NCP380 D-1509408
NCP380 D-1509408
NCP380 D-1509408
Current‐Limiting
Power‐Distribution
Switches
NCP380, NCV380
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The NCP380 is a high side power-distribution switch designed for
applications where heavy capacitive loads and short-circuits are likely
to be encountered. The device includes an integrated 55 mW (DFN
package), P-channel MOSFET. The device limits the output current to
a desired level by switching into a constant-current regulation mode
when the output load exceeds the current-limit threshold or a short is UDFN6 TSOP−5 TSOP−6
CASE 517AB CASE 483 CASE 318G
present. The current-limit threshold is either user adjustable between
500 mA and 2.1 A via an external resistor or internally fixed. The
power-switch rise and fall times are controlled to minimize current MARKING DIAGRAMS
ringing during switching.
An internal reverse-voltage detection comparator disables the 1 6
2 XXMG 5
power-switch if the output voltage is higher than the input voltage to 3 G 4
protect devices on the input side of the switch.
The FLAG logic output asserts low during over current, UDFN6
reverse-voltage or over temperature conditions. The switch is
controlled by a logic enable input active high or low. 5
Features XXXAYWG
G
• 2.5 V – 5.5 V Operating Range
1
• 70 mW High-side MOSFET
TSOP−5
• Current Limit:
♦ User adjustable from 500 mA to 2.1 A
♦ Fixed 500 mA, 1 A, 1.5 A, 2 A and 2.1 A
• Under Voltage Lock-out (UVLO) XXXAYWG
G
• Built-in Soft-start
1
• Thermal Protection
TSOP−6
• Soft Turn-off
• Reverse Voltage Protection XXX = Specific Device Code
• Junction Temperature Range: −40°C to 125°C A =Assembly Location
M = Date Code
• Enable Active High or Low (EN or EN) Y = Year
• Compliance to IEC61000−4−2 (Level 4) W = Work Week
♦ 8.0 kV (Contact) G = Pb−Free Package
♦ 15 kV (Air) (Note: Microdot may be in either location)
• UL Listed − File No. E343275
• NCV Prefix for Automotive and Other Applications Requiring ORDERING INFORMATION
See detailed ordering and shipping information in the package
Unique Site and Control Change Requirements; AEC−Q100 dimensions section on page 20 of this data sheet.
Qualified and PPAP Capable
• These are Pb-Free Devices
Typical Applications
• Laptops
• USB Ports/Hubs
• TVs
USB
DATA
D+
D− USB
USB INPUT Port
IN OUT VBUS
5V
GND
Rfault 1 mF 120 mF
100 kW NCP380
UDFN6 TSOP−5
TSOP−6
(Top view)
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2
NCP380, NCV380
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3
NCP380, NCV380
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4
NCP380, NCV380
VIN
IN OUT
1 mF CLOAD RLOAD
NCP380
GND
50%
VEN
TR TF
VEN
TOFF
VOUT 90%
TON 10%
10%
90%
VOUT
10%
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5
NCP380, NCV380
BLOCK DIAGRAM
Blocking Control
IN OUT
Current
ILIM* Gate Driver
Limiter
Vref
TSD UVLO Osc
GND
Flag
/FLAG
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6
NCP380, NCV380
Ton + TR
Toff + Tfall
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7
NCP380, NCV380
Treg
TSD
Warning
TOCP
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8
NCP380, NCV380
TFOCP
TSD Warning
VIN
VOUT
IIN
/FLAG
TOCP
Treg
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9
NCP380, NCV380
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10
NCP380, NCV380
TFOCP
VOUT
IOUT
/FLAG
VREV
VOUT
VIN
TFREV
/FLAG
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11
NCP380, NCV380
T RREV
2.4
2.38
2.36
2.34
2.32
UVLO (V)
2.3
2.28
2.26
2.2
−50 0 50 100 150
Temperature (°C)
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12
NCP380, NCV380
1.8
1.6
1.4
1.2
IINOFF (mA)
1.0
0.8
0.6
0.4
0.2
0.0
2.4 2.9 3.4 3.9 4.4 4.9 5.4
Vin(V)
Figure 18. Standby Current vs Vin
90
80
70
60
IINON (mA)
50
40
30
20
10
0
2.4 2.9 3.4 3.9 4.4 4.9 5.4
Vin(V)
Figure 19. Quiescent Current vs Vin
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13
NCP380, NCV380
