Basic Guidelines For Mixed-Signal PCB Layout Design - Electronic Design

15/04/2023, 08:20 Basic Guidelines for Mixed-Signal PCB Layout Design | Electronic Design
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Basic Guidelines for Mixed-Signal

PCB Layout Design
April 6, 2023
This article presents a practical approach to the layout
design of mixed-signal boards, discussing component
placement, board layering, and ground-plane
considerations.
May Anne Porley
Kevin Chesser
Related To: Analog Devices
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What you'll learn: ng

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Considerations for dividing analog and digital blocks.
Decoupling techniques.
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Breaking down the board layers.
How best to deal with grounding. ve from
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A mixed-signal printed-circuit-board (PCB) design requires basic Has

Value-
understanding of analog and digital circuitry to minimize, if not Based…
prevent, signal interference. Modern systems consist of
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components that are operational with both digital and analog owerBest
domains, and they must be carefully designed to ensure signal wards:…
integrity all throughout the system.
PCB layout—an important part of the mixed-signal development SPONSORED

process—can be intimidating and component placement is just the
beginning. Other factors must be considered, too, including board k: Tips
icks for
layers and how to properly manage them to minimize interference ate hig…
caused by parasitic capacitors that can be unintentionally created
between the PCB’s interplane layers. oduction
solation
Grounding also is an integral process in the PCB layout design of a

mixed-signal system. While grounding is a frequently debated
ease
topic in the industry, constructing a standardized approach may ductivity
h…
not always be the simplest task for any engineer. For instance, a
single issue of quality grounding can affect the entire layout of a
high-performance mixed-signal PCB design. And for this reason,
this area should not be overlooked.
Component Placement
Similar to building a house, it’s essential to create a floorplan of

the system before placing the circuit components. This step will
set the overall integrity of the system design and should help avoid
noisy signal interference.
In developing a floorplan, it’s advisable to follow the signal path of

the schematic, especially for high-speed circuits. The location of a
component also is a critical aspect of the design. The designer
should be able to identify the important functional blocks, signals,
and the connection between the blocks to identify the best fit
location of each component in the system. Connectors, for
instance, are better placed on the edges of the board, while
auxiliary components such as decoupling capacitors and crystals
must be placed as close as possible to the mixed-signal device.
Analog and Digital Blocks Partition
To help minimize the common return path for analog and digital
signals, analog and digital block separation may be considered so
that analog signals will not mix with digital signals.
Figure 1 shows a good example of analog and digital circuit

separation. Some considerations when separating analog and
digital sections include:
Sensitive analog components such as amplifiers and voltage

references are recommended to be placed within the analog
plane. Similarly, noisy digital components like logic controls
and timing blocks must be placed on the other side/digital
plane.
If a system contains one mixed-signal analog-to-digital
converter (ADC) or a digital-to-analog converter (DAC) with
low digital currents, this can be treated similar to analog
components in the analog plane.
For designs with more than one ADC and DAC with high
current, it’s recommended to split the analog and digital
supplies. That is, AVCC must be tied to the analog section
while DVDD should be connected to the digital section.

Microprocessors and microcontrollers may take up space and
will generate heat. These components must be placed in the
center of the board for better thermal dissipation, and, at the

same time, close to their related circuit blocks.
1. Partition of analog and digital circuits.
Power-Supply Block
The power supply is an important part of the circuit and should be

handled accordingly. As a rule of thumb, the power-supply block
must be isolated from the rest of the circuitry while remaining
close to the components being powered.
Complex systems with devices that have multiple supply pins can
use separate power-supply blocks dedicated for the analog and
digital sections to avoid noisy digital interference.
On the other hand, power-supply routing should be short, direct,

and use wide traces to reduce inductance and avoid current
limitation.
Decoupling Techniques
Power-supply rejection ratio (PSRR) is an important parameter a

designer must consider when trying to achieve target system
performance. PSRR is the measure of the sensitivity of a device
with respect to power-supply variations, which will eventually
dictate the performance of a given device.
To maintain an optimum PSRR, it’s necessary to keep the high

