Esp8684-Wroom-04c Datasheet en

ESP8684-WROOM-04C
Datasheet
2.4 GHz Wi-Fi (802.11 b/g/n) and Bluetooth® 5 module

Built around ESP8684 series of SoC, RISC-V single-core microprocessor
2 MB/4 MB flash in chip package
14 GPIOs
On-board PCB antenna
ESP8684-WROOM-04C
Version1.1
Espressif Systems
Copyright © 2023
www.espressif.com
1 Module Overview
1 Module Overview
1.1 Features
CPU and On-Chip Memory • High power mode (20 dBm)
• ESP8684H2 or ESP8684H4 embedded, 32-bit • Speed: 125 kbps, 500 kbps, 1 Mbps, 2 Mbps
RISC-V single-core processor, up to 120 MHz • Advertising extensions
• 576 KB ROM • Multiple advertisement sets
• 272 KB SRAM (16 KB for cache) • Channel selection algorithm #2
• In-Package flash (see details in Table 1 • Internal co-existence mechanism between Wi-Fi
ESP8684-WROOM-04C Series Comparison) and Bluetooth to share the same antenna
• Access to flash accelerated by cache
Peripherals
• Supports flash in-Circuit Programming (ICP)
• GPIO, SPI, UART, I2C, LED PWM controller,
Wi-Fi general DMA controller, temperature sensor, SAR
ADC, timers and watchdog
• 802.11 b/g/n
• Center frequency range of operating channel: Note:

2412 ~ 2484 MHz * Please refer to ESP8684 Series Datasheet for de-
tailed information about the module peripherals.
• Supports 20 MHz bandwidth in 2.4 GHz band
• 1T1R mode with data rate up to 72.2 Mbps

Integrated Components on Module
• Wi-Fi Multimedia (WMM)
• 26 MHz crystal oscillator
• TX/RX A-MPDU, TX/RX A-MSDU
• Immediate Block ACK Antenna Options

• Fragmentation and defragmentation
• On-board PCB antenna
• Transmit opportunity (TXOP)
Operating Conditions
• Automatic Beacon monitoring (hardware TSF)
• 3 × virtual Wi-Fi interfaces • Operating voltage/Power supply: 3.0 ~ 3.6 V
• Simultaneous support for Infrastructure BSS in • Operating ambient temperature: –40 ~ 105 °C
Station mode, SoftAP mode, Station + SoftAP
mode, and promiscuous mode Certification
Note that when ESP8684 series scans in Station
• Bluetooth certification: BQB
mode, the SoftAP channel will change along with
the Station channel • Green certification: RoHS/REACH
Bluetooth® Test
• Bluetooth LE: Bluetooth 5 • HTOL/HTSL/uHAST/TCT/ESD/Latch-up
Espressif Systems 2 ESP8684-WROOM-04C Datasheet v1.1

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1 Module Overview
1.2 Description
ESP8684-WROOM-04C is a general-purpose Wi-Fi and Bluetooth LE module. The rich set of peripherals and
high performance make this module an ideal choice for smart homes, industrial automation, health care,
consumer electronics, etc.
ESP8684-WROOM-04C comes with a PCB antenna.
The series comparison for ESP8684-WROOM-04C is as follows:
Table 1: ESP8684-WROOM-04C Series Comparison
Ambient Temp.1 Size2

Ordering Code In-Package Flash
(°C) (mm)
ESP8684-WROOM-04C-H2 2 MB
–40 ~105 24.0 × 16.0 × 3.1
ESP8684-WROOM-04C-H4 4 MB
1
Ambient temperature specifies the recommended temperature range of the environment
immediately outside the Espressif module.
2
For details, refer to Section 8.1 Physical Dimensions.
The ESP8684H2 chip and the ESP8684H4 chip fall into the same category, namely ESP8684 chip series, which
has a 32-bit RISC-V single-core processor.
ESP8684 integrates a rich set of peripherals including UART, I2C, LED PWM controller, general DMA controller,
temperature sensor, and SAR ADC etc.
Note:
For more information on ESP8684, please refer to ESP8684 Series Datasheet.
1.3 Applications
• Smart Home • Health Care
– Light control – Health monitor
– Smart button – Baby monitor
– Smart plug • Smart Agriculture
– Indoor positioning – Smart greenhouse
• Industrial Automation – Smart irrigation
– Industrial robot – Agriculture robot
– Industrial field bus • Retail and Catering
• Consumer Electronics – POS machines
– Smart watch and bracelet – Service robot
– Over-the-top (OTT) devices • Generic Low-power IoT Sensor Hubs
– Logger toys and proximity sensing toys • Generic Low-power IoT Data Loggers

Contents
Contents
1 Module Overview 2
1.1 Features 2
1.2 Description 3
1.3 Applications 3
2 Block Diagram 8
3 Pin Definitions 9
3.1 Pin Layout 9
3.2 Pin Description 9
3.3 Strapping Pins 10
4 Electrical Characteristics 13
4.1 Absolute Maximum Ratings 13
4.2 Recommended Operating Conditions 13
4.3 DC Characteristics (3.3 V, 25 °C) 13
4.4 Current Consumption Characteristics 14
4.4.1 Current Consumption in Active Mode 14
5 RF Characteristics 15
5.1 Wi-Fi Radio (2.4 GHz) 15
5.1.1 Wi-Fi RF Transmitter (TX) Characteristics 15
5.1.2 Wi-Fi RF Receiver (RX) Characteristics 16
5.2 Bluetooth 5 (LE) Radio 17
5.2.1 Bluetooth LE RF Transmitter (TX) Characteristics 17
5.2.2 Bluetooth LE RF Receiver (RX) Characteristics 18
6 Module Schematics 21
7 Peripheral Schematics 22
8 Physical Dimensions and PCB Land Pattern 23

