LM1084

SNVS037H – SEPTEMBER 1999 – REVISED MARCH 2024

LM1084 5A Low Dropout Positive Regulators

1 Features 3 Description
• Available in 3.3V, 5.0V, and adjustable versions The LM1084 is a regulator with a maximum dropout of
• Current limiting and thermal protection 1.5V at 5A of load current. The device has the same
• Output current: 5A pinout as TI's industry standard LM317.
• Industrial temperature range: −40°C to 125°C
Two resistors are required to set the output voltage of
• Line regulation: 0.015% (typical)
the adjustable output voltage version of the LM1084.
• Load regulation: 0.1% (typical)
Fixed output voltage versions integrate the adjust
2 Applications resistors.
• Post regulator for switching DC/DC converters The LM1084 circuit includes a zener trimmed band-
• High-efficiency linear regulators gap reference, current limiting, and thermal shutdown.
• Battery chargers
Refer to LM1085 for the 3A version, and the LM1086
for the 1.5A version.
Package Information
PART NUMBER PACKAGE(1) PACKAGE SIZE(2)
10.16mm ×
KTT (TO-263, 3)
LM1084 15.24mm
NDE (TO-220, 3) 10.16mm × 4.58mm

(1) For more information, see the Mechanical, Packaging, and

Orderable Information.
(2) The package size (length × width) is a nominal value and
includes pins, where applicable.

Typical Application

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM1084
SNVS037H – SEPTEMBER 1999 – REVISED MARCH 2024 www.ti.com

Table of Contents
1 Features............................................................................1 6.4 Device Functional Modes..........................................11
2 Applications..................................................................... 1 7 Application and Implementation.................................. 13
3 Description.......................................................................1 7.1 Application Information............................................. 13
4 Pin Configuration and Functions...................................3 7.2 Typical Applications.................................................. 13
5 Specifications.................................................................. 4 7.3 Power Supply Recommendations.............................19
5.1 Absolute Maximum Ratings........................................ 4 7.4 Layout....................................................................... 20
5.2 ESD Ratings............................................................... 4 8 Device and Documentation Support............................22
5.3 Recommended Operating Conditions.........................4 8.1 Receiving Notification of Documentation Updates....22
5.4 Thermal Information....................................................5 8.2 Support Resources................................................... 22
5.5 Electrical Characteristics.............................................5 8.3 Trademarks............................................................... 22
5.6 Typical Characteristics................................................ 7 8.4 Electrostatic Discharge Caution................................22
6 Detailed Description........................................................9 8.5 Glossary....................................................................22
6.1 Overview..................................................................... 9 9 Revision History............................................................ 22
6.2 Functional Block Diagram........................................... 9 10 Mechanical, Packaging, and Orderable
6.3 Feature Description.....................................................9 Information.................................................................... 23

2 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated

Product Folder Links: LM1084

 LM1084
www.ti.com SNVS037H – SEPTEMBER 1999 – REVISED MARCH 2024

4 Pin Configuration and Functions

Figure 4-1. 3-Pin TO-220 Package Top View

Figure 4-2. 3-Pin TO-263 Package Top View

Table 4-1. Pin Functions

PIN
I/O DESCRIPTION
NAME NO.
Adjust pin for the adjustable output voltage version. Ground pin for the fixed output voltage
ADJ/GND 1 -
versions.
OUTPUT 2 O Output voltage pin for the regulator.
INPUT 3 I Input voltage pin for the regulator.

Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 3

Product Folder Links: LM1084
LM1084
SNVS037H – SEPTEMBER 1999 – REVISED MARCH 2024 www.ti.com

5 Specifications
5.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1) (2)
MIN MAX UNIT
Maximum input to output voltage differential
LM1084-ADJ 29 V
LM1084-3.3 27 V
LM1084-5.0 25 V
Power dissipation(3) Internally limited
Junction temperature (TJ)(4) 150 °C
Lead temperature 260, to 10 sec °C
Storage temperature, Tstg –65 150 °C

(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. The Recommended Operating Conditions
indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured
specifications and the test conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) Power dissipation is kept in a safe range by current limiting circuitry. See the Overload Recovery section.
(4) The maximum power dissipation is a function of TJ(max) , θJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(max)–T A)/θJA. All numbers apply for packages soldered directly into a PC board. See the Thermal
Considerations.

5.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Junction temperature range (TJ)(2)
Control section –40 125 °C
Output section –40 150 °C

(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Recommended Operating Conditions
indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured
specifications and the test conditions, see the Electrical Characteristics.
(2) The maximum power dissipation is a function of TJ(max) , θJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(max)–T A)/θJA. All numbers apply for packages soldered directly into a PC board. Refer to Thermal
Considerations.

