AP2181/ AP2191

1.5A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH

Description Pin Assignments

The AP2181 and AP2191 are integrated high-side power switches
( Top View )
optimized for Universal Serial Bus (USB) and other hot-swap
applications. The family of devices complies with USB 2.0 and is GND 1 8 NC
available with both polarities of Enable input. They offer current and
thermal limiting and short circuit protection as well as controlled rise IN 2 7 OUT

time and under-voltage lockout functionality. A 7ms deglitch capability

IN 3 6 OUT
on the open-drain Flag output prevents false over-current reporting
and does not require any external components. EN 4 5 FLG

All devices are available in SO-8, MSOP-8EP, SOT25 and SO-8

U-DFN2018-6 packages.

Features
• Single USB Port Power Switches
• Over-Current and Thermal Protection
• 2.1A Accurate Current Limiting
• Reverse Current Blocking
• 95mΩ On-Resistance
• Input Voltage Range: 2.7V – 5.5V
• 0.6ms Typical Rise Time
• Very Low Shutdown Current: 1µA (max)
• Fault Report (FLG) with Blanking Time (7ms typ)
• ESD Protection: 4kV HBM, 300V MM
• Active Low (AP2181) or Active High (AP2191) Enable
• Ambient Temperature Range: -40°C to +85°C
• SOT25, SO-8, MSOP-8EP (Exposed Pad), and U-DFN2018-6:
Available in “Green” Molding Compound (No Br, Sb)
• Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) ( Top View )
• Halogen and Antimony Free. “Green” Device (Note 3)
GND 1 6 OUT
• UL Recognized, File Number E322375
• IEC60950-1 CB Scheme Certified OUT
IN 2 5

EN 3 4 FLG
Applications
U-DFN2018-6
• Consumer Electronics – LCD TVs & Monitors, Game Machines
• Communications – Set-Top-Boxes, GPS Systems,
Smartphones
• Computing – Laptops, Desktops, Servers, Printers, Docking
Stations, HUBs

Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.

AP2181/ AP2191 1 of 17 March 2015

Document number: DS31563 Rev. 8 - 2 www.diodes.com © Diodes Incorporated
 AP2181/ AP2191

Typical Applications Circuit

AP2191
AP2191 Enable Active High

Power Supply IN OUT Load

2.7V to 5.5V

10k
10k 10uF
10uF 0.1uF 0.1uF
120uF
120uF

FLG

EN GND
ON

OFF

Available Options

Current Limit Recommended Maximum Continuous

Part Number Channel Enable Pin (EN)
(typ) Load Current
AP2181 1 Active Low 2.1A 1.5A
AP2191 1 Active High 2.1A 1.5A

Pin Descriptions

Pin Pin Number

Function
Name SO-8 MSOP-8EP SOT25 U-DFN2018-6
GND 1 1 2 1 Ground
IN 2, 3 2, 3 5 2 Voltage input pin (all IN pins must be tied together externally)
EN 4 4 4 3 Enable input, active low (AP2181) or active high (AP2191)
Over-current and over-temperature fault report.
FLG 5 5 3 4
Open-drain flag is active low when triggered
OUT 6, 7 6, 7 1 5, 6 Voltage output pin (all OUT pins must be tied together externally)
No internal connection.
NC 8 8 N/A N/A
Recommend tie to OUT pins
Exposed pad.
Exposed tab - Exposed tab - Exposed tab It should be connected to GND and thermal mass for enhanced thermal
impedance. It should not be used as electrical ground conduction path.

AP2181/ AP2191 2 of 17 March 2015

Document number: DS31563 Rev. 8 - 2 www.diodes.com © Diodes Incorporated
 AP2181/ AP2191

Functional Block Diagram

AP2181, AP2191

Current
IN Sense OUT

UVLO

Current
Driver
EN Limit FLG

Thermal Deglitch
Sense

GND

Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.)

