ECSS-Q-ST-70-28C

31 July 2008

Space product
assurance
Repair and modification of printed
circuits board assemblies for space
use

ECSS Secretariat
ESA-ESTEC
Requirements & Standards Division
Noordwijk, The Netherlands
 ECSS‐Q‐ST‐70‐28C
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Foreword
This Standard is one of the series of ECSS Standards intended to be applied together for the
management, engineering and product assurance in space projects and applications. ECSS is a
cooperative effort of the European Space Agency, national space agencies and European industry
associations for the purpose of developing and maintaining common standards. Requirements in this
Standard are defined in terms of what shall be accomplished, rather than in terms of how to organize
and perform the necessary work. This allows existing organizational structures and methods to be
applied where they are effective, and for the structures and methods to evolve as necessary without
rewriting the standards.
This Standard has been prepared by the ECSS Executive Secretariat, endorsed by the Document and
Discipline Focal points, and approved by the ECSS Technical Authority.

Disclaimer
ECSS does not provide any warranty whatsoever, whether expressed, implied, or statutory, including,
but not limited to, any warranty of merchantability or fitness for a particular purpose or any warranty
that the contents of the item are error‐free. In no respect shall ECSS incur any liability for any
damages, including, but not limited to, direct, indirect, special, or consequential damages arising out
of, resulting from, or in any way connected to the use of this Standard, whether or not based upon
warranty, business agreement, tort, or otherwise; whether or not injury was sustained by persons or
property or otherwise; and whether or not loss was sustained from, or arose out of, the results of, the
item, or any services that may be provided by ECSS.

Published by: ESA Requirements and Standards Division

ESTEC, P.O. Box 299,
2200 AG Noordwijk
The Netherlands
Copyright: 2008 © by the European Space Agency for the members of ECSS

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Change log

ECSS‐Q‐70‐28A First issue

21 June 2002
ECSS‐Q‐70‐28B Never issued

ECSS‐Q‐ST‐70‐28C Second issue

31 July 2008 The main changes between ECSS-Q-70-28A (21 June 2002) and this revision are
the following:
1. At the “Normative references” unnecessary references were deleted.
2. The section “Terms, definitions and abbreviated terms” has been adapted in
conformance with the drafting rules. The definitions for “Repair” and
“Rework” were added.
3. In conformance with the drafting rules, the section 4 “Requirements” was
added.
4. The contents of the original sections 4 and 5 were moved to the sections 4.1
to 4.5.
5. The normative parts (requirements, procedure, acceptance criteria) of the
original sections 6 to 19 were moved to the sections 4.6 to 4.19.
6. The informative parts of the original sections 6 to 19 (introduction, tools and
materials required, method descriptions) were moved to the informative
Annexes A to M using an annex for each original section.
7. The requirements of section 4 were reworded and restructured in
conformance with the ECSS drafting rules.
8. The sections “Applicability matrix” and “Bibliography” were added.

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Table of contents

Change log .................................................................................................................3

1 Scope.....................................................................................................................11

2 Normative references ...........................................................................................12

3 Terms, definitions and abbreviated terms..........................................................13

3.1 Terms from other standards ..................................................................................... 13
3.2 Terms specific to the present standard .................................................................... 13
3.3 Abbreviated terms .................................................................................................... 14

4 Requirements........................................................................................................15
4.1 Basic requirements................................................................................................... 15
4.1.1 Hazard, health and safety precautions ....................................................... 15
4.1.2 Materials ..................................................................................................... 15
4.1.3 Facilities...................................................................................................... 15
4.1.4 General....................................................................................................... 15
4.2 Repairs ..................................................................................................................... 16
4.2.1 Repair criteria ............................................................................................. 16
4.2.2 Number of repairs....................................................................................... 16
4.3 Modifications ............................................................................................................ 16
4.3.1 Modification criteria..................................................................................... 16
4.3.2 Number of modifications............................................................................. 17
4.4 Rework ..................................................................................................................... 17
4.4.1 Rework criteria............................................................................................ 17
4.4.2 Number of reworks ..................................................................................... 17
4.5 Other requirements .................................................................................................. 17
4.6 Removal of conformal coating.................................................................................. 18
4.6.1 Requirements ............................................................................................. 18
4.6.2 Procedure ................................................................................................... 18
4.6.3 Acceptance criteria ..................................................................................... 18
4.7 Solder joint removal and unclinching........................................................................ 19
4.7.1 Procedure ................................................................................................... 19

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4.7.2 Acceptance criteria ..................................................................................... 19
4.8 Repair of damaged gold-plated areas ...................................................................... 19
4.8.1 Requirements ............................................................................................. 19
4.8.2 Procedure ................................................................................................... 19
4.8.3 Acceptance criteria ..................................................................................... 20
4.9 Repair of damaged conductor tracks ....................................................................... 20
4.9.1 Requirements ............................................................................................. 20
4.9.2 Procedure ................................................................................................... 20
4.9.3 Acceptance criteria ..................................................................................... 21
4.10 Repair of lifted conductors........................................................................................ 21
4.10.1 Requirements ............................................................................................. 21
4.10.2 Procedure ................................................................................................... 21
4.10.3 Acceptance criteria ..................................................................................... 21
4.11 Repair of lifted terminal areas (pads) ....................................................................... 22
4.11.1 Requirements ............................................................................................. 22
4.11.2 Procedure ................................................................................................... 22
4.11.3 Acceptance criteria ..................................................................................... 22
4.12 Terminal post replacement....................................................................................... 22
4.12.1 Requirements ............................................................................................. 22
4.12.2 Procedure ................................................................................................... 22
4.12.3 Acceptance criteria ..................................................................................... 22
4.13 Wire-to-wire joints..................................................................................................... 23
4.13.1 Requirements ............................................................................................. 23
4.13.2 Procedure ................................................................................................... 23
4.13.3 Acceptance criteria ..................................................................................... 23
4.14 Addition of components ............................................................................................ 23
4.14.1 Requirements ............................................................................................. 23
4.14.2 Procedure ................................................................................................... 24
4.14.3 Acceptance criteria ..................................................................................... 24
4.15 Removal and replacement of axial and multi-lead components ............................... 25
4.15.1 Requirements ............................................................................................. 25
4.15.2 Procedure ................................................................................................... 25
4.15.3 Acceptance criteria ..................................................................................... 25
4.16 Removal and replacement of flat-pack components ................................................ 25
4.16.1 Requirements ............................................................................................. 25
4.16.2 Procedure ................................................................................................... 25
4.16.3 Acceptance criteria ..................................................................................... 26

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4.17 Modification of component connections ................................................................... 26
4.17.1 Requirements ............................................................................................. 26
4.17.2 Procedure ................................................................................................... 26
4.17.3 Acceptance criteria ..................................................................................... 27
4.18 Cutting of internal track of a multi-layer printed circuit board ................................... 27
4.18.1 Procedure ................................................................................................... 27
4.18.2 Acceptance criteria ..................................................................................... 27
4.19 Quality assurance..................................................................................................... 27
4.19.1 General....................................................................................................... 27
4.19.2 Data ............................................................................................................ 27
4.19.3 Nonconformance ........................................................................................ 28
4.19.4 Calibration .................................................................................................. 28
4.19.5 Traceability ................................................................................................. 28
4.19.6 Operator and inspector training and certification........................................ 28

Annex A (informative) Removal of conformal coating .........................................29

A.1 Introduction............................................................................................................... 29
A.2 Tools and materials .................................................................................................. 29
A.3 Methods for the removal of conformal coating ......................................................... 29
A.3.1 Method for the removal of polyurethane and silicone-type coating ............ 29
A.3.2 Method for the removal of epoxy-type coating ........................................... 30

Annex B (informative) Solder joint removal and unclinching..............................32

B.1 Introduction............................................................................................................... 32
B.2 Tools and materials .................................................................................................. 32
B.3 Methods for solder joint removal and unclinching .................................................... 32
B.3.1 Method for solder extraction with continuous vacuum................................ 32
B.3.2 Method for solder extraction using sucker.................................................. 33
B.3.3 Method for hot jet extraction ....................................................................... 34
B.3.4 Method for the use of wicking braid............................................................ 34
B.3.5 Method for unclinching of leads.................................................................. 35

Annex C (informative) Repair of damaged gold-plated areas..............................36

C.1 Introduction............................................................................................................... 36
C.2 Tools and materials .................................................................................................. 36
C.3 Methods for the repair of damaged gold-plated areas.............................................. 36
C.3.1 Method for the removal of solder splatter on gold plating........................... 36

Annex D (informative) Repair of damaged conductor tracks ..............................37

D.1 Introduction............................................................................................................... 37

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D.2 Tools and materials .................................................................................................. 37
D.3 Method for the repair of damaged conductor tracks................................................. 37

Annex E (informative) Repair of lifted conductors ...............................................38

E.1 Introduction............................................................................................................... 38
E.2 Tools and materials .................................................................................................. 38
E.3 Methods for repair of lifted conductors ..................................................................... 39
E.3.1 Method for the use of epoxy under conductor ............................................ 39
E.3.2 Method for the use of epoxy over conductor .............................................. 39

Annex F (informative) Repair of lifted terminal areas (pads)...............................40

F.1 Introduction............................................................................................................... 40
F.2 Tools and materials .................................................................................................. 41
F.3 Method for the repair of lifted terminal areas (pads)................................................. 41

Annex G (informative) Terminal post replacement...............................................42

G.1 Introduction............................................................................................................... 42
G.2 Tools and materials .................................................................................................. 42
G.3 Method for the replacement of terminal post ............................................................ 42

Annex H (informative) Wire-to-wire joints .............................................................44

H.1 Introduction............................................................................................................... 44
H.2 Tools and materials .................................................................................................. 44
H.3 Method for wire-to-wire joining ................................................................................. 44

Annex I (informative) Addition of components.....................................................46

