LE910Cx

Hardware Design Guide

1VV0301298 Rev. 41 – 2023-10-06

Telit Technical Documentation

 LE910Cx Hardware Design Guide

APPLICABILITY TABLE
This documentation applies to the following products:

PRODUCTS DESCRIPTION

LE910C1-NA North America – AT&T with global roaming

LE910C1-NAD North America – AT&T with global roaming and Data only

LE910C1-NS North America - Sprint variant

LE910C1-AP APAC variant CAT1 variant

LE910C4-AP APAC variant CAT4 variant

LE910C1-APX APAC variant CAT1 variant

LE910C4-EU Europe CAT4 variant

LE910C1-EU Europe CAT1 variant

LE910C1-EUX Europe CAT1 variant

LE910C4-NF North America CAT4 variant

LE910C4-NFD North America CAT4 variant and Data only

LE910C1-NF North America CAT1 variant

LE910C1-NFD North America CAT1 variant and Data only

LE910C1-SA North America CAT1 variant – AT&T

LE910C1-SAD North America CAT1 variant – AT&T and Data only

LE910C1-SAX North America CAT1 variant – AT&T

LE910C1-SAXD North America CAT1 variant – AT&T and Data only

LE910C1-ST North America CAT1 variant – T Mobile

LE910C1-SV North America CAT1 variant – Verizon

LE910C1-SVX North America CAT1 variant – Verizon

LE910C1-LA Latin America CAT1 variant

LE910C4-LA Latin America CAT4 variant

LE910C4-CN China CAT4 variant

LE910C1-WWX Worldwide CAT1 variant

LE910C4-WWX Worldwide CAT4 variant

LE910C1-WWXD Worldwide CAT1 variant and Data only

LE910C4-WWXD Worldwide CAT4 variant and Data only

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PRODUCTS DESCRIPTION

LE910C1-SNX North America CAT1 variant

LE910C1-SNXD North America CAT1 variant and Data only

Table 1: Applicability table

Note: ‘X’ means ThreadX OS in LE910C1-EUX, LE910C1-SAX(D),

LE910C1-SVX, LE910Cx-WWX(D), LE910C1-APX and LE910C1-
SNX(D). The other models which don’t have the letter ‘X’ are Linux
OS.

Note: Data only variants share the same HW of related voice variants
and the voice features are disabled by SW.

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CONTENTS
APPLICABILITY TABLE 2

CONTENTS 4

1. INTRODUCTION 10
Scope 10
Audience 10
Contact Information, Support 10
Symbol Conventions 11
Related Documents 11

2. GENERAL PRODUCT DESCRIPTION 13

Overview 13
Applications 14
General Functionality and Main Features 14
Block Diagram 16
Environmental Requirements 18
2.5.1. Temperature Range 18
2.5.2. RoHS Compliance 18
Operating Frequency Bands 18
2.6.1. RF Bands per Regional Variant 18
2.6.2. Reference Table of RF Bands Characteristics 20
RF Parameters 23
2.7.1. Sensitivity 23
2.7.2. Output power 24
Mechanical Specifications 25
2.8.1. Dimensions 25
2.8.2. Weight 25

3. MODULE CONNECTIONS 26
Pin-out 26
Signals That Must Be Connected 34
LGA Pads Layout 35
Backward Compatibility to xE910 Family 35

4. ELECTRICAL SPECIFICATIONS 37

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Absolute Maximum Ratings – Not Operational 37

Recommended Operating Conditions 37
Logic Level Specifications 38
4.3.1. 1.8V Pads - Absolute Maximum Ratings 38
4.3.2. 1.8V Standard GPIOs 38
4.3.3. 1.8V SD Card Pads 39
4.3.4. 1.8V SIM Card Pads 39
4.3.5. Dual Voltage Pads - Absolute Maximum Ratings 40
4.3.6. SD Card Pads @ 2.95V 40
4.3.7. SIM Card Pads @2.95V 40

5. HARDWARE COMMANDS 42
Turning on the LE910Cx Module 42
Initialization and Activation State 42
Turning off the LE910Cx Module 46
5.3.1. Shutdown by Software Command 47
5.3.2. Hardware Shutdown 48
5.3.3. Unconditional Hardware Shutdown 48
Powering OFF the Module 50
Fast Power Down 50
5.5.1. Fast Shut Down by Hardware 50
5.5.2. Fast Shut Down by Software 53

6. POWER SUPPLY 54
Power Supply Requirements 54
Power Consumption 54
General Design Rules 56
6.3.1. Electrical Design Guidelines 57
6.3.1.1. + 5V Input Source Power Supply – Design Guidelines 57
6.3.1.2. + 12V Input Source Power Supply – Design Guidelines 58
6.3.1.3. Battery Source Power Supply – Design Guidelines 59
6.3.2. Thermal Design Guidelines 60
6.3.3. Power Supply PCB Layout Guidelines 61

7. ANTENNA(S) 63
GSM/WCDMA/TD-SCDMA/LTE Antenna Requirements 63

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GSM/WCDMA/TD-SCDMA/LTE Antenna – PCB Line Guidelines 64

GSM/WCDMA/LTE Antenna – Installation Guidelines 65
Antenna Diversity Requirements 65
GNSS Antenna Requirements 66
7.5.1. Combined GNSS Antenna 67
7.5.2. Linear and Patch GNSS Antenna 67
7.5.3. Front End Design Considerations 67
7.5.4. GNSS Antenna – PCB Line Guidelines 68
7.5.5. GNSS Antenna – Installation Guidelines 68

8. HARDWARE INTERFACES 69
USB Port 69
HSIC Interface (Optional) 71
SGMII Interface 71
8.3.1. Ethernet Control interface 71
Serial Ports 72
8.4.1. Modem Serial Port 1 Signals 72
8.4.2. Modem Serial Port 2 74
8.4.3. RS232 Level Translation 75
Peripheral Ports 76
8.5.1. SPI – Serial Peripheral Interface 76
8.5.2. I2C - Inter-integrated Circuit 77
8.5.3. SD/MMC Card Interface 78
8.5.4. WiFi SDIO Interface 79
Audio Interface 80
8.6.1. Digital Audio 80
8.6.1.1. Short Frame Timing Diagrams 82
8.6.1.2. Long Frame Timing Diagrams 83
8.6.1.3. I2S Digital Audio Diagram 85
General Purpose I/O 86
8.7.1. Using a GPIO Pad as Input 88
8.7.2. Using a GPIO Pad as an interrupt / Wakeup source 89
8.7.3. Using a GPIO Pad as Output 89

9. MISCELLANEOUS FUNCTIONS 90
Indication of Network Service Availability 90
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Indication of Software Ready 91

RTC – Real Time Clock 91
VAUX Power Output 91
ADC Converter 91
9.5.1. Description 91
9.5.2. Using the ADC Converter 92
Using the Temperature Monitor Function 92
GNSS Characteristics 92

10. MOUNTING THE MODULE ON YOUR BOARD 94

General 94
Finishing & Dimensions 94
Recommended Footprint for the Application 100
Stencil 104
PCB Pad Design 104
Recommendations for PCB Pad Dimensions (mm) 104
Solder Paste 105
10.7.1. Solder Reflow 105
10.7.2. Cleaning 106

11. APPLICATION GUIDE 108

Debug of the LE910Cx Module in Production 108
Bypass Capacitor on Power Supplies 108
SIM Interface 109
11.3.1. SIM Schematic Example 109
EMC Recommendations 110
Download and Debug Port 110
11.5.1. Recovery Boot Mode 111

12. PACKING SYSTEM 112

Packing System – Tray 112
Tape & Reel 115
Moisture Sensitivity 120

13. CONFORMITY ASSESSMENT ISSUES 121

Approvals Compliance Summary 121

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APAC Approvals 123

13.2.1. Australia RCM 123
13.2.2. Japan JRL/JTBL Regulatory Notices 123
13.2.3. Taiwan NCC Regulatory Notices 123
EMEA Approvals 124
13.3.1. EU RED Declaration of Conformity 124
13.3.1.1. RED Antennas 124
13.3.2. UK UKCA Declaration of Conformity 125
Americas Approvals 125
13.4.1. USA FCC Approval 125
13.4.1.1. FCC Certificates 125
13.4.1.2. Applicable FCC Rules 126
13.4.1.3. FCC Regulatory Notices 126
13.4.1.4. FCC Antenna info 128
Canada ISED Approval 130
13.5.1.1. ISED Database 130
13.5.1.2. Applicable ISED Rules 130
13.5.1.3. ISED Regulatory Notices 131
Brazil ANATEL Regulatory Notices 134
Bolivia ATT Regulatory Notices 135
PERU MTC Regulatory Notices 135
Colombia CRC Regulatory Notices 135
Paraguay CONATEL Regulatory Notices 135
Argentina RAMATEL Regulatory Notices (former ENACOM)136

14. PRODUCT AND SAFETY INFORMATION 137

Copyrights and Other Notices 137
14.1.1. Copyrights 137
14.1.2. Computer Software Copyrights 137
Usage and Disclosure Restrictions 138
14.2.1. License Agreements 138
14.2.2. Copyrighted Materials 138
14.2.3. High Risk Materials 138
14.2.4. Trademarks 138
14.2.5. 3rd Party Rights 139

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14.2.6. Waiver of Liability 139

Safety Recommendations 139

15. GLOSSARY 141

16. DOCUMENT HISTORY 142

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1. INTRODUCTION

Scope
This document introduces the Telit LE910Cx module and presents possible and
recommended hardware solutions for the development of a product based on this
module. All the features and solutions described in this document are applicable to all
LE910Cx variants listed in the applicability table.
If a specific feature is applicable to a specific product only, it will be clearly marked.

Note: LE910Cx refers to all modules listed in the Applicability Table.

This document takes into account all the basic functions of a wireless module; it suggests
a valid hardware solution for each function and points out incorrect solutions and
common errors to be avoided.

This document cannot include every hardware solution or every product that can be
designed. Avoiding invalid solutions must be considered mandatory. Where the
suggested hardware configurations are not be considered mandatory, the information
provided should be used as a guide and a starting point for the proper development of
the product with the Telit LE910Cx module.

Note: The integration of the GSM/GPRS/EGPRS/WCDMA/HSPA+/LTE

LE910Cx cellular module within a user application must be done
according to the design rules described in this manual.

Audience
This document is intended for Telit customers, especially system integrators, about to
implement their applications using the Telit LE910Cx module.

Contact Information, Support

For general contact, technical support services, technical questions and report
documentation errors, contact Telit Technical Support at:

 [email protected]
 [email protected]
 [email protected]

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Alternatively, use:
https://www.telit.com/support
For detailed information about where you can buy the Telit modules or for
recommendations on accessories and components visit:
https://www.telit.com
To register for product news and announcements or for product questions contact Telit’s
Technical Support Center (TTSC).

Our aim is to make this guide as helpful as possible. Keep us informed of your comments
and suggestions for improvements.
Telit appreciates feedback from the users of on information.

Symbol Conventions
The following conventions are used to emphasize specific types of information:

Danger: This information MUST be followed or catastrophic

equipment failure or personal injury may occur.

Warning: Alerts the user on important steps about the module

integration.

Note/Tip: Provides advice and suggestions that may be useful when

integrating the module.

Electro-static Discharge: Notifies the user to take proper grounding

precautions before handling the product.

All dates are in ISO 8601 format, that is YYYY-MM-DD.

Related Documents
 LE920x4/LE910Cx AT Command User Guide 80490ST10778A

 Telit EVB HW User Guide 1VV0301249

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 LE910Cx Interface Board HW User Guide 1VV0301323

 LE910/LE920 Digital Voice Interface Application Note 80000NT11246A

 Telit_LE920A4_LE910Cx_Wi-Fi_Interface_Application_Note_r1 80490NT11511A

 Antenna Detection Application Note 80000NT10002A

 High-Speed Inter-Chip USB Electrical Specification, version 1.0 (a supplement to
the USB 2.0 specification, Section 3.8.2)
 ETH_Expansion_board_Application Note 80490NT11622A
 LE910C1/LE910C4 PSM Application Note, 80502NT11758A

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2. GENERAL PRODUCT DESCRIPTION

Overview
LE910Cx is Telit’s new LTE series for IoT applications.
In its most basic use case, the LE910Cx can be applied as a wireless communication
front-end for telematics products, offering GNSS and mobile communication features to
an external host CPU through its rich interfaces.
LE910Cx is available in hardware variants as listed in Table 1: Applicability Table. For
differences in the designated RF band sets – refer to Section 2.6.1, RF Bands per Regional
Variant.

Note:

(EN) The integration of the LE910Cx cellular module within user

application shall be done according to the design rules described in this
manual.

(IT) L’integrazione del modulo cellulare LE910Cx all’interno

dell’applicazione dell’utente dovrà rispettare le indicazioni progettuali
descritte in questo manuale.

(DE) Die Integration des LE910Cx Mobilfunk-Moduls in ein Gerät muß

gemäß der in diesem Dokument beschriebenen Kunstruktionsregeln
erfolgen.

(SL) Integracija LE910Cx modula v uporabniški aplikaciji bo morala

upoštevati projektna navodila, opisana v tem priročniku.

(SP) La utilización del modulo LE910Cx debe ser conforme a los usos
para los cuales ha sido deseñado descritos en este manual del usuario.
(FR) L’intégration du module cellulaire LE910Cx dans l’application de
l’utilisateur sera faite selon les règles de conception décrites dans ce
manuel.

(HE)

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The information presented in this document is believed to be accurate and reliable.

However, no responsibility is assumed by Telit Communications S.p.A. for its use, nor any
infringement of patents or other rights of third parties which may result from its use. No
license is granted implicitly or in any other way under any patent rights of Telit
Communications S.p.A. except for circuitry embodied in Telit products. This document is
subject to change without notice.

Applications
LE910Cx can be used for telematics applications where tamper-resistance,
confidentiality, integrity, and authenticity of end-user information are required, for
example:

 Telematics services

 Road pricing
 Pay-as-you-drive insurance

 Stolen vehicles tracking

 Internet connectivity

General Functionality and Main Features

The LE910Cx series of cellular modules features an LTE and multi-RAT modem together
with a powerful on-chip application processor and a rich set of interfaces.

The major functions and features are listed below:

Function Features

Modem Multi-RAT cellular modem for voice and data communication

LTE FDD Cat1 and Cat4 (10/5Mbps DL/UL at cat1, 150/50Mbps DL/UL at
cat4).
Carrier aggregation is not supported
GSM/GPRS/EDGE
WCDMA up to DC HSPA+, Rel.9
Support for SIM profile switching
Regional variants with optimal choice of RF bands for worldwide coverage
of countries and MNOs
State-of-the-art GNSS solution with GPS/GLONASS/BeiDou/Galileo/QZSS
receiver

Digital audio subsystem PCM/I2S digital audio interface

Up to 48 kHz sample rate, 16-bit words

Two USIM ports – dual Class B and Class C support

voltage Hot swap support
Clock rates up to 5 MHz

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Function Features

Application processor Application processor to run customer application code

32-bit ARM Cortex-A7 up to 1.3 GHz running the Linux operating system
Flash + DDR are large enough to allow for customer’s own software
applications

Interfaces Rich set of interfaces, including:

SD/MMC Card Interface supporting SD3.0 standard
SDIO for external WiFi transceiver supporting SDIO3.0 standard
SGMII for external Ethernet transceiver
Compliant with IEEE802.3
Full duplex operation at 1 Gbps
Half/full duplex operation at 10/100 Mbps
Support for VLAN tagging
Support for IEEE1588, PTP (Precision Time Protocol)
USB2.0 – USB port is typically used for:
Flashing of firmware and module configuration
Production testing
Accessing the Application Processor’s file system
AT command access
High-speed WWAN access to external host
Diagnostic monitoring and debugging
NMEA data to an external host CPU
HSIC (Optional)
High-speed 480 Mbps (240 MHz DDR) USB transfers are 100% host driver
compatible with traditional USB cable connected topologies
Bidirectional data strobe signal (STROBE)
Bidirectional data signal (DATA)
No power consumption unless a transfer is in progress
Maximum trace length 10 cm
Signals driven at 1.2V standard LVCMOS levels
Peripheral Ports – SPI, I2C, UART
GPIOs
Antenna ports

Form factor Form factor (28x28mm), accommodating the multiple RF bands in each
region variant

Environment and quality The entire module is designed and qualified by Telit for satisfying the
requirements environment and quality requirements.

Single supply module The module generates all its internal supply voltages.

RTC No dedicated RTC supply, RTC is supplied by VBATT

Operating temperature Range -40 °C to +85 °C (conditions as defined in Section 2.5.1,

Temperature Range).
Table 2: Features Table

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Note: The following interfaces are unique to the LE910Cx and may
not be supported on other (former or future) xE910 family. Special
care must be paid when designing the application board if future
compatibility is required:
- SGMII for Ethernet connectivity

- SDIO for WIFI connectivity

- SD/MMC for SD Card connectivity

Warning: LE910C1-EUX, LE910C1-SAX(D), LE910C1-SVX, LE910Cx-

WWX(D) and LE910C1-APX models which are based on ThreadX OS,
does not support the following functions.

 Fastboot

 Wi-Fi / BT
 SD / MMC

 HSIC
 SGMII

 RNDIS over the USB

 NMEA over the USB

 USB Audio

 USB OTG
 Audio playback

 Audio playback during voice call

 Full duplex voice conversation recording (Voice Recording)

 In call music delivery

 AUX PCM interface

 TTY

Block Diagram
Figure 1 shows an overview of the internal architecture of the LE910Cx module.

It includes the following sub-functions:

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 Application processor, Modem subsystem and Location processing with their

external interfaces. These three functions are contained in a single SOC.

 RF front end and antenna ports.

 Digital Audio interface for external codec.

 Rich IO interfaces. Depending on the LE910Cx software features enabled, some of
its interfaces exported due to multiplexing may be used internally and therefore
may not be usable by the application.
 PMIC with the RTC function inside

MEMORIES

GNSS_Sync

SIM
PCM In/out
GNSS Antennna LOCATION
VBATT_PA
MODEM
Cellular antenna 1
RF
FRONTEND Cellular antenna 2

VBATT
APPLICATION PMIC
ADC
PROCESSOR RTC

JTAG I2C HSIC SPI SGMII USB2.0

UART GPIO 2xSDIO

Figure 1: LE910Cx Block Diagram

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Environmental Requirements

2.5.1. Temperature Range

Mode Temperature Note

Operating temperature range -40 ~ +85°C Ambient. Ambient

Temperatures outside of
the range –20°C ÷ +55°C
might slightly deviate
from ETSI specifications.
The module is fully
functional, able to make
and receive voice calls,
data calls, SMS and
GPRS traffic.

–20°C ÷ +55°C Temperatures outside of

this range might slightly
deviate from ETSI
specifications

Storage and non-operating temperature range –40°C ~ +90°C

Table 3: Temperature Range

2.5.2. RoHS Compliance

As a part of the Telit corporate policy of environmental protection, the LE910Cx complies
with the RoHS (Restriction of Hazardous Substances) directive of the European Union (EU
directive 2011/65/EU).

Operating Frequency Bands

The operating frequencies in GSM850, EGSM900, DCS1800, PCS1900, WCDMA & LTE
modes conform to the 3GPP specifications.

2.6.1. RF Bands per Regional Variant

Table 4 summarizes all region variants within the LE910Cx family, showing the supported
band sets in each variant.