4 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated

Product Folder Links: LM1084

 LM1084
www.ti.com SNVS037H – SEPTEMBER 1999 – REVISED MARCH 2024

5.4 Thermal Information

LM1084
THERMAL METRIC(1) KTT NDE UNIT
3 PINS 3 PINS
RθJA Junction-to-ambient thermal resistance 40.4 22.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 42.6 15.5 °C/W
RθJB Junction-to-board thermal resistance 23.0 4.1 °C/W
ψJT Junction-to-top characterization parameter 9.8 2.1 °C/W
ψJB Junction-to-board characterization parameter 22.0 4.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance: Control section/Output
0.65/2.7 0.65/2.7 °C/W
section

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
note.

5.5 Electrical Characteristics

Typicals and limits apply for TJ = 25°C unless specified otherwise.
PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT
VREF Reference Voltage LM1084-ADJ, IOUT = 10 mA, VIN − VOUT = 3 V, 10 mA ≤
1.238 1.250 1.262
IOUT ≤ IFULL LOAD,1.5 V ≤ (VIN−VOUT) ≤ 25 V(3)
LM1084-ADJ, IOUT = 10 mA, VIN − VOUT = 3 V, 10 mA ≤ V
IOUT ≤ IFULL LOAD,1.5 V ≤ (VIN−VOUT) ≤ 25 V(3), –40°C ≤ TJ 1.225 1.250 1.270
≤ 125°C
VOUT Output Voltage(3) LM1084-3.3, IOUT = 0 mA, VIN = 8 V, 0 ≤ IOUT ≤ IFULL LOAD,
3.270 3.300 3.330
4.8 V ≤ VIN ≤ 15 V
V
LM1084-3.3, IOUT = 0 mA, VIN = 8 V, 0 ≤ IOUT ≤ IFULL LOAD,
3.235 3.300 3.365
4.8 V ≤ VIN ≤ 15 V , –40°C ≤ TJ ≤ 125°C
LM1084-5.0, IOUT = 0 mA, VIN = 8 V, 0 ≤ IOUT ≤ IFULL LOAD,
4.950 5.000 5.050
6.5 V ≤ VIN ≤ 20 V
V
LM1084-5.0, IOUT = 0 mA, VIN = 8 V, 0 ≤ IOUT ≤ IFULL LOAD,
4.900 5.000 5.100
6.5 V ≤ VIN ≤ 20 V, –40°C ≤ TJ ≤ 125°C
ΔVOUT Line Regulation(4) LM1084-ADJ, IOUT = 10 mA, 1.5 V ≤ (VIN – VOUT) ≤ 15 V 0.015% 0.2%
LM1084-ADJ, IOUT = 10 mA, 1.5 V ≤ (VIN – VOUT) ≤ 15 V,
0.035% 0.2%
–40°C ≤ TJ ≤ 125°C
LM1084-3.3, IOUT = 0 mA, 4.8 V ≤ VIN ≤ 15 V 0.5 6
LM1084-3.3, IOUT = 0 mA, 4.8 V ≤ VIN ≤ 15 V, –40°C ≤ TJ mV
1.0 6
≤ 125°C
LM1084-5.0, IOUT = 0 mA, 6.5 V ≤ VIN ≤ 20 V 0.5 10
LM1084-5.0, IOUT = 0 mA, 6.5 V ≤ VIN ≤ 20 V, –40°C ≤ TJ mV
1.0 10
≤ 125°C
ΔVOUT Load Regulation(4) LM1084-ADJ, (VIN – V OUT) = 3 V, 10 mA ≤ IOUT ≤ IFULL
0.1 % 0.3%
LOAD

LM1084-ADJ, (VIN – V OUT) = 3 V, 10 mA ≤ IOUT ≤ IFULL

0.2% 0.4%
LOAD, –40°C ≤ TJ ≤ 125°C

LM1084-3.3, VIN = 5 V, 0 ≤ IOUT ≤ IFULL LOAD 3 15

LM1084-3.3, VIN = 5 V, 0 ≤ IOUT ≤ IFULL LOAD, –40°C ≤ TJ ≤ mV
7 20
125°C
LM1084-5.0, VIN = 8 V, 0 ≤ IOUT ≤ IFULL LOAD 5 20
LM1084-5.0, VIN = 8 V, 0 ≤ IOUT ≤ IFULL LOAD, –40°C ≤ TJ ≤ mV
10 35
125°C
Dropout Voltage(5) LM1084-ADJ, 3.3, 5, 12, ΔVREF, ΔVOUT = 1%, IOUT = 5A,
1.3 1.5 V
–40°C ≤ TJ ≤ 125°C

Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 5

Product Folder Links: LM1084
LM1084
SNVS037H – SEPTEMBER 1999 – REVISED MARCH 2024 www.ti.com