I.1 Introduction............................................................................................................... 46
I.2 Tools and materials .................................................................................................. 46
I.3 Methods for addition of components ........................................................................ 47
I.3.1 Method for additional components mounted on reverse
(non-component) side of board .................................................................. 47
I.3.2 Method for additional components mounted on component side of
board .......................................................................................................... 48
I.3.3 Method for additional components mounted on terminal posts,
including “piggyback“ mounting .................................................................. 49
I.3.4 Method for additional components mounted (on reverse side or on
component side of board) using staking compound ................................... 50
I.3.5 Method for additional components mounted (on reverse side or on
component side of board) to leads of adjacent components ...................... 51
I.3.6 Method for the addition of a wire link onto soldered chips on a single
side piece of PCB with appropriate pads.................................................... 56
I.3.7 Method for the addition of a wire link onto metallized cap of chips
directly glued on PCB ................................................................................. 57

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Annex J (informative) Removal and replacement of axial and multi-lead
components .........................................................................................................58
J.1 Introduction............................................................................................................... 58
J.2 Tools and materials .................................................................................................. 58
J.3 Methods for removal and replacement of axial and multi-lead components ............ 58
J.3.1 Method for the removal of components with axial leads (destructive
removal)...................................................................................................... 58
J.3.2 Method for the removal of multi-lead components (destructive
removal)...................................................................................................... 59

Annex K (informative) Removal and replacement of flat-pack components......61

K.1 Introduction............................................................................................................... 61
K.2 Tools and materials .................................................................................................. 61
K.3 Method for the removal and replacement of flat-pack components.......................... 61

Annex L (informative) Modification of component connections .........................63

L.1 Introduction............................................................................................................... 63
L.2 Tools and materials .................................................................................................. 63
L.3 Methods for modification of component connections ............................................... 63
L.3.1 Method for the soldering of a wrap-around connection to an extended
component lead .......................................................................................... 63
L.3.2 Method for the soldering of component lead to a stud lead mounted
into an existing hole.................................................................................... 64
L.3.3 Method for mounting a dual-in-line (DIL) package with or without a
wire link soldered onto a cropped lead ....................................................... 65
L.3.4 Method for mounting a connector with or without a wire link soldered
onto a cropped lead.................................................................................... 67
L.3.5 Method for the addition of a wire link into a plated-through hole
occupied by a flat-section lead ................................................................... 68
L.3.6 Method for the addition of a wire link on top of a flat-pack lead ................. 70
L.3.7 Method for the isolation of a component lead............................................. 70
L.3.8 Method for the addition of a wire link onto terminal pad of soldered
chips ........................................................................................................... 72

Annex M (informative) Cutting of internal track of a multi-layer printed

circuit board.........................................................................................................74
M.1 Introduction............................................................................................................... 74
M.2 Tools and materials .................................................................................................. 74
M.3 Method for cutting the internal track of a multi-layer printed circuit board ................ 74

Bibliography.............................................................................................................76

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Figures
Figure A-1 : Removal of coating by thermal parting device.................................................... 31
Figure B-1 : Continuous vacuum solder extraction on stud lead............................................ 33
Figure B-2 : Pulse-type solder sucker in use.......................................................................... 33
Figure B-3 : Lifting individual leads with hot jet ...................................................................... 34
Figure B-4 : Cross-sectional view of wicking method............................................................. 35
Figure B-5 : Hot unclinching with thermal parting device ....................................................... 35
Figure E-1 : Lifted conductors ................................................................................................ 38
Figure E-2 : Repair using epoxy under conductor.................................................................. 39
Figure E-3 : Repair using epoxy over conductor .................................................................... 39
Figure F-1 : Lifted terminal area ............................................................................................. 40
Figure F-2 : Terminal areas without track............................................................................... 40
Figure F-3 : Terminal areas with track attached..................................................................... 41
Figure G-1 : Terminal post replacement................................................................................. 43
Figure H-1 : Use of approved type support clamp/heat sink .................................................. 45
Figure I-1 : Additional components mounted on reverse (non-component) side of board ..... 48
Figure I-2 : Additional components mounted on component side of board ............................ 49
Figure I-3 :“Piggyback” mounting of one component on top of another ................................. 50
Figure I-4 : Mounting and wiring of additional axially-leaded components mounted (on
reverse side or on component side of board) using staking compound............... 52
Figure I-5 : Upside down mounting and wiring of additional side-brazed DIL component
(on reverse side or on component side of board) using staking compound ........ 53
Figure I-6 : Mounting of additional non-axially leaded components, e.g. capacitors, with
wire connecting top or bottom sides of the circuit board using staking
compound (on reverse side or on component side of board) .............................. 53
Figure I-7 : Mounting of additional component (on component side of board) with wire
connections on reverse side of board using staking compound .......................... 54
Figure I-8 : Mounting of additional component (on reverse side of board) across
extended leads of adjacent components ............................................................. 54
Figure I-9 : Mounting of additional component by linking to a “pigtailed” lead of an
adjacent component ............................................................................................ 55
Figure I-10 : Mounting of additional component by linking to lead of an adjacent
transistor (or other large component) .................................................................. 56
Figure I-11 : Addition of a wire link onto metallized cap of chips directly glued on PCB ........ 57
Figure J-1 : Removal of multi-lead components, clipping of component leads ...................... 59
Figure J-2 : Removal of multi-lead components, removal of remaining component leads ..... 60
Figure K-1 : Removal of flat-pack components ...................................................................... 62
Figure L-1 : Soldering of a wrap-around connection to an extended component lead........... 64
Figure L-2 : Soldering of component lead to a stud lead mounted into an existing hole........ 65

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Figure L-3 : Mounting a dual-in-line package with or without a wire link soldered onto a
cropped lead (cropped lead without connection and cropped lead with
connection led through hole and onto board) ...................................................... 66
Figure L-4 : Mounting a dual-in-line package with or without a wire link soldered onto a
cropped lead (wire link passing away from board) .............................................. 67
Figure L-5 : Mounting a connector with a wire link soldered onto a cropped lead ................. 68
Figure L-6 : Addition of a wire link into a plated through hole occupied by a flat-section
lead (wire link entering from the reverse side of the board)................................. 69
Figure L-7 : Addition of a wire link into a plated through hole occupied by a flat-section
lead (wire link entering from the component side of the board) ........................... 69
Figure L-8 : Addition of a wire link on top of a flat-pack lead.................................................. 70
Figure L-9 : Isolation of a component lead ............................................................................. 72
Figure L-10 : Addition of a wire link onto terminal pad of soldered chips ............................... 73
Figure M-1 : Cutting of internal track of a multi-layer circuit board......................................... 75

Tables
Table 4-1: Wire diameters for given conductor widths ........................................................... 20

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1
Scope

The requirements and procedures for repair and modification detailed in this
Standard are designed to maintain the rigorous standards set by the customer
for the manufacture and assembly of space‐quality printed circuit boards.
This Standard is confined to the repair and modification of single‐sided,
double‐sided and multi‐layer printed circuit board assemblies.
This Standard does not address the potential need for rework resulting from a
repair or modification and unassembled (bare) printed circuits boards.
This standard may be tailored for the specific characteristics and constraints of a
space project, in conformance with ECSS‐S‐ST‐00.

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2
Normative references

The following normative documents contain provisions which, through

reference in this text, constitute provisions of this ECSS Standard. For dated
references, subsequent amendments to, or revisions of any of these publications
do not apply. However, parties to agreements based on this ECSS Standard are
encouraged to investigate the possibility of applying the most recent editions of
the normative documents indicated below. For undated references the latest
edition of the publication referred to applies

ECSS‐S‐ST‐00‐01 ECSS system — Glossary of terms

ECSS‐Q‐ST‐10‐09 Space product assurance — Nonconformance
control system
ECSS‐Q‐ST‐20 Space product assurance — Quality assurance
ECSS‐Q‐ST‐70 Space product assurance — Materials, mechanical
parts and processes
ECSS‐Q‐ST‐70‐08 Space product assurance — Manual soldering of
high‐ reliability electrical connections
ECSS‐Q‐ST‐70‐10 Space product assurance — Qualification of
printed circuit boards
ECSS‐Q‐ST‐70‐38 Space product assurance — High‐reliability
soldering for surface‐mount and mixed technology

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3
Terms, definitions and abbreviated terms

3.1 Terms from other standards

For the purpose of this Standard, the terms and definitions from
ECSS‐S‐ST‐00‐01 apply.

3.2 Terms specific to the present standard

3.2.1 modification
process of modifying an electronic circuit by means of the addition or removal
of electrical parts or wiring

3.2.2 repair
change of a component with all its associated connections, including the fixing
down of a lifted pad or track or any similar procedure described in this
Standard
NOTE 1 Changing of components for tuning, i.e.
de‐soldering and changing component value is not
considered a repair, rework or modification
operation.
NOTE 2 During tuning, solder jointing is achieved with a
minimum of solder, just enough to ensure contact.

3.2.3 rework
process of reworking of a defective solder joint (without component changing)
as a consequence of the repair or modification process or for restoring good
workmanship of potentially defective solder joints

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3.3 Abbreviated terms

For the purpose of this Standard, the abbreviated terms from ECSS‐S‐ST‐00‐01
and the following apply:
Abbreviation Meaning
PCB printed circuit board
PTFE Polytetrafluoroethylene
PTH plated‐through hole
DIL dual‐in‐line

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4
Requirements

4.1 Basic requirements

4.1.1 Hazard, health and safety precautions

a. The supplier shall define and implement procedures to control hazards
to personnel, equipment or materials.

4.1.2 Materials
a. All materials used for repairs and which form part of the end product
shall meet the specification for the end product.
b. Solders, flux and cleaning solvents shall be as specified in
ECSS‐Q‐ST‐70‐08, clauses 6.1, 6.2 and 6.3.

4.1.3 Facilities
a. All facilities and tools for repair and modification of printed circuit board
assemblies for space use shall be in conformance with ECSS‐Q‐ST‐70‐08.

4.1.4 General
a. All processes, as described from clauses 4.2 to 4.19, shall conform with
the ECSS‐Q‐ST‐70 requirements
b. The supplier shall perform all soldering operations in conformance with
clauses 7, 8, 9, 10 and 11 of ECSS‐Q‐ST‐70‐08 or clauses 8, 9, 10, 11 and 12
of ECSS‐Q‐ST‐70‐38.
NOTE Many of the accessories and work aids detailed in
this Standard are contained within purpose‐built
equipment.
c. The supplier shall apply the repair or modification procedures as
detailed in clauses 4.6 to 4.18.
NOTE the verification of the supplier repair and
modification processes for each type of devise is
specified in accordance with clause 14.1 of ECSS‐
Q‐ST‐70‐38 and clause 13.1 of ECSS‐Q‐ST‐70‐08.