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LTE TD-
Region Variant 2G HSPA+ LTE FDD
TDD SCDMA

LE910C1-NA 2, 3, 5, 8 1, 2, 4, 5, 8 2, 4, 12 - -

LE910C1-NAD 2, 3, 5, 8 1, 2, 4, 5, 8 2, 4, 12 - -

LE910C1-NS - - 2, 4, 5, 12, 25, 26 - -

LE910C1-AP - 1, 5, 6, 8, 19 1, 3, 5, 8, 9, 18, 19, 26, 28 - -

LE910C4-AP - 1, 5, 6, 8, 19 1, 3, 5, 8, 9, 18, 19, 26, 28 - -

LE910C1-APX - - 1, 3, 5, 8, 18, 19, 26, 28 - -

LE910C4-EU 3, 8 1, 3, 8 1, 3, 7, 8, 20, 28A - -

LE910C1-EU 3, 8 1, 3, 8 1, 3, 7, 8, 20, 28A - -

LE910C1-EUX 3, 8 1, 3, 8 1, 3, 7, 8, 20, 28A - -

LE910C4-NF - 2, 4, 5 2, 4, 5, 12, 13, 14, 66, 71 - -

LE910C4-NFD - 2, 4, 5 2, 4, 5, 12, 13, 14, 66, 71 - -

LE910C1-NF - 2, 4, 5 2, 4, 5, 12, 13, 14, 66, 71 - -

LE910C1-NFD - 2, 4, 5 2, 4, 5, 12, 13, 14, 66, 71 - -

LE910C1-SA - - 2, 4, 12, 14, 66 - -

LE910C1-SAD - - 2, 4, 12, 14, 66 - -

LE910C1-SAX - - 2, 4, 12, 66 - -

LE910C1-SAXD - - 2, 4, 12, 66 - -

LE910C1-ST - - 2, 4, 12, 66, 71 - -

LE910C1-SV - - 4, 13 - -

LE910C1-SVX - - 4, 13 - -

LE910C1-LA 2, 3, 5, 8 1, 2, 4, 5 1, 2, 3, 4, 5, 7, 28 - -

LE910C4-LA 2, 3, 5, 8 1, 2, 4, 5 1, 2, 3, 4, 5, 7, 28 - -

LE910C4-CN 3, 8 1, 8 1, 3, 5, 8 38, 39, 34,39

40, 41

LE910C1-WWX 2, 3, 5, 8 1, 2, 4, 5, 6, 8, 19 1, 2, 3, 4, 5, 7, 8, 9, 12, 13, 14, 18, - -

19, 20, 25, 26, 28

LE910C4-WWX 2, 3, 5, 8 1, 2, 4, 5, 6, 8, 19 1, 2, 3, 4, 5, 7, 8, 9, 12, 13, 14, 18, - -

19, 20, 25, 26, 28

LE910C1-WWXD 2, 3, 5, 8 1, 2, 4, 5, 6, 8, 19 1, 2, 3, 4, 5, 7, 8, 9, 12, 13, 14, 18, - -

19, 20, 25, 26, 28

LE910C4-WWXD 2, 3, 5, 8 1, 2, 4, 5, 6, 8, 19 1, 2, 3, 4, 5, 7, 8, 9, 12, 13, 14, 18, - -

19, 20, 25, 26, 28

LE910C1-SNX - - 2, 4, 5, 12, 13, 66 - -

LE910C1-SNXD - - 2, 4, 5, 12, 13, 66 - -

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Table 4: RF Bands per Regional Variant

2.6.2. Reference Table of RF Bands Characteristics

Mode Freq. Tx (MHz) Freq. Rx (MHz) Channels Tx-Rx Offset

PCS 1900 1850.2 ~ 1909.8 1930.2 ~ 1989.8 512 ~ 810 80 MHz

DCS 1800 1710 ~ 1785 1805 ~ 1880 512 ~ 885 95 MHz

GSM 850 824.2 ~ 848.8 869.2 ~ 893.8 128 ~ 251 45 MHz

890 ~ 915 935 ~ 960 0 ~ 124 45 MHz

EGSM 900
880 ~ 890 925 ~ 935 975 ~ 1023 45 MHz

Tx: 9612 ~ 9888

WCDMA 2100 – B1 1920 ~ 1980 2110 ~ 2170 190 MHz
Rx: 10562 ~ 10838

Tx: 9262 ~ 9538

WCDMA 1900 – B2 1850 ~ 1910 1930 ~ 1990 80 MHz
Rx: 9662 ~ 9938

Tx: 937 ~ 1288

WCDMA 1800 – B3 1710 ~ 1785 1805 ~ 1880 95 MHz
Rx: 1162 ~ 1513

Tx: 1312 ~ 1513

WCDMA AWS – B4 1710 ~ 1755 2110 ~ 2155 400 MHz
Rx: 1537 ~ 1738

Tx: 4132 ~ 4233

WCDMA 850 – B5 824 ~ 849 869 ~ 894 45 MHz
Rx: 4357 ~ 4458

Tx: 2712 ~ 2863

WCDMA 900 – B8 880 ~ 915 925 ~ 960 45 MHz
Rx: 2937 ~ 3088

Tx: 8762 ~ 8912

WCDMA 1800 – B9 1750 ~ 1784.8 1845 ~ 1879.8 95 MHz
Rx: 9237 ~ 9387

Tx: 312 ~ 363

WCDMA 800 – B19 830 ~ 845 875 ~ 890 45 MHz
Rx: 712 ~ 763

TDS CDMA 2000 – Tx: 10054 ~ 10121

2010 ~ 2025 2010 ~ 2025 0 MHz
B34 Rx: 10054 ~ 10121

TDS CDMA 1900 – Tx: 9404 ~ 9596

1880 ~ 1920 1880 ~ 1920 0 MHz
B39 Rx: 9404 ~ 9596

Tx: 18000 ~ 18599

LTE 2100 – B1 1920 ~ 1980 2110 ~ 2170 190 MHz
Rx: 0 ~ 599

Tx: 18600 ~ 19199

LTE 1900 – B2 1850 ~ 1910 1930 ~ 1990 80 MHz
Rx: 600 ~ 1199

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Mode Freq. Tx (MHz) Freq. Rx (MHz) Channels Tx-Rx Offset

Tx: 19200 ~ 19949

LTE 1800 – B3 1710 ~ 1785 1805 ~ 1880 95 MHz
Rx: 1200 ~ 1949

Tx: 19950 ~ 20399

LTE AWS – B4 1710 ~ 1755 2110 ~ 2155 400 MHz
Rx: 1950 ~ 2399

Tx: 20400 ~ 20649

LTE 850 – B5 824 ~ 849 869 ~ 894 45 MHz
Rx: 2400 ~ 2649

Tx: 20750 ~ 21449

LTE 2600 – B7 2500 ~ 2570 2620 ~ 2690 120 MHz
Rx: 2750 ~ 3449

Tx: 21450 ~ 21799

LTE 900 – B8 880 ~ 915 925 ~ 960 45 MHz
Rx: 3450 ~ 3799

Tx: 21800 ~ 2149

LTE 1800 – B9 1749.9 ~ 1784.9 1844.9 ~ 1879.9 95 MHz
Rx: 3800 ~ 4149

Tx: 22150 ~ 22749

LTE AWS+ – B10 1710 ~ 1770 2110 ~ 2170 400 MHz
Rx: 4150 ~ 4749

Tx: 23010 ~ 23179

LTE 700a – B12 699 ~ 716 729 ~ 746 30 MHz
Rx: 5010 ~ 5179

Tx: 23180 ~ 23279

LTE 700c – B13 777 ~ 787 746 ~ 756 -31 MHz
Rx: 5180 ~ 5279

Tx: 23280 ~ 23379

LTE 700PS – B14 788 ~ 798 758 ~ 768 -30 MHz
Rx: 5280 ~ 5379

Tx: 23730 ~ 23849

LTE 700b – B17 704 ~ 716 734 ~ 746 30 MHz
Rx: 5730 ~ 5849

Tx: 24000 ~ 24149

LTE 800 – B19 830 ~ 845 875 ~ 890 45 MHz
Rx: 6000 ~ 6149

Tx: 24150 ~ 24449

LTE 800 – B20 832 ~ 862 791 ~ 821 -41 MHz
Rx: 6150 ~ 6449

Tx: 24450 ~ 24599

LTE 1500 – B21 1447.9 ~ 1462.9 1495.9 ~ 1510.9 48 MHz
Rx: 6450 ~ 6599

Tx: 26040 ~ 26689

LTE 1900+ – B25 1850 ~ 1915 1930 ~ 1995 80 MHz
Rx: 8040 ~ 8689

Tx: 26690 ~ 27039

LTE 850+ – B26 814 ~ 849 859 ~ 894 45 MHz
Rx: 8690 ~ 9039

Tx: 27210 ~ 27510

LTE 700 – B28A 703 ~ 733 758 ~ 788 55 MHz
Rx: 9210 ~ 9510

Tx: 27210 ~ 27659

LTE 700 – B28 703 ~ 748 758 ~ 803 55 MHz
Rx: 9210 ~ 9659

Tx: 131972-132671
LTE AWS-3 – B66 1710 ~ 1780 2210 ~ 2200 400 MHz
Rx: 66436-67335

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Mode Freq. Tx (MHz) Freq. Rx (MHz) Channels Tx-Rx Offset

Tx: 133122-133471
LTE600 – B71 663 ~ 698 617 ~ 652 46 MHz
Rx: 68568-68935

Tx: 37750 ~ 38250

LTE TDD 2600 – B38 2570 ~ 2620 2570 ~ 2620 0 MHz
Rx: 37750 ~ 38250

Tx: 38250 ~ 38650

LTE TDD 1900 – B39 1880 ~ 1920 1880 ~ 1920 0 MHz
Rx: 38250 ~ 38650

Tx: 38650 ~ 39650

LTE TDD 2300 – B40 2300 ~ 2400 2300 ~ 2400 0 MHz
Rx: 38650 ~ 39650

LTE TDD 2500 – Tx: 40265 ~ 41215

2555 ~ 2655 2555 ~ 2655 0 MHz
B41M Rx: 40265 ~ 41215

Table 5: RF Bands Characteristics

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RF Parameters

2.7.1. Sensitivity
Typical sensitivity levels are as follows:

Mode Primary Diversity SIMO 3GPP

PCS 1900 -107.5 - - -102

DCS 1800 -107.0 - - -102

GSM 850 -108.5 - - -102

EGSM 900 -107.5 - - -102

WCDMA 2100 – B1 -109.0 -110.0 -111.5 -106.7

WCDMA 1900 – B2 -109.5 -110.5 -112 -104.7

WCDMA 1800 – B3 -107.5 -109.5 -109.5 -103.7

WCDMA AWS – B4 -109.5 -110.0 -112 -106.7

WCDMA 850 – B5 -110.0 -111.0 -112.5 -104.7

WCDMA 850 – B6 -110.0 -111.0 -112.5 -106.7

WCDMA 850 – B19 -110.0 -111.0 -112.5 -106.7

WCDMA 900 – B8 -109.5 -110.5 -112 -103.7

TDS CDMA 2000 – B34 -110.0 - - -105

TDS CDMA 1900 – B39 -110.0 - - -105

LTE 2100 – B1 -98.0 -98.5 -100.5 -96.3

LTE 1900 – B2 -97.0 -99.0 -99 -94.3

LTE 1800 – B3 -97.5 -99.5 -99.5 -93.3

LTE AWS – B4 -98.0 -99.0 -100.5 -96.3

LTE 850 – B5 -99.0 -100.5 -101.5 -94.3

LTE 2600 – B7 -97.5 -97.5 -99.5 -94.3

LTE 900 – B8 -98.5 -99.5 -101 -93.3

LTE 1800 – B9 -98.0 -99.0 -100.5 -95.3

LTE 700a – B12 -98.5 -99.5 -101 -93.3

LTE 700c – B13 -98.5 -99.5 -101 -93.3

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Mode Primary Diversity SIMO 3GPP

LTE 700PS – B14 -98.0 -99.5 -100.5 -93.3

LTE 700b – B18 -99.0 -100.0 -101.5 -96.3

LTE 800 – B19 -99.0 -99.5 -101.5 -96.3

LTE 800 – B20 -99.0 -99.0 -101.5 -93.3

LTE 1900+ – B25 -96.5 -98.5 -98.5 -92.8

LTE 850+ – B26 -99.0 -100.0 -101.5 -93.8

LTE 700 – B28A/B -98.5 -100.5 -101.5 -94.8

LTE AWS-3 – B66 -98.0 -99.0 -100.5 -95.8

LTE600 – B71 -98.0 -97.5 -100.5 -93.5

LTE TDD 2600 – B38 -98.0 -98.5 -100.5 -96.3

LTE TDD 1900 – B39 -98.5 -99.5 -101 -96.3

LTE TDD 2300 – B40 -97.0 -98.5 -99.5 -96.3

LTE TDD 2500 – B41M -97.0 -98.0 -99.5 -94.3

Table 6: sensitivity levels

Note: The sensitivity level has a deviation about +/- <2dB each model,
device and channel because the level shows typical value.
LTE level is measured at BW 10M

2.7.2. Output power

Typical values for Max output level are as follow:

 2G (GSM):
LB: Class 4(2W, 33dBm)
Class E2(0.5W,27dBm@EDGE)

HB: Class 1(1W, 30Bm)

Class E2(0.4W, 26dBm@EDGE)

 3G (WCDMA): Class 3(0.25W, 24dBm)

 TD-SCDMA: Class 3(0.13W, 21dBm)

 4G (FDD & TDD): Class 3(0.2W, 23dBm@1RB)

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Mechanical Specifications

2.8.1. Dimensions
The module’s overall dimensions are:

 Length: 28.2 mm, +/- 0.15 mm tolerance

 Width: 28.2 mm, +/- 0.15 mm tolerance

 Thickness: 2.2 mm, +/- 0.15 mm tolerance and

The LE910Cx-WWX module’s overall dimensions are:

 Length: 29.4 mm, +/- 0.15 mm tolerance
 Width: 29.4 mm, +/- 0.15 mm tolerance

 Thickness: 2.2 mm, +/- 0.15 mm tolerance

Note: LE910C1-SV’s thickness is only 2.3mm, +/- 0.15 mm tolerance

Note: Consider a typical label thickness of 0.1 mm in addition to the

module thickness.

2.8.2. Weight
The nominal weight of the LE910Cx module is 5.0 grams.

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3. MODULE CONNECTIONS

Pin-out
PAD Signal I/O Function Type Comment

USB HS 2.0 Communication Port

B15 USB_D+ I/O USB differential Data (+)

C15 USB_D- I/O USB differential Data (-)

Power sense for the internal USB

A13 USB_VBUS AI Power
transceiver

A14 USB_ID AI USB ID See note below

Asynchronous UART

N15 C103/TXD I Serial data input (TXD) from DTE 1.8V

M15 C104/RXD O Serial data output to DTE 1.8V

Input for Request to send signal

L14 C105/RTS I 1.8V
(RTS) from DTE

Output for Clear to send signal

P15 C106/CTS O 1.8V
(CTS) to DTE

Output for Data Set Ready (DSR) to Alternate Fn

P14 C107/DSR O 1.8V
DTE GPIO_32

Input for Data Terminal Ready Alternate Fn

M14 C108/DTR I 1.8V
(DTR) from DTE GPIO_34

Output for Data Carrier Detect Alternate Fn

N14 C109/DCD O 1.8V
(DCD) to DTE GPIO_33

Output for Ring Indication (RI) to Alternate Fn

R14 C125/RING O 1.8V
DTE GPIO_31

SPI – Serial Peripheral Interface / AUX UART

F15 SPI_CLK O SPI Clock output 1.8V

SPI data Master Input Slave output

E15 SPI_MISO/ RX_AUX I 1.8V
/ RX_AUX

SPI data Master Output Slave

D15 SPI_MOSI/TX_AUX O 1.8V
input/ TX_AUX

H14 SPI_CS/GPIO11 O SPI Chip select output / GPIO11 1.8V See note below

SD/MMC Card Digital I/O

J12 SD/MMC_CMD O SD Command 1.8/2.95V

F12 SD/MMC_CLK O SD Card Clock 1.8/2.95V

E12 SD/MMC_DATA0 I/O SD Serial Data 0 1.8/2.95V

G12 SD/MMC_DATA1 I/O SD Serial Data 1 1.8/2.95V

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PAD Signal I/O Function Type Comment

K12 SD/MMC_DATA2 I/O SD Serial Data 2 1.8/2.95V

H12 SD/MMC_DATA3 I/O SD Serial Data 3 1.8/2.95V

G13 SD/MMC_CD I SD card detect input 1.8V Active Low

Power supply for MMC card pull-up

F13 VMMC - 1.8/2.95V
resistors

WiFi (SDIO) Interface

N13 WiFi_SD_CMD O Wi-Fi SD Command 1.8V

L13 WiFi_SD_CLK O Wi-Fi SD Clock 1.8V

J13 WiFi_SD_DATA0 I/O Wi-Fi SD Serial Data 0 1.8V

M13 WiFi_SD_DATA1 I/O Wi-Fi SD Serial Data 1 1.8V

K13 WiFi_SD_DATA2 I/O Wi-Fi SD Serial Data 2 1.8V

H13 WiFi_SD_DATA3 I/O Wi-Fi SD Serial Data 3 1.8V

L12 WiFi_SDRST O Wi-Fi Reset / Power enable control 1.8V

M11 WLAN_SLEEP_CLK O Wi-Fi Sleep clock output 1.8V

L4 WOW I Wake On WLAN 1.8V Active Low

LTE-WiFi Coexistence

M8 WCI_TX O Wireless coexistence interface TXD 1.8V

M9 WCI_RX I Wireless coexistence interface RXD 1.8V

SIM Card Interface 1

A6 SIMCLK1 O External SIM 1 signal – Clock 1.8/2.85V

A7 SIMRST1 O External SIM 1 signal – Reset 1.8/2.85V

Internally PU
A5 SIMIO1 I/O External SIM 1 signal - Data I/O 1.8/2.85V 10 kΩ to
SIMVCC1

A4 SIMIN1 I External SIM 1 signal - Presence 1.8V Active low

External SIM 1 signal – Power

A3 SIMVCC1 - 1.8/2.85V
supply for SIM 1

SIM Card Interface 2

C1 SIMCLK2 O External SIM 2 signal – Clock 1.8/2.85V

D1 SIMRST2 O External SIM 2 signal – Reset 1.8/2.85V

Internally PU
C2 SIMIO2 I/O External SIM 2 signal – Data I/O 1.8/2.85V 10kΩ to
SIMVCC2

G4 SIMIN2 I External SIM 2 signal – Presence 1.8V Active low

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PAD Signal I/O Function Type Comment

External SIM 2 signal – Power

D2 SIMVCC2 - 1.8/2.85V
supply for SIM 2

Digital Voice Interface (DVI)

Digital Voice interface (WAO

B9 DVI_WAO O 1.8V
master output)

B6 DVI_RX I Digital Voice interface (Rx) 1.8V

B7 DVI_TX O Digital Voice interface (Tx) 1.8V

Digital Voice interface (CLK master

B8 DVI_CLK O 1.8V
output)

B12 REF_CLK O Reference clock for external Codec 1.8V See Note below

General Purpose Digital I/O

Alternate Fn
C8 GPIO_01 I/O GPIO_01 / STAT_LED 1.8V
I2C

Alternate Fn
C9 GPIO_02 I/O GPIO_02 1.8V
I2C

Alternate Fn
C10 GPIO_03 I/O GPIO_03 1.8V
I2C

Alternate Fn
C11 GPIO_04 I/O GPIO_04 1.8V
I2C

Alternate Fn
B14 GPIO_05 I/O GPIO_05 1.8V
I2C

Alternate Fn
C12 GPIO_06 I/O GPIO_06 1.8V
I2C

Alternate Fn
C13 GPIO_07 I/O GPIO_07 1.8V
I2C

Alternate Fn
K15 GPIO_08 I/O GPIO_08 / SW_RDY 1.8V
I2C

Alternate Fn
L15 GPIO_09 I/O GPIO_09 1.8V
I2C

Alternate Fn
G15 GPIO_10 I/O GPIO_10 1.8V
I2C

RF Section

GSM/EDGE/UMTS/LTE Main
K1 Antenna I/O RF
antenna (50 Ohm)

UMTS/LTE antenna diversity input

F1 ANT_DIV I RF
(50 Ohm)

GPS Section

R9 ANT_GPS I GPS antenna (50 Ohm) RF

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PAD Signal I/O Function Type Comment

Enables the external regulator for

R7 GPS_LNA_EN O 1.8V
GPS LNA

GPS sync signal for Dead

N9 GPS_SYNC O 1.8V
Reckoning

Miscellaneous Functions

R12 ON_OFF_N I Power ON / Power OFF input Active low

R13 HW_SHUTDOWN_N I Unconditional Shutdown input Active low

Supply output for external

R11 VAUX/PWRMON O accessories / 1.8V
Power ON monitor

IO voltage for internal ICs

E13 VIO_1V8 O This power rail is always on while 1.8V
LE910Cx is working.

B1 ADC_IN1 AI Analog/Digital Converter Input 1 Analog

H4 ADC_IN2 AI Analog/Digital Converter Input 2 Analog

D7 ADC_IN3 AI Analog/Digital Converter Input 3 Analog

SGMII Interface

E4 SGMII_RX_P AI SGMII receive – plus PHY

F4 SGMII_RX_M AI SGMII receive – minus PHY

D5 SGMII_TX_P AO SGMII transmit – plus PHY

D6 SGMII_TX_M AO SGMII transmit - minus PHY

HSIC Interface

High-speed inter-chip interface -

A12 HSIC_DATA I/O 1.2V Optional
data

High-speed inter-chip interface -

A11 HSIC_STB I/O 1.2V Optional
strobe

I2C Interface

Internally PU
B11 I2C_SCL I/O I2C clock 1.8V
2.2kΩ to 1.8V

Internally PU
B10 I2C_SDA I/O I2C Data 1.8V
2.2kΩ to 1.8V

Power Supply

M1 VBATT - Main Power Supply (Digital Section) Power

M2 VBATT - Main Power Supply (Digital Section) Power

N1 VBATT_PA - Main Power Supply (RF Section) Power

N2 VBATT_PA - Main Power Supply (RF Section) Power

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PAD Signal I/O Function Type Comment

P1 VBATT_PA - Main Power Supply (RF Section) Power

P2 VBATT_PA - Main Power Supply (RF Section) Power

A2 GND - Ground

B13 GND Ground

D4 GND - Ground

E1 GND - Ground

E2 GND - Ground

E14 GND - Ground

F2 GND - Ground

G1 GND - Ground

G2 GND - Ground

G7 GND - Ground

G8 GND - Ground

G9 GND - Ground

H1 GND - Ground

H2 GND - Ground

H7 GND - Ground

H8 GND - Ground

H9 GND - Ground

J1 GND - Ground

J2 GND - Ground

J7 GND - Ground

J8 GND - Ground

J9 GND - Ground

K2 GND - Ground

L1 GND - Ground

L2 GND - Ground

M3 GND - Ground

M4 GND - Ground

M12 GND - Ground

N3 GND - Ground

N4 GND - Ground

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PAD Signal I/O Function Type Comment

N5 GND - Ground

N6 GND - Ground

P3 GND - Ground

P4 GND - Ground

P5 GND - Ground

P6 GND - Ground

P8 GND - Ground

P9 GND - Ground

P10 GND - Ground

P13 GND - Ground

R2 GND - Ground

R3 GND - Ground

R5 GND - Ground

R6 GND - Ground

R8 GND - Ground

R10 GND - Ground

Reserved

A8 Reserved - Reserved

A9 Reserved - Reserved

A10 Reserved - Reserved

B2 Reserved - Reserved

B3 Reserved - Reserved

B4 Reserved - Reserved

B5 Reserved - Reserved

C3 Reserved - Reserved

C4 Reserved - Reserved

C5 Reserved - Reserved

C6 Reserved - Reserved

C7 Reserved - Reserved

C14 Reserved - Reserved

D3 Reserved - Reserved

D8 Reserved - Reserved

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PAD Signal I/O Function Type Comment

D9 Reserved - Reserved

D10 Reserved - Reserved

D11 Reserved - Reserved

D12 Reserved - Reserved

D13 Reserved - Reserved

D14 Reserved - Reserved

E3 Reserved - Reserved

F3 Reserved - Reserved

F14 Reserved - Reserved

G3 Reserved - Reserved

G14 Reserved - Reserved

H3 Reserved - Reserved

H15 Reserved - Reserved

J3 Reserved - Reserved

J4 Reserved - Reserved

J14 Reserved - Reserved

J15 Reserved - Reserved

K3 Reserved - Reserved

K4 Reserved - Reserved

K14 Reserved - Reserved

L3 Reserved - Reserved

M5 Reserved - Reserved

M6 Reserved - Reserved

M7 Reserved - Reserved

M10 Reserved - Reserved

N7 Reserved - Reserved

N8 Reserved - Reserved

N10 Reserved - Reserved

N11 Reserved - Reserved

N12 Reserved - Reserved

P7 Reserved - Reserved

P11 Reserved - Reserved

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PAD Signal I/O Function Type Comment

P12 Reserved - Reserved

Reserved for future use

Reserved for future use. Not Can be tied to

R4 RFU -
connected internally GND
Table 7: Pin-out

Note: When the UART signals are used as the communication port
between the host and the modem, the RTS must be connected to GND
(on the module side) if flow control is not used.
If the UART port is not used, all UART signals can be left
disconnected.

