(19)

*EP002997099B1*
(11) EP 2 997 099 B1
(12) EUROPEAN PATENT SPECIFICATION

(45) Date of publication and mention (51) Int Cl.:

of the grant of the patent: C09D 175/04 (2006.01) C08G 18/76 (2006.01)
14.10.2020 Bulletin 2020/42 C08G 18/48 (2006.01) C08K 3/36 (2006.01)
C08G 18/10 (2006.01) C08G 18/24 (2006.01)
(21) Application number: 14733036.9 C08G 18/36 (2006.01) H05K 3/28 (2006.01)
C08G 2/10 (2006.01)
(22) Date of filing: 31.05.2014
(86) International application number:
PCT/US2014/040421

(87) International publication number:

WO 2014/194303 (04.12.2014 Gazette 2014/49)

(54) FORMULATED POLYURETHANE RESIN COMPOSITIONS FOR FLOOD COATING ELECTRONIC

CIRCUIT ASSEMBLIES
POLYURETHANHARZ-ZUSAMMENSETZUNGEN ZUR FLÄCHENBESCHICHTUNG VON
ELEKTONISCHEN SCHALTKREISBAUTEILEN
COMPOSITIONS DES RÉSINS POLYURÉTHANE POUR LE REVÊTEMENT DE SURFACE DES
ÉLEMENTS CONTENANT UN CIRCUIT ÉLECTRONIQUE

(84) Designated Contracting States: • SCANLON, Thomas, C., IV

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB Hinsdale, NY 14743 (US)
GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO
PL PT RO RS SE SI SK SM TR (74) Representative: de Vries, Adriaan Jacobus
Altana Chemie GmbH
(30) Priority: 31.05.2013 US 201361829681 P Patente
Abelstraße 45
(43) Date of publication of application: 46483 Wesel (DE)
23.03.2016 Bulletin 2016/12
(56) References cited:
(73) Proprietor: ELANTAS PDG Inc. US-A- 3 747 037 US-A1- 2004 012 936
St. Louis, MO 63147 (US) US-A1- 2004 198 943

(72) Inventors:
• JORDAN, Richard, David, Jr.
Allegany, NY 14706 (US)
EP 2 997 099 B1

Note: Within nine months of the publication of the mention of the grant of the European patent in the European Patent
Bulletin, any person may give notice to the European Patent Office of opposition to that patent, in accordance with the
Implementing Regulations. Notice of opposition shall not be deemed to have been filed until the opposition fee has been
paid. (Art. 99(1) European Patent Convention).

Printed by Jouve, 75001 PARIS (FR)

 EP 2 997 099 B1

Description

BACKGROUND OF THE INVENTION

5 1. Field of the Invention

[0001] The present invention generally relates to formulated resin systems, electronic circuit assemblies coated with
such systems, and to methods for applying same.
[0002] More specifically, the present invention relates to protective polymeric films such as two part polyurethane
10 resins for flood coating or encapsulating electronic circuit assemblies and other electronic devices that are part of a
unitized construction, and which are susceptible to extreme environmental and/or mechanical degradation such as from
vibration.

2. Description of the Related Art

15
[0003] There are a large assortment of two component filled or unfilled polymeric resin systems for potting and/or
encapsulating of electrical circuit assemblies or other such electronic devices. Many of these formulations are based on
similar technology using many of the same base raw materials to achieve desired properties during processing and/or
at cure. The formulations are usually made up such materials as acrylic, polyurethane, silicone, or epoxy synthetic resins.
20 [0004] The main objective of a potting material is to provide protection and support of sensitive electronics in environ-
ments including exposure to chemical, high humidity, vibration, and temperature extremes. While these potting materials
are successful, there is a need to reduce the weight and cost of such electronic assemblies. Potting materials are
traditionally used to fill the device or assembly and, thus, are very thick. This feature can be considered disadvantageous
for certain applications. Potted objects are also not easily re-enterable (i.e., soft enough to cut into for ease of removal
25 for inspection and/or repair of the filled component). Accordingly, low hardness (soft), low modulus (elastic), vibration
dampening polyurethane and silicone potting and encapsulation systems have been identified as the most desired
materials for providing environmental protection and mechanical support of surface mount electronics that are subjected
to such temperature extremes, as well as some level of vibration.
[0005] To this end, various manufacturers of electronic assemblies have chosen to use dielectric conformal coatings
30 as their environmental protection barrier. Such conformal coatings are typically 0.05 mm (2 mils) (6 0.025 mm (1 mil))
in thickness. Although this approach has proven successful in certain applications where a static environment exists,
applications requiring mechanical support and environmental protection of large components exposed to temperature
extremes and vibration have proven unsuccessful due to fatigue failure over time. The use of lead-free solder in electronic
components has also contributed to the need for greater mechanical support and vibration dampening of large heavy
35 electrical components.
[0006] The following U.S. Patents or Published Applications address some of the design challenges discussed above:
3,747,037; 4,300,184; 5,863,597; 5,871,822; 8,360,390; and US2006/007 6047.
[0007] US 3,747,037 describes a conventional potting system and a urethane potting compound. The potting compound
has a relative high viscosity and is not flowable. Further , this potting compound comprises a large amount of silica (>
40 75 wt.%) acting as a rheology agent.
[0008] Therefore, in an effort to fill the gap between thick and costly potting compounds and thin dielectric conformal
coatings with little mechanical integrity, low hardness, low modulus formulated resin systems that are capable of providing
mechanical structural support while providing vibrational dampening and reducing the overall resin weight and cost used
in a conventionally potted assembly would be a useful advance in the art and could find rapid acceptance in any industry
45 where use of potting and/or conformal coating systems are required.

SUMMARY OF THE INVENTION

[0009] The foregoing and additional objects are attained in accordance with the principles of the invention described
50 herein, which provides, in one aspect polyurethane flood coat compositions ABCD formed by reacting a polyisocyanate
prepolymer A, with a polyol B, which further contains a rheology agent/modifier C, and a catalyst D characterized in that
when a ratio of part A is mixed with a ratio of part B the mixture provides a thixotropic index from 1 to 5; a gel time from
5 to 15 minutes; and a Shore hardness of ISA to 60A when cured.
[0010] In another aspect, the invention provides electrical circuit assemblies including a base support with a plurality
55 of electrical circuit components extending outwardly from the surface of the base support attached thereto and electrically
connected to the electrical circuitry, and polyurethane flood coat compositions ABCD as defined and described in detail
herein, wherein the polyurethane flood coat composition completely covers and/or encapsulates the electrical circuit
assembly as a fixed mass upon cure such that the thickness of the flood coat composition ABCD on component surfaces

2
 EP 2 997 099 B1

parallel (i.e., horizontal) to the base support is from 0.51 mm to 1.91 mm (from 20 mils to 75 mils), and the thickness of
the flood coat composition ABCD on component surfaces perpendicular (i.e., vertical) to the base support is from 0.10
mm to 0.51 mm (from 4 mils to 20 mils).
[0011] In still another aspect, the present invention provides methods of encapsulating an electrical circuit assembly
5 by pressurizing a flood coat composition ABCD as defined and described herein in detail at a predetermined pressure
with an inert gas, applying a predetermined volume of the flood coat composition ABCD completely over said assembly
at said predetermined pressure, allowing the flood coat composition ABCD to gel, and curing the coated assembly for
a time and at a temperature sufficient to provide a Shore hardness of ISA to 60A.
[0012] These and other objects, features and advantages of this invention will become apparent from the following
10 detailed description of the various aspects of the invention taken in conjunction with the accompanying Figures and
Examples.

BRIEF DESCRIPTION OF THE DRAWINGS

15 [0013] So that the manner in which the above-recited features of the present invention can be understood in better
detail, a more particular description of the invention may be had by reference to embodiments, some of which are
illustrated or captured in the appended figures. It is to be noted, however, that the appended figures represent only
typical embodiments of this invention and should not be considered limiting of its scope, for the invention may admit to
other equally effective embodiments.
20
FIG. 1 illustrates a cross-section perspective view of an electronic circuit board assembly having tall electric circuit
components extending outwardly from the surface of a base support with a flood coat composition as described
herein applied thereto.

25 FIGS. 2A-2B together depict a top and side view, respectively, of an actual electronic circuit assembly with a protective
flood coat composition as described herein applied thereto and effectively encapsulating the assembly and the
electronic circuitry.

[0014] To facilitate understanding, identical reference numerals have been used, where possible, to designate identical
30 elements that are common to the figures. The figures are not drawn or depicted to scale and may be simplified for clarity.
Furthermore, it is contemplated that elements and features of one embodiment may be beneficially incorporated in other
embodiments without further recitation.

DETAILED DESCRIPTION OF CERTAIN EMBODIMENTS OF THE INVENTION

35
[0015] As summarized above, the present invention pertains to the discovery of formulated resin systems possessing
certain performance characteristics that are useful for protectively coating and/or encapsulating an electronic device
such as a surface mount electronic device that is subject to harsh environments including exposure to chemical, high
humidity, vibration, and temperature extremes. As discussed more fully below, the inventors have surprisingly discovered
40 polymeric formulations that are based on dead elastomer/energy absorbing chemistry back bones that provide low to
moderate hardness and low modulus, and that reduce the overall resin weight and cost compared to conventionally
potted devices, while simultaneously providing the same environmental protection, mechanical support, and vibrational
dampening. Such advantages were heretofore thought unattainable without using a traditional potting material that
completely fills the space where the electronic devise is housed. Accordingly, in view of the polymeric formulated resins
45 described herein, the use of such products and flood coat processes can be used to replace potting materials where
weight and overall cost due to the volume of resin is a concern, while still achieving desired performance properties,
[0016] Accordingly, in one aspect, the invention provides polymeric flood coat compositions ABCD formed by mixing
part A with part B, wherein part A comprises a prepolymer, and part B comprises a polyol in an amount from 93 to 98
wt.% based on the total wt.% of part B, a rheology agent/modifier C, and a catalyst D characterized in that when a ratio
50 of part A is mixed with a ratio of part B the mixture possesses a thixotropic index from 1 to 5; a gel time from 5 to 15
minutes; and a Shore hardness of ISA to 90A when cured;
wherein the thixotropic index refers to the viscosity measured at 2.5 RPM divided by the viscosity measured at 20 RPM
of a mix ratio of part A and part B, where the appropriate weight amounts of part A and part B are mixed by hand for 1-2
minutes at 25 °C, and the viscosity of the mixture is determined using a Brookfield viscometer with a #7 spindle at 2.5
55 RPM, and then at 20 RPM.
[0017] While the preferred compositions contemplated for use herein is a polyurethane flood coat composition, those
of skill in the art will appreciate that any suitable polymeric resin may be used including, for example, acrylic, silicone,
polysiloxane, and epoxy, as well as hybrids of these. In certain embodiments, the prepolymer of part A is a polyisocyanate

3
 EP 2 997 099 B1

containing prepolymer synthesized from a medium functionality polymeric diphenylmethane diisocyanate (pMDI) with
an enhanced 2,4’-MDI isomer content A1 (such as that commercially available by Bayer Corp. under the tradename
MONDUR® MRS, or other equivalent), reacted with a polypropylene glycol and benzoyl chloride as a stabilizer.
[0018] Other suitable polyisocyanates used to prepare the prepolymer of part A of the polyurethane composition
5 include any compounds having at least two isocyanate moieties. Diisocyanates can be exemplified by 1,5-naphthylene
diisocyanate, 4,4’• diphenylmethane diisocyanate (4,4’- MDI), 4,4’-diphenyldimethylmethane diisocyanate, 4,4’-dibenzyl
diisocyanate, dialkyldiphenylmethane diisocyanate, 1,3-phenylene diisocyanate, 1,4-phenylene diisocyanate, toluene
diisocyanate, butane-1,4-diisocyanate, hexamethylene diisocyanate, isopropylene diisocyanate, naphthylene diisocy-
anate, methylene diisocyanate, 2,2,4-tiimethylhexamethylene diisocyanate, cyclohexane-1,4- diisocyanate, xylylene
10 diisocyanate, hydrogenated xylylene diisocyanate, isophorone diisocyanate, lysine diisocyanate, dicyclohexylmethane-
4,4’-diisocyanate, 1,3-bis(isocyanatomethyl)cyclohexane, methyl-cyclohexane diisocyanate, m• tetramethylxylylene di-
isocyanate, 2,4,6-triisopropylbenzene diisocyanate, isopropylidene bis(4-cyclohexylisocyanate), and mixtures thereof
Exemplary mixtures of diisocyanates include mixtures of 4,4’-MDI and 2,4-MDI.
[0019] The polyisocyanate used to prepare the part A prepolymer can also be a polyisocyanate prepared, for example,
15 by reacting a diisocyanate with a diisocyanate• reactive compound such as a polyol e.g., a diol or polyamine, e.g., a
diamine. Exemplary polyisocyanates used to prepare the part A prepolymer include polymeric forms of MDI. The polyiso-
cyanate used to prepare the part A prepolymer can also be a carbodimide• modified diisocyanate, e.g., a carbodiimide-
modified MDI. The polyisocyanate used to prepare the prepolymer of part A has an isocyanate (NCO) content that varies
from 15% to 40% (mass percent) as measured by ASTM 02572, preferably from 10 % to 20 %.
20 [0020] The part A prepolymer is reacted with a polyol. In general, the polyol in part A is any polyol (i.e., a compound
having more than one hydroxyl group appended thereto) that can react with an isocyanate group. More specifically, the
polyol is preferably chosen from a group of polyols having a molecular weight of less than about 600. In one example,
the polyol is chosen from a group of polyols having a weight average molecular weight from about 300 to about 600
Daltons. Examples of polyols include glycols, i.e., diols containing a 1,2 dihydroxy group such as ethylene glycol or
25 propylene glycol and derivatives thereof, and glycerol or glycerin and derivatives thereof Examples of polyols include
polypropylene glycol and polytetramethylene ether glycol. In some embodiments, the polyol is an asymmetric diol having
from 3 to 20 carbon atoms, more preferably 4 to 12 carbon atoms, and most preferably 5 to 10 carbon atoms. Examples
of such asymmetric diols include, but are not limited to: 2-ethyl-1,3-hexanediol; 1,2-propanediol; 1,3-butanediol; 2,2,4-
trimethyl-1,3-pentanediol, 1, 12-octadecanediol; 1,2-hexanediol; 1,2-octanediol; and 1,2-decanediol. Further examples
30 of polyols include a tetrol such as pentaerythritol. The polyol can also be a polyether polyol prepared from either ethylene
oxide and/or propylene oxide optionally reacted with another polyol such as glycol or glycerol.
[0021] While polypropylene glycol (such as that commercially available from Lonza Corp. under the tradename POLY-
G® 20-56) is a preferred polyol for use in part A in synthesizing the polyurethane backbone, those of skill in the art will
recognize that other polyols are also suitable. Such other polyols include, for example, polybutadiene polyol. Examples
35 of polybutadiene polyols include, but are not limited to, liquid hydroxyl terminated polymers of butadiene sold under the
names Polybd® R-45HTLO and Poly bd® R-20LM, both commercially available from Cray Valley USA, LLC, Exton, PA,
USA, as well as under the name Hypro™ 2800X95 HTB, commercially available from CVC Thermoset Specialties,
Moorestown, NJ, USA.
[0022] In certain embodiments, the percentage of polymeric MDI and polypropylene glycol used to synthesize the
40 polyurethane backbone of part Ais from 40 to 60 wt. %, whereas the stabilizer is present in an amount of about 0.03 wt.
%, based on the total wt. % of part A. In a particular embodiment, the percentage of polymeric MDI present is about 40
wt. % and the percentage of polypropylene glycol present is about 60 wt. %, based on the total wt. % of part A.
[0023] In the same or other embodiments, part B of the polymeric resin system can include a polyol that is present in
an amount from 93 to 98 wt. %, based on the total wt. % of part B. In some embodiments, the polyol has less than 0.03
45 wt. % water. In the same or other embodiments, castor oil is the preferred polyol suitable for use with the present
invention. The castor oil, i.e., ricinoleic acid triglyceride, is a renewable raw material that is widely commercially available.
The invention also contemplates that a derivative of castor oil includes any polyol derived from castor oil, which includes
a hydrolysis product, an ethoxylated product, a transesterfied product, or an esterfied product, or a polyamide product.
Other suitable polyols will be known to those of skill in the art, however, and it is contemplated that the polyols suitable
50 for use in part B also include those polyols described above for part A, wherein the polyols may be the same or different.
[0024] The polyol of part B is further formulated with a rheology agent C and a catalyst D. The rheology agent includes
all synthetic and natural anti-sagging additives from BYK Additives/Elements Specialties, Wallingford, CT, USA, along
with primary amine• terminated polyether compounds. Primary amine-terminated polyether compounds include, but are
not limited to polyoxypropylene amine having a weight average molecular weight from about 110 or 200 Da, to preferably
55 about 500 Da (although
molecular weights up to about 2000 Da are also suitable) and an amine functionality of about 2 to 3, preferably about
2. Such primary amino-terminated polyethers are manufactured and sold by Huntsman Corporation, Salt Lake City, UT,
under the name Jeffamine. Particularly preferred is Jeffamine D-230, which is a polyoxypropylene glycol terminated with

4
 EP 2 997 099 B1

primary amines and having an amine functionality of 2 and a molecular weight of about 230. Crosslinking in the adhesive
composition can be further accelerated by adding a hydroxyl-containing tertiary amine such as diisoproponol amine
commercially available as QUADROL by BASF Corp., Germany. Thixotropy develops rapidly when part A and part Bare
mixed together in the presence of such amines. Rheology agents (or thixotropic agents) also include, but are not limited
5 to, inorganic additives and can include, for example, fumed silica, amorphous silicon dioxide, clays, bentonites, talcs,
and combinations thereof
[0025] The urethane catalyst D of part B of the polyurethane composition may be any urethane catalyst. Examples of
urethane catalysts include tin catalysts such as dialkyl tin dialkanoates, for example, FOMREZ® catalyst UL-28 (dimeth-
yltin dineodecanoate), which provides very short gel and tack-free times as well as good solubility in polyurethane
10 systems. Other examples of urethane catalysts include, but are not limited to: stannous octoate, commercially available
as DABCO® T-9 from Air Products, Allentown, PA, USA; organotin, commercially available as DABCO® 131 from Air
Products, Allentown, PA, USA; 1,4-diazabicyclooctane, available as DABCO® Crystalline Catalyst from Air Products,
Allentown, PA, USA; n-cetyl-n,n-dimethylamine, available as DABCO® B-16 from Air Products, Allentown, PA, USA;
dibutyltin dilaurate, available as DABCO® T-12 from Air Products, Allentown, PA, USA; dibutyltin diacetate, available
15 as METACURE™ T-1 catalyst from Air Products, Allentown, PA, USA; a blend of zinc neodecanoate, bismuth neo-
decanoate and neodecanoic acid, available as BiCAT® 8 from Shepherd Chemical Company, Norwood, OH, USA; ferric
acetylacetonate, available as AMSPEC® GCR-56 from Amspec Chemical Corporation, Bear, DE, USA; and oleic acid,
available as Oleic Acid 105 from Acme-Hardesty Company, Blue Bell, PA, USA.
[0026] In certain embodiments, the rheology agent C contains from 2 to 6 wt. % of fumed silica, based on the total wt.
20 % of part B (such as that commercially available from Cabot Corp. under the tradename CAB-O-SIL® M-5), and the
catalyst D contains from
0.2 wt. % to 0.5 wt. % (based on the total weight of part B), of an organo-metallic catalyst such as dibutyltin acetate.
While these are understood to be preferred embodiments, the specific rheology agent/modifier and/or catalyst are not
critical as other suitable agents
25 and catalysts discussed above can be used. Rather, what is important is to have the gel time and the rheology be in
close proximity in order to achieve the vertical build (i.e.,
on the elongated circuit components projecting outwardly from the base of the circuit board or other such electronic
device) desired for environmental protection, while allowing adequate flow to achieve a horizontal build sufficient to
provide the desired mechanical support when the flood coat composition is cured.
30 [0027] Accordingly, in certain embodiments, the thixotropic index can be from 1 to 5, and preferably from 1.20 to 3.50,
and more preferably from 1.22 to 1.23. As used herein, the term "thixotropic index" is refers to the viscosity measured
at 2.5 RPM divided by the viscosity measured at 20 RPM of a mix ratio of part A and part B, where the appropriate
weight amounts of part A and part B are mixed by band for 1-2 minutes at 25 °C, and the viscosity of the mixture is
determined using a Brookfield viscometer with a #7 spindle at 2.5 RPM, and then at 20 RPM.
35 [0028] In same or other embodiments, the gel time is from 5 to 15 minutes, and preferably from 5 to 12. In same or
other embodiments, the initial viscosity of the mix ratio of part A and part B is from 15,000 to 18,000 mPa.s (cps), and
preferably from 15,000 to 16,500 mPa.s (cps). It is contemplated that elements and features of one embodiment may
be beneficially incorporated in other embodiments without further recitation. It is further contemplated that part A and
part B can be mixed in any ratio or amount.
40 [0029] Part A and/or part B of the flood coat compositions contemplated herein may also contain other suitable fillers
or additives. Either or both part A and part B of the may also include a defoamer. In one embodiment, a defoamer is
added in an amount from about
0.01 to about 0.1 wt. % to part A. In another embodiment, a defoamer is added in an amount from about 0.01 to about
0.1 to part B. In a further embodiment, a defoamer is added in an amount from about 0.005 to about 0.05 to part A, and
45 in an amount from about 0.005 to about 0.05 to part B. The defoamer utilized in either or both part A and part B may be
any defoamer that is known in the art, In one example, the defoamer is a silicone based defoamer, such as, for example,
an alkyl aryl silicone polymer-based antifoaming additive, commercially available as SF8843 from Momentive Perform-
ance Materials Holdings LLC, Columbus, OH, USA. In another embodiment, the defoamer is a silicone free defoamer,
such as an isoparaffin based defoamer, such as, for example, BYK 054, available from BYK USA, Inc., Wallingford, CT,
50 USA.
[0030] The filler may be any suitable filler known in the art, including, but not limited to talc, calcium carbonate, barium
sulfate, magnesium hydroxide, clay, mica, titanium dioxide, or any combination of the foregoing.
[0031] In another aspect, and with reference to FIG. 1, the invention provides electrical circuit assemblies including a
base support 10 with a plurality of electrical circuit components 20 extending outwardly from the surface of the base
55 support 10 attached thereto and electrically connected to the electrical circuitry (not shown), and polyurethane flood
coat compositions ABCD as defined and described in detail herein, wherein the polyurethane flood coat composition
completely covers and/or encapsulates the electrical circuit assembly as a fixed mass upon cure such that the thickness
of the flood coat composition ABCD on component surfaces parallel (i.e., horizontal) 30 to the base support is from 0.51

5
 EP 2 997 099 B1

mm to 12.70 mm (from 20 mils to 500 mils), and the thickness of the flood coat composition ABCD on component
surfaces perpendicular (i.e., vertical) 40 to the base support is from 0.10 mm to 0.51 mm (from 4 mils to 20 mils). As
those skilled in the art will appreciate, the units "mils" as used herein (also known as "thous") refers to an imperial length
unit and is equal to 1/1000 of 25.4 mm (an inch).
5 [0032] In certain embodiments the thickness of the flood coat composition on component surfaces perpendicular to
the base support is greater than 0.10 mm and less than 0.51 mm (greater than 4 mils and less than 20 mils), and
preferably less than 0.25 mm (10 mils). In same or other embodiments, the thickness of the flood coat composition on
component surfaces horizontal to the base support is greater than 0.51 mm and less than 1.91 mm (greater than 20
mils and less than 75 mils), preferably greater than 1.02 mm and less than 1.52 mm (greater than 40 mils and less than
10 60 mils). It is contemplated that elements and features of one embodiment may be beneficially incorporated in other
embodiments without further recitation.
[0033] Again, obtaining these key characteristics is done by controlling the reactivity (i.e., gel time) and the rheology
to allow the resin system to be applied manually or through automation (i.e., a flood coat process, wherein the resin can
be dispensed in the form of a ribbon or curtain), which allows it to cover all components flowing down vertical surfaces
15 while maintaining a 0.10 mm to 0.25 mm (4 mils to 10 mils) build on all vertical surfaces,
[0034] While flowing down the vertical surfaces, the resin will build at a thickness from 0.51 mm to 12.70 mm (20 mils
to 500 mils) on the horizontal surfacee thereby providing mechanical support of large components as well.
[0035] While the formulated flood coat resin system described herein is suitable for use with any electrical circuit
assembly, exemplary devices include, but are not limited to, electrical circuit boards used in PCs, inverters (e.g., micro
20 solar inverters), converters, power supplies. Reference is given to FIGS. 2A-2B.
[0036] In still another aspect, the present invention provides methods of encapsulating or flood coating an electrical
circuit assembly by pressurizing a flood coat resin system composition ABCD as defined and described herein in detail
at a predetermined pressure with an inert gas, applying a predetermined volume of the flood coat composition ABCD
completely over said assembly at said predetermined pressure, allowing the flood coat composition ABCD to gel, and
25 curing the coated assembly for a time and at a temperature sufficient to provide a Shore hardness of 15A to 90A.
[0037] In certain embodiments the pressure applied is 30 psi and the inert gas is dry nitrogen. In same or other
embodiments, the curing step is from 5 to 7 days at a temperature of 25 ° C.
[0038] As discussed previously, the flood coat compositions are suitable for use with electronic assemblies and com-
ponents in applications requiring mechanical support and environmental protection due to exposure to temperature
30 extremes and vibration, which cause fatigue failure of the assemblies over time. Accordingly, in another aspect, the
invention provides methods of preventing failure of an electrical circuit assembly due to exposure to temperature extremes
(i.e., rapid increases or decreases in temperature and/or prolonged exposure to extreme cold and/or heat) and vibration
by applying a predetermined volume of a polyurethane flood coat composition as described and contemplated herein
completely over the electrical circuit assembly, allowing the flood coat composition to gel, and curing the flood coat
35 composition as a fixed mass on the electrical circuit assembly such that the thickness of the flood coat composition on
component surfaces horizontal to the base support of the assembly is from 0.51 mm to 1.91 mm (from 20 mils to 75
mils), and the thickness of the flood coat composition on component surfaces perpendicular to the base support is from
0.10 mm to 0.51 mm (4 mils to 20 mils). This aspect of the invention can be alternatively written as providing mechanical
support and environmental protection to an electrical circuit assembly exposed to temperature extremes and vibration.
40
Examples

[0039] The following examples are provided to assist one skilled in the art to further understand certain embodiments
of the present invention. These examples are intended for illustration purposes and are not to be construed as limiting
45 the scope of the various embodiments of the present invention.

Example 1 - Preparation of polymelic resin

[0040] A two part polyurethane resin system is prepared as follows: In Part A, 41.10 parts by weight (based on the
50 total weight of part A) of a medium functionality polymeric diphenylmethane diisocyanate (pMDI) having an enhanced
2,4’-MDI isomer content and isocyanate group (N=C=O) of 31 to 32 wt. % (based on a total weight of the diisocyanate)
(such as MONDUR® MRS available from Bayer Corp. or equivalent) is reacted with 58.87 parts by weight (based on
the total weight of part A) of polypropylene glycol (such as PolyG-20-56 available from Lonza Corporation, or equivalent),
and 0.03 parts by weight (based on the total weight of part A) benzoyl chloride as a stabilizer to form an MDI prepolymer
55 having an N=C=O content ranging between 10 to 12 wt. % (based on a total weight of the diisocyanate), inclusive. The
reaction is performed at a temperature of
80-85° C under a vacuum of >27" Hg for 4 hours.
[0041] In part B, 93.57 parts of castor oil is dried by heating it at a temperature from 100- 110 °C under a vacuum of

6
 EP 2 997 099 B1

>27" Hg for 1-2 hours in order to obtain a water content of < 0.03 wt. %. A thixotropic agent such as fumed silica (available
as CAB-O-SIL® M-5 from Cabot Corporation) at 6 parts by weight (based on the total weight of part B) is dried in an
oven at 130° C for 24 hours. The thixotropic agent is then mixed with the dry castor oil under a high speed (3000 rpm)
shear for 45 minutes in order to achieve a desired rheology - thixotropic index of 1.22. 0.41 parts by weight (based on
5 the total weight of
part B) of a metallic catalyst such as tin-based dibutyltin diacetate (available as METACURE® T-1 from Air Products)
is added to control the gel time when parts A and Bare mixed. Parts A and B are mixed at a ratio of 44.25 wt. % of part
A to 55.75 wt. % of part B.
[0042] Particulars of the formulation are provide below in Table 1:
10
Table 1.
PolyUrethane Flood Coat
Invention
Part A wt. % (on A)
15
Diisocyanate (Mondur MRS - 4) 41.10
Polyether Diol (Poly-G-20-56-U) 58.87
Benzoyl Chloride 0.03
Part A prepolymer NCO 10-12%
20 Part A prepolymer viscosity (mPa.s), (cps) 15,000-18,000

Part B wt. % (on B)

Castor Oil Polyol 93.57
Alkyl aryl siloxane (defoamer) (SF8843) 0.02
25
Dibutyl-Tin Acetate (Metacure Tl Catalyst) 0.41
Fumed Silica (Cab-o-Sil MS) 6.0
Part B mixture viscosity (mPa.s) (cps) 1,092
Mix Ratio by Weight 44.25 parts A/55.75 parts B
30 Part A+B mixture initial viscosity (mPa.s) (cps) 16,000
Shore Hardness 35A
Thixotropie Index 1.22
Average Coating Weight (grams) 93.1
Horizontal Thickness (mm) 0.51
35 ((mils = 1/1000 inch) 20)
Vertical Thickness (mm) 0.10-0.13
((mils = 1/1000 inch) 4-5

40 Example 2 - Flood Coating an Electronic Assembly

[0043] A 400 ml cartridge of a square style, 30 element static mixer, fitted with a 1" spade/flat tip, is filled with a
polymeric resin such as that prepared according to Example 1. Dry nitrogen at 30 psi is applied to the resin. A solar
micro inverter weighing 1,853.00 grams is provided and the polymeric resin is applied through a dispensing gun that is
45 held at an approximately 45° angle to the surface of the board. The polymeric resin "flood coats" the electrical circuit
board and components as it is dispensed in the form of a ribbon or curtain and allowed to cover all components flowing
down vertical surfaces, while maintaining a 0.10 mm to 0.13 mm (4 mils to 5 mils) build on all vertical surfaces due to
rheology and reactivity control. While flowing down the vertical surfaces, the resin builds at a thickness of 0.51 mm (20
mils) on horizontal surfaces, thereby resulting in mechanical support of large components. The coating time from start
50 to finish is about 5 minutes. The gel time is approximately 10-12 minutes, and the full cure time is about 7 days at 25°
C. The weight of the solar micro inverter after flood coating is 2, 200.00 grams (i.e., 347.96 grams of polymeric resin
material used).
[0044] Thus, using the polymeric flood coat resin composition and process described herein, the same environmental
protection and mechanical support as that provided by conventional potting resin is achieved, while reducing the overall
55 weight and resin cost used in a conventionally potted device by > 50 %.
[0045] Various patent and/or scientific literature references have been referred to throughout this application. The
disclosures of these publications in their entireties are hereby incorporated by reference as if written herein. In the case
of conflicting terms, the terms of this document will take preference. In view of the above description and the examples,

7
 EP 2 997 099 B1

one of ordinary skill in the art will be able to practice the invention as claimed without undue experimentation.

Claims
5
1. A polyurethane flood coat composition ABCD comprising
a polyisocyanate prepolymer as part A; and
in part B, a polyol in an amount from 93 to 98 wt.% based on the total wt.% of part B; a rheology agent C; and a
catalyst D,
10 characterized in that when a ratio of part A is mixed with a ratio of part B the mixture provides a thixotropic index
from 1 to 5; a gel time from 5 to 15 minutes; and a Shore hardness of 15A to 90A when cured;
wherein the thixotropic index refers to the viscosity measured at 2.5 RPM divided by the viscosity measured at 20
RPM of a mix ratio of part A and part B, where the appropriate weight amounts of part A and part B are mixed by
hand for 1-2 minutes at 25 °C, and the viscosity of the mixture is determined using a Brookfield viscometer with a
15 #7 spindle at 2.5 RPM, and then at 20 RPM.

2. The polyurethane flood coat composition ABCD according to claim 1, wherein the polyisocyanate prepolymer A
comprises from 50-60 wt. % of polymeric diphenylmethane diisocyanate A1; from 40-50 wt. % of polypropylene
glycol A2; and a stabilizer compound A3, such as benzoyl chloride present at 0.03 wt. %, based on the total weight
20 of part A.

3. The polyurethane flood coat composition ABCD according to claim 1 or claim 2, wherein the polyisocyanate pre-
polymer A contains from 10 to 12 wt. % isocyanate (N=C=O) groups, based on the total weight of the polyisocyanate.

25 4. The polyurethane flood coat composition ABCD according to any one of claims 1 to 3, wherein the polyol B is castor
oil; and/or
wherein the rheology agent C contains from 2 to 6 wt. % of fumed silica, based on the total weight of part B; and/or
wherein the catalyst D is an organo-metallic catalyst, such as dibutyltin diacetate; and/or wherein the Shore hardness
is from 40A to 60A; and/or
30 wherein the thixotropic index is from 1.2 to 3.5; and/or
wherein the gel time is from 5 to 12 minutes; and/or
wherein the initial viscosity of the mixture of part A and part B is from 15,000 to 18,000 cps.

5. An electrical circuit assembly comprising

35 a base support with a plurality of electrical circuit components extending outwardly from the surface of the base
support attached thereto and electrically connected to the electrical circuitry, and
the polyurethane flood coat composition ABCD as defined in any one of claims 1 to 4, wherein the polyurethane
flood coat composition ABCD completely covers or encapsulates the electrical circuit assembly as a fixed mass
upon cure such that the thickness of the polyurethane flood coat composition ABCD on component surfaces hori-
40 zontal to the base support is from 0.51 mm to 1.91 mm (from 20 mils to 75 mils), and the thickness of the polyurethane
flood coat composition ABCD on component surfaces perpendicular to the base support is from 0.10 mm to 0.51
mm (from 4 mils to 20 mils); or
wherein the thickness of the polyurethane flood coat composition ABCD on component surfaces perpendicular to
the base support is greater than 0.10 mm and less than 0.25 mm (greater than 4 mils and less than 10 mils); or
45 wherein the thickness of the polyurethane flood coat composition ABCD on component surfaces horizontal to the
base support is greater than 0.51 mm and less than 1.78 mm (greater than 20 mils and less than 70 mils); and/or
wherein the polyurethane flood coat composition ABCD has a Shore hardness from 15A to 90A when cured; or
wherein the polyurethane flood coat composition ABCD has a Shore hardness from 40A to 60A when cured.

50 6. An electrical circuit assembly according to claim 5, wherein said electrical circuit assembly is situated within an
electronic device, for example, wherein the electronic device is selected from the group consisting of inverters,
converters, and power supplies.

7. A method of encapsulating an electrical circuit assembly, the method comprising

55 pressurizing a polyurethane flood coat composition ABCD as defined in any one of claims 1 to 4 at a predetermined
pressure with an inert gas;
applying a predetermined volume of the polyurethane flood coat composition ABCD over said complete assembly
at said predetermined pressure;

8
 EP 2 997 099 B1

allowing the polyurethane flood coat composition ABCD to gel; and

curing the coated assembly for a time and at a temperature sufficient to provide a Shore hardness of 15A to 60A.

8. A method according to claim 7, wherein the pressure is 207 kPa (30 psi).
5
9. A method according to claim 7 or claim 8, wherein the inert gas is nitrogen.

10. A method according to any one of claims 7 to 9, wherein the curing step is from 5 to 7 days at 25° C.

10 11. A method of providing mechanical support and environmental protection to an electrical circuit assembly exposed
to temperature extremes and vibration, the method comprising
applying a predetermined volume of the polyurethane flood coat composition ABCD as defined in any of claims 1
to 4 completely over said electrical circuit assembly;
allowing the polyurethane flood coat composition ABCD to gel; and
15 curing the polyurethane flood coat composition ABCD as a fixed mass on the electrical circuit assembly for a sufficient
time and at a sufficient temperature such that upon cure the thickness of the polyurethane flood coat composition
ABCD on component surfaces horizontal to the base support of the assembly is from 0.51 mm to 1.91 mm (from
20 mils to 75 mils), and the thickness of the polyurethane flood coat composition ABCD on component surfaces
perpendicular to the base support of the assembly is from 0.10 mm to 0.51 mm (from 4 mils to 20 mils).
20
12. A method according to claim 11, wherein the polyurethane flood coat composition has a Shore hardness from 15A
to 90A when cured.

25 Patentansprüche

1. Polyurethanflächenbeschichtungszusammensetzung ABCD, umfassend

ein Polyisocyanat-Prepolymer als Teil A; und
in Teil B ein Polyol in einer Menge von 93 bis 98 Gew.-%, bezogen auf den Gesamtgewichtsprozentanteil von Teil
30 B; ein Rheologiemittel C; und einen Katalysator D,
dadurch gekennzeichnet, dass, wenn ein Verhältnis von Teil A mit einem Verhältnis von Teil B gemischt wird,
das Gemisch einen Thixotropieindex von 1 bis 5; eine Gelierzeit von 5 bis 15 Minuten; und nach dem Härten eine
Shore-Härte von 15A bis 90A bereitstellt;
wobei sich der Thixotropieindex auf die Viskosität, die bei 2,5 RPM gemessen wird, geteilt durch die Viskosität, die
35 bei 20 RPM gemessen wird, eines Mischverhältnisses von Teil A und Teil B bezieht, wobei die geeigneten Ge-
wichtsmengen von Teil A und Teil B mit der Hand 1-2 Minuten bei 25 °C gemischt werden, und die Viskosität des
Gemischs unter Verwendung eines Brookfield-Viskosimeters mit einer Spindel Nr. 7 bei 2,5 RPM und anschließend
bei 20 RPM bestimmt wird.

40 2. Polyurethanflächenbeschichtungszusammensetzung ABCD nach Anspruch 1, wobei das Polyisocyanat-Prepoly-

mer A zu 50-60 Gew.-% polymeres Diphenylmethandiisocyanat A1; zu 40-50 Gew.-% Polypropylenglycol A2; und
eine Stabilisatorverbindung A3, wie etwa Benzoylchlorid, umfasst, die zu 0,03 Gew.-%, bezogen auf das Gesamt-
gewicht von Teil A, vorhanden ist.

45 3. Polyurethanflächenbeschichtungszusammensetzung ABCD nach Anspruch 1 oder Anspruch 2, wobei das Polyi-

socyanat-Prepolymer A zu 10 bis 12 Gew.-% Isocyanat-Gruppen (N=C=O), bezogen auf das Gesamtgewicht des
Polyisocyanats, enthält.

4. Polyurethanflächenbeschichtungszusammensetzung ABCD nach einem der Ansprüche 1 bis 3, wobei das Polyol
50 B Rizinusöl ist; und/oder
wobei das Rheologiemittel C zu 2 bis 6 Gew.-% pyrogenes Siliciumdioxid, bezogen auf das Gesamtgewicht von
Teil B, umfasst; und/oder
wobei der Katalysator D ein metallorganischer Katalysator ist, wie etwa Dibutylzinndiacetat; und/oder wobei die
Shore-Härte bei 40 A bis 60 A liegt; und/oder wobei der Thixotropieindex bei 1,2 bis 3,5 liegt; und/oder
55 wobei die Gelierzeit bei 5 bis 12 Minuten liegt; und/oder wobei die Anfangsviskosität des Gemischs aus Teil A und
Teil B bei 15.000 bis 18.000 cp liegt.

