Max Mini Micro Fas Trak Apps Manual

Maxi, Mini, Micro Family
Design Guide & Applications Manual
DC-DC Converter and Accessory Modules

Maxi, Mini, Micro Family DC-DC Converters and Configurable Power Supplies
Table of Contents
1. High Density DC-DC Converter Technology 3
2. Control Pin Functions and Applications 6
3. Design Requirements 13
4. EMC Considerations 19
5. Current Sharing in Power Arrays 21
6. Thermal Performance Information 26
7. Autoranging Rectifier Module (ARM™) 32
8. Filter / Autoranging Rectifier Module (FARM™) 37
9. Modular AC Front-End System (ENMod™) 42
10. High-Boost HAM™ 49
11. Filter Input Attenuator Module (FIAM™) Family 54
12. Output Ripple Attenuator Module (MicroRAM™) 57
13. Lead-Free Pins (RoHS) 63
14. TIn Lead Pins 68
15. Surface-Mount Socketing System (SurfMate) 73
16. Through Hole Socket-Mount System (InMate) 77
17. Glossary of Technical Terms 81
Maxi, Mini, Micro Design Guide Rev 5.7

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1. High-Density DC-DC Converter Technology Design Guide & Applications Manual
The Maxi, Mini, Micro Family of DC-DC converters are an integral Resistors can be used to trim the output voltage up or down, if
part of the company’s overall component power solution necessary. Six pin styles, three baseplate options and a variety of
strategy (Figure 1.1), which includes advanced factory and design data collection and reporting options are available. The devices
automation. The modules are available in an unlimited variety of have an operating temperature range of –55 to 100°C and come in
standard versions, to the extent that the line between custom and five product grades – E, C, T, H and M.
standard DC-DC converter bricks becomes almost indistinguishable.
Other specifications include a typical no-load to full-load regulation
The design of the control, magnetic, switching and packaging of ±0.5%, a programmable output of 10 – 110%, conversion
elements of the module resulted in a component with a power efficiencies of up to 92% depending on the voltage combination
density of up to 120W/in3 (7,3W/cm3) in three package sizes: and power level chosen, and an input-to-output isolation test
voltage of 3,000VRMS [4,242VDC]. All models are parallelable with
Maxi 4.6 x 2.2 x 0.5in [117 x 55,9 x 12,7mm] N+M fault tolerance and current sharing. Paralleling architectures
Mini 2.28 x 2.2 x 0.5in [57,9 x 55,9 x 12,7mm] feature DC- or AC-coupled interface.
Micro 2.28 x 1.45 x 0.5in [57,9 x 36,8 x 12,7mm]
The modules have one-third the number of parts of
their predecessors.
While the natural by-products of this reduction in parts count has
improved reliability and lower cost. The extra space also means that
the bulk of the converter can now be devoted almost exclusively to
the power train (i.e., the magnetic and switching elements at the
core of the design).
AC-DC Products DC-DC Products

Harmonic Attenuator Module
Unity Power Factor DC-DC Converter
Universal High Boost Single wire paralleling for
HAM high power, fault tolerant arrays.
85 – 264VAC Up to 675W
per module
Front-end System Up to 600W per module

Autoranging for EN Compliance 1 – 54Vdc
115 – 230VAC FARM3 MINIHAM
Up to 550W
Input
Output Ripple Attenuation Module
DC-DC Converter combines active and passive filtering.
Autoranging
Filter / Autoranging Rectifier Module
90 – 132VAC QPO provides active filtering to
180 – 264VAC Up to 1,000W QPO
Up to 300W per module achieve differential noise attenuation.
1 – 48VDC
Autoranging Autoranging Rectifier Module

90 – 132VAC
Up to 1,500W DC-DC Converter
180 – 264VAC
DC-DC Products Up to 150W per module

1 – 48VDC
Nominal Input
18 – 425VDC
Transient Protection,
28VDC, 48VDC, Inrush Current Limiting EMI Filter
270VDC Up to 25A
24VDC, 28VDC, Active EMI Filter

QPI
48VDC Up to 576W @ 48V
Figure 1.1 — Component power solutions with the Maxi, Mini, Micro Family

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Key to the design of Maxi, Mini, Micro converters is its high level The Maxi, Mini, Micro devices use a proprietary, low-noise,
of component-level integration. (Figure 1.2) With the aid of hybrid integrated power device that has an order of magnitude lower
technology, the device packs all control functions and active parasitic effect.
circuitry into two (primary and secondary side) ICs occupying a total
The advances made in the overall design of the Maxi, Mini, Micro
volume of less than 1/10in3 [1,6cm3] each.
Family DC-DC converters have been complemented by equally
With Maxi, Mini, Micro devices, the plated-cavity transformer significant advances in the technology used to manufacture
cores use copper armor, plated onto the ferrite core, to more them. Vicor invested in a custom, fully-automated assembly
closely confine the magnetic flux to couple widely separated line specifically designed for the assembly of Maxi, Mini, Micro
primary and secondary windings. The wider separation provides power components. To further augment its Maxi, Mini, Micro
greater isolation and therefore lowers input-to-output parasitic product offering, Vicor has created an online user-interface tool,
capacitance and noise. The plated cavity also serves to conduct PowerBenchTM, that allows customers to specify DC-DC module
heat away from the transformer to the baseplate, thus increasing requirements anytime, anywhere via the internet.
the power-handling capability of the powertrain and minimizing
temperature rise.
The powertrain assembly is contained between the baseplate and a
terminal-block assembly, with input and output pins recessed. This
allows the converter body to be mounted into an aperture in the
PCB to reduce the height above board. The modules may be wave
soldered or plugged into through-hole or surface-mount sockets.
Bottom View
• Standard MLP power devices Baseplate
• Efficient pick-and-place assembly • Simplified baseplate construction
Model Number
Serial No. & Date Code
Top View
• Surface-mount components for greater Complete Assembly
manufacturing efficiency
• Insert molded terminal block for more
• Standard reflow process accurate pin positioning
• One-piece cover with label
• Encapsulated for superior thermal performance
Figure 1.2 — Maxi assembly shows high level of integration

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The Maxi, Mini, Micro’s ZCS / ZVS power-processing architecture Maxi, Mini, Micro transformers place the primary and secondary
(Figure 1.3) enables efficient, low-noise, high-frequency operation. windings far apart, but contain the magnetic flux using a copper
The main switch is common drain for improved thermal and noise armor plated onto the ferrite core. The armor also conducts excess
management. The reset switch located within the primary control heat to the baseplate.
IC is common source for ease of control.
The control circuitry is integrated into two (primary- and
secondary‑side) ICs. The result is a significant reduction in parts
with the ensuing savings in cost and increase in reliability. This
integration also provides extra room for the power train.
+IN +OUT
PC +SENSE*
SC
PR –SENSE*
–IN –OUT
Primary Control IC Secondary Control IC
Figure 1.3 — Maxi, Mini, Micro: Basic powertrain and control (*Not included in Micro family)

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2. Control Pin Functions and Applications Design Guide & Applications Manual
Primary Control (PC Pin) Primary Auxiliary Supply: At 5.75V, the PC can source up to
1.5mA. In the example shown in Figure 2.3, PC powers a LED to
Module Enable / Disable: The module can be disabled by pulling indicate the module is enabled. Another example of an isolated
the PC below 2.3V with respect to the –Input. This should be done on‑state indicator is shown in Figure 2.5.
with an open-collector transistor, relay or optocoupler. Multiple
converters may be disabled with a single transistor or relay via Note: When the module has detected a fault or when the input
“ORing” diodes. When using a mechanical switch or relay to voltage is above or below the normal operating range the PC voltage
control the PC pin, please ensure that the contacts are properly will pulse.
debounced with a capacitor (10nF max.) to avoid switch bounce.
Module Alarm: The module contains “watchdog” circuitry
NOTE: Do not exceed a repetitive on / off rate of 1Hz to the PC pin or that monitors input voltage, operating temperature and internal
input voltage pins. operating parameters. (Figures 2.2a and 2.2b) If any of these
parameters is outside their allowable operating range, the
An optocoupler must be used when converters are located on module will shut down and PC will go low. (Figure 2.4) Then PC
different PC boards, when a common-mode inductor is used will periodically go high and the module will check to see if the
directly at the module input or when the distance between fault (as an example, input undervoltage) has cleared. If the fault
the converters would cause excessive voltage drops. Under no has not been cleared, PC will go low again and the cycle will
circumstances should the PC pin be pulled negative more than a restart. The SC pin will go low when a fault occurs and return to
diode drop below the module –IN. (Figure 2.1) When the PC pin its normal state after the fault has been cleared. An example of
is pulled low the PC current will pulse similar to the PC voltage using a comparator for monitoring on the secondary is shown in
shown in Figure 2.4. When the outputs of two or more converters Figures 2.6a and 2.6b.
are connected in a parallel array to increase system power the
converters should be “group enabled” to ensure that all the
converters start at the same time. The PC pins of all converters
in the array should be controlled by an external circuit which will
enable the converters once the input voltage is within the normal
operating range.
+IN Input Undervoltage

Input Overvoltage
+IN Auto Overtemperature +OUT
Restart Module Faults
SW1
PC PC +S
2 – 20ms typ.
f (VIN)
50Ω
SW1, 2, & 3 SC
shown in SW2 SW3 1kΩ
PR 1MΩ
Disable PR "Fault" position –S
5.7VDC
–IN (0 – 3mA) 1.23 –OUT
–IN VDC 6kΩ
Disable = PC <2.3V
Figure 2.1 — Module Enable / Disable Figure 2.2a — PC and SC module alarm logic (Maxi / Mini)
Input Undervoltage
Input Overvoltage
+IN Over Temperature
Module Faults +OUT +IN
Auto
Restart
SW1
PC 50Ω PC
2 – 20ms typ.
f(VIN)
SC 4kΩ
SW2 SW3
1kΩ
"Module
PR 5.7VDC
Enabled" PR
1MΩ (0 – 3mA) 6kΩ
1.23
VDC –IN
–IN SW1, 2, & 3 shown –OUT
in "Fault" position
Figure 2.2b — PC and SC module alarm logic (Micro) Figure 2.3 — LED on-state indicator

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Optocoupler +IN
Fault 400µs typ.
5.7V PC
PC
4kΩ
PR
1.23V
SC 2 – 20ms typ. –IN
Figure 2.4 — PC / SC module alarm timing Figure 2.5 — Isolated on-state indicator
+IN +OUT Comparator +IN +OUT Comparator
PC +S
PC
SC SC
Alarm PR Alarm
PR –S
1.00V 1.00V
–IN –OUT
–IN –OUT
Figure 2.6a — Secondary side on-state (Maxi / Mini) Figure 2.6b — Secondary side on-state (Micro)
Parallel Bus (PR Pin) Connection methods for the PR bus include:
A unique feature has been designed into Vicor Maxi, Mini, 1. AC-coupled single-wire interface: All PR pins are connected
Micro converter modules that facilitates parallel operation for to a single communication bus through 0.001µF (500V)
power expansion or redundancy. The PR pin is a bidirectional capacitors. This interface supports current sharing and is fault
port that transmits and receives information between modules. tolerant except for the communication bus. (Figure 2.7) This
The pulse signal on the parallel (PR) bus serves to synchronize method may normally be used with a maximum of
the high‑frequency switching of each converter which in turn three converters.
forces them to load share. These modules possess the ability to
arbitrate the leadership role; i.e., a democratic array. The module 2. Transformer-coupled interface: Modules or arrays of
that assumes command transmits the sync pulse on the parallel modules may also be interfaced to share a load while providing
bus while all other modules on the bus listen. In the event of a galvanic isolation between PR pins via a transformer‑coupled
failure of the lead module, the array “elects” a new leader with no interface. For large arrays, buffering may be required.
interruption of the output power. The power source for the buffer circuit may be derived
from the PC pins. For arrays of four or more modules, the
transformer‑coupled interface is recommended. (Figure 2.8)

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Parallel Operation Considerations be at least 60MHz, and the signal attenuation must be minimized
so that the PR pulse level at the PR pin is not less than 4V. In most
Care must be taken to avoid introducing interfering signals (noise)
cases transformer coupling without buffering is adequate for up
onto the parallel bus that may prevent proper load sharing between
to four modules connected in parallel. A damping resistor must be
modules, instability or module failure. One possible source of
added in series with the PR pin of each module; the resistor must
interference is input ripple current conducted via the + and –Input
be located in close proximity to the PR pin and should not be less
power pins. The PR signal and DC power input share a common
than 33Ω. Table 2.1 below lists the recommended values. The PR
return, which is the –Input pin. Steps should be taken to decouple
pulse fidelity should be checked during the development stage
AC components of input current from the parallel bus. The input
of the module array to ensure it has sufficient amplitude and it
to each converter (designated as + and – pins on the input side of
is free of resonance. Please refer to Application Note AN:207 for
the module) should be bypassed locally with a 0.2µF ceramic or
further details.
film capacitor. This provides a shunt path for high‑frequency input
ripple current. A Y-rated 4,700pF capacitor should be connected
Number of Converters in Parallel *R1 value Ω
between both the + and –Input pins and baseplate of each
module, thus creating a shunt path for common‑mode components 2 75
of current. Attention to the PC board artwork should minimize the 3 50
parasitic impedance between –Input pins of parallel modules to
ensure that all PR pins are referenced to the same potential or use a 4 33
transformer-coupled interface. Modules should be placed physically 5 or more refer to application note:
close to each other and wide copper traces (0.75in [19mm], 2oz Designing High-Power Arrays
copper) should be used to connect power input pins. A dedicated using Maxi, Mini, Micro
layer of copper is the ideal solution. Family DC-DC Converters
Some applications require physical separation of paralleled Table 2.1 — Recommended damping resistor (*R1) values
modules on different boards and / or input power from separate
sources. For applications using separate sources, please refer to
Careful layout is important for the PR bus to avoid noise pickup.
the “Hot‑Swap Capability Eliminates Downtime” application note
The PR bus should not be run underneath or alongside the
on the Vicor website. In these cases, transformer coupling of
modules, nor should it pass in close proximity to strong magnetic
the PR signal, per Figure 2.8, is required to prevent inter‑module
or electrostatic fields. When the outputs of two or more modules
common‑mode noise from interfering with the sync-pulse
are joined in a parallel array, the modules should be “group
transmission. High-speed buffering may be required with large
enabled” to ensure that they all start at the same time. The PC
arrays or if the distance between modules is greater than a few
pins of all converters in the array should be controlled by an
inches. This is due to the fact that all modules, except the one
external circuit which will enable the converters once the input
that’s talking, are in the listening mode. Each listener presents a
voltage is within the normal operating range. Please consult with
load to the parent (talker), which is approximately 500Ω shunted
Applications Engineering at any Vicor Technical Support Center for
by 30pF capacitance. Long leads for the interconnection introduce
additional information.
losses and parasitic reactance on the bus, which can attenuate and
distort the sync‑pulse signal. The bandwidth of the PR bus must
4.7nF 4.7nF
+ +IN + +IN
0.2µF
PC 0.2µF PC
0.001µF
R1* Module 1 T1 R1* Module 1
PR PR
–
–IN –IN
4.7nF
–
Low inductance 4.7nF
ground plane
or bus
4.7nF 4.7nF
+IN +IN
0.2µF
PC Module 2 0.2µF PC Module 2
0.001µF R1* T2 R1*
PR PR
–IN –IN
4.7nF 4.7nF
Parallel Parallel
Bus Bus
Figure 2.7 — AC-coupled single-wire interface Figure 2.8 — Transformer-coupled interface

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Control Functions and Output Considerations Array Output Overvoltage Protection (OVP): In order to
maintain the highest possible uptime of a parallel array the
Parallel Operation (PR Pin): The PR pin supports paralleling
converters use an output overvoltage protection
for increased power with N+1 or N+M redundancy. Modules of
system (OVP) that is highly resistant to false tripping. For the
the same part number will current share if all PR pins are suitably
converter to shut down due to an OVP condition, two conditions
interfaced. Figures 2.9 and 2.10 show connections for the Maxi
must be satisfied (logical AND);
and Mini modules; Figure 2.11 shows connections for Micro array.
Applications containing two or more Micro modules must define a 1. The voltage at the output terminals must be greater than the
designated parent (talker) by stagger trimming the output voltage OVP set point.
of each subsequent module down by at least 2% or setting the
remaining Micro modules in the system as designated listeners by 2. The secondary control IC within the converter must be
connecting the SC pin to the negative output pin. requesting a power-conversion cycle from the internal primary
control IC.
PR Pin Considerations: When paralleling modules, it is important
that the PR signal is communicated to all modules within the By using this logic, false tripping of individual converters due
parallel array. Modules that do not receive a PR pulse in a parallel to externally induced OVP conditions such as load dumps
array will not current share and may be damaged by running in an or being driven by an external voltage source at the output
overpower condition. terminals is minimized.
All modules in an array must be of the same part number. Series Modules connected in a parallel array rely on the active‑parent
connection of outputs is accomplished without connecting the PR module for OVP of the entire array. Modules acting as boosters
pins and allowing each module to regulate its own output voltage. (children) in the array are receiving external requests for
Since the same current passes through the output of each module power‑conversion cycles (PR pulse) and will not shut down from an
with the series connection, power sharing is inherent. Series OVP condition. Therefore it is imperative that the + and –Output
connection of inputs requires special precautions, please contact pins of modules connected in a parallel array never be allowed
Applications Engineering for assistance. to become open circuited from the output bus. An open circuit at
the output terminals will result in terminal voltages far in excess of
the normal rating causing permanent damage to the module and
• The +OUT and –OUT power buses should be possible hazardous conditions.
+OUT designed to minimize and balance parasitic
+S +S
impedance from each module output
Module 1 SC
–S –S to the load.
–OUT +OUT
+S • The +Sense pins should be tied to the same Plane
point on the +OUT power bus; (Figure 2.10)
Module #1
Designated SC
+OUT the –Sense pins should be tied to the same
+S +S
Parent
–OUT
• The +OUT and –OUT power buses should be
point on the –OUT power bus.
Module 2 SC Load designed to minimize and balance parasitic
–S
–S
• At the discretion of the power system impedance from each module output to the load.
–OUT +OUT
designer, a subset of all modules within
Module #2 L • At the discretion of the power system designer,
–S an array may be configured as children by SC O
trimmed A a subset of all modules within an array may be
+OUT shorting SC to –S. D
down 2% configured as children by shorting SC to –OUT.
+S –OUT
Module N+1 SC • ORing diodes may be inserted in series with
• Do not use output ORing diodes with parallel
–S
the +OUT pins of each module to provide
–OUT +OUT arrays of the Micro.
module output fault tolerance.
Module #3
trimmed SC
Ground
down 4%
Figure 2.9 — N+1 module array output connections (Maxi and Mini) –OUT
Plane
Figure 2.11 — Parallel module array output connections (Micro)
+OUT
+S
SC
–S
–OUT +Sense from

other modules
in the array
Figure 2.10 — ORing diodes connections (Maxi and Mini)

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Control Functions, Secondary Control (SC Pin) It is recommended that the maximum rate of change applied to the
SC pin be limited to 30Hz, sinusoidal. Small step-up changes are
Output Voltage Programming: The output voltage of the
permissible; however, the resultant change in the output voltage
converter can be adjusted or programmed via fixed resistors,
can create significant current demands due to charge requirements
potentiometers or DACs.
of both the internal and external output capacitance. In no case
Trim Down: The converter is not a constant-power device; it has should the converter be driven beyond rated continuous output
a constant-current limit. Hence, available output power is reduced current. The response to programming a lower output voltage
by the same percentage that output voltage is trimmed down. Do is limited by the energy stored in both the internal and external
not exceed maximum-rated output current. The trim-down resistor output capacitance and the load. The converter cannot sink current
must be connected to the –S pin (–Out pin on a Micro). to lower the output voltage other than a minimal internal preload.
(Figures 2.12a and 2.12b)
Contact Applications Engineering if the module’s output is to be
Trim Up: The converter is rated for a maximum delivered power. dynamically trimmed.
To ensure that maximum rated power is not exceeded, reduce
Trimming resistor calculators are available on the Vicor web site at
maximum output current requirement in the application by the
https://www.vicorpower.com/powerbench. (Figure 2.16)
same percentage increase in output voltage. The trim-up resistor
must be connected to the +S pin (+OUT pin on a Micro.) Do not Resistor values can be calculated for fixed trim up, fixed trim
trim the converter above maximum trim range (+10%) or the down and for variable trim up or down. In addition to trimming
output overvoltage protection circuitry may be activated. information, the web also includes design tips, applications circuits,
(Figures 2.13a and 2.13b) EMC suggestions, thermal design guidelines and PDF data sheets
SC Pin and Output Voltage Trimming: If no connection is made for all Vicor products. Evaluation Boards (Figure 2.15) are available
for the Maxi, Mini and Micro DC-DC converters.
to the SC pin, the SC pin voltage will be 1.23V referenced to –S
(–OUT pin on a Micro) and the output of the converter will equal
the nominal output voltage. When the SC pin voltage is set by an
external source such as a D/A converter, the % change in SC will be
equal the % change in the output voltage.
For example, an application requires a +10, 0% (nominal), and
a –15% output voltage adjustment for a 48V output converter.
Referring to the table below, the voltage that should be applied to
the SC pin would be as follows:
VSC VOUT Change from Nominal

1.046 40.8 –15%
1.230 48.0 0%
1.353 52.8 +10%
Circuits such as op-amps and D/A converters, which directly drive

the SC pin, should be designed to limit the applied voltage to the
SC pin. It is also important to consider voltage excursions that may
occur during initialization of the external circuitry. The external
circuit must be referenced to the –S pin (–OUT on Micro).
See Figure 2.14 for remote sense implementation on Micro.
For systems that require an adjustable output voltage, it is good
practice to limit the adjustment range to a value only slightly
greater than that required. This will increase the adjustment
resolution while reducing noise pickup.

Page 10 of 87 05/2023
+OUT
+IN +OUT
+S
Error PC
SC Load Error
Amp RD Amp SC Load
Trim Down PR
1kΩ 0.033μF –S 1kΩ 0.033μF
RD
Trim Down
–OUT –IN –OUT

1.23V
1.23V
1,000 VOUT 1,000VOUT

RD (Ω) = RD (Ω) =
VNOM – VOUT VNOM – VOUT
Figure 2.12a — Output voltage trim-down circuit (Maxi / Mini) Figure 2.12b — Output voltage trim-down circuit (Micro)
+OUT
+IN +OUT
+S RU
RU
Error Trim Up
SC Trim Up Load PC
Amp Error
Amp SC Load
1kΩ 0.033μF –S PR
1kΩ 0.033μF
–OUT –IN –OUT
1.23V 1.23V
1,000 (VOUT – 1.23) VNOM 1,000 (VOUT – 1.23) VNOM

RU (Ω) = – 1,000 RU (Ω) =
1.23 (VOUT – VNOM) – 1,000
1.23 (VOUT – VNOM)
Figure 2.13a — Output voltage trim-up circuit (Maxi / Mini) Figure 2.13b — Output voltage trim-up circuit (Micro)
+OUT
+S
R7 21.0kΩ
R4 C3
R9
R1 C2 R8
R3
R5 U2 0.22µF 4.02kΩ
R2 U1 2.55kΩ
1.00kΩ TLV431 VCC
SC R Load
R11 R6 C1
– –
36.5kΩ 1.65kΩ 470pF

PS2701 + 200mV + R10
U3 1.24kΩ
LM10 Gnd
–S
–OUT
This module is designed for point of load regulation, where remote sensing is not required.
Active voltage drop compensator, as shown here, may be used in applications with
significant distribution losses.
Please consult with the Micro Family Isolated Remote Sense Application Note for
additional information.
Figure 2.14 — Voltage-drop compensation (Micro) Figure 2.15 — Evaluation Boards; Available for Maxi, Mini and
Micro Family DC-DC converters

Page 11 of 87 05/2023
Evaluation Boards
n Three styles: Maxi, Mini or Micro
n Short-pin and long-pin compatible
n Easy I/O and control connections
n Includes fusing and capacitors
n Can be paralleled for higher power arrays
Description Part Number

Maxi board style 24644R
Mini board style 24645R
Micro board style 24646R
Figure 2.16 — Online trim calculator

Page 12 of 87 05/2023
3. Design Requirements Design Guide & Applications Manual
Safety Considerations lists the acceptable fuse types and current rating for the Maxi,
Mini, Micro Family of DC-DC converters. Safety Certifications
Fusing: Safety agency conditions of acceptability require that the
on the Vicor web site should always be consulted for the latest
module positive (+) Input terminal be fused and the baseplate of
fusing requirements.
the converter be connected to earth ground. The following table
Acceptable Fuse Types and Current Rating for the Maxi, Mini, Micro Family of Converters
Package Size Input Voltage (V) Output Voltage (V) Output Power (W) Required Fuse
Maxi (A) 375 2 160 Bussmann PC-Tron 5A

Maxi (A) 375 3.3 264 / 200 Bussmann PC-Tron 5A
Maxi (A) 375 5, 8 400 / 300 Bussmann PC-Tron 5A
Maxi (A) 375 12, 15, 24, 28, 32, 36, 48, 54 600 / 400 Bussmann PC-Tron 5A
Mini (B) 375 2 100 Bussmann PC-Tron 5A

Mini (B) 375 3.3 150 / 100 Bussmann PC-Tron 5A
Mini (B) 375 5, 8 200 / 150 Bussmann PC-Tron 5A
Mini (B) 375 12, 15, 24, 28, 36, 48 300 / 200 Bussmann PC-Tron 5A
Micro (C) 375 2 50 Bussmann PC-Tron 3A

Micro (C) 375 3.3 75 / 50 Bussmann PC-Tron 3A
Micro (C) 375 5, 8 100 / 50 Bussmann PC-Tron 3A
Micro (C) 375 12, 15, 24, 28, 36, 48 150 / 75 Bussmann PC-Tron 3A
Maxi (A) 300 2 160 Bussmann PC-Tron 5A

Maxi (A) 300 3.3 264 / 200 Bussmann PC-Tron 5A
Maxi (A) 300 5, 8 400 / 300 Bussmann PC-Tron 5A
Maxi (A) 300 12, 15, 24, 28, 36, 48 500 / 400 Bussmann PC-Tron 5A
Mini (B) 300 2 100 Bussmann PC-Tron 5A


Micro (C) 300 5, 8 100 / 50 Bussmann PC-Tron 3A
Micro (C) 300 12, 15, 24, 28, 36, 48 150 / 75 Bussmann PC-Tron 3A
Maxi (A) 150 3.3 264 / 200 Bussmann ABC-8

Maxi (A) 150 5, 8 400 / 300 Bussmann ABC-8
Maxi (A) 150 12, 15, 24, 28, 36, 48 500 / 400 Bussmann ABC-8

Micro (C) 150 3.3 75 Bussmann PC-Tron 3A

Micro (C) 150 5, 8 100 Bussmann PC-Tron 3A
Micro (C) 150 12, 15, 24, 28, 36, 48 150 Bussmann PC-Tron 3A

Maxi (A) 110 5, 8 300 / 200 Bussmann ABC-8
Maxi (A) 110 12, 15, 24, 28, 36, 48 400 / 300 Bussmann ABC-8



Page 13 of 87 05/2023
Acceptable Fuse Types and Current Rating for the Maxi, Mini, Micro Family of Converters (Cont.)
Package Size Input Voltage (V) Output Voltage (V) Output Power (W) Required Fuse
Maxi (A) 72 3.3 264 Bussmann ABC-12

Maxi (A) 72 5, 8 300 Bussmann ABC-12
Maxi (A) 72 12, 15, 24, 28, 36, 48 400 Bussmann ABC-12
Mini (B) 72 3.3 100 Bussmann ABC-8

Mini (B) 72 5, 8 150 Bussmann ABC-8
Mini (B) 72 12, 15, 24, 28, 36, 48 250 Bussmann ABC-8


Maxi (A) 48 5, 8 400 Bussmann ABC-15
Maxi (A) 48 12, 15, 24, 28, 36, 48 500 Bussmann ABC-20
Mini (B) 48 2 100 Bussmann ABC-8

Mini (B) 48 5, 8 200 Bussmann ABC-10

Micro (C) 48 5, 8 100 / 75 / 50 Bussmann ABC-8
Micro (C) 48 12, 15, 24, 28, 36, 48 150 / 75 Bussmann ABC-8

Maxi (A) 28 5 175 Bussmann ABC-25
Maxi (A) 28 6.5, 8, 12, 15, 24, 28, 36, 48 200 Bussmann ABC-30

