JCOP V2.4.

1
JCOP V2.4.1 secure smart card controller
Rev. 3.2 — 2 September 2009 Product short specification
167532 CONFIDENTIAL

1. General description
NXP Semiconductors offers a Java Card Open Platform operating system called
JCOP V2.4.1 based on independent, third party specifications, i.e. by Sun Microsystems,
the Global Platform consortium, the International Organization for Standards (ISO), EMV
(Europay, MasterCard and VISA) and others. JCOP V2.4.1 family based on the SmartMX
family which is manufactured in most advanced CMOS 0.14 μm 5 metal layer technology
is positioned to service high volume, single- and multi-application markets such as
eGovernment e.g. Smart Passport, banking/finance, mobile communications, public
transportation, pay TV, conditional access, network access and digital rights
management.

The Java Card, GlobalPlatform, EMV and ISO industry standards together ensure
application interpretability for card issuers as well as application providers. By adhering
not just to the standards themselves, but also to their spirit as evidenced in numerous
heritage applications, JCOP V2.4.1 ensures large interpretability with third party applets
as well as all existing smart card infrastructures. With JCOP V2.4.1 the promise of
multi-sourcing any component in smart card solutions becomes true. Even in existing
infrastructures, JCOP V2.4.1 equipped with proper applications can substitute any
existing smart card.

Within its targeted segments, the new JCOP V2.4.1 platform on SmartMX is the most
advanced solution available. It is combining standard interfaces as defined in Java
Card 2.2.2 (see Ref. 1), GlobalPlatform Card Specification 2.1.1 (see Ref. 2) and powerful
cryptographic capabilities by using co-processors for public and secret key encryption
supporting RSA, ECC and Triple-DES, within the high security, ultra low power,
performance optimized design concept of NXP Semiconductors' handshaking technology.
The platform supports class “C”, “B” and “A” voltage ranges (1.62 to 5.5 V) as required by
application standards such as 3G Mobile Communication (3GPP) and the credit/debit
card standard (EMV).

For further details on JCOP V2.4.1 platform features and specifications supported by this
product refer to Section 3.

For more detailed information refer to following documentation1:

• Administrator manual, JCOP V2.4.1, Doc.No. 1495xx2
• User manual, JCOP V2.4.1, Doc.No. 1496xx
• Hardware data sheet, JCOP V2.4.1, Doc.No. 1497xx

1. These documents are available under NDA

2. where XX refers to the last version; e.g. 10 refers to version 1.0
NXP Semiconductors JCOP V2.4.1
JCOP V2.4.1 secure smart card controller
CONFIDENTIAL

The Administrator manual describes JCOP for the administrator of a JCOP card or secure
element. This means it explains the pre-personalisation process and its specific
commands.

The User manual describes JCOP for the applet developer. It outlines the features
available through the Java Card API. Also it explains any additional functionality at the
Java layer. Also, this User manual contains the information on how to order JCOP
products

The Hardware data sheet explains the details of the JCOP product from a hardware point
of view. This means it gives figures like pinning diagram and power consumption.

2. Block diagram
Application

MIFARE
Applets
layer

Applet 1 Applet 2 Applet n (Multi-)

Application
[3]

Industry specific extensions

Card operation system layer

Framework classes APIs

Installer (GlobalPlatform 2.1 API, MIFARE API
(Java Card 2.2.2 APIs)
Environment 2.2.2 [1]
Java Card Runtime

and SEED API)

MIFARE
JCOP V2.4.1

1 KB/4 KB
System classes emulation[3]
(incl. MIFARE
Applet Transaction I/O Network Other Security)
management management communication services

Java Card Virtual Machine Native methods

(JCVM) MIFARE
T=0 T=1 T = CL protocol
[3]
platform SmartMX

Memory A
Hardware layer

Triple-DES PKI MIFARE

Management C
co-processor co-processor Secure_MX51 RAM ROM EEPROM hardware[3]
Unit M
FameXE CPU
(MMU)
[2]

Contact interface Contactless interface

(ISO/IEC 7816-3) (ISO/IEC 14443-3A)

