FFC Catalogue
FFC Catalogue
®
Ventura V-Flex®
Whisker Controlled Flexible Flat Cable
Patent Pending
TM
Halogen Free
Pb
BACKGROUND lead-free
Lead co-deposition as an alternative of Tin Whisker mitigation has become obsolete as a result of RoHS directive on Jul 2006 that restricts the use of lead
(Pb). Current methods for Tin Whisker mitigation which use Gold or Nickel to perform plating on copper (Cu) conductor wire for Flexible Flat Cable
(FFC) is effective, but becoming uneconomical as gold price has increased 5 folds over the past 9 years. This provides the impetus to do research and
development into other methods of Tin Whisker Mitigation which is effective, economical and yet environmentally friendly.
Whisker Controlled Ventura V-Flex® FFC GOLD - LONDON PM FIX 2000 - PRESENT
1600
1500
1400
Gold Plating Whisker Control Method 1300
Jul 00
Jul 01
Jul 02
Jul 03
Jul 04
Jul 05
Jul 06
Jul 07
Jul 08
Jul 09
Jul 10
Jan00
Jan01
Jan02
Jan03
Jan04
Jan05
Jan06
Jan07
Jan08
Jan09
Jan10
Jan11
GOLD PRICES
GOLD PLATED FFC
JSB Tech Pte Ltd & A*STAR (Singapore Government Research Agency) have co-developed to innovate the breakthrough Ventura V-Flex® V3 Whisker
Controlled FFC new product (within INEMI Class 1 Standard) employing Annealing method for Tin Whisker mitigation Technology which is both
effective, economical and environmentally friendly.
RESULTS
Whiskers
Ventura V-Flex® V3
Normal Tin Plated FFC
(with no whisker mitigation control)
Whisker Controlled FFC
Terminal Pad Surface Terminal Pad Surface Molex Tin Plated
Connector (Reflow)
Molex Gold Plated Ventura V-Flex® V3
Connector Whisker Controlled FFC
Molex Tin Plated Terminal Pad Surface
Connector (Reflow)
* Normal Tin-Plated FFC with no Whisker Mitigation Control & * Ventura V-Flex® V3 FFC & Molex Gold-Plated Connector * Ventura V-Flex® V3 FFC & Molex Tin-Plated Connector (Reflow)
Molex Tin-Plated Connector (Reflow)
* No Whisker Growth observed after 1000 hours * No Whisker Growth observed after 1000 hours
* Whisker Growth clearly observed after 1000 hours
1) Reduction of COST comparing to GOLD (Au) Plating FFC by more than 30%
2) Improve product delivery LEAD TIME (no gold plating process & time required)
3) Environmental Friendly (eliminate the use of toxic chemical required by gold plating process)
APPLICATIONS:
Audio & Video System, Blue-Ray Player, Optical Drive, Game Consoles, Iphone/Ipad related, Laser/Inkjet printers/Scanner and other mobile devices
utilizing serial I/O technologies
www.jsbtech.com
Agency for
Science, Technology
JSB TECH Pte Ltd INEMI (International Electronics Manufacturing Initiative) is a global industry-led consortium responsible for establishment of standards