frequency energy from entering the device. This can be done by
properly decoupling the device’s power supply to the low-
impedance ground plane with a combination of electrolytic and
ceramic capacitors.
The whole concept of correct decoupling is to develop a low-noise

environment in which the circuit can operate. The basic rule is to
make it easy for the current to return by providing the shortest
path.
Designers must always check the high-frequency filtering

recommendation of each device. More so, this checklist will serve
as a guide by providing general decoupling techniques and their
correct implementation:
While electrolytic capacitors act as charge reservoirs to

transient currents to minimize low-frequency noise on power
supplies, low-inductance ceramic capacitors reduce high-
frequency noise. Also, ferrite beads are optional but will add
extra-high-frequency noise isolation and decoupling.
Decoupling capacitors must be placed as close as possible to
the power-supply pins of the device. These capacitors should
connect to a large area of low-impedance ground plane
through a via or short trace to minimize additional series
inductance.
The smaller capacitor, typically 0.01 to 0.1 μF, should be
placed as close as physically possible to the power pins of the
device. When the device has several outputs switching at the
same time, this placement prevents instabilities. The
electrolytic capacitor, typically 10 to 100 μF, should be placed
no more than one inch away from the power pin of the device.
For easier implementation, decoupling capacitors can be
linked through a T-type connection to the ground plane using
vias near the GND pin of the component rather than creating
a trace. See the sample in Figure 2.
2. A decoupling technique for power-supply pins.
Board Layers
Once component placement and the floorplan have been set, we

can go through the other dimension of the board design,
commonly referred to as board layers. It’s highly recommended
that board layers be considered first before doing the PCB routing,
as this will determine the allowable return current paths of the
system design.
A board layer is the vertical arrangement of the copper layers in

the board. These layers should manage the currents and signal
throughout the board.
A visual representation of the board layers is shown in Figure 3.

The table details a typical four-layer PCB setup.
3. A sample four-layer PCB.
In general, high-performance data-collecting systems should have

four or more layers. The top layer is often used for digital/analog
signals, while the bottom layer handles auxiliary signals. The
second layer (ground layer), which serves as a reference plane for
impedance-controlled signals, reduces IR drops and shields the
digital signals in the top layer. Finally, the power plane is on the
third layer.
Power and ground planes must be adjacent to each other as they

provide additional interplane capacitance, which helps with the
high-frequency decoupling of the power supply.
For the ground layer, advice has changed over the years for the
mixed-signal design. Over the years, splitting the ground plane
between analog and digital has made sense, but for modern
mixed-signal devices, a new approach is recommended. Proper
floorplanning and separating signals should prevent any issues
with noisy signals.
Ground Plane: To Split or Not to Split?
Grounding is an essential process in the layout design of a mixed-

signal PCB. A typical four-layer PCB must have at least one layer
dedicated to the ground plane to ensure a low-impedance path for
return signals. All integrated-circuit ground pins should be routed
and connected correctly to the low-impedance ground plane to
minimize the series inductance and resistance.
It’s become a standard grounding approach for mixed-signal

systems to separate analog and digital ground. However, mixed-
signal devices with low digital current can be best managed with a
single ground. Moving forward, a designer must consider which
one of two grounding practices suits best, depending on the
mixed-signal current requirement.
Single Ground Plane
For mixed-signal systems with a single ADC or DAC that has low
digital current, a solid single ground plane would be the best
approach. To understand the importance of a single ground layer,
we need to recall return current. Return current is the current that
flows while returning to ground and traces between devices to
complete a loop. To prevent mixed-signal interference, each
return path must be tracked throughout the PCB layout.
The simple circuit in Figure 4 shows the advantage of a single

