USER MANUAL

Mask Aligners

MA6 / MA8
Manual Mask Aligner
Rev05/ 07-06

www.suss.com
 Contents
I
Contents

Preface .................................................................................................................................................. a

1. Operation of the Machine ................................................................................. 1

1.1 Definitions .......................................................................................................................... 3
1.1.1 How to Use this Manual ........................................................................................ 3
1.1.2 Key LED's ............................................................................................................. 3
1.1.3 Coordinate Systems .............................................................................................. 4
1.1.4 Components of the Exposure Optics ..................................................................... 5
1.1.4.1 Exposure Lamp ....................................................................................... 6
1.1.4.2 Ellipsoidal Mirror ...................................................................................... 6
1.1.4.3 Cold Light Mirror ..................................................................................... 6
1.1.4.4 Fly’s Eye Lens ......................................................................................... 6
1.1.4.5 Condenser Lens ...................................................................................... 6
1.1.4.6 Filters ...................................................................................................... 6
1.1.4.7 Integrator Block ...................................................................................... 6
1.1.4.8 Field Lens ............................................................................................... 6
1.1.4.9 Turning Mirror ......................................................................................... 6
1.1.4.10 Front Lens ............................................................................................... 6
1.1.4.11 Cleaning of Optical Parts ......................................................................... 7
1.1.4.12 Deep UV Exposure .................................................................................. 7
1.2 Controls and Indicators ...................................................................................................... 8
1.2.1 Alignment Stage Controls ...................................................................................... 8
1.2.2 Front Panel Controls .............................................................................................. 9
1.2.3 Keyboard Controls .............................................................................................. 11
1.2.4 TSA-Microscope Controls ................................................................................... 15
1.2.4.1 M 3xx Microscope ................................................................................ 16
1.2.4.2 Dual Video Microscope DVM 6/8 .......................................................... 18
1.2.5 Lamp House Controls ......................................................................................... 18
1.2.6 Joystick and Buttons ........................................................................................... 19
1.3 Operating Procedures ..................................................................................................... 20
1.3.1 Power on Procedure ........................................................................................... 20
1.3.2 First Mask Print Mode ......................................................................................... 20
1.3.3 Top Side Alignment ............................................................................................. 21
1.3.4 Bottom Side Alignment ........................................................................................ 23
1.3.5 Single Bottom Side Alignment ............................................................................. 24
1.4 Advanced Technology ..................................................................................................... 26
1.4.1 Exposure Programs ............................................................................................. 26
1.4.2 Multiple Exposure ................................................................................................ 27
1.4.3 Wedge Error Compensation ................................................................................ 27
1.4.4 Load Mask by Slide ............................................................................................. 27
1.5 Step by Step Machine Interactions .................................................................................. 29
1.5.1 Select Mask Loading Type .................................................................................. 29
1.5.2 SELECT PROGRAM for Exposure ....................................................................... 30
1.5.3 EDIT PARAMETER Menu .................................................................................... 31
1.5.4 Changing the TSA, BSA and Stage Alignment Speed .......................................... 32
1.5.5 EDIT PROGRAM Menu ........................................................................................ 33
1.5.6 Change Mask ...................................................................................................... 34
1.5.7 Load Wafer ......................................................................................................... 35
1.5.8 Load Mask by Slide ............................................................................................. 36

2. Maintenance ....................................................................................................39
2.1 General ............................................................................................................................. 39

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 Contents
I
2.1.1 General Maintenance ............................................................................................ 39
2.1.2 Visual Checks ....................................................................................................... 39
2.1.3 Test Run ............................................................................................................... 39
2.1.4 Safety System Check ........................................................................................... 39
2.2 Preventive Maintenance for MA6/ MA8 ............................................................................. 39
2.2.1 Cleaning ............................................................................................................... 39
2.2.2 Lamp Service ....................................................................................................... 40
2.2.3 Greasing ............................................................................................................... 40
2.2.4 WEC-Check ......................................................................................................... 40
2.2.5 Recommended SUSS Service .............................................................................. 40
2.3 Measuring the Intensity/ Uniformity of the Exposure Light ................................................. 40
2.3.1 Power Supply Calibration ...................................................................................... 40
2.3.2 Alignment of Lamp in Ellipsoid Mirror .................................................................... 41
2.4 Replacement of the Exposure Lamp 1000 W .................................................................... 43
2.4.1 Replacement Procedure ....................................................................................... 43
2.4.2 Adjusting the Exposure Lamp ............................................................................... 43
2.4.3 N2-Control ........................................................................................................... 45
2.4.4 Exhaust Flow Control (in Lamp house Intake Tube) ............................................... 45
2.4.5 Use of Other Lamps ............................................................................................. 45
2.4.6 Lamp House 350W and 350W Lamp Replacement .............................................. 45
2.5 Replacement of the Microscope Lamp ............................................................................. 46
2.6 Cleaning of Optical Components ...................................................................................... 47
2.6.1 Cleaning Materials ................................................................................................ 48
2.6.2 Application Technique .......................................................................................... 48
2.6.3 Cleaning Procedure .............................................................................................. 48
2.6.4 Safe Clean-up after Use of Solvents ..................................................................... 50
2.6.5 Removal and Re-Insertion of Specific Optical Components .................................. 50
2..6.6 Conclusion ........................................................................................................... 51
2.7 Facts and Data for Maintenance and Service .................................................................... 51
2.7.1 Consumables ....................................................................................................... 51
2.7.2 Hazardous Materials and Solid Waste .................................................................. 52
2.7.3 Service Exchange of Heavy Subassemblies ......................................................... 52
2.7.4 Supplier’s Contact ................................................................................................ 52

3 Appendix ......................................................................................................... 53
3.1 Parameter Ranges and Default Settings ........................................................................... 53
3.2 List of Abbreviations ....................................................................................................... 55
3.3 Spare Parts Llist (Extract) ................................................................................................. 57
3.4 Lock-Out / Tag-Out Checklist .......................................................................................... 63
3.5 Schematics of the Pneumatic System .............................................................................. 65
3.6. Schematics of the Electronic System MA6/8 BA6/8........................................................... 82
3.7 Service Information .......................................................................................................... 84
3.7.1 Subassemblies: MA8; MA6; MA6/BA6; BA6; MA6/BA6-ISA; ............................... 84
3.7.2 Overview for Valves, Throttles, Sensors, etc. ....................................................... 85
3.8 International Chemical Safety Cards ................................................................................. 95

II MA6 / MA8 - Contents - Rev.05 07-06

 Preface

Preface

The SUSS laboratory mask aligners are machines designed for photolithography applica-
tions in laboratories and for small-scale production. The MA6 and MA8 machines only differ
insignificantly in terms of operation.

Accordingly, the manuals for the mask aligners MA6 and MA8 have also been combined.
In this manual, minor differences are given special mention or are described by means of
specially identified pictures or sketches. Essentially, the differences relate to:

– machine dimensions, outline and weight

– travel path of the microscscope
– maximum size of the masks and substrates/wafers which are used
– changeover between mask aligner and bond aligner operation
(a detailed description is provided in BA6 Bond Aligner manual)

All of the tooling for the MA6 and MA8, e.g. chucks, mask holders and mask holder adapter
frames can be used on both mask aligners. Excepted from this are the BSA chucks for
BSA microscopes with split-field magnification. The BSA apertures are approx. 185mm
wide in a horizontal direction. This means that these chucks cannot be used on a standard
mask aligner with standard BSA microscopes.

MA6 / MA8 - Preface - Rev.05 07-06 a

b MA6 / MA8 - Preface - Rev.05 07-06
 Attention !

Attention !

It is strongly recommended to read this

User Manual before starting the Mask
Aligner the first time.

MA6 / MA8 - Attention ! - Rev.05 07-06 c

d MA6 / MA8 - Attention ! - Rev.05 07-06
 Operation of the Machine
1
1. OPERATION OF THE MACHINE
The SUSS MA6 Mask Aligner is designed for high aligning wafers, substrates and fractions of it. Based
resolution photolithography in a laboratory for devel- on the proven world wide leader in it's lithography ap-
opment, small volume production or pilot production plication for more then three decades the SUSS
environment. MJB3.
It offers unsurpassed flexibility in the handling of irreg- With the SUSS MA6, all contact exposure programs
ularly shaped substrates of varying thickness, as well are supplied (vacuum, hard, soft contact and proxim-
as standard size wafers up to 150 mm in diameter ity). X- and Y-shift are below 0.1 µm and not detect-
and substrates up to 6"x 6". able by optical means.
Wafers and substrates up to 6 mm thickness may be The 400 nm exposure wavelength version is capable
processed. of 0.6 µm resolution in vacuum contact. Using 300
nm or 250 nm exposure optics or an excimer laser
With the modular concept, the MA6 enable easy ser-
improves resolution to 0.2 µm.
vice. The functional groups are easily accessible and
the subassemblies can be quickly exchanged. Various alignment options are available. Top side
alignment with a splitfield or a video microscope.
The SUSS MA6 represents a new generation of state
Back side alignment with BSA scopes as well as sev-
of the art mask aligners, combining time proven fea-
eral infrared alignment solutions.
tures with newly developed technology for mask