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d. For repairs and modifications, the supplier shall ask for formal approval
or authorization from the project PA/QA representative using NCR and
NRB procedures as specified in ECSS‐Q‐ST‐10‐09
e. The supplier shall remove components that are submitted to failure
analysis procedures from assemblies and handle them in such a way that
their state and conditions are not altered for the analysis procedures.
f. When the proposed repair method, tools or procedure are not covered by
this Standard, the supplier shall detail the repair procedure in the
relevant NCR and treat in conformance with ECSS‐Q‐ST‐10‐09.

4.2 Repairs

4.2.1 Repair criteria

a. The supplier shall carry out repairs only when it is necessary to restore
the functional or performance capability of a printed circuit assembly
that has been damaged during assembly or during testing.

4.2.2 Number of repairs

a. The total number of repairs (involving soldering or epoxy adhesives) to
any one printed circuit board assembly shall not exceed six.
b. When a printed circuit board assembly supports more than 120 passive
chip components, the total number of repairs shall not exceed 5 % of the
passive chip components.
NOTE 1 Repairing of passive chip components is not
considered as critical as other components of the
PCB and hence the larger number of repairs
allowed.
NOTE 2 A repair of one component or connector can
involve operations on one or more of its leads.
c. Repairs involving soldering operations shall not exceed three to any one
area of 25 cm2.
d. Repairs involving epoxy adhesives shall not exceed four to any one area
of 25 cm2.

4.3 Modifications

4.3.1 Modification criteria

a. The modification of a printed circuit assembly shall be the revision of
interconnecting features by interrupting conductors or adding
components as well as wire connections.

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b. The revision of connections to one component or connector shall count as
one modification.
c. The addition of one component shall count as one modification.

4.3.2 Number of modifications

a. The total number of such modifications on any one printed circuit shall
not exceed three to any one area of 25 cm2.

4.4 Rework

4.4.1 Rework criteria

a. All aspects of the reworked solder joint shall conform to
ECSS‐ST‐Q‐70‐38 or ECSS‐ST‐Q‐70‐08,

4.4.2 Number of reworks

a. The total number of such reworks on any one joint shall not exceed three.

4.5 Other requirements

a. The supplier shall not reuse components removed because of
malfunction or mechanical damage or because of damage to the
conductor track in the vicinity of the component but replace them by new
identical or equivalent components.
b. The supplier shall remove components only if the mounting density is
such that the integrity of other components in the vicinity can be ensured.
c. The supplier shall not carry out more than one de‐soldering operation on
a printed circuit termination besides the ones that receive chip
components.
d. For chip components, the number of replacements in one location shall
not exceed three.
e. For repair or modification methods not detailed in this Standard, or in
excess of criteria given in clauses 4.2.2, 4.3.2 and 4.4.2, the supplier shall
apply the following procedure:
1. Document deviation as NCR.
2. Involve final customer in NRB.
f. The supplier shall not straighten warped boards, with or without
components.

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4.6 Removal of conformal coating

4.6.1 Requirements
a. The supplier shall not use soldering irons for coating removal.
NOTE The high operating temperatures cause charring of
the coatings and possible delamination in the base
laminate.
b. It shall be verified that no damage occurs to the printed wiring assembly
by cutting around the area to be repaired.
c. When using the thermal parting tip it shall be assured that any adjacent
solder joints and circuitry does not melt.
d. The time for solvent application shall not exceed 15 minutes.
NOTE The time of solvent application is kept as short as
possible. The reason is that solvents tend to
expand the coating media and attack coatings on
electronic components in areas remote from direct
solvent application.

4.6.2 Procedure
a. The supplier should use method A.3.1 for polyurethane‐ and
silicone‐type coatings.
b. The supplier should use method A.3.2 for epoxy‐type coatings.

4.6.3 Acceptance criteria

a. The solder on the area to be repaired shall be accessible.
b. None of the following shall occur:
1. melting of adjacent solder joints or circuitry;
2. blistering, measling or charring of coating;
3. blistering, delamination, measling or charring of laminated base
material;
4. cuts, scratches or other damage to printed wiring.

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4.7 Solder joint removal and unclinching

4.7.1 Procedure
a. Depending on the kind of solder joint, the supplier should use one or
more of the methods described in B.3.1, B.3.2, B.3.3, B.3.4 and B.3.5.
NOTE To select the appropriate method refer to the
method descriptions.
b. Prior to commencing, the supplier should remove any conformal coating
that has been applied to the circuit in conformance with the procedure set
out in Annex A.

4.7.2 Acceptance criteria

a. There shall be no residual solder present on the treated solder joint.
b. None of the following shall occur:
1. melting of adjacent solder joints or circuitry;
2. lifting of the solder joint or pad track;
3. delamination of the base laminate;
4. damage to printed wiring or solder joint or pad.
NOTE Damages such as cuts, scratches.

4.8 Repair of damaged gold-plated areas

4.8.1 Requirements
a. The supplier shall repair scratches only if the current‐carrying capacity
requirement of the conductor is not met.
b. The supplier shall reject boards with defective plating other than in
requirements 4.8.1a.
NOTE Defect plating might be flaking or blistering.

4.8.2 Procedure
a. The supplier should use method C.3.1 for removal of solder splatter on
gold plating.
b. For repair of insufficient or scratched gold plating the supplier should
apply the following procedure:
1. remove gold plating before soldering in conformance with clauses
7.2.4 of ECSS‐ST‐Q‐70‐08;
2. perform method D.3.

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4.8.3 Acceptance criteria

4.8.3.1 Removal of solder splatter on gold plating

a. There shall be no residual solder present on the gold plating or damage
to the plating.
NOTE Colour changes on the conductor surface resulting
from gold‐tin alloying are permitted.

4.8.3.2 Repair of insufficient or scratched gold plating

a. After repair, the supplier shall inspect the soldered joints in conformance
with the accept/reject criteria of clause 12 in ECSS‐ST‐Q‐70‐08.
NOTE For example: Inspection of the pad or track area to
ensure that no lifting has occurred and that no
damage has been sustained by the base material is
one of the required inspections.

4.9 Repair of damaged conductor tracks

4.9.1 Requirements
a. The damage shall not involve a length of track in excess of five times the
conductor width.

4.9.2 Procedure
a. For conductor tracks having a thickness > 30 μm, the selection of tinned
copper or silver wire shall be in conformance with Table 4‐1.
b. The maximum wire diameter shall not be greater than two thirds of the
width of the conductor.

Table 4‐1: Wire diameters for given conductor widths

Wire diameter (mm)
Conductor width (mm) minimum AWG
0,30 0,16 34
0,40 0,20 32
0,50 0,25 30
0,80 0,32 28
1,60 0,40 26
3,20 0,51 24
c. The supplier should use method D.3.
d. The supplier should use alternative coatings in method D.3 only
according to disposition by NRB.

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4.9.3 Acceptance criteria

a. After repair, the supplier shall inspect the soldered joints in conformance
with the accept/reject criteria of clause 12 in ECSS‐Q‐ST‐70‐08.
NOTE For example: Inspection of the pad or track area to
ensure that no lifting has occurred and that no
damage has been sustained by the base material is
one of the required inspections.

4.10 Repair of lifted conductors

4.10.1 Requirements
a. The length of the lifted conductor to be repaired shall not exceed one‐half
of the length of conductor between two terminal areas and 2 cm,
whichever is the smallest.
b. The number of repairs per printed circuit board assembly shall conform
with the requirements detailed in clause 4.2.2.

4.10.2 Procedure
a. Depending on their applicability, the supplier should use either method
E.3.1 or E.3.2.
b. Before applying method E.3.1 or E.3.2, the supplier shall remove any
components or solder that can interfere with the repair of the damaged
conductor as described in clauses 4.7 and 4.15 before proceeding.

4.10.3 Acceptance criteria

a. The lifted conductor track shall be secured to the base laminate by the
epoxy
b. The epoxy shall be fully cured.
c. The epoxy shall not cover areas that require subsequent soldering.
d. Where components have been removed and subsequently replaced, the
supplier shall inspect the soldered joints in conformance with the
accept/reject criteria of clause 12 in ECSS‐Q‐ST‐70‐08.
NOTE For example: Inspection of the pad or track area to
ensure that no lifting has occurred and that no
damage has been sustained by the base material is
one of the required inspections.

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4.11 Repair of lifted terminal areas (pads)

4.11.1 Requirements
a. The repair shall not reduce circuitry spacing to less than the one specified
in clause 17 of ECSS‐Q‐ST‐70‐10.
b. In the unshaded areas in Figure F‐2 and Figure F‐3 the amount of
disbonded material shall not extend for more than one half the distance
from the edge of the terminal area to the nearest edge of the hole (annular
ring) over not more than 180° of the periphery.
c. For plated through holes only: When the repair is completed, the supplier
shall insert a clinched lead‐through in the plated through hole.
NOTE This can be a separate wire link or the component
lead.

4.11.2 Procedure
a. The supplier should use method F.3.
b. Before starting, the supplier shall remove components and solder that
impinge on the repair area in conformance with the agreed methods.

4.11.3 Acceptance criteria

a. The acceptance criteria shall be as stated in clause 4.10.3.

4.12 Terminal post replacement

4.12.1 Requirements
a. The supplier shall apply terminal post replacement only if the operation
can be carried out without damage to adjacent conductor track or base
laminate or components.
b. The supplier shall not carry out straightening operations.

4.12.2 Procedure
a. The supplier should use method G.3.

4.12.3 Acceptance criteria

a. The terminal installation shall be in conformance with manufacturer’s
procedure.
b. There shall be no visual damage to adjacent conductor tracks or base
laminate or components.

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c. Where components have been removed and subsequently replaced, the
supplier shall inspect the soldered joints in conformance with the accept/
reject criteria of clause 12 in ECSS‐Q‐ST‐70‐08.
NOTE For example: Inspection of the pad or track area to
ensure that no lifting has occurred and that no
damage has been sustained by the base material is
one of the required inspections.