solid ground plane over a split ground plane. The signal current
has an equal but opposite flow of return current. This return
current flows in the ground plane back to the source, following the
path of least impedance.
4. Return current for a system with a solid ground plane.
For low-frequency signals, the return current will take the path of
least resistance, usually a straight line between the ground
reference points of the devices. However, for higher-frequency
signals, a certain portion of the return current will try to follow the
signal path back. That’s because the impedance is lower following
this path, since it minimizes the size of the loop formed between
the outgoing and returning current.
Analog and Digital Ground Separation
For complex systems in which a solid ground scheme can be

challenging to achieve, a split ground may be more appropriate. A
split ground plane is popular approach where the ground plane is
split in two: analog and digital ground planes. This is applicable
for more complex systems with multiple mixed-signal devices
consuming high digital current. Figure 5 shows a system with a
split ground plane.
5. Return current for systems with a split ground plane.
For systems with a split ground plane, the simplest way to achieve
a cohesive ground is to remove the break in the ground planes and
enable the return current to take a more direct route through a
star ground junction. The star ground is the junction where the
analog and digital ground planes are joined together on a mixed-
signal layout design.
In common systems, the star ground can be associated with a

simple narrow continued junction in between analog and digital
ground planes. For more complex designs, the star ground is
commonly implemented with a jumper shunt to a ground header.
No high current carrying a header and jumper shunt is required
because there will be no flow of current in the star ground. Rather,
its main purpose is to make sure that both grounds have the same
reference levels.
Designers must always check grounding recommendations found

in each device’s datasheet to ensure grounding specifications will
be met and avoid ground-related issues.
On another note, for mixed-signal devices with AGND and DGND

pins, these can be tied to their respective ground planes since the
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star ground also will connect both grounds at one point. In this
way, all noisy digital currents will flow through the digital power
supply down to the digital ground plane and back to the digital
supply while being isolated from the sensitive analog circuitry.
Isolation of the AGND and DGND planes must be implemented on
all layers of a multilayer PCB.
Other Common Grounding Practices
This procedure/checklist can help to ensure an appropriate

grounding scheme has been implemented in a mixed-signal
analog/digital system:
Wide copper traces should make up the connections at the

star point.
Check the ground plane for narrow traces, as these
connections are undesired.
It’s useful to provide pads and vias so that the analog and
digital ground planes can be connected, if necessary.
Conclusion
The PCB layout for mixed-signal applications can be challenging.

Creating a component floorplan is just the starting point. Properly
managing board layers and preparing an adequate grounding
scheme also are part of the key points a system designer must
consider when trying to achieve optimum performance in a mixed-
signal system layout.
Preparing a component floorplan will help set the overall integrity

of the system design. Proper board-layer organization will help
manage the currents and signal throughout the board. Finally,
choosing the most beneficial grounding scheme will improve the
system’s performance and prevent any issues with noisy signals
and return current.
Acknowledgement
The material presented in this article was compiled from many

contributors, including Eric Carty, Genesis Garcia, Giovanni
Aguirri, Brendan Somers, Stuart Servis, Leandro Peje, Mar
Christian Lacida, and Yoworex Tiu.
Read more articles in the TechXchange: PCB Tools and

Technology.
References
Walt Kester, TheDataConversionHandbook. Analog Devices, Inc.,

2005.
John Ardizzoni, “APracticalGuidetoHigh-SpeedPrinted-Circuit-

BoardLayout.” Analog Dialogue, Vol. 39, No. 9,
September 2005.
Ralph Morrison, Grounding and Shielding Techniques. John

Wiley & Sons, Inc., 1998.
Thomas O’Shea, “AN-1349 Application Note: PCB Implementation

Guidelines to Minimize Radiated Emissions on the
ADM2582E/ADM2587E RS-485/RS-422 Transceivers.” Analog
Devices, Inc., August 2018.
“MT-101TutorialDecouplingTechniques.” Analog Devices, Inc.,

2009.
LinearCircuitDesignHandbook. Analog Devices, Inc., 2008.
Paul Brokaw, “AN-342ApplicationNote,AnalogSignal-

HandlingforHighSpeedand Accuracy.” Analog Devices, Inc.
Walt Kester, James Bryant, and Mike Byrne, “MT-031 Tutorial

