Dell PowerEdge M640

Technical Guide
Notes, cautions, and warnings

NOTE: A NOTE indicates important information that helps you make better use of your product.

CAUTION: A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoid the
problem.

WARNING: A WARNING indicates a potential for property damage, personal injury, or death.

© 2017 -2020 Dell Inc. or its subsidiaries. All rights reserved. Dell, EMC, and other trademarks are trademarks of Dell Inc. or its
subsidiaries. Other trademarks may be trademarks of their respective owners.

2020 - 04

Rev. A04
 Contents

List of Figures..........................................................................................................................................................5

List of Tables........................................................................................................................................................... 6

1 System overview.......................................................................................................................... 8
Introduction............................................................................................................................................................................ 8
New technologies.................................................................................................................................................................. 8

2 System features...........................................................................................................................9
Product comparison.............................................................................................................................................................. 9
Specifications......................................................................................................................................................................... 9

3 Chassis views and features.......................................................................................................... 12

Front view of the system.................................................................................................................................................... 12
Inside the system..................................................................................................................................................................13
Security features.................................................................................................................................................................. 13

4 Processor...................................................................................................................................14
Processor features...............................................................................................................................................................14
Supported Processors......................................................................................................................................................... 14
Chipset...................................................................................................................................................................................16

5 Memory..................................................................................................................................... 17
Memory configurations........................................................................................................................................................18

6 Storage......................................................................................................................................19
Internal persistent storage.................................................................................................................................................. 19
External storage...................................................................................................................................................................20

7 Networking and PCIe...................................................................................................................21

PCIe expansion..................................................................................................................................................................... 21
PCIe slot................................................................................................................................................................................ 21

8 Power, Thermal, and Acoustics....................................................................................................22

Power consumption and energy efficiency......................................................................................................................22
Power supply units.............................................................................................................................................................. 23
Thermal and Acoustics........................................................................................................................................................23
Power consumption and energy efficiency................................................................................................................ 23
Thermal design...............................................................................................................................................................23
Power supply units........................................................................................................................................................ 24
Acoustical design........................................................................................................................................................... 24

9 Dell EMC OpenManage systems management............................................................................... 25

Contents 3
 Server and Chassis Managers........................................................................................................................................... 26
Dell EMC consoles...............................................................................................................................................................26
Automation Enablers........................................................................................................................................................... 26
Integration with third-party consoles................................................................................................................................26
Connections for third-party consoles............................................................................................................................... 26
Dell EMC Update Utilities................................................................................................................................................... 26
Dell resources.......................................................................................................................................................................26

10 Appendix A. Additional specifications..........................................................................................28

Power supply........................................................................................................................................................................28
Chassis dimension............................................................................................................................................................... 28
Environmental specifications............................................................................................................................................. 28
Particulate and gaseous contamination specifications ............................................................................................ 29
Standard operating temperature................................................................................................................................. 30
Expanded operating temperature................................................................................................................................30
USB peripherals................................................................................................................................................................... 30

11 Appendix B. Standards compliance.............................................................................................. 31

12 Appendix C Additional resources................................................................................................ 32

13 Appendix D. Support and deployment services.............................................................................33

ProDeploy Enterprise Suite and Residency Services...................................................................................................... 33
ProDeploy Plus............................................................................................................................................................... 33
ProDeploy....................................................................................................................................................................... 33
Basic Deployment.......................................................................................................................................................... 33
Residency Services........................................................................................................................................................34
Deployment services........................................................................................................................................................... 34
Remote Consulting Services.............................................................................................................................................. 34
Data Migration Service....................................................................................................................................................... 34
ProSupport Enterprise Suite.............................................................................................................................................. 34
ProSupport Plus.................................................................................................................................................................. 35
ProSupport...........................................................................................................................................................................35
ProSupport One for Data Center...................................................................................................................................... 35
Support Technologies......................................................................................................................................................... 36
Additional professional services.........................................................................................................................................36
Dell Education Services...................................................................................................................................................... 36
Dell EMC Global Infrastructure Consulting Services.......................................................................................................37
Dell EMC Managed Services..............................................................................................................................................37

4 Contents
List of Figures
Figure 1. Front view of the system......................................................................................................................12

Figure 2. Inside the system.................................................................................................................................. 13

Figure 3. Dell EMC OpenManage Portfolio....................................................................................................... 25

Figure 4. ProDeploy Enterprise Suite capabilities............................................................................................. 33

Figure 5. ProSupport Enterprise Suite...............................................................................................................34

Figure 6. ProSupport One for Data Center model........................................................................................... 35

Figure 7. SupportAssist model............................................................................................................................ 36

List of Figures 5
List of Tables
Table 1. New technologies..................................................................................................................................... 8

Table 2. General comparison.................................................................................................................................9

Table 3. Technical specifications.......................................................................................................................... 9

Table 4. Features available on the front of the system....................................................................................12

Table 5. Security features.................................................................................................................................... 13

Table 6. Supported Processors for M640......................................................................................................... 14

Table 7. Supported memory technologies..........................................................................................................17

Table 8. Supported memory.................................................................................................................................17

Table 9. DIMM performance details....................................................................................................................17

Table 10. Supported RAS features......................................................................................................................18

Table 11. PERC series offering............................................................................................................................. 19

Table 12. Power tools and technologies............................................................................................................ 22

Table 13. Power tools and technologies............................................................................................................ 23

Table 14. Acoustical reference points and output comparisons..................................................................... 24

Table 15. Dell resources....................................................................................................................................... 26

Table 16. Temperature specifications................................................................................................................ 28

Table 17. Relative humidity specifications......................................................................................................... 28

Table 18. Maximum vibration specifications......................................................................................................28

Table 19. Maximum shock specifications...........................................................................................................28

Table 20. Maximum altitude specifications....................................................................................................... 29

Table 21. Operating temperature de-rating specifications..............................................................................29

6 List of Tables
Table 22. Particulate contamination specifications..........................................................................................29

Table 23. Gaseous contamination specifications..............................................................................................29

Table 24. Standard operating temperature specifications.............................................................................. 30

Table 25. Expanded operating temperature specifications.............................................................................30

Table 26. Industry standard documents.............................................................................................................31

Table 27. Additional resources............................................................................................................................ 32

List of Tables 7
 1
System overview
Introduction
The PowerEdge M640 is an ultra-efficient blade server combining up to 28 cores of Intel processing power and up to 16 DDR4 DIMMs in a
dense, easy to manage platform ideal for data center workloads.
The M640 is designed for use with the PowerEdge M1000e enclosure.

New technologies
Table 1. New technologies
Technology Detailed description
CPU • Single or dual CPU option
• Supports Up to 28 cores Second Generation Intel Xeon
Scalable processor family.
• Up to 46-bit physical addressing and 48-bit virtual addressing
• Intel AVX 256 b floating point
• 32 KB instruction and 32 KB data L1 cache per core
• 1.0 MB Mid Level Cache (MLC) per core
• 1.375 MB non-inclusive Last Level Cache (LLC)
• UPI up to 10.4 GT/s and up to two links
• Integrated PCIe Gen3, 40 lanes/socket

Intel Ultra Path Interconnect (UPI) • Up to 10.4 GT/s with up to two links between sockets

Memory • Up to 6 channels with 2 or 1 DIMM per channel

• 16 DIMMs in total
• Supports DDR4, RDIMM, and LRDIMM
• Support registered ECC DDR4 DIMMs only
• DDR4 speed up to 2933 MHz
• 64 GB (LRDIMM) or 32 GB (RDIMM) with a maximum RAM
size of 1 TB

Chipset • Intel Lewisburg chipset

• Provides PCIe Gen2 ports
• Up to 20 Gen3 lanes for root ports, and up to 24 Gen3 lanes
used as downstream ports
• 14 SATA ports

Internal cards • bNDC daughter cards

• Mezzanine cards
• miniPERC
• IDSDM and BOSS hardware RAID

iDRAC9 with Lifecycle controller The new embedded systems management solution for the Dell
EMC systems features hardware and firmware inventory and
alerting, data center level power monitoring, and faster
performance.
For details, see the Dell EMC OpenManage systems management
section

8 System overview
 2
System features
Product comparison
Table 2. General comparison
Feature M630 M640
Form factor Half height blade Half height blade
CPU • 2 socket Intel Haswell EP • 2 socket Second Generation Intel Xeon Scalable
processor family(Cascade Lake).

Memory • 24x DDR4 RDIMM and LRDIMM • 16x DDR4 RDIMM and LRDIMM

Hard drives • 2.5-inch-12 GB SAS/SATA • 2.5-inch-12 GB SAS and 6 GB SATA

• 1.8-inch-6 GB SATA

Backplane • 2.5-inch hard drive: • 2.5-inch hard drive:

• SATA only from chipset • SAS only from PERC
• SAS/SATA from PERC • SAS/NVMe-SAS from PERC/PCIe from
• PCIe SSD from PCIe Exterder Module CPU2
• 1.8-inch hard drive: • SATA/NVMe-SATA from chipset/PCIe from
CPU2
• uSATA from chipset
• uSATA from PERC

Storage controller • Hardware RAID: H330, H730, H730P • Hardware RAID: H330, H730P, BOSS-M.2 SATA
• Software RAID: PERC S130 • Software RAID: PERC S140

PCIe SSD Yes Yes-NVMe

Communications • bNDC: 4x1 GbE, 2x10 GbE, 4x10GbE • bNDC: 4x1 GbE, 2x10 GbE, 4x10 GbE

Remote management • iDRAC8 • iDRAC9

Heat sink type • 68 mm-24 DIMMs • CPU1 heat sink: 100x108x30.5 mm

• 86 mm-20 DIMMs • CPU2 heat sink: 86x108x30.5 mm

TPM TPM Modular-FIPS TPM 1.2 TPM Modular-TPM 1.2 FIPS, TPM 2.0 FIPS, TPM 2.0
China

Specifications
Table 3. Technical specifications
Feature Specification
CPU • One or Two – up to 28 cores Second Generation Intel Xeon
family for servers(Cascade lake).
• Up to 46‐bit physical addressing and 48‐bit virtual addressing
• Intel AVX 256b floating point
• 32 KB instruction and 32 KB data L1 cache per core
• 1.0 MB Mid Level Cache (MLC) per core
• 1.375 MB non‐inclusive Last Level Cache (LLC)

System features 9
Feature Specification

• UPI up to 10.4GT/s and up to two links

• Integrated PCIe Gen3 40 lanes/socket

Chipset • Platform Controller Hub: INTEL Lewisburg

• Up to 20 Gen3 lanes (16 devices max) for root ports, and up to
24 Gen3 lanes used as downstream ports(Note1)
• Up to 10 superspeed, 14 highspeed (Note2)
• One integrated MAC
• GPIO bus(Group A~L and GPD)
• 1 SMBus ports, 6 SMlink ports(SMLink0B, SMLink0‐4)
• 14 SATA ports, up to 6Gb/s(Note3)

Memory • Supports RDIMM and LRDIMM memory

• Operate at DDR4‐2933,2667, 2400 MT/s speeds
• X16 288‐pin memory module sockets
• 8GB, 16GB, 32GB, and 64GB memory module capacities
• Minimum 8GB capacitance per module
• 64 GB (LRDIMM) or 32 GB (RDIMM) with maximum RAM size
of 1 TB

PCIe slot • Internal slot:

• One x8 PCIe Gen3 for bNDC cards – connected to CPU1
• Two x8 PCIe Gen3 for Mezz cards – connected to CPU1
• One x8 PCIe Gen3 for miniPERC – connected to CPU1
• One x 2 PCIe Gen3 for BOSS HW RAID – connected to
CPU2

SATA • 14 SATA ports available on the chipset

• 2x2.5-in hard drive/SSD

Video • Integrated VGA in iDRAC

• 4 Gb DDR4 shared with iDRAC application memory

LAN bNDC card: 1 G Quad ports, 10 G Dual/Quad ports

Dimension • Depth: 544.32 mm-handle closed
• Height: 50.35 mm
• Width: 197.9 mm

Hard drives • 2x 2.5-inch hard drives

• 10,000 and 15,000 rpm 2.5-inch SAS hard drives
• 7,200 rpm 2.5-inch Enterprise SATA hard drives
• 2.5-inch Solid State Drives (SSD), including PCIe NVMe drives

RAID controller • S140-SATA and NVMe software RAID

• H330
• H730P

Tape drives RD1000

Operating systems • Supported operating systems:
• RedHat Enterprise Linux 6.9 Server x86_64
• RedHat Enterprise Linux 7.4 Server x86_64
• Novell SuSE Linux Enterprise Server 12 SP2 x86_64
• MS, Windows Server 2016
• MS, Windows Server 2012 R2
• Ubuntu 16.04 LTS

10 System features
Feature Specification

• VMWare vSphere 2016 U1 (ESXi 6.5 U1)

• VMWare vSphere 2015 U3 (ESXi 6.0 U3)
• Citrix Xen Server 7.1
• Supported virtualization:
• VMWare vSphere 2016 U1 (ESXi 6.5 U1)
• VMWare vSphere 2015 U3 (ESXi 6.0 U3)
• Citrix Xen Server 7.1

System features 11
 3
Chassis views and features
Front view of the system
You can access the following components from the front of the system:

Figure 1. Front view of the system

Table 4. Features available on the front of the system

Item Ports, panels, and Icon Description
components
1 Hard drives/SSDs N/A 2.5 inch hard drive/SSDs are supported. For more information, see
the Technical specifications section.
2 USB 3.0 port Enables you to connect USB devices to the system.

3 iDRAC Direct port The iDRAC Direct port is micro USB 2.0-compliant. This port enables
you to access the iDRAC Direct features. For more information, see
the Integrated Dell Remote Access Controller User's Guide at
www.dell.com/poweredgemanuals.

4 iDRAC Direct LED N/A The iDRAC Direct LED indicator lights up to indicate that the iDRAC
indicator Direct port is actively connected to a device. For more information,
see the iDRAC Direct LED indicator codes section
5 Status indicator Provides information about the status of the system. For more
information, see the Health status indicator section.
6 Power button Indicates if the system is turned on or off. Press the power button to
manually turn on or off the system.
NOTE: Press the power button to gracefully shut down an
ACPI-compliant operating system.

7 System handle release N/A Enables you to unlock the system from the enclosure.
button

12 Chassis views and features

Inside the system

Figure 2. Inside the system

1. drive cage 2. drive backplane
3. IDSDM card 4. air shroud
5. mezzanine card (fabric C) 6. I/O connector cover
7. Network Daughter Card (NDC) 8. mezzanine card (fabric B)
9. heat sink (CPU1) 10. heat sink (CPU2)
11. memory module (16) 12. system handle

Security features
Table 5. Security features
System feature Description
TPM The Trusted Platform Module (TPM) is used to generate/store
keys, protect/authenticate passwords, and create/store digital
certificates. TPM 1.2 is supported.
Power-off security BIOS has the ability to disable the power button function.

Chassis views and features 13

 4
Processor
Processor features
The PowerEdge M640 provides 2 socket server based on Intel's technology to support the Intel Xeon Scalable family processors(including
the Second Generation). The M640 will support the core speeds ratios for the processor to support its clock frequency. The M640's Intel
Skylake processor features are as follows:
• Up to 2 socket processors
• Up to 28 cores Second Generation Intel Xeon Scalable family processors
• Intel AVX 256b floating point
• 32 KB instruction and 32 KB data L1 cache per core
• 1.0 MB Mid Level Cache (MLC) per core
• 1.375 MB non‐inclusive Last Level Cache (LLC)
• UPI up to 10.4GT/s and up to two links
• Integrated PCIe Gen3 40 lanes/socket

Supported Processors
Table 6. Supported Processors for M640
Intel SKU SKU type Stepping Speed(GHz) Cache(MB QPI Max Cores Turbo TDP (W)
) Memory
(GT/s) Speed(MT
/s)
8276M Platinum XCC 2.2 38.5 10.4 2933 28 Yes 165
8276 Platinum XCC 2.2 38.5 10.4 2933 28 Yes 165
8260M Platinum XCC 2.4 35.75 10.4 2933 24 Yes 165
8260 Platinum XCC 2.4 35.75 10.4 2933 24 Yes 165
8176 Platinum XCC 2.1 38 10.4 2667 28 Yes 165
8160M Platinum XCC 2.1 33 10.4 2667 24 Yes 150
8160 Platinum XCC 2.1 33 10.4 2667 24 Yes 150
6252 Gold XCC 2.1 35.75 10.4 2933 24 Yes 150
6248R* Gold XCC 3.0 35.75 10.4 2933 24 Yes 205
6248 Gold XCC 2.5 27.5 10.4 2933 20 Yes 150
6246R* Gold XCC 3.4 35.75 10.4 2933 16 Yes 205
6246 Gold XCC 3.3 24.75 10.4 2933 12 Yes 165
6244 Gold XCC 3.6 24.75 10.4 2933 8 Yes 150
6246R* Gold XCC 3.1 35.75 10.4 2933 20 Yes 205
6242 Gold XCC 2.8 22 10.4 2933 16 Yes 150
6240 Gold XCC 2.6 24.75 10.4 2933 18 Yes 150
6240R Gold XCC 2.4 35.75 10.4 2933 24 Yes 165
6240M Gold XCC 2.6 24.75 10.4 2933 18 Yes 150
6238 Gold XCC 2.1 30.25 10.4 2933 22 Yes 140
6238R Gold XCC 2.2 38.5 10.4 2933 28 Yes 165

14 Processor
Intel SKU SKU type Stepping Speed(GHz) Cache(MB QPI Max Cores Turbo TDP (W)
) Memory
(GT/s) Speed(MT
/s)
6238M Gold XCC 2.1 30.25 10.4 2933 22 Yes 140
6234 Gold XCC 3.3 24.75 10.4 2933 8 Yes 130
6230 Gold XCC 2.1 27.5 10.4 2933 20 Yes 125
6230R Gold XCC 2.1 35.75 10.4 2933 26 Yes 150
6230N Gold XCC 2.3 27.5 10.4 2933 20 Yes 125
6226 Gold XCC 2.7 19.25 10.4 2933 12 Yes 125
6226R Gold XCC 2.9 22 10.4 2933 16 Yes 150
6222V Gold XCC 1.8 27.5 10.4 2400 20 Yes 115
6152 Gold XCC 2.1 30 10.4 2667 22 Yes 140
6150 Gold XCC 2.7 25 10.4 2667 18 Yes 165
6148 Gold XCC 2.4 27 10.4 2667 20 Yes 150
6142 Gold XCC 2.6 22 10.4 2667 16 Yes 150
6140M Gold XCC 2.3 25 10.4 2667 18 Yes 140
6140 Gold XCC 2.3 24.75 10.4 2667 18 Yes 140
6138 Gold XCC 2.0 27 10.4 2667 20 Yes 125
6136 Gold XCC 3.0 24.75 10.4 2667 12 Yes 150
6134M Gold XCC 3.2 24.75 10.4 2667 8 Yes 130
6134 Gold XCC 3.2 24.75 10.4 2667 8 Yes 130
6132 Gold XCC 2.6 19 10.4 2667 14 Yes 140
6130 Gold XCC 2.1 22 10.4 2667 16 Yes 125
6128 Gold XCC 3.4 19.25 10.4 2667 6 Yes 115
6126 Gold XCC 2.6 19.25 10.4 2667 12 Yes 125
5222 Gold XCC 3.8 16.5 10.4 2933 4 Yes 105
5220 Gold HCC 2.2 24.75 10.4 2667 18 Yes 125
5220R Gold XCC 2.2 35.75 10.4 2666 24 Yes 150
5220S Gold XCC 2.7 24.75 10.4 2667 18 Yes 125
5218 Gold XCC 2.3 22 10.4 2667 16 Yes 125
5218R Gold XCC 2.1 27.5 10.4 2666 20 Yes 125
5218N Gold XCC 2.3 22 10.4 2667 16 Yes 110
5217 Gold HCC 3.0 11 10.4 2667 8 Yes 115
5215 Gold HCC 2.5 16.5 10.4 2667 10 Yes 85
5215M Gold HCC 2.5 13.75 10.4 2667 10 Yes 85
5122 Gold XCC 3.6 16.5 10.4 2667 4 Yes 105
5120 Gold HCC 2.2 19.25 10.4 2667 14 Yes 105
5118 Gold HCC 2.3 16.5 10.4 2667 12 Yes 105
5117 Gold HCC 2.0 19.25 10.4 2667 14 Yes 105
4216 Gold HCC 2.1 22 9.6 2400 16 Yes 100
4215 Gold HCC 2.5 11 9.6 2400 8 Yes 85
4215R Silver HCC 3.2 11 9.6 2400 8 Yes 130

Processor 15
Intel SKU SKU type Stepping Speed(GHz) Cache(MB QPI Max Cores Turbo TDP (W)
) Memory
(GT/s) Speed(MT
/s)
4214 Silver HCC 2.2 16.5 9.6 2400 12 Yes 85
4214R Silver HCC 2.4 16.5 9.6 2400 12 Yes 100
4210 Silver LCC 2.2 13.75 9.6 2400 10 Yes 85
4210R Silver LCC 2.4 13.75 9.6 2400 10 Yes 100
4208 Silver LCC 2.1 11 9.6 2400 8 Yes 85
4116 Silver HCC 2.1 16 9.6 2400 12 Yes 85
4114 Silver LCC 2.2 14 9.6 2400 10 Yes 85
4112 Silver LCC 2.6 8.25 9.6 2400 4 Yes 85
4110 Silver LCC 2.1 11 9.6 2400 8 Yes 85
4108 Silver LCC 1.8 11 9.6 2400 8 Yes 85
3206R Bronze LCC 1.9 11 9.6 2133 8 No 85
3204 Bronze LCC 1.9 8.25 9.6 2133 6 No 85
3106 Bronze LCC 1.7 11 9.6 2133 8 No 85
3104 Bronze LCC 1.7 8 9.6 2133 6 No 85

NOTE: * Available 1H 2020

Chipset
The Intel Lewisburg provides extensive I/O support. Functions and capabilities include:
• ACPI Power Management Logic Support, Revision 4.0a
• PCI Express Base Specification Revision 3.0
• Integrated Serial ATA host controller, supports data transfer rates of up to 6 Gb/s on all ports.
• xHCI USB controller with SuperSpeed USB 3.0 ports
• Direct Media Interface
• Serial Peripheral Interface
• Enhanced Serial Peripheral Interface
• Flexible I/O—Allows some high speed I/O signals to be configured as PCIe root ports, PCIe uplink for use with certain PCH
• SKUs, SATA (and sSATA), or USB 3.0.
• General Purpose Input Output (GPIO)
• Low Pin Count interface, interrupt controller, and timer functions
• System Management Bus Specification, Version 2.0
• Integrated Clock Controller / Real Time Clock Controller
• Intel High Definition Audio and Intel Smart Sound Technology (Not Used)
• Integrated 10/1 Gb Ethernet (Not Used)
• Integrated 10/100/1000 Mbps Ethernet MAC (Not Used)
• Supports Intel Rapid Storage Technology Enterprise
• Supports Intel Active Management Technology and Server Platform Services
• Supports Intel Virtualization Technology for Directed I/O
• Supports Intel Trusted Execution Technology
• JTAG Boundary Scan support
• Intel QuickAssist Technology
• Intel Trace Hub for debug

16 Processor
 5
Memory
The M640 supports up to 16 DIMMs, with up to 2 TB of memory and speeds of up to 2933MT/s. The M640 supports registered
(RDIMMs) and load reduced DIMMs (LRDIMMs) which use a buffer to reduce memory loading and provide greater density, allowing for
the maximum platform memory capacity. Unbuffered DIMMs (UDIMMs) are not supported.

Supported memory technologies

Table 7. Supported memory technologies
Feature Description
DIMM type • LRDIMM
• RDIMM

Transfer speeds • 2933 MT/s

• 2666 MT/s
• 2400 MT/s

Voltage • 1.2 V-DDR4

Table 8. Supported memory

DIMM speed DIMM type DIMM capacity- Ranks per DIMM Data width SDDC support DIMM volts
GB
2933 MT/s RDIMM 8 1 x8 Advanced ECC 1.2
2933 MT/s RDIMM 16 2 x8 Advanced ECC 1.2
2933 MT/s RDIMM 32 2 x4 All modes 1.2
2933 MT/s LRDIMM 64 4 x4 All modes 1.2

Memory speed
The M640 support memory speeds of 2933 MT/s and 2666 MT/s depending on the DIMM types installed and the configuration. All
memory on all processors and channels run at the same speed and voltage. By default, this speed will be the highest common supported
speed between the CPUs and DIMMs. The operating speed of the memory is also determined by the maximum speed supported by the
processor, the speed settings and the operating voltage of the system are in the BIOS.

Table 9. DIMM performance details

DIMM DIMM ranking Capacity DIMM rated voltage, Intel Xeon-EP
type speed
1 DPC 2 DPC
RDIMM 1R/2R 8 GB, 16 GB, 32 GB DDR4-1.2 V, 2933 or 2933 or 2666 MT/s 2933 or 2666 MT/s
2666 MT/s
LRDIMM 4R/8R 64 GB,128 GB DDR4-1.2 V, 2666 MT/s 2666 MT/s
2666MT/s

Topics:
• Memory configurations

Memory 17
Memory configurations
The M640 server support flexible memory configurations ranging from capacities of 8 GB (minimum) to 1 TB (maximum). The M640
support up to 8 DIMMs per processor and up to 16 DIMMs in a dual‐ processor configuration. Each server has 6 memory channels per
processor, with each channel supporting up to 2 DIMMs.

Memory population guidelines

M640 support a flexible memory configuration, according to the following population rules:
• Speed: If DIMMs of different speeds are mixed, all channels across all processors operate at the slowest DIMM’s common frequency.
• DIMM type: Only one type of DIMM is allowed per system: RDIMM, or LRDIMM. These types cannot be mixed.
• DIMMs with different data widths can be mixed. DIMMs with x4 and x8 data widths are supported and mixing is allowed.
• Support mixing of DIMMs with different capacities.
• Population rules require the largest capacity DIMM be placed first-slot A1 populated first, then A2, and so on. The second CPU
mirrors the first CPU population.
• Maximum of two different capacity DIMMs is allowed in a system
• Support mixing of DIMMs with different ranks.
• Maximum of two different rank DIMMs is allowed in a system

Memory RAS features

Reliability, Availability, and Serviceability (RAS) features help keep the system online and operational without significant impact to
performance, and can decrease data loss and crashing due to errors. RAS aids in rapid, accurate diagnosis of faults which require service.

Table 10. Supported RAS features

Feature Description
Dense configuration optimized profile Increased memory reliability can be a result from this selectable
platform profile that adjusts parameters to reduce faults regarding
refresh rates, speed, temperature and voltage.
Memory demand and patrol scrubbing Demand scrubbing is the ability to write corrected data back to the
memory once a correctable error is detected on a read transaction.
Patrol scrubbing proactively searches the system memory,
repairing correctable errors.
Recovery from single DRAM device failure-SDDC Recovery from Single DRAM Device Failure-SDDC provides error
checking and correction that protects against any single memory
chip failure as well as multi‐ bit errors from any portion of a single
memory chip.
Failed DIMM isolation This feature provides the ability to identify a specific failing DIMM
channel pair, thereby enabling the user to replace only the failed
DIMM pair.
Memory mirroring Memory mirroring is a method of keeping a duplicate (secondary or
mirrored) copy of the contents of memory as a redundant backup
for use if the primary intra‐socket memory fails. The mirrored copy
of the memory is stored in memory of the same processor socket.
Memory address parity protection This feature provides the ability to detect transient errors on the
address lines of the DDR channel.
Memory sparing-rank Memory sparing allocates one rank per channel as a spare. If
excessive correctable errors occur in a rank or channel, they are
moved to the spare area while the operating system is running to
prevent the errors from causing an uncorrectable failure.
Memory thermal throttling This feature helps to optimize power/performance and can also be
used to prevent DIMMs from overheating.

18 Memory
 6
Storage
The M640 for M1000e supports scalable storage that allows you to adapt your workload and operational requirements. With
comprehensive storage options, the M640 for M1000e offers various internal and external storage controllers.

Storage controllers
Table 11. PERC series offering
Performance level Controller and description
Entry Software RAID: S140-SATA and NVMe
Value • H330 (Internal hardware RAID)
• Memory: None
• supports x8 12 Gb SAS and x8 PCIe 3.0

Value performance • H730P (Internal hardware RAID)

• Memory: 2 GB, NV72-bit, 866 MHz
• supports x8 12 Gb SAS and x8 PCIe 3.0

Supported hard drives

With comprehensive storage options, the system offers the following hard drives:
• 10,000 and 15,000 rpm 2.5-inch SAS drives
• 7,200 rpm 2.5-inch Enterprise SATA drives
• 2.5-inch Solid State Drives (SSD) including PCIe NVMe drives
Topics:
• Internal persistent storage
• External storage

Internal persistent storage

The system offers two internal persistent storage:
• IDSDM module
• Boot Optimized Storage Subsystem (BOSS)

IDSDM module
The IDSDM module has a dedicated slot at the back of the system chassis. This is a Dell-proprietary PCIe x1 slot that uses a USB 3.0
interface to host. In the system, the IDSDM card size changes from SD to microSD and the supported capacity for IDSDM microSD cards
are 16 GB, 32 GB, or 64 GB. The write-protect switch is built onboard the IDSDM module.