Note: Unless otherwise specified, RESERVED pins must be left

unconnected (floating).

Note: The following pins are unique for the LE910Cx and may not be
supported on other (former or future) xE910 family modules. Special care
must be taken when designing the application board if future compatibility
is required.

REF_CLK

SPI_CS
USB_ID

I2C_SCL
I2C_SDA

ADC_IN2

ADC_IN3

Note: The pin out of LE910Cx-WWX’s is perfectly same as LE910Cx

even if the demission is a little bigger than others.

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Signals That Must Be Connected

Table 8 lists the LE910Cx signals that must be connected even if not used by the end
application:

PAD Signal Notes

VBATT &
M1, M2, N1, N2, P1, P2
VBATT_PA

A2, B13, D4, E1, E2, E14, F2, GND

G1, G2, G7, G8, G9, H1, H2,
H7, H8, H9, J1, J2, J7, J8, J9,
K2, L1, L2, M3, M4, M12, N3,
N4, N5, N6, P3, P4, P5, P6,
P8, P9, P10, P13, R2, R3, R5,
R6, R8, R10

R12 ON/OFF Main power on off signal

R13 HW_SHUTDOWN_N Emergency power off

B15 USB_D+ If not used, connect to a Test Point

or an USB connector

C15 USB_D- If not used, connect to a Test Point

or an USB connector

A13 USB_VBUS If not used, connect to a Test Point

or an USB connector

N15 C103/TXD If not used, connect to a Test Point

M15 C104/RXD If not used, connect to a Test Point

L14 C105/RTS If flow control is not used, connect

to GND

P15 C106/CTS If not used, connect to a Test Point

D15 TX_AUX If not used, connect to a Test Point

E15 RX_AUX If not used, connect to a Test Point

K1 Antenna MAIN antenna

F1 ANT_DIV DIV antenna

R9 ANT_GPS GPS antenna

C4, C5, C6, C7, D3, E3, G3, Reserved Connect to a Test Point for Telit
P11 internal use

L15 GPIO_09 If not used, connect to a Test Point

M9 WCI_RX If not used, connect to a Test Point

Table 8: Mandatory Signals

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LGA Pads Layout

Figure 2: LGA Pads Layout ( Top View)

Backward Compatibility to xE910 Family

The LE910Cx is a new series in the xE910 form factor

The LE910Cx is fully backward compatible with the previous xE910 in terms of:
 Mechanical dimensions

 Package and pin-map

To support the extra features and additional interfaces, the LE910Cx introduces more
pins than the xE910.
The extra pins of the LE910Cx can be considered as optional if not needed and can be left
unconnected (floating) if not used.

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In this case, the new LE910Cx can be safely mounted on existing carrier boards designed
for the previous xE910.

The additional pins of the LE910Cx are shown in Figure 3 (marked Green)

Figure 3: LE910Cx vs. LE910 Pin-out Comparison (top view)

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4. ELECTRICAL SPECIFICATIONS

Absolute Maximum Ratings – Not Operational

Warning: A deviation from the value ranges listed below may harm
the LE910Cx module.

Symbol Parameter Min Max Unit

VBATT Battery supply -0.5 +6.0 [V]

voltage on pin
VBATT

VBATT TRANSIENT Transient voltage on -0.5 +7.0 [V]

pin VBATT (< 10 ms)

VBATT_PA Battery supply -0.3 +6.0 [V]

voltage on pin
VBATT_PA
Table 9: Absolute Maximum Ratings – Not Operational

Recommended Operating Conditions

Symbol Parameter Min Typ Max Unit

Tamb Ambient temperature -40 +25 +85 [°C]

VBATT Battery supply voltage on pin VBATT 3.4 3.8 4.2 [V]

VBATT_PA Battery supply voltage on pin 3.4 3.8 4.2 [V]

VBATT_PA

IBATT_PA + IBATT Peak current to be used to dimension - 80 2000 [mA]

decoupling capacitors on pin
VBATT_PA
Table 10: Recommended Operating Conditions

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Logic Level Specifications

Unless otherwise specified, all LE910Cx interface circuits are 1.8V CMOS logic. Only few
specific interfaces (such as MAC, USIM and SD Card) are capable of dual voltage I/O.

The following tables show the specifications of the logic level used in the LE910Cx
interface circuits.

Note: Do not connect LE910Cx digital logic signals directly to OEM

digital logic signals with a level higher than 2.7V for 1.8V CMOS
signals.

4.3.1. 1.8V Pads - Absolute Maximum Ratings

Parameter Min Max

Input level on any digital pin when on -0.3V +2.16V

Input voltage on analog pins when on -0.3V +2.16 V

Table 11: Absolute Maximum Ratings - Not Functional

4.3.2. 1.8V Standard GPIOs

Pad Parameter Min Max Unit Comment

VIH Input high level 1.25V -- [V]

VIL Input low level -- 0.6V [V]

VOH Output high 1.4V -- [V]

level

VOL Output low level -- 0.45V [V]

IIL Low-level input -1 -- [uA] No pull-up

leakage current

IIH High-level input -- +1 [uA] No pull-down

leakage current

RPU Pull-up 30 390 [kΩ]

resistance

RPD Pull-down 30 390 [kΩ]

resistance

Ci Input -- 5 [pF]
capacitance
Table 12: Operating Range – Interface Levels (1.8V CMOS)

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Note: Pull-Up and Pull-Down resistance of GPIO3, GPIO7 and GPIO8 is

different from the one mentioned above.

GPIO3 pull resistance is specified as 10KΩ to 50KΩ

4.3.3. 1.8V SD Card Pads

Pad Parameter Min Max Unit Comment

VIH Input high level 1.27V 2V [V]

VIL Input low level -0.3V 0.58V [V]

VOH Output high 1.4V -- [V]

level

VOL Output low level 0 0.45V [V]

IIL Low-level input -2 - [uA] No pull-up

leakage current

IIH High-level input - 2 [uA] No pull-down

leakage current

RPU Pull-up 10 100 [kΩ]

resistance

RPD Pull-down 10 100 [kΩ]

resistance

Ci Input 5 [pF]
capacitance
Table 13: Operating Range – SD Card Pads Working at 1.8V

4.3.4. 1.8V SIM Card Pads

Pad Parameter Min Max Unit Comment

VIH Input high level 1.35V 2V [V]

VIL Input low level -0.3V 0.43V [V]

VOH Output high 1.35V 1.875V [V]

level

VOL Output low level 0V 0.4V [V]

IIL Low-level input -2 - [uA] No pull-up

leakage current

IIH High-level input - 2 [uA] No pull-down

leakage current

RPU Pull-up 10 100 [kΩ]

resistance

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Pad Parameter Min Max Unit Comment

RPD Pull-down 10 100 [kΩ]

resistance

Ci Input 5 [pF]
capacitance
Table 14: Operating Range – SIM Pads Working at 1.8V

4.3.5. Dual Voltage Pads - Absolute Maximum Ratings

Parameter Min Max

Input level on any digital pin when on -0.3V +3.6V

Input voltage on analog pins when on -0.3V +3.6 V

Table 15: Absolute Maximum Ratings - Not Functional

4.3.6. SD Card Pads @ 2.95V

Pad Parameter Min Max Unit Comments

VIH Input high level 1.9V 3.1V [V]

VIL Input low level -0.3V 0.7V [V]

VOH Output high 2.1V 3.05V [V]

level

VOL Output low level 0V 0.4V [V]

IIL Low-level input -10 [uA] No pull-up

leakage current

IIH High-level input 10 [uA] No pull-down

leakage current

RPU Pull-up 10 100 [kΩ]

resistance

RPD Pull-down 10 100 [kΩ]

resistance

Ci Input 5 [pF]
capacitance
Table 16: Operating Range – For SD Card Pads Operating at 2.95V

4.3.7. SIM Card Pads @2.95V

Pad Parameter Min Max Unit Comment

VIH Input high level 2.1V 3.1V [V]

VIL Input low level -0.3V 0.55V [V]

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Pad Parameter Min Max Unit Comment

VOH Output high 2.25V 3.1V [V]

level

VOL Output low level 0V 0.4V [V]

IIL Low-level input -10 [uA] No pull-up

leakage current

IIH High-level input 10 [uA] No pull-down

leakage current

RPU Pull-up 10 100 [kΩ]

resistance

RPD Pull-down 10 100 [kΩ]

resistance

Ci Input 5 [pF]
capacitance
Table 17: Operating Range – For SIM Pads Operating at 2.95V

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5. HARDWARE COMMANDS

Turning on the LE910Cx Module

To turn on the LE910Cx module, the ON_OFF_N pad must be asserted low for at least 1
second and then released.
The maximum current that can be drained from the ON/OFF # pad is 0.1 mA. This pin is
pulled up internally; customers should expect to see ~ 800 mV on the output.
Figure 4 illustrates a simple circuit to power on the module using an inverted buffer
output.

Figure 4: Power-on Circuit

Note: Recommended values R2 = 47 kΩ, R1 = 10 kΩ.

Initialization and Activation State

After turning on the LE910Cx module, a predefined internal boot sequence performs the
HW and SW initialization of the module, which takes some time to complete. During this
process, the LE910Cx is not accessible.
As shown in Figure 5, the LE910Cx becomes operational at least 20 seconds after the
assertion of ON_OFF.

Note: During the Initialization state, the AT commands are not

available. The DTE host must wait for the Activation state before
communicating with the LE910Cx

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Figure 5: LE910Cx Initialization and Activation

A flow chart showing the proper turn on procedure is displayed below:

Figure 6: Turn-on Procedure

Timing of VAUX/PWRMON and SW_RDY

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Models ON ↔ VAUX/PWRMON ON ↔ SW_RDY

LE910C1-NA

LE910C1-NAD

LE910C4-NS

LE910C1-AP

LE910C4-AP

LE910C1-EU

LE910C4-EU
Typ. 21 sec Typ. 28 Sec
LE910C1-NF

LE910C1-NFD

LE910C4-NF

LE910C4-NFD

LE910C1-LA

LE910C4-LA

LE910C4-CN

LE910C1-SA

LE910C1-SAD
Typ. 13 Sec Typ. 16 Sec
LE910C1-ST

LE910C1-SV

LE910C1-EUX

LE910C1-SAX

LE910C1-SAXD

LE910C1-SVX

LE910C1-APX

LE910C1-WWX Typ. 10 Sec Typ. 20 Sec

LE910C4-WWX

LE910C1-WWXD

LE910C4-WWXD

LE910C1-SNX

LE910C1-SNXD
Table 18: Timing of VAUX/PWRMON and SW_RDY

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Note: SW_RDY signal is available on GPIO_08 (by default GPIO_08

functions as SW_RDY)

Note: To check whether the LE910Cx has completely powered on,

monitor the SW_RDY hardware line. When SW_RDY becomes high,
the module is completely powered on and is ready to accept AT
commands.

Note: During the SW initialization of the LE910Cx, the SW configures

all pads and interfaces to the desired mode. When PWRMON goes
high, this indicates that the initialization of all I/O pads is completed.

Note: Do not use any pull-up resistor on the ON_OFF_N line as it is

pulled up internally. Using a pull-up resistor may cause latch-up
problems on the LE910Cx power regulator and improper powering
on/off of the module. The ON_OFF_N line must be connected only in
an open-collector configuration.

Note: For systems not requiring controlled power ON/OFF,

automatic power on can be supported by shorting the ON_OFF
signal directly to GND
In this case, the module will start power on sequence immediately
after VBATT supply is applied

Note: Active low signals are labeled with a name that ends with "#" or with
“_N”

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Note: To avoid a back-powering effect, it is recommended to prevent any

HIGH logic level signal from being applied to the module’s digital pins when
it is powered OFF or during an ON/OFF transition.

A flow chart showing the AT commands managing procedure is displayed below:

Figure 7: AT commands managing procedure

Note: Waiting time for the AT commands answer can vary between
different LE910Cx variants, between 2-6 sec.

Turning off the LE910Cx Module

Turning off the device can be done in the following different ways:
 Shutdown by software using the AT#SHDN software command

 Hardware shutdown using ON_OFF_N pad

 Hardware Unconditional Shutdown using the SHDN_N pad

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When the device is shut down by a software command or hardware shutdown, it issues
a detach request to the network, informing the network that the device will no longer be
reachable.

Note: To check if the device has powered off, monitor the

PWRMON/SW_RDY hardware line. When PWRMON/SW_RDY goes
low, it means the device has powered off.

Note: To avoid a back-powering effect, it is recommended to

prevent any HIGH logic level signal from being applied to the
module’s digital pins when it is powered OFF or during an ON/OFF
transition.

5.3.1. Shutdown by Software Command

The LE910Cx module can be shut down by a software command.

When a shutdown command is sent, LE910Cx enters the Finalization state and at the end
of the finalization process shuts down PWRMON/SW_RDY .

The duration of the Finalization state may vary according to the current situation of the
module, so it is not possible to define a value.

Usually, it will take more than 10 seconds from sending a shutdown command until a
complete shutdown is achieved. The DTE host should monitor the PWRMON/SW_RDY
status to observe the actual power-off.

Figure 8: Shutdown by Software Command

Note: To check whether the device has powered off, monitor the
PWRMON/SW_RDY hardware line. When PWRMON/SW_RDY goes
low, the device has powered off.

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5.3.2. Hardware Shutdown

To turn off the LE910Cx module, the ON_OFF_N pad must be asserted low for at least 2.5
seconds and then released. Use the same circuitry and timing for power-on.

When the ON/OFF# hold time is above 2.5 seconds, the LE910Cx enters the Finalization
state and eventually shuts down PWRMON/SW_RDY .
The duration of the Finalization state can differ according to the current module situation,
so a value cannot be defined.
Usually, it will take more than 15 seconds from sending a shutdown command until a
complete shutdown is achieved. The DTE host should monitor the status of
PWRMON/SW_RDY to observe the actual power-off.

Figure 9: Hardware Shutdown

Note: To check whether the device has powered off, monitor the
PWRMON/SW_RDY hardware line. When PWRMON/SW_RDY or goes
low, the device has powered off.

5.3.3. Unconditional Hardware Shutdown

To unconditionally shut down the LE910Cx module, the HW_SHUTDOWN_N pad must be
tied low for at least 200 milliseconds and then released.
Figure 10 shows a simple circuit for applying an unconditional shutdown.

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Figure 10: Circuit for Unconditional Hardware Shutdown

Figure 11 shows the system power-down timing when using HW_SHUTDOWN_N.

VBATT

200mS Sec < T_Hold

SHDN_N

T_RDY ~0 Sec
SW_RDY

T_PWRMON ~0 Sec
V_AUX
PWRMON

Active State OFF State

Figure 11: Power down timing using HW_SHUTDOWN_N

Note: Recommended values are as follows: R2 = 47kΩ, R1 = 10kΩ.

Note: Do not use any pull-up resistor on the HW_SHUTDOWN_N line

or any totem pole digital output. Using a pull-up resistor may cause
latch-up problems on the LE910Cx power regulator and improper
functioning of the module. The HW_SHUTDOWN_N line must be
connected only in an open-collector configuration.

Note: The Unconditional Hardware Shutdown must always be

implemented on the boards, but this function must use it only as an
emergency exit procedure, and not as a normal power-off operation.

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Powering OFF the Module

Powering OFF the module should be done gracefully allowing the module to complete all
ongoing and pending tasks while properly handling all memory buffers.

In a complete power supply shut down is needed, the below procedure must be followed:
1. Perform a HW shutdown as described in Section 5.3.1
2. Wait for the HW Shutdown procedure to complete (monitor the PWRMON/SW_RDY
pin).
3. Turn OFF power supply to the module

Warning: Carefully follow the recommended procedure for shut down

and power off.

Failure to follow the recommended shut-down and power off

procedures might damage the device and consequently void the
warranty.

Fast Power Down

The gentle power down procedure is described in chapter 5.3.1 and 5.3.2. It normally
takes more than 15 seconds to de-attach network and make LE910Cx internal filesystem
properly closed.
In the event of an unwanted power supply loss, LE910Cx can be switched off without any
risk of filesystem data corruption by implementing Fast Power Down feature.

The Fast Power Down feature permits to reduce the current consumption and the time-
to-power off to minimum values.

Note: Refer to LE910Cx series AT command reference guide (Fast

power down - #FASTSHDN) in order to set up detailed AT command.

5.5.1. Fast Shut Down by Hardware

The Fast Shut Down is triggered by a GPIO. Customers wishing to implement the Fast
Shut Down should configure a GPIO as the trigger pin for the Fast Shut Down through AT
command. The high-to-low transition of a GPIO triggers the Fast Shut Down and then the
LE910Cx module turns off within 30ms.

Below is the example hardware configuration for the Fast Shut Down.

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Figure 12: Example for Fast Shut Down circuit

Note: Consider the voltage drop under max current conditions when
defining the voltage detector threshold in order to avoid unwanted
shutdown.

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Figure 13: Example of Timing diagram for Fast Shut Down

The most important thing is that a system should give enough energy. The LE910Cx turns
off safely for 30ms after the Fast Shut Down is triggered. Otherwise, unwanted memory
corruption may occur. The VAUX pin can be used to check if the LE910Cx is turned off. If
VUAX is low, LE910Cx is turned off.

The following formula can be used to calculate Ctank value to provide the LE910Cx with
sufficient energy during the Fast Shut Down.

The LE910Cx consumes up to 800mA and 30ms is the typical time to perform shutdown
and 1V is the minimum voltage margin from the threshold of LE910Cx hardware reset.
Based on the formula, more than 24mF is needed for the Fast Shut Down.

But the Ctank value should be optimized depending on the detection voltage and load
current LE910Cx consumes in the customer’s system.

Note: Make the same plot during system verification to check timing
and voltage levels.

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Warning: Ctank associated with low ESR requires current limiting feature
in the DCDC converter to avoid inrush current side effects.

5.5.2. Fast Shut Down by Software

The Fast Power Down can be triggered directly by the AT command.

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6. POWER SUPPLY
The power supply circuitry and board layout are very important parts of the full product
design, with a critical impact on the overall performance of the product. Please read the
following requirements and guidelines carefully to ensure a good and proper design.

Power Supply Requirements

The LE910Cx power requirements are as follows:

Power Supply Value

Nominal supply voltage 3.8V

Supply voltage range 3.4V – 4.2V

Max ripple on module input supply 30 mV

Table 19: Power Supply Requirements

Note: For PTCRB approval on the final products, the power supply is
required to be within the range of the “Normal Supply voltage
ranger”.

Power Consumption
Table 20 provides typical current consumption values of LE910Cx for the various available
modes.