VDD RST_N CLK VSS IO1 LA LB

(1) For more details see Ref. 13 Figure 3.4 page 36

(2) ACM = Access Condition Matrix (MIFARE Firewall)
(3) depends on configuration of JCOP V2.4.1 (A, B1 or B4):
MIFARE (Multi-) Application may be standardized applications with MIFARE application directory or other MIFARE applications.
Fig 1. Block diagram of all JCOP V2.4.1 products

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NXP Semiconductors JCOP V2.4.1
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3. Specifications supported with JCOP V2.4.1

3.1 Java Card

JCOP V2.4.1 meets Java Card specification V2.2.2 as defined in Ref. 1.

3.2 GlobalPlatform
JCOP V2.4.1 meets Global Platform specification as defined in Ref. 2 and Ref. 3.

3.3 Supported eGovernment specifications and applications

In order to provide extensive support for the eGovernment applications (electronic
passports, electronic identification cards), JCOP V2.4.1 is prepared to meet a wide range
of relevant specifications. Several applet providers worldwide are developing and testing
following applications on JCOP V2.4.1:

• BAC, Basic Access Control according to ICAO 9303 (see Ref. 10 and Ref. 11)
• EAC, Extended Access Control according to BSI TR03110 V1.1 (see Ref. 12)
• Fingerprint Biometric Matching on Card
• Digital Signature according to PKCS#11, IEC/CEN 14980
• European Citizen Card based on IEC/CEN 15480
• Various eID applications based on national specifications

In order to increase performance of the applications where retrieval of large data sets has
to be completed as fast as possible, NXP Semiconductors is introducing BAC Accelerator
API. For more details refer to JCOP V2.4.1 Administrator and User manual.

3.4 Supported banking specifications

Following sections give general information about support of banking specifications
provided with JCOP V2.4.1. Note that full support of these specifications is only possible
with the applet performing specific banking operations.

3.4.1 VISA International

Visa GlobalPlatform Card 2.1.1 Implementation Requirements Version 2.0 as defined in
Ref. 4 with specific product configurations described in Ref. 5, including support for
OpenPlatform 2.0.1 backwards compatibility and its relevant secure messaging methods.

Contactless communication is supported according to the Visa contactless Payment

Specification Version 2.0.2 which includes Additions and Clarifications v3.0.

3.4.2 EMV
EMV contactless communication is supported as defined in Ref. 5, Ref. 6, Ref. 7, Ref. 8
and Ref. 9. JCOP V2.4.1 supports all relevant security guidelines for the implementation
of EMV applets

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NXP Semiconductors JCOP V2.4.1
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3.5 Specifications for transportation and ticketing

JCOP V2.4.1 is prepared to meet various specifications for transportation and ticketing.
Configurations with MIFARE emulation with 1 KB or 4 KB EEPROM space provide
support for the classic MIFARE ticketing operations.

Additionally, in combination with applets running under JCOP V2.4.1, the operating
system ensures flexible support for different authentication mechanisms and
implementations of payment options in combination with the eGovernment and banking
applets.

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4. Additional JCOP V2.4.1 features

4.1 JCOPX - Additional Application Programming Interface (APIs)

features
JCOP V2.4.1 provides extended support for several industry specific requirements. This
support is given with the JCOPX API that comprises following functionality:
„ BAC Accelerator API for secure messaging performance increase
„ Extended cryptography support (several algorithms and methods not specified in Java
Card v2.2.2 (see Ref. 1)
„ UID options (single [fixed or random] or double UID support) according
ISO/IEC 14443-3A

More details about the JCOPX API can be found in JCOP V2.4.1 User Manual.

4.2 MIFARE emulation features

JCOP V2.4.1 provides full support for the MIFARE functionality. JCOP V2.4.1 is available
in 3 different configurations:
„ Configuration A - no support for MIFARE functionality.
„ Configuration B1 - 1 KB MIFARE functionality is supported according to the Java Card
specification v2.2.2 (see Ref. 1)
„ Configuration B4 - 4 KB MIFARE functionality is based on the same specification with
possibility to use up to 255 sectors.