Mini (B) 28 5 75 Bussmann ABC-15
Micro (C) 28 3.3 50 Bussmann ABC- 8

Micro (C) 28 5 50 Bussmann ABC-10
Micro (C) 28 12, 15, 24, 28, 36, 48 100 Bussmann ABC-10

Maxi (A) 24 5, 8, 12, 15, 24, 28, 36, 48 400 / 300 Bussmann ABC-30
Mini (B) 24 3.3 150 / 100 Bussmann ABC-15

Mini (B) 24 5, 8, 12, 15, 24, 28, 36, 48 200 / 150 Bussmann ABC-15
Micro (C) 24 3.3 75 / 50 Bussmann ABC-8

Micro (C) 24 5, 8, 12, 15, 24, 28, 36, 48 100 / 50 Bussmann ABC-10

Page 14 of 87 05/2023
The fuse must be in series with the positive (+) Input lead. Fusing High-Power Arrays and PR Pin
the negative (–) Input lead does not provide adequate protection
To simplify the implementation of large arrays, a subset of modules
since the PR and PC terminals of the converter are referenced to
within the parallel array should be configured as boosters (listeners)
the –Input. If a fuse located in the –Input lead were to open, the
by connecting the SC pin to the –S pin. Modules, which are
PR and PC terminals could rise to the potential of the +Input. This
configured as boosters, cannot assume the role of drivers (talkers)
may damage any converter or circuitry connected to these pins.
for N+M redundant arrays. Modules configured as boosters may be
The fuse should not be located in an area with a high ambient
locally sensed.
temperature as this will lower the current rating of the fuse.
Each module within the parallel array must be properly bypassed
Thermal and Voltage Hazards with capacitors. Film or ceramic types should be used across
Vicor component power products are intended to be used within the input of the module and between each input lead and
protective enclosures. Vicor DC-DC converters work effectively the baseplate. Modules having input sources, which are not
at baseplate temperatures, which could be harmful if contacted connected to SELV sources, should use X-capacitors across
directly. Voltages and high currents (energy hazard) present at the input and Y-capacitors from each input power pin to the
the terminals and circuitry connected to them may pose a safety baseplate. When in doubt about capacitor safety approvals, always
hazard if contacted or if stray current paths develop. Systems with consult with the governing safety regulatory agency or Vicor
removable circuit cards or covers which may expose the converter(s) Applications Engineering.
or circuitry connected to the converters, should have proper A maximum of 12 modules may be directly connected in parallel.
guarding to avoid hazardous conditions. Please contact Vicor Applications Engineering for assistance
The module pins are intended for PCB mounting either by wave with larger arrays.
soldering to a PCB or by insertion into one of the recommended The PR pin is referenced to the –IN pin; therefore, all modules
PCB socket solutions. Use of discrete wire soldered directly to the within the array must have a common low-impedance connection
pins may cause intermittent or permanent damage to the module; between each –IN pin. Special precautions are necessary if a PCB
therefore, it is not recommended as a reliable interconnection is not used for interconnection of modules, because the wiring
scheme for production as a final released product. In addition, impedance can be significant. Do not allow the connection
modules that have been soldered into printed circuit boards and between the –IN pin and the –IN bus to become disconnected as
have subsequently been removed should not be reused. damage to the module will result.
PC Pin Coupling transformers should be used to transmit the PR pulse

if long distances between each module are anticipated or if the
The PC pin should be used only to disable the module, provide interconnection impedance of the –IN leads is high or questionable.
a bias to input referenced circuitry or communicate status of the PR coupling transformer(s) should be used if the PR pulse exits the
module. The PC pin is referenced to the –Input pin. All circuits that PCB. For example, an array constructed of multiple circuit cards
connect to the PC pin must use the –Input as the reference. Do plugged into a backplane with a number of converters on each
not break the connection between the –Input and the circuitry card should have a PR coupling transformer at the entry point of
connected to the PC pin or damage to the module will result. each card; however, no coupling transformer would be required
Additional requirements include: between each converter on the card of three or less converters on
n Circuits that derive their power from the PC pin must not a single PCB. Do not externally drive the PR pin, connection to this
exceed 1.5mA. pin is limited to Vicor module application only.
n Do not drive the PC pin with external circuitry. Input Source Impedance
n Do not attempt to control the output of the converter by PWM The impedance of the source feeding the input of the module
pulsing of the PC pin, or exceed a repetitive on / off rate of 1Hz. directly affects both the stability and transient response of the
For applications where the converter will be disabled on a regular module. In general, the source impedance should be lower
basis or where capacitance is added to this pin, please contact than the input impedance of the module by a factor of ten,
Vicor Applications Engineering. from DC to 50kHz.

Page 15 of 87 05/2023
To calculate the required source impedance, use the Output Connections

following formula: For systems designed to charge batteries, subject the module
output to dynamic loading or loads that have large reactive
Z = 0.1(VLL)2 / PIN components, please contact Vicor Applications Engineering to
discuss your application in detail.
where: Do not externally drive the output of the module 10% above its
Z is required input impedance nominal setpoint voltage.
VLL is the low line input voltage Modules that are used to charge batteries should be applied with a
PIN is the input power of the module diode in series with the output of the module. The charge current
Filters, which precede the module, should be well damped to must be externally controlled to ensure that the module is not
prevent ringing when the input voltage is applied or the load on operated in excess of its power or current rating.
the output of the module is abruptly changed. Current-carrying conductors should be sized to
minimize voltage drops.
Input Transients and Surges
Do not use output ORing diodes with parallel arrays of the Micro
The voltage applied to the input of the module must not exceed
Family converters.
the ratings outlined in the data sheet. Protection devices such as
Zener diodes and MOVs should be used to protect the module Output Overvoltage Protection (OVP): The OVP detection
from short-duration transients. These shunt protection devices circuitry within the converter is highly resistant to false tripping.
are effective only if the source impedance is high relative to the For the converter to shut down due to an OVP condition two
impedance of the protection device when it is conducting. For conditions must be satisfied (logical AND):
voltage surges where the abnormal voltage is present for a long
period of time, shunt protection devices can easily be damaged by 1. The voltage at the output terminals must be greater than the
the power dissipated. For this type of condition, a voltage limiter OVP set point.
in series with the input of the module may be the best solution. 2. The secondary control IC within the converter must be
Vicor Applications Engineering can assist in recommending the requesting a power-conversion cycle from the internal primary
appropriate type of protection for the module. control IC.
NOTE: Do not allow the rate of change of the input voltage to exceed By using this logic, false tripping of individual converters due to
10Vµs for any input voltage deviation. To prevent damage, allow a externally induced OVP conditions such as load dumps or, being
minimum of 1s between power on / off / on cycles to allow for the driven by external voltage sources at the output terminals is
reinitialization of converter soft start. minimized. The user should not test the OVP circuit by back driving
the output terminals or by any other means as the OVP circuitry is
Sense Leads (Mini and Maxi only)
fully tested as part of the inline manufacturing process.
The sense leads of the module must always terminate either
directly to the output pins (local sense) or at the load (remote Overcurrent Protection
sense). When remote sense is used, the output wiring impedance
The Maxi, Mini, Micro converters incorporate a straight-line type
in combination with the load impedance can cause significant
current limit. (Figure 3.1) As output current is increased beyond
loss of phase margin and result in oscillation and possible damage
Imax, the output voltage remains constant and within its specified
to the module, poor transient response, or activation of the
limits up to a point, IKNEE, which is typically 5 – 25% greater than
output overvoltage protection. Long sense leads may require a
rated current, Imax. Beyond IKNEE, the output voltage falls to
compensation circuit for stability.
Ishortcircuit. Typically, modules will automatically recover after the
Protection circuitry is required if the possibility of reversed sense overcurrent condition is removed.
leads can occur. Please contact Vicor Applications Engineering for
specific recommendations.
Do not exceed 1V between –S and –OUT leads. This is an
important consideration if the converter is used in a Hot-Swap
application. ORing diodes, if used, should be located in the
+Output lead to avoid exceeding this rating.
Do not exceed the rated power of the converter. The total of the
power consumed by the load plus the power lost in conductors
from the converter to the load must be less than the output power
rating of the converter.

Page 16 of 87 05/2023
Absolute Maximum Ratings

IMAX IKNEE Please consult the latest module data sheets available on the Vicor
VOUT website for maximum ratings concerning pin-to-pin voltages,
isolation, temperature, and mechanical ratings.
Grounding of Baseplate and Referencing of Input and

Output Terminals
The baseplate of the converter should always be connected
to earth ground. If for any reason this is not possible in your
application please consult with Vicor Applications Engineering for
acceptable alternatives for your application.
The input and output leads of the converter should be referenced
to the baseplate at some point to avoid stray voltages. For offline
IOUT
ISHORT CIRCUIT applications the input leads are often referenced to earth ground
at the AC source ahead of the bridge rectifier. Either + or –Output
terminal may be referenced to earth ground and the baseplate.
Figure 3.1 — Typical Maxi, Mini, Micro current limiting “Floating” inputs or outputs should at a minimum have a
high‑resistance divider to bleed off stray charges to avoid damage
to the insulation system.
Maximum Output Capacitance
In general, adding external capacitance to the Maxi, Mini, and High-Frequency Bypassing
Micro’s output is not required. However, it is often common All Vicor converters must be bypassed for proper operation.
practice with power supply designs to add external capacitance (Figure 3.2) The minimum complement of high-frequency bypass
to the converter output for attenuation of output ripple and / capacitors must consist of the following:
or improving dynamic load performance. The Maxi, Mini, Micro
converters typically have a faster response to dynamic loads than n 0.2µF ceramic or film type connected between +IN and –IN.
other power solutions; hence, external capacitors may not be n 4.7nF Y-capacitor between +IN and baseplate and –IN and
necessary. In addition, the output ripple and noise specification baseplate.
listed on the data sheet may be acceptable for many applications.
n 10nF ceramic or film capacitor between +OUT and baseplate
A general equation for determining the maximum recommended and –OUT and baseplate.
output capacitance is as follows:
All applications utilizing Maxi, Mini, Micro converters should
be properly bypassed, even if no EMC standards need to be
POUT
VOUT (
400 • 10–6)
met. Bypass VIN and VOUT pins to each module baseplate as
shown in Figure 3.2. Lead length should be as short as possible.
CFARAD = Recommended values vary depending on the front end, if any, that
VOUT is used with the modules, and are indicated on the appropriate
data sheet or application note. In most applications, C1 is a
4,700pF Y-capacitor (Vicor P/N 01000) carrying the appropriate
where: safety agency approval; C2 is a 4,700pF Y-capacitor
POUT is the output power of the converter (Vicor P/N 01000) or a 0.01µF ceramic capacitor rated at 500V.
VOUT is the nominal output voltage of the converter In PC board applications, each of these components is typically
small enough to fit under the module baseplate flange. For PCB
The capacitance value is not the absolute maximum value, but mounting of the module. Please refer to Figures 3.3 and 3.4.
the value for which general application of the converter can be
deemed appropriate. Testing will be required to ensure that the
module is stable if the maximum capacitance value is used. 10% of
the modules available output current will be used to initially charge
the capacitor. Therefore, a resistive load should utilize no greater
than 90% of the rated current.
Caution: If exceeding this value, it is recommended that Vicor
Applications Engineering be consulted.

Page 17 of 87 05/2023
Standoffs also provide necessary

mechanical support in order to
prevent mechanical stresses from
C1a C2a damaging the module during shock / vibration.
+IN +OUT
CIN Maxi, Mini, Micro

DC-DC Converter
–IN –OUT
C1b C2b
Standoff sitting on pad / plated through-hole Female-female standoffs are
that is connected to the chassis shown, however standoffs are
Baseplate grounded ground plane within the PCB. also available in male-female versions.
Figure 3.2 — Minimum recommended bypassing for Maxi, Mini, Figure 3.3 — Recommended mounting method using standoffs
and Micro; Keep all leads short
Onboard Mount Inboard Mount

Cross-sectional view of pins Cross-sectional view of pins
and mounting hardware and mounting hardware.
0.53in 0.46in
[13,5mm] [11,7mm]
Exploded View Exploded View

Chassis
P/N 20265 ThermMate P/N 20265 ThermMate Tapped #4–40

Tapped #4–40
screw hole screw hole
Ex. V300C12M75BL Ex. V300C12M75B

(Long Solder Pin, (Short Solder Pin,
Slotted Baseplate) Slotted Baseplate)
P/N 18157 Standoff Kit P/N 18151 Standoff Kit
Pad and plated through- Pad and plated through-

hole connected to hole connected to
chassis ground plane chassis ground plane
PCB thickness is
0.062in [1.5mm] 0.062in [1.5mm] PCB with
aperture to allow belly of
the module to recess into board
Figure 3.4 — Onboard vs. inboard mounting of (1/4 brick) Micro with slotted baseplate
Filtering and Transient Protection Conducted noise on the input power lines can occur as
either differential-mode or common-mode noise currents.
All switching power supplies generate potentially interfering
Differential‑mode noise, largely at low frequencies, appears across
signals as a result of high-frequency, high-power switching. The
the input conductors at the fundamental switching frequency
Vicor power converter topology, to a large extent, addresses the
and its harmonics. Common-mode noise, which has mostly
problem at the source by the use of a quasi-resonant, zero-current
high‑frequency content, is measured between the converter’s input
switching (ZCS) and zero-voltage switching (ZVS) topology. The
conductors and ground.
switching current waveform is a half sine wave that generates far
less conducted and radiated noise in both frequency spectrum and The Vicor power converter being an electronic device may be
magnitude. EMI filtering, if properly designed and implemented, susceptible to high levels of conducted or radiated emissions. It is
reduce the magnitude of conducted noise an additional 40 – 60dB, the responsibility of the user to assess testing protocols in order to
and as a result, the noise radiated by the power conductors is determine applicability of the converter in the intended application.
reduced proportionally.

Page 18 of 87 05/2023
4. EMC Considerations Design Guide & Applications Manual
Basic Guidelines for Successful EMI Filtering DC-DC converter inputs and outputs must be properly bypassed,
to system chassis or earth. Bypass VIN and VOUT pins to each
1. Keep current loops small. The ability of a conductor to couple
DC‑DC module baseplate. Capacitor lead length must be as short
energy by induction and radiation is reduced accordingly.
as possible. (Figure 4.1)
2. For conductor pairs, use wide (low Z) copper traces aligned
EMI filtering can be application dependent. A packaged filter
above and below each other.
module may not always be the appropriate solution, and the
3. Locate filters at the source of interference; i.e., close to the general practice of bypassing VIN and VOUT may not produce
power converter(s). optimal results. You may have to adjust the values depending
on the severity of common-mode and differential-mode noise.
4. Filter component values should be chosen with consideration (Figures 4.2 and 4.3)
given to the desired frequency range of attenuation. For
example, capacitors are self-resonant at a certain frequency, Input transient suppression should be used in applications where
beyond which they look inductive. Keep bypass capacitor leads source transients may be induced by load changes, blown fuses,
as short as possible. etc. The level of transient suppression required will depend on the
expected severity of the transients. A Zener diode, TRANSORB™,
5. Locate components on the PCB with consideration given to or MOV will provide transient suppression, act as a voltage clamp
proximity of noise sources to potentially susceptible circuits. for DC input spikes, and provide reverse input voltage protection.
For example, the FIAM is an input line filter module that has The device voltage rating should be chosen above high-line voltage
been optimized for use with Maxi, Mini, and Micro DC-DC limits to avoid conducting during normal operation which would
converters. When used in conjunction with the recommended result in overheating.
external components and layout, it will significantly reduce the
differential and common-mode noise returned to the power Module shields that provide shielding around the belly (label side)
source. The FIAM meets the requirements of EN55022 “B”, of the Maxi, Mini, Micro are also available for applications that are
FCC “B”, and Bellcore GR-001089-CORE, Issue 2 when used highly noise sensitive. Module shield information is available on the
with any combination of Maxi, Mini, and Micro converters up Vicor website, see links provided, on the following page.
to the FIAM’s maximum rated current.
NOTE: Acoustic Noise: Audible noise may be emitted from the
module under no load, light load or dynamic loading conditions. This
is considered normal operation of the module.

Page 19 of 87 05/2023
4. EMC Considerations Design Guide & Applications Manual
C2* C4*
4.7nF 4.7nF
+IN +OUT
F1* PC
+S
C1* SC
PR
0.2µF –S
–IN –OUT
C3*
4.7nF C5*
4.7nF
For C1 – C5, keep leads and connections short.
Figure 4.1 — Recommended bypassing capacitors must be in Figure 4.2 — V48B28H250BN without bypass caps
close proximity, i.e., have short lead length (330µF across input)
to be effective
Figure 4.3 — V48B28H250BN with recommended bypass caps

(330µF across input)
Module Shield Information
Module shield for Maxi with threaded or through-hole baseplate P/N 30142
https://asp.vicorpower.com/CADPDF/H7CEX3.PDF
Module shield for Maxi with slotted baseplate P/N 30199

https://asp.vicorpower.com/CADPDF/HXE113.PDF
Module shield for Mini with threaded or through-hole baseplate P/N 30180
https://asp.vicorpower.com/CADPDF/UT55TT.PDF
Module shield for Mini with slotted baseplate P/N 30198

https://asp.vicorpower.com/CADPDF/HXE112.PDF
Module shield for Micro with threaded or through-hole baseplate P/N 30143
https://asp.vicorpower.com/CADPDF/9YRD8X.PDF
Module shield for Micro with slotted baseplate P/N 30141

https://asp.vicorpower.com/CADPDF/NG6SIS.PDF

Page 20 of 87 05/2023
5. Current Sharing in Power Arrays Design Guide & Applications Manual
Whenever power supplies or converters are operated in a parallel Current sharing, then, is important because it improves system
configuration – whether for higher output power, fault tolerance performance; it minimizes transient / dynamic response and thermal
or both – current sharing is an important consideration. Most problems and improves reliability. It is an essential ingredient in
current-sharing schemes employed with power converters involve most systems that use multiple power supplies or converters for
either artificially increasing the output impedance of the converter higher output power or for fault tolerance.
module or actually sensing each output current, forcing all of
the currents to be equal by feedback control. In a synchronous Current Sharing in Power Expansion Arrays
current-sharing scheme, however, there is no need for having a When parallel supplies or converters are used to increase power,
current-sensing or current-measuring device on each module, nor current sharing is achieved by a number of approaches. One
is there a need to artificially increase the output impedance, which scheme simply adds resistance in series with the load. A more
compromises load regulation. practical variant of that is the “droop-share” method, which
actively causes the output voltage to drop in response to increasing
Why Current Sharing Is Important load. The two most commonly used approaches to paralleling
Most paralleled power components – transistors, rectifiers, power converters for power expansion are the driver / booster or
conversion modules, offline power supplies – will not inherently parent / child arrays and analog current-share control. They appear
share the load. In the case of power converters, one or more of to be similar, but the implementation of each is quite different.
the converters will try to assume a disproportionate or excessive Driver / booster arrays usually contain one intelligent module or
fraction of the load unless forced current-share control is designed driver, and one or more powertrain-only modules or boosters.
into the system. One converter – typically the one with the highest Analog current-share control involves paralleling two or more
output voltage – may deliver current up to its current limit setting, identical modules, each containing intelligence.
which is beyond its rated maximum. Then the voltage will drop
Droop Share: The droop-share method, shown in Figure 5.1,
to the point where another converter in the array – the one with
increases the output impedance to force the currents to be equal.
the next highest voltage – will begin to deliver current. All of the
It is accomplished by an error signal, which is interjected into the
converters in an array may deliver some current, but the load
control loop of the converter causing the output voltage to operate
will be shared unequally. Built-in current limiting may cause all
as a function of load current. As load current increases, output
or most converters to deliver current, but the loading will remain
voltage decreases. All of the modules will have approximately the
unbalanced, and potentially cause damage to the converters.
same amount of current because they are all being summed into
Consider the situation when one module in a two-module array is one node. If one supply is delivering more current than another
providing all of the load. If it fails, the load on the second module supply, its output voltage will be forced down a little so that it
must go from no load to full load, during which time the output will be delivering equal current for an equal voltage out of that
voltage is likely to droop temporarily. This could result in system summing node. Figure 5.1 illustrates a simple implementation of
problems, including shutdown or reset. If both modules were this scheme where the voltage dropped across the ORing diode,
sharing the load and one failed, however, the surviving module being proportional to current, is used to adjust the output voltage
would experience a much less severe transient (one half to full of the associated converter.
load), and the output voltage would be likely to experience no
Droop share has advantages and disadvantages. One of the
more than a slight momentary droop. The dynamic response
advantages is that it can work with any topology. It is also fairly
characteristic of all forward converters, resonant or pulse-width
simple and inexpensive to implement. A major drawback, though,
modulated, is degraded when the load is stepped from zero (no
is that it requires that the current be sensed. A current-sensing
load) where the output inductor current is discontinuous.
device is needed in each of the converters or power supplies. In
In the same two-module array example, the module carrying all addition, a small penalty is paid in load regulation, although in
of the load is also generating all of the heat, resulting in a much many applications this is not an issue.
lower mean time between failure (MTBF) for that module. An
often-quoted rule of thumb says that for each 10°C increase in
operating temperature, average component life is cut in half. In a
current‑sharing system, all of the converters or supplies run at a
lower temperature than some modules would in a system without
current sharing. As a result, all of the modules age equally.

Page 21 of 87 05/2023
In general, it is not recommended to mix and match converters, It is important to remember that when using boosters, the input
especially those with incompatible current-sharing schemes. The voltage, output voltage, and output power of the boosters must be
droop-share method, however, is more forgiving in this regard than the same as the driver.
with any of the other methods. Current sharing can be achieved
The advantages of driver / booster arrays are that they have only
using arrays constructed from different converter models or even
a single control loop so there are no loop-within-a-loop stability
from different suppliers with a little external circuitry.
issues, and they have excellent transient response. However, this
Driver / Booster Arrays: Most Vicor converters can employ the arrangement is not fault tolerant. If the driver module fails, the
driver / booster array for increased power. (Figure 5.2) array will fail to maintain its output voltage.
Driver / booster arrays usually contain one intelligent module or
Analog Current-Share Control: Analog current-share control,
driver, and one or more powertrain-only modules or boosters.
typical of PWM type converters, involves paralleling two or more
The driver is used to set and control output voltage, while
identical modules, each containing intelligence. The circuit actively
booster modules are used to increase output power to meet
adjusts the output voltage of each supply so that the multiple
system requirements.
supplies deliver equal currents. This method, however, has a
Driver / booster arrays of quasi-resonant converters with identical number of disadvantages. Each converter in the array has its own
powertrains inherently current share because the per-pulse energy voltage regulation loop, and each requires a current sensing device
of each converter is the same. If the inputs and outputs are tied and current control loop.
together and the units have the same clock frequency, all modules
Analog current-share control supports a level of redundancy, but it
will deliver the same current (within component tolerances). The
is susceptible to single-point failures within the current‑share bus
single intelligent module in the array determines the transient
response, which does not change as modules are added. Booster that can at best, defeat current sharing, and at worst, destroy every
module in the array. The major reason for this is the single‑wire
modules require only one connection between units when their
galvanic connection between modules.
outputs are connected; no trimming, adjustments, or external
components are required to achieve load sharing. The load sharing
is dynamic and usually guaranteed to be within five percent.
+IN +IN +OUT
+S
PC
Maxi or Mini SC
DC-DC Converter +OUT
PR
–S
–IN –OUT
–IN
+IN +OUT
+S
PC
Maxi or Mini
SC
PR
DC-DC Converter Return
–S
–IN –OUT
Figure 5.1 — The droop-share method artificially increases the output impedance to force the currents to be equal

Page 22 of 87 05/2023
Current Sharing in Fault Tolerant Arrays Current sharing, required to ensure system reliability, can be
implemented by a multiplicity of methods. Figure 5.1, shown earlier
Current sharing is an essential element in fault-tolerant arrays,
as an example of the droop-share method, is also an example of
and regardless of the approach, there is an inherent additional
N+1 redundancy using ORing diodes.
cost incurred by the addition of at least one redundant
converter or supply. Synchronous Current Sharing: Synchronous current sharing is
available with Maxi, Mini, Micro converters – converters that use
Most applications today that require fault tolerance or redundancy
the zero-current-switching and zero-voltage-switching topology.
also require Hot-Swap capability to ensure continuous system
Each module has the capability to assume control of the array, that
operation. Hot-swappable cards must be designed so that the
is, they constitute a democratic array. The module that assumes
operator cannot come in contact with dangerous potentials,
command transmits a pulse on the parallel bus to which all other
currents or thermal hazards. It is also essential that when a module
modules on the bus synchronize.
fails, the failure is detected and identified by an alarm or notice to
provide service. A Hot-Swap system must ensure that during swap The converters use this pulse as a current-sharing signal for power
out there is minimal disturbance of the power bus. Specifically, the expansion and fault-tolerant applications. The pulsed signal on the
affected voltage bus must not drop enough to cause errors in the parallel bus simplifies current-sharing control by synchronizing the
system, either on the input bus or the output bus. high-frequency switching of each converter. The parallel pin is a
bi-directional port on each module used to transmit and receive
N+1 Redundancy: A power supply failure can cripple an entire
information between modules. If the lead module relinquishes
system, so a redundant converter or supply can be added to ensure
control, another module in the array will transparently take
that, in the event of a failure, the system will continue to operate.
command with little or no perturbation of the output bus. A pulsed
Adding an extra module (N+1) to a group of paralleled modules will
signal gives designers the option to use capacitors (Figure 5.2) or
significantly increase reliability with only a modest increase in cost.
transformers between parallel pins, providing DC-blocked coupling.
How redundant converters are implemented is determined in part Such coupling prevents certain failure modes internal to a single
by the available space and cost requirements. Two 500W Maxi module from affecting the other modules in the array, thus
modules, for example, could be used to provide a 1kW output providing an increased level of fault tolerance.
with an additional 500W module for 2+1 redundancy a total of
Use of a current-share bus transformer (Figure 5.3) enables arrays
1.5kW in a volume of about 16.5in3 [270cm3]. Four 200W half‑size
of Maxi, Mini, Micro converters to current share when they are
modules might be used instead with a fifth 200W module for 4+1
widely separated or operated from independent sources. Since
redundancy, a total of 1kW and 14in3 [229cm3]. Although the
the current-share signal is a pulsed signal, it can be transformer
second solution uses less space, it increases the accumulated failure
coupled. Transformer coupling this pulsed signal provides a high
rate because it employs more converters, more ORing diodes, more
level of common-mode noise immunity while maintaining SELV
monitoring circuitry, and more assembly.
isolation from the primary source. This is especially useful when
ORing diodes may be inserted in series with the +Output of each board-to-board load sharing is required in redundant applications.
module in a N+1 array to provide output fault tolerance
Synchronous current sharing eliminates the need for
(Figure 5.1). They are important in a redundant power system to
current‑sensing or current-measuring devices on each module,
maintain fault isolation. Without them, a short-circuit failure in the
and load regulation is not compromised. Additional advantages
output of one converter could bring down the entire array. As well,
of the synchronous current-sharing architecture includes excellent
fusing the input of each converter prevents a converter input short
transient response, no loop-within-a-loop control problems and
from compromising the entire array.
a high degree of immunity from system noise. The availability of
ORing diodes, however, add losses to the power system, reducing synchronous current sharing in democratically controlled arrays
overall efficiency (and, potentially, decreasing reliability). To offers power architects new opportunities to achieve simple,
ameliorate this negative effect on efficiency, ORing diodes non‑dissipative current-share control. It provides options that
should run hot, thereby reducing forward voltage drop and simplify current sharing and eliminates the tradeoffs – such
improving system efficiency. Reverse leakage current will be an as the need to sense the current from each individual module
issue only if the output of a converter shorts and the diode is and adjust each control voltage – as is the case with other
reverse biased. This is an important consideration with regard to current‑sharing methods.
operating temperature.