SUSS Mask Aligner MA6 3 Upper panel control

4 Alignment stage
1 EMERGENCY POWER OFF 5 Keyboard
2 TSA microscope

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 OPERATION OF THE MACHINE
1

SUSS Mask Aligner MA8

1 EMERGENCY POWER OFF

2 TSA microscope
3 Front panel
4 Alignment stage
5 Keyboard

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 Operation of the Machine
1
1.1 Definitions

1.1.1 How to Use this Manual

Start to reading this manual, some rules are applica-
ble. The name of a control function or control indica-
tor is written in capitals. For example:
EDIT PROGRAM
Refers to the key named edit program. Words shown
in the display are included in quotation marks. For ex-
ample:
"move slide into machine and confirm
with ENTER"
A warning for the operator of the machine is written
cursive. For example:
Watch out for the microscope movement!
Every operator control function and display is referred
by a number. The first digit of this is equal to the figure
number showing it. For example:
204. VACUUM gauge
This means that the element labeled VACUUM is a
gauge explained as item 4 and is displayed in figure
2. This documentation is for using the machine as a
mask aligner. The term TOP SUBSTRATE (on which
is the upper focus plane) represents the upper sub-
strate during bond alignment and a mask during li-
thography. The term BOTTOM SUBSTRATE (on
which is the lower focus plane) is replaced in the text
by the word wafer for bondalignment and lithogra-
phy.

1.1.2 Key LED's

Each key of the keyboard except the ARROW keys is
equipped with a light emitting diode, indicating the
following:
– LED on:
key selected or function active
– LED off:
key not selected or function deactivated
– LED flashing:
most applicable key to continue

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 OPERATION OF THE MACHINE
1
1.1.3 Coordinate Systems a coordinate system whose origin is in the center of
the alignment stage unit. The origin of the z-axis is
The length units for the x and y-direction are in milli- equal to the mask plane or upper substrate plane
meter. The z-direction length unit is µm. They refer to (see Figure 1).

Alignment Stage with Coordinate System

101 MAIN POWER switch

102 EMERGENCY POWER OFF key
103 Knob STG-X-MOVEMENT
104 Knob STG-Y-MOVEMENT
105 Knob STG-Θ-MOVEMENT
1 Mask holder
2 Transport slide
3 Snap in connector mask vacuum

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 Operation of the Machine
1
1.1.4 Components of the Exposure
Optics

The components of the optical system are depend- mirrors and a front lens as shown in the adjacent fig-
ing on the used lamp house system. ure.
The UV400, UV300, and UV250, exposure optics
are similar in design. The optical system consists of The following lamp houses are available:
an exposure lamp, ellipsoidal mirror, cold light mir- • LH350
ror • LH1500/1000
fly’s eye lens, condenser lenses, lens plates, turn- • LH5000
ing

9 9 2 1

10 8 7 6 5 4 3
Exposure Optics MA 8 with LH1000

1 Exposure Lamp 6 Filter, optional

2 Ellipsoidal Mirror 7 Integrator Block
3 Cold Light Mirror 8 Field Lens
4 Fly’s Eye Lens or Glass Window 9 Turning Mirror
5 Condenser Lens 10 Front Lens

Warning! Essential Note!

UV light can harm eyes and skin. Accurate arrangement of optical com-
ponents is essential for the quality of
Work on optical components should exposure.
be done with the exposure lamp
switched off, or at least with closed Modify positions or components only if
lamp house shutter. If lighting is es- trained for this job, and when the ap-
sential for adjustment purposes, wear propriate adjustment procedure is
UV protecting goggles and skin protec- available.
tion.
Also orientation of lenses and the cold
light mirror must not be changed.

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 OPERATION OF THE MACHINE
1
1.1.4.1 Exposure Lamp mity in the exposure area, a glass window (same
material) is available.
For the UV400 and UV300 exposure optics, the
standard exposure lamp is a 1000 W high pressure
mercury short-arc lamp in the LH1000.
1.1.4.5 Condenser Lens
The condenser lens collimates the exposure light.
250 nm 313 nm 365 nm 405 nm 436 nm The position of this lens in the mirror house tube af-
fects the intensity and uniformity of the exposure
light. A scale is mounted along the optical bench in-
side the house tube. The position of the condenser
lens depends on the type of exposure optics. The
condenser lens is made of optical grade fused sili-
ca.

1.1.4.6 Filters
The filter is located between the condenser lens
and the integrator block. Filters are used to select
more specific the exposure wavelength then the
cold light mirror can do it or reduce the intensity
1.1.4.2 Ellipsoidal Mirror (broad band intensity filter). All filters are made of
The exposure lamp is mounted inside an ellipsoidal quartz glass.
mirror in a way that the light source is exactly at its
first focal point. This mirror collects the radiation 1.1.4.7 Integrator Block
emitted by the lamp and focusses it to the second
The integrator block has two lens plates with an ex-
focal point. The ellipsoidal mirror can be the same
actly defined distance to each other. For a good uni-
for all exposure optics. But very hight reflection is
formity, each single light channel is super
available for standard UV400.
positioned at the exposure plane.The material of
the lenses is optical grade fused silica.
1.1.4.3 Cold Light Mirror
The cold light mirror splits the lamp radiation in the 1.1.4.8 Field Lens
not needed long wavelengths and the exposure
For best uniformity and a maximum of intensity of
light. The long wavelengths pass through the mirror
the exposure light, the field lens overlays each light
and are absorbed by a heat sink. The exposure light
channel of the integrator in the exposure plane on
(cold light) is reflected 90° to the integrator optics. A
each other. The material of the lens is optical grade
selective coating determines the reflected wave-
fused silica.
lengths. This application range (e.g. UV400) is
marked on the mirror as well as the coated face (by
the tip of an arrow at the edge). 1.1.4.9 Turning Mirror
Because of the selective coating at least the cold
It deflects the exposure beam to the exposure area.
light mirror has to be exchanged when ahanging the
The coated side of the mirror has to face the beam.
light application range.
Mirrors with dielectric coating are marked with the
Warning! application range and a sign for the coated surface.
Mirror exchange must be done only by Metallized mirrors are broad band mirrors, but not
trained personnel, who understand all optimized to spectral areas.
the risks associated with lamp replace-
ment!
1.1.4.10 Front Lens
This lens provides collimation and uniformity of the
1.1.4.4 Fly’s Eye Lens exposure beam. The lens is specific for each wave-
length range. For the UV 400 exposure optics the
This lens disperses the light and directs it to the front lens is fabricated of optical crown glass.
condenser lens. The fly’s eye lens is made of optical UV300 requires quartz glass.
grade fused silica for all optical systems.
Alternatively for more intensity but with less unifor-

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 Operation of the Machine
1
1.1.4.11 Cleaning of Optical Parts dose limit. Therefore it is recommended not to look to
the stray light, exiting from the mask stage during ex-
Optical Components can degrade with time by dep- posure and to keep unprotected hands away from
osition of particles or fumes. the stage during exposure.
In this case they must be removed from the ma-
chine and cleaned very carefully, in order to recon-
stitute the original quality of the machine. Warning!
Optical surfaces are polished and/ or coated. Be-
cause of this they are extremely susceptible to me- When using UV250 or UV300 then min-
imize eye-and skin- exposure from UV
chanical damage. For cleaning they must not be stray light by increasing your distance
wiped, but only rinsed with liquid solvent. to the stage during exposure times.
No other solvent than DI-water (with or without mild SUSS MicroTec could also provide a
detergent) or IPA (Isopropyl alcohol) shall be used. special stray light barrier to be placed
The choice between those depends on the charac- on top of the mask holder frame.
ter of contamination. The final cleaning step should
always use clear DI. If there is any doubt about the
adequate cleaning procedure call SUSS service.

See also instructions in the Maintenance chapter

and in the Preventive Maintenance Manual.

Caution!
To avoid damage on optical compo-
nents, use only recommended solvent
and do not wipe.
Place the part back to the identical po-
sition in the exposure optics system as
before

Warning!
When using IPO protect your skin
against contact with the solvent.
IPO is flammable, use it only away from
any ignition source. Do not spill IPO.
Used IPO and tissues soaked with IPO
must be deposited as flammable waste
following local regulations.

For details refer to the host interface documentation

delivered separately. This document describes the
GEM compliant SECS-II interface for the mentioned
equipment. It includes the information required by
the SECS-II and GEM standards including the GEM
State Models, SECS-II Message Documentation,
and other interface details.

1.1.4.12 Deep UV Exposure

Short-wave UV-light (<315nm) has a high biological
radiation effectivness and recommended maximum
dose for skin and eye exposure is very low.
Extended work in front of a laboratory mask aligner at
UV250 or UV300 optics can result in exceeding the

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 OPERATION OF THE MACHINE
1
1.2 Controls and Indicators
101 MAIN POWER switch
This connects the machine to the public power sta-
tion for electricity.

