LCD TV

Model No. TX-42LZ80C

Chassis: LH81

Specifications

Power Source AC AUTO 110 - 240V, 50/60 Hz

Power Consumption
Average use 206 W
Standby condition 1.0 W
Display panel
Aspect Ratio 16:9
Visible screen size 106 cm (diagonal)
(No. of pixels) 2,073,600 (1,920 (W) x 1,080 (H))
Sound
Speaker Full range x 2 pcs, 8 Ω
Audio Output 24W (12 W + 12 W), 10% THD
Headphones M3 (3.5 mm) Jack x 1
PC Signals XGA, WXGA
Horizontal scanning frequency 31 - 69 kHz
Vertical scanning frequency 59 - 86 Hz
Receiving Systems / Band name SYSTEMS FUNCTIONS
1 PAL B, G, H
2 PAL I
3 PAL D, K
Reception of broadcast transmission and
4 SECAM B, G
playback from video cassette tape recorders.
5 SECAM D, K
6 SECAM K1
7 NTSC M (NTSC 3.58 / 4.5MHZ)
8 NTSC 4.43 / 5.5 MHz
9 NTSC 4.43 / 6.0 MHz
10 NTSC 4.43 / 6.5 MHz
11 NTSC 3.58 / 5.5 MHz Playback from special VCR’s or DVD.
12 NTSC 3.58 / 6.0 MHz
13 NTSC 3.58 / 6.5 MHz
14 SECAM I
15 PAL 60 Hz / 5.5 MHz Playback from Special Disc Players and
16 PAL 60 Hz / 6.0 MHz Special VCR’s or DVD.
17 PAL 60 Hz / 6.5 MHz

© Panasonic Corporation 2008. Unauthorized

copying and distribution is a violation of law

TQB4WSM42LZ
Receiving Channels (Regular TV)
VHF BAND 2 - 12 PAL / SECAM B, K1
0 - 12 PAL B (AUST.)
1 - 9 PAL B (N.Z.)
1 - 12 PAL / SECAM D
1 - 12 NTSC M (JAPAN)
2 - 13 NTSC M (U.S.A.)
UHF BAND 21 - 69 PAL G, H, I / SECAM G, K, K1
28 - 69 PAL B (AUST.)
13 - 57 PAL D, K
13 - 62 NTSC M (JAPAN)
14 - 69 NTSC M (U.S.A.)
CATV S1 - S20 (OSCAR)
1 - 125 (U.S.A.CATV)
C13 - C49 (JAPAN)
S21 - S41 (HYPER)
Z1 - Z37 (CHINA)
5A, 9A (AUST.)

Aerial - Rear VHF / UHF

Operating Conditions Temperature : 0 °C - 40°C
Humidity : 20 % - 80 % RH (non-condensing)
Connection Terminals
AV1 Input AUDIO L-R VIDEO RCA PIN Type · 2 0.5 V [rms]
RCA PIN Type · 1 1.0 V [p-p] (75 W
)
AV2 Input AUDIO L-R VIDEO RCA PIN Type · 2 0.5 V [rms]
RCA PIN Type · 1 1.0 V [p-p] (75 W
)
COMPONENT Y 1.0 V[p-p] (including synchronization)
PB/CB, PR/CR ± 0.35 V [p-p]
AV3 Input AUDIO L-R VIDEO RCA PIN Type · 2 0.5 V [rms]
RCA PIN Type · 1 1.0 V [p-p] (75 W )
S-VIDEO Mini DIN 4-pin Y: 1.0 V[p-p] (75 O) C: 0.286 V[p-p] (75 W
)
Others HDMI 1/2 Input TYPE A Connectors
Audio Input for HDMI1 RCA PIN Type · 2 0.5 V [rms]
PC Input HIGH-DENSITY D-SUB 15 PIN R, G, B / 0.7 V[p-p] (75 W
)
HD, VD / TTL LEVEL 2.0-5.0 V[rms] (high impedance)
Monitor AUDIO L-R VIDEO RCA PIN Type · 2 0.5 V [rms] (High impedance)
Input RCA PIN Type · 1 1.0 V [p-p] (75 W)
Dimension (W x H x D) 1027 mm x 710 mm x 295 mm (With TV Stand)
1027 mm x 668 mm x 110 mm (TV only)

Mass 23 kg (Net), 27 kg (Gross)

Design and specifications are subject to change without notice. Mass and dimensions shown are approximate.