4.13 Wire-to-wire joints

4.13.1 Requirements
a. The supplier shall undertake repairs only after NRB approval.
NOTE Considering time, cost and use, repair can be more
efficient than a new installation.
b. If the wire is shaped to by‐pass a component, the wire shall have
additional fixing at each bend.
c. During the process the supplier shall avoid the ingress of flux between
conductor and insulating sleeve.

4.13.2 Procedure
a. The supplier should use method H.3.

4.13.3 Acceptance criteria

a. The supplier shall inspect the joint as per agreed method.
b. No damage to adjacent conductor tracks, base laminate or components
shall be visible.

4.14 Addition of components

4.14.1 Requirements

4.14.1.1 General
a. The supplier shall add components only if such addition does not
invalidate the physical dimension requirements as specified in clause 17
of ECSS‐Q‐ST‐70‐10.
b. If the remaining portion of lead on the non‐component side of the board
is removed, the supplier shall also remove any clinched portion in
conformance with clause 4.7.

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4.14.1.2 Extension of component leads
a. The supplier shall extend the leads for an equal distance on each side of
the component by means of the lap joint method defined in Annex H or
the wraparound method of clause “Turret and straight pin terminals” of
ECSS‐Q‐ST‐70‐08.
b. The supplier shall cover the wires with space‐approved insulation.
c. The lead extension shall be such that it does avoid subsequent vibration
problems by possible staking of the lead.
d. The first spot bond of the extension wire shall not be more than 15 mm
from the component‐to‐wire soldered joint.

4.14.2 Procedure
a. The supplier should use either method I.3.1, I.3.2, I.3.3, I.3.4 or I.3.5 for
single‐sided or double‐sided boards.
b. The supplier should choose the appropriate method (method I.3.1 or
method I.3.2) for addition of components to double‐sided boards
depending on the configuration required.
c. The supplier should employ method I.3.1, method I.3.4 (reverse side
mounting) and method I.3.5 (reverse side mounting) if the packaging
enables the component to be mounted on the underside of the assembly
and this does not cause problems.
d. The supplier should use method I.3.3 if there is sufficient metallic land, as
defined in clause 17 of ECSS‐Q‐ST‐70‐10, to allow for both soldering and
swaging of the terminal post.
e. The supplier should use method I.3.3 if there is sufficient metallic land, as
defined in clause 17 of ECSS‐Q‐ST‐70‐10 to permit drilling of the size
terminal post hole and subsequent soldering.
f. The supplier should use method I.3.4 for the addition of axially and
non‐axially leaded components and DIL packages.

4.14.3 Acceptance criteria

a. After repair, the supplier shall inspect the soldered joints in conformance
with the accept/reject criteria of clause 12 in ECSS‐Q‐ST‐70‐08.
NOTE For example: Inspection of the pad or track area to
ensure that no lifting has occurred and that no
damage has been sustained by the base material is
one of the required inspections.

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4.15 Removal and replacement of axial and multi-lead

components

4.15.1 Requirements
a. If the portion of lead on the non‐component side of the board is removed,
the supplier shall also remove any clinched portion in conformance with
clause 4.7.
NOTE Exercise extreme caution when dealing with circuit
boards having plated through holes as the
connecting surfaces rupture easily. Very small
lands are also hazardous as they loosen if the
temperature of the base material is too high or
excessive force is exerted during removal of the
leads.

4.15.2 Procedure
a. The supplier should use method J.3.1 and J.3.2.

4.15.3 Acceptance criteria

a. After repair, the supplier shall inspect the soldered joints in conformance
with the accept/reject criteria of clause 12 in ECSS‐Q‐ST‐70‐08.
NOTE For example: Inspection of the pad or track area to
ensure that no lifting has occurred and that no
damage has been sustained by the base material is
one of the required inspections.

4.16 Removal and replacement of flat-pack components

4.16.1 Requirements
a. The supplier shall address the removal of larger flat‐packs that have been
bonded to the PCB for mechanical support or for thermal reasons as part
of a NRB.
b. Scratching and overheating shall be avoided and preventive measures
demonstrated

4.16.2 Procedure
a. The supplier should use method K.3.
b. If another method is used, the supplier shall submit it for approval.

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4.16.3 Acceptance criteria

a. After repair, the supplier shall inspect the soldered joints in conformance
with the accept/reject criteria of clause 12 of ECSS‐Q‐ST‐70‐08.
NOTE For example: Inspection of the pad or track area to
ensure that no lifting has occurred and that no
damage has been sustained by the base material is
one of the required inspections.

4.17 Modification of component connections

4.17.1 Requirements
a. For modification of DIL package connections, the supplier shall not crop
or insulate more than one third of the leads per side.
NOTE These aspects are addressed in method L.3.3 for
cropping and in method L.3.7) for insulation
b. No more than two leads shall be cropped or insulated on each side of a
14‐lead DIL package

4.17.2 Procedure
a. The supplier should use either method I.3.6, I.3.7, L.3.1, L.3.2, L.3.3, L.3.4,
L.3.5, L.3.6, L.3.7, or L.3.8.
b. The supplier should use method L.3.2 to enable a component to be
mounted when the leads are of a larger diameter than that of existing
plated through holes in the printed circuit board.
c. The supplier should use method L.3.3 only if it is necessary to crop no
more than one third of the leads per side of a DIL package.
d. The supplier should use method L.3.5 only if the plated through hole is
occupied by a flat‐section lead.
e. The supplier should use method L.3.7 if it is necessary to isolate a
component lead from its plated through hole connection on either
double‐sided or multi‐layer printed circuit boards.
NOTE Although Figure L‐1 illustrates an isolated lead of
a DIL package, this method can also be used if it is
required to isolate a lead of a metal can package.
f. The supplier should use method L.3.7 if it is necessary to isolate no more
than one third of the leads per side of a DIL package.
g. The supplier should use method I.3.7 only if the glued surface on PCB is
not tinned.

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4.17.3 Acceptance criteria

a. After modification and where components have been removed and
subsequently replaced, the supplier shall inspect the soldered joints in
conformance with the accept/reject criteria of clause 12 in
ECSS‐Q‐ST‐70‐08.
NOTE For example: Inspection of the pad or track area to
ensure that no lifting has occurred and that no
damage has been sustained by the base material is
one of the required inspections.

4.18 Cutting of internal track of a multi-layer printed circuit

board

4.18.1 Procedure
a. The supplier should use method M.3.
b. If another method is used, the supplier shall submit it for approval.

4.18.2 Acceptance criteria

a. The supplier shall inspect the re‐worked area.
b. There shall be no damage to adjacent conductor tracks, plated through
holes, components and base laminate.

4.19 Quality assurance

4.19.1 General
a. ECSS‐Q‐ST‐20 shall apply.

4.19.2 Data
a. The supplier shall retain the quality records (e.g. logbooks) for at least ten
years or in conformance with project business agreement requirements,
b. Quality records shall contain, as a minimum, the following:
1. copy of final inspection documentation;
2. index of limited‐life articles and their use times;
3. nonconformance reports and corrective actions;
4. copy of the inspection and test results with reference to the
relevant procedure.

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4.19.3 Nonconformance
a. Any nonconformance shall be handled in conformance with
ECSS‐Q‐ST‐10‐09.

4.19.4 Calibration
a. The supplier shall calibrate each reference standard and piece of
measuring equipment.
b. The supplier shall record any suspected or actual equipment failure as a
project nonconformance report.
NOTE The purpose is that previous results can be
examined to ascertain whether or not re‐inspection
or retesting is required.
c. The supplier shall notify the final customer of the nonconformance
details.

4.19.5 Traceability
a. The supplier shall maintain traceability from incoming inspection to final
test, including details of test equipment, serial numbers and personnel
employed in performing the task.
b. The supplier shall record repair, modification or rework in the
documentation of the printed circuit board assembly.

4.19.6 Operator and inspector training and

certification
a. All operators and inspectors employed in repair or modification
procedures shall be trained and certified as detailed in clause 14.8 of
ECSS‐Q‐ST‐70‐08.
b. All operators and inspectors employed in repair or modification
procedures shall have undergone a further training programme to ensure
proficiency in the agreed repair methods.

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Annex A (informative)
Removal of conformal coating

A.1 Introduction
The operator removes any conformal coating before the disassembly of
components from printed circuit assemblies to ensure that:
a. the solder on the area to be repaired is freely accessible;
b. the re‐soldered joint is not contaminated.

A.2 Tools and materials

• Suitable cutting instrument,
• thermal parting device complete with tips,
• brushes,
• approved solvent and
• pencil‐type vacuum cleaner.

A.3 Methods for the removal of conformal coating

A.3.1 Method for the removal of polyurethane and

silicone-type coating
a. Carefully cut through the conformal coating that envelopes the
component to be replaced, using a suitable cutting instrument.
b. Peel away the cut area and, while doing so, apply the vacuum cleaner to
the area to remove any small loose particles of conformal coating.
c. Thoroughly clean the exposed area with an approved solvent, as
specified in ECSS‐Q‐ST‐70‐08 clause 6.4, before removal of solder joints;
apply minimum quantity of solvent and prevent solvent ingress beneath
the exposed edges of the conformal coating.

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A.3.2 Method for the removal of epoxy-type coating

a. Select an appropriate thermal parting tip to suit the workpiece
configuration. Set the nominal tip temperature, using the manufacturer’s
recommended procedure.
b. Apply the thermal parting tip to the coating, using a light pressure.
Regulate the tip temperature to a point where it will effectively “break
down“ the coating without scorching or charring (refer to Figure A‐1).
c. Gradually reduce the coating thickness around the component body
without contacting the board surface. Remove as much coating as
possible from around component leads to allow easy removal of the
leads. Preclip the leads of the component to be removed. This makes it
possible later to remove the component body separately from leads and
solder joints. Use the pencil‐type vacuum cleaner and a bristle brush to
remove waste material during the parting process to allow good visual
access and prevent inadvertent damage to the board and particulate
contamination.
d. When sufficient coating has been removed, leaving only a small bonded
joint between component and board, heat the component body with the
thermal parting unit or small soldering iron to weaken the bond at the
component or epoxy interface and lift the component free of the circuit
board.
e. Remove now the remaining coating material by additional thermal
parting. Then remove the remaining leads and solder joints by an
appropriate solder extraction means as described in Annex B.