Mode Average (Typ.) Mode Description

Switched Off

Switched off 10µA Module supplied but switched Off (RTC On)

Idle Mode (Standby Mode; No Call in Progress)

AT+CFUN=1 15.0 mA Module full functionality with power saving disabled

Tx and Rx disabled; module is not registered on the network

AT+CFUN=4 14.0 mA
(Flight mode)

Multi Variant

2.6 mA DRx2
GSM
2.1 mA DRx5
DRX
2.1 mA DRx7
AT+CFUN=5 WCDMA
1.9 mA DRx8

LTE 2.4mA Paging cycle #128 frames (1.28 sec DRx cycle)

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Mode Average (Typ.) Mode Description

2.1mA Paging cycle #256 frames (2.56 sec DRx cycle)

Single Variant / ThreadX

2.1mA Paging cycle #128 frames (1.28 sec DRx cycle)

DRX
LTE
AT+CFUN=5
1.8mA Paging cycle #256 frames (2.56 sec DRx cycle)

Operative Mode (LTE)

LTE CAT 1/CAT 4 channel BW 10 MHz, RB=12, Tx = Max

860mA
power

LTE CAT 1/CAT 4 channel BW 20 MHz,

LTE (max power) RB=Full RB, Tx = Max power
890mA With FTP TpT session LTE to USB
10Mbps DL/5Mbps UL (CAT 1)
150Mbps DL/50Mbps UL (CAT 4)

270mA LTE CAT 1/CAT 4 channel BW 10 MHz, RB=12, Tx = 0 dBm

LTE CAT 1/CAT 4 channel BW 20 MHz,

LTE (0dBm) RB=Full RB, Tx = 0 dBm
300mA With FTP TpT session LTE to USB
10Mbps DL/5Mbps UL (CAT 1)
150Mbps DL/50Mbps UL (CAT 4)

Operative Mode (WCDMA)

WCDMA Voice 330mA WCDMA voice call (Tx = 10 dBm)

WCDMA HSDPA (0 dBm) 220mA WCDMA data call (Cat 14, Tx = 0 dBm, Max throughput)

WCDMA HSDPA (22 dBm) 640mA WCDMA data call (Cat 14, Tx = 22 dBm, Max throughput)

Operative Mode (GSM)

GSM Tx and Rx mode

GSM900 PL5 330 mA

GSM voice call
DCS1800 PL0 220mA

GPRS 2 Tx + 1 Rx

GSM 900 PL5 510mA

GPRS Sending Data mode (CS-4)
DCS 1800 PL0 340mA

Operative Mode (GPS/GNSS)

GPS/GNSS tracking 40mA LTE connection is idle

PSM Mode

AT+CPSMS=1 10uA No current source or sink by any connected pin

Table 20: LE910Cx Current Consumption

* Worst/best case current values depend on the network configuration, not under module control.

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* The above currents in idle are measured when Status LED, which is controlled by AT#SLED, is turned
off. See the AT Command User Guide for details about the AT#SLED section.

Note: The current consumption of CFUN=0 mode could be 300uA

higher than CFUN=5 mode to support the wake-up by RTS pin. For
more details, please see the AT Command User Guide of AT+CFUN
section.

Note: Regarding the eDRX mode, please refer to 80502NT11758A,

LE910C1/LE910C4 PSM Application Note.

Note: The electrical design for the power supply must ensure a peak
current output of at least 2.0A.

Note: In GSM/GPRS mode, the RF transmission is not continuous, but

is packed into bursts at a base frequency of approximately 216 Hz
with relative current peaks up to about 2.0A. Therefore, the power
supply must be designed to withstand these current peaks without
large voltage drops. This means that both the electrical design and
the board layout must be designed for this current flow.
If the PCB layout is not well designed, a strong noise floor is
generated on the ground. This will be reflected on all audio paths
producing an annoying audible noise at 216 Hz.
If the voltage drops during the peaks, the current absorption is too
high. The device may even shut down as a consequence of the supply
voltage drop.

General Design Rules

The principal guidelines for the Power Supply Design embrace three different design
steps:
 Electrical design

 Thermal design

 PCB layout

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6.3.1. Electrical Design Guidelines

The electrical design of the power supply strongly depends on the power source where
this power is drained. Power sources can be divided into three categories:

 +5V input (typically PC internal regulator output)

 +12V input (typically automotive)

 Battery

6.3.1.1. + 5V Input Source Power Supply – Design Guidelines

The desired output for the power supply is 3.8V. So, the difference between the input
source and the desired output is not great and therefore a linear regulator can be used.
When using a linear regulator, a proper heat sink must be provided to dissipate the
generated power.

A switching power supply is preferred to reduce power consumption.

In case you decide to adopt a switching regulator, we suggest selecting a synchronous

type, despite the little increase in price, you will enjoy many advantages (you don’t need
the external diode, the EMC design is generally easier, the efficiency rises from typ.
82% to typ. 93%, the switching frequency will be much higher thus allowing
smaller/cheaper inductor and output filter and presenting a lower output impedance)

When the power supply output impedance is not low enough to prevent voltage drops
during absorption peaks a low ESR by-pass capacitor of adequate capacity is
recommended. A 100 μF capacitor is usually suitable on both VBATT and VBATT_PA
power lines (check that this value of output capacitor is within the acceptable range of
the voltage regulator you decided to use).

Make sure that the low ESR capacitor on the power supply output is rated at least 10V.

In case a polarity inversion is not prevented in other way, a protection diode placed near
the power input could help to protect the LE910Cx module.

Figure 14 shows an example of a linear regulator with 5V input.

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Figure 14: Example of Linear Regulator with 5V Input

6.3.1.2. + 12V Input Source Power Supply – Design Guidelines

 The desired output for the power supply is 3.8V. Due to the huge difference
between the input source and the desired output, a linear regulator is unsuitable
and must not be used. A switching power supply is preferable for its better
efficiency, especially with the 2A peak current load expected during GSM Tx.

 When using a switching regulator, a 500-kHz or higher switching frequency

regulator is preferable because of its smaller inductor size and its faster transient
response. This allows the regulator to respond quickly to the peak current
consumption.

 In any case, the selection of the frequency and switching design is related to the
application to be developed as the switching frequency can also generate EMC
interference.

 For car batteries (lead-acid accumulators) the input voltage can rise up to 15.8V.
This must be kept in mind when choosing components: all components in the
power supply must withstand this voltage.

 A bypass low ESR capacitor of adequate capacity must be provided to cut the
current absorption peaks. A 100μF capacitor is usually suitable on VBATT &
VBATT_PA power lines.

 Make sure that the low ESR capacitor on the power supply output is rated at least
10V.
 For automotive applications, a spike protection diode must be inserted close to the
power input to clean the supply of spikes.

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 A protection diode must be inserted close to the power input to protect the
LE910Cx module from power polarity inversion. This can be the same diode as for
spike protection.

Figure 15: Example of Switching Regulator with 12V Input

6.3.1.3. Battery Source Power Supply – Design Guidelines

 The desired nominal output for the power supply is 3.8V, and the maximum voltage
allowed is 4.2V. Hence, a single 3.7V Li-Ion cell battery type is suitable for
supplying the power to the LE910Cx module.

 LiFePO4 batteries with 3.2V nominal voltage range between 2.5V (0% charge) and
3.65V (100% charge), therefore they are not an optimal choice for direct powering
the modem. In case you are using a LiFePO4 battery, you can add a buck-boost
converter to supply the modem with constant 3.8V.
 Primary Lithium batteries such as LiSOCl2 batteries have 3.6V nominal voltage but
generally they have high internal resistance and the voltage drop during current
absorption peaks is high and can exceed the operating range of the modem,
especially when battery is partially depleted. Bobbin types are more affected by
this drop than spiral types. You should carefully evaluate the voltage drop during
modem operation and, in case, either add a DCDC converter to boost the voltage
inside the modem operating range or add capacitance to supply the current peaks.
Some LiSoCl2 batteries come already paired with a hybrid layer capacitor to
support high current peaks without too much voltage drop.

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Note: Do not use any Ni-Cd, Ni-MH, and Pb battery pack types directly
connected to the LE910Cx module. Their use can lead to overvoltage
on the LE910Cx and damage it.

 A bypass low ESR capacitor of adequate capacity helps to cut the current
absorption peaks; a 47-100μF capacitor is usually suitable.

 Make sure the low ESR capacitor is rated at least 10V.

 A protection diode should be inserted close to the power input to protect the
LE910Cx module from power polarity inversion. Otherwise, the battery connector
should be done in a way to avoid polarity inversions when connecting the battery.
 The battery capacity must be at least 500 mAh to withstand the current peaks of
2A.

6.3.2. Thermal Design Guidelines

The thermal design for the power supply heat sink must be done with the following
specifications:
 Average current consumption during RF transmission @PWR level max in LE910Cx
as shown in Table 20: LE910Cx Current Consumption
 Average current consumption during Class10 GPRS transmission @PWR level max
as shown in Table 20: LE910Cx Current Consumption
 Average GPS current consumption during GPS tracking (LTE @ idle): mA (40mA).

Note: The average consumption during transmission depends on the

power level at which the device is requested to transmit via the
network. Therefore, the average current consumption varies
significantly.

Note: The thermal design for the power supply must be made
keeping an average consumption at the max transmitting level during
calls of (LTE/HSPA)/GPRS plus average consumption in GPS
Tracking mode.

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Considering the very low current during Idle, especially if the Power Saving function is
enabled, it is possible to consider from the thermal point of view that the device absorbs
significant current only during an Active Call or Data session.
For the heat generated by the LE910Cx module, consider it to be 2W max during
transmission at Class10 GPRS upload.
In LTE/WCDMA/HSPA mode, the LE910Cx emits RF signals continuously during
transmission. Therefore, special attention must be paid to how to dissipate the heat
generated.
The LE910Cx is designed to conduct heat flow from the module IC’s towards the bottom
of the PCB across GND metal layers

The generated heat is mainly conducted to the ground plane under the LE910Cx module.
The application board should be properly designed to dissipate this heat.
Application board design must ensure that the area under the LE910Cx module is as large
as possible. Make sure that the LE910Cx is mounted to the large ground area of the
application board and provide plenty of ground vias to dissipate heat.
Although the peak current consumption in GSM mode is higher than in
LTE/WCDMA/HSPA, considerations for the heat sink are more important in the case of
WCDMA due to the continuous transmission conditions.

6.3.3. Power Supply PCB Layout Guidelines

As seen on the guidelines for electrical design, the power supply shall have a low ESR
capacitor on the output to cut the current peaks and a protection diode on the input to
protect the supply from spikes and polarity inversion. The placement of these
components is crucial for the correct operation of the circuitry. A misplaced component
can be useless or can even decrease the power supply performances.

 The bypass low ESR capacitor must be placed close to the LE910Cx power input
pads or, if the power supply is of a switching type, it can be placed close to the
inductor to cut the ripple, provided the PCB trace from the capacitor to LE910Cx is
wide enough to ensure a drop-less connection even during the 2A current peaks.

 The protection diode must be placed close to the input connector where the power
source is drained.
 The PCB traces from the input connector to the power regulator IC must be wide
enough to ensure that ohmic voltage drops doesn’t exceed 20-30mV during the 2A
current peaks.

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 Note that this is not done in order to avoid RF power loss but to avoid voltage drops
on the power line at the current peaks frequency of 216 Hz that will reflect on all
the components connected to this supply (also introducing the noise floor at the
burst base frequency)
 For this reason, while a voltage drop of 300-400 mV may be acceptable from the
RF power loss point of view, the same voltage drop may not be acceptable from
the noise point of view. If the application does not have an audio interface but only
uses the data feature of the LE910Cx, this noise is not so disturbing, and the power
supply layout design can be more forgiving.
 The PCB traces to LE910Cx and the bypass capacitor must be wide enough to
ensure that no significant voltage drops occur when the 2A current peaks are
absorbed. This is needed for the same above-mentioned reasons. Try to keep
these traces as short as possible.

 The PCB traces connecting the switching output to the inductor must be inductive
and not capacitive, so keep it short and not too wide placing the inductor the
closest you can to the power switching IC (only for the switching power supply).
This is done also to slightly improve efficiency but mainly to reduce the radiated
field (noise).

 Use a good common ground plane, (some exception to this general rule can be
done for the DCDC Power GND return path, according to DCDC vendor suggestions
(the return path of the input capacitor should not be on the main ground plane, it
should be routed with a short track directly to the ball of the Vss of the regulator).
 Place the power supply on the board ensuring that the high current return paths
in the ground plane do not overlap any noise sensitive circuitry, such as the
microphone amplifier/buffer or earphone amplifier.

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7. ANTENNA(S)
Antenna connection and board layout design are the most important parts in the full
product design, and they have a strong influence on the overall performance of the
product. Read carefully and follow the requirements and guidelines for a good and proper
design.

GSM/WCDMA/TD-SCDMA/LTE Antenna Requirements

The antenna for the LE910Cx device must meet the following requirements:

Item Value

Frequency range The customer must use the most suitable antenna
bandwidth to cover the frequency bands provided by the
network operator and supported by the OEM while
using the Telit module.
The bands supported by each variant of the LE910Cx
module family are provided in Section 2.6.1, RF Bands
per Regional Variant.

Gain Gain < 3 dBi

Impedance 50 Ohm

Input power > 33 dBm(2 W) peak power in GSM

> 24 dBm average power in WCDMA & LTE

VSWR absolute max <= 10:1 (limit to avoid permanent damage)

VSWR recommended <= 2:1 (limit to fulfill all regulatory requirements)

Table 21: Primary Antenna Requirements

Since there is no antenna connector on the LE910Cx module, the antenna must be
connected to the LE910Cx antenna pad (AD1) by a transmission line implemented on the
PCB.

If the antenna is not directly connected to the antenna pad of the LE910Cx, a PCB line is
required to connect to it or to its connector.
This transmission line must meet the following requirements:

Item Value

Characteristic impedance 50 Ohm

Max attenuation 0.3 dB

Avoid coupling with other signals.

Cold End (Ground Plane) of the antenna must be equipotential to the LE910Cx ground pads.
Table 22: Antenna Line on PCB Requirements

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Furthermore, if the device is developed for the US and/or Canadian market, it must
comply with FCC and/or IC approval requirements:

This device is to be used only for mobile and fixed application. The antenna(s) used for
this transmitter must be installed to provide a separation distance of at least 20 cm from
all people and must not be co-located or operating in conjunction with any other antennas
or transmitter. End-Users must be provided with transmitter operation conditions for
satisfying RF exposure compliance. OEM integrators must ensure that the end user has
no manual instructions to remove or install the LE910Cx module. Antennas used for this
OEM module must not exceed 3dBi gain for mobile and fixed operating configurations.

GSM/WCDMA/TD-SCDMA/LTE Antenna – PCB Line Guidelines

 Make sure that the transmission line’s characteristic impedance is 50 Ohm.

 Keep the line on the PCB as short as possible since the antenna line loss should
be less than around 0.3 dB.

 Line geometry should have uniform characteristics, constant cross sections, and
avoid meanders and abrupt curves.

 Any suitable geometry/structure can be used to implement the printed

transmission line affecting the antenna.
 If a ground plane is required in the line geometry, this plane must be continuous
and sufficiently extended so the geometry can be as similar as possible to the
related canonical model.

 Keep, if possible, at least one layer of the PCB used only for the Ground plane. If
possible, use this layer as reference Ground plane for the transmission line.
 Surround the PCB transmission line with ground (on both sides). Avoid that other
signal tracks face directly the antenna line track.

 Avoid crossing any un-shielded transmission line footprint with other tracks on
different layers.

 The ground surrounding the antenna line on the PCB must be strictly connected
to the main Ground plane by means of via-holes (once per 2 mm at least) placed
close to the ground edges facing the line track.

 Place EM-noisy devices as far as possible from LE910Cx antenna line.

 Keep the antenna line far away from the LE910Cx power supply lines.

 If EM-noisy devices are present on the PCB hosting the LE910Cx, such as fast
switching ICs, take care to shield them with a metal frame cover.

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 If EM-noisy devices are not present around the line, geometries like Micro strip or
Grounded Coplanar Waveguide are preferred because they typically ensure less
attenuation if compared to a Strip line of the same length.

GSM/WCDMA/LTE Antenna – Installation Guidelines

 Install the antenna in a location with access to the network radio signal.

 The antenna must be installed such that it provides a separation distance of at

least 20 cm from all people and must not be co-located or operating in conjunction
with any other antenna or transmitter.

 The antenna must not be installed inside metal cases.

 The antenna must be installed according to the antenna manufacturer’s
instructions.

Antenna Diversity Requirements

This product includes an input for a second Rx antenna to improve radio sensitivity. The
function is called Antenna Diversity.

Item Value

Frequency The customer must use the most suitable antenna bandwidth to cover the frequency bands
range provided by the network operator and supported by the OEM while using the Telit module.
The bands supported by each variant of the LE910Cx module family are provided in Section 2.6.1,
RF Bands per Regional Variant

Impedance 50Ω

VSWR ≤ 2:1 (limit to fulfill all regulatory requirements)

recommended
Table 23: Antenna Diversity Requirements

Since there is no antenna connector on the LE910Cx module, the antenna must be
connected to the LE910Cx antenna pad by means of a transmission line implemented on
the PCB.

If the antenna is not connected directly to the LE910Cx (F1) antenna pad, a PCB line is
required to connect to it or to its connector.

The second Rx antenna must not be placed in the immediate vicinity of the main antenna.
To improve diversity gain and isolation and to reduce mutual interaction, the two
antennas should be placed at the as far apart as possible, taking into consideration the
available space within the application.

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Note: If Rx Diversity is not used/connected, perfectly disable the

Diversity functionality using the AT#RXDIV command (refer to Ref 1:
LE910Cx AT Command User Guide) and connect the Diversity pad F1
to a 50 Ohm termination or floating

GNSS Antenna Requirements

LE910Cx supports an active antenna.
It is recommended to use antennas as follow:
 An external active antenna (From 14 to 17 dB typ. Gain, GPS only)

 An external active antenna plus GNSS pre-filter (From 14 to 17 dB typ. Gain)

Note: 80502ST10950A_LE910Cx AT_Commands_Reference_Guide

document must be referred to install passive or active GNSS ANT
configuration by customer.

Note: If the GNSS is not used/connected, please disable the GNSS

functionality perfectly using the AT$GPSP command (refer to Ref 1:
LE910Cx AT Command User Guide) and connect the GNSS pad R9 to
a 50 Ohm termination or floating.

Note: The external GNSS pre-filter is required for the GLONASS

application. The GNSS pre-filter must meet the following
requirements:
Source and load impedance = 50 Ohm

Insertion loss (1575.42–1576.42 MHz) = 1.4 dB (Max)

Insertion loss (1565.42–1585.42 MHz) = 2.0 dB (Max)

Insertion loss (1597.5515–1605.886 MHz) = 2.0 dB (Max)

Note: It is recommended to add a DC block to the customer’s GPS

application to prevent damage to the LE910Cx module due to
unwanted DC voltage.

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Note: It is recommended to add PI matching network near the GPS

connector on the application board in case that RF matching is
needed.

7.5.1. Combined GNSS Antenna

The use of a combined RF/GNSS antenna is NOT recommended. This solution can
generate extremely poor GNSS reception. Furthermore, the combination of antennas
requires an additional diplexer, which adds significant power loss in the RF path.

7.5.2. Linear and Patch GNSS Antenna

The use of this type of antenna introduces a loss of at least 3 dB compared to a circularly
polarized (CP) antenna. Having a spherical gain response instead of a hemispherical gain
response can aggravate multipath behaviour and create poor position accuracy.

7.5.3. Front End Design Considerations

Since there is no antenna connector on the LE910Cx module, the antenna must be
connected to the LE910Cx through the PCB to the antenna pad.

If the antenna is not directly connected at the antenna pad of the LE910Cx, a PCB line is
required.

This line of transmission must meet the following requirements:

Item Value

Characteristic impedance 50 Ohm

Max attenuation 0.3 dB

Avoid coupling with other signals.

Cold End (Ground Plane) of the antenna must be equipotential to the LE910Cx ground pads.
Table 24: Antenna Line on PCB Requirements

Furthermore, if the device is developed for the US and/or Canada market, it must comply
with the FCC and/or IC requirements.
This device is to be used only for mobile and fixed application.

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7.5.4. GNSS Antenna – PCB Line Guidelines

 Ensure that the antenna line impedance is 50 Ohm.

 Keep the line on the PCB as short as possible to reduce the loss.

 The antenna line must have uniform characteristics, constant cross section,
avoiding meanders and abrupt curves.

 Keep one layer of the PCB used only for the Ground plane; if possible.

 Surround (on the sides, top and bottom) the antenna line on the PCB with Ground.
Avoid having other signal tracks directly facing the antenna line track.

 The Ground around the antenna line on the PCB must be strictly connected to the
main Ground plane by placing vias at least once per 2mm.

 Place EM-noisy devices as far away from the LE910Cx antenna line as possible.

 Keep the antenna line far away from the LE910Cx power supply lines.
 If there are EM-noisy devices, such as fast switching ICs, around the PCB hosting
the LE910Cx, ensure shielding the antenna line by burying it inside the layers of
PCB and surrounding it with Ground planes; or shield it with a metal frame cover.

 If you do not have EM-noisy devices around the PCB of LE910Cx, use a Micro strip
line on the surface copper layer for the antenna line. The line attenuation will be
lower than a buried one.

7.5.5. GNSS Antenna – Installation Guidelines

 The LE910Cx, due to its sensitivity characteristics, is able to perform a fix inside
buildings. (In any case, the sensitivity could be affected by the characteristics of
the building, that is shielding.)

 The antenna must not be co-located or operating in conjunction with any other
antennas or transmitters.

 The antenna must not be installed inside metal cases.

 The antenna must be installed according to the antenna manufacturer’s
instructions.

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8. HARDWARE INTERFACES
Table 25 summarizes all the hardware interfaces of the LE910Cx module.

Interface LE910Cx

SGMII For Ethernet support

HSIC x1 (Optional)

SD/MMC x1 dual voltage interface for supporting SD/MMC card

SDIO For WIFI support (1.8V only)

USB2.0, OTG support on LE910C1-LA, LE910C4-LA and

USB
LE910C4-CN

SPI Master only, up to 50 MHz

I2C For sensors, audio control

UART 2 HS-UART (up to 4 Mbps)

Audio I/F I2S/PCM, Analog I/O

GPIO 10 ~ 27 (10 dedicated + 17 multiplexed with other signals)

USIM x2, dual voltage each (1.8V/2.85V)

ADC Up to x3

Antenna ports 2 for Cellular, 1 for GNSS

Table 25: LE910Cx Hardware Interfaces

USB Port
The LE910Cx module includes a Universal Serial Bus (USB) transceiver, which operates
at USB high-speed (480Mbits/sec). It can also operate with USB full-speed hosts
(12Mbits/sec).
It is compliant with the USB 2.0 specification and can be used for control and data transfer
as well as for diagnostic monitoring and firmware update.

