NXP Java Card p5cc080
NXP Java Card p5cc080
family
Secure dual interface and contact PKI smart card controller
Rev. 03 — 24 January 2008 Objective short data sheet
1. General description
• 12 KB to 144 KB EEPROM
• 200 KB user ROM
• 6144 B RAM
• High-performance secured Public Key Infrastructure (PKI) coprocessor (RSA, ECC)
• Secured dual/triple-DES coprocessor
• Secured AES coprocessor
• Memory Management Unit (MMU)
• ISO/IEC 7816 contact interface
• Optional ISO/IEC 14443 A Contactless Interface Unit (CIU)
• Optional S2C interface for NFC communication link
• 5-metal-layer 0.14 µm CMOS technology
• EEPROM with typical 500000 cycles endurance and minimum 20 years retention time
• Broad spectrum of delivery types
• Optional certified crypto library modules for RSA, ECC, DES, AES, SHA and PRNG
The availability of contact interface, optional contactless or S2C interface enables the easy
implementation of native or open platform and multi-application operating systems in
market segments like e.g. banking, E-passport, ID card, Health Card, secure access, Java
card, Near Field Communication (NFC) connectable mobile hand sets as well as Trusted
Platform Modules (TPM).
NXP Semiconductors P5Cx012/02x/40/73/80/144 family
Secure dual interface and contact PKI smart card controller
The FameXE PKI coprocessor supports 192-bit ECC key length that offers the same level
of security as 2048-bit RSA. An ECC GF(2n) based signature, using a 163-bit key can be
executed in less than 30 ms providing a security level comparable to 1024-bit RSA. The
operand size for ECC, supported by FameXE, is only limited by the 2.5 KB size of the
FXRAM. FameXE is easy to use and the flexible interface provides programmers with the
freedom to implement their own cryptology solutions. A secured and CC EAL5+ certified
crypto library providing a large range of required functions will be available for all devices
in order to support customers in implementing public key-based solutions.
A tutorial software library for ISO/IEC 14443-3 and ISO/IEC 14443-4 is available to
support NXP Semiconductors customers for easy integration of the contactless
technology into current system solutions.
Operated both in Contact mode (ISO/IEC 7816) and in S2C mode the user defines the
final function of the controller chip with its operating system. This allows the same level of
security, functionality and flexibility for the contact interface as well as for S2C interface.
The S2C interface is connected to the internal ISO 14443 CIU. The CIU handles the
demodulation and the modulation of the S2C signals in a way that a full contactless
communication via this interface and the NFC IC can be enabled. As the S2C interface is
connected to the CIU the power of the P5CN080/P5CN144 has to be supplied via the
VDD and VSS pads to use the S2C interface. The S2C interface does not need any
software adaptation compared to the normal contactless operation.
Connected to the S2C interface of a NFC IC the device is compatible with existing MIFARE
reader infrastructure and the optional emulation modes of MIFARE 1 KB or MIFARE 4 KB
enable fast system integration and backward compatibility to MIFARE based cards. The
communication on the S2C interface supports both the ISO/IEC 14443 A part 3 and the
ISO/IEC 14443 part 4.
NXP Semiconductors continues to drive forward third party security evaluations to provide
its customers with the relevant information and documentation needed to execute
subsequent composite evaluations of implemented applications.
• Various algorithms
– AES encryption and decryption using the AES coprocessor
– DES and Triple-DES encryption and decryption using the DES coprocessor
– RSA encryption and decryption, signature generation and verification for
straightforward and CRT keys up to 5024 bits
– RSA key generation
– ECC over GF(p) signature generation and verification (ECDSA) and Diffie-Hellman
key exchange for keys up to 544 bits
– ECC over GF(p) key generation
– ECC over GF(2n) signature generation and verification (ECDSA) and
Diffie-Hellman key exchange for keys up to 571 bits
– ECC over GF(2n) key generation
– SHA-1, SHA-224 and SHA-256 hash algorithm
– Pseudo-Random Number Generator (PRNG)
• Easy to use API for all algorithms
• Secure operation in contact as well as in the contactless mode
• Latest built-in security features to avoid power (SPA/DPA), timing and fault attacks
(DFA)
• Common criteria CC EAL5+ certification planned [except ECC over GF(2n)] according
to BSI-PP-0002 protection profile
2. Features
3. Applications
[1] In case of extended Class B (Class BE) operation mode (targeted for battery supplied applications), the
class C is not supported.