102 EMERGENCY POWER OFF key

In any case of danger press this button to disconnect
the machine from the public power line.

1.2.1 Alignment Stage Controls

103 Knob STG-X-MOVEMENT
This is located at the right side of the alignment stage
and moves the wafer in x-direction. Maximal travel
±10mm.

104 Knob STG-Y-MOVEMENT

This is located at the left side of the alignment stage
and moves the wafer in y-direction. Maximal travel
±5mm.

105 Knob STG-Θ-MOVEMENT

This is the small knob at the right side of the align-
ment stage. Maximal travel ±5°.

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 Operation of the Machine
1
1.2.2 Front Panel Controls

Front panel

Note
Controls of MA8 Front Panel are identical
except their position.

201 POWER SWITCH ELECTRONIC 3 Illumination

210 ILLUMINATION switch
1 Pressure 211 BSA/IR microscope illumination
202 COMPRESSED AIR gauge 212 TSA microscope illumination
203 NITROGEN gauge 213 MAGNIFICATION BSA switch
214 SPLITFIELD switch
4 Vacuum
204 VACUUM gauge 2 Substrate
205 VACUUM CHAMBER gauge (with regulator) 215 TOP SUBSTRATE LEFT/RIGHT
206 VACUUM SEAL (with regulator) 216 BOTTOM SUBSTRATE LEFT/RIGHT
207 WEC - PRESSURE gauge (with regulator)
322 BSA MICROSCOPE key
208 LCD-display 323 LEFT key
209 CONTACT indicator 324 BOTH key
325 RIGHT key
326 TOP/BOTTOM key

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 OPERATION OF THE MACHINE
1
201 POWER SWITCH ELECTRONIC 208 LCD-display
Start the MA6 by turning the switch shortly clockwise This user interface displays instructions, confirma-
to ON and release. Stop the MA6 also by turning the tions and other messages.
switch shortly clockwise to OFF and release.
209 CONTACT indicator
202 COMPRESSED AIR gauge
That lamp lights whenever mask and wafer or two
The machine operates properly when the pressure is wafers for bond alignment are in contact. If you move
set to 5 bar. The air pressure is controlled by a regu- the wafer manually further up, this indicator starts
lator adjusted by a service engineer. flashing.

203 NITROGEN gauge 210 ILLUMINATION switch

N2 gas is used to cool the exposure lamp, establish The illumination is supplied either to the TSA or BSA
a nitrogen "pillow" under the wafer (hard contact ex- microscope by way of fiber optic light cables from a
posure), purge the wafer exposure area, and to break light source. BSA illumination is selected in the BSA/
residual vacuum after vacuum contact and other sec- IR position.
ondary functions. At 1 bar N2 (adjusted by a service
engineer) the machine operates properly. 211 BSA/IR microscope illumination
The potentiometers labeled LEFT and RIGHT realize
204 VACUUM gauge
the fine illumination adjustment for the two objectives
The vacuum supplied to the machine should be of the BSA microscope (BSA/IR is selected).
-0.8 bar related to normal air pressure what means
0.2 bar absolute pressure. 212 TSA microscope illumination
The fine illumination adjustment is performed with the
205 VACUUM CHAMBER gauge
TSA adjustment knob. For the coarse adjustment use
(with regulator)
control 501 (see chapter 3.2.5 Lamp house controls).
The gauge indicates the vacuum level in the vacuum
chamber during exposure. The vacuum level is ad- 213 MAGNIFICATION BSA switch
justed opening a N2 leak valve. Open the vacuum re-
Select between low and high magnification.
strictor LOW VACUUM ADJUSTMENT below the
gauge counter clockwise. Close it by turning the
214 SPLITFIELD switch
knob clockwise.
With the rotary switch in middle position, the left/right
206 VACUUM SEAL (with regulator) objective image is shown on the left/right half side of
the video monitor simultaneously. With the switch in
The required pressure to inflate the rubber lip (neces-
right or left position, the right/left objective image is
sary to create the vacuum chamber) should be set to
displayed on the whole video monitor. Only for the
a value p = 0.1 to 0.2 bar for standard thickness wa-
microscope type M3xx this switch must be in left po-
fer according SEMI specification. Thicker wafer might
sition and the splitfield must be selected at the micro-
need a slightly higher pressure. A improper high pres-
scope itself.
sure could create an overcurrent error.
215 TOP SUBSTRATE LEFT/RIGHT
207 WEC - PRESSURE gauge (with regulator)
In order to improve the image of the mask structures
To perform the wedge error compensation the wafer
displayed on the video monitor only minor focus ad-
must be pressed with a defined force against the
justments are necessary. The two potentiometers in-
mask. The WEC-pressure is used to compensate the
dividually control the fine focus of the BSA and TSA
higher gravitation force of a bigger chuck. The WEC-
microscope objectives at the upper focus plane.
pressure also must be changed proportional to a
change of the wafer area. The air pressure for the
216 BOTTOM SUBSTRATE LEFT/RIGHT
WEC-head can be set in accordance with your pro-
cess requirements (range 0.2 and 1.0 bar). This is In order to improve the image of the wafer structures
done with the corresponding regulator below the displayed on the video monitor only minor focus ad-
gauge. justments are necessary. The two potentiometers in-
dividually control the fine focus of the BSA and TSA
microscope objectives at the lower focus plane.

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 Operation of the Machine
1
1.2.3 Keyboard Controls

Keyboard

301 X, Y-ARROW keys 315 SCAN key

302 FAST key 316 EXPOSURE key
303 SEP keys 317 Multiple Exposure key
304 ALIGN CONT/EXP key 318 LAMP TEST key
305 ALIGNMENT CHECK key 319 PRE-BOND key
306 F1 key 320 PERFORM CLAMPING key
307 LOAD key 321 OPTION key
308 UNLOAD key 322 BSA MICROSCOPE key
309 CHANGE MASK key 323 LEFT key
310 SELECT PROGRAM key 324 BOTH key
311 EDIT PARAMETER key 325 RIGHT key
312 EDIT PROGRAM key 326 TOP/BOTTOM key
313 ENTER key 327 GRAB IMAGE key
314 SET REFERENCE key

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 OPERATION OF THE MACHINE
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301 X, Y-ARROW keys 305 ALIGNMENT CHECK key
The function of these keys depends on the task per- With this key one can check the alignment prior ex-
formed: posure. Particles between mask and wafer or the
edge bead can affect the alignment of the wafer to
– movement of the upper microscope (TSA)
the mask. To test that the alignment remains stable
– movement of the lower microscope(BSA) while moving to exposure position, all parameters of
– movement of the wafer (only motorized stage) the exposure program are triggered except the expo-
(STG) sure itself. This key is active for the exposure pro-
– selection of next/last parameter in the control soft- grams: Vacuum Contact, Low Vacuum Contact, and
ware (X-arrows) Hard Contact. For example: starting the exposure
program "Vacuum Contact" triggers the pneumatic
– change of parameter values (Y-arrows)
procedures:
Arrow keys marked with X are labeled with an triangle
pointing to the right/left. To move the manipulators Pre Vac and Full Vac:
along the X-axis press one of this keys. Arrow keys To check the possible influence of these unexpected
marked with Y are labeled with an triangle pointing factors before exposure, press the ALIGNMENT
upward/downward. To move the manipulators along CHECK key. Press this key again to release the wafer
the Y-axis press one of this keys. In case the manip- back into alignment gap.
ulator reaches one/both limit positions along the X-
and/or Y-axis, the message on the monitor indicates: If mask and wafer are in contact
(CONTACT INDICATOR on),
"HW or SW limits active - use ARROW don't align the wafer!
keys"
to move back into regular range use the key for the 306 F1 key
opposite direction. If one wishes to leave the variable unchanged, simply
press the flashing F1 key.
302 FAST key
The different functions of F1 key are:
Activating this key (LED is ON) enables the movement
of the microscope manipulator and motorized stage – Microscope up/down
if existing into the desired direction with the fast During loading, aligning and exposure the micro-
speed (otherwise the movement is performed with scope does all necessary up and down move-
the slow speed). The speed level can be adjusted ments automatically. For a better view to mask
with function F1 - change align speed (see explana- and wafer this is manually possible by using the
tions to key F1). F1 key.
– Change alignment speed
303 SEP keys The user can select between slow and fast align-
ment speed by the FAST key. The speed selected
The keys are labeled with an arrow pointing upward
by the FAST key (fast or slow) will be displayed
and downward and marked with SEP (separation).
here. Select the desired alignment speed for the
With these keys the alignment position of the wafer
microscopes and motorized stage (if existing).
can be changed in steps of 1 µm along the z-axis.
The Y-ARROW keys change the parameter value,
The keys are active after WEC. Moving to mask con-
the X-ARROW keys toggle between the TSA, BSA
tact the CONTACT indicator lights on. Further moving
and STG parameter. Pressing the FAST key en-
the wafer up this indicator flashes.
ables the adjustment of the other speed parame-
If mask and wafer are in contact ter (see also 3.5.4 Changing the TSA, BSA and
(CONTACT INDICATOR on), stage alignment speed).
don't align the wafer! – Single step config
Define the step width for the alignment stage
304 ALIGN CONT/EXP key movement per each depression of a arrow key.
Acts as a toggle switch. The operator can quickly – Centering stage
change the position of the wafer between alignment For every WEC procedure the alignment stage
gap and exposure position relative to the mask. move to the center position for x, y and Θ. Center-
ing stage on (default) means, the wafer goes to
If mask and wafer are in contact
alignment gap keeping this center position. Cen-
(CONTACT INDICATOR on),
tering stage off means, the alignment stage move
don't align the wafer!

