A Review of Machine Learning Techniques in Analog Integrated Circuit Design Automation
A Review of Machine Learning Techniques in Analog Integrated Circuit Design Automation
Review
A Review of Machine Learning Techniques in Analog
Integrated Circuit Design Automation
Rayan Mina 1, *, Chadi Jabbour 2 and George E. Sakr 3
Abstract: Analog integrated circuit design is widely considered a time-consuming task due to the
acute dependence of analog performance on the transistors’ and passives’ dimensions. An important
research effort has been conducted in the past decade to reduce the front-end design cycles of analog
circuits by means of various automation approaches. On the other hand, the significant progress
in high-performance computing hardware has made machine learning an attractive and accessible
solution for everyone. The objectives of this paper were: (1) to provide a comprehensive overview of
the existing state-of-the-art machine learning techniques used in analog circuit sizing and analyze
their effectiveness in achieving the desired goals; (2) to point out the remaining open challenges, as
well as the most relevant research directions to be explored. Finally, the different analog circuits on
which machine learning techniques were applied are also presented and their results discussed from
a circuit designer perspective.
Keywords: automated circuit sizing; machine learning; analog IC design; deep neural networks
As a matter of fact, once the system-level architecture and specifications are deter-
mined, analog design generally consists of choosing first the topologies for the basic
building blocks such as amplifiers, oscillators, or comparators and then sizing the de-
vices (transistors and passive components) of these building blocks to achieve a set of
performance specifications.
This sizing step is challenging due to three major reasons: First, there are always mul-
tiple solutions to the same problem, which are usually spread in the space of possibilities.
Second, the circuit performance is sensitive to uncontrollable random variations of the
fabrication process [1,5] and temperature. Third, analog circuits are usually difficult to
specify with a few performance metrics, which leads in some cases to more than a dozen
of specifications to meet [6–8] before a circuit designer is fully satisfied. Finally, some
specifications are dynamic in the sense that they depend on the circuit conditions [9], and
therefore, some performance metrics could be degraded during the IC life-cycle, which
renders the design even more complex.
In the past ten years, a considerable amount of research work has been conducted
to enhance the automation level of analog IC design using machine learning (ML). The
corresponding prior state-of-the-art can be split into three main categories.
1. Neural networks (NNs) of different complexities (shallow and deep) using both su-
pervised [10–18] and reinforcement [19–21] learning techniques have been proposed
in the past six years. These methods have been boosted by the progress in the devel-
opment of high-performance computing hardware and are gaining attention in the
scientific community thanks to their ability to model complex nonlinear problems [22];
2. Multi-objective optimization with several heuristic- and stochastic-assisted strategies
to explore the search space efficiently: Bayesian [23,24], particle swarm [25], the
Gaussian process [26], simulated annealing [27], and genetic algorithms [28–30].
These are simulation-based optimizations that rely on a circuit simulator to find a
solution. Although global optimization is not an ML technique in the strict sense of
the word, it remains a powerful mathematical tool for the automation of circuit design.
In contrast, older equation-based techniques as in [31] are no longer considered;
3. Hybrid methods combining global optimization and NN were proposed in [32–37].
These techniques achieve enhanced results compared to pure multi-objective opti-
mization methods, at a lower computation time.
In this work, we aimed to survey and investigate the recent progress made in the past
six years in applying ML methods to analog IC front-end design automation exclusively.
Techniques that use surrogate modeling [38] instead of SPICE-like simulators were not
included. Moreover, contributions targeting device modeling, physical back-end IC de-
sign [39], and fault testing were not included in this paper. Instead, the focus was on the
existing methods and innovations that have been proposed in the fields of supervised and
reinforcement deep learning for front-end analog IC design. The working principles of
the employed techniques, as well as some of their pros and cons are also discussed. The
contributions of this work were: (1) to provide answers on which circuits and to which
extent ML techniques were effectively used to help analog designers achieve good results;
(2) to elaborate on the existing limitations that require further investigations in the field, as
well as relevant future research directions.
