±   
    
SLLS349J − JUNE 1999 − REVISED MARCH 2004

D RS-232 Bus-Pin ESD Protection Exceeds DB OR PW PACKAGE

±15 kV Using Human-Body Model (HBM) (TOP VIEW)

D Meets or Exceeds the Requirements of C2 + 1 28 C1+

TIA/EIA-232-F and ITU v.28 Standards GND 2 27 V+
D Operates With 3-V to 5.5-V VCC Supply C2− 3 26 VCC
D Operates Up To 250 kbit/s V− 4 25 C1−
D Five Drivers and Three Receivers DOUT1 5 24 DIN1
DOUT2 6 23 DIN2
D Low Standby Current . . . 1 µA Typical
DOUT3 7 22 DIN3
D External Capacitors . . . 4 × 0.1 µF RIN1 8 21 ROUT1
D Accepts 5-V Logic Input With 3.3-V Supply RIN2 9 20 ROUT2
D Always-Active Noninverting Receiver DOUT4 10 19 DIN4
Output (ROUT1B) RIN3 11 18 ROUT3
D Alternative High-Speed Pin-Compatible DOUT5 12 17 DIN5
Device (1 Mbit/s) FORCEON 13 16 ROUT1B
− SNx5C3238 FORCEOFF 14 15 INVALID
D Applications
− Battery-Powered Systems, PDAs,
Notebooks, Subnotebooks, Laptops,
Palmtop PCs, Hand-Held Equipment,
Modems, and Printers

description/ordering information
The MAX3238 consists of five line drivers, three line receivers, and a dual charge-pump circuit with ±15-kV ESD
(HBM) protection pin to pin (serial-port connection pins, including GND). The device meets the requirements
of TIA/EIA-232-F and provides the electrical interface between notebook and subnotebook computer
applications. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V
supply. In addition, the device includes an always-active noninverting output (ROUT1B), which allows
applications using the ring indicator to transmit data while the device is powered down. These devices operate
at data signaling rates up to 250 kbit/s and a maximum of 30-V/µs driver output slew rate.

ORDERING INFORMATION
ORDERABLE TOP-SIDE
TA PACKAGE†
PART NUMBER MARKING
Tube of 50 MAX3238CDB
SSOP (DB) MAX3238C
Reel of 2000 MAX3238CDBR
−0°C to 70°C
Tube of 50 MAX3238CPW
TSSOP (PW) MA3238C
Reel of 2000 MAX3238CPWR
Tube of 50 MAX3238IDB
SSOP (DB) MAX3238I
Reel of 2000 MAX3238IDBR
−40°C to 85°C
Tube of 50 MAX3238IPW
TSSOP (PW) MB3238I
Reel of 2000 MAX3238IPWR
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

       !"#$%&'(!$" !) *+%%,"( ') $# -+./!*'(!$" 0'(, Copyright  2004, Texas Instruments Incorporated
%$0+*() *$"#$%& ($ )-,*!#!*'(!$") -,% (1, (,%&) $# ,2') ")(%+&,"()
)('"0'%0 3'%%'"(4 %$0+*(!$" -%$*,))!"5 0$,) "$( ",*,))'%!/4 !"*/+0,
(,)(!"5 $# '// -'%'&,(,%)

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description/ordering information (continued)

Flexible control options for power management are featured when the serial port and driver inputs are inactive.
The auto-powerdown plus feature functions when FORCEON is low and FORCEOFF is high. During this mode
of operation, if the device does not sense valid signal transitions on all receiver and driver inputs for
approximately 30 s, the built-in charge pump and drivers are powered down, reducing the supply current to
1 µA. By disconnecting the serial port or placing the peripheral drivers off, auto-powerdown plus occurs if there
is no activity in the logic levels for the driver inputs. Auto-powerdown plus can be disabled when FORCEON
and FORCEOFF are high. With auto-powerdown plus enabled, the device activates automatically when a valid
signal is applied to any receiver or driver input. INVALID is high (valid data) if any receiver input voltage is greater
than 2.7 V or less than −2.7 V, or has been between −0.3 V and 0.3 V for less than 30 µs. INVALID is low (invalid
data) if all receiver input voltages are between −0.3 V and 0.3 V for more than 30 µs. Refer to Figure 5 for receiver
input levels.