5.5 Electrical Characteristics (continued)

Typicals and limits apply for TJ = 25°C unless specified otherwise.
PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT
ILIMIT Current Limit LM1084-ADJ, VIN− VOUT = 5 V, –40°C ≤ TJ ≤ 125°C 5.5 8.0
A
LM1084-ADJ, VIN− VOUT = 25 V, –40°C ≤ TJ ≤ 125°C 0.3 0.6
LM1084-3.3, VIN = 8 V, –40°C ≤ TJ ≤ 125°C 5.5 8.0 A
LM1084-5.0, VIN = 10 V, –40°C ≤ TJ ≤ 125°C 5.5 8.0 A
Minimum Load LM1084-ADJ, VIN − VOUT = 25 V
5 10.0 mA
Current(6)
Quiescent Current LM1084-3.3, VIN = 18 V 5.0 10.0 mA
LM1084-5.0, VIN ≤ 20 V 5.0 10.0 mA
Thermal Regulation TA = 25°C, 30 ms Pulse 0.003 0.015 %/W
Ripple Rejection fRIPPLE = 120 Hz, = COUT = 25 µF Tantalum, IOUT = 5A
LM1084-ADJ, CADJ, = 25 µF, (VIN − VO) = 3 V, –40°C ≤ TJ dB
60 75
≤ 125°C
LM1084-3.3, VIN = 6.3 V, –40°C ≤ TJ ≤ 125°C 60 72 dB
LM1084-5.0, VIN = 8 V, –40°C ≤ TJ ≤ 125°C 60 68 dB
Adjust Pin Current LM1084 55
µA
LM1084, –40°C ≤ TJ ≤ 125°C 120
Adjust Pin Current 10 mA ≤ IOUT ≤ IFULL LOAD, 1.5 V ≤ VIN − VOUT ≤ 25 V,
0.2 5 µA
Change –40°C ≤ TJ ≤ 125°C
Temperature Stability –40°C ≤ TJ ≤ 125°C 0.5%
Long Term Stability TA =125°C, 1000 Hrs 0.3% 1.0%
RMS Output Noise (% 10 Hz ≤ f≤ 10 kHz
0.003%
of VOUT)

(1) All limits are specified by testing or statistical analysis.

(2) Typical Values represent the most likely parametric norm.
(3) IFULLLOAD is defined in the current limit curves. The IFULLLOAD Curve defines the current limit as a function of input-to-output voltage.
Note that 30W power dissipation for the LM1084 is only achievable over a limited range of input-to-output voltage.
(4) Load and line regulation are measured at constant junction temperature, and are ensured up to the maximum power dissipation of
30W. Power dissipation is determined by the input/output differential and the output current. ensured maximum power dissipation will
not be available over the full input/output range.
(5) Dropout voltage is specified over the full output current range of the device.
(6) The minimum output current required to maintain regulation.

6 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated

Product Folder Links: LM1084

 LM1084
www.ti.com SNVS037H – SEPTEMBER 1999 – REVISED MARCH 2024

5.6 Typical Characteristics

Figure 5-1. Dropout Voltage (VIN−VOUT) Figure 5-2. Short-Circuit Current

Figure 5-3. Load Regulation Figure 5-4. LM1084-ADJ Ripple Rejection

Figure 5-5. LM1084-ADJ Ripple Rejection vs Current Figure 5-6. Temperature Stability

Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 7

Product Folder Links: LM1084
LM1084
SNVS037H – SEPTEMBER 1999 – REVISED MARCH 2024 www.ti.com

5.6 Typical Characteristics (continued)

Figure 5-7. Adjust Pin Current Figure 5-8. LM1084-ADJ Load Transient Response

Figure 5-9. LM1084-ADJ Line Transient Response Figure 5-10. Maximum Power Dissipation

8 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated

Product Folder Links: LM1084

 LM1084
www.ti.com SNVS037H – SEPTEMBER 1999 – REVISED MARCH 2024

6 Detailed Description
6.1 Overview
A basic functional diagram for the LM1084-ADJ (excluding protection circuitry) is shown in Figure 6-1. The
topology is basically that of the LM317 except for the pass transistor. Instead of a Darlington NPN with its two
diode voltage drop, the LM1084 uses a single NPN. This results in a lower dropout voltage. The structure of
the pass transistor is also known as a quasi LDO. The advantage of a quasi LDO over a PNP LDO is its
inherently lower quiescent current. The LM1084 is ensured to provide a minimum dropout voltage of 1.5-V over
temperature, at full load.

Figure 6-1. Basic Functional Diagram for the LM1084, Excluding Protection Circuitry

6.2 Functional Block Diagram

6.3 Feature Description

6.3.1 Ripple Rejection
Ripple rejection is a function of the open loop gain within the feed-back loop (refer to Figure 6-1 and Figure
6-4). The LM1084 exhibits 75dB of ripple rejection (typ.). When adjusted for voltages higher than VREF, the
ripple rejection decreases as a function of adjustment gain: (1+R1/R2) or VO/VREF. Therefore a 5-V adjustment
decreases ripple rejection by a factor of four (−12dB); Output ripple increases as adjustment voltage increases.

Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 9

Product Folder Links: LM1084
LM1084
SNVS037H – SEPTEMBER 1999 – REVISED MARCH 2024 www.ti.com

However, the adjustable version allows this degradation of ripple rejection to be compensated. The adjust
terminal can be bypassed to ground with a capacitor (CADJ). The impedance of the CADJ should be equal to or
less than R1 at the desired ripple frequency. This bypass capacitor prevents ripple from being amplified as the
output voltage is increased.