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 Operation of the Machine
1
to the X-, Y- and Θ-position used during the pre- 308 UNLOAD key
vious alignment at time of EXPOSURE key activa-
If one wishes to unload the wafer, press this key. This
tion. In case a prior saved program contains this
key also terminates some working sequences. Press-
position values, it will be activated.
ing UNLOAD after starting the exposure cycle the ex-
– Select maskloading posure sequence will be completed without exposure
The two options for the loading process are: itself.
• load manually (default)
• load by slide 309 CHANGE MASK key
Starting from the initial screen the operator initiates
the procedure for changing (loading/unloading) of the
For Load by slide it's possible to select between:
mask.
• without alignment of the mask (no align)
Unload the mask before powering off
• with BSA alignment of the mask (BSA align) the machine!

Both loading procedures are described separately

310 SELECT PROGRAM key
(see chapters 3.3.2 First mask print mode and 3.5.8
Load mask by slide). Select one of the six exposure programs of the ma-
chine (see also chapter 3.5.2).
– Scope synchron.
Infrared light is used to look through Wafer which
311 EDIT PARAMETER key
are opaque for visible light. The light is locally sup-
plied using the BSA microscope arms. The TSA After the desired exposure program has been select-
microscope is used as a transmitted light micro- ed, press the EDIT PARAMETER key. Edit the param-
scope. Synchronous movement of TSA and BSA eter of the exposure program. The parameter is
microscope is necessary. To enable this, deacti- changed with the corresponding Y-directional arrow
vate the BSA MICROSCOPE key. Switch the IL- key. The next parameter is selected by the X-direc-
LUMINATION switch (210) to BSR/IR and (if tional arrow key. The number of parameters depends
existing) the IR switch on. Adjust the TSA-objec- on the selected exposure program (see also chapter
tives by the OBJECTIVE X-SEPARATION knobs 3.5.3).
(405) to the location of the IR-light supply. The
synchronous scope movement is only possible by 312 EDIT PROGRAM key
the arrow keys.
This key enables the operator to assign all parameter
– Single BSA al. settings and the microscope position to a program
Use this special function to align substrates which number ranging from [0] to [99]. This number helps to
alignment mark distance is smaller then the mini- keep all settings in the nonvolatile memory (see also
mum distance of the BSA objectives. For this case chapter 3.5.5):
use only one objective in connection with the SET
REFERENCE key and SCAN key. For detailed in- – save
structions read chapter 3.3.5. after exposure program selection and the param-
eter adjustment, press the EDIT PROGRAM key
– WEC-delay
and toggle to "save" using the x-ARROW keys.
A large wafer needs longer time to set itself exact-
Assign a program number using the y-ARROW-
ly parallel to the mask. This is necessary to get
keys. Press ENTER key to save it. A former saved
high quality mask prints of small structures over
program to this number will be overwritten.
the whole wafer. The necessary time must be
tested and set by the operator. – load
press the EDIT PROGRAM key and toggle to
307 LOAD key "load". Select a program number to load a former
saved program. Press ENTER key to load it.
After the machine has been powered on, the LED of
– delete
the LOAD key is flashing. Hit the LOAD key to finalize
press the EDIT PROGRAM key and toggle to "de-
the boot procedure.
lete". Select a program number to delete. Delete
Press the LOAD key to start the wafer loading proce- the displayed program.
dure.

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 OPERATION OF THE MACHINE
1
313 ENTER key 322 BSA MICROSCOPE key
Press the ENTER key to confirm an action whenever Toggles the motor control and image processing be-
the program prompts you to do so. tween TSA (LED off) and BSA (LED on) microscopes.

314 SET REFERENCE key 323 LEFT key

The SET REFERENCE key enables the operator to For BSA alignment only the movement of the left ob-
store the actual microscope position of the TSA or jective is possible.
BSA microscope as reference position. This is neces-
sary for the SCAN key function. This can be used also 324 BOTH key
for the alignment stage.
The simultaneous movement of both BSA-objectives
is possible.
315 SCAN key
This key can be used only after a reference position 325 RIGHT key
for the selected microscope with the SET REFER-
For BSA alignment only the movement of the right
ENCE key is stored (i.e. the position for the first align-
objective is possible.
ment mark). Then the microscope can be moved to a
new position (i.e. the position for the second align-
326 TOP/BOTTOM key
ment mark). Activating the SCAN key toggle the po-
sition of the microscope between the current position Toggle the focus plane between mask plane (LED on)
and the reference position. This can be used also for and wafer plane.
the alignment stage.
327 GRAB IMAGE key
316 EXPOSURE key
By activating this key the current monitor image is
This key starts the active exposure program after an stored as background image to be superimposed
alignment or in first mask print mode. with the wafer image later on.

317 Multiple Exposure key

It is possible to split the exposure in several intervals.
The key must be activated for this (LED on). See also
chapter 3.4.2.

318 LAMP TEST key

Pressing this key moves the mirror house forward
and open the light shutter. Exposure intensity and
uniformity adjustment is possible. Deactivating this
key finish this task.

319 PRE-BOND key

Enabled only in the bond-aligner-mode: this moves
the wafers together and the vacuum sequence starts.

320 PERFORM CLAMPING key

Enabled only in the bond-aligner-mode: this clamps
the wafers together with or without spacers.

321 OPTION key

The X-ARROW keys controls the Θ-movement for the
motorized alignment stage when OPTION key is acti-
vated.

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 Operation of the Machine
1
1.2.4 TSA-Microscope Controls

TSA-Microscope M 336

401 BEAM SPLITTER TSA

402 TSA Z-MOVEMENT knob
403 TSA Θ-MOVEMENT knob
404 OBJECTIVE FOCUS FINE MANUAL knob
405 OBJECTIVE X-SEPARATION knobs
406 CLAMPING SCREW
407 APERTURE TSA-Illumination
408 TSA SPLITFIELD switch
409 Turret

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 OPERATION OF THE MACHINE
1
1.2.4.1 M 3xx Microscope 409 Turret

Before using the microscope make secure the TSA il- Turn the knurled ring to move another objective in the
lumination (control 210) is on and the BSA MICRO- beam.
SCOPE key is off. Turn the SPLITFIELD switch
(control 214) on the front panel to left to get the TSA
image on the monitor.

401 BEAM SPLITTER TSA

This slide on right side of the microscope tube guide
the beam to the eyepieces, the monitor or both.

402 TSA Z-MOVEMENT knob

The fine movement works at any position in a range
less than on turn and with a low torque. Continuing
rotation increases the torque and enables the coarse
adjustment.

403 TSA Θ-MOVEMENT knob

Rotates the microscopes around the z-axis by turn-
ing the knob located in the upper right TSA micro-
scope front.

404 OBJECTIVE FOCUS FINE MANUAL knob

For the M 3xx without motorized focus, fine focus of
the left/right objective is possible by the left/right
knobs only.

405 OBJECTIVE X-SEPARATION knobs

The right/left objective can move independently in x-
direction by the big knobs located in the right/left side
of the TSA microscope body. Never turn this screw
when the CLAMPING SCREW is fixed.

406 CLAMPING SCREW

This has two functions. First it acts as a crank. Sec-
ond it is used to clamp a certain objective position.
Press that knob gentle toward the microscope body
and turn clockwise. To release turn in the opposite di-
rection until it snaps out.

407 APERTURE TSA-Illumination

This right/left aperture at TSA-microscope front ad-
justs the illumination for the right/left TSA-objective
separately.

408 TSA SPLITFIELD switch

Located on the microscope front this switch selects
the left, right or both TSA-objective as source for the
eyepieces and monitor image.

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 Operation of the Machine
1

Dual Video Microscope DVM 6

402 TSA Z-MOVEMENT Knob

403 TSA Θ-MOVEMENT knob
405 OBJECTIVE X-SEPARATION knobs
407 APERTURE TSA-Illumination
409 Turret

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 OPERATION OF THE MACHINE
1
1.2.4.2 Dual Video Microscope DVM 6/8 1.2.5 Lamp House Controls
Before using the microscope make secure the ILLU-
MINATION TSA (210) is on and the BSA MICRO-
SCOPE key is off.

401 BEAM SPLITTER TSA

On this microscope not necessary.

402 TSA Z-MOVEMENT Knob

Turn this big knob to focus the microscope coarse.

403 TSA Θ-MOVEMENT knob

Rotates the microscopes around the z-axis by turn-
ing the knob located in the upper right TSA micro-
scope front.

404 OBJECTIVE FOCUS FINE MANUAL knob

This is a motorized focus here.