8.1 Physical Dimensions 23
8.2 Recommended PCB Land Pattern 24
9 Product Handling 25
9.1 Storage Conditions 25
9.2 Electrostatic Discharge (ESD) 25
9.3 Soldering Profile 25
9.3.1 Reflow Profile 25
9.4 Ultrasonic Vibration 26
10 Related Documentation and Resources 27

Contents
Revision History 28

List of Tables
List of Tables
1 ESP8684-WROOM-04C Series Comparison 3
2 Pin Definitions 10
3 Strapping Pins 11
4 Parameter Descriptions of Setup and Hold Times for the Strapping Pins 12
5 Absolute Maximum Ratings 13
6 Recommended Operating Conditions 13
7 DC Characteristics (3.3 V, 25 °C) 13
8 Current Consumption for Wi-Fi (2.4 GHz) in Active Mode 14
9 Current Consumption in Modem-sleep Mode 14
10 Current Consumption in Low-Power Modes 14
11 Wi-Fi RF Characteristics 15
12 TX Power with Spectral Mask and EVM Meeting 802.11 Standards 15
13 TX EVM Test 15
14 RX Sensitivity 16
15 Maximum RX Level 16
16 RX Adjacent Channel Rejection 17
17 Bluetooth LE RF Characteristics 17
18 Bluetooth LE - Transmitter Characteristics - 1 Mbps 17
19 Bluetooth LE - Transmitter Characteristics - 2 Mbps 17
20 Bluetooth LE - Transmitter Characteristics - 125 Kbps 18
21 Bluetooth LE - Transmitter Characteristics - 500 Kbps 18
22 Bluetooth LE - Receiver Characteristics - 1 Mbps 18
23 Bluetooth LE - Receiver Characteristics - 2 Mbps 19
24 Bluetooth LE - Receiver Characteristics - 125 Kbps 20
25 Bluetooth LE - Receiver Characteristics - 500 Kbps 20

List of Figures
List of Figures
1 ESP8684-WROOM-04C Block Diagram 8
2 Pin Layout (Top View) 9
3 Setup and Hold Times for the Strapping Pins 12
4 ESP8684-WROOM-04C Schematics 21
5 Peripheral Schematics 22
6 Physical Dimensions 23
7 Recommended PCB Land Pattern 24
8 Reflow Profile 25

2 Block Diagram
2 Block Diagram
ESP8684-WROOM-04C
26 MHz
3V3 Crystal Antenna
RF Matching
ESP8684
EN GPIOs
SPI Flash
Figure 1: ESP8684-WROOM-04C Block Diagram

3 Pin Definitions
3 Pin Definitions
3.1 Pin Layout

The pin diagram below shows the approximate location of pins on the module. For the actual diagram drawn to
scale, please refer to Figure 8.1 Physical Dimensions.
Keepout Zone
IO0 1 22 TXD0
IO1 2 21 RXD0
GND
EN 3 23 20 IO3
GND
IO2 4 19 IO10
IO4 5 18 IO9
IO5 6 17 IO8
IO6 7 16 IO7
10
11
12
13
14
3V3 8 15 GND
9
IO18
NC
NC
NC
NC
NC
Figure 2: Pin Layout (Top View)
3.2 Pin Description

The module has 17 pins. See pin definitions in Table 2 Pin Definitions.
For peripheral pin configurations, please refer to ESP8684 Series Datasheet.

3 Pin Definitions
Table 2: Pin Definitions
Name No. Type1 Function

IO0 1 I/O/T GPIO0�ADC1_CH0
IO1 2 I/O/T GPIO1, ADC1_CH1
High: on, enables the chip.
EN 3 I Low: off, the chip powers off.
Default: internally pulled-up
IO2 4 I/O/T GPIO2, ADC1_CH2, FSPIQ
IO4 5 I/O/T GPIO4, ADC1_CH4, FSPIHD, MTMS, LED PWM
IO5 6 I/O/T GPIO5, FSPIWP, MTDI, LED PWM
IO6 7 I/O/T GPIO6, FSPICLK, MTCK, LED PWM
3V3 8 P Power supply
NC 9-11, 13-14 — NC
IO18 12 I/O/T GPIO18
GND 15, 23 P Ground
IO7 16 I/O/T GPIO7, FSPID, MTDO, LED PWM
IO8 17 I/O/T GPIO8
IO9 18 I/O/T GPIO9
IO10 19 I/O/T GPIO10, FSPICS0, LED PWM
IO3 20 I/O/T GPIO3, ADC1_CH3, LED PWM
RXD0 21 I/O/T GPIO19, U0RXD
TXD0 22 I/O/T GPIO20, U0TXD
1
P: power supply; I: input; O: output; T: high impedance.
Note:
IO0, IO1, IO3, IO5/MTDI pins have low-level glitches during chip power up. See details in section General Purpose Input
/ Output Interface (GPIO) of ESP8684 Series Datasheet.
3.3 Strapping Pins

Note:
The content below is excerpted from Section Strapping Pins in ESP8684 Series Datasheet. For the strapping pin mapping
between the chip and modules, please refer to Chapter 6 Module Schematics.