1/(2π × fRIPPLE*CADJ) ≤ R1 (1)

6.3.2 Load Regulation

The LM1084 regulates the voltage that appears between its output and ground pins, or between its output and
adjust pins. In some cases, line resistances can introduce errors to the voltage across the load. To obtain the
best load regulation, a few precautions are needed.
Figure 6-2 shows a typical application using a fixed output regulator. Rt1 and Rt2 are the line resistances. VLOAD
is less than the VOUT by the sum of the voltage drops along the line resistances. In this case, the load regulation
seen at the RLOAD would be degraded from the data sheet specification. To improve this, the load should be tied
directly to the output pin on the positive side and directly tied to the ground pin on the negative side.

Figure 6-2. Typical Application Using Fixed Output Regulator

When the adjustable regulator is used (Figure 6-3), the best performance is obtained with the positive side of
the resistor R1 tied directly to the output pin of the regulator rather than near the load. This eliminates line drops
from appearing effectively in series with the reference and degrading regulation. For example, a 5-V regulator
with 0.05Ω resistance between the regulator and load will have a load regulation due to line resistance of 0.05Ω
× IL. If R1 (= 125Ω) is connected near the load the effective line resistance will be 0.05Ω (1 + R2/R1) or in this
case, it is 4 times worse. In addition, the ground side of the resistor R2 can be returned near the ground of the
load to provide remote ground sensing and improve load regulation.

Figure 6-3. Best Load Regulation Using Adjustable Output Regulator

10 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated

Product Folder Links: LM1084

 LM1084
www.ti.com SNVS037H – SEPTEMBER 1999 – REVISED MARCH 2024

6.3.3 Overload Recovery

Overload recovery refers to regulator's ability to recover from a short circuited output. A key factor in the
recovery process is the current limiting used to protect the output from drawing too much power. The current
limiting circuit reduces the output current as the input to output differential increases. Refer to short circuit curve
in the Typical Characteristics section.
During normal start-up, the input to output differential is small because the output follows the input. But, if the
output is shorted, then the recovery involves a large input to output differential. Sometimes during this condition
the current limiting circuit is slow in recovering. If the limited current is too low to develop a voltage at the output,
the voltage will stabilize at a lower level. Under these conditions it may be necessary to recycle the power of the
regulator in order to get the smaller differential voltage and thus adequate start up conditions. See the Typical
Characteristics section for the short circuit current vs. input differential voltage.
6.4 Device Functional Modes
6.4.1 Output Voltage
The LM1084 adjustable version develops a 1.25-V reference voltage, (VREF), between the output and the adjust
pin. As shown in Figure 6-4, this voltage is applied across resistor R1 to generate a constant current I1. This
constant current then flows through R2. The resulting voltage drop across R2 adds to the reference voltage to
sets the desired output voltage.
The current I ADJ from the adjustment terminal introduces an output error. But because it is small (120 uA max), it
becomes negligible when R1 is in the 100 Ω range.
For fixed voltage devices, R1 and R2 are integrated inside the devices.

Figure 6-4. Basic Adjustable Regulator

6.4.2 Stability Consideration

Stability consideration primarily concerns the phase response of the feedback loop. In order for stable operation,
the loop must maintain negative feedback. The LM1084 requires a certain amount series resistance with
capacitive loads. This series resistance introduces a zero within the loop to increase phase margin and thus
increase stability. The equivalent series resistance (ESR) of solid tantalum or aluminum electrolytic capacitors is
used to provide the appropriate zero (approximately 500 kHz).
Aluminum electrolytics are less expensive than tantalums, but their ESR varies exponentially at cold
temperatures; therefore requiring close examination when choosing the desired transient response over
temperature. Tantalums are a convenient choice because their ESR varies less than 2:1 over temperature.
The recommended load, decoupling capacitance is a 10-μF tantalum or a 50-μF aluminum. These values assure
stability for the majority of applications.
The adjustable versions allow an additional capacitor to be used at the ADJ pin to increase ripple rejection. If this
is done the output capacitor should be increased to 22 μF for tantalum or to 150 μF for aluminum.
Capacitors other than tantalum or aluminum can be used at the adjust pin and the input pin. A 10-μF capacitor is
a reasonable value at the input. See the Ripple Rejection section regarding the value for the adjust pin capacitor.

Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 11

Product Folder Links: LM1084
LM1084
SNVS037H – SEPTEMBER 1999 – REVISED MARCH 2024 www.ti.com

It is desirable to have large output capacitance for applications that entail large changes in load current
(microprocessors for example). The higher the capacitance, the larger the available charge per demand. It is
also desirable to provide low ESR to reduce the change in output voltage:

ΔV = ΔI x ESR (2)

It is common practice to use several tantalum and ceramic capacitors in parallel to reduce this change in the
output voltage by reducing the overall ESR.
Output capacitance can be increased indefinitely to improve transient response and stability.
6.4.3 Protection Diodes
Under normal operation, the LM1084 regulator does not need any protection diode. With the adjustable device,
the internal resistance between the adjustment and output terminals limits the current. No diode is needed to
divert the current around the regulator even with a capacitor on the adjustment pin. The adjust pin can take a
transient signal of ±25 V with respect to the output voltage without damaging the device.
When an output capacitor is connected to a regulator and the input is shorted, the output capacitor will discharge
into the output of the regulator. The discharge current depends on the value of the capacitor, the output voltage
of the regulator, and rate of decrease of VIN. In the LM1084 regulator, the internal diode between the output and
input pins can withstand microsecond surge currents of 10A to 20A. With an extremely large output capacitor
(≥ 1000 µf), and with input instantaneously shorted to ground, the regulator could be damaged. In this case, an
external diode is recommended between the output and input pins to protect the regulator, shown in Figure 6-5.

Figure 6-5. Regulator with Protection Diode

12 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated

Product Folder Links: LM1084

 LM1084
www.ti.com SNVS037H – SEPTEMBER 1999 – REVISED MARCH 2024

7 Application and Implementation

Note
Information in the following applications sections is not part of the TI component specification, and
TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining
suitability of components for their purposes. Customers should validate and test their design
implementation to confirm system functionality.

7.1 Application Information

The LM1084 is versatile in its applications, including uses in programmable output regulation and local on-card
regulation. Or, by connecting a fixed resistor between the ADJUST and OUTPUT terminals, the LM1084 can
function as a precision current regulator. An optional output capacitor can be added to improve transient
response. The ADJUST terminal can be bypassed to achieve very high ripple-rejection ratios, which are
difficult to achieve with standard three-terminal regulators. Please note, in the following applications, if ADJ
is mentioned, it makes use of the adjustable version of the part, however, if GND is mentioned, it is the fixed
voltage version of the part.
7.2 Typical Applications
7.2.1 1.2-V to 15-V Adjustable Regulator
This part can be used as a simple low drop out regulator to enable a variety of output voltages needed for
demanding applications. By using an adjustable R2 resistor a variety of output voltages can be made possible as
shown in Figure 7-1 based on the LM1084-ADJ.

Figure 7-1. 1.2-V to 15-V Adjustable Regulator

7.2.1.1 Design Requirements

The device component count is very minimal, employing two resistors as part of a voltage divider circuit and an
output capacitor for load regulation.
7.2.1.2 Detailed Design Procedure
The voltage divider for this part is set based on the equation shown in Figure 7-1, where R1 is the upper
feedback resistor and R2 is the lower feedback resistor.

Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 13

Product Folder Links: LM1084
LM1084
SNVS037H – SEPTEMBER 1999 – REVISED MARCH 2024 www.ti.com

7.2.1.3 Application Curve

7.2.2 Adjustable at 5 V
The application shown in Figure 7-2 outlines a simple 5 V output application made possible by the LM1084-ADJ.
This application can provide 5 A at high efficiencies and very low drop-out.

Figure 7-2. Adjustable @ 5 V

14 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated

Product Folder Links: LM1084

 LM1084
www.ti.com SNVS037H – SEPTEMBER 1999 – REVISED MARCH 2024

7.2.3 5-V Regulator With Shutdown

A variation of the 5 V output regulator application with shutdown control is shown in Figure 7-3 based on the
LM1084-ADJ. It uses a simple NPN transistor on the ADJ pin to block or sink the current on the ADJ pin. If the
TTL logic is pulled high, the NPN transistor is activated and the part is disabled, outputting approximately 1.25 V.
If the TTL logic is pulled low, the NPN transistor is unbiased and the regulator functions normally.

Figure 7-3. 5-V Regulator with Shutdown

7.2.4 Battery Charger

The LM1084-ADJ can be used as a battery charger to regulate the charging current required by the battery
bank as shown in Figure 7-4. In this application the LM1084 acts as a constant voltage, constant current part
by sensing the voltage potential across the battery and compensating it to the current voltage. To maintain
this voltage, the regulator delivers the maximum charging current required to charge the battery. As the battery
approaches the fully charged state, the potential drop across the sense resistor, RS,reduces and the regulator
throttles back the current to maintain the float voltage of the battery.

Figure 7-4. Battery Charger

Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 15

Product Folder Links: LM1084
LM1084
SNVS037H – SEPTEMBER 1999 – REVISED MARCH 2024 www.ti.com

7.2.5 Adjustable Fixed Regulator

A simple adjustable, fixed range output regulator can be made possible by placing a variable resistor on the
ground of the device as shown in Figure 7-5 based on the fixed output voltage LM1084-5.0. The GND pin has a
small quiescent current of 5 mA typical. Increasing the resistance on the GND pin increases the voltage potential
across the resistor. This potential is then mirrored on to the output to increase the total output voltage by the
potential drop across the GND resistor.