4.3 Extended Length APDU support

„ Extended Length APDUs are support for protocols T=1 and T=CL. For T=0 only short
APDUs are supported. APDU buffer length is given in Table 1.

4.4 Security features

JCOP V2.4.1 includes extensive support for security applications based on following
features:
„ Support for Triple-DES co-processor
„ AES cryptography based on SmartMX AES cryptographic co-processor
„ RSA support for the key lengths up to 2048 bit
„ Elliptic Curve Cryptography with key lengths up to 320 bit
„ SHA1, SHA-224 and SHA-256
„ Support for SEED algorithm
„ Support for MD5
„ On-Card Key generation
„ CRC calculations
„ Data Authentication Pattern (DAP) for the Supplementary Security Domains

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5. Supported interfaces
JCOP V2.4.1 supports following communication interfaces
„ Contact mode: T=0 and T=1 according to ISO/IEC 7816 with 3.5712 MHz following
communication speeds are supported:
‹ 9600 bit/s [default]
‹ 19200 bit/s
‹ 38400 bit/s
‹ 57600 bit/s
‹ 115200 bit/s
‹ 223200 bit/s
„ Contactless mode: T=CL according to ISO/IEC 14443 Type A with following
communication speeds.
‹ 106 kbit/s
‹ 212 kbit/s
‹ 424 kbit/s

6. Memory

6.1 Available memory space

In configuration B1 and B4 with JCOP and MIFARE two different operating system modes
are available on one device:

Table 1. Memory Maps for different configurations

Product Config Transient Heap Persistent Heap Free ROM for APDU Buffer
type (RAM) (EEPROM) Applets
J2A080 - 2406 bytes 76896 bytes 76208 bytes 1462 bytes
A 2406 bytes 76896 bytes
J3A080 B1 75872 bytes 76208 bytes 1462 bytes
2278 bytes
B4 72800 bytes
J2A040 - 2406 bytes 35940 bytes 76208 bytes 1462 bytes
A 2406 bytes 35940 bytes
J3A040 B1 34916 bytes 76208 bytes 1462 bytes
2278 bytes
B4 31844 bytes

6.2 Garbage collection

Garbage collection is fully implemented in JCOP V2.4.1; deleted objects, applets, and
packages are fully reclaimed (incl. compactification) and the space can be used for other
purposes after deletion.

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7. Supported hardware platforms

JCOP V2.4.1 runs on the following HW platforms:

• NXP Semiconductors SmartMX P5CD080V0B (J3A080)

• NXP Semiconductors SmartMX P5CD040V0B (J3A040)
• NXP Semiconductors SmartMX P5CC080V0B (J2A080)
• NXP Semiconductors SmartMX P5CC040V0B (J2A040)

With this HW platform it is possible to have products in contactless or dual interface mode.

• contactless package (NXP Semiconductors MOB6, MOB4) for all J3 products

• dual interface (NXP Semiconductors PDM1.1) for all J3 products
• contact (NXP Semiconductors PCM1.1) for all J2 products
Wafers with particular JCOP V2.4.1 configuration (A, B1, B4, contact or dual interface)
and other packages (i.e. SMD, HVQN) can be created and delivered on specific customer
request. For more information refer to Section 8.

8. Ordering information

8.1 JCOP V2.4.1 naming conventions

The following table explains the naming conventions of the commercial product name of
the JCOP V2.4.1 products. Every JCOP V2.4.1 product gets assigned such a commercial
name, which includes also customer and application specific data. This table does not
give any information about which commercial products are Common Criteria certified.

The JCOP V2.4.1 commercial names have the following format.

Jabcccxdd(d)/mvsrrffo

The ’J’ is a constant, all other letters are variables, which are explained in the following
Table 2.