5. Elektrische Schaltkreisbaugruppe, umfassend einen Grundträger mit einer Mehrzahl elektrischer Schaltkreiskom-

9
 EP 2 997 099 B1

ponenten, die sich von der Oberfläche des daran befestigten Grundträgers nach außen erstrecken und elektrisch
an den elektrischen Schaltkreis angeschlossen sind, und
die Polyurethanflächenbeschichtungszusammensetzung ABCD entsprechend der Definition in einem der Ansprü-
che 1 bis 4, wobei die Polyurethanflächenbeschichtungszusammensetzung ABCD die elektrische Schaltkreisbau-
5 gruppe nach dem Härten als feste Masse vollständig bedeckt oder einkapselt, sodass die Dicke der
Polyurethanflächenbeschichtungszusammensetzung ABCD auf Komponentenoberflächen horizontal zu dem
Grundträger bei 0,51 mm bis 1,91 mm (20 mil bis 75 mil) liegt und die Dicke der Polyurethanflächenbeschichtungs-
zusammensetzung ABCD auf Komponentenoberflächen senkrecht zu dem Grundträger bei 0,10 mm bis 0,51 mm
(4 mil bis 20 mil) liegt; oder
10 wobei die Dicke der Polyurethanflächenbeschichtungszusammensetzung ABCD auf Komponentenoberflächen
senkrecht zu dem Grundträger bei über 0,10 mm und unter 0,25 mm (über 4 mil und unter 10 mil) liegt; oder
wobei die Dicke der Polyurethanflächenbeschichtungszusammensetzung ABCD auf Komponentenoberflächen ho-
rizontal zu dem Grundträger bei über 0,51 mm und unter 1,78 mm (über 20 mil und unter 70 mil) liegt; und/oder
wobei die Polyurethanflächenbeschichtungszusammensetzung ABCD nach dem Härten eine Shore-Härte von 15
15 A bis 90 A aufweist; oder
wobei die Polyurethanflächenbeschichtungszusammensetzung ABCD nach dem Härten eine Shore-Härte von 40
A bis 60 A aufweist.

6. Elektrische Schaltkreisbaugruppe nach Anspruch 5, wobei die elektrische Schaltkreisbaugruppe innerhalb einer
20 elektronischen Vorrichtung angeordnet ist, wobei die elektronische Vorrichtung beispielsweise aus der Gruppe
bestehend aus Wechselrichtern, Umrichtern und Stromversorgungen ausgewählt ist.

7. Verfahren zum Einkapseln einer elektrischer Schaltkreisbaugruppe, wobei das Verfahren ein Druckbeaufschlagen
einer Polyurethanflächenbeschichtungszusammensetzung ABCD entsprechend der Definition in einem der Ansprü-
25 che 1 bis 4 bei einem vorab festgelegten Druck mit einem Inertgas; ein Aufbringen eines vorab festgelegten Volumens
der Polyurethanflächenbeschichtungszusammensetzung ABCD über die komplette Baugruppe bei dem vorab fest-
gelegten Druck; ein Gelierenlassen der Polyurethanflächenbeschichtungszusammensetzung ABCD; und ein Härten
der beschichteten Baugruppe für eine Zeit und bei einer Temperatur, die ausreichend sind, um eine Shore-Härte
von 15 A bis 60 A bereitzustellen, umfasst.
30
8. Verfahren nach Anspruch 7, wobei der Druck bei 207 kPa (30 psi) liegt.

9. Verfahren nach Anspruch 7 oder Anspruch 8, wobei das Inertgas Stickstoff ist.

35 10. Verfahren nach einem der Ansprüche 7 bis 9, wobei der Schritt des Härtens 5 bis 7 Tage bei 25 °C erfolgt.

11. Verfahren zum Bereitstellen von mechanischer Unterstützung und Umweltschutz für eine elektrische Schaltkreis-
baugruppe, die Temperaturextremen und Vibration ausgesetzt ist, wobei das Verfahren ein Aufbringen eines vorab
festgelegten Volumens der Polyurethanflächenbeschichtungszusammensetzung ABCD entsprechend der Defini-
40 tion in einem der Ansprüche 1 bis 4 komplett über die elektrische Schaltkreisbaugruppe; ein Gelierenlassen der
Polyurethanflächenbeschichtungszusammensetzung ABCD; und ein Härten der Polyurethanflächenbeschichtungs-
zusammensetzung ABCD als feste Masse auf der elektrischen Schaltkreisbaugruppe für eine ausreichende Zeit
und bei einer ausreichenden Temperatur umfasst, dass nach dem Härten die Dicke der Polyurethanflächenbe-
schichtungszusammensetzung ABCD auf den Komponentenoberflächen horizontal zu dem Grundträger der Bau-
45 gruppe bei 0,51 mm bis 1,91 mm (20 mil bis 75 mil) liegt, und die Dicke der Polyurethanflächenbeschichtungszu-
sammensetzung ABCD auf Komponentenoberflächen senkrecht zu dem Grundträger der Baugruppe bei 0,10 mm
bis 0,51 mm (4 mil bis 20 mil) liegt.

12. Verfahren nach Anspruch 11, wobei die Polyurethanflächenbeschichtungszusammensetzung nach dem Härten
50 eine Shore-Härte von 15 A bis 90 A aufweist.

Revendications

55 1. Composition de revêtement intégral en polyuréthane ABCD comprenant

un prépolymère de polyisocyanate en tant que partie A ; et
dans la partie B, un polyol en une quantité de 93 à 98 % en poids par rapport au % en poids total de partie B ; un
agent de rhéologie C ; et un catalyseur D, caractérisée en ce que lorsqu’une proportion de partie A est mélangée

10
 EP 2 997 099 B1

avec une proportion de partie B le mélange fournit un indice de thixotropie de 1 à 5 ; un temps de gélification de 5
à 15 minutes ; et une dureté Shore de 15A à 90A lorsqu’il est durci ;
l’indice de thixotropie faisant référence à la viscosité mesurée à 2,5 tr/min divisée par la viscosité mesurée à 20
tr/min d’une proportion de mélange de partie A et de partie B, quand les quantités en poids appropriées de partie
5 A et de partie B sont mélangées à la main pendant 1-2 minutes à 25 °C et la viscosité du mélange est déterminée
à l’aide d’un viscosimètre Brookfield avec un mobile #7 à 2,5 tr/min et ensuite à 20 tr/min.