Page 23 of 87 05/2023
The synchronous current-sharing method applies to quasi-resonant, Finally, no matter what method is used, current sharing reduces
frequency-modulated converters with the necessary intelligence, thermal problems, improves transient response and helps
such as the Vicor Maxi, Mini, Micro Family of high-density DC-DC extend the lifetimes of all modules in an array. Nevertheless, all
converters, where the energy per pulse is fixed. current‑sharing schemes require careful attention to electrical and
mechanical design to operate effectively.
+VIN +IN +OUT
+S
PC
DC-DC Converter SC
+VOUT
PR
–S
–IN –OUT
+IN +OUT
+S
PC
DC-DC Converter SC
PR Return
–S
–VIN –IN –OUT
Parallel Ground
Bus Plane
Figure 5.2 — Synchronous power architecture simplifies current-sharing control and enhances fault tolerance

Page 24 of 87 05/2023
+VIN +IN +OUT
+S
PC
DC-DC Converter SC
+VOUT
PR
T1 –S
–IN –OUT
–VIN
+VIN +IN +OUT
+S
PC
DC-DC Converter SC
PR Return
T2 –S
–IN –OUT
–VIN
Parallel
Bus
Figure 5.3 — Transformer-coupled interface provides load sharing and SELV isolation from the primary source

Page 25 of 87 05/2023
6. Thermal Performance Information Design Guide & Applications Manual
Simplified thermal management is one of the benefits of using The relevant nomenclature for the tabulated thermal
Vicor converters. High operating efficiency minimizes heat loss, and information supplied in this section for the Maxi, Mini and
the low-profile package features an easily accessible, electrically Micro modules is defined as follows:
isolated thermal interface surface.
TB = baseplate temperature
Proper thermal management pays dividends in terms of improved
converter and system MTBFs, smaller size, and lower product life- TA = ambient temperature
cycle costs. The following pages provide guidelines for achieving POUT = module output power
effective thermal management of Vicor converters.
PIN = module input power
Consideration should be given to the module baseplate
temperature during operation. The maximum baseplate h = module efficiency = POUT / PIN
temperature specification for Maxi, Mini, and Micro is 100°C.
PDISS = module power dissipation = PIN – POUT = (1/η – 1) • POUT
Enhanced module cooling can be achieved with free or forced
convection by using the appropriate heat sink. The available Supplied thermal resistance values:
Vicor heat sinks and thermal interface options are available on θBS = baseplate-to-heatsink thermal resistance
the Vicor website.
θBA = baseplate-to-ambient thermal resistance
Basis of output power versus ambient temperature

derating curves:
TA MAX = TBMAX – θBA • PDISS = TBMAX – θBA • (1/η – 1) • POUT
Additional Thermal Data
The following pages contain temperature derating curves.

For additional thermal data, see the following link:
https://asp.vicorpower.com/calculators/calculators.asp?calc=5

Page 26 of 87 05/2023
Thermal Performance Curves (Maxi) heat sink fins. Actual airflow through the fins should be verified.
For purposes of heat sink calculation, assume efficiencies listed on
Table Usage: The forced convection thermal impedance data
Maxi data sheets. Use as a design guide only. Verify final design by
shown in the tables on pages 27 – 29 assumes airflow through the
actual temperature measurement.
Maxi θBA (Baseplate-to-Ambient Thermal Resistance Values) vs. Airflow

θBS = 0.07°C/W Baseplate 0.9in Longitudinal Fins 0.9in Transverse Fins 0.4in Longitudinal Fins 0.4in Transverse Fins
Free Air 4.98 2.89 2.24 3.72 3.49
200LFM 3.23 1.30 1.02 2.14 1.53
400LFM 2.17 0.90 0.72 1.48 1.08
600LFM 1.73 0.72 0.60 1.10 0.87
800LFM 1.46 0.59 0.51 0.86 0.70
1,000LFM 1.27 0.51 0.44 0.71 0.60
1,200LFM 1.14 0.46 0.41 Curves - 4" Heat Sink
2V Maxi Thermal Performance 0.61 0.55
2V Maxi Thermal Performance Curves - No Heat sink
2V Maxi Thermal Performance Curves - 9" Heat Sink
Maxi Output Power vs. Ambient Temperature De-rating Curves

Baseplate (No Heat Sink) 0.4in [10,1mm] Heat Sink 0.9in [22,8 mm] Heat Sink
160 160 160
140 140 140
120 120 120

Output Power (Watts)

100 100 100
80 80 80
2V 60
3.3V Maxi Thermal Performance Curves - No Heat Sink
60 60
3.3V Maxi Thermal Performance Curves - .4" Heat Sink
40 40 40
3.3V Maxi Thermal Performance Curves - .9" Heat Sink
20 20 20
0 0 0
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
0
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
0
5
100
100
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
0
5
Ambient Temperature (°C) Ambient Temperature (°C) Ambient Temperature (°C)
250 250 250
200 200 200

150 150 150
3.3V 100 5V Maxi Thermal Performance Curves - No Heat Sink 100

5V Maxi Thermal Performance Curves - .4" Heat Sink 100
5V Maxi Thermal Performance Curves - .9" Heat Sink
50 50 50
0 0 0
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
0
5
100
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
0
5
100
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
0
5
100
400 400 400
350 350 350
300 300 300


250 250 250
200 200 200
5V 150 150 150
100 100 100
50 50 50
0 12 - 48V Maxi Thermal Performance Curves - No Heat Sink 0 0 12 - 48V Maxi Thermal Performance Curves - .9" Heat Sink
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
0
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
0
5
100
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
0
5
100
12 - 48V Maxi Thermal Performance Curves - .4" Heat Sink

600 600 600
500 500 500

Power Output (Watts)
Power Output (Watts)
400 400 400
300 300 300
12 – 54V 200 200 200
100 100 100
0 0 0
100
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
0
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
0
5
100
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
0
5
100
Free Air 200LFM 400LFM 600LFM 800LFM 1000LFM 1200LFM

Page 27 of 87 05/2023
Thermal Performance Curves (Mini) heat sink fins. Actual airflow through the fins should be verified.
Mini data sheets. Use as a design guide only. Verify final design by
Mini θBA (Baseplate-to-Ambient Thermal Resistance Values) vs. Airflow

Free Air 7.94 4.10 3.93 6.28 6.34
200LFM 4.50 1.72 1.93 2.81 3.00
400LFM 3.20 1.26 1.38 1.98 2.09
600LFM 2.52 1.02 1.06 1.55 1.59
800LFM 2.15 0.86 0.89 1.24 1.31
1,000LFM 1.89 0.75 0.77 1.05 1.11
1,200LFM 1.69 0.68 0.70
2V Mini Thermal Performance Curves - .4" Heat Sink
0.94 2V Mini Thermal Performance Curves - .9" Heat Sink 0.99
2V Mini Thermal Performance Curves - No Heat Sink
Mini Output Power vs. Ambient Temperature De-rating Curves

100 100 100
90 90 90
80 80 80
70

70 70
60 60
60
50 50
50
2V 40
40
3.3V Mini Thermal Performance Curves - .4" Heat Sink
40
30 30
3.3V Mini Thermal Performance Curves - .9" Heat Sink
30
20 3.3V Mini Thermal Performance Curves - No Heat Sink 20
20
10 10
10
0 0
0
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
0
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
0
5
100
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
0
5
100
Ambient Temperature (°C)
Ambient Temperature (°C) Ambient Temperature (°C)
140 140 140
120 120 120


100 100 100
80 80 80
3.3V 60 60 60
40 40 40
5V Mini Thermal Performance Curves - No Heat Sink
5V Mini Thermal Performance Curves - .4" Heat Sink
20 20 20 5V Mini Thermal Performance Curves - .9" Heat Sink
0 0 0
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
0
5
0
5
100
100
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
0
5
100
200 200 200
180 180 180
160 160 160

140 140 140
120 120 120
100 100 100
5V 80 80 80
60 60 60
40 40 40
20 20 12 - 48V Mini Thermal Performance Curves - .4" Heat Sink 20 12 - 48V Mini Thermal Performance Curves - .9" Heat Sink
12 - 48V Mini Thermal Performance Curves - No Heat Sink
0 0 0
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
0
5
100
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
0
5
100
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
0
5
100
300 300 300
250 250 250

200 200 200
150 150 150
12 – 54V 100 100 100
50 50 50
0 0 0
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
0
5
100
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
0
5
100
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
0
5
100

Page 28 of 87 05/2023
Thermal Performance Curves (Micro) heat sink fins. Actual airflow through the fins should be verified.
Micro data sheets. Use as a design guide only. Verify final design by
Micro θBA (Baseplate-to-Ambient Thermal Resistance Values) vs. Airflow

Free Air 10.90 5.37 5.04 7.77 7.76
200LFM 6.90 2.51 2.31 3.87 3.58
400LFM 4.78 1.79 1.68 2.68 2.52
600LFM 3.74 1.42 1.31 2.13 2.01
800LFM 3.15 1.20 1.10 1.78 1.67
1,000LFM 2.79 1.06 0.97 1.48 1.45
1,200LFM 2.49 0.93 0.88
2V Micro Thermal Performance Curves - .4" Heat Sink
1.32 1.29
2V Micro Thermal Performance Curves - No Heat Sink
2V Micro Thermal Performance Curves - .9" Heat Sink
Micro Output Power vs. Ambient Temperature De-rating Curves

50 50 50
45 45 45
40 40 40

35 35 35
30 30 30
25 25 25
2V 20 20 20
3.3V Micro Thermal Performance Curves - .9 Heat Sink
15 15 3.3V Micro Thermal Performance Curves - .4" Heat Sink 15

10 10 10
5 5 5
3.3V Micro Thermal Performance Curves - No Heat Sink
0 0 0
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
0
5
100
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
0
5
100
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
0
5
100
70 70 70
60 60 60
50 50 50
40 40 40
3.3V 30 5V Micro Thermal Performance Curves - No Heat Sink 30 30 5V Micro Thermal Performance Curves - .9" Heat Sink
20 20 20
10 10 10
0 0 5V Micro Thermal Performance Curves - .4" Heat Sink 0

10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
0
5
0
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
0
5
100
100 100 100

90 90 90
80 80 80
70
70 70
60 60 60
50 50 50
5V 40 40 40
30 30 30
20 20 20
10 12 - 48V Micro Thermal Performance Curves - No Heat Sink
10 12 - 48V Micro Thermal Performance Curves - .4" Heat Sink 10 12 - 48V Micro Thermal Performance Curves - .9" Heat Sink
0 0 0
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
0
5
100
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
0
5
100
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
0
5
100
140 140 140
120 120 120

100 100
100
80 80 80
12 – 54V 60 60 60
40 40
40
20 20
20
0 0
0
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
0
5
100
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
0
5
100
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
0
100

Page 29 of 87 05/2023
Typical Examples — Thermal Equations (Maxi, Mini, Micro) Example 2

Determine the maximum ambient for a Mini module with a 0.9in
Example 1
[22,8mm] heat sink in 400LFM of airflow delivering 200W at 5V.
Determine the maximum output power for a Maxi module without 5V Mini Thermal Performance Curves - .9" Heat Sink
a heat sink delivering 5V in 400LFM airflow at a maximum ambient From the output power versus ambient temperature chart for the
temperature of 40ºC. 5VOUT Mini with a 0.9in [22,8mm] heat sink, the 200W at 400LFM
data point results in a TAMAX of approximately 48ºC.
Maximum output power = TBMAX – TA MAX / [θBA • (1/η – 1)]
( )
TBMAX = 100ºC
TAMAX = 40ºC 200
180
For Maxi module without a heat sink @ 400LFM, θBA = 2.17ºC/W 160

140
For the 5V Maxi module the typical value for η = 0.83
120
Maximum output power = (100 – 40) / [2.17 (1/0.83 – 1)] ~135W 100
80
Or, the same answer could be obtained by using the output power
60
versus ambient temperature de-rating curves for the Maxi modules.
40
For the case with no heat sink the baseplate chart for the 20
5V module would be used. At a 40ºC ambient and 400LFM 0
airflow this chart indicates a maximum output power of
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
0
5
100
approximately 135W. Ambient Temperature (°C)
For full output power of 400W the required thermal resistance is;
Figure 6.1 — 5V Mini with 0.9in [22,8mm] heat sink
θBA = (100 – 40) / [400 (1/0.83 – 1)] = 0.73ºC/W
What size heat sink would be necessary to operate at full output
power (400W) under the same conditions?
From the θba versus airflow charts for the Maxi, the thermal
resistance at 400LFM airflow requires the use of a 0.9in [22,8mm]
transverse fin heat sink.

Page 30 of 87 05/2023
Thermal Management Accessories

All parts are RoHS compliant unless otherwise noted.
Maxi Heat Sinks Mini Heat Sinks Micro Heat Sinks

Threaded Through Hole Threaded Through Hole Threaded Through Hole
Longitudinal Fins
0.4in [10,1mm] Fin 0.4in [10,1mm] Fin 0.4in [10,1mm] Fin 0.4in [10,1mm] Fin 0.4in [10,1mm] Fin 0.4in [10,1mm] Fin
P/N 30482 P/N 30718 P/N 32188 P/N 30195 P/N 32174 P/N 30719
P/N 30188 P/N 30181 P/N 30189 P/N 30182 P/N 30190 P/N 30183
Transverse Fins
P/N 30778 P/N 30720 P/N 30184 P/N 30721 P/N 32173 P/N 30722
P/N 30196 P/N 30723 P/N 30269 P/N 30724 P/N 30270 P/N 30725
Low-profile Side-fin Heat Sinks Standoffs and Screws
Bulk and single-module kits compatible

Height only 0.125in [3,17mm] above module baseplate [a]
with all standard mounting configurations.
0.55in [13,97mm] 0.55in [13,97mm] 0.55in [13,97mm]

Side Fins Side Fins Side Fins See the specific products on the Vicor website for more information.
P/N 30096 P/N 32190 P/N 30095
ThermMate Thermal Pads
For use with Vicor modules, ThermMate thermal pads are a “dry” alternative to thermal
compound and are pre-cut to the outline dimensions of the module.
20263
Thermal pad Part Number Thickness
Maxi (10pc. pkg.) 20263 0.007” [0,177mm]

20264 Mini (10pc. pkg.) 20264 0.007” [0,177mm]
20265
Micro (10pc. pkg.) 20265 0.007” [0,177mm]
[a] For thermal curves of low-profile side-fin heat sinks and on-line capability for thermal curve calculations, see the following link:

Page 31 of 87 05/2023
7. Autoranging Rectifier Module (ARM™) Design Guide & Applications Manual
The Autoranging Rectifier Module (ARM) provides an effective Power-Down Sequence (Figure 7.2)
solution for the AC front end of a power supply designed with When input power is turned off or fails, the following sequence
Vicor DC-DC converters. This high-performance power system occurs as the bus voltage decays:
building block satisfies a broad spectrum of requirements and
agency standards. 1.2 Bus OK is de-asserted when the bus voltage falls below
205VDC (typical).
The ARM contains all of the power switching and control circuitry
necessary for autoranging rectification, inrush current limiting, 2.2 The converters are disabled when the bus voltage falls below
and overvoltage protection. This module also provides converter 200VDC. If power is reapplied after the converters are disabled,
enable and status functions for orderly power up / down control the entire power-up sequence is repeated. If a momentary
or sequencing. To complete the AC front-end configuration, the power interruption occurs and power is re-established before
user needs only to add hold-up capacitors and a suitable input filter the bus reaches the disable threshold, the power-up sequence
with transient protection. is not repeated.
Functional Description (Figure 7.1)

Initial Conditions: The switch that bypasses the inrush limiting
+OUT
Positive Temperature Coefficient (PTC) thermistor is open when
power is applied, as is the switch that engages the strap for
PTC
voltage doubling. In addition, the downstream DC-DC modules are Thermistor Strap
L Strap
disabled via the Enable (EN) line, and Bus OK (BOK) is high.
Power-Up Sequence (Figure 7.2)

1.1 Upon application of input power, the output bus capacitors –OUT
begin to charge. The thermistor limits the wcharge current, N

and the exponential time constant is determined by the
EN
hold‑up capacitor value and the thermistor cold resistance. The Microcontroller
slope (dV/dt) of the capacitor voltage approaches zero as the BOK
capacitors become charged to the peak of the AC line voltage.
2.1 If the bus voltage is less than 200V as the slope nears zero,
the voltage doubler is activated, and the bus voltage climbs Figure 7.1 — Functional block diagram
exponentially to twice the peak line voltage. If the bus voltage
is greater than 200V, the doubler is not activated.
3.1 If the bus voltage is greater than 235V as the slope approaches Power
Up
Power
Down
zero, the inrush limiting thermistor is bypassed. Below 235V,
the thermistor is not bypassed. 90 – 132V
AC Line
4.1 The converters are enabled ~150ms after the thermistor bypass 400
300
switch is closed. 200
Output 100
Bus 0 1.1
5.1 Bus OK is asserted after an additional ~150ms delay to allow (VDC)
the converter outputs to settle within specification. 2.1

Strap
PTC
Thermistor 3.1
Bypass
Converter 4.1 2.2
~150ms
Enable
Bus OK
5.1 1.2
~150ms
Figure 7.2 — Timing diagram: power up / down sequence
Timing Diagram, Power Up/Down Sequence

Page 32 of 87 05/2023
Off-Line Power Supply Configuration attempt to start while the hold-up capacitors were being charged
through an un-bypassed thermistor, preventing the bus voltage
The ARM™ maintains the DC output bus voltage between
from reaching the thermistor bypass threshold, thus disabling
200 and 375VDC over the entire universal input range, this being
the power supply. The Enable output (the drain of a N-channel
compatible with the Maxi, Mini, Micro 300V input converters as
MOSFET) is internally pulled up to 15V through a 150kΩ resistor.
well as VI-260 family and VI-J60 family DC-DC converters. The ARM
automatically switches to the proper rectification mode (doubled A signal diode should be placed close to and in series with the PC
or undoubled) depending on the input voltage, eliminating the or GATE IN pin of each converter to eliminate the possibility of
possibility of damage due to improper line connection. The VI- control interference between converters. The Enable pin switches
ARM-x1 is rated at 500W in the low range (90 –132VAC input), and to the high state (15V) with respect to the negative output power
750W in the high range (180 – 264VAC input). The VI-ARMB–x2 pin to turn on the converters after the power-up inrush is over.
is rated for 750 and 1,500W for the low and high input ranges The Enable function also provides input overvoltage protection
respectively. Either of these modules can serve as the AC front for the converters by turning off the converters if the DC bus
end for any number and combination of compatible converters as voltage exceeds 400VDC. The thermistor bypass switch opens if this
long as the maximum power rating is not exceeded. See VI-ARMB condition occurs, placing the thermistor in series with the input
derating curves (Figures 1 and 2) on VI-ARM data sheet. voltage, which reduces the bus voltage to a safe level while limiting
input current in case the varistors conduct. The thermistor bypass
Strap (ST) Pin: In addition to input and output power pin
switch also opens if a fault or overload reduces the bus voltage to
connections, it is necessary to connect the Strap pin to the junction
less than 180VDC.
of the series hold-up capacitors (C1, C2, Figure 7.3) for proper
(autoranging) operation. Varistors across the capacitors provide CAUTION: There is no input to output isolation in the ARM, hence
input transient protection. The bleeder resistors (R1, R2, Figure 7.3) the –OUT of the ARM and thus the –IN of the downstream DC-DC
discharge the hold-up capacitors when power is switched off. converter(s) are at a high potential. If it is necessary to provide
an external enable / disable function by controlling the DC-DC
Enable (EN) Pin: (Figure 7.4) The Enable pin must be connected converter’s PC or GATE IN pin (referenced to the –IN) of the converter,
to the PC or GATE IN pin of all converter modules to disable the an opto-isolator or isolated relay should be employed.
converters during power up. Otherwise, the converters would
C3
R1 C1 F1
+IN
N N +V V1 C10
PC (GATE IN)
BOK C7*
Filter Vicor DC-DC
Z1 ST VI-ARM
EN Converter
F3 C8* D3
V2 PR
L L –V
–IN
PE R2 C2
Part Number
Part Description (Vicor if no vendor given) C4
C1,2 Holdup capacitors R3
C3–6 4700pF (Y2 type) 01000
R1,2 150kΩ, 0.5W 00127-1503 D1 C5
V1,2 220V MOV Panasonic ERZV10D221
or equivalent
F1,2 Use reccommended fusing for F2
specific DC-DC Converters +IN
D1,2 1N4006 R4
C11
C7,8* 0.62µF 250V Film Cap. PC (GATE IN)
Vicor DC-DC
Z1 MOV (270V) 30076 D2
D3,D4 1N5817 D4 Converter
PR
C10,C11 0.001µF
R3, R4** 250Ω –IN
F3 ABC-10 A VI-ARM-_1
Not used with VI-260/VI-J60
ABC-10 A VI-ARMB-_2
Sizing PCB traces:
All traces shown in bold carry significant C6
current and should be sized accordingly.
*Required if C1 & C2 are located more than
6in [15cm] from output of VI-ARM.
**Not used with VI-260/VI-J60 To additional modules
Figure 7.3 — Typical ARM application

Page 33 of 87 05/2023
Not used with VI-260/VI-J60 +IN

+IN
+5 VDC
N 15 VDC +V PC (GATE IN)
Vicor +V PC
N 15VDC
Vicor
DC-DC
BOK DC-DC
ST Converter BOK Secondary
Micro- EN PR ST referenced Converter
controller Micro- EN PR
controller
L –V
–IN L –V
–IN
To additional modules
Figure 7.4 — Enable (EN) function Figure 7.5 — Bus OK (BOK) isolated power status indicator
R1
R2
C2
L2/N L3 N L2/N N
L1 R4 C2 C4
CM L2
Z1 C1 R3 ST R1 CM CM
Z1 C1 C6 ST
L2
C3 C5
L1 L L1 L1 L3 L4
F1 C3 C4 L
F1
GND
R2
GND R3
Part Number Part Number
Part Description (Vicor if no vendor given)
Part Description (Vicor if no vendor given)
C1 1.0µF, type X2, 310VAC Vishay F1772-510-2000 or equivalent
L1, L4 1,000µH 12A / 6.5MΩ 31743
C2, C3 4700pF, type Y2, 250VAC Vishay WY0472MCMCF0KR or equivalent
L2, L3 22µH 33206
C4 0.15µF, type X2, 310VAC Vishay F1772-415-2000 or equivalent
F1 10A Max 05147 C1 1.0µF, type X2, 310VAC Vishay F1772-510-2000 or equivalent
L1, L2 27µH 32012 C2, C3, C4, C5 4700pF, type Y2, 250VAC Vishay WY0472MCMCF0KR or equivalent
L3 2.2mH 32006 C6 0.22µF, type X2, 310VAC Vishay F1772-422-2000 or equivalent
R1, R2 10Ω R1 390kΩ 1/2W
R3 150kΩ, 0.5W R2, R3 10Ω 1/2W
R4 2.2Ω F1 15A Max
Z1 MOV 30076 Z1 MOV 30076
Figure 7.6a — Recommended filter design; low-power filter Figure 7.6b — Recommended filter design; high-power filter
connection for VI-ARM-x1 connection for VI-ARMB-x2
Bus OK (BOK) Pin: (Figure 7.5) The Bus OK pin is intended to The energy stored on a capacitor, which has been charged
provide early-warning power fail information and is also referenced to voltage V, is:
to the negative output pin.
CAUTION: There is no input-to-output isolation in the ARM. It is ε = 1/2(CV 2) (1)
necessary to monitor Bus OK via an optocoupler if it is to be used
on the secondary (output) side of the converters. A line-isolation
transformer should be used when performing scope measurements.
where: ε = stored energy
C = capacitance
Scope probes should never be applied simultaneously to the input
V = voltage across the capacitor
and output as this will damage the module.
Filter: Two input filter recommendations are shown for low-power Energy is given up by the capacitors as they are discharged by the
VI-ARM-x1 and high-power VI-ARMB-x2. (Figures 7.6a and 7.6b) converters. The energy expended (the power-time product) is:
Both filter configurations provide sufficient common-mode and ε = PΔt = C(V1 2 – V2 2)/2 (2)
differential-mode insertion loss in the frequency range between
100kHz and 30MHz to comply with the Class B conducted
emissions limit. where: P = operating power
∆t = discharge interval
Hold-up Capacitors: Hold-up capacitor values should be V1 = capacitor voltage at the beginning of ∆t
determined according to output bus voltage ripple, power-fail V2 = capacitor voltage at the end of ∆t
hold‑up time, and ride-through time. (Figure 7.7) Many applications
require the power supply to maintain output regulation during a
momentary power failure of specified duration, i.e., the converters
must hold up or ride through such an event while maintaining
undisturbed output voltage regulation. Similarly, many of these
same systems require notification of an impending power failure to
allow time to perform an orderly shutdown.

Page 34 of 87 05/2023
Hold-up Time
Power-Fail
Ripple (VP-P)
π–θ θ Warning
254V
205V
190V
Ride-Through Time
Power Fail Bus OK Converter

Shut down
Figure 7.7 — General timing diagram of bus voltage following interruption of the AC mains
40 100
90
Power-Fail Warning Time (ms)
35
Ride –Through Time (ms)

80
30
70
90VAC 115VAC
25 1,100μF
1,300μF
820μF
1,600μF
* 680μF (VI-ARM-x1)
2,200μF (VI-ARMB-x2)
60
20 50
40
15
30
10
20
5
* 10
0 * 0
250 500 750 1000 1250 1500 250 500 750 1000 1250 1500
Operating Power (W) Operating Power (W)
Figure 7.8 — Power-fail warning time vs. operating power and Figure 7.9 — Ride-through time vs. operating power
total bus capacitance, series combination of C1, C2
(Figure 7.3)
30 80
* 75
25
P-P Ripple Voltage (Vac)
Ripple Rejection (dB)
70
20
* 65
15 60
55
10
50
5
1,100μF
1,300μF
820μF
1,600μF
* 680μF (VI-ARM-x1)
2,200μF (VI-ARMB-x2)
45
0
40
250 500 750 1000 1250 1500
2 5 15 30 50
Operating Power (W) Output Voltage
Figure 7.10 — Ripple voltage vs. operating power and bus Figure 7.11 — Converter ripple rejection vs. output
capacitance, series combination of C1, C2 (Figure 7.3) voltage (typical)

Page 35 of 87 05/2023
Rearranging equation 2 to solve for the required capacitance: Another consideration in hold-up capacitor selection is their ripple
current rating. The capacitors’ rating must be higher than the
C = 2PΔt / (V1 2 – V2 2) (3) maximum operating ripple current. The approximate operating
ripple current (RMS) is given by:
The power-fail warning time (∆t) is defined as the interval between IRMS = 2P / VAC (6)
(BOK) and converter shutdown (EN) as illustrated in Figure 7.7. The
Bus OK and Enable thresholds are 205V and 190V, respectively.
A simplified relationship between power fail warning time, where: P = operating power level
operating power, and bus capacitance is obtained by inserting
VAC = operating line voltage
these constants:
Calculated values of bus capacitance for various hold-up time,
C = 2PΔt / (2052 – 1902) ride-through time, and ripple voltage requirements are given
as a function of operating power level in Figures 7.8, 7.9 and
C = 2PΔt / (5,925) 7.10, respectively.
It should be noted that the series combination (C1, C2, Figure 7.3) Example
requires each capacitor to be twice the calculated value, but the In this example, the output required at the point of load is 12VDC at
required voltage rating is reduced to 200V. 320W. Therefore, the output power from the ARM would be 375W
Allowable ripple voltage on the bus (or ripple current in the (assuming a converter efficiency of 85%). The desired hold-up time
capacitors) may define the capacitance requirement. Consideration is at least 9ms over an input range of 90 – 264VAC.
should also be given to converter ripple rejection and resulting Determining Required Capacitance for Power-Fail Warning:.
output ripple voltage. Figure 7.8 is used to determine capacitance for a given power
For example, a converter whose output is 15V and nominal input fail warning time and power level, and shows that the total bus
is 300V will provide typically 56dB ripple rejection, i.e., 10VP-P of capacitance must be at least 820µF. Since two capacitors are
input ripple will produce 15mVP-P of output ripple. (Figure 7.11) configured in series, each capacitor must be at least 1,640µF.
Equation 3 is again used to determine the required capacitance. Note: The warning time is not dependent on line voltage. A hold-up
In this case, V1 and V2 are the instantaneous values of bus voltage capacitor calculator is available on the Vicor website, at:
at the peaks and valleys (Figure 7.7) of the ripple, respectively. The https://asp.vicorpower.com/calculators/calculators.asp?calc=4
capacitors must hold up the bus voltage for the time interval (∆t)
between peaks of the rectified line as given by: Determining Ride-through Time: Figure 7.9 illustrates
ride‑through time as a function of line voltage and output power
and shows that at a nominal line of 115VAC, ride-through would be
Δt = (π – θ) / 2πf (4) 68ms. Ride-through time is a function of line voltage.
Determining Ripple Voltage on the Hold-up Capacitors:
where: f = line frequency Figure 7.10 is used to determine ripple voltage as a function of
operating power and bus capacitance, and shows that the ripple
θ = rectifier conduction angle
voltage across the hold-up capacitors will be 12VAC.
(Figure 7.7)
Determining the Ripple on the Output of the DC-DC
The approximate conduction angle is given by: Converter: Figure 7.11 is used to determine the ripple rejection
of the DC-DC converter and indicates a ripple rejection of
θ = cos –1 V2 / V1 (5) approximately 60dB for a 12V output. If the ripple on the bus
voltage is 12VAC and the ripple rejection of the converter is 60dB,
the output ripple of the converter due to ripple on its input
(primarily 120Hz) will be 12mVP-P.

