Nvsu233b D4 e

NICHIA STS-DA1-5059B <Cat.No.
180619>
NICHIA CORPORATION SPECIFICATIONS FOR UV LED
NVSU233B(T)-D4
● Pb-free Reflow Soldering Application
● Built-in ESD Protection Device
● RoHS Compliant
NICHIA STS-DA1-5059B <Cat.No.180619>
SPECIFICATIONS
(1) Absolute Maximum Ratings

Item Symbol Absolute Maximum Rating Unit
Forward Current IF 1400 mA
Pulse Forward Current IFP 2000 mA
U365
Power Dissipation PD 5.88 W
Junction Temperature TJ 130 °C
U385
U395
U405
Allowable Reverse Current IR 85 mA
Operating Temperature Topr -10~85 °C
Storage Temperature Tstg -40~100 °C
* Absolute Maximum Ratings at TS=25°C.
* IFP conditions with pulse width ≤10ms and duty cycle ≤10%.
(2) Initial Electrical/Optical Characteristics

Item Symbol Condition Typ Max Unit
Forward Voltage VF IF=1000mA 3.85 - V
Radiant Flux Φe IF=1000mA 1450 - mW
U365
Peak Wavelength λp IF=1000mA 365 - nm
Spectrum Half Width Δλ IF=1000mA 9.0 - nm
U385
Spectrum Half Width Δλ IF=1000mA 11 - nm
U395
U405
Thermal Resistance RθJS - 3.9 5.7 °C/W
* Characteristics at TS=25°C.
* Radiant Flux value as per CIE 127:2007 standard.
* RθJS is the thermal resistance from the junction to the TS measurement point.
* It is recommended to operate the LEDs at a current greater than 10% of the sorting current to stabilize the LED characteristics.
1
RANKS
Item Rank Min Max Unit

H1 4.0 4.2
M 3.6 4.0
Forward Voltage V
L 3.2 3.6
K 2.8 3.2
P11d22 2060 2240
P11d21 1900 2060
P10d22 1740 1900
P10d21 1600 1740
Radiant Flux P9d22 1460 1600 mW
P9d21 1340 1460
P8d22 1230 1340
P8d21 1130 1230
P7d22 1040 1130
U405 400 410
U395 390 400
Peak Wavelength nm
U385 380 390
U365 360 370
* Ranking at TS=25°C.
* Forward Voltage Tolerance: ±0.05V
* Radiant Flux Tolerance: ±6%
* Peak Wavelength Tolerance: ±3nm
* LEDs from the above ranks will be shipped. The rank combination ratio per shipment will be decided by Nichia.
Forward Voltage Ranks by Peak Wavelength

Ranking by
Forward Voltage
K L M H1
Ranking by
Peak Wavelength
U365,U385
U395,U405
Radiant Flux Ranks by Peak Wavelength

Ranking by
Radiant Flux
P7d22 P8d21 P8d22 P9d21 P9d22 P10d21 P10d22 P11d21 P11d22
Ranking by
Peak Wavelength
U365
U385,U395
U405
2
OUTLINE DIMENSIONS
* 本製品はRoHS指令に適合しております。 NVSU233x-Dx
This product complies with RoHS Directive. 管理番号 No. STS-DA7-8202A
* 括弧で囲まれた寸法は参考値です。
(単位 Unit:±0.2)
(単位 Unit: mm, 公差 Tolerance: mm)
The dimension(s) in parentheses are for reference purposes.
(3.3)
3.5
Cathode Mark
(3.3) 0.9
3.5 2.73
項目 Item 内容 Description
パッケージ材質セラミックス
Cathode Package Materials Ceramics
Anode
レンズ材質硬質ガラス
Lens Materials Hard Glass
接着剤材質シリコーン
Adhesive Materials Silicone Adhesive
3.05
0.6
電極材質金メッキ
Electrodes Materials Au-plated
質量
Weight 0.053g(TYP)
0.8
3.05
K A
保護素子
Protection Device
3
SOLDERING
• Recommended Reflow Soldering Condition(Lead-free Solder)
1 to 5°C per sec

260°CMax
10sec Max
Pre-heat
180 to 200°C
60sec Max
Above 220°C
120sec Max
● Recommended Soldering Pad Pattern

