Product Overview

The DWM1000 module is based on Decawave's DW1000 Ultra

Wideband (UWB) transceiver IC. It integrates antenna, all RF
circuitry, power management and clock circuitry in one module.
It can be used in 2-way ranging or TDOA location systems to
locate assets to a precision of 10 cm and supports data rates of
up to 6.8 Mbps

Key Features Key Benefits

DWM1000 IEEE 802.15.4-2011 UWB Transceiver Module

• Simplifies integration, no RF design
• IEEE 802.15.4-2011 UWB required
compliant
• Very precise location of tagged objects
• Supports 4 RF bands from delivers enterprise efficiency gains and
3.5 GHz to 6.5 GHz cost reductions
• Programmable transmitter • Extended communications range
output power minimises required infrastructure in
• Fully coherent receiver for RTLS
maximum range and accuracy • High multipath fading immunity
• Designed to comply with FCC • Supports very high tag densities in
& ETSI UWB spectral masks RTLS
• Supply voltage 2.8 V to 3.6 V • Low cost allows cost-effective
• Low power consumption implementation of solutions
• Data rates of 110 kbps, • Low power consumption reduces the
850 kbps, 6.8 Mbps need to replace batteries and lowers
• Maximum packet length of system lifetime costs
1023 bytes for high data
throughput applications
• Integrated MAC support
Applications
features
• Precision real time location systems
• Supports 2-way ranging and
(RTLS) using two-way ranging or
TDOA
TDOA schemes in a variety of
• SPI interface to host processor
markets.
• 23 mm x 13 mm x 2.9 mm 24- • Location aware wireless sensor
pin side castellation package networks (WSNs)

On-board
On-board Power
Antenna Management

ANALOG RECEIVER POWER MANAGEMENT 2.8 V to

DC/DC 3.6 V DC
DIGITAL TRANSCEIVER

supply

SPI Control
PLL / CLOCK GENERATOR HOST INTERFACE / SPI SPI I/F
Interface

On-board
STATE CONTROLLER Crystal and
ANALOG TRANSMITTER
Clock
Management
DW1000 IC

DWM1000

High Level Block Diagram

 DWM1000 Datasheet

Table of Contents
1 OVERVIEW ................................................... 5 5.2 APPLICATION CIRCUIT DIAGRAM .................... 17
5.2.1 SPI Bus ............................................ 18
1.1 DWM1000 FUNCTIONAL DESCRIPTION ........... 5
5.2.2 Configuring the SPI Mode ............... 18
1.2 DWM1000 POWER UP ............................... 5
5.2.3 Powering down the DWM1000 ...... 19
1.3 SPI HOST INTERFACE .................................... 6
1.3.1 SPI Signal Timing .............................. 6 6 PACKAGE INFORMATION ............................ 20
1.4 GENERAL PURPOSE INPUT OUTPUT (GPIO) ...... 7
6.1 MODULE DRAWINGS ................................... 20
1.5 ALWAYS-ON (AON) MEMORY ....................... 7
6.2 MODULE LAND PATTERN ............................. 20
1.6 ONE-TIME PROGRAMMABLE (OTP) MEMORY ... 7
6.3 DWM1000 V1 MODULE MARKING
1.7 INTERRUPTS AND DEVICE STATUS .................... 7
INFORMATION ...................................................... 22
1.8 MAC ......................................................... 7
6.4 DWM1000 V2 MODULE MARKING
2 DWM1000 CALIBRATION ............................. 8 INFORMATION ...................................................... 22
6.5 MODULE SOLDER PROFILE ............................ 23
2.1.1 Crystal Oscillator Trim ...................... 8
2.1.2 Transmitter Calibration .................... 8 7 ORDERING INFORMATION .......................... 24
2.1.3 Antenna Delay Calibration ............... 8
7.1 TAPE AND REEL INFORMATION FOR DWM1000
3 DWM1000 PIN CONNECTIONS ..................... 9 V1 24
7.2 TAPE AND REEL INFORMATION FOR DWM1000
3.1 PIN NUMBERING .......................................... 9
V2 26
3.2 PIN DESCRIPTIONS ........................................ 9
7.3 DWM1000 PACKAGING INFORMATION ......... 27
4 ELECTRICAL SPECIFICATIONS ...................... 12 7.3.1 Inner Box V2.................................... 27
7.3.2 Outer Box V2 ................................... 27
4.1 NOMINAL OPERATING CONDITIONS ............... 12
4.2 DC CHARACTERISTICS.................................. 12 8 REGULATORY INFORMATION...................... 28
4.3 RECEIVER AC CHARACTERISTICS .................... 12
8.1 EUROPEAN UNION REQUIREMENTS ................ 28
4.4 RECEIVER SENSITIVITY CHARACTERISTICS ......... 13
8.1.1 Radio Equipment Directive ............. 28
4.5 REFERENCE CLOCK AC CHARACTERISTICS ........ 13
8.1.2 ETSI harmonised standards ........... 29
4.5.1 Reference Frequency ...................... 13
4.6 TRANSMITTER AC CHARACTERISTICS .............. 13 9 GLOSSARY ................................................... 30
4.7 TEMPERATURE AND VOLTAGE MONITOR
10 REFERENCES ............................................ 31
CHARACTERISTICS.................................................. 14
4.8 ANTENNA PERFORMANCE ............................ 14 11 DOCUMENT HISTORY .............................. 31
4.9 ABSOLUTE MAXIMUM RATINGS .................... 16
12 FURTHER INFORMATION ......................... 33
5 APPLICATION INFORMATION ..................... 17
5.1 APPLICATION BOARD LAYOUT GUIDELINES ...... 17

