Tda4565 Philips
Tda4565 Philips
Tda4565 Philips
DATA SHEET
TDA4565
Colour transient improvement
circuit
Product specification November 1989
File under Integrated Circuits, IC02
Philips Semiconductors Product specification
GENERAL DESCRIPTION
The TDA4565 is a monolithic integrated circuit for colour transient improvement (CTI) and luminance delay line in gyrator
technique in colour television receivers.
Features
• Colour transient improvement for colour difference signals (R-Y) and (B-Y) with transient detecting-, storage- and
switching stages resulting in high transients of colour difference output signals
• A luminance signal path (Y) which substitutes the conventional Y-delay coil with an integrated Y-delay line
• Switchable delay time from 730 ns to 1000 ns in steps of 90 ns and additional fine adjustment of 50 ns
• Two Y output signals; one of 180 ns less delay
PACKAGE OUTLINE
18-lead DIL; plastic (SOT102); SOT102-1; 1996 November 27.
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Philips Semiconductors Product specification
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Philips Semiconductors Product specification
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Philips Semiconductors Product specification
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
PARAMETER SYMBOL MIN. MAX. UNIT
Supply voltage range (pin 10) VP = V10-18 0 13.2 V
Voltage ranges to pin 18 (ground)
at pins 1, 2, 12 and 15 Vn-18 0 VP V
at pin 11 V11-18 0 (Vp −3 V) V
at pin 17 V17-18 0 7 V
Voltage ranges
at pin 7 to pin 6 V7-6 0 5 V
at pin 8 to pin 9 V8-9 0 5 V
Currents
at pins 6, 9 I6, 9 −10 +10 mA
at pins 7, 8, 11 and 12 I7, 8, 11, 12 internally limited
Total power dissipation
(Tj = 150 °C; Tamb = 70 °C) Ptot − 1.1 W
Storage temperature range Tstg −25 +150 °C
Operating ambient temperature range Tamb 0 +70 °C
THERMAL RESISTANCE
From junction to ambient (in free air) Rth j-a = 70 K/W
Note
1. Pins 3, 4, 5, 6, 9, 13 and 14 DC potential not published.
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Philips Semiconductors Product specification
CHARACTERISTICS
VP = V10-18 = 12 V; Tamb = 25 °C; measured in application circuit Fig.3; unless otherwise specified
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Philips Semiconductors Product specification
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Philips Semiconductors Product specification
DC output voltage
pin 11 V11−18 1.8 2.3 2.6 V
pin 12 V12−18 9.8 10.3 10.8 V
Output current note 2
source I11, 12 − − 0.4 mA
sink −I11, 12 − − 1.0 mA
Notes to the characteristics
1. Output signal transient time measured with C6−18 = C9-18 = 220 pF without resistor (see Fig.3).
2. Output current measured with emitter follower with constant current source of 0.6 mA.
3. R14-18 influences the bandwidth; a value of 1.2 kΩ results in a bandwidth of 5 MHz (typ.).
4. Delay time is proportional to resistor R14-18. Devices with suffix “A” require the value of the resistor to be 1.15 kΩ;
a 27 kΩ resistor connected in parallel with R14-18 = 1.2 kΩ.
5. Frequency response measured with V15-18 = 9.5 V and switch S1 open.
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Philips Semiconductors Product specification
APPLICATION INFORMATION
Note
1. When switch (S1) is closed the delay time is increased by 50 ns.
2. Where: X = connection closed; 0 = connection open.
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Philips Semiconductors Product specification
PACKAGE OUTLINE
D ME
seating plane
A2 A
A1
L
c
Z e w M
b1
(e 1)
b b2
18 10 MH
pin 1 index
E
1 9
0 5 10 mm
scale
UNIT
A A1 A2
b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1)
max. min. max. max.
1.40 0.53 1.40 0.32 21.8 6.48 3.9 8.25 9.5
mm 4.7 0.51 3.7 2.54 7.62 0.254 0.85
1.14 0.38 1.14 0.23 21.4 6.20 3.4 7.80 8.3
inches 0.055 0.021 0.055 0.013 0.86 0.26 0.15 0.32 0.37
0.19 0.020 0.15 0.10 0.30 0.01 0.033
0.044 0.015 0.044 0.009 0.84 0.24 0.13 0.31 0.33
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
93-10-14
SOT102-1
95-01-23
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Philips Semiconductors Product specification
SOLDERING
Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and
surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for
surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often
used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“IC Package Databook” (order code 9398 652 90011).
DEFINITIONS
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