E28-2G4M27SX User Manual

SX1280 2.4GHz 500mW SPI High-speed LoRa module

 Chengdu Ebyte Electronic Technology Co., Ltd. E28-2G4M27SX
User Manual

CONTENTS
Chapter 1 Product Overview ................................................................................................................................................. 3
1.1 Product Introduction ....................................................................................................................................................3
1.2 Features and Functions ............................................................................................................................................... 3
1.3 Application ..................................................................................................................................................................4
Chapter 2 Technical Parameters ...............................................................................................................................................4
2.1 Limit parameters ...................................................................................................................................................... 4
2.2 Working parameters ................................................................................................................................................. 4
Chapter 3 Mechanical Dimensions and Pin Definition ..................................................................................................... 5
Chapter 4 Basic Operations ........................................................................................................................................................5
4.1 Hardware design ........................................................................................................................................................ 6
4.2 Software editing ...................................................................................................................................................... 7
Chapter 5 Basic Applications ..................................................................................................................................................... 8
5.1 Basic circuit ............................................................................................................................................................. 8
Chapter 6 FAQ ................................................................................................................................................................................ 9
6.1 Communication range is too short .................................................................................................................9
6.2 Module is easy to damage ................................................................................................................................... 9
6.3 Bit error rate is too high ...............................................................................................................................9
Chapter 7 Welding Operation Guidance............................................................................................................................ 10
7.1 Reflow temperature ...............................................................................................................................................10
7.2 Reflow soldering curve ......................................................................................................................................11
Chapter 8 Related Models ....................................................................................................................................................11
Chapter 9 Antenna Guidelines ................................................................................................................................................12
9.1 Antenna recommendation ......................................................................................................................................12
Revise History ................................................................................................................................................................................12
About us .........................................................................................................................................................................................13

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 Chengdu Ebyte Electronic Technology Co., Ltd. E28-2G4M27SX
User Manual

Disclaimer and Copyright Notice

Information in this document, including URL addresses for reference, is
subject to change without notice. Documentation is provided "as is" without
warranty of any kind, including any warranties of merchantability, fitness for
a particular purpose, or non-infringement, and any warranties referred to
elsewhere in any proposal, specification or sample. No liability is assumed in
this document, including any liability for infringement of any patent rights
arising out of the use of the information in this document. This document does
not hereby grant, by estoppel or otherwise, any license, express or implied,
to any intellectual property rights.

The test data obtained in this article are all obtained by the Ebyte
laboratory test, and the actual results may be slightly different.

All trade names, trademarks and registered trademarks mentioned herein are
the property of their respective owners and are hereby acknowledged.

The final interpretation right belongs to Chengdu Ebyte Electronic

Technology Co., Ltd.

Notice:

Due to product version upgrade or other reasons, the contents of this manual may be changed. Ebyte

Electronic Technology Co., Ltd. reserves the right to modify the contents of this manual without any notice

or prompt. This manual is only used as a guide. Chengdu Ebyte Electronic Technology Co., Ltd. does its

best to provide accurate information in this manual. However, Chengdu Ebyte Electronic Technology Co.,

Ltd. does not ensure that the contents of the manual are completely error-free. All statements in this

manual, information and advice do not create any express or implied warranties.

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 Chengdu Ebyte Electronic Technology Co., Ltd. E28-2G4M27SX
User Manual

Chapter 1 Product Overview

1.1 Product Introduction

E28-2G4M27SX is a 2.4GHz RF transceiver module designed and

produced by Ebyte Company, with a transmit power of 500mW, SPI
interface, and extremely low current consumption in low-power mode;
the module is a small-volume SMD type (pin spacing 1.27mm) , using
52MHz industrial-grade high-precision low-temperature drift
crystal oscillator to ensure its industrial characteristics and its
stable performance.

Using Semtech's SX1280 radio frequency chip, this chip contains a

variety of physical layers and a variety of modulation methods, such as LoRa, FLRC, GFSK, and is compatible with
Bluetooth protocols; special modulation and processing methods make LoRa and FLRC modulation The transmission distance
has significant Improvement, built-in power amplifier (PA) and low noise amplifier (LNA) on the basis of the original,
so that the maximum transmit power reaches 500mW and the receiving sensitivity is further improved, and the overall
communication stability is compared with no power amplifier and low Noise amplifier products have been greatly improved;
excellent low-power performance, on-chip DC-DC and Time-of-flight make this chip powerful and can be used in smart
homes, security systems, location tracking, wireless ranging, wearable devices, Smart bracelets and health management,
etc. SX1280 supports RSSI, users can realize in-depth secondary development according to their needs, and also
integrates time of flight, which is suitable for ranging function.