List of Figures
FIGURE 1: DWM1000 POWER-UP SEQUENCE ................ 5 INFORMATION ................................................... 22
FIGURE 2: DW1000 SPIPHA=0 TRANSFER PROTOCOL.... 6 FIGURE 14: DWM1000 V2 MODULE MARKING
FIGURE 3: DWM1000 SPI TIMING DIAGRAM ................ 6 INFORMATION ................................................... 22
FIGURE 4: DWM1000 SPI DETAILED TIMING DIAGRAM .. 6 FIGURE 15: DWM1000 MODULE SOLDER PROFILE ....... 23
FIGURE 5: DWM1000 PIN DIAGRAM ........................... 9 FIGURE 16: DWM1000 V1 MODULE CARRIER DIMENSION
FIGURE 6. DWM1000 CIRCUIT BOARD MOUNTING....... 14 (UNITS: MM)..................................................... 24
FIGURE 7. MEASURED ANTENNA RADIATION PATTERNS... 15 FIGURE 17: DWM1000 V1 MODULE TAPE CARRIER
FIGURE 8: DWM1000 APPLICATION BOARD KEEP-OUT DIMENSION (UNITS: MM) .................................... 25
AREAS ............................................................. 17 FIGURE 16: DWM1000 V2 MODULE CARRIER DIMENSION
FIGURE 9: EXAMPLE DWM1000 APPLICATION CIRCUIT .. 18 (UNITS: MM)..................................................... 26
FIGURE 10: SPI BUS CONNECTIONS ............................ 18 FIGURE 17: DWM1000 V2 MODULE TAPE CARRIER
FIGURE 11: MODULE PACKAGE SIZE (UNITS: MM) ......... 20 DIMENSION (UNITS: MM) .................................... 26
FIGURE 12: DWM1000 MODULE LAND PATTERN (UNITS: FIGURE 18: MODULE INNER BOX (UNITS: MM) .............. 27
MM) ............................................................... 21 FIGURE 19: MODULE OUTER BOX: (MODULE QUANTITY
FIGURE 13: DWM1000 V1 MODULE MARKING 2000 PIECES) ................................................... 27

© Decawave Ltd 2016 Subject to change without notice Version 1.8 Page 2
 DWM1000 Datasheet

List of Tables
TABLE 1: DW1000 POWER-UP TIMINGS ........................ 5
TABLE 2: DWM1000 SPI TIMING PARAMETERS ............. 6
TABLE 3: DWM1000 PIN FUNCTIONS ........................... 9
TABLE 4: EXPLANATION OF ABBREVIATIONS ................... 11
TABLE 5: DWM1000 OPERATING CONDITIONS ............ 12
TABLE 6: DWM1000 DC CHARACTERISTICS ................. 12
TABLE 7: DWM1000 RECEIVER AC CHARACTERISTICS ... 12
TABLE 8: DWM1000 TYPICAL RECEIVER SENSITIVITY
CHARACTERISTICS .............................................. 13
TABLE 9: DWM1000 REFERENCE CLOCK AC
CHARACTERISTICS .............................................. 13
TABLE 10: DWM1000 TRANSMITTER AC CHARACTERISTICS
...................................................................... 13
TABLE 11: DWM1000 TEMPERATURE AND VOLTAGE
MONITOR CHARACTERISTICS................................ 14
TABLE 12: DWM1000 ABSOLUTE MAXIMUM RATINGS . 16
TABLE 13: DW1000 SPI MODE CONFIGURATION ......... 18
TABLE 14: MODULE WEIGHT ...................................... 21
TABLE 15: GLOSSARY OF TERMS .................................. 30

© Decawave Ltd 2016 Subject to change without notice Version 1.8 Page 3
DWM1000 Datasheet

DOCUMENT INFORMATION

Disclaimer

Decawave reserves the right to change product specifications without notice. As far as possible changes to
functionality and specifications will be issued in product specific errata sheets or in new versions of this
document. Customers are advised to check with Decawave for the most recent updates on this product.

Copyright © 2016 Decawave Ltd

LIFE SUPPORT POLICY

Decawave products are not authorized for use in safety-critical applications (such as life support) where a
failure of the Decawave product would reasonably be expected to cause severe personal injury or death.
Decawave customers using or selling Decawave products in such a manner do so entirely at their own risk
and agree to fully indemnify Decawave and its representatives against any damages arising out of the use of
Decawave products in such safety-critical applications.

Caution! ESD sensitive device. Precaution should be used when handling the device in order
to prevent permanent damage.

REGULATORY APPROVALS

The DWM1000, as supplied from Decawave, has not been certified for use in any particular geographic
region by the appropriate regulatory body governing radio emissions in that region although it is
capable of such certification depending on the region and the manner in which it is used.

All products developed by the user incorporating the DWM1000 must be approved by the relevant
authority governing radio emissions in any given jurisdiction prior to the marketing or sale of such
products in that jurisdiction and user bears all responsibility for obtaining such approval as needed
from the appropriate authorities.

© Decawave Ltd 2016 Version 1.8 Page 4

 DWM1000 Datasheet

1 OVERVIEW
The DWM1000 module is an IEEE 802.15.4-2011 UWB implementation. RF components, Decawave DW1000
UWB transceiver, and other components reside on-module. DWM1000 enables cost effective and reduced
complexity integration of UWB communications and ranging features, greatly accelerating design implementation.

1.1 DWM1000 Functional Description

The DW1000 on board the DWM1000 is a fully integrated low-power, single chip CMOS RF transceiver IC
compliant with the IEEE 802.15.4-2011 [1] UWB standard. The DWM1000 module requires no RF design as the
antenna and associated analog and RF components are on the module.

The module contains an on-board 38.4 MHz reference crystal. The crystal has been trimmed in production to
reduce the initial frequency error to approximately 2 ppm, using the DW1000 IC’s internal on-chip crystal trimming
circuit, see section 2.1.1.

Always-On (AON) memory can be used to retain DWM1000 configuration data during the lowest power operational
states when the on-chip voltage regulators are disabled. This data is uploaded and downloaded automatically. Use
of DWM1000 AON memory is configurable.

The on-chip voltage and temperature monitors allow the host to read the voltage on the VDDAON pin and the
internal die temperature information from the DW1000.

See the DW1000 Datasheet [2] for more detailed information on device functionality, electrical specifications and
typical performance.

1.2 DWM1000 Power Up

3.3 V Supplies Von

(VDDAON / VDD / VDD)

EXTON Text_on

RSTn
Tdig_on

STATE OFF POWER UP INIT

Figure 1: DWM1000 Power-up Sequence

When power is applied to the DWM1000, RSTn is driven low by internal circuitry as part of its power up
sequence. See Figure 1 above. RSTn remains low until the on-module crystal oscillator has powered up and its
output is suitable for use by the rest of the device, at which time RSTn is deasserted high.
Table 1: DW1000 Power-up Timings
Nominal
Parameter Description Units
Value
VON Voltage threshold to enable power up 2.0 V
Time at which EXTON goes high before RSTn is
TEXT_ON 3 ms
released
RSTn held low by internal reset circuit / driven low by
TDIG_ON 3 ms
external reset circuit

RSTn may be used as an output to reset external circuitry as part of system bring-up as power is applied.