The USB port is typically the main interface between the LE910Cx module and OEM
hardware.

Note: The USB_D+ and USB_D- signals have a clock rate of 480 MHz.
The signal traces must be routed carefully. Minimize trace lengths,
number of vias, and capacitive loading. The impedance value should
be as close as possible to 90 Ohms differential.

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Table 26 lists the USB interface signals.

Signal Pad No. Usage

USB_VBUS A13 Power and cable detection for the

internal USB transceiver.
Acceptable input voltage range 2.5V
– 5.5V @ max 5 mA consumption

USB_D- C15 Minus (-) line of the differential, bi-

directional USB signal to/from the
peripheral device

USB_D+ B15 Plus (+) line of the differential, bi-

directional USB signal to/from the
peripheral device

USB_ID A14 Used for USB OTG to determine

host or client mode
Table 26: USB Interface Signals

Note: USB_VBUS input power is used internally to detect the USB

port and start the enumeration process.
It is a power supply pin with a maximum consumption of 5 mA.

Do not use pull up or a voltage divider for sourcing this supply

Note: Even if USB communication is not used, it is still highly

recommended to place an optional USB connector on the application
board.
At least USB signal test points are required as USB physical
communication is needed in the case of SW update.

Note: USB OTG feature is supported by default.

If the USB_ID pin asserted to ‘low’, USB OTG is enabled.
Please note that LE910Cx doesn’t supply 5V power to OTG devices
therefore an external 5V power is required on an application board to
provide 5V power to OTG devices.

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HSIC Interface (Optional)

The application processor exposes a High-Speed Inter-Chip (HSIC). HSIC eliminates the
analog transceiver from a USB interface for lower voltage operation and reduced power
dissipation.
Further details will be provided in a future release of this document.

SGMII Interface
The SOC includes an integrated Ethernet MAC with an SGMII interface, with the following
key features:

 This interface can be directly connected to external Ethernet devices which use
SGMII interface.
 When enabled, an additional network interface will be available to the Linux
kernel.
 Further details can be found at Ref 8: ETH_Expansion_board_Application Note

8.3.1. Ethernet Control interface

When using an external PHY for Ethernet connectivity, the LE910Cx also includes the
control interface for managing the external PHY
Table 27 lists the signals for controlling the external PHY

PAD Signal I/O Function Type Comment

C2 MAC_MDC O MAC to PHY 2.85V Logic Level

Clock Specifications are
shown in Section 0,
C1 MAC_MDIO I/O MAC to PHY Data 2.85V Table 16: Operating
Range – For SD Card
D1 ETH_RST_N O Reset to Ethernet 2.85V
Pads Operating at
PHY
2.95V
SIM Card Pads
@2.95V, Table 17

G4 ETH_INT_N I Interrupt from 1.8V Logic Level

Ethernet PHY Specifications are
shown in Table 12
Table 27: Ethernet Control Interface Signals

Note: The Ethernet control interface is shared with USIM2 port!

When Ethernet PHY is used, USIM2 port cannot be used (and vice
versa).

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Note: ETH_INT_N is a 1.8V input. It has an internal pull up to 1.8V

inside the module thus it should be connected to an open drain
interrupt pin of the Ethernet PHY. In case the PHY does not support
1.8V I/O, proper level shifter needs to be used.

Serial Ports
The serial port is typically a secondary interface between the LE910Cx module and OEM
hardware. The following serial ports are available on the module:

 Modem Serial Port 1 (Main)

 Modem Serial Port 2 (Auxiliary)

Several serial port configurations can be designed for the OEM hardware. The most
common are:
 RS232 PC com port

 Microcontroller UART @ 1.8V (Universal Asynchronous Receive Transmit)

 Microcontroller UART @ 3.3V/5V or other voltages different from 1.8V

Depending on the type of serial port on the OEM hardware, level translator circuits may
be required to operate the system. The only configuration that does not need level
translation is the 1.8V UART.

The LE910Cx UART has CMOS levels as described in Section 4.3, Logic Level
Specifications.

8.4.1. Modem Serial Port 1 Signals

On the LE910Cx, Serial Port 1 is a +1.8V UART with 7 RS232 signals. It differs from the
PC-RS232 in the signal polarity (RS232 is reversed) and levels. Table 28 lists the signals
of LE910Cx Serial Port 1.

RS232 Pin# Signal Pad No. Name Usage

Output from
LE910Cx that
1 DCD - DCD_UART N14 Data Carrier Detect
indicates carrier
presence

Transmit line *see Output transmit line

2 RXD - TX_UART M15
Note of LE910Cx UART

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RS232 Pin# Signal Pad No. Name Usage

Receive line *see Input receive line of

3 TXD -RX_UART N15
Note LE910Cx UART

Input to LE910Cx
Data Terminal that controls the
4 DTR - DTR_UART M14
Ready DTE READY
condition

5 GND A2, B13, D4… Ground Ground

Output from
LE910Cx that
6 DSR - DSR_UART P14 Data Set Ready
indicates that the
module is ready

Input to LE910Cx
controlling the
7 RTS - RTS_UART L14 Request to Send
Hardware flow
control

Output from
LE910Cx controlling
8 CTS - CTS_UART P15 Clear to Send
the Hardware flow
control

Output from
LE910Cx indicating
9 RI - RI_UART R14 Ring Indicator
the Incoming call
condition
Table 28: Modem Serial Port 1 Signals

Note: DCD, DTR, DSR, RI signals that are not used for UART
functions can be configured as GPIO using AT commands.

Note: To avoid a back-powering effect, it is recommended to prevent

any HIGH logic level signal from being applied to the module’s digital
pins when it is powered OFF or during an ON/OFF transition.

Note: For minimum implementations, only the TXD and RXD lines
need be connected. The other lines can be left open provided a
software flow control is implemented.

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Note: According to V.24, Rx/Tx signal names refer to the application

side; therefore, on the LE910Cx side, these signal are in the opposite
direction: TXD on the application side will be connected to the receive
line (here named TXD/ RX_UART) of the LE910Cx serial port and vice
versa for Rx.

Note: The DTR pin is used to control the UART and system sleep
Pulling the DTR pin down prevents the UART and the entire module
from entering low power mode.

DTR can be left floating if not used (DTR is internally pulled high).

8.4.2. Modem Serial Port 2

On the LE910Cx, Serial Port 2 is a +1.8V UART with Rx and Tx signals only.
The UART functionality is shared with SPI, thus simultaneous use of SPI and UART is not
supported.
Table 29 lists the signals of the LE910Cx Serial Port 2.

PAD Signal I/O Function Type Comment

D15 TXD_AUX O Auxiliary UART 1.8V Shared with

(Tx Data to DTE) SPI_MOSI

E15 RXD_AUX I Auxiliary UART 1.8V Shared with

(Rx Data to DTE) SPI_MISO
Table 29: Modem Serial Port 2 Signals

Note: To avoid a back-powering effect, it is recommended to prevent

any HIGH logic level signal from being applied to the module’s digital
pins when it is powered OFF or during an ON/OFF transition.

Note: The Auxiliary UART is used as the SW main debug console. It

is required to place test points on this interface even if not used.

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8.4.3. RS232 Level Translation

To interface the LE910Cx with a PC COM port or an RS232 (EIA/TIA-232) application, a
level translator is required. This level translator must perform the following actions:

 Invert the electrical signal in both directions

 Change the level from 0/1.8V to +15/-15V
The RS232 UART 16450, 16550, 16650 & 16750 chipsets accept signals with lower levels
on the RS232 side (EIA/TIA-562), allowing a lower voltage-multiplying ratio on the level
translator. Note that the negative signal voltage must be less than 0V and hence some
sort of level translation is always required.
The easiest way to translate the levels and invert the signal is by using a single chip-level
translator. There are a multitude of them, differing in the number of drivers and receivers
and in the levels (make sure to get a true RS232 level translator, not a RS485 or other
standards).
By convention, the driver is the level translator from the 0-1.8V UART to the RS232 level.
The receiver is the translator from the RS232 level to 0-1.8V UART. To translate the whole
set of control lines of the UART, the following is required:

 2 drivers
 2 receivers

Warning: The digital input lines, operating at 1.8V CMOS levels, have
an absolute maximum input voltage of 2.0V. The level translator IC
outputs on the module side (i.e. LE910Cx inputs) will cause damage
to the module inputs if the level translator is powered with +3.8V
power.
So, the level translator IC must be powered by a dedicated +1.8V
power supply.

As an example, RS232 level adaption circuitry could use a MAXIM transceiver (MAX218).
In this case, the chipset is capable of translating directly from 1.8V to the RS232 levels
(example on 4 signals only).

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Figure 16: RS232 Level Adaption Circuitry Example

Note: In this case, the length of the lines on the application must be
taken into account to avoid problems in the case of high-speed rates
on RS232.

The RS232 serial port lines are usually connected to a DB9 connector as shown in Figure
17. Signal names and directions are named and defined from the DTE point of view.

Figure 17: RS232 Serial Port Lines Connection Layout

Peripheral Ports
In addition to the LE910Cx serial ports, the LE910Cx supports the following peripheral
ports:

 SPI – Serial Peripheral Interface

 I2C - Inter-integrated circuit

 SD/MMC Card Interface

 SDIO Interface

8.5.1. SPI – Serial Peripheral Interface

The LE910Cx SPI supports the following:

 Master Mode only

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 1.8V CMOS level

 Up to 50 MHz clock rate

Note: The LE910Cx module supports Master mode only and cannot
be configured as Slave mode.

PAD Signal I/O Function Type Comment

F15 SPI_CLK O SPI clock output 1.8V

E15 SPI_MISO I SPI data Master 1.8V Shared with

input Slave RX_AUX
output

D15 SPI_MOSI O SPI data Master 1.8V Shared with

output Slave TX_AUX
input

H14 SPI_CS O SPI chip-select 1.8V

output
Table 30: SPI Signals

LE910Cx (Master) Host (Slave)

SPI_CS SPI_CS
SPI_CLK SPI_CLK
SPI_MOSI SPI_MOSI
SPI_MISO SPI_MISO

Figure 18: SPI Signal Connectivity

8.5.2. I2C - Inter-integrated Circuit

The LE910Cx supports an I2C interface on the following pins:

 B11 - I2C_SCL
 B10 - I2C_SDA
The I2C can also be used externally by the end customer application.
In addition, SW emulated I2C functionality can be used on GPIO pins 1-10. Any GPIO
(among GPIO 1-10) can be configured as SCL or SDA.

LE910Cx only supports I2C Master Mode.

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Note: SW emulated I2C on GPIO lines is only supported from the

modem side. For more information, refer to Ref 1: LE910Cx AT
Command User Guide for command settings.

Note: To keep backward compatibility with previous LE910 products,

it is recommended to keep using the SW emulated I2C available on
GPIO’s 1-10.

8.5.3. SD/MMC Card Interface

The LE910Cx provides an SD port supporting the SD3.0 specification, which can be used
to support standard SD/MMC memory cards with the following features:

 Interface with SD/MMC memory cards up to 32 GB

 Max clock @ 2.95V - 50 MHz SDR

 Max Data: 25 MB/s

 SD standard: HS-SDR25 at 2.95V

 Max clock @ 1.8V - 200 MHz SDR

 Max Data: 100 MB/s

 SD standard: UHS-SDR104 at 1.8 V

 Max clock @ 1.8V - 50 MHz DDR

 Max Data: 50 MB/s

 SD standard: UHS-DDR50 at 1.8 V

Table 31 lists the LE910Cx SD card signals.

PAD Signal I/O Function Type Comments

J12 SD/MMC_CMD O SD command 1.8/2.95V

F12 SD/MMC_CLK O SD card clock 1.8/2.95V

E12 SD/MMC_DATA0 I/O SD Serial Data 0 1.8/2.95V

G12 SD/MMC_DATA1 I/O SD Serial Data 1 1.8/2.95V

K12 SD/MMC_DATA2 I/O SD Serial Data 2 1.8/2.95V

H12 SD/MMC_DATA3 I/O SD Serial Data 3 1.8/2.95V

SD/MMC_CD I SD card detect 1.8V Active Low

G13
input

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PAD Signal I/O Function Type Comments

VMMC - Power supply for 1.8/2.95V Max Current is

F13 MMC card pull-up 50mA
resistors
Table 31: SD Card Signals

Figure 19 shows the recommended connection diagram of the SD interface.

VMMC External PS 3V

GND C=100nF LE910Cx

SD/MMC Interface

MicroSD 10 10 10 10 10
K K K K K
DATA2 SD/MMC_DATA2
DATA3 SD/MMC_DATA3
CMD SD/MMC_CMD
VDD
SD/MMC_CLK
VSS
DATA0 SD/MMC_DATA0
DATA1 SD/MMC_DATA1
MMC_CD
SD/MMC_CD

GND GND

Figure 19: SD/MMC Interface Connectivity

Note: SD/MMC is only supported on the Linux side.

The power supply to the SD/MMC card must be supplied from the
Host application board. The LE910Cx does not provide a dedicated
power supply for the SD/MMC card.
The VMMC Supply is limited to 50mA so it can only supply the MMC
card external pull-up resistors.
The Pull-up resistors must be placed on the host application board.
The card detection input has an internal pull-up resistor.
VMMC can be used to enable the external power supply (LDO Enable
signal)

8.5.4. WiFi SDIO Interface

The LE910Cx provides an SDIO port supporting the SDIO3.0 specification, which can be
used to interface with a WiFi chipset (Qualcomm QCA65x4 chipset or other WiFi
solutions). The LE910Cx module includes an integrated SW driver to support the
Qualcomm QCA6574 chipset.

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Note: Qualcomm QCA9377 WiFi chipset may be supported on some of the

LE910Cx variants.
Please contact your Telit representative for more details.

The LE910Cx SDIO port supports the SDIO 3.0 specification at 1.8V CMOS only, so it cannot
be used as an external SD/MMC card connection.
The LE910Cx module supports an LTE/WiFi coexistence mechanism via the WCI (Wireless
Coexistence Interface) port, which connects between the module and the external WiFi
IC.
For a detailed explanation, refer to Ref 5: Telit LE920A4 LE910Cx WiFi Interface
Application Note r1.

PAD Signal I/O Function Type Comments

N13 WIFI_SD_CMD O WiFi SD Command 1.8V

L13 WIFI_SD_CLK O WiFi SD Clock 1.8V 200 MHz max.

WiFi SD Serial Data

J13 WIFI_SD_DATA0 I/O 1.8V
0

WiFi SD Serial Data

M13 WIFI_SD_DATA1 I/O 1.8V
1

WiFi SD Serial Data

K13 WIFI_SD_DATA2 I/O 1.8V
2

WiFi SD Serial Data

H13 WIFI_SD_DATA3 I/O 1.8V
3

WiFi Reset / Power

L12 WIFI_SDRST O 1.8V Active Low
enable control

Wireless
M8 WCI_TX O coexistence 1.8V
interface TXD

Wireless
M9 WCI_RX I coexistence 1.8V
interface RXD
Table 32: WiFi SDIO Interface Signals

Audio Interface
The LE910Cx module supports a digital audio interface.

8.6.1. Digital Audio

The LE910Cx module can be connected to an external codec through the digital interface.

The product provides Digital Audio Interface (PCM/I2S) on the following pins:

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PAD Signal I/O Function Type Comments

PCM_SYNC
B9 DVI_WA0 O Digital Audio Interface (WA0) B-PD 1.8V
I2S_WS

PCM_DIN
B6 DVI_RX I Digital Audio Interface (RX) B-PD 1.8V
I2S_DIN

PCM_DOUT
B7 DVI_TX O Digital Audio Interface (TX) B-PD 1.8V
I2S_DOUT

PCM_CLK
B8 DVI_CLK O Digital Audio Interface (CLK) B-PD 1.8V
I2S_CLK

B12 REF_CLK O Audio Master Clock B-PD 1.8V MCLK

Table 33: Digital Audio Interface Signals (PCM/I2S)

LE910Cx DVI has the following characteristics:

LE910Cx Linux OS

PCM
 PCM Master and slave modes using short or long frame sync modes

 16-bit linear PCM format

 PCM clock rates of 128kHz, 256 kHz, 512 kHz, 1024 kHz and 2048 kHz (Default),
4096kHz

 Frame size of 8, 16, 32, 64, 128 & 256 bits per frame
 Sample rates of 8 kHz and 16 kHz

I2S

 Master and slave modes

 Sample rate 8KHz, 16KHz, 48KHz

 Sample-width is 16bit only.

 Supported I2S standard only - Phillips I2S Bus Specifications revised June 5, 1996

LE910Cx ThreadX OS
PCM
 PCM Master mode using short or long frame sync modes
 16-bit linear PCM format

 PCM clock rates of 2048 kHz, 4096kHz

 Frame size of 256 bits per frame

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 Sample rates of 8 kHz and 16 kHz

I2S

 Master mode

 Sample rate 8KHz, 16KHz

 Sample-width is 16bit only.

 Supported I2S standard only - Phillips I2S Bus Specifications revised June 5, 1996

In addition to the DVI port, the LE910Cx module provides a master clock signal (REF_CLK
on Pin B12) which can either provide a reference clock to an external codec or form an
PCM/I2S interface together with the DVI port where the REF_CLK acts as the MCLK.

The REF_CLK default frequency is 12.288 MHz.

When using the DVI with REF_CLK as PCM/I2S interface, 12.288 MHz is 256 x fs (where fs
= 48 kHz)

8.6.1.1. Short Frame Timing Diagrams

Figure 20: Primary PCM Timing

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Parameter Comments Min Typ Max Unit

t(sync) PCM_SYNC cycle time - 125 - µs

t(synca) PCM_SYNC asserted time - 488 - ns

t(syncd) PCM_SYNC de-asserted time - 124.5 - µs

t(clk) PCM_CLK cycle time - 488 - ns

t(clkh) PCM_CLK high time - 244 - ns

t(clkl) PCM_CLK low time - 244 - ns

PCM_SYNC offset time to

t(sync_offset) - 122 - ns
PCM_CLK falling

PCM_DIN setup time to

t(sudin) 60 - - ns
PCM_CLK falling

PCM_DIN hold time after

t(hdin) 60 - - ns
PCM_CLK falling

Delay from PCM_CLK rising to

t(pdout) - - 60 ns
PCM_DOUT valid

Delay from PCM_CLK falling to

t(zdout) - - 60 ns
PCM_DOUT HIGH-Z
Table 34: PCM_CODEC Timing Parameters

8.6.1.2. Long Frame Timing Diagrams

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Figure 21: Auxiliary PCM Timing

Parameter Comments Min Typ Max Unit

t(auxsync) AUX_PCM__SYNC cycle time - 125 - µs

t(auxsynca) AUX_PCM_SYNC asserted time 62.4 62.5 - µs

t(auxsyncd) AUX_PCM_SYNC de-asserted time 62.4 62.5 - µs

t(auxclk) AUX_PCM_CLK cycle time - 7.8 - µs

t(auxclkh) AUX_PCM_CLK high time 3.8 3.9 - µs

t(auxclkl) AUX_PCM_CLK low time 3.8 3.9 - µs

AUX_PCM_SYNC setup time to

t(suauxsync) 1.95 - - ns
AUX_PCM_CLK rising

PCM_DIN hold time after

t(hauxsync) 1.95 - - ns
AUX_PCM_CLK rising

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Parameter Comments Min Typ Max Unit

AUX_PCM_DIN setup time to

t(suauxdin) 70 - - ns
AUX_PCM_CLK falling

AUX_ PCM_DIN hold time after

t(hauxdin) 20 - - ns
AUX_PCM_CLK falling

Delay from AUX_PCM_CLK to

t(pauxdout) - - 50 ns
AUX_PCM_DOUT valid
Table 35: AUX_PCM_CODEC Timing Parameters

8.6.1.3. I2S Digital Audio Diagram

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Figure 22: I2S timing diagram

Note LE910Cx family supports both PCM/I2S.

Parameter Comments Min Typ Max Unit

Using internal SCK

Frequency - - 12.288 MHz

T Clock period 81.380 - - ns

t(HC) Clock high 0.45*T - 0.55*T ns

t(LC) Clock low 0.45*T - 0.55*T ns

t(sr) SD and WS input setup time 16.276 - - ns

t(hr) SD and WS input hold time 0 - - ns

t(dtr) SD and WS output delay - 65.100 ns

t(htr) SD and WS output hold time 0 - - ns

Using external SCK

Frequency - - 12.288 MHz

T Clock period 81.380 - - ns

t(HC) Clock high 0.45*T - 0.55*T ns

t(LC) Clock low 0.45*T - 0.55*T ns

t(sr) SD and WS input setup time 16.276 - - ns

t(hr) SD and WS input hold time 0 - - ns

t(dtr) SD and WS output delay - 65.100 ns

t(htr) SD and WS output hold time 0 - - ns

Table 36: Interface timing

General Purpose I/O

The general-purpose I/O pads can be configured to act in three different ways:
 Input

 Output
 Alternative function (internally controlled)

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The Input pads can only be read, reporting the digital values (high / low) present on the
pad at the time of reading. The Output pads can only be written or queried and set values
on the pad output. Pads with alternative function can be internally controlled by the
LE910Cx firmware and act according to the implementation.
The following GPIOs are always available as a primary function on the LE910Cx.