405 OBJECTIVE X-SEPARATION knobs

The right/left objective can move independently in x-
direction by the big knobs located in the right/left side
of the TSA microscope body.

406 CLAMPING SCREW

Does not exist at this microscope.

407 APERTURE TSA-Illumination

This right/left aperture at TSA-microscope front ad-
justs the illumination for the right/left TSA-objective Lamp house LH 350 and LH 1000
separately.
501 Illumination adjustment coarse
1 Thumb wheel housing
408 TSA SPLITFIELD switch
This function is electronically realized. See the manual 501 ILLUMINATION ADJUSTMENT COARSE
for the corresponding image processing system.
For a coarse adjustment of the light intensity turn the
thumb wheel at the microscope light source. Turn
409 Turret
clockwise / counterclockwise to open/close the ap-
Turn the knurled ring to move another objective into erture. The big thumb wheel ILLUMINATION AD-
the beam. JUSTMENT COARSE (501) has a diameter of nearly
5 cm, 0.5 cm thick.
For the lamphouse LH 350 find the adjustment wheel
behind the lamp house. It might be necessary to re-
move the left stainless steel cover of the lamphouse
to have access to the microscope illumination.
For the lamphouse LH 1000 find the adjustment
wheel on the upper front side of the lamphouse.
Lamp exchanging is possible opening the two
knurled screws.

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 Operation of the Machine
1
1.2.6 Joystick and Buttons 604 X-Y-JOYSTICK
Flexure the joystick located on the right side of the
(motorized stage only) alignment stage in this direction in which the micro-
scope/alignment stage should move. Release if final
position is reached. The movement speed increase
by a stronger joystick flexure. Activating FAST key al-
lows fast movement.

605 Θ-JOYSTICK (alignment stage only)

This joystick is located at the left side of the alignment
stage. Flexure in x-direction rotates the wafer in fast
speed clockwise or back. Flexure in y-direction ro-
tates the wafer in slow speed clockwise or back.

Joystick keys

601 STG/TSA/BSA button

602 CONT/ALIGN/EXP button
603 SINGLE STEP button
604 X-Y-JOYSTICK

601 STG/TSA/BSA button

• Illuminated:
Joystick and arrow keys controls the alignment
stage motors.
• Dark:
Joystick and arrow keys control the TSA or BSA
motors depending on the status of the BSA MI-
CROSCOPE key (see 322).

602 CONT/ALIGN/EXP button

The wafer is in alignment position if this button is ac-
tivated, otherwise the wafer is in exposure position.

603 SINGLE STEP button

Every joystick flexure or arrow key depression will
only result in a single step movement in accordance
with the value programmed via the F1 key.

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 OPERATION OF THE MACHINE
1
1.3 Operating Procedures Select between mask align- (MA6) and bond align-
(BA6) operation mode (with the Y-ARROW keys). Af-
A condensed step by step operation instruction is de- ter this selection the software is loaded and the ma-
scribed in chapter 3.5 Step by step machine interac- chine is in a initial state, ready for operate and
tions. displays:
"Ready for load"
1.3.1 Power on Procedure All motorized manipulators (TSA, BSA and alignment
stage) are set to the position used before the ma-
A. Before powering on the machine check or ad- chine was powered off. For your information: if you
just need a software reset, press the key combination
– Compressed Air: 5 bar FAST - UNLOAD (nearly 200ms time distance). Keep
– Nitrogen: 1 bar the EDIT PARAMETER key (311) pressed down while
power on the POWER SWITCH ELECTRONIC (201)
– Vacuum. The gauge should read -0.8 bar
overwrites all parameter settings with the default val-
Turn the MAIN POWER switch (on left side of align- ues from the EPROM. Power off the machine by turn-
ment stage) to the ON position. ing the POWER SWITCH ELECTRONIC (201) on the
front panel counterclockwise into OFF position and
B. Ignition of the exposure lamp (CIC 1200) release.
POWER SWITCH ELECTRONIC of the machine
should be OFF. Switch on power of the Constant In-
tensity Controller (CIC). The software version is 1.3.2 First Mask Print Mode
shown in the display. The CIC performs a self calibra-
The first mask print of a wafer is done without align-
tion test and displays "ready". Press CP (constant
ment. This software sequence is started by the EX-
power) key. Display shows "wait", followed by "Start".
POSURE key. Starting from the initial state of the
Press START key. This will ignite the exposure lamp.
machine this steps has to be performed:
LED LAMP LIFE/POWER is flashing until lamp warm-
ing up is finished. For more detailed information use
1. Adjust Parameters
the CIC-manual.
– select mask loading type: F1 key
Attention! Nitrogen failure for longer
Make secure that no mask is loaded before select
then 5 minutes will turn off the
mask loading type.
exposure lamp!
– select exposure mode: SELECT PROGRAM key
C. Starting the machine Press SELECT PROGRAM key (310). Toggle
through the menu and confirm your exposure pro-
Shortly turn the POWER SWITCH ELECTRONIC
gram by pressing SELECT PROGRAM key again.
(201) on the frontpanel clockwise into ON position
and release. Machine initialize. An example for the – edit parameters: EDIT PARAMETER key
display message is: Press EDIT PARAMETER key (311) to edit the pa-
rameter. Change all necessary value and confirm
"Ready for Start - press LOAD Button by pressing EDIT PARAMETER key again.
MA6-BA6-[M] V 4.000 04.05.01 SW:P"
– save all settings: EDIT PROGRAM key
The meaning of the second displayed line is: This function is an optional possibility to save this
parameter set for the future. Toggle with the X-
configuration software version date includ-
ARROW keys to "SAVE Pgm.". Select with the Y-
ed options (here: purge)
ARROW keys a program number. Prior saved
Press the flashing LOAD key on the keyboard. programs to the same number will be overwritten
without warning. Save the settings by the EDIT
"Watch out machine is starting!"
PROGRAM key (312). Existing programs can be
Now you are asked for: loaded from here.
"Select machine configuration: MA6"

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 Operation of the Machine
1
2. Load Mask 1.3.3 Top Side Alignment
Watch out for the microscope
movement!

– start mask loading sequence: CHANGE MASK

key
You have to take out the mask holder, flip it 180°
and put it on the tray left. If a mask is loaded,
press ENTER to toggle the mask vacuum off, re-
tract the mechanical mask clamp and remove the
mask.
– load mask and fix it: ENTER key
Place the mask onto the mask holder against the
stop pins. Toggle the mask vacuum on by press-
ing the ENTER key. Activate the mechanical mask
clamp by pressing on the leaf spring.
– slide the mask holder back into the machine and
clamp it: CHANGE MASK key
Flip the mask holder 180° back and move it into
the machine. Lock the mask holder slide by
pressing CHANGE MASK key again.

3. Load Wafer
– first pull out transport slide and load wafer: EXPO-
SURE key
The machine instructs: "pull slide and load sub-
strate onto chuck". Pull out the transport slide
completely. Insert the proper chuck and place the
wafer against the prealignment pins. Confirm with
ENTER key. Now the wafer is hold by vacuum.
– move slide in: ENTER key
The machine instructs: "move slide into machine
and confirm with ENTER"
– wedge error compensation
WEC starts automatically after the last action is
completed. The wafer is adjusted parallel to the
mask.

4. Exposure Alignment Procedure

After WEC the wafer moves automatically in expo-
1 Grabbed mask alignment marks
sure position. Depending on the exposure program
2 Superimposed wafer alignment marks
selected all program steps will be performed auto-
3 Alignment marks central symmetrical aligned
matically. Exposure takes place. After finishing the
wafer chuck moves down to unload the exposed wa-
In this mode the wafer is aligned to the mask using
fer.
the topside alignment microscope (TSA). The follow-
ing example explains the steps to align and expose
5. Unload Mask: CHANGE MASK key
with manual mask loading, soft contact print and
Hit the CHANGE MASK key and the mask holder will WEC-type contact. Starting from the initial state of
be released. Pull the mask holder out, flip it by 180° the machine these tasks must be performed:
and store it on the tray to your left. Hit ENTER to
switch the mask vacuum off. Retract the mechanical
clamping and remove the mask.