An external circuit can reset the DWM1000 by asserting RSTn for a minimum of 10 ns. RSTn is an
asynchronous input. DW1000 initialization will proceed when the pin is released to high impedance. RSTn
should never be driven high by an external source.

© Decawave Ltd 2016 Version 1.8 Page 5

 DWM1000 Datasheet

Please see DW1000 Datasheet [2] for more details of DW1000 power up.

1.3 SPI Host Interface

The DW1000 host communications interface is a slave-only SPI. Both clock polarities (SPIPOL=0/1) and phases
(SPIPHA=0/1) are supported. The data transfer protocol supports single and multiple byte read/writes accesses.
All bytes are transferred MSB first and LSB last. A transfer is initiated by asserting SPICSn low and terminated
when SPICSn is deasserted high.

See the DW1000 Datasheet [2] for full details of the SPI interface operation and mode configuration for clock
phase and polarity.

Cycle 8*Number of
1 2 3 4 5 6 7 8 9
bytes
Number, #

SPIPOL=0, SPIPHA=0

SPICLK

SPIPOL=1, SPIPHA=0

SPICLK

SPICSn

SPIMISO z MSB 6 5 4 3 2 1 LSB MSB LSB X Z

SPIMOSI z MSB 6 5 4 3 2 1 LSB MSB LSB X Z

Figure 2: DW1000 SPIPHA=0 Transfer Protocol

1.3.1 SPI Signal Timing

SPICSn

S PICLK

SPIMOSI Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Bit 7 Bit 6 Bit 5

SPIMISO 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 7 6 5

t6
t7 t5 t8
t9

Figure 3: DWM1000 SPI Timing Diagram

SPICSn

S PICLK

SPIMOSI Bit 7 Bit 6 Bit 5

SPIMISO 7 6 5

t3 t4
t1 t2

Figure 4: DWM1000 SPI Detailed Timing Diagram

Table 2: DWM1000 SPI Timing Parameters

Parameter Min Typ Max Unit Description

SPICLK The maximum SPI frequency is 20 MHz when the CLKPLL is locked,
50 ns
Period otherwise the maximum SPI frequency is 3 MHz.
t1 38 ns SPICSn select asserted low to valid slave output data
t2 12 ns SPICLK low to valid slave output data

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 DWM1000 Datasheet

Parameter Min Typ Max Unit Description

t3 10 ns Master data setup time
t4 10 ns Master data hold time
t5 32 ns LSB last byte to MSB next byte
t6 10 ns SPICSn de-asserted high to SPIMISO tri-state
t7 16 ns Start time; time from select asserted to first SPICLK
t8 40 ns Idle time between consecutive accesses
t9 40 ns Last SPICLK to SPICSn de-asserted

1.4 General Purpose Input Output (GPIO)

The DWM1000 provides 8 configurable pins.

On reset, all GPIO pins default to input. GPIO inputs, when appropriately configured, are capable of generating
interrupts to the host processor via the IRQ signal.

GPIO0, 1, 2, & 3, as one of their optional functions, can drive LEDs to indicate the status of various chip
operations. Any GPIO line being used to drive an LED in this way should be connected as shown. GPIO5 & 6
are used to configure the operating mode of the SPI as described in the DW1000 Datasheet [2].

See DW1000 Datasheet [2] and DW1000 User Manual [3] provide full details of the configuration and use of the
GPIO lines.

1.5 Always-On (AON) Memory

Configuration retention in lowest power states is enabled in DWM1000 by provision of an Always-On (AON)
memory array with a separate power supply, VDDAON. The DWM1000 may be configured to upload its
configuration to AON before entering a low-power state and to download the configuration when waking up from
the low –power state.

1.6 One-Time Programmable (OTP) Memory

The DWM1000 contains a 56x32 -bit user programmable OTP memory on the DW1000 device that is used to
store per chip calibration information.

1.7 Interrupts and Device Status

DWM1000 has a number of interrupt events that can be configured to drive the IRQ output pin. The default IRQ
pin polarity is active high. A number of status registers are provided in the system to monitor and report data of
interest. See DW1000 User Manual [3] for a full description of system interrupts and their configuration and of
status registers.

1.8 MAC
A number of MAC features are implemented including CRC generation, CRC checking and receive frame filtering.
See the DW1000 Datasheet [2] and DW1000 User Manual [3] for full details.

© Decawave Ltd 2016 Version 1.8 Page 7

 DWM1000 Datasheet

2 DWM1000 CALIBRATION
Depending on the end-use application s and the system design, DWM1000 settings may need to be tuned. To
help with this tuning a number of built in functions such as continuous wave TX and continuous packet
transmission can be enabled. See the DW1000 User Manual [3] for further details.

2.1.1 Crystal Oscillator Trim

DWM1000 modules are calibrated at production to minimise initial frequency error to reduce carrier frequency
offset between modules and thus improve receiver sensitivity. The calibration carried out at module production
will trim the initial frequency offset to less than 2 ppm, typically.

2.1.2 Transmitter Calibration

In order to maximise range, DWM1000 transmit power spectral density (PSD) should be set to the maximum
allowable for the geographic region in which it will be used. For most regions this is -41.3 dBm/MHz.

As the module contains an integrated antenna, the transmit power can only be measured over the air. The
Effective Isotropic Radiated Power (EIRP) must be measured and the power level adjusted to ensure compliance
with applicable regulations.

The DWM1000 provides the facility to adjust the transmit power in coarse and fine steps; 3 dB and 0.5 dB
nominally. It also provides the ability to adjust the spectral bandwidth. These adjustments can be used to
maximise transmit power whilst meeting regulatory spectral mask.

If required, transmit calibration should be carried out on a per DWM1000 module basis, see DW1000 User
Manual [3] for full details. 1

2.1.3 Antenna Delay Calibration

In order to measure range accurately, precise calculation of timestamps is required. To do this the antenna delay
must be known. The DWM1000 allows this delay to be calibrated and provides the facility to compensate for
delays introduced by PCB, external components, antenna and internal DWM1000 delays.

To calibrate the antenna delay, range is measured at a known distance using two DWM1000 systems. Antenna
delay is adjusted until the known distance and reported range agree. The antenna delay can be stored in OTP
memory.

Antenna delay calibration must be carried out as a once off measurement for each DWM1000 design
implementation. If required, for greater accuracy, antenna delay calibration should be carried out on a per
DWM1000 module basis, see DW1000 User Manual [3] for full details.