4.1
0.6
3.5
(単位 Unit: mm)
* This LED is designed to be reflow soldered to a PCB. If dip soldered or hand soldered, Nichia will not guarantee its reliability.
* Reflow soldering must not be performed more than twice.
* When the LEDs are cooled from the peak reflow temperature, ensure that the cooling is performed very gradually to avoid
excessive stress on the LED (e.g. causing cracks in the solder joints). Ensure that sufficient preliminary verification is performed
to ensure that there are no issues with the chosen reflow soldering conditions/process.
* During reflow soldering, the heat and atmosphere in the reflow oven may cause the optical characteristics to degrade. In particular,
reflow soldering performed with an air atmosphere may have a greater negative effect on the optical characteristics than if a
nitrogen atmosphere is used; Nichia recommends using a nitrogen reflow atmosphere.
If an automatic pick and place machine is used for the LEDs, use a pick up nozzle that does not affect the lens.
Recommended conditions:
Using a nozzle specifically designed for the LEDs is recommended (See the nozzle drawing below).
* Otherwise, it may cause the wire to break causing a catastrophic failure (i.e. the LED not to illuminate).
Φ2
0.5
3
0.15
Φ3.6 A A部拡大
Φ4.6 Expansion of A (単位 Unit: mm)
4
* Repairing should not be done after the LEDs have been soldered. It should be confirmed beforehand whether the characteristics
of the LEDs will or will not be damaged by repairing.
* When soldering, do not apply stress to the LED while the LED is hot.
* When using a pick and place machine, choose an appropriate nozzle for this product.
* The soldering pad pattern above is a general recommendation for LEDs to be mounted without issues; if a high degree of precision
is required for the chosen application (i.e. high-density mounting), ensure that the soldering pad pattern is optimized.
* When flux is used, it should be a halogen free flux. Ensure that the manufacturing process is not designed in a manner where the
flux will come in contact with the LEDs.
* Ensure that there are no issues with the type and amount of solder that is being used.
5
PACKAGING - BULK
シリカゲルとともにICパックをアルミ防湿袋に入れ、熱シールにより封をします。 Nxxxxxxx
Anti-static IC packs are shipped with desiccants 管理番号 No. STS-DA7-11842
in heat-sealed moisture-proof bags.
ICパックラベル Label
anti-static IC Pack bag
シリカゲル
Desiccants
UV LED
TYPE Nxxxxxxx
*******
LOT YMxxxx-RRR
QTY. PCS
熱シール RoHS
Seal NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
警告ラベル Warning and Explanatory Labels
UV LED
・「UV LEDは紫外領域の光(UV光)を発します。」
アルミ防湿袋・「UV光は人間の目には見えませんが、
光が見えていなくてもUV光により目を傷める可能性があります。」
Moisture-proof bag ・「UV光を直接目にあてないでください。必ず適切な防具を着用してください。」
・「UV LEDを組み込んだ製品には、適切な警告表示をしてください。」
・ UV LEDs emit light in the ultraviolet region (UV light).

・ UV light is invisible and may be harmful to the human eye.
・ Do not expose the eyes directly to the UV light. Wear appropriate protective gear when handling.
・ Use appropriate warning signs/labels on devices using the UV LEDs.
アルミ防湿袋を並べて入れ、間隔にはクッション材を詰めます。
Moisture-proof bags are packed in cardboard boxes
with shock absorbing materials to fill empty spaces.
ラベル Label
UV LED
TYPE Nxxxxxxx
*******
RANK RRR
QTY. PCS
RoHS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
* 客先型名を*******で示します。
客先型名が設定されていない場合は空白です。
******* is the customer part number.
Nichia LED If not provided, it will not be indicated on the label.
* ロット表記方法についてはロット番号の項を
参照して下さい。
For details, see "LOT NUMBERING CODE"
in this document.
* 本製品はICパックに入れたのち、輸送の衝撃から保護するためダンボールで梱包します。
Products shipped in anti-static IC packs are packed in a moisture-proof bag.
They are shipped in cardboard boxes to protect them from external forces during transportation.
* 取り扱いに際して、落下させたり、強い衝撃を与えたりしますと、製品を損傷させる原因になりますので注意して下さい。
Do not drop or expose the box to external forces as it may damage the products.
* ダンボールには防水加工がされておりませんので、梱包箱が水に濡れないよう注意して下さい。
Do not expose to water. The box is not water-resistant.
* 輸送、運搬に際して弊社よりの梱包状態あるいは同等の梱包を行って下さい。
Using the original package material or equivalent in transit is recommended.
6
TAPE AND REEL DIMENSIONS
Nxxx233x
テーピング部 Tape
管理番号 No. STS-DA7-8412
1.75±0.1
8±0.1 2±0.05 4±0.1 (単位 Unit: mm)
Φ1.5+0.1
-0 0.25±0.05
3.7±0.1
Cathode Mark
5.5±0.05
12+0.3
-0.1
2.85±0.1
Φ1.5+0.2
-0
3.7±0.1 エンボスキャリアテープ
Embossed Carrier Tape
トレーラ部/リーダ部 Trailer and Leader トップカバーテープ

Top Cover Tape
引き出し方向
Feed
Direction
トレーラ部最小160mm（空部） LED装着部引き出し部最小100mm（空部）

Trailer 160mm MIN(Empty Pockets) Loaded Pockets Leader with Top Cover Tape
100mm MIN(Empty Pocket)
リーダ部最小400mm
Leader without Top Cover Tape 400mm MIN
リール部 Reel
180+0
-3
* 数量は1リールにつき 800個入りです。
13+1
-0 Reel Size: 800pcs
* 実装作業の中断などでエンボスキャリアテープをリールに巻き取る場合、
Φ
21
エンボスキャリアテープを強く(10N以上)締めないで下さい。
±
0.
LEDがカバーテープに貼り付く可能性があります。
8
When the tape is rewound due to work interruptions,