There are some existing surveys in the literature that have tackled IC design automa-
tion [40–42]. Nevertheless, they differ from the proposed survey in this paper. The authors
in [42] pointed out the recent advancements in the usage of deep convolutional neural
networks and graph-based neural networks to accelerate the digital IC design workflow.
Their survey covered ML-assisted micro-architectural space exploration (from high-level
RTL design), physical back-end design (layout) for power optimization and estimation,
critical IR drops in routes, and efficient placement. Thus, they focused on the digital VLSI
flow and did not target analog circuits.
In [40], a general high-level review of ML applications was provided in multiple areas
of IC design from device modeling, front-end synthesis, and layout (back-end) design
Electronics 2022, 11, 435 3 of 20
to fault testing. The work is well organized and provides a wide overview of the prior
state-of-the-art without focusing particularly on one area.
The work in [41] is another example of a high-level paper that surveyed a wide
spectrum of artificial intelligence (AI) methods including knowledge-based and equation-
based optimization techniques. In addition to sizing, the work covered performance
modeling, which predicts the circuit performance dependency on device-level variations
(e.g., ∆VTH , ∆gm ), as well as IC yield optimization under process variation (i.e., corners).
Finally, the paper spanned two decades of analysis in its presentation and covered digital
along with analog design.
Therefore, the current work is, to the best of our knowledge, the first survey in the
literature to focus particularly on recent (post-2015) ML-assisted analog front-end IC design
automation, propose a profound level of understanding of the problem, and discuss the
details of the key contributions from prior state-of-the-art and the effectiveness of the
employed methods.
This paper is organized as follows: The existing NN-based automation approaches for
analog IC design are detailed in Section 2. Hybrid techniques are explained in Section 3.
Section 4 provides a comparative analysis of the prior state-of-the-art, while Section 5
covers the remaining open challenges and the most promising research directions to be
explored in the field.
the same target specifications, but in a novel technology node (0.35 µm CMOS). Although
scalable, this solution cannot be generalized to predict sizes for new, different specifications.
The transient power consumption of a relaxation oscillator was modeled in [18] using a
60-neuron time-delay NN, to enhance the circuit’s functional model during system-level
verification. This approach was focused on power consumption and is well suited for
mixed-signal blocks, which are usually modeled in behavioral languages.
Analog ICs implementing more complex functions (e.g., amplification, filtering) re-
quire more elaborate studies, larger training datasets, and networks with higher complexi-
ties in terms of layers and neurons.
In order to discuss the existing work in the literature, which applies supervised
learning to analog IC design automation, a set of criteria for evaluating the prior state-
of-the-art should be defined. In this work, the following criteria are proposed for this
purpose:
• Dataset generation technique;
• Feature selection;
• NN complexity;
• IC fabrication process used;
• Types of circuits targeted;
• Result validation method.
𝑋1 𝑌1
Design IC CAD Performance
Parameters Metrics
Simulator
𝑋𝑛 𝑌𝑚
Dataset
{𝑋11 … 𝑋𝑛1 } {𝑌11 … 𝑌𝑚
1
}
𝑉𝐷𝐷
𝑊4 𝑊3
𝐿3 𝐿3
𝑊1 𝑊1
𝑉𝑖𝑛2
𝑅𝑏𝑖𝑎𝑠 𝑉𝑖𝑛1 𝐿1 𝐿1
𝑉𝑜𝑢𝑡
𝑊2 𝑊2
𝐿2 𝐿2
Assume for simplicity that the amplifier to be designed is specified only for the
following performance: differential voltage gain and power consumption. Consequently,
Yj = { Ad , Ic }, and the combined vector { Xi , Yj } represents a single entry in the dataset,
which is an N × 9 matrix where N is the number of examples. Table 1 shows two examples
from the dataset of the previous circuit (dimensions in µm, Ic in mA).