Grounding Data Converters and Solving the Mystery of ‘AGND’
and‘DGND’.” Analog Devices, Inc., 2009.
Paul Brokaw and Jeff Barrow, “AN-345 Application Note:

Grounding for Low- and High-Frequency Circuits, Know Your
Ground and Signal Paths for Effective Designs, Current Flow
Seeks Path of Least Impedance–Not Just Resistance.” Analog
Devices, Inc.
Doug Grant and Scott Wurce, “AN-348 Application Note:

Avoiding Passive ComponentPitfalls, The Wrong Passive
ComponentCan Derail Even the Best Op Amp or Data Converter
Here Are Some Basic Traps to Watch For.” Analog Devices, Inc.
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15/04/2023, 08:20 Basic Guidelines for Mixed-Signal PCB Layout Design | Electronic Design

TOP TECH ANALOG POWER EMBEDDED TEST AUTOMATION AUTOMOTIVE DATA

Basic Guidelines for Mixed-Signal

What you'll learn: ng

A mixed-signal printed-circuit-board (PCB) design requires basic Has

integrity all throughout the system.

PCB layout—an important part of the mixed-signal development SPONSORED

Grounding also is an integral process in the PCB layout design of a

Similar to building a house, it’s essential to create a floorplan of

In developing a floorplan, it’s advisable to follow the signal path of

Analog and Digital Blocks Partition

Figure 1 shows a good example of analog and digital circuit

Sensitive analog components such as amplifiers and voltage

while DVDD should be connected to the digital section.

center of the board for better thermal dissipation, and, at the

1. Partition of analog and digital circuits.

The power supply is an important part of the circuit and should be

On the other hand, power-supply routing should be short, direct,

Power-supply rejection ratio (PSRR) is an important parameter a

To maintain an optimum PSRR, it’s necessary to keep the high

The whole concept of correct decoupling is to develop a low-noise

Designers must always check the high-frequency filtering

While electrolytic capacitors act as charge reservoirs to

2. A decoupling technique for power-supply pins.

Once component placement and the floorplan have been set, we

A board layer is the vertical arrangement of the copper layers in

A visual representation of the board layers is shown in Figure 3.

3. A sample four-layer PCB.

In general, high-performance data-collecting systems should have

Power and ground planes must be adjacent to each other as they

Ground Plane: To Split or Not to Split?

Grounding is an essential process in the layout design of a mixed-

It’s become a standard grounding approach for mixed-signal

Single Ground Plane

The simple circuit in Figure 4 shows the advantage of a single

4. Return current for a system with a solid ground plane.

Analog and Digital Ground Separation

For complex systems in which a solid ground scheme can be

5. Return current for systems with a split ground plane.

In common systems, the star ground can be associated with a

Designers must always check grounding recommendations found

On another note, for mixed-signal devices with AGND and DGND

Other Common Grounding Practices

This procedure/checklist can help to ensure an appropriate

Wide copper traces should make up the connections at the

The PCB layout for mixed-signal applications can be challenging.

Preparing a component floorplan will help set the overall integrity

The material presented in this article was compiled from many

Read more articles in the TechXchange: PCB Tools and

Walt Kester, TheDataConversionHandbook. Analog Devices, Inc.,

John Ardizzoni, “APracticalGuidetoHigh-SpeedPrinted-Circuit-

Ralph Morrison, Grounding and Shielding Techniques. John

Thomas O’Shea, “AN-1349 Application Note: PCB Implementation

“MT-101TutorialDecouplingTechniques.” Analog Devices, Inc.,

LinearCircuitDesignHandbook. Analog Devices, Inc., 2008.

Paul Brokaw, “AN-342ApplicationNote,AnalogSignal-

Walt Kester, James Bryant, and Mike Byrne, “MT-031 Tutorial

Paul Brokaw and Jeff Barrow, “AN-345 Application Note:

Doug Grant and Scott Wurce, “AN-348 Application Note: