[24] DQ[30] DDR0_C DDR0_C DDR0_P / DDR0_C
AT VSS DQSP[1 DQSN[1 VSS --- / / --- VSS --- / / --- VSS --- VSS --- --- DDR0_C ---
] ] DDR0_ DDR0_ DDR0_ DDR0_ KP[1] KP[0] AR AB[7]/ AB[6]/
DDR0_B
DQ[48] DQ[54] DQ[56] DQ[62] DDR0_ A[1]
MA[10]
DDR1_ DDR1_ DDR1_ DDR1_
DQSN[2 DQSP[2 DQSN[3 DQSP[3
AR DDR0_ DDR0_ DDR0_ DDR0_ --- ]/ ]/ --- VSS --- ]/ ]/ --- VSS --- ZVM# VSS --- VSS VSS --- VSS --- VSS
DQ[12] DQ[8] DQ[13] DQ[9] DDR0_ DDR0_ DDR0_ DDR0_
DQSN[6 DQSP[6 DQSN[7 DQSP[7
] ] ] ]
DDR1_B DDR1_ DDR1_
DQ[21] DQ[18] DQ[29] DQ[26] A[2] / MA[9] / MA[7] /
DDR1_C DDR1_C DDR1_C DDR1_C DDR1_C
AP --- VSS --- VSS --- / / --- VSS --- / / --- VSS --- MSM# KE[1] --- KE[3] AA[5]/ --- AA[1] / --- AA[4] /
DQ[53] DQ[50] DQ[61] DQ[58] DDR1_B DDR1_ DDR1_
G[0] MA[9] MA[7]
DDR1_ DDR1_ DDR1_ DDR1_ MA[15] MA[14] MA[12] MA[11]
DQ[20] DQ[19] DQ[28] DQ[27] / / / /
DDR0_ DDR0_ DDR0_ DDR0_ DDR1_C DDR1_C
AN DQ[7] DQ[6] DQ[3] DQ[2] --- / / --- VSS --- / / --- VSS --- KE[0] KE[2] --- DDR1_C DDR1_C --- DDR1_C --- DDR1_C
DDR0_ DDR0_ DDR0_ DDR0_ AA[8]/ AA[9]/ AA[6] / AA[7] /
DQ[52] DQ[51] DQ[60] DQ[59] DDR1_A DDR1_B DDR1_ DDR1_
CT# G[1] MA[12] MA[11]
DDR0_ DDR0_
AM VSS DQSN[0 DQSP[0 VSS --- --- --- --- --- --- VSS VSS --- VccGTx --- VccGTx VSS --- VccGTx VccGTx --- VccGTx --- VccGTx
] ]
DDR0_ DDR0_ DDR0_ DDR0_ VCCEOP VSSGTx
AL --- VSS VSS VSS IO_SEN --- VccGTx --- VSS --- VccGTx VSS --- VccGTx VSS --- VccGTx --- VSS
DQ[0] DQ[4] DQ[5] DQ[1] SE _SENSE
DQ[6] / DQ[7] / DQ[2] / DQ[3] / VCCGTx
AK --- VccGTx VSS VSS VSS --- VccGTx --- VccGTx --- VccGTx VccGTx --- VccGTx VccGTx --- VccGTx --- VccGTx
DDR0_ DDR0_ DDR0_ DDR0_ _SENSE
DQ[22] DQ[23] DQ[18] DQ[19]
VSSEOP
AJ --- --- --- --- --- --- --- --- --- IO_SEN --- --- --- --- --- --- --- --- --- --- --- --- --- ---
SE
DDR1_ DDR1_
DDR1_ DDR1_ DDR1_ DDR1_ DQSN[0 DQSP[0
DQ[10] DQ[14] DQ[15] DQ[11]
AH / / / / VSS ]/ ]/ VSS VSS --- --- --- --- --- --- --- --- --- --- --- --- --- --- ---
DDR0_ DDR0_
DDR0_ DDR0_ DDR0_ DDR0_ DQSN[2 DQSP[2
DQ[26] DQ[30] DQ[31] DQ[27]
] ]
DDR1_ DDR1_
DQSP[1 DQSN[1
]/ ]/ VCCEOP
AG VSS DDR0_ DDR0_ --- --- --- --- --- --- IO --- --- --- --- --- --- --- --- --- --- --- --- --- ---
DQSP[3 DQSN[3
] ]
DDR1_ DDR1_ DDR1_ DDR1_ DDR1_ DDR1_ DDR1_ DDR1_
DQ[12] DQ[13]
AF / DQ[8] / / DQ[9] / DQ[5] / DQ[4] / DQ[0] / DQ[1] / VSS --- --- --- --- --- --- --- --- --- --- --- --- --- --- ---
DDR0_ DDR0_ DDR0_ DDR0_ DDR0_ DDR0_
DDR0_ DQ[24] DDR0_ DQ[25] DQ[21] DQ[20] DQ[16] DQ[17]
DQ[28] DQ[29]
VSSOP- VCCEOP
AE --- N/A VSS VSS VSS VSS VSS VSS C_SENS --- --- --- --- --- --- --- --- --- --- --- --- --- ---
E IO
AD --- --- --- --- --- --- --- --- --- VSS --- --- --- --- --- --- --- --- --- --- --- --- --- ---
VCCOP-
AC VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT C_SENS --- --- --- --- --- --- --- --- --- --- --- --- --- --- ---
E
AB --- --- --- --- --- --- --- --- --- VCCOPC --- --- --- --- --- --- --- --- --- --- --- --- --- ---

Figure 9-2. U/U-Quad Core Processor Ball Map (Upper Middle, Columns 47-24)
47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24
DDR1_
BA[0] / DDR0_ DDR0_ DDR0_ DDR0_ DDR0_ DDR0_ DDR0_ DDR0_
DDR1_ DQ[36] DQ[39] DQ[44] DQ[47] DQ[52] DQ[55] DQ[60] DQ[63]
DDR1_ DDR1_
BB VDDQ MA[3] --- CAB[4] VSS CS#[0] VDDQ --- / VSS / --- / VSS / VDDQ / VSS / --- / VSS / ---
/ DDR1_ DDR1_ DDR1_ DDR1_ DDR1_ DDR1_ DDR1_ DDR1_
DDR1_ DQ[4] DQ[7] DQ[12] DQ[15] DQ[36] DQ[39] DQ[44] DQ[47]
BA[0]
DDR1_
DDR1_ DDR1_
MA[0] / BA[1] / MA[13] DDR0_ DDR0_ DDR0_ DDR0_ DDR0_ DDR0_ DDR0_ DDR0_ DDR0_ DDR0_ DDR0_ DDR0_
/ DQSN[ DQSP[5 DQSN[ DQSP[7
DDR1_ DDR1_ DDR1_ DDR1_ DDR1_ DQ[37] 4] / DQ[38] DQ[45] ]/ DQ[46] DQ[53] 6] / DQ[54] DQ[61] ]/ DQ[62]
BA CAB[9] VSS CAB[6] VSS --- / / VSS / / VSS / / VSS / / ---
MA[4] / / CAB[0] ODT[0] DDR1_ DDR1_ DDR1_ DDR1_ DDR1_ DDR1_ DDR1_ DDR1_ DDR1_ DDR1_ DDR1_ DDR1_
/ DQSN[ DQSP[1 DQSN[ DQSP[5
DDR1_ DDR1_ DDR1_ DQ[5] 0] DQ[6] DQ[13] ] DQ[14] DQ[37] 4] DQ[38] DQ[45] ] DQ[46]
MA[0] BA[1]
MA[13]
MA[2] / MA[1] / WE#/ CAS#/ DDR0_ DQSP[4 DDR0_ DDR0_ DQSN[ DDR0_ DDR0_ DQSP[6 DDR0_ DDR0_ DQSN[ DDR0_
DDR1_ DDR1_ DDR1_ DDR1_ DQ[32] DQ[34] DQ[40] DQ[42] DQ[48] DQ[50] DQ[56] DQ[58]
AY CAB[5] CAB[8] --- CAB[2] CAB[1] DDR1_ --- --- / ]/ / --- / 5] / / --- / ]/ / --- / 7] / / ---
CS#[1] DDR1_ DDR1_ DDR1_ DDR1_
/ / / / DDR1_ DQSP[0 DDR1_ DDR1_ DQSN[ DDR1_ DDR1_ DQSP[4 DDR1_ DDR1_ DQSN[ DDR1_
DDR1_ DDR1_ DDR1_ DDR1_ DQ[0] DQ[2] DQ[8] DQ[10] DQ[32] DQ[34] DQ[40] DQ[42]
MA[2] MA[1] MA[14] MA[15] ] 1] ] 5]
DDR1_
MA[10] DDR1_
RAS# / DDR0_ DDR0_ DDR0_ DDR0_ DDR0_ DDR0_ DDR0_ DDR0_
/ DDR1_ DQ[33] DQ[35] DQ[41] DQ[43] DQ[49] DQ[51] DQ[57] DQ[59]
DDR1_ DDR1_
AW VSS CAB[7] VSS CAB[3] VSS ODT[1] VSS --- / VSS / VSS / VSS / VSS / VSS / VSS / VSS / ---
/ DDR1_ DDR1_ DDR1_ DDR1_ DDR1_ DDR1_ DDR1_ DDR1_
/ DDR1_ DQ[1] DQ[3] DQ[9] DQ[11] DQ[33] DQ[35] DQ[41] DQ[43]
DDR1_
MA[10] MA[16]
AV --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- ---
DDR0_
MA[13]
/ DDR1_ DDR1_ DDR1_ DDR1_
DQ[32] DQ[35] DQ[41] DQ[42]
AU --- DDR0_ DDR0_ --- DDR0_ VDDQ --- / --- VSS / --- VDDQ --- / VSS --- / --- VDDQ DDR1_ --- DDR1_ ---
CAB[0] CS#[0] CS#[1] DQ[48] DQ[51]
DQ[16] DQ[19] DQ[25] DQ[26]
DDR0_
MA[13]
DDR0_ DDR1_ DDR1_
WE#/ DDR1_ DDR1_ DDR1_ DDR1_
DDR0_ DQ[33] DQSN[ DQ[34] DQ[40] DQSN[ DQ[43]
DDR0_ DDR0_ 4] / 5] / DDR1_ DDR1_
AT --- CAB[2] ODT[0] --- ODT[1] VSS --- / --- DDR1_ / --- VSS --- / DDR1_ --- / --- VSS DQ[49] --- DQ[50] ---
DQSN[ DQSN[
DDR0_ DQ[17] 2] DQ[18] DQ[24] 3] DQ[27]
MA[14]
DDR1_ DDR1_ DDR1_ DDR1_ DDR1_ DDR1_
DQSP[4 DQSP[5
DQ[36] ]/ DQ[39] DQ[44] ]/ DQ[46] DDR1_ DDR1_
AR --- VSS VSS --- VSS VSS --- / --- / --- VSS --- / --- / --- VSS DQSP[6 --- DQSN[ ---
DDR1_ DDR1_ DDR1_ DDR1_ DDR1_ DDR1_ ] 6]
DQSP[2 DQSP[3
DQ[20] ] DQ[23] DQ[28] ] DQ[30]
DQ[37] DQ[38] DQ[45] DQ[47]
DDR1_ DDR1_ DDR1_ DDR1_ DDR1_
AP --- CKP[1] CKP[0] --- PAR VSS --- / --- VSS / --- VSS --- / VSS --- / --- VSS DQ[52] --- DQ[55] ---
DQ[21] DQ[22] DQ[29] DQ[31]
DDR1_ DDR1_ DDR1_ DDR1_ DDR1_
AN --- CKN[1] CKN[0] --- ALERT# VSS --- VSS --- VSS VSS --- VSS --- VSS VSS --- VSS --- VSS DQ[53] --- DQ[54] ---
AM --- VSS VSS --- VSS VCCIO --- VDDQC --- VCC VCC --- VCC --- VCC VCC --- VCCIO --- VCCIO VSS --- VSS ---
AL --- VccGTx VSS --- VccGTx VCCIO --- VCC --- VSS VCC --- VSS --- VCC VSS --- VCCIO --- VSS RSVD --- RSVD ---
AK --- VccGTx VccGTx --- VccGTx VccGTx --- VCC --- VCC VCC --- VCC --- VCC RSVD --- VCCIO --- VCCIO VSS --- VCCSA ---
AJ --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- ---
AH --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- ---
AG --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- ---
AF --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- ---
AE --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- ---
AD --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- ---
AC --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- ---
AB --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- ---
131
Figure 9-3. U/U-Quad Core Processor Ball Map (Upper Right, Columns 23-1)
23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
HDA_SD GPD9 / GPP_A3 GPP_A7 GPP_A1 GPP_A2
O/ DSW_P / LAD2 / 6/ 0/
BB VDDQ I2S0_TX --- WROK --- VSS SLP_WL --- WAKE# VCCRTC ESPI_IO --- / DCPRTC SD_1P8 --- ISH_GP VSS TP4 RSVD TP2 RSVD ---
AN# PIRQA#
D 2 _SEL 2
GPP_A5 GPP_A1 GPP_A1
HDA_SY HDA_SD GPD5 / GPD3 / GPP_A2 / 4/ 7/ GPP_A1 GPP_A2 GPP_B3
NC / I0/ PCH_PW GPD8 / / LAD1 / LFRAME SUS_ST SD_PW 9/ 1/ /
BA VSS I2S0_SF I2S0_R ROK --- VSS SUSCLK SLP_S4 PWRBTN VSS ESPI_IO #/ AT#/ VSS R_EN# / ISH_GP ISH_GP VSS CPU_GP RSVD RSVD VSS VSS
# #
RM XD 1 ESPI_CS ESPI_RE ISH_GP 1 3 2
# SET# 7
HDA_BL HDA_SD GPD10 / GPD1 / GPP_A1 GPP_A4 GPP_A6 GPP_A1 GPP_A1 GPP_A2 GPP_B4
K/ I1 / I2S1_SF RSMRST / LAD0 / / LAD3 / 0/ 8/ 2/ /
AY --- I2S0_S I2S1_R RM --- --- # SLP_S5 ACPRES --- ESPI_IO ESPI_IO / --- CLKOUT ISH_GP ISH_GP --- CPU_GP TP1 RSVD RSVD RSVD
# ENT SERIRQ
CLK XD 0 3 _LPC1 0 4 3
GPP_A9
HDA_RS GPD11 / GPP_A8 / GPP_A2 GPP_B1
T# / I2S1_TX SLP_LA GPP_A0 / CLKOUT 3/ SPI0_MI SPI0_IO
AW VSS I2S1_S VSS D --- VSS LANPHY VSS N# VSS / RCIN# VSS CLKRUN VSS _LPC0 / VSS ISH_GP VSS 4/ N/A SO 2 RSVD
PC SPKR
CLK # ESPI_CL 5
K
AV --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- SPI0_M SPI0_CL VSS
OSI K
GPD0 / GPP_B9 GPP_B1
DDR1_D DDR1_D DDR_RC PCH_OP GPP_A1 / 0/ SPI0_IO SPI0_C SPI0_C SPI0_C
AU VDDQ Q[57] Q[58] VSS --- OMP[2] --- IRCOMP VSS --- BATLOW --- 1 /PME# VSS --- SRCCLK SRCCLK --- TP5 3 S0# S1# S2#
#
REQ4# REQ5#
GPP_B1 GPP_B8 GPP_B7 GPP_B6
PROC_P
AT VSS DDR1_D DDR1_D VSS --- DDR_RC --- OPIRCO GPD7 / --- DRAM_R --- 2/ / --- / / --- TP6 VSS --- VSS EMMC_R
Q[56] Q[59] OMP[1] RSVD ESET# SLP_S0 SRCCLK SRCCLK SRCCLK COMP
MP # REQ3# REQ2# REQ1#
GPP_A1
3/ GPP_B5 GPP_B1
AR VSS DDR1_D DDR1_D VSS --- DDR_RC --- VSS VSS --- SUSWA --- VSS / --- VSS 8/ --- VSS --- --- --- ---
QSN[7] QSP[7] OMP[0] RN# / SRCCLK GSPI0_
SUSPW REQ0# MOSI
RDNACK
Sx_EX-
IT_HOL
DOFF# /
GPD4 / GPP_A1 GPP_A1 GPP_B1 GPP_B1 GPP_B2 GPP_F1 GPP_F1 GPP_F1 GPP_F1
DDR1_D DDR1_D INTRUD 5/ 7/ 6/ 1/ 2/ 5/ 3/ 4/
AP VSS Q[61] Q[62] VSS --- VSS --- ER# SLP_S3 --- 2/ --- SUSACK VSS --- GSPI0_ GSPI0_ --- GSPI1_ EMMC_C EMMC_ EMMC_ EMMC_
# BM_BUS
# MISO CLK MISO MD DATA2 DATA0 DATA1
Y# /
ISH_GP
6
GPP_B1 GPP_B0 GPP_B1 GPP_B1 GPP_B2 GPP_B2 GPP_F1 GPP_F1 GPP_F1
DDR1_D DDR1_D SRTCRS GPD6 / SLP_SU / / 3/ 5/ 0/ 2/ 6/ 8/ 7/
AN VSS VSS --- --- --- --- --- --- ---
Q[60] Q[63] T# SLP_A# S# CORE_V CORE_V PLTRST GSPI0_ GSPI1_ GSPI1_ EMMC_ EMMC_ EMMC_
ID1 ID0 # CS# CLK MOSI DATA3 DATA5 DATA4
GPP_B1 GPP_B2
GPP_B2 3/ GPP_B1 GPP_F1 GPP_F2 GPP_F2 GPP_F2
VCCIO_ VSSIO_ RTCRST GPD2 / / 1/ SML1AL 9/ 9/ 2/ 1/ 0/
AM VSS RTCX2 --- RTCX1 --- LAN_WA --- VSS --- EXT_P- --- VSS ---
SENSE SENSE # KE# VRALER WR_GAT ERT# / GSPI1_ EMMC_ EMMC_C EMMC_R EMMC_
T# PCHHOT CS# DATA6 LK CLK DATA7
E# #
VCCPLL DCPDS
AL _OC --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- VSS --- VSS W_1p0
GPP_F3 GPP_F2 GPP_F1 GPP_F0
VCCPRI VCCRT- VCCPGP RSVD_T RSVD_T / / / /
AK VCCSA VSS VSS VCCRTC VSS CPRIM_ VSS --- VSS VSS --- --- --- --- ---
M_1p0 3p3 PA P P I2S2_R I2S2_TX I2S2_SF I2S2_S
XD D RM CLK
AJ --- --- VCCPRI VSS VCCHDA VSS VCCDS VCCSPI VSS --- --- --- --- --- --- --- --- --- --- VSS USB2P_ USB2P_ USB2N_
M_3p3 W_3p3 3 5 5
GPP_F7 GPP_F6 GPP_F5 GPP_F4
/ / / / USB2P_ USB2N_ USB2N_ USB2P_ USB2N_
AH --- --- --- --- --- --- --- --- --- --- VSS I2C3_S I2C3_S I2C2_S I2C2_S 10 10 VSS --- --- 3 7 7
CL DA CL DA
USB2_V
VCCPGP USB2_I USB2P_ USB2N_
AG --- --- VSS VSS VSS VSS VSS VSS PB --- --- --- --- --- --- --- --- --- --- BUSSEN D 9 9
SE
GPP_F9 GPP_F8
VCCSRA VCCSRA VCCPRI VCCPRI VCCPGP GPP_F2 / / USB2P_ USB2N_ USB2P_ USB2N_
AF --- --- M_1P0 M_1P0 M_CORE M_CORE VSS PF VSS --- 3 I2C4_S I2C4_S VSS 8 8 6 6 --- VSS --- VSS VSS
CL DA
AE --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- ---
GPP_F1 GPP_F1
1/ 0/ GPP_C2 GPP_C2 GPP_C2 GPP_C2
AD --- --- VSS VSS VSS VCCDS VCCDS VSS VCCPGP --- VSS I2C5_S I2C5_S USB2P_ USB2N_ VSS USB2P_ USB2N_ --- 3/ 2/ 1/ 0/
W_3p3 W_3p3 PG CL / DA / 4 4 2 2 UART2_ UART2_ UART2_ UART2_
ISH_I2C ISH_I2C CTS# RTS# TXD RXD
2_SCL 2_SDA
GPP_C1 GPP_C1 GPP_C1
4/ 3/ 2/
UART1_ UART1_ UART1_
AC --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- RTS# / TXD / RXD /
ISH_UA ISH_UA ISH_UA
RT1_RT RT1_TX RT1_RX
S# D D
GPP_C1
5/
GPP_G1 GPP_G2 GPP_G0 GPP_C1 GPP_C9 GPP_C8
VCCPRI VCCPRI VCCPRI / / / USB2P_ USB2N_ SD_RCO USB2_C UART1_ 1/ / /
AB --- --- VSS VSS VSS VSS --- VSS --- CTS# /
M_1P0 M_1P0 M_1p0 SD_DAT SD_DAT SD_CM 1 1 MP OMP ISH_UA UART0_ UART0_ UART0_
A0 A1 D CTS# TXD RXD
RT1_CT
S#

Figure 9-4. U/U-Quad Core Processor Ball Map (Lower Left, Columns 71-48)
71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48
AA VCCGT VCCGT VCCGT VSS VCCGT VCCGT VSS VCCGT VCCGT --- --- --- --- --- --- --- --- --- --- --- --- --- --- ---
Y --- --- --- --- --- --- --- --- --- VCCGT --- --- --- --- --- --- --- --- --- --- --- --- --- ---
W VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT --- --- --- --- --- --- --- --- --- --- --- --- --- --- ---
VCCOP
V --- --- --- --- --- --- --- --- --- C --- --- --- --- --- --- --- --- --- --- --- --- --- ---
U VCCGT VSS VSS VCCGT VSS VSS VCCGT VSS VSS --- --- --- --- --- --- --- --- --- --- --- --- --- --- ---
T --- --- --- --- --- --- --- --- --- VCCGT --- --- --- --- --- --- --- --- --- --- --- --- --- ---
R VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT --- --- --- --- --- --- --- --- --- --- --- --- --- --- ---
P --- --- --- --- --- --- --- --- --- VCCOP --- --- --- --- --- --- --- --- --- --- --- --- --- ---
C
N VCCGT VCCGT VCCGT VSS VCCGT VCCGT VSS VCCGT VCCGT --- --- --- --- --- --- --- --- --- --- --- --- --- --- ---
M --- --- --- --- --- --- --- --- --- VCCGT --- --- --- --- --- --- --- --- --- --- --- --- --- ---
L VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT --- --- --- --- --- --- --- --- --- --- --- --- --- ---
K VSS VSS --- VSS VSS VSS VSS VSS VSS --- VSS VCCGT --- VCCGT --- VCCGT VCCGT --- VCCGT VCCGT --- VCCGT --- VCCGT
VCCGT VSSGT
J RSVD _SENS _SENS RSVD --- --- --- --- --- --- --- VCCGT --- VCCGT --- VCCGT VCCGT --- VCCGT VCCGT --- VCCGT --- VCCGT
E E
OPCE_ OPC_R VCC_O
CFG[1 CFG[1
H VSS 2] 4] --- --- RCOM COMP --- PC_1P --- --- --- --- --- --- --- --- --- --- --- --- --- --- ---
P 8
VCC_O
CFG[1 CFG[1 CFG[9 CFG[1 DDI1_ DDI1_ DDI1_
G --- VSS VSS --- VSS --- PC_1P VSS --- VSS --- VSS --- VSS --- --- VSS
3] 5] ] 1] TXP[3] TXP[2] AUXN
8
DDI1_ DDI1_ DDI1_
CFG[8 CFG[1 CFG[1 CFG[1 DDI1_ DDI1_ DDI2_
F --- VSS --- VSS --- --- RSVD RSVD --- --- TXN[3 TXP[0] --- TXN[2 RSVD --- ---
] 0] 9] 7] TXP[1] AUXP AUXP
] ]
DDI1_ DDI1_
CFG[4 CFG[0 CFG[1 CFG[1 RSVD CFG_R eDP_R DDI2_
E VSS ] --- ] --- 8] VSS --- 6] --- COMP --- TXN[1 --- VSS TXN[0 --- VSS COMP --- VSS --- AUXN
] ]
PROC_ PROC_ PCH_J
CFG[6 CFG[3 CFG[2 VIDSO CATER PROC_ BPM#[ RSVD DDI2_ DDI2_ DDI2_
D RSVD --- VSS VSS VSS PREQ TDI TAG_T VSS --- VSS TXP[1] TXN[3 --- VSS
] ] ] UT R# PRDY# 1] TXP[0]
# DI ]
PROC PROC_ MTRIP
THER PCH_J DDI2_ DDI2_ DDI2_
CFG[5 CFG[7 PCH_T PROC_ TAG_T BPM#[ BPM#[ RSVD
C RSVD RSVD --- --- HOT# SELEC --- --- --- --- TXN[1 TXP[3] TXN[0 --- ---
] ] RST# TMS 3] 0]
T# # MS ] ]
VCCST PCH_J EDP_D
CFG[1 VIDAL PROC_ PROC_ BPM#[ DDI2_
B VSS RSVD RSVD --- ] VSS _PWR --- ERT# VSS TCK --- TRST# VSS --- TAG_T --- 2] VSS ISP_U --- TXP[2] --- VSS
GD CK TIL
PCH_J DDI2_
RSVD PROCP VCCGT SKTOC VIDSC VCCGT PROC_
A --- VSS VSS --- --- JTAGX VCCGT --- TAG_T --- PECI VCCGT RSVD --- TXN[2 --- VCCGT
WRGD C# K TDO DO ]
133
Figure 9-5. U/U-Quad Core Processor Ball Map (Lower Middle, Columns 47-24)
47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24
AA --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- ---
Y --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- ---
W --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- ---
V --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- ---
U --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- ---
T --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- ---
R --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- ---
P --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- ---
N --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- ---
M --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- ---
L --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- ---
VCCS
K --- RSVD RSVD --- VCC VCC --- VCC --- VCC VCC --- VCC --- VCC RSVD --- --- VCCSA VCCSA --- VCCSA ---
A
VCCG VCCG VCCG
J --- --- VSS --- VCC --- VSS VCC --- VSS --- VCC VSS --- VCC --- VSS VCCSA --- VSS ---
T T T
H --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- ---
G --- RSVD VSS --- VSS VCC --- VCC --- VCC VCC --- VCC --- VCC VCC --- VCC --- VCCSA VCCSA --- VCCSA ---
PCIE1
CLKO 2_RXP
RSVD EDP_A UT_IT PCIE10
F --- --- VSS --- VSS --- VSS VSS --- VSS --- VSS VSS --- / --- VSS VSS --- ---
UXP PXDP_ _RXN
SATA2
N _RXP
PCIE1
CLKO PCIE11_ PCIE11_
UT_IT XCLK_ CLKO CLKO 2_RXN
EDP_A UT_PC XTAL2 XTAL2 VSS_S VCC_S RXN / RXP / PCIE10
E --- VSS --- PXDP_ BIASR --- UT_PC --- --- --- --- / --- --- ---
UXN IE_P5 4_IN 4_OUT ENSE ENSE SATA1B SATA1B _RXP
EF IE_N5 SATA2
P _RXN _RXP
_RXN
PCIE11
CLKO CLKO CLKO
EDP_T CSI2_ CSI2_ CSI2_ CSI2_ CSI2_ CSI2_ CSI2_ CSI2_D CSI2_D _TXN /
D VSS VSS VSS --- UT_PC UT_PC UT_PC VSS --- VSS VSS VSS VSS
XN[1] DP1 CLKP0 DP2 DP5 CLKP1 DP4 CLKP2 P9 P11 SATA1B
IE_N0 IE_N2 IE_N3 _TXN
PCIE11
CLKO CLKO CLKO
EDP_T EDP_T EDP_T CSI2_ CSI2_ CSI2_ CSI2_ CSI2_ CSI2_ CSI2_ CSI2_D CSI2_D _TXP /
C --- --- UT_PC UT_PC UT_PC --- --- --- --- --- VSS
XN[0] XP[0] XP[1] DN1 CLKN0 DN2 DN5 CLKN1 DN4 CLKN2 N9 N11 SATA1B
IE_P0 IE_P2 IE_P3 _TXP
PCIE12
CLKO CLKO
EDP_T EDP_T VSS CSI2_ CSI2_ CSI2_ CSI2_ CSI2_ CSI2_D CSI2_ _TXP /
B XP[3] --- XP[2] --- UT_PC --- UT_PC VSS DP3 --- DP0 --- VSS DP7 --- DP6 VSS DP8 --- P10 CLKN3 SATA2_ ---
IE_N1 IE_N4 TXP
PCIE12
CLKO CLKO
EDP_T EDP_T VCC CSI2_ CSI2_ CSI2_ CSI2_ CSI2_ CSI2_D CSI2_ _TXN /
A --- --- UT_PC --- UT_PC VCC --- --- VCC --- VCC --- ---
XN[3] XN[2] DN3 DN0 DN7 DN6 DN8 N10 CLKP3 SATA2_
IE_P1 IE_P4 TXN