Function Tables

EACH DRIVER
INPUTS
OUTPUT
TIME ELAPSED SINCE LAST DRIVER STATUS
DIN FORCEON FORCEOFF DOUT
RIN OR DIN TRANSITION
X X L X Z Powered off
L H H X H Normal operation with
H H H X L auto-powerdown plus disabled
L L H <30 s H Normal operation with
H L H <30 s L auto-powerdown plus enabled
L L H >30 s Z Powered off by
H L H >30 s Z auto-powerdown plus feature
H = high level, L = low level, X = irrelevant, Z = high impedance

EACH RECEIVER
INPUTS OUTPUTS
TIME ELAPSED SINCE LAST RIN RECEIVER STATUS
RIN1 RIN2−RIN3 FORCEOFF ROUT1B ROUT
OR DIN TRANSITION
L X L X L Z Powered off while
H X L X H Z ROUT1B is active
L L H <30 s L H
L H H <30 s L L Normal operation with
H L H <30 s H H auto-powerdown plus
H H H <30 s H L disabled/enabled

Open Open H >30 s L H

H = high level, L = low level, X = irrelevant, Z = high impedance (off), Open = input disconnected or connected driver off

2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265



 
    
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logic diagram (positive logic)

24 5
DIN1 DOUT1

23 6
DIN2 DOUT2

22 7
DIN3 DOUT3

19 10
DIN4 DOUT4

17 12
DIN5 DOUT5

14
FORCEOFF
15
Auto-powerdown INVALID
13
FORCEON Plus

16
ROUT1B

21 8
ROUT1 RIN1

20 9
ROUT2 RIN2

18 11
ROUT3 RIN3

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absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6 V
Positive output supply voltage range, V+ (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 7 V
Negative output supply voltage range, V− (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to −7 V
Supply voltage difference, V+ − V− (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 V
Input voltage range, VI: Driver (FORCEOFF, FORCEON) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6 V
Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −25 V to 25 V
Output voltage range, VO: Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −13.2 V to 13.2 V
Receiver (INVALID) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to VCC + 0.3 V
Package thermal impedance, θJA (see Notes 2 and 3): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . 62°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . 62°C/W
Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltages are with respect to network GND.
2. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
3. The package thermal impedance is calculated in accordance with JESD 51-7.

recommended operating conditions (see Note 4 and Figure 6)

MIN NOM MAX UNIT
VCC = 3.3 V 3 3.3 3.6
Supply voltage V
VCC = 5 V 4.5 5 5.5
VCC = 3.3 V 2
VIH Driver and control high-level input voltage DIN, FORCEOFF, FORCEON V
VCC = 5 V 2.4
VIL Driver and control low-level input voltage DIN, FORCEOFF, FORCEON 0.8 V
VI Driver and control input voltage DIN, FORCEOFF, FORCEON 0 5.5 V
VI Receiver input voltage −25 25 V
MAX3238C 0 70
TA Operating free-air temperature °C
MAX3238I −40 85
NOTE 4: Testing supply conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.15 V; C1−C4 = 0.22 µF at VCC = 3.3 V ± 0.3 V; and C1 = 0.047 µF
and C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V.

electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
PARAMETER TEST CONDITIONS MIN TYP‡ MAX UNIT
II Input leakage current FORCEOFF, FORCEON ±0.01 ±1 µA
Auto-powerdown plus No load,
0.5 2 mA
disabled FORCEOFF and FORCEON at VCC
Supply current Powered off No load, FORCEOFF at GND 1 10
ICC
(TA = 25
25°C)
C) No load, FORCEOFF at VCC,
Auto-powerdown plus µA
FORCEON at GND, 1 10
enabled
All RIN are open or grounded
‡ All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
NOTE 4: Testing supply conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.15 V; C1−C4 = 0.22 µF at VCC = 3.3 V ± 0.3 V; and C1 = 0.047 µF
and C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V.

