Computer Hardware-1
Computer Hardware-1
Heman A.M.
Computer
Its an electronic device that receives data as input and perform finite
sequence of operations called processing according to the instructions
contained therein and generates output as information by reason the
operation.
What is Computer Hardware
Computer hardware is the collection of physical parts of a computer
system:
1. Chases, Monitor, Keyboard, mouse, printer ect
Physical Components
• P-type
• N-type
Table of common elements used
for semiconductors
Extrinsic
• P-type: trivalent and tetravalent e.g. Si and Ga
• N-type: tetravalent and pentavalent e.g. Ge and As
Diode
• A two-terminal device that acts like a mechanical switch
Either
• P-N or
• N-P
Fabrication of Diode
• Doping: doping is the intentional introduction of impurities into an
intrinsic semiconductor for the purpose of modulating its electrical
properties. The doped material is referred to as extrinsic
semiconductors. Example:
Biasing
• Forward bias: NB: be mindful of current
Depletion region
Biasing conn’d
• Reverse bias: NB: be mindful of voltage
Silicon Diode I-V characteristic
VCE is +ve
Symbolic Representation of BJT
NPN PNP
BJT Conn’d
• Form KVL,
- - - - (2)
• Major difference is that when I is +v on PNP it will be –ve on NPN and vis-
vasa
I-V Characteristics of BJT
Practically,
iB << iC
Hence:
iE ≌ iC
However, DC gain is
iC = βiB - - (4)
• iC = αiE - - - - - (6)
BJT conn’t
• From semiconductor Physics it is proven that
𝑣𝐵𝐸
• IC = IS 𝑒 𝑣𝑇 −1 - - - - - (6)
Where
• IC ,
Field Effect Transistors (FET)
• It’s majority-charge-carrier devices, in which the current is carried
predominantly by majority carriers, or minority-charge-carrier
devices, in which the current is mainly due to a flow of minority
carriers
• The device consists of an active channel through which charge
carriers, electrons or holes, flow from the source to the drain
FET Conn’d
• Source (S): through which the carriers enter the channel.
Conventionally, current entering the channel at S is designated by I S.
• Drain (D): through which the carriers leave the channel.
Conventionally, current entering the channel at D is designated by I D.
Drain-to-source voltage is VDS.
• Gate (G): the terminal that modulates the channel conductivity. By
applying voltage to G, one can control ID.
• Body (p):serves to bias the transistor into operation; connected to
the highest or lowest voltage within the circuit
• Gate and Source are connected in revers bias
FET Channels
• n-channel: a negative gate-to-source voltage causes a depletion
region, if the active region expands and completely closes the
channel, the resistance of source-drain become too large that no
current flows. This is called pitch-off and the corresponding voltage is
called pitch-off voltage
• p-channel: a positive voltage from gate to body creates a depletion
layer by forcing the positively charged holes to the gate
insulator/semiconductor interface, leaving exposed a carrier-free
region of immobile, negatively charged acceptor ions.