5. Ordering information
Table 3. Ordering information
Type number Package
Name Description Version
P5CC021UA FFC 8 inch wafer (sawn; 150 µm thickness; on film <tbd>
P5CC040UA frame carrier; electronic fail die marking according
to SECSII format)
P5CC073UA
P5CC080UA
P5CC144UA
P5CD012UA
P5CD020UA
P5CD040UA
P5CD080UA
P5CD144UA
P5CN080UA
P5CN144UA
P5CD012UE FFC 8 inch wafer (sawn; 75 µm thickness; on film frame <tbd>
P5CD020UE carrier; electronic fail die marking according to
SECSII format)
P5CD040UE
P5CD080UE
P5CD144UE
P5CC021XS PCM1.1 contact chip card module (super 35 mm format, SOT658
P5CC040XS 8-contact)
P5CC073XS
P5CC080XS
P5CC144XS
P5CD012X1 PDM1.1 contactless chip card module (Plug-in type; super SOT658
P5CD020X1 35 mm format, 8-contact)
P5CD040X1
P5CD080X1
P5CD144X1
P5CD040X0
P5CD080X0
P5CD144X0
P5CD012A4 MOB4 plastic leadless module carrier package; 35 mm SOT500-2
P5CD020A4 wide tape
P5CD040A4
P5CD080A4
P5CD144A4
P5CD012A6 MOB6 plastic leadless module carrier package; 35 mm SOT500-3
P5CD020A6 wide tape
P5CD040A6
P5CD080A6
P5CD144A6
6. Functional diagram
NXP Semiconductors
ROM EEPROM RAM
P5CC021 P5CC040 P5CC073 P5CC080
P5CC144
20 KB/40 KB/
72 KB/80 KB/
200 KB 6144 B
144 KB FameXE
PROGRAM DATA
DATA AND ENHANCED PUBLIC
IO1 MEMORY MEMORY
PROGRAM KEY
PROGRAMMABLE UART MEMORY COPROCESSOR e.g.
IO2
IO 1, 2, 3 ISO 7816 RSA, ECC
IO3
P5Cx012/02x/40/73/80/144 family
MEMORY MANAGEMENT UNIT (MMU)
Rev. 03 — 24 January 2008
NXP Semiconductors
P5CD020 P5CD040 P5CD080 P5CD144
LA
ROM EEPROM RAM
RF CIU
INTERFACE ISO 14443
LB 20 KB/40 KB/
200 KB 80 KB/144 KB 6144 B
DATA AND FameXE
PROGRAM DATA
PROGRAM ENHANCED PUBLIC
IO1 MEMORY MEMORY
MEMORY KEY
PROGRAMMABLE UART COPROCESSOR e.g.
IO2
IO 1, 2, 3 ISO 7816 RSA, ECC
IO3
P5Cx012/02x/40/73/80/144 family
MEMORY MANAGEMENT UNIT (MMU)
Rev. 03 — 24 January 2008
NXP Semiconductors
P5CN080 P5CN144
SIGIN
ROM EEPROM RAM
S2C CIU
INTERFACE ISO 14443
SIGOUT 80 KB/
200 KB 144 KB 6144 B
DATA AND FameXE
PROGRAM DATA
PROGRAM ENHANCED PUBLIC
IO1 MEMORY MEMORY
MEMORY KEY
PROGRAMMABLE UART COPROCESSOR e.g.
IO 1, 2 ISO 7816 RSA, ECC
IO2
P5Cx012/02x/40/73/80/144 family
MEMORY MANAGEMENT UNIT (MMU)
Rev. 03 — 24 January 2008
7. Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to
VSS (ground = 0 V).
Symbol Parameter Conditions Min Max Unit
VDD supply voltage −0.5 +6.0 V
VI input voltage any signal pad −0.5 VDD + 0.5 V
II input current pad IO1, IO2 or - ±15.0 mA
IO3
IO output current pad IO1, IO2 or - ±15.0 mA
IO3
Ilu latch-up current VI < 0 V - ±100 mA
or VI > VDD
Vesd electrostatic discharge voltage pads VDD, VSS, [1] - ±4.0 kV
CLK, RST_N, IO1,
IO2, IO3
pads LA, LB [1] - ±2.0 kV
Ptot total power dissipation [2] - 1 W
Tstg storage temperature [3] - -
[1] MIL Standard 883-D method 3015; human body model; C = 100 pF, R = 1.5 kΩ; Tamb = −25 °C to +85 °C.
[2] Depending on appropriate thermal resistance of the package.
[3] Depending on delivery type, refer to NXP Semiconductors General Specification for 8” Wafer and to NXP
Semiconductors Contact & Dual Interface Chip Card Module Specification.