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Pencil type vacuum

cleaner

Thermal parting device

Figure A‐1: Removal of coating by thermal parting device

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Annex B (informative)
Solder joint removal and unclinching

B.1 Introduction
A basic step for the repair of an electronic circuit is the removal of the solder
joint retaining the component in position. There are various methods of
achieving this and avoiding thermal and mechanical damage during
component replacement. The following clauses describe a number of removal
methods which can be used according to the facilities and the specific
conditions.

B.2 Tools and materials

• Soldering iron or hot jet blower (as applicable),
• solder sucker: continuous vacuum device, hand, wicking wire (as
applicable), and
• thermal parting device, tweezers, pliers (as applicable).

B.3 Methods for solder joint removal and unclinching

B.3.1 Method for solder extraction with continuous

vacuum
To obtain the continuous vacuum the operator either uses a vacuum pump or a
separate vacuum device attached to the soldering iron. The solder can then be
withdrawn from the joint either directly through the tip of the soldering iron or
through a separate vacuum device attached to the soldering iron. The heated tip
of the iron is applied to the soldered joint and, when a melt is noted, the
vacuum is activated, e.g. by means of a foot switch, causing the solder to be
withdrawn from the joint and deposited into a collecting chamber.
With appropriate handling, this method will minimise the overheating
problem. The correct positioning of the vacuum device tip is shown in Figure B‐
1.

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Vacuum device tip

Air flow

Figure B‐1: Continuous vacuum solder extraction on stud lead

B.3.2 Method for solder extraction using sucker

This is a method in which the molten solder is removed by means of a sucker
tip. There are several variations of this technique, but all of them have the
disadvantage that the vacuum is applied only in short pulses and the procedure
may have to be repeated several times. In addition, since the work is performed
with two different devices simultaneously, i.e. soldering iron and sucker tip
(refer to Figure B‐2), this method finds only limited use.

Hand sucker

Figure B‐2: Pulse‐type solder sucker in use

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B.3.3 Method for hot jet extraction

This method relies on a thin jet of heated air (200 °C to 300 °C) to melt the
defective solder joint. It is well suited to circuits in flat packages. Owing to the
controlled dimensions of the jet, one can unsolder connecting wires
individually without affecting the other joints. The molten solder is then wicked
off or vacuumed away (refer to Figure B‐3). This method finds only limited use.

Hot jet blower

Protective sleeving

Figure B‐3: Lifting individual leads with hot jet

B.3.4 Method for the use of wicking braid

This method (refer to Figure B‐4) incorporates braiding saturated with flux or
stranded wire heated in contact with the solder joint. Capillary action causes the
molten solder to be drawn into the wick. This method works well on large
surface joints and can be applied to through‐hole solder joints or, with more
difficulty, to the solder between a clinched lead and a terminal area. As the
amount of wicked‐out solder increases, the capillary action becomes less
effective. Thus, joints containing a large amount of solder often require the
repeated application of heat, creating a danger of overheating.

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Wicking braid

Component

Figure B‐4: Cross‐sectional view of wicking method

B.3.5 Method for unclinching of leads

a. Initial solder removal: first use method B.3.1 (Vacuum) or method B.3.4
(Wicking) to remove at least the surface solder from around the clinched
lead and terminal area. This permits observation of the true
circumstances of the clinched lead contact to the terminal area and the
extent of the remaining solder joint between them.
b. After solder removal from the clinched area, the joint is allowed to cool
down for a few seconds and the wire is carefully lifted with a thin plastic
rod or similar device. The method, shown in Figure B‐5, is designed to
prevent damage to the terminal area. In lieu of the thermal parting
device, tweezers or pliers may be used, provided that no contact is made
with the terminal area.
c. Final solder removal: once the clinched leads are straightened, one may
proceed to remove the solder joints by method B.3.1, treating them as if
they were originally unclinched leads.

Thermal parting device

Figure B‐5: Hot unclinching with thermal parting device

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Annex C (informative)
Repair of damaged gold-plated areas

C.1 Introduction
Gold‐plating can be damaged as a result of:
a. solder splatter on gold plating;
b. uneven scratched plating.

C.2 Tools and materials

• Soldering iron,
• solder sucker, wicking wire, pencil‐type vacuum cleaner,
• safety glasses (or similar protecting device),
• rubber gloves,
• glass fibre eraser,
• cleaning tissue, and
• approved solvent.

C.3 Methods for the repair of damaged gold-plated areas

C.3.1 Method for the removal of solder splatter on

gold plating
a. Remove solder by vacuuming or by wicking with a flux impregnated
wire (refer to method B.3.1 or B.3.4). Apply heat just long enough for
melting and removal of the solder.
b. Remove remaining solder with a glass fibre eraser or similar and
employing a vacuum cleaner.
c. Clean repair area with approved solvent.

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Annex D (informative)
Repair of damaged conductor tracks

D.1 Introduction
The damage to the conductor can be in one of the following forms:
a. complete break;
b. scratches or nicks that reduce the current‐carrying capacity of the
conductor to levels below standard requirement.

D.2 Tools and materials

• Soldering iron and solder,
• Tweezers,
• Epoxy resin,
• Approved solvent,
• Fibre eraser,
• Cleaning tissue.

D.3 Method for the repair of damaged conductor tracks

a. Clean both sides of break in conductor, to at least three times the track
width on each side, with a fibre eraser and then with an approved
solvent.
b. Cut a piece of applicable gauge tinned copper or silver wire to at least six
times the track width.
c. Hold the wire with a pair of tweezers on centre line of conductor and
solder in place.
d. Clean area with approved solvent.
e. Flow a small amount of epoxy resin over the entire repair and cure.
Alternative coatings according to disposition by NRB may be used.

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Annex E (informative)
Repair of lifted conductors

E.1 Introduction
This procedure is applicable where a portion of the conductor has lifted from
the substrate but not broken (refer to Figure E‐1).

2 cm max.

Lifted conductor

Base laminate

Figure E‐1: Lifted conductors

E.2 Tools and materials

• Approved solvent,
• space‐approved epoxy adhesive (compatible with base epoxy),
• plastic or wooden toothpicks,
• strip of thin PTFE sheet,
• small weights.

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E.3 Methods for repair of lifted conductors

E.3.1 Method for the use of epoxy under conductor

(Refer to Figure E‐2)
a. Clean underside of lifted conductor and surrounding area with an
approved solvent.
b. Remove all particles that prevent the lifted conductor from making
intimate contact with the surface of the substrate.
c. Using a hot air lance, gently blow the adhesive under the entire length of
lifted conductor. Ensure the epoxy does not come into contact with
surfaces required subsequently for soldering.
d. Press conductor into contact with substrate by the application of small
weights; cover the interface between the weights and track with a thin
piece of PTFE. Cure in conformance with the manufacturer data sheet
e. Do not handle repaired units until the epoxy has cured.

Epoxy

Figure E‐2: Repair using epoxy under conductor

E.3.2 Method for the use of epoxy over conductor

(Refer to Figure E‐3)
a. Clean the upper face of the lifted conductor and surrounding area with
an approved solvent
b. Apply epoxy to the surface of the lifted conductor and to its
surroundings to a distance of at least 3 mm in all directions from the
damaged area.
c. Cure in conformance with the manufacturer data sheet.
d. Do not handle repaired units until the epoxy has cured.

Epoxy

Figure E‐3: Repair using epoxy over conductor

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Annex F (informative)
Repair of lifted terminal areas (pads)

F.1 Introduction
This procedure is applicable to:
a. any terminal area that has been separated, loosened or lifted or which is
otherwise no longer bonded to the base material, as shown in Figure F‐1;
b. any terminal area that has been damaged by tearing, cutting, or other
mechanical means in excess of established acceptance limits (refer to
Figure F‐2 and Figure F‐3);
c. terminal areas designed to accommodate clinched leads.

Base laminate

Figure F‐1: Lifted terminal area

X
Acceptance limit: x/2

Figure F‐2: Terminal areas without track

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W
D

W
W≥ D/4
Acceptance limit

Figure F‐3: Terminal areas with track attached

F.2 Tools and materials

• Solder remover (vacuum type),
• oven (if thermal curing epoxy is used),
• soldering iron,
• plastic or wooden toothpicks (for lifting terminal area whilst cleaning),
• approved solvent,
• space‐approved epoxy resin compatible with base epoxy,
• weights.

F.3 Method for the repair of lifted terminal areas (pads)

a. Clean all dirt, fingerprints, flux residue and foreign matter from under
and around pad with isopropyl alcohol or other approved solvent.
b. Insert space‐approved epoxy adhesive under the copper with a
camel‐hair brush, syringe or other suitable applicator.
c. Clean solder side of repair of terminal area.
d. Press terminal area down with a clamp or weight unit set.
e. Air cure or bake to manufacturer’s instructions before attempting further
work.

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Annex G (informative)
Terminal post replacement

G.1 Introduction
This procedure is applicable when terminal posts have become damaged.

G.2 Tools and materials

• Replacement terminal posts,
• side cutters,
• soldering iron,
• approved solder,
• approved solvent,
• appropriate PCB drill bits,
• suitable support jigs,
• pliers,
• pencil vacuum cleaner.

G.3 Method for the replacement of terminal post

a. Remove the conformal coating from the area surrounding the damaged
post (see clause 4.6).
b. Remove the component connected to the terminal post by cutting the
component leads. Remove the section of component lead remaining at
the non‐damaged side of the component using the method described in
Annex J.
c. Turn the printed circuit assembly over and support it on suitable jigging
so that the subsequent drilling operation does not cause flexing of the
assembly.
d. Select a drill bit that is approximately 80 % of the post diameter and drill
into the post to a depth that just exceeds the thickness of the epoxy board
(refer to Figure G‐1).
e. With a drill bit the exact size of the terminal post, slowly drill into the
post until the swaged section has been removed (refer to Figure G‐1).

