AX222

User Manual
[AX222-UM-003-EN]

Rev 0.0.3
January 2012

AppoTech Limited
Add: Unit 705-707, 7/F, IC Development Ctr, No. 6, Science Park West Ave. Hong Kong Science Park, Shatin, N.T. HK
Tel: (852) 2607 4090 Fax: (852) 2607 4096 www.appotech.com
AX222 SD/MMC/MS Card Reader
Controller

High performance SOC

USB Features
• Support USB specification v2.0
• Support USB Storage Class specification v1.0

SD Card Features
• Support SD specification v2.0
• Support SDHC card up to 32GB
• Support write protection
• Support hot plug and removal

MMC Card Features

• Support MMC specification v4.2
• Support MMC card up to 32GB
• Support hot plug and removal

MS/MSPRO Features
• Support MS specification v1.43
• Support MSPRO specification v1.03
• Support MS PRO-HG Duo specification v1.01
• Support 1/4/8 bit bus mode
• Support card up to 32GB

LED Driver IO

Dual voltage regulator

AppoTech Limited
Address :Unit 705-707, 7/F, IC Development Centre,
No.6, Science Park West Ave.,
Hong Kong Science Park,
Shatin, N.T., Hong Kong
Telephone :(852) 2607 4090
Fax :(852) 2607 4096
www.appotech.com
Preliminary Rev 0.0.3 AX222 SD/MMC/MS Card Reader Controller
USER MANUAL

1 Architecture Overview

1.1 System architecture

Figure 1-1: AX222 hardware architecture

SD / MMC SD / MMC
Controller Card

DMA
SOC Controller
MS / MSPRO MS /
Controller MSPRO
Stick

SRAM Mask ROM

USB USB
Controller PHY

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2 PIN DEFINITIONS

2.1 Pin Assignment

Test

NC
NC
NC
NC
NC
D1
D0

D3

WP
VDDIO

CMD/BS
D2

VSSIO

CLK
SDIN
MSIN
1002.15um
UVDD33T
UVDD33P

UVSS33T
UVSS33P

UVDD18

VREG33
VREG18
UVSS18

VDD50

SDV33
TCLK

LED
VSS
DM

NC
DP

1595.34um

Die Size: 1595.34um (Width) x 1002.15um (Height)

Table 2-1: Pad Coordinates

Pin No. Name X-axis (um) Y-axis(um)

1 UVDD33T 39.8 38.7

2 UVDD33P 123.8 38.7

3 DP 208.4 38.7

4 DM 292.9 38.7

5 UVSS33T 376.2 38.7

6 UVSS33P 460.5 38.7

7 UVSS18 559.9 38.7

8 UVDD18 645.7 38.7

9 TCLK 824.9 38.7

10 P1.2/LED 973.2 38.7

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11 VSS 1093.1 38.7

12 VDD50/NC 1170.5 38.7

13 VDD50 1238.4 38.7

14 VREG33 1328.1 38.7

15 VREG18 1423.3 38.7

16 SDV33 1529.0 38.7

17 P1.3/MSIN 1474.2 942.7

18 P1.4/SDIN 1385.5 942.7

19 P1.0/CLK 1295.3 942.7

20 P1.1/CMD/BS 1203.0 942.7

21 P1.6/WP 1114.8 942.7

22 P0.7/NC 1034.8 942.7

23 P0.6/NC 949.4 942.7

24 P0.5/NC 863.3 942.7

25 P0.4/NC 777.9 942.7

26 P1.7/NC 693.5 942.7

27 VSSIO 608.0 942.7

28 P0.3/D3 523.2 942.7

29 VDDIO 436.8 942.7

30 P0.2/D2 352.2 942.7

31 P0.1/D1 265.5 942.7

32 P0.0/D0 176.6 942.7

33 P1.5/Test 86.3 942.7

2.2 Pad Descriptions

Name Pad # Nature Functions

UVDD33T 1 P PHY analog power input (Double-bond with UVDD33P)

UVDD33P 2 P PHY analog power input (Double-bond with UVDD33T)

DP 3 IO USB D+

DM 4 IO USB D-

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UVSS33T 5 P PHY analog ground (Double-bond with UVSS33P)

UVSS33P 6 P PHY analog ground (Double-bond with UVSS33T)

UVSS18 7 P 1.8V Digital power ground

UVDD18 8 P 1.8V Digital power input

TCLK 9 I Test mode external clock

P1.2/LED 10 IO Port 1 pin 2 – LED0 indication or serial port

VSS 11 P Regulator ground

VDD50/NC 12 P NC

VDD50 13 P Regulator 5V power input

Regulator 3.3V power output (for external capacitor

VREG33 14 P connection)
Note: VREG33 is short-circuit with VDDIO

Regulator 1.8V power output (for external capacitor

VREG18 15 P
connection)