3 Pin Definitions
ESP8684 series has two strapping pins:
• GPIO8
• GPIO9
Software can read the values of GPIO8 and GPIO9 from GPIO_STRAPPING field in GPIO_STRAP_REG register.
For register description, please refer to Section GPIO Matrix Register Summary in
ESP8684 Technical Reference Manual.
During the chip’s power-on reset, RTC watchdog reset, and brownout reset, the latches of the strapping pins
sample the voltage level as strapping bits of ”0” or ”1”, and hold these bits until the chip is powered down or shut
down.
By default, GPIO9 is connected to the internal weak pull-up resistor. If GPIO9 is not connected or connected to
an external high-impedance circuit, the latched bit value will be ”1”.
To change the strapping bit values, you can apply the external pull-down/pull-up resistances, or use the host
MCU’s GPIOs to control the voltage level of these pins when powering on ESP8684.
After reset, the strapping pins work as normal-function pins.
Table 3 lists detailed booting configurations of the strapping pins.
Table 3: Strapping Pins
Booting Mode 1
Pin Default SPI Boot Download Boot
GPIO8 N/A Don’t care 1
Internal weak
GPIO9 1 0
pull-up
Enabling/Disabling ROM Messages Print During Booting
Pin Default Functionality
When the value of eFuse field EFUSE_UART_PRINT_CONTROL is
0 (default), print is enabled and not controlled by GPIO8.
GPIO8 N/A 1, if GPIO8 is 0, print is enabled; if GPIO8 is 1, it is disabled.
2, if GPIO8 is 0, print is disabled; if GPIO8 is 1, it is enabled.
3, print is disabled and not controlled by GPIO8.
1
The strapping combination of GPIO8 = 0 and GPIO9 = 0 is invalid and will trigger unexpected be-
havior.
Figure 3 shows the setup and hold times for the strapping pins before and after the CHIP_EN signal goes high.
Details about the parameters are listed in Table 4.

3 Pin Definitions
t0 t1
VIL_nRST
CHIP_EN
VIH
Strapping pin
Figure 3: Setup and Hold Times for the Strapping Pins
Table 4: Parameter Descriptions of Setup and Hold Times for the Strapping Pins
Min
Parameter Description (ms)
t0 Setup time before CHIP_EN goes from low to high 0
t1 Hold time after CHIP_EN goes high 3

4 Electrical Characteristics
4.1 Absolute Maximum Ratings

Stresses above those listed in Table 5 Absolute Maximum Ratings may cause permanent damage to the device.
These are stress ratings only and functional operation of the device at these or any other conditions beyond
those indicated under Table 6 Recommended Operating Conditions is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability.
Table 5: Absolute Maximum Ratings
Symbol Parameter Min Max Unit

VDD33 Power supply voltage –0.3 3.6 V
TST ORE Storage temperature –40 105 °C
4.2 Recommended Operating Conditions
Table 6: Recommended Operating Conditions
Symbol Parameter Min Typ Max Unit

VDD33 Power supply voltage 3.0 3.3 3.6 V
IV DD Current delivered by external power supply 0.5 — — A
TA Operating ambient temperature –40 — 105 °C
4.3 DC Characteristics (3.3 V, 25 °C)
Table 7: DC Characteristics (3.3 V, 25 °C)
Symbol Parameter Min Typ Max Unit

CIN Pin capacitance — 2 — pF
1 1
VIH High-level input voltage 0.75 × VDD — VDD + 0.3 V
1
VIL Low-level input voltage –0.3 — 0.25 × VDD V
IIH High-level input current — — 50 nA
IIL Low-level input current — — 50 nA
2 1
VOH High-level output voltage 0.8 × VDD — — V
2 1
VOL Low-level output voltage — — 0.1 × VDD V
1
High-level source current (VDD = 3.3 V,
IOH — 40 — mA
VOH >= 2.64 V, PAD_DRIVER = 3)
Low-level sink current (VDD1= 3.3 V, VOL =
IOL — 28 — mA
0.495 V, PAD_DRIVER = 3)
RP U Pull-up resistor — 45 — kΩ
RP D Pull-down resistor — 45 — kΩ
1 1
VIH_nRST Chip reset release voltage 0.75 × VDD — VDD + 0.3 V
1
VIL_nRST Chip reset voltage –0.3 — 0.25 × VDD V

1
VDD is the I/O voltage for a particular power domain of pins.
2
VOH and VOL are measured using high-impedance load.
4.4 Current Consumption Characteristics

4.4.1 Current Consumption in Active Mode
The current consumption measurements are taken with a 3.3 V supply at 25 °C ambient temperature.
TX current consumption is rated at a 100% duty cycle.
RX current consumption is rated when the peripherals are disabled and the CPU idle.
Table 8: Current Consumption for Wi-Fi (2.4 GHz) in Active Mode
Work Mode RF Condition Description Peak (mA)

802.11b, 1 Mbps, DSSS @21.0 dBm 364
TX 802.11g, 54 Mbps, OFDM @19.0 dBm 305
Active (RF working)
802.11n, HT20, MCS7 @18.0 dBm 287
RX 802.11b/g/n, HT20 63
Note:
The content below is excerpted from Section Power Consumption in Other Modes in ESP8684 Series Datasheet.
Table 9: Current Consumption in Modem-sleep Mode
Frequency Typ1 Typ2