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 OPERATION OF THE MACHINE
1
1. Adjust Parameters wafer against the prealignment pins. Confirm with
ENTER key. Now the wafer is hold by vacuum.
– select mask loading type: F1 key
Make secure that no mask is loaded before select – move slide in: ENTER key
mask loading manual (default). The machine instructs: "move slide into machine
and confirm with ENTER"
– select alignment microscope
Deactivate BSA MICROSCOPE key (LED off). Watch out for the microscope
movement!
– select exposure mode: SELECT PROGRAM key
Press SELECT PROGRAM key (310). Toggle
through the menu and confirm the selection soft – wedge error compensation
contact by pressing SELECT PROGRAM key WEC starts automatically after the last action is
again. completed. The wafer is adjusted parallel to the
– edit parameter: EDIT PARAMETER key mask and moves to the alignment gap. The mi-
Press EDIT PARAMETER key (311) to edit the pa- croscope moves down to start the alignment.
rameter exposure time, alignment gap and WEC-
type. Change all necessary value and confirm by 4. Microscope Alignment
pressing EDIT PARAMETER key again. – set the TSA to meet your requirements (see
– save all settings: EDIT PROGRAM key 3.2.4): SPLITFIELD switch
This function is an optional possibility to save this For the M3xx microscope only, an actual TSA-mi-
parameter set for the future. Toggle with the X- croscope image on the monitor is enabled by
ARROW keys to "SAVE Pgm.". Select with the Y- turning the SPLITFIELD switch (214) to LEFT.
ARROW keys a program number. Prior saved Toggle BSA MICROSCOPE key (322) off. This key
programs to the same number will be overwritten switch also the controlled manipulator motors
without warning. Save the settings by the EDIT from BSA to TSA. If no camera and monitor ex-
PROGRAM key (312). Existing programs can be ists, use the microscope eyepieces.
loaded from here. – microscope illumination: ILLUMINATION to TSA
Turn ILLUMINATION switch (210) to TSA and se-
2. Load Mask lect the light intensity by the potentiometer under
Watch out for the microscope this switch. Separate intensity selection for the
movement! left/right objective is possible with the aperture lo-
cated at the left/right microscope front.
– focus on the mask plane: TOP/BOTTOM key
– start mask loading sequence: CHANGE MASK
Coarse focus is possible by using the TSA Z-
key
MOVEMENT knob (402) placed behind the TSA-
You have to take out the mask holder, flip it 180°
microscope. Make secure the TOP/BOTTOM key
and put it on the tray left. If a mask is loaded,
LED (326) is on and adjust the fine focus sepa-
press ENTER to toggle the mask vacuum off, re-
rately using the TOP SUBSTRATE LEFT/RIGHT
tract the mechanical mask clamp and remove the
(215) regulators. If no motorized focus exist, use
mask.
the OBJECTIVE FOCUS FINE MANUAL (404 ) on
– load mask and fix it: ENTER key the microscope.
Place the mask onto the mask holder against the
– adjust microscope to the mask alignment marks
stop pins. Toggle the mask vacuum on by press-
Move the left/right objective to the left/right mask
ing the ENTER key. Activate the mechanical mask
alignment mark by the OBJECTIVE X-SEPARA-
clamp by pressing on the leaf spring.
TION knobs (405).
– Slide the mask holder back into the machine and
– grab image: GRAB IMAGE key (option)
clamp it: CHANGE MASK key
First keystroke grabs the image. The objectives
Flip the mask holder 180° back and move it into
move the focal plane to the wafer and theTOP/
the machine. Lock the mask holder by pressing
BOTTOM key LED (326) goes off. The motor con-
CHANGE MASK key again.
trol of the microscope manipulator is disabled at
this time. Second keystroke delete the stored im-
3. Load Wafer
age and enables the manipulator again.
– pull out transport slide and load wafer: LOAD key
The machine instructs: "pull slide and load sub-
strate onto chuck". Pull out the transport slide
completely. Insert the proper chuck and place the

22 MA6 / MA8 - 1. Operation of the Machine - Rev.05 07-06

 Operation of the Machine
1
5. Wafer Alignment 1. Adjust Parameters
– focus on the wafer plane – select maskloading type: F1 key
Adjust the left/right microscope image with the Make secure that no mask is loaded before select
BOTTOM SUBSTRATE LEFT/RIGHT (216) regu- mask loading type.
lator. If no motorized focus exist, use the OBJEC- – select alignment microscope
TIVE FOCUS FINE MANUAL (404) on the Activate BSA MICROSCOPE key (LED on).
microscope.
– select exposure mode: SELECT PROGRAM key
– alignment Press SELECT PROGRAM key (310). Toggle
Use the micrometer screws of the alignment through the menu up to exposure type "Vac" and
stage for STG-X-Y-T-MOVEMENT (103, 104, confirm by pressing SELECT PROGRAM key
105). If these doesn't exist use instead this the again.
ARROW-keys or joysticks. Align the wafer align-
– edit parameter: EDIT PARAMETER key
ment marks central symmetrical to the mask
Press EDIT PARAMETER key (311) to edit the pa-
alignment marks(see Figure 7 alignment proce-
rameter for exposure time, alignment gap, preVac
dure).
time, fullVac time, purge time and WEC type:
If mask and wafer are in contact spacer. Confirm the settings by pressing EDIT PA-
(CONTACT INDICATOR on), RAMETER key again.
don't align the wafer!
– save all settings: EDIT PROGRAM key
– alignment check This function is an optional possibility to save this
Depending on your requirements, an alignment parameter set for the future. Toggle with the X-
check could be helpful using the SEP keys (303), ARROW keys to "SAVE Pgm.". Select with the Y-
ALIGN CONT/EXP key (304) or the ALIGNMENT ARROW keys a program number. Prior saved
CHECK key (305). programs to the same number will be overwritten
without warning. Save the settings by EDIT PRO-
6. Exposure GRAM key (312). Existing programs can be load-
ed from here.
– EXPOSURE key
By pressing this key the wafer will move into ex-
2. Load Mask
posure position. Exposure takes place. Despite
the exposure was initiated hitting the UNLOAD Watch out for the microscope
key before the light shutter has opened will con- movement!
tinue it's exposure without wafer exposure. After
finishing the wafer chuck moves down for unload
– start mask loading sequence: CHANGE MASK
the exposed wafer.
key
Watch out for the microscope You have to take out the mask holder, flip it 180°
movement! and put it on the tray left. If a mask is loaded,
press ENTER key to toggle the mask vacuum off,
retract the mechanical mask clamp and remove
7. Unload Mask: CHANGE MASK key the mask.
Hit the CHANGE MASK key and the mask holder will – load mask and fix it: ENTER key
be released. Pull the mask holder out, flip it by 180° Place the mask onto the mask holder against the
and store it on the tray to your left. Hit ENTER to stop pins. Toggle the mask vacuum on by press-
switch the mask vacuum off. Retract the mechanical ing the ENTER key. Activate the mechanical mask
clamping and remove the mask. clamp by pressing on the leaf spring.
– slide the mask holder back into the machine and
1.3.4 Bottom Side Alignment clamp it: CHANGE MASK key
Flip the mask holder 180° back and move it into
The wafer is aligned to the mask using the bottom the machine. Lock the mask holder slide by
side alignment microscope (BSA). The following ex- pressing CHANGE MASK key again.
ample explains the steps to align and expose with
manual mask loading, vacuum contact and WEC-
type proximity. Starting from the initial state of the
machine these steps have to be performed:

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 OPERATION OF THE MACHINE
1
3. Load Wafer Chuck for BSA 6. Wafer Alignment
– Insert a proper chuck without wafer onto the – focus on the wafer plane
transport slide Adjust the left/right objective image with the BOT-
Move the BSA-chuck placed onto the transport TOM SUBSTRATE LEFT/RIGHT (216) regulators.
slide into the machine. Don't press a key. Correct illumination if necessary.
– alignment
4. Microscope Alignment Use the micrometer screws of the alignment
– set the monitor image: SPLITFIELD switch stage for STG-X-Y-Θ-MOVEMENT (103, 104,
Turn the SPLITFIELD switch (214) to middle posi- 105). If these doesn't exist use instead this the
tion and toggle BSA MICROSCOPE key on (LED ARROW-keys or joysticks. Align the wafer align-
on). This key enables the microscope manipula- ment marks central symmetrical to the mask
tors accordingly. alignment marks (see Figure 7 alignment proce-
dure).
– microscope illumination: ILLUMINATION to BSA/
IR If mask and wafer are in contact
Turn the ILLUMINATION switch (210) to BSA/IR (CONTACT INDICATOR on),
and adjust the light intensity by the potentiome- don't align the wafer!
ters labeled BSA/IR microscope illumination left/ – alignment check
right (211). Depending on your requirements, an alignment
– focus on the top focus plane: TOP/BOTTOM key check could be helpful using the SEP keys (303),
Make secure the TOP/BOTTOM key LED (326) is ALIGN CONT/EXP key (304) or the ALIGNMENT
on and adjust the fine focus separately with the CHECK key (305).
TOP SUBSTRATE LEFT/RIGHT regulators.
– move objectives to the chuck opening: LEFT, 7. Exposure
BOTH, RIGHT keys – EXPOSURE key
Select one of these keys to move the left/right ob- By pressing this key the wafer will move into ex-
jective with the ARROW keys. If necessary use posure position. Exposure takes place. Despite
fast speed (FAST key LED on). the exposure was initiated hitting the UNLOAD
– grab image: GRAB IMAGE key (option) key before the light shutter has opened will con-
First keystroke grabs the mask image. The objec- tinue it's exposure without wafer exposure. After
tives move to the wafer focus plane (TOP/BOT- finishing the wafer chuck moves down for unload
TOM key LED off). The motor control of the the exposed wafer.
microscope manipulator is disabled. Second key-
stroke GRAB IMAGE key deletes stored image 8. Unload mask: CHANGE MASK key
and enables the manipulator again.
– CHANGE MASK key
Hit the CHANGE MASK key and the mask holder
5. Load Wafer
will be released. Slide the mask holder out, flip it
– pull out transport slide and load wafer: LOAD key by 180° and store it on the tray to your left. Hit EN-
After grab image the machine informs you: "ready TER to switch the mask vacuum off. Retract the
for load... BSA image stored". Press LOAD key to mechanical clamping and remove the mask.
start this procedure. Load wafer onto chuck and
push slide into the machine as prompted on the
display. Press ENTER key. 1.3.5 Single Bottom Side Alignment
This procedure describes the adjustment of small
Attention! Microscope moves
substrates to a mask using only one BSA micro-
downwards!
scope. Therefor we recommend a transparent wafer
chuck. Starting from the initial state of the machine
these steps have to be performed:
– wedge error compensation
WEC starts automatically. After WEC the wafer
1. Adjust Parameters
will move to the alignment gap.
– select maskloading type: F1 key
Make secure that no mask is loaded before select
mask loading type. Select mask loading by slide
with BSA alignment.