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Table 2. JCOP Commercial Name Format

Variable Meaning Example Parameter settings
Values
a Hardware Type 1 SC hardware (no PKI, no contactless interface)
2 CC hardware (no contactless interface)
3 CD hardware
b JCOP version A JCOP V2.4.1 on one of:
• P5CD080V0B
• P5CC080V0B
• P5CD040V0B
• P5CC040V0B
ccc EEPROM size in KB 080 80 KB EEPROM
040 40 KB EEPROM
x JCOP type G Generic
C Customized
others others are possible and are application
dependent
dd(d) Delivery type UA 150um sawn wafer, inkless
UE 75um sawn wafer, inkless
X0 PDM module
X1 PDM 1.1 plug-in module
A4 MOB4
A6 MOB6
others other delivery forms
m Manufacturing Site Code T
v Silicon Version Code 0
s Silicon Version Subcode B
rr ROM Code ID
ff FabKey ID
o Option 0 Config A (No MIFARE)
1 Config B1 (MIFARE 1K)
4 Config B4 (MIFARE 4K)

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8.2 Ordering JCOP V2.4.1 products and support items

8.2.1 JCOP V2.4.1 product configurations

With the explanation given in the Section 8.1 following product type name configurations
could be available from NXP Semiconductors:

Table 3. Ordering information of JCOP V2.4.1

Type number[1][2] Package
Name Description Version
J3A080xA4/... MOB4 plastic leadless module carrier package; 35 mm wide tape SOT500-2
J3A080xA6/... MOB6 plastic leadless module carrier package; 35 mm wide tape SOT500-3
J3A080xX0/... PDM1.1 contactless chip card module (super 35 mm format, 8-contact) SOT658
J3A080xX1/... PDM1.1 contactless chip card module (Plug-in type; super 35 mm format, 8-contact) SOT658
J3A080xUA/... FFC 8 inch wafer (sawn; 150 μm thickness; on film frame carrier; electronic fail
die marking according to SECSII format)
J3A080xUE/... FFC 8 inch wafer (sawn; 75 μm thickness; on film frame carrier; electronic fail die
marking according to SECSII format)
J3A080xAi/... Inlay (index i contains capital character [A-Z])
J3A040xA4/... MOB4 plastic leadless module carrier package; 35 mm wide tape SOT500-2
J3A040xA6/... MOB6 plastic leadless module carrier package; 35 mm wide tape SOT500-3
J3A040xX0/... PDM1.1 contactless chip card module (super 35 mm format, 8-contact) SOT658
J3A040xX1/... PDM1.1 contactless chip card module (Plug-in type; super 35 mm format, 8-contact) SOT658
J3A040xUA/... FFC 8 inch wafer (sawn; 150 μm thickness; on film frame carrier; electronic fail
die marking according to SECSII format)
J3A040xUE/... FFC 8 inch wafer (sawn; 75 μm thickness; on film frame carrier; electronic fail die
marking according to SECSII format)
J3A040xAi/... Inlay (index i contains capital character [A-Z])
J2A080xX0/... PCM1.1 PCM1.1 module (PST)
J2A080xXK/... PCM1.1 PCM1.1 module (NedCard)
J2A080xXS/... PCM1.1 PCM1.1 module (dual source)
J2A080xUA/... FFC 8 inch wafer (sawn; 150 μm thickness; on film frame carrier; electronic fail
die marking according to SECSII format)
J2A080xTS/... SSOP20 SSOP20 package
J2A040xX0/... PCM1.1 PCM1.1 module (PST)
J2A040xXK/... PCM1.1 PCM1.1 module (NedCard)
J2A040xXS/... PCM1.1 PCM1.1 module (dual source)
J2A040xUA/... FFC 8 inch wafer (sawn; 150 μm thickness; on film frame carrier; electronic fail
die marking according to SECSII format)
J2A040xTS/... SSOP20 SSOP20 package

[1] Refer also to JCOP v2.4.1 Administrator manual, Section 8 “Customer's type submission by using Order Entry Form”.
[2] x = G, C, or other according the COP V2.4.1 type classification see the JCOP v2.4.1 Administrator manual.

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8.2.2 Available JCOP V2.4.1 products

Table 4. JCOP V2.4.1 product overview
Product type Java Global VGP Appl. MIFARE Interface and protocols IC EEPROM
Card Platform config. backward [KB][2]
1, 2, 3 compatible ISO/ ISO/ NFC USB
VGP 2.0.1’[1] IEC 7816 IEC 14443A S2C 2.0
T=0, T=1 T=CL
J3A080 2.2.2 2.1.1 3 yes yes yes yes no no 80
J2A080 2.2.2 2.1.1 3 yes no yes no no no 80
J3A040 2.2.2 2.1.1 3 yes yes yes yes no no 40
J2A040 2.2.2 2.1.1 3 yes no yes no no no 40

[1] To configure JCOP V2.4.1 to be application backward compatible contact NXP Semiconductors Customer Application Support (CAS)
[2] Further information on available EEPROM size for each product refer to the Section 6.1

Table 5. JCOP V2.4.1 product feature map

Product type Cryptographic features Additional features
AES Triple- RSA ECC On Card SHA1 MD5 SEED CRC Global MSD/ Applet MIFARE
DES [bit] GF(p) Key Gen. PIN DAP loading API
[bit]
J3A080 yes yes 2048 320 yes yes yes yes yes yes yes yes yes
J2A080 yes yes 2048 320 yes yes yes yes yes yes yes yes no
J3A040 yes yes 2048 320 yes yes yes yes yes yes yes yes yes
J2A040 yes yes 2048 320 yes yes yes yes yes yes yes yes no

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8.3 Ordering JCOP V2.4.1 samples

It is possible to order samples in following delivery types from NXP Semiconductors.

1. MOB4 contactless modules

2. MOB6 contactless modules
3. PDM1.1 dual interface modules (standard and plug-in type with contacts on C4 and
C8)
4. Contactless and dual interface white cards
5. Contactless and dual interface printed cards (NXP Semiconductors layout)
6. (On request) wafers with specific JCOP v2.4.1 configuration based on HW platform
(see Section 7 “Supported hardware platforms”)

Note that NXP Semiconductors can provide up to 50 modules and up to 5 cards free of
charge. Larger quantities have to be ordered separately. Valid NDA has to be in place
before samples are shipped.

Contact your local NXP Semiconductors representative for further information.

8.4 Ordering generic JCOP V2.4.1 products

8.4.1 Ordering generic products from NXP Semiconductors stock

NXP Semiconductors has created several generic product types that are available for
ordering. Delivery types 1, 2, 3 and 6 (see Section 8.3) are available for such ordering.

All products ordered from NXP Semiconductors Stock will have same product type, 12NC
number, transport and authentication key.

Contact your local NXP Semiconductors representative for further information.

8.4.2 Ordering generic products through Order Entry Form

In the cases where customer specific product type, 12NC number, transport and
authentication key are desired, customer will have to fill NXP Semiconductors Order Entry
Form for JCOP V2.4.1 product.

Contact your local NXP Semiconductors representative for further information on OEF
availability.

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8.5 Ordering JCOP V2.4.1 custom products

8.5.1 Ordering custom products created by NXP Semiconductors

For the customer convenience, NXP has created JCOP V2.4.1 Custom ROM masks that
already contain applets supporting eGovernment applications.

Contact your local NXP Semiconductors representative for further information.

8.5.2 Creating and ordering custom products with customer applets in the ROM
mask
It is possible to include customer applets in the free ROM space of the JCOP V2.4.1.
Customer will have to prepare, test and verify applet functionality on the generic
JCOP V2.4.1 sample.

Product type creation and submission of the applet is enabled through the NXP
Semiconductors Order Entry Form for JCOP V2.4.1.

Contact your local NXP Semiconductors representative for further information on OEF
availability.

8.6 Ordering JCOP V2.4.1 support items

8.6.1 JCOP V2.4.1 transport and authentication keys

Pre-personalization phase for the JCOP V2.4.1 products is possible only with the
Transport Key.

Authentication key can be used for verification of the JCOP V2.4.1 authenticity during the
pre-personalization.

Customer will need at least the Transport Key for not pre-personalized samples of
JCOP V2.4.1.