Figure 9-6. U/U-Quad Core Processor Ball Map (Lower Right, Columns 23-1)
23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
AA --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- VSS --- VSS VCCATS
_1p8
Y --- --- VSS VSS VSS VCCPRI VSS VCCPGP VCCPGP --- --- --- --- --- --- --- --- --- --- --- --- --- ---
M_1p0 PC PD
GPP_G3 GPP_G4 GPP_G5 GPP_G6 GPP_G7 GPP_C1 GPP_C6 GPP_C4 GPP_C5
/ / / 0/ / / /
W --- --- --- --- --- --- --- --- --- --- VSS SD_DAT SD_DAT SD_CD VSS / / VSS --- UART0_ SML1CL SML0DA SML0AL
SD_CLK SD_WP
A2 A3 # RTS# K TA ERT#
GPP_C7 GPP_D2 GPP_D2
V --- --- VCCPRI VCCPRI VCCPRI VSS VSS VSS VCCAPL --- --- --- --- --- --- --- --- --- --- --- / 2/ 1/
M_CORE M_CORE M_3p3 L_1P0 SML1DA SPI1_IO SPI1_IO
TA 3 2
GPP_D1 GPP_D1
GPP_D1 4/ 3/
GPP_C1 GPP_C1 GPP_C1 GPP_C1 6/ GPP_D1 ISH_UA ISH_UA
ISH_UA 5/ RT0_TX RT0_RX
U --- --- --- --- --- --- --- --- --- --- eDP_VD RSVD RSVD VSS 9/ 8/ 6/ 7/ --- RT0_CT ISH_UA D/ D/
DEN I2C1_S I2C1_S I2C0_S I2C0_S
CL DA DA CL S# / RT0_RT SML0BC SML0BD
SML0BA S# LK / ATA /
LERT# I2C4B_ I2C4B_
SCL SDA
VCCSRA VCCSRA VCCPGP VCCPRI
T --- --- VSS VSS VSS VSS --- --- --- --- --- --- --- --- --- --- VSS --- VSS
M_1P0 M_1P0 PE M_1p0
GPP_C2 GPP_C3 GPP_C1
GPP_C0
R --- --- --- --- --- --- --- --- --- --- VSS eDP_BK eDP_BK / / / / VSS --- --- --- --- ---
LTEN LTCTL SMBALE SML0CL SMBDAT
RT# K A SMBCLK
VCCMPH VCCMPH
P --- --- VSS VSS VSS VCCPRI VSS YGT_1P YGT_1P --- --- --- --- --- --- --- --- --- --- GPP_D1 GPP_D1 GPP_D9 GPP_D1
M_1P0 1 0 2
0 0
GPP_E2
GPP_E1 GPP_E2 GPP_D6 GPP_D8 GPP_D7
VCCCLK VCCAPL VCCMPH VCCMPH VCCMPH GPP_E2 GPP_E2 6/ 1/ 0/ / / /
N --- --- VSS VSS LEBB_1 YGT_1P YGT_1P YGT_1P --- VSS VSS DDPC_C VSS --- ---
4 P0 0 0 0 3 2 DDPE_H TRLDAT DDPC_C ISH_I2C ISH_I2C ISH_I2C
PD3 TRLCLK 0_SCL 1_SCL 1_SDA
A
GPP_D5 GPP_D2 GPP_D1 GPP_D0
M --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- / / / /
ISH_I2C SPI1_MI SPI1_CL SPI1_C
0_SDA SO K S#
GPP_E1
VCCAM- GPP_E1 9/ GPP_E1 GPP_E1 GPP_E1 GPP_E1 VCCMPH
VCCCLK VCCCLK 8/ 7/ 3/ 4/ 5/
L --- --- VSS VSS VSS VSS PHYPLL --- DDPB_C VSS VSS --- VSS --- VSS YAON_1
3 5 _1P0 DDPB_C TRLDAT EDP_HP DDPB_H DDPC_H DDPD_ P0
TRLCLK D PD0 PD1 HPD2
A
VCCMPH VCCAM-
VCCCLK
K VCCSA VSS VccPLL VccPLL 2 VSS YAON_1 VSS PHYPLL --- --- --- --- --- --- --- --- --- --- --- --- --- ---
P0 _1P0
USB3_2 GPP_D2 GPP_D3 GPP_E6 GPP_E5 GPP_E4
USB3_3 _RXN / 3/ / / / /
J VCCSA VCCSA --- --- --- --- --- --- --- --- VSS --- VSS _RXN --- VSS --- SSIC_R I2S_MC SPI1_M DEVSLP DEVSLP DEVSLP
XN LK OSI 2 1 0
GPP_E1 GPP_E0
PCIE1_ USB3_2 GPP_D1 / / GPP_E8
VSSSA_ VCCSA_ PCIE3_ RXN / USB3_3 USB3_1 _RXP / 9/ SATAXP SATAXP /
H --- --- SENSE SENSE --- VSS --- RXN VSS --- USB3_5 --- RSVD _RXP --- _RXN --- SSIC_R DMIC_C --- CIE1 / CIE0 / SATALE
_RXN XP LK0 SATAGP SATAGP D#
1 0
GPP_E2
PCIE8_ PCIE1_ PCIE2_ /
RXN / PCIE6_ PCIE3_ PCIE4_ RXP / RXN / USB3_1 SATAXP CL_DAT CL_RST
G VCCSA VSS VCCSTG --- --- --- --- VSS --- --- VSS VSS CL_CLK
SATA1A RXN RXP RXN USB3_5 USB3_6 _RXP CIE2 / A #
_RXN _RXP _RXN SATAGP
2
PCIE8_ PCIE7_ PCIE2_
RXP / RXN / PCIE6_ PCIE5_ PCIE4_ RXP / USB3_4 PCIE_R
F VSS VSS --- --- --- VSS --- --- VSS --- RSVD VSS --- VSS VSS
SATA1A SATA0_ RXP RXN RXP USB3_6 _RXP COMPN
_RXP RXN _RXP
PCIE7_
PCIE9_ PCIE9_ RXP / PCIE5_ CSI2_C USB3_4 ITP_PM PCIE_R
E RXP RXN VSS SATA0_ --- VSS --- RXP VSS --- OMP --- VSS _RXN --- ODE --- VSS COMPP --- RSVD RSVD RSVD
RXP
PCIE8_T PCIE2_T GPP_E1 GPP_D1 GPP_D2
D PCIE10_ VSS XN / PCIE6_T PCIE5_T VSS PCIE3_T XN / USB3_4 VSS USB3_1 RSVD VSS VSS 1/ 7/ 0/ VSS RSVD RSVD RSVD --- RSVD
TXN SATA1A XN XP XN USB3_6 _TXP _TXP USB2_O DMIC_C DMIC_D
_TXN _TXN C2# LK1 ATA0
PCIE8_T PCIE2_T GPP_E1 GPP_D1
PCIE10_ XP / PCIE6_T PCIE5_T PCIE3_T XP / USB3_4 USB3_1 0/ 8/
C --- --- --- RSVD RSVD --- RSVD --- VSS RSVD --- RSVD VSS
TXP SATA1A XP XN XP USB3_6 _TXN _TXN USB2_O DMIC_D
_TXP _TXP C1# ATA1
PCIE7_T PCIE1_T USB3_2 GPP_E1 GPP_D4
PCIE9_T XN / PCIE4_T XN / USB3_3 _TXN / 2/ / SYS_PW SYS_RE
B XN VSS SATA0_ --- XN VSS USB3_5 --- _TXN VSS SSIC_T --- RSVD VSS USB2_O --- FLASHT ROK SET# --- RSVD RSVD ---
TXN _TXN XN C3# RIG
PCIE7_T PCIE1_T USB3_2 GPP_E9 GPP_E7 GPP_E3
A PCIE9_T VCCSTG XP / --- PCIE4_T VCCST XP / --- USB3_3 VCCCLK _TXP / --- RSVD VCCCLK / --- / / VSS RSVD RSVD --- ---
XP SATA0_ XP USB3_5 _TXP 1 SSIC_T 6 USB2_O CPU_GP CPU_GP
TXP _TXP XP C0# 1 0
135
Table 9-1. U/U-Quad Core Processor Ball List (Sheet 1 of 39)
Non-
Interleaved
Ball # Ball Name DDR3L LPDDR3 DDR4 Interleaved X[um] Y[um]
(IL)
(NIL)
A10 VCCCLK6 14988.794 -10989.056
A11 RSVD 14313.154 -11314.176

USB3_2_TXP /
A13 13186.41 -11314.176
SSIC_TXP
A14 VCCCLK1 12510.77 -10989.056
A15 USB3_3_TXP 11835.13 -11314.176

PCIE1_TXP /
A17 10708.386 -11314.176
USB3_5_TXP
A18 VCCST 10032.746 -10989.056
A19 PCIE4_TXP 9357.106 -11314.176
A21 PCIE7_TXP / SATA0_TXP 8230.362 -11314.176
A22 VCCSTG 7554.722 -10989.056
A23 PCIE9_TXP 6879.082 -11314.176

PCIE12_TXN /
A25 5752.338 -11314.176
SATA2_TXN
A26 CSI2_CLKP3 5076.698 -10989.056
A27 CSI2_DN10 4401.058 -11314.176
A29 CSI2_DN8 3274.314 -11314.176
A3 RSVD 19348.958 -11314.176
A30 VCC 2598.674 -10989.056
A31 CSI2_DN6 1923.034 -11314.176
A33 CSI2_DN7 796.29 -11314.176
A34 VCC 120.65 -10989.056
A36 CSI2_DN0 -554.99 -11314.176
A38 CSI2_DN3 -1681.734 -11314.176
A39 VCC -2357.374 -10989.056
A4 RSVD 18698.718 -11314.176
A40 CLKOUT_PCIE_P4 -3033.014 -11314.176
A42 CLKOUT_PCIE_P1 -4159.758 -11314.176
A44 VCC -4835.398 -10989.056
A45 EDP_TXN[2] -5511.038 -11314.176
A47 EDP_TXN[3] -6637.782 -11314.176
A48 VCCGT -7313.422 -10989.056
A5 VSS 18048.478 -11314.176
A50 DDI2_TXN[2] -7989.062 -11314.176
A52 RSVD -9115.806 -11314.176
A53 VCCGT -9791.446 -10989.056
A54 PECI -10467.086 -11314.176
A56 PCH_JTAG_TDO -11593.83 -11314.176
A58 VCCGT -12269.47 -10989.056

Non-
Interleaved
(IL)
(NIL)
A59 JTAGX -12945.11 -11314.176
A6 GPP_E3 / CPU_GP0 17466.818 -10989.056
A61 PROC_TDO -14071.854 -11314.176
A62 VCCGT -14747.494 -10989.056
A63 VIDSCK -15423.134 -11314.176
A65 SKTOCC# -16549.878 -11314.176
A66 VCCGT -17225.518 -10989.056
A67 VSS -17901.158 -11314.176
A68 PROCPWRGD -18551.652 -11314.176
A69 RSVD -19201.892 -11314.176
A7 GPP_E7 / CPU_GP1 16791.178 -11314.176
A70 VSS -19852.132 -11314.176
A9 GPP_E9 / USB2_OC0# 15664.434 -11314.176
AA1 VCCATS_1p8 19989.038 -510.54
AA2 VSS 19338.798 -510.54
AA4 VSS 18363.438 -510.54
AA63 VCCGT -15112.492 -595.63
AA64 VCCGT -15762.732 -595.63
AA65 VSS -16412.972 -595.63
AA66 VCCGT -17063.212 -595.63
AA67 VCCGT -17713.452 -595.63
AA68 VSS -18363.692 -595.63
AA69 VCCGT -19013.932 -595.63
AA70 VCCGT -19664.172 -595.63
AA71 VCCGT -20314.412 -595.63
AB1 GPP_C8 / UART0_RXD 20314.158 152.4
AB10 USB2P_1 14984.476 -133.096
AB11 GPP_G0 / SD_CMD 14334.236 -133.096
AB12 GPP_G2 / SD_DATA1 13683.996 -133.096
AB13 GPP_G1 / SD_DATA0 13033.756 -133.096
AB15 VSS 12188.19 -8.89
AB16 VSS 11537.95 -8.89
AB17 VCCPRIM_1p0 10887.71 -8.89
AB18 VSS 10237.47 -8.89
AB19 VCCPRIM_1P0 9587.23 -8.89
AB2 GPP_C9 / UART0_TXD 19663.918 152.4
AB20 VCCPRIM_1P0 8936.99 -8.89
AB21 VSS 8286.75 -8.89
137
Non-
Interleaved
(IL)
(NIL)
AB3 GPP_C11 / UART0_CTS# 19013.678 152.4

GPP_C15 / UART1_CTS#
AB4 18363.438 152.4
/ ISH_UART1_CTS#
AB6 USB2_COMP 17585.436 -133.096
AB62 VCCOPC -14643.862 -138.43
AB7 SD_RCOMP 16935.196 -133.096
AB8 VSS 16284.956 -133.096
AB9 USB2N_1 15634.716 -133.096

GPP_C12 / UART1_RXD /
AC1 19989.038 815.34
ISH_UART1_RXD
GPP_C13 / UART1_TXD /
AC2 19338.798 815.34
ISH_UART1_TXD
GPP_C14 / UART1_RTS#
AC3 18688.558 815.34
/ ISH_UART1_RTS#
AC63 VCCOPC_SENSE -15112.492 318.77
AC64 VCCGT -15762.732 318.77
AC65 VCCGT -16412.972 318.77
AC66 VCCGT -17063.212 318.77
AC67 VCCGT -17713.452 318.77
AC68 VCCGT -18363.692 318.77
AC69 VCCGT -19013.932 318.77
AC70 VCCGT -19664.172 318.77
AC71 VCCGT -20314.412 318.77
AD1 GPP_C20 / UART2_RXD 20314.158 1478.28
AD10 USB2P_4 14984.476 933.704

GPP_F10 / I2C5_SDA /
AD11 14334.236 933.704
ISH_I2C2_SDA
GPP_F11/ I2C5_SCL /
AD12 13683.996 933.704
ISH_I2C2_SCL
AD13 VSS 13033.756 933.704
AD15 VCCPGPPG 12188.19 829.31
AD16 VSS 11537.95 829.31
AD17 VCCDSW_3p3 10887.71 829.31
AD18 VCCDSW_3p3 10237.47 829.31
AD19 VSS 9587.23 829.31
AD2 GPP_C21 / UART2_TXD 19663.918 1478.28
AD20 VSS 8936.99 829.31
AD21 VSS 8286.75 829.31
AD3 GPP_C22 / UART2_RTS# 19013.678 1478.28
AD4 GPP_C23 / UART2_CTS# 18363.438 1478.28
AD6 USB2N_2 17585.436 933.704
AD62 VSS -14643.862 775.97

Non-
Interleaved
(IL)
(NIL)
AD7 USB2P_2 16935.196 933.704
AD8 VSS 16284.956 933.704
AD9 USB2N_4 15634.716 933.704
AE62 VCCEOPIO -14643.862 1690.37
AE63 VSSOPC_SENSE -15112.492 1233.17
AE64 VSS -15762.732 1233.17
AE65 VSS -16412.972 1233.17
AE66 VSS -17063.212 1233.17
AE67 VSS -17713.452 1233.17
AE68 VSS -18363.692 1233.17
AE69 VSS -19013.932 1233.17
AF1 VSS 19989.038 2141.22
AF10 VSS 14984.476 2000.504
AF11 GPP_F8 / I2C4_SDA 14334.236 2000.504
AF12 GPP_F9 / I2C4_SCL 13683.996 2000.504
AF13 GPP_F23 13033.756 2000.504
AF15 VSS 12188.19 1667.51
AF16 VCCPGPPF 11537.95 1667.51
AF17 VSS 10887.71 1667.51
AF18 VCCPRIM_CORE 10237.47 1667.51
AF19 VCCPRIM_CORE 9587.23 1667.51
AF2 VSS 19338.798 2141.22
AF20 VCCSRAM_1P0 8936.99 1667.51
AF21 VCCSRAM_1P0 8286.75 1667.51
AF4 VSS 18363.438 2141.22
AF6 USB2N_6 17585.436 2000.504
AF63 VSS -15112.492 2147.57

DDR1_DQ[1] / DDR1_DQ[1] DDR0_DQ[17]
AF64 -15762.732 2147.57
DDR0_DQ[17]
AF65 -16412.972 2147.57
DDR0_DQ[16]
AF66 -17063.212 2147.57
DDR0_DQ[20]
AF67 -17713.452 2147.57
DDR0_DQ[21]
AF68 -18363.692 1939.036
DDR0_DQ[25]
AF69 -19013.932 1939.036
DDR0_DQ[29]
AF7 USB2P_6 16935.196 2000.504
AF70 -19664.172 1839.976
DDR0_DQ[24]
139
Non-
Interleaved
(IL)
(NIL)

AF71 -20314.412 1839.976
DDR0_DQ[28]
AF8 USB2N_8 16284.956 2000.504
AF9 USB2P_8 15634.716 2000.504
AG1 USB2N_9 20314.158 2804.16
AG15 VCCPGPPB 12188.19 2505.71
AG16 VSS 11537.95 2505.71
AG17 VSS 10887.71 2505.71
AG18 VSS 10237.47 2505.71
AG19 VSS 9587.23 2505.71
AG2 USB2P_9 19663.918 2804.16
AG20 VSS 8936.99 2505.71
AG21 VSS 8286.75 2505.71
AG3 USB2_ID 19013.678 2804.16
AG4 USB2_VBUSSENSE 18363.438 2804.16
AG62 VCCEOPIO -14643.862 2604.77

DDR1_DQSN[1] / DDR1_DQSN[1] DDR0_DQSN[3]
AG69 -18688.812 2601.976
DDR0_DQSN[3]
DDR1_DQSP[1] / DDR1_DQSP[1] DDR0_DQSP[3]
AG70 -19339.052 2502.916
DDR0_DQSP[3]
AG71 VSS -19989.292 2502.916
AH1 USB2N_7 19989.038 3467.1
AH10 GPP_F5 / I2C2_SCL 14984.476 3067.304
AH11 GPP_F6 / I2C3_SDA 14334.236 3067.304
AH12 GPP_F7 / I2C3_SCL 13683.996 3067.304
AH13 VSS 13033.756 3067.304
AH2 USB2P_7 19338.798 3467.1
AH3 USB2N_3 18688.558 3467.1
AH6 VSS 17585.436 3067.304
AH63 VSS -15112.492 3061.97
AH64 VSS -15762.732 3061.97

AH65 -16412.972 3061.97
DDR0_DQSP[2]
AH66 -17063.212 3061.97
DDR0_DQSN[2]
AH67 VSS -17713.452 3061.97
AH68 -18363.692 3165.856
DDR0_DQ[27]
AH69 -19013.932 3165.856
DDR0_DQ[31]
AH7 USB2N_10 16935.196 3067.304
AH70 -19664.172 3165.856
DDR0_DQ[30]

Non-
Interleaved
(IL)
(NIL)

AH71 -20314.412 3165.856
DDR0_DQ[26]
AH8 USB2P_10 16284.956 3067.304
AH9 GPP_F4 / I2C2_SDA 15634.716 3067.304
AJ1 USB2N_5 20314.158 4130.04
AJ15 VSS 12188.19 3343.91
AJ16 VCCSPI 11537.95 3343.91
AJ17 VCCDSW_3p3 10887.71 3343.91
AJ18 VSS 10237.47 3343.91
AJ19 VCCHDA 9587.23 3343.91
AJ2 USB2P_5 19663.918 4130.04
AJ20 VSS 8936.99 3343.91
AJ21 VCCPRIM_3p3 8286.75 3343.91
AJ3 USB2P_3 19013.678 4130.04
AJ4 VSS 18363.438 4130.04
AJ62 VSSEOPIO_SENSE -14643.862 3519.17
AK10 GPP_F3 / I2S2_RXD 14984.476 4007.104
AK11 VSS 14334.236 4007.104
AK12 RSVD_TP 13683.996 4007.104
AK13 RSVD_TP 13033.756 4007.104
AK15 VCCPGPPA 12188.19 4182.11
AK16 VSS 11537.95 4182.11
AK17 VCCRTCPRIM_3p3 10887.71 4182.11
AK18 VSS 10237.47 4182.11
AK19 VCCRTC 9587.23 4182.11
AK20 VCCPRIM_1p0 8936.99 4182.11
AK21 VSS 8286.75 4182.11
AK22 VSS 7595.616 4009.136
AK23 VCCSA 6681.216 4009.136
AK25 VCCSA 5766.816 4009.136
AK27 VSS 4852.416 4009.136
AK28 VCCIO 3938.016 4009.136
AK30 VCCIO 3023.616 4009.136
AK32 RSVD 2109.216 4009.136
AK33 VCC 1194.816 4009.136
AK35 VCC 280.416 4009.136
AK37 VCC -633.984 4009.136
AK38 VCC -1548.384 4009.136
AK40 VCC -2462.784 4009.136
141
Non-
Interleaved
(IL)
(NIL)
AK42 VccGTx -3377.184 4009.136
AK43 VccGTx -4291.584 4009.136
AK45 VccGTx -5205.984 4009.136
AK46 VccGTx -6120.384 4009.136
AK48 VccGTx -7034.784 4009.136
AK50 VccGTx -7949.184 4009.136
AK52 VccGTx -8863.584 4009.136
AK53 VccGTx -9777.984 4009.136
AK55 VccGTx -10692.384 4009.136
AK56 VccGTx -11606.784 4009.136
AK58 VccGTx -12521.184 4009.136
AK6 GPP_F0 / I2S2_SCLK 17585.436 4007.104
AK60 VccGTx -13435.584 4009.136
AK62 VCCGTx_SENSE -14459.712 4143.756
AK63 VSS -15112.492 3976.37

AK64 -15762.732 3976.37
DDR0_DQ[19]
AK65 -16412.972 3976.37
DDR0_DQ[18]
AK66 -17063.212 3976.37
DDR0_DQ[23]
AK67 -17713.452 3976.37
DDR0_DQ[22]
AK68 VSS -18363.692 3828.796
AK69 VSS -19339.052 3828.796
AK7 GPP_F1 / I2S2_SFRM 16935.196 4007.104
AK70 VccGTx -19989.292 3828.796
AK8 VSS 16284.956 4007.104
AK9 GPP_F2 / I2S2_TXD 15634.716 4007.104
AL1 DCPDSW_1p0 19989.038 4792.98
AL2 VSS 19338.798 4792.98
AL23 VCCPLL_OC 7138.416 4473.956
AL25 RSVD 6224.016 4473.956
AL27 RSVD 5309.616 4473.956
AL28 VSS 4395.216 4473.956
AL30 VCCIO 3480.816 4473.956
AL32 VSS 2566.416 4473.956
AL33 VCC 1652.016 4473.956
AL35 VSS 737.616 4473.956
AL37 VCC -176.784 4473.956
AL38 VSS -1091.184 4473.956

Non-
Interleaved
(IL)
(NIL)
AL4 VSS 18363.438 4792.98
AL40 VCC -2005.584 4473.956
AL42 VCCIO -2919.984 4473.956
AL43 VccGTx -3834.384 4473.956
AL45 VSS -4748.784 4473.956
AL46 VccGTx -5663.184 4473.956
AL48 VSS -6577.584 4473.956
AL50 VccGTx -7491.984 4473.956
AL52 VSS -8406.384 4473.956
AL53 VccGTx -9320.784 4473.956
AL55 VSS -10235.184 4473.956
AL56 VccGTx -11149.584 4473.956
AL58 VSS -12063.984 4473.956
AL60 VccGTx -12978.384 4473.956
AL61 VSSGTx_SENSE -13892.784 4473.956
AL63 VCCEOPIO_SENSE -15112.492 4845.05
AL64 VSS -15762.732 4845.05
AL65 VSS -16412.972 4845.05
AL66 VSS -17063.212 4845.05
AL68 DDR0_DQ[1] -18363.692 4491.736
AL69 DDR0_DQ[5] -19013.932 4491.736
AL70 DDR0_DQ[4] -19664.172 4491.736
AL71 DDR0_DQ[0] -20314.412 4491.736
AM1 GPP_F20 / EMMC_DATA7 20314.158 5455.92

GPP_B11 /
AM10 14910.816 4946.396
EXT_PWR_GATE#
AM11 GPP_B2 / VRALERT# 13996.416 4946.396
AM13 VSS 13082.016 4946.396
AM15 GPD2 / LAN_WAKE# 12167.616 4946.396
AM16 RTCRST# 11253.216 4946.396
AM18 RTCX1 10338.816 4946.396
AM2 GPP_F21 / EMMC_RCLK 19663.918 5455.92
AM20 RTCX2 9424.416 4946.396
AM21 VSS 8510.016 4946.396
AM22 VSSIO_SENSE 7595.616 4946.396
AM23 VCCIO_SENSE 6681.216 4946.396
AM25 VSS 5766.816 4946.396
AM27 VSS 4852.416 4946.396
AM28 VCCIO 3938.016 4946.396
143
Non-
Interleaved
(IL)
(NIL)
AM3 GPP_F22 / EMMC_CLK 19013.678 5455.92
AM30 VCCIO 3023.616 4946.396
AM32 VCC 2109.216 4946.396
AM33 VCC 1194.816 4946.396
AM35 VCC 280.416 4946.396
AM37 VCC -633.984 4946.396
AM38 VCC -1548.384 4946.396
AM4 GPP_F19 / EMMC_DATA6 18363.438 5455.92
AM40 VDDQC -2462.784 4946.396
AM42 VCCIO -3377.184 4946.396
AM43 VSS -4291.584 4946.396
AM45 VSS -5205.984 4946.396
AM46 VSS -6120.384 4946.396
AM48 VccGTx -7034.784 4946.396
AM5 GPP_B19 / GSPI1_CS# 17654.016 4946.396
AM50 VccGTx -7949.184 4946.396
AM52 VccGTx -8863.584 4946.396
AM53 VccGTx -9777.984 4946.396
AM55 VSS -10692.384 4946.396
AM56 VccGTx -11606.784 4946.396
AM58 VccGTx -12521.184 4946.396
AM60 VSS -13435.584 4946.396
AM61 VSS -14349.984 4946.396
AM68 VSS -18038.572 5055.616
AM69 DDR0_DQSP[0] -18688.812 5055.616

GPP_B23 / SML1ALERT#
AM7 16739.616 4946.396
/ PCHHOT#
AM70 DDR0_DQSN[0] -19339.052 5154.676
AM71 VSS -19989.292 5154.676
AM8 VSS 15825.216 4946.396
AN1 GPP_F17 / EMMC_DATA4 19989.038 6118.86
AN10 GPP_B13 / PLTRST# 14910.816 5596.636
AN11 GPP_B0 / CORE_VID0 13996.416 5596.636
AN13 GPP_B1 / CORE_VID1 13082.016 5596.636
AN15 SLP_SUS# 12167.616 5596.636
AN16 GPD6 / SLP_A# 11253.216 5596.636
AN18 SRTCRST# 10338.816 5596.636
AN2 GPP_F18 / EMMC_DATA5 19338.798 6118.86
AN20 VSS 9424.416 5596.636

Non-
Interleaved
(IL)
(NIL)
AN21 DDR1_DQ[63] 8510.016 5596.636
AN22 DDR1_DQ[60] 7595.616 5596.636
AN23 VSS 6681.216 5596.636
AN25 DDR1_DQ[54] 5766.816 5596.636
AN27 DDR1_DQ[53] 4852.416 5596.636
AN28 VSS 3938.016 5596.636
AN3 GPP_F16 / EMMC_DATA3 18688.558 6118.86
AN30 VSS 3023.616 5596.636
AN32 VSS 2109.216 5596.636
AN33 VSS 1194.816 5596.636
AN35 VSS 280.416 5596.636
AN37 VSS -633.984 5596.636
AN38 VSS -1548.384 5596.636
AN40 VSS -2462.784 5596.636
AN42 VSS -3377.184 5596.636
AN43 DDR1_ALERT# -4291.584 5596.636
AN45 DDR1_CKN[0] -5205.984 5596.636
AN46 DDR1_CKN[1] -6120.384 5596.636

DDR1_MA[11] / DDR1_MA[11] DDR1_CAA[7] DDR1_MA[11]
AN48 DDR1_CAA[7] / -7034.784 5596.636
DDR1_MA[11]
AN5 GPP_B22 / GSPI1_MOSI 17654.016 5596.636
AN50 DDR1_CAA[6] / -7949.184 5596.636
DDR1_MA[12]
DDR1_MA[14] / DDR1_MA[14] DDR1_CAA[9] DDR1_BG[1]
AN52 DDR1_CAA[9]/ -8863.584 5596.636
DDR1_BG[1]
DDR1_MA[15] / DDR1_MA[15] DDR1_CAA[8] DDR1_ACT#
AN53 DDR1_CAA[8]/ -9777.984 5596.636
DDR1_ACT#
AN55 DDR1_CKE[2] -10692.384 5596.636
AN56 DDR1_CKE[0] -11606.784 5596.636
AN58 VSS -12521.184 5596.636

AN60 -13435.584 5596.636
DDR0_DQ[59]
AN61 -14349.984 5596.636
DDR0_DQ[60]
AN63 VSS -15264.384 5596.636
AN65 -16178.784 5596.636
DDR0_DQ[51]
AN66 -17093.184 5596.636
DDR0_DQ[52]
AN68 DDR0_DQ[2] -18363.692 5718.556
145
Non-
Interleaved
(IL)
(NIL)
AN69 DDR0_DQ[3] -19013.932 5718.556
AN7 GPP_B20 / GSPI1_CLK 16739.616 5596.636
AN70 DDR0_DQ[6] -19664.172 5817.616
AN71 DDR0_DQ[7] -20314.412 5817.616
AN8 GPP_B15 / GSPI0_CS# 15825.216 5596.636
AP1 GPP_F14 / EMMC_DATA1 20314.158 6781.8
AP10 VSS 14910.816 6246.876
AP11 GPP_A15 / SUSACK# 13996.416 6246.876

Sx_EXIT_HOLDOFF# /
AP13 GPP_A12 / BM_BUSY# / 13082.016 6246.876
ISH_GP6
AP15 GPD4 / SLP_S3# 12167.616 6246.876
AP16 INTRUDER# 11253.216 6246.876
AP18 VSS 10338.816 6246.876
AP2 GPP_F13 / EMMC_DATA0 19663.918 6781.8
AP20 VSS 9424.416 6246.876
AP21 DDR1_DQ[62] 8510.016 6246.876
AP22 DDR1_DQ[61] 7595.616 6246.876
AP23 VSS 6681.216 6246.876
AP25 DDR1_DQ[55] 5766.816 6246.876
AP27 DDR1_DQ[52] 4852.416 6246.876
AP28 VSS 3938.016 6246.876
AP3 GPP_F15 / EMMC_DATA2 19013.678 6781.8

AP30 3023.616 6246.876
DDR1_DQ[31]
AP32 VSS 2109.216 6246.876
AP33 1194.816 6246.876
DDR1_DQ[29]
AP35 VSS 280.416 6246.876
AP37 -633.984 6246.876
DDR1_DQ[22]
AP38 VSS -1548.384 6246.876
AP4 GPP_F12 / EMMC_CMD 18363.438 6781.8

AP40 -2462.784 6246.876
DDR1_DQ[21]
AP42 VSS -3377.184 6246.876
AP43 DDR1_PAR -4291.584 6246.876
AP45 DDR1_CKP[0] -5205.984 6246.876
AP46 DDR1_CKP[1] -6120.384 6246.876

AP48 DDR1_CAA[4] / -7034.784 6246.876
DDR1_MA[7]

Non-
Interleaved
(IL)
(NIL)
AP5 GPP_B21 / GSPI1_MISO 17654.016 6246.876

AP50 DDR1_CAA[1] / -7949.184 6246.876
DDR1_MA[9]
DDR1_BA[2] / DDR1_BA[2] DDR1_CAA[5] DDR1_BG[0]
AP52 DDR1_CAA[5]/ -8863.584 6246.876
DDR1_BG[0]
AP53 DDR1_CKE[3] -9777.984 6246.876
AP55 DDR1_CKE[1] -10692.384 6246.876
AP56 MSM# -11606.784 6246.876
AP58 VSS -12521.184 6246.876

