FusionServer 2288H V7 Server Technical White Paper

FusionServer 2288H V7 Server
Technical White Paper
Issue 04
Date 2024-03-15
xFusion Digital Technologies Co., Ltd.

Copyright © xFusion Digital Technologies Co., Ltd. 2024. All rights reserved.
No part of this document may be reproduced or transmitted in any form or by any means without prior written
consent of xFusion Digital Technologies Co., Ltd.
Trademarks and Permissions

and other xFusion trademarks are trademarks of xFusion Digital Technologies Co., Ltd.
All other trademarks and trade names mentioned in this document are the property of their respective
holders.
Notice
In this document, "xFusion" is used to refer to "xFusion Digital Technologies Co., Ltd." for concise description
and easy understanding, which does not mean that "xFusion" may have any other meaning. Any "xFusion"
mentioned or described hereof may not be understood as any meaning other than "xFusion Digital
Technologies Co., Ltd.", and xFusion Digital Technologies Co., Ltd. shall not bear any liability resulting from
the use of "xFusion".
The purchased products, services and features are stipulated by the contract made between xFusion and
the customer. All or part of the products, services and features described in this document may not be within
the purchase scope or the usage scope. Unless otherwise specified in the contract, all statements,
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The information in this document is subject to change without notice. Every effort has been made in the
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xFusion Digital Technologies Co., Ltd.

Address: 9th Floor, Building 1, Zensun Boya Square, Longzihu Wisdom Island
Zhengdong New District 450046
Zhengzhou, Henan Province
People's Republic of China
Website: https://www.xfusion.com
Issue 04 (2024-03-15) Copyright © xFusion Digital Technologies Co., Ltd. i

Technical White Paper About This Document
About This Document
Purpose
This document describes the appearance, features, performance parameters, and
hardware and software compatibility of FusionServer 2288H V7, so that users can
have an in-depth and detailed understanding of FusionServer 2288H V7.
Intended Audience
This document is intended for pre-sales engineers.
Symbolic Conventions
The symbols that may be found in this document are defined as follows:
Symbol Description
Indicates a hazard with a high level of risk which, if not

avoided, could result in death or serious injury.
Indicates a hazard with a medium risk which, if not

avoided, could result in death or serious injury.
Indicates a low-level hazard which, if not avoided, could

result in minor or moderate injury.
Indicates a potentially hazardous situation which, if not

avoided, could result in device damage, data loss, device
performance degradation, or other unpredictable results.
NOTICE is used to address practices not related to
personal injury.
Supplements the important information in the main text.

NOTE is used to address information not related to
personal injury, equipment damage, and environment
deterioration.
Issue 04 (2024-03-15) Copyright © xFusion Digital Technologies Co., Ltd. ii

Technical White Paper About This Document
Change History
Issue Release Date Change Description
04 2024-03-15 Updated:
5.5.1.6 24 x 2.5" Drive NVMe Configurations
03 2024-01-31 Updated:
5.4.1.5 Memory Installation Positions
5.5.1 Drive Configurations and Drive
Numbering
02 2023-11-30 Updated:
5.7.2 PCIe Slots
Added:
11 Waste Product Recycling
02 2023-11-30 Added 8 x 2.5" drive pass-through configuration

3 and 4, 8 x 2.5" drive + 4 GPU configuration 1
and 2, 12 x 2.5" drive pass-through configuration
1 and 2 (4 x SATA + 8 x NVMe), 12 x 2.5" drive
(4 x SAS/SATA + 8 x NVMe) + 4 GPU
configuration 1 and 2, 12 x 3.5" drive EXP
configuration 1 and 2, 24 x 2.5" drive pass-
through configuration (3 x RAID controller
cards), and 25 x 2.5" drive EXP configuration.
01 2023-06-21 This issue is the first official release.
Issue 04 (2024-03-15) Copyright © xFusion Digital Technologies Co., Ltd. iii

Technical White Paper Contents
Contents
About This Document.........................................................................................................ii

