SMD Kit
SMD Kit
SMD Kit
Scope: This specification for approval relates to Ultra - High Power Thick Film Chip Resistors
Ratings:
Nominal Resistance
Effective figures of nominal resistance shall be in accordance :
E-24 values – these are preferred and will have standard MOQ
E-96 values – are available on case by case basis and availability and MOQ need to be confirmed with factory first
Voltage rating:
Resistors shall have a rated direct-current (DC) continuous working voltage or an approximate sine-wave root-mean-square
(RMS) alternating-current (AC) continuous working voltage at commercialline frequency and waveform corresponding to the
power rating , as determined from the following formula :
RCWV = √P x R
Note : Max. Working Voltage or √P x R whichever is lesser
Max. Overload Voltage or 2.5 √P x R whichever is lesser
Where : RCWV = Rated DC or RMS AC continuous working voltage at commercial-line frequency and waveform (volt)
P = Power Rating (watt)
R = Nominal Resistance (ohm)
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Construction
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Dimension
Dimensions : Millimetres
Dimension (mm)
Type
L W H ℓ1 ℓ2
MPP10 (2010) 5.00 ± 0.10 2.50 ± 0.15 0.60 ± 0.25 0.50 ± 0.20
MPP12 (2512) 6.35 ± 0.10 3.20 ± 0.15 0.60 ± 0.25 1.80 ± 0.20
MPP17 (2817) 7.10 ± 0.20 4.20 ± 0.20 1.10 ± 0.10 0.60 ± 0.20 1.80 ± 0.20
MPP20 (4320) 11.00 ± 0.30 5.00 ± 0.25 0.80 ± 0.20 2.40 ± 0.20
MPP27 (4527) 11.60 ± 0.30 6.85 ± 0.25 1.00 ± 0.20 2.50 ± 0.20
Power Rating
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Performance specification
Test Methods
Characteristics Limits
(AEC - Q200)
Resistance change rate is 125°C, at 35% of operating power, 1000H(1.5 hours “ON”, 0.5
Operational Life ±1%: ±(1.0%+0.1Ω)max hour “OFF”)
±5%: ±(3.0%+0.1Ω)Max. (MIL-STD-202 Method 108)
4.8 Natural resistance change per temp.
degree centigrade.
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Test Methods
Characteristics Limits
(AEC - Q200)
Resistance change rate is 10% rated power, 85°C/85%RH, 1000H,Measurement at 24
Biased Humidity 1%: ± (1.0%+0.1Ω) Max. hours after test conclusion.
5%: ± (3.0%+0.1Ω) Max. (MIL-STD-202 Method 103)
Wave Form: Tolerance for half sine shock pulse. Peak value
Resistance change rate is
Mechanical Shock is 100g’s. Normal duration (D) is 6.
±(1.0%+0.1Ω)max
(MIL-STD-202 Method 213)
5g’s for 20 min., 12cycle each of 3 orientations.
Note: Use 8”*5”PCB. 031” thick 7 secure points (onone) long
Resistance change rate is
Vibration side and 2 secure points at corners of opposite sides. Parts
±(1.0%+0.1Ω)max
mounted within 2’ from any secure point. Test from
10-2000Hz. (MIL-STD-202 Method 204)
-55°C/+155°C,Note: Number of cycles required -300,
Resistance change rate is
Thermal Shock Maximum transfer time -20 seconds, Dwell time -15 minutes.
±(1.0%+0.1Ω)max
Air-Air. (MIL-STD-202 Method 107)
With the electrometer in direct contact with the discharge
tip, verify the voltage setting at levels of ±500V,±1KV, ±2KV,
Resistance change rate is
ESD ±4KV, ±8KV, The electrometer reading shall be within ±10%
±(10%+0.1Ω)max
for voltages from 500V to 800V.
(AEC-Q200-002)
For both leaded & SMD. Electrical test not required.
Magnification 50X. Conditions:
a) Method B 4hrs at 155°C dry heat, the dip in bath with
Solderability 95% coverage Min. 245°C,5s.
b) Method B: at 215°C,5s.
c) Method D: at 260°C, 60s.
( J-STD-002)
No ignition of the tissue paper
Flammability or scorching or the pinewood V-0 or V-1 are acceptable. Electrical test not required. (UL-94)
board
Resistance change rate is 2mm (Min)
Board Flex
±(1%+0.05Ω)max (JIS-C-6429)
Temperature sensing at 500°C, Voltage power subjected to
32V DC current clamped up to 500A DC and decreased in
Flame Retardance No flame
1.0V DC/hour.
(AEC-Q200-001)
Condition B No per-heat of samples. Note: Single Wave
Resistance to Soldering Resistance change rate is Solder-Procedure 2 for SMD and Procedure 1 for Leaded with
Heat ±(1%+0.05Ω)max. solder within 1.5mm of device body.
(MIL-STD-202 Method 210)
* Sulfuration test: H2S 3~5PPM 50°C±2°C 91%~93%RH 1000H
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Packing specification
Tapping Dimension
ØD +0.1
Type A ±0.1 B ±0.1 C ±0.15 E ±0.1 F ±0.15 G ±0.1 W ±0.30 ØD1±0.1 T ± 0.1
-0
MPP10
2.65 5.25 5.5 12 1
(2010)
MPP12
3.5 6.7 5.5 12 1.5
(2512)
MPP17
4.5 7.4 2 1.5 1.75 7.5 4 16 - 1.35
(2817)
MPP17
5.4 11.5 11.5 24 -
(2817)
MPP27
7.2 11.9 11.5 24 -
(4527)
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Important Notice : This data sheet and its contents (the “Information”) belong to the members of the AVNET group of companies (the “Group”) or are licensed to it. No licence is granted for
the use of it other than for information purposes in connection with the products to which it relates. No licence of any intellectual property rights is granted. The Information is subject to change
without notice and replaces all data sheets previously supplied. The Information supplied is believed to be accurate but the Group assumes no responsibility for its accuracy or completeness,
any error in or omission from it or for any use made of it. Users of this data sheet should check for themselves the Information and the suitability of the products for their purpose and not make
any assumptions based on information included or omitted. Liability for loss or damage resulting from any reliance on the Information or use of it (including liability resulting from negligence or
where the Group was aware of the possibility of such loss or damage arising) is excluded. This will not operate to limit or restrict the Group’s liability for death or personal injury resulting from its
negligence. Multicomp Pro is the registered trademark of Premier Farnell Limited 2019.
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