1To achieve best results when using the DWM1000 with Decawave’s DecaRanging software, you will need to

adjust the default transmit power value programmed into the DWM1000 by the software. This is because
DecaRanging software is targeted at Decawave’s EVB1000 evaluation board which has a different RF path
compared to the DWM1000. You should increase the transmit power by approximately 3 dB.
© Decawave Ltd 2016 Version 1.8 Page 8
 DWM1000 Datasheet

3 DWM1000 PIN CONNECTIONS

3.1 Pin Numbering
DWM1000 module pin assignments are as follows (viewed from top): -

UWB
Chip
Antenna

EXTON 1 24 VSS

WAKEUP 2 23 VSS

RSTn 3 22 IRQ / GPIO8

GPIO7 4 21 VSS

VDDAON 5 20 SPICLK

VDD3V3 6 19 SPIMISO

VDD3V3 7 18 SPIMOSI

VSS 8 17 SPICSn
GPIO5 / EXTTXE / SPIPOL 10

GPIO4 / EXTPA 11

GPIO3 / TXLED 12

GPIO2 / RXLED 13

GPIO1 / SFDLED 14

GPIO0 / RXOKLED 15

VSS 16
9
GPIO6 / EXTRXE / SPIPHA

Figure 5: DWM1000 Pin Diagram

3.2 Pin Descriptions

Table 3: DWM1000 Pin functions

I/O
SIGNAL NAME PIN DESCRIPTION
(Default)
Digital Interface
SPICLK 20 DI SPI clock
DO
SPIMISO 19 SPI data output. Refer to DW1000 Datasheet for more details [2].
(O–L)
SPIMOSI 18 DI SPI data input. Refer to DW1000 Datasheet for more details [2].
SPI chip select. This is an active low enable input. The high-to-low
transition on SPICSn signals the start of a new SPI transaction.
SPICSn 17 DI SPICSn can also act as a wake-up signal to bring DW1000 out of
either SLEEP or DEEPSLEEP states Refer to DW1000 Datasheet
for more details [2].
When asserted into its active high state, the WAKEUP pin brings
the DW1000 out of SLEEP or DEEPSLEEP states into operational
WAKEUP 2 DIO mode.
If unused, this pin can be tied to ground.

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DWM1000 Datasheet

I/O
SIGNAL NAME PIN DESCRIPTION
(Default)
External device enable. Asserted during wake up process and held
DO active until device enters sleep mode. Can be used to control
EXTON 1 external DC-DC converters or other circuits that are not required
(O-L) when the device is in sleep mode so as to minimize power
consumption. Refer to DW1000 Datasheet for more details [2].
Interrupt Request output from the DWM1000 to the host processor.
By default IRQ is an active-high output but may be configured to be
active low if required. For correct operation in SLEEP and
DIO DEEPSLEEP modes it should be configured for active high
IRQ / GPIO8 22 operation. This pin will float in SLEEP and DEEPSLEEP states and
(O-L)
may cause spurious interrupts unless pulled low.
When the IRQ functionality is not being used the pin may be
reconfigured as a general purpose I/O line, GPIO8.
Defaults to operate as a SYNC input – refer [2]. THIS
DIO FUNCTIONALITY IS NOT APPLICABLE TO THE DWM1000. This
GPIO7 4
(I) pin may be reconfigured as a general purpose I/O pin, GPIO7 under
software control.
General purpose I/O pin.
DIO On power-up it acts as the SPIPHA (SPI phase selection) pin for
GPIO6 /
9 configuring the SPI mode of operation. Refer to Section 5.2.2 and
SPIPHA (I) the DW1000 Datasheet for more details [2].
After power-up, the pin will default to a General Purpose I/O pin.
General purpose I/O pin.
DIO On power-up it acts as the SPIPOL (SPI polarity selection) pin for
GPIO5 /
10 configuring the SPI operation mode. Refer to Section 5.2.2 and the
SPIPOL (I) DW1000 Datasheet for more details [2].
After power-up, the pin will default to a General Purpose I/O pin.
DIO
GPIO4 11 General purpose I/O pin.
(I)
General purpose I/O pin.
DIO It may be configured for use as a TXLED driving pin that can be
GPIO3 / TXLED 12
(I) used to light a LED following a transmission. Refer to the DW1000
User Manual [2] for details of LED use.
General purpose I/O pin.
DIO It may be configured for use as a RXLED driving pin that can be
GPIO2 / RXLED 13
(I) used to light a LED during receive mode. Refer to the DW1000
User Manual [2] for details of LED use.
General purpose I/O pin.
GPIO1 / DIO It may be configured for use as a SFDLED driving pin that can be
14 used to light a LED when SFD (Start Frame Delimiter) is found by
SFDLED (I)
the receiver. Refer to the DW1000 User Manual [2] for details of
LED use.
General purpose I/O pin.
GPIO0 / DIO It may be configured for use as a RXOKLED driving pin that can be
15
RXOKLED (I) used to light a LED on reception of a good frame. Refer to the
DW1000 User Manual [2] for details of LED use.
Reset pin. Active Low Output.
DIO
RSTn 3 May be pulled low by external open drain driver to reset the
(O-H)
DW1000. Refer to DW1000 Datasheet for more details [2].
Power Supplies
VDDAON 5 P External supply for the Always-On (AON) portion of the chip.

3.3 V supply pins. Note that for programming the OTP in the
VDD3V3 6,7 P DWM1000 module this voltage may be increased to a nominal value
of 3.8 V for short periods.

© Decawave Ltd 2016 Version 1.8 Page 10

DWM1000 Datasheet

I/O
SIGNAL NAME PIN DESCRIPTION
(Default)
Ground
8,16,
GND G Common ground.
21,23,24

Table 4: Explanation of Abbreviations

ABBREVIATION EXPLANATION
I Input
IO Input / Output
O Output
G Ground
P Power Supply
PD Power Decoupling
O-L Defaults to output, low level after reset
O-H Defaults to output, high level after reset
I Defaults to input.
Note: Any signal with the suffix ‘n’ indicates an active low signal.