Page 36 of 87 05/2023
8. Filter / Autoranging Rectifier Module (FARM™) Design Guide & Applications Manual
The Filter / Autoranging Rectifier Module (FARM) provides an Power-Down Sequence (Figure 8.2)
effective solution for the AC front end of a power supply built with When input power is turned off or fails, the following sequence
Vicor DC-DC converters. This high-performance power-system occurs as the bus voltage decays:
building block satisfies a broad spectrum of requirements and
agency standards. 1.2 Bus OK is de-asserted when the bus voltage falls below
205VDC (Typical).
In addition to providing transient / surge immunity and EMI
filtering, the FARM contains all of the power switching and 2.2 The converters are disabled when the bus voltage falls below
control circuitry necessary for autoranging rectification, inrush 190VDC. If power is reapplied after the converters are disabled,
current limiting and overvoltage protection. This module also the entire power-up sequence is repeated. If a momentary
provides converter enable and status functions for orderly power power interruption occurs and power is re-established before
up / down control or sequencing. To complete the AC front-end the bus reaches the disable threshold, the power-up sequence
configuration, the user only needs to add hold-up capacitors and a is not repeated, i.e., the power supply “rides through” the
few discrete components. momentary interruption.
Functional Description (Figure 8.1)

+OUT
Initial Condition: The switch that bypasses the inrush limiting
PTC (positive temperature coefficient) thermistor is open when PTC
power is applied, as is the switch that engages the strap for voltage Thermistor Strap
L Strap
doubling. In addition, the converters are disabled via the Enable
(EN) line and Bus OK (BOK) is high. EMI
Filter
Power-Up Sequence (Figure 8.2) –OUT
1.1 Upon application of input power, the output bus capacitors N
begin to charge. The thermistor limits the charge current and

EN
the exponential time constant is determined by the hold-up Microcontroller
capacitor value and the thermistor cold resistance. The slope BOK
(dV/dt) of the capacitor voltage versus time approaches zero
as the capacitors become charged to the peak of the AC line EMI GRD
voltage. If the bus voltage is less than 200V as the slope nears
zero, the voltage doubler is activated and the bus voltage Figure 8.1 — Functional block diagram: FARM
climbs exponentially to twice the peak line voltage.
2.1 If the bus voltage is greater than 200V, the doubler is not Power Power
Up Down
activated.
3.1 If the bus voltage is greater than 235V as the slope approaches 90 – 132V
AC Line
zero, the inrush limiting thermistor is bypassed. Below 235V, it 400
is not bypassed. 300
200
Output 100
Bus 1.1
4.1 The converters are enabled ~150ms after the thermistor bypass (VDC)
0
switch is closed. 2.1

Strap
5.1 Bus OK is asserted after an additional ~150ms delay to allow PTC
the converter outputs to settle within specification. Thermistor
Bypass
3.1
Converter 4.1 2.2

~150ms
Enable
Bus OK
5.1 1.2
~150ms
Figure 8.2 — Timing diagram: power up / down sequence

Page 37 of 87 05/2023
Off-Line Power Supply Configuration converters during power up. Otherwise, the converters would
attempt to start while the hold-up capacitors were being charged
The FARM maintains the DC output bus voltage between
through an un-bypassed current-limiting thermistor, preventing
250 and 370VDC over the entire input-voltage range, which is
the bus voltage from reaching the thermistor bypass threshold,
compatible with the Maxi, Mini, Micro 300V input converters as
thus disabling the power supply. The Enable output (the drain of
well as VI-260 family and VI-J60 family DC-DC converters. The
an N channel MOSFET) is internally pulled up to 15V through a
FARM automatically switches to the proper bridge or doubler
150kΩ resistor.
mode depending on the input voltage, eliminating the possibility of
damage due to improper line connection. The FARM1xxx is rated at A signal diode should be placed close to and in series with the PC
500W in the low range (90 – 132VAC input), and 750W in the high or GATE IN pin of each converter to eliminate the possibility of
range (180 – 264VAC input). The FARM2xxx is rated for control interference between converters. The Enable pin switches
750W and 1,000W for the low and high input ranges respectively. to the high state (15V) with respect to the negative output power
Either of these modules can serve as the AC front end for any pin to turn on the converters after the power-up inrush is over.
number and combination of compatible converters as long as the The Enable function also provides input overvoltage protection
maximum power rating is not exceeded. for the converters by turning off the converters if the DC bus
voltage exceeds 400VDC. The thermistor bypass switch opens if this
condition occurs, placing the thermistor in series with the input
connections, it is necessary to connect the strap pin to the center
voltage, which reduces the bus voltage to a safe level while limiting
junction of the series hold-up capacitors (C1, C2, Figure 8.3) for
input current in case the varistors conduct. The thermistor bypass
proper (autoranging) operation. Metal-oxide varistors, V1 and V2
switch also opens if a fault or overload reduces the bus voltage to
provide capacitor protection. The bleeder resistors (R1, R2,
Figure 8.3) discharge the hold-up capacitors when power is less than 180VDC.
switched off. Capacitors C7 and C8 are recommended if the CAUTION: There is no input to output isolation in the FARM, hence
hold-up capacitors are located more than 3in [75mm] from the the –OUT of the FARM and thus the –IN of the downstream DC-
FARM output pins. DC converter(s) are at a high potential. If it is necessary to provide
an external enable / disable function by controlling the DC-DC
Enable (EN) Pin: (Figure 8.4) The Enable pin must be connected converter’s PC or GATE IN pin (referenced to the –IN) of the converter,
to the PC or GATE IN pin of all converter modules to disable the an opto-isolator or isolated relay should be employed.
C3
R1 C1 F1
N N + +IN
EMI GND C7** V1 C10

BOK PC (GATE IN)
FARM Vicor DC-DC
Z1 C9 Filter/Autoranging ST Converter
Rectifier Module D3
N/C EN PR
C8** V2
L L – –IN
R2 C2
F3 *
PE R3
C4
Vishay F1772-447-2000
or equivalent D1
Part Number
Part Description (Vicor if no vendor given) Sizing PCB traces: C5
C1,2 Hold-up capacitors
All traces shown in bold carry significant
C3-C6 4,700pF (Y2 type) 01000
C7,8** 0.62µF, 250V Film Cap.
current and should be sized accordingly. F2
C9 0.47µF, Vishay F1772-447-2000 N/ST/L 10ARMS at 90VAC and 500W +IN
type X2, 310VAC ± IN 4ADC at 190VDC and 750W R4
or equivalent C11
C10,C11 0.001µF PC (GATE IN)
FARM2-xxx
D1, 2 Diode1N4006 D2 Vicor DC-DC
N/ST/L 20ARMS at 90VAC and 750W
D3, 4 Diode 1N5817 ± IN 8ADC at 190VDC and 1000W D4 Converter
F1, F2 Use recommended fusing for specific
PR
DC-DC Converters * See Agency Approvals on FARM data sheet.
R1, 2 150kΩ, 0.5W **Required if C1 & C2 are located more than
–IN
R3, 4*** 250Ω 3in [75mm] from output of the FARM. Not used with VI-260/VI-J60
V1,2 220V MOV Panasonic ERZV10D221 ***Not used with VI-260/VI-J60
or equivalent
Z1 MOV 270 30076 C6
Figure 8.3 — Offline power supply configuration

Page 38 of 87 05/2023
Bus OK (BOK) Pin: (Figure 8.5) The Bus OK pin is intended to The power-fail warning time (∆t) is defined as the interval between
provide early-warning power-fail information and is also referenced Bus OK and converter shut down (EN) as illustrated in Figure 8.7.
to the negative output pin. The Bus OK and Enable thresholds are 205 and 190V, respectively.
A simplified relationship between power-fail warning time,
CAUTION: There is no input-to-output isolation in the FARM. It is
necessary to monitor Bus OK via an optoisolator if it is to be used
operating power, and bus capacitance is obtained by inserting
on the secondary (output) side of the converters. A line-isolation these constants:
Scope probes should never be applied simultaneously to the input C = 2PΔt / (2052 – 1902)
and output as this will damage
the module. C = 2PΔt / (5,925)
Filter: (Figure 8.6) An integral input filter consists of a common-
mode choke and Y-capacitors (line-ground) plus two X-capacitors It should be noted that the series combination (C1, C2,
(line-line). This filter configuration provides common-mode and Figure 8.3) requires each capacitor to be twice the calculated value,
differential-mode insertion loss in the frequency range between but the required voltage rating of each capacitor is reduced to
100kHz and 30MHz. 200V. Allowable ripple voltage on the bus (or ripple current in the
capacitors) may define the capacitance requirement. Consideration
Hold-up Capacitors: Hold-up capacitor values should be should be given to converter ripple rejection and resulting output
determined according to output bus voltage ripple, power fail ripple voltage.
hold‑up time, and ride-through time. (Figure 8.7)
For example, a converter whose output is 15V and nominal input is
Many applications require the power supply to maintain output 300V will provide 56dB ripple rejection, i.e., 10VP-P of input ripple
regulation during a momentary power failure of specified duration, will produce 15mVP-P of output ripple. (Figure 8.11) Equation 3 is
i.e., the converters must hold up or ride through such an event again used to determine the required capacitance. In this case,
while maintaining undisturbed output voltage regulation. Similarly, V1 and V2 are the instantaneous values of bus voltage at the peaks
many of these same systems require notification of an impending and valleys (Figure 8.7) of the ripple, respectively. The capacitors
power failure to allow time to perform an orderly shut down. must hold up the bus voltage for the time interval (∆t) between
The energy stored in a capacitor which has been charged peaks of the rectified line as given by:
to voltage V is:
Δt = (π – θ) / 2πf (4)
ε = 1/2(CV 2) (1)
where: f = line frequency
where: ε = stored energy θ = rectifier conduction angle
C = capacitance (Figure 8.7)
V = voltage across the capacitor The approximate conduction angle is given by:
Energy is given up by the capacitors as they are discharged by the Another consideration in hold-up capacitor selection is their ripple
converters. The energy expended (the power-time product) is:
θ = cos –1 V2 / V1 (5)
where: P = operating power
ε = PΔt = C(V1 2 – V2 2)/2 (2)

current rating. The capacitors’ rating must be higher than the
maximum operating ripple current. The approximate operating
∆t = discharge interval
where: P = total output power
V1 = capacitor voltage at the beginning of ∆t
IRMS = 2P / VAC (6)
V2 = capacitor voltage at the end of ∆t
Rearranging Equation 2 to solve for the required capacitance: VAC = operating line voltage
Calculated values of bus capacitance for various hold-up
C = 2PΔt / (V1 2 – V2 2) (3)
time, ride-through time and ripple-voltage requirements are
given as a function of operating power level in Figures 8.8,
8.9 and 8.10, respectively.

Page 39 of 87 05/2023
Example Determining Ride-through Time: Figure 8.9 illustrates

ride‑through time as a function of line voltage and output power
In this example, the output required from the DC-DC converter at
and shows that at a nominal line of 90VAC, ride-through would be
the point of load is 12VDC at 320W. Therefore, the output power
68ms. Ride-through time is a function of line voltage.
from the FARM would be 375W (assuming a converter efficiency
of 85%). The desired hold-up time is 9ms over an input range Determining Ripple Voltage on the Hold-up Capacitors:
of 90 – 264VAC. Figure 8.10 is used to determine ripple voltage as a function of
operating power and bus capacitance, and shows that the ripple
Determining Required Capacitance for Power Fail Warning:
voltage across the hold-up capacitors will be 12VP-P.
Figure 8.8 is used to determine capacitance for a given power‑fail
warning time and power level and shows that the total bus Determining the Ripple on the Output of the DC-DC
capacitance must be at least 820µF. Since two capacitors are Converter: Figure 8.11 is used to determine the ripple rejection
configured in series, each capacitor must be at least 1,640µF. of the DC-DC converter and indicates a ripple rejection of
approximately 60dB for a 12V output. Since the ripple on the
Note: The warning time is not dependent on line
bus voltage is 12VAC and the ripple rejection of the converter is
voltage. A hold-up capacitor calculator is available on the
60dB, the output ripple of the converter due to ripple on its input
Vicor website at:
(primarily 120Hz) will be 12mVP-P.
Not used with VI-260/VI-J60
N + +IN
+5 VDC
N + +IN
15 VDC
15 VDC EMI GND BOK PC
EMI GND BOK PC (GATE IN)
150kΩ ST
Secondary Vicor DC-DC
Converter
referenced
ST Vicor DC-DC
FARM Converter N/C EN PR
N/C EN PR Micro-
Micro- controller
controller
L – –IN L – –IN
Figure 8.4 — Enable (EN) function Figure 8.5 — Bus OK (BOK) isolated power status indicator
N +
330µH
L1
EMI GND 4.7nF 0.099µF BOK
CM
0.47µF ST
N/C EN
4.7nF
L –
Figure 8.6 — Internal filter

Page 40 of 87 05/2023
Hold-up Time
Power-Fail
Ripple (VP-P)
π–θ θ Warning
254V
205V
190V
Ride-Through Time

Shut down
40 100
Total
90 capacitance
35
(FARM2XXX) 820μF 90VAC 115VAC
80
Ride-through Time (ms)

30
* (FARM1XXX) 70
25
60
20 50
15 40
30
10
20
5
* 10
0 * 0
250 500 750 1000 250 500 750 1000
(Figure 8.3)
30 80
* 75
25
P-P Ripple Voltage (VAC)
70
20
* 65
15 60
55
10
50
5
1100μF
1300μF
820μF
1600μF
* 2200μF
680μF (FARM1XXX)
(FARM2XXX)
45
0 40
250 500 750 1000 2 5 15 30 50
Figure 8.10 — Ripple voltage vs. operating power and bus Figure 8.11 — Converter ripple rejection vs. output voltage (typical)
capacitance, series combination of C1, C2
(Figure 8.3)

Page 41 of 87 05/2023
9. Modular AC Front-End System (ENMod™) Design Guide & Applications Manual
The ENMod component power front-end system for EN compliance The ENMod system provides transient / surge immunity, harmonic
provides an effective solution for an AC front end of a power current attenuation (Figure 9.2) and EMI filtering, in addition
supply enabled with Vicor DC-DC converters. The ENMod system’s to all of the power switching and control circuitry necessary for
basic building blocks are the MiniHAM™ passive harmonic autoranging rectification, inrush current limiting and overvoltage
attenuation module, the FARM3™ autoranging AC-DC front-end protection. Converter enable and status functions for orderly power
module (Figure 9.3) and a discrete EMI filter. up / down control or sequencing are also provided. To complete
the AC front-end configuration, the user only needs to add hold-up
capacitors, EMI filter (Figure 9.1b), and a few discrete components.
V5
C3
Holdup Box (HUB)

F1
R1 C1 410μF HUB820-S 1100μF HUB2200-S
N N N N + N/+ N/+ +IN
600μF HUB1200-S 1350μF HUB2700-S
900μF HUB1800-S 1650μF HUB3300-S
Filter EMI GND BOK C7 V1 NC NC
D3
PC
AC line Input PE
MINI Vicor 300VIN
(Fig.9–1b) V3 FARM3 ST NC DC-DC
HAM C9 Converter
(Fig.1b) SR EN NC NC PR
C8 V2
L L L L – L/– L/– –IN
R2 C2
PE Part Number
R3 Part Description (Vicor if no vendor given)
C4
C1,2 Hold-up capacitors
V6
D1 C3 – 6 4,700pF (Y2 type) 01000
C5 C7,8 0.62µF 250V Film Cap.
C9,C10 0.001µF
F2
+IN R1,2 150kΩ, 0.5W
Sizing PCB traces: R4 R3, R4 250Ω, 0.125W
D4
PC
All traces shown in bold carry significant Vicor 300VIN V1,2 MOV 220V Panasonic ERZV10D221
D2 DC-DC
current and should be sized accordingly. C10 Converter or equivalent
PR
V3 270V MOV 30076
–IN V5,V6 Bidirectional TVS Diode 1.5KE51CA
F1,2 Use recommended fusing for
C6
specific converters
D1,2 Diode 1N4006
D3,D4 1N5817
To additional converters
Figure 9.1a — Offline power supply configuration
Part Number
R1 Part Description (Vicor if no vendor given)
Input Output C1 1.0µF Vishay F1772-510-2000
C2 (type x2, 310VAC) or equivalent
L2/N N C2, C3 4,700pF (Y2 type) 01000
L1 L3 R4 C4 0.33µF Vishay F1772-433-2000
V1 C1 R3 CM (type x2, 310VAC) or equivalent
L1 L
L2 F1 10A Wickman 194 Series
or Bussman ABC-10
F1 R2 C3 C4
PE PE L1, L2 27µH 32012
L3 1.3mH 32006
R1, R2 10Ω
R3 150kΩ, 0.5W
R4 2.2Ω, 2W
V1 MOV 30076
Figure 9.1b — Input EMI filter for EN55022, Class B compliance

Page 42 of 87 05/2023
Harmonic Current
10.00
1.00
Odd Harmonic Limits

Current (A)
* Even Harmonic Limits

Measured Values
0.10
0.01
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40
Harmonic Number
Figure 9.2 — Measured harmonic current at 230VAC, 575W vs. EN spec limits (*Measured values of even harmonics are below 0.01A)
Power Power
+OUT Up Down
PTC 90 – 132V
Thermistor Strap AC Line
L Strap 400
300
200
Output 100
EMI Bus 0 1.1
(VDC)
Filter
–OUT 2.1
Strap
N SR
PTC
Thermistor 3.1
EN Bypass
Microcontroller 4.1
Converter 2.2
~150ms
BOK Enable
Bus OK
5.1 1.2
~150ms
EMI GND
Figure 9.3 — Functional block diagram: FARM3™ module Figure 9.4 — Timing diagram: power-up / down sequence
VDC output
VDC output
⇒

Strap
Engaged
Enable Enable
Bus OK Bus OK
Figure 9.5 — Start up at 120VAC input Figure 9.6 — Start up at 240VAC input

Page 43 of 87 05/2023
Power-Up Sequence (Figure 9.4)

1.1 Upon application of input power, the hold-up capacitors
begin to charge. The thermistor limits the charge current, and VDC output
the exponential time constant is determined by the hold-up
capacitor value and the thermistor cold resistance. The slope
(dV/dt) of the capacitor voltage versus time approaches zero as IAC input @2A / mV
the capacitors become charged to the peak of the
AC line voltage.
The switch that bypasses the inrush limiting
Positive‑Temperature Coefficient PTC thermistor is open when
Enable
power is applied, as is the switch that engages the strap for
voltage doubling. In addition, the converter modules are
disabled via the Enable (EN) line, and Bus OK (BOK) is high. Bus OK
2.1 If the bus voltage is less than 200V as the slope nears zero,
the voltage doubler is activated and the bus voltage climbs Figure 9.7 — Power down from 120VAC
exponentially to twice the peak line voltage. If the bus voltage
is greater than 200V, the doubler is not activated.
3.1 If the bus voltage is greater than 235V as the slope approaches
zero, the inrush limiting thermistor is bypassed. Below 235V, it
is not bypassed. VDC output
4.1 The converters are enabled ~150ms after the thermistor bypass
switch is closed. IAC input @2A / mV
5.1 Bus OK is asserted after an additional ~150ms delay to allow
the converter outputs to settle within specification.
Enable
Power-Down Sequence (Figure 9.4)
When input power is turned off or fails, the following sequence
occurs as the bus voltage decays: Bus OK
1.2 Bus OK is de-asserted when the bus voltage falls

below 210VDC.
Figure 9.8 — Power down from 240VAC
2.2 The converters are disabled when the bus voltage falls below
190VDC. If power is reapplied after the converters are disabled,
the entire power-up sequence is repeated. If a momentary
power interruption occurs and power is reestablished before
the bus reaches the disable threshold, the power-up sequence
is not repeated, i.e., the power conversion system “rides
through” the momentary interruption.
VDC output
Enable
Bus OK
Figure 9.9 — Output overvoltage protection 240VAC range

Page 44 of 87 05/2023
Filtering and Transient Protection CAUTION: There is no input to output isolation in the ENMods,
hence the –OUT of the ENMods and thus the –IN of the downstream
The ENMod system maintains the DC output bus voltage between DC‑DC converter(s) are at a high potential. If it is necessary to
250 and 370VDC over the entire input-voltage range, which is provide an external enable / disable function by controlling the
compatible with all Vicor 300V input converters. Autoranging DC-DC converter’s PC pin (referenced to the –IN) of the converter, an
automatically switches to the proper bridge or doubler mode at opto‑isolator or isolated relay should be employed.
startup depending on the input voltage, eliminating the possibility
of damage due to improper line connection. The ENMod system
is rated at 575W output power. These modules can serve as the
AC front end for any number and combination of compatible
converters as long as the maximum power rating is not exceeded.
FARM3™ Module Pin Descriptions

connections, it is necessary to connect the Strap pin to the center
junction of the series hold-up capacitors (C1, C2) for proper
(autoranging) operation. Varistors V1 and V2 provide capacitor
protection. The bleeder resistors (R1, R2) discharge the hold-up
capacitors when power is switched off. Capacitors C7 and C8 are
recommended if the hold-up capacitors are located more than
3in [75mm] from the output pins.
Enable (EN) Pin: The Enable pin must be connected to the PC pin Figure 9.10a — Peak detection
of all converter modules to disable the converters during power
up. Otherwise, the converters would attempt to start while the
hold-up capacitors are being charged through the current limiting
thermistor, preventing the bus voltage from reaching the thermistor
bypass threshold, thus disabling the power supply. The Enable
output (the drain of an N-channel MOSFET) is internally pulled up
to 15V through a 150kΩ resistor. (Figure 9.11)
A signal diode should be placed close to and in series with the
PC pin of each converter to eliminate the possibility of control
interference between converters. The Enable pin switches to
the high state (15V) with respect to the SR pin to turn on the
converters after the power-up inrush is over. The Enable function
also provides input overvoltage protection for the converters by
turning off the converters if the DC bus voltage exceeds 400VDC.
The thermistor bypass switch opens if this condition occurs,
placing the thermistor in series with the input voltage, reducing
the bus voltage to a safe level while limiting input current in Figure 9.10b — Quasi-peak detection
case the varistors conduct. The thermistor bypass switch also
opens if a fault or overload reduces the bus voltage to less than
180VDC. (Figure 9.3)
Figure 9.10c — Average detection

Page 45 of 87 05/2023
Bus OK (BOK) Pin: (Figure 9.12) The Bus OK pin is intended Energy is given up by the capacitors as they are discharged by the
to provide early-warning power-fail information and is also converters. The energy expended (the power-time product) is:
referenced to the SR pin.
Caution: There is no input-to-output isolation in the ENMods. It is ε = PΔt = C(V1 2 – V2 2)/2 (2)
necessary to monitor Bus OK via an optoisolator if it is to be used
on the secondary (output) side of the converters. A line-isolation where: P = operating power
Scope probes should never be applied simultaneously to the input ∆t = discharge interval
and output as this will damage the module.
V1 = capacitor voltage at the beginning of ∆t
L, N Pins: Line and neutral input.
V2 = capacitor voltage at the end of ∆t
+ / – Pins: Positive and negative outputs.
Rearranging Equation 2 to solve for the required capacitance:
SR Pin: Signal return for BOK and EN outputs.
For MiniHAM™ Module Pin connections (Figure 9.1a) C = 2PΔt / (V1 2 – V2 2) (3)
Filter: (Figure 9.1b) The input EMI filter consists of differential The power-fail warning time (∆t) is defined as the interval between
and common-mode chokes, Y-capacitors (line-ground) and Bus OK and converter shutdown (EN) as illustrated in Figure 9.13.
X-capacitors (line-line). This filter configuration provides The Bus OK and Enable thresholds are 205 and 190V, respectively.
sufficient common‑mode and differential-mode insertion loss A simplified relationship between power fail warning time,
in the frequency range between 100kHz and 30MHz to comply operating power and bus capacitance is obtained by inserting these
with the Class B conducted emissions limit, as illustrated in constants in Equation 3:
Figures 9.10a – 9.10c.
Hold-up Capacitors: Hold-up capacitor values should be C = 2PΔt / (2052 – 1902)
determined according to output bus voltage ripple, power‑fail
hold‑up time, and ride-through time. (Figure 9.13) Many C = 2PΔt / (5,925)
applications require the power supply to maintain output regulation
during a momentary power failure of specified duration, i.e., the It should be noted that the series combination (C1, C2, Figure 9.1a)
converters must hold-up or ride-through such an event while requires each capacitor to be twice the calculated value, but the
maintaining undisturbed output voltage regulation. Similarly, many required voltage rating of each capacitor is reduced to 200V.
of these same systems require notification of an impending power
failure in order to allow time to perform an orderly shutdown. Allowable ripple voltage on the bus (or ripple current in the
capacitors) may define the capacitance requirement. Consideration
The energy stored on a capacitor which has been charged should be given to converter ripple rejection and resulting output
to voltage V is: ripple voltage.
ε = 1/2(CV 2) (1) Equation 3 is again used to determine the required capacitance. In

this case, V1 and V2 are the instantaneous values of bus voltage at
the peaks and valleys (Figure 9.13) of the ripple, respectively. The
where: ε = stored energy capacitors must hold up the bus voltage for the time interval (∆t)
C = capacitance between peaks of the rectified line as given by:
V = voltage across the capacitor

Δt = (π – θ) / 2πf (4)
where: f = line frequency

θ = rectifier conduction angle

Page 46 of 87 05/2023
The approximate conduction angle is given by: Determining the Ripple on the Output of the DC-DC
Converter: Figure 9.17 is used to determine the ripple rejection
θ = cos –1 V2 / V1 (5) of the DC-DC converter and indicates a ripple rejection of
approximately 60dB for a 12V output. Since the ripple on the
Another consideration in hold-up capacitor selection is their ripple bus voltage is 12VAC and the ripple rejection of the converter is
current rating. The capacitors’ rating must be higher than the 60dB, the output ripple of the converter due to ripple on its input
maximum operating ripple current. The approximate operating (primarily 120Hz) will be 12mVP-P.
A variety of hold-up capacitor options are available. Please
visit our website at
IRMS = 2P / VAC (6)
https://asp.vicorpower.com/calculators/calculators.asp?calc=4.
where: P = total output power

VAC = operating line voltage
Calculated values of bus capacitance for various hold-up time, Not used with VI-260/VI-J60
ride-through time and ripple voltage requirements are given as

a function of operating power level in Figures 9.14, 9.15 and N + +IN
9.16, respectively. 15 Vdc
EMI GND BOK PC (GATE IN)
150 k
ST Vicor DC-DC
Example FARM3™ Converter
SR EN PR
In this example, the output required from the DC-DC converter at Micro-
controller
the point of load is 12VDC at 320W. Therefore the output power L – –IN
from the ENMods would be 375W (assuming a converter efficiency

of 85%). The desired hold-up time is 9ms over an input range of
90 – 264VAC.
Determining Required Capacitance for Power Fail Warning:
Figure 9.14 is used to determine capacitance for a given power Figure 9.11 — Enable (EN) function
fail warning time and power level, and shows that the total bus
capacitance should be at least 820µF. Since two capacitors are
configured in series, each capacitor should be at least 1,640µF.
Note: The warning time is not dependent on line
N +
voltage. A hold-up capacitor calculator is available on the +5VDC
Vicor website at: 15VDC
BOK
EMI GND
https://asp.vicorpower.com/calculators/calculators.asp?calc=4 27kΩ Secondary
ST referenced
Determining Ride-through Time: Figure 9.15 illustrates
ride‑through time as a function of line voltage and output power, SR EN
Micro-
and shows that at a nominal line of 90VAC, ride-through would be controller
68ms. Ride-through time is a function of line voltage. L –
Determining Ripple Voltage on the Hold-up Capacitors:

