Tps2514a q1
Tps2514a q1
Tps2514a q1
TPS2513A-Q1, TPS2514A-Q1
SLVSCC8A – MAY 2014 – REVISED DECEMBER 2014
Typical Application as USB Dedicated Charging Port Controller of Dual Port Automotive USB Charge Port Solution
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPS2513A-Q1, TPS2514A-Q1
SLVSCC8A – MAY 2014 – REVISED DECEMBER 2014 www.ti.com
Table of Contents
1 Features .................................................................. 1 8.3 Feature Description................................................... 9
2 Applications ........................................................... 1 8.4 Device Functional Modes........................................ 11
3 Description ............................................................. 1 9 Applications and Implementation ...................... 12
4 Simplified Application Diagram............................ 1 9.1 Application Information............................................ 12
9.2 Typical Application .................................................. 12
5 Revision History..................................................... 2
6 Pin Configuration and Functions ......................... 3 10 Power Supply Recommendations ..................... 13
7 Specifications......................................................... 4 11 Layout................................................................... 14
11.1 Layout Guidelines ................................................. 14
7.1 Absolute Maximum Ratings ...................................... 4
11.2 Layout Example .................................................... 14
7.2 ESD Ratings.............................................................. 4
7.3 Recommended Operating Conditions....................... 4 12 Device and Documentation Support ................. 15
7.4 Thermal Information .................................................. 4 12.1 Related Links ........................................................ 15
7.5 Electrical Characteristics........................................... 5 12.2 Trademarks ........................................................... 15
7.6 Typical Characteristics .............................................. 6 12.3 Electrostatic Discharge Caution ............................ 15
12.4 Glossary ................................................................ 15
8 Detailed Description .............................................. 7
8.1 Overview ................................................................... 7 13 Mechanical, Packaging, and Orderable
8.2 Functional Block Diagram ......................................... 8
Information ........................................................... 15
5 Revision History
Changes from Original (May 2014) to Revision A Page
TPS2513A-Q1
DBV (SOT23-6) TPS2514A-Q1
(TOP VIEW) DBV (SOT23-6)
(TOP VIEW)
DP1 1 6 DM1
DP1 1 6 DM1
GND 2 5 IN
5
GND 2 IN
DP2 3 4 DM2
N/C 3 4 N/C
7 Specifications
7.1 Absolute Maximum Ratings (1)
Over recommended junction temperature range, voltages are referenced to GND (unless otherwise noted)
MIN MAX UNIT
IN –0.3 7
Voltage range DP1, DP2 output voltage, DM1, DM2 output voltage –0.3 5.8 V
DP1, DP2 input voltage, DM1, DM2 input voltage –0.3 5.8
Continuous output sink current DP1, DP2 input current, DM1, DM2 input current 35 mA
Continuous output source current DP1, DP2 output current, DM1, DM2 output current 35 mA
Operating Junction Temperature, TJ –40 125 °C
Storage temperature range, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(1) Parameters provided for reference only, and do not constitute part of TI's published device specifications for purposes of TI's product
warranty
3.2 3.2
DP1 and DM1 Output Voltage (V)
2.4 2.4
2.0 2.0
DP1 DP2
DM1 DM2
1.6 1.6
±40 ±20 0 20 40 60 80 100 120 140 ±40 ±20 0 20 40 60 80 100 120 140
Junction Temperature (C) C005 Junction Temperature (C) C006
VIN = 5 V VIN = 5 V
Figure 1. DP1 and DM1 Output Voltage vs Temperature Figure 2. DP2 and DM2 Output Voltage vs Temperature
180
170
Supply Current (A)
160
150
140
130
±40 ±20 0 20 40 60 80 100 120 140
Junction Temperature (C) C007
VIN = 5 V
8 Detailed Description
8.1 Overview
TPS2513A-Q1 and TPS2514A-Q1 are dedicated charging port controllers, used for the charging of most popular
mobile phones and tablets.
The following overview references various industry standards. It is always recommended to consult the latest
standard to ensure the most recent and accurate information.
Rechargeable portable equipment requires an external power source to charge its batteries. USB ports are
convenient locations for charging because of an available 5-V power source. Universally accepted standards are
required to ensure host and client-side devices meet the power management requirements. Traditionally, USB
host ports following the USB 2.0 Specification must provide at least 500 mA to downstream client-side devices.
Because multiple USB devices can be attached to a single USB port through a bus-powered hub, it is the
responsibility of the client-side device to negotiate the power allotment from the host to guarantee the total
current draw does not exceed 500 mA. In general, each USB device can subsequently request more current,
which is granted in steps of 100 mA up 500 mA total. The host may grant or deny the request based on the
available current.
Additionally, the success of the USB technology makes the micro-USB connector a popular choice for wall
adapter cables. This allows a portable device to charge from both a wall adapter and USB port with only one
connector.
One common difficulty has resulted from this. As USB charging has gained popularity, the 500-mA minimum
defined by the USB 2.0 Specification or 900 mA defined in the USB 3.0 Specification, has become insufficient for
many handsets, tablets and personal media players (PMP) which have a higher rated charging current. Wall
adapters and car chargers can provide much more current than 500 mA or 900 mA to fast charge portable
devices. Several new standards have been introduced defining protocol handshaking methods that allow host
and client devices to acknowledge and draw additional current beyond the 500 mA (defined in the USB 2.0
Specification) or 900 mA (defined in the USB 3.0 Specification) minimum while using a single micro-USB input
connector.
