Legal Disclaimer

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY
INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL
ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING
LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER
INTELLECTUAL PROPERTY RIGHT.

A "Mission Critical Application" is any application in which failure of the Intel Product could result, directly or indirectly, in personal injury or death. SHOULD YOU PURCHASE OR
USE INTEL'S PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND ITS SUBSIDIARIES, SUBCONTRACTORS AND
AFFILIATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH, HARMLESS AGAINST ALL CLAIMS COSTS, DAMAGES, AND EXPENSES AND REASONABLE ATTORNEYS'
FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL INJURY, OR DEATH ARISING IN ANY WAY OUT OF SUCH MISSION CRITICAL
APPLICATION, WHETHER OR NOT INTEL OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS
PARTS.

Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or
instructions marked "reserved" or "undefined". Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from
future changes to them. The information here is subject to change without notice. Do not finalize a design with this information.

The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current
characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or go
to: http://www.intel.com/design/literature.htm

This document contains information on products in the design phase of development.

Learn About Intel® Processor Numbers

Copyright © 2017 Intel Corporation. All rights reserved

2
Agenda
• Introduction & Motivation
• Breakthrough Technology
• Cost Savings
• Energy & Environment
• Faster Technology Scaling

3
Motivation for Low Temperature Reflow
Faster Technology Scaling Energy & Emissions Process & Materials

1.2
I/O Density
1
0.8
Wave Solder Elimination
0.6 Reduced Emissions saves
Pkg X-Y 57 metric tons of CO2 per oven/year
0.4
0.2
0
2012 2014 2016 2018 2020

Reduced Electricity Saves

… > $8,500/oven/year

SKL-Y
20x16.5x0.91mm

Solder Material Cost Reduction

5
History of Green Electronics

SMT Reflow Timeline

European, Japan and US mandates
270 the removal of Pb-based solders
from mass production
250
SnAgCu
230
SnPb
210 Environmental, cost and
Widespread adaption of Tin- scalability concerns inspire SnBi
190 Lead solders for SMT the need for low
production of micro-electronics temperature processing
170
150
1985 1995 2006 2010 2017
Year

5
 Balance Between Social-technical responsibility
• Technical requirements vs
Social Responsibility vs Technical Requirements environmental friendly
manufacturing
Social
Responsibility • Opportunity to adopt socially
responsible MFG parameters
Paste without sacrificing product
Capability Standards Based
Zone Requirements reliability

System Based
• LTS capability still under
Technical Requirements evaluation
Responsibility
• Gen 3 performance trending
towards SAC capability
Technology Target Socially
Dominated Dominated

Social Responsibility Without Sacrificing Technical Capability

6
 Example of Social-Technical Responsibility: Shock
Social Responsibility vs Technical Requirements
Gold Star:
175-225G Technical overkill leads to highest
reliability possible but may sacrifice
Standards Based “green”
Requirements Happy Face:
125-175G
The right mix of technical requirements
System Based and social responsibility can meet actual
100-125G Requirements reliability needs
Green Cloud:
Socially dominated MFG can lead to
lower than required reliability capability

Technology Target Socially

q Dominated Dominated
Example only. Does not imply actual capability targets

LTS Paste Offers a Unique Opportunity to Be Socially and Technically Responsible

7
 Module

Breakthrough Technology
Breakthrough Technology
LTS lowers reflow peak temp from 250C190C and
reduces inherent board-to-package warpage by > 50%

component

High (+)
Dynamic Warpage

PCB

Low (0) 25 C 200 C Reflow Temperature

250 C

High (-)
Lower Temperature = Less Warpage
Breakthrough Technology
Material: SnBi Paste
Low Temp Solder (LTS)
Before Reflow
Melting Point:
Package

SAC Solder ball

SAC alloys
SnAgCu (96.5/3/0.5)
Low temp BiSnAg
SnAgCu (95.5/4/0.5) Paste
Board

Eutectic Tin-Lead Alloy

SnPb(63/37)
After Reflow
Package
Bismuth-Tin Eutectic Alloy Un-melted SAC
BiSn(57/42) + Ag (x=0.4-1) Solder Ball
Bismuth
In use today for consumer TVs, diffused
White Goods, LED products region
Board

SnBi Paste + SAC Sphere = Mixed Joint

Breakthrough Technology: Increased Ductility
Module

LTS Solder Reliability Improvement

Mechanical Shock or Drop
via Dopants
Bi causes joint
hardening and is
prone to brittle SAC
Bismuth is Inherently
more Brittle
region Fracture
fractures under Bi-mixed
region
Through
IMC
mechanical shock
and drop forces

Dopants increase
ductility through Path to Reduce
precipitation
Embrittlement
strengthening (Cu, Ni) or
Grain size refinement (Co,
Bi-Sn Metallurgy Mn, Sb)