© Decawave Ltd 2016 Version 1.8 Page 11

 DWM1000 Datasheet

4 ELECTRICAL SPECIFICATIONS
4.1 Nominal Operating Conditions
Table 5: DWM1000 Operating Conditions

Parameter Min. Typ. Max. Units Condition/Note

Operating temperature -40 +85 ˚C
Supply voltage VDDAON, VDD3V3 2.8 3.3 3.6 V Normal operation
Note that for programming the
OTP in the DWM1000 the
Supply voltage VDD3V3 for programming
3.7 3.8 3.9 V VDD3V3 voltage must be
OTP
increased to 3.8 V nominal for
short periods.
Note that 3.6 V is the max
Voltage on GPIO0..7, WAKEUP, RSTn,
3.6 V voltage that may be applied to
SPICSn, SPIMOSI, SPICLK
these pins

Note: Unit operation is guaranteed by design when operating within these ranges

4.2 DC Characteristics
Tamb = 25 ˚C, all supplies centred on typical values
Table 6: DWM1000 DC Characteristics

Parameter Min. Typ. Max. Units Condition/Note

Supply current DEEP SLEEP mode 200 nA
Supply current SLEEP mode 550 nA Total current drawn from all
Supply current IDLE mode 13.4 mA supplies.
Supply current INIT mode 3.5 mA
TX : 3.3 V supplies Channel 5:TX Power:
140 mA
(VDDAON, VDD) 9.3 dBm/500 MHz
RX : 3.3 V supplies
160 mA Channel 5
(VDDAON, VDD)
Digital input voltage high 0.7*VDD V
Digital input voltage low 0.3*VDD V
Digital output voltage high 0.7*VDD V Assumes 500 Ω load
Digital output voltage low 0.3*VDD V Assumes 500 Ω load
Digital Output Drive Current
GPIOx, IRQ 4 6
mA
SPIMISO 8 10
EXTON 3 4

4.3 Receiver AC Characteristics

Tamb = 25 ˚C, all supplies centred on nominal values
Table 7: DWM1000 Receiver AC Characteristics

Parameter Min. Typ. Max. Units Condition/Note

Frequency range 3244 6999 MHz
Channel bandwidth 500 MHz Channel 1,2,3 and 5
In-band blocking level 30 dBc Continuous wave interferer
Out-of-band blocking level 55 dBc Continuous wave interferer

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4.4 Receiver Sensitivity Characteristics

Tamb = 25 ˚C, all supplies centred on typical values. 20 byte payload. These sensitivity figures assume an
antenna gain of 0 dBi and should be modified by the antenna characteristics quoted in Table 12 depending on
the orientation of the DWM1000.
Table 8: DWM1000 Typical Receiver Sensitivity Characteristics
Packet
Receiver
Error Data Rate Units Condition/Note
Sensitivity
Rate
110 kbps -102 dBm/500 MHz Preamble 2048
All measurements
1% 850 kbps -101 dBm/500 MHz Preamble 1024 performed on
Carrier Channel 5, PRF 16
6.8 Mbps -93 dBm/500 MHz Preamble 256 frequency MHz
110 kbps -106 dBm/500 MHz Preamble 2048 offset
±10 ppm Channel 2 is
10% 850 kbps -102 dBm/500 MHz Preamble 1024 approximately 1
dB less sensitive
6.8 Mbps -94 dBm/500 MHz Preamble 256

4.5 Reference Clock AC Characteristics

Tamb = 25 ˚C, all supplies centred on typical values

4.5.1 Reference Frequency

Table 9: DWM1000 Reference Clock AC Characteristics

Parameter Min. Typ. Max. Units Condition/Note

On-board crystal oscillator reference
38.4 MHz
frequency
Internally trimmed to +/- 2 ppm
On-board crystal trimming range ±25 ppm
under typical conditions.
On-board crystal frequency stability ppm
±30* -40⁰C to +85⁰
with temperature ppm
On-board crystal aging ±3 ppm/3year @25⁰C ±2⁰C
Low Power RC Oscillator 5 12 15 kHz

*By using the temperature monitoring capability of the DW1000 chip on the DWM1000 module it is possible to dynamically trim
the crystal during run time to maintain the +/- 2ppm specification over the full temperature range of operation.

4.6 Transmitter AC Characteristics

Tamb = 25 ˚C, all supplies centred on typical values
Table 10: DWM1000 Transmitter AC Characteristics

Parameter Min. Typ. Max. Units Condition/Note

Frequency range 3244 6999 MHz
Channel Bandwidths 500 MHz Channel 1, 2, 3 and 5
Output power spectral density
-39 -35 dBm/MHz See DW1000 Datasheet [2]
(programmable)
Power level range 37 dB
Coarse Power level step 3 dB
Fine Power level step 0.5 dB
Output power variation with
0.05 dB/OC
temperature
2.73 Channel 2
Output power variation with voltage dB/V
3.34 Channel 5

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 DWM1000 Datasheet

4.7 Temperature and Voltage Monitor Characteristics

Table 11: DWM1000 Temperature and Voltage Monitor Characteristics

Parameter Min. Typ. Max. Units Condition/Note

Voltage Monitor Range 2.4 3.75 V
Voltage Monitor Precision 20 mV
Voltage Monitor Accuracy 140 mV
Temperature Monitor Range -40 +100 °C
Temperature Monitor Precision 0.9 °C

4.8 Antenna Performance

The antenna used in the module is the Partron dielectric chip antenna, part number ACS5200HFAUWB, see [4]
for full details.

Antenna radiation patterns, measured in an anechoic chamber for three planes, are shown in Figure 7. As the
antenna is linearly polarised, in the Azimuth plane the vertically polarised field (Theta) is measured and the
horizontally polarised field (Phi) is measured for elevation planes 1 and 2.

For these measurements, the DWM1000 module is mounted on a circuit board with dimensions shown in Figure
6.

2.85 cm 2.85 cm

7 cm

7 cm
Figure 6. DWM1000 Circuit Board Mounting

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DWM1000 Datasheet

Gain (dBi) vs Angle (°)

0
350 10 10
340 20
330 5 30
320 40
0
180° Measurement 310 50
-5
Plane 300 60
-10
290 -15 70
-20
90° 270° 280
-25
80

270 -30 90

260 100

DUT rotated 0° 250 110

through 360° in 240 120

this direction 230 130
220 140 Ch_5
210 150
200 160 Ch_2
190 170
180

Azimuth Plane (Theta)

Gain (dBi) vs Angle (°)
0
350 10 10
340 20
330 5 30
320 40
0
310 50
-5
300 -10 60
180°
290 -15 70
-20
280 80
-25
90° 270° 270 -30 90

260 100

250 110
240 120
0°
230 130
220 140
Ch_5
210 150
200 160
190 170 Ch_2
180

Elevation 1 Plane (Phi)

Gain (dBi) vs Angle (°)
0
350 10 10
340 20
330 5 30
320 40
180° 0
310 50
-5
300 -10 60
290 -15 70
90° 270° 280
-20
80
-25
270 -30 90

260 100
0°
250 110
240 120
230 130
220 140 Ch_5
210 150
200 160 Ch_2
190 170
180

Elevation 2 Plane (Phi)

Figure 7. Measured Antenna Radiation Patterns

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 DWM1000 Datasheet

4.9 Absolute Maximum Ratings

Table 12: DWM1000 Absolute Maximum Ratings

Parameter Min. Max. Units

Voltage
-0.3 4.0 V
VDD3V3 / VDDAON

Receiver Power 0 dBm

Temperature - Storage temperature -40 +85 ˚C

Temperature – Operating temperature -40 +85 ˚C

ESD (Human Body Model) 2000 V

Stresses beyond those listed in this table may cause permanent damage to the device. This is a stress rating
only; functional operation of the device at these or any other conditions beyond those indicated in the operating
conditions of the specification is not implied. Exposure to the absolute maximum rating conditions for extended
periods may affect device reliability.