24 MA6 / MA8 - 1. Operation of the Machine - Rev.05 07-06

 Operation of the Machine
1
– select single BSA align: F1 key focus regulator (215). Search for a reference mask
Toggle to single BSA align and enable this option. alignment mark with the BSA microscope. Store
– select alignment microscope this stage position by activating the SET REFER-
Activate BSA MICROSCOPE key (LED on). ENCE key (314). Search for a second mask align-
ment mark only by the x-movement of the BSA-
– select exposure mode: SELECT PROGRAM key
microscope. Toggle back to the reference align-
Press SELECT PROGRAM key (310). Toggle
ment mark using the SCAN key (315). Press
through the menu up to the desired exposure type
GRAB IMAGE key (327) to store the reference
and confirm by pressing SELECT PROGRAM key
alignment mark image. Toggle to the second
again.
alignment mark using the SCAN key (315).
– edit parameter: EDIT PARAMETER key
– mask alignment
Press EDIT PARAMETER key (311) to edit the pa-
For an motorized stage only switch the manipula-
rameter for the exposure. Confirm the settings by
tor control to the stage activating the STG/TSA/
pressing EDIT PARAMETER key again.
BSA button (601). Adjust the real mask alignment
– save all settings: EDIT PROGRAM key mark to the stored one only with the (Θ-JOY-
This function is an optional possibility to save this STICK (605) or the (Θ-micrometer screw of the
parameter set for the future. Toggle with the X- alignment stage about 1/2 of the misalignment.
ARROW keys to "SAVE Pgm.". Select with the Y- Switch the manipulator control to BSA deactivat-
ARROW keys a program number. Prior saved ing the STG/TSA/BSA button (601). Toggle to the
programs to the same number will be overwritten reference alignment mark using the SCAN key
without warning. Save the settings by EDIT PRO- (315). Press GRAB IMAGE key (327) twice to re-
GRAM key (312). Existing programs can be load- lease the stored and grab the new image. Press
ed from here. SCAN key (315) to toggle to the second alignment
mark position. Repeat this mask alignment until
2. Load Mask there is no misalignment left.
– load mask: ENTER key
Attention! Microscope moves up!
Pressing ENTER the mask moves to the mask
holder and is taken by the mask holder vacuum.
Transport chuck moves down for unloading.
– start mask loading sequence: CHANGE MASK
3. Load Substrate
key
Follow the displayed instructions. – load wafer chuck and substrate onto the transport
– load mask holder slide: LOAD key
For this sequence make sure the prealignment We recommend to use a transparent wafer
pins and the mechanical mask clamping is re- chuck. Move the loaded transport slide in and
moved from the mask holder. confirm with ENTER key.
– load mask transfer chuck and mask: ENTER key – wedge error compensation
Insert mask transfer chuck into transport slide. WEC starts automatically. The substrate moves to
Load mask face down onto mask transfer chuck. the alignment gap.
Toggle the mask vacuum on by pressing the EN-
TER key. 4. Substrate Alignment
– slide the transport slide in: ENTER key – alignment preparation
For non motorized stages only if the chuck is not Adjust the microscope illumination using the BSA/
centered, move it with the micrometer screws to IR microscope illumination left/right (211). Select
the middle position. Confirm with ENTER key. Af- the Substrate focus plane by deactivating the
ter WEC relative to the mask holder the mask is in TOP/BOTTOM key (326). Focus by the BOTTOM
100 µm alignment gap. SUBSTRATE LEFT/RIGHT focus regulator (216).
– alignment preparation Search for a reference wafer alignment mark with
Enable the used single BSA microscope using the the BSA microscope. Store this stage position by
SPLITFIELD switch (214). Adjust the microscope activating the SET REFERENCE key (314). Search
illumination using the BSA/IR microscope illumi- for a second wafer alignment mark only by the x-
nation left/right (211). Focus on the mask plane by movement of the BSA-microscope. Toggle back
activating the TOP/BOTTOM key (326) and the to the reference alignment mark using the SCAN
corresponding TOP SUBSTRATE LEFT/RIGHT key (315). Press GRAB IMAGE key (327) to store
the reference alignment mark image. Toggle to

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 OPERATION OF THE MACHINE
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the second alignment mark using the SCAN key
(315).
1.4 Advanced Technology
– substrate alignment
For an motorized stage only switch the manipula- 1.4.1 Exposure Programs
tor control to the stage activating the STG/TSA/
BSA button (601). Adjust the real substrate align- An important parameter for the exposure is the con-
ment mark to the stored one only with the Θ- tact method between mask and wafer. The type of
movement of the alignment stage about 1/2 of the exposure program is selectable with the SELECT
misalignment. Switch the manipulator control to PROGRAM key. After this selection it is possible to
BSA deactivating the STG/TSA/BSA button (601). edit all corresponding parameters by pressing the
Press SCAN key (315) to toggle to the reference EDIT PARAMETER key.
position. Press GRAB IMAGE key (327) to release
the stored image. Deactivate the TOP/BOTTOM Proximity Exposure
key (326) and grab the new image using GRAB This is the most careful exposure for the mask. Mask
IMAGE key (327). Repeat this substrate alignment damage is reduced to a minimum. But the structural
until there is no misalignment left. resolution is not as high as with any contact expo-
– substrate to mask alignment sure. Between mask and wafer is a distance left, the
Move the substrate away using the x-y-movement exposure gap. The gap value is adjustable by the
of the alignment stage to see a real mask align- EDIT PARAMETER key. The wedge error compensa-
ment mark. Focus on the mask plane by activat- tion is performed by using three precision reference
ing the TOP/BOTTOM key (326) and using the spacers between mask and wafer.
corresponding TOP SUBSTRATE LEFT/RIGHT
focus regulator (215). Press GRAB IMAGE key Soft Contact Exposure
(327) to store the mask alignment mark. Move the
Mask and wafer are brought in contact. The structur-
substrate back using the x-y-movement of the
al resolution is better than in proximity exposure. The
alignment stage. Focus on the substrate plane by
vacuum securing the wafer onto the chuck is main-
deactivating the TOP/BOTTOM key (326) and us-
tained during exposure. The only force to press the
ing the corresponding TOP SUBSTRATE LEFT/
wafer against the mask is the force applied during
RIGHT focus regulator (215). Align the substrate
WEC.
alignment mark central symmetrical to the mask
alignment mark. Check the alignment using the
Hard Contact Exposure
ALIGN CONT/EXP key (304).
This is similar to soft contact mode. After the wafer
5. Exposure has moved into contact the vacuum underneath the
wafer is switched off and nitrogen is purged under the
– EXPOSURE key
wafer instead. So a closer contact between wafer
By pressing this key the substrate will move into
and mask is guaranteed, even with large wafers.
exposure position. Exposure takes place. Despite
the exposure was initiated hitting the UNLOAD
Vacuum Contact Exposure
key before the light shutter has opened will con-
tinue it's exposure without substrate exposure. This mode performs the highest resolution levels. Af-
After finishing the wafer chuck moves down for ter the WEC and alignment the wafer is brought into
unload the exposed substrate. contact with the mask. The rubber seal of a neces-
sary vacuum chuck is creating a mini chamber be-
6. Unload Mask tween mask and wafer. The rubber seal pressure is
adjustable by the VACUUM SEAL regulator (206).
– CHANGE MASK key
This chamber is evacuated in steps. Pre vacuum
Hit the CHANGE MASK key to start the unload
gently pulls vacuum into that mini chamber to enable
procedure. Follow the displayed instructions to
a smooth contact between mask and wafer. Further-
unload the mask.
more it prevents gas bubbles to be trapped between
both. Full vacuum will be applied with the next step.
The wafer will be loaded in the closest contact posi-
tion. The vacuum securing the wafer on the chuck is
replaced by nitrogen. In this mode the best contact
between mask and wafer is achieved. After the expo-
sure nitrogen will purge into the mini chamber to