W1 L1 W2 L2 W3 L3 W4 Ad Ic
1 5.2 0.13 10 0.2 2.4 0.3 0.24 56 2.3
2 4.1 0.18 11 0.6 2.1 0.35 0.4 112 4
... ... ... ... ... ... ... ... ... ...
On the other hand, there are no strict rules that define how many data are required for
each type of circuit. Usually, more data are helpful (since this increases the model accuracy);
nevertheless, in the case of analog IC design automation, the designer will generate only a
reasonable amount of data to keep the task practical and time manageable. For example,
20,000 examples (dataset size) were needed in [13] to train the NN and predict results for a
similar circuit that was designed in [14,15] using only 9000 and 16,600 different examples,
respectively. On the other hand, only 1600 data points were sufficient in [12]. However, the
previous numbers cannot be directly compared since the way the datasets were generated
out of circuit simulators differed significantly from one study to the other. It is hence
insightful to look into the different methods used to generate the training examples.
In [14], the authors manually adjusted, prior to simulation, all MOS transistors sizes
in order to obtain an initial valid solution that achieved proper performance (from a circuit
designer’s perspective). This initial adjustment was made by circuit designers. Only then,
the initial design parameters were slightly varied by 5%, and the different corresponding
circuits were simulated one by one to extract their performance and build the dataset.
Moreover, all transistors’ lengths L were fixed to 1 µm to reduce the design space and avoid
short-channel effects. Therefore, the dataset in [14] was too dependent on a pre-sized state
of the circuit.
Electronics 2022, 11, 435 6 of 20
Reference [13] proposed a similar, yet different approach for dataset generation: Initial
values for the design parameters (Xi0 ) were first determined by a circuit designer. Next,
100 different patterns were produced by randomly varying Xi0 in the range ±30%. The
obtained circuits were then simulated, and a score was calculated to select the best circuit
that had the highest score among all. The score was defined as the ratio of higher-the-
better performance metrics in the numerator and lower-the-better in the denominator. This
process was iterated as many times as needed to build the dataset, with the best circuit
from the previous 100 patterns being the starting circuit for the generation of the next
100 patterns. The whole process is depicted in Figure 3.
This approach had better exploration capabilities than [14] thanks to its higher range
of variation (30%); nevertheless, the selection of a solution at each step was dictated by a
single score that compressed the valuable information contained in a set of performances
to a unique metric. Moreover, the dataset used in training the NN depended somewhat on
a pre-defined state of the circuit.
The authors in [15] presented two novel ideas in data generation: First, they used an
existing dataset from previous optimizations made by analog designers, which contained
optimal or quasi-optimal circuits. The motivation here was to make the training data as
accurate as possible by having in the examples only the design parameter values that
guaranteed good performance. Second, the dataset was augmented by exploiting the fact
that some specifications correspond to inequalities. When a circuit is required to have a
power consumption below a specified threshold, all solutions resulting in a lower power
consumption values were considered compliant and hence added to the set of examples.
Therefore, the authors in [15] artificially increased the dataset size by randomly generating
additional examples with the same design parameters, but lower or higher (inequality)
performance values.
In [16], the dataset was generated from a special software framework (MaxFit GA-
SPICE), based on a genetic multi-objective optimization algorithm that relied on a set of
predefined circuit equations, which were developed by analog circuit designers. Therefore,
the circuit performances for all examples had a high level of confidence and were highly
accurate, since they were produced by a previous study. Nevertheless, this approach
entirely relied on the accuracy and availability of the aforementioned software framework.
Moreover, the generated dataset was further filtered to remove any outlier values, which
were values exceeding three-times the standard deviation from the mean value (as defined
in [16]).
The work in [17] proposed an interesting approach to widen the prediction range for
the target performance, by generating a fully random dataset from a normal distribution
on all design parameters. Some restrictions were rightly added to ensure quality examples
and improve the model’s accuracy.
Table 2 summarizes the details of the different dataset-generation techniques used in
the aforementioned studies.