AP60 -13435.584 6246.876
DDR0_DQ[58]
AP61 -14349.984 6246.876
DDR0_DQ[61]
AP63 VSS -15264.384 6246.876
AP65 -16178.784 6246.876
DDR0_DQ[50]
AP66 -17093.184 6246.876
DDR0_DQ[53]
AP68 VSS -18038.572 6331.966
AP7 GPP_B16 / GSPI0_CLK 16739.616 6246.876
AP70 VSS -19257.772 6331.966
AP8 GPP_B17 / GSPI0_MISO 15825.216 6246.876

GPP_B5 /
AR10 14910.816 6897.116
SRCCLKREQ0#
AR11 VSS 13996.416 6897.116
GPP_A13 / SUSWARN# /
AR13 13082.016 6897.116
SUSPWRDNACK
AR15 VSS 12167.616 6897.116
AR16 VSS 11253.216 6897.116
AR18 DDR_RCOMP[0] 10338.816 6897.116
AR20 VSS 9424.416 6897.116
AR21 DDR1_DQSP[7] 8510.016 6897.116
AR22 DDR1_DQSN[7] 7595.616 6897.116
AR23 VSS 6681.216 6897.116
AR25 DDR1_DQSN[6] 5766.816 6897.116
AR27 DDR1_DQSP[6] 4852.416 6897.116
AR28 VSS 3938.016 6897.116

AR30 3023.616 6897.116
DDR1_DQ[30]
AR32 2109.216 6897.116
DDR1_DQSP[3]
AR33 1194.816 6897.116
DDR1_DQ[28]
147
Non-
Interleaved
(IL)
(NIL)
AR35 VSS 280.416 6897.116

AR37 -633.984 6897.116
DDR1_DQ[23]
AR38 -1548.384 6897.116
DDR1_DQSP[2]
AR40 -2462.784 6897.116
DDR1_DQ[20]
AR42 VSS -3377.184 6897.116
AR43 VSS -4291.584 6897.116
AR45 VSS -5205.984 6897.116
AR46 VSS -6120.384 6897.116
AR48 VSS -7034.784 6897.116
AR5 VSS 17654.016 6897.116
AR50 VSS -7949.184 6897.116
AR52 VSS -8863.584 6897.116
AR53 VSS -9777.984 6897.116
AR55 VSS -10692.384 6897.116
AR56 ZVM# -11606.784 6897.116
AR58 VSS -12521.184 6897.116

AR60 -13435.584 6897.116
DDR0_DQSP[7]
AR61 -14349.984 6897.116
DDR0_DQSN[7]
AR63 VSS -15264.384 6897.116
AR65 -16178.784 6897.116
DDR0_DQSP[6]
AR66 -17093.184 6897.116
DDR0_DQSN[6]
AR68 DDR0_DQ[9] -18363.692 6945.376
AR69 DDR0_DQ[13] -19013.932 6945.376
AR7 GPP_B18 / GSPI0_MOSI 16739.616 6897.116
AR70 DDR0_DQ[8] -19664.172 6846.316
AR71 DDR0_DQ[12] -20314.412 6846.316
AR8 VSS 15825.216 6897.116
AT1 EMMC_RCOMP 19989.038 7444.74

GPP_B8 /
AT10 14910.816 7547.356
SRCCLKREQ3#
AT11 GPP_B12 / SLP_S0# 13996.416 7547.356
AT13 DRAM_RESET# 13082.016 7547.356
AT15 GPD7 / RSVD 12167.616 7547.356
AT16 PROC_POPIRCOMP 11253.216 7547.356
AT18 DDR_RCOMP[1] 10338.816 7547.356
AT2 VSS 19338.798 7444.74

Non-
Interleaved
(IL)
(NIL)
AT20 VSS 9424.416 7547.356
AT21 DDR1_DQ[59] 8510.016 7547.356
AT22 DDR1_DQ[56] 7595.616 7547.356
AT23 VSS 6681.216 7547.356
AT25 DDR1_DQ[50] 5766.816 7547.356
AT27 DDR1_DQ[49] 4852.416 7547.356
AT28 VSS 3938.016 7547.356

AT30 3023.616 7547.356
DDR1_DQ[27]
AT32 2109.216 7547.356
DDR1_DQSN[3]
AT33 1194.816 7547.356
DDR1_DQ[24]
AT35 VSS 280.416 7547.356
AT37 -633.984 7547.356
DDR1_DQ[18]
AT38 -1548.384 7547.356
DDR1_DQSN[2]
AT4 VSS 18363.438 7444.74
AT40 -2462.784 7547.356
DDR1_DQ[17]
AT42 VSS -3377.184 7547.356
AT43 DDR0_ODT[1] -4291.584 7547.356
AT45 DDR0_ODT[0] -5205.984 7547.356

DDR0_WE#/ DDR0_WE# DDR0_CAB[2] DDR0_MA[14]
AT46 DDR0_CAB[2]/ -6120.384 7547.356
DDR0_MA[14]
DDR0_BA[1] / DDR0_BA[1] DDR0_CAB[6] DDR0_BA[1]
AT48 DDR0_CAB[6]/ -7034.784 7547.356
DDR0_BA[1]
AT5 TP6 17654.016 7547.356
DDR0_MA[10] / DDR0_MA[10] DDR0_CAB[7] DDR0_MA[10]
AT50 DDR0_CAB[7]/ -7949.184 7547.356
DDR0_MA[10]
AT52 DDR0_PAR -8863.584 7547.356
AT53 DDR0_CKP[0] -9777.984 7547.356
AT55 DDR0_CKP[1] -10692.384 7547.356
AT56 VSS -11606.784 7547.356
AT58 VSS -12521.184 7547.356

AT60 -13435.584 7547.356
DDR0_DQ[62]
AT61 -14349.984 7547.356
DDR0_DQ[56]
AT63 VSS -15264.384 7547.356
AT65 -16178.784 7547.356
DDR0_DQ[54]
149
Non-
Interleaved
(IL)
(NIL)

AT66 -17093.184 7547.356
DDR0_DQ[48]
AT68 VSS -18038.572 7509.256
AT69 DDR0_DQSN[1] -18688.812 7509.256

GPP_B6 /
AT7 16739.616 7547.356
SRCCLKREQ1#
AT70 DDR0_DQSP[1] -19339.052 7509.256
AT71 VSS -19989.292 7509.256

GPP_B7 /
AT8 15825.216 7547.356
SRCCLKREQ2#
AU1 SPI0_CS2# 20314.158 8107.68
AU10 VSS 14910.816 8197.596
AU11 GPP_A11 /PME# 13996.416 8197.596
AU13 GPD0 / BATLOW# 13082.016 8197.596
AU15 VSS 12167.616 8197.596
AU16 PCH_OPIRCOMP 11253.216 8197.596
AU18 DDR_RCOMP[2] 10338.816 8197.596
AU2 SPI0_CS1# 19663.918 8107.68
AU20 VSS 9424.416 8197.596
AU21 DDR1_DQ[58] 8510.016 8197.596
AU22 DDR1_DQ[57] 7595.616 8197.596
AU23 VDDQ 6681.216 8197.596
AU25 DDR1_DQ[51] 5766.816 8197.596
AU27 DDR1_DQ[48] 4852.416 8197.596
AU28 VDDQ 3938.016 8197.596
AU3 SPI0_CS0# 19013.678 8107.68

AU30 3023.616 8197.596
DDR1_DQ[26]
AU32 VSS 2109.216 8197.596
AU33 1194.816 8197.596
DDR1_DQ[25]
AU35 VDDQ 280.416 8197.596
AU37 -633.984 8197.596
DDR1_DQ[19]
AU38 VSS -1548.384 8197.596
AU4 SPI0_IO3 18363.438 8107.68

AU40 -2462.784 8197.596
DDR1_DQ[16]
AU42 VDDQ -3377.184 8197.596
AU43 DDR0_CS#[1] -4291.584 8197.596
AU45 DDR0_CS#[0] -5205.984 8197.596

Non-
Interleaved
(IL)
(NIL)

AU46 DDR0_CAB[0] / -6120.384 8197.596
DDR0_MA[13]
DDR0_CAS#/ DDR0_CAS# DDR0_CAB[1] DDR0_MA[15]
AU48 DDR0_CAB[1]/ -7034.784 8197.596
DDR0_MA[15]
AU5 TP5 17654.016 8197.596
DDR0_RAS# / DDR0_RAS# DDR0_CAB[3] DDR0_MA[16]
AU50 DDR0_CAB[3]/ -7949.184 8197.596
DDR0_MA[16]
AU52 DDR0_CAB[4]/ -8863.584 8197.596
DDR0_BA[0]
AU53 DDR0_CKN[0] -9777.984 8197.596
AU55 DDR0_CKN[1] -10692.384 8197.596
AU56 RSVD -11606.784 8197.596
AU58 VccGTx -12521.184 8197.596

AU60 -13435.584 8197.596
DDR0_DQ[63]
AU61 -14349.984 8197.596
DDR0_DQ[57]
AU63 VccGTx -15264.384 8197.596
AU65 -16178.784 8197.596
DDR0_DQ[55]
AU66 -17093.184 8197.596
DDR0_DQ[49]
AU68 DDR0_DQ[11] -18363.692 8146.796
AU69 DDR0_DQ[15] -19013.932 8172.196

GPP_B10 /
AU7 16739.616 8197.596
SRCCLKREQ5#
AU70 DDR0_DQ[14] -19664.172 8172.196
AU71 DDR0_DQ[10] -20314.412 8172.196

GPP_B9 /
AU8 15825.216 8197.596
SRCCLKREQ4#
AV1 VSS 20314.158 8827.516
AV2 SPI0_CLK 19364.198 8798.56
AV3 SPI0_MOSI 18688.558 8798.56
AV68 VSS -18028.92 8711.438
AV69 VSS -19013.932 8901.176
AV70 VSS -19664.172 8901.176
AV71 VSS -20314.412 8901.176
AW1 RSVD 20314.158 9551.416
AW10 VSS 14752.828 9038.336
AW11 GPP_A8 / CLKRUN# 14143.228 9363.456
AW12 VSS 13565.124 9038.336
AW13 GPP_A0 / RCIN# 12995.148 9363.456
151
Non-
Interleaved
(IL)
(NIL)
AW14 VSS 12332.208 9038.336
AW15 SLP_LAN# 11722.608 9363.456
AW16 VSS 11144.504 9038.336
AW17 GPD11 / LANPHYPC 10574.528 9363.456
AW18 VSS 9911.588 9038.336
AW2 SPI0_IO2 19689.318 9362.44
AW20 I2S1_TXD 9301.988 9363.456
AW21 VSS 8723.884 9038.336
AW22 HDA_RST# / I2S1_SCLK 8153.908 9363.456
AW23 VSS 7465.568 9038.336

AW25 6828.028 9363.456
DDR1_DQ[43]
AW26 VSS 6264.148 9038.336
AW27 5601.208 9363.456
DDR1_DQ[41]
AW28 VSS 4987.798 9038.336
AW29 4374.388 9363.456
DDR1_DQ[35]
AW3 SPI0_MISO 19039.078 9362.44
AW30 VSS 3711.448 9038.336

AW31 3147.568 9363.456
DDR1_DQ[33]
AW32 VSS 2484.628 9038.336
AW33 1847.088 9363.456
DDR1_DQ[11]
AW34 VSS 1283.208 9038.336
AW35 620.268 9363.456
DDR1_DQ[9]
AW36 VSS 6.858 9038.336
AW37 -606.552 9363.456
DDR1_DQ[3]
AW38 VSS -1269.492 9038.336
AW39 -1833.372 9363.456
DDR1_DQ[1]
AW41 VSS -2470.912 9038.336
AW42 DDR1_ODT[1] -3108.452 9363.456
AW43 VSS -3672.332 9038.336

DDR1_RAS# / DDR1_RAS# DDR1_CAB[3] DDR1_MA[16]
AW44 DDR1_CAB[3]/ -4335.272 9363.456
DDR1_MA[16]
AW45 VSS -4948.682 9038.336
AW46 DDR1_CAB[7]/ -5562.092 9363.456
DDR1_MA[10]
AW47 VSS -6162.802 9038.336

Non-
Interleaved
(IL)
(NIL)
AW48 RSVD -6726.682 9363.456
AW49 VSS -7355.332 9038.336
AW5 GPP_B14 / SPKR 17780.508 8911.336
AW50 DDR0_ALERT# -7983.982 9363.456
AW51 VSS -8547.862 9038.336

AW52 DDR0_CAA[4] / -9148.572 9363.456
DDR0_MA[7]
AW53 VSS -9761.982 9038.336
AW54 DDR0_CAA[6] / -10375.392 9363.456
DDR0_MA[12]
AW55 VSS -11038.332 9038.336
AW56 DDR0_CKE[2] -11602.212 9363.456
AW57 VSS -12239.752 9038.336

AW59 -12877.292 9363.456
DDR0_DQ[43]
AW6 VSS 17130.268 9038.336
AW60 VSS -13441.172 9038.336

AW61 -14104.112 9363.456
DDR0_DQ[41]
AW62 VSS -14717.522 9038.336
AW63 -15330.932 9363.456
DDR0_DQ[34]
AW64 VSS -15993.872 9038.336
AW65 -16557.752 9363.456
DDR0_DQ[33]
AW66 VSS -17093.184 8900.414
AW67 DDR_VTT_CNTL -18017.744 9370.568
AW68 RSVD -18621.756 9622.028
AW69 RSVD -19266.916 9535.668
AW7 GPP_A23 / ISH_GP5 16563.848 9363.456
AW70 RSVD_TP -19684.746 10034.778
AW71 RSVD_TP -20314.412 9551.416
AW8 VSS 15985.744 9038.336

GPP_A9 / CLKOUT_LPC0
AW9 15415.768 9363.456
/ ESPI_CLK
AY1 RSVD 20314.158 10201.656
AY11 GPP_A6 / SERIRQ 14130.528 10013.696

GPP_A4 / LAD3 /
AY12 13565.124 9688.576
ESPI_IO3
GPP_A1 / LAD0 /
AY13 12995.148 10013.696
ESPI_IO0
AY15 GPD1 / ACPRESENT 11709.908 10013.696
153
Non-
Interleaved
(IL)
(NIL)
AY16 GPD10 / SLP_S5# 11144.504 9688.576
AY17 RSMRST# 10574.528 10013.696
AY2 RSVD 19685 10034.27
AY20 I2S1_SFRM 9289.288 10013.696
AY21 HDA_SDI1 / I2S1_RXD 8723.884 9688.576
AY22 HDA_BLK / I2S0_SCLK 8153.908 10013.696

AY25 6828.028 10013.696
DDR1_DQ[42]
AY26 6264.148 9688.576
DDR1_DQSN[5]
AY27 5601.208 10013.696
DDR1_DQ[40]
AY29 4374.388 10013.696
DDR1_DQ[34]
AY3 RSVD 19028.41 10027.92
AY30 3711.448 9688.576
DDR1_DQSP[4]
AY31 3147.568 10013.696
DDR1_DQ[32]
AY33 1847.088 10013.696
DDR1_DQ[10]
AY34 1283.208 9688.576
DDR1_DQSN[1]
AY35 620.268 10013.696
DDR1_DQ[8]
AY37 -606.552 10013.696
DDR1_DQ[2]
AY38 -1269.492 9688.576
DDR1_DQSP[0]
AY39 -1833.372 10013.696
DDR1_DQ[0]
AY4 TP1 18274.284 10043.16
AY42 DDR1_CS#[1] -3108.452 10013.696

DDR1_CAS#/ DDR1_CAS# DDR1_CAB[1] DDR1_MA[15]
AY43 DDR1_CAB[1]/ -3672.332 9688.576
DDR1_MA[15]
DDR1_WE#/ DDR1_WE# DDR1_CAB[2] DDR1_MA[14]
AY44 DDR1_CAB[2]/ -4335.272 10013.696
DDR1_MA[14]
AY46 DDR1_CAB[8]/ -5562.092 10013.696
DDR1_MA[1]
AY47 DDR1_CAB[5]/ -6162.802 9688.576
DDR1_MA[2]
AY48 DDR1_CAA[0] / -6788.912 10013.696
DDR1_MA[5]
AY5 GPP_B4 / CPU_GP3 17664.684 9688.576

Non-
Interleaved
(IL)
(NIL)

AY50 DDR0_CAB[9]/ -7921.752 10013.696
DDR0_MA[0]
AY51 DDR0_CAB[5]/ -8547.862 9688.576
DDR0_MA[2]
AY52 DDR0_CAA[3] / -9148.572 10013.696
DDR0_MA[8]
DDR0_MA[14] / DDR0_MA[14] DDR0_CAA[9] DDR0_BG[1]
AY54 DDR0_CAA[9]/ -10375.392 10013.696
DDR0_BG[1]
DDR0_BA[2] / DDR0_BA[2] DDR0_CAA[5] DDR0_BG[0]
AY55 DDR0_CAA[5]/ -11038.332 9688.576
DDR0_BG[0]
AY56 DDR0_CKE[3] -11602.212 10013.696
AY59 -12877.292 10013.696
DDR0_DQ[47]
AY60 -13441.172 9688.576
DDR0_DQSN[5]
AY61 -14104.112 10013.696
DDR0_DQ[45]
AY63 -15330.932 10013.696
DDR0_DQ[35]
AY64 -15993.872 9688.576
DDR0_DQSP[4]
AY65 -16557.752 10013.696
DDR0_DQ[37]
AY66 VSS -17220.692 9688.576
AY67 DDR_VREF_CA -17901.412 10013.696
AY68 DDR0_VREF_DQ -18535.396 10267.188
AY7 GPP_A22 / ISH_GP4 16551.148 10013.696
AY71 VSS -20314.412 10201.656
AY8 GPP_A18 / ISH_GP0 15985.744 9688.576

GPP_A10 /
AY9 15415.768 10013.696
CLKOUT_LPC1
B10 VSS 14988.794 -10338.816
B11 RSVD 14313.154 -10663.936

USB3_2_TXN /
B13 13186.41 -10663.936
SSIC_TXN
B14 VSS 12510.77 -10338.816
B15 USB3_3_TXN 11835.13 -10663.936

PCIE1_TXN /
B17 10708.386 -10663.936
USB3_5_TXN
B18 VSS 10032.746 -10338.816
B19 PCIE4_TXN 9357.106 -10663.936
B2 RSVD 19831.558 -10831.576

PCIE7_TXN /
B21 8230.362 -10663.936
SATA0_TXN
155
Non-
Interleaved
(IL)
(NIL)
B22 VSS 7554.722 -10338.816
B23 PCIE9_TXN 6879.082 -10663.936

PCIE12_TXP /
B25 5752.338 -10663.936
SATA2_TXP
B26 CSI2_CLKN3 5076.698 -10338.816
B27 CSI2_DP10 4401.058 -10663.936
B29 CSI2_DP8 3274.314 -10663.936
B3 RSVD 19196.558 -10679.176
B30 VSS 2598.674 -10338.816
B31 CSI2_DP6 1923.034 -10663.936
B33 CSI2_DP7 796.29 -10663.936
B34 VSS 120.65 -10338.816
B36 CSI2_DP0 -554.99 -10663.936
B38 CSI2_DP3 -1681.734 -10663.936
B39 VSS -2357.374 -10338.816
B40 CLKOUT_PCIE_N4 -3033.014 -10663.936
B42 CLKOUT_PCIE_N1 -4159.758 -10663.936
B44 VSS -4835.398 -10338.816
B45 EDP_TXP[2] -5511.038 -10663.936
B47 EDP_TXP[3] -6637.782 -10663.936
B48 VSS -7313.422 -10338.816
B5 SYS_RESET# 18048.478 -10663.936
B50 DDI2_TXP[2] -7989.062 -10663.936
B52 EDP_DISP_UTIL -9115.806 -10663.936
B53 VSS -9791.446 -10338.816
B54 BPM#[2] -10467.086 -10663.936
B56 PCH_JTAG_TCK -11593.83 -10663.936
B58 VSS -12269.47 -10338.816
B59 PROC_TRST# -12945.11 -10663.936
B6 SYS_PWROK 17466.818 -10338.816
B61 PROC_TCK -14071.854 -10663.936
B62 VSS -14747.494 -10338.816
B63 VIDALERT# -15423.134 -10663.936
B65 VCCST_PWRGD -16549.878 -10663.936
B66 VSS -17225.518 -10338.816
B67 CFG[1] -17901.158 -10663.936
B69 RSVD -19035.014 -10684.51
B7 GPP_D4 / FLASHTRIG 16791.178 -10663.936
B70 RSVD -19685.254 -10684.51

Non-
Interleaved
(IL)
(NIL)
B71 VSS -20314.412 -10851.896
B9 GPP_E12 / USB2_OC3# 15664.434 -10663.936
BA1 VSS 20314.158 10851.896
BA10 VSS 14752.828 10257.536

GPP_A14 / SUS_STAT#/
BA11 14188.948 10663.936
ESPI_RESET#
GPP_A5 / LFRAME# /
BA12 13565.124 10338.816
ESPI_CS#
GPP_A2 / LAD1 /
BA13 12995.148 10663.936
ESPI_IO1
BA14 VSS 12332.208 10257.536
BA15 GPD3 / PWRBTN# 11768.328 10663.936
BA16 GPD5 / SLP_S4# 11144.504 10338.816
BA17 GPD8 / SUSCLK 10574.528 10663.936
BA18 VSS 9911.588 10257.536
BA2 VSS 19685 10684.51
BA20 PCH_PWROK 9347.708 10663.936
BA21 HDA_SDI0/ I2S0_RXD 8723.884 10338.816
BA22 HDA_SYNC / I2S0_SFRM 8153.908 10663.936
BA23 VSS 7465.568 10257.536

BA25 6828.028 10663.936
DDR1_DQ[46]
BA26 6165.088 10338.816
DDR1_DQSP[5]
BA27 5502.148 10663.936
DDR1_DQ[45]
BA28 VSS 4987.798 10257.536
BA29 4473.448 10663.936
DDR1_DQ[38]
BA3 RSVD 19034.76 10684.51
BA30 3810.508 10338.816
DDR1_DQSN[4]
BA31 3147.568 10663.936
DDR1_DQ[37]
BA32 VSS 2484.628 10257.536
BA33 1847.088 10663.936
DDR1_DQ[14]
BA34 1184.148 10338.816
DDR1_DQSP[1]
BA35 521.208 10663.936
DDR1_DQ[13]
BA36 VSS 6.858 10257.536
BA37 -507.492 10663.936
DDR1_DQ[6]
BA38 -1170.432 10338.816
DDR1_DQSN[0]
157
Non-
Interleaved
(IL)
(NIL)

BA39 -1833.372 10663.936
DDR1_DQ[5]
BA4 RSVD 18365.724 10689.336
BA41 VSS -2470.912 10257.536
BA42 DDR1_ODT[0] -3108.452 10663.936

BA43 DDR1_CAB[0] / -3771.392 10338.816
DDR1_MA[13]
BA44 DDR1_CAB[6]/ -4434.332 10663.936
DDR1_BA[1]
BA45 VSS -4948.682 10257.536
BA46 DDR1_CAB[9]/ -5463.032 10663.936
DDR1_MA[0]
BA47 DDR1_MA[4] -6125.972 10338.816
BA48 DDR1_CAA[2] / -6788.912 10663.936
DDR1_MA[6]
BA49 VSS -7355.332 10338.816
BA5 GPP_B3 / CPU_GP2 17715.484 10625.836
BA50 DDR0_MA[3] -7921.752 10663.936

BA51 DDR0_CAA[0] / -8584.692 10338.816
DDR0_MA[5]
BA52 DDR0_CAA[2] / -9247.632 10663.936
DDR0_MA[6]
BA53 VSS -9761.982 10257.536
BA54 DDR0_CAA[7] / -10276.332 10663.936
DDR0_MA[11]
DDR0_MA[15] / DDR0_MA[15] DDR0_CAA[8] DDR0_ACT#
BA55 DDR0_CAA[8]/ -10939.272 10338.816
DDR0_ACT#
BA56 DDR0_CKE[0] -11602.212 10663.936
BA57 VSS -12239.752 10257.536

BA59 -12877.292 10663.936
DDR0_DQ[46]
BA6 VSS 17173.448 10257.536
BA60 -13540.232 10338.816
DDR0_DQSP[5]
BA61 -14203.172 10663.936
DDR0_DQ[40]
BA62 VSS -14717.522 10257.536
BA63 -15231.872 10663.936
DDR0_DQ[38]
BA64 -15894.812 10338.816
DDR0_DQSN[4]

Non-
Interleaved
(IL)
(NIL)

BA65 -16557.752 10663.936
DDR0_DQ[36]
BA66 VSS -17220.692 10338.816
BA67 DDR1_VREF_DQ -17901.412 10663.936
BA68 RSVD_TP -19034.506 10685.018
BA7 GPP_A21 / ISH_GP3 16609.568 10663.936
BA70 RSVD_TP -19684.746 10685.018
BA71 VSS -20314.412 10851.896
BA8 GPP_A19 / ISH_GP1 15985.744 10338.816

GPP_A17 /
BA9 SD_PWR_EN# / 15415.768 10663.936
ISH_GP7
BB10 DCPRTC 14752.828 10989.056
BB11 GPP_A7 / PIRQA# 14188.948 11314.176

GPP_A3 / LAD2 /
BB13 12995.148 11314.176
ESPI_IO2
BB14 VCCRTC 12332.208 10989.056
BB15 WAKE# 11768.328 11314.176
BB17 GPD9 / SLP_WLAN# 10574.528 11314.176
BB18 VSS 9911.588 10989.056
BB2 RSVD 19851.878 11314.176
BB20 DSW_PWROK 9347.708 11314.176
BB22 HDA_SDO / I2S0_TXD 8153.908 11314.176
BB23 VDDQ 7465.568 10907.776

BB25 6828.028 11314.176
DDR1_DQ[47]
BB26 VSS 6165.088 10989.056
BB27 5502.148 11314.176
DDR1_DQ[44]
BB29 4473.448 11314.176
DDR1_DQ[39]
BB3 TP2 19201.638 11314.176
BB30 VSS 3810.508 10989.056

BB31 3147.568 11314.176
DDR1_DQ[36]
BB32 VDDQ 2484.628 10907.776
BB33 1847.088 11314.176
DDR1_DQ[15]
BB34 VSS 1184.148 10989.056
BB35 521.208 11314.176
DDR1_DQ[12]
BB37 -507.492 11314.176
DDR1_DQ[7]
BB38 VSS -1170.432 10989.056
159
Non-
Interleaved
(IL)
(NIL)

BB39 -1833.372 11314.176
DDR1_DQ[4]
BB4 RSVD 18551.398 11314.176
BB41 VDDQ -2470.912 10907.776
BB42 DDR1_CS#[0] -3108.452 11314.176
BB43 VSS -3771.392 10989.056

BB44 DDR1_CAB[4]/ -4434.332 11314.176
DDR1_BA[0]
BB46 DDR1_MA[3] -5463.032 11314.176
BB47 VDDQ -6125.972 10989.056

DDR1_MA[8] / DDR1_MA[8] DDR1_MA[8]
BB48 DDR1_CAA[3] / DDR1_CAA[3] -6788.912 11314.176
DDR1_MA[8]
BB5 TP4 17785.588 11314.176
BB50 DDR0_CAB[8]/ -7921.752 11314.176
DDR0_MA[1]
BB51 VDDQ -8584.692 10989.056
BB52 DDR0_MA[4] -9247.632 11314.176

BB54 DDR0_CAA[1] / -10276.332 11314.176
DDR0_MA[9]
BB55 VSS -10939.272 10989.056
BB56 DDR0_CKE[1] -11602.212 11314.176
BB57 VccGTx -12239.752 10907.776

BB59 -12877.292 11314.176
DDR0_DQ[42]
BB6 VSS 17173.448 10989.056
BB60 VSS -13540.232 10989.056

BB61 -14203.172 11314.176
DDR0_DQ[44]
BB63 -15231.872 11314.176
DDR0_DQ[39]
BB64 VSS -15894.812 10989.056
BB65 -16557.752 11314.176
DDR0_DQ[32]
BB66 VccGTx -17220.692 10989.056
BB67 VSS -17901.412 11314.176
BB68 RSVD_TP -18551.652 11314.176
BB69 RSVD_TP -19201.892 11314.176
BB7 GPP_A20 / ISH_GP2 16609.568 11314.176
BB70 VSS -19852.132 11314.176
BB9 GPP_A16 / SD_1P8_SEL 15415.768 11314.176
C1 VSS 20314.158 -10348.976

Non-
Interleaved
(IL)
(NIL)
C11 RSVD 14313.154 -10013.696
C12 RSVD 13749.782 -10338.816
C13 USB3_1_TXN 13186.41 -10013.696
C15 USB3_4_TXN 11835.13 -10013.696

PCIE2_TXP /
C16 11271.758 -10338.816
USB3_6_TXP
C17 PCIE3_TXP 10708.386 -10013.696
C19 PCIE5_TXN 9357.106 -10013.696
C2 RSVD 19679.158 -10196.576
C20 PCIE6_TXP 8793.734 -10338.816

PCIE8_TXP /
C21 8230.362 -10013.696
SATA1A_TXP
C23 PCIE10_TXP 6879.082 -10013.696
PCIE11_TXP /
C24 6315.71 -10338.816
SATA1B_TXP
C25 VSS 5752.338 -10013.696
C27 CSI2_DN11 4401.058 -10013.696
C28 CSI2_DN9 3837.686 -10338.816
C29 CSI2_CLKN2 3274.314 -10013.696
C31 CSI2_DN4 1923.034 -10013.696
C32 CSI2_CLKN1 1359.662 -10338.816
C33 CSI2_DN5 796.29 -10013.696
C36 CSI2_DN2 -554.99 -10013.696
C37 CSI2_CLKN0 -1118.362 -10338.816
C38 CSI2_DN1 -1681.734 -10013.696
C4 RSVD 18614.898 -10336.276
C40 CLKOUT_PCIE_P3 -3033.014 -10013.696
C41 CLKOUT_PCIE_P2 -3596.386 -10338.816
C42 CLKOUT_PCIE_P0 -4159.758 -10013.696
C45 EDP_TXP[1] -5511.038 -10013.696
C46 EDP_TXP[0] -6074.41 -10338.816
C47 EDP_TXN[0] -6637.782 -10013.696
C5 VSS 18048.478 -10013.696
C50 DDI2_TXN[0] -7989.062 -10013.696
C51 DDI2_TXP[3] -8552.434 -10338.816
C52 DDI2_TXN[1] -9115.806 -10013.696
C54 RSVD -10467.086 -10013.696
C55 BPM#[0] -11030.458 -10338.816
C56 BPM#[3] -11593.83 -10013.696
C59 PCH_JTAG_TMS -12945.11 -10013.696
161
Non-
Interleaved
(IL)
(NIL)
C60 PROC_TMS -13508.482 -10338.816
C61 PCH_TRST# -14071.854 -10013.696
C63 THERMTRIP# -15423.134 -10013.696
C64 PROC_SELECT# -15986.506 -10338.816
C65 PROCHOT# -16549.878 -10013.696
C67 CFG[7] -18485.104 -10299.446
C68 CFG[5] -18622.264 -9621.52
C7 RSVD 16791.178 -10013.696
C70 RSVD -19685.254 -10034.27
C71 RSVD -20314.412 -10201.656
C8 GPP_D18 / DMIC_DATA1 16227.806 -10338.816
C9 GPP_E10 / USB2_OC1# 15664.434 -10013.696
D1 RSVD 20314.158 -9698.736
D10 VSS 14988.794 -9322.816
D11 VSS 14313.154 -9363.456
D12 RSVD 13749.782 -9688.576
D13 USB3_1_TXP 13186.41 -9363.456
D14 VSS 12510.77 -9322.816
D15 USB3_4_TXP 11835.13 -9363.456

PCIE2_TXN /
D16 11271.758 -9688.576
USB3_6_TXN
D17 PCIE3_TXN 10708.386 -9363.456
D18 VSS 10032.746 -9322.816
D19 PCIE5_TXP 9357.106 -9363.456
D20 PCIE6_TXN 8793.734 -9688.576

PCIE8_TXN /
D21 8230.362 -9363.456
SATA1A_TXN
D22 VSS 7554.722 -9322.816
D23 PCIE10_TXN 6879.082 -9363.456

PCIE11_TXN /
D24 6315.71 -9688.576
SATA1B_TXN
D25 VSS 5752.338 -9363.456
D26 VSS 5076.698 -9322.816
D27 CSI2_DP11 4401.058 -9363.456
D28 CSI2_DP9 3837.686 -9688.576
D29 CSI2_CLKP2 3274.314 -9363.456
D3 RSVD 19338.798 -9608.312
D30 VSS 2598.674 -9322.816
D31 CSI2_DP4 1923.034 -9363.456
D32 CSI2_CLKP1 1359.662 -9688.576

Non-
Interleaved
(IL)
(NIL)
D33 CSI2_DP5 796.29 -9363.456
D34 VSS 120.65 -9322.816
D36 CSI2_DP2 -554.99 -9363.456
D37 CSI2_CLKP0 -1118.362 -9688.576
D38 CSI2_DP1 -1681.734 -9363.456
D39 VSS -2357.374 -9322.816
D4 RSVD 18690.59 -9668.51
D40 CLKOUT_PCIE_N3 -3033.014 -9363.456
D41 CLKOUT_PCIE_N2 -3596.386 -9688.576
D42 CLKOUT_PCIE_N0 -4159.758 -9363.456
D44 VSS -4835.398 -9322.816
D45 VSS -5511.038 -9363.456
D46 EDP_TXN[1] -6074.41 -9688.576
D47 VSS -6637.782 -9363.456
D48 VSS -7313.422 -9322.816
D5 RSVD 18090.388 -9363.456
D50 DDI2_TXP[0] -7989.062 -9363.456
D51 DDI2_TXN[3] -8552.434 -9688.576
D52 DDI2_TXP[1] -9115.806 -9363.456
D53 VSS -9791.446 -9322.816
D54 RSVD -10467.086 -9363.456
D55 BPM#[1] -11030.458 -9688.576
D56 PROC_PRDY# -11593.83 -9363.456
D58 VSS -12269.47 -9322.816
D59 PCH_JTAG_TDI -12945.11 -9363.456
D6 VSS 17441.418 -9322.816
D60 PROC_TDI -13508.482 -9688.576
D61 PROC_PREQ# -14071.854 -9363.456
D62 VSS -14747.494 -9322.816
D63 CATERR# -15423.134 -9363.456
D64 VIDSOUT -15986.506 -9688.576
D65 CFG[2] -16549.878 -9363.456
D66 VSS -17225.518 -9322.816
D67 CFG[3] -17898.618 -10013.696
D68 CFG[6] -19267.424 -9535.16
D69 VSS -18561.812 -8971.026
D7 GPP_D20 / DMIC_DATA0 16791.178 -9363.456
D71 RSVD -20314.412 -9551.416
163
Non-
Interleaved
(IL)
(NIL)
D8 GPP_D17 / DMIC_CLK1 16227.806 -9688.576
D9 GPP_E11 / USB2_OC2# 15664.434 -9363.456
E1 RSVD 20314.158 -9039.86
E10 USB3_4_RXN 14910.816 -8591.296
E11 VSS 13996.416 -8591.296
E13 CSI2_COMP 13082.016 -8591.296
E15 VSS 12167.616 -8591.296
E16 PCIE5_RXP 11253.216 -8591.296
E18 VSS 10338.816 -8591.296
E2 RSVD 19663.918 -9039.86
E20 PCIE7_RXP / SATA0_RXP 9424.416 -8591.296
E21 VSS 8510.016 -8591.296
E22 PCIE9_RXN 7595.616 -8591.296
E23 PCIE9_RXP 6681.216 -8591.296
E25 PCIE10_RXP 5766.816 -8591.296

PCIE11_RXP /
E27 4852.416 -8591.296
SATA1B_RXP
PCIE11_RXN /
E28 3938.016 -8591.296
SATA1B_RXN
E3 RSVD 19013.678 -9039.86
PCIE12_RXN /
E30 3023.616 -8591.296
SATA2_RXN
E32 VCC_SENSE 2109.216 -8591.296
E33 VSS_SENSE 1194.816 -8591.296
E35 XTAL24_OUT 280.416 -8591.296
E37 XTAL24_IN -633.984 -8591.296
E38 CLKOUT_PCIE_P5 -1548.384 -8591.296
E40 CLKOUT_PCIE_N5 -2462.784 -8591.296
E42 XCLK_BIASREF -3377.184 -8591.296
E43 CLKOUT_ITPXDP_P -4291.584 -8591.296
E45 EDP_AUXN -5205.984 -8591.296
E46 VSS -6120.384 -8591.296
E48 DDI2_AUXN -7034.784 -8591.296
E5 PCIE_RCOMPP 17654.016 -8591.296
E50 VSS -7949.184 -8591.296
E52 eDP_RCOMP -8863.584 -8591.296
E53 VSS -9777.984 -8591.296
E55 DDI1_TXN[0] -10692.384 -8591.296
E56 VSS -11606.784 -8591.296
E58 DDI1_TXN[1] -12521.184 -8591.296

Non-
Interleaved
(IL)
(NIL)
E6 VSS 16739.616 -8591.296
E60 CFG_RCOMP -13435.584 -8591.296
E61 RSVD -14349.984 -8591.296
E63 CFG[16] -15315.184 -8654.796
E65 VSS -16331.184 -8654.796
E66 CFG[18] -17347.184 -8654.796
E68 CFG[0] -17898.618 -9363.456
E70 CFG[4] -19664.172 -9009.126
E71 VSS -20314.412 -8901.176
E8 ITP_PMODE 15825.216 -8591.296
F1 VSS 19989.038 -8465.82
F10 USB3_4_RXP 14910.816 -7941.056

PCIE2_RXP /
F11 13996.416 -7941.056
USB3_6_RXP
F13 VSS 13082.016 -7941.056
F15 PCIE4_RXP 12167.616 -7941.056
F16 PCIE5_RXN 11253.216 -7941.056
F18 PCIE6_RXP 10338.816 -7941.056
F2 VSS 19338.798 -8465.82

PCIE7_RXN /
F20 9424.416 -7941.056
SATA0_RXN
PCIE8_RXP /
F21 8510.016 -7941.056
SATA1A_RXP
F22 VSS 7595.616 -7941.056
F23 VSS 6681.216 -7941.056
F25 PCIE10_RXN 5766.816 -7941.056
F27 VSS 4852.416 -7941.056
F28 VSS 3938.016 -7941.056

PCIE12_RXP /
F30 3023.616 -7941.056
SATA2_RXP
F32 VSS 2109.216 -7941.056
F33 VSS 1194.816 -7941.056
F35 VSS 280.416 -7941.056
F37 VSS -633.984 -7941.056
F38 VSS -1548.384 -7941.056
F4 VSS 18363.438 -8465.82
F40 VSS -2462.784 -7941.056
F42 VSS -3377.184 -7941.056
F43 CLKOUT_ITPXDP_N -4291.584 -7941.056
F45 EDP_AUXP -5205.984 -7941.056
F46 RSVD -6120.384 -7941.056
165
Non-
Interleaved
(IL)
(NIL)
F48 DDI2_AUXP -7034.784 -7941.056
F5 PCIE_RCOMPN 17654.016 -7941.056
F50 DDI1_AUXP -7949.184 -7941.056
F52 RSVD -8863.584 -7941.056
F53 DDI1_TXN[2] -9777.984 -7941.056
F55 DDI1_TXP[0] -10692.384 -7941.056
F56 DDI1_TXN[3] -11606.784 -7941.056
F58 DDI1_TXP[1] -12521.184 -7941.056
F6 RSVD 16739.616 -7941.056
F60 RSVD -13435.584 -7941.056
F61 RSVD -14349.984 -7941.056
F63 CFG[17] -15315.184 -8004.556
F65 VSS -16331.184 -8004.556
F66 CFG[19] -17347.184 -8004.556
F68 VSS -18561.812 -8320.024
F70 CFG[10] -19212.052 -8320.024
F71 CFG[8] -19862.292 -8383.524
F8 VSS 15825.216 -7941.056
G1 CL_RST# 20314.158 -7802.88
G10 VSS 14910.816 -7290.816

PCIE2_RXN /
G11 13996.416 -7290.816
USB3_6_RXN
PCIE1_RXP /
G13 13082.016 -7290.816
USB3_5_RXP
G15 PCIE4_RXN 12167.616 -7290.816
G16 PCIE3_RXP 11253.216 -7290.816
G18 PCIE6_RXN 10338.816 -7290.816
G2 CL_DATA 19663.918 -7802.88
G20 VCCSTG 9424.416 -7290.816

PCIE8_RXN /
G21 8510.016 -7290.816
SATA1A_RXN
G22 VSS 7595.616 -7290.816
G23 VCCSA 6681.216 -7290.816
G25 VCCSA 5766.816 -7290.816
G27 VCCSA 4852.416 -7290.816
G28 VCCSA 3938.016 -7290.816
G3 CL_CLK 19013.678 -7802.88
G30 VCC 3023.616 -7290.816
G32 VCC 2109.216 -7290.816
G33 VCC 1194.816 -7290.816

Non-
Interleaved
(IL)
(NIL)
G35 VCC 280.416 -7290.816
G37 VCC -633.984 -7290.816
G38 VCC -1548.384 -7290.816

GPP_E2 / SATAXPCIE2 /
G4 18363.438 -7802.88
SATAGP2
G40 VCC -2462.784 -7290.816
G42 VCC -3377.184 -7290.816
G43 VSS -4291.584 -7290.816
G45 VSS -5205.984 -7290.816
G46 RSVD -6120.384 -7290.816
G48 VSS -7034.784 -7290.816
G5 VSS 17654.016 -7290.816
G50 DDI1_AUXN -7949.184 -7290.816
G52 VSS -8863.584 -7290.816
G53 DDI1_TXP[2] -9777.984 -7290.816
G55 VSS -10692.384 -7290.816
G56 DDI1_TXP[3] -11606.784 -7290.816
G58 VSS -12521.184 -7290.816
G6 VSS 16739.616 -7290.816
G60 VSS -13435.584 -7290.816
G61 VCC_OPC_1P8 -14349.984 -7290.816
G63 VSS -15315.184 -7354.316
G65 VSS -16331.184 -7354.316
G66 VSS -17347.184 -7354.316
G68 CFG[11] -18363.692 -7659.624
G69 CFG[9] -19013.932 -7659.624
G70 CFG[15] -19664.172 -7758.684
G71 CFG[13] -20314.412 -7758.684
G8 USB3_1_RXP 15825.216 -7290.816
H1 GPP_E8 / SATALED# 19989.038 -7139.94
H10 USB3_3_RXP ? 14910.816 -6640.576
H11 RSVD 13996.416 -6640.576

PCIE1_RXN /
H13 13082.016 -6640.576
USB3_5_RXN
H15 VSS 12167.616 -6640.576
H16 PCIE3_RXN 11253.216 -6640.576
H18 VSS 10338.816 -6640.576

H2 19338.798 -7139.94
SATAGP0
H20 VCCSA_SENSE 9424.416 -6640.576
167
Non-
Interleaved
(IL)
(NIL)
H21 VSSSA_SENSE 8510.016 -6640.576

H3 18688.558 -7139.94
SATAGP1
H5 GPP_D19 / DMIC_CLK0 17654.016 -6640.576
USB3_2_RXP /
H6 16739.616 -6640.576
SSIC_RXP
H63 VCC_OPC_1P8 -15315.184 -6704.076
H65 OPC_RCOMP -16331.184 -6704.076
H66 OPCE_RCOMP -17347.184 -6704.076
H69 CFG[14] -18688.812 -7095.744
H70 CFG[12] -19339.052 -7095.744
H71 VSS -19989.292 -7095.744
H8 USB3_1_RXN 15825.216 -6640.576
J1 GPP_E4 / DEVSLP0 20314.158 -6477
J10 USB3_3_RXN 14910.816 -5990.336
J11 VSS 13996.416 -5990.336
J13 VSS 13082.016 -5990.336
J2 GPP_E5 / DEVSLP1 19663.918 -6477
J22 VCCSA 7138.416 -6826.504
J23 VCCSA 6224.016 -6826.504
J25 VSS 5309.616 -6826.504
J27 VCCSA 4395.216 -6826.504
J28 VSS 3480.816 -6826.504
J3 GPP_E6 / DEVSLP2 19013.678 -6477
J30 VCC 2566.416 -6826.504
J32 VSS 1652.016 -6826.504
J33 VCC 737.616 -6826.504
J35 VSS -176.784 -6826.504
J37 VCC -1091.184 -6826.504
J38 VSS -2005.584 -6826.504
J4 GPP_D3 / SPI1_MOSI 18363.438 -6477
J40 VCC -2919.984 -6826.504
J42 VSS -3834.384 -6826.504
J43 VCCGT -4748.784 -6826.504
J45 VCCGT -5663.184 -6826.504
J46 VCCGT -6577.584 -6826.504
J48 VCCGT -7491.984 -6826.504
J5 GPP_D23 / I2S_MCLK 17654.016 -5990.336
J50 VCCGT -8406.384 -6826.504

Non-
Interleaved
(IL)
(NIL)
J52 VCCGT -9320.784 -6826.504
J53 VCCGT -10235.184 -6826.504
J55 VCCGT -11149.584 -6826.504
J56 VCCGT -12063.984 -6826.504
J58 VCCGT -12978.384 -6826.504

USB3_2_RXN /
J6 16739.616 -5990.336
SSIC_RXN
J60 VCCGT -13892.784 -6826.504
J68 RSVD -18361.914 -6519.926
J69 VSSGT_SENSE -19013.932 -6432.804
J70 VCCGT_SENSE -19664.172 -6432.804
J71 RSVD -20314.412 -6432.804
J8 VSS 15825.216 -5990.336
K15 VCCAMPHYPLL_1P0 12188.19 -5876.29
K16 VSS 11537.95 -5876.29
K17 VCCMPHYAON_1P0 10887.71 -5876.29
K18 VSS 10237.47 -5876.29
K19 VCCCLK2 9587.23 -5876.29
K20 VccPLL 8936.99 -5876.29
K21 VccPLL 8286.75 -5876.29
K22 VSS 7595.616 -6361.684
K23 VCCSA 6681.216 -6361.684
K25 VCCSA 5766.816 -6361.684
K27 VCCSA 4852.416 -6361.684
K28 VCCSA 3938.016 -6361.684
K30 VCCSA 3023.616 -6361.684
K32 RSVD 2109.216 -6361.684
K33 VCC 1194.816 -6361.684
K35 VCC 280.416 -6361.684
K37 VCC -633.984 -6361.684
K38 VCC -1548.384 -6361.684
K40 VCC -2462.784 -6361.684
K42 VCC -3377.184 -6361.684
K43 VCC -4291.584 -6361.684
K45 RSVD -5205.984 -6361.684
K46 RSVD -6120.384 -6361.684
K48 VCCGT -7034.784 -6361.684
K50 VCCGT -7949.184 -6361.684
K52 VCCGT -8863.584 -6361.684
169
Non-
Interleaved
(IL)
(NIL)
K53 VCCGT -9777.984 -6361.684
K55 VCCGT -10692.384 -6361.684
K56 VCCGT -11606.784 -6361.684
K58 VCCGT -12521.184 -6361.684
K60 VCCGT -13435.584 -6361.684
K61 VSS -14349.984 -6361.684
K63 VSS -15132.812 -6054.09
K64 VSS -15783.052 -6054.09
K65 VSS -16433.292 -6054.09
K66 VSS -17083.532 -6054.09
K67 VSS -17733.772 -6054.09
K68 VSS -18351.754 -5846.064
K70 VSS -19339.052 -5744.464
K71 VSS -19989.292 -5744.464
L1 VCCMPHYAON_1P0 19989.038 -5814.06
L10 GPP_E17 / EDP_HPD 14984.476 -5340.096
L11 VSS 14334.236 -5340.096

GPP_E19 /
L12 13683.996 -5340.096
DDPB_CTRLDATA
GPP_E18 /
L13 13033.756 -5340.096
DDPB_CTRLCLK
L15 VCCAMPHYPLL_1P0 12188.19 -5038.09
L16 VSS 11537.95 -5038.09
L17 VSS 10887.71 -5038.09
L18 VSS 10237.47 -5038.09
L19 VCCCLK5 9587.23 -5038.09
L2 VSS 19338.798 -5814.06
L20 VSS 8936.99 -5038.09
L21 VCCCLK3 8286.75 -5038.09
L4 VSS 18363.438 -5814.06
L6 GPP_E15 / DDPD_HPD2 17585.436 -5340.096
L62 VCCGT -14643.862 -5624.83
L63 VCCGT -15112.492 -5167.63
L64 VCCGT -15762.732 -5167.63
L65 VCCGT -16412.972 -5167.63
L66 VCCGT -17063.212 -5167.63
L67 VCCGT -17713.452 -5167.63
L68 VCCGT -18363.692 -5167.63
L69 VCCGT -19013.932 -5167.63

Non-
Interleaved
(IL)
(NIL)
L7 GPP_E14 / DDPC_HPD1 16935.196 -5340.096
L70 VCCGT -19664.172 -5167.63
L71 VCCGT -20314.412 -5167.63
L8 VSS 16284.956 -5340.096
L9 GPP_E13 / DDPB_HPD0 15634.716 -5340.096
M1 GPP_D0 / SPI1_CS# 20314.158 -5151.12
M2 GPP_D1 / SPI1_CLK 19663.918 -5151.12
M3 GPP_D2 / SPI1_MISO 19013.678 -5151.12

GPP_D5 /
M4 18363.438 -5151.12
ISH_I2C0_SDA
M62 VCCGT -14643.862 -4710.43
GPP_D7 /
N1 19989.038 -4488.18
ISH_I2C1_SDA
N10 VSS 14984.476 -4400.296
N11 GPP_E22 14334.236 -4400.296
N12 GPP_E23 13683.996 -4400.296
N13 VSS 13033.756 -4400.296
N15 VCCMPHYGT_1P0 12188.19 -4199.89
N16 VCCMPHYGT_1P0 11537.95 -4199.89
N17 VCCMPHYGT_1P0 10887.71 -4199.89
N18 VCCAPLLEBB_1P0 10237.47 -4199.89
N19 VSS 9587.23 -4199.89
N2 GPP_D8 / ISH_I2C1_SCL 19338.798 -4488.18
N20 VCCCLK4 8936.99 -4199.89
N21 VSS 8286.75 -4199.89
N3 GPP_D6 / ISH_I2C0_SCL 18688.558 -4488.18
N6 VSS 17585.436 -4400.296
N63 VCCGT -15112.492 -4253.23
N64 VCCGT -15762.732 -4253.23
N65 VSS -16412.972 -4253.23
N66 VCCGT -17063.212 -4253.23
N67 VCCGT -17713.452 -4253.23
N68 VSS -18363.692 -4253.23
N69 VCCGT -19013.932 -4253.23

GPP_E20 /
N7 16935.196 -4400.296
DDPC_CTRLCLK
N70 VCCGT -19664.172 -4253.23
N71 VCCGT -20314.412 -4253.23

GPP_E21 /
N8 16284.956 -4400.296
DDPC_CTRLDATA
N9 GPP_E16 / DDPE_HPD3 15634.716 -4400.296
171
Non-
Interleaved
(IL)
(NIL)
P1 GPP_D12 20314.158 -3825.24
P15 VCCMPHYGT_1P0 12188.19 -3361.69
P16 VCCMPHYGT_1P0 11537.95 -3361.69
P17 VSS 10887.71 -3361.69
P18 VCCPRIM_1P0 10237.47 -3361.69
P19 VSS 9587.23 -3361.69
P2 GPP_D9 19663.918 -3825.24
P20 VSS 8936.99 -3361.69
P21 VSS 8286.75 -3361.69
P3 GPP_D10 19013.678 -3825.24
P4 GPP_D11 18363.438 -3825.24
P62 VCCOPC -14643.862 -3796.03
R10 GPP_C2 / SMBALERT# 14984.476 -3333.496
R11 eDP_BKLTCTL 14334.236 -3333.496
R12 eDP_BKLTEN 13683.996 -3333.496
R13 VSS 13033.756 -3333.496
R6 VSS 17585.436 -3333.496
R63 VCCGT -15112.492 -3338.83
R64 VCCGT -15762.732 -3338.83
R65 VCCGT -16412.972 -3338.83
R66 VCCGT -17063.212 -3338.83
R67 VCCGT -17713.452 -3338.83
R68 VCCGT -18363.692 -3338.83
R69 VCCGT -19013.932 -3338.83
R7 GPP_C0 / SMBCLK 16935.196 -3333.496
R70 VCCGT -19664.172 -3338.83
R71 VCCGT -20314.412 -3338.83
R8 GPP_C1 / SMBDATA 16284.956 -3333.496
R9 GPP_C3 / SML0CLK 15634.716 -3333.496
T1 VCCPRIM_1p0 19989.038 -3162.3
T15 VSS 12188.19 -2523.49
T16 VCCPGPPE 11537.95 -2523.49
T17 VSS 10887.71 -2523.49
T18 VSS 10237.47 -2523.49
T19 VCCSRAM_1P0 9587.23 -2523.49
T2 VSS 19338.798 -3162.3
T20 VCCSRAM_1P0 8936.99 -2523.49
T21 VSS 8286.75 -2523.49

Non-
Interleaved
(IL)
(NIL)
T4 VSS 18363.438 -3162.3
T62 VCCGT -14643.862 -2881.63

GPP_D13 /
ISH_UART0_RXD /
U1 20314.158 -2499.36
SML0BDATA /
I2C4B_SDA
U10 VSS 14984.476 -2266.696
U11 RSVD 14334.236 -2266.696
U12 RSVD 13683.996 -2266.696
U13 eDP_VDDEN 13033.756 -2266.696

GPP_D14 /
U2 ISH_UART0_TXD / 19663.918 -2499.36
SML0BCLK / I2C4B_SCL
GPP_D15 /
U3 19013.678 -2499.36
ISH_UART0_RTS#
GPP_D16 /
U4 ISH_UART0_CTS# / 18363.438 -2499.36
SML0BALERT#
U6 GPP_C17 / I2C0_SCL 17585.436 -2266.696
U63 VSS -15112.492 -2424.43
U64 VSS -15762.732 -2424.43
U65 VCCGT -16412.972 -2424.43
U66 VSS -17063.212 -2424.43
U67 VSS -17713.452 -2424.43
U68 VCCGT -18363.692 -2424.43
U69 VSS -19013.932 -2424.43
U7 GPP_C16 / I2C0_SDA 16935.196 -2266.696
U70 VSS -19664.172 -2424.43
U71 VCCGT -20314.412 -2424.43
U8 GPP_C18 / I2C1_SDA 16284.956 -2266.696
U9 GPP_C19 / I2C1_SCL 15634.716 -2266.696
V1 GPP_D21 / SPI1_IO2 19989.038 -1836.42
V15 VCCAPLL_1P0 12188.19 -1685.29
V16 VSS 11537.95 -1685.29
V17 VSS 10887.71 -1685.29
V18 VSS 10237.47 -1685.29
V19 VCCPRIM_3p3 9587.23 -1685.29
V2 GPP_D22 / SPI1_IO3 19338.798 -1836.42
V20 VCCPRIM_CORE 8936.99 -1685.29
V21 VCCPRIM_CORE 8286.75 -1685.29
V3 GPP_C7 / SML1DATA 18688.558 -1836.42
V62 VCCOPC -14643.862 -1967.23
173
Non-
Interleaved
(IL)
(NIL)
W1 GPP_C5 / SML0ALERT# 20314.158 -1173.48
W10 GPP_G5 / SD_CD# 14984.476 -1199.896
W11 GPP_G4 / SD_DATA3 14334.236 -1199.896
W12 GPP_G3 / SD_DATA2 13683.996 -1199.896
W13 VSS 13033.756 -1199.896
W2 GPP_C4 / SML0DATA 19663.918 -1173.48
W3 GPP_C6 / SML1CLK 19013.678 -1173.48
W4 GPP_C10 / UART0_RTS# 18363.438 -1173.48
W6 VSS 17585.436 -1199.896
W63 VCCGT -15112.492 -1510.03
W64 VCCGT -15762.732 -1510.03
W65 VCCGT -16412.972 -1510.03
W66 VCCGT -17063.212 -1510.03
W67 VCCGT -17713.452 -1510.03
W68 VCCGT -18363.692 -1510.03
W69 VCCGT -19013.932 -1510.03
W7 GPP_G7 / SD_WP 16935.196 -1199.896
W70 VCCGT -19664.172 -1510.03
W71 VCCGT -20314.412 -1510.03
W8 GPP_G6 / SD_CLK 16284.956 -1199.896
W9 VSS 15634.716 -1199.896
Y15 VCCPGPPD 12188.19 -847.09
Y16 VCCPGPPC 11537.95 -847.09
Y17 VSS 10887.71 -847.09
Y18 VCCPRIM_1p0 10237.47 -847.09
Y19 VSS 9587.23 -847.09
Y20 VSS 8936.99 -847.09
Y21 VSS 8286.75 -847.09
Y62 VCCGT -14643.862 -1052.83