Symbol Parameter Ratings Units

ESD HBM Human Body Model ESD Protection 4 kV
Machine Model ESD Protection
400 V
for MSOP-8EP, SOT25 Packages
ESD MM
Machine Model ESD Protection
300 V
for U-DFN2018-6, SO-8 Packages
VIN Input Voltage 6.5 V
VOUT Output Voltage VIN +0.3 V
VEN , VFLG Enable Voltage 6.5 V
ILOAD Maximum Continuous Load Current Internal Limited A
TJ(MAX) Maximum Junction Temperature +150 °C
TST Storage Temperature Range (Note 4) -65 to +150 °C
Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only;
functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be
affected by exposure to absolute maximum rating conditions for extended periods of time.
Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling
and transporting these devices
Note: 4. UL Recognized Rating from -30°C to +70°C (Diodes qualified TST from -65°C to +150°C).

Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.)

Symbol Parameter Min Max Units
VIN Input Voltage 2.7 5.5 V
IOUT Output Current 0 1.5 A
TA Operating Ambient Temperature -40 +85 °C
VIH High-Level Input Voltage on EN or EN 2.0 VIN V
VIL Low-Level Input Voltage on EN or EN 0 0.8 V

AP2181/ AP2191 3 of 17 March 2015

Document number: DS31563 Rev. 8 - 2 www.diodes.com © Diodes Incorporated
 AP2181/ AP2191

Electrical Characteristics (@TA = +25°C, VIN = +5V, unless otherwise specified.)

Symbol Parameter Test Conditions Min Typ Max Unit

VUVLO Input UVLO RLOAD = 1kΩ 1.6 1.9 2.5 V
ISHDN Input Shutdown Current Disabled, IOUT = 0 — 0.5 1 µA
IQ Input Quiescent Current Enabled, IOUT = 0 — 45 70 µA
ILEAK Input Leakage Current Disabled, OUT grounded — — 1 µA
IREV Reverse Leakage Current Disabled, VIN = 0V, VOUT = 5V, IREV at VIN — 1 — µA
SOT25, MSOP-8EP, SO-8 — 95 115
VIN = 5V, TA = +25°C
U-DFN2018-6 — 90 110
IOUT= 1.5A
RDS(ON) Switch On-Resistance -40°C ≤ TA ≤ +85°C — — 140 mΩ
VIN = 3.3V, TA = +25°C — 120 140
IOUT= 1.5A -40°C ≤ TA ≤ +85°C — — 170
ISHORT Short-Circuit Current Limit Enabled into short circuit, CL = 100µF — 2.0 — A
ILIMIT Over-Load Current Limit VIN = 5V, VOUT = 4.5V, CL = 120µF, -40°C ≤ TA ≤ +85°C 1.6 2.1 2.6 A
ITrig Current Limiting Trigger Threshold Output Current Slew Rate (<100A/s) , CL = 100µF — 2.6 — A
VIL EN Input Logic Low Voltage VIN = 2.7V to 5.5V — — 0.8 V
VIH EN Input Logic High Voltage VIN = 2.7V to 5.5V 2 — — V
ISINK EN Input Leakage VEN = 5V — — 1 µA
TD(ON) Output Turn-On Delay Time CL = 1µF, RLOAD = 10Ω — 0.05 — ms
TR Output Turn-On Rise Time CL = 1µF, RLOAD = 10Ω — 0.6 1.5 ms
TD(OFF) Output Turn-Off Delay Time CL = 1µF, RLOAD = 10Ω — 0.01 — ms
TF Output Turn-Off Fall Time CL = 1µF, RLOAD = 10Ω — 0.05 0.1 ms
RFLG FLG Output FET On-Resistance IFLG = 10mA, CL = 100µF — 20 40 Ω
TBlank FLG Blanking Time CIN = 10µF, CL = 100µF 4 7 15 ms
TSHDN Thermal Shutdown Threshold Enabled, RLOAD = 1kΩ — +140 — °C
THYS Thermal Shutdown Hysteresis — — +25 — °C
SO-8 (Note 5) — 110 — °C/W
Thermal Resistance Junction-to- MSOP-8EP (Note 6) — 60 — °C/W
θJA
Ambient SOT25 (Note 7) — 157 — °C/W
U-DFN2018-6 (Note 8) — 70 — °C/W
Notes: 5. Test condition for SO-8: Device mounted on FR-4, 2oz copper, with minimum recommended pad layout.
6. Test condition for MSOP-8EP: Device mounted on 2” x 2” FR-4 substrate PC board, 2oz copper, with minimum recommended pad on top layer and
thermal vias to bottom layer ground plane.
7. Test condition for SOT25: Device mounted on FR-4, 2oz copper, with minimum recommended pad layout.
8. Test condition for U-DFN2018-6: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad on top layer and 3 vias to bottom
layer 1.0”x1.4” ground plane.

