HT68FV022: Voice Peripheral MCU
HT68FV022: Voice Peripheral MCU
HT68FV022: Voice Peripheral MCU
HT68FV022
Table of Contents
Features.................................................................................................................. 5
CPU Features................................................................................................................................5
Peripheral Features........................................................................................................................5
Development Tools................................................................................................ 5
General Description............................................................................................... 6
Block Diagram........................................................................................................ 6
Pin Assignment...................................................................................................... 7
Pin Description...................................................................................................... 7
Absolute Maximum Ratings.................................................................................. 8
D.C. Characteristics............................................................................................... 8
Operating Voltage Characteristics..................................................................................................8
Operating Current Characteristics..................................................................................................8
Standby Current Characteristics....................................................................................................9
A.C. Characteristics............................................................................................... 9
High Speed Internal Oscillator – HIRC – Frequency Accuracy...................................................... 9
Low Speed Internal Oscillator Characteristics – LIRC................................................................. 10
Operating Frequency Characteristic Curves................................................................................10
System Start Up Time Characteristics......................................................................................... 11
Input/Output Characteristics.............................................................................. 11
Memory Characteristics...................................................................................... 12
LVR Electrical Characteristics............................................................................ 12
Voice PWM Driver Characteristics..................................................................... 12
Audio PWM Driver Characteristics...............................................................................................12
PWM/PB0/PB1 Driver Characteristics.........................................................................................14
Data Memory........................................................................................................ 22
Structure.......................................................................................................................................22
General Purpose Data Memory...................................................................................................22
Special Purpose Data Memory....................................................................................................23
Oscillators............................................................................................................ 27
Oscillator Overview......................................................................................................................27
System Clock Configurations.......................................................................................................27
Internal High Speed RC Oscillator – HIRC..................................................................................28
Internal 32kHz Oscillator – LIRC..................................................................................................28
Watchdog Timer................................................................................................... 37
Watchdog Timer Clock Source.....................................................................................................37
Watchdog Timer Control Register................................................................................................37
Watchdog Timer Operation..........................................................................................................38
Input/Output Ports............................................................................................... 43
Pull-high Resistors.......................................................................................................................44
Port A Wake-up............................................................................................................................44
I/O Port Control Registers............................................................................................................45
Pin-shared Functions...................................................................................................................45
I/O Pin Structures.........................................................................................................................46
Programming Considerations.......................................................................................................46
Timer/Event Counter........................................................................................... 47
Timer/Event Counter Input Clock Source.....................................................................................47
Timer/Event Counter Registers....................................................................................................47
Timer/Event Counter Operating Modes.......................................................................................49
Programming Considerations.......................................................................................................51
Configuration Options......................................................................................... 64
Application Circuits............................................................................................. 65
Peripheral IC Mode.............................................................................................. 65
Features for Peripheral IC Mode..................................................................................................65
Pin Assignment for Peripheral IC Mode.......................................................................................65
Pin Descriptions for Peripheral IC Mode......................................................................................66
Control Modes..............................................................................................................................66
Application Circuits.......................................................................................................................71
Instruction Set...................................................................................................... 72
Introduction..................................................................................................................................72
Instruction Timing.........................................................................................................................72
Moving and Transferring Data......................................................................................................72
Arithmetic Operations...................................................................................................................72
Logical and Rotate Operation......................................................................................................73
Branches and Control Transfer....................................................................................................73
Bit Operations..............................................................................................................................73
Table Read Operations................................................................................................................73
Other Operations..........................................................................................................................73
Instruction Definition........................................................................................... 76
Package Information........................................................................................... 85
8-pin SOP (150mil) Outline Dimensions......................................................................................86
16-pin NSOP (150mil) Outline Dimensions..................................................................................87
Features
CPU Features
• Operating Voltage
♦ fSYS=8MHz: 2.3V~5.5V
♦ fSYS=12MHz: 2.3V~5.5V
♦ fSYS=16MHz: 3.0V~5.5V
• Up to 0.25μs instruction cycle with 16MHz system clock at VDD=5V
• Power down and wake-up functions to reduce power consumption
• Oscillator types
♦ Internal High Speed 8/12/16MHz RC – HIRC
♦ Internal Low Speed 32kHz RC – LIRC
• Multi-mode operation: FAST, SLOW, IDLE and SLEEP
• Fully integrated internal oscillators require no external components
• All instructions executed in one or two instruction cycles
• Table read instructions
• 61 powerful instructions
• 6-level subroutine nesting
• Bit manipulation instruction
Peripheral Features
• Flash Program Memory: (1K-16)×14
• RAM Data Memory: 64×8
• Voice Flash Memory: 16Mbit
• Watchdog Timer function
• 5 bidirectional I/O lines
• One external interrupt line shared with I/O pin
• One 8-bit programmable Timer/Event Counter with overflow interrupt and prescaler
• Single Time Base function for generation of fixed time interrupt signal
• Audio PWM driver
• Integrated 3.0V LDO
• Low voltage reset function – LVR
• Support Peripheral IC mode
• Package type: 8-pin SOP
Development Tools
For rapid product development and to simplify device parameter setting, Holtek has provided
relevant development tools which users can download from the following link:
https://www.holtek.com/esk-fv160-200
General Description
The device is a Flash Memory 8-bit high performance RISC architecture microcontroller, which
designed for various voice application terminal products such as smart home appliances, consumer
electronic products, etc.
For memory features, the Flash Memory offers users the convenience of multi-programming
features. Other memory includes an area of RAM Data Memory as well as an area of 16Mbit Voice
Flash Memory.
A single extremely flexible Timer/Event Counter provides timing, event counting and pulse wide
measurement functions. In addition, an internal LDO function provides power to the Voice Flash
Memory. Protective features such as an internal Watchdog Timer and Low Voltage Reset coupled
with excellent noise immunity and ESD protection ensure that reliable operation is maintained in
hostile electrical environments.
A full choice of internal high and low speed oscillators are provided, the two fully integrated system
oscillators require no external components for their implementation. The ability to operate and
switch dynamically between a range of operating modes using different clock sources gives users
the ability to optimise microcontroller operation and minimise power consumption.
The device integrates a audio PWM driver, for which the device has a digital programmable volume
control with a wide range. The device also supports the Peripheral IC mode, implementing voice
editing together with Holtek Voice MCU Workshop. The inclusion of flexible I/O programming
features, Time Base function, along with many other features ensure that the device will find
excellent use for voice application terminal products.
Block Diagram
Pin-Shared
with Port B
Reset ROM RAM
Circuit (1K-16)×14 64×8
PWM1
Stack Voice PWM
Interrupt LVR
INT 6-level PWM2
Controller
Voice Flash
Pin-Shared Watchdog
Memory
with Port A Timer
16Mbit Port A
I/O PA0~PA2
Driver
HT8 MCU Core Pin-Shared
Function
Port B
Bus
Digital Peripherals
Time Base
LIRC
32kHz
MUX
: Pin-Shared Node
Pin Assignment
N.C. 1 16 N.C.
N.C. 2 15 N.C.
VSS 3 14 BIAS
PA0/INT/ICPDA 4 13 PB0/PWM1
VSS 1 8 BIAS PA2/ICPCK 5 12 PB1/PWM2
PA0/INT/ICPDA 2 7 PB0/PWM1 PA1/TC 6 11 VDD
PA2/ICPCK 3 6 PB1/PWM2 N.C. 7 10 N.C.
PA1/TC 4 5 VDD OCDSCK 8 9 OCDSDA
HT68FV022 HT68VV022
8 SOP-A 16 NSOP-A
Note: 1. If the pin-shared pin functions have multiple outputs, the desired pin-shared function is
determined by the corresponding software control bits.
2. The OCDSDA and OCDSCK pins are supplied as OCDS dedicated pins and as such only
available for the HT68VV022 device which is the OCDS EV chip for the HT68FV022
device.
3. For the less pin count package type there will be unbounded pins which should be properly
configured to avoid unwanted power consumption resulting from floating input conditions.
Refer to the “Standby Current Considerations” and “Input/Output Ports” sections.
Pin Description
The function of each pin is listed in the following table, however the details behind how each pin is
configured is contained in other sections of the datasheet. As the Pin Description table shows the situation
for the package with the most pins, not all pins in the tables will be available on smaller package sizes.
Pin Name Function OPT I/T O/T Description
PAPU
PA0 ST CMOS General purpose I/O. Register enabled pull-high and wake-up
PAWU
PA0/INT/ICPDA INTEG
INT ST — External interrupt input
INTC0
ICPDA — ST CMOS ICP data/address
PAPU
PA1 ST CMOS General purpose I/O. Register enabled pull-high and wake-up
PA1/TC PAWU
TC — ST — Timer/Event Counter clock input
PAPU
PA2 ST CMOS General purpose I/O. Register enabled pull-high and wake-up
PA2/ICPCK PAWU
ICPCK — ST — ICP clock pin
PBPU
PB0 ST CMOS General purpose I/O. Register enabled pull-high
PB0/PWM1 PBS0
PWM1 PBS0 — CMOS PWM driver output 1
PBPU
PB1 ST CMOS General purpose I/O. Register enabled pull-high
PB1/PWM2 PBS0
PWM2 PBS0 — CMOS PWM driver output 2
BIAS BIAS — — PWR Supply IC basic power
VDD VDD — PWR — Positive power supply
VSS VSS — PWR — Negative power supply, ground
OCDSDA OCDSDA — ST CMOS OCDS data/address, for EV chip only
OCDSCK OCDSCK — ST — OCDS clock pin, for EV chip only
N.C. N.C. — — — No connected
Note: These are stress ratings only. Stresses exceeding the range specified under “Absolute
Maximum Ratings” may cause substantial damage to the device. Functional operation of the
device at other conditions beyond those listed in the specification is not implied and prolonged
exposure to extreme conditions may affect device reliability.
D.C. Characteristics
For data in the following tables, note that factors such as oscillator type, operating voltage, operating
frequency, pin load conditions, temperature and program instruction type, etc., can all exert an
influence on the measured values.
Note: When using the characteristic table data, the following notes should be taken into consideration:
1. Any digital inputs are setup in a non-floating condition.
2. All measurements are taken under conditions of no load and with all peripherals in an off state.
3. There are no DC current paths.
4. All Operating Current values are measured using a continuous NOP instruction program loop.
Note: When using the characteristic table data, the following notes should be taken into consideration:
1. Any digital inputs are setup in a non-floating condition.
2. All measurements are taken under conditions of no load and with all peripherals in an off state.
3. There are no DC current paths.
4. All Standby Current values are taken after a HALT instruction execution thus stopping all instruction
execution.
A.C. Characteristics
For data in the following tables, note that factors such as oscillator type, operating voltage, operating
frequency and temperature etc., can all exert an influence on the measured values.
Note: 1. The 3V/5V values for VDD are provided as these are the two selectable fixed voltages at which the HIRC
frequency is trimmed by the writer.
2. The row below the 3V/5V trim voltage row is provided to show the values for the full VDD range operating
voltage. It is recommended that the trim voltage is fixed at 3V for application voltage ranges from 2.3V
to 3.6V and fixed at 5V for application voltage ranges from 3.3V to 5.5V.
3. The minimum and maximum tolerance values provided in the table are only for the frequency at which
the writer trims the HIRC oscillator. After trimming at this chosen specific frequency any change in
HIRC oscillator frequency using the oscillator register control bits by the application program will give a
frequency tolerance to within ±20%.
16MHz
12MHz
8MHz
Note: 1. For the System Start-up time values, whether fSYS is on or off depends upon the mode type and the chosen
fSYS system oscillator. Details are provided in the System Operating Modes section.
2. The time units, shown by the symbols tHIRC etc., are the inverse of the corresponding frequency values as
provided in the frequency tables. For example, tHIRC=1/fHIRC, tSYS=1/fSYS etc.
3. If the LIRC is used as the system clock and if it is off when in the SLEEP Mode, then an additional LIRC
start up time, tSTART, as provided in the LIRC frequency table, must be added to the tSST time in the table
above.
4. The System Speed Switch Time is effectively the time taken for the newly activated oscillator to start up.
Input/Output Characteristics
Ta=-40°C~85°C
Test Conditions
Symbol Parameter Min. Typ. Max. Unit
VDD Conditions
VDD VDD Power Supply — — 2.3 — 5.5 V
Input Low Voltage for I/O Ports except 5V 0 — 1.5
VIL — V
PB0~PB1 Pins — 0 — 0.2VDD
Input High Voltage for I/O Ports except 5V 3.5 — 5.0
VIH — V
PB0~PB1 Pins ─ 0.8VDD — VDD
Sink Current for I/O Ports except 3V 5 10 —
IOL VOL=0.1VDD mA
PB0~PB1 Pins 5V 10 20 —
Source Current for I/O Ports except 3V -2.5 -5.0 —
IOH VOH=0.9VDD mA
PB0~PB1 Pins 5V -5 -10 —
Pull-high Resistance for I/O Ports except 3V 20 60 100
RPH — kΩ
PB0~PB1 Pins (Note) 5V 10 30 50
ILEAK Input Leakage Current for I/O Ports 5V VIN=VDD or VIN=VSS — — ±1 μA
tTC TC Input Pin Minimum Pulse Width — — 25 — — ns
tINT Interrupt Pin Minimum Pulse Width — — 0.3 — — μs
Note: The RPH internal pull-high resistance value is calculated by connecting to ground and enabling the input pin
with a pull-high resistor and then measuring the pin current at the specified supply voltage level. Dividing
the voltage by this measured current provides the RPH value.
Memory Characteristics
Ta=-40°C~85°C, unless otherwise specified
Test Conditions
Symbol Parameter Min. Typ. Max. Unit
VDD Conditions
Flash Program Memory
tDEW Erase/Write Cycle Time — — — 2 3 ms
IDDPGM Programming/Erase Current on VDD — — — — 5.0 mA
EP Cell Endurance — — 10K — — E/W
tRETD ROM Data Retention Time — Ta=25°C — 40 — Year
RAM Data Memory
VDR RAM Data Retention Voltage — — 1.0 — — V
Test Conditions
Symbol Parameter Min. Typ. Max. Unit
VDD Conditions
3V VOL=0.1VDD; DRV_EN=1 20.3 29.0 — mA
5V PWDC[3:0]=0100B 44.1 63.0 — mA
3V VOL=0.1VDD; DRV_EN=1 26.6 38.0 — mA
5V PWDC[3:0]=0101B 56.7 81.0 — mA
3V VOL=0.1VDD; DRV_EN=1 30.1 43.0 — mA
5V PWDC[3:0]=0110B 64.4 92.0 — mA
3V VOL=0.1VDD; DRV_EN=1 33.1 48.0 — mA
5V PWDC[3:0]=0111B 71.4 102.0 — mA
3V VOL=0.1VDD; DRV_EN=1 40.6 58.0 — mA
5V PWDC[3:0]=1000B 84 120 — mA
3V VOL=0.1VDD; DRV_EN=1 46.9 67.0 — mA
5V PWDC[3:0]=1001B 95.9 137.0 — mA
IOL PWM1/PWM2 Sink Current
3V VOL=0.1VDD; DRV_EN=1 53.2 76.0 — mA
5V PWDC[3:0]=1010B 107.8 154.0 — mA
3V VOL=0.1VDD; DRV_EN=1 58.1 83.0 — mA
5V PWDC[3:0]=1011B 117.6 168.0 — mA
3V VOL=0.1VDD; DRV_EN=1 72 90 — mA
5V PWDC[3:0]=1100B 144 180 — mA
3V VOL=0.1VDD; DRV_EN=1 87.2 109.0 — mA
5V PWDC[3:0]=1101B 170.4 213.0 — mA
3V VOL=0.1VDD; DRV_EN=1 116.8 146.0 — mA
5V PWDC[3:0]=1110B 217.6 272.0 — mA
3V VOL=0.1VDD; DRV_EN=1 144 180 — mA
5V PWDC[3:0]=1111B 256.8 321.0 — mA
3V VOH=0.9VDD; DRV_EN=1 -4.2 -6.0 — mA
5V PWDC[3:0]=0000B -11.2 -16.0 — mA
3V VOH=0.9VDD; DRV_EN=1 -9.1 -13.0 — mA
5V PWDC[3:0]=0001B -21.7 -31.0 — mA
3V VOH=0.9VDD; DRV_EN=1 -13.3 -19.0 — mA
5V PWDC[3:0]=0010B -31.5 -45.0 — mA
3V VOH=0.9VDD; DRV_EN=1 -17.5 -25.0 — mA
5V PWDC[3:0]=0011B -40.6 -58.0 — mA
3V VOH=0.9VDD; DRV_EN=1 -19.6 -28.0 — mA
5V PWDC[3:0]=0100B -40.6 -66.0 — mA
PWM1/PWM2 Source 3V VOH=0.9VDD; DRV_EN=1 -19.6 -37.0 — mA
IOH
Current 5V PWDC[3:0]=0101B -59.5 -85.0 — mA
3V VOH=0.9VDD; DRV_EN=1 -29.4 -42.0 — mA
5V PWDC[3:0]=0110B -67.2 -96.0 — mA
3V VOH=0.9VDD; DRV_EN=1 -32.9 -47.0 — mA
5V PWDC[3:0]=0111B -73.5 -105.0 — mA
3V VOH=0.9VDD; DRV_EN=1 -39.2 -56.0 — mA
5V PWDC[3:0]=1000B -86.1 -123.0 — mA
3V VOH=0.9VDD; DRV_EN=1 -44.8 -64.0 — mA
5V PWDC[3:0]=1001B -97.3 -139.0 — mA
3V VOH=0.9VDD; DRV_EN=1 -50.4 -72.0 — mA
5V PWDC[3:0]=1010B -109.2 -156.0 — mA
Test Conditions
Symbol Parameter Min. Typ. Max. Unit
VDD Conditions
3V VOH=0.9VDD; DRV_EN=1 -55.3 -79.0 — mA
5V PWDC[3:0]=1011B -117.6 -168.0 — mA
3V VOH=0.9VDD; DRV_EN=1 -68 -85 — mA
5V PWDC[3:0]=1100B -143.2 -179.0 — mA
PWM1/PWM2 Source 3V VOH=0.9VDD; DRV_EN=1 -81.6 -102.0 — mA
IOH
Current 5V PWDC[3:0]=1101B -167.2 -209.0 — mA
3V VOH=0.9VDD; DRV_EN=1 -106.4 -133.0 — mA
5V PWDC[3:0]=1110B -208 -260 — mA
3V VOH=0.9VDD; DRV_EN=1 -128 -160 — mA
5V PWDC[3:0]=1111B -240 -300 — mA
Test Conditions
Symbol Parameter Min. Typ. Max. Unit
VDD Conditions
3V VOL=0.1VDD; DRV_EN=1 87.2 109.0 — mA
5V PWDC[3:0]=1101B 170.4 213.0 — mA
3V VOL=0.1VDD; DRV_EN=1 116.8 146.0 — mA
IOL PB0/PB1 Sink Current
5V PWDC[3:0]=1110B 217.6 272.0 — mA
3V VOL=0.1VDD; DRV_EN=1 144 180 — mA
5V PWDC[3:0]=1111B 256.8 321.0 — mA
3V VOH=0.9VDD; DRV_EN=1 -4.2 -6.0 — mA
5V PWDC[3:0]=0000B -11.2 -16.0 — mA
3V VOH=0.9VDD; DRV_EN=1 -9.1 -13.0 — mA
5V PWDC[3:0]=0001B -21.7 -31.0 — mA
3V VOH=0.9VDD; DRV_EN=1 -13.3 -19.0 — mA
5V PWDC[3:0]=0010B -31.5 -45 — mA
3V VOH=0.9VDD; DRV_EN=1 -17.5 -25 — mA
5V PWDC[3:0]=0011B -40.6 -58.0 — mA
3V VOH=0.9VDD; DRV_EN=1 -19.6 -28.0 — mA
5V PWDC[3:0]=0100B -46.2 -66.0 — mA
3V VOH=0.9VDD; DRV_EN=1 -25.9 -37.0 — mA
5V PWDC[3:0]=0101B -59.5 -85 — mA
3V VOH=0.9VDD; DRV_EN=1 -29.4 -42.0 — mA
5V PWDC[3:0]=0110B -67.2 -96.0 — mA
3V VOH=0.9VDD; DRV_EN=1 -32.9 -47.0 — mA
5V PWDC[3:0]=0111B -73.5 -105.0 — mA
IOH PB0/PB1 Source Current
3V VOH=0.9VDD; DRV_EN=1 -39.2 -56.0 — mA
5V PWDC[3:0]=1000B -86.1 -123.0 — mA
3V VOH=0.9VDD; DRV_EN=1 -44.8 -64.0 — mA
5V PWDC[3:0]=1001B -97.3 -139.0 — mA
3V VOH=0.9VDD; DRV_EN=1 -50.4 -72.0 — mA
5V PWDC[3:0]=1010B -109.2 -156.0 — mA
3V VOH=0.9VDD; DRV_EN=1 -55.3 -79.0 — mA
5V PWDC[3:0]=1011B -117.6 -168.0 — mA
3V VOH=0.9VDD; DRV_EN=1 -68 -85 — mA
5V PWDC[3:0]=1100B -143.2 -179.0 — mA
3V VOH=0.9VDD; DRV_EN=1 -81.6 -102.0 — mA
5V PWDC[3:0]=1101B -167.2 -209.0 — mA
3V VOH=0.9VDD; DRV_EN=1 -106.4 -133.0 — mA
5V PWDC[3:0]=1110B -208 -260 — mA
3V VOH=0.9VDD; DRV_EN=1 -128 -160 — mA
5V PWDC[3:0]=1111B -240 -300 — mA
VDD
tPOR RRPOR
VPOR
Time
System Architecture
A key factor in the high-performance features of the Holtek range of microcontrollers is attributed
to their internal system architecture. The range of device takes advantage of the usual features found
within RISC microcontrollers providing increased speed of operation and enhanced performance.
The pipelining scheme is implemented in such a way that instruction fetching and instruction
execution are overlapped, hence instructions are effectively executed in one cycle, with the
exception of branch or call instructions which need one more cycle. An 8-bit wide ALU is used in
practically all instruction set operations, which carries out arithmetic operations, logic operations,
rotation, increment, decrement, branch decisions, etc. The internal data path is simplified by moving
data through the Accumulator and the ALU. Certain internal registers are implemented in the
Data Memory and can be directly or indirectly addressed. The simple addressing methods of these
registers along with additional architectural features ensure that a minimum of external components
is required to provide a functional I/O control system with maximum reliability and flexibility. This
makes the device suitable for low-cost, high-volume production for controller applications.
fSYS
(System Clock)
Phase Clock T1
Phase Clock T2
Phase Clock T3
Phase Clock T4
Instruction Fetching
Program Counter
During program execution, the Program Counter is used to keep track of the address of the
next instruction to be executed. It is automatically incremented by one each time an instruction
is executed except for instructions, such as “JMP” or “CALL” that demands a jump to a non-
consecutive Program Memory address. Only the lower 8 bits, known as the Program Counter Low
Register, are directly addressable by the application program.
When executing instructions requiring jumps to non-consecutive addresses such as a jump
instruction, a subroutine call, interrupt or reset, etc., the microcontroller manages program control
by loading the required address into the Program Counter. For conditional skip instructions, once
the condition has been met, the next instruction, which has already been fetched during the present
instruction execution, is discarded and a dummy cycle takes its place while the correct instruction is
obtained.
Program Counter
High Byte Low Byte (PCL)
PC9~PC8 PCL7~PCL0
Program Counter
The lower byte of the Program Counter, known as the Program Counter Low Byte register or
PCL, is available for program control and is a readable and writeable register. By transferring data
directly into this register, a short program jump can be executed directly; however, as only this
low byte is available for manipulation, the jumps are limited to the present page of memory that is
256 locations. When such program jumps are executed it should also be noted that a dummy cycle
will be inserted. Manipulating the PCL register may cause program branching, so an extra cycle is
needed to pre-fetch.
Stack
This is a special part of the memory which is used to save the contents of the Program Counter only.
The stack is organized into six levels and neither part of the data nor part of the program space,
and is neither readable nor writeable. The activated level is indexed by the Stack Pointer, and is
neither readable nor writeable. At a subroutine call or interrupt acknowledge signal, the contents of
the Program Counter are pushed onto the stack. At the end of a subroutine or an interrupt routine,
signaled by a return instruction, RET or RETI, the Program Counter is restored to its previous value
from the stack. After a device reset, the Stack Pointer will point to the top of the stack.
If the stack is full and an enabled interrupt takes place, the interrupt request flag will be recorded but
the acknowledge signal will be inhibited. When the Stack Pointer is decremented, by RET or RETI,
the interrupt will be serviced. This feature prevents stack overflow allowing the programmer to use
the structure more easily. However, when the stack is full, a CALL subroutine instruction can still
be executed which will result in a stack overflow. Precautions should be taken to avoid such cases
which might cause unpredictable program branching.
If the stack is overflow, the first Program Counter save in the stack will be lost.
Program Counter
Structure
The Program Memory has a capacity of (1K-16)×14 bits. Note that the subtractive 16×14-bit space
is reserved and cannot be used. The Program Memory is addressed by the Program Counter and also
contains data, table information and interrupt entries. Table data, which can be setup in any location
within the Program Memory, is addressed by a separate table pointer register.
000H
Initialisation Vector
004H
Interrupt Vectors
010H
n00H
Look-up Table
nFFH
14 bits
16×14
3FFH
Special Vectors
Within the Program Memory, certain locations are reserved for the reset and interrupts. The location
000H is reserved for use by the device reset for program initialisation. After a device reset is
initiated, the program will jump to this location and begin execution.
Look-up Table
Any location within the Program Memory can be defined as a look-up table where programmers can
store fixed data. To use the look-up table, the table pointer must first be setup by placing the address
of the look up data to be retrieved in the table pointer register, TBLP. This register defines the total
address of the look-up table.
After setting up the table pointer, the table data can be retrieved from the Program Memory using
the “TABRD [m]” or “TABRDL [m]” instruction. When the instruction is executed, the lower order
table byte from the Program Memory will be transferred to the user defined Data Memory register [m]
as specified in the instruction. The higher order table data byte from the Program Memory will be
transferred to the TBLH special register.
The accompanying diagram illustrates the addressing data flow of the look-up table.
Last page or
present page
PC9~PC8 Program Memory
PC High Byte
Address
Data
14 bits
TBLP Register
User Selected
Register TBLH Register
High Byte Low Byte
The Program Memory can be programmed serially in-circuit using this 6-wire interface. Data is
downloaded and uploaded serially on two pins and an additional line for the clock and one pin for
chip select. Two additional lines are required for the power supply. The technical details regarding
the in-circuit programming of the device are beyond the scope of this document and will be supplied
in supplementary literature.
During the programming process, the user must take control of the ICPDA/MOSI, ICPCK/SCK,
MISO and CS pins for data and clock programming purposes to ensure that no other outputs are
connected to these four pins.
Writer_VDD VDD
MISO PA1
ICPDA/MOSI PA0
ICPCK/SCK PA2
CS PB1
Writer_VSS VSS
* * * *
To other Circuit
Note: * may be resistor or capacitor. The resistance of * must be greater than 1kΩ or the capacitance
of * must be less than 1nF.
Data Memory
The Data Memory is a volatile area of 8-bit wide RAM internal memory and is the location where
temporary information is stored.
Structure
Categorized into two types, the first of these is an area of RAM where special function registers are
located. These registers have fixed locations and are necessary for correct operation of the device.
Many of these registers can be read from and written to directly under program control, however, some
remain protected from user manipulation. The second area of Data Memory is reserved for general
purpose use. All locations within this area are read and write accessible under program control.
The start address of the Data Memory for the device is 00H. The address range of the Special
Purpose Data Memory for the device is from 00H to 3FH while the General Purpose Data Memory
address range is from 40H to 7FH.
00H
Special Purpose
Data Memory
3FH
40H
General Purpose
Data Memory
7FH Bank 0
and writing operations. By using the bit operation instructions individual bits can be set or reset under
program control giving the user a large range of flexibility for bit manipulation in the Data Memory.
loop:
clr IAR0 ; clear the data at address defined by MP0
inc mp0 ; increase memory pointer
sdz block ; check if last memory location has been cleared
jmp loop
continue:
The important point to note here is that in the example shown above, no reference is made to specific
Data Memory addresses.
Accumulator – ACC
The Accumulator is central to the operation of any microcontroller and is closely related with
operations carried out by the ALU. The Accumulator is the place where all intermediate results
from the ALU are stored. Without the Accumulator it would be necessary to write the result of
each calculation or logical operation such as addition, subtraction, shift, etc., to the Data Memory
resulting in higher programming and timing overheads. Data transfer operations usually involve
the temporary storage function of the Accumulator; for example, when transferring data between
one user-defined register and another, it is necessary to do this by passing the data through the
Accumulator as no direct transfer between two registers is permitted.
The Z, OV, AC, C, SC and CZ flags generally reflect the status of the latest operations.
• C is set if an operation results in a carry during an addition operation or if a borrow does not take
place during a subtraction operation; otherwise C is cleared. C is also affected by a rotate through
carry instruction.
• AC is set if an operation results in a carry out of the low nibbles in addition, or no borrow from
the high nibble into the low nibble in subtraction; otherwise AC is cleared.
• Z is set if the result of an arithmetic or logical operation is zero; otherwise Z is cleared.
• OV is set if an operation results in a carry into the highest-order bit but not a carry out of the
highest-order bit, or vice versa; otherwise OV is cleared.
• PDF is cleared by a system power-up or executing the “CLR WDT” instruction. PDF is set by
executing the “HALT” instruction.
• TO is cleared by a system power-up or executing the “CLR WDT” or “HALT” instruction. TO is
set by a WDT time-out.
• CZ is the operational result of different flags for different instructions. Refer to register definitions
for more details.
• SC is the result of the “XOR” operation which is performed by the OV flag and the MSB of the
current instruction operation result.
In addition, on entering an interrupt sequence or executing a subroutine call, the status register will
not be pushed onto the stack automatically. If the contents of the status register are important and if
the subroutine can corrupt the status register, precautions must be taken to correctly save it.
• STATUS Register
Bit 7 6 5 4 3 2 1 0
Name SC CZ TO PDF OV Z AC C
R/W R/W R/W R R R/W R/W R/W R/W
POR x x 0 0 x x x x
“x”: unknown
Bit 7 SC: The result of the “XOR” operation which is performed by the OV flag and the
MSB of the instruction operation result.
Bit 6 CZ: The operational result of different flags for different instructions.
For SUB/SUBM instructions, the CZ flag is equal to the Z flag.
For SBC/SBCM instructions, the CZ flag is the “AND” operation result which is
performed by the previous operation CZ flag and current operation zero flag.
For other instructions, the CZ flag will not be affected.
Bit 5 TO: Watchdog Time-out flag
0: After power up or executing the “CLR WDT” or “HALT” instruction
1: A watchdog time-out occurred
Bit 4 PDF: Power down flag
0: After power up or executing the “CLR WDT” instruction
1: By executing the “HALT” instruction
Bit 3 OV: Overflow flag
0: No overflow
1: An operation results in a carry into the highest-order bit but not a carry out of the
highest-order bit or vice versa
Bit 2 Z: Zero flag
0: The result of an arithmetic or logical operation is not zero
1: The result of an arithmetic or logical operation is zero
Oscillators
Various oscillator options offer the user a wide range of functions according to their various
application requirements. The flexible features of the oscillator functions ensure that the best
optimisation can be achieved in terms of speed and power saving. Oscillator operations are selected
through the combination of configuration option and relevant control registers.
Oscillator Overview
In addition to being the source of the main system clock the oscillators also provide clock sources
for the Watchdog Timer and Time Base Interrupt. Two fully integrated internal oscillators, requiring
no external components, are provided to form a wide range of both fast and slow system oscillators.
The higher frequency oscillator provides higher performance but carry with it the disadvantage of
higher power requirements, while the opposite is of course true for the lower frequency oscillator.
With the capability of dynamically switching between fast and slow system clock, the device has the
flexibility to optimize the performance/power ratio, a feature especially important in power sensitive
portable applications.
Type Name Frequency
Internal High Speed RC HIRC 8/12/16MHz
Internal Low Speed RC LIRC 32kHz
Oscillator Types
fH
fH/2
High Speed
Oscillator fH/4
HIRC fH/8
IDLE0 Prescaler fH/16 fSYS
SLEEP
fH/32
HIRCEN
fH/64
fSUB
Low Speed
Oscillator
CKS2~CKS0
LIRC
IDLE2 fSUB
SLEEP
fLIRC
System Clocks
The device has many different clock sources for both the CPU and peripheral function operation. By
providing the user with a wide range of clock options using register programming, a clock system
can be configured to obtain maximum application performance.
The main system clock, can come from a high frequency, fH, or low frequency, fSUB, source, and is
selected using the CKS2~CKS0 bits in the SCC register. The high speed system clock is sourced
from the HIRC oscillator. The low speed system clock source is sourced from the LIRC oscillator.
The other choice, which is a divided version of the high speed system oscillator has a range of
fH/2~fH/64.
fH
fH/2
High Speed
Oscillator fH/4
fH/8
HIRC
IDLE0 Prescaler fH/16 fSYS
SLEEP
fH/32
HIRCEN
fH/64
fSUB
Low Speed
Oscillator
CKS2~CKS0
LIRC
IDLE2 fSUB
SLEEP
TBON
Time
Base
fSUB
fTP 12-stage TB[2:0]
fSYS Divider
fLIRC
WDT Timer
TS
TPSC[2:0]
Note: When the system clock source fSYS is switched to fSUB from fH, the high speed oscillator will
stop to conserve the power or continue to oscillate to provide the clock source, fH~fH/64, for
peripheral circuit to use, which is determined by configuring the corresponding high speed
oscillator enable control bit.
FAST Mode
This is one of the main operating modes where the microcontroller has all of its functions
operational and where the system clock is provided by the high speed oscillator. This mode operates
allowing the microcontroller to operate normally with a clock source which will come from the high
speed oscillator, HIRC. The high speed oscillator will however first be divided by a ratio ranging
from 1 to 64, the actual ratio being selected by the CKS2~CKS0 bits in the SCC register. Although
a high speed oscillator is used, running the microcontroller at a divided clock ratio reduces the
operating current.
SLOW Mode
This is also a mode where the microcontroller operates normally although now with a slower speed
clock source. The clock source used will be from fSUB. The fSUB clock is derived from the LIRC
oscillator.
SLEEP Mode
The SLEEP Mode is entered when a HALT instruction is executed and when the FHIDEN and
FSIDEN bit both are low. In the SLEEP mode the CPU will be stopped. The fSUB clock provided to
the peripheral function will also be stopped. However, the fLIRC clock can continue to operate if the
WDT function is enabled.
IDLE0 Mode
The IDLE0 Mode is entered when a HALT instruction is executed and when the FHIDEN bit in the
SCC register is low and the FSIDEN bit in the SCC register is high. In the IDLE0 Mode the CPU
will be switched off but the low speed oscillator will be turned on to drive some peripheral functions.
IDLE1 Mode
The IDLE1 Mode is entered when a HALT instruction is executed and when the FHIDEN bit in the
SCC register is high and the FSIDEN bit in the SCC register is high. In the IDLE1 Mode the CPU
will be switched off but both the high and low speed oscillators will be turned on to provide a clock
source to keep some peripheral functions operational.
IDLE2 Mode
The IDLE2 Mode is entered when a HALT instruction is executed and when the FHIDEN bit in the
SCC register is high and the FSIDEN bit in the SCC register is low. In the IDLE2 Mode the CPU
will be switched off but the high speed oscillator will be turned on to provide a clock source to keep
some peripheral functions operational.
Control Registers
The SCC and HIRCC registers are used to control the system clock and the HIRC oscillator
configurations.
Register Bit
Name 7 6 5 4 3 2 1 0
SCC CKS2 CKS1 CKS0 — — — FHIDEN FSIDEN
HIRCC — — — — HIRC1 HIRC0 HIRCF HIRCEN
System Operating Mode Control Register List
• SCC Register
Bit 7 6 5 4 3 2 1 0
Name CKS2 CKS1 CKS0 — — — FHIDEN FSIDEN
R/W R/W R/W R/W — — — R/W R/W
POR 0 0 0 — — — 0 0
• HIRCC Register
Bit 7 6 5 4 3 2 1 0
Name — — — — HIRC1 HIRC0 HIRCF HIRCEN
R/W — — — — R/W R/W R R/W
POR — — — — 0 0 0 1
FAST SLOW
fSYS=fH~fH/64 fSYS=fSUB
fH on fSUB on
CPU run CPU run
fSYS on fSYS on
fSUB on fH on/off
SLEEP IDLE0
HALT instruction executed HALT instruction executed
CPU stop CPU stop
FHIDEN=0 FHIDEN=0
FSIDEN=0 FSIDEN=1
fH off fH off
fSUB off fSUB on
IDLE2 IDLE1
HALT instruction executed HALT instruction executed
CPU stop CPU stop
FHIDEN=1 FHIDEN=1
FSIDEN=0 FSIDEN=1
fH on fH on
fSUB off fSUB on
FAST Mode
CKS2~CKS0=111
SLOW Mode
FHIDEN=0, FSIDEN=0
HALT instruction is executed
SLEEP Mode
FHIDEN=0, FSIDEN=1
HALT instruction is executed
IDLE0 Mode
FHIDEN=1, FSIDEN=1
HALT instruction is executed
IDLE1 Mode
FHIDEN=1, FSIDEN=0
HALT instruction is executed
IDLE2 Mode
SLOW Mode
CKS2~CKS0=000~110
FAST Mode
FHIDEN=0, FSIDEN=0
HALT instruction is executed
SLEEP Mode
FHIDEN=0, FSIDEN=1
HALT instruction is executed
IDLE0 Mode
FHIDEN=1, FSIDEN=1
HALT instruction is executed
IDLE1 Mode
FHIDEN=1, FSIDEN=0
HALT instruction is executed
IDLE2 Mode
• The fH clock will be stopped and the application program will stop at the “HALT” instruction, but
the fSUB clock will be on.
• The Data Memory contents and registers will maintain their present condition.
• The I/O ports will maintain their present conditions.
• In the status register, the Power Down flag, PDF, will be set and the Watchdog time-out flag, TO,
will be cleared.
• The WDT will be cleared and resume counting if the WDT function is enabled. If the WDT
function is disabled, the WDT will be cleared and then stopped.
Care must also be taken with the loads, which are connected to I/O pins, which are setup as outputs.
These should be placed in a condition in which minimum current is drawn or connected only to
external circuits that do not draw current, such as other CMOS inputs. Also note that additional
standby current will also be required if the LIRC oscillator has been enabled.
In the IDLE1 and IDLE2 Modes the high speed oscillator is on, if the peripheral function clock
source is derived from the high speed oscillator, the additional standby current will also be perhaps
in the order of several hundred micro-amps.
Wake-up
To minimise power consumption the device can enter the SLEEP or any IDLE Mode, where the
CPU will be switched off. However, when the device is woken up again, it will take a considerable
time for the original system oscillator to restart, stabilise and allow normal operation to resume.
After the system enters the SLEEP or IDLE Mode, it can be woken up from one of various sources
listed as follows:
• An external falling edge on Port A
• A system interrupt
• A WDT overflow
When the device executes the “HALT” instruction, it will enter the IDLE or SLEEP mode and the
PDF flag will be set high. The PDF flag is cleared to 0 if the device experiences a system power-up
or executs the clear Watchdog Timer instruction.
If the system is woken up by a WDT overflow, a Watchdog Timer time-out reset will be initiated and
the TO flag will be set to 1. The TO flag is set high if a WDT time-out occurs, and causes a wake-
up that only resets the Program Counter and Stack Pointer, the other flags remain in their original
status.
Each pin on Port A can be setup using the PAWU register to permit a negative transition on the
pin to wake up the system. When a pin wake-up occurs, the program will resume execution at the
instruction following the “HALT” instruction.
If the system is woken up by an interrupt, then two possible situations may occur. The first is where
the related interrupt is disabled or the interrupt is enabled but the stack is full, in which case the
program will resume execution at the instruction following the “HALT” instruction. In this situation,
the interrupt which woke up the device will not be immediately serviced, but will rather be serviced
later when the related interrupt is finally enabled or when a stack level becomes free. The other
situation is where the related interrupt is enabled and the stack is not full, in which case the regular
interrupt response takes place. If an interrupt request flag is set high before entering the SLEEP or
IDLE Mode, the wake-up function of the related interrupt will be disabled.
Watchdog Timer
The Watchdog Timer is provided to prevent program malfunctions or sequences from jumping to
unknown locations, due to certain uncontrollable external events such as electrical noise.
• WDTC Register
Bit 7 6 5 4 3 2 1 0
Name WE4 WE3 WE2 WE1 WE0 WS2 WS1 WS0
R/W R/W R/W R/W R/W R/W R/W R/W R/W
POR 0 1 0 1 0 1 1 1
• RSTFC Register
Bit 7 6 5 4 3 2 1 0
Name — — — — — LVRF LRF WRF
R/W — — — — — R/W R/W R/W
POR — — — — — x 0 0
“x”: unknown
Bit 7~3 Unimplemented, read as “0”
Bit 2 LVRF: LVR function reset flag
Refer to the Low Voltage Reset section.
Bit 1 LRF: LVR control register software reset flag
Refer to the Low Voltage Reset section.
Under normal program operation, a Watchdog Timer time-out will initialise a device reset and set the
status bit TO high. However, if the system is in the SLEEP or IDLE Mode, when a Watchdog Timer
time-out occurs, the TO and PDF bits in the status register will be set high and only the Program
Counter and Stack Pointer will be reset. Three methods can be adopted to clear the contents of the
Watchdog Timer. The first is a WDTC software reset, which means a certain value except 01010B
and 10101B written into the WE4~WE0 bits, the second is using the Watchdog Timer software clear
instruction and the third is via a HALT instruction.
There is only one method of using software instruction to clear the Watchdog Timer. That is to use
the single “CLR WDT” instruction to clear the WDT.
WS2~WS0
(fLIRC/20 ~ fLIRC/27)
Watchdog Timer
Reset Functions
There are several ways in which a microcontroller reset can occur, through events occurring
internally.
Power-on Reset
The most fundamental and unavoidable reset is the one that occurs after power is first applied to
the microcontroller. As well as ensuring that the Program Memory begins execution from the first
memory address, a power-on reset also ensures that certain other registers are preset to known
conditions. All the I/O port and port control registers will power up in a high condition ensuring that
all pins will be first set to inputs.
VDD
Power-on Reset
tRSTD
SST Time-out
LVR
tRSTD + tSST
Internal Reset
Register Bit
Name 7 6 5 4 3 2 1 0
LVRC LVS7 LVS6 LVS5 LVS4 LVS3 LVS2 LVS1 LVS0
TLVRC — — — — — — TLVR1 TLVR0
Low Voltage Reset Register List
• LVRC Register
Bit 7 6 5 4 3 2 1 0
Name LVS7 LVS6 LVS5 LVS4 LVS3 LVS2 LVS1 LVS0
R/W R/W R/W R/W R/W R/W R/W R/W R/W
POR 0 1 1 0 0 1 1 0
• TLVRC Register
Bit 7 6 5 4 3 2 1 0
Name — — — — — — TLVR1 TLVR0
R/W — — — — — — R/W R/W
POR — — — — — — 0 1
• RSTFC Register
Bit 7 6 5 4 3 2 1 0
Name — — — — — LVRF LRF WRF
R/W — — — — — R/W R/W R/W
POR — — — — — x 0 0
“x”: unknown
Bit 7~3 Unimplemented, read as “0”
Bit 2 LVRF: LVR function reset flag
0: Not occurred
1: Occurred
This bit is set high when an actual Low Voltage Reset situation occurs. This bit can
only be cleared to zero by the application program.
Bit 1 LRF: LVR control register software reset flag
0: Not occurred
1: Occurred
This bit is set high by the LVRC control register containing any undefined LVR
voltage register values. This in effect acts like a software reset function. Note that this
bit can only be cleared to zero by the application program.
Bit 0 WRF: WDTC register software reset flag
Refer to the Watchdog Timer Control Register section.
WDT Time-out
tRSTD
Internal Reset
WDT Time-out
tSST
Internal Reset
The different kinds of resets all affect the internal registers of the microcontroller in different ways.
To ensure reliable continuation of normal program execution after a reset occurs, it is important to
know what condition the microcontroller is in after a particular reset occurs. The following table
describes how each type of reset affects each of the microcontroller internal registers.
WDT Time-out WDT Time-out
Register Power-On Reset
(Normal Operation) (IDLE/SLEEP)
IAR0 xxxx xxxx uuuu uuuu uuuu uuuu
MP0 xxxx xxxx uuuu uuuu uuuu uuuu
IAR1 xxxx xxxx uuuu uuuu uuuu uuuu
MP1 xxxx xxxx uuuu uuuu uuuu uuuu
ACC xxxx xxxx uuuu uuuu uuuu uuuu
PCL 0000 0000 0000 0000 0000 0000
TBLP xxxx xxxx uuuu uuuu uuuu uuuu
TBLH --xx xxxx --uu uuuu --uu uuuu
STATUS xx00 xxxx uu1u uuuu uu11 uuuu
RSTFC ---- -x00 ---- -uuu ---- -uuu
INTC0 -000 0000 -000 0000 -uuu uuuu
INTC1 -000 -000 -000 -000 -uuu -uuu
INTEG ---- --00 ---- --00 ---- --uu
PA 1111 -111 1111 -111 uuuu -uuu
PAC 1111 -111 1111 -111 uuuu -uuu
PAPU 0000 -000 0000 -000 uuuu -uuu
PAWU 0000 -000 0000 -000 uuuu -uuu
PB ---- --11 ---- --11 ---- --uu
PBC ---- --11 ---- --11 ---- --uu
PBPU ---- --00 ---- --00 ---- --uu
PBS0 ---- 0000 ---- 0000 ---- uuuu
Input/Output Ports
Holtek microcontrollers offer considerable flexibility on their I/O ports. With the input or output
designation of every pin fully under user program control, pull-high selections for all ports and
wake-up selections on certain pins, the user is provided with an I/O structure to meet the needs of a
wide range of application possibilities.
The device provides bidirectional input/output lines labeled with port names PA~PB. These I/O
ports are mapped to the RAM Data Memory with specific addresses as shown in the Special Purpose
Data Memory table. All of these I/O ports can be used for input and output operations. For input
operation, these ports are non-latching, which means the inputs must be ready at the T2 rising edge
of instruction “MOV A, [m]”, where m denotes the port address. For output operation, all the data is
latched and remains unchanged until the output latch is rewritten.
Register Bit
Name 7 6 5 4 3 2 1 0
PA D7 D6 D5 D4 — PA2 PA1 PA0
PAC D7 D6 D5 D4 — PAC2 PAC1 PAC0
PAPU D7 D6 D5 D4 — PAPU2 PAPU1 PAPU0
PAWU D7 D6 D5 D4 — PAWU2 PAWU1 PAWU0
PB — — — — — — PB1 PB0
PBC — — — — — — PBC1 PBC0
PBPU — — — — — — PBPU1 PBPU0
“—”: Unimplemented, read as “0”
I/O Logic Function Register List
Pull-high Resistors
Many product applications require pull-high resistors or pull-low resistors for their switch inputs
usually requiring the use of an external resistor. To eliminate the need for these external resistors,
all I/O pins, when configured as a digital input have the capability of being connected to an internal
pull-high resistor or pull-low resistor. These pull-high resistors are selected using the PxPU register
and are implemented using weak PMOS transistors.
Note that the pull-high resistors can be controlled by the relevant pull-high control register only
when the pin-shared functional pin is selected as a digital input or NMOS output. Otherwise, the
pull-high resistors cannot be enabled.
• PxPU Register
Bit 7 6 5 4 3 2 1 0
Name PxPU7 PxPU6 PxPU5 PxPU4 PxPU3 PxPU2 PxPU1 PxPU0
R/W R/W R/W R/W R/W R/W R/W R/W R/W
POR 0 0 0 0 0 0 0 0
Port A Wake-up
The HALT instruction forces the microcontroller into the SLEEP or IDLE Mode which preserves
power, a feature that is important for battery and other low-power applications. Various methods
exist to wake up the microcontroller, one of which is to change the logic condition on one of the Port
A pins from high to low. This function is especially suitable for applications that can be woken up
via external switches. Each pin on Port A can be selected individually to have this wake-up feature
using the PAWU register.
Note that the wake-up function can be controlled by the wake-up control register only when the pin
is selected as a general purpose input and the MCU enters the IDLE or SLEEP mode.
• PAWU Register
Bit 7 6 5 4 3 2 1 0
Name D7 D6 D5 D4 — PAWU2 PAWU1 PAWU0
R/W R/W R/W R/W R/W — R/W R/W R/W
POR 0 0 0 0 — 0 0 0
• PxC Register
Bit 7 6 5 4 3 2 1 0
Name PxC7 PxC6 PxC5 PxC4 PxC3 PxC2 PxC1 PxC0
R/W R/W R/W R/W R/W R/W R/W R/W R/W
POR 1 1 1 1 1 1 1 1
• PBS0 Register
Bit 7 6 5 4 3 2 1 0
Name — — — — PBS03 PBS02 PBS01 PBS00
R/W — — — — R/W R/W R/W R/W
POR — — — — 0 0 0 0
VDD
Pull-high
Control Bit Register Weak
Select Pull-up
Data Bus D Q
Programming Considerations
Within the user program, one of the first things to consider is port initialisation. After a reset, all
of the I/O data and port control registers will be set high. This means that all I/O pins will default
to an input state, the level of which depends on the other connected circuitry and whether pull-
high selections have been chosen. If the port control registers are then programmed to setup some
pins as outputs, these output pins will have an initial high output value unless the associated port
data registers are first programmed. Selecting which pins are inputs and which are outputs can be
achieved byte-wide by loading the correct values into the appropriate port control register or by
programming individual bits in the port control register using the “SET [m].i” and “CLR [m].i”
instructions. Note that when using these bit control instructions, a read-modify-write operation takes
place. The microcontroller must first read in the data on the entire port, modify it to the required new
bit values and then rewrite this data back to the output ports.
Port A has the additional capability of providing wake-up functions. When the device is in the SLEEP
or IDLE Mode, various methods are available to wake the device up. One of these is a high to low
transition of any of the Port A pins. Single or multiple pins on Port A can be setup to have this function.
Timer/Event Counter
The provision of the Timer/Event Counter forms an important part of any microcontroller, giving the
designer a means of carrying out time related functions. The device contains an 8-bit Timer/Event
Counter, which contains an 8-bit programmable count-up counter and the clock may come from an
external or internal clock source. As the timer has three different operating modes, it can be configured
to operate as a general timer, an external event counter or a pulse width measurement device.
TC
Pulse Width 8-bit Timer/Event Overflow to
TM1
Measurement Counter interrupt (TMINT)
TEG TM0
Mode Control
TON
Register Bit
Name 7 6 5 4 3 2 1 0
TMR D7 D6 D5 D4 D3 D2 D1 D0
TMRC TM1 TM0 TS TON TEG TPSC2 TPSC1 TPSC0
Timer/Event Counter Register List
• TMR Register
Bit 7 6 5 4 3 2 1 0
Name D7 D6 D5 D4 D3 D2 D1 D0
R/W R/W R/W R/W R/W R/W R/W R/W R/W
POR 0 0 0 0 0 0 0 0
• TMRC Register
Bit 7 6 5 4 3 2 1 0
Name TM1 TM0 TS TON TEG TPSC2 TPSC1 TPSC0
R/W R/W R/W R/W R/W R/W R/W R/W R/W
POR 0 0 0 0 1 0 0 0
Timer Mode
To select this mode, bits TM1 and TM0 in the TMRC register should be set to “10” respectively.
In this mode, the Timer/Event Counter can be utilised to measure fixed time intervals, providing an
internal interrupt signal each time the Timer/Event Counter overflows.
When operating in this mode the internal clock fTP is used as the timer clock, which can be selected
to be devirved from fSYS or fSUB by setting the TS bit in the TMRC register. The division of the fTP
clock is selected by the TPSC2~TPSC0 bits in the same register. The timer-on bit TON must be
set high to enable the timer to run. Each time an internal clock high to low transition occurs, the
timer increases by one. When the timer reaches its maximum 8-bit, FFH Hex, value and overflows,
an interrupt signal is generated and the timer will reload the value already loaded into the preload
register and continue counting. It should be noted that in the Timer mode, even if the device is in
the IDLE/SLEEP mode, if the selected internal clock is still activated and a timer overflow occurs, it
will generate a timer interrupt and corresponding wake-up source.
Prescaler
Output
Increment
Timer + 1 Timer + 2 Timer + N Timer + N + 1
Timer Controller
level. When the Timer/Event Counter is full and overflows, an interrupt signal is generated and the
Timer/Event Counter will reload the value already loaded into the preload register and continue counting.
It should be noted that in the Pulse Width Measurement mode, even if the device is in the
IDLE/SLEEP Mode, the Timer/Event Counter will continue to record externally changing logic
events on the TC pin if the selected internal clock source is still activated and the external signal
continues to change state. As a result when the timer overflows it will generate a timer interrupt and
corresponding wake-up source.
External TC Pin Input
TON – with TE = 0
Increment
Timer +1 +2 +3 +4
Timer Counter
Prescaler Output is sampled at every falling edge of T1.
Programming Considerations
When running in the Timer Mode, if the internal system clock is used as the timer clock source,
the timer can be synchronised with the overall operation of the microcontroller. In this mode when
the timer register is full, the microcontroller will generate an internal interrupt signal directing
the program flow to the respective internal interrupt vector. For the Pulse Width Measurment
Mode, the internal clock is also used as the timer clock source but the timer will only run when
the correct logic condition appears on the external timer input pin. As this is an external event and
not synchronised with the internal timer clock, the microcontroller will only see this external event
when the next timer clock pulse arrives. As a result, there may be small errors in measured values
requiring programmers to take this into account during programming. The same applies if the
timer is configured to operate in the Event Counter Mode, which again is an external event and not
synchronised with the internal timer clock.
When the Timer/Event Counter is read, or if data is written to the preload register, the clock is
inhibited to avoid errors, however as this may result in a counting error, it should be taken into
account by the programmer. Care must be taken to ensure that the timers are properly initialised
before using them for the first time. The associated timer interrupt enable bit in the interrupt control
register must be properly set otherwise the internal interrupt associated with the timer will remain
inactive. The active edge selection, timer operating mode selection and clock source control bits in
timer control register must also be correctly issued to ensure the timer is properly configured for the
required applications. It is also important to ensure that a desired initial value is first loaded into the
timer register before the timer is switched on. After the timer has been initialised the timer can be
turned on and off by controlling the enable bit in the timer control register.