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f. Remove the solder from the base of the post.
g. Take the post between the jaws of a pair of pliers and, with a slight
rocking motion, pull the post from the printed circuit assembly. Apply
heat if the terminal post is installed in a plated‐through hole.
h. Clean the surrounding area with approved solvent and pencil vacuum
cleaner.
i. Fit replacement terminal post in conformance with normal
manufacturing procedure.
j. Clean with approved solvent.
k. Inspect joint for correctness of swage and soldering.
l. Fit new component.
m. Re‐apply conformal coating to the area.
n. On PCBs with more than 2 layers and PTHs make sure that the internal
layers are still connected.

Existing terminal post

Depth of first drilling

Completion of second drilling

Figure G‐1: Terminal post replacement

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Annex H (informative)
Wire-to-wire joints

H.1 Introduction
Wire‐to‐wire joints are used for wires that are broken or require lengthening for
modification purposes.

H.2 Tools and materials

• Side cutters,
• soldering iron, solder and flux,
• heating means (infrared or hot air),
• approved solvent,
• wire stripper,
• heat shunt,
• heat shrink sleeving (transparent, approved type),
• approved insulated wire,
• wire clamping device and
• cotton gloves or finger cots.

H.3 Method for wire-to-wire joining

a. Cut wires to the correct length.
b. Remove wire insulation as detailed in clause 9.9.2 of ECSS‐Q‐ST‐70‐08
and ensure that the insulation clearance is as prescribed in clause 7.2.1.4
of ECSS‐Q‐ST‐70‐08.
c. If disturbed, restore the lay of a stranded conductor. Do not use bare
fingers to achieve this.
d. Pre‐tin the wires in conformance with clause 7 of ECSS‐Q‐ST‐70‐08.
e. Place heat‐shrink sleeving over the wire insulation in readiness for
sliding over the joined wire.
f. If necessary, position wires into joined configuration and maintain
position with clamping device (refer to Figure H‐1).

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g. Solder wires together (using heat shunt on each lead) to form a lap‐type
joint. Ensure a low contact angle between the solder and wires and
ensure that the contour of the individual conductor wires is visible.
h. Clean area with approved solvent to remove flux.
i. Inspect joint in conformance with clause 12 of ECSS‐Q‐ST‐70‐08.
j. Position shrink sleeve over joint and shrink to size in conformance with
manufacturer’s instructions. Ensure that the shrink temperature is always
below the melting point of the solder. For the configurations described in
clauses Annex I and Annex L, a wrap‐around joint can be used for
component lead extension.
k. Position the extended wire on the board and bond to the board using a
suitable space‐approved adhesive. Bond the lead along its length at
intervals of not more than 2,5 cm. Make the first spot bond of the
extension wire within 1,5 cm from the component‐to‐wire soldered joint.

Component

5-8 mm

Protective sleeving

Shrink sleeving

Figure H‐1: Use of approved type support clamp/heat sink

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Annex I (informative)
Addition of components

I.1 Introduction
Additional components can be required on a printed circuit assembly for the
following reasons:
a. an oversight in design;
b. subsequent testing of the manufactured assembly indicates a need for
modification;
c. a change in the design requirement.

I.2 Tools and materials

• Soldering iron,
• approved solder,
• side cutters,
• heat shunt,
• wire stripper,
• approval solvent and cleaning brushes,
• approved epoxy paste staking compound,
• approved thixotropic polyurethane staking compound,
• terminal pins,
• wire insulation,
• approved insulated wire,
• lint‐free paper, and
• pencil type vacuum cleaner.

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I.3 Methods for addition of components

I.3.1 Method for additional components mounted on

reverse (non-component) side of board
a. Using lint‐free paper, mask as much as possible of the circuitry
surrounding the area to be worked.
b. Carefully remove any conformal coating from the area to be worked. Use
the method described in Annex A.
c. If the new component lead traverses conductors, assemble insulating
sleeving to the section of lead that will not be soldered (refer to Figure I‐
1).
d. Form the component lead as shown in Figure I‐1. Form the section of lead
to be soldered so that it follows the centre‐line of the conductor track.
Observe forming in conformance with clause 8.1.5 of ECSS‐Q‐ST‐70‐08.
e. Use component lead diameter (or width) less or equal to two thirds of
track width.
f. Solder into position.
g. Remove protective paper.
h. Clean soldered area with approved solvent.
i. Inspect with respect to clause 8.1.5 of ECSS‐Q‐ST‐70‐08 .
j. Re‐apply conformal coating and cure in conformance with the
manufacturer data sheet

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PCB track 4 mm min.

Insulating sleeving

New component
Base laminate

Figure I‐1: Additional components mounted on reverse (non‐component) side of board

I.3.2 Method for additional components mounted on

component side of board
a. Using lint‐free paper, mask as much as possible of the circuitry
surrounding the area to be worked.
b. Carefully remove any conformal coating from the area to be worked. Use
the method described in Annex A.
c. Drill holes in the printed circuit assembly adjacent to the conductor
tracks to which the component is to be joined. Use the vacuum cleaner
during this operation to remove swarf. Drill holes with diameters which
are of the size component lead diameter, plus 0,25 mm to 0,50 mm.
Position the hole that the edge of the hole is a minimum of 0,2 mm from
the edge of the conductor.
d. Form the component leads and assemble the component to the board as
shown in Figure I‐2. Components may also be mounted parallel with
existing tracks to avoid additional bending of leads. Consider the stress
relief and bend radius requirements of clause 8.1.5 in ECSS‐Q‐ST‐70‐08.
e. Place the section of the component lead to be soldered along the centre
line of the conductor and solder into this position (refer to Figure I‐2).
f. Use component lead diameter (or width) less or equal to two thirds of
track width.
g. Clean soldered area with approved solvent.

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h. Inspect in conformance with clause 8.1.5 of ECSS‐Q‐ST‐70‐08.
i. Re‐apply conformal coating and cure according to the manufacturer data
sheet

Base laminate

New component

0,2 mm min.

PCB track

4 mm min.

Figure I‐2: Additional components mounted on component side of board

I.3.3 Method for additional components mounted on

terminal posts, including “piggyback“
mounting
a. Using lint‐free paper, mask as much as possible of the circuitry
surrounding the area to be worked.
b. Carefully remove any conformal coating from the area to be worked. Use
the method described in Annex A.
c. Drill the terminal post holes into suitable land areas of the conductor
track. Use the vacuum cleaner during this operation.
d. Mount and solder the terminal posts in their respective holes.
e. Solder the component to the terminal posts in conformance with clause 9
ECSS‐Q‐ST‐70‐08.
f. If it is necessary to attach the leads of the component to the
non‐component side of the board, use method I.3.2 step c.
Mount components parallel to each other with one side of each
component lying on the PCB. However, it is also permissible to mount
one component on top of another (“piggyback” mounting). If this is
required, solder the second component to the terminal posts as shown in
Figure I‐3.

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g. For a “piggyback” configuration, apply an approved staking compound
to join component bodies together and the lower component to the board.
h. Re‐apply conformal coating and cure according to the manufacturer data
sheet

“Piggyback” mounted component

Epoxy staking compound Terminal post

Base
laminate

Figure I‐3:“Piggyback” mounting of one component on top of another

I.3.4 Method for additional components mounted (on

reverse side or on component side of board)
using staking compound
The bonding of components avoids subsequent vibration problems. Several
configurations are permissible (refer to Figure I‐4, Figure I‐5, Figure I‐6, and
Figure I‐7).
a. Using lint‐free paper, mask as much as possible of the circuitry
surrounding the area to be worked.
b. Carefully remove any conformal coating from the area to be worked. Use
the method described in Annex A.
c. For the configuration shown in Figure I‐7 only, drill holes in the
double‐sided printed circuit board at the position where the component
is to be mounted. Use the vacuum cleaner during this operation to
remove swarf. Drill holes with diameters which are of the size
component lead diameter, plus 0,25 mm to 0,50 mm. This procedure can

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be applied to multi‐layer boards, if controls are applied to ensure that
internal conductors are not damaged.
d. Form the component leads. Bond the component to the board with epoxy
paste or thixotropic polyurethane staking compound as illustrated in
Figure I‐4, Figure I‐5, Figure I‐6, and Figure I‐7. Cure according the
manufacturer data sheet.
If a DIL package is mounted upside down, de‐gold and pre‐tin leads in
conformance with clause 7.2.3 of ECSS‐Q‐ST‐70‐08. Re‐mark part coding
onto the underside to preserve identification.
Consider the stress relief and bend radius requirements (clause 8.1.5 of
ECSS‐Q‐ST‐70‐08).
e. Strip, pre‐tin (with use of a heat sink to prevent wicking) and form
space‐approved insulated wire for component lead extension.
For connecting top/bottom sides of double‐sided or multi‐layer printed
circuit boards, insulated wire can be passed through unused plated
through holes. Holes should not be drilled or solder‐wicked to enable the
wire to be inserted. (AWG 30, silver plated, stranded, insulated wire fits
adequately in a plated through hole of diameter 0,75 mm).
f. Solder wires to component leads using a wrap‐around connection as per
clause “Turret and straight pin terminals” of ECSS‐Q‐ST‐70‐08 (refer to
Figure I‐4, Figure I‐5,Figure I‐6, and Figure I‐7).
g. For some component types, use a heat sink to prevent reflow of low
melting point soldered connections within the component body.
h. Clean soldered area with approved solvent.
i. Inspect in conformance with clause 12 of ECSS‐Q‐ST‐70‐08.
j. Position wire extensions on board and bond to the board in conformance
with Annex H.
k. Re‐apply conformal coating and cure according to the manufacturer data
sheet

I.3.5 Method for additional components mounted (on

reverse side or on component side of board) to
leads of adjacent components
Different configurations in conformance with the Figure I‐8, Figure I‐9, and
Figure I‐10 may be used.
a. Using lint‐free paper, mask as much as possible of the circuitry
surrounding the area to be worked.
b. Carefully remove any conformal coating from the area to be worked. Use
the method described in clause Annex A.
c. For the configurations shown in Figure I‐8 and Figure I‐9, remove
existing components in the adjacent positions (to which connections of
the additional component are required). Use the method described in
Annex J. Replace with new components which have either leads

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extended in the “Z” direction (refer to Figure I‐8) or a formed “pigtail”
lead (refer to Figure I‐9).
d. Form the leads of the additional component. Consider the stress relief
and bend radius requirements (clause 8.1.5 of ECSS‐Q‐ST‐70‐08. For the
configuration shown in Figure I‐10, assemble insulating sleeving to the
section of lead that will not be soldered if lead passes above a conductor.
e. Solder leads onto the leads of adjacent components using a wrap‐around
connection as per clause “Turret and straight pin terminals” of ECSS‐
Q‐ST‐70‐08.
f. Clean soldered area with approved solvent.
g. Inspect in conformance with clause 12 of ECSS‐Q‐ST‐70‐08.
h. For the configurations shown in Figure I‐9 and Figure I‐10, bond
components to the board.
i. Re‐apply conformal coating and cure in conformance with the
manufacturer data sheet

Insulated wire

New components

Fillet of staking compound

Base laminate

Spot bonding

Figure I‐4: Mounting and wiring of additional axially‐leaded components mounted

(on reverse side or on component side of board) using staking compound

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Insulated wire

Fillet of staking
compound

Spot bonding

Base laminate
15 mm max.