AP2181/ AP2191 4 of 17 March 2015

Document number: DS31563 Rev. 8 - 2 www.diodes.com © Diodes Incorporated
 AP2181/ AP2191

Typical Performance Characteristics

VEN 50%
50% 50%
50% VEN
50%
50% 50%
50%

TD(OFF)
OFF) TD(OFF)
OFF)
TR TR
TF TF
TD(ON)
ON) 90%
90% 90%
90%
TD(ON)
ON) 90%
90% 90%
90%
VOUT VOUT
10%
10% 10%
10% 10%
10% 10%
10%

Figure 1 Voltage Waveforms: AP2181 (left), AP2191 (right)

All Enable Plots are for AP2191 Active High

Turn-On Delay and Rise Time Turn-Off Delay and Fall Time

Ven Ven
5V/div 5V/div

Vout Vout
2V/div 2V/div CL = 1µF

CL = 1µF TA = +25°C

TA = +25°C RL = 5 Ω

RL = 5 Ω

400µs/div 400µs/div

Turn-On Delay and Rise Time Turn-Off Delay and Fall Time

Ven Ven
5V/div 5V/div

Vout Vout
CL = 100µF
2V/div 2V/div
TA = +25°C
CL = 100µF
RL = 5 Ω
TA = +25°C
RL = 5 Ω

400µs/div 400µs/div

AP2181/ AP2191 5 of 17 March 2015

Document number: DS31563 Rev. 8 - 2 www.diodes.com © Diodes Incorporated
 AP2181/ AP2191

Typical Performance Characteristics (continued)

Short Circuit Current,
Device Enabled Into Short Inrush Current

Ven Ven
5V/div 5V/div
CL = 470uF VIN = 5V
CL = 100uF TA = +25°C
RL = 3.3Ω

Iout
Iout VIN = 5V 500mA/div
500mA/div
TA = +25°C
CL = 100µF
CL = 220uF

500µs/div 1ms/div

0.6 Ω Load Connected to Enabled Device Short Circuit with Blanking Time and Recovery
VIN = 5V VIN = 5V
TA = +25°C TA = +25°C
Vout
CL = 100µF 5V/div CL = 100µF
Vflag
2V/div

Vflag
5V/div

Iout Iout
1A/div 2A/div

2ms/div 20ms/div

Power On UVLO Increasing

Vflag
5V/div

Vin
2V/div
TA = +25°C

Iout CL = 68µF
500mA/div RL = 3.3Ω

Ven TA = +25°C
5V/div CL = 68µF
Iout
500mA/div RL = 3.3Ω
Vin
5V/div

1ms/div 1ms/div

AP2181/ AP2191 6 of 17 March 2015

Document number: DS31563 Rev. 8 - 2 www.diodes.com © Diodes Incorporated
 AP2181/ AP2191

Typical Performance Characteristics (cont.)

UVLO Decreasing Current Limit Response vs Peak Current

45
TA = +25°C 40

Current Limit Response (us)

Vin CL = 68µF
35
2V/div RL = 3.3Ω
30

25 VIN = 5V
20 TA = +25°C

15

Iout 10
500mA/div
5

0
0 2 4 6 8 10 12
Peak Current (A)

10ms/div

Turn-On Time vs Input Voltage Turn-Off Time vs Input Voltage

850 55

750 50 CL = 1µF
RL = 10Ω
Turn-On Time (us)

Turn-Off Time (us)

650 45
TA = +25°C

550 40

450 35
CL = 1µF
350 RL =10Ω 30
TA = +25°C
250 25
1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6

Input Voltage (V) Input Voltage (V)

Rise Time vs Input Voltage Fall Time vs Input Voltage

650 25

600 24

550
23
Rise Time (us)

Fall Time (us)

500
22
450

CL = 1µF 21 CL = 1µF
400
RL = 10Ω RL = 10Ω

350 TA = +25°C
20 TA = +25°C

300 19
2 2.5 3 3.5 4 4.5 5 5.5 6 2 2.5 3 3.5 4 4.5 5 5.5 6

Input Voltage (V) Input Voltage (V)

AP2181/ AP2191 7 of 17 March 2015

Document number: DS31563 Rev. 8 - 2 www.diodes.com © Diodes Incorporated
 AP2181/ AP2191

Typical Performance Characteristics (cont.)

Supply Current, Output Enabled vs Ambient Temperature Supply Current, Output Disabled vs Ambient Temperature

52 0.9

Supply Current, Output Disabled (uA)

Vin = 5.5V
Supply Current, Output Enabled (uA)

0.8
Vin = 5.0V Vin = 5.0V
47 0.7

Vin = 5.5V 0.6

42 Vin = 3.3V
0.5

0.4
37
Vin = 2.7V 0.3

0.2
32 Vin = 2.7V
Vin = 3.3V
0.1

27 0.0
-60 -40 -20 0 20 40 60 80 100 -60 -40 -20 0 20 40 60 80 100

Ambient Temperature (°C) Ambient Temperature (°C)

Static Drain-Source On-State Resistance vs Ambient Short-Circuit Output Current vs Ambient Temperature
Temperature
2.60
180 CL = 100uF
170 Short-Circuit Output Current (A) 2.50
Vin = 2.7V Vin = 3.3V
Static Drain-Source On-State

160 Vin = 2.7V Vin = 5.0V

150 2.40
Resistance (mΩ)

140
2.30
130
Vin = 3.3V
120
2.20
110

100 2.10
Vin = 5V
90
Vin = 5.5V
80 2.00
-60 -40 -20 0 20 40 60 80 100 -60 -40 -20 0 20 40 60 80 100

Ambient Temperature (°C) Ambient Temperature (°C)

Undervoltage Lockout vs Ambient Temperature Threshold Trip Current vs Input Voltage

2.15 3.24

3.22
Threshold Trip Current (A)

2.10
Undervoltage Lockout (V)

3.20
UVLO Rising
3.18
2.05

3.16

2.00 TA = +25°C
3.14
CL = 68µF
UVLO Falling
3.12
1.95
3.10

1.90 3.08
-60 -40 -20 0 20 40 60 80 100 2.8 3.3 3.8 4.3 4.8 5.3

Ambient Temperature (°C) Input Voltage (V)

AP2181/ AP2191 8 of 17 March 2015

Document number: DS31563 Rev. 8 - 2 www.diodes.com © Diodes Incorporated
 AP2181/ AP2191

Application Information
Power Supply Considerations
A 0.01-µF to 0.1-µF X7R or X5R ceramic bypass capacitor between IN and GND, close to the device, is recommended. Placing a high-value
electrolytic capacitor on the input (10-µF minimum) and output pin(s) is recommended when the output load is heavy. This precaution reduces
power-supply transients that may cause ringing on the input. Additionally, bypassing the output with a 0.01-µF to 0.1-µF ceramic capacitor improves
the immunity of the device to short-circuit transients.

Over-Current and Short Circuit Protection

An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the series
resistance of the current path. When an overcurrent condition is detected, the device maintains a constant output current and reduces the output
voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting.

Three possible overload conditions can occur. In the first condition, the output has been shorted to GND before the device is enabled or before VIN
has been applied. The AP2181/AP2191 senses the short circuit and immediately clamps output current to a certain safe level namely ILIMIT.