Figure 7-5. Adjustable Fixed Regulator

7.2.6 Regulator with Reference

A fixed output voltage version of the LM1084-5.0 can be employed to provide an output rail and a reference rail
at the same time as shown in Figure 7-6. This simple application makes use of a reference diode, the LM136-5,
to regulate the GND voltage to a fixed 5 V based on the quiescent current generated by the GND pin. This
voltage is then added onto the output to generate a total of 10 V out.

Figure 7-6. Regulator with Reference

16 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated

Product Folder Links: LM1084

 LM1084
www.ti.com SNVS037H – SEPTEMBER 1999 – REVISED MARCH 2024

7.2.7 High Current Lamp Driver Protection

A simple constant current source with protection can be designed by controlling the impedance between the
lamp and ground. The LM1084-ADJ shown in Figure 7-7 makes use of an external TTL or CMOS input to drive
the NPN transistor. This pulls the output of the regulator to a few tenths of a volt and puts the part into current
limit. Releasing the logic will reduce the current flow across the lamp into the normal operating current thereby
protecting the lamp during startup.

Figure 7-7. High Current Lamp Driver Protection

7.2.8 Battery Backup Regulated Supply

A regulated battery backup supply can be generated by using two fixed output voltage versions of the part as
shown in Figure 7-8. The top regulator supplies the Line voltage during normal operation, however when the
input is not available, the second regulator derives power from the battery backup and regulates it to 5 V based
on the LM1084-5.0. The diodes prevent the rails from back feeding into the supply and batteries.

Figure 7-8. Battery Backup Regulated Supply

Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 17

Product Folder Links: LM1084
LM1084
SNVS037H – SEPTEMBER 1999 – REVISED MARCH 2024 www.ti.com

7.2.9 Ripple Rejection Enhancement

A very simple ripple rejection circuit is shown in Figure 7-9 using the LM1084-ADJ. The capacitor C1 smooths
out the ripple on the output by cleaning up the feedback path and preventing excess noise from feeding back
into the regulator. Please remember XC1 should be approximately equal to R1 at the ripple frequency.

Figure 7-9. Ripple Rejection Enhancement

7.2.10 Automatic Light Control

A common street light control or automatic light control circuit is designed in Figure 7-10 based on the LM1084-
ADJ. The photo transistor conducts in the presence of light and grounds the ADJ pin preventing the lamp from
turning on. However, in the absence of light, the LM1084 regulates the voltage to 1.25V between OUT and ADJ,
ensuring the lamp remains on.

Figure 7-10. Automatic Light Control

18 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated

Product Folder Links: LM1084

 LM1084
www.ti.com SNVS037H – SEPTEMBER 1999 – REVISED MARCH 2024

7.2.11 Generating Negative Supply Voltage

A quick inverting output rail or negative output rail is shown in Figure 7-11 using the LM1084 fixed output part.
By tying the output to GND, the GND node is at a relatively more negative potential than the output. This is then
interfaced to the negative application such as an operational amplifier or any other rail needing negative voltage.

Figure 7-11. Generating Negative Supply Voltage

7.2.12 Remote Sensing

Remote sensing is a method of compensating the output voltage to a very precise degree by sensing the
output and feeding it back through the feedback. The circuit implementing this is shown in Figure 7-12 using
the LM1084-ADJ. The output of the regulator is fed into a voltage follower to avoid any loading effects and the
output of the op-amp is injected into the top of the feedback resistor network. This has the effect of modulating
the voltage to a precise degree without additional loading on the output.

Figure 7-12. Remote Sensing

7.3 Power Supply Recommendations

The linear regulator input supply should be well regulated and kept at a voltage level such that the maximum
input to output voltage differential allowed by the device is not exceeded. The minimum dropout voltage (VIN –
VOUT) should be met with extra headroom when possible in order to keep the output well regulated. A 10 μF or
higher capacitor should be placed at the input to bypass noise.

Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 19

Product Folder Links: LM1084
LM1084
SNVS037H – SEPTEMBER 1999 – REVISED MARCH 2024 www.ti.com

7.4 Layout
7.4.1 Layout Guidelines
For the best overall performance, some layout guidelines should be followed. Place all circuit components on the
same side of the circuit board and as near as practical to the respective linear regulator pins. Traces should be
kept short and wide to reduce the amount of parasitic elements into the system. The actual width and thickness
of traces will depend on the current carrying capability and heat dissipation required by the end system. An array
of plated vias can be placed on the pad area underneath the TAB to conduct heat to any inner plane areas or to
a bottom-side copper plane.
7.4.1.1 Thermal Considerations
ICs heats up when in operation, and power consumption is one factor in how hot it gets. The other factor is how
well the heat is dissipated. Heat dissipation is predictable by knowing the thermal resistance between the IC and
ambient (θJA). Thermal resistance has units of temperature per power (C/W). The higher the thermal resistance,
the hotter the IC.
The LM1084 specifies the thermal resistance for each package as junction to case (θJC). In order to get the total
resistance to ambient (θJA), two other thermal resistance must be added, one for case to heat-sink (θCH) and
one for heatsink to ambient (θHA). The junction temperature can be predicted as follows:

TJ = TA + PD (θJC + θCH + θHA) = TA + PD θJA (3)

TJ is junction temperature, TA is ambient temperature, and PD is the power consumption of the device. Device
power consumption is calculated as follows:

IIN = IL + IG (4)

PD = (VIN−VOUT) IL + VINIG (5)

Figure 7-13 shows the voltages and currents which are present in the circuit.