SDV33 16 P SD/MMC/MS card output 3.3V power

P1.3/MSIN 17 IO Port 1 pin 3 – MS card insertion indication signal

P1.4/SDIN 18 IO Port 1 pin 4 – MDC card insertion indication signal

P1.0/CLK 19 IO Port 1 pin 0 – MDC/MS clock

P1.1/CMD/BS 20 IO Port 1 pin 1 – MDC command, MS BS

P1.6/WP 21 IO Port 1 pin 6 – MDC write protect

P0.7/NC 22 IO Port 0 pin 7 – NC

P0.6/NC 23 IO Port 0 pin 6 – NC

P0.5/NC 24 IO Port 0 pin 5 – NC

P0.4/NC 25 IO Port 0 pin 4 – NC

P1.7/NC 26 IO Port 1 pin 7 – NC

VSSIO 27 P Digital ground

P0.3/D3 28 IO Port 0 pin 3 – MDC/MS data 3

VDDIO 29 P Digital I/O 3.3V power input

P0.2/D2 30 IO Port 0 pin 2 – MDC/MS data 2

P0.1/D1 31 IO Port 0 pin 1 – MDC/MS data 1

P0.0/D0 32 IO Port 0 pin 0 – MDC/MS data 0

P1.5/Test 33 IO Port 1 pin 5 – Test Pin

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USER MANUAL

3 DIE SCHEMATICS

3.1 SD/MMC/MS 4-bit Mode

Figure 3-1: Valid pads for SD/MMC/MS 4-bit mode

NC
NC
NC
NC
NC
Test

D1
D0

D3

WP
VDDIO

CMD/BS
D2

VSSIO

CLK
SDIN
MSIN
UVDD33T
UVDD33P

UVSS33T
UVSS33P

UVDD18

VREG33
VREG18
UVSS18

VDD50

SDV33
TCLK

LED
VSS
DM

NC
DP

Note: Only highlighted pads are valid.

Figure 3-2: Bonding Diagram for 4-bit Mode (SD/MMC/MS Card)

Notes :
1.If MS Card is used ,
MSIN must be bonded .
2.If LED is used ,
Test

NC
NC
NC
NC
NC
D1

WP
D0

D3
VDDIO
D2

VSSIO

CLK
SDIN
MSIN
CMD/BS

LED must be bonded .

UVDD33T
UVDD33P

UVSS33T
UVSS33P

UVDD18

VREG33
VREG18
UVSS18

VDD50

SDV33
TCLK

LED
VSS
DM

NC
DP

4 bit mode

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Figure 3-3: Schematic for SD/MMC/MS 4-bit mode

Note:
1. Choose R1, C1, C3 and C4 according to your needs. Lower value can minimize cost, while a higher value can
provide stability.
2. Place C3 close to pin 2, and C4 close to pin 11. Routing for 3.3V and 1.8V should be as short as possible.
3. NC = Not Connected.

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3.2 Electrical Characteristics

Table 3-1: Absolute maximum ratings

Symbol Descriptions Min Typ Max Units Conditions
Electrical Discharge
VESD - Passed 8k - V
Voltage
o
TSTOR Storage Temperature -40 - 125 C
o
TAMB Ambient Temperature 0 - 70 C

Table 3-2: Electrical Characteristics (Standard testing condition at 25 oC)

Symbol Descriptions Min Typ Max Units Conditions
USBVDD USB supply voltage 4.5 5 5.5 V

IDD Operating current - 56 - mA No cards inserted

Operating current at
ISUP - 0.37 - mA No cards inserted
suspend mode

Operating current with SD No read/write

ISDIDLE - 62 - mA
card inserted operation

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Table 3-3: Oscillator Characteristics (Standard testing condition at 25 oC)

Symbol Descriptions Conditions Min Typ Max Units
FDT MCLK Frequency Data transaction mode - - 48 MHz

FID MCLK Frequency Identification mode - - 235 KHz

TSET COMMAND/DAT setup time 6 - - ns

THOLD COMMAND/DAT hold time 3 - - ns

COMMAND/DAT output Data transaction mode - - 14 ns

TDELAY
delay time Identification mode - - 50 ns

Figure 3-4: Timing diagram for SD/MMC normal speed read/write operation

Figure 3-5: Timing diagram for SD/MMC high speed read/write operation

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4 Ordering Code

Part No – S S S
Packing: T = Tray form

Package: DE6 = Bare DIE, thickness 11mil

Device Option: NNN = No device option

Device: AX222

Ordering Code Brief Description

AX222-NNNDE6T Bare 11mil

Please contact sales office ([email protected]) for ordering procedures.

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5 Appendix I Revision History

Date Version Comment Revised by

2010-12-07 0.0.1 1. Change Format Rimsky Cheng

2. Rename to AX222

2010-08-11 0.0.2 1. Add ordering code Erica Cheong

2012-01-18 0.0.3 1. Update logo Karen Keung

The information in this document is believed to be accurate in all respects at the time of publication but is
subject to change without notice. AppoTech assumes no responsibility for errors and omissions, and
disclaims responsibility for any consequences resulting from the use of information included herein.
Additionally, AppoTech assumes no responsibility for the functioning of undescribed features or
parameters. AppoTech reserves the right to make changes without further notice. AppoTech makes no
warranty, representation or guarantee regarding the suitability of its products for any particular purpose,
nor does AppoTech assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages.
AppoTech products are not designed, intended, or authorized for use in applications intended to support or
sustain life, or for any other application in which the failure of the AppoTech product could create a
situation where personal injury or death may occur. Should Buyer purchase or use AppoTech products for
any such unintended or unauthorized application, Buyer shall indemnify and hold AppoTech harmless
against all claims and damages.
In case of any questions or comments about this documentation, please feel free to contact AppoTech at
[email protected] .

12 © 2010 AppoTech Ltd