E28-2G4M27SX is a pure RF transceiver module, which needs to be driven by MCU or use a dedicated SPI debugging tool.

1.2 Features and Functions

 Under ideal conditions, the communication distance can reach 8km;

 Built-in PA+LNA, maximum transmit power 500mW;
 Compatible with BLE protocol;
 Support license-free ISM 2.4GHz frequency band;
 Support data transmission rate of 0.595k～2Mbps;
 Support multiple modulation modes（GFSK Mode，FLRC Mode，LoRa Mode）;
 Support 2.5 ~ 3.6V power supply, more than 3.3V power supply can ensure the best performance;
 Adjustable air rate, up to 1.3Mbps under FLRC modulation;
 Excellent anti-blocking properties;
 Ranging, with Time-of-flight function.

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1.3 Application

 Smart home and industrial sensors, etc;

 Security system, positioning system;
 Wireless remote control, drone;
 Wireless game remote;
 Healthcare products;
 Wireless voice, wireless headset;
 Automotive industry applications.

Chapter 2 Technical Parameters

2.1 Limit parameters

Performance
Main parameters Remark
Min Max
Supply voltage (V) 0 3.6 Exceeding 3.6V will permanently burn the module
The probability of burning at close range is
Blocking power (dBm) - 10
small
Working temperature (℃) -40 +85 Industrial grade

2.2 Working parameters

Performance
Main parameters Remark
Min Typ Max
Working voltage (V) 2.5 3.3 3.6 ≥3.3V can guarantee output power
Communication level (V) 3.3 Risk of burnout with 5V TTL
Working temperature (℃) -40 - 85 Industrial grade design
Working frequency band (MHz) 2400 2450 2500 Support ISM band
Emission current (mA) 580 Instantaneous power consumption
Power
Receive current (mA) 14.5
consumption
Sleep current (μA) 2.0 software shutdown
Maximum transmit power (dBm) 26 26.5 27 See section 4.2 for details
LoRa receiver sensitivity with CR=4/5
Receive Sensitivity (dBm) -130 -131 -132 and high sensitivity mode enabled 1
SF12,BW=203kHz
LoRa（bps） 0.595k - 253.9k User programmable customization
Air Rate FLRC（bps） 260k - 1.3M User programmable customization
GFSK（bps） 125k - 2M User programmable customization

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Main parameters Description Remark

Clear and open, antenna gain 5dBi, antenna height 2.5 meters,
Reference Distance 8000m
air rate 1kbps
FIFO 256Byte The maximum length of a single transmission
Crystal Frequency 52MHz ±10ppm/11pF
Modulation LoRa(recommend) GFSK，FLRC，LoRa
Packaging Method SMD
Interface 1.27mm
Communication Interface SPI 0～10Mbps
Dimensions 15*20mm
Antenna Interface IPEX/PCB Equivalent impedance is about 50Ω

Chapter 3 Mechanical Dimensions and Pin Definition

Pin Pin
Pin item Application
Number Orientation
Power supply, range 2.5~3.6V (recommended to add external ceramic filter
1 VCC
capacitor)
2 GND Ground wire, connected to the power reference ground

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SPI data output pin; can also be used as UART transmit pin (see SX1280 manual
3 MISO_TX Output
for details)
SPI data input pin; can also be used as a UART receive pin (see SX1280 manual
4 MOSI_RX Input
for details)
SPI clock input pin; can also be used as a UART request to transmit pin
5 SCK_RTSN Input
(see SX1280 manual for details)
Module chip select pin, used to start an SPI communication; also used for
6 NSS_CTS Input
UART clear transmit pin (See SX1280 manual for details)
7 GND Ground wire, connected to the power reference ground
8 RX_EN Input LNA control pin, active high
9 TX_EN Input PA control pin, active high
10 GND Ground wire, connected to the power reference ground
11 NRESET Input Chip reset trigger input pin, active low, built-in pull-up resistor 50K
12 BUSY Output Used for status indication (see SX1280 manual for details)
13 DIO1 Input/Output Configurable general-purpose IO ports (see SX1280 manual for details)
14 DIO2 Input/Output Configurable general-purpose IO ports (see SX1280 manual for details)
15 DIO3 Input/Output Configurable general-purpose IO ports (see SX1280 manual for details)
16 GND Ground wire, connected to the power reference ground