MOSFET
• The oxide layer is made of polycrystalline silicon
• The gate is an insulator
• Conductivity changes with amount of applied voltage
• Potential drop across the oxide material induces conducting channel
between the source and the drain
• It designed to be used in enhanced mode
• nMOSFET or nMOS is made of p-type while pMOS is made of n-type
FET I-V Characteristic
Integrated Circuits (ICs)
• Interconnected circuit components in a Si substrate to form a desired
electronic function
ICs Characteristics
• All components are embedded in semiconductor substrate which
they cannot be removed for repairs or replacement
• They are a monolithic structure such that the components can best
be seen with microscope
• No component is seen outside of the chip
• Can work on low voltage
• They can handle a limited amount of power
• They are very small in size
• They are cheap
• Complex circuits in a chip can be used to obtain improve performance
characteristics
ICs Types
• Analogue: Made primarily of Transistors. E.g. Bipolar, MOSFETs Field
Effect etc
• Digital: Made of electronic gates. E.g. NOT, NOR, OR, XOR, AND etc
Discrete Circuits
• Discrete Circuit: The formation of circuit using electrical/electronic
components on a Printed Circuit Board (PCB) to form a circuit for a
particular function
✓ They occupy a very large space in large electronic circuits
✓ They have reliability issues because they are joined together by
soldering
Characteristics of Discrete Circuits
• They require more voltage
• They can handle much more power than ICs
• They occupy large space
• They are more expensive than ICs
• Their performance is not good
Scales of ICs
Name Signification Year Transistors number Logic gates number
small-scale
SSI 1964 1 to 10 1 to 12
integration
medium-scale
MSI 1968 10 to 500 13 to 99
integration
large-scale
LSI 1971 500 to 20,000 100 to 9,999
integration
very large-scale
VLSI 1980 20,000 to 1,000,000 10,000 to 99,999
integration
ultra-large-scale
ULSI 1984 1,000,000 and more 100,000 and more
integration
SSI ICs
SSI ICs
MSI ICs
VLSI ICs
Intel 80486
Produced from 1989 – 2007
Max clock 16 MHz to 150MHz
ULSI ICs (Semiconductor memory)
Memory Cell
Logic Gates
• Are digital combinatorics components used for designing
combinatorics and non-combinatorics circuits electronic IC circuits
• These include AND, OR, NOT, NAND, NOR, EXOR and EXNOR gates
AND gate
OR gate
NOT gate
NAND gate
NOR gate
EXOR gate
EXNOR
ULSI ICs (digital memory)
Memory Cell
Magnetic Disk
• A disk is a circular platter constructed of nonmagnetic material, called
the substrate, coated with a magnetizable material.
• The substrate used to be aluminum/aluminium alloy but now its
mostly made of glass
Benefits of Using glass
substrate
• Improvement in the uniformity of the magnetic film surface to increase disk
reliability
• A significant reduction in overall surface defects to help reduce read-write errors
• Ability to support lower fly heights (described subsequently)
• Better stiffness to reduce disk dynamics
• Greater ability to withstand shock and damage
Magnetic Read and Write
Mechanism
• Data is written on a magnetic disc using the Read/Write head
• A typical Read/Write head a rectangular doughnut with a gap along
one side and a few turns of conducting wire along the opposite side
• Magnetic field is created between the gab on the Read/Write head
due to winding on the other side of the Read/Write head
• In writing, magnetic patterns are created on the disc relative to HIGH
(1) and LOW (0) current input to the coil
• Same process is repeated in reading, LOW patterns on the magnetic
platter denotes 0 and HIGH patterns on the platter denotes 1
Read/Read Mechanism of a
Magnetic Disk Conn’d
Read/Write: Hard drive type
• Read head is separate from the write head positioned closely though
• The heads are shielded with Magnitoresistive (MR) sensors
• When current is passed to the MR, data is written on the magnetic
platter due to the HIGH (1) and LOW (0) current input to the MR
• To read from the platter, HIGH (1) and LOW (0) current is read from
the magnetic platter by the MR
Data Organization and
formatting
Data Organization and
Formatting Conn’d
• Intersector or track gap: prevents, or at least minimizes, errors due to
misalignment of the head or simply interference of magnetic fields.
• Track: concentric circles in which data is written and read from the disc
• Sector: Is the number of block each track is divided into separated by
intersector gap
• Constant Angular Velocity (CAV): This enable the reading or writing from
sectors near the middle of a disc at the same rate with those further from
the middle of the disc
• Multizone Recording: surface of a disc is divided into a number of
concentric zones (16) (commonly found on HDD) with higher bits
concentration at the middle and space towards the outside of the disk
Physical Characteristics
• Fixed-head Disk: there is one read-write head per track
• Movable-head disk: there is only one read-write head.
• Nonremovable disk: is permanently mounted in the disk drive
• Removable disk: can be removed and replaced with another disk
• Cylinder: set of all the tracks in the same relative position on the
platter
• Tradeoff: The narrower the head the high density of data written
which increases chances of error
Components of a Disk Drive
Typical Hard Disk Drive
Parameter
• Seek time: is the time it takes to position the head at the track
• Rotation delay or rotational latency: is the time it takes for the
beginning of the sector to reach the head
• Access time: is the sum of the seek time, if any, and the rotational
delay
• Transfer time: is the time taken for the Read/Write head travers from
the beginning of a sector where it is suppose to read or write to the
end of the sector. Hence,
Cathode Ray Tube (CRT) Display