TABLE OF CONTENTS
PAGE PAGE
1 Safety Precautions -----------------------------------------------4 4.1. Self Check -------- ----------------------------------------- 7
1.1. General Guidelines ----------------------------------------4 4.2. Power LED Blinking Timing Chart --------------------- 7
1.2. Touch-Current Check------------------ --------------------4 5 Chassis Board ----------------------------------------------------- 9
2 Prevention of Electro Static Discharge (ESD) to 5.1. Chassis Installation------------------------ ---------------- 9
Electrostatically Sensitive (ES) Devices ------------------5 6 Location of Controls and Components ----------------- 10
3 About Lead Free Solder (PbF) --------------------------------6 6.1. Wire Dressing--------------------------------------------- 10
4 Self Check Function----------------------------------------------7 7 Disassembly and Assembly Instructions ---------------11
 7.1. AC Code dressing for K2CQ2YY00009 (2 Pin) --- 11
7.2. AC Code dressing for K2CT2YY00009 (3 Pin) --- 11
7.3. Chassis Rail Installation --------------------------------12
7.4. VESA Bracket Installation ------------------------------13
7.5. Pedestal Assembly Preparation ----------------------14
7.5.1. Pedestal Rotation Base ----------------------------14
7.5.2. Pedestal Stand Base Preparation ---------------14
7.5.3. Pedestal Stand Cover Preparation --------------14
7.6. LED Panel Installation-----------------------------------15
7.7. LCD Panel Assembly Installation---------------------16
7.8. LVDS Installation -----------------------------------------17
7.9. Back Cover-------------------------------------------------17
8 Service Mode Adjustment ------------------------------------19
8.1. SERVICE 1-------------------------------------------------19
8.2. SERVICE 2-------------------------------------------------19
8.3. Self Check Mode -----------------------------------------19
8.4. Hotel Mode Adjustment ---------------------------------19
9 Measurements and Adjustments---------------------------21
9.1. Voltage Chart of A Board -------------------------------21
9.2. Voltage Chart of P Board -------------------------------21
10 Printed Circuit Board-------------------------------------------22
10.1. A-Board -----------------------------------------------------22
10.2. A-Board -----------------------------------------------------23
11 Schematic Diagram ---------------------------------------------24
11.1. Schematic Diagram Notes -----------------------------24
11.2. A Board -----------------------------------------------------25
11.2.1. A Board (1 / 11)---------------------------------------25
11.2.2. A Board (2 / 11)---------------------------------------26
11.2.3. A Board (3 / 11)---------------------------------------27
11.2.4. A Board (4 / 11)---------------------------------------28
11.2.5. A Board (5 / 11)---------------------------------------29
11.2.6. A Board (6 / 11)---------------------------------------30
11.2.7. A Board (7 / 11)---------------------------------------31
11.2.8. A Board (8 / 11)---------------------------------------32
11.2.9. A Board (9 / 11)---------------------------------------33
11.2.10. A Board (10 / 11) -------------------------------------34
11.2.11. A Board (11 / 11) -------------------------------------35
11.3. G Board -----------------------------------------------------36
11.3.1. G Board (1 / 2)----------------------------------------36
11.3.2. G Board (2 / 2)----------------------------------------37
11.4. K2 Board----------------------------------------------------38
11.4.1. K2 Board (1 / 1) --------------------------------------38
11.5. P Board -----------------------------------------------------39
11.5.1. P Board (1 / 4) ----------------------------------------39
11.5.2. P Board (2 / 4) ----------------------------------------40
11.5.3. P Board (3 / 4) ----------------------------------------41
11.5.4. P Board (4 / 4) ----------------------------------------42
11.6. SW Board---------------------------------------------------43
11.6.1. SW Board (1 / 1) -------------------------------------43
11.7. V Board -----------------------------------------------------44
11.7.1. V Board (1 / 3) ----------------------------------------44
11.7.2. V Board (2 / 3) ----------------------------------------45
11.7.3. V Board (3 / 3) ----------------------------------------46
12 Exploded View and Replacement Parts List -----------47
12.1. Exploded View and Mechanical Replacement
Parts List----------------------------------------------------47
12.2. Electrical Replacement Parts List --------------------47
12.2.1. Replacement Parts List Notes --------------------47
12.2.2. Electrical Replacement Parts List ---------------48

3
1 Safety Precautions
1.1. General Guidelines
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.