More details about transport and authentication key and information how to order them
can be found in JCOP V2.4.1 User Manual.

8.6.2 JCOP V2.4.1 tools

JCOP tools provide integrated development environment (IDE) based on the ECLIPSE
framework and specific JCOP product family through the JCOP tools plug-in.

Contact your local NXP Semiconductors representative for further information on

JCOP V2.4.1 tools (plug-in) availability.

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9. Security certifications
Following security certificates apply for JCOP V2.4.1

• For the underlying HW platforms (see Section 7 “Supported hardware platforms”):

CC EAL5+
• For the JCOP V2.4.1 Card Operating System: CC EAL 5+
All JCOP V2.4.1 products are prepared for composite security evaluation and certification
of the customer applets. Note that NXP Semiconductors does not perform any security
certification for applets running on the JCOP V2.4.1.

Contact your local NXP Semiconductors representative for further information on

JCOP V2.4.1 certification.

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10. Abbreviations
Table 6. Abbreviations JCOP
Acronym Description
ACM Access Condition Matrix
APDU Application Protocol Data Unit as defined in ISO/IEC 7816
CRC Cyclic redundancy check
DES Data Encryption Standard
EEPROM Electrically Erasable Programmable Read Only Memory
KB 1024 bytes
RAM Random Access Memory
ROM Read Only Memory

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11. References
[1] Sun Microsystems: Java Card 2.2.1 http://java.sun.com/products/javacard
[2] Global Platform Consortium: GlobalPlatform Card Specification 2.1.1, March 2003
http://www.globalplatform.org/
[3] GlobalPlatform Consortium: GlobalPlatform; Card Specification 2.1.1 Amendment A,
March 2004
[4] Visa International: Visa GlobalPlatform 2.1.1 Card Implementation Requirements
Version 2.0; Effective: July 2007
[5] Visa GlobalPlatform 2.1.1 Card Implementation Requirements Configuration 1, 2
and 3 (“VGPCIR 1", “VGPCIR 2", “VGPCIR3”) version 1.0 dated May 2003
[6] EMV Contactless Communication Protocol Specification - V2.0, August 2007
[7] EMV Contactless Communication Protocol Specification V2.0, List of Changes,
August 03, 2007
[8] EMVCo Contactless Communication Protocol Specification replaces the PayPass -
ISO/IEC 14443 Application Note #4, March 31, 2006
[9] PayPass - ISO/IEC 14443 Implementation Specification, Version 1.1 - March 31,
2006
[10] Machine Readable Travel Documents Technical Report, Development of a Logical
Data Structure - LDS, For Optional Capacity Expansion Technologies, Revision -1.7,
published by authority of the secretary general, International Civil Aviation
Organization, LDS 1.7, 2004-05-18
[11] Machine Readable Passport - Volume 2 Specifications for Electronically Enabled
Passports with Biometric Identification Capabilities, Sixth edition, published by
authority of the secretary general, International Civil Aviation Organization, 2006
[12] German Federal Office for Information Security (BSI): “Technical Guideline
TR03110: Advanced Security Mechanisms for Machine Readable Travel Documents
- Extended Access Control (EAC)”, Version 1.1
[13] Java CardTM Technology for Smart Cards, Zhiqun Chen, ISBN 0-201-70329-7