PAD Signal I/O Function Type Note

C8 GPIO_01 I/O Configurable GPIO CMOS 1.8V *

C9 GPIO_02 I/O Configurable GPIO CMOS 1.8V

C10 GPIO_03 I/O Configurable GPIO CMOS 1.8V

C11 GPIO_04 I/O Configurable GPIO CMOS 1.8V

B14 GPIO_05 I/O Configurable GPIO CMOS 1.8V *

C12 GPIO_06 I/O Configurable GPIO CMOS 1.8V *

C13 GPIO_07 I/O Configurable GPIO CMOS 1.8V *

K15 GPIO_08 I/O Configurable GPIO CMOS 1.8V *

L15 GPIO_09 I/O Configurable GPIO CMOS 1.8V *

G15 GPIO_10 I/O Configurable GPIO CMOS 1.8V

Table 37: Primary GPIOs

Warning: GPIO’s marked with (*) must not be pulled high externally
(from the carrier board) during module power on procedure. Pulling
these pads high during module power up might lead to
unwanted/non-operational boot mode.

The additional GPIOs below can be used in case their initial functionality is not used:

PAD Signal I/O Initial Function Alternate Function Type Note

L12 GPIO_13 I/O WIFI_SDRST Configurable GPIO CMOS 1.8V *

N13 GPIO_14 I/O WIFI_SDIO_CMD Configurable GPIO CMOS 1.8V

J13 GPIO_15 I/O WIFI_SDIO_D0 Configurable GPIO CMOS 1.8V

M13 GPIO_16 I/O WIFI_SDIO_D1 Configurable GPIO CMOS 1.8V

K13 GPIO_17 I/O WIFI_SDIO_D2 Configurable GPIO CMOS 1.8V

H13 GPIO_18 I/O WIFI_SDIO_D3 Configurable GPIO CMOS 1.8V

L13 GPIO_19 I/O WIFI_SDIO_CLK Configurable GPIO CMOS 1.8V

M8 GPIO_24 I/O WCI_TXD Configurable GPIO CMOS 1.8V *

M9 GPIO_25 I/O WCI_RXD Configurable GPIO CMOS 1.8V *

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PAD Signal I/O Initial Function Alternate Function Type Note

R14 GPIO_31 I/O UART_RI Configurable GPIO CMOS 1.8V

P14 GPIO_32 I/O UART_DSR Configurable GPIO CMOS 1.8V

N14 GPIO_33 I/O UART_DCD Configurable GPIO CMOS 1.8V

M14 GPIO_34 I/O UART_DTR Configurable GPIO CMOS 1.8V

F15 GPIO_35 I/O SPI_CLK Configurable GPIO CMOS 1.8V

E15 GPIO_36 I/O SPI_MISO Configurable GPIO CMOS 1.8V

D15 GPIO_37 I/O SPI_MOSI Configurable GPIO CMOS 1.8V

H14 GPIO_11 I/O SPI_CS Configurable GPIO CMOS 1.8V

Table 38: Additional GPIOs

Warning: GPIO’s marked with (*) should not be pulled high externally
(from the carrier board) during module power on procedure. Pulling
these pads high during module power up might lead to
unwanted/non-operational boot mode.

Note: LE910Cx GPIOs 1~10 can also be used as alternate I2C function.
Refer to Section 8.5.2, I2C - Inter-integrated Circuit.

8.7.1. Using a GPIO Pad as Input

GPIO pads, when used as inputs, can be connected to a digital output of another device
and report its status, provided that this device has interface levels compatible with the
1.8V CMOS levels of the GPIO.
If the digital output of the device is connected to the GPIO input, the pad has interface
levels other than 1.8V CMOS. It can be buffered with an open collector transistor with a
10 kΩ pull-up resistor to 1.8V.

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8.7.2. Using a GPIO Pad as an interrupt / Wakeup source

GPIO pads used as inputs can also be used as an interrupt source for software. In general,
all GPIO pads can also be used as an interrupt. However, not all GPIO’s can be used as a
wakeup source of the module (wakeup from sleep).
Only the following GPIO’s can be used for waking up the system from sleep:

 GPIO1

 GPIO4
 GPIO5

 GPIO8

8.7.3. Using a GPIO Pad as Output

The GPIO pads, when used as outputs, can drive 1.8V CMOS digital devices or compatible
hardware. When set as outputs, the pads have a push-pull output, and therefore the pull-
up resistor can be omitted.

Figure 23: GPIO Output Pad Equivalent Circuit

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9. MISCELLANEOUS FUNCTIONS

Indication of Network Service Availability

The STAT_LED pin status shows information on the network service availability and call
status. In the LE910Cx module, the STAT_LED usually needs an external transistor to
drive an external LED.
The STAT_LED does not have a dedicated pin. The STAT_LED functionality is available on
GPIO_01 pin (by default GPIO_01 functions as STAT_LED)
See the AT Command User Guide for details about the AT#SLED section.

LED Status Device Status

Permanently off Device off

Blinking 1s on and 2s off Registered in idle

Blinking Blinking time depends on network

condition in order to minimize Registered in idle with power saving
power consumption

Permanently on Not registered

Table 39: Network Service Availability Indication

Figure 24: Status LED Circuit Example

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Indication of Software Ready

The SW_RDY signal provides indication on the module’s ability to receive commands. As
long as the SW_RDY is asserted low, it indicates that the LE910Cx has not finished booting
yet. Once the SW_RDY is asserted high, it indicates that the LE910Cx is ready to receive
commands.
The SW_RDY does not have a dedicated pin. The SW_RDY functionality is available on
GPIO_08 pin (by default GPIO_08 functions as SW_RDY).

RTC – Real Time Clock

The RTC within the LE910Cx module does not have a dedicated RTC supply pin. The RTC
block is supplied by the VBATT supply.
If the battery is removed, the RTC is not maintained so if it is necessary to maintain an
internal RTC , VBATT must be supplied continuously.
In Power OFF mode, the average current consumption is ~25uA.

VAUX Power Output

A regulated power supply output is provided to supply small devices from the module.
This output is active when the module is ON and turns OFF when the module is shut down.
The operating range characteristics of the supply are as follows:

Item Min Typical Max

Output voltage 1.75V 1.80V 1.85V

Output current 100 mA

Output bypass capacitor

1 μF
(within the module)
Table 40: Operating Range – VAUX Power Supply

ADC Converter

9.5.1. Description
The LE910Cx module provides three on-board 8-bit Analog to Digital converters. Each
ADC reads the voltage level applied on the relevant pin, converts it and stores it into an
8-bit word.

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Item Min Max Units

Input voltage range 0.1 1.7 Volt

AD conversion - 8 bits

Resolution - < 6.6 mV

Table 41: ADC Parameters

9.5.2. Using the ADC Converter

An AT command is available to use the ADC function.

The command is AT#ADC=1,2. The read value is expressed in mV.

Refer to Ref 1: LE910Cx AT Command User Guide for the full description of this function.

Using the Temperature Monitor Function

The Temperature Monitor supports temperature monitoring by providing periodic
temperature indications, to perform some functions in extreme conditions. When
properly set (see the #TEMPMON command in Ref 1: LE910Cx AT Command User Guide),
it raises a GPIO to High Logic level when the maximum temperature is reached.

GNSS Characteristics
Table 42 specifies the GNSS characteristics and expected performance. The values are
related to typical environment and conditions.
Typical
Parameters Notes
Measurement
Standalone or MS Based Tracking
-160.0 dBm
Sensitivity
Sensitivity Acquisition -147.0 dBm

Cold Start Sensitivity -145.0 dBm

Hot 1.1s GPS+GLONASS Simulator test

TTFF Warm 22.1s GPS+GLONASS Simulator test

Cold 29.94s GPS+GLONASS Simulator test

GPS+GLONASS Simulator test @
Accuracy < 2.0 m
CEP50
Min Navigation update rate 1Hz

Dynamics 2g

Operation limits 515 m/sec

A-GPS Supported

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Table 42: GNSS Characteristics

Note: The sensitivity level has a deviation about +/- <2dB each model
and device

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10. MOUNTING THE MODULE ON YOUR BOARD

General
The LE910Cx module is designed to be compliant with a standard lead-free soldering
process.

Finishing & Dimensions

The below figure shows the mechanical dimensions of the LE910Cx module.

Pin
B1

Lead-free Alloy:
Surface finishing Ni/Au for all solder pads

Figure 25: LE910Cx Mechanical Dimensions (Bottom View) except for LE910Cx-WWX

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Figure 26-1: LE910Cx-WWX Mechanical Dimensions (Bottom View)

Note: LE910Cx-WWX mechanical dimension is bigger than other

LE910Cx variants
Please, refer to 10.3 section for detail information.

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Figure 26: LE910Cx Mechanical Dimensions (Top view) with two kinds of shield design except for
LE910Cx-WWX

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Note: LE910Cx-AP/APX/NA/NA/NS/EU/NF/NF/ST/SA has two shield

designs and LE910Cx-SV/SVX/LA/CN/EUX/SAX/WWX has one shield
design.

Figure 27: LE910C1-APX Mechanical Dimensions (Top view) with frame and cover shield design

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Figure 27: LE910Cx-WWX Mechanical Dimensions (Top view)

Figure 28: LE910Cx Mechanical Dimensions (Side view) except for LE910C1-SV and -SVX

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Figure 29: LE910C1-SV and SVX Mechanical Dimensions (Side view)

Figure 30: LE910C1-APX Mechanical Dimensions (Side view)

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Recommended Footprint for the Application

Figure 30 and 32-1 shows the recommended footprint for the application board
(dimensions are in mm).

To facilitate the replacement of the LE910Cx module if necessary, it is suggested to

design the application board with a 1.5 mm placement inhibit area around the module.
It is also suggested, as a common rule for an SMT component, to avoid having a
mechanical part of the application board in direct contact with the module.

Note: In the customer application, the region marked as INHIBIT

WIRING in Figure 30 and 32-1 must be clear of signal wiring or
ground polygons.

Figure 30: Recommended Footprint, Copper pattern - Top View, 181 pads for LE910Cx variants except for
LE910Cx-WWX (dimensions in mm)

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Figure 31-1: Recommended Footprint, Copper pattern - Top View, 181 pads for LE910Cx-WWX only
(dimensions in mm)

Note: LE910Cx-WWX footprint is same as LE910Cx variants but PCB

size is differenct others.
Please, refer to above dimension for LE910Cx-WWX.

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INHIBIT WIRING AREAS (Top vew, dimensions in mm)

Figure 32:: Inhibit Wiring Area

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Solder Resist pattern

Figure 33: Recommended Footprint, Solder Resist pattern - Top View, 181 pads for LE910Cx variants
except for LE910Cx-WWX (dimensions in mm)

Recommended Footprint, Solder Resist pattern - Top View, 181 pads for LE910Cx-WWX only (dimensions
in mm)

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Stencil
The layout of the stencil openings can be the same as the recommended footprint (1:1).
The suggested thickness of stencil foil is greater than 120 µm.

PCB Pad Design

The solder pads on the PCB are recommended to be of the Non-Solder Mask Defined
(NSMD) type.

Figure 34: PCB Pad Design

Recommendations for PCB Pad Dimensions (mm)

Figure 35: PCB Pad Dimensions

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It is not recommended to place a via or micro-via not covered by solder resist around the
pads in an area of 0.15 mm unless it carries the same signal as the pad itself. Micro vias
inside the pads are allowed.
Holes in pad are only allowed for blind holes and not for through holes.

Finish Layer Thickness (um) Properties

Good solder ability protection, high

Electro-less Ni / Immersion Au 3-7 / 0.03-0.15
shear force values
Table 43: Recommendations for PCB Pad Surfaces

The PCB must be able to resist the higher temperatures, which occur during the lead-
free process. This issue should be discussed with the PCB-supplier. In general, the
wettability of tin-lead solder paste on the described surface plating is better compared
to lead-free solder paste.

Solder Paste
We recommend using only “no clean” solder paste to avoid the cleaning of the modules
after assembly.

10.7.1. Solder Reflow

Figure 36 shows the recommended solder reflow profile.

Figure 36: Solder Reflow Profile

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Warning: The above solder reflow profile represents the typical SAC
reflow limits and does not guarantee adequate adherence of the
module to the customer application throughout the temperature
range. Customer must optimize the reflow profile depending on the
overall system taking into account such factors as thermal mass and
warpage

Profile Feature Pb-Free Assembly

Average ramp-up rate (TL to TP) 3°C/second max

Preheat 150°C
– Temperature min (Tsmin) 200°C
– Temperature max (Tsmax) 60-180 seconds
– Time (min to max) (ts)

Tsmax to TL 3°C/second max

– Ramp-up rate

Time maintained above: 217°C

– Temperature (TL) 60-150 seconds
– Time (tL)

Peak temperature (Tp) 245 +0/-5°C

Time within 5°C of actual peak 10-30 seconds

Temperature (tp)

Ramp-down rate 6°C/second max

Time 25°C to peak temperature 8 minutes max

Table 44: Solder Profile Characteristics

Note: All temperatures refer to the top side of the package,

measured on the package body surface.

Warning: The LE910Cx module withstands one reflow process only.

10.7.2. Cleaning
In general, cleaning the module mounted on the carrier board is not recommended.

 Residues between the module and the host board cannot be easily removed with
any cleaning method.

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 Cleaning with water or any organic solvent can lead to capillary effects where the
cleaning solvent is absorbed into the gap between the module and the host board
or even leaks inside the module (due to the gap between the module shield and
PCB). The combination of soldering flux residues and encapsulated solvent could
lead to short circuits between conductive parts. The solvent could also damage the
module label.
 Ultrasonic cleaning could damage the module permanently. Especially for crystal
oscillators where the risk of damaging is very high.

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11. APPLICATION GUIDE

Debug of the LE910Cx Module in Production

To test and debug the mounting of the LE910Cx module, we strongly recommend adding
several test pads on the application board design for the following purposes:
 Check the connection between the LE910Cx itself and the application

 Test the performance of the module by connecting it to an external computer

Depending on the customer’s application, these test pads include, but are not limited to
the following signals:
 TXD

 RXD
 ON/OFF

 HW_SHUTDOWN_N
 GND

 VBATT
 TX_AUX
 RX_AUX

 USB_VBUS
 USB_D+

 USB_D-

 GPIO_09
 WCI_RX
In addition, the following signals are also recommended (but not mandatory):

 PWRMON
 GPIO_01 (STAT_LED)

 GPIO_08 (SW_RDY)

Bypass Capacitor on Power Supplies

When there is a sudden voltage step to or a cut from the power supplies, the steep
transition causes some reactions such as overshoot and undershoot. This abrupt voltage
transition can affect the device causing it to fail or malfunction.

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Bypass capacitors are needed to alleviate this behaviour. The behaviour can appear
differently depending on the various applications. Customers need to pay special
attention to this issue when designing their application board. The length and width of the
power lines must be carefully considered, and the capacitance of the capacitors must be
selected accordingly. The capacitor will also prevent power supplies ripple and switching
noise caused in TDMA systems, such as GSM.
Especially, a suitable bypass capacitor must be mounted on the following lines on the
application board:
 VBATT & VBATT_PA (M1, M2, N1, N2, P1, P2)
 USB_VBUS (Pad A13)

Recommended values are:

 100uF for both VBATT and VBATT_PA together

 4.7uF for USB_VBUS (including the 1uF capacitor inside the module)

Customers must still consider that the capacitance mainly depends on the conditions of
their application board.

Generally, more capacitance is required when the power line is longer.

SIM Interface
This section presents the recommended schematics for the design of SIM interfaces on
the application boards. The LE910Cx supports two external SIM interfaces.

11.3.1. SIM Schematic Example

Figure 37 illustrates in particular how to design the application side and what values to
assign the components.

Figure 37: SIM Schematics

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Note: The resistor value on SIMIO pulled up to SIMVCC must be

defined to be compliant with the 3GPP specification for USIM
electrical testing.
The LE910Cx module contains an internal pull-up resistor of 10K Ω
on SIMIO.

However, the un-mounted R1 option in the application can be used to

tune SIMIO timing if necessary.

Table 45 lists the values of C1 to be adopted with the LE910Cx product:

Product P/N C1 Range (nF)

LE910Cx 100 nF
Table 45: SIM Interface – C1 Range

EMC Recommendations
All LE910Cx signals are provided with some EMC protection. However, the accepted level
differs according to the specific pin.

Human body model (HBM) rating: 2000 V, JESD22-A114

Charged device model (CDM) rating: 500 V, JESD22-C101
Appropriate series resistors must be considered to protect the input lines from
overvoltage.

Download and Debug Port

Choose one of the following options in the design of the host system to download or
upgrade the Telit software and debug the LE910Cx module when it is already mounted on
a host system.
 UART and USB interfaces.

 Users who use both UART and USB interfaces to communicate with the LE910Cx
module must implement a USB download method in the host system to upgrade
the LE910Cx when it is mounted.

 USB interface only.

 Users who use a USB interface only to communicate with the LE910Cx module
must arrange for a USB port in the host system to debug or upgrade the LE910Cx
when it is mounted.
 UART interface only.

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 Users who use a UART interface only to communicate with the LE910Cx module
must arrange for a UART port in the host system to debug or upgrade the LE910Cx
when it is mounted.

11.5.1. Recovery Boot Mode

Emergency boot download mode is used in case of corrupted boot image has been flashed
into the device or in case all other recovery modes failed to work

The emergency download mode is triggered by WCI_RX signal (PAD M9). Asserting this
signal high (1.8V) during boot will force the system into Emergency download.

Note: The application board must support accessible test pads on

WCI_RX signal to enable the download recovery modes mentioned
above.

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12. PACKING SYSTEM

Packing System – Tray

The LE910Cx modules are packaged on trays of 36 pieces each as shown in Figure 38.
These trays can be used in SMT processes for pick & place handling.

Figure 38: Packing

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Figure 39: Tray Drawing

In case of LE910Cx-WWX (D) modules are packaged on trays of 27 pieces each as shown
in Figure 3840

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Figure 40: Packing

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Figure 41: LE910Cx-WWX(D) Tray Drawing

Tape & Reel

The LE910Cx can be packaged on reels of 200 pieces each.
See figure for module positioning into the carrier.

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Figure 42: Module Positioning into the Carrier

Figure 43: Carrier Tape Detail

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Figure 44: Reel Detail

Figure 45: Detail

Figure 46: Reel Box Detail

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The LE910Cx-WWX(D) can be packaged on reels of 4 00 pieces each.

See figure for module positioning into the carrier.

Figure 47: Module Positioning into the Carrier

Figure 48: WWX Carrier Tape Detail

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Figure 49: LE910Cx-WWX(D) Carrier Tape Detail

Figure 50: LE910Cx-WWX(D) Reel Box Detail

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Moisture Sensitivity
The LE910Cx module is a Moisture Sensitive Device Level 3, in accordance with standard
IPC/JEDEC J-STD-020. Comply with all the requirements for using this kind of
components.

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13. CONFORMITY ASSESSMENT ISSUES

Approvals Compliance Summary

Region APAC
Country & AU CH JP KR SG TW
Type Approval RCM CCC JRL / JTBL KCC IMDA NCC

LE910C1-EU

LE910C4-EU

LE910C1-AP

LE910C4-AP

LE910C1-APX

LE910C4-CN

LE910C1-WWX

LE910C1-WWXD

LE910C4-WWX

LE910C4-WWXD

Table 46: APAC Compliance Summary

Region EMEA
Country & EU UAE UK ZA
Type Approval RED TRA UKCA ICASA

LE910C1-EU

LE910C1-EUX

LE910C4-EU

LE910C1-WWX

LE910C1-WWXD

LE910C4-WWX

LE910C4-WWXD

Table 47: EMEA Compliance Summary

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Region Americas
Country & AR BR CA CO MX PE US BOL ECU PY
Type Approval ENACOM ANATEL ISED CRC IFETEL MTC FCC ATT ARCOTEL CONATEL

LE910C1-NA

LE910C1-NAD

LE910C1-NS

LE910C1-NF

LE910C1-NFD

LE910C4-NF

LE910C4-NFD

LE910C1-SV

LE910C1-LA

LE910C4-LA

LE910C1-SA

LE910C1-SAD

LE910C1-SAX

LE910C1-SAXD

LE910C1-ST

LE910C1-WWX

LE910C1-WWXD

LE910C4-WWX

LE910C4-WWXD

LE910C1-AP

LE910C1-SNX

LE910C1-SNXD

Table 48: Americas Compliance Summary

The equipment is compliant

Type approval is in progress
The equipment is not compliant

Note: For approvals not included in the above, please contact Telit
support.

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APAC Approvals

13.2.1. Australia RCM

In accordance with the above Approval Compliance Summary table, where applicable
(green ball), hereby, Telit Communications S.p.A declares that the equipment is in
compliance with Regulatory Compliance Mark (RCM) of Australia.
NOTE: The equipment listed may not work when main power fails.

13.2.2. Japan JRL/JTBL Regulatory Notices

Antenna info

According to Japan regulatory rule, module certification is valid only with the specific
antennas registered to and approved by Japan Radio Law (JRL) certified body in relation
to module certification. Customers who are going to use modules under JRL are
responsible to contact Telit technical support or sales to get the list of these antennas.

Dial Function
The Japan Telecommunication Business Law (JTBL) Module Certification for “LE910C1-
AP” and “LE910C1-APX” is for “non-Auto Redial Function” device.

In case customer implement “Auto Redial” function into Application Device by controlling
LE910C1-AP and LE910C1-APX, the customer cannot utilize LE910C1-AP and LE910C1-
APX JTBL certification, and they must apply JTBL as “Application Device” System.

13.2.3. Taiwan NCC Regulatory Notices

According to National Communication Commission (NCC) Taiwan requirements, the
module and the packaging shall be identified as described in the following lines. Shall be
added also the specified safety warning statement.