When the Timer/Event Counter overflows, its corresponding interrupt request flag in the interrupt
control register will be set to generate an interrupt signal. If the Timer/Event Counter interrupt
is enabled this will in turn allow program branch to its interrupt vector. However irrespective of
whether the interrupt is enabled or not, a Timer/Event Counter overflow will also generate a wake-
up signal if the device is in the IDLE/SLEEP mode. This situation may occur if the Timer/Event
Counter internal clock source is still activated or if the external signal continues to change state. In
such cases, the Timer/Event Counter will continue to count and if an overflow occurs the device will
be woken up. To prevent such a wake-up from occurring, the timer interrupt request flag should first
be set high before issuing the “HALT” instruction to enter the IDLE/SLEEP mode.
8
PLADH 13 PWM1/PB0
8 13-bit Buffer 13-bit PWM PWM Driver
PLADL PWM2/PB1
PWM_BSEL[1:0]
÷2
4MHz 64MHz PWM_MODE
fH ÷3 PLL
÷4
HIRC[1:0] PLL_EN
Register Bit
Name 7 6 5 4 3 2 1 0
PWDC — — — — PWDC3 PWDC2 PWDC1 PWDC0
PWMC0 PWM_MODE PWM_BSEL1 PWM_BSEL0 — MUTEB PLL_EN DRV_EN PWM_EN
PWMC1 BUFCLR BUFFLAG1 BUFFLAG0 — NORMALC PWPRCN INSERT1 INSERT0
PLADL P_D7 P_D6 P_D5 P_D4 P_D3 P_D2 P_D1 P_D0
PLADH P_D15 P_D14 P_D13 P_D12 P_D11 P_D10 P_D9 P_D8
• PWDC Register
Bit 7 6 5 4 3 2 1 0
Name — — — — PWDC3 PWDC2 PWDC1 PWDC0
R/W — — — — R/W R/W R/W R/W
POR — — — — 0 1 0 0
• PWMC0 Register
Bit 7 6 5 4 3 2 1 0
Name PWM_MODE PWM_BSEL1 PWM_BSEL0 — MUTEB PLL_EN DRV_EN PWM_EN
R/W R/W R/W R/W — R/W R/W R/W R/W
POR 0 0 0 — 0 0 0 0
• PWMC1 Register
Bit 7 6 5 4 3 2 1 0
Name BUFCLR BUFFLAG1 BUFFLAG0 — NORMALC PWPRCN INSERT1 INSERT0
R/W R/W R R — R/W R/W R/W R/W
POR 0 0 0 — 0 0 0 0
• PLADL Register
Bit 7 6 5 4 3 2 1 0
Name P_D7 P_D6 P_D5 P_D4 P_D3 P_D2 P_D1 P_D0
R/W R/W R/W R/W R/W R/W R/W R/W R/W
POR 0 0 0 0 0 0 0 0
Bit 7~0 P_D7~P_D0: Play data low byte register bit 7 ~ bit 0
This register is used to store the PWM play data low byte. Note that before writing
data to this register, the PWM function should be enabled first and the low byte play
data register should be modified followed by the high byte play data register being
written if the PWM play data is necessary to be updated. If the play data has N
effective bits determined by the PWM_BSEL[1:0] bits, then the effective bits are from
P_D15 to P_Dx, where x is equal to 16-N-1 for Green mode and is equal to 16-N for
Normal mode.
• PLADH Register
Bit 7 6 5 4 3 2 1 0
Name P_D15 P_D14 P_D13 P_D12 P_D11 P_D10 P_D9 P_D8
R/W R/W R/W R/W R/W R/W R/W R/W R/W
POR 1 0 0 0 0 0 0 0
Bit 7~0 P_D15~P_D8: Play data high byte register bit 7 ~ bit 0
This register is used to store the PWM play data high byte. Note that before writing
data to this register, the PWM function should be enabled first and the low byte play
data register should be modified followed by the high byte play data register being
written if the PWM play data is necessary to be updated. If the play data has N
effective bits determined by the PWM_BSEL[1:0] bits, then the effective bits are from
P_D15 to P_Dx, where x is equal to 16-N-1 for Green mode and is equal to 16-N for
Normal mode.
Note: 1. When MUTEB=0, the PLADH/PLADL will always be 8000H and cannot be written.
2. When PLADH/PLADL=0000H or 0001H, the PWM output will be the signal of PLADH/
PLADL=0000H.
PWM1
PWM2
PWM1
PWM2
In the Normal mode, there are two operation modes, symmetry operation and asymmetric operation.
The description are shown below: (Voice Data: the value obtained by the buffer; DC: the default
value is PLADH/PLADL=8000H)
• Symmetry Operation (NORMALC=0)
♦ Voice Data ≥ DC
N=(Voice Data-DC)
M=(DC-(Complement value of the Voice Data))
PWM1=DC+N
PWM2=DC-M
PWM 1 PWM 1
M M
PWM 2 PWM 2
PWM 1 PWM 1
M M
PWM 2 PWM 2
Voice Data1
Insert 1
Voice Data0
Insert 1 Point
Voice Data1
Insert 1
Insert 3 Insert 2
Insert 3 Voice Data2
Insert 2
Insert 1
Voice Data0
Insert 3 Points
Voice Data1
7 1 Insert
6 2 3
Insert 4
5 5 6 7
4 Voice Data2
3
2
1
Voice Data0
Insert 7 Points
REGEN1~REGEN0
• REGC Register
Bit 7 6 5 4 3 2 1 0
Name — — — — — — REGEN1 REGEN0
R/W — — — — — — R/W R/W
POR — — — — — — 0 0
Interrupts
Interrupts are an important part of any microcontroller system. When an external event or an
internal function such as a Timer/Event Counter or Time Base requires microcontroller attention,
their corresponding interrupt will enforce a temporary suspension of the main program allowing the
microcontroller to direct attention to their respective needs. The device contains an external interrupt
and several internal interrupt functions. The external interrupt is generated by the action of the
external INT pin, while the internal interrupts are generated by various internal functions including
the Timer/Event Counter, PWM and Time Base.
Interrupt Registers
Overall interrupt control, which basically means the setting of request flags when certain
microcontroller conditions occur and the setting of interrupt enable bits by the application program,
is controlled by a series of registers, located in the Special Purpose Data Memory. The registers fall
into two categories. The first is the INTC0~INTC1 registers which setup the primary interrupts, the
second is the INTEG register which sets the external interrupt trigger edge type.
Each register contains a number of enable bits to enable or disable individual registers as well as
interrupt flags to indicate the presence of an interrupt request. The naming convention of these
follows a specific pattern. First is listed an abbreviated interrupt type, then the (optional) number of
that interrupt followed by either an “E” for enable/disable bit or “F” for request flag.
Function Enable Bit Request Flag
Global EMI —
INT pin INTE INTF
Timer/Event Counter TE TF
Time Base TBE TBF
Buffer empty interrupt EMPTE EMPTF
PWM
Reload data interrupt RELDE RELDF
Interrupt Register Bit Naming Conventions
Register Bit
Name 7 6 5 4 3 2 1 0
INTEG — — — — — — INTS1 INTS0
INTC0 — TF D5 INTF TE D2 INTE EMI
INTC1 — RELDF EMPTF TBF — RELDE EMPTE TBE
Interrupt Register List
• INTEG Register
Bit 7 6 5 4 3 2 1 0
Name — — — — — — INTS1 INTS0
R/W — — — — — — R/W R/W
POR — — — — — — 0 0
• INTC0 Register
Bit 7 6 5 4 3 2 1 0
Name – TF D5 INTF TE D2 INTE EMI
R/W – R/W R/W R/W R/W R/W R/W R/W
POR – 0 0 0 0 0 0 0
• INTC1 Register
Bit 7 6 5 4 3 2 1 0
Name — RELDF EMPTF TBF — RELDE EMPTE TBE
R/W — R/W R/W R/W — R/W R/W R/W
POR — 0 0 0 — 0 0 0
Interrupt Operation
When the conditions for an interrupt event occur, such as a timer overflow etc., the relevant interrupt
request flag will be set. Whether the request flag actually generates a program jump to the relevant
interrupt vector is determined by the condition of the interrupt enable bit. If the enable bit is set high,
then the program will jump to its relevant vector; if the enable bit is zero then although the interrupt
request flag is set an actual interrupt will not be generated and the program will not jump to the
relevant interrupt vector. The global interrupt enable bit, if cleared to zero, will disable all interrupts.
When an interrupt is generated, the Program Counter, which stores the address of the next instruction
to be executed, will be transferred onto the stack. The Program Counter will then be loaded with a new
address which will be the value of the corresponding interrupt vector. The microcontroller will then
fetch its next instruction from this interrupt vector. The instruction at this vector will usually be a “JMP”
which will jump to another section of program which is known as the interrupt service routine. Here is
located the code to control the appropriate interrupt. The interrupt service routine must be terminated
with a “RETI”, which retrieves the original Program Counter address from the stack and allows the
microcontroller to continue with normal execution at the point where the interrupt occurred.
The various interrupt enable bits, together with their associated request flags, are shown in the
accompanying diagrams with their order of priority. All interrupt sources have their own individual
vector. Once an interrupt subroutine is serviced, all the other interrupts will be blocked, as the global
interrupt enable bit, EMI bit will be cleared automatically. This will prevent any further interrupt
nesting from occurring. However, if other interrupt requests occur during this interval, although the
interrupt will not be immediately serviced, the request flag will still be recorded.
If an interrupt requires immediate servicing while the program is already in another interrupt service
routine, the EMI bit should be set after entering the routine, to allow interrupt nesting. If the stack
is full, the interrupt request will not be acknowledged, even if the related interrupt is enabled, until
the Stack Pointer is decremented. If immediate service is desired, the stack must be prevented from
becoming full. In case of simultaneous requests, the accompanying diagram shows the priority that
is applied. All of the interrupt request flags when set will wake up the device if it is in SLEEP or
IDLE Mode, however to prevent a wake-up from occurring the corresponding flag should be set
before the device are in SLEEP or IDLE Mode.
Legend
xxF Request Flag, auto reset in ISR
Interrupt Structure
External Interrupt
The external interrupt is controlled by signal transitions on the INT pin. An external interrupt
request will take place when the external interrupt request flag, INTF, is set, which will occur when
a transition, whose type is chosen by the edge selection bits, appears on the external interrupt pin.
To allow the program to branch to its interrupt vector address, the global interrupt enable bit, EMI,
and the external interrupt enable bit, INTE, must first be set. Additionally, the correct interrupt edge
type must be selected using the INTEG register to enable the external interrupt function and to
choose the trigger edge type. As the external interrupt pin is pin-shared with I/O pin, it can only be
configured as external interrupt pin if its external interrupt enable bit in the corresponding interrupt
register has been set. The pin must also be setup as an input by setting the corresponding bit in the
port control register. When the interrupt is enabled, the stack is not full and the correct transition
type appears on the external interrupt pin, a subroutine call to the external interrupt vector, will take
place. When the interrupt is serviced, the external interrupt request flag, INTF, will be automatically
reset and the EMI bit will be automatically cleared to disable other interrupts. Note that the pull-high
resistor selection on the external interrupt pin will remain valid even if the pin is used as an external
interrupt input.
The INTEG register is used to select the type of active edge that will trigger the external interrupt.