8. Abbreviations
Table 6. Abbreviations
Acronym Description
AES Advanced Encryption Standard
API Application Programming Interface
ASK Amplitude Shift Keying
CIU Contactless Interface Unit
CRC Cyclic Redundancy Check
CRT Chinese Remainder Theorem
DES Digital Encryption Standard
DFA Differential Fault Analysis
DPA Differential Power Analysis
DSS Digital Signature Standard
ECC Elliptic Curve Cryptography
ECDSA Elliptic Curve Digital Signature Algorithm
EEPROM Electrically Erasable Programmable Read-Only Memory
GF Galois Function
MAC Message Authentication Code
MMU Memory Management Unit
9. Revision history
Table 7. Revision history
Document ID Release date Data sheet status Change notice Supersedes
P5CX012_02X_40_73_80_ 20080124 Objective short data sheet P5CX02X_40_73_80_144_
144_FAM_SDS_3 FAM_SDS_2
Modifications: • Type number P5CD012 added
• Table 3 “Ordering information” corrected and new type number added
• Figure 2 added
P5CX02X_40_73_80_144_ 20070424 Objective short data sheet - P5CX02X_40_80_144_FAM
FAM_SDS_2 _SDS_1
P5CX02X_40_80_144_FAM 20070216 Objective short data sheet - -
_SDS_1
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Short data sheet — A short data sheet is an extract from a full data sheet Limiting values — Stress above one or more limiting values (as defined in
with the same product type number(s) and title. A short data sheet is intended the Absolute Maximum Ratings System of IEC 60134) may cause permanent
for quick reference only and should not be relied upon to contain detailed and damage to the device. Limiting values are stress ratings only and operation of
full information. For detailed and full information see the relevant full data the device at these or any other conditions above those given in the
sheet, which is available on request via the local NXP Semiconductors sales Characteristics sections of this document is not implied. Exposure to limiting
office. In case of any inconsistency or conflict with the short data sheet, the values for extended periods may affect device reliability.
full data sheet shall prevail. Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
10.3 Disclaimers intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
General — Information in this document is believed to be accurate and any inconsistency or conflict between information in this document and such
reliable. However, NXP Semiconductors does not give any representations or terms and conditions, the latter will prevail.
warranties, expressed or implied, as to the accuracy or completeness of such
No offer to sell or license — Nothing in this document may be interpreted
information and shall have no liability for the consequences of use of such
or construed as an offer to sell products that is open for acceptance or the
information.
grant, conveyance or implication of any license under any copyrights, patents
Right to make changes — NXP Semiconductors reserves the right to make or other industrial or intellectual property rights.
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior 10.4 Trademarks
to the publication hereof.
Notice: All referenced brands, product names, service names and trademarks
Suitability for use — NXP Semiconductors products are not designed,
are the property of their respective owners.
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or MIFARE — is a trademark of NXP B.V.
malfunction of an NXP Semiconductors product can reasonably be expected FabKey — is a trademark of NXP B.V.
12. Tables
Table 1. Naming conventions . . . . . . . . . . . . . . . . . . . . . .2 Table 5. Limiting values . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 2. Quick reference data . . . . . . . . . . . . . . . . . . . . .9 Table 6. Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 3. Ordering information . . . . . . . . . . . . . . . . . . . . .9 Table 7. Revision history . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 4. Feature table . . . . . . . . . . . . . . . . . . . . . . . . . .10
13. Figures
Fig 1. Functional diagram
P5CC021/P5CC040/P5CC073/P5CC080/
P5CC144 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Fig 2. Functional diagram
P5CD012/P5CD020/P5CD040/P5CD080/
P5CD144 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Fig 3. Functional diagram P5CN080/P5CN144 . . . . . . .13
continued >>
14. Contents
1 General description . . . . . . . . . . . . . . . . . . . . . . 1
1.1 SmartMX family approach . . . . . . . . . . . . . . . . 1
1.2 SmartMX family properties . . . . . . . . . . . . . . . . 1
1.3 Naming conventions . . . . . . . . . . . . . . . . . . . . . 2
1.4 Cryptographic hardware coprocessors . . . . . . . 2
1.4.1 FameXE coprocessor . . . . . . . . . . . . . . . . . . . 2
1.4.2 Triple-DES coprocessor . . . . . . . . . . . . . . . . . . 2
1.4.3 AES coprocessor . . . . . . . . . . . . . . . . . . . . . . . 2
1.5 SmartMX interfaces . . . . . . . . . . . . . . . . . . . . . 3
1.5.1 SmartMX contact interface . . . . . . . . . . . . . . . . 3
1.5.2 SmartMX contactless interface . . . . . . . . . . . . 3
1.5.3 SmartMX S2C interface . . . . . . . . . . . . . . . . . . 3
1.6 Security features. . . . . . . . . . . . . . . . . . . . . . . . 4
1.7 Security evaluation and certificates . . . . . . . . . 4
1.8 Optional crypto library. . . . . . . . . . . . . . . . . . . . 4
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1 Standard family features . . . . . . . . . . . . . . . . . . 5
2.2 Product specific family features . . . . . . . . . . . . 6
2.3 Security features. . . . . . . . . . . . . . . . . . . . . . . . 7
2.4 Design-in support . . . . . . . . . . . . . . . . . . . . . . . 8
3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.1 Application areas . . . . . . . . . . . . . . . . . . . . . . . 8
4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 9
5 Ordering information . . . . . . . . . . . . . . . . . . . . . 9
6 Functional diagram . . . . . . . . . . . . . . . . . . . . . 11
7 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 14
8 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 14
9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 15
10 Legal information. . . . . . . . . . . . . . . . . . . . . . . 16
10.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16
10.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
10.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
10.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
11 Contact information. . . . . . . . . . . . . . . . . . . . . 16
12 Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
13 Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.