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 DWM1000 Datasheet

5 APPLICATION INFORMATION
5.1 Application Board Layout Guidelines
When designing the PCB onto which DWM1000 will be soldered, the proximity of the DWM100 on-board ceramic
monopole antenna to metal and other non-RF transparent materials needs to considered carefully. Two
suggested placement schemes are shown below.

For best RF performance, ground copper should be flooded in all areas of the application board, except
in the areas marked “Keep-Out Area”, where there should be no metal either side, above or below (e.g.
do not place battery under antenna).

The placement schemes in Figure 8 show an application board with no non-RF transparent material in the keep-
out area, or an application board with the antenna projecting off of the board so that the keep out area is in free-
space. In this second scheme it is still important not to place metal components above or below the antenna in a
system implementation. It is also important to note that the ground plane on the application board affects the
DWM1000 antenna radiation pattern. In Figure 8 below, d must be a minimum of 10 mm. This gives the most
vertically polarized radiation pattern. As d is increased from 10 mm the degree of vertical polarization reduces.

d d

Keep- Antenna Keep- Antenna

Out Area Out Area d d

DWM1000 DWM1000

Application Board Application Board

Figure 8: DWM1000 Application Board Keep-Out Areas

5.2 Application Circuit Diagram

A simple application circuit integrating the DWM1000 module need only power the device and connect the device
to a host controller, see Figure 9.

UWB
Chip
Antenna
DWM1000_RSTn
+3.3 V DWM1000_RSTn
EXTON 1 24 VSS

Do not do this!
RSTn must never
be pulled high by
WAKEUP 2
DWM1000 23 VSS

RSTn 3 22 IRQ / GPIO8

an external source

+3.3 V
GPIO7 4 21 VSS Optional pulldown on
IRQ to prevent Host
0.1uF

Metal Cap spurious interrupts

uProcessor
GND VDDAON 5 20 SPICLK GND

VDD3V3 6 19 SPIMISO

VDD3V3 7 18 SPIMOSI

VSS 8 17 SPICSn
GPIO5 / EXTTXE / SPIPOL 10

GPIO4 / EXTPA 11

GPIO3 / TXLED 12

GPIO2 / RXLED 13

GPIO1 / SFDLED 14

GPIO0 / RXOKLED 15
9

VSS 16
GPIO6 / EXTRXE / SPIPHA

GND

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 DWM1000 Datasheet

Figure 9: Example DWM1000 Application Circuit

5.2.1 SPI Bus

The SPI signal bus and mode configuration pins may need to be treated carefully if it is desirable to connect
additional SPI devices to the SPI bus, or to configure the SPI for a non-default clock polarity of phase behaviour.
Please see the DW1000 Datasheet [2] for a description of all SPI clock polarity and phase configurations,
referred to as SPI modes.

The SPIMISO line may be connected to multiple slave SPI devices each of which is required to go open-drain
when their respective SPICSn lines are de-asserted.

The DW1000 has internal pull up and pull down circuits to ensure safe operation
in the event of the host interface signals being disconnected. These are for
internal use only, and should not be used to pull an external signal high or low.

Internal pull-down resistance values are in the range 34 kΩ – 90 kΩ, internal pull-
up resistance values are in the range 40 kΩ - 90 kΩ.

33 VDDIOA
GPIO5
(SPIPOL) ~60kΩ
~55kΩ 24
SPICSn

SPI PORT
39
30 SPIMOSI
GPIO6 DW1000 ~55kΩ Host Controller
(SPIPHA) 40
~55 kΩ SPIMISO

41
SPICLK
~55kΩ

Figure 10: SPI Bus Connections

5.2.2 Configuring the SPI Mode

The SPI interface supports a number of different clock polarity and clock / data phase modes of operation. These
modes are selected using GPIO5 & 6 as follows: -
Table 13: DW1000 SPI Mode Configuration

GPIO 5 GPIO 6 SPI

Description (from the master / host point of view)
(SPIPOL) (SPIPHA) Mode
Data is sampled on the rising (first) edge of the clock and launched on the
0 0 0
falling (second) edge.
Data is sampled on the falling (second) edge of the clock and launched on
0 1 1
the rising (first) edge.
Data is sampled on the falling (first) edge of the clock and launched on the
1 0 2
rising (second) edge.
Data is sampled on the rising (second) edge of the clock and launched on
1 1 3
the falling (first) edge.
Note: The 0 on the GPIO pins can either be open circuit or a pull down to ground. The 1 on the GPIO pins is a pull up to VDDIO.

GPIO 5 / 6 are sampled / latched on the rising edge of the RSTn pin to determine the SPI mode. They are
internally pulled low to configure a default SPI mode 0 without the use of external components. If a mode other
than 0 is required then they should be pulled up using an external resistor of value no greater than 10 kΩ to the
VDDIO output supply.

If GPIO5 / 6 are also being used to control an external transmit / receive switch then external pull-up resistors of
no less than 1 kΩ should be used so that the DW1000 can correctly drive these outputs in normal operation after
the reset sequence / SPI configuration operation is complete.

The recommended range of resistance values to pull-up GPIO 5 / 6 is in the range of 1-10 kΩ. If it is required to
pull-down GPIO 5 / 6, such as in the case where the signal is also pulled high at the input to an external IC, the
resistor value chosen needs to take account of the DW1000 internal pull-down resistor values as well as those of

© Decawave Ltd 2016 Version 1.8 Page 18

 DWM1000 Datasheet

any connected external pull-up resistors.

Refer to the DW1000 Data Sheet [2] and the DW1000 User Manual [3] for further details.

