CMC Callforpapers CollaborativeEdgeIntelligenceandItsEmergingApplications
CMC Callforpapers CollaborativeEdgeIntelligenceandItsEmergingApplications
Applications
Large AI models
Prof. Milos Stojmenovic
Singidunum University, Serbia Blockchain and web3
5G and beyond
Summary
In recent years, we have witnessed the great success of edge computing with a wide range of successful applications,
such as on-site IoT (internet of things) data processing and smart home. In these applications, edge devices receive
computation tasks from the end devices and collaborate with the cloud to accomplish the tasks. However, such edge
computing solutions are inadequate. On the one hand, edge devices still need to communicate frequently with the
remote central cloud, leading to high latency and privacy concerns. On the other hand, edge devices only handle
simplistic tasks, while emerging applications (e.g., intelligence transportation systems and metaverse) demand advanced
AI services.
To address the limitations, the industry and research communities have proposed collaborative edge intelligence (CEI), a
new distributed computing paradigm in which edge devices are interconnected to provide artificial intelligence services.
CEI is autonomous in that it eliminates reliance on remote central clouds to perform tasks. In CEI, edge devices are
equipped with heterogeneous hardware (e.g., TPU, GPU, and CPU) to support the training and inference of AI models.
CEI echoes the increasing demands on AI hardware and services.
Researchers and practitioners are also investigating the integration of CEI with other emerging technologies, including
large AI models, blockchain, 6G, and web3. For instance, it is possible to infer and finetune large AI models on CEI now,
and training is also on the way to realization. Blockchain technology can be employed as the system-level security
solution, 6G provides ultra-low latency networks to connect edge and end devices, and web3 can build a
fast-developing and autonomous ecosystem for CEI.
This page was created by Cathy from TSP Marketing. For inquiries
https://www.techscience.com/journal/cmc or adjustments, please email us at [email protected] or add
E-mail:[email protected] 17365497922 on whatsapp.