Chapter 4 Basic Operations

4.1 Hardware design

 It is recommended to use a DC regulated power supply to supply power to the module, the power supply
ripple coefficient should be as small as possible, and the module should be grounded reliably;
 Please pay attention to the correct connection of the positive and negative poles of the power supply,
such as reverse connection may cause permanent damage to the module;
 Please check the power supply to ensure that it is between the recommended power supply voltages.
If it exceeds the maximum value, the module will be permanently damaged;
 Please check the stability of the power supply, the voltage should not fluctuate greatly and
frequently;
 When designing the power supply circuit for the module, it is often recommended to reserve more than
30% of the margin, so that the whole machine can work stably for a long time;
 The module should be kept as far away as possible from the power supply, transformer, high-frequency
wiring and other parts with large electromagnetic interference;
 High-frequency digital traces, high-frequency analog traces, and power traces must avoid the
underside of the module. If it is absolutely necessary to pass under the module, assuming that the
module is soldered on the Top Layer, lay copper on the Top Layer of the contact part of the module.
Copper and well grounded), must be close to the digital part of the module and routed on the Bottom
Layer;

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 Chengdu Ebyte Electronic Technology Co., Ltd. E28-2G4M27SX
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 Assuming that the module is soldered or placed on the Top Layer, it is also wrong to arbitrarily
route wires on the Bottom Layer or other layers, which will affect the stray and receiving sensitivity
of the module to varying degrees;
 Assuming that there are devices with large electromagnetic interference around the module, it will
also greatly affect the performance of the module. It is recommended to stay away from the module
according to the intensity of the interference. If the situation allows, appropriate isolation and
shielding can be done;
 Assuming that there are traces with large electromagnetic interference around the module
(high-frequency digital, high-frequency analog, power traces), the performance of the module will
also be greatly affected. It is recommended to stay away from the module according to the intensity
of the interference. Proper isolation and shielding;
 If the communication line uses 5V level, a 1k-5.1k resistor must be connected in series (not
recommended, there is still a risk of damage);
 Try to stay away from some TTL protocols whose physical layer is also 2.4GHz, such as USB3.0;
 The antenna installation structure has a great influence on the performance of the module. Make sure
that the antenna is exposed, preferably vertically upward. When the module is installed inside the
casing, a high-quality antenna extension cable can be used to extend the antenna to the outside of
the casing;
 The antenna must not be installed inside the metal shell, which will greatly reduce the transmission
distance.

4.2 Software editing

 This module is SX1280+PA+LNA, its driving mode is completely equivalent to SX1280, users can operate
according to the SX1280 chip manual;
 GDO0 is a general-purpose I/O port, see SX1280 manual;
 GDO2 is generally configured as an IRQ-like function, or it can be disconnected. The SPI query method
can be used to obtain the interrupt status, but it is recommended to use the external interrupt of
the microcontroller for connection;
 After the SX1280 is restored to IDLE mode or configured in sleep mode, it is recommended to
re-initialize the power configuration table.
 It is recommended to set the power output parameter of SX1280 to 0dBm. At this time, the module can
output power of 27dBm. When the output power of SX1280 is increased, the current will increase, and
the power will not increase significantly.

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Chapter 5 Basic Applications

5.1 Basic circuit

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Chapter 6 FAQ

6.1 Communication range is too short

 When there is a straight-line communication obstacle, the communication distance will be correspondingly
attenuated;
 Temperature, humidity, and co-channel interference will increase the communication packet loss rate;
 The ground absorbs and reflects radio waves, and the test effect close to the ground is poor;
 Seawater has a strong ability to absorb radio waves, so the seaside test effect is poor;
 If there is a metal object near the antenna, or is placed in a metal shell, the signal attenuation will be very
serious;
 The power register is set incorrectly, and the air rate is set too high (the higher the air rate, the closer the
distance);
 The low voltage of the power supply at room temperature is lower than the recommended value, and the
lower the voltage, the lower the output power;
 The antenna used is poorly matched with the module or the quality of the antenna itself is faulty.