Electronics 2022, 11, 435 7 of 20
𝑌1 𝑋1
Performance Design
Specifications NN Parameters
𝑌𝑚 𝑋𝑛
Figure 4. Inputs/outputs of a neural network using the performance metrics directly as fea-
tures [14,16].
2.1.3. NN Complexity
The NN structure and complexity must be carefully defined with the optimal number
of layers and neurons per layer, to start the training process. There is no defined rule for this
choice. It may vary substantially depending on the realized circuit function, the transistor
count, the number of features (Yi ) and their polynomial combinations (if any), as well as the
size of the generated dataset. In IC design automation, the first layer has a number of inputs
equal to the number of features, while the number of neurons in the output layer must
match the number of design parameters to be predicted. In the middle, hidden layers are
inserted to model complex nonlinear combinations of the circuit features, and this is where
each NN should be customized for the intended circuit. Some good guidelines in this sense
are the following: (1) for complex circuits (i.e., transistor count), a high number of neurons
is required in each Layer; (2) when the combination of several performance metrics in a
circuit contains useful information that needs to be included in the model, a high number
of layers should be used to allow the NN to learn those effects. Nevertheless, adding more
neurons and/or layers always comes with a longer training time. Table 3 summarizes the
prior state-of-the-art NN complexities implemented in supervised learning.
Table 3. Complexities in terms of number of neurons for the different NN structures used in prior
state-of-the-art.
For example, the work in [15] used three hidden layers with 120, 240, and 60 neurons,
respectively, while in [16], the authors opted for a single hidden layer with just nine neurons
because the training examples were pre-sized ones. On the other hand, and since the dataset
was randomly generated in [14], which led to widely spread values in the design space, a
much more complex network composed of 15 layers with 1024 neurons each was designed
to obtain accurate results (Table 3). This major difference stems from the simple observation
that a low-complexity NN training on highly accurate datasets can learn as good as complex
networks do on random data.
circuit on which to apply the supervised ML approach. An intuitive decision is to opt for a
structure that is easily reused in numerous systems, such as opamps, since their theory of
operation is well known and they have the widest application range in analog systems [1].
In fact, opamps are usually specified and designed as single open-loop circuits to be reused
extensively in closed-loop systems. The automatic sizing of all the opamp components
provides a huge benefit to circuit designers since they can focus more on the optimization
of their macro-system performance and architecture decisions.
In [14,16], the same two-stage opamp circuit was used in the supervised ML approach.
It corresponds to an NMOS source-coupled pair followed by a PMOS common-source. The
biasing was realized by a simple resistor, thus exhibiting large process, supply voltage, and
temperature variations.
In [13], the authors used a very similar circuit, only replacing each transistor with
its complementary type (PMOS vs. NMOS). Both circuits are valid opamps, although
analog designers have a slight preference for the PMOS input devices, in order to minimize
noise and optimize unity-gain frequency [45]. All three previously studied circuits have
differential inputs, but single-ended output structures.
A slightly different circuit was investigated in [15], having differential outputs and
using voltage combiners for biasing.
An interesting case is the CMOS band-gap voltage reference studied in [12]. It includes
an amplifier, with additional MOS transistors, diodes, and resistors. It represents a different
type of analog circuit compared to [13,16] with the particularity of providing a supply- and
temperature-independent DC voltage.
It is worth noting that previous work focused mainly on opamps and all had moderate
circuit complexity (transistor count < 12).
Yj,pred is the jth performance metric estimated using a circuit simulator from the schematic
that contains the NN-predicted design parameters X j,pred . On the other hand, Yj,true is
the jth performance metric that was initially input to the NN to make the prediction.
For example, the gain and slew rate metrics in [13] had a mean prediction error of 1.1%
and 19.1%, respectively, according to Table 4. The overall performance of a circuit is the
combined effect of each of its predefined metrics, and therefore, it is interesting to compute
both the average µe and standard deviation σe of the mean error for each performance. All
prior state-of-the-art works achieved a low average error <10%; however, from a circuit
designer’s perspective, it is mandatory that each metric reaches a low mean error, and
hence, a low σe is highly desirable. The work in [13] had the highest µe and σe computed
on 12 target specifications because the training dataset was randomly generated with
30% variation and the selection of examples was based on a single score. On the other hand,
Electronics 2022, 11, 435 10 of 20
the work in [16] had the lowest values thanks to high-accuracy pre-sized circuit examples
provided to the NN by a special software framework.