A choice of either rising or falling or both edge types can be chosen to trigger an external interrupt.
Note that the INTEG register can also be used to disable the external interrupt function.
TBON
M
fTP/24 ~ fTP/211 U Time Base Interrupt
X
TB[2:0]
• TBC Register
Bit 7 6 5 4 3 2 1 0
Name TBON — — — — TB2 TB1 TB0
R/W R/W — — — — R/W R/W R/W
POR 0 — — — — 0 0 0
Programming Considerations
By disabling the relevant interrupt enable bits, a requested interrupt can be prevented from being
serviced, however, once an interrupt request flag is set, it will remain in this condition in the
interrupt register until the corresponding interrupt is serviced or until the request flag is cleared by
the application program.
It is recommended that programs do not use the “CALL” instruction within the interrupt service
subroutine. Interrupts often occur in an unpredictable manner or need to be serviced immediately.
If only one stack is left and the interrupt is not well controlled, the original control sequence will be
damaged once a CALL subroutine is executed in the interrupt subroutine.
Every interrupt has the capability of waking up the microcontroller when it is in SLEEP or IDLE
Mode, the wake-up being generated when the interrupt request flag changes from low to high. If it is
required to prevent a certain interrupt from waking up the microcontroller then its respective request
flag should be first set high before enter SLEEP or IDLE Mode.
As only the Program Counter is pushed onto the stack, then when the interrupt is serviced, if the
contents of the accumulator, status register or other registers are altered by the interrupt service
program, their contents should be saved to the memory at the beginning of the interrupt service
routine.
To return from an interrupt subroutine, either a RET or RETI instruction may be executed. The RETI
instruction in addition to executing a return to the main program also automatically sets the EMI
bit high to allow further interrupts. The RET instruction however only executes a return to the main
program leaving the EMI bit in its present zero state and therefore disabling the execution of further
interrupts.
Configuration Options
Configuration options refer to certain options within the MCU that are programmed into the device
during the programming process. During the development process, these options are selected using
the HT-IDE software development tools. All options must be defined for proper system function, the
details of which are shown in the table.
No. Option
Oscillator Option
HIRC frequency selection – fHIRC:
1
8MHz, 12MHz or 16MHz
Note: 1. The HIRC frequency selected by the configuration option should be the same as the frequency
determined by Holtek Voice MCU Workshop.
2. When the HIRC has been configured at a frequency shown in this table, the HIRC1 and
HIRC0 bits should also be setup to select the same frequency to achieve the HIRC frequency
accuracy specified in the A.C. Characteristics.
Application Circuits
VDD
*
10uF
*
0.1uF * 0.1uF
VDD BIAS
VSS
SW1
PA0 PWM1 SP+
PA1
SW2
PA2 PWM2 SP-
SW3
Speaker
Note: The capacitors marked with * should be placed close to the device.
Peripheral IC Mode
The device provides the Peripheral mode for editing voice using Holtek Voice MCU Workshop. It
also has three interface control modes, implementing both voice data and control interface program
programming, as described below.
VSS 1 8 BIAS
CLK/SEL/KEY1 2 7 PWM1
Busy/KEY2 3 6 PWM2
DATA/KEY3 4 5 VDD
HT68FV022
8 SOP-A
Control Modes
The device has various control modes, which are the key controlled Direct mode and serial interface
controlled One-wire and Two-wire modes. The control mode can be set by users according to their
requirements when arranging the voices in Holtek Voice MCU Workshop. The Direct mode provides
three keys.
In addition, the SEL pin can be used to select the One-wire mode or Two-wire mode by directly
connecting an external resistor between the pin and ground.
One-wire Mode
DATA Keep High
D0 D1 D2 D3 D4 D5 D6 D7
5ms 100ms
20ms
Halt Mode
Busy
Next command
Voice 1ms
Playing
After DATA is pulled low for a time range of 4ms~15ms (5ms recommended), 8 bits of data will be
sent, LSB first and MSB last. The value of each bit is expressed in terms of the ratio of high voltage
to low voltage.
When the high to low ratio is 3:1, this indicates a value of 1. It is recommended to use the values
1200μs:400μs.
When the high to low ratio is 1:3, this indicates a value of 0. It is recommended to use the values
400μs:1200μs.
After command end the DATA line needs to be kept at a high level.
Maximum 100ms from DATA end to Busy pulled low.
Maximum 20ms from Voice end into Halt mode.
At least 1ms from BUSY end to the next command.
Value range: 60μs:180μs ~ 600μs:1800μs. Note that it is recommended to use 3:1 and 1:3 voltage
ratios to ensure communication stability.
Two-wire Mode
• Two-wire Mode 1
Keep High
CLK
100ms
5ms
DATA D0 D1 D2 D3 D4 D5 D6 D7
20ms
Halt Mode
Busy
Next command
1ms
Voice Playing
After CLK is pulled low for 4ms~15ms (5ms is recommended), CLK will fetch the DATA on the
rising edge and 8 bits of data will be sent, LSB first and MSB last.
The CLK period range is 200μs~5ms, a value of 600μs is recommended.
After command end the CLK line needs to be kept at a high level.
Maximum 100ms from CLK end to Busy pulled low.
Maximum 20ms from Voice end into Halt mode.
At least 1ms from BUSY end to the next command.
• Two-wire Mode 2
Keep High
CLK
200ms
100ms
DATA D0 D1 D2 D3 D4 D5 D6 D7
20ms
Halt Mode
Busy Next command
1ms
Voice Playing
After CLK is pulled high for 200ms~400ms (200ms is recommended), CLK will fetch the DATA
on the falling edge and 8 bits of data will be sent, LSB first and MSB last.
The CLK period range is 8ms~30ms, a value of 20ms is recommended.
After command end the CLK line needs to be kept at a high level.
Maximum 100ms from CLK end to Busy pulled low.
Maximum 20ms from Voice end into Halt mode.
At least 1ms from BUSY end to the next command.
Control Commands
Command Code
Function Description
(Hexadecimal)
Select the desired voice to play,
00H is voice 0
00H~7FH Play voice
01H is voice 1
And so on, from 0 to 127, there are 128 voices.
Select the desired sentence to play,
80H is sentence 0
80H~DFH Play sentence
81H is sentence 1
And so on, from 0 to 95, there are 96 sentences.
This command is used to control the LDO for supplying Voice
Flash Memory power.
When the operating voltage is 2.3V~3.6V, this command is
required to adjust the Voice Flash Memory power voltage. If
Operating voltage
E0H this command is not used, the default operating voltage will be
selection
3.6V~5.5V.
When applied to situations where the operating voltage varies,
this command can be used to make the system operate under
optimum conditions.
E1 is the minimum volume and EF is the maximum volume.
There are 15 levels of volume adjustment.
E1H~EFH Volume selection
Note: The relationship between the voice command code and
the PWDC[3:0] value is shown in the table below.
Pause voice/
F1H Pause playing the current voice and sentence.
sentence
F2H Play after pause Continue playing the paused voice and sentence.
Loop playback
F4H the current voice/ Loop playback for the current voice and sentence.
sentence
Stop playing the
F8H current voice/ Stop playing the current voice and sentence.
sentence
Direct Mode
The device supports a key control mode, namely the Direct mode, which can be set according to
requirements when arranging voices in the Holtek Voice MCU Workshop. This mode supports three
keys, KEY1~KEY3, which are active low. The key functions are as follows:
Key Pin Function Description
Short press the key to stop playing the current voice, long press (3
KEY1 Stop/Reset
seconds) the key to reset to the first voice.
Short press the key to play voice, press again to play the next voice
without requiring the current voice to finish.
KEY2 Play/Next
Long press (3 seconds) the key to play sentence, long press again
to play the next sentence without requiring the current voice to finish.
Short press the key to increment volume, long press (3 seconds) to
decrement.
If long press for more than 3 seconds, it will decrement the volume
KEY3 Volume Up/Down
even more.
Note: There are 15 levels of volume. The relationship between the
volume level and the PWDC[3:0] value is shown in the table below
VSS
SW2
Busy/KEY2 PWM1 SP+
CLK/SEL/KEY1
SW1
DATA/KEY3 PWM2 SP-
SW3
Speaker
The direct mode volume levels and control mode command code corresponding to the PWDC[3:0]
values are shown in the following table.
Direct Mode Volume Level Control Mode Command Code PWDC[3:0]
Mute
1 E1H
(Ignore the PWDC[3:0] value)
2 E2H 0000B
3 E3H 0001B
4 E4H 0010B
5 E5H 0011B
6 E6H 0100B
7 E7H 0101B
8 E8H 0110B
9 E9H 0111B
10 EAH 1000B
11 EBH 1001B
12 ECH 1011B
13 EDH 1100B
14 EEH 1110B
15 EFH 1111B
R 10uF 0.1uF
VDD BIAS
0.1uF
VSS
VDD LED
0.1uF VDD
VSS
MCU Busy/KEY2 PWM1 SP+
CLK/SEL/KEY1
IO DATA/KEY3 PWM2 SP-
Speaker
4.7K
The original One-wire mode will change to the Two-wire mode 1 after connecting a 4.7kΩ resistor
to the SEL pin.
VDD
VDD
R 10uF 0.1uF
VDD BIAS
0.1uF
VSS
VDD LED
0.1uF VDD
VSS
MCU Busy/KEY2 PWM1 SP+
IO1 CLK/SEL/KEY1
IO2 DATA/KEY3 PWM2 SP-
Speaker
4.7K
Application Circuits
VDD
VDD
R *
10uF
*
0.1uF * 0.1uF
VDD BIAS
VSS
VDD LED
0.1uF VDD
VSS
MCU Busy/KEY2 PWM1 SP+
CLK/SEL/KEY1
IO DATA/KEY3 PWM2 SP-
Speaker
VDD
VDD
R *
10uF
*
0.1uF * 0.1uF
VDD BIAS
VSS
VDD LED
0.1uF VDD
VSS
MCU Busy/KEY2 PWM1 SP+
IO1 CLK/SEL/KEY1
IO2 DATA/KEY3 PWM2 SP-
Speaker
VDD
VDD
*
10uF
*
0.1uF * 0.1uF
R VDD BIAS
VSS
LED
SW2
Busy/KEY2 PWM1 SP+
CLK/SEL/KEY1
SW1
DATA/KEY3 PWM2 SP-
SW3
Speaker
Note: The capacitors marked with * should be placed close to the device.
Instruction Set
Introduction
Central to the successful operation of any microcontroller is its instruction set, which is a set of
program instruction codes that directs the microcontroller to perform certain operations. In the case
of Holtek microcontroller, a comprehensive and flexible set of over 60 instructions is provided to
enable programmers to implement their application with the minimum of programming overheads.
For easier understanding of the various instruction codes, they have been subdivided into several
functional groupings.