1.2. Touch-Current Check

1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2. Connect a measuring network for touch currents between each exposed metallic part on the set and a good earth ground
such as a water pipe as shown in Figure 1.
3. Use the Leakage Current Tester (Simpson 228 or equivalent) to measure the potential across the measuring network.
4. Check each exposed metallic part and measure the voltage at each point.
5. The potential at any point (touch current) expressed as voltage U1 and U2, do not exceed the following values:
For AC: U1 = 35 V (peak) and U2 = 0.35 V (peak);
For DC: U1 = 1.0 V,

NOTE :
The limit value of U2 = 0.35 V (peak) for AC and U1 = 1.0 V for DC correspond to the values 0.7 mA (peak) AC and 2.0 mA
DC.
The limit value U1 = 35 V (peak) for AC correspond to the value 70 mA (peak) AC for frequencies greater than 100 kHz.

6. Should a measurement be out of the limits specified, there is a possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the customer.

4
2 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are
called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-
effect transistors and semiconductor “chip” components. The following techniques should be used to help reduce the
incidence of component damage caused by electro static discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as
aluminium foil to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as “anti-static (ESD protected)” can
generate electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it (most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminium foil or
comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution:
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices (otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD)
sufficient to damage an ES device).

5
3 About Lead Free Solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead Solder and PbF will refer to Lead Free Solder.
The Lead Free Solder (PbF) used in our manufacturing process and discussed below is (Sn+Ag+Cu).
Those are Tin (Sn), Silver (Ag) and Copper (Cu), although other types are available.

This model uses PbF in its manufacture due to environmental conservation issues. For service and repair work, we would suggest
the use of PbF as well, although Pb may be used.

PCBs manufactured using lead-free will have the “PbF within a leaf Symbol” stamped on their back.

Caution
• PbF has a higher melting point than that of standard solder. Typically the melting point is 50 ~ 70°F (30~40°C) higher.
Please use a high temperature soldering iron and set it to 700 ± 20°F (370 ± 10°C).
• PbF will tend to splash when heated too high (about 1100°F or 600°C).
If you must use Pb solder, please completely remove all of the PbF on the pins or solder area before applying Pb. If this is not
practical, be sure to heat the PbF until it melts, before applying Pb.
• After applying PbF to double layered boards, please check the component side for excess solder which may flow onto the
opposite side (see Figure 2).

Figure 2

Suggested PbF
There are several kinds of PbF available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. However, Sn+Cu
(tin, copper) and Sn+Zn+Bi (tin, zinc, bismuth) solders can also be used.

Figure 3

6
4 Self Check Function
4.1. Self Check
1. Self Check is used to automatically check the bus lines and hexadecimal codes of the TV set.
2. To get into the Self Check mode, press the vol ( - ) “DOWN” button on the customer’s controls at the front of the set, at the same
time pressing the “MENU” button on the remote control. The screen that will show is represented by Figure 4.

Figure 4

4.2. Power LED Blinking Timing Chart

1. Subject
Information of LED blinking timing chart.
2. Contents
When an abonormality has occurred in the unit, the protection circuit operates and resets to standby mode. At this time, the defective block
can be identified by the number of blinks of the Power LED on the front panel of the unit.