Boot Optimized Storage Subsystem (BOSS)

BOSS is offered as a means of booting 14G servers to a full OS in the following scenarios:
• A solution such as IDSDM may be desired, but the target OS is a full OS (not just hypervisor).
• The user does not to trade off the standard hot-plug hard drive slot for OS install.

Storage 19
BOSS located at the front of the system to support up to two 80mm M.2 SATA devices.

External storage
The PowerEdge M640 supports the RD1000 externally.

20 Storage
 7
Networking and PCIe
The PowerEdge M640 provides PCIe slot capabilities with support of generation 3 expansion cards.
Topics:
• PCIe expansion
• PCIe slot

PCIe expansion
For information on card installation, requirements, and slot priorities, see the PowerEdge M640 Installation and Service Manual at
Dell.com/Support/Manuals.

PCIe slot
The list below shows the available PCIe slots:
• One x8 PCIe Gen3 for bNDC card-connected to CPU1
• Two x8 PCIe Gen3 for Mezz card-connected to CPU1
• One x8 PCIe Gen3 for MiniPERC card-connected to CPU1
• One x2 PCIe Gen3 for BOSS hardware RAID-connected to CPU2

Networking and PCIe 21

 8
Power, Thermal, and Acoustics
The lower overall system-level power draw is a result of the breakthrough system design developed by Dell EMC. The system aims to
maximize performance per watt through a combination of energy efficient technologies, optimized thermal designs and intelligent fan
control algorithms. The system fan control algorithms use an extensive array of sensors that automatically monitor power and thermal
activity to minimize fan speeds based on system cooling requirements, reducing the power required for cooling.
Topics:
• Power consumption and energy efficiency
• Power supply units
• Thermal and Acoustics

Power consumption and energy efficiency

With the rise in the cost of energy coupled with increasing data center density, Dell EMC provides tools and technologies to help you
realize greater performance with lower energy cost and wastage. More efficient data center usage can reduce costs by slowing the need
for additional data center space. The following table lists the tools and technologies that Dell EMC offers to help you achieve your data
center goals by lowering power consumption and increasing energy efficiency.

Table 12. Power tools and technologies

Feature Description
Power supply units (PSU) portfolio PSU portfolio includes intelligent features such as dynamically optimizing efficiency while
maintaining availability and redundancy. For more information, see the Power supply units
section.
Tools for right-sizing Enterprise Infrastructure Planning Tool (EIPT) is a tool that helps you plan and tune your
computer and infrastructure equipment for maximum efficiency by calculating hardware
power consumption, power infrastructure and storage. Learn more at Dell.com/calc.
Power monitoring accuracy PSU power monitoring improvements include:
• Power monitoring accuracy of 1%, whereas the industry standard is 5%
• More accurate reporting of power
• Better performance under a power cap

Power capping Use Dell EMC systems management tools such as OpenManage Power Center and iDRAC9
with an Enterprise license can be used to set a power limit for your server. This limits the
output of a PSU and reduce system power consumption and help in constrained power
situations.
Systems management The integrated Dell Remote Access Controller 9 (iDRAC9) with Lifecycle Controller is
embedded within every Dell EMC PowerEdge™ server and provides functionality that helps
IT administrators deploy, update, monitor, and maintain servers with no need for any
additional software to be installed. iDRAC functions regardless of operating system or
hypervisor presence because from a pre-OS or bare-metal state, iDRAC is ready to work
because it is embedded within each server from the factory.
Active power management Dell EMC offers a complete power management solution accessed through the iDRAC9
with Enterprise licensing and OpenManage Power Center to implement policy-based
management of power and thermal levels at the individual system, rack, or data center
level. Hot spares reduce power consumption of redundant power supplies. Thermal control
of fan speed optimizes the thermal settings for your environment to reduce fan
consumption and lower system power consumption.

22 Power, Thermal, and Acoustics

Power supply units
Energy Smart power supplies have intelligent features, such as the ability to dynamically optimize efficiency while maintaining availability
and redundancy. Also featured are enhanced power-consumption reduction technologies, such as high-efficiency power conversion and
advanced thermal-management techniques, and embedded power-management features including high-accuracy power monitoring.
The system supports two hot-swappable AC power supplies with 1 + 1 redundancy, auto-sensing and auto-switching capability.

Thermal and Acoustics

The system's thermal management delivers high performance through optimized cooling of components at the lowest fan speeds across a
wide range of ambient temperatures from 10°C to 35°C (50°F to 95°F) and to extended ambient temperature ranges. These
optimizations result in lower fan power consumption which translate to lower system power and data center power consumption.

Power consumption and energy efficiency

With the rise in the cost of energy coupled with increasing data center density, Dell EMC provides tools and technologies to help you
realize greater performance with lower energy cost and wastage. More efficient data center usage can reduce costs by slowing the need
for additional data center space. The following table lists the tools and technologies that Dell EMC offers to help you achieve your data
center goals by lowering power consumption and increasing energy efficiency.

Table 13. Power tools and technologies

Feature Description
Power supply units (PSU) portfolio PSU portfolio includes intelligent features such as dynamically optimizing efficiency while
maintaining availability and redundancy. For more information, see the Power supply units
section.
Tools for right-sizing Enterprise Infrastructure Planning Tool (EIPT) is a tool that helps you plan and tune your
computer and infrastructure equipment for maximum efficiency by calculating hardware
power consumption, power infrastructure and storage. Learn more at Dell.com/calc.
Power monitoring accuracy PSU power monitoring improvements include:
• Power monitoring accuracy of 1%, whereas the industry standard is 5%
• More accurate reporting of power
• Better performance under a power cap

Power capping Use Dell EMC systems management tools such as OpenManage Power Center and iDRAC9
with an Enterprise license can be used to set a power limit for your server. This limits the
output of a PSU and reduce system power consumption and help in constrained power
situations.
Systems management The integrated Dell Remote Access Controller 9 (iDRAC9) with Lifecycle Controller is
embedded within every Dell EMC PowerEdge™ server and provides functionality that helps
IT administrators deploy, update, monitor, and maintain servers with no need for any
additional software to be installed. iDRAC functions regardless of operating system or
hypervisor presence because from a pre-OS or bare-metal state, iDRAC is ready to work
because it is embedded within each server from the factory.
Active power management Dell EMC offers a complete power management solution accessed through the iDRAC9
with Enterprise licensing and OpenManage Power Center to implement policy-based
management of power and thermal levels at the individual system, rack, or data center
level. Hot spares reduce power consumption of redundant power supplies. Thermal control
of fan speed optimizes the thermal settings for your environment to reduce fan
consumption and lower system power consumption.

Thermal design
The thermal design of the system reflects the following:
• Optimized thermal design: The system layout is architected for optimum thermal design. System component placement and layout
are designed to provide maximum airflow coverage to critical components with minimal expense of fan power.

Power, Thermal, and Acoustics 23

• Comprehensive thermal management: The thermal control system regulates the system fan speeds based on feedback from
system component temperature sensors, as well as for system inventory and subsystem power draw. Temperature monitoring
includes components such as processors, DIMMs, chipset, system inlet air temperature and hard disk drives.
• Open and closed loop fan speed control: Open loop fan control uses system configuration to determine fan speed based on
system inlet air temperature. Closed loop thermal control uses temperature feedback to dynamically adjust fan speeds based on
system activity and cooling requirements.
• User-configurable settings: With the understanding and realization that every customer has a unique set of circumstances or
expectations from the system, in this generation of servers, we have introduced limited user-configurable settings in the iDRAC9 BIOS
setup screen. For more information, see the Dell EMC PowerEdge system Installation and Service Manual on Dell.com/Support/
Manuals and “Advanced Thermal Control: Optimizing across Environments and Power Goals” on Dell.com.
• Cooling redundancy: The system allows N+1 fan redundancy, allowing continuous operation with one fan failure in the system.