2. Composition de revêtement intégral en polyuréthane ABCD selon la revendication 1, dans laquelle le prépolymère
de polyisocyanate A comprend de 50 à 60 % en poids de diisocyanate de diphénylméthane polymère A1 ; de 40
10 à 50 % en poids de polypropylèneglycol A2 ; et un composé stabilisant A3, tel que le chlorure de benzoyle présent
à hauteur de 0,03 % en poids, par rapport au poids total de partie A.

3. Composition de revêtement intégral en polyuréthane ABCD selon la revendication 1 ou la revendication 2, dans

laquelle le prépolymère de polyisocyanate A contient de 10 à 12 % en poids de groupes isocyanate (N=C=O), par
15 rapport au poids total du polyisocyanate.

4. Composition de revêtement intégral en polyuréthane ABCD selon l’une quelconque des revendications 1 à 3, dans
laquelle le polyol B est l’huile de ricin ; et/ou
dans laquelle l’agent de rhéologie C contient de 2 à 6 % en poids de silice sublimée, par rapport au poids total de
20 partie B ; et/ou
dans laquelle le catalyseur D est un catalyseur organométallique, tel que le diacétate de dibutylétain ; et/ou
dans laquelle la dureté Shore est de 40A à 60A ; et/ou
dans laquelle l’indice de thixotropie est de 1,2 à 3,5 ; et/ou
dans laquelle le temps de gélification est de 5 à 12 minutes ; et/ou
25 dans laquelle la viscosité initiale du mélange de partie A et de partie B est de 15 000 à 18 000 cP.

5. Ensemble circuit électrique comprenant

un support de base doté d’une pluralité de composants de circuit électrique s’étendant vers l’extérieur à partir de
la surface du support de base fixés à celui-ci et électriquement connectés à la circuiterie électrique et
30 la composition de revêtement intégral en polyuréthane ABCD telle que définie dans l’une quelconque des reven-
dications 1 à 4,
dans lequel la composition de revêtement intégral en polyuréthane ABCD recouvre ou encapsule complètement
l’ensemble circuit électrique sous forme d’une masse fixe après durcissement de façon telle que l’épaisseur de la
composition de revêtement intégral en polyuréthane ABCD sur des surfaces de composants horizontales par rapport
35 au support de base est de 0,51 mm à 1,91 mm (de 20 millièmes de pouce à 75 millièmes de pouce) et l’épaisseur
de la composition de revêtement intégral en polyuréthane ABCD sur des surfaces de composants perpendiculaires
au support de base est de 0,10 mm à 0,51 mm (de 4 millièmes de pouce à 20 millièmes de pouce) ; ou
dans lequel l’épaisseur de la composition de revêtement intégral en polyuréthane ABCD sur des surfaces de
composants perpendiculaires au support de base est supérieure à 0,10 mm et inférieure à 0,25 mm (supérieure à
40 4 millièmes de pouce et inférieure à 10 millièmes de pouce) ; ou
dans lequel l’épaisseur de la composition de revêtement intégral en polyuréthane ABCD sur des surfaces de
composants horizontales par rapport au support de base est supérieure à 0,51 mm et inférieure à 1,78 mm (supérieure
à 20 millièmes de pouce et inférieure à 70 millièmes de pouce) ; et/ou
dans lequel la composition de revêtement intégral en polyuréthane ABCD a une dureté Shore de 15A à 90A
45 lorsqu’elle est durcie ; ou
dans lequel la composition de revêtement intégral en polyuréthane ABCD a une dureté Shore de 40A à 60A
lorsqu’elle est durcie.

6. Ensemble circuit électrique selon la revendication 5, ledit ensemble circuit électrique étant situé au sein d’un dispositif
50 électronique, par exemple le dispositif électronique étant choisi dans le groupe constitué par des onduleurs, des
convertisseurs et des alimentations électriques.

7. Procédé d’encapsulation d’un ensemble circuit électrique, le procédé comprenant

la mise sous pression d’une composition de revêtement intégral en polyuréthane ABCD telle que définie dans l’une
55 quelconque des revendications 1 à 4 à une pression prédéfinie avec un gaz inerte ;
l’application d’un volume prédéfini de la composition de revêtement intégral en polyuréthane ABCD par-dessus
ledit ensemble complet à ladite pression prédéfinie ;
le fait de laisser la composition de revêtement intégral en polyuréthane ABCD gélifier ; et

11
 EP 2 997 099 B1

le durcissement de l’ensemble revêtu pendant une durée et à une température suffisantes pour fournir une dureté
Shore de 15A à 60A.

8. Procédé selon la revendication 7, dans lequel la pression est de 207 kPa (30 lb/po2).
5
9. Procédé selon la revendication 7 ou la revendication 8, dans lequel le gaz inerte est l’azote.

10. Procédé selon l’une quelconque des revendications 7 à 9, dans lequel l’étape de durcissement est de 5 à 7 jours
à 25 °C.
10
11. Procédé de fourniture de support mécanique et de protection contre l’environnement à un ensemble circuit électrique
exposé à des extrêmes de température et à des vibrations, le procédé comprenant
l’application d’un volume prédéfini de la composition de revêtement intégral en polyuréthane ABCD telle que définie
dans l’une quelconque des revendications 1 à 4 complètement par-dessus ledit ensemble circuit électrique ;
15 le fait de laisser la composition de revêtement intégral en polyuréthane ABCD gélifier ; et
le durcissement de la composition de revêtement intégral en polyuréthane ABCD sous forme d’une masse fixe sur
l’ensemble circuit électrique pendant une durée suffisante et à une température suffisante de façon telle qu’après
durcissement l’épaisseur de la composition de revêtement intégral en polyuréthane ABCD sur des surfaces de
composants horizontales par rapport au support de base de l’ensemble est de 0,51 mm à 1,91 mm (de 20 millièmes
20 de pouce à 75 millièmes de pouce) et l’épaisseur de la composition de revêtement intégral en polyuréthane ABCD
sur des surfaces de composants perpendiculaires au support de base de l’ensemble est de 0,10 mm à 0,51 mm
(de 4 millièmes de pouce à 20 millièmes de pouce).

12. Procédé selon la revendication 11, dans lequel la composition de revêtement intégral en polyuréthane a une dureté
25 Shore de 15A à 90A lorsqu’elle est durcie.

30

35

40

45

50

55

12
EP 2 997 099 B1

13
EP 2 997 099 B1

14
EP 2 997 099 B1

15
 EP 2 997 099 B1

REFERENCES CITED IN THE DESCRIPTION

This list of references cited by the applicant is for the reader’s convenience only. It does not form part of the European
patent document. Even though great care has been taken in compiling the references, errors or omissions cannot be
excluded and the EPO disclaims all liability in this regard.

Patent documents cited in the description

• US 3747037 A [0006] [0007] • US 5871822 A [0006]

• US 4300184 A [0006] • US 8360390 B [0006]
• US 5863597 A [0006] • US 20060076047 A [0006]

16