5.2.3 Powering down the DWM1000

The DWM1000 has a very low DEEPSLEEP current (typ. 200 nA – see Table 6). The recommended practise is
to keep the DWM1000 powered up and use DEEPSLEEP mode when the device is inactive.

In situations where the DWM1000 must be power-cycled (the +3.3V supply in figure 10 turned off and then back
on) it is important to note that when power is removed the supply voltage will decay towards 0V at a rate
determined by the characteristics of the power source and the amount of decoupling capacitance in the system.

In this scenario, power should only be reapplied to the DWM1000 when: -

• VDDAON is above 2.3 V or:

• VDDAON has fallen below 100 mV

Reapplying power while VDDAON is between 100mV and 2.3V can lead to the DWM1000 powering up in an
unknown state which can only be recovered by fully powering down the device until the voltage on VDDAON falls
below 100 mV.

© Decawave Ltd 2016 Version 1.8 Page 19

 DWM1000 Datasheet

6 PACKAGE INFORMATION
The DWM1000 V2 was introduced to the market in July 2020, replacing the previous DWM1000 V1 part which
will no longer be produced. For more information on the changes from V1 to V2, see the product change notice -
PCN019.

6.1 Module Drawings

All measurements are given in millimetres.

Figure 11: Module Package Size (units: mm)

6.2 Module Land Pattern

The diagram below shows the DWM1000 module land pattern.

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DWM1000 Datasheet

Figure 12: DWM1000 Module Land Pattern (units: mm)

Table 14: Module weight

Parameter Min Typ Max Units

Unit weight 1.4 g

© Decawave Ltd 2016 Version 1.8 Page 21

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6.3 DWM1000 V1 Module Marking Information

Figure 13: DWM1000 V1 Module Marking Information

6.4 DWM1000 V2 Module Marking Information

YY Year
WW Week
1 DWM1000
SSSSS Serial number

Figure 14: DWM1000 V2 Module Marking Information

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DWM1000 Datasheet

6.5 Module Solder Profile

Figure 15: DWM1000 Module Solder Profile

© Decawave Ltd 2016 Version 1.8 Page 23

DWM1000 Datasheet

7 ORDERING INFORMATION
7.1 Tape and Reel Information for DWM1000 V1

Figure 16: DWM1000 V1 Module Carrier Dimension (units: mm)

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DWM1000 Datasheet

Figure 17: DWM1000 V1 Module Tape Carrier Dimension (units: mm)

© Decawave Ltd 2016 Version 1.8 Page 25

DWM1000 Datasheet

7.2 Tape and Reel Information for DWM1000 V2

Figure 18: DWM1000 V2 Module Carrier Dimension (units: mm)

Figure 19: DWM1000 V2 Module Tape Carrier Dimension (units: mm)

© Decawave Ltd 2016 Version 1.8 Page 26

 DWM1000 Datasheet

7.3 DWM1000 Packaging Information

7.3.1 Inner Box V2

Note 1) Recommendation: 72 hours floor time (30 degree C / 60 % RH)
Note 2) Recommendation: The time between opening and chip mount should be within 72 hours

Figure 20: Module Inner Box (units: mm)

7.3.2 Outer Box V2

Each box contents are 2000 x DWM1000 pieces total. In each box there are 4 Inner boxes containing 500 x
DWM1000 each.

Figure 21: Module Outer Box: (Module Quantity 2000 pieces)

© Decawave Ltd 2016 Version 1.8 Page 27

 DWM1000 Datasheet

8 REGULATORY INFORMATION
8.1 European Union requirements

8.1.1 Radio Equipment Directive

The DWM1000 Module has been certified for use in European Union countries. A copy of the EU Declaration of
Conformity is available for download on our website.

If these modules are incorporated into a product, the manufacturer must ensure continuing compliance of the
final product to the Radio Equipment Directive 2014/53/EU. The manufacturer must then draw up a new written
EU Declaration of Conformity as per RED Article 18.

Furthermore, the manufacturer must ensure the final product does not exceed the specified power ratings,
antenna specifications, and/or installation requirements as specified in this document. If any of these
specifications are exceeded in the final product, the manufacturer must assess whether additional compliance
testing is required.

IMPORTANT: The “CE” marking must be in compliance with the RED Article 19. It must be affixed to a visible
location on the OEM product. The CE mark shall have a height of at least 5mm except where this is not possible
on account of the nature of the apparatus. The CE marking must be affixed visibly, legibly, and indelibly.

© Decawave Ltd 2016 Version 1.8 Page 28

 DWM1000 Datasheet

8.1.2 ETSI harmonised standards

The DWM1000 module conforms with the requirements of the following ETSI standards:

Essential requirement Standard Notes

Art 3.1(a) – Health and safety EN 62479 Assessment of the Also see (1).
compliance of low-power electronic
and electrical equipment with the
basic restrictions related to human
exposure to electromagnetic fields
(10 MHz to 300 GHz)
EN62368-1 Audio/video, information
and communication technology
equipment. Safety requirements
Art 3.1(b) – EMC EN 301 489-33 Products based on DWM1000
Electromagnetic compatibility (EMC) can comply with EN 301 489-
standard for radio equipment and
services; Part 33: Specific conditions 33(1).
for Ultra-WideBand (UWB) devices
Art 3.2 – Spectrum use EN 302 065-1 Products based on DWM1000
Short Range Devices (SRD) using Ultra can comply with the EN 302
Wide Band technology (UWB); 065 series(1).
Harmonised Standard covering the
essential requirements of article 3.2
of the Directive 2014/53/EU;
Part 1: Requirements for generic
UWB applications
Art 3.3 – Delegated acts N/A There are currently no
delegated acts applicable to
UWB products.
(1) Guidance and instructions for manufacturers are available from the application note section on the
web-site. https://www.decawave.com/APR003-Certification-Guide-Europe.pdf