Figure 9.16 is used to determine ripple voltage as a function of FARM3
operating power and bus capacitance and shows that the ripple
voltage across the hold-up capacitors will be 12VP-P.
Figure 9.12 — Bus OK (BOK) isolated power status indicator

Page 47 of 87 05/2023
Hold-up Time
Power-Fail
Ripple (VP-P)
π–θ θ Warning
254V
205V
190V
Ride-Through Time

Shut down
40 100
1,300μF 1,600μF 2,200μF
35 90
1,100μF 820μF
* 680μF 80
Ride-through Time (ms)

30
70
25
60
20 50
15 40
90 VAC 115 VAC
30
10
20
5
* 10
0 0
250 500 250 500
(Figure 9.1a)
80
30
75
25
1,100μF 820μF
* 680μF
P-P Ripple Voltage (Vac)
1,300μF 1,600μF 2,200μF

70
20 65
* 60
15
55
10
50
5 45
40
0
2 5 15 30 50
250 500
Figure 9.16 — Ripple voltage vs. operating power and bus Figure 9.17 — Converter ripple rejection vs. output voltage (typical)
capacitance, series combination of C1, C1
(Figure 9.1a)

Page 48 of 87 05/2023
10. High-Boost HAM™ Design Guide & Applications Manual
The High-Boost Harmonic Attenuator Module Compatible

with V375, VI-26x and VI-J6x Families
The High-Boost Harmonic Attenuation Module (HAM) consists
of a full-wave rectifier, a high-frequency zero-current switching
(ZCS) boost converter, active inrush current limiting, short-circuit
protection, control and housekeeping circuitry (Figure 10.1). The
incoming AC line is rectified and fed to the boost converter.
The control circuitry varies the operating frequency of the boost
converter to regulate and maintain the output voltage of the
HAM above the peak of the incoming line, while forcing the input
current to follow the waveshape and phase of the line voltage. A
power factor better than 0.99 is achieved (Figure 10.2). Operating
efficiency of the boost converter is optimized at any incoming line
voltage by an adaptive output voltage control scheme. Figure 10.2 — Input voltage and current wave forms
The output voltage of the HAM is a function of incoming AC line without and with power factor correction.
voltage (Figure 10.3). On a nominal 115VAC line, the output voltage
of the HAM is 280VDC – well within the input operating voltage 425
range of Vicor V375 DC-DC converters. Above 180V input, the
output voltage linearly increases with input voltage. At 230VAC the 700 400
delivered voltage will be approximately 365V. For any given input
Output Voltage (VDC)

650 375
Output Power (W)

line voltage, the HAM maintains enough headroom between the
600 350
output voltage and peak input voltage to ensure high quality active
derate output power 11W/V for VIN <110VAC
power factor correction without sacrificing operating efficiency. 550 325
The HAMD version does not contain an internal bridge rectifier 500 300
and is intended for configuring higher-power arrays with Booster 450 275
versions, referred to as the VI-BAMD (Figure 10.5).
400 250
85 95 105 115 125 135 145 155 165 175 185 195 205 215 225 235 245 255 265
110 Input Voltage Rated Output Power

VRMS Output Voltage
Inrush +
AC Recti- ZCS & Short DC
Line fier Boost Circuit OUT
Converter Protection –
Figure 10.3 — Output voltage and power rating vs.
Current input voltage
Sense Note:
High-Frequency
Control Non-Isolated
Voltage Output L1 and L2/N (HAM) Pin: An appropriate line filter is required to
Waveform Control Output Voltage limit conducted emissions and ensure reliable operation of the
& House- Module Enable
keeping HAM, see Page 51. Connect single phase AC mains to the input
Power OK
Circuitry of the line filter via a 10A, 250V fuse. Connect the output of the
filter to L1 and L2/N of the HAM. Do not put an X-capacitor across
Gate IN
Gate OUT
Aux. Supply the input of the HAM or use a line filter with an X-capacitor on its
output as power factor correction may be impacted.
NOTE: No input-to-output isolation. +IN, –IN (HAMD, BAMD) Pin: These pins are connected to
the output of the external bridge rectifier in HAMD / BAMD
Figure 10.1 — HAM block diagram (HAMD version has the configurations (Figure 10.5).
rectifier block deleted) GATE IN (HAM) Pin: The user should not make any
connection to this pin.
GATE IN (HAMD) Pin: This pin provides line voltage envelope and
phase information for power factor correction. This connection
must be made through the synchronization diodes between the
line filter and bridge rectifier (Figure 10.5).
GATE IN (BAMD) Pin: The GATE IN pin is an interface pin to the
GATE OUT pin of a HAMD or BAMD depending on configuration.
The user should not make any other connection to this pin.
GATE OUT Pin: The GATE OUT pin is a synchronization pin
for HAMD/BAMD arrays; the user should not make any other
connection to this pin.

Page 49 of 87 05/2023
+OUT and –OUT Pin: Connect the +OUT of the HAM to the +IN Safety Notes
of the respective Vicor DC-DC converters with the recommended Each HAM, HAMD or BAMD module must be preceded by a
fuse. Connect the –OUT of the HAM to the –IN of the converters. safety agency recognized fast-blow 10A 3AG fuse.
In addition, an external hold-up capacitor of 1,000µF with a
minimum voltage rating of 450VDC, is required (across the output The HAM is not isolated from the line to either input or
of the HAM) for 16ms ride through time at full power (500µF output; a line isolation transformer must be used when
for half power, etc.). This capacitor must be in close proximity to making scope measurements. HAMs do not provide input
the HAM. Do not exceed 3,000µF of total output capacitance. to output isolation. Differential probes should be used
Lower values of capacitance may be used for reduced hold up when probing the input and output simultaneously to avoid
requirements, but not less than 500µF. Lower capacitance values destructive ground loops.
may degrade power factor specifications.
Protective Features
Auxiliary Supply (A/S) Pin: The HAM provides a low voltage non
isolated output Auxiliary Supply (A/S) that may be used to power Over Temperature Shut Down: The HAM is designed to
primary side control and monitoring circuitry. This output is shut down when the temperature of the baseplate exceeds
19 – 23VDC, referenced to –OUT, at 3mA max. Do not overload 90°C. Do not operate the HAM above its maximum operating
or short this output as the HAM will fail. A typical use for temperature of 85°C.
A/S is to power an optical coupler that isolates the Power OK Short-Circuit Protection: The HAM contains output short-circuit
signal (Figure 10.6). protection. Operation of this function does not clear the input fuse
Enable Output (E/O) Pin: The Enable Output (E/O) is used to and the output will resume normal operation after removal of the
inhibit the DC-DC converters at start up until the hold up capacitors fault. A short period of time may be required to allow for cooling
are charged, at which time Enable is asserted high (open state, of an internal temperature sensor.
Figure 10.8). If the AC line fails, E/O goes low when the DC output Output Overvoltage Protection: The HAM contains output
of the HAM drops below 250VDC. overvoltage protection. In the event the output voltage exceeds
E/O must be connected to the Gate Input of all VI-26x and VI-J6x approximately 420VDC, the boost will decrease to maintain 420VDC
drivers and/or the PC pin of the V375 DC-DC converters on the output. When the peak of the AC line exceeds 420V
(Figure 10.4); failure to do so may cause the converters to toggle (approximately 293VAC) the boost will have been reduced to zero
on and off. If an external load is connected directly to the output and the E/O line will be pulled low shutting down the converters.
of the HAM, do not apply the load until the output hold up Beyond this the protection circuit will be enabled and the output
capacitor(s) are fully charged. voltage will decrease.
In applications using VI-26x drivers and VI-26x boosters, the E/O

pin should be connected to the GATE IN pin of the driver module
only, it is not necessary to connect this pin to boosters as they are
controlled by their respective driver.

The E/O pin ancillary circuitry illustrated in Figures 10.4 and 10.5
provides transient immunity. The illustrated circuitry is the minimum
required, see Figures 10.4 and 10.5.
Power OK (P/OK) Pin: Power OK is a monitor signal that indicates
the status of the AC mains and the DC output voltage of the
HAM. P/OK is asserted (active low) when the output bus voltage
is within normal operating range (>270VDC) and 20 – 25ms after
DC-DC converters are enabled by the E/O signal of the HAM. This
provides sufficient time for the converters to turn on and their
output(s) to stabilize prior to P/OK being asserted, (Figure 10.9). For
momentary interruptions of AC power, the HAM will provide at
least 16ms of ride through or hold up time (with 1,000µF output
capacitor). On loss of power or brownout, (when the HAM output
voltage drops below 270VDC) the P/OK signal will go to an open
circuit state (Figure 10.7), signaling an impending loss of input
power to the converter modules. P/OK will provide power fail
warning at least 1ms prior to converter shut down. When the HAM
output voltage drops below 250VDC the converters are disabled via
Enable Output (E/O).
NOTE: Acoustic Noise: Audible noise may be emitted from the module
under no load, light load or dynamic loading conditions.
This is considered normal operation of the module.

Page 50 of 87 05/2023
F3
V1 C5
F1
L1 L1 + OUT +IN
L1
Vicor P/OK V375
GATE IN R1 R2 D2
GND Line Filter VI-HAM-xL E/O
PC DC-DC
P/N 30205 GATE OUT A/S C1 C2 PR Converters
6.3A D1 D4
L2/N L2/N L2/N – OUT –IN
LINE LOAD C6 Y-Capacitor
Component Description Vicor

Designation Part Number
C1 0.1µF ceramic, 50V
C7
C2, C3 0.01µF ceramic, 5V
F2
C4 Hold up capacitor, Available as a HUB
+IN
500 – 3,000µF from Vicor (see
D3 VI-26x or
adjoining table) G ATE IN VI-J6x
D5
R1 50kΩ C4
R3* DC-DC
C3
R2 250Ω, 0.25W G ATE OUT Converters
R3* 100kΩ, 2W –IN
D1 1N4691 zener, 6.2V
D2, D3 1N4006 diode C8 Y-Capacitor
D4, D5 1N5817 diode
V1 275V MOV 30076 Hold-up Box (HUB)
C5–C8 4,700pF Y2 cap. 01000
µF
F1, F2 Use recommended fusing for specific
µF
DC-DC Converters
µF
F3 10A, 250V
Figure 10.4 — Connection diagram HAM / DC-DC converter
V375 DC-DC Converters
C5
10A F1
+IN +OUT +IN
GATE IN P/OK R1 R2 D2 C9
Bridge PC
Rectifier VI-HAMD-xL E/O
GATE OUT A/S C1
PR
F3 600V, 35A D1
C2 D4
L1 L1 –IN –IN
–OUT
JMK Filter 1N4006 Z1
Input P/N 1319-13 Z2
V1 GND
12.6A * C6
1N4006 Z3 C7
L2/N L2/N 10A F2
+IN +OUT +IN
R3 D3 C10
GATE IN PC
VI-BAMD-xL D5
Component Description Vicor C4
R4 ** C3
Designation Part Number GATE OUT PR
C1 0.1µF ceramic, 50V –IN –OUT –IN
C2, C3 0.01µF ceramic, 50V
C4 Hold up capacitor, C8
1000 – 6000µF
C5–C8 4,700pF Y2 cap. 01000

C9,C10 0.2µF, 500V Film or Ceramic
D1 1N4691 zener, 6.2V
* Consult Vicor Applications Engineering for specific
D2, D3 1N4006 diode
HAMD / BAMD filtering information.
D4, D5 1N5817 diode ** A 100kΩ, 2W resistor is used for every 1,000µF
F1, F2 Use recommended fusing for specific of hold up capacitance.
DC-DC Converters
F3 20A, 250V
R1 50kΩ
R2, R3 250Ω, 0.25W
R4** 100kΩ, 2W
Hold-up Box (HUB)
V1 275V MOV 30076
2000µF HUB1000-P 1350W
Z1, Z2 130V Transorb 1.5KE130CA
Z3 150V Transorb 1.5KE150CA
Figure 10.5 — Connection diagram, HAMD / BAMD / V375 DC-DC converters.

HAMD-CL Driver HAM: No internal bridge rectifier or synchronization diodes.
Booster HAM: Companion module to HAMD-CM used for additional output power. No internal bridge rectifier.

Page 51 of 87 05/2023
+OUT DO NOT OVERLOAD

or directly connect a capacitor
P/OK to the A/S terminal.
E/O IAS ≤ 3mA

+ A/S +OUT
19 – 23V
– –OUT D
"Power OK" Status P/OK
Low = OK
G E/O
LOGIC S
+OUT
A/S
P/OK –OUT
E/O 18kΩ, 1/4W
A/S
–OUT
Figure 10.6 — Auxiliary upply (A/S) Figure 10.7 — Power OK (P/OK)
AC Mains
120VRMS
Boost Voltage
DC Output 280VDC
+OUT of HAM 270VDC
250VDC
Rectified Line
P/OK
Enable Output (E/O) Off at 250VDC
E/O
D
A/S
LOGIC S
25ms
Off at 270VDC
G –OUT Power OK (P/OK)
Outputs 10ms
DC-DC Converter(s) Off below 250VDC
Figure 10.8 — Enable Output (E/O) Figure 10.9 — Start-up / shut-down timing diagram
LINE Filter for High-Boost Ham

A line filter is required to provide attenuation of conducted
emissions generated by the HAM module and to protect it from
line transients. It also presents a well defined high frequency Cy D1
MOV*
LINE
LOAD
DM CM
AC line impedance to the input of the HAM. To meet the listed P/N 30076
R Cx D2
Cy D3
specifications, Vicor P/N 30205 line filter / transient suppressor or
equivalent must be used, see Figure 10.10. The addition of a MOV
external to this filter is required to meet normal mode transient HAM Filter P/N 30205
surge requirements. Cx = 1.5µF(x2)SH C y = 0.01µF, Y2 type LC = 6.9mH LD = 0.72mH
R = 235kΩ D1,2 = 1.5KE130CA D3 = 1.5KE150CA
For applications using HAMD + BAMD or where the user desires
*MOV required external to filter to meet normal mode transient surge requirements
to construct a custom HAM filter, the filter should be designed
following Figure 10.10, the schematic of Vicor P/N 30205 filter.
The current carrying capability of the inductors must be scaled
proportionally to the number of HAM modules used. Inductance
values must be selected according to Table 10.1. These limits are Figure 10.10 — Recommended HAM filter
to ensure proper operation of the HAM and do not guarantee a
system will meet conducted emissions specifications.
For applications requiring magnetic field shielding, do not place a Parameter Min Typ Max Unit
ferrous EMI shield over the plastic cover of the HAM module. This Differential Mode
0.2 0.35 0.75 mH
can cause thermal problems due to induction heating effects. Inductance (LD)
Common Mode
3 6 –– mH
Inductance (LC)
Table 10.1 — HAM filter inductance range

Page 52 of 87 05/2023
RATED CURRENT VS AMBIENT TEMPERATURE

90
4-40 INSERT
0.25 DP 4 PL
OPERATING TEMP (°C)

4.60 ±0.02
80
2.50 ø0.080 PIN 0.060
1.200 6 PLACES
70
FACE MAY BE
BOWED 0.04 MAX
60
LOAD
LINE
2.40±0.02 2.00 1.800

0.100 0.900
50
0.30 ±0.02
0.13 ±0.02
1.00
0.500 0.500 MAX
1.45
±0.02
2.800
40
1.0 2.0 3.0 4.0 5.0 6.0 7.0
'0'
CURRENT (AMPS)
4.000 2 PL
2.500 2 PL
1.200 2 PL
Figure 10.11 — HAM filter mechanical diagram Figure 10.12 — HAM filter’s current rating vs. temperature
4.410
3.500
.310
.700
2.260 A A
90 2.000 2 PL
1.900 2 PL
ø.102 TPH
6 PL
.060 80 1.000 2 PL
SEE
70
NOTE 1
INSERTION LOSS (db)
A
'0' .100 2 PL
DM .260 A '0'
60
NOTES ø.136 REPRESENTS WORST
1. TOP OF INSERTS TO BE FLUSH TO .010 '0' 4 PL CASE LOCATION FOR
50
ABOVE TOP OF PLASTIC WASHER.
2. FILTER MUST HAVE VICOR AGENCY LABEL
MKED 'A' EDGE OF FILTER
(PART # 08094-01 CSA, TUV, UL). RECOMMENDED CUSTOMER
40 MOUNTING
CM
30
20
10
0
0.01 0.04 0.1 0.4 1 4 10 40 100
0.02 0.07 0.2 0.7 2 7 20 70
FREQUENCY (MHz)
Figure 10.13 — HAM filter insertion loss vs. frequency, typical
Parameter Min Type Max Unit

Operating Voltage 85 250 VAC
Operating Temperature (See Figure 10.12) –40 40 °C
Leakage Current at 264VAC, 63Hz (either line to earth) 1.2 mA
Operating Current 6.3 A
Dielectric Withstand (line – case) 1500 VAC
Residual Voltage after 1s 34 V
Operating Frequency 50 60 Hz
Agency Approvals UL, CSA, TÜV
Table 10.2 — HAM filter part #30205 specifications

Page 53 of 87 05/2023
11. Filter Input Attenuator Module (FIAM™) Family Design Guide & Applications Manual
Description When power is applied, the charge pump / control circuit drives the
gate of the MOSFET in series with the positive rail (Q1). The charge
The FIAM family of front-end modules (Figure 11.1) provides EMI
pump limits the time rate of change of the gate bias voltage, which
filtering, transient protection and inrush current limiting in DC-DC
results in a controlled voltage ramp up – this limits the rate at
applications. The FIAM enables designers using Vicor Maxi, Mini,
which the external output capacitor is charged, thereby limiting the
and Micro DC-DC converters, and in select cases VI Chip® -based
system inrush current.
devices, to meet the transient immunity and EMI requirements of
the standards referenced in the respective model data sheet. During normal operation Q1 is fully enhanced – essentially a
closed switch.
Theory of Operation
Surge protection is accomplished by robbing gate charge of the
Refer to the simplified FIAM block diagram Figure 11.2. Q1 by the bottom MOSFET Q2. During this condition, the source
Internally, the FIAM employs a transient suppressor directly terminal of the Q1 follows the gate, offset by the gate threshold
across the input. A passive EMI filter that is tuned to attenuate voltage. A transient surge event at the input, or drain terminal
both common-mode and differential-mode conducted of the Q1 is therefore attenuated and absorbed by Q1 while in
emissions follow this. the source follower mode. As a result, the transient surge is not
propagated to the output of the FIAM.
When the FIAM ON / OFF control pin is tied to –OUT the device
is set to “ON” and will provide an output upon application Removing the ON / OFF connection shuts down the charge pump
of input voltage. and turns off Q1.
Note: The FIAM is shown in the on state. To disable,

open the connection between ON/OFF and –OUT .
4,700pF 0.01µF
F1
+IN +OUT +OUT
+IN
NC NC PC Mini, Maxi, Micro +S

External Reverse 0.2µF
Input Polarity Protection FIAM NC C1 SC
EMI ON PR DC-DC Converter –S
GND OFF
–IN –OUT –IN –OUT
0.01µF
4,700pF
Figure 11.1 — Typical application (FIAM)
Q1
+IN +OUT
Transient EMI ON/OFF

Charge Pump /
Suppression Filter
Control
Q2
–IN –OUT
EMI GND
Figure 11.2 — Block diagram (FIAM)

Page 54 of 87 05/2023
Parameter FIAM1 FIAM2 M-FIAM3

Input Voltage
36 – 76VDC 36 – 76VDC 180 – 375VDC
(Continuous)
Recommended Fusing (F1) Bussman ABC-10 Bussman ABC-20 Bussman ABC-3
Output Current
10A 20A 3A
(Maximum)
External Capacitance (C1) 10μF min – 150μF max 100μF min – 330μF max 10μF min – 22μF max
Inrush Limiting
0.014A/μF 0.014A/μF 0.018A/μF
(Maximum)
Bellcore GR-001089-Core, EN55022 Bellcore GR-001089-Core, EN55022 MIL-STD-461E, CE101, CE102, CS101,
EMI / RFI
Class B, FCC Part 15 Class B Class B, FCC Part 15 Class B CS114, CS115, CS116
Bellcore TR-NWT-0004999, ETS 300 Bellcore TR-NWT-0004999, ETS 300
Transient Immunity Exceeds limits of MIL-STD-704E/F
386-1, Class 2 386-1, Class 2
Mini Package Size 2.28 x 2.2 x 0.5in 2.28 x 2.2 x 0.5in 2.28 x 2.2 x 0.5in
Parameter M-FIAM5B M-FIAM9

Input Voltage
14 – 36VDC 10 – 36VDC
(Continuous)
Recommended Fusing (F1) Bussman ABC-20 Bussman ABC-20
Output Current
20A 18A
(Maximum)
External Capacitance (C1) 330μF min –1000μF max 330μF min –1000μF max
Inrush Limiting
0.007A/μF 0.007A/μF
(Maximum)
MIL-STD-461E, CE101, CE102, CS101, MIL-STD-461E, CE101, CE102, CS101,
EMI / RFI
CS114, CS115, CS116 CS114, CS115, CS116
100VDC 50ms per MIL-STD 1275A/B/D, 250VDC 70μs
50V Max. 12.5ms per MIL-STD-704E/F, per MIL-STD-1275A/B/D, 70VDC 20ms per MIL-STD-704A.
Transient Immunity
cont. operation 50VDC 12.5ms per MIL-STD-704E/F,
cont. operation
Mini Package Size 2.28 x 2.2 x 0.5in 2.28 x 2.2 x 0.5in
Table 11.1 — FIAM family specifications (see specific data sheets for more detail)

Page 55 of 87 05/2023
Figure 11.3 — FIAM and model V48A12C500B DC-DC converter Figure 11.4 — FIAM and model V48B24C250B DC-DC converter
conducted emissions typical conducted emissions typical
Figure 11.5 — Transient immunity: FIAM output response to an Figure 11.6 — Inrush limiting: Inrush current with 330µF external
input transient typical capacitance typical

Page 56 of 87 05/2023
12. Output Ripple Attenuator Module (MicroRAM™) Design Guide & Applications Manual
RSENSE
5.1
+IN +OUT
22µF
+IN +OUT
PC +S
RHR
DC-DC SC
SC
VREF LOAD
Converter CTRAN
PR
CHR*
–S
CTRAN* –IN –OUT
–IN –OUT
*Optional Component
Figure 12.1a — Typical configuration using remote sense
20kΩ
IRML6401
+IN +OUT +IN +OUT
PC DC-DC RSC SC RHR

SC μRAM VREF LOAD
PR Converter CTRAN
CHR* 1µF
–IN –OUT CTRAN* –IN –OUT
*Optional Component
Figure 12.1b — Typical configuration using SC control (optional CHR, 25µF maximum in SC configuration.)
Functional Description sustain while the converter responds. See Figures 12.8 through
12.16 for examples of dynamic performance. A larger headroom
The MicroRAM has an internal passive filter, (Figure 12.2) that
voltage setting will provide increased transient performance,
effectively attenuates ripple in the 50kHz to 1MHz range. An
ripple attenuation, and power dissipation while reducing overall
active filter provides attenuation from low frequency up to the
efficiency. (Figures 12.4a, 12.4b, 12.4c and 12.4d)
1MHz range. The user must set the headroom voltage of the active
block with the external RHR resistor to optimize performance. The The active loop senses the output current and reduces the
MicroRAM must be connected as shown in Figures 12.1a or 12.1b headroom voltage in a linear fashion to approximate constant
depending on the load-sensing method. The transient load current power dissipation of MicroRAM with increasing loads. (Figures 12.7,
performance can be increased by the addition of optional CTRAN 12.8 and 12.9) The headroom setting can be reduced to decrease
capacitance to the CTRAN pin. The low-frequency ripple attenuation power dissipation where the transient requirement is low and
can be increased by addition of optional CHR capacitance to the efficient ripple attenuation is the primary performance concern.
VREF pin as shown in Figures 12.3a and 12.3b.
The active dynamic headroom range is limited on the low end by
Transient load current is supplied by the internal CTRAN capacitance, the initial headroom setting and the maximum expected load.
plus optional external capacitance, during the time it takes the If the maximum load in the application is 10A, for example, the
converter loop to respond to the increase in load. The MicroRAM’s 1A headroom can be set 75mV lower to conserve power and still
active loop responds in roughly one microsecond to output voltage have active headroom at the maximum load current of 10A. The
perturbations. There are limitations to the magnitude and the high‑end or maximum headroom range is limited by the internal
rate of change of the transient current that the MicroRAM can ORing diode function.