Work mode (MHz) Description (mA) (mA)
WFI (Wait-for-Interrupt) 9.4 10.3
80
CPU run at full speed 12.1 13.0
Modem-sleep3
WFI (Wait-for-Interrupt) 10.7 11.5
120
CPU run at full speed 14.7 15.6
1
Current consumption when all peripheral clocks are disabled.
2
Current consumption when all peripheral clocks are enabled. In practice, the current consumption
might be different depending on which peripherals are enabled.
3
In Modem-sleep mode, Wi-Fi is clock gated, and the current consumption might be higher when
accessing flash. For a flash rated at 80 Mbit/s, in SPI 2-line mode the consumption is 10 mA.
Table 10: Current Consumption in Low-Power Modes
Work mode Description Typ Unit

Light-sleep — 140 µA
Deep-sleep Only RTC timer is powered on 5 µA
Power off CHIP_EN is set to low level, and the chip is powered off 1 µA

5 RF Characteristics
This section contains tables with RF characteristics of the Espressif product.
The RF data is measured at the antenna port, where RF cable is connected, including the front-end loss.
Devices should operate in the center frequency range allocated by regional regulatory authorities. The target
center frequency range and the target transmit power are configurable by software. See ESP RF Test Tool and
Test Guide for instructions.
Unless otherwise stated, the RF tests are conducted with a 3.3 V (±5%) supply at 25 ºC ambient temperature.
5.1 Wi-Fi Radio (2.4 GHz)
Table 11: Wi-Fi RF Characteristics
Name Description
Center frequency range of operating channel 2412 ~ 2484 MHz
Wi-Fi wireless standard IEEE 802.11b/g/n
5.1.1 Wi-Fi RF Transmitter (TX) Characteristics
Table 12: TX Power with Spectral Mask and EVM Meeting 802.11 Standards
Min Typ Max

Rate (dBm) (dBm) (dBm)
802.11b, 1 Mbps, DSSS — 21.0 —
802.11b, 11 Mbps, CCK — 21.0 —
802.11g, 6 Mbps, OFDM — 21.0 —
802.11g, 54 Mbps, OFDM — 19.0 —
802.11n, HT20, MCS0 — 19.0 —
802.11n, HT20, MCS7 — 18.0 —
Table 13: TX EVM Test1
Min Typ Limit

Rate (dB) (dB) (dB)
802.11b, 1 Mbps, DSSS — –25.0 –10.0
802.11b, 11 Mbps, CCK — –25.0 –10.0
802.11g, 6 Mbps, OFDM — –25.0 –5.0
802.11g, 54 Mbps, OFDM — –30.0 –25.0
802.11n, HT20, MCS0 — –29.0 –5.0
802.11n, HT20, MCS7 — –31.0 –27.0
1
EVM is measured at the corresponding typical TX power provided
in Table 12 TX Power with Spectral Mask and EVM Meeting 802.11
Standards above.

5.1.2 Wi-Fi RF Receiver (RX) Characteristics

For RX tests, the PER (packet error rate) limit is 8% for 802.11b, and 10% for 802.11g/n.
Table 14: RX Sensitivity
Min Typ Max

802.11b, 1 Mbps, DSSS — –99.2 —
802.11b, 2 Mbps, DSSS — –96.4 —
802.11b, 5.5 Mbps, CCK — –93.2 —
802.11b, 11 Mbps, CCK — –89.4 —
802.11g, 6 Mbps, OFDM — –94.0 —
802.11g, 9 Mbps, OFDM — –92.0 —
802.11g, 12 Mbps, OFDM — –91.4 —
802.11g, 18 Mbps, OFDM — –89.0 —
802.11g, 24 Mbps, OFDM — –86.2 —
802.11g, 36 Mbps, OFDM — –82.2 —
802.11g, 48 Mbps, OFDM — –78.0 —
802.11g, 54 Mbps, OFDM — –76.4 —
802.11n, HT20, MCS0 — –93.4 —
802.11n, HT20, MCS1 — –91.2 —
802.11n, HT20, MCS2 — –88.2 —
802.11n, HT20, MCS3 — –84.6 —
802.11n, HT20, MCS4 — –81.0 —
802.11n, HT20, MCS5 — –77.4 —
802.11n, HT20, MCS6 — –75.4 —
802.11n, HT20, MCS7 — –74.0 —
Table 15: Maximum RX Level
Min Typ Max

802.11b, 1 Mbps, DSSS — 5 —
802.11b, 11 Mbps, CCK — 5 —
802.11g, 6 Mbps, OFDM — 5 —
802.11g, 54 Mbps, OFDM — 0 —
802.11n, HT20, MCS0 — 5 —
802.11n, HT20, MCS7 — –1 —

Table 16: RX Adjacent Channel Rejection
Min Typ Max

Rate (dB) (dB) (dB)
802.11b, 1 Mbps, DSSS — 35 —
802.11b, 11 Mbps, CCK — 35 —
802.11g, 6 Mbps, OFDM — 31 —
802.11g, 54 Mbps, OFDM — 20 —
802.11n, HT20, MCS0 — 31 —
802.11n, HT20, MCS7 — 16 —
5.2 Bluetooth 5 (LE) Radio
Table 17: Bluetooth LE RF Characteristics
Name Description
Center frequency range of operating channel 2402 ~ 2480 MHz
RF transmit power range –24.0 ~ 20.0 dBm
5.2.1 Bluetooth LE RF Transmitter (TX) Characteristics
Table 18: Bluetooth LE - Transmitter Characteristics - 1 Mbps
Parameter Description Min Typ Max Unit