Model LE910C1-AP LE910C1-WWX LE910C1-WWXD LE910C4-WWX LE910C4-WWXD

Brand
Telit Telit Telit Telit Telit
name

Product
WWAN module WWAN module WWAN module WWAN module WWAN module
name

NCC Logo

NCC ID CCAF19Z10050T8 CCAK22Y00020T2 CCAK22Y00021T4 CCAK22Y00030T5 CCAK22Y00031T7

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Model LE910C1-AP LE910C1-WWX LE910C1-WWXD LE910C4-WWX LE910C4-WWXD

NCC safety “減少電磁波影 “減少電磁波影 “減少電磁波影 “減少電磁波影 “減少電磁波影

warning 響，請妥適使用 響，請妥適使用 響，請妥適使用 響，請妥適使用 響，請妥適使用
statmement
” ” ” ” ”
Table 49: Taiwan NCC labeling requirements

EMEA Approvals

13.3.1. EU RED Declaration of Conformity

In accordance with the above Approval Compliance Summary table, where applicable
(green ball), hereby, Telit Communications S.p.A declares that the equipment is in
compliance with the Directive 2014/53/EU.
The full text of the EU declaration of conformity is available at the following internet
address: https://www.telit.com/red

Text of 2014/53/EU Directive (RED) requirements can be found here:

https://eur-lex.europa.eu/legal-content/EN/TXT/?uri=CELEX:32014L0053

13.3.1.1. RED Antennas

This radio transmitter has been approved under RED to operate with the antenna types
listed below with the maximum permissible gain indicated. The usage of a different
antenna in the final hosting device may need a new assessment of host conformity to
RED.

Model Antenna Type

LE910C4-EU Omnidirectional
LE910C1-EU Atel-Cab T-AT305
LE910C1-EUX Antenna Gain 2.14 dBi

LE910C4-WWX
Omnidirectional
LE910C1-WWX
Hankook Type WE14-LF-07
LE910C4-WWXD
Antenna max gain: 4 dBi
LE910C1-WWXD

Table 50: RED Antenna Type used for module type approval

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Max Gain for RED (dBi)

Band LE910C4-EU LE910C4-WWX

LE910C1-EU LE910C1-WWX
LE910C1-EUX LE910C4-WWXD
LE910C1-WWXD

GSM 900 5.96 6.00

DCS 1800 11.33 11.80

WCDMA Band VIII 5.96 8.90

WCDMA Band III 11.33 ---

WCDMA Band I 11.83 12.30

LTE FDD 1 11.83 12.80

LTE FDD 3 11.33 ---

LTE FDD 7 12.01 13.00

LTE FDD 8 5.96 9.40

LTE FDD 20 9.03 9.20

LTE FDD 28 8.68 9.30

Table 51: Max Gain for RED (dBi)

13.3.2. UK UKCA Declaration of Conformity

In accordance with the above Approval Compliance Summary table, where applicable
(green ball), hereby, Telit Communications S.p.A declares that the equipment is in
compliance with the Radio Equipment Regulations 2017 for UKCA.
The full text of the UKCA declaration of conformity is available at the following internet
address: https://www.telit.com/ukca

The UKCA requirements can be found here:

https://www.gov.uk/guidance/using-the-ukca-marking

Americas Approvals

13.4.1. USA FCC Approval

13.4.1.1. FCC Certificates

The FCC Grants can be found here: https://www.fcc.gov/oet/ea/fccid

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13.4.1.2. Applicable FCC Rules

Model Applicable FCC rules
LE910C1-LA
Title 47 CFR Part 22H, Part 24E, Part 27
LE910C4-LA

LE910C1-NA
Title 47 CFR Part 22H, Part 24E, Part 27
LE910C1-NAD

LE910C1-NF

LE910C1-NFD

LE910C4-NF Title 47 CFR Part 22H, Part 24E, Part 27 and Part 90

LE910C4-NFD

LE910C1-NS

LE910C1-SA
Title 47 CFR Part 24E, Part 27 and Part 90
LE910C1-SAD

LE910C1-SAX

LE910C1-SAXD Title 47 CFR Part 24 and Part 27

LE910C1-ST

LE910C1-SV Title 47 CFR Part 27

LE910C1-WWX

LE910C1-WWXD
Title 47 CFR Part 22H, Part 24E, Part 27 and Part 90
LE910C4-WWX

LE910C4-WWXD

LE910C1-SNX
Title 47 CFR Part 22H, Part 24E, Part 27
LE910C1-SNXD

Table 52: Applicable FCC rules

13.4.1.3. FCC Regulatory Notices

Modification Statement
Telit has not approved any changes or modifications to this device by the user. Any
changes or modifications could void the user’s authority to operate the equipment.
Interference Statement (if it is not placed in the device)
This device complies with Part 15 of the FCC Rules and Industry Canada licence-exempt
RSS standard(s). Operation is subject to the following two conditions: (1) this device may
not cause interference, and (2) this device must accept any interference, including
interference that may cause undesired operation of the device.
Wireless Notice

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This device complies with FCC radiation exposure limits set forth for an uncontrolled
environment and meets the FCC radio frequency (RF) Exposure Guidelines. This
transmitter must not be co-located or operate in conjunction with any other antenna or
transmitter. The antenna should be installed and operated with a minimum distance of
20 cm between the radiator and your body

FCC Class B digital device notice

This equipment has been tested and found to comply with the limits for a Class B digital
device, according to part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference in a residential installation. This
equipment generates, uses, and can radiate radio frequency energy and, if not installed
and used per the instructions, may cause harmful interference to radio communications.
However, there is no guarantee that interference will not occur in a particular installation.
If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to
correct the interference by taking one or more of the following measures:
 Reorient or relocate the receiving antenna.

 Increase the separation between the equipment and the receiver.

 Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.
 Consult the dealer or an experienced radio/TV technician for help.
Information for the OEMs and Integrators
The following statement must be included with all versions of this document supplied to
an OEM or integrator but should not be distributed to the end user.

1. This device is intended for OEM integrators only.

2. Please see the full Grant of Equipment document for other restrictions
Manual Information to the End User

The OEM integrator should be aware not to provide information to the end user on how to
install or remove this RF module in the user’s manual of the end product which integrates
this module. The end user manual shall include all required regulatory
information/warming as shown in this manual
Information on test modes and additional testing requirement

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The module has been evaluated in mobile stand-alone conditions. For operational
conditions other than a stand-alone modular transmitter in a host (multiple,
simultaneously transmitting modules or other transmitters in a host), additional testing
may be required (collocation, retesting…). If this module is intended for use in a portable
device, you are responsible for separate approval to satisfy the SAR requirements of FCC
Part 2.1093.
Additional testing, Part 15 Subpart B disclaimer

The modular transmitter is only authorized by the FCC for the specific rule parts (for
example, FCC transmitter rules) listed on the grant, and that the host product
manufacturer is responsible for compliance to any other FCC rules that apply to the host
not covered by the modular transmitter grant of certification. If the grantee markets their
product as being Part 15 Subpart B compliant (when it also contains unintentional-
radiator digital circuity), then the grantee shall provide a notice stating that the final host
product still requires Part 15 Subpart B compliance testing with the modular transmitter
installed. The end product with an embedded module may also need to pass the FCC Part
15 unintentional emission testing requirements and be properly authorized per FCC Part
15.

Trace antenna designs

See 7.2 GSM/WCDMA/TD-SCDMA/LTE Antenna - PCB Line Guidelines

Summary of the specific operational use conditions

See apart 7.1 GSM/WCDMA/TD-SCDMA/LTE Antenna - Antenna requirements

13.4.1.4. FCC Antenna info

This radio transmitter has been approved by FCC to operate with the antenna types listed
below with the maximum allowable gain indicated. Antenna types not included in this list,
with a gain greater than the maximum gain indicated for that type, are strictly prohibited
from use with this device.
LE910C1/C4-WWXD
LE910C1/C4 -WWX
LE910C1/C4 -NFD
LE910C1/C4 -NF

LE910C1-SNXD
LE910C1-SNX /
LE910C1-NAD

LE910C1 -SAX
LE910C1-SAD

LE910C1-SXD
LE910C1 -NA

LE910C1 -NS

LE910C1 -SA
LE910C4 -LA

LE910C1 -ST
LE910C1 -SV

LE910C1-LA

Frequency Band Freq [MHz]

850 MHz 850 3.64 6.08 6.12 NA 3.50 NA NA NA 3.62 10,4

1900 MHz 1900 2.51 8.01 8.01 NA 9.50 8.01 8.00 8.01 8.51 9,00

1700 MHz 1700 5.00 5.00 5.00 6.00 13.00 5.00 5.00 5.00 5.50 6,00

900 MHz 900 5.00 NA NA NA NA NA NA NA 7.38 NA

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LE910C1/C4-WWXD
LE910C1/C4 -WWX
LE910C1/C4 -NFD
LE910C1/C4 -NF

LE910C1-SNXD
LE910C1-SNX /
LE910C1-NAD

LE910C1 -SAX
LE910C1-SAD

LE910C1-SXD
LE910C1 -NA

LE910C1 -NS

LE910C1 -SA
LE910C4 -LA

LE910C1 -ST
LE910C1 -SV

LE910C1-LA
Frequency Band Freq [MHz]

700 MHz 700 5.63 5.63 5.94 6.44 NA 5.63 5.60 5.63 6.64 6.63

600 MHz 600 NA NA 5.63 NA NA NA NA 5.63 NA NA

2600 MHz 2600 NA NA NA NA 13.0 NA NA NA 9.01 NA

Table 53: Antenna gain from FCC (dBi)

This transmitter must not be co-located or operating in conjunction with any other
antenna or transmitter.
Labelling requirements for the host device

The host device shall be properly labelled to identify the modules within the host device.
The certification label of the module shall be clearly visible at all times when installed in
the host device, otherwise the host device must be labelled to display the FCC ID of the
module, preceded by the words "Contains transmitter module", or the word "Contains",
or similar wording expressing the same meaning, as in the below table.

Model / HVIN Host device FCC label

LE910C1-NA
Contains FCC ID: RI7LE910C1NA
LE910C1-NAD*

LE910C1-NS Contains FCC ID: RI7LE910C1NS

LE910C1-NF LE910C4-NF
Contains FCC ID: RI7LE910CXNF
LE910C1-NFD* LE910C4-NFD*

LE910C1-SV Contains FCC ID: RI7LE910C1SV

LE910C1-SA
Contains FCC ID: RI7LE910C1SA
LE910C1-SAD*

LE910C1-SAX
Contains FCC ID: RI7LE910CXSAX
LE910C1-SAXD*

LE910C1-ST Contains FCC ID: RI7LE910C1ST

LE910C1-LA
Contains FCC ID: RI7LE910CXLA
LE910C4-LA

LE910C1-WWX

LE910C4-WWX
Contains FCC ID: RI7LE910CXWWX
LE910C1-WWXD*

LE910C4-WWXD*

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LE910C1-SNX
Contains FCC ID: RI7LE910C1SNX
LE910C1-SNXD

Table 54: FCC Labelling requirements for the host device

* Data only variants share the same HW of related voice variants and the voice features
are disabled by SW. The new FVIN has the same stack of the original approved voice
variant but w/o the voice support and this to satisfy mainly the need of MNOs is USA.

Canada ISED Approval

13.5.1.1. ISED Database

The products ISED certified can be found here:

Les produits certifiés ISED peuvent être trouvés ici :

https://sms-sgs.ic.gc.ca/equipmentSearch/searchRadioEquipments?execution=e1s1&lang=en

13.5.1.2. Applicable ISED Rules

Model Applicable FCC rules

LE910C1-LA
Not applicable
LE910C4-LA

LE910C1-NA
RSS-130 Issue 2, RSS-132 Issue 3,
LE910C1-NAD RSS-133 Issue 6, RSS-139 Issue 3

LE910C1-NF

LE910C1-NFD RSS-130 Issue 2, RSS-132 Issue 3,

RSS-133 Issue 6, RSS-139 Issue 3,
LE910C4-NF RSS-140 Issue 1
LE910C4-NFD

RSS-130 Issue 1, RSS-132 Issue 3,

LE910C1-NS
RSS-133 Issue 6, RSS-139 Issue 3,

LE910C1-SA
RSS-130 Issue 2, RSS-133 Issue 6,
LE910C1-SAD RSS-139 Issue 3, RSS-140 Issue 1

LE910C1-SAX
RSS-130 Issue 2, RSS-133 Issue 6,
LE910C1-SAXD
RSS-139 Issue 3
LE910C1-ST

LE910C1-SV Not Applicable

LE910C1-WWX
RSS-130 Issue 2, RSS-132 Issue 3,
LE910C1-WWXD RSS-133 Issue 6, RSS-139 Issue 3,
RSS-140 Issue 1, RSS-199 Issue 3
LE910C4-WWX

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Model Applicable FCC rules

LE910C4-WWXD

LE910C1-SNX RSS-130 Issue 2, RSS-132 Issue 4,

RSS-133 Issue 6, RSS-139 Issue 4,
LE910C1-SNXD

Table 55: Applicable ISED rules

13.5.1.3. ISED Regulatory Notices

Modification Statement / Déclaration de modification
Telit has not approved any changes or modifications to this device by the user. Any
changes or modifications could void the user’s authority to operate the equipment.
Telit n’approuve aucune modification apportée à l’appareil par l’utilisateur, quelle qu’en
soit la nature. Tout changement ou modification peuvent annuler le droit d’utilisation de
l’appareil par l’utilisateur.
Interference Statement / Déclaration d'interférence
This device complies with Industry Canada licence-exempt RSS standard(s). Operation is
subject to the following two conditions: (1) this device may not cause interference, and (2)
this device must accept any interference, including interference that may cause
undesired operation of the device.

Le présent appareil est conforme aux applicables RSS standards d'Industrie Canada.
L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas
produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage
radioélectrique subi, même si le brouillage est susceptible d'en compromettre le
fonctionnement.
Radio Exposure Notice / Avis d'exposition radio
This device complies with ISED radiation exposure limits set forth for an uncontrolled
environment and meets the RSS‐102 of the ISED radio frequency (RF) Exposure rules.
Antenna gain must be less than the values reported in the table below:
Le présent appareil est conforme à l'exposition aux radiations FCC / ISED définies pour
un environnement non contrôlé et répond aux directives d'exposition de la fréquence de
la FCC radiofréquence (RF) et RSS‐102 de la fréquence radio (RF) ISED règles
d'exposition. Gain de l'antenne doit être ci-dessous:

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LE910C1/C4-WWXD
LE910C1/C4 -WWX
LE910C1/C4 -NFD
LE910C1/C4 -NF

LE910C1/C4 -LA

LE910C1-SNXD
LE910C1 -NA /
LE910C1-NAD

LE910C1 -SAX

LE910C1-SNX
LE910C1-SAD

LE910C1-SXD
LE910C1 -NS

LE910C1 -SA

LE910C1 -ST
LE910C1 -SV
Frequency Band Freq [MHz]

850 MHz 850 3.64 6.08 6.12 NA 3.5 NA NA NA 3.62 7.12

1900 MHz 1900 2.51 8.01 8.01 NA 9.5 8.01 8.00 8.01 8.51 9.00

1700 MHz 1700 5.00 5.00 5.00 6.00 13.0 5.00 5.00 5.00 5.50 6.00

900 MHz 900 5.00 NA NA NA NA NA NA NA 7.38 NA

700 MHz 700 5.63 5.63 5.94 6.44 NA 5.63 5.60 5.63 6.64 6.63

600 MHz 600 NA NA 5.63 NA NA NA NA 5.63 NA NA

2600 MHz 2600 NA NA NA NA 13.0 NA NA NA 9.01 NA

Table 56: Antenna gain from ISED (dBi)

This transmitter must not be co-located or operating in conjunction with any other
antenna or transmitter.

L'émetteur ne doit pas être colocalisé ni fonctionner conjointement avec à autre antenne
ou autre émetteur.
This equipment must be installed and operated in accordance with provided instructions
and the antenna(s) used for this transmitter must be installed to provide a separation
distance of at least 20 cm from all persons and must not be co-located or operating in
conjunction with any other antenna or transmitter. End-users and installers must be
provided with antenna installation instructions and consider removing the no-collocation
statement.
Cet équipement doit être installé et utilisé conformément aux instructions fournies et la
ou les antennes utilisées pour cet émetteur doivent être installées pour fournir une
distance de séparation d'au moins 20 cm de toutes les personnes et ne doivent pas être
co-localisées ou fonctionner en conjonction avec toute autre antenne ou émetteur. Les
utilisateurs finaux et les installateurs doivent recevoir les instructions d'installation de
l'antenne et envisager de supprimer la déclaration de non-collocation.

Information on test modes and additional testing requirement / Informations sur les
modes de test et exigences de test supplémentaires

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The module has been evaluated in mobile stand-alone conditions. For operational
conditions other than a stand-alone modular transmitter in a host (multiple,
simultaneously transmitting modules or other transmitters in a host), additional testing
may be required (collocation, retesting…) If this module is intended for use in a portable
device, you are responsible for separate approval to satisfy the SAR requirements IC RSS-
102.
Le module a été évalué dans des conditions mobiles autonomes. Pour des conditions de
fonctionnement autres qu'un émetteur modulaire autonome dans un hôte (plusieurs
modules transmettant simultanément ou d'autres émetteurs dans un hôte), des tests
supplémentaires peuvent être nécessaires (colocalisation, retest…) Si ce module est
destiné à être utilisé dans un appareil portable , vous êtes responsable de l'approbation
séparée pour satisfaire aux exigences SAR IC RSS-102.
Trace antenna designs

See 7.2 GSM/WCDMA/TD-SCDMA/LTE Antenna - PCB Line Guidelines

Summary of the specific operational use conditions

See apart 7.1 GSM/WCDMA/TD-SCDMA/LTE Antenna - Antenna requirements

Labelling requirements for the host device / Exigences d'étiquetage pour le périphérique
hôte
The host device shall be properly labelled to identify the modules within the host device.
The certification label of the module shall be clearly visible at all times when installed in
the host device, otherwise the host device must be labelled to display the IC of the
module, preceded by the words "Contains transmitter module", or the word "Contains",
or similar wording expressing the same meaning, as in the following table.

L'appareil hôte doit être étiqueté comme il faut pour permettre l'identification des
modules qui s'y trouvent. L'étiquette de certification du module donné doit être posée sur
l'appareil hôte à un endroit bien en vue en tout temps. En l'absence d'étiquette, l'appareil
hôte doit porter une étiquette donnant le IC du module, précédé des mots « Contient un
module d'émission », du mot « Contient » ou d'une formulation similaire exprimant le
même sens, comme en tableau suivant.

Model / HVIN Host device IC label

LE910C1-NA
Contains IC: 5131A-LE910C1NA
LE910C1-NAD*

LE910C1-NS Contains IC: 5131A-LE910C1NS

LE910C1-NF LE910C4-NF
Contains IC: 5131A-LE910CXNF
LE910C1-NFD* LE910C4-NFD*

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Model / HVIN Host device IC label

LE910C1-SV ---

LE910C1-SA
Contains IC: 5131A-LE910C1SA
LE910C1-SAD*

LE910C1-SAX
Contains IC: 5131A-LE910CXSAX
LE910C1-SAXD*

LE910C1-ST Contains IC: 5131A-LE910C1ST

LE910C1-LA
Contains IC: 5131A-LE910CXLA
LE910C4-LA

LE910C1-WWX

LE910C4-WWX
Contains IC: 5131A-LE910CXWWX
LE910C1-WWXD*

LE910C4-WWXD*

LE910C1-SNX
Contains IC: 5131A-LE910C1SNX
LE910C1-SNXD

Table 57: ISED Labelling requirements for the host device

* Data only variants share the same HW of related voice variants and the voice features
are disabled by SW. The new FVIN has the same stack of the original approved voice
variant but w/o the voice support and this to satisfy mainly the need of MNOs is USA.
Les variantes avec soulement data fonctionnalité partagent le même HW que les
variantes avec les fonctionnalités vocales qui sont désactivées par le SW. Le nouveau
FVIN a le même stack que la variante avec fonctionnalités vocales approuvée d'origine,
mais sans la prise en charge vocale et cela pour satisfaire principalement le besoin des
MNO aux États-Unis.
CAN ICES-3 (B) / NMB-3 (B)

This Class B digital apparatus complies with Canadian ICES-003.

Cet appareil numérique de classe B est conforme à la norme canadienne ICES-003.

Brazil ANATEL Regulatory Notices

Agência Nacional de Telecomunicações (ANATEL) of Brazil

"Este equipamento não tem direito à proteção contra interferência prejudicial e não pode
causar interferência em sistemas devidamente autorizados"

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"This equipment is not entitled to protection against harmful interference and must not
cause interference in duly authorized systems"

LE910C1-LA Homologation # 05818-19-02618

LE910C1-AP Homologation # 04679-18-02618

LE910C4-LA Homologation # 07669-19-02618
LE910C4-WWX Homologation # 08491-22-02618
LE910C1-WWX Homologation # 08491-22-02618
LE910C4-WWXD Homologation # 08491-22-02618
LE910C1-WWXD Homologation # 08491-22-02618

Bolivia ATT Regulatory Notices

Notice for Telit customers:
In case of diffusion of written or audio-visual advertising about the equipment, the ATT
logo must be included, and it must be noted that the device was approved by the Authority.

PERU MTC Regulatory Notices

In accordance with MTC rules the model LE910C1-WWXD is also identified with FCC ID:
RI7LE910CXWWX on product and packaging label.