© Decawave Ltd 2016 Version 1.8 Page 29

DWM1000 Datasheet

9 GLOSSARY
Table 15: Glossary of Terms
Abbreviation Full Title Explanation
Equivalent The amount of power that a theoretical isotropic antenna (which evenly distributes
EIRP Isotropically power in all directions) would emit to produce the peak power density observed in the
Radiated Power direction of maximum gain of the antenna being used
European Regulatory body in the EU charged with the management of the radio spectrum and
ETSI Telecommunication the setting of regulations for devices that use it
Standards Institute
Federal Regulatory body in the USA charged with the management of the radio spectrum and
FCC Communications the setting of regulations for devices that use it
Commission
General Purpose Pin of an IC that can be configured as an input or output under software control and
GPIO
Input / Output has no specifically identified function
Institute of Electrical Is the world’s largest technical professional society. It is designed to serve
IEEE and Electronic professionals involved in all aspects of the electrical, electronic and computing fields
Engineers and related areas of science and technology
Long Inter-Frame Defined in the context of the IEEE 802.15.4-2011 [1] standard
LIFS
Spacing
Circuit normally found at the front-end of a radio receiver designed to amplify very low
LNA Low Noise Amplifier
level signals while keeping any added noise to as low a level as possible
Physical radio channel configuration in which there is a direct line of sight between
LOS Line of Sight
the transmitter and the receiver
Physical radio channel configuration in which there is no direct line of sight between
NLOS Non Line of Sight
the transmitter and the receiver
Programmable Gain Amplifier whose gain can be set / changed via a control mechanism usually by
PGA
Amplifier changing register values
Circuit designed to generate a signal at a particular frequency whose phase is related
PLL Phase Locked Loop
to an incoming “reference” signal.
Used to quantify very small relative proportions. Just as 1% is one out of a hundred,
PPM Parts Per Million
1 ppm is one part in a million
Generally used to refer to signals in the range of 3 kHz to 300 GHz. In the context of
RF Radio Frequency a radio receiver, the term is generally used to refer to circuits in a receiver before
down-conversion takes place and in a transmitter after up-conversion takes place
Real Time Location System intended to provide information on the location of various items in real-time.
RTLS
System
Start of Frame Defined in the context of the IEEE 802.15.4-2011 [1] standard.
SFD
Delimiter
Serial Peripheral An industry standard method for interfacing between IC’s using a synchronous serial
SPI
Interface scheme first introduced by Motorola
Temperature A crystal oscillator whose output frequency is very accurately maintained at its
TCXO Controlled Crystal specified value over its specified temperature range of operation.
Oscillator
Method of measuring the physical distance between two radio units by exchanging
TWR Two Way Ranging messages between the units and noting the times of transmission and reception.
Refer to Decawave’s website for further information
Method of deriving information on the location of a transmitter. The time of arrival of a
transmission at two physically different locations whose clocks are synchronized is
Time Difference of noted and the difference in the arrival times provides information on the location of
TDOA
Arrival the transmitter. A number of such TDOA measurements at different locations can be
used to uniquely determine the position of the transmitter. Refer to Decawave’s
website for further information.
UWB Ultra Wideband A radio scheme employing channel bandwidths of, or in excess of, 500MHz
Wireless Sensor A network of wireless nodes intended to enable the monitoring and control of the
WSN
Network physical environment

© Decawave Ltd 2016 Version 1.8 Page 30

 DW1000 Datasheet

10 REFERENCES
[1] IEEE802.15.4-2011 or “IEEE Std 802.15.4™‐2011” (Revision of IEEE Std 802.15.4-2006). IEEE Standard
for Local and metropolitan area networks – Part 15.4: Low-Rate Wireless Personal Area Networks (LR-
WPANs). IEEE Computer Society Sponsored by the LAN/MAN Standards Committee. Available from
http://standards.ieee.org/
[2] Decawave DW1000 Datasheet www.decawave.com
[3] Decawave DW1000 User Manual www.decawave.com
[4] Partron(Now manufactured by Abracon) Dielectric Chip Antenna, P/N ACS5200HFAUWB(Now ACA-107-T),
www.digikey.com also see www.abracon.com

11 DOCUMENT HISTORY
Revision 1.01

Page Change Description

All Update of version number to v1.01
1 Removal of range number
2 Update of table of contents
6 Modification of SPI timing diagrams figure 3 & 4 to correct timing definitions
7 Addition of note re external clock
8 Addition of footnote
20 Addition of section 4.2.3 re power down
Addition of v1.01 to table 16
27
Addition of this section & modification of heading numbers as a result

Revision 1.1

Page Change Description

All Update of version number to v1.1
4 Modification of copyright notice to 2015
12 Addition of note on Rx sensitivity
18 Addition of note on effect of application ground plane on antenna polarization
19 Addition of explanatory note to Table 14 column heading re SPI master
20 Addition of power supplies that should be removed to power down the chip
22 Addition of module weight in new Table 15 and update of all subsequent table captions
Addition of v1.1 to Table 17
27
Addition of this table

© Decawave Ltd 2016 Version 1.8 Page 31

 DW1000 Datasheet

Revision 1.2

Page Change Description

All Update of version number to v1.2
Various Minor typographical changes
7 Removal of section 1.9 External Synchronization
9 Modification to Figure 5 to correct pin names and correct the descriptions of GPIO5 & 6.
Modification to description of pin 4; removal of SYNC functionality as not applicable to DWM100.
10 - 11
Modification to description of GPIO5 / 6 – SPIPHA and SPIPOL functionality was incorrectly stated.
Addition of OTP programming voltage to table 5
12
Addition of max digital input voltage to table 5
19 Modification to Figure 10 to correct pin names
Addition of v1.2 to table 17
27 - 28
Addition of this table

Revision 1.3

Page Change Description

All Update of version number to v1.3
Various Minor typographical changes
18 Modification to application board layout guidelines
Addition of v1.3 to table 17
27 - 28
Addition of this table

Revision 1.4

Page Change Description

All Update of version number to v1.4
17 Insertion of measured antenna radiation pattern data
Addition of v1.4 to table 17
29 - 30
Addition of this table

Revision 1.5

Page Change Description

All Update of version number to v1.5
26 Update to refer to Abracon as antenna manufacturer.

Revision 1.6

Page Change Description

All Update of version number to v1.6
20 Update to Figure 11 to correct height dimension

REVISION 1.7

Page Change Description

All Update with new logo

REVISION 1.8

Page Change Description

All Update with new logo
22, 24 Added V2 label details, packaging information.
27 Add a regulatory information section

© Decawave Ltd 2016 Version 1.8 Page 32

 DW1000 Datasheet

12 FURTHER INFORMATION
Decawave develops semiconductors solutions, software, modules, reference designs - that enable real-time,
ultra-accurate, ultra-reliable local area micro-location services. Decawave’s technology enables an entirely new
class of easy to implement, highly secure, intelligent location functionality and services for IoT and smart
consumer products and applications.

For further information on this or any other Decawave product, please refer to our website www.decawave.com.

© Decawave Ltd 2016 Version 1.8 Page 33