Max. |fn |n=0, 1, 2, 3, ...k — 1.4 — kHz
Max. |f0 − fn |n=2, 3, 4, ...k — 1.7 — kHz
Carrier frequency offset and drift
Max. |fn − fn−5 |n=6, 7, 8, ...k — 0.9 — kHz
|f1 − f0 | — 1.0 — kHz
∆ F 1avg — 250.2 — kHz
Modulation characteristics Min. ∆ F 2max (for at least
— 238.2 — kHz
99.9% of all ∆ F 2max )
∆ F 2avg /∆ F 1avg — 1.00 — —
± 2 MHz offset — –32 — dBm
In-band emissions ± 3 MHz offset — –38 — dBm
> ± 3 MHz offset — –41 — dBm
Table 19: Bluetooth LE - Transmitter Characteristics - 2 Mbps

Max. |fn |n=0, 1, 2, 3, ...k — 4.0 — kHz
Max. |f0 − fn |n=2, 3, 4, ...k — 1.6 — kHz
Max. |fn − fn−5 |n=6, 7, 8, ...k — 1.0 — kHz
|f1 − f0 | — 0.7 — kHz
Cont’d on next page

Table 19 – cont’d from previous page

∆ F 1avg — 497.4 — kHz
Modulation characteristics Min. ∆ F 2max (for at least
— 477.5 — kHz
99.9% of all ∆ F 2max )
∆ F 2avg /∆ F 1avg — 1.00 — —
Table 20: Bluetooth LE - Transmitter Characteristics - 125 Kbps

Max. |fn |n=0, 1, 2, 3, ...k — 0.5 — kHz
Max. |f0 − fn |n=1, 2, 3, ...k — 0.4 — kHz
|f0 − f3 | — 0.2 — kHz
Max. |fn − fn−3 |n=7, 8, 9, ...k — 0.6 — kHz
∆ F 1avg — 249.8 — kHz
Modulation characteristics
Min. ∆ F 1max (for at least
— 238.9 — kHz
99.9% of all ∆ F 1max )
Table 21: Bluetooth LE - Transmitter Characteristics - 500 Kbps

Max. |fn |n=0, 1, 2, 3, ...k — 0.5 — kHz
Max. |f0 − fn |n=1, 2, 3, ...k — 0.5 — kHz
|f0 − f3 | — 0.2 — kHz
Max. |fn − fn−3 |n=7, 8, 9, ...k — 0.6 — kHz
∆ F 2avg — 250.9 — kHz
Modulation characteristics
Min. ∆ F 2max (for at least
— 236.8 — kHz
99.9% of all ∆ F 2max )
5.2.2 Bluetooth LE RF Receiver (RX) Characteristics
Table 22: Bluetooth LE - Receiver Characteristics - 1 Mbps

Sensitivity @30.8% PER — — –98.0 — dBm
Cont’d on next page

Table 22 – cont’d from previous page

Maximum received signal @30.8% PER — — 8 — dBm
Co-channel F = F0 MHz — 8 — dB
F = F0 + 1 MHz — –1 — dB
F = F0 – 1 MHz — –3 — dB
F = F0 + 2 MHz — –26 — dB
F = F0 – 2 MHz — –28 — dB
Adjacent channel
C/I and receiver F = F0 + 3 MHz — –34 — dB
selectivity performance F = F0 – 3 MHz — –33 — dB
F ≥ F0 + 4 MHz — –33 — dB
F ≤ F0 – 4 MHz — –31 — dB
Image frequency — — –33 — dB
Adjacent channel to F = Fimage + 1 MHz — –32 — dB
image frequency F = Fimage – 1 MHz — –34 — dB
30 MHz ~ 2000 MHz — –23 — dBm
Out-of-band blocking performance 2003 MHz ~ 2399 MHz — –30 — dBm
2484 MHz ~ 2997 MHz — –10 — dBm
3000 MHz ~ 12.75 GHz — –17 — dBm
Intermodulation — — –31 — dBm
Table 23: Bluetooth LE - Receiver Characteristics - 2 Mbps

F = F0 + 2 MHz — –11 — dB
F = F0 – 2 MHz — –7 — dB
F = F0 + 4 MHz — –35 — dB
F = F0 – 4 MHz — –30 — dB
Adjacent channel
F ≥ F0 + 8 MHz — –39 — dB
F ≤ F0 – 8 MHz — –33 — dB
30 MHz ~ 2000 MHz — –30 — dBm
Out-of-band blocking performance 2003 MHz ~ 2399 MHz — –34 — dBm
2484 MHz ~ 2997 MHz — –19 — dBm
3000 MHz ~ 12.75 GHz — –28 — dBm
Intermodulation — — –33 — dBm

Table 24: Bluetooth LE - Receiver Characteristics - 125 Kbps

F = F0 + 1 MHz — –7 — dB
F = F0 – 1 MHz — –5 — dB
F = F0 + 2 MHz — –35 — dB
F = F0 – 2 MHz — –34 — dB
Adjacent channel
F ≥ F0 + 4 MHz — –41 — dB
F ≤ F0 – 4 MHz — –45 — dB
Table 25: Bluetooth LE - Receiver Characteristics - 500 Kbps