Table 4. Prediction error statistics in % per specification in prior state-of-the-art calculated using
Equation (1).
Specifications RL Agent
Action = Design Parameters 𝑋𝑖
Performance
Features 𝑌𝑖 Update Action for NN
Reward Circuit
Generator Predicted Performance Simulator 𝑊𝑘 , 𝐿𝑘
Features 𝑌𝑖
Figure 5. Reinforcement learning design flow as applied to analog IC design automation.
Reference [19] trained an RL agent for 30–40 h and achieved comparable or better
performance than human experts on several circuits. The algorithm would output at
each time step a set of values corresponding to the dimensions of the transistors and
passive components (i.e., design parameters). The circuit simulation environment would
then take those values and compute the performance metrics of the circuit. A reward
function was defined based on hard design constraints, as well as good-to-have targets. The
reward was formulated to be high if the simulated performance was close to the real values
and low otherwise. Their approach was validated on two circuits: two- and three-stage
transimpedance amplifiers in CMOS 0.18 µm. Five performance features were targeted:
Electronics 2022, 11, 435 11 of 20
noise, gain, power consumption, AC response peaking, and bandwidth. In both circuits,
RL showed promising results, where it outperformed the human experts in the time taken
to find the optimal values.
On the other hand, a deep reinforcement learning framework was used in [20] to
find the circuit design parameters, as well as to gain knowledge of the design space.
The algorithm found relevant solutions 40-times faster than regular genetic algorithm
optimization. The approach was tested on a simple transimpedance amplifier and a
two-stage opamp in CMOS 45 nm, then on another opamp with negative-gm load in
FinFET 16 nm. On the first circuit, the algorithm converged 25-times faster than regular
algorithms and was able to generalize well with 97% correct predictions out of 500 different
target specifications. For the second and third circuits, it showed a speedup of 40-times
over regular algorithms and predicted correctly 96% of 1000 and 100% of 500 different
specifications.
The work in [21] used deep RL to predict circuit design parameters as in the previous
papers. However, the authors introduced a novel technique based on a symbolic analysis
that rapidly evaluated the values of the DC gain and phase margin (PM) without invoking
the circuit simulator. This process filtered out the most-likely bad states of the circuit and
helped reduce the number of states that needed to be sent to the simulator for accurate
performance prediction. Any set of design parameters that did not satisfy the DC gain
and PM specifications were taken out of the loop early. Their system was tested on a
folded-cascode opamp in CMOS 65 nm. The results did not show values for convergence
speedup; nevertheless, the work was able to find sizing solutions correctly.
A promising work using a graph NN (GNN) and RL was presented in [46]. The GNN
achieved good prediction in applications where understanding the dependencies between
related entities was important: chemistry (properties of molecules) and social networks
(human interactions). The authors in [46] exploited the fact that a circuit is not different from
a graph where nodes are components and edges represent connections (i.e., wires). They
implemented a convolutional GNN that processed the connection relationship between
IC components and extracted features in order to transfer knowledge from one circuit to
another. The proposed technique was capable of transferring knowledge between two
slightly different topologies when they had some common design aspects (e.g., two-stage
and three-stage amplifiers) or between two different fabrication process nodes of the
same topology (e.g., CMOS 65 nm and 45 nm). For instance, the proposed RL algorithm
learned to change the gain of a differential amplifier by tuning the dimensions of the input
pair transistors. A successful demonstration on four circuits in CMOS 0.18 µm including
amplifiers and low-dropout voltage regulators was presented. The problem was formulated
to maximize a figure of merit (FoM), which was defined as the weighted sum of several
performance metrics. Finally, porting of two sized circuits from one larger process node to
several lower ones was achieved with shorter runtime.