7
8
5 Chassis Board
5.1. Chassis Installation
1. Fix 12 pcs screws to ‘A-board’ and ‘P-board’.
Tightening torque should be 50 Ncm to 80 Ncm (5 kgf cm to 8 kgf cm).
2. Fix connectors G1, G2 and G3 at AT G-board.
3. Fix 2 pcs screws to the side of AV bracket assembly.
Tightening torque should be 100 Ncm to 130 Ncm (10 kgf cm to 13 kgf cm).
4. Fix 1 pcs screw to cabinet with power switch PCB bracket.
6 Location of Controls and Components
6.1. Wire Dressing

Connection 1 2 3 4 5 6 7 8 9 10
1 CN 1 ~ P 2

2 CN 1 ~ A 16

3 A 11 ~ P 3

4 A 12 ~ P 4

5 A7 ~ G 4

6 V1~A8

7 A 3 ~ SPEAKER (R)

8 A 3 ~ SPEAKER (L)

9 P 1 ~ SW 2

10 P 5 ~ CN201

10
7 Disassembly and Assembly Instructions
7.1. AC Code dressing for K2CQ2YY00009 (2 Pin)

7.2. AC Code dressing for K2CT2YY00009 (3 Pin)

11
7.3. Chassis Rail Installation
1. Stick sponges at chassis rail for rail no.1, no.2 and no.3.
2. Fix 3 pieces of chassis frames and fix 4 screws to the bottom and top mountings.
-Tightening torque should be 100 N cm - 130 N cm (10 kgf cm to 13 kgf cm).

12
7.4. VESA Bracket Installation
1. Stick 2 pcs of felt at VESA bracket (each part).
2. Fix 4 pcs screws to VESA bracket.
Tightening torque should be 100 Ncm to 130 Ncm (10 kgf cm to 13 kgf cm).
3. Slot pedestal jig assembly to cabinet.

13
7.5. Pedestal Assembly Preparation
7.5.1. Pedestal Rotation Base

7.5.2. Pedestal Stand Base Preparation

7.5.3. Pedestal Stand Cover Preparation

14
7.6. LED Panel Installation
1. Put PCB to LED panel and ensure hook is properly locked on the PCB.

2. Fix LED panel to cabinet with 3 screws.

Tightening torgue should be 0.5 N m ~ 0.8 N m (5 to 8 kgf cm).

= Screw - XTW3 + 10TFJ (3 pcs)

3. Fix wires at cabinet slit and make sure all wires are fully inserted to avoid contact with the pedestal metal.

15
7.7. LCD Panel Assembly Installation
1. Put LCD panel to cabinet assembly.
2. Follow by LCD top mounting and LCD bottom mounting.
3. Fix screw into LCD panel, LCD top mounting and LCD bottom mounting.
- Tightening torque should be 100 N cm ~ 130 N cm (10 kgf cm to 13 kgf cm).

16
7.8. LVDS Installation
1. Insert LVDS wire into T-con connector.
2. Stick the felts to hold LVDS wire.

7.9. Back Cover

1. Stick felts to back cover.

17
2. Stick rear AV indication and HDMI sheet at cabinet.

18
8 Service Mode Adjustment
Set timer to 30min, press the “RECALL” button on the remote control and press “-” vol button on the LCD panel.

8.1. SERVICE 1
1.Press button cursor up and down for adjustment below, then press ok button.
Tests
•Backlight
•Colours
•Keys
•RedLED
•Checksum

8.2. SERVICE 2
1.Select CEC CHECK mode in service 1, by press button 4, then press the “HOLD” button (on the remote control) to enter
service 2.

8.3. Self Check Mode

1.Press the “MENU” button (on the remote contro l) and the vol ( - ) “DOWN” button on the LCD panel.
2.Press ON/OFF button on the panel to Exit.

8.4. Hotel Mode Adjustment

1.Press the “VOLUME DOWN” button on the TV panel and simult aneously press the AV button on the remote control 3 times to
enter Hotel Mode.
2.Set Hotel mode “on”, then press “EXIT” to come out.

19
SERVICE 1

Panasonic LH81 GREEN GREEN

V1.08
SUB CONTRAST DVCO
Service 1 RED RED
Tests RED GREEN
Backlight RED RED
colours GAIN R
keys CEC CHECK G
Red LED B
check SUM GREEN GREEN CENTER R
G
B

SERVICE 2

Panasonic LH81 GREEN GREEN

V1.08
OPTION 0 OPTION 1
Service 2
RED RED
OP0 E2 RED GREEN
RED RED
OP1 31
LIFE TIMER
OP2 01 OPTION 2
HOURS
GREEN GREEN

Key Command
SERVICE 1
• Press the RED/GREEN button to step up/down through the functions.
• Press the YELLOW/BLUE button (or VOLUME UP/DOWN button) to change the function values.
• Press the OK button of remote control after each adjustment has been made to store the required values.