F = F0 + 1 MHz — –6 — dB
F = F0 – 1 MHz — –5 — dB
F = F0 + 2 MHz — –29 — dB
F = F0 – 2 MHz — –32 — dB
Adjacent channel
F ≥ F0 + 4 MHz — –34 — dB
F ≤ F0 – 4 MHz — –33 — dB

Espressif Systems
6 Module Schematics
6 Module Schematics
This is the reference design of the module.
5 4 3 2 1
GND
GND GND
3
U1
GND
GND XOUT
The values of C1 and C2 vary with C1 C2
D the selection of the crystal. TBD TBD D
XIN
The value of R1 varies with the
actual PCB board. R1 could be a
2
resistor or inductor, the initial
value is suggested to be 24 nH. PCB ANTENNA
VDD33 GND
26MHz(±10ppm)
C3 C4
TBD
1uF 10nF
VDD33
GND GND R2 499 U0TXD
L1 2.0nH(0.1nH) U0RXD Pin.1 GPIO0 U0TXD Pin.22
R1
GND
C5 C6 C7 GND IO0 TXD0
25
24
23
22
21
20
19
C
10uF(NC) 0.1uF 1.5pF
Pin.2 GPIO1 U0RXD Pin.21 C
C10
IO1 RXD0
VDDA
VDDA
GND
U0TXD
U0RXD
XTAL_P
XTAL_N
GND GND GND VDD33
21
0.1uF
ANT1 50 ohm Impedance Control Pin.3 CHIP_EN GPIO3 Pin.20
RF_ANT C11 LNA_IN
1 TBD L2 TBD 1
ANT GPIO18
18 GPIO18
EN IO3
2 2
3 VDDA3P3 VDD3P3_CPU
17
16 GPIO10
EPAD
L3 C8 C9
Pin.4 Pin.19
PCB_ANT GPIO0 4 VDDA3P3 GPIO10 15 GPIO9 GPIO2 GPIO10
GPIO0 GPIO9
IO2 IO10
TBD TBD TBD GPIO1 5 14 GPIO8
GPIO1 GPIO8
VDD3P3_RTC
GPIO2 6 13 GPIO7
GPIO2 MTDO
Pin.5 Pin.18
CHIP_EN
GPIO4 GPIO9
GPIO3
IO4 IO9
MTMS
GND GND GND GND R3 R9

MTCK
MTDI
The values of L3, C11, C8, L2 and C9 10K(NC) 10K(NC)

vary with the actual PCB board. U2 ESP8684
VDD33
Pin.6 GPIO5 GPIO8 Pin.17
7
8
9
10
11
12
VDD33 IO5 IO8

NC: No component. CHIP_EN
VDD33 GPIO3 Pin.7 GPIO6 GPIO7 Pin.16
B GPIO4 C12
IO6 IO7 B
ESP8684-WROOM-04C Datasheet v1.1
GPIO18
GPIO5 VDD33 GND
GPIO6 0.1uF VDD33
R11 Pin.8 Pin.15
10K GND 3V3 GND
CHIP_EN
Pin.10
Pin.11
Pin.12
Pin.13
Pin.14
C13 D1
Pin.9
C14
IO18
10uF ESD
NC
NC
NC
NC
NC
1uF
GND GND GND ESP8684-WROOM-04C(pin-out)
Figure 4: ESP8684-WROOM-04C Schematics

A A
Title
ESP8684-WROOM-04
Size Page Name Rev

A4 <02_ESP8684-WROOM-04> V1.1 Confidential and Proprietary
Date: Monday, June 26, 2023 Sheet 2 of 2
5 4 3 2 1
7 Peripheral Schematics
7 Peripheral Schematics
5 4 3
This is the typical application circuit of the module connected with peripheral components (for example, power
supply, antenna, reset button, JTAG interface, and UART interface).
GND VDD33
U1 ESP8684-WROOM-04C JP4
23 1
EN on the module is pulled up IO0 1 EPAD 22 TXD0 2 1
to VDD33 through a 10 K IO1 2 IO0 TXD0 21 RXD0 3 2
D resistor, and connected to EN 3 IO1 RXD0 20 IO3 4 3
GND through a 1uF capacitor. IO2 4 EN IO3 19 IO10 4
IO4 5 IO2 IO10 18 IO9 UART
VDD33 IO5 6 IO4 IO9 17 IO8 GND
IO6 7 IO5 IO8 16 IO7 JP2
3V3 8 IO6 IO7 15 1
3V3 GND R8 1
IO18
2
NC
NC
NC
NC
NC
C1 C2 10K 2
9 VDD33 Boot Option
10
11
12
13
14
10uF 0.1uF GND
IO18
GND GND
JP1 SW1
IO4 TMS 1 R2 0 EN
IO5 TDI 2 1
IO6 TCK 3 2 C4 0.1uF
IO7 TDO 4 3
4
JTAG GND
C
Figure 5: Peripheral Schematics
• Soldering the EPAD to the ground of the base board is not a must, however, it can optimize thermal
performance. If you choose to solder it, please apply the correct amount of soldering paste. Too much
soldering paste may increase the gap between the module and the baseboard. As a result, the adhesion
between other pins and the baseboard may be poor.
• To ensure that the power supply to the ESP8684 chip is stable during power-up, it is advised to add an RC
delay circuit at the EN pin. The recommended setting for the RC delay circuit is usually R = 10 kΩ and C =
1 µF (such RC delay circuit has already been built into the module). However, specific parameters should
be adjusted based on the power-up timing of the module and the power-up and reset sequence timing of
the chip. For ESP8684’s power-up and reset sequence timing diagram, please refer to Section Power
B Scheme in ESP8684 Series Datasheet.