Power supply units

Energy Smart power supplies have intelligent features, such as the ability to dynamically optimize efficiency while maintaining availability
and redundancy. Also featured are enhanced power-consumption reduction technologies, such as high-efficiency power conversion and
advanced thermal-management techniques, and embedded power-management features including high-accuracy power monitoring.
The system supports two hot-swappable AC power supplies with 1 + 1 redundancy, auto-sensing and auto-switching capability.

Acoustical design
Dell EMC focuses on sound quality in addition to sound power level and sound pressure level. Sound quality describes how disturbing or
pleasing a sound is interpreted, and Dell EMC references a number of psychacoustical metrics and thresholds in delivering to it. Tone
prominence is one such metric. Sound power and sound pressure levels increase with greater populations or higher utilization, while sound
quality remains good even as the frequency content changes. A reference for comparison to sound pressure levels for familiar noise
sources is given in the following table. An extensive description of Dell EMC Enterprise acoustical design and metrics is available in the Dell
Enterprise Acoustics white paper.

Table 14. Acoustical reference points and output comparisons

Equivalent familiar noise experience

LpA, dBA, re 20 µPa Loudness, sones
90 80 Loud concert
75 39 Data center, vacuum cleaner, voice must be elevated
to be heard
60 10 Conversation levels
45 4 Whispering, open office layout, normal living room
35 2 Quiet office
30 1 Quiet library
20 0 Recording studio

24 Power, Thermal, and Acoustics

 9
Dell EMC OpenManage systems management

Figure 3. Dell EMC OpenManage Portfolio

Dell EMC delivers management solutions that help IT Administrators effectively deploy, update, monitor, and manage IT assets.
OpenManage solutions and tools enable you to quickly respond to problems by helping them to manage Dell EMC servers effectively and
efficiently; in physical, virtual, local, and remote environments, operating in-band, and out-of-band (agent-free). The OpenManage
portfolio includes innovative embedded management tools such as the integrated Dell Remote Access Controller (iDRAC), Chassis
Management Controller and Consoles like OpenManage Enterprise, OpenManage Power Manager plug in, and tools like Repository
Manager.
Dell EMC has developed comprehensive systems management solutions based on open standards and has integrated with management
consoles that can perform advanced management of Dell hardware. Dell EMC has connected or integrated the advanced management
capabilities of Dell hardware into offerings from the industry's top systems management vendors and frameworks such as Ansible, thus
making Dell EMC platforms easy to deploy, update, monitor, and manage.
The key tools for managing Dell EMC PowerEdge servers are iDRAC and the one-to-many OpenManage Enterprise console. OpenManage
Enterprise helps the system administrators in complete lifecycle management of multiple generations of PowerEdge servers. Other tools
such as Repository Manager, which enables simple yet comprehensive change management.
OpenManage tools integrate with systems management framework from other vendors such as VMware, Microsoft, Ansible, and
ServiceNow. This enables you to use the skills of the IT staff to efficiently manage Dell EMC PowerEdge servers.
Topics:
• Server and Chassis Managers
• Dell EMC consoles
• Automation Enablers
• Integration with third-party consoles
• Connections for third-party consoles
• Dell EMC Update Utilities
• Dell resources

Dell EMC OpenManage systems management 25

Server and Chassis Managers
• Integrated Dell Remote Access Controller (iDRAC)
• Chassis Management Controller (CMC)
• iDRAC Service Module (iSM)

Dell EMC consoles

• Dell EMC OpenManage Enterprise
• Dell EMC Repository Manager (DRM)
• Dell EMC OpenManage Enterprise Power Manager plugin to OpenManage Enterprise
• Dell EMC OpenManage Mobile (OMM)

Automation Enablers
• OpenManage Ansible Modules
• iDRAC RESTful APIs (Redfish)
• Standards-based APIs (Python, PowerShell)
• RACADM Command Line Interface (CLI)
• GitHub Scripting Libraries

Integration with third-party consoles

• Dell EMC OpenManage Integrations with Microsoft System Center
• Dell EMC OpenManage Integration for VMware vCenter (OMIVV)
• Dell EMC OpenManage Ansible Modules
• Dell EMC OpenManage Integration with ServiceNow

Connections for third-party consoles

• Micro Focus and other HPE tools
• OpenManage Connection for IBM Tivoli
• OpenManage Plug-in for Nagios Core and XI

Dell EMC Update Utilities

• Dell System Update (DSU)
• Dell EMC Repository Manager (DRM)
• Dell EMC Update Packages (DUP)
• Dell EMC Server Update Utility (SUU)
• Dell EMC Platform Specific Bootable ISO (PSBI)

Dell resources
For additional information about white papers, videos, blogs, forums, technical material, tools, usage examples, and other information, go
to the OpenManage page at www.dell.com/openmanagemanuals or the following product pages:

Table 15. Dell resources

Resource Location
Integrated Dell Remote Access Controller (iDRAC) www.dell.com/idracmanuals
iDRAC Service Module (iSM) www.dell.com/support/article/sln310557
OpenManage Ansible Modules www.dell.com/support/article/sln310720

26 Dell EMC OpenManage systems management

Resource Location
OpenManage Essentials (OME) www.dell.com/support/article/sln310714
OpenManage Mobile (OMM) www.dell.com/support/article/sln310980
OpenManage Integration for VMware vCenter (OMIVV) www.dell.com/support/article/sln311238
OpenManage Integration for Microsoft System Center www.dell.com/support/article/sln312177
(OMIMSSC)
Dell EMC Repository Manager (DRM) www.dell.com/support/article/sln312652
Dell EMC System Update (DSU) www.dell.com/support/article/sln310654
Dell EMC Platform Specific Bootable ISO (PSBI) Dell.com/support/article/sln296511
Dell EMC Chassis Management Controller (CMC) www.dell.com/support/article/sln311283
OpenManage Connections for Partner Consoles www.dell.com/support/article/sln312320
OpenManage Enterprise Power Manager
OpenManage Integration with ServiceNow (OMISNOW) Dell.com/support/article/sln317784

NOTE: Features may vary by server. Please refer to the product page on www.dell.com/manuals for details.

Dell EMC OpenManage systems management 27

 10
Appendix A. Additional specifications
Power supply
The list below shows the supported power supply units for the M640 for M1000e:
• 2700 W
• 3000 W

Chassis dimension
The following are the enclosure dimensions for the M640:
• Depth: 544.32 mm x Width: 50.35 mm x Height: 197.9 mm - handle push in.
• Depth: 564.87 mm x Width: 50.35 mm x Height: 197.9 mm - handle pull out.

Environmental specifications
NOTE: For additional information about environmental measurements for specific system configurations, see Dell.com/
environmental_datasheets.

Table 16. Temperature specifications

Temperature Specifications
Storage –40°C to 65°C (–40°F to 149°F)
Continuous operation (for altitude less than 950 m or 3117 10°C to 35°C (50°F to 95°F) with no direct sunlight on the equipment.
ft)
Maximum temperature gradient (operating and storage) 20°C/h (68°F/h)

Table 17. Relative humidity specifications

Relative humidity Specifications
Storage 5% to 95% RH with 33°C (91°F) maximum dew point. Atmosphere must be
non-condensing at all times.
Operating 10% to 80% relative humidity with 26°C (78.8°F) maximum dew point.