SERVICE 2
• Press the RED/GREEN button to select the Option.
• Press 1 or 2 button to select the bit.
• Press VOLUME UP/DOWN button to change the bit, 0 or 1.
• Press the OK button of remote control after each Option code has been changed to store.

20
9 Measurements and Adjustments
9.1. Voltage Chart of A Board
Specification
Power name Test point
NORMAL STANDBY
MAIN_5V TP1823 5.0 ± 0.25V —
BT_30V TP1820 30.0V ± 2.0V —
24V TP1818 24.0 ± 1.2V —
MAIN_8V TP1822 8.0V ± 0.4V —
STB_3.3V TP1835 3.30 ± 0.17V 3.30 ± 0.17V
MAIN3.3V Pin 8 A8-A 3.30 ± 0.17V —
STBY1.0V TP1838 1.0V ± 0.05V 1.0V ± 0.05V
MAIN1.0V TP3832 1.025V ± 0.017V —
CORE1.0V TP1842 1.08V ± 0.019V —
MAIN1.25V TP1844 1.25V ± 0.05V —
MAIN1.8V TP1847 1.8V ± 0.07V —
MAIN2.5V TP1848 2.5V + 0.137V, -0.114V —
SOUND_13.9V TP1816 13.9V ± 0.7V —

SOS CHECK A BOARD

• TV-SOS Check
1. Connect Collector of Q2310 at TP 1850 (A-PCB parts side) to GND.
2. Check the set is OFF and LED is red blink 5 times repeating.

• INV_SOS
1. Apply DC 3.3V to Q2311 Collector AT TP 1849.
2. Check the set is OFF and LED is red blink 5 times repeating.

9.2. Voltage Chart of P Board

Specification
Power name Test point
NORMAL STANDBY
PANEL_12V TPP033 12.0 + 0.60V, -0.45V —
BT_30V TPP015 30.0V ± 2.0V —
24V TPP007 24.0 ± 1.2V —
MAIN_8V TPP006 8.0V ± 0.4V —
STB_3.3V TPP035 3.30 ± 0.17V 3.30 ± 0.17V
SOUND_13.9 TPP028 13.9V ± 0.7V —

1. Connect the dummy set and turn on the main power SW and check that each output voltage of test point is within the
specifications below.
CONDITION : Philip pattern - dynamic (Normal)
- Sound Minimum

2. Turn off the power supply by the remote controller and set to standby and check that each output voltage of test point is within
the specifications below.

21
10 Printed Circuit Board
10.1. A-Board
A-Board (A Side)
TNP4G439

22
10.2. A-Board
A-Board (B Side)
TNP4G439

23
11 Schematic Diagram
11.1. Schematic Diagram Notes

Notes :
1. Resistor
Unit of resistance is OHM [Ω] (K = 1 000, M = 1 000 000).

2. Capacitor
Unit of capacitance is μF unless otherwise noted.

3. Coil
Unit of inductance is μF unless otherwise noted.

4. Test Point

: Test Point position

5. Earth Symbol

: Chassis Earth (Cold) : Line Earth (Hot)

6. Voltage Measurement
Voltage is measured using DC voltmeter.
Conditions of the measurement are the following :
Power Source....................AC AUTO 110-240 V, 50/60 Hz
Receiving Signal................Colour Bar signal (RF)
All customer’s controls.......Maximum positions

7. Number in red circle indicates waveform number.

(See waveform pattern table)

8. When an arrow mark ( ) is found, connection is easily found from the direction of the arrow.

9. Indicates the major signal flow: Video Audio

10. This schematic diagram is the latest at the time of printing and subject to change without notice.

Remarks :
1. The Power Circuit contains a circuit area which uses a separate power supply to isolate the earth connection.
The circuit is defined by HOT and COLD indications in the schematic diagram. Take the following precautions:
All circuits, except the Power Circuit are cold.
Precautions:
a. Do not touch the hot part or the hot and cold parts at the same time or you may be shocked.
b. Do not short-circuit the hot and cold circuits or a fuse may blow and parts may break.
c. Do not connect an instrument such as an oscilloscope to the hot and cold circuits simultaneously or a fuse may blow.
Connect the earth of instruments to the earth connection of the circuit being measured.
d. Make sure to disconnect the power plug before removing the chassis.