Instruction Timing
Most instructions are implemented within one instruction cycle. The exceptions to this are branch,
call, or table read instructions where two instruction cycles are required. One instruction cycle is
equal to 4 system clock cycles, therefore in the case of an 8MHz system oscillator, most instructions
would be implemented within 0.5μs and branch or call instructions would be implemented within
1μs. Although instructions which require one more cycle to implement are generally limited to
the JMP, CALL, RET, RETI and table read instructions, it is important to realize that any other
instructions which involve manipulation of the Program Counter Low register or PCL will also take
one more cycle to implement. As instructions which change the contents of the PCL will imply a
direct jump to that new address, one more cycle will be required. Examples of such instructions
would be "CLR PCL" or "MOV PCL, A". For the case of skip instructions, it must be noted that if
the result of the comparison involves a skip operation then this will also take one more cycle, if no
skip is involved then only one cycle is required.
Arithmetic Operations
The ability to perform certain arithmetic operations and data manipulation is a necessary feature of
most microcontroller applications. Within the Holtek microcontroller instruction set are a range of
add and subtract instruction mnemonics to enable the necessary arithmetic to be carried out. Care
must be taken to ensure correct handling of carry and borrow data when results exceed 255 for
addition and less than 0 for subtraction. The increment and decrement instructions INC, INCA, DEC
and DECA provide a simple means of increasing or decreasing by a value of one of the values in the
destination specified.
Bit Operations
The ability to provide single bit operations on Data Memory is an extremely flexible feature of all
Holtek microcontrollers. This feature is especially useful for output port bit programming where
individual bits or port pins can be directly set high or low using either the "SET [m].i" or "CLR [m].i"
instructions respectively. The feature removes the need for programmers to first read the 8-bit output
port, manipulate the input data to ensure that other bits are not changed and then output the port with
the correct new data. This read-modify-write process is taken care of automatically when these bit
operation instructions are used.
Other Operations
In addition to the above functional instructions, a range of other instructions also exist such as
the "HALT" instruction for Power-down operations and instructions to control the operation of
the Watchdog Timer for reliable program operations under extreme electric or electromagnetic
environments. For their relevant operations, refer to the functional related sections.
Table Conventions
x: Bits immediate data
m: Data Memory address
A: Accumulator
i: 0~7 number of bits
addr: Program memory address
Mnemonic Description Cycles Flag Affected
Arithmetic
ADD A,[m] Add Data Memory to ACC 1 Z, C, AC, OV, SC
ADDM A,[m] Add ACC to Data Memory 1Note Z, C, AC, OV, SC
ADD A,x Add immediate data to ACC 1 Z, C, AC, OV, SC
ADC A,[m] Add Data Memory to ACC with Carry 1 Z, C, AC, OV, SC
ADCM A,[m] Add ACC to Data memory with Carry 1Note Z, C, AC, OV, SC
SUB A,x Subtract immediate data from the ACC 1 Z, C, AC, OV, SC, CZ
SUB A,[m] Subtract Data Memory from ACC 1 Z, C, AC, OV, SC, CZ
SUBM A,[m] Subtract Data Memory from ACC with result in Data Memory 1Note Z, C, AC, OV, SC, CZ
SBC A,[m] Subtract Data Memory from ACC with Carry 1 Z, C, AC, OV, SC, CZ
SBCM A,[m] Subtract Data Memory from ACC with Carry, result in Data Memory 1Note Z, C, AC, OV, SC, CZ
DAA [m] Decimal adjust ACC for Addition with result in Data Memory 1Note C
Logic Operation
AND A,[m] Logical AND Data Memory to ACC 1 Z
OR A,[m] Logical OR Data Memory to ACC 1 Z
XOR A,[m] Logical XOR Data Memory to ACC 1 Z
ANDM A,[m] Logical AND ACC to Data Memory 1Note Z
ORM A,[m] Logical OR ACC to Data Memory 1Note Z
XORM A,[m] Logical XOR ACC to Data Memory 1Note Z
AND A,x Logical AND immediate Data to ACC 1 Z
OR A,x Logical OR immediate Data to ACC 1 Z
XOR A,x Logical XOR immediate Data to ACC 1 Z
CPL [m] Complement Data Memory 1Note Z
CPLA [m] Complement Data Memory with result in ACC 1 Z
Increment & Decrement
INCA [m] Increment Data Memory with result in ACC 1 Z
INC [m] Increment Data Memory 1Note Z
DECA [m] Decrement Data Memory with result in ACC 1 Z
DEC [m] Decrement Data Memory 1Note Z
Rotate
RRA [m] Rotate Data Memory right with result in ACC 1 None
RR [m] Rotate Data Memory right 1Note None
RRCA [m] Rotate Data Memory right through Carry with result in ACC 1 C
RRC [m] Rotate Data Memory right through Carry 1Note C
RLA [m] Rotate Data Memory left with result in ACC 1 None
RL [m] Rotate Data Memory left 1Note None
RLCA [m] Rotate Data Memory left through Carry with result in ACC 1 C
RLC [m] Rotate Data Memory left through Carry 1Note C
Note: 1. For skip instructions, if the result of the comparison involves a skip then two cycles are required, if no
skip takes place only one cycle is required.
2. Any instruction which changes the contents of the PCL will also require 2 cycles for execution.
Instruction Definition
DAA [m] Decimal-Adjust ACC for addition with result in Data Memory
Description Convert the contents of the Accumulator value to a BCD (Binary Coded Decimal) value
resulting from the previous addition of two BCD variables. If the low nibble is greater than 9
or if AC flag is set, then a value of 6 will be added to the low nibble. Otherwise the low nibble
remains unchanged. If the high nibble is greater than 9 or if the C flag is set, then a value of 6
will be added to the high nibble. Essentially, the decimal conversion is performed by adding
00H, 06H, 60H or 66H depending on the Accumulator and flag conditions. Only the C flag
may be affected by this instruction which indicates that if the original BCD sum is greater than
100, it allows multiple precision decimal addition.
Operation [m] ← ACC + 00H or
[m] ← ACC + 06H or
[m] ← ACC + 60H or
[m] ← ACC + 66H
Affected flag(s) C
NOP No operation
Description No operation is performed. Execution continues with the next instruction.
Operation No operation
Affected flag(s) None
RET A,x Return from subroutine and load immediate data to ACC
Description The Program Counter is restored from the stack and the Accumulator loaded with the specified
immediate data. Program execution continues at the restored address.
Operation Program Counter ← Stack
ACC ← x
Affected flag(s) None
RLCA [m] Rotate Data Memory left through Carry with result in ACC
Description Data in the specified Data Memory and the carry flag are rotated left by 1 bit. Bit 7 replaces the
Carry bit and the original carry flag is rotated into the bit 0. The rotated result is stored in the
Accumulator and the contents of the Data Memory remain unchanged.
Operation ACC.(i+1) ← [m].i; (i=0~6)
ACC.0 ← C
C ← [m].7
Affected flag(s) C
RRCA [m] Rotate Data Memory right through Carry with result in ACC
Description Data in the specified Data Memory and the carry flag are rotated right by 1 bit. Bit 0 replaces
the Carry bit and the original carry flag is rotated into bit 7. The rotated result is stored in the
Accumulator and the contents of the Data Memory remain unchanged.
Operation ACC.i ← [m].(i+1); (i=0~6)
ACC.7 ← C
C ← [m].0
Affected flag(s) C
SBCM A,[m] Subtract Data Memory from ACC with Carry and result in Data Memory
Description The contents of the specified Data Memory and the complement of the carry flag are
subtracted from the Accumulator. The result is stored in the Data Memory. Note that if the
result of subtraction is negative, the C flag will be cleared to 0, otherwise if the result is
positive or zero, the C flag will be set to 1.
Operation [m] ← ACC − [m] − C
Affected flag(s) OV, Z, AC, C, SC, CZ
SDZA [m] Skip if decrement Data Memory is zero with result in ACC
Description The contents of the specified Data Memory are first decremented by 1. If the result is 0, the
following instruction is skipped. The result is stored in the Accumulator but the specified
Data Memory contents remain unchanged. As this requires the insertion of a dummy
instruction while the next instruction is fetched, it is a two cycle instruction. If the result is not 0,
the program proceeds with the following instruction.
Operation ACC ← [m] − 1
Skip if ACC=0
Affected flag(s) None
SIZA [m] Skip if increment Data Memory is zero with result in ACC
Description The contents of the specified Data Memory are first incremented by 1. If the result is 0, the
following instruction is skipped. The result is stored in the Accumulator but the specified
Data Memory contents remain unchanged. As this requires the insertion of a dummy
instruction while the next instruction is fetched, it is a two cycle instruction. If the result is not
0 the program proceeds with the following instruction.
Operation ACC ← [m] + 1
Skip if ACC=0
Affected flag(s) None
SUBM A,[m] Subtract Data Memory from ACC with result in Data Memory
Description The specified Data Memory is subtracted from the contents of the Accumulator. The result is
stored in the Data Memory. Note that if the result of subtraction is negative, the C flag will be
cleared to 0, otherwise if the result is positive or zero, the C flag will be set to 1.
Operation [m] ← ACC − [m]
Affected flag(s) OV, Z, AC, C, SC, CZ
TABRD [m] Read table (specific page or current page) to TBLH and Data Memory
Description The low byte of the program code addressed by the table pointer (TBHP and TBLP or only
TBLP if no TBHP) is moved to the specified Data Memory and the high byte moved to
TBLH.
Operation [m] ← program code (low byte)
TBLH ← program code (high byte)
Affected flag(s) None
TABRDL [m] Read table (last page) to TBLH and Data Memory
Description The low byte of the program code (last page) addressed by the table pointer (TBLP) is moved
to the specified Data Memory and the high byte moved to TBLH.
Operation [m] ← program code (low byte)
TBLH ← program code (high byte)
Affected flag(s) None
Package Information
Note that the package information provided here is for consultation purposes only. As this
information may be updated at regular intervals users are reminded to consult the Holtek website for
the latest version of the Package/Carton Information.
Additional supplementary information with regard to packaging is listed below. Click on the relevant
section to be transferred to the relevant website page.
• Package Information (include Outline Dimensions, Product Tape and Reel Specifications)
• Carton information
Dimensions in inch
Symbol
Min. Nom. Max.
A — 0.236 BSC —
B — 0.154 BSC —
C 0.012 — 0.020
C′ — 0.193 BSC —
D — — 0.069
E — 0.050 BSC —
F 0.004 — 0.010
G 0.016 — 0.050
H 0.004 — 0.010
α 0° — 8°
Dimensions in mm
Symbol
Min. Nom. Max.
A — 6.00 BSC —
B — 3.90 BSC —
C 0.31 — 0.51
C′ — 4.90 BSC —
D — — 1.75
E — 1.27 BSC —
F 0.10 — 0.25
G 0.40 — 1.27
H 0.10 — 0.25
α 0° — 8°
Dimensions in inch
Symbol
Min. Nom. Max.
A — 0.236 BSC —
B — 0.154 BSC —
C 0.012 — 0.020
C’ — 0.390 BSC —
D — — 0.069
E — 0.050 BSC —
F 0.004 — 0.010
G 0.016 — 0.050
H 0.004 — 0.010
α 0° — 8°
Dimensions in mm
Symbol
Min. Nom. Max.
A — 6.00 BSC —
B — 3.90 BSC —
C 0.31 — 0.51
C’ — 9.90 BSC —
D — — 1.75
E — 1.27 BSC —
F 0.10 — 0.25
G 0.40 — 1.27
H 0.10 — 0.25
α 0° — 8°