Table 18. Maximum vibration specifications

Maximum vibration Specifications
Operating 0.26 Grms at 5 Hz to 350 Hz (all operation orientations).
Storage 1.87 Grms at 10 Hz to 500 Hz for 15 min (all six sides tested).

Table 19. Maximum shock specifications

Maximum shock Specifications
Operating Six consecutively executed shock pulses in the positive and negative x, y,
and z axes of 6 G for up to 11 ms.
Storage Six consecutively executed shock pulses in the positive and negative x, y,
and z axes (one pulse on each side of the system) of 71 G for up to 2 ms.

28 Appendix A. Additional specifications

Table 20. Maximum altitude specifications
Maximum altitude Specifications
Operating 3048 m (10,000 ft)

Storage 12,000 m (39,370 ft)

Table 21. Operating temperature de-rating specifications

Operating temperature de-rating Specifications
Up to 35°C (95°F) Maximum temperature is reduced by 1°C/300 m (1°F/547 ft) above 950 m
(3,117 ft).
35°C to 40°C (95°F to 104°F) Maximum temperature is reduced by 1°C/175 m (1°F/319 ft) above 950 m
(3,117 ft).
40°C to 45°C (104°F to 113°F) Maximum temperature is reduced by 1°C/125 m (1°F/228 ft) above 950 m
(3,117 ft).

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If
the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you may need to
rectify the environmental conditions. Re-mediation of environmental conditions is the responsibility of the customer.

Table 22. Particulate contamination specifications

Particulate contamination Specifications
Air filtration Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a
95% upper confidence limit.
NOTE: This condition applies to data center environments only.
Air filtration requirements do not apply to IT equipment designed
to be used outside a data center, in environments such as an
office or factory floor.
NOTE: Air entering the data center must have MERV11 or
MERV13 filtration.

Conductive dust Air must be free of conductive dust, zinc whiskers, or other conductive
particles.
NOTE: This condition applies to data center and non-data center
environments.

Corrosive dust • Air must be free of corrosive dust.

• Residual dust present in the air must have a deliquescent point less than
60% relative humidity.
NOTE: This condition applies to data center and non-data center
environments.

Table 23. Gaseous contamination specifications

Gaseous contamination Specifications
Copper coupon corrosion rate <300 Å/month per Class G1 as defined by ANSI/ISA71.04-1985.
Silver coupon corrosion rate <200 Å/month as defined by AHSRAE TC9.9.

NOTE: Maximum corrosive contaminant levels measured at ≤50% relative humidity.

Appendix A. Additional specifications 29

Standard operating temperature
Table 24. Standard operating temperature specifications
Standard operating temperature Specifications
Continuous operation (for altitude less than 950 m or 3117 10°C to 35°C (50°F to 95°F) with no direct sunlight on the equipment.
ft)
Humidity percentage range 10% to 80% Relative Humidity with 26°C (78.8°F) maximum dew point.

Expanded operating temperature

Table 25. Expanded operating temperature specifications
Expanded operating temperature Specifications
Continuous operation 5°C to 40°C at 5% to 85% RH with 29°C dew point.
NOTE: Outside the standard operating temperature (10°C to
35°C), the system can operate continuously in temperatures as
low as 5°C and as high as 40°C.
For temperatures between 35°C and 40°C, de-rate maximum allowable dry
bulb temperature by 1°C per 175 m above 950 m (1°F per 319 ft).

Less than or equal to 1% of annual operating hours –5°C to 45°C at 5% to 90% RH with 29°C dew point.
NOTE: Outside the standard operating temperature (10°C to
35°C), the system can operate down to –5°C or up to 45°C for a
maximum of 1% of its annual operating hours.
For temperatures between 40°C and 45°C, de-rate maximum allowable
temperature by 1°C per 125 m above 950 m (1°F per 228 ft).

NOTE: When operating in the expanded temperature range, system performance may be impacted.

NOTE: When operating in the expanded temperature range, ambient temperature warnings maybe reported on the LCD
panel and in the System Event Log.

USB peripherals
The M640 supports the following USB 2.0 and USB 3.0 devices:
• DVD-ROM
• USB key
• External USB tape library RD1000
• Keyboard
• Mouse
• Floppy drive

30 Appendix A. Additional specifications

 11
Appendix B. Standards compliance
The system conforms to the following industry standards.

Table 26. Industry standard documents

Standard URL for information and specifications

ACPI Advance Configuration and Power Interface Specification, acpi.info
v2.0c
Ethernet IEEE 802.3-2005 standards.ieee.org/getieee802/802.3.html
HDG Hardware Design Guide Version 3.0 for Microsoft Windows microsoft.com/whdc/system/platform/pcdesign/desguide/
Server serverdg.mspx
IPMI Intelligent Platform Management Interface, v2.0 intel.com/design/servers/ipmi
DDR4 Memory DDR4 SDRAM Specification jedec.org/standards-documents/docs/jesd79-4.pdf
PCI Express PCI Express Base Specification Rev. 2.0 and 3.0 pcisig.com/specifications/pciexpress
PMBus Power System Management Protocol Specification, v1.2 pmbus.info/specs.html
SAS Serial Attached SCSI, v1.1 t10.org
SATA Serial ATA Rev. 2.6; SATA II, SATA 1.0a Extensions, Rev. 1.2 sata-io.org
SMBIOS System Management BIOS Reference Specification, v2.7 dmtf.org/standards/smbios
TPM Trusted Platform Module Specification, v1.2 and v2.0 trustedcomputinggroup.org
UEFI Unified Extensible Firmware Interface Specification, v2.1 uefi.org/specifications
USB Universal Serial Bus Specification, Rev. 2.0 usb.org/developers/docs

Appendix B. Standards compliance 31

 12
Appendix C Additional resources
Table 27. Additional resources
Resource Description of contents Location
Installation and Service Manual This manual, available in PDF format, provides the following Dell.com/Support/Manuals
information:
• Chassis features
• System Setup program
• System messages
• System codes and indicators
• System BIOS
• Remove and replace procedures
• Troubleshooting
• Diagnostics
• Jumpers and connectors

Getting Started Guide This guide ships with the system, and is also available in PDF Dell.com/Support/Manuals
format. This guide provides the following information:
• Initial setup steps
• Key system features
• Technical specifications

Rack Installation Instructions This document ships with the rack kits, and provides instructions Dell.com/Support/Manuals
for installing a server in a rack.
Information Update This document ships with the system, is also available in PDF Dell.com/Support/Manuals
format online, and provides information on system updates.
System Information Label The system information label documents the system board layout Inside the system chassis cover
and system jumper settings. Text is minimized due to space
limitations and translation considerations. The label size is
standardized across platforms.
Quick Resource Locator (QRL) This code on the chassis can be scanned by a phone application Inside the system chassis cover
to access additional information and resources for the server,
including videos, reference materials, service tag information, and
Dell EMC contact information.
Energy Smart Solution Advisor The Dell EMC online ESSA enables easier and more meaningful Dell.com/calc
(ESSA) estimates to help you determine the most efficient configuration
possible. Use ESSA to calculate the power consumption of your
hardware, power infrastructure, and storage.