8 Physical Dimensions and PCB Land Pattern
8.1 Physical Dimensions
Unit: mm
16±0.2 3.1±0.15
0.8
6
16 x 0.55 16 x 1.2
Ø0 2.8
.5
2
16 x 1.1
6 x 0.9
6 x 0.45
16 x 1.1
6.8
24±0.2
15.15
1.5
0.55
22 x Ø0.6
14
2.8
1.6
11.865
0.93
10.14
12.15
2
6 x 0.9 1.93 6 x 0.9 3
10
Top View Side View Bottom View
Figure 6: Physical Dimensions
Note:
For information about tape, reel, and product marking, please refer to Espressif Module Packaging Information.

8.2 Recommended PCB Land Pattern

This section provides the following resources for your reference:
• Figure for the recommended PCB land pattern with all the dimensions needed for PCB design. See Figure
7 Recommended PCB Land Pattern.
• Source file of the recommended PCB land pattern to measure dimensions not covered in Figure 7. You can
view the source files for ESP8684-WROOM-04C with Autodesk Viewer.
Unit: mm
Via for thermal pad
Copper
16
8.5
Antenna Area
6
16 x 1.7
2.8
1 6.8 22
24
0.5 16 x 1.1
2.8
2
11.865
10.14
6 x 1.4
0.55
1.6
0.5
1.5
1.5
2
9 14
15.3
6 x 0.9 0.5
0.5 3
Figure 7: Recommended PCB Land Pattern

9 Product Handling
9 Product Handling
9.1 Storage Conditions

The products sealed in moisture barrier bags (MBB) should be stored in a non-condensing atmospheric
environment of < 40 °C and 90%RH. The module is rated at the moisture sensitivity level (MSL) of 3.
After unpacking, the module must be soldered within 168 hours with the factory conditions 25±5 °C and
60%RH. If the above conditions are not met, the module needs to be baked.
9.2 Electrostatic Discharge (ESD)

• Human body model (HBM): ±2000 V
• Charged-device model (CDM): ±500 V
9.3 Soldering Profile

9.3.1 Reflow Profile
Solder the module in a single reflow.
Temperature (℃)
Peak Temp.
235 ~ 250 ℃
250
Preheating zone Reflow zone Cooling zone
150 ~ 200 ℃ 60 ~ 120 s 217 ℃ 60 ~ 90 s –1 ~ –5 ℃/s
217
200
Soldering time
> 30 s
Ramp-up zone
1 ~ 3 ℃/s
100
50
25
Time (sec.)
0
0 50 100 150 200 250
Ramp-up zone — Temp.: 25 ~ 150 ℃ Time: 60 ~ 90 s Ramp-up rate: 1 ~ 3 ℃/s

Preheating zone — Temp.: 150 ~ 200 ℃ Time: 60 ~ 120 s
Reflow zone — Temp.: >217 ℃ 60 ~ 90 s; Peak Temp.: 235 ~ 250 ℃ Time: 30 ~ 70 s
Cooling zone — Peak Temp. ~ 180 ℃ Ramp-down rate: –1 ~ –5 ℃/s
Solder — Sn-Ag-Cu (SAC305) lead-free solder alloy
Figure 8: Reflow Profile

9 Product Handling
9.4 Ultrasonic Vibration

Avoid exposing Espressif modules to vibration from ultrasonic equipment, such as ultrasonic welders or
ultrasonic cleaners. This vibration may induce resonance in the in-module crystal and lead to its malfunction or
even failure. As a consequence, the module may stop working or its performance may deteriorate.

10 Related Documentation and Resources
10 Related Documentation and Resources

Related Documentation
• ESP8684 Series Datasheet – Specifications of the ESP8684 hardware.
• ESP8684 Technical Reference Manual – Detailed information on how to use the ESP8684 memory and peripherals.
• ESP8684 Hardware Design Guidelines – Guidelines on how to integrate the ESP8684 into your hardware product.
• Certificates
https://espressif.com/en/support/documents/certificates
• ESP8684 Product/Process Change Notifications (PCN)
https://espressif.com/en/support/documents/pcns?keys=ESP8684
• Documentation Updates and Update Notification Subscription
https://espressif.com/en/support/download/documents
Developer Zone
• ESP-IDF Programming Guide for ESP8684 – Extensive documentation for the ESP-IDF development framework.
• ESP-IDF and other development frameworks on GitHub.
https://github.com/espressif
• ESP32 BBS Forum – Engineer-to-Engineer (E2E) Community for Espressif products where you can post questions,
share knowledge, explore ideas, and help solve problems with fellow engineers.
https://esp32.com/
• The ESP Journal – Best Practices, Articles, and Notes from Espressif folks.
https://blog.espressif.com/
• See the tabs SDKs and Demos, Apps, Tools, AT Firmware.
https://espressif.com/en/support/download/sdks-demos
Products
• ESP8684 Series SoCs – Browse through all ESP8684 SoCs.
https://espressif.com/en/products/socs?id=ESP8684
• ESP8684 Series Modules – Browse through all ESP8684-based modules.
https://espressif.com/en/products/modules?id=ESP8684
• ESP8684 Series DevKits – Browse through all ESP8684-based devkits.
https://espressif.com/en/products/devkits?id=ESP8684
• ESP Product Selector – Find an Espressif hardware product suitable for your needs by comparing or applying filters.
https://products.espressif.com/#/product-selector?language=en
Contact Us
• See the tabs Sales Questions, Technical Enquiries, Circuit Schematic & PCB Design Review, Get Samples
(Online stores), Become Our Supplier, Comments & Suggestions.
https://espressif.com/en/contact-us/sales-questions

