Assignment -1

Q.1 Definition of scatter matrix.

Q.2 Properties of scatter matrix.
Q.3 Classification of microwave tube.
Q.4 Limitation of conventional tube at microwave frequency.
Q.5 Draw and explain intra electrode capacitor.
Q.6 Draw and explain gain bandwidth limitation.
Q.7 Draw and explain transient time effect.
Q.8 Explain skin effect.
Q.9 Explain explain gain bandwidth.
Q.10 Explain the conventional tube at microwave frequency.
 Assignment -2
Q.1 Write characteristic on 2 cavity klystron amplifier and it Application.

Q.2 Draw and explain working of cavity klystron

Q.3 Explain the type of magnetrons

Q.4 Expression for power and efficiency of reflex klystron

Q.5 Draw and explain working of travelling wave tube

Q.6 Draw and explain working of magnetron

Q.7 Draw apple gate diagram of reflex klystron and also explain
there cycles
Q.7 Explain the working of reflex klystron with proper diagram

Q.8 Draw and explain working of multi cavity klystron amplifier

Q.9 Difference Between reflex klystron and travelling wave tube.

Q.10 Application and Advantage of reflex klystron and travelling wave tube.
 Assignment- 3
Q.1 Draw the explain Gyrator
Q.2 Draw the explain Isolator
Q.4 Draw the explain Direction coupler
Q.3 Draw the explain Circulator
Q.5 Define
1. Coupling factor
2. Directivity
3. Isolation
4. Return losses
Q.6 Explain Ferrite device
Q.7 Waveguide H Plan-T
Q.8 Waveguide E plan- T
Q.9 Define scatter matrix with two port network
Q.10 Explain waveguide tees
 Assignment-4
Q.1 Explain working of gun diode
Q.2 Explain working of pin diode
Q.3 Explain working of IMPATT diode
Q.4 Explain working of TRAPATT diode
Q.5 Define solid state microwave device and give the application and advantage.
Q.6 Draw and explain Gunn oscillator mode
Q.7 Write down the performance advantage and application IMPATT diode
Q.8 Write down the performance advantage and application of TRAPATT
Q.9 Application of pin diode.
Q.10 Difference Between TRAPATT and IMPATT diode.

Assignment-5
Q1 Explain Different Types of Losses in Micro Strip Lines.
Q.2 Explain Strip line and micro strip line devices.
Q.3 Explain Planar Transmission Structures.
Q.4 Explain Strip Line Configuration.
Q.5 Explain Micro strip line Configuration.
Q.6 Design of A Micro strip line Structure.
Q.7 Explain Losses in Micro strip line Structure
Q.8 Limitation of Micros trip line Structure
 Assignment-5
Q1 Explain Different Types of Losses in Micro Strip Lines.

The Different Types of Losses in Micro Strip Lines

Circuit designers classify power loss in micro strip lines into conductor loss, dielectric loss,
and radiation loss. These losses are dependent on:

 The loss tangent or dissipation factor of the dielectric material.

 The surface roughness of the conductor.

 The frequency of the signal through the micro strip line.

 The dielectric constant of the substrate.

 The height of the substrate.

Conductor Losses

The conductivity of the metal, the skin effect, and surface roughness affect conductor
losses in micro strip lines. Micro strip lines will experience more ohmic loss with reduced
conductivity. The skin effect is a phenomenon that increases the effective resistance of the
micro strip line and boosts ohmic losses. As the surface roughness goes from low to high, the
conductor losses also increase. So, the skin effect is higher in rougher conductor strips.

Dielectric Losses

The dielectric substrate loss tangent drives microstrip line dielectric losses. The substrates
with a high loss tangent contribute more to dielectric loss, whereas low loss tangent
substrates decrease dielectric loss. Dielectric losses are directly proportional to frequency.

Dielectric losses are less than conductor losses when using dielectrics such as Alumina, AlN,
or BeO. When silicon substrates are used in monolithic integrated circuits, the dielectric loss
values are comparable to conductor loss values. This is because silicon substrates have lower
resistivity, which makes dielectric and conductor losses almost equal. The material GaAs has
higher resistivity, so using it as a dielectric substrate reduces dielectric losses.