Figure 7-13. Power Dissipation Diagram

Once the devices power is determined, the maximum allowable (θJA (max)) is calculated as:

θJA (max) = TR(max)/PD = TJ(max) − TA(max)/PD (6)

The LM1084 has different temperature specifications for two different sections of the IC: the control section
and the output section. The Thermal Information table shows the junction to case thermal resistances for each
of these sections, while the maximum junction temperatures (TJ(max)) for each section is listed in the Absolute
Maximum Ratings table. TJ(max) is 125°C for the control section, while TJ(max) is 150°C for the output section.
θJA (max) should be calculated separately for each section as follows:

θJA (max, CONTROL SECTION) = (125°C - TA(max))/PD (7)

θJA (max, OUTPUT SECTION) = (150°C - TA(max))/PD (8)

The required heat sink is determined by calculating its required thermal resistance (θHA (max)).

20 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated

Product Folder Links: LM1084

 LM1084
www.ti.com SNVS037H – SEPTEMBER 1999 – REVISED MARCH 2024

θHA (max) = θJA (max) − (θJC + θCH) (9)

(θHA (max)) should also be calculated twice as follows:

(θHA (max)) = θJA (max, CONTROL SECTION) - (θJC (CONTROL SECTION) + θCH) (10)

(θHA (max)) = θJA(max, OUTPUT SECTION) - (θJC (OUTPUT SECTION) + θCH) (11)

If thermal compound is used, θCH can be estimated at 0.2 C/W. If the case is soldered to the heat sink, then a
θCH can be estimated as 0 C/W.
After, θHA (max) is calculated for each section, choose the lower of the two θHA (max) values to determine the
appropriate heat sink.
If PC board copper is going to be used as a heat sink, then Figure 7-14 can be used to determine the
appropriate area (size) of copper foil required.

Figure 7-14. Heat Sink Thermal Resistance vs Area

7.4.2 Layout Example

Figure 7-15. Layout Example

Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 21

Product Folder Links: LM1084
LM1084
SNVS037H – SEPTEMBER 1999 – REVISED MARCH 2024 www.ti.com

8 Device and Documentation Support

8.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Notifications to register and receive a weekly digest of any product information that has changed. For change
details, review the revision history included in any revised document.
8.2 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
8.3 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
8.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.

8.5 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.

22 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated

Product Folder Links: LM1084

 LM1084
www.ti.com SNVS037H – SEPTEMBER 1999 – REVISED MARCH 2024

9 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision G (January 2015) to Revision H (March 2024) Page
• Updated the numbering format for tables, figures, and cross-references throughout the document................. 1
• Changed output deviation voltage units in LM1084-ADJ Line Transient Response figure from V to mV...........7
• Changed diode configuration in Generating Negative Supply Voltage figure...................................................19

Changes from Revision F (March 2013) to Revision G (January 2015) Page

• Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device
Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout
section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information
section ............................................................................................................................................................... 1

10 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 23

Product Folder Links: LM1084
 PACKAGE OPTION ADDENDUM

www.ti.com 30-Apr-2024

PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)

LM1084IS-3.3/NOPB ACTIVE DDPAK/ KTT 3 45 RoHS-Exempt SN Level-3-245C-168 HR -40 to 125 LM1084 Samples
TO-263 & Green IS-3.3
LM1084IS-5.0/NOPB ACTIVE DDPAK/ KTT 3 45 RoHS-Exempt SN Level-3-245C-168 HR -40 to 125 LM1084 Samples
TO-263 & Green IS-5.0
LM1084IS-ADJ/NOPB ACTIVE DDPAK/ KTT 3 45 RoHS-Exempt SN Level-3-245C-168 HR -40 to 125 LM1084 Samples
TO-263 & Green IS-ADJ
LM1084ISX-3.3/NOPB ACTIVE DDPAK/ KTT 3 500 RoHS-Exempt SN Level-3-245C-168 HR -40 to 125 LM1084 Samples
TO-263 & Green IS-3.3
LM1084ISX-5.0/NOPB ACTIVE DDPAK/ KTT 3 500 RoHS-Exempt SN Level-3-245C-168 HR -40 to 125 LM1084 Samples
TO-263 & Green IS-5.0
LM1084ISX-ADJ/NOPB ACTIVE DDPAK/ KTT 3 500 RoHS-Exempt SN Level-3-245C-168 HR -40 to 125 LM1084 Samples
TO-263 & Green IS-ADJ
LM1084IT-3.3/NOPB ACTIVE TO-220 NDE 3 45 RoHS & Green SN Level-1-NA-UNLIM -40 to 125 LM1084 Samples
IT-3.3
LM1084IT-5.0/NOPB ACTIVE TO-220 NDE 3 45 RoHS & Green SN Level-1-NA-UNLIM -40 to 125 LM1084 Samples
IT-5.0
LM1084IT-ADJ/NOPB ACTIVE TO-220 NDE 3 45 RoHS & Green SN Level-1-NA-UNLIM -40 to 125 LM1084 Samples
IT-ADJ