TSOP Package
100
85
80
RDS(on) (mW)
75
70
65
60
55
50
45
40
−50 −40 −30 −20 −10 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140
Temperature (°C)
mDFN Package
100
95
RDS(on) vs. Temperature
90
85
80
RDS(on) (mW)
75
70
65
60
55
50
45
40
−50 −40 −30 −20 −10 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140
Temperature (°C)
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14
NCP380, NCV380
FUNCTIONAL DESCRIPTION
Overview VOUT
The NCP380 is a high side P channel MOSFET power Thermal Timer
Regulation Regulation
distribution switch designed to protect the input supply Threshold Mode
voltage in case of heavy capacitive loads, short circuit or
over current. In addition, the high side MOSFET is turned
IOUT
off during under voltage, thermal shutdown or reverse
voltage condition. Adjustable version allows the user to
program the current limit threshold using an external
IOCP
resistor. Thanks to the soft start circuitry, NCP380 is able to
limit large current and voltage surges. TOCP TREG
Overcurrent Protection Figure 24. Short circuit
NCP380 switches into a constant current regulation mode
when the output current is above the IOCP threshold. Then, the device enters in timer regulation mode, described
Depending on the load, the output voltage is decreased in 2 phases:
accordingly. • Off-phase: Power MOSFET is off during TOCP to allow
• In case of hot plug with heavy capacitive load, the the die temperature to drop.
output voltage is brought down to the capacitor voltage. • On-phase: regulation current mode during TREG. The
The NCP380 will limit the current to the IOCP threshold current is regulated to the IOCP level.
value until the charge of the capacitor is completed.
The timer regulation mode allows the device to handle
VOUT high thermal dissipation (in case of short circuit for
example) within temperature operating condition.
Drop due to
Capacitor Charge NCP380 stays in on-phase/off-phase loop until the over
current condition is removed or enable pin is toggled.
IOUT Remark: Other regulation modes can be available for
different applications. Please contact our
IOCP
ON Semiconductor representative for availability.
FLAG Indicator
Figure 22. Heavy capacitive load
The FLAG pin is an open-drain MOSFET asserted low
• In case of overload, the current is limited to the IOCP during over current, reverse-voltage or over temperature
value and the voltage value is reduced according to the conditions. When an over current or a reverse voltage fault
load by the following relation: is detected on the power path, FLAG pin is asserted low at
the end of the associate deglitch time (see electrical
V OUT + R LOAD I OCP (eq. 1)
characteristics). Thanks to this feature, the FLAG pin is not
VOUT tied low during the charge of a heavy capacitive load or a
voltage transient on output. Deglitch time is TFOCP for over
current fault and TREV for reverse voltage. The FLAG pin
IOCP × RLOAD remains low until the fault is removed. Then, the FLAG pin
goes high at the end of TFGL.
IOUT
Undervoltage Lock-out
Thanks to a built-in under voltage lockout (UVLO)
IOCP
circuitry, the output remains disconnected from input until
Figure 23. Overload VIN voltage is below VUVLO. When VIN voltage is above
VUVLO, the system try to reconnect the output after a
• In case of short circuit or huge load, the current is rearming time. TRUVLO. This circuit has a VHYST hysteresis
limited to the IOCP value within TDET time until the witch provides noise immunity to transient.
short condition is removed. If the output remains
shorted or tied to a very low voltage, the junction Thermal Sense
temperature of the chip exceeds TSDOCP value and the Thermal shutdown turns off the power MOSFET if the die
device enters in thermal shutdown (MOSFET is temperature exceeds TSD. A Hysteresis prevents the part
turned-off). from turning on until the die temperature cools at TRSD.