Radiation Losses

Radiation losses in microstrip lines are overlooked when compared to ohmic losses and
dielectric losses. Radiation losses depend on the dielectric constant, thickness of the dielectric
substrate, and the microstrip line geometry. When the dielectric constant value is less, the
concentration of the electromagnetic energy in the substrate decreases, and radiation losses
increase. When using a high dielectric constant material, the electromagnetic field gets stored
in the dielectric between the microstrip and the ground plane, which lowers radiation loss.
The table below shows the dielectric constant of various dielectric substrates.
Q.2 Explain Strip line and microstrip line devices.
Strip line and micro strip line devices are the convenient substitute for the above structure.
The strip line structure is a three conductor TEM mode transmission line. The strip line
structure is a three conductor TEM mode transmission line. It consists of a thin conductor
strip sandwiched between two dielectric laminates metalized on the outer sides. The field
configuration is shows that the field line concentrates around the strip conductor and decrease
outward with distance away from the metal strip. It is an excellent medium for realizing
passive components but it suffers from the conductor and dielectric losses. These losses are
overcome by introducing micro strip lines structure.
Strip line and micro strip line devices are the convenient substitute for the above structure.
The strip line structure is a three conductor TEM mode transmission line. The strip line
structure is a three conductor TEM mode transmission line. It consists of a thin conductor
strip sandwiched between two dielectric laminates metalized on the outer sides. The field
configuration is shows that the field line concentrates around the strip conductor and decrease
outward with distance away from the metal strip. It is an excellent medium for realizing
passive components but it suffers from the conductor and dielectric losses. These losses are
overcome by introducing micro strip lines structure.
Q.3 Explain Planar Transmission Structures.
Planar transmission structures suitable for MICs have a geometry that allows the
characteristic impedance of the structure to be controlled by defining the dimension in a
single plane. This feature allows the complete transmission structure to be fabricated in one
step by thin film technology and photolithography techniques. These processes are similar to
that use for making printed circuit card for low frequency electronic circuitry. Several
configurations for planar transmission structures are possible. Commonly used structures are
strip line, micro strip line, slot line coplanar strips, coplanar waveguide and their different
types of variants such as suspended and inverted strip line and micro strip lines etc. Many of
these follow TEM – mode of wave propagation and others follow non – TEM – mode.
Q.4 Explain Strip line Configuration.
Strip line transmission structure is a three conductor following TEM-mode of wave
propagation. It is a modified version of triplet structure and first member of the planar
transmission line family. It consists of a flat strip conductor placed symmetrically between
two large ground planes with the intervening space homogenously filled with a dielectric
substrate. The field lines concentrate around the strip conductor and decay rapidly with
distance away from the strip in the lateral directions. The strip width of the structure is much
greater than its thickness. The upper and lower sides of the structure are completely
metalized. These two metal laminates are clamped together to form a final stable
configuration. The space between two metal sub states is negligible due to small thickness of
the strip line. The energy propagates mostly in the dielectric substrate just below the strip
conductor, some part of it is associated with the fringe fields and some extends in the space
above the dielectrics. The dominant mode of propagation is pure.
Q.5 Explain Micro strip line Configuration.
Due to following features Micro strip line is more useful than strip line: (i) There is an easy
access to the top surface which makes it very convenient to mount active and passive devices
and to make minor adjustment after the circuit has been fabricated. (ii) Because of openness
of the structure care has to take to minimize the radiation loss or interference due to nearby
conductors. To insure that fields are confined near the strip, use of high dielectric constant
substrate is necessary. Since the electromagnetic fields extend in the space above the micro
strip, micro strip configuration becomes a mixed dielectric transmission structure effective
dielectric permittivity is considered. In this structure most of the energy is concentrated
below the strip. It is a simplest and modified form of strip line structure. The micro strip lines
structure consists of a narrow conductor strip on one side of a dielectric substrate other side
of which is metalized to serve as a ground plane. It is an open structure and simple