Φ60+1
-0
no more than 10N should be applied to

the embossed carrier tape.
The LEDs may stick to the top cover tape.
.2
0
13 ±
* JIS C 0806電子部品テーピングに準拠しています。
15.4±1 The tape packing method complies with JIS C 0806
Φ
ラベル
(Packaging of Electronic Components on Continuous Tapes).
Label
7
PACKAGING - TAPE & REEL
シリカゲルとともにリールをアルミ防湿袋に入れ、熱シールにより封をします。 Nxxxxxxx
Reels are shipped with desiccants in heat-sealed moisture-proof bags. 管理番号 No. STS-DA7-11776
リールラベル Label

シリカゲル
Desiccants Reel
UV LED
TYPE Nxxxxxxx
*******
LOT YMxxxx-RRR
QTY. PCS
熱シール RoHS
Seal NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
警告ラベル Warning and Explanatory Labels

アルミ防湿袋
UV LED
Moisture-proof Bag ・「UV LEDは紫外領域の光(UV光)を発します。」
・「UV光は人間の目には見えませんが、
光が見えていなくてもUV光により目を傷める可能性があります。」
・「UV光を直接目にあてないでください。必ず適切な防具を着用してください。」
・「UV LEDを組み込んだ製品には、適切な警告表示をしてください。」
・ UV LEDs emit light in the ultraviolet region (UV light).

アルミ防湿袋を並べて入れ、ダンボールで仕切ります。・ UV light is invisible and may be harmful to the human eye.
・ Do not expose the eyes directly to the UV light. Wear appropriate protective gear when handling.
Moisture-proof bags are packed in cardboard boxes ・ Use appropriate warning signs/labels on devices using the UV LEDs.
with corrugated partitions.
ラベル Label
UV LED
TYPE Nxxxxxxx
*******
RANK RRR
QTY. PCS
RoHS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
* 客先型名を*******で示します。
客先型名が設定されていない場合は空白です。
******* is the customer part number.
Nichia LED If not provided, it will not be indicated on the label.
* ロット表記方法についてはロット番号の項を
参照して下さい。
For details, see "LOT NUMBERING CODE"
in this document.
* 本製品はテーピングしたのち、輸送の衝撃から保護するためダンボールで梱包します。
Products shipped on tape and reel are packed in a moisture-proof bag.
They are shipped in cardboard boxes to protect them from external forces during transportation.
* 取り扱いに際して、落下させたり、強い衝撃を与えたりしますと、製品を損傷させる原因になりますので注意して下さい。
Do not drop or expose the box to external forces as it may damage the products.
* ダンボールには防水加工がされておりませんので、梱包箱が水に濡れないよう注意して下さい。
Do not expose to water. The box is not water-resistant.
* 輸送、運搬に際して弊社よりの梱包状態あるいは同等の梱包を行って下さい。
Using the original package material or equivalent in transit is recommended.
8
LOT NUMBERING CODE
Lot Number is presented by using the following alphanumeric code.

YMxxxx - RRR
Y - Year
Year Y
2017 H
2018 I
2019 J
2020 K
2021 L
2022 M
M - Month
Month M Month M
1 1 7 7
2 2 8 8
3 3 9 9
4 4 10 A
5 5 11 B
6 6 12 C
xxxx-Nichia's Product Number

RRR-Ranking by Wavelength, Ranking by Radiant Flux, Ranking by Forward Voltage
9
DERATING CHARACTERISTICS
NVSU233x-Dx
管理番号 No. STS-DA7-8203A
周囲温度-許容順電流特性はんだ接合部温度(アノード側)-許容順電流特性
Ambient Temperature vs Solder Temperature(Anode Side) vs
Allowable Forward Current Allowable Forward Current
Derating1 RθJA =14°C/W Derating2
1500 1500
(52, 1400)
(85, 1400)
1200 1200
Allowable Forward Current(mA)