24
11.2. A Board
11.2.1. A Board (1 / 11)

<1A>

<2A>

<3A>
<4A>

25
11.2.2. A Board (2 / 11)

<1A> <1B>

<2A> <2B>

<3A> <3B>
<4A> <4B>

26
11.2.3. A Board (3 / 11)

<1B>

<1C>

<2B> <2C>

<3B> <3C>
<4B> <4C>

27
11.2.4. A Board (4 / 11)

<1D>

<1C> <2D>

<3D>

<4D>

<5D>

<2C> <6D>

<3C> <7D>
<4C> <8D>

28
11.2.5. A Board (5 / 11)

<1D> <1E>

<2D>

<2E>

<3E>

<3D>

<4D>

<5D>

<6D>
<4E>
<7D>
<8D>

9
11.2.6. A Board (6 / 11)

<1E>

<1F>

<2E>
<2F>

<3E> <3F>

<4E>

<4F>

30
11.2.7. A Board (7 / 11)

<1G>

<1F>

<2F> <2G>

<3F> <3G>

<4G>

<4F> <5G>

31
11.2.8. A Board (8 / 11)

<1G> <1H>

<2G> <2H>

<3G> <3H>

<4H>

<4G>
<5H>

<5G> <6H>

32
11.2.9. A Board (9 / 11)

<1H> <1I>

<2I>

<2H> <3I>

<3H> <4I>

<4H>

<5I>

<6I>

<7I>

<8I>

<5H>

<6H> <9I>

33
11.2.10. A Board (10 / 11)

<1I> <1J>

<2I> <2J>

<3I>
<3J>

<4I>

<4J>

<5I>

<5J>

<6I>

<6J>

<7I>

<8I> <7J>

<9I> <8J>

34
11.2.11. A Board (11 / 11)

<1J>

<2J>

<3J>

<4J>

<5J>

<6J>

<7J>

<8J>

35
11.3. G Board
11.3.1. G Board (1 / 2)

<1A>

<2A>

<3A>

<4A>

<5A>

36
11.3.2. G Board (2 / 2)

<1A>

<2A>

<3A>

<4A>

<5A>

37
11.4. K2 Board
11.4.1. K2 Board (1 / 1)

38
11.5. P Board
11.5.1. P Board (1 / 4)

<1A>

<2A>

<3A>

<4A>

<5A>

39
11.5.2. P Board (2 / 4)

<1A> <1B>

<2A>

<2B>

<3B>

<3A>

<4A>

<5A> <4B>

40
11.5.3. P Board (3 / 4)

<1B> <1C>

<2C>

<3C>

<4C>

<2B>

<5C>

<3B>

<6C>

<7C>

<8C>
<4B>

41
11.5.4. P Board (4 / 4)

<1C>

<2C>

<3C>

<4C>

<5C>

<6C>

<7C>

<8C>

42
11.6. SW Board
11.6.1. SW Board (1 / 1)

43
11.7. V Board
11.7.1. V Board (1 / 3)

<1A>

<2A>

<3A>

<4A>

44
11.7.2. V Board (2 / 3)

<1A> <1B>

<2B>

<2A>

<3B>
<3A>

<4B>

<4A> <5B>

45
11.7.3. V Board (3 / 3)

<1B>

<2B>

<3B>

<4B>

<5B>

46
12 Exploded View and Replacement Parts List
12.1. Exploded View and Mechanical Replacement Parts List
Please click the radio button for “Diagrams ll/Parts List” on the menu bar.

12.2. Electrical Replacement Parts List

12.2.1. Replacement Parts List Notes

Important Safety Notice

Components identified by mark have special characteristics important for safety.