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15
NCP380, NCV380
APPLICATION INFORMATION
Where:
PD = Power dissipation (W)
VIN = Input Voltage (V)
RLOAD = Load Resistance (W)
IOCP = Output regulated current (A)
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16
NCP380, NCV380
The “Min current limit Value” column, represents the DC Second column is the theoretical resistor value obtained
current to provide to the accessory without over current with following formula to achieve typical current target:
activation.
Rlim + −5.2959 ILIM 5 ) 45.256 ILIM 4 * 155.25 ILIM 3 ) 274.39 ILIM 2 * 267.6 ILIM ) 134.21 (eq. 5)
26
24
22
20
18
16
14
12
10
8
6
4
2
0
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8
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17
NCP380, NCV380
IOCP max + 2.2885175 * 0.0446914 Rlim ) 0.0015163(Rlim * 22.375) 2 * 0.000061 (Rlim * 22.375) 3 )
(eq. 7)
) 0.0000012 (Rlim * 22.375) 4
3.0
2.8
IOCP min vs. RLIM
2.6
IOCP vs. RLIM
2.4
IOCP max vs. RLIM
2.2
2.0
1.8
ILIM (A)
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47
RLIM (kW)
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18
Power Supply NCP380
GPM21BR61C106KE15L 1 6
IN IN OUT
10 mF 2 5
4.7 mF GND ILIM 100 mF
3 4 GPM31CR60J107ME39L
EN /FLAG
LDO 3.3 V
1 3
IN OUT
USB Host
Controller
VCC
GND STATUS SYS SYSTEM
EN
19
2
USB USB
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1 Transceiver Transceiver 1
NCP380, NCV380
VCC VCC
5 12 12 5
VBUS VBUS(sense) CRTL[x:0] CRTL_IN[x:0] CRTL_OUT[x:0] CRTL[x:0] VBUS(sense) VBUS
2 11 11 2
D+ D+ DATA[x:0] DATA_IN[x:0] DATA_OUT[x:0] DATA[x:0] D+ D+
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20
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TSOP−6
CASE 318G−02
1 ISSUE V
SCALE 2:1 DATE 12 JUN 2012
NOTES:
D 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
H 2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM
ÉÉ
LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
6 5 4 L2 4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR
ÉÉ
GAUGE
E1 E PLANE GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D
AND E1 ARE DETERMINED AT DATUM H.
1 2 3 5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE.
L
MILLIMETERS
NOTE 5
M C SEATING
b PLANE DIM MIN NOM MAX
STYLE 13: STYLE 14: STYLE 15: STYLE 16: STYLE 17:
PIN 1. GATE 1 PIN 1. ANODE PIN 1. ANODE PIN 1. ANODE/CATHODE PIN 1. EMITTER
2. SOURCE 2 2. SOURCE 2. SOURCE 2. BASE 2. BASE
3. GATE 2 3. GATE 3. GATE 3. EMITTER 3. ANODE/CATHODE
4. DRAIN 2 4. CATHODE/DRAIN 4. DRAIN 4. COLLECTOR 4. ANODE
5. SOURCE 1 5. CATHODE/DRAIN 5. N/C 5. ANODE 5. CATHODE
6. DRAIN 1 6. CATHODE/DRAIN 6. CATHODE 6. CATHODE 6. COLLECTOR
RECOMMENDED GENERIC
SOLDERING FOOTPRINT* MARKING DIAGRAM*
6X
0.60
XXXAYWG XXX MG
G G
1 1
3.20 6X
0.95 IC STANDARD
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
DOCUMENT NUMBER: 98ASB14888C Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
TSOP−5
CASE 483
5 ISSUE N
1 DATE 12 AUG 2020
SCALE 2:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
NOTE 5 D 5X Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
0.20 C A B 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
2X 0.10 T THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
M 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
5 4 FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
2X 0.20 T S
B FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
1 2 3 EXCEED 0.15 PER SIDE. DIMENSION A.