6.2 Module is easy to damage

 Please check the power supply to ensure that it is between the recommended power supply voltages. If it
exceeds the maximum value, the module will be permanently damaged;
 Please check the stability of the power supply, the voltage should not fluctuate greatly and frequently;
 Please ensure anti-static operation during installation and use, and high-frequency components are
electrostatically sensitive;
 Please ensure that the humidity during installation and use should not be too high, and some components
are humidity-sensitive devices;
 If there is no special requirement, it is not recommended to use it at too high or too low temperature.

6.3 Bit error rate is too high

 There is co-frequency signal interference nearby, stay away from the interference source or modify
the frequency and channel to avoid interference;
 The clock waveform on the SPI is not standard, check whether there is interference on the SPI line,
and the SPI bus line should not be too long;
 If the power supply is not ideal, it may also cause garbled characters. Be sure to ensure the
reliability of the power supply;
 Poor quality or too long extension lines and feeder lines will also cause a high bit error rate.

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Chapter 7 Welding Operation Guidance

7.1 Reflow temperature

Profile Feature Curve feature Sn-Pb Assembly Pb-Free Assembly

Solder Paste Solder paste Sn63/Pb37 Sn96.5/Ag3/Cu0.5
Minimum preheat
Preheat Temperature min （Tsmin） 100℃ 150℃
temperature
Maximum preheat
Preheat temperature max (Tsmax) 150℃ 200℃
temperature
Preheat Time (Tsmin to Tsmax)(ts) Preheat time 60-120 sec 60-120 sec
Average ramp-up rate(Tsmax to Tp) Average rate of ascent 3℃/second max 3℃/second max
Liquidous Temperature (TL) Liquidus temperature 183℃ 217℃
Time（tL）Maintained Above（TL） Time above liquidus 60-90 sec 30-90 sec
Peak temperature（Tp） Peak temperature 220-235℃ 230-250℃
Aveage ramp-down rate（Tp to Tsmax） Average rate of descent 6℃/second max 6℃/second max
Time from 25°C to peak
Time 25℃ to peak temperature 6 minutes max 8 minutes max
temperature

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7.2 Reflow soldering curve

Chapter 8 Related Models

Frequency Power Distance Size

Model IC Package Interface
Hz dBm km mm
E28-2G4T12S SX1280 2.4G 12.5 3 17.5*28.7 SMD TTL

E28-2G4M27S SX1280 2.4G 27 8 15*26.5 SMD SPI

E28-2G4M20S SX1280 2.4G 20 6 15*26.5 SMD SPI

E28-2G4M12S SX1280 2.4G 12.5 3 25*14 SMD SPI

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Chapter 9 Antenna Guidelines

9.1 Antenna recommendation

Antennas play an important role in the communication process, and often inferior antennas will have a great
impact on the communication system. Therefore, our company recommends some antennas as antennas with
excellent performance and reasonable price for our wireless modules.
Frequency Gain Size Feeder
Model Type Interface Features
Hz dBi mm cm
TX2400-NP-5010 FPC 2.4G 2.0 10x50 - IPEX Flexible FPC Soft Antenna
Ultra-short straight,
TX2400-JZ-3 Rubber 2.4G 2.0 30 - SMA-J
omnidirectional antenna
Ultra-short straight,
TX2400-JZ-5 Rubber 2.4G 2.0 50 - SMA-J
omnidirectional antenna
Fixed bent, omnidirectional
TX2400-JW-5 Rubber 2.4G 2.0 50 - SMA-J
antenna
Bendable glue stick,
TX2400-JK-11 Rubber 2.4G 2.5 110 - SMA-J
omnidirectional antenna
Bendable glue stick,
TX2400-JK-20 Rubber 2.4G 3.0 200 - SMA-J
omnidirectional antenna
Small suction cup antenna,
TX2400-XPL-150 Sucker 2.4G 3.5 150 150 SMA-J
cost-effective

Revise History

Version Revision Date Revision Notes Operator

1.0 2021-11-15 Initial Version Linson

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About us

Hotline：4000-330-990 Tel：028-61399028
Support：[email protected]
Website：https://www.cdebyte.com
Address：Building B5, No. 199, West District Avenue, High-tech West
District, Chengdu City, Sichuan Province

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