1 Overview........................................................................................................................... 1
2 Product Features............................................................................................................. 2
3 Physical Structure........................................................................................................... 5
4 Logical Structure............................................................................................................. 7
5 Hardware Description......................................................................................................8
5.1 Front Panel.................................................................................................................................................. 8
5.1.1 Appearance...............................................................................................................................................8
5.1.2 Indicators and Buttons............................................................................................................................ 10
5.1.3 Ports........................................................................................................................................................15
5.2 Rear Panel.................................................................................................................................................18
5.2.1 Appearance.............................................................................................................................................18
5.2.2 Indicators and Buttons............................................................................................................................ 20
5.2.3 Ports........................................................................................................................................................22
5.3 Processors.................................................................................................................................................24
5.4 Memory......................................................................................................................................................24
5.4.1 DDR5 Memory........................................................................................................................................ 25
5.4.1.1 Memory Identifier................................................................................................................................. 25
5.4.1.2 Memory Subsystem Architecture......................................................................................................... 26
5.4.1.3 Memory Compatibility.......................................................................................................................... 27
5.4.1.4 DIMM Installation Rules.......................................................................................................................28
5.4.1.5 Memory Installation Positions.............................................................................................................. 29
5.4.1.6 Memory Protection Technologies.........................................................................................................33
5.5 Storage...................................................................................................................................................... 34
5.5.1 Drive Configurations and Drive Numbering............................................................................................ 34
5.5.1.1 8 x 2.5" Drive Pass-Through Configurations........................................................................................34
5.5.1.2 12 x 2.5" Drive Pass-Through Configurations......................................................................................41
5.5.1.4 12 x 3.5" Drive EXP Configurations..................................................................................................... 55
5.5.1.6 24 x 2.5" Drive NVMe Configurations.................................................................................................. 63
Issue 04 (2024-03-15) Copyright © xFusion Digital Technologies Co., Ltd. iv

5.5.1.7 25 x 2.5" Drive EXP Configurations..................................................................................................... 71

5.5.2 Drive Indicators.......................................................................................................................................74
5.5.3 RAID Controller Card..............................................................................................................................76
5.6 Network......................................................................................................................................................76
5.6.1 OCP 3.0 NIC...........................................................................................................................................76
5.7 I/O Expansion............................................................................................................................................ 76
5.7.1 PCIe Cards............................................................................................................................................. 76
5.7.2 PCIe Slots...............................................................................................................................................77
5.7.3 PCIe Slot Description..............................................................................................................................84
5.8 PSUs..........................................................................................................................................................89
5.9 Fan Modules.............................................................................................................................................. 90
5.10 LCD..........................................................................................................................................................90
5.11 Boards......................................................................................................................................................92
5.11.1 Mainboard............................................................................................................................................. 92
5.11.2 Drive Backplanes.................................................................................................................................. 95
5.11.3 Fan Board........................................................................................................................................... 106
5.11.4 Adapter Board..................................................................................................................................... 106
6 Product Specifications................................................................................................ 109

6.1 Technical Specifications...........................................................................................................................109
6.2 Environmental Specifications................................................................................................................... 113
6.3 Physical Specifications.............................................................................................................................115
7 Software and Hardware Compatibility....................................................................... 117

8 Safety Instructions.......................................................................................................118
8.1 Security.................................................................................................................................................... 118
8.2 Maintenance and Warranty......................................................................................................................121
9 System Management................................................................................................... 123

10 Certifications ............................................................................................................. 125
11 Waste Product Recycling.......................................................................................... 127
A Appendix...................................................................................................................... 128
A.1 Chassis Label Information.......................................................................................................................128
A.1.1 Chassis Head Label............................................................................................................................. 128
A.1.1.1 Nameplate......................................................................................................................................... 129
A.1.1.2 Certificate.......................................................................................................................................... 130
A.1.1.3 Quick Access Label...........................................................................................................................131
A.1.2 Chassis Internal Label..........................................................................................................................132
A.1.3 Chassis Tail Label.................................................................................................................................133
A.2 Product SN.............................................................................................................................................. 133
A.3 Operating Temperature Limitations......................................................................................................... 136
A.4 Nameplate............................................................................................................................................... 150
A.5 RAS Features..........................................................................................................................................151
Issue 04 (2024-03-15) Copyright © xFusion Digital Technologies Co., Ltd. v

A.6 Sensor List...............................................................................................................................................151
B Glossary....................................................................................................................... 158
B.1 A-E...........................................................................................................................................................158
B.2 F-J........................................................................................................................................................... 159
B.3 K-O.......................................................................................................................................................... 159
B.4 P-T...........................................................................................................................................................159
B.5 U-Z...........................................................................................................................................................160
C Acronyms and Abbreviations.................................................................................... 161

