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Optimizing Reflow 98043 r1

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41 views1 page

Optimizing Reflow 98043 r1

Uploaded by

Bo Burrell
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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Optimizing

Hoja Reflowde Producto


de Datos

A typical reflow profile consists of four stages: preheat, Soak or Dryout — This stage serves to activate the
soak or dryout, reflow, and cooling. Understanding these flux and stabilize temperature across the board before
four stages is essential when designing an effective entering the reflow zone. The forced air convection reflow
thermal profile. ovens of today offer more uniform heat transfer than
the infrared ovens commonly used a few years ago. The
Recommended profile: uniform heating allows a more linear ramp rate right up
to liquidus temperature depending on board size, density
& oven efficiency. This eliminates the hump or shoulder
profile of the past where the board was held at around
150°C for 1 to 2 minutes.

Reflow — Actual soldering occurs in this stage. As the


profile moves into the reflow zone, the ramp rate should
increase to 2.5°–3.5°C/second up to a peak temperature
of 30°–40°C above the liquidus temperature. The time
above liquidus should be 30–90 seconds to reduce

APPLICATION NOTE
Preheat — The objective of the preheat stage is to excessive intermetallic formation which can weaken
elevate the board and components to a temperature solder joints. Thermal damage and charring of the post
between 120° and 150°C. This drives off volatile solvents reflow residue can also result from excessive time above
in the paste and attempts to minimize thermal shock liquidus and/or too high a peak temperature.
on components. A ramp rate of 0.5°–2°C/second is
recommended. Too fast a ramp rate can result in solder Cool Down — A cooling rate of <4°C/second is
balls due to spattering caused by rapid outgassing of recommended to allow the board to cool quickly, solidify
volatile solvents. Wicking, skewing and additional defects the solder joint and minimize intermetallic growth. Cooling
may occur during a fast preheat. Faster ramp rates may also prevents discharge of flux fumes into the work area
be evaluated with respect to process requirements. and allows manual handling of the boards. A fast cooling
Contact component suppliers for their recommended rate produces a small, tight grain structure which is
ramp rate and observe reflowed boards closely for desired. Too slow a cooling rate can result in a large grain
any defects mentioned above. If a faster ramp rate is structure and a weaker, less reliable solder joint.
required, a compromise may be reached by increasing the
peak temperature and/or time above liquidus.

This application note is provided for general information only. It is not intended, and shall not be construed, to warrant or guarantee the performance of the products
described which are sold subject exclusively to written warranties and limitations thereon included in product packaging and invoices. All Indium Corporation’s
products and solutions are designed to be commercially available unless specifically stated otherwise.
Form No. 98043 R1

www.indium.com [email protected]
ASIA: Singapore, Cheongju, Malaysia: +65 6268 8678
CHINA: Suzhou, Shenzhen: +86 (0)512 628 34900
EUROPE: Milton Keynes, Torino: +44 (0) 1908 580400
USA: Utica, Clinton, Chicago, Rome: +1 315 853 4900
©2016 Indium Corporation

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