In the second condition, an output short or an overload occurs while the device is enabled. At the instance the overload occurs, higher current may
flow for a very short period of time before the current limit function can react. After the current limit function has tripped (reached the over-current
trip threshold), the device switches into current limiting mode and the current is clamped at ILIMIT.

In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until the
current-limit threshold (ITRIG) is reached or until the thermal limit of the device is exceeded. The AP2181/AP2191 is capable of delivering current up
to the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its current limiting mode
and is set at ILIMIT.

Note that when the output has been shorted to GND at extremely low temperature (< -30°C), a minimum 120-µF electrolytic capacitor on the output
pin is recommended. A correct capacitor type with capacitor voltage rating and temperature characteristics must be properly chosen so that
capacitance value does not drop too low at the extremely low temperature operation. A recommended capacitor should have temperature
characteristics of less than 10% variation of capacitance change when operated at extremely low temp. Our recommended aluminum electrolytic
capacitor type is Panasonic FC series.

FLG Response
When an over-current or over-temperature shutdown condition is encountered, the FLG open-drain output goes active low after a nominal 7-ms
deglitch timeout. The FLG output remains low until both over-current and over-temperature conditions are removed. Connecting a heavy capacitive
load to the output of the device can cause a momentary over-current condition, which does not trigger the FLG due to the 7-ms deglitch timeout.
The AP2181/AP2191 is designed to eliminate false over-current reporting without the need of external components to remove unwanted pulses.

Power Dissipation and Junction Temperature

The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating
ambient temperature (TA) and RDS(ON), the power dissipation can be calculated by:
PD = RDS(ON)× I2
Finally, calculate the junction temperature:
TJ = PD x RθJA + TA
Where:
TA = Ambient temperature °C
RθJA = Thermal resistance
PD = Total power dissipation
Thermal Protection
Thermal protection prevents the IC from damage when heavy-overload or short-circuit faults are present for extended periods of time. The
AP2181/AP2191 implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die
temperature rises to approximately 140°C due to excessive power dissipation in an over-current or short-circuit condition the internal thermal sense
circuitry turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit allowing the
device to cool down approximately 25°C before the switch turns back on. The switch continues to cycle in this manner until the load fault or input
power is removed. The FLG open-drain output is asserted when an over-temperature shutdown or over-current occurs with 7-ms deglitch.

AP2181/ AP2191 9 of 17 March 2015

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 AP2181/ AP2191

Application Information (continued)

Under-Voltage Lockout (UVLO)
The under-voltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply has reached at least 1.9V,
even if the switch is enabled. Whenever the input voltage falls below approximately 1.9V, the power switch is quickly turned off. This facilitates the
design of hot-insertion systems where it is not possible to turn off the power switch before input power is removed.

Host/Self-Powered HUBs
Hosts and self-powered hubs (SPH) have a local power supply that powers the embedded functions and the downstream ports (see Figure 2). This
power supply must provide from 5.25V to 4.75V to the board side of the downstream connection under both full-load and no-load conditions. Hosts
and SPHs are required to have current-limit protection and must report over-current conditions to the USB controller. Typical SPHs are desktop
PCs, monitors, printers, and stand-alone hubs.

Figure 2 Typical One-Port USB Host / Self-Powered Hub

Generic Hot-Plug Applications

In many applications it may be necessary to remove modules or pc boards while the main unit is still operating. These are considered hot-plug
applications. Such implementations require the control of current surges seen by the main power supply and the card being inserted. The most
effective way to control these surges is to limit and slowly ramp the current and voltage being applied to the card, similar to the way in which a
power supply normally turns on. Due to the controlled rise times and fall times of the AP2181/AP2191, these devices can be used to provide a
softer start-up to devices being hot-plugged into a powered system. The UVLO feature of the AP2181/AP2191 also ensures that the switch is off
after the card has been removed, and that the switch is off during the next insertion.