9.2 Y-Processor Ball Information
The Y-Processor is available in the BGA package (BGA1515). Figure 9-7 through
Figure 9-12 provide a top view of the Ball map. Table 9-2 provides the Ball list.
175
Figure 9-7. Y-Processor Ball Map (Upper Left, Columns 64-44)
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44
BP VDDQ VSS VSS VDDQ VDDQ VSS VSS VDDQ VDDQ VSS VSS
DDR0_BA[ DDR0_MA[
0] / 1] / DDR1_DQ[ DDR1_DQ[ DDR1_DQ[ DDR1_DQ[ DDR0_DQ[
DDR0_CAB DDR0_ODT DDR0_CAB 20] / 21] / 29] / 28] / DDR_VTT_ 48] /
BN VDDQ [4]/ [0] [8]/ DDR0_DQ[ DDR0_DQ[ DDR0_DQ[ DDR0_DQ[ CNTL DDR1_DQ[
DDR0_BA[ DDR0_MA[ 52] 53] 61] 60] 32]
0] 1]
DDR0_MA[
10] / DDR1_DQS DDR1_DQ[ DDR1_DQS DDR1_DQ[ DDR0_DQ[ DDR0_DQS
BM DDR0_CAB N[2] / 22] / P[3] / 31] / 49] / P[6] /
[7]/ DDR0_PAR DDR0_DQS DDR0_DQ[ DDR0_DQS DDR0_DQ[ DDR1_DQ[ DDR1_DQS
DDR0_MA[ N[6] 54] P[7] 63] 33] P[4]
10]
DDR0_CAS DDR0_BA[
#/ 1] / DDR1_DQ[ DDR1_DQ[ DDR1_DQ[ DDR1_DQ[ DDR0_DQ[
BL DDR0_CAB DDR0_CAB DDR0_MA[ 17] / 19] / 24] / 26] / 53] /
RSVD_TP VSS
[1]/ [6]/ 4] DDR0_DQ[ DDR0_DQ[ DDR0_DQ[ DDR0_DQ[ DDR1_DQ[
DDR0_MA[ DDR0_BA[ 49] 51] 56] 58] 37]
15] 1]
DDR0_MA[
DDR0_CAB P[2] / 23] / N[3] / 30] / 51] / N[6] /
BK [0] / VSS DDR0_DQS DDR0_DQ[ DDR0_DQS DDR0_DQ[ DDR1_DQ[ DDR1_DQS
DDR0_MA[ P[6] 55] N[7] 62] 35] N[4]
13]
DDR0_WE
#/ DDR1_DQ[ DDR1_DQ[ DDR1_DQ[ DDR1_DQ[ DDR0_DQ[
BJ DDR_RCO DDR0_CAB DDR0_CS# 16] / 18] / 25] / 27] / 54] /
VSS VSS
MP[1] [2]/ [1] DDR0_DQ[ DDR0_DQ[ DDR0_DQ[ DDR0_DQ[ DDR1_DQ[
DDR0_MA[ 48] 50] 57] 59] 38]
14]
BH VSS VSS VSS VSS VSS VSS VSS VSS
DDR0_MA[
14] / DDR0_DQ[ DDR0_DQ[ DDR0_DQ[ DDR0_DQ[ DDR0_DQ[
BG DDR0_CAA DDR0_ALE 21] / 18] / 28] / 29] / 43] /
VSS RSVD_TP
[9]/ RT# DDR0_DQ[ DDR0_DQ[ DDR0_DQ[ DDR0_DQ[ DDR1_DQ[
DDR0_BG[ 37] 34] 44] 45] 11]
1]
DDR0_MA[
DDR_RCO DDR0_CAA P[2] / 23] / N[3] / 30] / 47] / P[5] /
BF MP[0] [2] / VSS VSS DDR0_DQS DDR0_DQ[ DDR0_DQS DDR0_DQ[ DDR1_DQ[ DDR1_DQS
DDR0_MA[ P[4] 39] N[5] 46] 15] P[1]
6]
DDR0_DQ[ DDR0_DQ[ DDR0_DQ[ DDR0_DQ[ DDR0_DQ[
BE DDR0_CKE 16] / 19] / 25] / 27] / 46] /
VSS
[2] DDR0_DQ[ DDR0_DQ[ DDR0_DQ[ DDR0_DQ[ DDR1_DQ[
32] 35] 41] 43] 14]
DDR0_MA[ DDR0_MA[
15] / 11] / DDR0_DQS DDR0_DQ[ DDR0_DQS DDR0_DQ[ DDR0_DQ[ DDR0_DQS
BD DDR0_CAA DDR0_CAA N[2] / 22] / P[3] / 31] / 41] / N[5] /
VSS [8]/ [7] / VSS DDR0_DQS DDR0_DQ[ DDR0_DQS DDR0_DQ[ DDR1_DQ[ DDR1_DQS
DDR0_ACT DDR0_MA[ N[4] 38] P[5] 47] 9] N[1]
# 11]
DDR0_DQ[ DDR0_DQ[ DDR0_DQ[ DDR0_DQ[ DDR0_DQ[
DDR_RCO DDR0_CKN DDR0_CKP DDR0_CKE 17] / 20] / 24] / 26] / 44] /
BC VSS
MP[2] [0] [0] [1] DDR0_DQ[ DDR0_DQ[ DDR0_DQ[ DDR0_DQ[ DDR1_DQ[
33] 36] 40] 42] 12]
DDR0_MA[
2] /
BB DDR0_MA[ DDR0_CAB DDR0_CKE
VSS VSS VSS VSS VSS VSS VSS
3] [5]/ [0]
DDR0_MA[
2]
DDR0_MA[
12]/
DDR0_CKP DDR0_CKN DDR0_CAA
BA VSS [1] [1] VSS [6]/ VSS VDDQ VDDQ VDDQ VDDQ
DDR0_MA[
12]
AY VSS VSS VSS VSS VSS
DDR0_MA[ DDR0_MA[ DDR0_MA[
5]/ 7]/ 9]/
AW DDR0_CS# DDR0_CKE DDR0_CAA DDR0_CAA DDR0_CAA DDR1_VRE VCCIO_DD VCCIO_DD VCCIO_DD VCCIO_DD
[0] [3] [0]/ [4]/ [1]/ F_DQ R R R R
DDR0_MA[ DDR0_MA[ DDR0_MA[
5] 7] 9]
DDR0_MA[ DDR0_RAS DDR0_BA[ DDR0_MA[
0] / #/ 2] / 8] /
DDR0_CAB DDR0_CAB DDR0_CAA DDR0_CAA VCCIO_DD VCCIO_DD VCCIO_DD VCCIO_DD
AV VDDQ VSS VSS
[9]/ [3]/ [5]/ [3] / R R R R
DDR0_MA[ DDR0_MA[ DDR0_BG[ DDR0_MA[
0] 16] 0] 8]
AU VSS VSS VSS VSS VSS VSS
DDR1_DQ[ DDR1_DQ[
AT VDDQ DDR0_DQ[ DDR0_DQ[ 5] / 0] /
VSS VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT
15] 10] DDR0_DQ[ DDR0_DQ[
21] 16]
DDR1_DQ[ DDR1_DQ[
AR DDR0_DQ[ DDR0_DQ[ VSS
4] / 1] / DDR_VREF VSS VSS VSS VSS VSS VSS
14] 11] DDR0_DQ[ DDR0_DQ[ _CA
20] 17]
DDR1_DQS DDR1_DQS
AP VSS DDR0_DQS DDR0_DQS P[0] / N[0] /
VSS
N[1] P[1] DDR0_DQS DDR0_DQS
P[2] N[2]
DDR1_DQ[ DDR1_DQ[
AN DDR0_DQ[ DDR0_DQ[ 2] / 3] / DDR0_VRE
VSS VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT
13] 12] DDR0_DQ[ DDR0_DQ[ F_DQ
18] 19]
DDR1_DQ[ DDR1_DQ[
AM DDR0_DQ[ DDR0_DQ[ 6] / 7] /
VSS VSS
22] 23]
DDR1_DQ[ DDR1_DQ[
AL DDR0_DQ[ DDR0_DQ[ 9] / 8] /
VSS VSS VSS VSS VSS VSS VSS VSS
25] 24]
DDR1_DQ[ DDR1_DQ[
AK DDR0_DQ[ DDR0_DQ[ 12] / 13] /
VDDQ VSS VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT
28] 29]
DDR1_DQS DDR1_DQS
AJ DDR0_DQS DDR0_DQS N[1] / P[1] /
VSS VCCGT
P[0] N[0] DDR0_DQS DDR0_DQS
N[3] P[3]

Figure 9-8. Y-Processor Ball Map (Upper Middle, Columns 43-23)
43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23
BP VDDQ VDDQ VSS VSS VDDQ VDDQ VSS VSS VDDQ VDDQ
DDR1_B DDR1_M DDR1_M
DDR0_D DDR0_D DDR0_D A[2] / A[14] / A[9] / DDR1_D DDR1_D DDR1_D
Q[52] / Q[57] / Q[59] / DDR1_C DDR1_C DDR1_C DDR1_C Q[33] / Q[36] / Q[45] /
BN DDR1_D DDR1_D DDR1_D AA[5]/ AA[9]/ KE[0] AA[1] / VSS DDR1_D DDR1_D DDR1_D
Q[36] Q[41] Q[43] DDR1_B DDR1_B DDR1_M Q[17] Q[20] Q[29]
G[0] G[1] A[9]
DDR1_M DDR1_M
DDR0_D DDR0_D A[15] / A[6] / DDR1_D DDR1_D DDR1_D
Q[56] / QSN[7] / DDR1_C DDR1_C DDR1_C DDR1_C Q[32] / QSP[4] / Q[40] /
BM VSS
DDR1_D DDR1_D KP[0] AA[8]/ AA[2] / S#[0] DDR1_D DDR1_D DDR1_D
Q[40] QSN[5] DDR1_A DDR1_M Q[16] QSP[2] Q[24]
CT# A[6]
DDR1_M
DDR0_D DDR0_D DDR0_D A[8] / DDR1_D DDR1_D DDR1_D
BL Q[50] / Q[61] / Q[62] / DDR1_C VSS VSS VSS VSS Q[37] / Q[35] / Q[44] /
DDR1_D DDR1_D DDR1_D AA[3] / DDR1_D DDR1_D DDR1_D
Q[34] Q[45] Q[46] DDR1_M Q[21] Q[19] Q[28]
A[8]
DDR1_M
DDR0_D DDR0_D A[5] / DDR1_D DDR1_D DDR1_D
Q[60] / QSP[7] / DDR1_C DDR1_M DDR1_C DDR1_C Q[34] / QSN[4] / Q[41] /
BK DDR1_D DDR1_D VSS KN[0] A[4] KE[1] AA[0] / DDR1_D DDR1_D DDR1_D
Q[44] QSP[5] DDR1_M Q[18] QSN[2] Q[25]
A[5]
DDR1_M DDR1_M
DDR0_D DDR0_D DDR0_D A[12] / A[11] / DDR1_D DDR1_D DDR1_D
Q[55] / Q[58] / Q[63] / DDR1_C DDR1_C DDR1_C DDR1_M Q[39] / Q[38] / Q[43] /
BJ VSS
DDR1_D DDR1_D DDR1_D AA[6] / AA[7] / S#[1] A[3] DDR1_D DDR1_D DDR1_D
Q[39] Q[42] Q[47] DDR1_M DDR1_M Q[23] Q[22] Q[27]
A[12] A[11]
DDR1_C
BH VSS VSS VSS VSS VSS VSS KE[3] VSS VSS VSS
DDR1_M DDR1_M DDR1_M
DDR0_D DDR0_D DDR0_D A[13] / A[10] / A[7] /
BG Q[42] / Q[34] / Q[38] / DDR1_C DDR1_C DDR1_C DDR1_C VSS DDR1_D DDR1_D DDR1_D
DDR1_D DDR1_D DDR1_D AB[0] / AB[7]/ KE[2] AA[4] / Q[52] Q[50] Q[61]
Q[10] Q[2] Q[6] DDR1_M DDR1_M DDR1_M
A[13] A[10] A[7]
DDR1_M DDR1_R DDR1_M
DDR0_D DDR0_D A[0] / AS# / A[2] /
Q[36] / QSP[4] / DDR1_C DDR1_C DDR1_C DDR1_C DDR1_D DDR1_D DDR1_D
BF VSS
DDR1_D DDR1_D AB[9]/ AB[3]/ KP[1] AB[5]/ Q[48] QSP[6] Q[56]
Q[4] QSP[0] DDR1_M DDR1_M DDR1_M
A[0] A[16] A[2]
DDR1_C
DDR0_D DDR0_D DDR0_D AS#/
BE Q[45] / Q[39] / Q[35] / DDR1_C VSS VSS VSS VSS DDR1_D DDR1_D DDR1_D
DDR1_D DDR1_D DDR1_D AB[1]/ Q[53] Q[54] Q[60]
Q[13] Q[7] Q[3] DDR1_M
A[15]
DDR1_B
DDR0_D DDR0_D A[1] /
Q[37] / QSN[4] / DDR1_C DDR1_A DDR1_C DDR1_P DDR1_D DDR1_D DDR1_D
BD DDR1_D DDR1_D VSS AB[6]/ LERT# KN[1] AR Q[49] QSN[6] Q[57]
Q[5] QSN[0] DDR1_B
A[1]
DDR1_W DDR1_B DDR1_M
DDR0_D DDR0_D DDR0_D E#/ A[0] / A[1] /
Q[40] / Q[32] / Q[33] / DDR1_C DDR1_O DDR1_C DDR1_C DDR1_D DDR1_D DDR1_D
BC VSS
DDR1_D DDR1_D DDR1_D AB[2]/ DT[0] AB[4]/ AB[8]/ Q[51] Q[55] Q[59]
Q[8] Q[0] Q[1] DDR1_M DDR1_B DDR1_M
A[14] A[0] A[1]
BB VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS
BA VDDQ VDDQ VDDQC VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ TP5
AY VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS
VCCIO_D VCCIO_D VCCIO_D VCCIO_D VCCIO_D VCCIO_D VCCIO_D VCCIO_D VCCIO_D
AW DR DR DR DR DR DR DR DR DR VSS VSS
VCCIO_D VCCIO_D VCCIO_D VCCIO_D VCCIO_D VCCIO_D VCCIO_D VCCIO_D VCCIO_D
AV DR DR DR DR DR DR DR DR DR VSS
AU
AT VCCGT VCC VCC VCC VCC VCC VCC VCC VCCSA_ VCCSA_ VSS VCCIO VCCIO_S VCCHDA
DDR DDR ENSE
AR VSS VCC VSS VCCG1 VSS VCCG1 VSS VCC VSS VCCSA VSS VCCIO VSSIO_S VCCSRA
ENSE M_1P0
AP
VCCSRA
AN VCCGT VCC VSS VCCG1 VSS VCCG1 VSS VCC VCCSA VCCSA VSS VCCIO VSS
M_1P0
AM
VCCSRA
AL VSS VCC VSS VCCG1 VSS VCCG1 VSS VCC VSS VCCSA VSS VCCIO VSS M_1P0
VCCSRA
AK VCCGT VCC VSS VCCG1 VSS VCCG1 VSS VCC VCCSA VCCSA VSS VCCIO VSS M_1P0
AJ
177
Figure 9-9. Y-Processor Ball Map (Upper Right, Columns 42-1)
22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
GPP_A5 /
GPP_A4 /
BP VSS DRAM_RE RTCX2 PCH_OPIR PCH_PWR SLP_LAN# WAKE#
LFRAME#
LAD3 / RSVD VSS
SET# COMP OK /
ESPI_CS# ESPI_IO3
DDR1_DQ[
GPP_A16 /
BN 42] / PROC_POP DSW_PWR GPP_A6 /
DDR1_DQ[ RTCX1 RTCRST# SLP_SUS# VSS SD_1P8_S RSVD TP4
IRCOMP OK SERIRQ
26] EL
DDR1_DQ
BM SN[5] /
DDR1_DQ VSS VSS VSS VSS VSS
SN[3]
GPP_A13 /
DDR1_DQ[ HDA_RST GPP_A17 /
47] / #/ HDA_SDI1 HDA_SDI0 SUSWARN
BL I2S1_SFR GPP_A0 / SD_PWR_ GPP_A21 /
/ / VSS #/ VSS
DDR1_DQ[ I2S1_SCL M RCIN# EN_# / ISH_GP3
31] K I2S1_RXD I2S0_RXD SUSPWRD
ISH_GP7
NACK
DDR1_DQ HDA_BLK
HDA_SDO GPP_A1 /
SP[5] / /
BK DDR1_DQ VSS I2S0_SCL / I2S1_TXD LAD0 /
I2S0_TXD ESPI_IO0
SP[3] K
Sx_EX-
GPP_A14 / IT_HOLDO
DDR1_DQ[ HDA_SYN GPP_A9 /
GPP_A2 / SUS_STAT FF# /
46] / C/ CLKOUT_L GPP_A22 / GPP_A20 /
BJ DDR1_DQ[ I2S0_SFR TP2 TP1 RSMRST# PC0 / LAD1 / #/ GPP_A12 /
ESPI_IO1 ESPI_RES BM_BUSY ISH_GP4 ISH_GP2
30] M ESPI_CLK ET# #/
ISH_GP6
GPD9 /
BH GPD10 / GPP_A8 /
VSS VSS SRTCRST# SLP_WLAN
# SLP_S5# CLKRUN#
GPP_A3 /
DDR1_DQ[ INTRUDER
BG VSS VSS VSS LAD2 / VSS VSS VSS VSS
58] # ESPI_IO2
GPP_A10 /
BF DDR1_DQ GPD5 / GPD3 / GPP_A18 / GPP_A15 / GPP_A11 / GPP_A7 / SD_RCOM
VSS RSVD CLKOUT_LP
SN[7] SLP_S4# PWRBTN# ISH_GP0 SUSACK# PME# PIRQA# P
C1
DDR1_DQ[ GPD6 / GPD2 /

BE RSVD LAN_WAK VSS
63] SLP_A#
E#
GPD1 / GPP_B7 /
DDR1_DQ GPD0 / GPP_B3 / GPP_B2 / GPP_A23 / GPP_A19 /
BD VSS RSVD ACPRESEN SRCCLKRE
SP[7] BATLOW# T Q2# CPU_GP2 VRALERT# ISH_GP5 ISH_GP1
GPP_B11 /
DDR1_DQ[ GPD11 / GPP_B4 / GPP_B12 / EXT_P- GPP_B10 / GPP_B15 / EMMC_RC
BC RSVD VSS SRCCLKREQ GSPI0_CS
62] LANPHYPC CPU_GP3 SLP_S0# WR_GATE OMP
# 5# #
GPP_B23 /
GPD7 / GPP_B1 / GPP_B5 / GPP_B13 / SML1ALER GPP_B18 / GPP_B19 /
BB VSS VSS RSVD RSVD CORE_VID SRCCLKRE GSPI0_MO GSPI1_CS
RSVD PLTRST# T# /
1 Q0# PCHHOT# SI #
GPP_B0 /
BA RSVD RSVD RSVD_TP GPD8 / CORE_VID VSS VSS VSS VSS VSS VSS
SUSCLK
0
AY TP6 RSVD RSVD_TP VSS GPD4 /

SLP_S3#
GPP_B20 / GPP_B16 / GPP_B22 / GPP_B17 / GPP_B21 /
AW VSS VSS VSS GSPI1_CL GSPI0_CL GSPI1_MO GSPI0_MI GSPI1_MI VCCPGPPB
K K SI SO SO
GPP_B6 / GPP_B9 / GPP_B8 / GPP_B14 /
AV VCCHDA VSS DCPRTC VSS VCCSPI SPI0_IO3 SPI0_IO2 SRCCLKRE SRCCLKRE SRCCLKREQ VCCPGPPB
SPKR
Q1# Q4# 3#
AU SPI0_MIS SPI0_CS2 SPI0_CS1 SPI0_CS0

SPI0_CLK VCCPGPPA
O # # #
GPP_F11/
GPP_F1 / GPP_F0 / I2C5_SCL
AT VCCPRIM_ VCCRTC DCPRTC VCCPRIM_ VCCSPI I2S2_SFR I2S2_SCL / GPP_F7 / GPP_F3 / SPI0_MOS VCCPGPPA
1P0 CORE I2C3_SCL I2S2_RXD I
M K ISH_I2C2_
SCL
VCCPRIM_ VCCPRIM_
AR VCCRTC VSS VSS VSS VSS VSS VSS VSS VSS
1P0 CORE
GPP_F14 /
GPP_F2 / GPP_F5 / GPP_F6 / GPP_F4 /
AP VCCPGPPG EMMC_DA VCCPGPPF
I2S2_TXD TA1 I2C2_SCL I2C3_SDA I2C2_SDA
GPP_F13 / GPP_F15 / GPP_F20 /

AN VSS VSS VSS VSS VCCPGPPG EMMC_DA EMMC_DA EMMC_DA GPP_F9 / GPP_F8 / VCCPGPPF
I2C4_SCL I2C4_SDA
TA0 TA2 TA7
GPP_F10 /
GPP_F12 / GPP_F17 / I2C5_SDA
AM VCCDSW_ EMMC_CM EMMC_DA / USB2P_2 USB2N_2 DCPDSW_
3P3 1P0
D TA4 ISH_I2C2_
SDA
VCCRT- GPP_F18 / GPP_F21 / GPP_F22 /
AL VSS CPRIM_3P VCCPRIM_ VSS VCCDSW_ EMMC_DA EMMC_RC EMMC_CL USB2N_3 USB2P_3 DCPDSW_
1P0 3P3 1P0
3 TA5 LK K
VCCPRIM_ VCCRT- VCCPRIM_

AK 3P3
CPRIM_3P
1P0 VSS VSS VSS VSS VSS VSS VSS VSS VSS
3
GPP_F19 / GPP_F16 /
AJ EMMC_DA EMMC_DA GPP_F23 USB2N_1 USB2P_1 VCCPGPPC
TA6 TA3

Figure 9-10. Y-Processor Ball Map (Lower Left, Columns 64-44)
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44
DDR1_ DDR1_
DQ[10] DQ[11]
DDR0_ DDR0_
AH VDDQ / / VSS VSS VSS VSS VSS VSS VSS
DQ[4] DQ[1] DDR0_ DDR0_
DQ[26] DQ[27]
DDR1_ DDR1_
DQ[15] DQ[14]
DDR0_ DDR0_
AG VSS / / VCCGT
DQ[5] DQ[0] DDR0_ DDR0_
DQ[31] DQ[30]
AF VSS VSS VSS VSS VSS VSS VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT
AE VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT VSS VSS VSS VSS VSS VSS
AD VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT
AC VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT
AB VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT
AA VSS VSS VSS VSS VSS VCCGT VSS VSS VSS VSS VSS VSS
Y VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT
W VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT
V VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT VSS VSS VSS VSS VSS VSS
U VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT
T VSS VSS VSS VSS VSS VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT
R VCC VCC VCC VCC VSS VCCGT VCCGT VSS VSS VSS VSS VSS
VSSGT
P VCC VCC VCC VCC VCC VSS _SENS
E
VCCGT
N VCC VCC VCC VCC VCC VCC _SENS VCCGT VCCGT VCCGT VCCGT
E
M VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC
L VCC VSS VSS VSS VCC VCC VCC VCC VCC VCC
K VSS VSS VSS VSS VSS VSS
CFG[12 CFG[13 CFG[19 CFG[16 BPM#[ PROCH EDP_T EDP_T
J VCC VSS ] ] ] ] CFG[2] 1] OT# XN[2] XN[1]
CFG[14 CFG[15 BPM#[ CATER THERM EDP_T
H VCC CFG[4] CFG[3]
] ] 0] R# TRIP# XN[0]
CFG[18 CFG[17 BPM#[ PROC_ EDP_T EDP_T
G CFG[9] CFG[0]
] ] 3] TDO XP[2] XP[1]
CFG[11 BPM#[ PROC_ EDP_T
F VCC VSS ] CFG[7] CFG[1] 2] PECI TRST# XP[0]
E VSS VSS VSS VSS VSS VSS VSS VSS
CFG[10 PROC_ PROC_ DDI1_ DDI1_
D VCC VSS CFG[8] CFG[5] RSVD
] TCK PRDY# TXP[3] TXP[2]
PCH_JT
PROC_ PROC_ PCH_T DDI1_ DDI1_ DDI2_
C TMS CFG[6] TDI RST# AG_TD TXN[1] TXP[0] TXP[1]
I
VCCST PCH_JT PCH_JT
SKTOC _PWRG VIDALE PROC_ DDI1_ DDI1_
B VCC AG_TC AG_TD JTAGX
C# RT# PREQ# TXN[3] TXN[2]
D K O
PCH_JT
PROCP ITP_PM VIDSO VIDSC CFG_R eDP_R DDI1_ DDI1_ DDI2_
A VCC AG_TM
WRGD ODE UT K COMP COMP TXP[1] TXN[0] TXN[1]
S
179
Figure 9-11. Y-Processor Ball Map (Lower Middle, Columns 43-23)
43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23
AH VSS VCC VSS VCCG1 VSS VCCG1 VSS VCC VSS VCCSA VSS VCCIO VSS VSS
AG
VCCPLL VCCIO
AF VCCGT VCC VSS VCCG1 VSS VCCG1 VSS VCC VCCSA VCCSA VCCIO VSS
_OC
VCCPLL VCCIO
AE VSS VCC VCC VCC VCC VCC VCC VCC VSS VCCSA VCCIO VCCIO
_OC
AD
VCCST
AC VCCGT VCC VSS VCCG0 VSS VCCG0 VSS VCC VCCSA VCCSA VSS VCCIO VCCIO
G
AB
VCCSR
VCCST
AA VSS VCC VSS VCCG0 VSS VCCG0 VSS VCC VSS VCCSA VSS VSS AM_1P
G 0
VCCCL
Y VCCGT VCC VSS VCCG0 VSS VCCG0 VSS VCC VCCSA VCCSA VSS VCCST VSS K3
W
VCCCL
V VSS VCC VSS VCCG0 VSS VCCG0 VSS VCC VSS VCCSA VSS VCCST VSS K3
U
T VCCGT VCC VSS VCCG0 VSS VCCG0 VSS VCC VCCSA VCCSA VCCPLL VCCST VSS VSS
G
VCCPLL VCCST VCCCL
R VSS VCC VSS VCCG0 VSS VCCG0 VSS VCC VSS VCCSA VSS
G K5
P
VSSSA
N VCC VCC VCC VCC VCC VCC VCCSA _SENS VSS VSS
E
VCCSA
M VCC VCC VCC VCC VCC VCC VCCSA _SENS RSVD RSVD RSVD
E
VCC_S VSS_S
L VCC VCC RSVD RSVD VCCSA RSVD RSVD RSVD
ENSE ENSE
K VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS
PCIE7_
CLKOU CLKOU CLKOU
EDP_A DDI2_ CSI2_D CSI2_D PCIE9_ TXP / PCIE5_
J UXN AUXN T_PCIE T_PCIE T_ITPX N3 N2 TXP SATA0_ TXP
_N3 _N2 DP_N TXP
PCIE8_
CLKOU CLKOU CLKOU
EDP_T DDI1_ CSI2_D CSI2_C CSI2_D PCIE10 TXP / PCIE6_
H T_PCIE T_PCIE T_PCIE
XN[3] AUXN P1 LKN0 N0 _TXP SATA1 TXP
_N5 _N4 _N1 A_TXP
PCIE7_
CLKOU CLKOU CLKOU
EDP_A DDI2_ CSI2_D CSI2_D PCIE9_ TXN / PCIE5_
G T_PCIE T_PCIE T_ITPX
UXP AUXP P3 P2 TXN SATA0_ TXN
_P3 _P2 DP_P TXN
PCIE8_
CLKOU CLKOU CLKOU
EDP_T DDI1_ CSI2_D CSI2_C CSI2_D PCIE10 TXN / PCIE6_
F XP[3] AUXP T_PCIE T_PCIE T_PCIE N1 LKP0 P0 _TXN SATA1 TXN
_P5 _P4 _P1 A_TXN
E VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS
PCIE8_
DDI2_T DDI2_T CSI2_C CSI2_D CSI2_D CSI2_D CSI2_C CSI2_D PCIE10 RXP / PCIE6_
D XP[3] XP[2] LKN3 N10 N8 N7 LKN1 N4 _RXP SATA1 RXP
A_RXP
PCIE7_
DDI2_T CSI2_D CSI2_D CSI2_C CSI2_D CSI2_D PCIE9_ RXN / PCIE5_
C XP[0] VSS N11 N9 LKN2 N5 N6 RXN SATA0_ RXN
RXN
PCIE8_
DDI2_T DDI2_T CSI2_C CSI2_D CSI2_D CSI2_D CSI2_C CSI2_D PCIE10 RXN / PCIE6_
B XN[3] XN[2] LKP3 P10 P8 P7 LKP1 P4 _RXN SATA1 RXN
A_RXN
PCIE7_
EDP_DI
DDI2_T CSI2_D CSI2_D CSI2_C CSI2_D CSI2_D PCIE9_ RXP / PCIE5_
A SP_UTI
XN[0] P11 P9 LKP2 P5 P6 RXP SATA0_ RXP
L RXP

Figure 9-12. Y-Processor Ball Map (Lower Right, Columns 42-1)
22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
AH VCCPRIM_ VCCPRIM_ VCCPRIM_ VCCPRIM_ VCCPRIM_ GPP_G1 / GPP_G0 /

VSS RSVD USB2N_5 USB2P_5 VCCPGPPC
3P3 1P0 1P0 1P0 1P0 SD_DATA0 SD_CMD
AG GPP_G2 / GPP_G6 / GPP_G5 / USB2N_9 USB2P_9 VCCPGPPD

SD_DATA1 SD_CLK SD_CD#
VCCPRIM_ VCCPRIM_ GPP_G4 / GPP_G3 /
AF VSS VSS VSS VSS USB2_ID USB2N_7 USB2P_7 VCCPGPPD
CORE CORE SD_DATA3 SD_DATA2
AE VCCPRIM_ VCCPRIM_ GPP_G7 / USB2_VBU

VSS VCCATS VCCATS VSS VSS VSS VSS
CORE CORE SD_WP SSENSE
GPP_C23 / GPP_C21 / GPP_C20 / GPP_C22 /
AD GPP_C16 / VCCPRIM_
VSS UART2_CT UART2_TX UART2_RX UART2_RT
I2C0_SDA S# D D S# 3P3
GPP_C12 / GPP_C13 /
GPP_C8 / UART1_RX UART1_TX
AC GPP_C0 / GPP_C4 / VCCPRIM_
VSS VSS VSS VSS VSS UART0_RX D/ D/
SMBCLK SML0DATA D ISH_UART ISH_UART 3P3
1_RXD 1_TXD
GPP_C14 / GPP_C15 /
UART1_RT UART1_CT
AB GPP_C19 / GPP_C18 / GPP_C17 /
VSS S# / S# / VCCPGPPE
I2C1_SCL I2C1_SDA I2C0_SCL
ISH_UART ISH_UART
1_RTS# 1_CTS#
GPP_C11 / GPP_C10 / GPP_C9 / GPP_C5 /
AA VCCSRAM_ VCCAPLL_ VCCAPLL_ VCCPRIM_ VCCPRIM_ UART0_CT UART0_RT UART0_TX SML0ALER GPP_C6 /
VCCPGPPE
1P0 1P0 1P0 1P0 1P0 SML1CLK
S# S# D T#
Y VCCCLK4 VCCCLK2 VCCCLK1 VSS VSS VSS VSS VSS VSS VSS VSS VSS
GPP_C2 /
W GPP_C7 / GPP_C1 / GPP_C3 / VCCMPHYA
GPP_D21 SMBALERT
SML1DATA # SMBDATA SML0CLK ON_1P0
GPP_D16 /
VCCAM- VCCAM- GPP_D20 / ISH_UART GPP_D19 /
V GPP_D23 / VCCMPHYA
VCCCLK4 VCCCLK2 VCCCLK1 PHYPLL_1P PHYPLL_1P VSS DMIC_DAT 0_CTS# / GPP_D22 DMIC_CLK
0 0 A0 SML0BALE I2S_MCLK 0 ON_1P0
RT#
GPP_D13 /
GPP_D14 /
GPP_D17 / ISH_UART GPP_D18 / GPP_D15 /
U ISH_UART VCCMPHYG
DMIC_CLK 0_RXD / DMIC_DAT ISH_UART 0_TXD / T_1P0
1 SML0BDAT A1 0_RTS#
A SML0BCLK
GPP_D7 / GPP_D8 /
T VSS VCCCLK6 VSS VCCMPHYG VCCMPHYG VSS GPP_D12 ISH_I2C1_ GPP_D10 GPP_D11 ISH_I2C1_ VCCMPHYG
T_1P0 T_1P0 T_1P0
SDA SCL
R VCCCLK5 VCCCLK6 VSS VCCAPLLE VCCAPLLE RSVD VSS VSS VSS VSS VSS
BB_1P0 BB_1P0
GPP_D5 / GPP_D6 /
P RSVD GPP_D9 GPP_D1 ISH_I2C0_ ISH_I2C0_ GPP_D3 XCLK_BIA
SREF
SDA SCL
GPP_E9 / GPP_E2 / GPP_D4 /

SATAXPCIE USB2_COM
N VSS VSS VSS VSS VSS USB2_OC0 GPP_D2 GPP_D0 FLASHTRI
# 2/ G P
SATAGP2
GPP_E10 / GPP_E7 / GPP_E15 /
M RSVD RSVD RSVD RSVD USB2_OC1 DDPD_HPD GPP_E22 VSS XTAL24_IN
CPU_GP1
# 2
GPP_E14 / GPP_E18 /
GPP_E6 / XTAL24_O
L RSVD RSVD RSVD RSVD VSS DDPC_HPD DDPB_C- GPP_E23
1 DEVSLP2 TRLCLK UT
K VSS VSS VSS VSS RSVD