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DRIVER SECTION

electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
PARAMETER TEST CONDITIONS MIN TYP† MAX UNIT
VOH High-level output voltage All DOUT at RL = 3 kΩ to GND 5 5.4 V
VOL Low-level output voltage All DOUT at RL = 3 kΩ to GND −5 −5.4 V
IIH High-level input current VI = VCC ±0.01 ±1 µA
IIL Low-level input current VI at GND ±0.01 ±1 µA
VCC = 3.6 V, VO = 0 V ±35 ±60
IOS Short-circuit output current‡ mA
VCC = 5.5 V, VO = 0 V ±40 ±100
ro Output resistance VCC, V+, and V− = 0 V, VO = ±2 V 300 10M Ω
VO = ±12 V, VCC = 3 V to 3.6 V ±25
Ioff Output leakage current FORCEOFF = GND µA
VO = ±10 V, VCC = 4.5 V to 5.5 V ±25
† All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
‡ Short-circuit durations should be controlled to prevent exceeding the device absolute power-dissipation ratings, and not more than one output
should be shorted at a time.
NOTE 4: Testing supply conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.15 V; C1−C4 = 0.22 µF at VCC = 3.3 V ± 0.3 V; and C1 = 0.047 µF
and C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V.

switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
PARAMETER TEST CONDITIONS MIN TYP† MAX UNIT
CL = 1000 pF, RL = 3 kΩ,
Maximum data rate 150 250 kbit/s
One DOUT switching, See Figure 1
RL = 3 kΩ to 7 kΩ,
tsk(p) Pulse skew§ CL = 150 pF to 2500 pF 100 ns
See Figure 2
Slew rate, transition region VCC = 3.3 V, CL = 150 pF to 1000 pF 6 30
SR(tr) V/µs
(see Figure 1) RL = 3 kΩ to 7 kΩ CL = 150 pF to 2500 pF 4 30
† All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
§ Pulse skew is defined as |tPLH − tPHL| of each channel of the same device.
NOTE 4: Testing supply conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.15 V; C1−C4 = 0.22 µF at VCC = 3.3 V ± 0.3 V; and C1 = 0.047 µF
and C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V.

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RECEIVER SECTION

electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
PARAMETER TEST CONDITIONS MIN TYP† MAX UNIT
VOH High-level output voltage IOH = −1 mA VCC−0.6 V VCC−0.1 V V
VOL Low-level output voltage IOL = 1.6 mA 0.4 V
VCC = 3.3 V 1.5 2.4
VIT+ Positive-going input threshold voltage V
VCC = 5 V 1.8 2.4
VCC = 3.3 V 0.6 1.2
VIT− Negative-going input threshold voltage V
VCC = 5 V 0.8 1.5
Vhys Input hysteresis (VIT+ − VIT−) 0.3 V
Ioff Output leakage current (except ROUT1B) FORCEOFF = 0 V ±0.05 ±10 µA
ri Input resistance VI = ±3 V to ±25 V 3 5 7 kΩ
† All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
NOTE 4: Testing supply conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.15 V; C1−C4 = 0.22 µF at VCC = 3.3 V ± 0.3 V; and C1 = 0.047 µF
and C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V.

switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4)
PARAMETER TEST CONDITIONS MIN TYP† MAX UNIT
tPLH Propagation delay time, low- to high-level output 150 ns
CL = 150 pF, See Figure 3
tPHL Propagation delay time, high- to low-level output 150 ns
ten Output enable time 200 ns
CL = 150 pF, RL = 3 kΩ,
kΩ See Figure 4
tdis Output disable time 200 ns
tsk(p) Pulse skew‡ See Figure 3 50 ns
† All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
‡ Pulse skew is defined as |tPLH − tPHL| of each channel of the same device.
NOTE 4: Testing supply conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.15 V; C1−C4 = 0.22 µF at VCC = 3.3 V ± 0.3 V; and C1 = 0.047 µF
and C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V.