Page 57 of 87 05/2023
The SC or trim-up function can be used when remote sensing

is not available on the source converter or is not desirable. It is
specifically designed for converters with a 1.23V reference and a
1kΩ input impedance like Vicor Maxi, Mini, Micro converters. In +IN Passive Active +OUT
comparison to remote sensing, the SC configuration will have an Block Block
error in the load voltage versus load current. It will be proportional SC
to the output current and the resistance of the load path from the VREF
output of the MicroRAM to the load. CTRAN SC
Control
The ORing feature prevents current flowing from the output of the –IN –OUT
MicroRAM back through its input terminal in a redundant system
configuration in the event that a converter output fails. When the
converter output supplying the MicroRAM droops below the ORed
output voltage potential of the redundant system, the input of the
MicroRAM is isolated from its output. Less than 50mA will flow out Figure 12.2 — MicroRAM block diagram
of the input terminal of the MicroRAM over the full range of input
voltage under this condition.
Ripple Attenuation @ 28V (Room Temp.)
Load capacitance can affect the overall phase margin of the 20.00
MicroRAM active loop as well as the phase margin of the converter
loop. The distributed variables such as inductance of the load 0.00
path, the capacitor type and value as well as its ESR and ESL also
Gain (dB)
affect transient capability at the load. The following guidelines –20.00
should be considered when point-of-load capacitance is used with
the MicroRAM in order to maintain a minimum of 30 degrees –40.00
of phase margin.
1. Using ceramic load capacitance with <1mΩ ESR and <1nH ESL: –60.00
a. 20 – 200µF requires 20nH of trace / wire load –80.00

10 100 1,000 10,000 100,000 1,000,000 10,000,000
path inductance
Freq. (Hz)
b. 200 – 1,000µF requires 60nH of trace / wire load 10A, 100µF VREF 10A, No VREF Cap
path inductance
2. For the case where load capacitance is connected directly to Figure 12.3a — The small signal attenuation performance as
the output of the MicroRAM, i.e., no trace inductance, and the measured on a network analyzer with a typical
ESR is >1mΩ: module at 28V and 10A output. The low
frequency attenuation can be enhanced by
a. 20 – 200µF load capacitance needs an ESL of >50nH
connecting a 100µF capacitor, CHR, to the VREF
b. 200 – 1,000µF load capacitance needs an ESL of >5nH pin as shown in Figures 12.1 and 12.2
3. Adding low ESR capacitance directly at the output terminals of
MicroRAM is not recommended and may cause Ripple Attenuation @ 5V (Room Temp.)
stability problems. 20.00
4. In practice, the distributed board or wire inductance at a load 0.00

or on a load board will be sufficient to isolate the output of
the MicroRAM from any load capacitance and minimize any
Gain (dB)
–20.00
appreciable effect on phase margin.
–40.00
–60.00
–80.00
10 100 1,000 10,000 100,000 1,000,000 10,000,000
Freq. (Hz)
10A, 100µF VREF 10A, No VREF Cap
Figure 12.3b — The small signal attenuation performance as

measured on a network analyzer with a typical
module at 5V and 10A. The low frequency
attenuation can be enhanced by connecting a
100µF capacitor, CHR, to the VREF pin as shown
in Figures 12.1 and 12.2

Page 58 of 87 05/2023
–0
VOUT = 3V load = 20A RHR = 28k (Vheadroom = 90mV)
100 degrees baseplate temperature 27kΩ (100mV)
26kΩ (110mV)
25kΩ (122mV)
24kΩ (135mV)
23kΩ (150mV)
–25 22kΩ (160mV)
–50
17kΩ (260mV)
18kΩ (240mV)
–75 19kΩ (217mV)
20kΩ (197mV)
21kΩ (180mV)
10Hz 100Hz 1.0kHz 10kHz 100kHz 1.0MHz
... DB(VVOUT)
Frequency
Figure 12.4a — Graph of simulated results demonstrating the tradeoff of attenuation vs. headroom setting at 20A and a equivalent
100°C baseplate temperature at 3V
–0 RHR = 260kΩ (Vheadroom = 90mV)

VOUT = 28V load = 20A
250kΩ (100mV)
100 degrees baseplate temperature 240kΩ (110mV)
230kΩ (122mV)
220kΩ (135mV)
210kΩ (150mV)
–25 200kΩ (160mV)
–50
150kΩ (260mV)
160kΩ (240mV)
170kΩ (217mV)
–75
180kΩ (197mV)
190kΩ (180mV)
10Hz 100Hz 1.0kHz 10kHz 100kHz 1.0MHz
... DB(VVOUT)
Frequency
Figure 12.4b — Graph of simulated results demonstrating the tradeoff of attenuation vs. headroom setting at 20A and a equivalent
100°C baseplate temperature at 28V
–10
–10
RHR = 26kΩ
–20 –20 250kΩ 100kHz 28V

100kHz 3V
RHR=28kΩ 500kHz 3V
500kHz 28V
27kΩ 240kΩ 1MHz 28V
1MHz 3V
–30 –30
230kΩ
26kΩ
25kΩ 220kΩ
dB
–40 –40
dB
24kΩ
23kΩ 210kΩ
22kΩ 200kΩ
–50 21kΩ –50 190kΩ
20kΩ 180kΩ
19kΩ 170kΩ
18kΩ 160kΩ 150kΩ
–60 17kΩ –60
–70
–70
3.0 3.5 4.0 4.5 5.0 5.5 6.0
3.0 3.5 4.0 4.5 5.0 5.5 6.0
Watts Watts
Figure 12.4c — MicroRAM attenuation vs. power dissipation Figure 12.4d — MicroRAM attenuation vs. power dissipation
at 3V, 20A at 28V, 20A

Page 59 of 87 05/2023
450mV
VOUT = 3V
400mV
VHEADROOM
RHR=16kΩ
300mV
17kΩ
18kΩ
19kΩ
20kΩ
200mV 21kΩ
1A 2A 4A 6A 8A 10A 12A 14A 16A 18A 20A
ILOAD
Figure 12.5 — Headroom vs. load current at 3V output
450mV
VOUT = 15V
400mV
VHEADROOM
RHR = 80kΩ
300mV
85kΩ
90kΩ
95kΩ
100kΩ
200mV 105kΩ
1A 2A 4A 6A 8A 10A 12A 14A 16A 18A 20A

ILOAD
450mV
VOUT=28V
400mV
VHEADROOM
RHR=150kΩ
300mV
160kΩ
170kΩ
180kΩ
190kΩ
200mV 200kΩ
1A 2A 4A 6A 8A 10A 12A 14A 16A 18A 20A

ILOAD

Page 60 of 87 05/2023
Figure 12.8 — V375A28C600B and µRAM: Input and output Figure 12.9 — V375A28C600B and µRAM; Input and output
ripple @ 50% (10A) load CH1 = VIN; dynamic response no added C TRAN; 20% of 20A
CH2 = VOUT; VIN – VOUT = 332mV; RHR = 178kΩ rating load step of 4A (10 – 14A); RHR = 178kΩ
(Configured as in Figures 12.1a and 12.1b)
Figure 12.10 — V375A28C600B and µRAM; Input and output Figure 12.11 — V375B12C250B and µRAM; Input and output
dynamic response C TRAN = 820µF Electrolytic; ripple @50% (10A) load CH1 = VIN; CH2 = VOUT;
33% of load step of 6.5A (10 – 16.5A); VIN – VOUT = 305mV; RHR = 80kΩ (Configured as
RHR = 178kΩ (Configured as in in Figures 12.1a and 12.1b)
Figures 12.1a and 12.1b)
Figure 12.12 — V300B12C250B and µRAM; Input and output Figure 12.13 — V300B12C250B and µRAM; Input and output
dynamic response no added C TRAN; 18% of 20A dynamic response C TRAN = 820µF Electrolytic;
rating load step of 3.5A (10 – 13.5A); RHR = 80kΩ 30% of load step of 6A (10 – 16A); RHR = 80kΩ
(Configured as in Figures 12.1a and 12.1b) (Configured as in Figures 12.1a and 12.1b)

Page 61 of 87 05/2023
Figure 12.14 — V48C5C100B and µRAM; Input and output ripple Figure 12.15 — V48C5C100B and µRAM; Input and output
@ 50% (10A) load CH1 = VIN; CH2 = VOUT; dynamic response no added C TRAN; 23% of 20A
VIN – VOUT = 327mV; RHR = 31kΩ rating load step of 4.5A (10 – 14.5A); RHR = 31kΩ
(Configured as in Figures 12.1a and 12.1b) (Configured as in Figures 12.1a and 12.1b)
Figure 12.16 — V48C5C100B and µRAM; Input and output

dynamic response C TRAN = 820µF Electrolytic;
35% of load step of 7A (10 – 17A); RHR = 31kΩ
(Configured as in Figures 12.1a and 12.b)
Notes:
The measurements in Figures 12.8 – 12.16 were taken with a µRAM2C21
and standard scope probes set at 20MHz bandwidth scope setting.
The criteria for transient current capability was as follows: The transient load
current step was incremented from 10A to the peak value indicated, then
stepped back to 10A until the resulting output peak to peak
measured ~ 40mV.

Page 62 of 87 05/2023
13. Lead-Free Pins (RoHS) Design Guide & Applications Manual
Overview
The following chapters contain soldering information for the
following Vicor product families; Maxi, Mini, Micro, VE-200,
VE-J00; VI Brick® and similar package filters and front ends. This
document is intended to provide guidance for making high-quality
solder connections of RoHS-compliant Vicor power modules to
printed circuit boards. This application note applies to lead-free
soldering of the Vicor RoHS-compliant modules. The following
provides an outline for appropriate soldering procedures and the
evaluation of solder joints to ensure an optimal connection to
the power module. Common soldering defects will be examined
and direction will be provided for detecting and handling them.
The Vicor manufacturing facilities use the IPC-A-610 standards
for establishing quality solder joints. It is recommended that
manufacturing processes using Vicor modules refer to these
same standards, which can be found along with supporting
documentation at www.ipc.org.
Analysis of a Good Solder Joint Figure 13.1 — Side profile of Maxi or Mini module’s
The IPC-A-610 standard requires that solder fill at least 75% of RoHS solder joint.
the barrel to ensure a solid connection. Ideally, all connections
should have a 100% fill. To accomplish this, the solder applied Soldering Procedures
to both the barrel and the pin must exhibit a process known as Hand Soldering: Before soldering, make sure that the PCB is
wetting. Wetting occurs when liquid solder on a surface is heated clean and free of debris, chemical residue, or liquid. It is not
to the point that it loses a significant amount of latent surface recommended that additional flux other than what is contained in
tension and evenly coats the surface via capillary action (both the solder be used during soldering because it potentially leaves
cohesion and adhesion). a residue that cannot be removed without potentially damaging
During the soldering process wetting can be identified by an even or compromising the power module. Also, the presence of these
coating of solder on the barrel and pin. In addition, coating the residues on the modules may cause harm or improper operation.
surface of barrel and pin, the solder will gather at the intersection The pins on Vicor modules are optimized to provide a
of the two and produce a trailing fillet along each surface. low‑resistance electrical connection. The final mounting scheme
Once wetting has occurred, then upon solidification it will bond for any module should be designed to minimize any potential
appropriately to both components, producing a quality connection. mechanical stress on the pins and solder joints. Modules with
Figure 13.1 shows a side profile of a good solder joint with a power heat sinks or modules used in systems that are subject to shock or
module. Notice that the solder forms a concave meniscus between vibration should use standoffs to minimize stress on the pins. It is
pin and barrel. This is an example of a properly formed fillet and is not recommended that discrete wires or connectors be soldered
evidence of good wetting during the soldering process. The joint directly onto a module.
between solder and pin as well as solder and pad should always
exhibit a feathered edge. In Figure 13.1 it can also be seen that the
solder covers a good deal of the surface area of both the pin and
the pad. This is also evidence of good wetting. (Notice also that the
solder joint is dull compared to leaded processing). This is evidence
of good immobilization of the joint during cooling as well as good
cleaning of the board prior to soldering. All soldering connections
should exhibit similar characteristics regardless of whether they are
soldered by hand, by fountain or by wave.
In examining a solder joint, be sure that there is no solder
connecting one pad to another. This is known as a solder bridge
and will be discussed later.

Page 63 of 87 05/2023
Also necessary for a good solder connection is pin protrusion Since there are so many factors that influence soldering time,
from the PCB. It is not possible to create a good solder joint listing actual times is difficult. In general, it is recommended that
without some protrusion of module pins from the PCB. If the PCB the joint be examined post-process to insure a quality soldering
is too thick to allow good pin protrusion, consider using Vicor joint. If necessary, different parameters can then be varied in order
module accessories such as sockets to allow proper mounting. to ensure a solid process. The soldering times listed in Table 13.1
Before soldering, the module should be mechanically affixed or can be used as a guideline for establishing more application and
immobilized with respect to the PCB to ensure no movement process specific parameters. Below are some recommendations for
during the soldering process. The standoffs can be used for this general practice:
process. Vicor power modules contain two types of pins: power
1. Do not run tip temperature above 810°F [430°C]. This will
pins (which deliver the power to the load and are typically sized
greatly increase the risk of damaging the pads, traces, printed
according to the rated output current) and signal pins (which
circuit board or Vicor power module. Check with the printed
typically carry very little current and are of a uniform size across a
circuit board manufacturer that the boards are RoHS capable
given product family). The larger the pin, the more soldering time
and for any additional recommendations in regard
required to form an adequate connection. In addition to the sizing
to temperature.
of the pin, the time required to create a robust connection will vary
depending on several parameters: 2. Apply the soldering iron to one side of the pin and pad and
apply the solder to the other, allowing the heat from the
1. PCB Thickness: The thicker the printed circuit board, the more
pin and pad to melt the solder. Do not apply solder to the
heat it is able to dissipate and will require more
soldering iron and subsequently attempt to transfer it to the
soldering time.
pad and pin. Melting the solder by applying it directly to the
2. Copper Trace Area: Power pins require large copper traces soldering iron does not guarantee adequate wetting on the
to minimize resistive power losses in carrying the power to the joint and is not considered good technique.
load. Since the copper tends to conduct heat well, the actual
3. Do not apply excessive pressure with the soldering iron to
sizes of these copper traces directly affect the amount of time
the printed circuit board, barrel or pad. This could result in
necessary to heat the PCB socket.
breaking a trace, dislodging a barrel or damaging the PCB,
3. Copper Trace Thickness: As above, the thickness of the which becomes noticeably softer when heated.
copper trace is a function of output current of the module and
4. Do not apply the soldering iron to a connection for an
has a direct impact on the amount of soldering time. Typically,
extended period of time or damage to the module could
PCB copper thickness is specified in terms of weight per square
result. If the soldering times exceed the upper limit listed
foot, typically 2 or 3oz copper for current-carrying planes.
in Table 13.1, consider using a larger tip or a higher power
4. Soldering Iron Power: A higher-power soldering iron can soldering iron.
source more heat and thus take less time to heat a PCB trace.
5. Make sure PCB pads and holes are clean before to soldering.
As a soldering iron is heating a point on the board, everything
that is adjacent to this point is being heated as well, including 6. Solders with no-clean flux may be used to facilitate soldering.
the Vicor power module. A large copper trace, because it
conducts heat very well, will exhibit less of a thermal gradient, 7. Keep the tip of the soldering iron clean and free from resin.
and thus a low-power soldering iron will have to heat the Apply a small amount of solder directly to the tip of the iron.
whole trace to a higher temperature before the area close to This process is known as tinning.
the iron is hot enough to flow solder. Because the trace and 8. Be careful not to jar the module or PCB while the solder is
board are both dissipating and conducting thermal energy, cooling. This could result in a cold solder joint, a void in the
some irons may not have enough power to heat a trace to the barrel or a cracked joint.
temperature that will allow proper soldering.
9. If it is necessary to re-solder a joint, remove all existing solder
5. Tip Temperature: Typical SAC-type solder melts at from the pad and pin before reapplying solder.
419 – 491°F [215 – 225°C]. Pb-free soldering requires a tip
temperature of about 800°F. A higher tip temperature will 10. Use of a soldering gun is not recommended for soldering
bring the barrel and pin above the melting point of solder Vicor modules.
faster. However, a higher tip temperature may cause damage 11. It is not recommended that Maxi / Mini / Micro module pins
to the pad, printed circuit board or module pin. be trimmed under any circumstances.
6. Type of Lead-free Solder: The actual melting point of the As a procedural benchmark, given an 800°F [427ºC] temperature
solder varies depending on the type of solder used and affects on a 60W iron with a 3mm tip, approximate times to solder
the necessary temperature of the pad and pin for flow. Vicor a Vicor power module to a 0.062in [1,5 mm] thick PCB board
recommends SAC305 SnAgCu solder for use on Vicor with an appropriately sized copper trace would be in the
power modules. range of Table 13.1.
7. Tip Size: A larger tip will be able to heat a larger surface area,
thus lowering soldering time.

Page 64 of 87 05/2023
Soldering Post Solder Cleaning: Vicor modules are not hermetically sealed
Converter Family Pin Type and must not be exposed to liquid, including but not limited to
Time (Range)
cleaning solvents, aqueous washing solutions or pressurized sprays.
VE-200 / VE-J00 Signal 3 – 5s
Cleaning the backside of the PCB is acceptable provided no solvent
VE-200 Power 5 – 8s contacts the body of the module.
VE-J00 Power 4 – 7s When soldering, it is recommended that no-clean flux solder be
Maxi / Mini / Micro Signal 3 – 5s used, as this will ensure that potentially corrosive mobile ions
will not remain on, around or under the module following the
Maxi Power 5 – 8s
soldering process.
Mini Power 4 – 7s
If the application requires the PCB to be subject to an aqueous
Micro Power 3 – 5s wash after soldering, then it is recommended that Vicor module
VI Brick® Input & Signal 3 – 5s accessories such as through-hole or surface-mount sockets
be used. These sockets should be mounted to the PCB, and
VI Brick Power 4 – 7s
the modules subsequently inserted following the aqueous
Also relevant for similar packaged accessory modules washing sequence.
Table 13.1 — Recommended pin soldering times for RoHS De-soldering Vicor Modules: Vicor modules should not be
family modules re‑used after de-soldering for the following reasons:
Again, please note that soldering for significantly longer periods 1. Most de-soldering procedures introduce damaging mechanical
of time than those listed above could result in damage to the and thermal stresses to the module.
module. Table 13.1 should not be used without verifying that 2. Devices or processes that may be capable of de-soldering a
the times will produce a quality soldering joint as defined in the Vicor module from a printed circuit board without causing
previous sections. damage have not been qualified for use with Vicor modules.
Wave Soldering: Vicor modules achieve an adequate solder For applications that require removal of a module with the intent of
connection on a wave-soldering machine with conveyor speeds reuse, use Vicor socketing systems.
from three to seven feet per minute. As with hand soldering,
times and parameters vary with the properties of the PCB and
copper traces. As a standard benchmark, the parameters below
may be used. As with hand-soldered boards, the results should be
examined to ensure a quality soldering joint and a sound process.
Wave Soldering Profile:
1. Bottom-side preheaters: Zone 1: 350°F [177°C],
Zone 2: 300°F [149°C], Zone 3: 675°F [357°C]
2. Top-side preheaters: 220 – 235°F [104 – 113°C]
3. Wave temperature: 510°F [266°C]
4. Wave type: 4.25in [107,95mm] standard laminar wave
Preheating of the PCB is generally required for wave soldering
operations to ensure adequate wetting of the solder to the PCB.
The recommended temperature for PCB topside is 203 – 248°F
[95 – 120°C] prior to the molten wave. Thick, multilayer PCBs
should be heated toward the upper limit of this range, while
simple two-layer PCBs should be heated to the lower limit. These
parameters are consistent with generally accepted requirements
for circuit-card assembly. The power module is often much more
massive than other components mounted to the PCB. During wave
solder preheating, the pins will dissipate much of their absorbed
heat within the module; therefore, adjustments to preheaters
alone will not improve module soldering significantly. A more
effective way to improve the soldering of the module is to lower
the conveyor speed and increase the dwell time in the molten
wave. Approximately five seconds of exposure to the molten wave
is required to achieve an acceptable solder joint for a
Maxi / Mini / Micro power module. The VE-200 / VE-J00 / VE-HAM
and VI Brick® modules should solder in approximately four seconds
of molten wave exposure.

Page 65 of 87 05/2023
Index of Common Soldering defects: 4. De-wetting: The solder initially appears to wet, but then pulls
back to expose the pad surface. More common
1. Solder Bridge: A short circuit between two electrically in wave-soldering.
inadvertently forming a “bridge” or connection between the
two points. Recommended Solution: Make sure the PCB is clean
prior to soldering.
Recommended Solution: Use a smaller soldering tip or hold
the tip at a different angle when soldering, so as to contact 5. Dry Joint: The solder has a dull gray appearance as opposed
only one pad at a time. to a bright silver surface. The solder joint may have a mottled
look as well, with jagged ridges. It is caused by the solder joint
2. Cold Solder: An incomplete or poor connection caused by moving before it has completely cooled.
either the barrel or the pin not being heated to the flow
temperature of solder. A cold solder joint will typically exhibit a Recommended Solution: Immobilize the module with
convex meniscus with possibly a dark spot around the barrel or respect to the PCB to ensure that the solder joint
pad. Also, a cold solder joint will not be shiny, but will typically cools properly.
have a “dirty” appearance.
6. Icicles: Jagged or conical extensions from solder fillet. These
CAUTION: A cold solder joint is not necessarily an open are caused by soldering with the temperature too low or
connection electrically, and cannot be diagnosed by a simple soldering to a highly heat absorbent surface.
continuity check. A cold solder joint is frequently an electrically
intermittent connection and is best diagnosed by way of visual Recommended Solution: Increase the soldering temperature,
inspection. A cold solder joint will likely become electrically open but not outside the recommended limits. If necessary, use a
following a period of temperature cycling. higher-power soldering iron.
Recommended Solution: Increase soldering iron 7. Pinholes: Small or large holes in surface of solder joint, most
temperature, soldering time or use a soldering iron with a commonly occurring in wave solder systems.
higher output wattage if hand soldering. If soldering, lower
conveyor speed or increase preheat temperature. Recommended Solution: Increase preheat or topside heater
temperature, but not outside the recommended limits.
3. PC Board Damage: An intermittent or poor connection
caused by damage to a trace, pad or barrel. A damaged
pad is best identified by a burn mark on the PCB or a trace pad
that moves when prodded with a mechanical object.
Recommended Solution: Lower the soldering iron
temperature or the soldering time. If damage persists, use a
lower power iron or consult with the manufacturer of the PCB
for recommended soldering guidelines.

Page 66 of 87 05/2023
References
Organizations
www.ipc.org
Commercial
www.aimsolder.com
www.alphaassembly.com
www.kester.com
Maxi / Mini / Micro Standoff Kits for Solder-Mounted Modules

Board Mounting Slotted Through-Hole Threaded
Thickness Options Baseplate Baseplate Baseplate
Nom. Mounting Pin Through-Hole Threaded Through-Hole Threaded Through-Hole
(Min / Max) Style Style Heat Sink Heat Sink Heat Sink Heat Sink Heat Sink
Kit-18150 Kit-18151 Kit-18146 Kit-18147 Kit-18146
0.062in Inboard F
(0.055in/0.071in) Bag-19126 Bag-19127 Bag-19122 Bag-19123 Bag-19122
1,5mm Kit-18156 Kit-18157 Kit-18150 Kit-18152 Kit-18150
(1,4mm /1,8mm) Onboard G
Bag-19132 Bag-19133 Bag-19126 Bag-19128 Bag-19126
0.093in Kit-18150 Kit-18151 Kit-18146 Kit-18147 Kit-18146

(0.084in/0.104in)
Inboard G
2,4mm
(2,1mm /2,6mm) Bag-19126 Bag-19127 Bag-19122 Bag-19123 Bag-19122
Kits include six (6) standoffs and screws. Mini and Micro modules require a minimum of four (4) standoffs.
Bags contain 100 standoffs only (#4-40 screws required).
Table 13.2 — Standoff kits for solder mounted modules
VI Brick® Standoff Kits

Standoffs Description Part No.
12pc Kit for 0.125in PCB (includes M3 x 5mm and M3 x 6mm screws) 34717
F-F Standoff
12pc Kit for 0.062in PCB (includes M3 x 5 mm screws) 34718
0.287in long
100pc bag 34709
M-F Standoff 12pc Kit (includes M3 x 6 mm screws) 34719

0.287in long 100pc bag 34710
Bags contain 100 standoffs only (M3 screws required).
Table 13.3 — VI Brick® Standoff Kits

Page 67 of 87 05/2023
14. Tin Lead Pins and InMate Sockets Design Guide & Applications Manual
Overview
The following chapters contain soldering information for the
following Vicor product families; Maxi, Mini, Micro; VI-200™,
VI-J00™; VI Brick® and similar package filters and front-ends. This
document is intended to provide guidance in utilizing soldering
practices to make high-quality connections of Vicor power modules
to printed circuit boards. Some care will be taken to outline
appropriate soldering procedures as well as the evaluation of solder
joints in a manner that enables the customer to ensure that the
end application has an optimal connection to the power module.
Common soldering defects will be examined and direction will be
provided for detecting and handling the common defects.
Vicor manufacturing facilities use the IPC-A-610C standards as
a means of establishing quality solder joints. It is recommended
that manufacturing processes using Vicor modules refer to these
same standards, which can be found, along with supporting Figure 14.1 — Side profile of a Mini module solder joint
documentation at: www.ipc.org.
Analysis of a Good Solder Joint

The IPC-A-610C standard requires that solder fill at least 75%
of the barrel in order to ensure a solid connection. Ideally, all
connections should have a 100% fill. In order to accomplish this,
the solder applied to both the barrel and the pin must exhibit a
process known as wetting. Wetting occurs when liquid solder on
a surface is heated to the point that it loses a significant amount
of latent surface tension and evenly coats the surface via capillary
action (both cohesion and adhesion).
During the soldering process wetting can be identified by an even
coating of solder on the barrel and pin. In addition to coating the
surface of barrel and pin, the solder will gather at the intersection
of the two and produce a trailing fillet along each surface.
Once wetting has occurred, then upon solidification it will bond
appropriately to both components, producing a quality connection.
Figure 14.1 shows a side profile of a good solder joint with a Mini Figure 14.2 — Maxi / Mini output power pin and sense pin
power module. Notice that for both examples the solder forms a
concave meniscus between pin and barrel. This is an example of
a properly formed fillet and is evidence of good wetting during
the soldering process. The joint between solder and pin as well as
solder and pad should always exhibit a feathered edge.
In Figure 14.1 it can also be seen that the solder covers a good
deal of the surface area of both the pin and the pad. This is also
evidence of good wetting. Notice also that the solder joint has
a smooth surface with a silver color. This is evidence of good
immobilization of the joint during cooling as well as good cleaning
of the board prior to soldering. All soldering connections should
exhibit similar characteristics regardless of whether they are
soldered by hand or wave soldered.
Figure 14.2 is a top view of the signal and power pin of a Maxi or
Mini module properly soldered to a printed circuit board. Notice
that both the joint and the area around the joint are clean and
free from resin and solder residue. Also the pad and printed circuit
board adjacent to the barrel are not burnt or discolored and are
solidly attached to each other. In examining a solder joint, be
sure that there is no solder connecting one pad to another. This is
known as a solder bridge and will be discussed further along with
other potential soldering defects.

Page 68 of 87 05/2023
Soldering Procedures 1. PCB Thickness: The thicker the printed circuit board is, the
more heat it is able to dissipate and thus it will require more
Hand Soldering: Before soldering, make sure that the PCB
soldering time.
is clean and free of debris, chemical residue or liquid. It is not
recommended that additional flux other than what is contained 2. Copper Trace Area: Power pins require large copper traces
in the solder be used during soldering as it potentially leaves a to minimize resistive power losses in carrying the power to the
residue that cannot be removed without potentially damaging load. Since the copper tends to conduct heat rather well, the
or compromising the power module. Also, the presence of these actual size of these copper traces directly affect the amount of
residues themselves on the modules may cause harm or improper time necessary to heat the PCB socket.
operation. The pins on Vicor modules are optimized in design for
providing a low-resistance electrical connection. The final mounting 3. Copper Trace Thickness: As above, the thickness of the
scheme for any module should be designed so as to minimize any copper trace is a function of output current of the module,
potential mechanical stress on the pins and solder joints. Modules and has a direct impact on the amount of soldering time.
with heat sinks or modules used in systems that are subject to Typically, PCB copper thickness is specified in terms of weight
shock or vibration should use standoffs to minimize stress on per square foot, typically 2 or 3oz copper for
the pins. Tin / lead pins are specifically designed for soldering current‑carrying planes.
applications while gold pin options are specified for socketed 4. Soldering Iron Power: A higher power soldering iron can
applications (see SurfMate or InMate mounting systems). It is source more heat and thus take less time to heat a PCB
not recommended that discrete wires or connectors be soldered trace. When a soldering iron is heating a point on the board,
directly onto a module. everything that is adjacent to this point is being heated as
Also necessary for a good solder connection is pin protrusion from well, including the Vicor power module. A large copper
the PCB. It is not possible to create a good solder joint without trace, because it conducts heat very well, will exhibit less of a
some protrusion of module pins from the PCB. If the PCB is too thermal gradient and thus a low-power soldering iron will have
thick to allow good pin protrusion, consider using Vicor module to heat the whole trace to a higher temperature before the
accessories such as sockets to allow proper mounting. area close to the iron is hot enough to flow solder. Because
the trace and board are both dissipating and conducting
Before soldering, the module should be mechanically affixed or thermal energy, some irons may not have enough power to
immobilized with respect to the PCB to ensure no movement heat a trace to the temperature that will allow
during the soldering process. The standoffs can be used proper soldering.
for this process.
5. Tip Temperature: Typical 63 / 37 solder melts at 392°F
Vicor power modules contain two types of pins: power pins (which [200°C]. A higher tip temperature will bring the barrel and pin
deliver the power to the load and are typically sized according to above the melting point of solder faster. However, a higher
the rated output current) and signal pins (which typically carry tip temperature may cause damage to the pad, printed circuit
very little current and are of a uniform size across a given product board or module pin.
family). The larger the pin, the more soldering time required to
form an adequate connection. In addition to the sizing of the pin 6. Type of Solder: The actual melting point of the solder
the time required to create a robust connection will vary depending varies depending on the type of solder used and affects the
on several parameters: necessary temperature of the pad and pin for flow. Vicor
recommends 63 / 37 SnPb solder for use on Vicor
power modules.
7. Tip Size: A larger tip will be able to heat a larger surface area,
thus lowering soldering time.