PCIE1_TXP GPP_E1 /
J / USB3_3_T USB3_1_T SATAXPCIE SYS_PWRO
PCIE3_TXP VSS VSS VSS VSS VSS
USB3_5_T XP XP 1/ K
XP SATAGP1
PCIE2_TXP
/ USB3_4_T USB3_2_T GPP_E5 / GPP_E8 / GPP_E19 / GPP_E20 / SYS_RESE
H PCIE4_TXP XP / RSVD DDPB_C- DDPC_C-
USB3_6_T XP DEVSLP1 SATALED# T#
XP SSIC_TXP TRLDATA TRLCLK
PCIE1_TXN GPP_E0 /
G / USB3_3_T USB3_1_T SATAXPCIE
PCIE3_TXN VSS
USB3_5_T XN XN 0/
XN SATAGP0
PCIE2_TXN
/ USB3_4_T USB3_2_T GPP_E4 / GPP_E11 / GPP_E16 / GPP_E21 /
F PCIE4_TXN XN / CL_CLK USB2_OC2 DDPE_HPD DDPC_C- RSVD RSVD
USB3_6_T XN DEVSLP0
XN SSIC_TXN # 3 TRLDATA
GPP_E3 /
E VSS VSS VSS VSS VSS CPU_GP0
PCIE2_RXP
USB3_2_R
D / USB3_4_R eDP_BKLE eDP_VDDE
PCIE4_RXP USB3_6_R XP / CL_DATA VSS VSS VSS VSS
XP N N
SSIC_RXP
XP
PCIE1_RX
GPP_E13 /
C PCIE3_RX N/ USB3_3_R USB3_1_R VSS DDPB_HPD
N USB3_5_R XN XN
0
XN
PCIE2_RX
USB3_2_R GPP_E12 /
B PCIE4_RX N/ USB3_4_R XN / CL_RST# PCIE_RCO USB2_OC3 eDP_BKLC RSVD RSVD
N USB3_6_R XN SSIC_RXN MPP # TL
XN
PCIE1_RXP
A / USB3_3_R USB3_1_R CSI2_COM PCIE_RCO GPP_E17 /
PCIE3_RXP VSS VSS
USB3_5_R XP XP P MPN EDP_HPD
XP
181
Table 9-2. Y-Processor Ball List (Sheet 1 of 40)
Non-Interleaved
Ball # Ball Name LPDDR3 Interleaved (IL) X [um] Y [um]
(NIL)
A11 CSI2_COMP 6763.51 -7541.01
A14 VSS 6119.37 -7541.01
A16 USB3_1_RXP 5475.22 -7541.01
A18 USB3_3_RXP 4831.08 -7541.01
A20 PCIE1_RXP / USB3_5_RXP 4186.94 -7541.01
A22 PCIE3_RXP 3542.79 -7541.01
A24 PCIE5_RXP 2898.65 -7541.01
A26 PCIE7_RXP / SATA0_RXP 2254.5 -7541.01
A28 PCIE9_RXP 1610.36 -7541.01
A30 CSI2_DP6 966.22 -7541.01
A32 CSI2_DP5 322.07 -7541.01
A34 CSI2_CLKP2 -322.07 -7541.01
A36 CSI2_DP9 -966.22 -7541.01
A38 CSI2_DP11 -1610.36 -7541.01
A40 EDP_DISP_UTIL -2254.5 -7541.01
A42 DDI2_TXN[0] -2898.65 -7541.01
A44 DDI2_TXN[1] -3542.79 -7541.01
A46 DDI1_TXN[0] -4186.94 -7541.01
A48 DDI1_TXP[1] -4831.08 -7541.01
A5 VSS 8401.05 -7541.01
A50 eDP_RCOMP -5475.22 -7541.01
A52 PCH_JTAG_TMS -6119.37 -7541.01
A54 CFG_RCOMP -6763.51 -7541.01
A56 VIDSCK -7407.66 -7541.01
A58 VIDSOUT -7953.09 -7541.01
A60 ITP_PMODE -8401.05 -7541.01
A62 PROCPWRGD -8855.71 -7541.01
A64 VCC -9310.37 -7541.01
A7 GPP_E17 / EDP_HPD 7946.39 -7541.01
A9 PCIE_RCOMPN 7407.66 -7541.01
AA10 GPP_C10 / UART0_RTS# 7067.55 -1932.43
AA12 GPP_C11 / UART0_CTS# 6574.79 -1932.43
AA15 VCCPRIM_1P0 5846.1 -1869.71
AA16 VCCPRIM_1P0 5350.8 -1869.71
AA18 VCCAPLL_1P0 4855.5 -1869.71
AA19 VCCAPLL_1P0 4360.2 -1869.71
AA2 VCCPGPPE 9038.59 -1932.43
AA21 VCCSRAM_1P0 3864.9 -1869.71
AA23 VCCSRAM_1P0 3369.6 -1869.71

Non-Interleaved
(NIL)
AA24 VSS 2874.3 -1869.71
AA26 VCCSTG 2379 -1869.71
AA27 VSS 1883.7 -1869.71
AA29 VCCSA 1388.4 -1869.71
AA30 VSS 893.1 -1869.71
AA32 VCC 397.8 -1869.71
AA33 VSS -97.5 -1869.71
AA35 VCCG0 -592.8 -1869.71
AA36 VSS -1088.1 -1869.71
AA38 VCCG0 -1583.4 -1869.71
AA4 GPP_C6 / SML1CLK 8545.83 -1932.43
AA40 VSS -2078.7 -1869.71
AA41 VCC -2574 -1869.71
AA43 VSS -3069.3 -1869.71
AA44 VSS -3564.6 -1869.71
AA46 VSS -4059.9 -1869.71
AA47 VSS -4555.2 -1869.71
AA49 VSS -5050.5 -1869.71
AA50 VSS -5545.8 -1869.71
AA51 VSS -6041.1 -1869.71
AA53 VCCGT -6574.79 -1932.43
AA55 VSS -7067.55 -1932.43
AA57 VSS -7560.31 -1932.43
AA59 VSS -8053.07 -1932.43
AA6 GPP_C5 / SML0ALERT# 8053.07 -1932.43
AA61 VSS -8545.83 -1932.43
AA63 VSS -9038.59 -1932.43
AA8 GPP_C9 / UART0_TXD 7560.31 -1932.43
AB1 VCCPGPPE 9310.37 -1610.36
AB11 GPP_C19 / I2C1_SCL 6821.17 -1610.36
AB13 VSS 6328.41 -1605.28
AB3 GPP_C17 / I2C0_SCL 8792.21 -1610.36
GPP_C15 / UART1_CTS# / 8299.45 -1610.36

AB5
ISH_UART1_CTS#
AB54 VCCGT -6821.17 -1610.36
AB56 VCCGT -7313.93 -1610.36
AB58 VCCGT -7806.69 -1610.36
AB60 VCCGT -8299.45 -1610.36
AB62 VCCGT -8792.21 -1610.36
183
Non-Interleaved
(NIL)
AB64 VCCGT -9310.37 -1610.36
GPP_C14 / UART1_RTS# / 7806.69 -1610.36

AB7
ISH_UART1_RTS#
AB9 GPP_C18 / I2C1_SDA 7313.93 -1610.36
AC10 GPP_C4 / SML0DATA 7067.55 -1288.29
AC12 GPP_C0 / SMBCLK 6574.79 -1288.29
AC15 VSS 5846.1 -1310.91
AC16 VSS 5350.8 -1310.91
AC18 VSS 4855.5 -1310.91
AC19 VSS 4360.2 -1310.91
AC2 VCCPRIM_3P3 9038.59 -1288.29
AC21 VSS 3864.9 -1310.91
AC23 VCCIO 3369.6 -1310.91
AC24 VCCIO 2874.3 -1310.91
AC26 VCCSTG 2379 -1310.91
AC27 VSS 1883.7 -1310.91
AC29 VCCSA 1388.4 -1310.91
AC30 VCCSA 893.1 -1310.91
AC32 VCC 397.8 -1310.91
AC33 VSS -97.5 -1310.91
AC35 VCCG0 -592.8 -1310.91
AC36 VSS -1088.1 -1310.91
AC38 VCCG0 -1583.4 -1310.91
AC4 GPP_C13 / UART1_TXD / ISH_UART1_TXD 8545.83 -1288.29
AC40 VSS -2078.7 -1310.91
AC41 VCC -2574 -1310.91
AC43 VCCGT -3069.3 -1310.91
AC44 VCCGT -3564.6 -1310.91
AC46 VCCGT -4059.9 -1310.91
AC47 VCCGT -4555.2 -1310.91
AC49 VCCGT -5050.5 -1310.91
AC50 VCCGT -5545.8 -1310.91
AC51 VCCGT -6041.1 -1310.91
AC53 VCCGT -6574.79 -1288.29
AC55 VCCGT -7067.55 -1288.29
AC57 VCCGT -7560.31 -1288.29
AC59 VCCGT -8053.07 -1288.29
AC6 GPP_C12 / UART1_RXD / ISH_UART1_RXD 8053.07 -1288.29
AC61 VCCGT -8545.83 -1288.29

Non-Interleaved
(NIL)
AC63 VCCGT -9038.59 -1288.29
AC8 GPP_C8 / UART0_RXD 7560.31 -1288.29
AD1 VCCPRIM_3P3 9310.37 -966.22
AD11 GPP_C16 / I2C0_SDA 6821.17 -966.22
AD13 VSS 6328.41 -961.14
AD3 GPP_C22 / UART2_RTS# 8792.21 -966.22
AD5 GPP_C20 / UART2_RXD 8299.45 -966.22
AD54 VCCGT -6821.17 -966.22
AD56 VCCGT -7313.93 -966.22
AD58 VCCGT -7806.69 -966.22
AD60 VCCGT -8299.45 -966.22
AD62 VCCGT -8792.21 -966.22
AD64 VCCGT -9310.37 -966.22
AD7 GPP_C21 / UART2_TXD 7806.69 -966.22
AD9 GPP_C23 / UART2_CTS# 7313.93 -966.22
AE10 VSS 7067.55 -644.14
AE12 GPP_G7 / SD_WP 6574.79 -644.14
AE15 VCCATS 5846.1 -752.11
AE16 VCCATS 5350.8 -752.11
AE18 VCCPRIM_CORE 4855.5 -752.11
AE19 VCCPRIM_CORE 4360.2 -752.11
AE2 VSS 9038.59 -644.14
AE21 VSS 3864.9 -752.11
AE23 VCCIO 3369.6 -752.11
AE24 VCCIO 2874.3 -752.11
AE26 VCCIO 2379 -752.11
AE27 VCCPLL_OC 1883.7 -752.11
AE29 VCCSA 1388.4 -752.11
AE30 VSS 893.1 -752.11
AE32 VCC 397.8 -752.11
AE33 VCC -97.5 -752.11
AE35 VCC -592.8 -752.11
AE36 VCC -1088.1 -752.11
AE38 VCC -1583.4 -752.11
AE4 VSS 8545.83 -644.14
AE40 VCC -2078.7 -752.11
AE41 VCC -2574 -752.11
AE43 VSS -3069.3 -752.11
AE44 VSS -3564.6 -752.11
185
Non-Interleaved
(NIL)
AE46 VSS -4059.9 -752.11
AE47 VSS -4555.2 -752.11
AE49 VSS -5050.5 -752.11
AE50 VSS -5545.8 -752.11
AE51 VSS -6041.1 -752.11
AE53 VCCGT -6574.79 -644.14
AE55 VCCGT -7067.55 -644.14
AE57 VCCGT -7560.31 -644.14
AE59 VCCGT -8053.07 -644.14
AE6 USB2_VBUSSENSE 8053.07 -644.14
AE61 VCCGT -8545.83 -644.14
AE63 VCCGT -9038.59 -644.14
AE8 VSS 7560.31 -644.14
AF1 VCCPGPPD 9310.37 -322.07
AF11 GPP_G4 / SD_DATA3 6821.17 -322.07
AF13 VSS 6328.41 -316.99
AF15 VSS 5846.1 -193.31
AF16 VSS 5350.8 -193.31
AF18 VCCPRIM_CORE 4855.5 -193.31
AF19 VCCPRIM_CORE 4360.2 -193.31
AF21 VSS 3864.9 -193.31
AF23 VSS 3369.6 -193.31
AF24 VCCIO 2874.3 -193.31
AF26 VCCIO 2379 -193.31
AF27 VCCPLL_OC 1883.7 -193.31
AF29 VCCSA 1388.4 -193.31
AF3 USB2P_7 8792.21 -322.07
AF30 VCCSA 893.1 -193.31
AF32 VCC 397.8 -193.31
AF33 VSS -97.5 -193.31
AF35 VCCG1 -592.8 -193.31
AF36 VSS -1088.1 -193.31
AF38 VCCG1 -1583.4 -193.31
AF40 VSS -2078.7 -193.31
AF41 VCC -2574 -193.31
AF43 VCCGT -3069.3 -193.31
AF44 VCCGT -3564.6 -193.31
AF46 VCCGT -4059.9 -193.31
AF47 VCCGT -4555.2 -193.31

Non-Interleaved
(NIL)
AF49 VCCGT -5050.5 -193.31
AF5 USB2N_7 8299.45 -322.07
AF50 VCCGT -5545.8 -193.31
AF51 VCCGT -6041.1 -193.31
AF54 VSS -6821.17 -322.07
AF56 VSS -7313.93 -322.07
AF58 VSS -7806.69 -322.07
AF60 VSS -8299.45 -322.07
AF62 VSS -8792.21 -322.07
AF64 VSS -9310.37 -322.07
AF7 USB2_ID 7806.69 -322.07
AF9 GPP_G3 / SD_DATA2 7313.93 -322.07
AG10 GPP_G6 / SD_CLK 7067.55 0
AG12 GPP_G2 / SD_DATA1 6574.79 0
AG2 VCCPGPPD 9038.59 0
AG4 USB2P_9 8545.83 0
AG53 VCCGT -6574.79 0
AG55 DDR1_DQ[14] / DDR0_DQ[30] DDR1_DQ[14] DDR0_DQ[30] -7067.55 0
AG57 DDR1_DQ[15] / DDR0_DQ[31] DDR1_DQ[15] DDR0_DQ[31] -7560.31 0
AG59 VSS -8053.07 0
AG6 USB2N_9 8053.07 0
AG61 DDR0_DQ[0] -8545.83 0
AG63 DDR0_DQ[5] -9038.59 0
AG8 GPP_G5 / SD_CD# 7560.31 0
AH1 VCCPGPPC 9310.37 322.07
AH11 GPP_G1 / SD_DATA0 6821.17 322.07
AH13 VCCPRIM_1P0 6328.41 327.15
AH15 VCCPRIM_1P0 5846.1 365.49
AH16 VSS 5350.8 365.49
AH18 VCCPRIM_1P0 4855.5 365.49
AH19 VCCPRIM_1P0 4360.2 365.49
AH21 VCCPRIM_3P3 3864.9 365.49
AH23 VSS 3369.6 365.49
AH24 VSS 2874.3 365.49
AH26 VCCIO 2379 365.49
AH27 VSS 1883.7 365.49
AH29 VCCSA 1388.4 365.49
AH3 USB2P_5 8792.21 322.07
AH30 VSS 893.1 365.49
187
Non-Interleaved
(NIL)
AH32 VCC 397.8 365.49
AH33 VSS -97.5 365.49
AH35 VCCG1 -592.8 365.49
AH36 VSS -1088.1 365.49
AH38 VCCG1 -1583.4 365.49
AH40 VSS -2078.7 365.49
AH41 VCC -2574 365.49
AH43 VSS -3069.3 365.49
AH44 VSS -3564.6 365.49
AH46 VSS -4059.9 365.49
AH47 VSS -4555.2 365.49
AH49 VSS -5050.5 365.49
AH5 USB2N_5 8299.45 322.07
AH50 VSS -5545.8 365.49
AH51 VSS -6041.1 365.49
AH54 VSS -6821.17 322.07
AH56 DDR1_DQ[11] / DDR0_DQ[27] DDR1_DQ[11] DDR0_DQ[27] -7313.93 322.07
AH58 DDR1_DQ[10] / DDR0_DQ[26] DDR1_DQ[10] DDR0_DQ[26] -7806.69 322.07
AH60 DDR0_DQ[1] -8299.45 322.07
AH62 DDR0_DQ[4] -8792.21 322.07
AH64 VDDQ -9310.37 322.07
AH7 RSVD 7806.69 322.07
AH9 GPP_G0 / SD_CMD 7313.93 322.07
AJ10 GPP_F16 / EMMC_DATA3 7067.55 644.14
AJ12 GPP_F19 / EMMC_DATA6 6574.79 644.14
AJ2 VCCPGPPC 9038.59 644.14
AJ4 USB2P_1 8545.83 644.14
AJ53 VCCGT -6574.79 644.14
AJ55 DDR1_DQSP[1] / DDR0_DQSP[3] DDR1_DQSP[1] DDR0_DQSP[3] -7067.55 644.14
AJ57 DDR1_DQSN[1] / DDR0_DQSN[3] DDR1_DQSN[1] DDR0_DQSN[3] -7560.31 644.14
AJ59 VSS -8053.07 644.14
AJ6 USB2N_1 8053.07 644.14
AJ61 DDR0_DQSN[0] -8545.83 644.14
AJ63 DDR0_DQSP[0] -9038.59 644.14
AJ8 GPP_F23 7560.31 644.14
AK1 VSS 9310.37 966.22
AK11 VSS 6821.17 966.22
AK13 VSS 6328.41 971.3
AK15 VSS 5846.1 924.29

Non-Interleaved
(NIL)
AK16 VSS 5350.8 924.29
AK18 VCCPRIM_1P0 4855.5 924.29
AK19 VCCRTCPRIM_3P3 4360.2 924.29
AK21 VCCPRIM_3P3 3864.9 924.29
AK23 VCCSRAM_1P0 3369.6 924.29
AK24 VSS 2874.3 924.29
AK26 VCCIO 2379 924.29
AK27 VSS 1883.7 924.29
AK29 VCCSA 1388.4 924.29
AK3 VSS 8792.21 966.22
AK30 VCCSA 893.1 924.29
AK32 VCC 397.8 924.29
AK33 VSS -97.5 924.29
AK35 VCCG1 -592.8 924.29
AK36 VSS -1088.1 924.29
AK38 VCCG1 -1583.4 924.29
AK40 VSS -2078.7 924.29
AK41 VCC -2574 924.29
AK43 VCCGT -3069.3 924.29
AK44 VCCGT -3564.6 924.29
AK46 VCCGT -4059.9 924.29
AK47 VCCGT -4555.2 924.29
AK49 VCCGT -5050.5 924.29
AK5 VSS 8299.45 966.22
AK50 VCCGT -5545.8 924.29
AK51 VCCGT -6041.1 924.29
AK54 VSS -6821.17 966.22
AK56 DDR1_DQ[13] / DDR0_DQ[29] DDR1_DQ[13] DDR0_DQ[29] -7313.93 966.22
AK58 DDR1_DQ[12] / DDR0_DQ[28] DDR1_DQ[12] DDR0_DQ[28] -7806.69 966.22
AK60 DDR0_DQ[3] -8299.45 966.22
AK62 DDR0_DQ[2] -8792.21 966.22
AK64 VDDQ -9310.37 966.22
AK7 VSS 7806.69 966.22
AK9 VSS 7313.93 966.22
AL10 GPP_F21 / EMMC_RCLK 7067.55 1288.29
AL12 GPP_F18 / EMMC_DATA5 6574.79 1288.29
AL15 VCCDSW_3P3 5846.1 1483.09
AL16 VSS 5350.8 1483.09
AL18 VCCPRIM_1P0 4855.5 1483.09
189
Non-Interleaved
(NIL)
AL19 VCCRTCPRIM_3P3 4360.2 1483.09
AL2 DCPDSW_1P0 9038.59 1288.29
AL21 VSS 3864.9 1483.09
AL23 VCCSRAM_1P0 3369.6 1483.09
AL24 VSS 2874.3 1483.09
AL26 VCCIO 2379 1483.09
AL27 VSS 1883.7 1483.09
AL29 VCCSA 1388.4 1483.09
AL30 VSS 893.1 1483.09
AL32 VCC 397.8 1483.09
AL33 VSS -97.5 1483.09
AL35 VCCG1 -592.8 1483.09
AL36 VSS -1088.1 1483.09
AL38 VCCG1 -1583.4 1483.09
AL4 USB2P_3 8545.83 1288.29
AL40 VSS -2078.7 1483.09
AL41 VCC -2574 1483.09
AL43 VSS -3069.3 1483.09
AL44 VSS -3564.6 1483.09
AL46 VSS -4059.9 1483.09
AL47 VSS -4555.2 1483.09
AL49 VSS -5050.5 1483.09
AL50 VSS -5545.8 1483.09
AL51 VSS -6041.1 1483.09
AL53 VSS -6574.79 1288.29
AL55 DDR1_DQ[8] / DDR0_DQ[24] DDR1_DQ[8] DDR0_DQ[24] -7067.55 1288.29
AL57 DDR1_DQ[9] / DDR0_DQ[25] DDR1_DQ[9] DDR0_DQ[25] -7560.31 1288.29
AL59 VSS -8053.07 1288.29
AL6 USB2N_3 8053.07 1288.29
AL61 DDR0_DQ[6] -8545.83 1288.29
AL63 DDR0_DQ[7] -9038.59 1288.29
AL8 GPP_F22 / EMMC_CLK 7560.31 1288.29
AM1 DCPDSW_1P0 9310.37 1610.36
AM11 GPP_F12 / EMMC_CMD 6821.17 1610.36
AM13 VCCDSW_3P3 6328.41 1615.44
AM3 USB2N_2 8792.21 1610.36
AM5 USB2P_2 8299.45 1610.36
AM54 VSS -6821.17 1610.36
AM56 DDR1_DQ[7] / DDR0_DQ[23] DDR1_DQ[7] DDR0_DQ[23] -7313.93 1610.36

Non-Interleaved
(NIL)
AM58 DDR1_DQ[6] / DDR0_DQ[22] DDR1_DQ[6] DDR0_DQ[22] -7806.69 1610.36
AM60 DDR0_DQ[8] -8299.45 1610.36
AM62 DDR0_DQ[9] -8792.21 1610.36
AM64 VSS -9310.37 1610.36
AM7 GPP_F10 / I2C5_SDA / ISH_I2C2_SDA 7806.69 1610.36
AM9 GPP_F17 / EMMC_DATA4 7313.93 1610.36
AN10 GPP_F15 / EMMC_DATA2 7067.55 1932.43
AN12 GPP_F13 / EMMC_DATA0 6574.79 1932.43
AN15 VCCPGPPG 5846.1 2041.89
AN16 VSS 5350.8 2041.89
AN18 VSS 4855.5 2041.89
AN19 VSS 4360.2 2041.89
AN2 VCCPGPPF 9038.59 1932.43
AN21 VSS 3864.9 2041.89
AN23 VCCSRAM_1P0 3369.6 2041.89
AN24 VSS 2874.3 2041.89
AN26 VCCIO 2379 2041.89
AN27 VSS 1883.7 2041.89
AN29 VCCSA 1388.4 2041.89
AN30 VCCSA 893.1 2041.89
AN32 VCC 397.8 2041.89
AN33 VSS -97.5 2041.89
AN35 VCCG1 -592.8 2041.89
AN36 VSS -1088.1 2041.89
AN38 VCCG1 -1583.4 2041.89
AN4 GPP_F8 / I2C4_SDA 8545.83 1932.43
AN40 VSS -2078.7 2041.89
AN41 VCC -2574 2041.89
AN43 VCCGT -3069.3 2041.89
AN44 VCCGT -3564.6 2041.89
AN46 VCCGT -4059.9 2041.89
AN47 VCCGT -4555.2 2041.89
AN49 VCCGT -5050.5 2041.89
AN50 VCCGT -5545.8 2041.89
AN51 VCCGT -6041.1 2041.89
AN53 DDR0_VREF_DQ -6574.79 1932.43
AN55 DDR1_DQ[3] / DDR0_DQ[19] DDR1_DQ[3] DDR0_DQ[19] -7067.55 1932.43
AN57 DDR1_DQ[2] / DDR0_DQ[18] DDR1_DQ[2] DDR0_DQ[18] -7560.31 1932.43
AN59 VSS -8053.07 1932.43
191
Non-Interleaved
(NIL)
AN6 GPP_F9 / I2C4_SCL 8053.07 1932.43
AN61 DDR0_DQ[12] -8545.83 1932.43
AN63 DDR0_DQ[13] -9038.59 1932.43
AN8 GPP_F20 / EMMC_DATA7 7560.31 1932.43
AP1 VCCPGPPF 9310.37 2254.5
AP11 GPP_F2 / I2S2_TXD 6821.17 2254.5
AP13 VCCPGPPG 6328.41 2259.58
AP3 GPP_F4 / I2C2_SDA 8792.21 2254.5
AP5 GPP_F6 / I2C3_SDA 8299.45 2254.5
AP54 VSS -6821.17 2254.5
AP56 DDR1_DQSN[0] / DDR0_DQSN[2] DDR1_DQSN[0] DDR0_DQSN[2] -7313.93 2254.5
AP58 DDR1_DQSP[0] / DDR0_DQSP[2] DDR1_DQSP[0] DDR0_DQSP[2] -7806.69 2254.5
AP60 DDR0_DQSP[1] -8299.45 2254.5
AP62 DDR0_DQSN[1] -8792.21 2254.5
AP64 VSS -9310.37 2254.5
AP7 GPP_F5 / I2C2_SCL 7806.69 2254.5
AP9 GPP_F14 / EMMC_DATA1 7313.93 2254.5
AR10 VSS 7067.55 2576.58
AR12 VSS 6574.79 2576.58
AR15 VSS 5846.1 2600.69
AR16 VCCPRIM_CORE 5350.8 2600.69
AR18 VSS 4855.5 2600.69
AR19 VCCRTC 4360.2 2600.69
AR2 VSS 9038.59 2576.58
AR21 VCCPRIM_1P0 3864.9 2600.69
AR23 VCCSRAM_1P0 3369.6 2600.69
AR24 VSSIO_SENSE 2874.3 2600.69
AR26 VCCIO 2379 2600.69
AR27 VSS 1883.7 2600.69
AR29 VCCSA 1388.4 2600.69
AR30 VSS 893.1 2600.69
AR32 VCC 397.8 2600.69
AR33 VSS -97.5 2600.69
AR35 VCCG1 -592.8 2600.69
AR36 VSS -1088.1 2600.69
AR38 VCCG1 -1583.4 2600.69
AR4 VSS 8545.83 2576.58
AR40 VSS -2078.7 2600.69
AR41 VCC -2574 2600.69

Non-Interleaved
(NIL)
AR43 VSS -3069.3 2600.69
AR44 VSS -3564.6 2600.69
AR46 VSS -4059.9 2600.69
AR47 VSS -4555.2 2600.69
AR49 VSS -5050.5 2600.69
AR50 VSS -5545.8 2600.69
AR51 VSS -6041.1 2600.69
AR53 DDR_VREF_CA -6574.79 2576.58
AR55 DDR1_DQ[1] / DDR0_DQ[17] DDR1_DQ[1] DDR0_DQ[17] -7067.55 2576.58
AR57 DDR1_DQ[4] / DDR0_DQ[20] DDR1_DQ[4] DDR0_DQ[20] -7560.31 2576.58
AR59 VSS -8053.07 2576.58
AR6 VSS 8053.07 2576.58
AR61 DDR0_DQ[11] -8545.83 2576.58
AR63 DDR0_DQ[14] -9038.59 2576.58
AR8 VSS 7560.31 2576.58
AT1 VCCPGPPA 9310.37 2898.65
AT11 GPP_F0 / I2S2_SCLK 6821.17 2898.65
AT13 GPP_F1 / I2S2_SFRM 6328.41 2903.73
AT15 VCCSPI 5846.1 3159.49
AT16 VCCPRIM_CORE 5350.8 3159.49
AT18 DCPRTC 4855.5 3159.49
AT19 VCCRTC 4360.2 3159.49
AT21 VCCPRIM_1P0 3864.9 3159.49
AT23 VCCHDA 3369.6 3159.49
AT24 VCCIO_SENSE 2874.3 3159.49
AT26 VCCIO 2379 3159.49
AT27 VSS 1883.7 3159.49
AT29 VCCSA_DDR 1388.4 3159.49
AT3 SPI0_MOSI 8792.21 2898.65
AT30 VCCSA_DDR 893.1 3159.49
AT32 VCC 397.8 3159.49
AT33 VCC -97.5 3159.49
AT35 VCC -592.8 3159.49
AT36 VCC -1088.1 3159.49
AT38 VCC -1583.4 3159.49
AT40 VCC -2078.7 3159.49
AT41 VCC -2574 3159.49
AT43 VCCGT -3069.3 3159.49
AT44 VCCGT -3564.6 3159.49
193
Non-Interleaved
(NIL)
AT46 VCCGT -4059.9 3159.49
AT47 VCCGT -4555.2 3159.49
AT49 VCCGT -5050.5 3159.49
AT5 GPP_F3 / I2S2_RXD 8299.45 2898.65
AT50 VCCGT -5545.8 3159.49
AT51 VCCGT -6041.1 3159.49
AT54 VSS -6821.17 2898.65
AT56 DDR1_DQ[0] / DDR0_DQ[16] DDR1_DQ[0] DDR0_DQ[16] -7313.93 2898.65
AT58 DDR1_DQ[5] / DDR0_DQ[21] DDR1_DQ[5] DDR0_DQ[21] -7806.69 2898.65
AT60 DDR0_DQ[10] -8299.45 2898.65
AT62 DDR0_DQ[15] -8792.21 2898.65
AT64 VDDQ -9310.37 2898.65
AT7 GPP_F7 / I2C3_SCL 7806.69 2898.65
AT9 GPP_F11/ I2C5_SCL / ISH_I2C2_SCL 7313.93 2898.65
AU10 SPI0_CLK 7067.55 3220.72
AU12 SPI0_MISO 6574.79 3220.72
AU2 VCCPGPPA 9038.59 3220.72
AU4 SPI0_CS0# 8545.83 3220.72
AU53 VSS -6574.79 3220.72
AU55 VSS -7067.55 3220.72
AU57 VSS -7560.31 3220.72
AU59 VSS -8053.07 3220.72
AU6 SPI0_CS1# 8053.07 3220.72
AU61 VSS -8545.83 3220.72
AU63 VSS -9038.59 3220.72
AU8 SPI0_CS2# 7560.31 3220.72
AV1 VCCPGPPB 9310.37 3542.79
AV11 SPI0_IO2 6821.17 3542.79
AV13 SPI0_IO3 6328.41 3542.79
AV15 VCCSPI 5881.62 3573.53
AV16 VSS 5475.22 3573.53
AV18 DCPRTC 4831.08 3573.53
AV20 VSS 4186.94 3573.53
AV22 VCCHDA 3542.79 3573.53
AV24 VSS 2898.65 3573.53
AV26 VCCIO_DDR 2254.5 3573.53
AV28 VCCIO_DDR 1610.36 3573.53
AV3 GPP_B14 / SPKR 8792.21 3542.79
AV30 VCCIO_DDR 966.22 3573.53