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AUTO-POWERDOWN PLUS SECTION

electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 5)
PARAMETER TEST CONDITIONS MIN TYP† MAX UNIT
Receiver input threshold FORCEON = GND,
VT+(valid) 2.7 V
for INVALID high-level output voltage FORCEOFF = VCC
Receiver input threshold FORCEON = GND,
VT−(valid) −2.7 V
for INVALID high-level output voltage FORCEOFF = VCC
Receiver input threshold FORCEON = GND,
VT(invalid) −0.3 0.3 V
for INVALID low-level output voltage FORCEOFF = VCC
IOH = −1 mA, FORCEON = GND,
VOH INVALID high-level output voltage VCC−0.6 V
FORCEOFF = VCC
IOL = 1.6 mA, FORCEON = GND,
VOL INVALID low-level output voltage 0.4 V
FORCEOFF = VCC
† All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.

switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 5)
PARAMETER MIN TYP† MAX UNIT
tvalid Propagation delay time, low- to high-level output 0.1 µs
tinvalid Propagation delay time, high- to low-level output 50 µs
ten Supply enable time 25 µs
tdis Receiver or driver edge to auto-powerdown plus 15 30 60 s
† All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.

PARAMETER MEASUREMENT INFORMATION

3V
Input
RS-232
0V
Output
Generator
50 Ω tTHL tTLH
(see Note B) CL
RL (see Note A)
VOH
3V 3V
3V Output
FORCEOFF −3 V −3 V VOL
SR(tr) + 6V
TEST CIRCUIT t THL or t TLH VOLTAGE WAVEFORMS

NOTES: A. CL includes probe and jig capacitance.

B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.

Figure 1. Driver Slew Rate

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PARAMETER MEASUREMENT INFORMATION

3V
RS-232 Input 1.5 V 1.5 V
Output 0V
Generator
50 Ω
(see Note B) CL tPHL tPLH
RL (see Note A)
VOH
3V
Output 50% 50%
FORCEOFF
VOL

TEST CIRCUIT VOLTAGE WAVEFORMS

NOTES: A. CL includes probe and jig capacitance.

B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.

Figure 2. Driver Pulse Skew

3 V or 0 V
FORCEON 3V
Input 1.5 V 1.5 V
−3 V
Output
Generator tPHL tPLH
50 Ω
(see Note B) CL
3V (see Note A)
VOH
FORCEOFF Output 50% 50%
VOL

TEST CIRCUIT VOLTAGE WAVEFORMS

NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.

Figure 3. Receiver Propagation Delay Times

3V
Input
VCC 1.5 V 1.5 V
GND
3 V or 0 V 0V
S1
FORCEON tPHZ
RL (S1 at GND)

3 V or 0 V Output VOH
Output 50%
CL 0.3 V
FORCEOFF (see Note A)
tPLZ tPZL
Generator (S1 at VCC) (S1 at VCC)
(see Note B) 50 Ω
0.3 V
Output 50%
VOL
TEST CIRCUIT VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
C. tPLZ and tPHZ are the same as tdis.
D. tPZL and tPZH are the same as ten.