S1
DM1
S2
IN S4 Auto-detect
S3
DP1
2.7V 2.7V 1.2V
UVLO
S5
DM2
DRIVER
S6
S8 Auto-detect
GND
S7
DP2
2.7V 2.7V 1.2V
S1
DM1
S2
IN UVLO S4 Auto-detect
S3
DP1
2.7V 2.7V 1.2V
DRIVER
N/C
N/C
GND
The BC1.2 Specification defines the protocol necessary to allow portable equipment to determine what type of
port it is connected to so that it can allot its maximum allowable current drawn. The hand-shaking process is two
steps. During step one, the primary detection, the portable equipment outputs a nominal 0.6 V output on its D+
line and reads the voltage input on its D– line. The portable device concludes it is connected to a SDP if the
voltage is less than the nominal data detect voltage of 0.3 V. The portable device concludes that it is connected
to a Charging Port if the D– voltage is greater than the nominal data detect voltage of 0.3V and less than 0.8 V.
The second step, the secondary detection, is necessary for portable equipment to determine between a CDP and
a DCP. The portable device outputs a nominal 0.6 V output on its D– line and reads the voltage input on its D+
line. The portable device concludes it is connected to a CDP if the data line being remains is less than the
nominal data detect voltage of 0.3 V. The portable device concludes it is connected to a DCP if the data line
being read is greater than the nominal data detect voltage of 0.3 V and less than 0.8 V.
5V
VBUS
Divider 2
USB Connector
S1, S2: ON
S1 DM1 D- S3, S4: OFF
DP1 D+ Short Mode
S2 S4 ON
S4
GND S1, S2, S3: OFF
S3 1.2V on DP1 and DM1
S3, S4: ON
2.7V 2.7V 1.2 V GND S1, S2: OFF
USB Connector
D-
200 (max)
D+
GND
USB Connector
USB Connector
D- D- D-
D+ D+ D+
2.7 V 2.0 V 2.0 V 2.7 V 2.7 V 2.7 V
GND GND GND
D-
200 (max)
D+
1.2 V
GND
The device is a USB dedicated charging port (DCP) controllers. Applications include vehicle power charger, wall
adapters with USB DCP and other USB chargers. The device DCP controllers have the auto-detect feature that
monitors the D+ and D– line voltages of the USB connector, providing the correct electrical signatures on the DP
and DM pins for the correct detections of compliant portable devices to fast charge. These portable devices
include smart phones, 5-V tablets and personal media players.
USB Connector2
VBUS
TPS2561A-Q1 OUT1
OUT2 D-
Power ILIM D+
Supply GND
RILIM
CUSB1
TPS2513A-Q1
DM2 DP2
4 3
IN GND
5 2
DP1
DM1
6 1 VBUS
USB Connector1
D-
0.1F
CUSB2
D+
GND
6 6
VIN
5 5 DP1
DM1
4 4
VIN, DM1, DP1 (V)
2 2
1 1
VIN
0 DP1 0
DM1
±1 ±1
±0.008 ±0.004 0.000 0.004 0.008 ±0.05 ±0.04 ±0.03 ±0.02 ±0.01 0.00 0.01 0.02 0.03 0.04 0.05
Time (s) C001 Time (s) C002
Figure 13. Power On (DM1 and DP1) Figure 14. Power Off (DM1 and DP1)
6 6
VIN
5 5 DP2
DM2
4 4
VIN, DM2, DP2 (V)
3 3
2 2
1 1
VIN
0 DP2 0
DM2
±1 ±1
±0.008 ±0.004 0.000 0.004 0.008 ±0.05 ±0.04 ±0.03 ±0.02 ±0.01 0.00 0.01 0.02 0.03 0.04 0.05
Time (s) C003 Time (s) C004
Figure 15. Power On (DM2 and DP2) Figure 16. Power Off (DM2 and DP2)
11 Layout
DP2
DM2
VBUS2
Power
Ground
FAULT1
1 10 4 3
2 9 5 TPS2513A-Q1 2
High Frequency
Bypass Capacitor IN
3 8 1
6
4 7 ILIM
5 6 DP1
DM1
FAULT2
VBUS1
12.2 Trademarks
All trademarks are the property of their respective owners.
12.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 10-Dec-2020
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
TPS2513AQDBVRQ1 ACTIVE SOT-23 DBV 6 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 PB6Q
TPS2513AQDBVTQ1 ACTIVE SOT-23 DBV 6 250 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 PB6Q
TPS2514AQDBVRQ1 ACTIVE SOT-23 DBV 6 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 ZBAW
TPS2514AQDBVTQ1 ACTIVE SOT-23 DBV 6 250 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 ZBAW
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 24-Apr-2020
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 24-Apr-2020
Pack Materials-Page 2
PACKAGE OUTLINE
DBV0006A SCALE 4.000
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
3.0 C
2.6
1.75 0.1 C
B A
1.45
PIN 1
INDEX AREA
1
6
2X 0.95
3.05
2.75
1.9 5
2
4
3
0.50
6X
0.25
0.15
0.2 C A B (1.1) TYP
0.00
1.45 MAX
0 -10
0.25
GAGE PLANE 0.22
TYP 0 -10
0.08
8
TYP 0.6
0 TYP SEATING PLANE
0.3
0 -10
-10 -10
4214840/D 09/2023
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.25 per side.
4. Leads 1,2,3 may be wider than leads 4,5,6 for package orientation.
5. Refernce JEDEC MO-178.
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EXAMPLE BOARD LAYOUT
DBV0006A SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
6X (1.1)
1
6X (0.6)
6
SYMM
2 5
2X (0.95)
3 4
SOLDER MASK
SOLDER MASK METAL METAL UNDER OPENING
OPENING SOLDER MASK
4214840/D 09/2023
NOTES: (continued)
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EXAMPLE STENCIL DESIGN
DBV0006A SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
6X (1.1)
1
6X (0.6)
6
SYMM
2 5
2X(0.95)
3 4
(R0.05) TYP
(2.6)
4214840/D 09/2023
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
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