Non-Interleaved
(NIL)
AV32 VCCIO_DDR 322.07 3573.53
AV34 VCCIO_DDR -322.07 3573.53
AV36 VCCIO_DDR -966.22 3573.53
AV38 VCCIO_DDR -1610.36 3573.53
AV40 VCCIO_DDR -2254.5 3573.53
AV42 VCCIO_DDR -2898.65 3573.53
AV44 VCCIO_DDR -3542.79 3573.53
AV46 VCCIO_DDR -4186.94 3573.53
AV48 VCCIO_DDR -4831.08 3573.53
AV5 GPP_B8 / SRCCLKREQ3# 8299.45 3542.79
AV50 VCCIO_DDR -5475.22 3573.53
AV52 VSS -6119.37 3573.53
AV54 VSS -6821.17 3542.79
AV56 DDR0_MA[8] / DDR0_CAA[3] /DDR0_MA[8] DDR0_CAA[3] -7313.93 3542.79
AV58 DDR0_BA[2] / DDR0_CAA[5]/ DDR0_BG[0] DDR0_CAA[5] -7806.69 3542.79
AV60 DDR0_RAS# /DDR0_CAB[3]/DDR0_MA[16] DDR0_CAB[3] -8299.45 3542.79
AV62 DDR0_MA[0] /DDR0_CAB[9]/DDR0_MA[0] DDR0_CAB[9] -8792.21 3542.79
AV64 VDDQ -9310.37 3542.79
AW10 GPP_B16 / GSPI0_CLK 7067.55 3864.86
AW12 GPP_B20 / GSPI1_CLK 6574.79 3864.86
AW17 VSS 5153.15 3819.91
AW19 VSS 4509.01 3819.91
AW2 VCCPGPPB 9038.59 3864.86
AW21 VSS 3864.86 3819.91
AW23 VSS 3220.72 3819.91
AW25 VSS 2576.58 3819.91
AW27 VCCIO_DDR 1932.43 3819.91
AW29 VCCIO_DDR 1288.29 3819.91
AW31 VCCIO_DDR 644.14 3819.91
AW33 VCCIO_DDR 0 3819.91
AW35 VCCIO_DDR -644.14 3819.91
AW37 VCCIO_DDR -1288.29 3819.91
AW39 VCCIO_DDR -1932.43 3819.91
AW4 GPP_B21 / GSPI1_MISO 8545.83 3864.86
AW41 VCCIO_DDR -2576.58 3819.91
AW43 VCCIO_DDR -3220.72 3819.91
AW45 VCCIO_DDR -3864.86 3819.91
195
Non-Interleaved
(NIL)
AW47 VCCIO_DDR -4509.01 3819.91
AW49 VCCIO_DDR -5153.15 3819.91
AW51 VCCIO_DDR -5797.3 3819.91
AW53 DDR1_VREF_DQ -6441.44 3827.53
AW55 DDR0_MA[9]/DDR0_CAA[1]/DDR0_MA[9] DDR0_CAA[1] -7067.55 3864.86
AW6 GPP_B17 / GSPI0_MISO 8053.07 3864.86
AW61 DDR0_CKE[3] -8545.83 3864.86
AW63 DDR0_CS#[0] -9038.59 3864.86
AW8 GPP_B22 / GSPI1_MOSI 7560.31 3864.86
AY14 GPD4 / SLP_S3# 5994.4 3959.86
AY16 VSS 5475.22 4066.29
AY18 RSVD_TP 4831.08 4066.29
AY20 RSVD 4186.94 4066.29
AY22 TP6 3542.79 4066.29
AY24 VSS 2898.65 4066.29
AY26 VSS 2254.5 4066.29
AY28 VSS 1610.36 4066.29
AY30 VSS 966.22 4066.29
AY32 VSS 322.07 4066.29
AY34 VSS -322.07 4066.29
AY36 VSS -966.22 4066.29
AY38 VSS -1610.36 4066.29
AY40 VSS -2254.5 4066.29
AY42 VSS -2898.65 4066.29
AY44 VSS -3542.79 4066.29
AY46 VSS -4186.94 4066.29
AY48 VSS -4831.08 4066.29
AY50 VSS -5475.22 4066.29
AY52 VSS -6119.37 4066.29
B10 PCIE_RCOMPP 7085.58 -7269.23
B12 CL_RST# 6441.44 -7269.23
B15 USB3_2_RXN / SSIC_RXN 5797.3 -7269.23
B17 USB3_4_RXN 5153.15 -7269.23
B19 PCIE2_RXN / USB3_6_RXN 4509.01 -7269.23
B21 PCIE4_RXN 3864.86 -7269.23
B23 PCIE6_RXN 3220.72 -7269.23
B25 PCIE8_RXN / SATA1A_RXN 2576.58 -7269.23

Non-Interleaved
(NIL)
B27 PCIE10_RXN 1932.43 -7269.23
B29 CSI2_DP4 1288.29 -7269.23
B3 RSVD 8881.11 -7111.75
B31 CSI2_CLKP1 644.14 -7269.23
B33 CSI2_DP7 0 -7269.23
B35 CSI2_DP8 -644.14 -7269.23
B37 CSI2_DP10 -1288.29 -7269.23
B39 CSI2_CLKP3 -1932.43 -7269.23
B4 RSVD 8451.85 -7111.75
B41 DDI2_TXN[2] -2576.58 -7269.23
B43 DDI2_TXN[3] -3220.72 -7269.23
B45 DDI1_TXN[2] -3864.86 -7269.23
B47 DDI1_TXN[3] -4509.01 -7269.23
B49 JTAGX -5153.15 -7269.23
B51 PCH_JTAG_TDO -5797.3 -7269.23
B53 PCH_JTAG_TCK -6441.44 -7269.23
B55 PROC_PREQ# -7085.58 -7269.23
B58 VIDALERT# -7777.48 -7178.04
B6 eDP_BKLCTL 8022.59 -7111.75
B61 VCCST_PWRGD -8479.79 -7111.75
B62 SKTOCC# -8881.11 -7111.75
B64 VCC -9310.37 -7086.35
B8 GPP_E12 / USB2_OC3# 7593.33 -7111.75
BA1 VSS 9310.37 4186.94
BA11 VSS 6821.17 4186.94
BA13 GPP_B0 / CORE_VID0 6328.41 4186.94
BA15 GPD8 / SUSCLK 5797.3 4312.67
BA17 RSVD_TP 5153.15 4312.67
BA19 RSVD 4509.01 4312.67
BA21 RSVD 3864.86 4312.67
BA23 TP5 3220.72 4312.67
BA25 VDDQ 2576.58 4312.67
BA27 VDDQ 1932.43 4312.67
BA29 VDDQ 1288.29 4312.67
BA3 VSS 8792.21 4186.94
BA31 VDDQ 644.14 4312.67
BA33 VDDQ 0 4312.67
BA35 VDDQ -644.14 4312.67
BA37 VDDQ -1288.29 4312.67
197
Non-Interleaved
(NIL)
BA39 VDDQC -1932.43 4312.67
BA41 VDDQ -2576.58 4312.67
BA43 VDDQ -3220.72 4312.67
BA45 VDDQ -3864.86 4312.67
BA47 VDDQ -4509.01 4312.67
BA49 VDDQ -5153.15 4312.67
BA5 VSS 8299.45 4186.94
BA51 VDDQ -5797.3 4312.67
BA53 VSS -6441.44 4320.29
BA56 DDR0_MA[12]/DDR0_CAA[6]/DDR0_MA[12] DDR0_CAA[6] -7313.93 4186.94
BA58 VSS -7806.69 4186.94
BA60 DDR0_CKN[1] -8299.45 4186.94
BA62 DDR0_CKP[1] -8792.21 4186.94
BA64 VSS -9310.37 4186.94
BA7 VSS 7806.69 4186.94
BA9 VSS 7313.93 4186.94
BB10 GPP_B5 / SRCCLKREQ0# 7067.55 4509.01
BB12 GPP_B1 / CORE_VID1 6548.63 4559.05
BB14 RSVD 6119.37 4559.05
BB16 GPD7 / RSVD 5475.22 4559.05
BB18 RSVD 4831.08 4559.05
BB2 GPP_B19 / GSPI1_CS# 9038.59 4509.01
BB20 VSS 4186.94 4559.05
BB22 VSS 3542.79 4559.05
BB24 VSS 2898.65 4559.05
BB26 VSS 2254.5 4559.05
BB28 VSS 1610.36 4559.05
BB30 VSS 966.22 4559.05
BB32 VSS 322.07 4559.05
BB34 VSS -322.07 4559.05
BB36 VSS -966.22 4559.05
BB38 VSS -1610.36 4559.05
BB4 GPP_B18 / GSPI0_MOSI 8545.83 4509.01
BB40 VSS -2254.5 4559.05
BB42 VSS -2898.65 4559.05
BB44 VSS -3542.79 4559.05
BB46 VSS -4186.94 4559.05
BB48 VSS -4831.08 4559.05
BB50 VSS -5475.22 4559.05

Non-Interleaved
(NIL)
BB52 VSS -6119.37 4559.05
BB54 VSS -6763.51 4559.05
BB57 DDR0_CKE[0] -7560.31 4509.01
BB59 VSS -8053.07 4509.01
BB6 GPP_B23 / SML1ALERT# / PCHHOT# 8053.07 4509.01
BB61 DDR0_MA[2] /DDR0_CAB[5]/DDR0_MA[2] DDR0_CAB[5] -8545.83 4509.01
BB63 DDR0_MA[3] -9038.59 4509.01
BB8 GPP_B13 / PLTRST# 7560.31 4509.01
BC1 EMMC_RCOMP 9310.37 4831.08
BC11 GPP_B4 / CPU_GP3 6695.44 4978.4
BC15 GPD11 / LANPHYPC 5797.3 4805.43
BC17 VSS 5153.15 4805.43
BC19 RSVD 4509.01 4805.43
BC21 DDR1_DQ[62] 3864.86 4805.43
BC23 DDR1_DQ[59] 3220.72 4805.43
BC25 DDR1_DQ[55] 2576.58 4805.43
BC27 DDR1_DQ[51] 1932.43 4805.43
BC29 VSS 1288.29 4805.43
BC3 GPP_B15 / GSPI0_CS# 8792.21 4831.08
BC31 DDR1_MA[1] /DDR1_CAB[8]/DDR1_MA[1] DDR1_CAB[8] 644.14 4805.43
BC33 DDR1_BA[0] /DDR1_CAB[4]/DDR1_BA[0] DDR1_CAB[4] 0 4805.43
BC35 DDR1_ODT[0] -644.14 4805.43
BC37 DDR1_WE#/DDR1_CAB[2]/DDR1_MA[14] DDR1_CAB[2] -1288.29 4805.43
BC39 DDR0_DQ[33] / DDR1_DQ[1] DDR0_DQ[33] DDR1_DQ[1] -1932.43 4805.43
BC47 VSS -4509.01 4805.43
BC5 GPP_B10 / SRCCLKREQ5# 8299.45 4831.08
BC58 DDR0_CKE[1] -7806.69 4831.08
BC60 DDR0_CKP[0] -8299.45 4831.08
BC62 DDR0_CKN[0] -8792.21 4831.08
BC64 DDR_RCOMP[2] -9310.37 4831.08
BC7 GPP_B11 / EXT_PWR_GATE# 7806.69 4831.08
BC9 GPP_B12 / SLP_S0# 7313.93 4831.08
199
Non-Interleaved
(NIL)
BD10 GPP_B7 / SRCCLKREQ2# 7067.55 5148.58
BD14 GPD1 / ACPRESENT 6119.37 5051.81
BD16 GPD0 / BATLOW# 5475.22 5051.81
BD18 RSVD 4831.08 5051.81
BD2 GPP_A19 / ISH_GP1 9038.59 5153.15
BD20 VSS 4186.94 5051.81
BD22 DDR1_DQSP[7] 3542.79 5051.81
BD24 DDR1_DQ[57] 2898.65 5051.81
BD26 DDR1_DQSN[6] 2254.5 5051.81
BD28 DDR1_DQ[49] 1610.36 5051.81
BD30 DDR1_PAR 966.22 5051.81
BD32 DDR1_CKN[1] 322.07 5051.81
BD34 DDR1_ALERT# -322.07 5051.81
BD36 DDR1_BA[1] /DDR1_CAB[6]/DDR1_BA[1] DDR1_CAB[6] -966.22 5051.81
BD38 VSS -1610.36 5051.81
BD4 GPP_A23 / ISH_GP5 8545.83 5153.15
BD40 DDR0_DQSN[4] / DDR1_DQSN[0] DDR0_DQSN[4] DDR1_DQSN[0] -2254.5 5051.81
BD42 DDR0_DQ[37] / DDR1_DQ[5] DDR0_DQ[37] DDR1_DQ[5] -2898.65 5051.81
BD50 DDR0_DQSP[3] / DDR0_DQSP[5] DDR0_DQSP[3] DDR0_DQSP[5] -5475.22 5051.81
BD56 VSS -7407.66 5051.81
DDR0_MA[11] /DDR0_CAA[7] / DDR0_CAA[7] -8133.08 5237.48

BD59
DDR0_MA[11]
BD6 GPP_B2 / VRALERT# 8053.07 5153.15
BD61 DDR0_MA[15] /DDR0_CAA[8]/DDR0_ACT# DDR0_CAA[8] -8545.83 5153.15
BD63 VSS -9038.59 5153.15
BD8 GPP_B3 / CPU_GP2 7560.31 5153.15
BE12 VSS 6441.44 5298.19
BE15 GPD2 / LAN_WAKE# 5797.3 5298.19
BE17 GPD6 / SLP_A# 5153.15 5298.19
BE19 RSVD 4509.01 5298.19
BE21 DDR1_DQ[63] 3864.86 5298.19
BE23 DDR1_DQ[60] 3220.72 5298.19
BE25 DDR1_DQ[54] 2576.58 5298.19
BE27 DDR1_DQ[53] 1932.43 5298.19

Non-Interleaved
(NIL)
BE29 VSS 1288.29 5298.19
BE31 VSS 644.14 5298.19
BE33 VSS 0 5298.19
BE35 VSS -644.14 5298.19
BE37 DDR1_CAS#/DDR1_CAB[1]/DDR1_MA[15] DDR1_CAB[1] -1288.29 5298.19
BE39 DDR0_DQ[35] / DDR1_DQ[3] DDR0_DQ[35] DDR1_DQ[3] -1932.43 5298.19
BE47 VSS -4509.01 5298.19
BE57 DDR0_CKE[2] -7729.73 5298.19
BF1 SD_RCOMP 9310.37 5475.22
BF11 GPP_A18 / ISH_GP0 6763.51 5544.57
BF14 GPD3 / PWRBTN# 6119.37 5544.57
BF16 GPD5 / SLP_S4# 5475.22 5544.57
BF18 RSVD 4831.08 5544.57
BF20 VSS 4186.94 5544.57
BF22 DDR1_DQSN[7] 3542.79 5544.57
BF24 DDR1_DQ[56] 2898.65 5544.57
BF26 DDR1_DQSP[6] 2254.5 5544.57
BF28 DDR1_DQ[48] 1610.36 5544.57
BF3 GPP_A7 / PIRQA# 8792.21 5475.22
BF30 DDR1_MA[2] /DDR1_CAB[5]/DDR1_MA[2] DDR1_CAB[5] 966.22 5544.57
BF32 DDR1_CKP[1] 322.07 5544.57
BF34 DDR1_RAS# /DDR1_CAB[3]/DDR1_MA[16] DDR1_CAB[3] -322.07 5544.57
BF36 DDR1_MA[0] /DDR1_CAB[9]/DDR1_MA[0] DDR1_CAB[9] -966.22 5544.57
BF38 VSS -1610.36 5544.57
BF40 DDR0_DQSP[4] / DDR1_DQSP[0] DDR0_DQSP[4] DDR1_DQSP[0] -2254.5 5544.57
BF42 DDR0_DQ[36] / DDR1_DQ[4] DDR0_DQ[36] DDR1_DQ[4] -2898.65 5544.57
BF5 GPP_A10 / CLKOUT_LPC1 8299.45 5475.22
BF50 DDR0_DQSN[3] / DDR0_DQSN[5] DDR0_DQSN[3] DDR0_DQSN[5] -5475.22 5544.57
201
Non-Interleaved
(NIL)
BF56 VSS -7407.66 5544.57
BF59 VSS -8163.56 5638.8
BF62 DDR0_MA[6] /DDR0_CAA[2] /DDR0_MA[6] DDR0_CAA[2] -8792.21 5475.22
BF64 DDR_RCOMP[0] -9310.37 5475.22
BF7 GPP_A11 /PME# 7806.69 5475.22
BF9 GPP_A15 / SUSACK# 7308.85 5480.3
BG10 GPP_A3 / LAD2 / ESPI_IO2 7170.42 5890.26
BG12 VSS 6441.44 5790.95
BG15 VSS 5797.3 5790.95
BG17 VSS 5153.15 5790.95
BG19 INTRUDER# 4509.01 5790.95
BG2 VSS 9038.59 5797.3
BG21 DDR1_DQ[58] 3864.86 5790.95
BG23 DDR1_DQ[61] 3220.72 5790.95
BG25 DDR1_DQ[50] 2576.58 5790.95
BG27 DDR1_DQ[52] 1932.43 5790.95
BG29 VSS 1288.29 5790.95
BG31 DDR1_MA[7] /DDR1_CAA[4] /DDR1_MA[7] DDR1_CAA[4] 644.14 5790.95
BG33 DDR1_CKE[2] 0 5790.95
DDR1_MA[10] /DDR1_CAB[7]/ DDR1_CAB[7] -644.14 5790.95

BG35
DDR1_MA[10]
DDR1_MA[13] /DDR1_CAB[0] / DDR1_CAB[0] -1288.29 5790.95
BG37
DDR1_MA[13]
BG39 DDR0_DQ[38] / DDR1_DQ[6] DDR0_DQ[38] DDR1_DQ[6] -1932.43 5790.95
BG4 VSS 8545.83 5797.3
BG47 RSVD_TP -4509.01 5790.95
BG57 DDR0_ALERT# -7729.73 5790.95
BG6 VSS 8053.07 5797.3
BG61 DDR0_MA[14] /DDR0_CAA[9]/ DDR0_BG[1] DDR0_CAA[9] -8545.83 5797.3
BG63 VSS -9038.59 5797.3
BG8 VSS 7560.31 5797.3
BH11 GPP_A8 / CLKRUN# 6763.51 6037.33

Non-Interleaved
(NIL)
BH14 GPD10 / SLP_S5# 6119.37 6037.33
BH16 GPD9 / SLP_WLAN# 5475.22 6037.33
BH18 SRTCRST# 4831.08 6037.33
BH20 VSS 4186.94 6037.33
BH22 VSS 3542.79 6037.33
BH24 VSS 2898.65 6037.33
BH26 VSS 2254.5 6037.33
BH28 VSS 1610.36 6037.33
BH30 DDR1_CKE[3] 966.22 6037.33
BH32 VSS 322.07 6037.33
BH34 VSS -322.07 6037.33
BH36 VSS -966.22 6037.33
BH38 VSS -1610.36 6037.33
BH40 VSS -2254.5 6037.33
BH42 VSS -2898.65 6037.33
BH44 VSS -3542.79 6037.33
BH46 VSS -4186.94 6037.33
BH48 VSS -4831.08 6037.33
BH50 VSS -5475.22 6037.33
BH52 VSS -6119.37 6037.33
BH54 VSS -6763.51 6037.33
BH56 VSS -7407.66 6037.33
BH59 VSS -8051.8 6037.33
BJ1 GPP_A20 / ISH_GP2 9310.37 6177.03
BJ10 GPP_A9 / CLKOUT_LPC0 / ESPI_CLK 7085.58 6283.71
BJ12 RSMRST# 6441.44 6283.71
BJ15 TP1 5797.3 6283.71
BJ17 TP2 5153.15 6283.71
BJ19 HDA_SYNC / I2S0_SFRM 4509.01 6283.71
BJ21 DDR1_DQ[46] / DDR1_DQ[30] DDR1_DQ[46] DDR1_DQ[30] 3864.86 6283.71
BJ29 VSS 1288.29 6283.71
BJ3 GPP_A22 / ISH_GP4 8881.11 6253.23
BJ31 DDR1_MA[3] 644.14 6283.71
BJ33 DDR1_CS#[1] 0 6283.71

BJ35
DDR1_MA[11]
203
Non-Interleaved
(NIL)

BJ37
DDR1_MA[12]
BJ39 DDR0_DQ[63] / DDR1_DQ[47] DDR0_DQ[63] DDR1_DQ[47] -1932.43 6283.71
Sx_EXIT_HOLDOFF# / GPP_A12 / 8451.85 6253.23

BJ4
BM_BUSY#/ISH_GP6
BJ47 VSS -4509.01 6283.71
BJ57 DDR0_CS#[1] -7729.73 6283.71
BJ6 GPP_A14 / SUS_STAT#/ ESPI_RESET# 8022.59 6253.23
BJ61 DDR0_WE#/DDR0_CAB[2]/DDR0_MA[14] DDR0_CAB[2] -8451.85 6253.23
BJ62 VSS -8881.11 6253.23
BJ64 DDR_RCOMP[1] -9310.37 6177.03
BJ8 GPP_A2 / LAD1 / ESPI_IO1 7593.33 6253.23
BK11 GPP_A1 / LAD0 / ESPI_IO0 6763.51 6530.09
BK14 I2S1_TXD 6119.37 6530.09
BK16 HDA_SDO / I2S0_TXD 5475.22 6530.09
BK18 HDA_BLK / I2S0_SCLK 4831.08 6530.09
BK20 VSS 4186.94 6530.09
BK22 DDR1_DQSP[5] / DDR1_DQSP[3] DDR1_DQSP[5] DDR1_DQSP[3] 3542.79 6530.09
BK24 DDR1_DQ[41] / DDR1_DQ[25] DDR1_DQ[41] DDR1_DQ[25] 2898.65 6530.09
BK26 DDR1_DQSN[4] / DDR1_DQSN[2] DDR1_DQSN[4] DDR1_DQSN[2] 2254.5 6530.09
BK28 DDR1_DQ[34] / DDR1_DQ[18] DDR1_DQ[34] DDR1_DQ[18] 1610.36 6530.09
BK30 DDR1_MA[5] /DDR1_CAA[0] /DDR1_MA[5] DDR1_CAA[0] 966.22 6530.09
BK32 DDR1_CKE[1] 322.07 6530.09
BK34 DDR1_MA[4] -322.07 6530.09
BK36 DDR1_CKN[0] -966.22 6530.09
BK38 VSS -1610.36 6530.09
BK40 DDR0_DQSP[7] / DDR1_DQSP[5] DDR0_DQSP[7] DDR1_DQSP[5] -2254.5 6530.09
BK42 DDR0_DQ[60] / DDR1_DQ[44] DDR0_DQ[60] DDR1_DQ[44] -2898.65 6530.09
BK44 DDR0_DQSN[6] / DDR1_DQSN[4] DDR0_DQSN[6] DDR1_DQSN[4] -3542.79 6530.09
BK50 DDR1_DQSN[3] / DDR0_DQSN[7] DDR1_DQSN[3] DDR0_DQSN[7] -5475.22 6530.09

Non-Interleaved
(NIL)
BK54 DDR1_DQSP[2] / DDR0_DQSP[6] DDR1_DQSP[2] DDR0_DQSP[6] -6763.51 6530.09
BK56 VSS -7407.66 6530.09
DDR0_MA[13] /DDR0_CAB[0] / DDR0_CAB[0] -8102.6 6453.89

BK59
DDR0_MA[13]
BL1 VSS 9310.37 6631.69
BL10 GPP_A0 / RCIN# 7085.58 6776.47
BL12 I2S1_SFRM 6441.44 6776.47
BL15 HDA_SDI0/ I2S0_RXD 5797.3 6776.47
BL17 HDA_SDI1 / I2S1_RXD 5153.15 6776.47
BL19 HDA_RST# /I2S1_SCLK 4509.01 6776.47
BL21 DDR1_DQ[47] / DDR1_DQ[31] DDR1_DQ[47] DDR1_DQ[31] 3864.86 6776.47
BL29 VSS 1288.29 6776.47
BL3 GPP_A21 / ISH_GP3 8881.11 6682.49
BL31 VSS 644.14 6776.47
BL33 VSS 0 6776.47
BL35 VSS -644.14 6776.47
BL37 DDR1_MA[8] / DDR1_CAA[3] /DDR1_MA[8] DDR1_CAA[3] -1288.29 6776.47
BL39 DDR0_DQ[62] / DDR1_DQ[46] DDR0_DQ[62] DDR1_DQ[46] -1932.43 6776.47
BL4 GPP_A17 / SD_PWR_EN# / ISH_GP7 8451.85 6682.49
BL47 VSS -4509.01 6776.47
BL57 DDR0_MA[4] -7729.73 6768.85
BL6 GPP_A13 / SUSWARN# / SUSPWRDNACK 8022.59 6682.49
BL61 DDR0_BA[1] /DDR0_CAB[6]/DDR0_BA[1] DDR0_CAB[6] -8451.85 6682.49
BL62 DDR0_CAS#/DDR0_CAB[1]/DDR0_MA[15] DDR0_CAB[1] -8881.11 6682.49
BL64 RSVD_TP -9310.37 6631.69
BL8 VSS 7593.33 6682.49
BM11 VSS 6763.51 7022.85
BM14 VSS 6119.37 7022.85
BM16 VSS 5475.22 7022.85
205
Non-Interleaved
(NIL)
BM18 VSS 4831.08 7022.85
BM20 VSS 4186.94 7022.85
BM22 DDR1_DQSN[5] / DDR1_DQSN[3] DDR1_DQSN[5] DDR1_DQSN[3] 3542.79 7022.85
BM24 DDR1_DQ[40] / DDR1_DQ[24] DDR1_DQ[40] DDR1_DQ[24] 2898.65 7022.85
BM26 DDR1_DQSP[4] / DDR1_DQSP[2] DDR1_DQSP[4] DDR1_DQSP[2] 2254.5 7022.85
BM28 DDR1_DQ[32] / DDR1_DQ[16] DDR1_DQ[32] DDR1_DQ[16] 1610.36 7022.85
BM30 DDR1_CS#[0] 966.22 7022.85
BM32 DDR1_MA[6] /DDR1_CAA[2] /DDR1_MA[6] DDR1_CAA[2] 322.07 7022.85
BM34 DDR1_MA[15] /DDR1_CAA[8]/DDR1_ACT# DDR1_CAA[8] -322.07 7022.85
BM36 DDR1_CKP[0] -966.22 7022.85
BM38 VSS -1610.36 7022.85
BM40 DDR0_DQSN[7] / DDR1_DQSN[5] DDR0_DQSN[7] DDR1_DQSN[5] -2254.5 7022.85
BM42 DDR0_DQ[56] / DDR1_DQ[40] DDR0_DQ[56] DDR1_DQ[40] -2898.65 7022.85
BM44 DDR0_DQSP[6] / DDR1_DQSP[4] DDR0_DQSP[6] DDR1_DQSP[4] -3542.79 7022.85
BM50 DDR1_DQSP[3] / DDR0_DQSP[7] DDR1_DQSP[3] DDR0_DQSP[7] -5475.22 7022.85
BM54 DDR1_DQSN[2] / DDR0_DQSN[6] DDR1_DQSN[2] DDR0_DQSN[6] -6763.51 7022.85
BM56 DDR0_PAR -7407.66 7022.85
DDR0_MA[10] /DDR0_CAB[7]/ DDR0_CAB[7] -8098.79 6923.28

BM59
DDR0_MA[10]
BN1 TP4 9310.37 7086.35
BN10 SLP_SUS# 7085.58 7269.23
BN12 RTCRST# 6441.44 7269.23
BN15 DSW_PWROK 5797.3 7269.23
BN17 PROC_POPIRCOMP 5153.15 7269.23
BN19 RTCX1 4509.01 7269.23
BN21 DDR1_DQ[42] / DDR1_DQ[26] DDR1_DQ[42] DDR1_DQ[26] 3864.86 7269.23
BN29 VSS 1288.29 7269.23
BN3 RSVD 8881.11 7111.75
BN31 DDR1_MA[9] /DDR1_CAA[1] /DDR1_MA[9] DDR1_CAA[1] 644.14 7269.23
BN33 DDR1_CKE[0] 0 7269.23
BN35 DDR1_MA[14] /DDR1_CAA[9]/ DDR1_BG[1] DDR1_CAA[9] -644.14 7269.23
BN37 DDR1_BA[2] /DDR1_CAA[5]/ DDR1_BG[0] DDR1_CAA[5] -1288.29 7269.23
BN39 DDR0_DQ[59] / DDR1_DQ[43] DDR0_DQ[59] DDR1_DQ[43] -1932.43 7269.23