Page 69 of 87 05/2023
Since there are so many factors that influence soldering time, As a procedural benchmark, given a 750°F [400°C] temperature
listing actual times is difficult. In general, it is recommended that on a 60W iron with a 0.19in [3mm] tip, approximate times to
the joint be examined post-process to ensure a quality soldering solder a Vicor power module to a 0.062in [1,5mm] thick PCB
joint. If necessary, different parameters can then be varied in order board with an appropriately sized copper trace would be in the
to ensure a solid process. The soldering times listed in Table 14.1 range of Table 14.1.
can be used as a guideline for establishing more application and
process-specific parameters. Below are some recommendations for Converter Family Pin Type
Soldering
general practice: Time (Range)
1. Do not run tip temperature above 750°F [400°C] because VI-200™ / VI-J00™ Signal 3 – 5s
it will greatly increase the risk of damagingthe pads, traces, VI-200 Power 5 – 8s
printed circuit board or Vicor power module. Check with VI-J00 Power 4 – 7s
the printed circuit board manufacturer for any additional
recommendations with regards to temperature. Maxi / Mini / Micro Signal 3 – 5s
Maxi Power 5 – 8s
2. Apply the soldering iron to one side of the pin and pad and
apply the solder to the other, allowing the heat from the Mini Power 4 – 7s
pin and pad to melt the solder. Do not apply solder to the Micro Power 3 – 5s
soldering iron and subsequently attempt to transfer it to the
pad and pin. Melting the solder by applying it directly to the Table 14.1 — Recommended pin soldering times for
soldering iron does not guarantee adequate wetting on the Vicor modules
joint and is not considered good technique. Again, please note that soldering for significantly longer periods
3. Do not apply excessive pressure with the soldering iron to of time than the time listed above could result in damage to the
the printed circuit board, barrel or pad. This could result in module. The time listed in Table 14.1 should not be used without
breaking a trace, dislodging a barrel or damaging the PCB, verifying that the times will produce a quality soldering joint as
which becomes noticeably softer when heated. defined in the previous sections.
4. Do not apply the soldering iron to a connection for an Wave Soldering: Vicor modules achieve an adequate solder
extended period of time or damage to the module could connection on a wave soldering machine with conveyor speeds
result. If the soldering times exceed the upper limit listed from three to seven feet per minute. As with hand soldering,
in Table 14.1, consider using a larger tip or a higher power times and parameters vary with the properties of the PCB and
soldering iron. copper traces. As a standard benchmark the parameters below
may be used. As with hand-soldered boards, the results should be
5. Make sure PCB pads and holes are clean prior to soldering. examined to ensure a quality soldering joint and a sound process.
6. Solders with no-clean flux may be used to facilitate soldering. Wave Soldering Profile:
7. Keep the tip of the soldering iron clean and free from resin. 1. Bottom-side preheaters: Zone 1: 650°F [343°C],
Apply a small amount of solder directly to the tip of the iron. Zone 2: 750°F [398°C]
This process is known as tinning.
2. Top-side preheaters: 203 – 248°F [95 – 120°C]
8. Be careful not to jar the module or PCB while the solder is
cooling. This could result in a cold solder joint, a void in the 3. Wave temperature: 500°F [260°C]
barrel, or a cracked joint. 4. Wave type: 4.25in [107,9mm] standard laminar wave
9. If it is necessary to re-solder a joint, remove all existing solder Preheating of the PCB is generally required for wave soldering
from the pad and pin prior to reapplying solder. operations to ensure adequate wetting of the solder to the PCB.
10. Use of a soldering gun is not recommended for soldering The recommended temperature for PCB topside is 203 – 248°F
Vicor modules. [95 – 120°C] prior to the molten wave. Thick, multilayer PCBs
should be heated toward the upper limit of this range, while
11. It is not recommended that Maxi, Mini, Micro module pins be simple two-layer PCBs should be heated to the lower limit. These
trimmed under any circumstances. parameters are consistent with generally accepted requirements for
12. The caps of the InMate socket are designed to repel solder. It is circuit-card assembly.
normal for this surface to be free of solder.

Page 70 of 87 05/2023
The power module is often much more massive than other Index of Common Soldering defect:.
components mounted to the PCB. During wave solder preheating,
1. Solder Bridge: A short circuit between two electrically
the pins will dissipate much of their absorbed heat within the
unconnected points caused by a piece of solder inadvertently
module. Adjustments to preheaters alone, therefore, will not
forming a “bridge” or connection between the two points.
improve module soldering significantly.
Recommended Solution: Use a smaller soldering tip or
A more effective way to improve the soldering of the module is
hold the tip at a different angle when soldering, so as to only
to lower the conveyor speed and increase the dwell time in the
contact one pad at a time.
molten wave. Approximately five seconds of exposure to the
molten wave is required to achieve an acceptable solder joint for a 2. Cold Solder: An incomplete or poor connection caused by
Maxi, Mini or Micro power module. either the barrel or the pin not being heated to the flow
temperature of solder. A cold-solder joint will typically exhibit a
Post-Solder Cleaning: Vicor modules are not hermetically sealed
convex meniscus with possibly a dark spot around the barrel or
and must not be exposed to liquid, including but not limited to
pad. Also a cold-solder joint will not be shiny, but will typically
cleaning solvents, aqueous washing solutions or pressurized sprays.
have a “dirty”appearance.
Cleaning the backside of the PCB is acceptable provided no solvent
contacts the body of the module. CAUTION: A cold-solder joint is not necessarily an open
connection electrically and cannot be diagnosed by a simple
When soldering, it is recommended that no-clean flux solder be continuity check. A cold-solder joint is frequently an electrically
used, as this will ensure that potentially corrosive mobile ions intermittent connection and is best diagnosed by visual
will not remain on, around, or under the module following the inspection. A cold-solder joint will likely become electrically open
soldering process. following a period of temperature cycling.
If the application requires the PCB to be subject to an aqueous Recommended Solution: Increase soldering iron
wash after soldering, then it is recommended that Vicor module temperature, soldering time or use a soldering iron with a
accessories such as through-hole or surface-mount sockets higher output wattage if hand soldering. If wave soldering,
be used. These sockets should be mounted to the PCB and lower conveyor speed or increase preheat temperature.
the modules subsequently inserted following the aqueous
3. PC Board Damage: An intermittent or poor connection
washing sequence.
caused by damage to a trace, pad or barrel. A damaged pad
De-soldering Vicor Modules: Vicor modules should not be is best identified by a burn mark on the PCB or a trace of pad
re‑used after desoldering for the following reasons: that moves when prodded with a mechanical object.
1. Most de-soldering procedures introduce damaging mechanical Recommended Solution: Lower the soldering iron
and thermal stresses to the module. temperature or the soldering time. If damage persists use a
lower-power iron or consult with the manufacturer of the PCB
2. Devices or processes that may be capable of de-soldering a for recommended soldering guidelines.
Vicor module from a printed circuit board without causing
damage have not been qualified for use with Vicor modules. 4. De-wetting: The solder initially appears to wet but then pulls
For applications that require removal of a module with the back to expose the pad surface, more common in
intent of reuse, use Vicor socketing systems. wave soldering.
Recommended Solution: Make sure the PCB is clean prior
to soldering.
5. Dry Joint: The solder has a dull gray appearance as opposed
to a bright silver surface. The solder joint may have a mottled
look as well, with jagged ridges. It is caused by the solder joint
moving before completely cooled.
Recommended Solution: Immobilize the module with
respect to the PCB to ensure that the solder joint
cools properly.
6. Icicles: Jagged or conical extensions from solder fillet. These
are caused by soldering with the temperature too low or
soldering to a highly heat-absorbent surface.
Recommended Solution: Increase the soldering temperature,
but not outside the recommended limits. If necessary, use a
higher power soldering iron.
7. Pinholes: Small or large holes in surface of solder joint, most
commonly occurring in wave-solder systems.
Recommended Solution: Increase preheat or topside heater
temperature, but not outside the recommended limits.

Page 71 of 87 05/2023
References
Organizations
www.ipc.org
Commercial
www.aimsolder.com
www.alphaassembly.com
www.kester.com
Maxi / Mini / Micro Standoff Kits for Solder-Mounted Modules

Nominal Mounting Pin Through-Hole Threaded Through-Hole Threaded Through-Hole
[Min / Max] Style Style Heat Sink Heat Sink Heat Sink Heat Sink Heat Sink
Short Kit-18150 Kit-18151 Kit-18146 Kit-18147 Kit-18146

0.062in Inboard
(0.055in/0.071in) Tin / Lead Bag-19126 Bag-19127 Bag-19122 Bag-19123 Bag-19122
1,5mm Kit-18156 Kit-18157 Kit-18150 Kit-18152 Kit-18150
(1,4mm /1,8mm) Onboard L
Bag-19132 Bag-19133 Bag-19126 Bag-19128 Bag-19126
0.093in Kit-18150 Kit-18151 Kit-18146 Kit-18147 Kit-18146

(0.084in/0.104in)
Inboard L
2,4mm
(2,1mm /2,6mm) Bag-19126 Bag-19127 Bag-19122 Bag-19123 Bag-19122
Bags contain 100 standoffs only (#4-40 screws required).
Table 13.2 — Standoff Kits for solder mounted modules

Page 72 of 87 05/2023
15. Surface-Mount Socketing System (SurfMate) Design Guide & Applications Manual
SurfMate is a surface-mount connector system for use with Solder Paste: Solder paste thickness requirements will vary
pin‑compatible Maxi, Mini, Micro Family converters and depending on whether the board pads are flush or elevated
input / front-end modules. For the first time, circuit-board designers from the laminate.
and assemblers have the ability to surface mount high-density
Elevated Pads (preferred): The ideal height for elevated pads
DC-DC converters having current ratings up to 50A. (Table 15.1)
is 0.0042in [ 0,106 mm] ±10%. This can be achieved by using a
SurfMate utilizes a pair of surface-mounted headers that contain three-ounce copper surface layer. With this height, a minimum
sockets to accept the input and output pins of the module. solder paste thickness of 0.006in should be used. Thicker stencils of
(Table 15.2) The SurfMate header assembly is compatible with any between 0.008in [0,203mm] and 0.012in [0,305mm] are preferred.
thickness PC board, does not increase the module mounting height
Flush-Mounted Pads: For boards with flush-mounted pads
above the board, and is available for all three standard module size:
a minimum of 0.010in [0,254mm] solder paste should be
Maxi, Mini and Micro (full, half and quarter bricks).
used. Preferred thickness is between 0.012in [0,305mm] and
SurfMates are available packaged in standard recyclable 0.016in [0,406mm].
JEDEC-style trays for use with automated pick-and-place equipment
Placement: SurfMate locating pins will engage in the
and are compatible with standard reflow solder operations. After
corresponding PCB holes with a light push of the SurfMate into
reflow, the modules are simply inserted into the SurfMates. Any
the solder paste. The SurfMate should not be taped or adhered in
secondary soldering operation used for through-hole sockets or
place. The surface tension of the solder during reflow will center
pins can now be entirely eliminated – reducing manufacturing time
the SurfMate parts on the PCB, resulting in accurate positioning.
and eliminating dual processes.
Equipment and Solder: Soldering of SurfMates should be
This unique interconnect scheme combines the inherent flexibility
done using either an infrared or convection oven reflow process.
of component power designs with the manufacturing efficiency of
Solder type Sn63Pb37, or equivalent, with a eutectic temperature
surface-mount assembly.
of 361°F [183°C] should be used. Higher temperature solder is
not recommended.
Printed Circuit Board Design and Solder Guidelines for the
SurfMate Socketing System Standoffs: Mounting standoffs are required for SurfMate
Recommended PCB layout drawings for SurfMates are provided applications. The location for standoff holes is shown on the PCB
on the Vicor website. All unspecified PCB dimensional tolerances layout. A selection chart of recommended standoff kits is provided
comply with ANSI/IPC-D-300 for Class “B” boards. DXF versions in this section.
of the PCB outlines are available in the Accesorries section of Module Pins: SurfMates must be used with modules with the “S”
the Vicor website. or “F” pin style.
Recommended PCB Construction: The SurfMate system is Module Insertion / Extraction: Sockets and modules are
capable of very high current-carrying capacity. We therefore rated for up to five insertions and extractions before requiring
recommend a multilayer PCB with three-ounce copper and replacement. When installing a module, lightly place it into position
internal power and ground planes. Consult the drawings for the so that all pins are properly aligned over each socket. Then apply
recommended size and quantity of via holes for carrying current to even pressure by uniformly tightening each of the mounting
the internal planes. screws through the mounting slots on the baseplate into the pcb
Solder Mask and Pad: Two solder mask keep-out areas are mounted standoffs. For module removal, Vicor highly recommends
recommended. The larger area encompasses the complete pad the use of our Module Exchange Tool in order to ensure that the
area at either end. It ensures the proper height of the three‑ounce sockets are not damaged during the module removal process.
solder pads to the surrounding laminate. This provides for the Removing the module at an angle should be avoided as this can
optimum gap between the SurfMate and the damage the sockets.
PCB 0.0042in ±0.0004in [0,106mm ±0,010mm], minimizing
the solder paste thickness required for quality solder joints.
Without this solder mask keep-out area, the gap may widen,
(see “Flush‑Mounted Pads”), requiring thicker solder paste to fill
the larger gap.
The smaller solder mask keep-out areas are circular and are
located on each pad, for the solder joint between the PCB and the
SurfMate. The remainder of the pad has a covering of solder mask.
The solder paste is dispensed in a rectangular area covering the
soldering area and part of the solder mask area. During soldering,
the paste will migrate away from the solder mask area to the
soldering area, providing ample volume for quality solder joints.
Each pad features a non-plated through hole in the center of the
pad to provide a venting function. It is normal for the solder joint to
have a slight void centered on this through hole.

Page 73 of 87 05/2023
SurfMate: Surface-Mount Sockets

Full Brick (Maxi) Half Brick (Mini) Quarter Brick (Micro)
Board Mounting Five Five Five Pin
Input Output Input Output Input Output
Thickness Style Sets Sets Sets Style
Surface
All 22100 22101 16017 22100 22102 16021 22103 22104 16025 S, F
Mount
1. 2. 3.
Parameter Specification Value Reference

Compatibility
F Short RoHS pins
Module Pin Style
S Short ModuMate pins
Mechanical
Contact Normal Force 100g EOL min GR-1217-CORE, R5-23
Exception to GR-1217-CORE
Number of Mating Cycles 5 max [d]
which specifies 25 mating cycle
Module Engagement Force 32lbs per connector set max GR-1217-CORE, R5-31,32
Module Disengagement Force 32lbs per connector set max GR-1217-CORE, R5-31,32
Electrical
50A Maxi [a], Mini; 25A Micro Gold plating standards and accepted
Current Rating (Based on 248°F [120°C] max socket temp industry standards such as
& 86°F [30°C] max temperature rise of contact) IICIT, EIA, Bellcore guidelines
Low-Level Contact Resistance
400μΩ max GR-1217-CORE, 6.2.1
0.080in [2,03mm] dia socket (LLCR)
300μΩ max GR-1217-CORE, 6.2.1
200μΩ max GR-1217-CORE, 6.2.1
0.180in [4,57mm] dia sockets (LLCR)
Thermal
Max continuous-use
Max Socket Temperature 248°F [120°C] max
temperature for gold plating
GR-1217-CORE [b]
Temperature Rise 86°F [30°C] max
EIA-364-70A [c]
Environmental
SurfMate products are tested in random vibration environments to best simulate the broad spectrum of
frequencies and amplitudes that may be encountered in typical applications. Actual system resonant frequencies
Shock and Vibration
will depend on PCB construction and mounting details. For critical or unusual shock and vibration environments,
the performance of the system should be independently verified.
Table 15.1 — SurfMate specifications and materials
[a] For 80A operation with Maxi, contact Applications Engineering.

[b] GR-1217-CORE issue 1, November 1995 Generic requirements for separable electrical connectors used in telecommunications hardware.
A module of NEBSFR, FR-2063
[c] ANSI/EIA-364 American National Standards Institute / Electronic Industries Association (Electronic Components, Assemblies & Materials Association)
[d] The module and socket must be replaced after five mating cycles.

Page 74 of 87 05/2023
Materials Ratings
Headers
Material: Vectra E150i LCP Liquid Crystal Polymer
Flammability UL94 V-0/5VA
Thermal Stability (short term) 500°F [260°C]
Thermal Stability (long term) 392°F [200°C]
Solder Cap
Material 260 cartridge brass (70Cu, 30Zn)
100μin min Cu, followed by 50 – 100μin min low stress sulfamate-based electrolytic nickel,
Plating
followed by 20μin min soft gold
Sockets
Material Brush Wellman Alloy #25 C17200 deep draw quality or equiv. 0.010in thick
Woods nickel strike followed by 50μin min low stress sulfamate-based electrolytic nickel,
Plating
followed by 20μin min hard gold, followed by 10μin min soft gold
SurfMates
Figure 15.1 — SurfMates; five-pair sets Figure 15.2 — SurfMates; individual part numbers
Package Maxi Mini Micro Notes

Five-Pair Sets 16017 16021 16025 Inputs and outputs for five modules
Individual Part Numbers
Input 22100 22100 22103 Sold only in multiples of 35 Maxi, Mini or 40 Micro
Output 22101 22102 22104 Shipped in JEDEC trays

Page 75 of 87 05/2023
Module Exchange Tool
Used in facilitating the proper extraction of modules from InMate or SurfMate sockets.
22829
Removal without using the Exchange Tool may cause damage to the sockets.
22827
Description Part Number 22828
Maxi Exchange Tool 22827
Mini Exchange Tool 22828
Micro Exchange Tool 22829
Standoff Kits for SurfMate Mounted Modules
Figure 15.3 — Slotted baseplate; height above board Figure 15.4 — Through-hole or threaded baseplate;
with standoff height above board with standoff
Heat Sinks Module Kit # 100 Piece Kit

Slotted Baseplate
Through Hole 20178 20188
Threaded 20179 20189
Through-Hole Baseplate
Threaded 20177 20187
No Heat Sink 20184 20186
Threaded Baseplate
Threaded N/A N/A
No Heat Sink 20184 20186
Table 15.4 — Standoff kits for SurfMate mounted modules: part numbering and packaging;
module kits contain enough standoffs and screws for one module. 100 piece kits contain standoffs only.
Standoff Kits for SurfMate-Mounted Modules

Nominal Mounting Through-Hole Threaded Through-Hole Threaded Through-Hole
[Min / Max] Style Heat Sink Heat Sink Heat Sink Heat Sink Heat Sink
Surface Kit-20178 Kit-20179 Kit-20176 Kit-20177 Kit-20176

All
Mount Bag-20188 Bag-20189 Bag-20186 Bag-20187 Bag-20186
Bags of one hundred (100) do not include screws; #4-40 thread hardware required.

Page 76 of 87 05/2023
16. Through-Hole Socket-Mount System (InMate) Design Guide & Applications Manual
InMates are an innovative solution for through-hole socket Sockets also allow for mounting modules either inboard, with a
requirements. Consisting of individual plastic carriers for the input cutout in the PCB for the module, to minimize the height above the
and the output, each contains an array of sockets for either a full-, board or onboard. InMates are compatible with the ModuMate or
half- or quarter-brick sized module. The sockets are factory loaded RoHS pin style.
into the carrier, which holds them rigidly in place throughout the
InMates are available in standard recyclable JEDEC style trays for
assembly and soldering process. The carriers are later removed,
use with automated pick-and-place equipment and are compatible
leaving the sockets accurately positioned.
with most standard wave or hand solder operations. The sockets
Designed for use with pin-compatible Maxi, Mini and Micro Family are soldered into the board as part of the PCB assembly process.
converters, InMates are available for a wide range of PCB sizes and The module can then be plugged into place at anytime later.
mounting styles. PCB thicknesses can range from 0.055in [1,39mm]
NOTE: Please refer to Section 13 of the design guide for the InMate
to 0.1375in [3,49mm].
soldering procedure.
Insert 
Solder 
Remove Carrier 
Insert Module 
Figure 16.1 — InMate carrier / socket assembly and soldering process

Page 77 of 87 05/2023
InMate: Through-Hole Sockets
1. 2. 4. 5.
3.
Board Thickness Full Brick [Maxi) Half Brick [Mini) Quarter Brick [Micro)
Normal Mounting Five Five Five Pin
Input Output Input Output Input Output
[Min / Max) Style Sets Sets Sets Style
0.062in Inboard 18374 18382 18362 18374 18384 18366 18376 18386 18370 S or F
(0.055in / 0.071in)
1,5mm
(1,4mm / 1,8mm) Onboard 18378 18388 18364 18378 18390 18368 18380 18392 18372 N or G
0.093in Inboard 18375 18383 18363 18375 18385 18367 18377 18387 18371 S or F
(0.084in / 0.104in)
2,4mm
(2,1mm / 2,6mm) Onboard 18379 18389 18365 18379 18391 18369 18381 18393 18373 N or G
0.125in
(0.1125in / 0.1375in)
Onboard 21539 21543 21510 21539 21544 21511 21540 21545 21512 N or G
3,1mm
(2,8mm / 3,5mm)
Table 16.1 — Guide to InMate selection
1. Select Board Thickness: 4. Select the Ordering Part Number:

Nominal 0.062in [1,5mm], 0.093in [2,4mm] or 0.125in [3,1mm]. Order packages of five input / output sets or in higher
quantities order input and output InMates separately. For
2. Select Mounting Style: individual input or output InMates, minimum orders of 35 for
Inboard requires a PCB cutout for the “belly” of the module. Maxi or Mini and 40 for Micro apply.
See dotted lines in PCB drawing links on Page 80 for
cut-out area. 5. Verify Correct Pin Style for the Module:
For predefined parts, “S” or “F”= short ModuMate and “N” or
3. Identify Module Type: “G” = long ModuMate
Full brick (Maxi), half brick (Mini) or quarter brick (Micro).
See Table 16.4 for standoff recommendations.

Page 78 of 87 05/2023
Parameter Specification Value Reference

Compatibility
F = short Au plated Short RoHS pins
S = short Au plated Short ModuMate pins
Module Pin Styles
G = long Au plated Long RoHS pins
N = long Au plated Long ModuMate pins
Mechanical
Contact Normal Force 100g EOL min GR-1217-CORE, R5-23
Number of Mating Cycles 5 max [h] Exception to GR-1217-CORE which specifies 25 mating cycle
Module Engagement Force 32lbs per connector set max GR-1217-CORE, R5-31,32
Module Disengagement Force 32lbs per connector set max GR-1217-CORE, R5-31,32
Electrical
50A Maxi [e] / 50A Mini / 25A Micro Gold plating standards and accepted
Current Rating for Output Pin Sockets (Based on 248°F [120°C] max socket temp industry standards such as
& 86°F [30°C] max temperature rise of contact) IICIT, EIA, Bellcore guidelines
400μΩ max GR-1217-CORE, 6.2.1
300μΩ max GR-1217-CORE, 6.2.1
200μΩ max GR-1217-CORE, 6.2.1
0.180in [4,57mm] dia sockets (LLCR)
Thermal
Max Socket Temperature 248°F [120°C] max Max continuous-use temperature for gold plating
GR-1217-CORE [g]
Temperature Rise 86°F [30°C] max
EIA-364-70A [f]
Environmental
InMate products are tested in random vibration environments to best simulate the broad spectrum of frequencies
and amplitudes that may be encountered in typical applications. Actual system resonant frequencies will depend on
Shock and Vibration
PCB construction and mounting details. For critical or unusual shock and vibration environments, the performance
of the system should be independently verified.
Table 16.2 — InMate specifications and materials
Materials Ratings
Headers
Material: Ryton™ R–7 PPS, 65% Glass Fiber and
Poly-Phenylene Sulfide
Mineral-Filled Compound
Flammability UL94 V-0/5VA
Thermal Stability (short term) 500°F [260°C]
Thermal Stability (long term) 392°F [200°C]
Solder Cap
Material 305 stainless steel
Plating Clear passivate to repel solder
Sockets
Material Brush Wellman Alloy #25 C17200 deep draw quality or equiv. 0.010in thick
Woods nickel strike followed by 50μin min low stress sulfamate-based electrolytic nickel,
Plating
followed by 20μin min hard gold, followed by 10μin min soft gold
Table 16.3 — Material properties of InMate components

[e] For 80A operation with Maxi, contact Applications Engineering.
[f] GR-1217-CORE issue 1, November 1995 Generic requirements for separable electrical connectors used in telecommunications hardware.
A module of NEBSFR, FR-2063
[g] ANSI/EIA-364 American National Standards Institute / Electronic Industries Association (Electronic Components, Assemblies & Materials Association)
[h] The module and socket must be replaced after five mating cycles.

Page 79 of 87 05/2023
Standoff Kits for InMate Mounted Modules

Nominal Mounting Through-Hole Threaded Through-Hole Threaded Through-Hole
(Min / Max] Style Heat Sink Heat Sink Heat Sink Heat Sink Heat Sink
Kit -18153 Kit -18154 Kit -18148 Kit -18149 Kit -18148
0.062in Inboard
(0.055in / 0.071in) Bag -19129 Bag -19130 Bag -19124 Bag -19125 Bag -19124
1,5mm Kit -18158 Kit -18159 Kit -18153 Kit -18155 Kit -18153
(1,4mm /1,8mm) Onboard
Bag -19134 Bag -19135 Bag -19129 Bag -19131 Bag -19129
Kit -18153 Kit -18154 Kit -18148 Kit -18149 Kit -18148
0.093in Inboard
(0.084in / 0.104in) Bag -19129 Bag -19130 Bag -19124 Bag -19125 Bag -19124
2,4mm Kit -18156 Kit -18157 Kit -18150 Kit -18152 Kit -18150
(2,1mm /2,6mm) Onboard
Bag -19132 Bag -19133 Bag -19126 Bag -19128 Bag -19126
0.125in Kit - 24054 Kit -18157 Kit -24056 Kit - 18152 Kit-24056
(0.113in / 0.138in)
Onboard
3,1mm
(2,8mm / 3,5mm) Bag -19132 Bag -19133 Bag -19126 Bag - 19128 Bag-19126
Kits include six (6] standoffs and screws. Mini and Micro modules require a minimum of four (4] standoffs.
Bags of one hundred (100] do not include screws; #4-40 thread hardware required.
Table 16.4 — InMate standoff recommendations
References
InMate PCB layout drawing for Maxi Module https://asp.vicorpower.com/cadUtil/display_cad.asp?pn=18400&ct=PDF

InMate PCB layout drawing for Mini Module https://asp.vicorpower.com/cadUtil/display_cad.asp?pn=18399&ct=PDF
InMate PCB layout drawing for Micro Module https://asp.vicorpower.com/cadUtil/display_cad.asp?pn=18398&ct=PDF
InMate and Socket outline drawing for Inboard Maxi Modules https://asp.vicorpower.com/cadUtil/display_cad.asp?pn=18483-XX&ct=PDF
InMate and Socket outline drawing for Inboard Mini Modules https://asp.vicorpower.com/cadUtil/display_cad.asp?pn=18482-XX&ct=PDF
InMate and Socket outline drawing for Inboard Micro Modules https://asp.vicorpower.com/cadUtil/display_cad.asp?pn=18481-XX&ct=PDF
InMate and Socket outline drawing for Onboard Maxi Modules https://asp.vicorpower.com/cadUtil/display_cad.asp?pn=18480-XX&ct=PDF
InMate and Socket outline drawing for Onboard Mini Modules https://asp.vicorpower.com/cadUtil/display_cad.asp?pn=20030-XX&ct=PDF
InMate and Socket outline drawing for Onboard Micro Modules https://asp.vicorpower.com/cadUtil/display_cad.asp?pn=20029-XX&ct=PDF
Module Exchange Tool
Used in facilitating the proper extraction of modules from InMate or SurfMate sockets.
22829
Removal without using the Exchange Tool may cause damage to the sockets.
22827
Description Part Number 22828
Maxi Exchange Tool 22827
Mini Exchange Tool 22828
Micro Exchange Tool 22829

Page 80 of 87 05/2023
17. Glossary of Technical Terms Design Guide & Applications Manual
A C
AC-OK Signal: The signal used to indicate the loss of AC input Capacitive Coupling: Coupling of a signal between two circuits,
voltage from the 115 / 230V line. due to discrete or parasitic capacitance between the circuits.
Altitude Testing: Generally performed to determine the Center Tap: An electrical connection made at the center of a
proper functionality of equipment in airplanes and other flying transformer or inductor winding, usually so as to result in an equal
objects. MIL-STD-810. number of turns on either side of the tap.
Ambient Temperature: The temperature of the environment, Centralized Power Architecture (CPA): One of the oldest power
usually the still air in the immediate proximity of the power supply. systems architectures, generates all system voltages at a central
location and distributes them to load locations via distribution
Apparent Power: A value of power for AC circuits that is buses. This can be effective if the voltages are high and the
calculated as the product of RMS current times RMS voltage, currents low or if the distances between the power supply and the
without taking power factor into account. loads are small.
C-Grade: Industry standard where the operating temperature of a
B device does not drop below –20°C.
Bandwidth: A range of frequencies over which a certain Chassis-Mount Configuration: A configuration where the
phenomenon is to be considered. modules or AC front ends are mounted directly to the chassis.
Baseplate: All modular products have an aluminum mounting base Common-Mode Noise: Noise present equally on two conductors
at which Vicor specifies operating temperatures and which should with respect to some reference point; often used specifically to
be affixed to a thermally conductive surface for cooling. refer to noise present on both the hot and neutral AC lines with
respect to ground.
Bellcore Specification: A telecommunications industry standard
developed by Bellcore. ComPAC™: A Vicor DC input power supply that provides EMC
filtering and transient suppression for industrial, military and
Bipolar Transistor: A transistor that operates by the action of telecommunications markets.
minority carriers across a PN junction; and is a current controlled
device as opposed to a voltage controlled device. Constant-Current Power Supply: A power supply designed
to regulate output current for changes in line, load, ambient
Bleeder Resistor: A resistor added to a circuit for the purpose of temperature and drift resulting from time.
providing a small current drain, to assure discharge of capacitors.
Constant-Voltage Power Supply: A power supply designed
Bobbin: A device upon which the windings of a transformer or to regulate output voltage for changes in line, load, ambient
inductor are wound, it provides a form for the coil and insulates the temperature and drift resulting from time.
windings from the core.
Control Circuit: A circuit in a closed-loop system, typically
Booster Converter: A “child” module in a Driver / Booster containing an error amplifier, that controls the operation of the
combination, where the Driver is the parent. Several Boosters can system to achieve regulation.
be paralleled with a Driver module for higher output power.
Converter: An electrical circuit that accepts a DC input and
Breakdown Voltage: A voltage level at which dielectric insulation generates a DC output of a different voltage usually achieved by
fails by excessive leakage current or arcing. In reference to power high frequency switching action employing inductive and capacitive
supplies the breakdown voltage is the maximum AC or DC voltage filter elements.
that can be applied from input to output and / or chassis.
Crest Factor: In an AC circuit, the mathematical ratio of the peak
Bridge Converter: A DC-DC converter topology (configuration) to RMS values of a waveform. Crest factor is sometimes used for
employing two or four active switching components in a bridge describing the current stress in AC mains supply wires, since for a
configuration across a power transformer. given amount of power transferred, the RMS value, and hence the
Bridge Rectifier: A full wave rectifier circuit employing four losses, become greater with increasing peak values. Crest factor
rectifiers in a bridge configuration. gives essentially the same information as power factor, and is being
replaced by power factor in power supply technology.
British Telecom Standards: A telecommunications industry
standard developed by the British PTT authorities. Cross Regulation: The effect of a load change on one output to
the regulation of another output. It usually only applies to non
Brownout: A reduction of the AC mains distribution voltage, postregulated (quasi) outputs.
usually caused deliberately by the utility company to reduce
power consumption when demand exceeds generation or Crowbar: An overvoltage protection method that shorts the
distribution capacity. power supply output to ground in order to protect the load when
an overvoltage fault is detected.
Burn-In: Operating a newly manufactured power supply, usually at
rated load, for a period of time in order to force component infant CSA: Canadian Standards Association. Defines the standards and
mortality failures or other latent defects. safety requirements for power components.