900 900
許容順電流
許容順電流
(85, 800)
600 600
300 300
0 0
0 20 40 60 80 100 120 0 20 40 60 80 100 120
周囲温度はんだ接合部温度(アノード側)
Ambient Temperature(°C) Solder Temperature(Anode Side)(°C)
デューティー比-許容順電流特性
Duty Ratio vs
Allowable Forward Current
Duty T A =25°C
10000
2000
許容順電流
1400
1000
100
1 10 100
デューティー比
Duty Ratio(%)
10
OPTICAL CHARACTERISTICS
* 本特性は参考です。 NVSU233B-D4
All characteristics shown are for reference only and are not guaranteed. 管理番号 No. STS-DA7-12810A
発光スペクトル
Spectrum
TA =25°C
Spectrum IFP=1000mA
1.0
0.8
Relative Emission Intensity(a.u.)
0.6
相対発光強度
0.4
0.2
0.0
300 350 400 450 500 550 600
波長
Wavelength(nm)
Directivity1
指向特性
Directivity TA =25°C
IFP=1000mA
0°
-10° 10°
-20° 20°
-30° 30°
-40° 40°
-50°
50°
Radiation Angle
放射角度
-60° 60°
-70° 70°
-80° 80°
-90° 90°
1 0.5 0 0.5 1
相対放射強度
Relative Radiant Intensity(a.u.)
* 本特性はピーク波長ランクU365xに対応しています。
The graphs above show the characteristics for U365x LEDs of this product.
11
Spectrum
TA =25°C
Spectrum IFP=1000mA
1.0
0.8
0.6
相対発光強度
0.4
0.2
0.0
300 350 400 450 500 550 600
波長
Wavelength(nm)
Directivity1
指向特性
IFP=1000mA
0°
-10° 10°
-20° 20°
-30° 30°
-40° 40°
-50°
50°
Radiation Angle
放射角度
-60° 60°
-70° 70°
-80° 80°
-90° 90°
1 0.5 0 0.5 1
相対放射強度
12
Spectrum
TA =25°C
Spectrum IFP=1000mA
1.0
0.8
0.6
相対発光強度
0.4
0.2
0.0
300 350 400 450 500 550 600
波長
Wavelength(nm)
Directivity1
指向特性
IFP=1000mA
0°
-10° 10°
-20° 20°
-30° 30°
-40° 40°
-50°
50°
Radiation Angle
放射角度
-60° 60°
-70° 70°
-80° 80°
-90° 90°
1 0.5 0 0.5 1
相対放射強度
13
Spectrum
TA =25°C
Spectrum IFP=1000mA
1.0
0.8
0.6
相対発光強度
0.4
0.2
0.0
300 350 400 450 500 550 600
波長
Wavelength(nm)
Directivity1
指向特性
IFP=1000mA
0°
-10° 10°
-20° 20°
-30° 30°
-40° 40°
-50°
50°
Radiation Angle
放射角度
-60° 60°
-70° 70°
-80° 80°
-90° 90°
1 0.5 0 0.5 1
相対放射強度
14
FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS
順電圧-順電流特性周囲温度-順電圧特性
Forward Voltage vs Ambient Temperature vs
VfIf TaVf
Forward Current Forward Voltage
TA =25°C IFP=1000mA
10000 4.5
Forward Current(mA)
Forward Voltage(V)
2000 4.0
順電流
順電圧
1000
3.5
100 3.0
3.0 3.5 4.0 4.5 -60 -40 -20 0 20 40 60 80 100 120
順電圧周囲温度
Forward Voltage(V) Ambient Temperature(°C)
順電流-相対放射束特性周囲温度-相対放射束特性
Forward Current vs Ambient Temperature vs
Relative Radiant Flux
IfIv Relative Radiant Flux
TaIv
2.5 1.4
2.0
Relative Radiant Flux(a.u.)
1.2
1.5
相対放射束
相対放射束
1.0
1.0
0.8
0.5
0.0 0.6
0 500 1000 1500 2000 2500 -60 -40 -20 0 20 40 60 80 100 120
順電流周囲温度
Forward Current(mA) Ambient Temperature(°C)
15
VfIf TaVf
10000 4.5
4.0
Forward Current(mA)
Forward Voltage(V)
2000
順電流
順電圧
1000 3.5
3.0
100 2.5
2.5 3.0 3.5 4.0 4.5 -60 -40 -20 0 20 40 60 80 100 120
TaIv
2.5 1.4
2.0
1.2
1.5
相対放射束
相対放射束
1.0
1.0
0.8
0.5
0.0 0.6
0 500 1000 1500 2000 2500 -60 -40 -20 0 20 40 60 80 100 120
16
VfIf TaVf
10000 4.5
4.0
Forward Current(mA)
Forward Voltage(V)
2000
順電流
順電圧
1000 3.5
3.0
100 2.5
2.5 3.0 3.5 4.0 4.5 -60 -40 -20 0 20 40 60 80 100 120
TaIv
2.5 1.4
2.0
1.2
1.5
相対放射束
相対放射束
1.0
1.0
0.8
0.5
0.0 0.6
0 500 1000 1500 2000 2500 -60 -40 -20 0 20 40 60 80 100 120
17
VfIf TaVf
10000 4.0
Forward Current(mA)
Forward Voltage(V)
2000 3.5
順電流
順電圧
1000
3.0
100 2.5
2.5 3.0 3.5 4.0 -60 -40 -20 0 20 40 60 80 100 120
TaIv
2.5 1.4
2.0
1.2
1.5
相対放射束
相対放射束
1.0
1.0
0.8
0.5
0.0 0.6
0 500 1000 1500 2000 2500 -60 -40 -20 0 20 40 60 80 100 120
18
順電流-ピーク波長特性
Forward Current vs
Peak Wavelength
IfλD TA =25°C
371
369
Peak Wavelength(nm)
367
ピーク波長
365
363
361
359
100 1000 10000
順電流
Forward Current(mA)
周囲温度-ピーク波長特性
Ambient Temperature vs
Peak Wavelength IFP= 1000mA
TaλD
371
369
Peak Wavelength(nm)
367
ピーク波長
365
363
361
359
-60 -40 -20 0 20 40 60 80 100 120
周囲温度
Ambient Temperature(°C)
19
Forward Current vs
Peak Wavelength
IfλD TA =25°C
391
389
Peak Wavelength(nm)
387
ピーク波長
385
383
381
379
100 1000 10000
順電流
Forward Current(mA)
TaλD
391
389
Peak Wavelength(nm)
387
ピーク波長
385
383
381
379
-60 -40 -20 0 20 40 60 80 100 120
周囲温度
20
Forward Current vs
Peak Wavelength
IfλD TA =25°C
401
399
Peak Wavelength(nm)
397
ピーク波長
395
393
391
389
100 1000 10000
順電流
Forward Current(mA)
TaλD
401
399
Peak Wavelength(nm)
397
ピーク波長
395
393
391
389
-60 -40 -20 0 20 40 60 80 100 120
周囲温度
21
Forward Current vs
Peak Wavelength
IfλD TA =25°C
411
409
Peak Wavelength(nm)
407
ピーク波長
405
403
401
399
100 1000 10000
順電流
Forward Current(mA)
TaλD
411
409
Peak Wavelength(nm)
407
ピーク波長
405
403
401
399
-60 -40 -20 0 20 40 60 80 100 120
周囲温度
22
RELIABILITY
(1) Tests and Results