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12. Revision history

Table 7. Revision history
Document ID Release date Data sheet status Change notice Supersedes
167532 2 September 2009 Product short specification 167531
Modifications: • Section 1 “General description” on page 1: corrected in third paragraph References: (see
Section 3.1) -> “Ref. 1” and (see Section 3.2) -> “Ref. 2”
• Figure 1 “Block diagram of all JCOP V2.4.1 products” on page 2: corrected in Figure note 1
Ref. 17> “Ref. 13”
• Section 3.1 “Java Card” on page 3: added Ref. 1
• Section 3.2 “GlobalPlatform” on page 3: rewording
• Section 3.3 “Supported eGovernment specifications and applications” on page 3: renamed
section title and rewording
• Section 3.4.1 “VISA International” on page 3: rewording
• Section 3.4.2 “EMV” on page 3: rewording
• Section 4.1 “JCOPX - Additional Application Programming Interface (APIs) features” on page
5: rewording
• Section 4.2 “MIFARE emulation features” on page 5: added in “Configuration B1 ....see Ref. 1”
• Section 4.3 “Extended Length APDU support” on page 5: added paragraph “APDU buffer ....”
• Table 1 “Memory Maps for different configurations” on page 6: update
• Section 7 “Supported hardware platforms” on page 7: rewording
• Table 2 “JCOP Commercial Name Format” on page 8: update
• Table 3 “Ordering information of JCOP V2.4.1” on page 9: update
• Table 4 “JCOP V2.4.1 product overview” on page 10: update
• Table 5 “JCOP V2.4.1 product feature map” on page 10: update
• Section 8.3 “Ordering JCOP V2.4.1 samples” on page 11: added new bullet paragraph “(On
request) wafers...”
• Section 8.5.1 “Ordering custom products created by NXP Semiconductors” on page 12: added
new section
• Section 8.5.2 “Creating and ordering custom products with customer applets in the ROM
mask” on page 12: added new section
• Section 9 “Security certifications” on page 13: rewording
• Section 11 “References” on page 15: update
167531 18 December 2008 Product short specification 167530
Modifications: • Table 1 “Memory Maps for different configurations”: removed 1 KB in B1, B4 (EEPROM) and
ROM
167530 9 December 2008 Product short specification
Modifications: • Initial version

167532 © NXP B.V. 2009. All rights reserved.

Product short specification Rev. 3.2 — 2 September 2009 16 of 18

NXP Semiconductors JCOP V2.4.1
JCOP V2.4.1 secure smart card controller
CONFIDENTIAL

13. Legal information

13.1 Data sheet status

Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.

[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.

13.2 Definitions damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in Applications — Applications that are described herein for any of these
modifications or additions. NXP Semiconductors does not give any products are for illustrative purposes only. NXP Semiconductors makes no
representations or warranties as to the accuracy or completeness of representation or warranty that such applications will be suitable for the
information included herein and shall have no liability for the consequences of specified use without further testing or modification.
use of such information. Limiting values — Stress above one or more limiting values (as defined in
Short data sheet — A short data sheet is an extract from a full data sheet the Absolute Maximum Ratings System of IEC 60134) may cause permanent
with the same product type number(s) and title. A short data sheet is intended damage to the device. Limiting values are stress ratings only and operation of
for quick reference only and should not be relied upon to contain detailed and the device at these or any other conditions above those given in the
full information. For detailed and full information see the relevant full data Characteristics sections of this document is not implied. Exposure to limiting
sheet, which is available on request via the local NXP Semiconductors sales values for extended periods may affect device reliability.
office. In case of any inconsistency or conflict with the short data sheet, the Terms and conditions of sale — NXP Semiconductors products are sold
full data sheet shall prevail. subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
13.3 Disclaimers explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
General — Information in this document is believed to be accurate and terms and conditions, the latter will prevail.
reliable. However, NXP Semiconductors does not give any representations or
No offer to sell or license — Nothing in this document may be interpreted or
warranties, expressed or implied, as to the accuracy or completeness of such
construed as an offer to sell products that is open for acceptance or the grant,
information and shall have no liability for the consequences of use of such
conveyance or implication of any license under any copyrights, patents or
information.
other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to make
Quick reference data — The Quick reference data is an extract of the
changes to information published in this document, including without
product data given in the Limiting values and Characteristics sections of this
limitation specifications and product descriptions, at any time and without
document, and as such is not complete, exhaustive or legally binding.
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed, 13.4 Trademarks
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or Notice: All referenced brands, product names, service names and trademarks
malfunction of an NXP Semiconductors product can reasonably be expected are the property of their respective owners.
to result in personal injury, death or severe property or environmental FabKey — is a trademark of NXP B.V.
MIFARE — is a trademark of NXP B.V.