Non-Interleaved
(NIL)
BN4 GPP_A16 / SD_1P8_SEL 8451.85 7111.75
BN47 DDR_VTT_CNTL -4509.01 7269.23
BN58 DDR0_MA[1] /DDR0_CAB[8]/DDR0_MA[1] DDR0_CAB[8] -7777.48 7178.04
BN6 VSS 8022.59 7111.75
BN61 DDR0_ODT[0] -8451.85 7111.75
BN62 DDR0_BA[0] /DDR0_CAB[4]/DDR0_BA[0] DDR0_CAB[4] -8881.11 7111.75
BN64 VDDQ -9310.37 7086.35
BN8 GPP_A6 / SERIRQ 7593.33 7111.75
BP1 VSS 9310.37 7541.01
BP11 SLP_LAN# 6763.51 7541.01
BP14 PCH_PWROK 6119.37 7541.01
BP16 PCH_OPIRCOMP 5475.22 7541.01
BP18 RTCX2 4831.08 7541.01
BP20 DRAM_RESET# 4186.94 7541.01
BP22 VSS 3542.79 7541.01
BP24 VDDQ 2898.65 7541.01
BP26 VDDQ 2254.5 7541.01
BP28 VSS 1610.36 7541.01
BP3 RSVD 8855.71 7541.01
BP30 VSS 966.22 7541.01
BP32 VDDQ 322.07 7541.01
BP34 VDDQ -322.07 7541.01
BP36 VSS -966.22 7541.01
BP38 VSS -1610.36 7541.01
BP40 VDDQ -2254.5 7541.01
BP42 VDDQ -2898.65 7541.01
BP44 VSS -3542.79 7541.01
BP46 VSS -4186.94 7541.01
BP48 VDDQ -4831.08 7541.01
BP5 GPP_A4 / LAD3 / ESPI_IO3 8401.05 7541.01
BP50 VDDQ -5475.22 7541.01
BP52 VSS -6119.37 7541.01
207
Non-Interleaved
(NIL)
BP54 VSS -6763.51 7541.01
BP56 VDDQ -7407.66 7541.01
BP58 VDDQ -7946.39 7541.01
BP60 VSS -8401.05 7541.01
BP62 VSS -8855.71 7541.01
BP64 VDDQ -9310.37 7541.01
BP7 GPP_A5 / LFRAME# / ESPI_CS# 7946.39 7541.01
BP9 WAKE# 7407.66 7541.01
C11 GPP_E13 / DDPB_HPD0 6763.51 -7022.85
C14 VSS 6119.37 -7022.85
C16 USB3_1_RXN 5475.22 -7022.85
C18 USB3_3_RXN 4831.08 -7022.85
C20 PCIE1_RXN / USB3_5_RXN 4186.94 -7022.85
C22 PCIE3_RXN 3542.79 -7022.85
C24 PCIE5_RXN 2898.65 -7022.85
C26 PCIE7_RXN / SATA0_RXN 2254.5 -7022.85
C28 PCIE9_RXN 1610.36 -7022.85
C30 CSI2_DN6 966.22 -7022.85
C32 CSI2_DN5 322.07 -7022.85
C34 CSI2_CLKN2 -322.07 -7022.85
C36 CSI2_DN9 -966.22 -7022.85
C38 CSI2_DN11 -1610.36 -7022.85
C40 VSS -2254.5 -7022.85
C42 DDI2_TXP[0] -2898.65 -7022.85
C44 DDI2_TXP[1] -3542.79 -7022.85
C46 DDI1_TXP[0] -4186.94 -7022.85
C48 DDI1_TXN[1] -4831.08 -7022.85
C50 PCH_JTAG_TDI -5475.22 -7022.85
C52 PCH_TRST# -6119.37 -7022.85
C54 PROC_TDI -6763.51 -7022.85
C56 CFG[6] -7403.09 -7022.85
C59 PROC_TMS -8110.22 -6918.2
D1 VSS 9310.37 -6631.69
D10 VSS 7085.58 -6776.47
D12 CL_DATA 6441.44 -6776.47
D15 USB3_2_RXP / SSIC_RXP 5797.3 -6776.47
D17 USB3_4_RXP 5153.15 -6776.47
D19 PCIE2_RXP / USB3_6_RXP 4509.01 -6776.47
D21 PCIE4_RXP 3864.86 -6776.47

Non-Interleaved
(NIL)
D23 PCIE6_RXP 3220.72 -6776.47
D25 PCIE8_RXP / SATA1A_RXP 2576.58 -6776.47
D27 PCIE10_RXP 1932.43 -6776.47
D29 CSI2_DN4 1288.29 -6776.47
D3 eDP_VDDEN 8881.11 -6682.49
D31 CSI2_CLKN1 644.14 -6776.47
D33 CSI2_DN7 0 -6776.47
D35 CSI2_DN8 -644.14 -6776.47
D37 CSI2_DN10 -1288.29 -6776.47
D39 CSI2_CLKN3 -1932.43 -6776.47
D4 eDP_BKLEN 8451.85 -6682.49
D41 DDI2_TXP[2] -2576.58 -6776.47
D43 DDI2_TXP[3] -3220.72 -6776.47
D45 DDI1_TXP[2] -3864.86 -6776.47
D47 DDI1_TXP[3] -4509.01 -6776.47
D49 RSVD -5153.15 -6776.47
D51 PROC_PRDY# -5797.3 -6776.47
D53 PROC_TCK -6441.44 -6776.47
D55 CFG[5] -7149.08 -6687.57
D57 CFG[10] -7724.65 -6756.15
D6 VSS 8022.59 -6682.49
D61 CFG[8] -8451.85 -6682.49
D62 VSS -8881.11 -6682.49
D64 VCC -9310.37 -6631.69
D8 VSS 7593.33 -6682.49
E11 GPP_E3 / CPU_GP0 6763.51 -6530.09
E14 VSS 6119.37 -6530.09
E16 VSS 5475.22 -6530.09
E18 VSS 4831.08 -6530.09
E20 VSS 4186.94 -6530.09
E22 VSS 3542.79 -6530.09
E24 VSS 2898.65 -6530.09
E26 VSS 2254.5 -6530.09
E28 VSS 1610.36 -6530.09
E30 VSS 966.22 -6530.09
E32 VSS 322.07 -6530.09
E34 VSS -322.07 -6530.09
E36 VSS -966.22 -6530.09
E38 VSS -1610.36 -6530.09
209
Non-Interleaved
(NIL)
E40 VSS -2254.5 -6530.09
E42 VSS -2898.65 -6530.09
E44 VSS -3542.79 -6530.09
E46 VSS -4186.94 -6530.09
E48 VSS -4831.08 -6530.09
E50 VSS -5475.22 -6530.09
E52 VSS -6119.37 -6530.09
E54 VSS -6763.51 -6530.09
E56 VSS -7509.26 -6403.09
E59 VSS -8088.88 -6413.25
F1 RSVD 9310.37 -6177.03
F10 GPP_E4 / DEVSLP0 7085.58 -6283.71
F12 CL_CLK 6441.44 -6283.71
F15 USB3_2_TXN / SSIC_TXN 5797.3 -6283.71
F17 USB3_4_TXN 5153.15 -6283.71
F19 PCIE2_TXN / USB3_6_TXN 4509.01 -6283.71
F21 PCIE4_TXN 3864.86 -6283.71
F23 PCIE6_TXN 3220.72 -6283.71
F25 PCIE8_TXN / SATA1A_TXN 2576.58 -6283.71
F27 PCIE10_TXN 1932.43 -6283.71
F29 CSI2_DP0 1288.29 -6283.71
F3 RSVD 8881.11 -6253.23
F31 CSI2_CLKP0 644.14 -6283.71
F33 CSI2_DN1 0 -6283.71
F35 CLKOUT_PCIE_P1 -644.14 -6283.71
F37 CLKOUT_PCIE_P4 -1288.29 -6283.71
F39 CLKOUT_PCIE_P5 -1932.43 -6283.71
F4 GPP_E21 / DDPC_CTRLDATA 8451.85 -6253.23
F41 DDI1_AUXP -2576.58 -6283.71
F43 EDP_TXP[3] -3220.72 -6283.71
F45 EDP_TXP[0] -3864.86 -6283.71
F47 PROC_TRST# -4509.01 -6283.71
F49 PECI -5153.15 -6283.71
F51 BPM#[2] -5797.3 -6283.71
F53 CFG[1] -6441.44 -6283.71
F55 CFG[7] -7085.58 -6283.71
F6 GPP_E16 / DDPE_HPD3 8022.59 -6253.23
F61 CFG[11] -8477.25 -6253.23
F62 VSS -8881.11 -6253.23

Non-Interleaved
(NIL)
F64 VCC -9310.37 -6171.03
F8 GPP_E11 / USB2_OC2# 7593.33 -6253.23
G11 GPP_E0 / SATAXPCIE0 / SATAGP0 6763.51 -6037.33
G14 VSS 6119.37 -6037.33
G16 USB3_1_TXN 5475.22 -6037.33
G18 USB3_3_TXN 4831.08 -6037.33
G20 PCIE1_TXN / USB3_5_TXN 4186.94 -6037.33
G22 PCIE3_TXN 3542.79 -6037.33
G24 PCIE5_TXN 2898.65 -6037.33
G26 PCIE7_TXN / SATA0_TXN 2254.5 -6037.33
G28 PCIE9_TXN 1610.36 -6037.33
G30 CSI2_DP2 966.22 -6037.33
G32 CSI2_DP3 322.07 -6037.33
G34 CLKOUT_ITPXDP_P -322.07 -6037.33
G36 CLKOUT_PCIE_P2 -966.22 -6037.33
G38 CLKOUT_PCIE_P3 -1610.36 -6037.33
G40 DDI2_AUXP -2254.5 -6037.33
G42 EDP_AUXP -2898.65 -6037.33
G44 EDP_TXP[1] -3542.79 -6037.33
G46 EDP_TXP[2] -4186.94 -6037.33
G48 PROC_TDO -4831.08 -6037.33
G50 BPM#[3] -5475.22 -6037.33
G52 CFG[0] -6119.37 -6037.33
G54 CFG[17] -6763.51 -6037.33
G56 CFG[18] -7417.82 -6010.66
G58 CFG[9] -7818.63 -6095.75
H10 GPP_E5 / DEVSLP1 7170.42 -5890.26
H12 RSVD 6441.44 -5790.95
H15 USB3_2_TXP / SSIC_TXP 5797.3 -5790.95
H17 USB3_4_TXP 5153.15 -5790.95
H19 PCIE2_TXP / USB3_6_TXP 4509.01 -5790.95
H2 SYS_RESET# 9038.59 -5797.3
H21 PCIE4_TXP 3864.86 -5790.95
H23 PCIE6_TXP 3220.72 -5790.95
H25 PCIE8_TXP / SATA1A_TXP 2576.58 -5790.95
H27 PCIE10_TXP 1932.43 -5790.95
H29 CSI2_DN0 1288.29 -5790.95
H31 CSI2_CLKN0 644.14 -5790.95
H33 CSI2_DP1 0 -5790.95
211
Non-Interleaved
(NIL)
H35 CLKOUT_PCIE_N1 -644.14 -5790.95
H37 CLKOUT_PCIE_N4 -1288.29 -5790.95
H39 CLKOUT_PCIE_N5 -1932.43 -5790.95
H4 GPP_E20 / DDPC_CTRLCLK 8545.83 -5797.3
H41 DDI1_AUXN -2576.58 -5790.95
H43 EDP_TXN[3] -3220.72 -5790.95
H45 EDP_TXN[0] -3864.86 -5790.95
H47 THERMTRIP# -4509.01 -5790.95
H49 CATERR# -5153.15 -5790.95
H51 BPM#[0] -5797.3 -5790.95
H53 CFG[3] -6441.44 -5790.95
H55 CFG[4] -7085.58 -5783.33
H59 CFG[15] -8130.79 -5839.21
H6 GPP_E19 / DDPB_CTRLDATA 8053.07 -5797.3
H61 CFG[14] -8545.83 -5797.3
H63 VCC -9038.59 -5797.3
H8 GPP_E8 / SATALED# 7560.31 -5797.3
J1 SYS_PWROK 9310.37 -5475.22
J11 GPP_E1 / SATAXPCIE1 / SATAGP1 6763.51 -5544.57
J14 VSS 6119.37 -5544.57
J16 USB3_1_TXP 5475.22 -5544.57
J18 USB3_3_TXP 4831.08 -5544.57
J20 PCIE1_TXP / USB3_5_TXP 4186.94 -5544.57
J22 PCIE3_TXP 3542.79 -5544.57
J24 PCIE5_TXP 2898.65 -5544.57
J26 PCIE7_TXP / SATA0_TXP 2254.5 -5544.57
J28 PCIE9_TXP 1610.36 -5544.57
J3 VSS 8792.21 -5475.22
J30 CSI2_DN2 966.22 -5544.57
J32 CSI2_DN3 322.07 -5544.57
J34 CLKOUT_ITPXDP_N -322.07 -5544.57
J36 CLKOUT_PCIE_N2 -966.22 -5544.57
J38 CLKOUT_PCIE_N3 -1610.36 -5544.57
J40 DDI2_AUXN -2254.5 -5544.57
J42 EDP_AUXN -2898.65 -5544.57
J44 EDP_TXN[1] -3542.79 -5544.57
J46 EDP_TXN[2] -4186.94 -5544.57
J48 PROCHOT# -4831.08 -5544.57
J5 VSS 8299.45 -5475.22

Non-Interleaved
(NIL)
J50 BPM#[1] -5475.22 -5544.57
J52 CFG[2] -6119.37 -5544.57
J54 CFG[16] -6763.51 -5544.57
J56 CFG[19] -7407.66 -5544.57
J58 CFG[13] -7805.93 -5605.53
J60 CFG[12] -8299.45 -5475.22
J62 VSS -8792.21 -5475.22
J64 VCC -9310.37 -5475.22
J7 VSS 7806.69 -5475.22
J9 VSS 7313.93 -5475.22
K12 RSVD 6441.44 -5298.19
K15 VSS 5797.3 -5298.19
K17 VSS 5153.15 -5298.19
K19 VSS 4509.01 -5298.19
K21 VSS 3864.86 -5298.19
K23 VSS 3220.72 -5298.19
K25 VSS 2576.58 -5298.19
K27 VSS 1932.43 -5298.19
K29 VSS 1288.29 -5298.19
K31 VSS 644.14 -5298.19
K33 VSS 0 -5298.19
K35 VSS -644.14 -5298.19
K37 VSS -1288.29 -5298.19
K39 VSS -1932.43 -5298.19
K41 VSS -2576.58 -5298.19
K43 VSS -3220.72 -5298.19
K45 VSS -3864.86 -5298.19
K47 VSS -4509.01 -5298.19
K49 VSS -5153.15 -5298.19
K51 VSS -5797.3 -5298.19
K53 VSS -6441.44 -5298.19
K55 VSS -7085.58 -5298.19
L10 GPP_E14 / DDPC_HPD1 7067.55 -5153.15
L14 VSS 6119.37 -5051.81
L16 RSVD 5475.22 -5051.81
L18 RSVD 4831.08 -5051.81
L2 XTAL24_OUT 9038.59 -5153.15
L20 RSVD 4186.94 -5051.81
L22 RSVD 3542.79 -5051.81
213
Non-Interleaved
(NIL)
L24 RSVD 2898.65 -5051.81
L26 RSVD 2254.5 -5051.81
L28 RSVD 1610.36 -5051.81
L30 VCCSA 966.22 -5051.81
L32 VSS_SENSE 322.07 -5051.81
L34 VCC_SENSE -322.07 -5051.81
L36 RSVD -966.22 -5051.81
L38 RSVD -1610.36 -5051.81
L4 GPP_E23 8545.83 -5153.15
L40 VCC -2254.5 -5051.81
L42 VCC -2898.65 -5051.81
L44 VCC -3542.79 -5051.81
L46 VCC -4186.94 -5051.81
L48 VCC -4831.08 -5051.81
L50 VCC -5475.22 -5051.81
L52 VCC -6119.37 -5051.81
L54 VCC -6763.51 -5051.81
L57 VSS -7660.64 -5232.4
L59 VSS -8053.07 -5153.15
L6 GPP_E18 / DDPB_CTRLCLK 8053.07 -5153.15
L61 VSS -8545.83 -5153.15
L63 VCC -9038.59 -5153.15
L8 GPP_E6 / DEVSLP2 7560.31 -5153.15
M1 XTAL24_IN 9310.37 -4831.08
M11 GPP_E10 / USB2_OC1# 6821.17 -4831.08
M15 RSVD 5797.3 -4805.43
M17 RSVD 5153.15 -4805.43
M19 RSVD 4509.01 -4805.43
M21 RSVD 3864.86 -4805.43
M23 RSVD 3220.72 -4805.43
M25 RSVD 2576.58 -4805.43
M27 RSVD 1932.43 -4805.43
M29 VCCSA_SENSE 1288.29 -4805.43
M3 VSS 8792.21 -4831.08
M31 VCCSA 644.14 -4805.43
M33 VCC 0 -4805.43
M35 VCC -644.14 -4805.43
M37 VCC -1288.29 -4805.43
M39 VCC -1932.43 -4805.43

Non-Interleaved
(NIL)
M41 VCC -2576.58 -4805.43
M43 VCC -3220.72 -4805.43
M45 VCC -3864.86 -4805.43
M47 VCC -4509.01 -4805.43
M49 VCC -5153.15 -4805.43
M5 GPP_E22 8299.45 -4831.08
M51 VCC -5797.3 -4805.43
M53 VCC -6441.44 -4805.43
M56 VCC -7341.87 -4989.83
M58 VCC -7806.69 -4831.08
M60 VCC -8299.45 -4831.08
M62 VCC -8792.21 -4831.08
M64 VCC -9310.37 -4831.08
M7 GPP_E15 / DDPD_HPD2 7806.69 -4831.08
M9 GPP_E7 / CPU_GP1 7313.93 -4831.08
N10 GPP_E2 / SATAXPCIE2 / SATAGP2 7067.55 -4509.01
N12 GPP_E9 / USB2_OC0# 6574.79 -4509.01
N14 VSS 6119.37 -4559.05
N16 VSS 5475.22 -4559.05
N18 VSS 4831.08 -4559.05
N2 USB2_COMP 9038.59 -4509.01
N20 VSS 4186.94 -4559.05
N22 VSS 3542.79 -4559.05
N24 VSS 2898.65 -4559.05
N26 VSS 2254.5 -4559.05
N28 VSSSA_SENSE 1610.36 -4559.05
N30 VCCSA 966.22 -4559.05
N32 VCC 322.07 -4559.05
N34 VCC -322.07 -4559.05
N36 VCC -966.22 -4559.05
N38 VCC -1610.36 -4559.05
N4 GPP_D4 / FLASHTRIG 8545.83 -4509.01
N40 VCC -2254.5 -4559.05
N42 VCC -2898.65 -4559.05
N44 VCCGT -3542.79 -4559.05
N46 VCCGT -4186.94 -4559.05
N48 VCCGT -4831.08 -4559.05
N50 VCCGT -5475.22 -4559.05
N52 VCCGT_SENSE -6119.37 -4559.05
215
Non-Interleaved
(NIL)
N54 VCC -6777.48 -4586.99
N55 VCC -7176.77 -4625.34
N57 VCC -7560.31 -4509.01
N59 VCC -8053.07 -4509.01
N6 GPP_D0 8053.07 -4509.01
N61 VCC -8545.83 -4509.01
N63 VCC -9038.59 -4509.01
N8 GPP_D2 7560.31 -4509.01
P1 XCLK_BIASREF 9310.37 -4186.94
P11 GPP_D9 6821.17 -4186.94
P13 RSVD 6328.41 -4181.86
P3 GPP_D3 8792.21 -4186.94
P5 GPP_D6 / ISH_I2C0_SCL 8299.45 -4186.94
P52 VSSGT_SENSE -6423.66 -4277.36
P54 VSS -6821.17 -4186.94
P56 VCC -7313.93 -4186.94
P58 VCC -7806.69 -4186.94
P60 VCC -8299.45 -4186.94
P62 VCC -8792.21 -4186.94
P64 VCC -9310.37 -4186.94
P7 GPP_D5 / ISH_I2C0_SDA 7806.69 -4186.94
P9 GPP_D1 7313.93 -4186.94
R10 VSS 7067.55 -3864.86
R12 RSVD 6574.79 -3864.86
R15 VCCAPLLEBB_1P0 5846.1 -4104.91
R16 VCCAPLLEBB_1P0 5350.8 -4104.91
R18 VSS 4855.5 -4104.91
R19 VCCCLK6 4360.2 -4104.91
R2 VSS 9038.59 -3864.86
R21 VCCCLK5 3864.9 -4104.91
R23 VCCCLK5 3369.6 -4104.91
R24 VSS 2874.3 -4104.91
R26 VCCSTG 2379 -4104.91
R27 VCCPLL 1883.7 -4104.91
R29 VCCSA 1388.4 -4104.91
R30 VSS 893.1 -4104.91
R32 VCC 397.8 -4104.91
R33 VSS -97.5 -4104.91
R35 VCCG0 -592.8 -4104.91

Non-Interleaved
(NIL)
R36 VSS -1088.1 -4104.91
R38 VCCG0 -1583.4 -4104.91
R4 VSS 8545.83 -3864.86
R40 VSS -2078.7 -4104.91
R41 VCC -2574 -4104.91
R43 VSS -3069.3 -4104.91
R44 VSS -3564.6 -4104.91
R46 VSS -4059.9 -4104.91
R47 VSS -4555.2 -4104.91
R49 VSS -5050.5 -4104.91
R50 VSS -5545.8 -4104.91
R51 VCCGT -6041.1 -4104.91
R53 VCCGT -6574.79 -3864.86
R55 VSS -7067.55 -3864.86
R57 VCC -7560.31 -3864.86
R59 VCC -8053.07 -3864.86
R6 VSS 8053.07 -3864.86
R61 VCC -8545.83 -3864.86
R63 VCC -9038.59 -3864.86
R8 VSS 7560.31 -3864.86
T1 VCCMPHYGT_1P0 9310.37 -3542.79
T11 GPP_D12 6821.17 -3542.79
T13 VSS 6328.41 -3537.71
T15 VCCMPHYGT_1P0 5846.1 -3546.11
T16 VCCMPHYGT_1P0 5350.8 -3546.11
T18 VSS 4855.5 -3546.11
T19 VCCCLK6 4360.2 -3546.11
T21 VSS 3864.9 -3546.11
T23 VSS 3369.6 -3546.11
T24 VSS 2874.3 -3546.11
T26 VCCSTG 2379 -3546.11
T27 VCCPLL 1883.7 -3546.11
T29 VCCSA 1388.4 -3546.11
T3 GPP_D8 / ISH_I2C1_SCL 8792.21 -3542.79
T30 VCCSA 893.1 -3546.11
T32 VCC 397.8 -3546.11
T33 VSS -97.5 -3546.11
T35 VCCG0 -592.8 -3546.11
T36 VSS -1088.1 -3546.11
217
Non-Interleaved
(NIL)
T38 VCCG0 -1583.4 -3546.11
T40 VSS -2078.7 -3546.11
T41 VCC -2574 -3546.11
T43 VCCGT -3069.3 -3546.11
T44 VCCGT -3564.6 -3546.11
T46 VCCGT -4059.9 -3546.11
T47 VCCGT -4555.2 -3546.11
T49 VCCGT -5050.5 -3546.11
T5 GPP_D11 8299.45 -3542.79
T50 VCCGT -5545.8 -3546.11
T51 VCCGT -6041.1 -3546.11
T54 VCCGT -6821.17 -3542.79
T56 VSS -7313.93 -3542.79
T58 VSS -7806.69 -3542.79
T60 VSS -8299.45 -3542.79
T62 VSS -8792.21 -3542.79
T64 VSS -9310.37 -3542.79
T7 GPP_D10 7806.69 -3542.79
T9 GPP_D7 / ISH_I2C1_SDA 7313.93 -3542.79
U10 GPP_D13 / ISH_UART0_RXD / SML0BDATA 7067.55 -3220.72
U12 GPP_D17 / DMIC_CLK1 6574.79 -3220.72
U2 VCCMPHYGT_1P0 9038.59 -3220.72
U4 GPP_D14 / ISH_UART0_TXD / SML0BCLK 8545.83 -3220.72
U53 VCCGT -6574.79 -3220.72
U55 VCCGT -7067.55 -3220.72
U57 VCCGT -7560.31 -3220.72
U59 VCCGT -8053.07 -3220.72
U6 GPP_D15 / ISH_UART0_RTS# 8053.07 -3220.72
U61 VCCGT -8545.83 -3220.72
U63 VCCGT -9038.59 -3220.72
U8 GPP_D18 / DMIC_DATA1 7560.31 -3220.72
V1 VCCMPHYAON_1P0 9310.37 -2898.65
V11 GPP_D20 / DMIC_DATA0 6821.17 -2898.65
V13 VSS 6328.41 -2893.57
V15 VCCAMPHYPLL_1P0 5846.1 -2987.31
V16 VCCAMPHYPLL_1P0 5350.8 -2987.31
V18 VCCCLK1 4855.5 -2987.31
V19 VCCCLK2 4360.2 -2987.31
V21 VCCCLK4 3864.9 -2987.31

Non-Interleaved
(NIL)
V23 VCCCLK3 3369.6 -2987.31
V24 VSS 2874.3 -2987.31
V26 VCCST 2379 -2987.31
V27 VSS 1883.7 -2987.31
V29 VCCSA 1388.4 -2987.31
V3 GPP_D19 / DMIC_CLK0 8792.21 -2898.65
V30 VSS 893.1 -2987.31
V32 VCC 397.8 -2987.31
V33 VSS -97.5 -2987.31
V35 VCCG0 -592.8 -2987.31
V36 VSS -1088.1 -2987.31
V38 VCCG0 -1583.4 -2987.31
V40 VSS -2078.7 -2987.31
V41 VCC -2574 -2987.31
V43 VSS -3069.3 -2987.31
V44 VSS -3564.6 -2987.31
V46 VSS -4059.9 -2987.31
V47 VSS -4555.2 -2987.31
V49 VSS -5050.5 -2987.31
V5 GPP_D23 / I2S_MCLK 8299.45 -2898.65
V50 VSS -5545.8 -2987.31
V51 VSS -6041.1 -2987.31
V54 VCCGT -6821.17 -2898.65
V56 VCCGT -7313.93 -2898.65
V58 VCCGT -7806.69 -2898.65
V60 VCCGT -8299.45 -2898.65
V62 VCCGT -8792.21 -2898.65
V64 VCCGT -9310.37 -2898.65
V7 GPP_D22 7806.69 -2898.65
GPP_D16 / ISH_UART0_CTS# / 7313.93 -2898.65

V9
SML0BALERT#
W10 GPP_C7 / SML1DATA 7067.55 -2576.58
W12 GPP_D21 6574.79 -2576.58
W2 VCCMPHYAON_1P0 9038.59 -2576.58
W4 GPP_C3 / SML0CLK 8545.83 -2576.58
W53 VCCGT -6574.79 -2576.58
W55 VCCGT -7067.55 -2576.58
W57 VCCGT -7560.31 -2576.58
W59 VCCGT -8053.07 -2576.58
219
Non-Interleaved
(NIL)
W6 GPP_C1 / SMBDATA 8053.07 -2576.58
W61 VCCGT -8545.83 -2576.58
W63 VCCGT -9038.59 -2576.58
W8 GPP_C2 / SMBALERT# 7560.31 -2576.58
Y1 VSS 9310.37 -2254.5
Y11 VSS 6821.17 -2254.5
Y13 VSS 6328.41 -2249.42
Y15 VSS 5846.1 -2428.51
Y16 VSS 5350.8 -2428.51
Y18 VCCCLK1 4855.5 -2428.51
Y19 VCCCLK2 4360.2 -2428.51
Y21 VCCCLK4 3864.9 -2428.51
Y23 VCCCLK3 3369.6 -2428.51
Y24 VSS 2874.3 -2428.51
Y26 VCCST 2379 -2428.51
Y27 VSS 1883.7 -2428.51
Y29 VCCSA 1388.4 -2428.51
Y3 VSS 8792.21 -2254.5
Y30 VCCSA 893.1 -2428.51
Y32 VCC 397.8 -2428.51
Y33 VSS -97.5 -2428.51
Y35 VCCG0 -592.8 -2428.51
Y36 VSS -1088.1 -2428.51
Y38 VCCG0 -1583.4 -2428.51
Y40 VSS -2078.7 -2428.51
Y41 VCC -2574 -2428.51
Y43 VCCGT -3069.3 -2428.51
Y44 VCCGT -3564.6 -2428.51
Y46 VCCGT -4059.9 -2428.51
Y47 VCCGT -4555.2 -2428.51
Y49 VCCGT -5050.5 -2428.51
Y5 VSS 8299.45 -2254.5
Y50 VCCGT -5545.8 -2428.51
Y51 VCCGT -6041.1 -2428.51
Y54 VCCGT -6821.17 -2254.5
Y56 VCCGT -7313.93 -2254.5
Y58 VCCGT -7806.69 -2254.5
Y60 VCCGT -8299.45 -2254.5
Y62 VCCGT -8792.21 -2254.5

Non-Interleaved
(NIL)
Y64 VCCGT -9310.37 -2254.5
Y7 VSS 7806.69 -2254.5
Y9 VSS 7313.93 -2254.5
§§
221

7th Gen Core Family Mobile U y Processor Lines Datasheet Vol1 Rev008

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7th Gen Core Family Mobile U y Processor Lines Datasheet Vol1 Rev008

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7th Generation Intel® Processor

Families for U/Y Platforms and 8th

Supporting 7th Generation Intel® Core™ Processor Families, Intel®

Document Number: 334661-008

001 • Initial release August 2016

Processor Volatility statement:

Some of the processor SKUs are offered with On-Package Cache.

Table 1-1. Processor Lines

KBL Y-Processor Line BGA1515 4.5W 2 GT2 N/A 1-Chip

KBL Y-Processor Line

AML-Y Processor Line (2-

KBL U-Processor Line BGA1356 15W 2 GT2 N/A 1-Chip

KBL U-Processor Line 15W 2 GT2 N/A 1-Chip

This document is for the following U/Y-Processor SKUs:

Refer to the processor Specification Update for additional SKU details.

Digital Display DDIx2 DDR Ch.A

Interface x 2 DDR Ch.B System Memory

I 2C/UART/ USB BT/3G/4G Wi-Fi

Refer to Chapter 3, “Technologies” for more information.

1.2 Power Management Support

Refer to Chapter 4, “Power Management” for more information.

1.2.3 Memory Controller Power Management

1.2.4 Processor Graphics Power Management

1.2.4.2 Display Power Savings Technologies

1.2.4.3 Graphics Core Power Savings Technologies

Refer to Chapter 5, “Thermal Management” for more information.

1.4 Package Support

1.5 Processor Testability

U-processor line Yes Yes Yes Yes

U-processor line Yes Yes Yes Yes

4K Ultra High Definition (UHD)

AES Advanced Encryption Standard

AGC Adaptive Gain Control

BLT Block Level Transfer

BPP Bits per pixel

CDR Clock and Data Recovery

CTLE Continuous Time Linear Equalizer

DDI Digital Display Interface for DP or HDMI/DVI

DDR3 Third-generation Double Data Rate SDRAM memory technology

DDR3L/RS DDR3 Low Voltage Reduced Standby Power

Fourth-Generation Double Data Rate SDRAM Memory Technology

DFE decision feedback equalizer

DMA Direct Memory Access

DMI Direct Media Interface

DTS Digital Thermal Sensor

eDP* embedded DisplayPort*

EU Execution Unit in the Processor Graphics

GSA Graphics in System Agent

HDCP High-bandwidth Digital Content Protection

HDMI* High Definition Multimedia Interface

IMC Integrated Memory Controller

Intel® 64 Technology 64-bit memory extensions to the IA-32 architecture

Intel® DPST Intel Display Power Saving Technology

Intel® TSX-NI Intel Transactional Synchronization Extensions

Intel® TXT Intel Trusted Execution Technology

Intel Virtualization Technology. Processor virtualization, when used in conjunction

IOV I/O Virtualization

ISP Image Signal Processor

Low Frequency Mode. corresponding to the Enhanced Intel SpeedStep®