Failure
Reference Test Units
Test Test Conditions Criteria
Standard Duration Failed/Tested
#
Resistance to
JEITA ED-4701 Tsld=260°C, 10sec, 2reflows,
Soldering Heat #1 0/10
300 301 Precondition: 30°C, 70%RH, 168hr
(Reflow Soldering)
Thermal Shock -40°C to 100°C, 15min dwell 100cycles #1 0/10
High Temperature JEITA ED-4701
TA=100°C 1000hours #1 0/10
Storage 200 201
Low Temperature JEITA ED-4701
TA=-40°C 1000hours #1 0/10
Storage 200 202
Room Temperature
TA=25°C, IF=1400mA 1000hours #1 0/10
Operating Life
High Temperature
TA=85°C, IF=800mA 1000hours #1 0/10
Operating Life
Temperature Humidity
60°C, RH=90%, IF=1000mA 500hours #1 0/10
Operating Life
Low Temperature
TA=-10°C, IF=1000mA 1000hours #1 0/10
Operating Life
JEITA ED-4701 200m/s2, 100~2000~100Hz,
Vibration 48minutes #1 0/10
400 403 4cycles, 4min, each X, Y, Z
JEITA ED-4701 HBM, 2kV, 1.5kΩ, 100pF, 3pulses,
Electrostatic Discharges #1 0/10
300 304 alternately positive or negative
NOTES:
1) RθJA≈14.0°C/W
2) Measurements are performed after allowing the LEDs to return to room temperature.
(2) Failure Criteria

Criteria # Items Conditions Failure Criteria
Forward Voltage(VF) IF=1000mA >Initial value×1.1
#1
Radiant Flux(ΦE) IF=1000mA <Initial value×0.7
23
CAUTIONS
(1) Storage
Conditions Temperature Humidity Time
Before Opening Aluminum Bag ≤30°C ≤90%RH Within 1 Year from Delivery Date
Storage
After Opening Aluminum Bag ≤30°C ≤70%RH ≤168hours
Baking 65±5°C - ≥24hours
● The storage/packaging requirements for this LED are comparable to JEDEC Moisture Sensitivity Level (MSL) 3 or equivalent.
Nichia used IPC/JEDEC STD-020 as a reference to rate the MSL of this LED.
● This LED uses a package that could absorb moisture; if the package absorbs moisture and is exposed to heat during soldering, it
may cause the moisture to vaporize and the package to expand and the resulting pressure may cause internal delamination. This
may cause the optical characteristics to degrade. To minimize moisture absorption in storage/transit, moisture-proof aluminum
bags are used for the LEDs with a silica gel packet to absorb any air moisture in the bag. The silica gel beads turn blue to red as
they absorb moisture.
● Once the moisture-proof aluminum bag is open, ensure that the LED is soldered to a PCB within the range of the conditions above.
To store any remaining unused LEDs, use a hermetically sealed container with silica gel desiccants. Nichia recommends placing
them back to the original moisture-proof bag and reseal it.
● If the “After Opening” storage time has been exceeded or any pink silica gel beads are found, ensure that the LED are baked before
use. Baking should only be done once.
● This LED has gold-plated electrodes. If the LEDs are exposed to a corrosive environment, it may cause the plated surface to
tarnish causing issues (i.e. solderability). Ensure that when storing LEDs, a hermetically sealed container is used. Nichia
recommends placing them back to the original moisture-proof bag and reseal it.
● To prevent substances/gases from affecting the plated surface, ensure that the parts/materials used with the LEDs in the same
assembly/system do not contain sulfur (e.g. gasket/seal, adhesive, etc.). If the plating is contaminated, it may cause issues (e.g.
electric connection failures). If a gasket/seal is used, silicone rubber gaskets/seals are recommended; ensure that this use of
silicone does not result in issues (e.g. electrical connection failures) caused by low molecular weight volatile siloxane.
● To avoid condensation, the LEDs must not be stored in areas where temperature and humidity fluctuate greatly.
● Do not store the LEDs in a dusty environment.
● Do not expose the LEDs to direct sunlight and/or an environment over a long period of time where the temperature is higher than
normal room temperature.
24
(2) Directions for Use