K 5. OPTIONAL CONSTRUCTION: AN ADDITIONAL
B TRIMMED LEAD IS ALLOWED IN THIS LOCATION.
G DETAIL Z
TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2
FROM BODY.
A A
MILLIMETERS
TOP VIEW DIM MIN MAX
A 2.85 3.15
B 1.35 1.65
DETAIL Z C 0.90 1.10
J D 0.25 0.50
G 0.95 BSC
C H 0.01 0.10
0.05 J 0.10 0.26
H SEATING K 0.20 0.60
C PLANE
END VIEW M 0_ 10 _
SIDE VIEW S 2.50 3.00
GENERIC
SOLDERING FOOTPRINT*
MARKING DIAGRAM*
1.9
0.074 5 5
0.95
0.037 XXXAYWG XXX MG
G G
1 1
Analog Discrete/Logic
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
DOCUMENT NUMBER: 98ARB18753C Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
NOTES:
D A B 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
NOTE 5 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED
BETWEEN 0.15 AND 0.25MM FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE
ÍÍ
TERMINALS.
PIN ONE 5. TIE BARS MAY BE VISIBLE IN THIS VIEW AND ARE CONNECTED TO
REFERENCE
ÍÍ
E THE THERMAL PAD.
ÍÍ
MILLIMETERS
DIM MIN MAX
0.10 C
A 0.45 0.55
A1 0.00 0.05
0.10 C END VIEW A3 0.127 REF
TOP VIEW b 0.25 0.35
D 2.00 BSC
ÉÉÉ ÉÉ
A3 A3 D2 1.50 1.70
EXPOSED Cu MOLD CMPD E 2.00 BSC
ÉÉÉ
ÇÇÇ ÉÉ
ÇÇ
DETAIL B E2
0.10 C 0.80 1.00
e 0.65 BSC
A L 0.25 0.35
L1 --- 0.15
6X 0.08 C A1
A1 GENERIC
NOTE 4
SIDE VIEW C SEATING
PLANE
DETAIL B MARKING DIAGRAM*
ALTERNATE
CONSTRUCTIONS
DETAIL A
XXMG
D2 L G
1 3 L L
XX = Specific Device Code
M = Date Code
L1
G = Pb−Free Package
E2 DETAIL A
ALTERNATE TERMINAL
(Note: Microdot may be in either location)
CONSTRUCTIONS *This information is generic. Please refer to
device data sheet for actual part marking.
6 4 6X b Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
e 0.10 M C A B
0.05 M C RECOMMENDED
BOTTOM VIEW
SOLDERING FOOTPRINT*
PACKAGE
OUTLINE 1.70 6X
0.47
0.95 2.30
1
0.65 6X
PITCH 0.40
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
DOCUMENT NUMBER: 98AON22162D Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
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1
Mouser Electronics
Authorized Distributor
ON Semiconductor:
NCP380HMU20AATBG NCP380LMU20AATBG NCP380HMU21AATBG NCP380HMU05AATBG
NCP380HMU10AATBG NCP380HMU15AATBG NCP380HMUAJAATBG NCP380HSN05AAT1G
NCP380HSN10AAT1G NCP380HSNAJAAT1G NCP380LMU05AATBG NCP380LMU10AATBG
NCP380LMU15AATBG NCP380LMUAJAATBG NCP380LSN05AAT1G NCP380LSN10AAT1G NCP380LSNAJAAT1G
NCV380LMUAJAATBG NCV380LMU15AATBG NCP380HSN05AAT2G NCV380HMUAJAATBG