When replacing any of these components, use manufacturer’s specified parts.

Note: Printed circuit board assembly with “NLA” is no longer available after production
discontinuation of the complete set.

Abbreviation of part name and description

1. Resistor 2. Capacitor
Example : Example :
ERD25TJ104 C 100 KΩ, J, 1/4 W ECKF1H103ZF C 0.01 μF, Z, 50 V
Type Allowance Type Allowance

Type Allowance Type Allowance

C : Carbon F : ± 1% C : Carbon C : ± 0.25 pF

F : Fuse G : ± 2% E : Electrolytic D : ± 0.5 pF

M : Metal Oxide J : ± 5% P : Polyester F : ± 1 pF

Metal Film K : ± 10% Polypropylene G : ± 3%

S : Solid M : ± 20% T : Tantalum J : ± 5%

W : Wire Wound K : ± 10%

L : ± 15%

M : ± 20%

P : ± 100%, -0%

Z : ± 80%, -20%

47
12.2.2. Replacement Parts List

REF No. PART NO. DESCRIPTION QTY

C831 F2A1H221B262 E , 220 uF , 50V 1
MECHANICAL / EXCLUSIVE PARTS C832 ECJ1VB1H104K C , 0.1 uF , 50V 1
C833 F2A1V5600014 E , 56 uF , 35V 1
REF No. PART NO. DESCRIPTION QTY
C834 F2A1V1020043 E , 1 uF , 35 V 1
TZRTY010NQN CABINET PACKING KIT 1 C835 F2A1V1020043 E , 1 uF , 35 V 1
L5EDDAT00001 LCD PANEL 1 C837 ECJ2FB1C474K C , 470 kpF , 16V 1
EAS16S07B SPEAKER 2 C838 F1A2E101A002 C, 100 pF , 250V 1
K1PY51Y00028 A8-PANEL (LVDS HARNES) 1 C840 F1J1E3340003 C , 0.33 uF , 25V 1
K2CP2YY00006 AC CORD 1 C841 F1A2E681A002 C, 680 pF , 250V 1
TBX4GA00202 CONTROL BUTTON 1 C842 F2A1V221A470 E , 220 uF , 35V 1
TKP4GA00201 CONTROL PANEL BRACKET 1 C845 ECQE6333JFB F , 33 kpF 1
TZRBL010NQN PEDESTAL PACKING KIT 1 C846 ECJ2VB1H821K C , 820 pF , 50V 1
TZRKU010NDP-A BACKCOVER PACKING KIT 1 C847 ECJ1VB1H104K C , 0.1 uF , 50V 1
TPC4W10181 PACKING CASE 1 C848 F0C2K393A035 F, 39 kpF , 800V 1
TPD4W1010 TOP CUSHION 1 C849 ECJ1VB1H104K C , 0.1 uF , 50V 1
N2QAKB000065 REMOTE ( N2QAYB000227 ) 1 C852 F2A1C471A537 E , 470 uF , 16 V 1
TNP4G440AJ P PCB Assy. 1 C853 ECJ1VB1H104K C , 0.1 uF , 50V 1
TNP4G442AC K PCB Assy. 1 C854 ECJ2VB1H333K C , 33 kpF , 50V 1
TNP4G443AC G PCB Assy. 1 C856 F2A1V221A470 E , 220 uF , 35V 1
TNP4G444AC V PCB Assy. 1 C857 ECJ1VB1H104K C , 0.1 uF , 50V 1
TNP4G445AC SW PCB Assy. 1 C858 F2A1C1210014 E , 120 uF , 16 V 1
TZRNP010NQN A PCB Assy. 1 C859 ECQV1H105JL3 F , 1 uF , 50V 1
TQE4W42LZ80 OPERATING MANUAL ASSY. 1 C861 ECJ1VB1H104K C , 0.1 uF , 50V 1
ELECTRICAL PARTS C862 ECJ1VB1H104K C , 0.1 uF , 50V 1