Colombia CRC Regulatory Notices

In accordance with CRC rules the product identification code LE910C1-WWXD, or model
name or type name, is used on product label, packaging as well on test reports submitted
for type approval.

Paraguay CONATEL Regulatory Notices

In accordance with CONATEL rules the product is marked as below evidenced:

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LE910C1-WWX Registration Number: NR: XXXX-XX-X-XXXX

Notice for Telit customers:
For equipment imported in Paraguay, label must be inserted before to enter in Paraguay
and include also the following information:
 Supplier name

 Address of the supplier in Paraguay.

Argentina RAMATEL Regulatory Notices (former ENACOM)

In accordance with ENACOM/RAMATEL rules the product is marked as below evidenced:

LE910C1-WWX Registration Number: X-00000

Notice for Telit customers:
If the RAMATEL identification number is not visible upon the module installation inside
another device, then the external part of the main device must also carry a label
referencing the module it contains.

This external label must include the RAMATEL identification information of the
homologated product, preceded by the inscription “CONTIENE”, as shown in the attached
file.
The “CONTIENE” inscription must be printed in Arial font with a minimum height of 5
points. Those main devices containing one or more modules subject to homologation
and/or coding must include in their identification the registration numbers issued for
each module.

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14. PRODUCT AND SAFETY INFORMATION

Copyrights and Other Notices

SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE

Although reasonable efforts have been made to ensure the accuracy of this document,
Telit assumes no liability resulting from any inaccuracies or omissions in this document,
or from the use of the information contained herein. The information in this document
has been carefully checked and is believed to be reliable. Telit reserves the right to make
changes to any of the products described herein, to revise it and to make changes from
time to time with no obligation to notify anyone of such revisions or changes. Telit does
not assume any liability arising from the application or use of any product, software, or
circuit described herein; neither does it convey license under its patent rights or the
rights of others.
This document may contain references or information about Telit’s products (machines
and programs), or services that are not announced in your country. Such references or
information do not necessarily mean that Telit intends to announce such Telit products,
programming, or services in your country.

14.1.1. Copyrights
This instruction manual and the Telit products described herein may include or describe
Telit’s copyrighted material, such as computer programs stored in semiconductor
memories or other media. Laws in Italy and in other countries reserve to Telit and its
licensors certain exclusive rights for copyrighted material, including the exclusive righ to
copy, reproduce in any form, distribute and make derivative works of the copyrighted
material. Accordingly, any of Telit’s or its licensors’ copyrighted material contained
herein or described in this instruction manual, shall not be copied, reproduced,
distributed, merged or modified in any manner without the express written permission of
the owner. Furthermore, the purchase of Telit’s products shall not be deemed to grant in
any way, neither directly nor by implication, or estoppel, any license.

14.1.2. Computer Software Copyrights

Telit and the 3rd Party supplied Software (SW) products, described in this instruction
manual may include Telit’s and other 3rd Party’s copyrighted computer programs stored
in semiconductor memories or other media. Laws in Italy and in other countries reserve
to Telit and other 3rd Party SW exclusive rights for copyrighted computer programs,
including – but not limited to - the exclusive right to copy or reproduce in any form the

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copyrighted products. Accordingly, any copyrighted computer programs contained in

Telit’s products described in this instruction manual shall not be copied (reverse
engineered) or reproduced in any manner without the express written permission of the
copyright owner, being Telit or the 3rd Party software supplier. Furthermore, the
purchase of Telit products shall not be deemed to grant either directly or by implication,
estoppel, or in any other way, any license under the copyrights, patents or patent
applications of Telit or other 3rd Party supplied SW, except for the normal non-exclusive,
royalty free license to use arising by operation of law in the sale of a product.

Usage and Disclosure Restrictions

14.2.1. License Agreements

The software described in this document is owned by Telit and its licensors. It is furnished
by express license agreement only and shall be used exclusively in accordance with the
terms of such agreement.

14.2.2. Copyrighted Materials

The Software and the documentation are copyrighted materials. Making unauthorized
copies is prohibited by the law. The software or the documentation shall not be
reproduced, transmitted, transcribed, even partially, nor stored in a retrieval system, nor
translated into any language or computer language, in any form or by any means, without
prior written permission of Telit.

14.2.3. High Risk Materials

Components, units, or third-party goods used in the making of the product described
herein are NOT fault-tolerant and are NOT designed, manufactured, or intended for use
as on-line control equipment in the following hazardous environments requiring fail-safe
controls: operations of Nuclear Facilities, Aircraft Navigation or Aircraft Communication
Systems, Air Traffic Control, Life Support, or Weapons Systems (“High Risk Activities").
Telit and its supplier(s) specifically disclaim any expressed or implied warranty of fitness
eligibility for such High Risk Activities.

14.2.4. Trademarks
TELIT and the Stylized T-Logo are registered in the Trademark Office. All other product
or service names are property of their respective owners.

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14.2.5. 3rd Party Rights

The software may include 3rd Party’s software Rights. In this case the user agrees to
comply with all terms and conditions imposed in respect of such separate software
rights. In addition to 3rd Party Terms, the disclaimer of warranty and limitation of liability
provisions in this License, shall apply to the 3rd Party Rights software as well.
TELIT HEREBY DISCLAIMS ANY AND ALL WARRANTIES EXPRESSED OR IMPLIED FROM
ANY 3RD PARTY REGARDING ANY SEPARATE FILES, ANY 3RD PARTY MATERIALS
INCLUDED IN THE SOFTWARE, ANY 3RD PARTY MATERIALS FROM WHICH THE
SOFTWARE IS DERIVED (COLLECTIVELY “OTHER CODES”), AND THE USE OF ANY OR ALL
OTHER CODES IN CONNECTION WITH THE SOFTWARE, INCLUDING (WITHOUT
LIMITATION) ANY WARRANTIES OF SATISFACTORY QUALITY OR FITNESS FOR A
PARTICULAR PURPOSE.
NO 3RD PARTY LICENSORS OF OTHER CODES MUST BE LIABLE FOR ANY DIRECT,
INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES
(INCLUDING WITHOUT LIMITATION LOST OF PROFITS), HOWEVER CAUSED AND
WHETHER MADE UNDER CONTRACT, TORT OR OTHER LEGAL THEORY, ARISING IN ANY
WAY OUT OF THE USE OR DISTRIBUTION OF THE OTHER CODES OR THE EXERCISE OF
ANY RIGHTS GRANTED UNDER EITHER OR BOTH THIS LICENSE AND THE LEGAL TERMS
APPLICABLE TO ANY SEPARATE FILES, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH
DAMAGES.

14.2.6. Waiver of Liability

IN NO EVENT WILL TELIT AND ITS AFFILIATES BE LIABLE FOR AY DIRECT, INDIRECT,
SPECIAL, GENERAL, INCIDENTAL, CONSEQUENTIAL, PUNITIVE OR EXEMPLARY
INDIRECT DAMAGE OF ANY KIND WHATSOEVER, INCLUDING BUT NOT LIMITED TO
REIMBURSEMENT OF COSTS, COMPENSATION OF ANY DAMAGE, LOSS OF
PRODUCTION, LOSS OF PROFIT, LOSS OF USE, LOSS OF BUSINESS, LOSS OF DATA OR
REVENUE, WHETHER OR NOT THE POSSIBILITY OF SUCH DAMAGES COULD HAVE BEEN
REASONABLY FORESEEN, CONNECTD IN ANY WAY TO THE USE OF THE PRODUCT/S OR
TO THE INFORMATION CONTAINED IN THE PRESENT DOCUMENTATION, EVEN IF TELIT
AND/OR ITS AFFILIATES HAVE BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES
OR THEY ARE FORESEEABLE OR FOR CLAIMS BY ANY THIRD PARTY.

Safety Recommendations
Make sure the use of this product is allowed in your country and in the environment
required. The use of this product may be dangerous and has to be avoided in areas where:

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 it can interfere with other electronic devices, particularly in environments such as

hospitals, airports, aircrafts, etc.
 there is a risk of explosion such as gasoline stations, oil refineries, etc. It is the
responsibility of the user to enforce the country regulation and the specific
environment regulation.

Do not disassemble the product; any mark of tampering will compromise the warranty
validity. We recommend following the instructions of the hardware user guides for
correct wiring of the product. The product has to be supplied with a stabilized voltage
source and the wiring has to be conformed to the security and fire prevention regulations.
The product has to be handled with care, avoiding any contact with the pins because
electrostatic discharges may damage the product itself. Same cautions have to be taken
for the SIM, checking carefully the instruction for its use. Do not insert or remove the SIM
when the product is in power saving mode.
The system integrator is responsible for the functioning of the final product. Therefore,
the external components of the module, as well as any project or installation issue, have
to be handled with care. Any interference may cause the risk of disturbing the GSM
network or external devices or having an impact on the security system. Should there be
any doubt, please refer to the technical documentation and the regulations in force. Every
module has to be equipped with a proper antenna with specific characteristics. The
antenna has to be installed carefully in order to avoid any interference with other
electronic devices and has to guarantee a minimum distance from the body (20 cm). In
case this requirement cannot be satisfied, the system integrator has to assess the final
product against the SAR regulation.
The equipment is intended to be installed in a restricted area location.
The equipment must be supplied by an external specific limited power source in
compliance with the standard EN 62368-1:2014.
The European Community provides some Directives for the electronic equipment
introduced on the market. All of the relevant information is available on the European
Community website:
https://ec.europa.eu/growth/sectors/electrical-engineering_en

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15. GLOSSARY

ADC Analog-to-digital converter

AE Application-enabled
CABC Content Adaptive Backlight Control
DAC Digital-to-analog converter
DTE Data Terminal Equipment
FDD Frequency division duplex
GLONASS Global orbiting navigation satellite system
GNSS Global navigation satellite system
GPIO General-purpose input/output
GPRS General packet radio services
GPS Global positioning system
GSM Global system for mobile communications
HSIC High-speed inter-chip
I2C Inter-integrated circuit
LTE Long term evolution
RGMII Reduced Gigabit media-independent interface
SD Secure digital
SGMII Serial Gigabit media-independent interface
SIM Subscriber identity module
SMX SmartMX
SOC System-on-Chip
SPI Serial peripheral interface
UART Universal asynchronous receiver transmitter
UMTS Universal mobile telecommunications system
USB Universal serial bus
WCDMA Wideband code division multiple access
WCI Wireless Coexistence Interface

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16. DOCUMENT HISTORY

Revision Date Changes

41 2023-10-06 Added SNX(D) Variant

Updated 13 – FCC and ISED

40 2023-04-27 Added Mechanical Drawing LE910C1-APX

Updated 12 - Packing System

39 2022-12-23 Updated reference to APX variant

38 2022-11-23 Updated APX variant

Updated 13.1 Approvals Compliance Summary
Updated chapter 6 – Power Supply
Updated 7.5 – GNSS Antenna Gain
Updated 10.2 Finishing and dimensions

37 2022-10-26 Added 13.7 Bolivia ATT Regulatory Notices

Added 13.8 PERU MTC Regulatory Notices
Added 13.9 Colombia CRC Regulatory Notices
Added 13.10 Paraguay CONATEL Regulatory Notices
Added 13.11 Argentina RAMATEL Regulatory Notices (former ENACOM)
Updated 13.1 Approvals Compliance Summary
Updated 13.2.3 NCC table
Updated 13.6 Brazil ANATEL Regulatory Notices
Updated 11.5.1 Fast Boot Mode and Recovery Mode

36 2022-06-24 Updated Section 10.3 Recommended Footprint for the Application

35 2022-04-08 Updated HUG with DOM variants (LE910C1-NAD / LE910C1-SAD / LE910C1-SAXD

/ LE910C1/C4-NFD)
Updated chapter 13. CONFORMITY ASSESSMENT ISSUES
Updated Section 10.3 Recommended Footprint for the Application

34 2021-10-22 Update WWXD Variant

Table 18: Add WWX Variant
Table 20 : Update Current consumption
Table 58: GNSS Characteristics updated
8.6.1. Update Audio interface (Update ThreadX Support Audio)
13.1. FCC/ISED Regulatory Notices updated for LE910Cx-WWX
13.5. Europe Approvals section added

33 2021-07-01 Section 1.5 – Updated Related Documents

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Revision Date Changes

Section 5.1 – Added flow chart for turn on and AT command managing procedure
Section 6.2 – Added note for eDRX
Section 8.6 – Update Audio Interface (ThreadX OS support PCM)
Section 10-3 - Recommended Footprint for the Application updated
for LE910Cx-WWX
Table 20: LE910Cx Current Consumption updated
Section 10.x – Dimension and Mechanical design updated

32 2021-03-23 Section 5.3.3 – Fixed Typo in Note of Section.

Section 8.6 – Update PCM CLK rate.

31 2021-02-05 Table 1: Applicability Table updated

Table4: RF Bands per Regional Variant updated
2.8.1 Dimensions updated
3.1 Note added

30 2021-01-29 Section 2.3 – Added not supported function only based on TreadX OS models
Section 8.5.1 – Updated Note

29 2021-01-12 Updated Section 8.6 – updated I2S diagram

28 2020-12-08 Updated APPLICABILITY TABLE and added notes

Section 3.1 – Updated Pin-out
Section 5.2 – Updated Initialization and Activation figure and added timing table
Section 5.3 – Updated figures
Section 14.1 - Updated FCC/ISED Regulatory Notices
Updated Table 59: RF Bands per Regional Variant

27 2020-07-31 Section 11.4 – Updated EMC Recommendations

26 2020-07-22 7.4 Antenna Diversity Requirements – Note comment changed to AT#RXDIV

14.4 ANATEL Regulatory Notices - Updated

25 2020-06-15 Section 8 – Hardware Interfaces; USB part updated

Section 8.1 – Note Updated
Table 45 and 4 - EUX variant added
Table 46 – CAT 4 DL/UL Tput swapped
Section 14.1 ANATEL Regulatory Notices – Homologation No. fixed
Section 2.7.1 Sensitivity – Sensitivity Table added
Section 2.2. Applications – E-call comment deleted
Table 47 – Sensitivity level changed
Sections 7.4 Antenna Diversity Requirements – Note comment changed
Section 7.5 GNSS Antenna Requirements – Note added

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Revision Date Changes

Table 39 – Sensitivity table changed and note added

24 2020-04-29 Section 8.3 – SGMII interface updated

23 2020-04-20 Section 6.2 – Power Consumption updated

22 2020-04-02 Section 7.4 – Diversity ANT PAD changed

21 2020-03-30 Section 2.8.2 – Weight updated

20 2020-01-23 Section 3.1 – WOW pin updated

Section 3.2 – Table updated
Section 3.3 – LGA Pads Layout updated
Section 8.7 – GPIOs table updated

19 2019-11-27 Section 14.4 – Added ANATEL Regulatory notices

18 2019-11-21 Section 8.5.3 – SD/MMC Card interface updated

17 2019-10-29 Section 9.1 – STATUS LED control updated

16 2019-10-22 Section 2.7.2 – Output power updated

15 2019-10-15 Section 3.1 – Warning comment removed

Table 34, 35 – note updated
Table 18 – Updated Idle mode current consumption
Section 14.3 – Added NCC (TW) requirement section

14 2019-09-03 Table 18 – Updated the current consumption of LTE max power

Table 6 – Updated the description of E13 pin-out
14.1 FCC/ISED Regulatory Notices updated for LE910C1/C4-LA
14.1 FCC/ISED Regulatory Notices updated
Table 5 – LTE B2 fixed
Section 2.7.1 – Sensitivity updated
Section 7.5 – Note added for passive or active ANT installation
Table 36 – Network Service Availability Indication updated

13 2019-05-14 Table 1 and 4 LE910C1-xx bis Variants removed

Section 3.2 and 7– Note for C1 bis variants removed

12 2019-04-23 Table 1, 4 – Added variants

Table 19,21 – Added comment

11 2019-03-22 Section 10.7.1 – Warning comment added

10 2019-03-13 Section 2.8.1 – Note added for C1-SV variant

Section 3.1 – Updated E13 Pin-out

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Revision Date Changes

Section 3.3 – Updated figure 2. LGA Pads Layout
Added Fast Power Down Section 5.5
Table 18 – Updated Idle mode current consumption
Section 10.2 – Picture added for Cx-SV/LA variants
Section 14.2 – Japan Radio Law comment added

9 2019-03-06 Table 1 and 4 Variants updated

Section 2.7 - RF Parameters updated
Section 3.2 – Note added for C1 bis variants
Section 6.2 – Power consumption update
Section 7 – Note added for C1 bis variants

8 2018-12-12 14.1 FCC/ISED Regulatory Notices updated for LE910C1-SA

and LE910C1-ST

7 2018-11-19 14.1 FCC/ISED Regulatory Notices updated for LE910C1-SV

6 2018-10-25 Table 1 & 4 – Added -SA, ST, SV and LA variants.

Table 5 – Added B14
Section 2.5.1 – Updated Temperature Range

5 2018-09-16 Section 14 – Adding Antenna gain and FCC ID & IC numbers for LE910C1/C4 NF.
Section 5.2 – Fixed typo related to power up timing.

4 2018-08-20 Table 1 & 4 - Added LE910C4-EU variant

Section 2.3 – Updated SIM interface max speed
Declared HSIC interface as optional throughout the document
Section 2.6.2 – Updated RF frequency table
Section 6.2 – Added clarification related to DRX and CFUN=5
Section 8.1 - Corrected Typo related to USB_VBUS pad number
Section 8.4.1- Clarified note about DTR pin

3 2018-07-18 Section 2.8.1 - Fixed typo related to module size

General - Align cross reference links across the document

2 2018-06-14 Template update and pagination update

Section 1.5 – Updated AT Command UG reference
Section 2.6.1 - Updated Band support table
Section 6.3.2 - Updated Thermal design guidelines
Section 8.3 - Removed “optional” term from Ethernet interface

1.13 2018-05-17 Added new variant LE910C1-NF

Section 2.6.1 - Added band 66 support for LE910Cx-NF

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Revision Date Changes

Section 2.6.2 - Added band 66 and band 71 to frequency table
Section 3.1 - Updated value of SIM internal pullup
Section 8.3 – added clarification regarding Ethernet control interface logic levels
Section 8.5.4 – Removed note related to WIFI_SDRST
Section 9.7 - Updated GNSS characteristics

1.12 2018-03-18 Replaced LE910C1 with LE910Cx throughout the document

Section 2.6.1 and Table 1 - Added LE910C1-EU and LE910C4-NF variants
Section 8.7 – Added notes related to GPIO pullups
Section 10.7.2 - Added clarification related to flux cleaning

1.11 2018-02-22 Section 5.3.2 – Updated section name

Section 5.4 – Added section for clarifying power down and power off procedures
Section 8.6.1 – Update for PCM slave mode

1.10 2017-12-27 General spelling and grammar edits throughout the document
Section 2.3 – Updated features list table.
Section 2.4 - Fixed typo in section and inside block diagram.

1.09 2017-12-07 Section 14.1 – Updated LE910C1 NA 850MHz Max antenna gain.
Section 6.2.2 – Corrected Class12 to Class10.

1.08 2017-11-14 Section 2.6.2 - Changed B41 to B41M

Section 2.7 – Renamed from Sensitivity to RF parameters and added TX output
power section (2.7.2)
Section 2.8 – Added note regarding label thickness
Section 3.1 - Removed duplication of description related to USB_VBUS.
Section 5.2 – Added clarification regarding ON_OFF.
Section 7.5 – Added note related to GPS port.
Section 8.1 – Added clarification regarding VBUS supply.
Section 8.1.1 – Added clarification regarding OTG.
Section 8.3.1 – Added clarification regarding ETH_INT_N pin.

1.07 2017-07-23 Adding a note for power supply section

1.06 2017-07-10 Renaming the product from LE910Cx to LE910C1

1.05 2017-06-18 Section 6.1 – Updated power consumption tables

1.04 2017-05-25 Section 14.1 – Added Labelling Requirements for the Host device

1.03 2017-04-23 Section 11.4:

Updated ESD values
Updated Reference document table

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Revision Date Changes

Section 8.3 - Updated Ethernet control interface information
Section 8.5.2 – Added note related to I2C
Section 2.6.2 – Updated table 4 with B25 information.
Section 14.1:
Added LE910C1 NS Max antenna gain.
Added LE910C1 NS FCC ID & IC number.

1.02 2017-04-03 Section 14.1 – updated column “Band” to “Frequency Band” in Wireless notice
table
Section 8.4.1 - Added note regarding DTR

1.01 2017-02-16 Adding Section 14: FCC/ISED Regulatory notices

Changing Document History section from 14 to 15

1.0 2016-12-22 Section 1.5 - Updated “Related Documents” table

Section 5.3.4 – Added Figure for SHDN_N power down timing
Section 8.5.3 – Added clarification about VMMC
Section 9.7 - Added GNSS characteristics

0.6 2016-12-07 Remove all China variant related information

0.5 2016-12-02 Added section 9.2 to better describe SW_RDY signal

Minor modifications per typos and improved description
Renaming of SHDN_N pin

0.4 2016-11-30 Updated band support table

Updated WIFI application note doc info
Added note related to future compatibility related to few pins
Updated section 3.2 - Signals That Must Be Connected
Updated pinout and pin description
Updated pinout layout (Figure 2)
Remove HW RESET description section
Updated serial port 2 section
Updated SPI port section
Updated 1.8V pads pull info
Updated AUX UART section
Updated GPIO section
Updated mechanical drawing (Cosmetic)

0.3 2016-11-13 Added information for GPIO usage as Interrupt

Added clarification for AUX_UART location and backward compatibility

0.2 2016-09-05 Minor edits

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Revision Date Changes

0.1 2016-08-30 First Draft

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