Material Engineering can Overcome Brittleness

Breakthrough Technology: Material Engineering
Decrease Bi Content Precipitation Strengthening - Cu,Ni doping Grain Size Refinement - Co, Mn, Sb doping

Bi42Sn0.4Ag C1A (BiSn+dopants)

Sn-40Bi Alloy

Eutectic

Increase
Ductility
Increase
Ductility
59.1 68.7

Elongation, %
Elongation, %
C1B (BiSn+dopants) C1C (BiSn+dopants)
61.3 72.3

Less Bismuth = Lower Lattice distortion impedes

Brittleness dislocation and strengthens Finer grain size
alloy increases ductility

Multiple Paths to Overcome Brittleness

Breakthrough Technology: Improved Reliability
Measureable Improvement in Reliability
Temp Cycle Performance

Gen 3
Ductile SAC

Gen 2
Ductile Pass
Gen 1
Ductile

Sn-Bi Fail

Drop Shock Performance

2H 14 2H 15 Q4 16

Material Engineering Improves Reliability

 Module

Cost Savings
Cost Saving: Reduced Electricity Consumption

40% Reduction in
Electricity Consumption

SAC
Measured Parameter BiSnAg Reflow
Reflow
Current (RMS), amps 60.4 36.7
Power (Average), Kilowatts 29.3 17.8

 Significant cost reduction for High Volume Factory

 ~$9K USD per over per year
Cost Savings: Direct Cost Opportunity

• LTS enables single-pass process

• Low Tg, low cost components
• Equivalent reliability and joint strength
• Over $10M USD saved in volume production

LT Reflow HT Reflow Comment

Process Temp 190 C 250 C LTS better
Adhesion 2.4 kgf 2.28 kgf Equal
Strength
Reliability No issue No issue Equal
Component $2.66 (-$0.52) $3.17 LTS better
Cost

LTS can Save Direct Operational Costs 16

 Module

Energy and Environment

Energy & Environment: CO2 Reduction

LTS vs. SAC Reflow Electrical Usage

Estimated SMT Process Energy Cost Comparison
SAC 305 Paste Sn/Bi/Ag Paste
Oven Energy Consumption (Kw) 29.5 Oven Energy Consumption (Kw) 17.8
80% Utilization (Hours/Wk) 134.4 80% Utillzation (Hours/Wk) 134.4
CO2 Metric ton p/kwh (EPA est)* 0.0007 0.0007
CO2 emission per month 2.78 1.67
CO2 Savings (metric tons per oven/week) 1.1
CO2 Savings (metric tons per oven/yr) 57.2

 Significant CO2 emission reduction for High Volume Factory

 60 metric tons per over per year
Energy & Environment: CO2 Reduction
LTS potentially saves the computer assembly industry 35K –
50K metric tons of CO2 every year
 Carbon equivalent of 33-50 Million pounds of Coal burned
 Power generated by 32 – 50 Wind Turbines

Electronics Manufacturers in China Must Join New Pollution

Tracking System
On January 23, 2017, the Chinese government published a list of industries, including
computer, communications and electronic equipment manufacturing, that will be required
to register under the new critical monitoring system outlined in November 2016. The
system will track companies’ air and water discharges, which may be taxed.
While more than 20 industries must register this year, computer, communications and
electronic equipment manufacturers are included in the second wave of companies
which must join the system by 2020.
IPC will continue to post updates as they become available.
Source: IPC Global Insight online magazine

LTS Enables Carbon Emission Reduction

 Module

Faster Technology Scaling

Faster Technology Scaling
Lower Temperature Enables Tighter Pitch & Thinner Systems

Non-Contact Defect
Solder Bridge Defect due to due to expansion
compression

1.4
Risk of Non-Contact Opens
Solder Bridge Risk

Risk of Solder Bridge Short 1.2

NCO Open Risk

1
0.8
0.6
255 C
Smaller pitch, 255 C 0.4 Thinner system,
less risk less risk
0.2
190 C 190 C
0
0.25 0.35 0.45 0.55 0.65 1 1.25 1.5 1.75 2
BGA Pitch (mm) Platform Z-height (PCB+BGA, mm)

LTS Provides Design Freedom for Thin & Light Systems

Faster Technology Scaling
• Future Products will be thinner, lighter, with better performance products
• LTS enables design freedom – more options for system architectures

1.2
I/O Density
1

0.8

0.6

0.4 Pkg X-Y

0.2

0
2012 2014 2016 2018 2020

…..
SKL-Y
20x16.5x0.91mm

LTS Enables System Manufacturing to Keep Pace with Moore’s Law 22

Conclusion
• Breakthrough Technology has enabled the
advancement of Low Temperature Solder (LTS) Paste
that meets process and reliability requirements
• LTS provides Production Cost Savings and
Environmental Benefits
• LTS enables Faster Technology Scaling for Electronic
Assembly

23