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 Operation of the Machine
1
break the vacuum. The larger the wafer the longer the Two methods are standard:
vacuum and purge times. For best results start a test
– contact mode:
with long times and reduce them gradually. All the pa-
For the exact parallel setting the wafer will be
rameter could be set using the EDIT PARAMETER
moved against the mask.
key (311).
– spacer mode:
Low Vacuum Contact Exposure To treat mask and wafer with maximum care the
machine moves spacers in between both. A prox-
This mode is similar to vacuum contact with one dif- imity mask holder is necessary. Contact area is re-
ference: The vacuum level in the wafer chamber can duced to three points near the wafer edge.
be adjusted by the LOW VACUUM ADJUSTMENT
regulator (205). So the high resolution level of the vac-
uum contact exposure can be combined with a min- Additionally two other methods are also possible.
imum mechanical stress for wafer and mask. Set an Global WEC between mask and chuck. This could be
appropriate vacuum with the vacuum chamber regu- used for pieces or other special applications. It is
lator (205) and test the result using the ALIGNMENT mandatory to set the thickness of a substrate or wa-
CHECK key (305). fer accordingly before WEC procedure is initiated.
– global WEC contact mode:
Flood Exposure
The WEC will be performed between wafer chuck
It is possible to exposure the whole wafer without a and mask without the wafer (GlobCont). Before
mask. After this mode is selected, the exposure can alignment set the wafer thickness. Another pa-
be started from the initial state by pressing the EXPO- rameter of the EDIT PARAMETER menu is listed.
SURE key (316). The exposure takes place as long as It is the substrate thickness.
the exposure time was set independent if a mask – global WEC spacer mode:
(and mask holder) is loaded or not. The WEC will be performed between wafer chuck
and mask using spacers in between (GlobSpac).
1.4.2 Multiple Exposure Depending of the spacer and substrate dimen-
sions it's enabled to perform this with a loaded
For special applications the numerical value for the substrate. Before alignment set the wafer thick-
overall exposure time can be segmented into equal ness using the EDIT PARAMETER menu.
exposure intervals alternating with wait time intervals
in which the wafer is not exposed. One exposure time 1.4.4 Load Mask by Slide
and one wait time is named as one exposure cycle.
To perform Multiple Exposure proceed as follows: Additional to the manual mask loading (described in
the operating procedures, Chapter 3.3.3, Load
– Select the corresponding exposure program by mask) this method is available. Mask and mask hold-
the SELECT PROGRAM key (310). er must not be flipped 180°. The active side of the
– Press the Multiple Exposure key (317). mask is never face up. A standard mask holder and
– Press the EDIT PARAMETER key (311). mask loading chuck are necessary. Working with this
loading sequence prealignment pins and mechanical
– Edit the parameter for the exposure program. Edit
mask clamping has to be removed from the mask
the numerical value of the corresponding param-
holder. Load the mask holder in the stage and clamp
eters wait time and cycles.
it. insert the mask transfer chuck in the transport slide
– Press the flashing EDIT PARAMETER key to finish and place the mask face down on it. Fix it by toggle
editing and start alignment followed by the multi- the vacuum on. Move transport slide in the machine
ple exposure process. and confirm. Now there are two possibilities depend-
ing of the prior selection (by F1 key):
1.4.3 Wedge Error Compensation – without alignment
The machine moves the mask against mask hold-
During this procedure the top side of the wafer will be er. After the vacuum sensor detect that the mask
set exactly parallel to the bottom side of the mask. holder vacuum take in the mask, the transport
This guarantees a perfect gap setting and so a homo- slide vacuum switches off. Transport slide moves
geneous quality of the exposed structures over the down.
whole wafer. Set the WEC type using the EDIT PA-
RAMETER key (311).

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 OPERATION OF THE MACHINE
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– with alignment
The machine moves the mask against mask hold-
er and backwards in a alignment gap. Align mask
now and confirm finally with ENTER key. Mask
moves up. Same procedure as described in with-
out alignment follows.

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 Operation of the Machine
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1.5 Step by Step Machine Interactions

1.5.1 Select Mask Loading Type

For example: select manual mask loading (default)
Unload the mask before this selection is
initiated!

Display message Following operator action (keystroke)

"ready for Load" F1

"microscope up/down" x

"change align speed" x

"single step config" x

"centering stage" x

"select maskloading" ENTER

"manual" x

"slide" x

"manual" ENTER

"ready for load"

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 OPERATION OF THE MACHINE
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1.5.2 SELECT PROGRAM for Exposure
For example: select soft contact

Display message Following operator action (keystroke)

"ready for Load" SELECT PROGRAM

"Exposure Type: Soft" y

"Exposure Type: Flood E" y

"Exposure Type: Prox" y

"Exposure Type: Vac" y

"Exposure Type: Low Vac" y

"Exposure Type: Hard" y

"Exposure Type: Soft" SELECT PROGRAM

"ready for Load"

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 Operation of the Machine
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1.5.3 EDIT PARAMETER Menu
For example: select exposure time, alignment gap,
WEC type and exposure type
The number of parameters listed depends of prior se-
lections.

Display message Following operator action (keystroke)

"ready for Load" EDIT PARAMETER

"Exp. Time [s]: 5.0" x

(Edit value by Y and Y )

"Al. Gap [µm]: 100" x

(Edit value by Y and Y )

"WEC Type: Contact" x

(Edit value by Y and Y )

"Exposure Type: Soft" x

(Edit value by Y and Y )
Press EDIT PARAMETER key to
confirm the edited value

"ready for Load"

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1.5.4 Changing the TSA, BSA and Stage Alignment Speed
(If necessary)

Display message Following operator action (keystroke)

"ready for Load" F1

"microscope up/down" x

"Change align speed" ENTER

"BSA Parameter
Slow Speed [%]: 39" x
(Edit value by Y and Y )

"STG Parameter
Slow Speed [%]: 39" x
(Edit value by Y and Y )

"TSA Parameter
Slow Speed [%]: 39" x
(Edit value by Y and Y )

"BSA Parameter
Slow Speed [%]: 39" ENTER

"ready for Load"

(to edit the fast speed activate the FAST key, LED on)

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 Operation of the Machine
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1.5.5 EDIT PROGRAM Menu
For example: save a program
All active parameters and the stage position are
stored. A stored file number is indicated with [0] on
the display.

Display message Following operator action (keystroke)

"ready for Load" EDIT PROGRAM

"Load Pgm. From: 0" x

(Edit value by Y and Y )

"EXIT Pgm. Editor" x

"DELETE Pgm. no: 0" x

(Edit value by Y and Y )

"SAVE Pgm to: 0" (Edit value by Y and Y )

EDIT PROGRAM

"ready for Load"

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1.5.6 Change Mask
For example: manual

Display message Following operator action (keystroke)

"ready for Load" CHANGE MASK

"Change Mask -
press ENTER to toggle
mask vacuum: OFF" • pull out mask holder and flip it 180°
• deposit it on the tray left
• place the mask against the stop pins
• press ENTER

"Change Mask -
press ENTER to toggle
mask vacuum: ON" • activate the mechanical mask clamping
by pressing the leaf spring
• flip mask holder 180° and slide it back
into the machine (up to the end and
preverably to the right position)
• press CHANGE MASK

"ready for Load"

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1.5.7 Load Wafer

Display message Following operator action (keystroke)

"ready for Load" LOAD

"pull slide and load sub-

strate onto chuck" • place wafer against the prealignment
pins on the chuck
• confirm with ENTER
• vacuum on transport slide goes on

"move slide into machine

and confirm with ENTER" ENTER

"performing WEC - please wait..."

"microscope moving - please wait..."
(if BSA MICROSCOPE key is off)

"Align substrate" • setup microscope (see chap. 3.3.3,

par. 4)
• align wafer
• optional check the alignment using
ALIGN CONT/EXP key (304) or ALIGN-
MENT CHECK key (305)
• press EXPOSURE

"z-axis moving -
please wait..." (wafer moves to exposure position)

"Microscope moving -
please wait..." (exposure takes place)

"please wait..." (wafer moves down)

"Microscope moving - please wait..."

"pull slide and unload

exposed substrate" do it

"ready for Load"

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1.5.8 Load Mask by Slide
For Example: load mask by transport slide with BSA
align
Unload the mask before this selection
is initiated!

Display message Following operator action (keystroke)

"ready for Load" F1

"microscope up/down" x

"Change align speed" x

"single step config" x

"centering stage" x

"select maskloading" ENTER

"manual" x

"slide" ENTER

"no align" y

"TSA align" y

"BSA align" ENTER

"ready for Load" CHANGE MASK

"Load maskholder" ENTER

"Load mask transfer plate and

mask" ENTER

"Perform mask loading - please wait"

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 Operation of the Machine
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Display message Following operator action (keystroke)

"continue: ENTER - align mask

abort: UNLOAD" • align mask using the alignment stage
controls and continue with ENTER

"Performing mask loading -

please wait" (mask vacuum takes mask in)

"center chuck automatically" (mask transfer chuck goes down)

"ready for Load"

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38 MA6 / MA8 - 1. Operation of the Machine - Rev.05 07-06