Previously-optimized Circuits
(Data-set) Performance Estimator
(multivariate poly. Regression optimization)
New Context
(supply voltage, load)
Performance figures
& trade-off
The previous two-step hybrid approach is a rapid tool for predicting (given a new
circuit context) the sizing solutions corresponding to a near-optimal performance trade-off.
A major aspect of this study was to benefit from existing designs and make an efficient
reuse of them to predict the circuit performance under new conditions. The method was
tested on a folded-cascode opamp with Vth -biasing designed in CMOS 0.13 µm. A re-design
was made for new load capacitor values.
In [32], the core idea was to delegate part of the NN design to a genetic algorithm (GA)
that iterated to decide on the following: the neural network type (multi-layer perceptron
or radial-basis function) and which performance metrics and which design constraints
to include as the input features during training. The GA was actually given a set of
performance specifications and some additional design constraints: the algorithm worked
by feeding consecutively several subsets of the two previous variables to the NN, thus
removing and adding input elements depending on the training and validation results.
The best combination of NN type and set of features/constraints was selected as the
optimal solution to perform the prediction of the circuit. One novelty in the proposed
technique was that the constraints on the design parameters (to be predicted) were actually
presented as additional inputs to the GA-NN combination to help reduce the level of
under-determination. This hybrid approach was tested on a wide-band low-noise amplifier
(LNA) based on a common-source cascode circuit with inductive degeneration, working at
3 GHz with input and output matching networks (see Figure 7).
𝑉𝐷𝐷
Matching Network
Out
Bias
Input
Matching
Network
only classified two design samples (parent and current offspring) and output which one
was better for each specification separately. The NN was trained progressively during the
optimization and converged to stable weights quickly, since it only helped in increasing the
sample efficiency (see Figure 8). This novel method was tested on three different circuits:
an amplifier similar to [14], a two-stage opamp with negative-gm loads, and a mixed-signal
system comprising an optical link receiver front-end. Moreover, layout parasitic effects
were included in the prediction, which constituted a clear advantage.
A significantly different approach was used in [35], wherein the objective was to reduce
the convergence time of the evolutionary algorithm that predicted the circuits’ design
parameters. Data produced from on-going optimization iterations were used to train an
NN in parallel, in order to replace the time-consuming SPICE circuit simulators. Once the
training was complete, the simulator was no longer used, and the NN would estimate the
circuit performance rapidly, thus achieving quicker optimization results. The particularity
of this work was that a separate NN was used for each performance specification. This
hybrid method was successfully tested on a single-stage PMOS coupled-pair amplifier and
a folded-cascode opamp with cascode loads and Vth biasing designed in 0.13 µm CMOS
while achieving an ∼65% reduction in the execution time.
A time-efficient approach based on a genetic algorithm (GA) global optimization
was adopted in [37]. SPICE simulations were first used with the GA to cover the large
space encountered in analog circuits, while a local minimum search for neighboring design
regions was computed using a trained NN. The latter was progressively trained during the
GA process, and once completed, it replaced the time-consuming circuit simulators for local
regions only. The method was tested on a two-stage rail-to-rail opamp in CMOS 0.18 µm
with a fifth-order Chebyshev active filter achieving <2% average error and a four-times
speed improvement compared to classic evolutionary algorithms.
With the objective of decreasing the computation cost, the authors in [36] used a
Bayesian neural network (BNN) to model multiple circuit specifications by means of a
novel training method (differential variational inference). The trained BNN was then
introduced within a Bayesian optimization framework to capture the performance trade-off
efficiently. The method was tested on a charge-pump circuit and a three-stage PMOS input
device folded-cascode amplifier in 55 nm CMOS technology.
to provide some insights into the required design time. However, the hardware platform
used for computation was rarely stated, which somewhat limits the conclusions. It is worth
noting also that a straightforward estimation of the reliability of the presented techniques
was difficult to obtain since each work had a different circuit, fabrication process, dataset
size, and design parameters. Nevertheless, several important aspects of the comparison are
presented in the coming paragraphs.