Figure 4. Receiver Enable and Disable Times

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PARAMETER MEASUREMENT INFORMATION

ÎÎÎÎÎÎÎÎÎÎÎÎ
Valid RS-232 Level, INVALID High

ÎÎÎÎÎÎÎÎÎÎÎÎ
ROUT 2.7 V
Generator

ÎÎÎÎÎÎÎÎÎÎÎÎ
50 Ω Indeterminate
(see Note B)
0.3 V
If Signal Remains Within This Region

ÎÎÎÎÎÎÎÎÎÎÎÎ
0V For More Than 30 µs, INVALID Is Low†

ÎÎÎÎÎÎÎÎÎÎÎÎ
−0.3 V
Indeterminate

ÎÎÎÎÎÎÎÎÎÎÎÎ
Auto-
powerdown INVALID
−2.7 V
Plus CL = 30 pF
Valid RS-232 Level, INVALID High
(see Note A)

FORCEOFF † Auto-powerdown plus disables drivers and reduces

supply current to 1 µA.
DIN DOUT
FORCEON

TEST CIRCUIT

NOTES: A. CL includes probe and jig capacitance.

B. The pulse generator has the following
characteristics: PRR = 5 kbit/s, ZO = 50 Ω,
50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.

3V
Receiver 2.7 V
0V
Input 0V −2.7 V
−3 V
tinvalid

tvalid
INVALID VCC
Output 50% 50%
0V

3 V to 5 V
Driver
Input 50% 50%
0V

≈5.5 V
Driver
Output
≈ −5.5 V
tdis tdis
ten ten

V+ V+
Supply V+ −0.3 V
Voltages
V− +0.3 V
V− V−
Voltage Waveforms and Timing Diagrams

Figure 5. INVALID Propagation-Delay Times and Supply-Enabling Time

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APPLICATION INFORMATION

+
CBYPASS = 0.1 µF
− 28
1 C1+
C2+ 27
V+
+ 2 +
C2 GND C3†
− − +
C1
3 26 −
C2− VCC
4
V− 25
− C1−
C4
+
5 24
DOUT1 DIN1

6 23
DOUT2 DIN2

7 22
DOUT3 DIN3

8 21
RIN1 ROUT1

RS-232 Port
9 20
RIN2 ROUT2 Logic I/Os

5 kΩ
10 19
DOUT4 DIN4

11 18
RIN3 ROUT3

5 kΩ
12 17
DOUT5 DIN5

16
ROUT1B

5 kΩ

Auto-
13 powerdown 15
FORCEON Plus INVALID
14
FORCEOFF

VCC vs CAPACITOR VALUES

VCC C1 C2, C3, and C4

† C3 can be connected to VCC or GND.
NOTES: A. Resistor values shown are nominal. 3.3 V ± 0.15 V 0.1 µF 0.1 µF
B. Nonpolarized ceramic capacitors are acceptable. If polarized 3.3 V ± 0.3 V 0.22 µF 0.22 µF
tantalum or electrolytic capacitors are used, they should be connected 5 V ± 0.5 V 0.047 µF 0.33 µF
as shown. 3 V to 5.5 V 0.22 µF 1 µF

Figure 6. Typical Operating Circuit and Capacitor Values

10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

 PACKAGE OPTION ADDENDUM

www.ti.com 30-Nov-2022

PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)

MAX3238CDB NRND SSOP DB 28 50 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 MAX3238C

MAX3238CDBR ACTIVE SSOP DB 28 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 MAX3238C Samples

MAX3238CDBRE4 ACTIVE SSOP DB 28 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 MAX3238C Samples

MAX3238CPW NRND TSSOP PW 28 50 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 MA3238C

MAX3238CPWR ACTIVE TSSOP PW 28 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 MA3238C Samples

MAX3238IDB NRND SSOP DB 28 50 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 MAX3238I
MAX3238IDBR ACTIVE SSOP DB 28 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 MAX3238I Samples

MAX3238IPW NRND TSSOP PW 28 50 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 MB3238I
MAX3238IPWR ACTIVE TSSOP PW 28 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 MB3238I Samples

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

Addendum-Page 1
 PACKAGE OPTION ADDENDUM

www.ti.com 30-Nov-2022

(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF MAX3238 :

