ABSOLUTE MAXIMUM RATINGS (TA = 25 °C Unless Otherwise Noted)
PARAMETERS/TEST CONDITIONS SYMBOL LIMITS UNITS Drain-Source Voltage VDS -20 V Gate-Source Voltage VGS ±12 TC = 25 °C -10 Continuous Drain Current ID TC = 100 °C -6.2 A 1 IDM Pulsed Drain Current -24 TC = 25 °C 25 Power Dissipation PD W TC = 100 °C 9.6 Operating Junction & Storage Temperature Range TJ, TSTG -55 to 150 °C
THERMAL RESISTANCE RATINGS
THERMAL RESISTANCE SYMBOL TYPICAL MAXIMUM UNITS Junction-to-Case RqJC 5 °C / W Junction-to-Ambient RqJA 110 1 Pulse width limited by maximum junction temperature. 2 Duty cycle ≤1%
Ver 1.1 1 2013-3-26
PA102FDG P-Channel Enhancement Mode MOSFET
ELECTRICAL CHARACTERISTICS (TJ = 25 °C, Unless Otherwise Noted)
LIMITS PARAMETER SYMBOL TEST CONDITIONS UNIT MIN TYP MAX STATIC Drain-Source Breakdown Voltage V(BR)DSS VGS = 0V, ID = -250mA -20 V Gate Threshold Voltage VGS(th) VDS = VGS, ID = -250mA -0.45 -0.8 -1.2 Gate-Body Leakage IGSS VDS = 0V, VGS = ±12V ±100 nA VDS = -16V, VGS = 0V -1 Zero Gate Voltage Drain Current IDSS mA VDS = -13.2V, VGS = 0V , TJ = 125 °C -10 On-State Drain Current1 ID(ON) VDS = -5V, VGS = -4.5V -24 A Drain-Source On-State VGS = -2.5V, ID = -2A 124 180 RDS(ON) mΩ Resistance1 VGS = -4.5V, ID = -3A 93 115 Forward Transconductance1 gfs VDS = -5V, ID = -3A 4.4 S DYNAMIC Input Capacitance Ciss 369 Output Capacitance Coss VGS = 0V, VDS = -10V, f = 1MHz 78 pF Reverse Transfer Capacitance Crss 67 2 Qg Total Gate Charge 5.1 2 VDS = 0.5V(BR)DSS, VGS = -4.5V, Gate-Source Charge Qgs 1 nC ID = -3A 2 Qgd Gate-Drain Charge 2 2 td(on) Turn-On Delay Time 25 2 tr Rise Time VDD = -10V, 60 nS Turn-Off Delay Time 2 td(off) ID @ -1A, VGS = -5V, RG = 6Ω 70 Fall Time2 tf 60 SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS (TJ = 25 °C) Continuous Current IS -10 3 A Pulsed Current ISM -24 Forward Voltage1 VSD IF = -10A, VGS = 0V -1.2 V 1 Pulse test : Pulse Width 300 msec, Duty Cycle 2%. 2 Independent of operating temperature. 3 Pusle width limited by maximum junction temperature.