Page 81 of 87 05/2023
Current Limiting: An overload protection circuit that limits the EMC: Electromagnetic Compatibility. Relating to compliance with
maximum output current of a power supply in order to protect the electromagnetic emissions and susceptibility standards.
load and/or the power supply.
EMI: Electromagnetic Interference. The generation of unwanted
Current Mode: A control method for switch-mode converters noise during the operation of a power supply or other electrical or
where the converter adjusts its regulating pulsewidth in response electronic equipment.
to measured output current and output voltage, using a dual loop
ESR: Equivalent Series Resistance. The value of resistance in
control circuit.
series with an ideal capacitor that duplicates the performance
Current Monitor: An analog power supply signal that is linearly characteristics of a real capacitor.
proportional to output current flow.
F
D
Factorized Power Architecture (FPA™): A power distribution
DC-OK Signal: Signal used to monitor the status of the DC output. architecture that is inherently more granular and leverages
an allocation of the DC-DC converter functions consistent
De-rating: A reduction in an operating specification to improve with efficient power distribution principles. An optimal power
reliability. For power supplies it is usually a specified reduction in distribution architecture should efficiently support demanding low
output power to facilitate operation at higher temperatures. voltage, high current loads. FPA is a higher level power architecture
Design Life: The expected lifetime of a power supply during which that offers dramatic improvements in onboard power distribution
it will operate to its published specifications. systems, in performance, reliability and economy.
Differential-Mode Noise: Noise that is measured between Fault Tolerant Configuration: A method of parallel operation,
two lines with respect to a common reference point excluding using output Oring diodes, in which the failure of a single supply
common‑mode noise. The resultant measurement is the difference (module) will not result in a loss of power. The total current
of the noise components of the two lines. The noise between the of the parallel system must not exceed the load requirements
DC output and DC return is usually measured in power supplies. to a point where the failure of a single unit will not result in a
system overload.
Distributed Power Architecture (DPA): A power distribution
architecture that replaces multiple central power sources with a FET: Field Effect Transistor. A majority carrier-voltage
single bulk supply that is converted to the end-use voltages by controlled transistor.
DC-DC converters located at the point of need. The growth of FinMod™: A flangeless / finned packaging option available on the
this design technique is demonstrated by the size of the DC‑DC Vicor VI-/MI-Family converters and accessory modules.
converter market. Distributed power can reduce the system
size, reduce the system weight, provide better operation with FlatPAC™: A Vicor AC-DC switcher available with one, two or
battery power, and deliver more efficient sub-system isolation three outputs, with total power rating from 50 – 600W.
and redundancy.
Floating Output: An output of a power supply that is not
Drift: The change in an output voltage, after a warm-up period, connected or referenced to any other output, usually denoting full
as a function of time when all other variables such as line, load and galvanic isolation. Floating outputs can generally be used as either
operating temperature are held constant. positive or negative outputs. Non floating outputs share a common
return line and are hence DC referenced to one another.
Driver Module: The controlling module in a standalone or
Driver / Booster configuration. The Driver module contains all the Foldback Current Limiting: A type of protection circuit where
control circuitry. the output current decreases as the overload increases. The
output current reaches a minimum as the load approaches a short
Dropout: The lower limit of the AC input voltage where the circuit condition.
power supply just begins to experience insufficient input to
maintain regulation. The dropout voltage for linears is largely Forward Converter: A switching power supply in which the
line dependent, whereas for most switchers it is largely load energy is transferred from the input to the output during the “on”
dependent, and to a smaller degree line dependent. time of the primary switching device.
Dynamic Load Regulation: The delta in output voltage when the
output load is rapidly changed.
G
GATE IN: The GATE IN pin of the module may be used to turn
E the module on or off. When GATE IN is pulled low, the module is
turned off. When GATE IN is floating (open collector) the module
Efficiency: The ratio of total output power to input power is turned on. The open circuit voltage of the GATE IN pin is less
expressed as a percentage. than 10V, referenced to –VIN. A GATE OUT / GATE IN connection
Electronic Load: An electronic device designed to provide a load is necessary to run Driver / Booster configurations.
to the outputs of a power supply, usually capable of dynamic
loading, and frequently programmable or computer controlled.

Page 82 of 87 05/2023
GATE OUT: The GATE OUT pin is the clock pulse of the converter. Inrush Current: The peak current flowing into a power supply the
It is used to synchronize Booster modules to a Driver module for instant AC power is applied. This peak may be much higher than
high power arrays. the steady state input current due to the charging of the input
filter capacitors.
Ground: An electrical connection to earth or some other
conductor that is connected to earth. Sometimes the term Inrush-Current Limiting: A circuit that limits the amount of inrush
“ground” is used in place of “common,” but such usage is not current when a power supply is turned on.
correct unless the connection is also connected to earth.
Isolation: Two circuits that are completely electrically separated
Ground Loop: An unintentionally induced feedback loop caused with respect to DC potentials, and almost always AC potentials. In
by two or more circuits sharing a common electrical ground. power supplies, it is defined as the electrical separation of the input
and output via the transformer.
Isolation Voltage: The maximum AC or DC test voltage that
H may be applied from input to output and/or chassis of a power
Haversine: A waveform that is sinusoidal in nature, but consists of supply. Usually this has a time limit per preregulatory agency
a portion of a sine wave superimposed on another waveform. The such as EN60950.
input current waveform to a typical offline power supply has the Intermediate Bus Architecture (IBA): A power distribution
form of a haversine. architecture that relies on non-isolated point-of-load regulators
Headroom: Used in conjunction with series pass regulators, (niPOLs), reducing the PoL function to regulation and
headroom is the difference between the input and output voltages. transformation. The niPOLs operate from an intermediate bus
voltage provided by upstream isolated converters. However, IBA
Heat Sink: A medium of high thermal mass that can absorb (sink) has inherent limitations that require tradeoffs between distribution
heat indefinitely with negligible change in temperature. Heat and conversion loss that limit responsiveness to rapid load changes.
sinks are not necessarily needed with Vicor modules, and their IBA has proven effective as an interim method of containing power
use is highly dependent on the individual application, power and system cost while addressing the trend toward a proliferation of
ambient temperature. lower load voltages.
High Line Input: The maximum steady-state input voltage
on the input pin.
L
Hipot: Abbreviation for high potential, and generally refers to
the high voltages used to test dielectric withstand capability for Leakage Current: A term relating to current flowing between the
regulatory agency electrical safety requirements. AC supply wires and earth ground. The term does not necessarily
denote a fault condition. In power supplies, leakage current usually
Hold-Up Capacitor: A capacitor whose energy is used to provide refers to the 60Hz current that flows through the EMC filter
output voltage for a period after the removal of input voltage. capacitors connected between the AC lines and ground (Y caps).
Hold-Up Time: The length of time a power supply can operate Linear Regulator: A regulating technique where a dissipative
in regulation after failure of the AC input. Linears have very active device such as a transistor is placed in series with a power
short hold-up times due to the energy stored on the low-voltage supply output to regulate the output voltage.
secondary side output capacitors. Switchers have longer times due
to higher-voltage primary-side energy storage capacitors. Line Regulation: The change in output voltage when the AC input
voltage is changed from minimum to maximum specified.
Hot Swap: Insertion and extraction of a power supply into a
system while power is applied. Line Voltage (Mains): The sine wave voltage provided to the
power supply, usually expressed in volts RMS.
Load Regulation: The change in output voltage when the load on
I the output is changed.
I-Grade: Industry standard where the operation temperature of a Local Sensing: Using the voltage output terminals of the power
device does not drop below –40°C. supply as sense points for voltage regulation.
Impedance: The ratio of voltage to current at a Long-Term Stability: Power supply output voltage change due
specified frequency. to time with all other factors held constant. This is expressed in
Induced Noise: Noise generated in a circuit by varying a magnetic percent and is a function of component aging.
field produced by another circuit. Low Line: The minimum steady state voltage that can be applied
Input Line Filter: An internally or externally mounted lowpass or between the +IN and –IN pins of a converter and still maintain
band-reject filter at the power supply input that reduces the noise output regulation.
fed into the power supply.

Page 83 of 87 05/2023
M Output Filtering: Filter used to reduce switching power supply

noise and ripple.
Mains: The utility AC power distribution wires.
Output Good: A power supply status signal that indicates the
Margining: Adjusting a power supply output voltage up or down output voltage is within a certain tolerance. An output that is either
from its nominal setting in order to verify system performance too high or too low will deactivate the Output Good signal.
margin with respect to supply voltage. This is usually done
electrically by a system-generated control signal. Output Impedance: The ratio of change in output voltage to
change in load current.
MegaMod™: A chassis mount packaging option that incorporates
one, two or three VI-/MI-200 Family converters for single, dual or Output Noise: The AC component that may be present on the
triple outputs having a combined power of up to 600W. DC output of a power supply. Switch-mode power supply output
noise usually has two components: a lower frequency component
M-Grade: An industry standard where the operating temperature at the switching frequency of the converter and a high frequency
of a device does not drop below –55°C. component due to fast edges of the converter switching transitions.
MIL-SPECS: Military standards that a device must meet to be used Noise should always be measured directly at the output terminals
in military environments. with a scope probe having an extremely short grounding lead.
MiniMod™: A junior size (VI-/MI-J00) version of the VI-/MI-200 Output-Power Rating: The maximum power in watts
Family of DC-DC converters offering up to half the power in a that the power supply can provide and still maintain safety
2.28 x 2.4 x 0.5in [57,9 x 61,0 x 12,7mm] package. agency approvals.
Minimum Load: The minimum load current / power that must Output-Voltage Accuracy: See Setpoint Accuracy.
be drawn from the power supply in order for the supply to meet Overload Protection: A power supply protection circuit that limits
its performance specifications. Less frequently, a minimum load is the output current under overload conditions.
required to prevent the power supply from failing.
Overshoot: A transient output voltage change exceeding
Module Evaluation Board: A test fixture used to evaluate Vicor the high limit of the voltage accuracy specification caused by
DC-DC converters. turning the power supply on or off, or abruptly changing line or
MTBF (Mean Time Between Failure): MTBF is the point at which load conditions.
63% of a given population no longer meet specification. It can Overtemp Warning: A TTL compatible signal that indicates an
either be calculated or demonstrated. The usual calculation is per overtemperature condition exists in the power supply.
MIL-STD-217 Rev. E. Demonstrated reliability is usually determined
by temperature accelerated life testing and is usually greater than Overvoltage Protection (OVP): A circuit that either shuts down
calculated MTBF. the power supply or crowbars the output in the event of an output
overvoltage condition.
N
Nominal Input: The center value for the input voltage range.
P
Nominal Value: A usual, average, normal, or expected operating
condition. This stated value will probably not be equal to the value Parallel Boost: VI-/MI-200 Family Booster modules may be added
actually measured. to a Driver to create multi-kilowatt arrays. Boosters do not contain
any feedback or control circuitry.
Parallel Operation: Connecting the outputs of two or more
O power supplies together for the purpose of obtaining a higher
Offline: A power supply that receives its input power from the output current. This requires power supplies specially designed
AC line, without using a 50 / 60Hz power transformer prior to for load sharing.
rectification and filtering, hence the term “offline” power supply. PARD: Periodic And Random Deviation. Referring to the sum of all
Open Frame: A power supply where there is no external metal ripple and noise components on the DC output of a power supply,
chassis; the power supply is provided to the end user essentially as regardless of nature or source.
a printed circuit board that provides mechanical support as well as Peak Power: The absolute maximum output power that a power
supporting the components and making electrical connections. supply can produce without immediate damage. Peak power
Operating Temperature: The range of temperatures in which a capability is typically well beyond the continuous output power
unit can operate within specifications. capability and the resulting average power should not exceed rated
specifications.
Optoisolator: An electro-optical device that transmits a signal
across a DC isolation boundary. Pi Filter: A commonly used filter at the input of a switching
supply or DC-DC converter to reduce reflected ripple current.
ORing Diodes: Diodes used to isolate supplies from one another The filter usually consists of two shunt capacitors with
under a fault condition. inductance between them.

Page 84 of 87 05/2023
Post Regulator: A secondary regulating circuit on an auxiliary Remote On / Off: Enables power supply to be remotely turned on
output of a power supply that provides regulation on that output. or off. Turn-on is typically performed by open circuit or TTL logic
“1”, and turn-off by switch closure or TTL logic “0”.
Power Fail: A power supply interface signal that gives a
warning that the input voltage will no longer sustain full power Remote Sense: Wires connected in parallel with power supply
regulated output. output cables such that the power supply can sense the actual
voltage at the load to compensate for voltage drops in the output
Power Factor: The ratio of true power to apparent power in an cables and/or isolation devices.
AC circuit. In power conversion technology, power factor is used in
conjunction with describing AC input current to the power supply. Return: The designation of the common terminal for the power
supply outputs. It carries the return current for the outputs.
Preload: A small amount of current drawn from a power supply to
stabilize its operation. Reverse-Voltage Protection: A protection circuit that prevents
the power supply from being damaged in the event that a reverse
Primary: The input section of an isolated power supply, it is voltage is applied at the input or output terminals.
connected to the AC mains and hence has dangerous voltage
levels present. RFI: Radio Frequency Interference. Undesirable noise produced by
a power supply or other electrical or electronic device during its
Product Grade: The environmental and acceptance tests operation. In power supply technology, RFI is usually taken to mean
performed on Vicor products. the same thing as EMC.
Pulse Width Modulation (PWM): A switching power Ripple and Noise: The amplitude of the AC component on the DC
conversion technique where the on-time (or width) of a duty output of a power supply usually expressed in millivolts
cycle is modulated to control power transfer for regulating power peak-to-peak or RMS. For a linear power supply it is usually at the
supply outputs. frequency of the AC mains. For a switching power supply, it is
Push-Pull Converter: A switch-mode power supply topology that usually at the switching frequency of the converter stage.
utilizes a center-tapped transformer and two power switches. The
two switches are alternately driven on and off.
S
Safety Ground: A conductive path to earth that is designed
Q to protect persons from electrical shock by shunting
Quasi-Regulated Output: The regulation of an auxiliary away any dangerous currents that might occur due to
output that is accomplished by regulation of the main output. A malfunction or accident.
transformer turns ratio, commensurate with the desired auxiliary Secondary: The output section of an isolated power supply, it is
output voltage, is used in conjunction with the output around isolated from the AC mains and specially designed for safety of
which the main control loop is closed. Quasi-regulated outputs are personnel who might be working with power on the system.
significantly affected by second order effects in the converter.
SELV: An acronym for Safety Extra Low Voltage, a term generally
defined by the regulatory agencies as the highest voltage that
R can be contacted by a person and not cause injury. It is often
specifically defined as 30VAC or 42.4VDC.
Rated Output Current: The maximum load current that a power
supply can provide at a specified ambient temperature. Setpoint Accuracy: Ratio of actual to specified output voltage.
Reflected Ripple Current: The RMS or peak-to-peak AC current Sequencing: The technique of establishing a desired order of
present at the input of the power supply that is a result of the activating the outputs of a multiple output power supply.
switching frequency of the converter. Soft Start: A technique for gradually activating a power supply
Regulation: The ability of a power supply to maintain an output circuit when the power supply is first turned on. This technique
voltage within a specified tolerance as referenced to changing is generally used to provide a gradual rise in output voltages and
conditions of input voltage and / or load. inrush current limiting.
Regulation Band: The total error band allowable for an output Soft Line: A condition where there is substantial impedance
voltage. This includes the effects of all of the types of regulation: present in the AC mains feeding input power to a power supply.
line, load, temperature and time. The input voltage to the power supply drops significantly with
increasing load.
Regulatory Agencies: CSA: Canadian Standards Association; FCC:
Federal Communications Commission; FTZ: Fernmelde Technisches Split-Bobbin Winding: A transformer winding technique where
Zentralamt; TÜV: Technischer Überwachungs Verein; U.L.: the primary and secondary are wound side-by-side on a bobbin
Underwriters Laboratory; VDE: Verband Deutscher Electrotechniker. with an insulation barrier between them.
Remote Inhibit: A power supply interface signal, usually TTL

compatible, that commands the power supply to shut down one
or all outputs.

Page 85 of 87 05/2023
Standby Current: The input current drawn by a power V

supply when shut down by a control input (remote inhibit)
VI Chip® (VIC): VI Chips are the smallest power components
or under no load.
available today – about the size of a 1/16 brick and very power
Stiff Line: A condition where there is no significant impedance dense. They can be used as building blocks to replace existing
present in the AC mains feeding input power to a power circuits (quarter bricks and silver box power supplies). VI Chips offer
supply. The input voltage to the power supply does not change flexible thermal management: a low thermal impedance package
appreciably with load. and the design of the package simplifies heat sink design.
Switching Frequency: The rate at which the DC voltage is Voltage Balance: The difference in magnitudes, in percent, of two
switched on and off in a switching power supply. output voltages that have equal nominal voltage magnitudes but
opposite polarities.
Voltage Mode: A method of closed loop control of a switching
T converter to correct for changes in the output voltage.
Temperature Coefficient: The average output voltage
change expressed as a percent per degree Celsius of ambient
temperature change. This is usually specified for a predetermined W
temperature range.
Warm-Up Drift: The initial change in the output voltage of a
Temperature De-rating: Reducing the output power of a power power supply in the time period between turn-on and when
supply with increasing temperature to maintain reliable operation. the power supply reaches thermal equilibrium at 25°C, full load
and nominal line.
Thermal Pad: A phase change material (ThermMate) used as a
thermal interface between the converter and a heat sink or chassis. Warm-Up Time: The time required after initial turn-on for a power
supply to achieve compliance to its performance specifications.
Thermal Protection: A power supply protection circuit that
shuts the power supply down in the event of unacceptably high
internal temperatures.
X
Topology: The design type of a converter, indicative of the
X-Capacitor: A capacitor connected across the supply lines to
configuration of switching transistors, utilization of the transformer,
suppress normal mode interference.
and type of filtering. Examples of topologies are the Flyback,
Forward, Half Bridge, Full Bridge, Resonant and
Zero-Current Switching.
Y
Tracking: A characteristic in a multiple output power supply where
any changes in the output voltage of one output caused by line, Y-Capacitor: Power conversion modules generally require
load, and/or temperature are proportional to similar changes in bypass capacitors from line to chassis (earth ground) to shunt
accompanying outputs. common‑mode noise currents and keep them local to the
converter. In cases where the converters are operating from
Transient-Recovery Time: The time required for an output rectified AC line voltage, the failure of a bypass capacitor could
voltage to be within specified accuracy limits after a step change in result in excessive leakage current to the equipment chassis thus
line or load conditions. creating a ground fault and shock hazard. For this reason, a
special classification of capacitor, referred to as a Y-capacitor, is
True Power: In an AC circuit, true power is the actual power
recommended. These capacitors contain a dielectric with unique
consumed. It is distinguished from apparent power by eliminating
“self-healing” properties to help prevent against excessive leakage.
the reactive power component that may be present.
To meet general EMC requirements (Section 9), Vicor recommends
U
the use of Y-capacitors with all power conversion modules.
Undershoot: A transient output voltage change which does not Y-capacitors meet IEC384-14, EN132400, and UL1283 standards.
meet the low limit of the voltage accuracy specification and is
caused by turning the power supply on or off, or abruptly changing
line or load conditions. Z
Universal Input: An AC input capable of operating from major AC Zero-Current Switching: The turn-on and turn-off of a switching
lines worldwide, without straps or switches. device at zero current, resulting in essentially lossless switching. The
zero-current-switching topology allows Vicor converters to operate
at frequencies up to 1MHz, with efficiencies higher than 80% and
power densities greater than conventional topologies.
Zero-Voltage Switching: This technique significantly minimizes
the switching losses and dV/dt noise due to the discharge of the
switching MOSFET junction capacitance and reverse recovery
of the diode, and enables switch mode converters to operate at
higher frequencies.

Page 86 of 87 05/2023
Limitation of Warranties
Information in this document is believed to be accurate and reliable. HOWEVER, THIS INFORMATION IS PROVIDED “AS IS” AND WITHOUT
ANY WARRANTIES, EXPRESSED OR IMPLIED, AS TO THE ACCURACY OR COMPLETENESS OF SUCH INFORMATION. VICOR SHALL HAVE
NO LIABILITY FOR THE CONSEQUENCES OF USE OF SUCH INFORMATION. IN NO EVENT SHALL VICOR BE LIABLE FOR ANY INDIRECT,
INCIDENTAL, PUNITIVE, SPECIAL OR CONSEQUENTIAL DAMAGES (INCLUDING, WITHOUT LIMITATION, LOST PROFITS OR SAVINGS,
BUSINESS INTERRUPTION, COSTS RELATED TO THE REMOVAL OR REPLACEMENT OF ANY PRODUCTS OR REWORK CHARGES).
Vicor reserves the right to make changes to information published in this document, at any time and without notice. You should verify that
this document and information is current. This document supersedes and replaces all prior versions of this publication.
All guidance and content herein are for illustrative purposes only. Vicor makes no representation or warranty that the products and/or
services described herein will be suitable for the specified use without further testing or modification. You are responsible for the design
and operation of your applications and products using Vicor products, and Vicor accepts no liability for any assistance with applications or
customer product design. It is your sole responsibility to determine whether the Vicor product is suitable and fit for your applications and
products, and to implement adequate design, testing and operating safeguards for your planned application(s) and use(s).
VICOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED OR WARRANTED FOR USE IN LIFE SUPPORT, LIFE-CRITICAL OR SAFETY-CRITICAL
SYSTEMS OR EQUIPMENT. VICOR PRODUCTS ARE NOT CERTIFIED TO MEET ISO 13485 FOR USE IN MEDICAL EQUIPMENT NOR ISO/TS16949
FOR USE IN AUTOMOTIVE APPLICATIONS OR OTHER SIMILAR MEDICAL AND AUTOMOTIVE STANDARDS. VICOR DISCLAIMS ANY AND ALL
LIABILITY FOR INCLUSION AND/OR USE OF VICOR PRODUCTS IN SUCH EQUIPMENT OR APPLICATIONS AND THEREFORE SUCH INCLUSION
AND/OR USE IS AT YOUR OWN RISK.
Terms of Sale
The purchase and sale of Vicor products is subject to the Vicor Corporation Terms and Conditions of Sale which are available at:
(https://www.vicorpower.com/termsconditionswarranty)
Export Control
This document as well as the item(s) described herein may be subject to export control regulations. Export may require a prior authorization
from U.S. export authorities.
Contact Us: https://www.vicorpower.com/contact-us
Vicor Corporation
25 Frontage Road
Andover, MA, USA 01810
Tel: 800-735-6200
Fax: 978-475-6715
www.vicorpower.com
email
Customer Service: [email protected]
Technical Support: [email protected]
©2018 – 2023 Vicor Corporation. All rights reserved. The Vicor name is a registered trademark of Vicor Corporation.
All other trademarks, product names, logos and brands are property of their respective owners.

Page 87 of 87 05/2023

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Maxi, Mini, Micro Family

Design Guide & Applications Manual

DC-DC Converter and Accessory Modules

Maxi, Mini, Micro Design Guide Rev 5.7

AC-DC Products DC-DC Products

Front-end System Up to 600W per module

Autoranging Autoranging Rectifier Module

DC-DC Products Up to 150W per module

24VDC, 28VDC, Active EMI Filter

Maxi, Mini, Micro Design Guide Rev 5.7

Figure 1.2 — Maxi assembly shows high level of integration

Maxi, Mini, Micro Design Guide Rev 5.7

Primary Control IC Secondary Control IC

Maxi, Mini, Micro Design Guide Rev 5.7

+IN Input Undervoltage

Maxi, Mini, Micro Design Guide Rev 5.7

+IN +OUT Comparator +IN +OUT Comparator

Maxi, Mini, Micro Design Guide Rev 5.7

Figure 2.7 — AC-coupled single-wire interface Figure 2.8 — Transformer-coupled interface

Maxi, Mini, Micro Design Guide Rev 5.7

Figure 2.11 — Parallel module array output connections (Micro)

–OUT +Sense from

Figure 2.10 — ORing diodes connections (Maxi and Mini)

Maxi, Mini, Micro Design Guide Rev 5.7

VSC VOUT Change from Nominal

Circuits such as op-amps and D/A converters, which directly drive

Maxi, Mini, Micro Design Guide Rev 5.7

–OUT –IN –OUT

1,000 VOUT 1,000VOUT

1,000 (VOUT – 1.23) VNOM 1,000 (VOUT – 1.23) VNOM

36.5kΩ 1.65kΩ 470pF

Maxi, Mini, Micro Design Guide Rev 5.7

Description Part Number

Figure 2.16 — Online trim calculator

Maxi, Mini, Micro Design Guide Rev 5.7

Maxi (A) 375 2 160 Bussmann PC-Tron 5A

Mini (B) 375 2 100 Bussmann PC-Tron 5A

Micro (C) 375 2 50 Bussmann PC-Tron 3A

Maxi (A) 300 2 160 Bussmann PC-Tron 5A

Mini (B) 300 2 100 Bussmann PC-Tron 5A

Micro (C) 300 2 50 Bussmann PC-Tron 3A

Maxi (A) 150 3.3 264 / 200 Bussmann ABC-8

Mini (B) 150 3.3 150 / 100 Bussmann PC-Tron 5A

Micro (C) 150 3.3 75 Bussmann PC-Tron 3A

Maxi (A) 110 3.3 200 / 150 Bussmann ABC-8

Mini (B) 110 3.3 100 / 75 Bussmann PC-Tron 5A

Micro (C) 110 3.3 50 Bussmann PC-Tron 3A

Maxi, Mini, Micro Design Guide Rev 5.7

Maxi (A) 72 3.3 264 Bussmann ABC-12

Mini (B) 72 3.3 100 Bussmann ABC-8

Micro (C) 72 3.3 75 Bussmann PC-Tron 5A

Maxi (A) 48 3.3 264 Bussmann ABC-10

Mini (B) 48 2 100 Bussmann ABC-8

Micro (C) 48 2 50 Bussmann PC-Tron 5A

Maxi (A) 28 3.3 150 Bussmann ABC-25

Mini (B) 28 3.3 75 Bussmann ABC-15

Micro (C) 28 3.3 50 Bussmann ABC- 8

Maxi (A) 24 3.3 264 / 200 Bussmann ABC-25

Mini (B) 24 3.3 150 / 100 Bussmann ABC-15

Micro (C) 24 3.3 75 / 50 Bussmann ABC-8