Digi Connectcore mp2
Digi Connectcore mp2
Digi Connectcore mp2
Specifications
Digi ConnectCore Cloud Services.
Create. Configure. Deploy. Manage.
ARTIFICIAL INTELLIGENCE Neural Processing Unit (NPU) — VeriSilicon® at 900 MHz, 1.35 TOPS
3D GPU — VeriSilicon at 900 MHz; OpenGL® ES 3.2.8 — Vulkan 1.2; Open CL™ 3.0, OpenVX™ 1.3; up to 138 Mtriangle/s, 900 Mpixel/s;
LCD-TFT controller, up to 24-bit digital RGB888; up to FHD (1920 x 1080) at 60 fps, 3 layers including a secure layer; YUV support, 90°
VIDEO / GRAPHICS output rotation;
MIPI DSI®, 4x data lanes, up to 2.5 Gbit/s each; up to QXGA (2048 x 1536) at 60 fps;
FPD-1 and OpenLDI JEIDA/VESA (LVDS), 1x link of 4x data lanes, up to 1.1 Gbit/s each, up to 1080p at 60 fps
Camera interface #1 (5 Mpixels at 30 fps); MIPI CSI-2®, 2x data lanes up to 2.5 Gbit/s each; 8- to 16-bit parallel, up to 120 MHz; RGB, YUV,
JPG, RawBayer with basic ISP, downscaling, cropping, 3-pixel pipelines;
CAMERA Camera interface #2 (1 Mpixels at 15 fps); 8- to 14-bit parallel, up to 80 MHz; RGB, YUV, JPG, cropping;
Digital parallel interface up to 16-bit input or output
Secure boot, TrustZone® peripherals, up to 8 tamper input pins + 8 active tamper output pins, 1x CRC calculation unit, 2x cryptographic
processors, hardware acceleration with DMA support; environmental monitors, display secure layers;
Encryption/decryption: AES-128/192/256, DES/TDES; secure AES-256 with SCA; RSA, ECC, ECDSA with SCA; HASH (SHA-1, SHA-224,
SECURITY SHA-256, SHA3), HMAC; true random number generator; “on-the-fly” DDR encryption/decryption (AES-128); “on-the-fly” OTFDEC
Octo-SPI flash memory decryption (AES-128);
Complete resource isolation framework;
Digi TrustFence embedded security framework
8x I2C FM+ (1 Mbit/s, SMBus/PMBus®); 4x I3C (12.5 Mbit/s); 5x UART + 4x USART (12.5 Mbit/s, ISO7816 interface, LIN, IrDA, SPI slave);
8x SPI (50 Mbit/s, including 3 with full duplex I2S audio class accuracy via internal audio PLL or external clock);
4x SAI (stereo audio: I2S, PDM, SPDIF Tx);
SPDIF Rx with 4 inputs;
3x SDMMC up to 8-bit, out of which one is used for eMMC and one for Wi-Fi;
up to 3x CAN controllers supporting CAN FD protocol, out of which one supports time-triggered CAN (TTCAN);
1x USB 2.0 high-speed Host with embedded 480 Mbits/s PHY;
1x USB 2.0/3.0 high-speed/SuperSpeed dual role data with embedded 480 Mbits/s and 5 Gbits/s PHY (5 Gbits/s PHY shared with PCI
Express);
1x USB Type-C® Power Delivery control with two CC lines PHY;
1x PCI Express with embedded 5 Gbits/s PHY (PHY shared with USB 3.0 SuperSpeed);
up to 172 secure I/O ports with interrupt capability; up to 6 wake-up inputs; up to 8 tamper input pins + 8 active tamper output pins;
3x ADCs with 12-bit max. resolution (up to 5 Msps each, up to 24 channels);
PERIPHERALS / INTERFACES Internal temperature sensor;
1x multifunction digital filter (MDF) with up to 8 channels/8 filters;
1x audio digital filter with 1 filter and sound activity detection;
Internal or external ADC reference VREF+;
4x 32-bit timers with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input;
3x 16-bit advanced motor control timers;
10x 16-bit general-purpose timers (including 2 basic timers without PWM);
5x 16-bit low-power timers;
Secure RTC with subsecond accuracy and hardware calendar;
up to 2x 4 Cortex-A35 system timers (secure, non-secure, virtual, hypervisor);
2x SysTick M33 timer (secure, non-secure);
1x SysTick M0+ timer;
7x watchdogs (5x independent and 2x window)
2x Gigabit Ethernet with external PHY interfaces, optional 3x Gigabit Ethernet GMAC interfaces and 2+1 switch with STM32MP257F MPU;
ETHERNET TSN, IEEE 1588v2 hardware, MII/RMII/RGMII
Wi-Fi 5 dual-band 802.11a/b/g/n/ac 1x1 radio (up to 433.3 Mbps) with strong WPA3-Enterprise authentication/encryption;
WIRELESS −40 °C to 85 °C (−40 °F to 185 °F) full temperature range; Bluetooth 5.2 (Basic Rate, Enhanced Data Rate and Bluetooth Low Energy)
The information provided in this document is preliminary and may be subject to change without notice.
OPERATING TEMPERATURE Industrial: −40 °C to 85 °C (−40 °F to 185 °F); depending on use case and enclosure/system design
RADIO APPROVALS* US, Canada, EU, Japan, Australia/New Zealand, Brazil, Mexico
FCC Part 15 Class B, EN 55022 Class B, EN 61000-3-2, EN 61000-3-3, ICES- 003 Class B, VCCI Class II, AS 3548
EMISSIONS / IMMUNITY / SAFETY* FCC Part 15 Subpart C Section 15.247, IC (Industry Canada), RSS-210 Issue 5 Section 6.2.2(o), EN 300 328, EN 301 489-17, EN 55024
EN 301 489-3, Safety (IEC 62368-1); visit digi.com/resources/certifications for latest updates
DESIGN VERIFICATION* Temperature: IEC 60068-2-1, IEC 60068-2-2, IEC 60068-2-78; vibration/shock: IEC 60068-2-6, IEC 60068-2-64, IEC 60068-2-27, HALT
Digi SMTplus (30 mm x 30 mm) surface mount footprint using 333-pad LGA (1.27 mm pitch) with option for simple carrier board designs
MOUNTING / PIN COUNT supporting subset of interfaces
Digi ConnectCore MP255 Development Kit with development board and Digi ConnectCore MP255 dual 1 GB DDR4, 8 GB eMMC,
CC-WMP255-KIT
wireless SOM including Digi ConnectCore Cloud Services Premium 1-year license
Digi ConnectCore MP255 dual A35 1.5 GHz, M33, GPU, ISP, NPU, 1 GB DDR4, 8 GB eMMC, secure boot, −40 to 85 °C (−40 to 185 °F),
CC-WST-J17D-NK
802.11a/b/g/n/ac Wi-Fi 5 1x1, Bluetooth 5.2
CC-ST-J17D-ZK Digi ConnectCore MP255 dual A35 1.5 GHz, M33, GPU, ISP, NPU, 1 GB DDR4, 8 GB eMMC, secure boot, −40 to 85 °C (−40 to 185 °F)
CC-ACC-LCDH-10 LCD application kit, including 10 in WXGA (high resolution) LCD panel
The information provided in this document is preliminary and may be subject to change without notice.
Part Numbers
CC-SEC-ENT-ADD Digi ConnectCore Security Services — Enterprise for additional product (same duration as main contract)
877-912-3444 I 952-912-3444
91004670
© 2024 Digi International Inc. All rights reserved. All other trademarks are the property of their respective owners. A7/424