By placing the AP2181/AP2191 between the VCC input and the rest of the circuitry, the input power reaches these devices first after insertion. The
typical rise time of the switch is approximately 1ms, providing a slow voltage ramp at the output of the device. This implementation controls system
surge current and provides a hot-plugging mechanism for any device.

Dual-Purpose Port Applications

AP2181/AP2191 is not recommended for use in dual-purpose port applications in which a single port is used for data communication between the
host and peripheral devices while simultaneously maintaining a charge to the battery of the peripheral device. An example of a non-recommended
application is a shared HDMI/MHL (Mobile High-definition Link) port that allows streaming video between an HDTV or set-top box and a
smartphone or tablet while maintaining a charge to the smartphone or tablet battery. If a voltage is maintained across the output of the
AP2181/AP2191 when the output is disabled and the Vin of the device is subsequently ramped up, an overstress condition to the AP2181/AP2191
may result.

AP2181/ AP2191 10 of 17 March 2015

Document number: DS31563 Rev. 8 - 2 www.diodes.com © Diodes Incorporated
 AP2181/ AP2191

Ordering Information

7”/13”
13” Tape and Reel
Part Number Package Code Packaging
Quantity Part Number Suffix
AP21X1WG-7 W SOT25 3,000/Tape & Reel -7
AP21X1SG-13 S SO-8 2,500/Tape & Reel -13
AP21X1MPG-13 MP MSOP-8EP 2,500/Tape & Reel -13
AP21X1FMG-7 FM U-DFN2018-6 3,000/Tape & Reel -7

Marking Information

(1) SO-8
( Top view )

8 7 6 5
Logo
1 : 1 Channel
Part Number AP21
AP21X
21 X X G : Green
8 : Active Low YY : Year : 08, 09,10~
~
9 : Active High YY WW X X
WW : Week : 01~52; 52
represents 52 and 53 week
X : Internal Code
1 2 3 4

(2) MSOP-8EP

( Top view )

8 7 6 5
A~Z : Green
Logo YWXE MSOP-8L-EP
Y : Year : 0~9
Part Number AP21X X W : Week : A~Z : 1~26 week;
week
a~z : 27~52 week; z represents
8 : Active Low 52 and 53 week
9 : Active High 1 : 1 Channel
1 2 3 4

AP2181/ AP2191 11 of 17 March 2015

Document number: DS31563 Rev. 8 - 2 www.diodes.com © Diodes Incorporated
 AP2181/ AP2191

Marking Information (continued)

(3) SOT25
( Top View )
5 4

7
XX : Identification code
Y : Year 0~9
XX Y W X W : Week : A~Z : 1~26 week;
a~z : 27~52 week; z represents
52 and 53 week
1 2 3 X : A~Z : Green

Device Package type Identification Code

AP2181W SOT25 HX
AP2191W SOT25 HY

(4) U-DFN2018-6

Device Package type Identification Code

AP2181FM U-DFN2018-6 HX
AP2191FM U-DFN2018-6 HY

AP2181/ AP2191 12 of 17 March 2015

Document number: DS31563 Rev. 8 - 2 www.diodes.com © Diodes Incorporated
 AP2181/ AP2191

Package Outline Dimensions (All dimensions in mm.)

Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version.

(1) Package Type: SO-8

SO-8

0.254
E1 E Dim Min Max
Gauge Plane A - 1.75
A1 Seating Plane
L A1 0.10 0.20
A2 1.30 1.50
Detail ‘A’ A3 0.15 0.25
b 0.3 0.5
h 7°~9° D 4.85 4.95
45° E 5.90 6.10
Detail ‘A’ E1 3.85 3.95
A2 A A3
e 1.27 Typ
b
h - 0.35
e
L 0.62 0.82
D
θ 0° 8°
All Dimensions in mm

(2) Package Type: MSOP-8EP

D
MSOP-8EP
Dim Min Max Typ
A - 1.10 -
4X
10
° A1 0.05 0.15 0.10
D1
A2 0.75 0.95 0.86
0.25

x
E E2 A3 0.29 0.49 0.39
Gauge Plane b 0.22 0.38 0.30
y Seating Plane c 0.08 0.23 0.15
D 2.90 3.10 3.00
a