CAPACITORS C863 ECJ1VB1H104K C , 0.1 uF , 50V 1
SCHEM COMPONENT DESCRIPTION QTY C867 F1J0J1060004 C , 10 uF , 6.3V 1
C1003 ECEA1CKS220B E , 22 uF , 16 V 1 C868 ECJ2VB1H103K C , 10nF , K , 50V 1
C1006 ECEA0JKS470B E , 47 uF , 6.3 V 1 C872 ECJ2VC1H101J C , 100 pF , 50V 1
C1007 ECJ2VB1H103K C , 10nF , K , 50V 1 C875 F2A1H221A115 E , 220 uF , 50 V 1
C800 ECKCNA101MB7 C , 100pF , M , 250V 1 C876 F2A1C471A537 E , 470 uF , 16 V 1
C801 F0CAF224A066 F, 0.22 uF , 250 Vac 1 C878 ECJ1VB1H104K C , 0.1 uF , 50V 1
C803 F0CAF224A066 F, 0.22 uF , 250 Vac 1 C880 ECJ1VB1H104K C , 0.1 uF , 50V 1
C804 F0CAF224A066 F, 0.22 uF , 250 Vac 1 C881 ECJ1VB1H104K C , 0.1 uF , 50V 1
C805 ECKCNA101MB7 C , 100pF , M , 250V 1 C882 ECJ1VB1H104K C , 0.1 uF , 50V 1
C806 ECKCNA101MB7 C , 100pF , M , 250V 1 C883 ECJ1VB1H104K C , 0.1 uF , 50V 1
C807 ECKCNA101MB7 C , 100pF , M , 250V 1 C884 ECJ1VB1H104K C , 0.1 uF , 50V 1
C808 F0C2H105A011 F, 1 uF , 500V 1 C885 F2A1V221A470 E , 220 uF , 35V 1
C810 ECKW3D471KBP C , 470pF , K , 2 KV 1 C886 F2A1C471A537 E , 470 uF , 16 V 1
C811 ECJ2VB1H103K C , 10nF , K , 50V 1 C887 ECJ2VB1H103K C , 10nF , K , 50V 1
C812 ECJ1VB1H473K C , 47 kpF , 50V 1 C888 ECJ1VB1H104K C , 0.1 uF , 50V 1
C814 ECJ1VB1H104K C , 0.1 uF , 50V 1 C889 ECJ1VB1H104K C , 0.1 uF , 50V 1
C815 ECJ2VB1H222K C , 2.2 kpF , 50V 1 C894 ECJ2VB1H103K C , 10nF , K , 50V 1
C816 ECJ2VB1H102K C , 0.001uF , 50V 1 C895 ECJ3YB1E106M C , 10 uF , 25V 1
C818 F2A1H4700031 E , 47 uF , 50 V 1 C896 ECJ1VB1H104K C , 0.1 uF , 50V 1
C819 ECJ2VB1H472K C , 4.7 kpF , 50V 1 C897 ECJ3YB1E106M C , 10 uF , 25V 1
C820 F2B2W2210005 E , 220 uF , 450 V 1 C921 ECJ3YB1E106M C , 10 uF , 25V 1
C821 ECJ2VB1H223K C, 22 kpF , 50V 1 C922 ECJ3YB1E106M C , 10 uF , 25V 1
C822 ECJ1VB1H104K C , 0.1 uF , 50V 1 DIODES
C823 F2A1E221A487 E , 220 uF , 16 V 1 D1001 B3AGA0000072 LED 1
C824 ECJ1VB1H104K C , 0.1 uF , 50V 1 D3501 MAZ81400ML Diode 1
C825 ECJ2FB1E105K C , 1 uF , 25V 1 D3502 MAZ81400ML Diode 1
C826 ECJ2VB1H103K C , 10nF , K , 50V 1 D3503 MAZ81400ML Diode 1
C827 ECJ2VB1H472K C , 4.7 kpF , 50V 1 D3504 MAZ81400ML Diode 1
C828 ECJ2VB1H821K C , 820 pF , 50V 1 D3506 MAZ81400ML Diode 1
C829 F2A1H100A317 E , 10 uF , 50V 1 D3507 MAZ81400ML Diode 1
C830 ECJ2VB1H102K C , 0.001uF , 50V 1 D3508 MAZ81400ML Diode 1

48
Parts Location

52
Packing Exploded View

53