● The circuit must be designed to ensure that the Absolute Maximum Ratings are not exceeded for each LED. The LEDs should be
operated at a constant current per LED. In the case of operating at a constant voltage, Circuit B is recommended. If Circuit A is
used, it may cause the currents flowing through the LEDs to vary due to the variation in the forward voltage characteristics of the
LEDs on the circuit.
(A) (B)
...
...
● This LED is designed to be operated at a forward current. Ensure that no voltage is applied to the LED in the forward/reverse
direction while the LED is off. If the LEDs are used in an environment where reverse voltages are applied to the LED continuously,
it may cause electrochemical migration to occur causing the LED to be damaged. When not in use for a long period of time, the
system’s power should be turned off to ensure that there are no issues/damage.
● To stabilize the LED characteristics while in use, Nichia recommends that the LEDs are operated at currents ≥ 10% of the sorting
current.
● Ensure that transient excessive voltages (e.g. lighting surge) are not applied to the LEDs.
● If the LEDs are used for outdoor applications, ensure that necessary measures are taken (e.g. protecting the LEDs from water/salt
damage and high humidity).
● Although this LED is specifically designed to emit invisible light, a small amount of light in the visible region exists in the emission
spectrum. Ensure that when using the LEDs for sensors, verification is performed to ensure that the emission spectrum is fit for
the intended use.
● If this product is stored and/or used constantly under high humidity conditions, it may accelerate the deterioration of the die; this
may cause the radiant flux to decrease. If the LEDs are stored and/or used under these conditions, sufficient verification must be
done prior to use to ensure there are no issues for the chosen application.
● Do not design this LED into applications where condensation may occur. If the LEDs are stored/operated in these environments,
it may cause issues (e.g. current leaks that cause the radiant flux to decrease).
(3) Handling Precautions

● Do not handle the LEDs with bare hands:
- this may contaminate the LED surface and have an effect on the optical characteristics,
- this may cause the LED to deform and/or the wire to break causing a catastrophic failure (i.e. the LED not to illuminate).
● When handling the product with tweezers, be careful not to apply excessive force to the glass. Otherwise, The glass can be cut,
chipped, delaminate or deformed, causing wire-bond breaks and catastrophic failures.
● Dropping may cause damage to the LED (e.g. deformation).
● Do not stack assembled PCBs together. Otherwise, it may cause damage to the glass cover (e.g. cut, scratch, chip, crack,
delamination and deformation) and the wire to break causing a catastrophic failure (i.e. the LED not to illuminate).
25
(4) Design Consideration

● To operate the LEDs, using a copper-core PCB is recommended; this may cause issues (e.g. cracks in the glass cover/solder joints
due to thermal stress) depending on the reflow soldering conditions. Ensure that sufficient verification is performed prior to use
to ensure that there are no issues with the PCB/soldering conditions for the chosen application.
● If the LEDs are soldered to a PCB and the PCB assembly is bent (e.g. PCB depaneling process), it may cause the LED package to
break. The PCB layout should be designed to minimize the mechanical stress on the LEDs when the PCB assembly is bent/warped.
● The amount of mechanical stress exerted on the LED from depaneling may vary depending on the LED position/orientation on the
PCB assembly (e.g. especially in areas near V-groove scores). The PCB layout should be designed to minimize the mechanical
stress on the LEDs when the PCB is separated into individual PCB assemblies.
● To separate a PCB populated with the LEDs, use a specially designed tool. Do not break the PCB by hand.
● If an aluminum-core PCB is used to operate the LEDs, it may cause thermal stress during operation causing damage to the solder
joints (e.g. crack). Ensure that sufficient verification is performed prior to use.
● Volatile organic compounds that have been released from materials present around the LEDs (e.g. housing, gasket/seal, adhesive,
secondary lens, lens cover, thermal grease, etc.) may adhere to the LED glass cover and other areas (e.g. package). If the LEDs
are being used in a hermetically sealed environment, these volatile compounds can discolor after being exposed to heat and/or
photon energy and it may greatly reduce the LED light output. In this case, ventilating the environment may improve the
reduction in light output. Perform a light-up test of the chosen application for optical evaluation to ensure that there are no issues.
(5) Electrostatic Discharge (ESD)