Figure I‐5: Upside down mounting and wiring of additional side‐brazed DIL component
(on reverse side or on component side of board) using staking compound

Fillet of staking compound

New component

Insulated wire

Spot bond

Base laminate

Figure I‐6: Mounting of additional non‐axially leaded components, e.g. capacitors, with
wire connecting top or bottom sides of the circuit board using staking compound (on
reverse side or on component side of board)

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New component

Insulated
wire

Plain holes drilled to

take extended lead
Fillet of staking
compound
Base laminate
(Double-sided board)

2 mm max.

Spot bonding

Figure I‐7: Mounting of additional component (on component side of board) with wire
connections on reverse side of board using staking compound

Components replaced and

leads extended

New component

2 mm max.

Base laminate

Figure I‐8: Mounting of additional component (on reverse side of board) across extended
leads of adjacent components

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Component replaced and

lead “pigtailed”

New component bonded to board

Base laminate

Figure I‐9: Mounting of additional component by linking to a “pigtailed” lead of an

adjacent component

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Wrap-around connection to transistor lead,

away from stress relief bend

Transistor support rod

(bonded to board and
component)
New component
bonded to board

Sleeved lead bonded to board

(required when lead passes
above a conductor)

Base lamintate

Figure I‐10: Mounting of additional component by linking to lead of an adjacent transistor

(or other large component)

I.3.6 Method for the addition of a wire link onto

soldered chips on a single side piece of PCB
with appropriate pads
The number of pieces of PCB should not exceed two within any one area of
25 cm2. It is possible to glue a piece of PCB onto a tinned surface if this does not
exceed 50 % of piece surface.
a. Glue with epoxy pieces of PCB on PCB board and cure.
b. Solder wire on appropriate pads on piece of PCB. With a length greater
than 1,2 mm.
c. Clean soldered area with approved solvent.
d. Inspect joint in conformance with clause 12 ECSS‐Q‐ST‐70‐08.
e. Position the extended wire on the board and bond to the board by using
a suitable space‐approved adhesive (epoxy spot). Bond the lead along its
length at intervals of not more than 3 cm, if it is longer than 3 cm. Make
the first spot bond of the extension wire just after the wire stress relief.
f. Re‐apply conformal coating and cure in conformance with the
manufacturer data sheet.

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I.3.7 Method for the addition of a wire link onto

metallized cap of chips directly glued on PCB
a. Put an epoxy spot at the centre of component, suited with the size of
package.
b. Bond the chip on PCB and cure.
c. Check that the epoxy spot does not extend onto metallized cap.
d. Solder silver wires or insulated wire (refer to Figure I‐11.
e. Clean soldered area with approved solvent.
f. Inspect in conformance with clause 12 of ECSS‐Q‐ST‐70‐08.
g. Position the extended wire on the board and bond to the board by using
a suitable space‐approved adhesive (epoxy spot). Bond the lead along its
length at intervals of not more than 3 cm, if it is longer than 3 cm. Make
the first spot bond of the extension wire just after the wire stress relief.
h. Re‐apply conformal coating and cure in conformance with the
manufacturer data sheet.

Figure I‐11: Addition of a wire link onto metallized cap of chips directly glued on PCB

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Annex J (informative)
Removal and replacement of axial and
multi-lead components

J.1 Introduction
This procedure is applicable to components having axial or multi‐lead
configurations.

J.2 Tools and materials

• Side‐cutting pliers or diamond saw,
• soldering iron,
• long‐nose pliers, and
• approved solvent.

J.3 Methods for removal and replacement of axial and

multi-lead components

J.3.1 Method for the removal of components with

axial leads (destructive removal)
a. Cut the vertical section of the component leads just above the solder fillet
and parallel to the surface of the board. Ensure that burrs are not formed.
b. Remove the remaining portion of the lead on the other side of the board
using either a soldering iron with wick or vacuum extractor, then gently
pull the lead with long‐nose pliers when the solder is molten.
c. Remove excess solder with a vacuum extractor or solder remover.
d. Clean up the area of the joint with an approved solvent.
e. Fit new component and solder it in place in conformance with clause 8
ECSS‐Q‐ST‐70‐08.

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J.3.2 Method for the removal of multi-lead

components (destructive removal)
a. Cut component leads using diamond saw or side‐cutting pliers (refer to
Figure J‐1 and Figure J‐2).
b. Unsolder and remove the remaining portion of the leads on the other
side of the board, whilst gently pulling with long‐nose pliers when the
solder is molten.
c. Remove excess solder with a vacuum extractor or by the wicking
method.
d. Clean the area of the joint with an approved solvent.
e. Fit new component and solder in place in conformance with clause 8 of
ECSS‐Q‐ST‐70‐08.

Figure J‐1: Removal of multi‐lead components, clipping of component leads

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Figure J‐2: Removal of multi‐lead components, removal of remaining

component leads

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Annex K (informative)
Removal and replacement of flat-pack
components

K.1 Introduction
This procedure is applicable to components in flat‐pack configuration mounted
on the printed circuit board, in the same plane as the conductive pattern by
means of lap‐soldered joints.

K.2 Tools and materials

• Soldering iron, heat controlled,
• solder,
• wicking braid,
• strip Kapton® or Teflon® sheet (approx. 6 cm long),
• lead‐bending fixture for flat‐pack circuits, and
• approved solvent and cleaning tissue.

K.3 Method for the removal and replacement of flat-pack

components
a. Apply heat to the soldered joint, simultaneously lifting the leads by
sliding a piece of thin Kapton® or Teflon® sheet progressively from the
non‐soldered section of the lead towards the soldered section (refer to
Figure K‐1).
b. Remove adhesive bonding, if applicable, by suitable means as
dispositioned by NRB.
c. Clean solder area using an approved cleaning solvent.
d. Inspect surface of joint for raised areas of track and overheated solder.
Repair raised surfaces in conformance with the methods described in
Annex E. Remove overheated solder by wicking and re‐tin the solder
area.

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e. Position new component, tack it to the board for stability if required and
solder in place using a heat‐controlled soldering iron. If package density
allows, a reflow machine with a single lead tip (peg‐tip) may be used.
f. Apply new adhesive if required by component size, in conformance with
the clause 8.1.2 of ECSS‐Q‐ST‐70‐08.

PCB track

Kapton® strip
Solder area

Figure K‐1: Removal of flat‐pack components

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Annex L (informative)
Modification of component connections

L.1 Introduction
Modification of the connections from components to the printed circuit board
can be required for the same reasons as those given in clause I.1.

L.2 Tools and materials

• Soldering iron,
• approved solder,
• side cutters,
• approved solvent and cleaning brushes,
• lint‐free paper,
• pencil type vacuum cleaner,
• approved epoxy paste staking compound,
• approved insulated wire,
• plain copper wire,
• Teflon® sleeve tubing,
• hand‐held drill,
• scalpel blade, and
• long‐nose pliers.

L.3 Methods for modification of component connections

L.3.1 Method for the soldering of a wrap-around

connection to an extended component lead
a. Using lint‐free paper, mask as much as possible of the circuitry
surrounding the area to be worked.
b. Carefully remove any conformal coating from the area to be worked. Use
the method described in Annex A.

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c. Remove existing component in the location at which a wrap around
connection is required. Use the method described in Annex J. Replace
with a new component with lead extended in the “Z”‐direction (refer to
Figure L‐1).
d. Strip, pre‐tin (with use of a heat sink to prevent wicking) and form
space‐approved insulated wire for wrap‐around connection to extended
lead.
e. Solder wire to extended component lead using a wrap‐around
connection as per clause “Turret and straight pin terminals” of ECSS‐Q‐
ST‐70‐08.
f. Clean soldered area with approved solvent.
g. Inspect in conformance with clause 12 of ECSS‐Q‐ST‐70‐08.
h. Position wire connection on board and bond to the board as defined in
Annex H.
i. Re‐apply conformal coating and cure in conformance with the
manufacturer data sheet.

Z-direction

Component replaced
and lead extended

Base laminate
2 mm max.

Insulated wire

Spot bonding

Figure L‐1: Soldering of a wrap‐around connection to an extended component lead

L.3.2 Method for the soldering of component lead to

a stud lead mounted into an existing hole
a. Pre‐tin and solder a suitable diameter plain copper wire into the plated
through hole.
b. Mount component by attaching component lead to stud lead using a
wrap‐around connection (refer to Figure L‐2) as per clause “Turret and
straight pin terminals” of ECSS‐Q‐ST‐70‐08.
c. Clean soldered area with approved solvent.
d. Inspect in conformance with clause 12 of ECSS‐Q‐ST‐70‐08.
e. Ensure stress relief is provided in component lead.