32 Appendix C Additional resources

 13
Appendix D. Support and deployment services
ProDeploy Enterprise Suite and Residency
Services
ProDeploy Enterprise Suite gets your server out of the box and into optimized production - fast. Our elite deployment engineers with
broad and deep experience utilizing best-in-class processes along with our established global scale can help you around the clock and
around the globe. From simple to the most complex server installations and software integration, we take the guess work and risk out of
deploying your new server technology. Who's better suited to implement the latest Dell EMC servers than the Dell EMC elite deployment
engineers who do it every day?

Figure 4. ProDeploy Enterprise Suite capabilities

NOTE: Hardware installation not applicable on selected software products.

ProDeploy Plus
From beginning to end, ProDeploy Plus provides the skill and scale needed to successfully execute demanding deployments in today's
complex IT environments. Certified Dell EMC experts start with extensive environmental assessments and detailed migration planning and
recommendations. Software installation includes set up of most versions of Dell EMC SupportAssist and OpenManage system
management utilities. Post-deployment configuration assistance, testing, and product orientation help you rest easy knowing your systems
have been deployed and integrated by the best.

ProDeploy
ProDeploy provides full service installation and configuration of both server hardware and system software by certified deployment
engineers including set up of most versions of Dell EMC SupportAssist and OpenManage system management utilities. To prepare for the
deployment, we conduct a site readiness review and implementation planning. System testing, validation and full project documentation
with knowledge transfer complete the process. We focus on getting you up and running so you can focus on your business and prepare
for whatever comes next.

Basic Deployment
Basic Deployment delivers worry-free professional installation of your servers by experienced technicians who know Dell EMC servers
inside and out.

Appendix D. Support and deployment services 33

Residency Services
Residency helps customers transition to new capabilities quickly through on-site or remote Dell EMC experts whose priorities and time you
control. Residency experts can provide post implementation management and knowledge transfer related to a new technology acquisition
or day-to-day operational management of the IT infrastructure.

Deployment services
Deployment services details and exceptions can be found in service description documents at the Enterprise Configuration and
Deployment pageon Dell.com.

Remote Consulting Services

When you are in the final stages of your PowerEdge server implementation, you can rely on Dell Remote Consulting and our certified
technical experts to help you optimize your configuration with best practices for your software, virtualization, server, storage, networking,
and systems management.

Data Migration Service

Protect your business and data with our single point of contact to manage your data migration project. Your project manager will work
with our experienced team of experts to create a plan using industry-leading tools and proven processes based on global best practices to
migrate your existing files and data, so your business gets up and running quickly and smoothly.

ProSupport Enterprise Suite

With Dell EMC ProSupport Services, we can help you keep your operation running smoothly, so you can focus on running your business.
We will help you maintain peak performance and availability of your most essential workloads. Dell EMC ProSupport is a suite of support
services that enable you to build the solution that is right for your organization. Choose support models based on how you use technology
and where you want to allocate resources. From the desktop to the data center, address everyday IT challenges, such as unplanned
downtime, mission-critical needs, data and asset protection, support planning, resource allocation, software application management and
more. Optimize your IT resources by choosing the right support model.

Figure 5. ProSupport Enterprise Suite

34 Appendix D. Support and deployment services

ProSupport Plus
When you purchase your PowerEdge server, we recommend ProSupport Plus, our proactive and preventative support for your business-
critical systems. ProSupport Plus provides you with all the benefits of ProSupport, plus the following:
• A designated Technology Service Manager who knows your business and your environment
• Access to senior ProSupport engineers for faster issue resolution
• Personalized, preventive recommendations based on analysis of support trends and best practices from across the Dell EMC customer
base to reduce support issues and improve performance
• Predictive analysis for issue prevention and optimization enabled by SupportAssist
• Proactive monitoring, issue detection, notification and automated case creation for accelerated issue resolution enabled by
SupportAssist
• On-demand reporting and analytics-based recommendations enabled by SupportAssist and TechDirect

ProSupport
Our ProSupport service offers highly trained experts around the clock and around the globe to address your IT needs. We will help you
minimize disruptions and maximize availability of your PowerEdge server workloads with:
• 24x7x365 access to certified hardware and software experts
• Collaborative 3rd party support
• Hypervisor and OS support
• Consistent level of support available for Dell EMC hardware, software and solutions
• Onsite parts and labor response options including next business day or four-hour mission critical

ProSupport One for Data Center

ProSupport One for Data Center offers flexible site-wide support for large and distributed data centers with more than 1,000 assets. This
offering is built on standard ProSupport components that leverage our global scale but are tailored to your company's needs. While not for
everyone, it offers a truly unique solution for Dell EMC's largest customers with the most complex environments.
• Team of designated Technology Services Managers with remote, on-site options
• Designated ProSupport One technical and field engineers who are trained on your environment and configurations
• On-demand reporting and analytics-based recommendations enabled by SupportAssist and TechDirect
• Flexible on-site support and parts options that fit your operational model
• A tailored support plan and training for your operations staff

Figure 6. ProSupport One for Data Center model

Appendix D. Support and deployment services 35

Support Technologies
Powering your support experience with predictive, data-driven technologies.

SupportAssist
The best time to solve a problem is before it happens. The automated proactive and predictive technology SupportAssist* helps reduce
your steps and time to resolution, often detecting issues before they become a crisis. Benefits include:
• Value - SupportAssist is available to all customer at no additional charge.
• Improve productivity - replace manual, high-effort routines with automated support.
• Accelerate time to resolution - receive issue alerts, automatic case creation and proactive contact from Dell EMC experts.
• Gain insight and control - optimize enterprise devices with on-demand ProSupport Plus reporting in TechDirect and get predictive
issue detection before the problem starts.
SupportAssist is included with all support plans but features vary based on service level agreement.

Figure 7. SupportAssist model

Get started at Dell.com/SupportAssist

TechDirect
Boost your IT teams productivity when supporting Dell EMC systems. With over 1.4 million self-dispatches processed each year,
TechDirect has proven its effectiveness as a support tool. You can:
• Self-dispatch replacement parts
• Request technical support
• Integrate APIs into your help desk
Or, access all your Dell EMC certification and authorization needs. Train your staff on Dell EMC products as TechDirect allows you to:
• Download study guides
• Schedule certification and authorization exams
• View transcripts of completed courses and exams
Register at techdirect.dell.com

Additional professional services

Dell Education Services
Dell Education Services offers the PowerEdge server training courses designed to help you achieve more with your hardware investment.
The curriculum is designed in conjunction with the server development team, as well as Dell EMC’s technical support team, to ensure that
the training delivers the information and practical, hands-on skills you and your team need to confidently manage and maintain your Dell
EMC server solution. To learn more or register for a class today, visit LearnDell.com/Server.

36 Appendix D. Support and deployment services

Dell EMC Global Infrastructure Consulting
Services
Dell EMC Global Infrastructure Consulting Services use skilled solution architects, innovative tools, automated analysis and Dell EMC’s
intellectual property to give you rapid insight into the root causes of unnecessary complexity. We seek better answers than traditional
service models, and our strategy is to help you quickly identify high-impact, short-duration projects that deliver return on investment (ROI)
and free up resources. The results are practical, action-oriented plans with specific, predictable, measurable outcomes. From data center
optimization to server virtualization to systems management, our consulting services can help you build a more efficient enterprise.

Dell EMC Managed Services

Dell EMC Managed Services are a modular set of lifecycle services designed to help you automate and centrally configure, deploy, and
manage your day-to-day data center operations. These services extend your existing on-premise IT infrastructure with off-premise cloud
services designed to better address challenges with mobility, highly distributed organizations, security, compliance, business continuity,
and disaster preparedness.

Appendix D. Support and deployment services 37