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Addendum-Page 1
 PACKAGE OPTION ADDENDUM

www.ti.com 30-Apr-2024

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2
 PACKAGE MATERIALS INFORMATION

www.ti.com 13-May-2024

TAPE AND REEL INFORMATION

REEL DIMENSIONS TAPE DIMENSIONS

K0 P1

B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers

Reel Width (W1)

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE

Sprocket Holes

Q1 Q2 Q1 Q2

Q3 Q4 Q3 Q4 User Direction of Feed

Pocket Quadrants

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM1084ISX-3.3/NOPB DDPAK/ KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2
TO-263
LM1084ISX-5.0/NOPB DDPAK/ KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2
TO-263
LM1084ISX-ADJ/NOPB DDPAK/ KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2
TO-263

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 13-May-2024

TAPE AND REEL BOX DIMENSIONS

Width (mm)
H
W

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM1084ISX-3.3/NOPB DDPAK/TO-263 KTT 3 500 356.0 356.0 45.0
LM1084ISX-5.0/NOPB DDPAK/TO-263 KTT 3 500 356.0 356.0 45.0
LM1084ISX-ADJ/NOPB DDPAK/TO-263 KTT 3 500 356.0 356.0 45.0

Pack Materials-Page 2
 PACKAGE MATERIALS INFORMATION

www.ti.com 13-May-2024

TUBE

T - Tube
height L - Tube length

W - Tube
width

B - Alignment groove width

*All dimensions are nominal

Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm)
LM1084IS-3.3/NOPB KTT TO-263 3 45 502 25 8204.2 9.19
LM1084IS-5.0/NOPB KTT TO-263 3 45 502 25 8204.2 9.19
LM1084IS-ADJ/NOPB KTT TO-263 3 45 502 25 8204.2 9.19
LM1084IT-3.3/NOPB NDE TO-220 3 45 502 33 6985 4.06
LM1084IT-5.0/NOPB NDE TO-220 3 45 502 33 6985 4.06
LM1084IT-ADJ/NOPB NDE TO-220 3 45 502 33 6985 4.06

Pack Materials-Page 3
 MECHANICAL DATA
NDE0003B

www.ti.com
 PACKAGE OUTLINE
KTT0003B SCALE 1.000
TO-263 - 4.83 mm max height
TO-263

B 8.64 A
OPTIONAL

2X 2.54
10.41
9.91

3
0.97
3X
0.71
0.25 C A B

14.35 MAX

1.27 MAX
0.76
0.38

0.25 4.64
GAGE PLANE 4.45 C

0.25 1.32
2.24 0.00 1.22
8 1.24
0

5.08 MIN

0 -8 3

4 5.08 MIN
0.25
2.24 GAGE PLANE
1.24 1

OPTIONAL LEAD FORM

EXPOSED
THERMAL PAD NOTE 3
NOTE 3

4215105/B 05/2023

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Features may not exist and shape may vary per different assembly sites.
4. Reference JEDEC registration TO-263, except minimum lead thickness and minimum exposed pad length.

www.ti.com
 EXAMPLE BOARD LAYOUT
KTT0003B TO-263 - 4.83 mm max height
TO-263

(6.99)

(1.91)

3X (2.16)
3X (1.07)
1

4
(2.54)
SYMM (10.8)
(8.33)

(R0.05) TYP

(14.17)

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN
SCALE:5X

0.07 MAX 0.07 MIN

ALL AROUND ALL AROUND
EXPOSED
METAL
EXPOSED
METAL
SOLDER MASK METAL SOLDER MASK
OPENING METAL UNDER OPENING
SOLDER MASK
NON SOLDER MASK SOLDER MASK
DEFINED DEFINED

SOLDER MASK DETAILS

4215105/B 05/2023

NOTES: (continued)

5. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature numbers
SLMA002(www.ti.com/lit/slm002) and SLMA004 (www.ti.com/lit/slma004).
6. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled, plugged or tented.

www.ti.com
 EXAMPLE STENCIL DESIGN
KTT0003B TO-263 - 4.83 mm max height
TO-263

(1.28) TYP (0.905)

(1.24)

3X (2.16)
3X (1.07)
1
(1.27) TYP

(4.435)
(2.54)
SYMM
4

3
EXPOSED METAL
(R0.05) TYP TYP

14.17

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

EXPOSED PAD
60% PRINTED SOLDER COVERAGE BY AREA
SCALE:6X

4215105/B 05/2023

NOTES: (continued)

7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.

www.ti.com
 IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, regulatory or other requirements.
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an
application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license
is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you
will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these
resources.
TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with
such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for
TI products.
TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2024, Texas Instruments Incorporated