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4 mm typ. Stud lead

Component with
lead diameter great
2 mm max. er than that of exist
ing hole

Base laminate

Figure L‐2: Soldering of component lead to a stud lead mounted into an

existing hole

L.3.3 Method for mounting a dual-in-line (DIL)

package with or without a wire link soldered
onto a cropped lead
a. Using lint‐free paper, mask as much as possible of the circuitry
surrounding the area to be worked.
b. Remove the existing DIL package. Use the method described in Annex J.
c. As required, crop leads of a replacement component in line with the
bottom of the component body as shown in Figure L‐3. (The component
may be of either a “J”‐lead or a “side‐brazed” lead configuration).
d. De‐gold and pre‐tin the leads in two operations in conformance with
clause 7 of ECSS‐Q‐ST‐70‐08. If connection of cropped leads to the board
is required, then de‐gold and pre‐tin the cropped leads by hand. For
cropped side‐brazed leads de‐gold and pre‐tin the entire lead shoulder
(but this does not necessarily include the gold‐plating on the braze fillet).
e. Solder the replacement component into position. If no connection of
cropped leads to the board is required, proceed to step h.
f. Strip, pre‐tin (with use of a heat sink to prevent wicking) and form
space‐approved insulated wire for connection of cropped leads to board.
g. Solder wires to cropped leads to form a lap joint. Wires may be led down
onto the board or may pass away from the board (refer to Figure L‐3 and
Figure L‐4). Use the lap joint with a length of three times the stripped
wire diameter. For cropped “J”‐leads, solder for not ore than 3 seconds at
a tip temperature of (250 ± 5) °C. For cropped “side‐brazed” leads, solder
for not more than 3 seconds at a tip temperature of (295 ± 5) °C.
h. Clean soldered area with approved solvent.
i. Inspect in conformance with clause 12 of ECSS‐Q‐ST‐70‐08. Position wire
connections on board and bond to the board as defined in Annex H.
j. Re‐apply conformal coating and cure in conformance with the
manufacturer data sheet.

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New component with cropped leads

Spot bonding
Base laminate
Insulated wire

Side view
Showing one cropped lead without connection and one
cropped lead with wire connection

2 mm min.
Insulating
support pad

Base laminate
Cross section

Figure L‐3: Mounting a dual‐in‐line package with or without a wire link soldered onto a
cropped lead (cropped lead without connection and cropped lead with connection led
through hole and onto board)

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New component with cropped lead

Spot bonding

Insulated wire

Base laminate

Figure L‐4: Mounting a dual‐in‐line package with or without a wire link soldered onto a
cropped lead (wire link passing away from board)

L.3.4 Method for mounting a connector with or

without a wire link soldered onto a cropped
lead
a. Using lint‐free paper, mask as much as possible of the circuitry
surrounding the area to be worked.
b. Remove the existing connector from the board. Use the method described
in Annex J.
c. As required, crop leads of a replacement connector as shown in Figure L‐
5.
d. De‐gold and pre‐tin connector leads, including cropped leads, if
connection of cropped leads to the board is required.
e. Solder the replacement connector into position. If no connection of
cropped leads to the board is required, proceed to step h.
f. Strip, pre‐tin (with use of a heat sink to prevent wicking) and form
space‐approved insulated wire for connection of cropped leads to board.
g. Solder wires to cropped leads using a wrap‐around connection as per
clause “Turret and straight pin terminals” of ECSS‐Q‐ST‐70‐08.
h. Clean soldered area with approved solvent.
i. Inspect in conformance with clause 12 of ECSS‐Q‐ST‐70‐08.
j. Position wire connections on board and bond to the board as defined in
Annex H.
k. Re‐apply conformal coating and cure in conformance with the
manufacturer data sheet.

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New connector with

cropped lead

Spot bonding

Insulated wire
Base laminate

Figure L‐5: Mounting a connector with a wire link soldered onto a cropped lead

L.3.5 Method for the addition of a wire link into a

plated-through hole occupied by a flat-section
lead
Volume limitations prevent the insertion of a wire link into a hole occupied by a
round‐section lead.
a. Using lint‐free paper, mask as much as possible of the circuitry
surrounding the area to be worked.
b. Remove conformal coating from the area surrounding the plated through
hole requiring addition of a wire link. Use the method described in
Annex A.
c. De‐solder the lead occupying the hole. Use the method described in
Annex B.
d. Strip, pre‐tin (with use of a heat sink to prevent wicking) and form
space‐approved insulated AWG 30 wire for making a link into the plated
through hole.
e. Insert wire into plated through hole to lie alongside the existing
component lead. The wire may enter from either the reverse side of the
board (refer to Figure L‐6) or from the component side of the board (refer
to Figure L‐7). Solder wire or component lead into place. (Figure L‐6 and
Figure L‐7 illustrate the solder fillet to be achieved).
f. Clean soldered area with approved solvent.
g. Inspect in conformance with clause 12 of ECSS‐Q‐ST‐70‐08.

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h. Position wire link on board and bond to the board as defined in Annex
H.
i. Re‐apply conformal coating and cure in conformance with the
manufacturer data sheet

Component with flat-

section leads

Base laminate

Spot bonding
Insulated wire

Figure L‐6: Addition of a wire link into a plated through hole occupied by a flat‐section
lead (wire link entering from the reverse side of the board)

Component with flat-

section leads

Spot bonding

Insulated wire

Base laminate

Figure L‐7: Addition of a wire link into a plated through hole occupied by a flat‐section
lead (wire link entering from the component side of the board)

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L.3.6 Method for the addition of a wire link on top of a

flat-pack lead
a. Using lint‐free paper, mask as much as possible of the circuitry
surrounding the area to be worked.
b. Remove conformal coating from the area surrounding the flat‐pack lead
requiring addition of a wire link. Use the method described in Annex A.
c. Strip, pre‐tin (with use of a heat sink to prevent wicking) and form
space‐approved insulated wire for making a link on top of the flat‐pack
lead.
d. Place the section of the wire to be soldered along the centre line of the
lead and solder into this position (refer to Figure L‐8 and, for the solder
fillet appropriate for a lap joint, Figure I‐1 and Figure I‐2). Use a wire
with diameter less or equal to two thirds lead width.
e. Clean soldered area with approved solvent.
f. Inspect in conformance with clause 12 of ECSS‐Q‐ST‐70‐08.
g. Position wire link on board and bond to the board as defined in Annex
H.
h. Re‐apply conformal coating and cure in conformance with the
manufacturer data sheet .

Wire soldered on top

of flat-pack lead

Spot bonding 2 mm min.

Insulated wire

Base laminate

Figure L‐8: Addition of a wire link on top of a flat‐pack lead

L.3.7 Method for the isolation of a component lead

This “drilling‐isolation” method is critical.
a. Using lint‐free paper, mask as much as possible of the circuitry
surrounding the area to be worked.

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b. Remove the existing component. Use the method described in Annex J.
c. Where isolation is required, drill out plated through holes, using a
hand‐held drill. Hold the drill vertically with respect to the board. For
example, a 1,1 mm diameter drill can be used for a 0,75 mm diameter
hole.
d. Remove pads on both sides of the board using a new scalpel blade. Take
care that no glass fibres within the board are cut.
e. Drill out further. For example, after using a 1,1 mm diameter drill (refer
to step c.) use a 1,3 mm diameter hand‐held drill. Use the vacuum cleaner
to remove swarf from the drilling operations.
f. Insert lengths of Teflon® sleeve tubing into drilled out holes so that the
tube isolates the lead between component body and soldering spot in
such a way that a minimum distance of 0,5 mm is achieved (refer to
Figure L‐9). (For the example above, use tubing of 0,5 mm internal bore
diameter).
g. Insert new component with appropriate leads passing through the
isolated holes. Solder remaining leads.
h. When required, attach stripped, pre‐tinned and formed insulated wire to
the isolated lead using a wrap‐around connection as per clause “Turret
and straight pin terminals” of ECSS‐Q‐ST‐70‐08.
i. Clean soldered area with approved solvent.
j. Inspect in conformance with clause 12 of ECSS‐Q‐ST‐70‐08
k. Spot bond component and wire connections using epoxy staking
compound and cure in conformance with standard requirements.
l. Re‐apply conformal coating and cure in conformance with the
manufacturer data sheet .

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New component

Base laminate

Spot bonding
0,5 mm min.

0,5 mm min. Insulated wire

Teflon® sleeve tubing

Figure L‐9: Isolation of a component lead

L.3.8 Method for the addition of a wire link onto

terminal pad of soldered chips
a. Flux the chip solder joint with brush.
b. Solder silver wires or insulated wires (refer to Figure L‐10) over a length
greater than 1,2 mm.
c. Clean soldered area with approved solvent.
d. Inspect joint in conformance with clause 12 of ECSS‐Q‐ST‐70‐08.
e. Position the extended wire on the board and bond to the board by using
a suitable space‐approved adhesive (epoxy spot). Bond the lead along its
length at intervals of not more than 3 cm, if it is longer than 3 cm. Make
the first spot bond of the extension wire just after the wire stress relief.
f. Re‐apply conformal coating and cure in conformance with the
manufacturer data sheet.

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Figure L‐10: Addition of a wire link onto terminal pad of soldered chips

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Annex M (informative)
Cutting of internal track of a multi-layer
printed circuit board

M.1 Introduction
This procedure can be used when it is necessary to interrupt an internal
connection of a multi‐layer printed circuit board.

M.2 Tools and materials

• Lint‐free paper,
• approved solvent and cleaning brushes,
• pencil type vacuum cleaner,
• approved PCB repair facility (work station), including a milling
attachment, and
• approved epoxy compound.

M.3 Method for cutting the internal track of a multi-layer

printed circuit board
a. Using lint‐free paper, mask as much as possible of the circuitry
surrounding the area to be worked.
b. Carefully remove any conformal coating from the area to be worked. Use
the method described in clause Annex A.
c. Mill through successive layers of the board progressively (to ensure clear
visibility of layer separation and to avoid the presence of shorts caused
by burrs) until there is clear visibility of the internal track to be cut (refer
to Figure M‐1). Use the vacuum cleaner to remove swarf from the milling
operation.
d. Cut the track and check that the resistance is greater than 2 MΩ.
Ensure there is no damage to mounted parts during electrical
monitoring.
e. Remove protective paper.
f. Clean milled area with approved solvent.

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g. Fill hole with epoxy compound and cure to the manufacturer data sheet
h. Re‐apply conformal coating and cure to the manufacturer data sheet.

1 mm

X-face

0,75 mm

1st layer in
0,5 mm
Laminate layers

Track out

Dimensions are for guidance only

Figure M‐1: Cutting of internal track of a multi‐layer circuit board

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Bibliography

ECSS‐S‐ST‐00 ECSS system — Description and implementation

and general requirements

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