Usually, hybrid techniques rely on neural networks to assist the main optimization
algorithm that actually performs the circuit-sizing task, either by reducing the operation
time (replace the circuit simulator) or by helping to decide which exploration path to
undertake. The software framework that hosts the whole process is hence complex, since a
circuit simulator, a neural network, and a global optimization algorithm are required to
communicate at the same time. In contrast, supervised and reinforcement methods rely
on the NN to achieve the objective, and therefore, the framework is simpler to build, with
the circuit simulator feeding its results to the NN in one step (supervised) or progressively
(reinforcement). Moreover, the network complexity varies among the existing solutions for
the same circuit being designed (Tables 5 and 6).
The number of different circuit simulations that should be performed in the analog IC
design (e.g., DC, AC, transient) is a bottleneck for the computation time. Some simulations
are particularly time consuming such as the transient, while others are time efficient such
as AC. Therefore, adding a new performance might lead to excessive simulation time and
should be considered upfront during the problem definition. Circuits that require heavy
transient simulations to be characterized are not well adapted to hybrid techniques that
employ evolutionary algorithms, which are known to take an excessive time to converge.
This point is worth considering when choosing between NN-based or hybrid techniques
for a particular circuit.
Table 5. Comparative summary of supervised and reinforcement learning techniques in the prior
state-of-the-art.
Circuit bandgap 2-stage 2-stage volt. combi. 2-stage 2-stage 3-stage 2-stage fold.-casc.
reference opamp opamp diff. opamp opamp opamp opamp opamp-gm opamp
Fabrication
CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
technology
missing <1 µm <1 µm 0.13 µm 0.18 µm 0.18 µm 0.18 µm 45 nm 65 nm
Perform. 3 12 5 4 (exp. 14) 6 5 6 4 4
features
Design 1 7 6 8 12 9 17 11 16
parameters
Average 0.25 7.8 4.4 7.7 3.7 <10 missing 3.7 missing
error (%)
Dataset ∼1600 20,000 9000 16,600 10,000 40,000 N/A N/A N/A
size
Generation
time missing 28 h missing 0 (existing) 3.6 h 16 h N/A N/A N/A
Circuit cascode LNA fold.-casc. 2-stage fold.-casc. charge-pump and rail-to-rail opamp
induc. deg. opamp Vth-bias opamp-gm opamp Vth-bias fold.-casc. opamp 5th-ord. filter
Fabrication CMOS CMOS CMOS CMOS CMOS CMOS
technology 0.18 µm 0.13 µm 45 nm 0.13 µm 40/55 nm 0.18/0.13 µm
Perform. 6 5 (expanded 20) 3 4 6/3 4/3
features
Design 10 19 11 19 16/13 9/8
parameters
The origin and reliability of a training dataset are crucial when using supervised
learning in analog circuit design automation. How are the examples gathered? To what
extent do they represent the full reality of the circuit? Answers to these questions determine
the generalization capability of the obtained model, which guarantees that for new target
specifications, we will obtain a set of relevant design parameters.
Some of the supervised learning techniques as in [13,14] constructed their dataset
by randomly varying the design parameters in a close region around an initial solution
corresponding to a pre-sized circuit with good performance. Thus, the NN model is highly
correlated with this region within the overall design space, which raises questions on how
good the predictions will be for solutions that are geometrically far in the design space
from the initial one. Therefore, such a generation method creates local prediction models
that are acceptable only if the intended application limits the circuit performance to a small
region of the design space (opamps targeting audio applications always have low GBW
values).
On the other hand, in [15,16], the dataset was collected from an existing database
of solutions and, hence, depended totally on the availability and the validity of such an
optimized set of examples. The dataset size may not be sufficient, nor is it possible to obtain
on a wide range of circuits and fabrication technologies. Consequently, the computed
model will have moderate generalization capability. To overcome this limitation, we
recommend building a fully random dataset in order to cover the widest region in the
overall design space.