• Automotive : MAX3238-Q1

NOTE: Qualified Version Definitions:

• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects

Addendum-Page 2
 PACKAGE MATERIALS INFORMATION

www.ti.com 3-Jun-2022

TAPE AND REEL INFORMATION

REEL DIMENSIONS TAPE DIMENSIONS

K0 P1

B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers

Reel Width (W1)

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE

Sprocket Holes

Q1 Q2 Q1 Q2

Q3 Q4 Q3 Q4 User Direction of Feed

Pocket Quadrants

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
MAX3238CDBR SSOP DB 28 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
MAX3238CPWR TSSOP PW 28 2000 330.0 16.4 6.9 10.2 1.8 12.0 16.0 Q1
MAX3238IDBR SSOP DB 28 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
MAX3238IPWR TSSOP PW 28 2000 330.0 16.4 6.9 10.2 1.8 12.0 16.0 Q1

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 3-Jun-2022

TAPE AND REEL BOX DIMENSIONS

Width (mm)
H
W

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
MAX3238CDBR SSOP DB 28 2000 356.0 356.0 35.0
MAX3238CPWR TSSOP PW 28 2000 356.0 356.0 35.0
MAX3238IDBR SSOP DB 28 2000 356.0 356.0 35.0
MAX3238IPWR TSSOP PW 28 2000 356.0 356.0 35.0

Pack Materials-Page 2
 PACKAGE MATERIALS INFORMATION

www.ti.com 3-Jun-2022

TUBE

T - Tube
height L - Tube length

W - Tube
width

B - Alignment groove width

*All dimensions are nominal

Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm)
MAX3238CDB DB SSOP 28 50 530 10.5 4000 4.1
MAX3238CPW PW TSSOP 28 50 530 10.2 3600 3.5
MAX3238CPW PW TSSOP 28 50 530 10.2 3600 3.5
MAX3238IDB DB SSOP 28 50 530 10.5 4000 4.1
MAX3238IPW PW TSSOP 28 50 530 10.2 3600 3.5
MAX3238IPW PW TSSOP 28 50 530 10.2 3600 3.5

Pack Materials-Page 3
 PACKAGE OUTLINE
DB0028A SCALE 1.500
SSOP - 2 mm max height
SMALL OUTLINE PACKAGE

C
8.2
TYP
A 7.4
0.1 C SEATING
PIN 1 INDEX AREA
PLANE
26X 0.65
28
1

2X
10.5
8.45
9.9
NOTE 3

14
15
0.38
28X
0.22
5.6 0.15 C A B
B
5.0
NOTE 4

2 MAX
(0.15) TYP 0.25
SEE DETAIL A GAGE PLANE

0.95 0.05 MIN

0 -8 0.55

DETAIL A
A 15

TYPICAL

4214853/B 03/2018

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-150.

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 EXAMPLE BOARD LAYOUT
DB0028A SSOP - 2 mm max height
SMALL OUTLINE PACKAGE

28X (1.85) SYMM

1 (R0.05) TYP

28X (0.45) 28

26X (0.65)

SYMM

14 15

(7)

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN
SCALE: 10X

SOLDER MASK METAL UNDER SOLDER MASK

METAL
OPENING SOLDER MASK OPENING

EXPOSED METAL EXPOSED METAL

0.07 MAX 0.07 MIN

ALL AROUND ALL AROUND

NON-SOLDER MASK SOLDER MASK

DEFINED DEFINED
(PREFERRED)
SOLDER MASK DETAILS
15.000

4214853/B 03/2018
NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

www.ti.com
 EXAMPLE STENCIL DESIGN
DB0028A SSOP - 2 mm max height
SMALL OUTLINE PACKAGE

28X (1.85) SYMM

(R0.05) TYP
1
28X (0.45) 28

26X (0.65)

SYMM

14 15

(7)

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL
SCALE: 10X

4214853/B 03/2018
NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.

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