14. Contact information

For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]

167532 © NXP B.V. 2009. All rights reserved.

Product short specification Rev. 3.2 — 2 September 2009 17 of 18

NXP Semiconductors JCOP V2.4.1
JCOP V2.4.1 secure smart card controller
CONFIDENTIAL

15. Tables
Table 1. Memory Maps for different configurations . . . . .6 Table 6. JCOP V2.4.1 product feature map. . . . . . . . . . 10
Table 2. JCOP Commercial Name Format . . . . . . . . . . .8 Table 7. Abbreviations JCOP. . . . . . . . . . . . . . . . . . . . . 14
Table 4. Ordering information of JCOP V2.4.1 . . . . . . . . .9 Table 8. Revision history . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 5. JCOP V2.4.1 product overview . . . . . . . . . . . .10

16. Figures
Fig 1. Block diagram of all JCOP V2.4.1 products. . . . . .2

17. Contents
1 General description . . . . . . . . . . . . . . . . . . . . . . 1 8.4.2 Ordering generic products through Order Entry
2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Form. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3 Specifications supported with JCOP V2.4.1 . . 3 8.5 Ordering JCOP V2.4.1 custom products . . . . 12
8.5.1 Ordering custom products created by NXP
3.1 Java Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Semiconductors . . . . . . . . . . . . . . . . . . . . . . . 12
3.2 GlobalPlatform . . . . . . . . . . . . . . . . . . . . . . . . . 3
8.5.2 Creating and ordering custom products with
3.3 Supported eGovernment specifications and
customer applets in the ROM mask . . . . . . . . 12
applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
8.6 Ordering JCOP V2.4.1 support items . . . . . . 12
3.4 Supported banking specifications . . . . . . . . . . . 3
8.6.1 JCOP V2.4.1 transport and authentication
3.4.1 VISA International. . . . . . . . . . . . . . . . . . . . . . . 3
keys . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.4.2 EMV . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
8.6.2 JCOP V2.4.1 tools . . . . . . . . . . . . . . . . . . . . . 12
3.5 Specifications for transportation and ticketing . 4
9 Security certifications. . . . . . . . . . . . . . . . . . . 13
4 Additional JCOP V2.4.1 features . . . . . . . . . . . 5
4.1 JCOPX - Additional Application Programming 10 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 14
Interface (APIs) features. . . . . . . . . . . . . . . . . . 5 11 References. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4.2 MIFARE emulation features . . . . . . . . . . . . . . . 5 12 Revision history . . . . . . . . . . . . . . . . . . . . . . . 16
4.3 Extended Length APDU support . . . . . . . . . . . 5 13 Legal information . . . . . . . . . . . . . . . . . . . . . . 17
4.4 Security features. . . . . . . . . . . . . . . . . . . . . . . . 5 13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17
5 Supported interfaces . . . . . . . . . . . . . . . . . . . . . 6 13.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
6 Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 13.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 17
6.1 Available memory space. . . . . . . . . . . . . . . . . . 6 13.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 17
6.2 Garbage collection . . . . . . . . . . . . . . . . . . . . . . 6 14 Contact information . . . . . . . . . . . . . . . . . . . . 17
7 Supported hardware platforms. . . . . . . . . . . . . 7 15 Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
8 Ordering information . . . . . . . . . . . . . . . . . . . . . 7 16 Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
8.1 JCOP V2.4.1 naming conventions . . . . . . . . . . 7 17 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
8.2 Ordering JCOP V2.4.1 products and support
items . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
8.2.1 JCOP V2.4.1 product configurations . . . . . . . . 9
8.2.2 Available JCOP V2.4.1 products . . . . . . . . . . 10
8.3 Ordering JCOP V2.4.1 samples . . . . . . . . . . . 11
8.4 Ordering generic JCOP V2.4.1 products . . . . 11
8.4.1 Ordering generic products from NXP
Semiconductors stock . . . . . . . . . . . . . . . . . . 11

Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.

© NXP B.V. 2009. All rights reserved.

For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 2 September 2009
Document identifier: 167532