Film Capacitors: EMI Suppression Capacitors (MKP)
Film Capacitors: EMI Suppression Capacitors (MKP)
© TDK Electronics AG 2020. Reproduction, publication and dissemination of this publication, enclosures hereto
and the information contained therein without TDK Electronics' prior express consent is prohibited.
EMI suppression capacitors (MKP) B32021 ... B32026
Y2 / 300 V AC
Climatic
Max. operating temperature: 110 °C
Climatic category (IEC 60068-1:2013):
40/110/56
Construction
Dielectric: polypropylene (MKP)
Plastic case (UL 94 V-0)
Epoxy resin sealing (UL 94 V-0) Dimensions in mm
Features
Very small dimensions Lead spacing Lead Type
Good self-healing properties ±0.4 diameter
High voltage capability d1 ±0.05
RoHS-compatible 10 0.6 B32021
Halogen-free capacitors available on
15 ... 27.5 0.8 B32022 ... B32024
request
37.5 1.0 B32026
Terminals
Parallel wire leads, lead-free tinned
Special lead lengths available on request
Marking
Manufacturer's logo, lot number,
date code, rated capacitance (coded),
capacitance tolerance (code letter),
rated AC voltage (IEC),
series number, sub-class (Y2),
dielectric code (MKP), climatic category,
passive flammability category, approvals.
Delivery mode
Bulk (untaped)
Taped (Ammo pack or reel)
For taping details, refer to chapter
"Taping and packing"
Approvals
Technical data
"dV/dt" represents the maximum permissible voltage change per unit of time for non-sinusoidal
voltages, expressed in V/μs.
"k0" represents the maximum permissible pulse characteristic of the waveform applied to the
capacitor, expressed in V2/μs.
Note:
The values of dV/dt and k0 provided below must not be exceeded in order to avoid damaging the
capacitor.
Mounting guidelines
1 Soldering
Before a solderability test is carried out, terminals are subjected to accelerated ageing (to
IEC 60068-2-2:2007, test Ba: 4 h exposure to dry heat at 155 °C). Since the ageing temperature
is far higher than the upper category temperature of the capacitors, the terminal wires should be
cut off from the capacitor before the ageing procedure to prevent the solderability being impaired
by the products of any capacitor decomposition that might occur.
Solder bath temperature 235 ±5 °C
Soldering time 2.0 ±0.5 s
Immersion depth 2.0 +0/0.5 mm from capacitor body or seating plane
Evaluation criteria:
Wetting of wire surface by new solder ≥90%,
Visual inspection
free-flowing solder
The overheating associated with some of these factors can usually be reduced by suitable coun-
termeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced
cooling process may possibly have to be included.
Recommendations
As a reference, the recommended wave soldering profile for our film capacitors is as follows:
Application note
A Y capacitor to be connected between AC lines and the Frame Ground (FG) has an effect of
emitting common mode current to the FG.Leak current corresponding in frequency and voltage to
the AC power supply flows in the Y capacitor.
As the capacity of a Y capacitor grows, leak current also increases. This can cause electric shock.
Therefore, UL and other safety standards restrict the capacity so that the amount of leak current
does not exceed a certain level. Usually, two Y capacitors are used, as shown in Figure below. As
AC lines are connected with capacitors, they are effective in reducing differential mode noises. In
particular, they are effective for high frequency ranges of 8 to 10 MHz.
The table below summarizes the safety instructions that must always be observed. A detailed
description can be found in the relevant sections of the chapters "General technical information"
and "Mounting guidelines".
&RUUHODWLRQRIGDWDVKHHWYDOXHVDQGPRGHOOLQJWRRORXWSXWV
'DWDVKHHWYDOXHVDQGUHVXOWVRIGHVLJQWRROVPD\GHYLDWHDVWKH\KDYHQRWEHHQGHULYHGLQWKH
VDPHFRQWH[W
:KLOH GDWD VKHHWV VKRZ LQGLYLGXDO SDUDPHWHU VWDWHPHQWV ZLWKRXW FRQVLGHULQJ D SRVVLEOH GHSHQ
GHQF\WRRWKHUSDUDPHWHUV7RROVPRGHODFRPSOHWHJLYHQVFHQDULRDVLQSXWDQGSURFHVVHGLQVLGH
WKHWRRO
)XUWKHUPRUHDVZHFRQVWDQWO\VWULYHWRLPSURYHRXUPRGHOVWKHUHVXOWVRIWRROVFDQFKDQJHRYHU
WLPHDQGEHDQRQELQGLQJLQGLFDWLRQRQO\
Page 22 of 23
Important notes
7. Our manufacturing sites serving the automotive business apply the IATF 16949 stan-
dard. The IATF certifications confirm our compliance with requirements regarding the quality
management system in the automotive industry. Referring to customer requirements and cus-
tomer specific requirements (“CSR”) TDK always has and will continue to have the policy of
respecting individual agreements. Even if IATF 16949 may appear to support the acceptance
of unilateral requirements, we hereby like to emphasize that only requirements mutually
agreed upon can and will be implemented in our Quality Management System. For clari-
fication purposes we like to point out that obligations from IATF 16949 shall only become
legally binding if individually agreed upon.
8. The trade names EPCOS, CarXield, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas,
CSMP, CTVS, DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue,
MiniCell, MKD, MKK, ModCap, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap,
PowerHap, PQSine, PQvar, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID,
SineFormer, SIOV, ThermoFuse, WindCap, XieldCap are trademarks registered or pend-
ing in Europe and in other countries. Further information will be found on the Internet at
www.tdk-electronics.tdk.com/trademarks.
Release 2020-06
Page 23 of 23