realization. The field lines are confined in the vicinity of the strip conductor with a larger
concentration inside substrate and smaller in the air region. It depends on the permittivity of
the substrate used. Suitable substrate is preferred which can minimize the dielectric loss. A
quassi TEM mode is preferable but in in lower gigahertz frequency range TEM mode of
wave propagation is considered. As micros trip lines is an inhomogeneous structure
consisting of a dielectric substrate and strip conductor on the surface, effective permittivity
ϵreff. is considered for the calculation of the characteristics of the structure. The
characteristics parameters of the structure. The knowledge of characteristics impedance and
phase velocity enables one to obtain the capacitance of the structure when two microstriplines
are placed together in close proximity with broadside parallel; the structure is called coupled
microstripline. The characteristics parameter depends on the geometries of structure,
substrate height and permittivity and spacing between the two striplines. This also offers the
knowledge of coupling coefficient of the coupled microstripline.
Q.6 Design of A Micro strip line Structure.
The analysis and synthesis are two methods for study transmission structure. The analysis
method involves the study of characteristic parameters of the structures for given variables
such as strip geometry, permittivity & frequency. The synthesis (design) involves choosing
relative permittivity (ϵr) and height (h) for the substrate and calculating strip width (w) to
achieve desired characteristics impedance (z) using equation. While selecting ϵr, h and w, it is
important to insured that only dominant mode is propagating. For a 50Ω line on a lamina
substrate (ϵr = 9.6) of thickness 0.633 mm, w/h = 1 or w = 0.535mm. assuming w = 0.4 mm,
h = 0.254 mm, the cut off frequency range is 57 GHz for TM-mode and 40 GHz for TEmode.
The recommended frequency ranges for 50 Ω microstripline on alumina is 0 – 30 GHz. For
increasing the upper limit, we need to reduce h or ϵr. reduction of h leads to more stringent
dimensional tolerances during fabrication and reduction of ϵr increases the radiation loss.
In order to reduce to radiation and also to provide electromagnetic shielding, practical
microstrip circuits are housed in a shielded enclosure. The lower limit of Z in a microstripline
is 20 Ω and is set by the onset of TE-mode. The upper limit of Z is 120 Ω and is set by the
smallest realizable value of W. one major advantage of the microstrip is that its surface is
accessible for mounting passive as well as active discrete devices. It is also a versatile
medium for realizing a variety of circuit forms and combining several circuit functions. By
placing two similar strip lines parallel to each other at small spacing coupled micro strip
structure is formed and for coupled strip line of given characteristic impedance and coupling
we have to obtained the width of the strip and spacing between them which is the aim of the
present work.
Q.7 Explain Losses in Micro strip line Structure
As micro strip line structures are open and consist of metal strips embedded on the dielectric
substrates, there are some losses especially in the case of high frequency range. The strip line
and micro strip line though are less lossy, they suffers from four types of losses : (1)
Dielectric loss, (2) Conductor loss (skin loss), (3) Radiation loss & (4) Surface wave loss. Out
of these first two are important for the study. The dielectric loss is due to finite loss tangent of
the dielectric substate and conductor loss is due to the finite resistivity of the strip conductor.
The loss tangent is expressed as tan δ = σ/wϵr where, σ = specific conductivity of the
substrate, ϵr = permittivity of the substrate w = 2TTf = the operating angular frequency.
These losses have been studied by several investigates . if αc be denoted as the attenuation
constant due to the conductor loss and αd as the attenuation constant due to dielectric loss,
both expressed in dB/ unit length, then the total attenuation is given as Α =αc + αd dB/ unit
length.
Q.8 Limitation of Microstripline Structure
Since microstripline is simple and open structure filled with mixed dielectrics air and
dielectric substrate. (i) As most of the field lines are concentrated at the dielectric substrate, a
slight change in ϵr due to temperature change or due to batch to batch variation will change
the impedance, guide wavelength and phase velocity considerably. (ii) Circuit dimension at
millimeter wave frequency are very small – results in fabrication problems. (iii) Thinner
substrate permits high frequency operation but at the cost lower Q-factor (≈100). (iv) The
conductor loss in the microstrip increases with an increase in frequency. The useful range of
frequency for microstrip is upto about 50 GHz. CONCLUSION These results obtained in the
synthesis process are also responsible agreement with those obtained in analysis process. So,
this provides an important and necessary tool for the designer to fabricate directional coupler
of desired coupling coefficient and directivity.