Revision History
Revision History
Date Version Release notes
• Updated 6 Module Schematics

2023-06-26 v1.1 • Updated 7 Peripheral Schematics
• Updated 8.1 Physical Dimensions
• Updated Chapter 1.1 Features

2023-06-15 v1.0
• Updated Chapter 8.2 Recommended PCB Land Pattern
2022-05-15 v0.5 Preliminary release

2022-11-15 v0.1 Draft

Disclaimer and Copyright Notice
Information in this document, including URL references, is subject to change without notice.
ALL THIRD PARTY’S INFORMATION IN THIS DOCUMENT IS PROVIDED AS IS WITH NO
WARRANTIES TO ITS AUTHENTICITY AND ACCURACY.
NO WARRANTY IS PROVIDED TO THIS DOCUMENT FOR ITS MERCHANTABILITY, NON-
INFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, NOR DOES ANY WARRANTY
OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE.
All liability, including liability for infringement of any proprietary rights, relating to use of information
in this document is disclaimed. No licenses express or implied, by estoppel or otherwise, to any
intellectual property rights are granted herein.
The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a
registered trademark of Bluetooth SIG.
All trade names, trademarks and registered trademarks mentioned in this document are property
www.espressif.com of their respective owners, and are hereby acknowledged.
Copyright © 2023 Espressif Systems (Shanghai) Co., Ltd. All rights reserved.

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ESP8684-WROOM-04C

2.4 GHz Wi-Fi (802.11 b/g/n) and Bluetooth® 5 module

CPU and On-Chip Memory • High power mode (20 dBm)

• Center frequency range of operating channel: Note:

• 1T1R mode with data rate up to 72.2 Mbps

• Immediate Block ACK Antenna Options

• 3 × virtual Wi-Fi interfaces • Operating voltage/Power supply: 3.0 ~ 3.6 V

• Bluetooth LE: Bluetooth 5 • HTOL/HTSL/uHAST/TCT/ESD/Latch-up

Espressif Systems 2 ESP8684-WROOM-04C Datasheet v1.1

ESP8684-WROOM-04C comes with a PCB antenna.

The series comparison for ESP8684-WROOM-04C is as follows:

Table 1: ESP8684-WROOM-04C Series Comparison

Ambient Temp.1 Size2

– Light control – Health monitor

– Smart button – Baby monitor

– Smart plug • Smart Agriculture

– Indoor positioning – Smart greenhouse

• Industrial Automation – Smart irrigation

– Industrial robot – Agriculture robot

– Industrial field bus • Retail and Catering

• Consumer Electronics – POS machines

– Smart watch and bracelet – Service robot

– Over-the-top (OTT) devices • Generic Low-power IoT Sensor Hubs

Espressif Systems 3 ESP8684-WROOM-04C Datasheet v1.1

8 Physical Dimensions and PCB Land Pattern 23

10 Related Documentation and Resources 27

Espressif Systems 4 ESP8684-WROOM-04C Datasheet v1.1

Espressif Systems 5 ESP8684-WROOM-04C Datasheet v1.1

Espressif Systems 6 ESP8684-WROOM-04C Datasheet v1.1

Espressif Systems 7 ESP8684-WROOM-04C Datasheet v1.1

Figure 1: ESP8684-WROOM-04C Block Diagram

Espressif Systems 8 ESP8684-WROOM-04C Datasheet v1.1

3.1 Pin Layout

Figure 2: Pin Layout (Top View)

3.2 Pin Description

For peripheral pin configurations, please refer to ESP8684 Series Datasheet.

Espressif Systems 9 ESP8684-WROOM-04C Datasheet v1.1

Table 2: Pin Definitions

Name No. Type1 Function

3.3 Strapping Pins

Espressif Systems 10 ESP8684-WROOM-04C Datasheet v1.1

ESP8684 series has two strapping pins:

After reset, the strapping pins work as normal-function pins.

Table 3 lists detailed booting configurations of the strapping pins.

Table 3: Strapping Pins

Espressif Systems 11 ESP8684-WROOM-04C Datasheet v1.1

Figure 3: Setup and Hold Times for the Strapping Pins

Espressif Systems 12 ESP8684-WROOM-04C Datasheet v1.1

4.1 Absolute Maximum Ratings

Table 5: Absolute Maximum Ratings

Symbol Parameter Min Max Unit

4.2 Recommended Operating Conditions

Table 6: Recommended Operating Conditions

Symbol Parameter Min Typ Max Unit

4.3 DC Characteristics (3.3 V, 25 °C)

Table 7: DC Characteristics (3.3 V, 25 °C)

Symbol Parameter Min Typ Max Unit

Espressif Systems 13 ESP8684-WROOM-04C Datasheet v1.1

4.4 Current Consumption Characteristics