On the other hand, hybrid methods rely on the wide exploration capability of the
global optimization algorithms they employ (e.g., genetic) to cover the majority of the
design space. Nevertheless, this comes at the cost of excessive simulation time and possible
convergence issues.
A classification of all the studied machine learning techniques used in analog IC design
in this paper is presented in Figure 9.
The supervised learning technique is further divided into three sub-categories depend-
ing on how the dataset is being generated: using an existing pre-sized circuit database, by
random generation in a close region around a predefined initial solution, or from a global
normal distribution. On the other hand, hybrid techniques employ NNs for different pur-
poses: replace the time-consuming IC simulators that slow down the global optimization or
assist the algorithm itself by sampling or search exploration speedup. Finally, some hybrid
methods use the genetic algorithm to design the optimal NN structure and to select the
features for training.
Electronics 2022, 11, 435 16 of 20
ML Techniques
for IC Design
[19][20][21]
[17] [34][36]
Figure 10 shows the different exploration capabilities of the supervised learning and
hybrid techniques studied in this work. Without loss of generality, a simplified two-
dimensional representation of the design space was adopted. The wider the exploration
within the design space, the higher the generalization of the computed model will be.
Ideally, fully random dataset generation would cover the whole white space in Figure 10 by
sampling in multiple small regions spread over the entire design space, which is practically
very difficult. Some randomized methods start by sampling over the whole design space
before zooming-in on promising areas, which would help address this issue.
Figure 10. Exploration and generalization capabilities of all the studied techniques in the prior
state-of-the-art.
ML algorithm’s implementation, by classifying the metrics into three types: lower, higher
and hard feature. For example, in an LNA, the voltage gain must be processed as a hard
feature, while its power consumption as a lower feature, meaning that reaching below
the target is acceptable. Such domain-specific insights can be incorporated dynamically
using logically inferred rules, as in [47] or manually by domain experts, as is the case in the
medical field.
In some cases, it is relevant to define two ways to measure the same performance
depending on the input signal’s magnitude. For instance, the linearity of a voltage buffer
should be measured by computing the full-scale (FS) THD in addition to the IIP3 figure.
Thus, both metrics should be included in the training dataset; otherwise, the ML model will
be limited to the small-signal behavior of the circuit and cannot predict accurate designs
that meet FS requirements.
6. Conclusions
This paper reviewed the existing state-of-the-art in front-end analog IC design automa-
tion using machine learning. Previous contributions in this field were classified into three
main categories: supervised, reinforcement, and hybrid learning techniques. A comparative
study was carried out based on relevant criteria such as the type of circuits, the NN com-
plexity, the result validation, and feature selection methods. Different dataset-generation
approaches in supervised learning were also discussed, and qualitative recommendations
were given on how to build relevant data to enhance the exploration and generalization
capabilities of the ML model. Furthermore, this work pointed out several open challenges
(that have not been explored yet) when using machine learning for automated analog IC
design: the sizing of switched circuits, the impact of including CMFB loops in sizing fully
differential structures, the early estimation of PVT variations in the proposed solutions, the
impact of specific effects related to advanced CMOS fabrication technologies, and finally,
the feasibility of a flat-level optimization when designing complex systems composed of
multiple sub-circuits.
Author Contributions: Formal analysis, R.M., C.J. and G.E.S.; investigation, R.M., C.J. and G.E.S.;
writing—original draft preparation, R.M.; writing—review and editing, R.M., C.J. and G.E.S.; visual-
ization, R.M. and C.J.; All authors have read and agreed to the published version of the manuscript.
Funding: This research received no external funding.
Acknowledgments: The authors would like to thank Marc Ibrahim from Saint-Joseph University of
Beirut for his insightful comments on the efficiency of global optimization methods and evolutionary
algorithms.
Conflicts of Interest: The authors declare no conflict of interest.
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