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MEMS - Module 3 Notes

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25 views5 pages

MEMS - Module 3 Notes

xfxgxgxg

Uploaded by

Vinod Kumar
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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Dr.

Swetha Vura ICEAS

MODULE 3
Engineering Mechanics for Microsystem Design

Introduction:
Engineering Mechanics, which involves both solid and fluid mechanics, is the base for
mechanical design of microsystems. Mechanics is the branch of engineering science that
studies the relationship between the applied forces and resulting motions. The word motion in
microsystems can involve either rigid body motion (accelerometer) or deformation of solids
(diaphragm).
Solid mechanics is extensively used in design of system packaging whereas fluid mechanics is
involved in design of microvalves and microfluidics.
Units for Solid Mechanics Problems: The following International System (SI) units are
recommended.
The unit newton (N) is used for forces. A force of 1 N is defined as a force required to give 1
kg mass an acceleration of 1 m/s2. Since 1 kg of mass has a weight of 9.81 N, we can recognize
that 1 kg force equals 9.81 Ns.
Gravitational acceleration, g = 9.81 m/s2
The unit meter (m) is recommended for length. Thus, 1 μm = 10-6 m, and 1 mm = 1000 μm.
The unit kilogram (kg) is recommended for the mass in all computations. The pascal (Pa) is
used for pressures and stresses; 1 Pa is equivalent to 1 N/m2, from which 1 MPa = 106 Pa= 106
N/m2.

Static Bending of Thin Plates:


Micro pressure sensors work on the principle of converting strain in a deformed thin slicon
diaphragm (circular, square, or rectangular) by applied pressure into desired form of electronics
output.
Bending of a rectangular plate:
The differential equation for the deflection of a rectangular plate subject to lateral bending is
given by

In which w=w(x,y) is the lateral deflection of a flat plane due to uniformly distributed applied
pressure p. The x-y plane defines the plate as in Fig. 3.1.
Dr. Swetha Vura ICEAS

Fig. 3.1: Bending of a rectangular plate

The parameter D is the flexural rigidity of the plate given by

Where E=Young’s modulus, v=Poisson’s ratio and h=thickness of the plate


The bending moments and the bending stresses can be given by
Dr. Swetha Vura ICEAS

Bending of Circular Plates with Edge Fixed:


The following equations are for a circular plate with a radius a, thickness h and uniform
pressure p.

Fig. 3.2: A circular plate subjected to uniform pressure loading

where W=(∏a2)p and m=1/v. The negative sign in deflection indicates its downward direction.
Dr. Swetha Vura ICEAS

Bending of Rectangular Plates with all Edges Fixed:

Fig. 3.3: Bending of a rectangular plate

Bending of Square Plates with all Edges Fixed:


Square diaphragms are used commonly in micro pressure sensors because it allows easy slicing
or dicing of the silicon sensing elements from standard sized wafers.
In Fig. 3.4, by letting the two edges of the plate parallel to each other (a=b), we can get the
following expressions.
Dr. Swetha Vura ICEAS

Fig. 3.4: Bending of a square plate

Based on the geometry of diaphragm, the following can be concluded.

It is understood that circular diaphragm is most favourable. The deflection is excessive but a
mechanical stopper can be installed in the die to limit such deflection.
The square diaphragm appears to be the least favoured geometry from the maximum stress
and deflection point of view but is popular because of easy wafer dicing.

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