● This LED is sensitive to transient excessive voltages (e.g. ESD, lightning surge). If this excessive voltage occurs in the circuit, it
may cause the LED to be damaged causing issues (e.g. the LED to have a reduction in the radiant flux or not to illuminate [i.e.
catastrophic failure]).
Ensure that when handling the LEDs, necessary measures are taken to protect them from an ESD discharge. The following
examples are recommended measures to eliminate the charge:
- Grounded wrist strap, ESD footwear, clothes, and floors
- Grounded workstation equipment and tools
- ESD table/shelf mat made of conductive materials
● Ensure that all necessary measures are taken to prevent the LEDs from being exposed to transient excessive voltages (e.g. ESD,
lightning surge):
- tools, jigs, and machines that are used are properly grounded
- appropriate ESD materials/equipment are used in the work area
- the system/assembly is designed to provide ESD protection for the LEDs
● If the tool/equipment used is an insulator (e.g. glass cover, plastic, etc.), ensure that necessary measures have been taken to
protect the LED from transient excessive voltages (e.g. ESD). The following examples are recommended measures to eliminate
the charge:
- Dissipating static charge with conductive materials
- Preventing charge generation with moisture
- Neutralizing the charge with ionizers
● To detect if an LED was damaged by transient excess voltages (i.e. an ESD event during the system’s assembly process), perform
a characteristics inspection (e.g. forward voltage measurement) at low current (≤1mA).
● Failure Criteria: VF<2.0V at IF=0.5mA
If the LED is damaged by transient excess voltages (e.g. ESD), it will cause the Forward Voltage (VF) to decrease.
26
(6) Thermal Management

● The Absolute Maximum Junction Temperature (TJ) must not be exceeded under any circumstances. The increase in the
temperature of an LED while in operation may vary depending on the PCB thermal resistance and the density of LEDs on the PCB
assembly. Ensure that when using the LEDs for the chosen application, heat is not concentrated in an area and properly managed
in the system/assembly.
● The operating current should be determined by considering the temperature conditions surrounding the LED (i.e. TA). Ensure that
when operating the LED, proper measures are taken to dissipate the heat.
● The following two equations can be used to calculate the LED junction temperature:
1) TJ=TA+RθJA･W 2) TJ=TS+RθJS･W
*TJ=LED Junction Temperature: °C
TA=Ambient Temperature: °C
TS=Soldering Temperature (Anode Side): °C
RθJA=Thermal Resistance from Junction to Ambient: °C/W
RθJS=Thermal Resistance from Junction to TS Measurement Point: °C/W
W=Input Power(IF×VF): W
Anode Cathode
TS Measurement Point
(7) Cleaning
● Do not clean the LEDs. If the LED is cleaned, it may cause damage to the package/glass cover causing issues; ensure that if the
LEDs are cleaned, sufficient verification is performed prior to use. Additionally, ensure that the solvent being used does not cause
any other issues (e.g. CFC-based solvents are heavily regulated).
● Do not clean the LEDs with an ultrasonic cleaner. If cleaning must be done, ensure that sufficient verification is performed by using
a finished assembly with LEDs to determine cleaning conditions (e.g. ultrasonic power, LED position on the PCB assembly) that do
not cause an issue.
(8) Eye Safety