4X L D1 1.60 2.00 1.80

10
°
1
e 8Xb E 4.70 5.10 4.90
E3 Detail C E1 2.90 3.10 3.00
A1 A3 E2 1.30 1.70 1.50
c E3 2.85 3.05 2.95
A A2 e - - 0.65
D L 0.40 0.80 0.60
E1
a 0° 8° 4°
See Detail C x - - 0.750
y - - 0.750
All Dimensions in mm

AP2181/ AP2191 13 of 17 March 2015

Document number: DS31563 Rev. 8 - 2 www.diodes.com © Diodes Incorporated
 AP2181/ AP2191

Package Outline Dimensions (All dimensions in mm.)

Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version.

(3) Package Type: SOT25

A
SOT25
Dim Min Max Typ
A 0.35 0.50 0.38
B C
B 1.50 1.70 1.60
C 2.70 3.00 2.80
D   0.95
H 2.90 3.10 3.00
H J 0.013 0.10 0.05
K 1.00 1.30 1.10
K M L 0.35 0.55 0.40
N
M 0.10 0.20 0.15
N 0.70 0.80 0.75
J α 0° 8° 
D L
All Dimensions in mm

(4) Package Type: U-DFN2018-6

A3
A U-DFN2018-6
SEATING PLANE
Dim Min Max Typ
A1 A 0.545 0.605 0.575
A1 0 0.05 0.02
Pin#1 ID D
A3   0.13
D2 b 0.15 0.25 0.20
L
D 1.750 1.875 1.80
D2 1.30 1.50 1.40
e   0.50
E 1.95 2.075 2.00
E E2 E2 0.90 1.10 1.00
L 0.20 0.30 0.25
z   0.30
z All Dimensions in mm

e b

AP2181/ AP2191 14 of 17 March 2015

Document number: DS31563 Rev. 8 - 2 www.diodes.com © Diodes Incorporated
 AP2181/ AP2191

Suggested Pad Layout

Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.

(1) Package Type: SO-8

X

Dimensions Value (in mm)

X 0.60
C1 Y 1.55
C1 5.4
C2 1.27
C2

(2) Package Type: MSOP-8EP

X C

G Y
Value
Dimensions
(in mm)
C 0.650
G 0.450
Y2 Y1 X 0.450
X1 X1 2.000
Y 1.350
Y1 1.700
Y2 5.300

(3) Package Type: SOT25

C2 C2

Dimensions Value (in mm)

Z 3.20
G C1 G 1.60
Z
X 0.55
Y 0.80
Y C1 2.40
C2 0.95
X

AP2181/ AP2191 15 of 17 March 2015

Document number: DS31563 Rev. 8 - 2 www.diodes.com © Diodes Incorporated
 AP2181/ AP2191

Suggested Pad Layout (continued)

Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.

(4) Package Type: U-DFN2018-6

X C

Y
Dimensions Value (in mm)
C 0.50
G 0.20
Y1 X 0.25
X1 1.60
Y 0.35
Y1 1.20
G

X1

Taping Orientation
For U-DFN2018-6

Notes: 9. The taping orientation of the other package type can be found on our website at http://www.diodes.com/datasheets/ap02007.pdf.

AP2181/ AP2191 16 of 17 March 2015

Document number: DS31563 Rev. 8 - 2 www.diodes.com © Diodes Incorporated
 AP2181/ AP2191

IMPORTANT NOTICE

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).

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final and determinative format released by Diodes Incorporated.

LIFE SUPPORT

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:

A. Life support devices or systems are devices or systems which:

1. are intended to implant into the body, or

2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.

B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.

Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
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representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.

Copyright © 2015, Diodes Incorporated

www.diodes.com

AP2181/ AP2191 17 of 17 March 2015

Document number: DS31563 Rev. 8 - 2 www.diodes.com © Diodes Incorporated