● There may be two important international specifications that should be noted for safe use of the LEDs: IEC 62471:2006
Photobiological safety of lamps and lamp systems and IEC 60825-1:2001 (i.e. Edition 1.2) Safety of Laser Products - Part 1:
Equipment Classification and Requirements. Ensure that when using the LEDs, there are no issues with the following points:
- LEDs have been removed from the scope of IEC 60825-1 since IEC 60825-1:2007 (i.e. Edition 2.0) was published. However,
depending on the country/region, there are cases where the requirements of the IEC 60825-1:2001 specifications or
equivalent must be adhered to.
- LEDs have been included in the scope of IEC 62471:2006 since the release of the specification in 2006.
- Most Nichia LEDs will be classified as the Exempt Group or Risk Group 1 according to IEC 62471:2006. However, in the case
of high-power LEDs containing blue wavelengths in the emission spectrum, there are LEDs that will be classified as Risk
Group 2 depending on the characteristics (e.g. radiation flux, emission spectrum, directivity, etc.)
- If the LED is used in a manner that produces an increased output or with an optic to collimate the light from the LED, it may
cause damage to the human eye.
● If an LED is operated in a manner that emits a flashing light, it may cause health issues (e.g. visual stimuli causing eye discomfort).
The system should be designed to ensure that there are no harmful effects on the human body.
● This LED emits light in the ultraviolet (UV) region. The UV light from an LED while in operation is intense and harmful; if human
eyes are exposed to this light, it may cause damage to them. Do not look directly or indirectly (e.g. through an optic) at the UV
light. Ensure that if there is a possibility that the UV light reflects off objects and enters the eyes, appropriate protection gear (e.g.
goggles) is used to prevent the eyes from being exposed to the light.
● Ensure that appropriate warning signs/labels are provided both on each of the systems/applications using the UV LEDs, in all
necessary documents (e.g. specification, manual, catalogs, etc.), and on the packaging materials.
27
(9) Miscellaneous
● Nichia warrants that the discrete LEDs will meet the requirements/criteria as detailed in the Reliability section within this
specification. If the LEDs are used under conditions/environments deviating from or inconsistent with those described in this
specification, the resulting damage and/or injuries will not be covered by this warranty.
● Nichia warrants that the discrete LEDs manufactured and/or supplied by Nichia will meet the requirements/criteria as detailed in
the Reliability section within this specification; it is the customer’s responsibility to perform sufficient verification prior to use to
ensure that the lifetime and other quality characteristics required for the intended use are met.
● The applicable warranty period is one year from the date that the LED is delivered. In the case of any incident that appears to be
in breach of this warranty, the local Nichia sales representative should be notified to discuss instructions on how to proceed while
ensuring that the LED in question is not disassembled or removed from the PCB if it has been attached to the PCB. If a breach of
this warranty is proved, Nichia will provide the replacement for the non-conforming LED or an equivalent item at Nichia’s
discretion. FOREGOING ARE THE EXCLUSIVE REMEDIES AVAILABLE TO THE CUSTOMER IN RESPECT OF THE BREACH OF THE
WARRANTY CONTAINED HEREIN, AND IN NO EVENT SHALL NICHIA BE RESPONSIBLE FOR ANY INDRECT, INCIDENTAL OR
CONSEQUENTIAL LOSSES AND/OR EXPENSES (INCLUDING LOSS OF PROFIT) THAT MAY BE SUFFERED BY THE CUSTOMER
ARISING OUT OF A BREACH OF THE WARRANTY.
● NICHIA DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, INCLUDING THE IMPLIED WARRANTIES OF
MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE.
● This LED is intended to be used for general lighting, household appliances, electronic devices (e.g. mobile communication
devices); it is not designed or manufactured for use in applications that require safety critical functions (e.g. aircraft, automobiles,
combustion equipment, life support systems, nuclear reactor control system, safety devices, spacecraft, submarine repeaters,
traffic control equipment, trains, vessels, etc.). If the LEDs are planned to be used for these applications, unless otherwise
detailed in the specification, Nichia will neither guarantee that the LED is fit for that purpose nor be responsible for any resulting
property damage, injuries and/or loss of life/health. This LED does not comply with ISO/TS 16949 and is not intended for
automotive applications.
● The customer will not reverse engineer, disassemble or otherwise attempt to extract knowledge/design information from the LED.
● All copyrights and other intellectual property rights in this specification in any form are reserved by Nichia or the right holders who
have granted Nichia permission to use the content. Without prior written permission from Nichia, no part of this specification may
be reproduced in any form or by any means.
● Both the customer and Nichia will agree on the official specifications for the supplied LEDs before any programs are officially
launched. Without this agreement in writing (i.e. Customer Specific Specification), changes to the content of this specification
may occur without notice (e.g. changes to the foregoing specifications and appearance, discontinuation of the LEDs, etc.).
28

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NICHIA STS-DA1-5059B <Cat.No.

NICHIA CORPORATION SPECIFICATIONS FOR UV LED

(1) Absolute Maximum Ratings

(2) Initial Electrical/Optical Characteristics

Item Rank Min Max Unit

Forward Voltage Ranks by Peak Wavelength

Radiant Flux Ranks by Peak Wavelength

• Recommended Reflow Soldering Condition(Lead-free Solder)

1 to 5°C per sec

● Recommended Soldering Pad Pattern

(単位 Unit: mm)

警告ラベル Warning and Explanatory Labels

・ UV LEDs emit light in the ultraviolet region (UV light).

TAPE AND REEL DIMENSIONS

トレーラ部/リーダ部 Trailer and Leader トップカバーテープ

トレーラ部最小160mm（空部） LED装着部 引き出し部最小100mm（空部）

When the tape is rewound due to work interruptions,

no more than 10N should be applied to

PACKAGING - TAPE & REEL

リール ラベル Label

警告ラベル Warning and Explanatory Labels

・ UV LEDs emit light in the ultraviolet region (UV light).

LOT NUMBERING CODE

Lot Number is presented by using the following alphanumeric code.

xxxx-Nichia's Product Number

Allowable Forward Current(mA)

FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS

FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS

FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS

FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS

FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS

FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS

FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS

FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS

(1) Tests and Results

(2) Failure Criteria

(2) Directions for Use

(3) Handling Precautions

(4) Design Consideration

(5) Electrostatic Discharge (ESD)

(6) Thermal Management

(8) Eye Safety

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トレーラ部最小160mm（空部） LED装着部引き出し部最小100mm（空部）

リールラベル Label