C.1 A-E.......................................................................................................................................................... 161
C.2 F-J........................................................................................................................................................... 162
C.3 K-O..........................................................................................................................................................163
C.4 P-T...........................................................................................................................................................164
C.5 U-Z.......................................................................................................................................................... 166
Issue 04 (2024-03-15) Copyright © xFusion Digital Technologies Co., Ltd. vi

Technical White Paper 1 Overview
1 Overview
FusionServer 2288H V7 is a new-generation 2U 2-socket rack server designed for

the Internet, Internet Data Center (IDC), cloud computing, enterprise business, and
telecom.
This product is ideal for IT core services, cloud computing, virtualization, high-
performance computing, distributed storage, big data processing, enterprise or
telecom applications, and other complex workloads.
This product features low power consumption, high scalability, high reliability, and
easy management and deployment.
NO TE
For details about the server nameplate, see A.4 Nameplate.
Figure 1-1 Server with 12 x 3.5" drives (example)
Issue 04 (2024-03-15) Copyright © xFusion Digital Technologies Co., Ltd. 1

Technical White Paper 2 Product Features
2 Product Features
Performance
● The server supports the new generation of Intel® Xeon® Scalable processors
(Sapphire Rapids). A processor provides up to 60 cores and 120 threads, up to
350 W TDP, a maximum of 4.2 GHz turbo frequency, 2 MB L2 cache and 1.875
MB L3 cache, and four groups of 16 GT/s UPI links between the processors,
which deliver supreme processing performance.
● The server supports a maximum of 32 DDR5 4800 MT/s registered dual-inline
memory modules (RDIMMs), delivering up to 4096 GB total memory capacity
(calculated using the maximum capacity of a single memory module: 128 GB).
The memory modules feature high speed and availability.
Scalability
● Flexible drive configurations cater to a variety of business requirements and
ensure high elasticity and scalability of storage resources.
● Supports up to 12 x 3.5" or 25 x 2.5" front drives + 4 x 3.5" built-in drives.
● Supports up to 24 x 2.5" NVMe U.2 drives, improving storage density and I/O
performance.
● The server supports a maximum of 14 standard slots (including four built-in
slots). Among the 14 slots, up to six can be PCIe x16 slots and up to eight
(including four built-in slots) support PCIe 5.0.
● Supports two GE/10GE/25GE/100GE OCP 3.0 NICs with bandwidth scalable to
PCIe 4.0 x 16 and orderly hot swap.
NO TE
A hot swap of an OCP NIC requires support of related OS drivers. Ensure that the OS is
started and the OCP hot swap-related drivers have been loaded before performing a hot
swap of an OCP NIC.
Availability and Serviceability

● Carrier-class components with process expertise ensure high system reliability
and availability.
● The server uses hot-swappable SAS/SATA drives. SAS/SATA drives support
RAID 0, 1, 1E, 10, 5, 50, 6, and 60, depending on the RAID controller card used.

It also uses a supercapacitor to protect the RAID cache data against power
failures.
● The panel provides a UID/Healthy LED indicator, fault diagnosis LCD, and fault
diagnosis LCD touch panel. The iBMC Web management interface provides key
component status indications. The iBMC web management interface helps
technical personnel quickly find faulty components or the components with risk
of faults, simplifying maintenance, speeding up troubleshooting, and improving
system availability.
● The mounting ear provides the iBMC direct connect management port to support
local iBMC O&M, improving O&M efficiency.
● A server provides two hot-swappable PSUs in 1+1 redundancy mode and four
hot-swappable fan modules in N+1 redundancy mode, improving system
availability.
● The onboard Intelligent Baseboard Management Controller (iBMC) can
continuously monitor system parameters, trigger alarms, and take recovery
measures to minimize shutdown.
Manageability and Security

● The built-in iBMC monitors server operating status and provides remote
management.
● Supports BIOS menu passwords to ensure the security of system startup and
system management.
● Supports the Network Controller Sideband Interface (NC-SI) feature that allows
a network port to provide functions of both a management network port and a
service network port. The NC-SI feature can be enabled or disabled through the
iBMC or BIOS. The NC-SI feature is disabled by default.
NO TE
The service network port of the NC-SI feature supports the following configurations:
● It can be bound to any network port of the server's OCP 3.0 NIC or other standard
PCIe NICs that support the NC-SI function.
● It allows users to enable or disable the virtual local area network ID (VLAN ID) and
configure the VLAN ID. The VLAN ID is 0 and disabled by default.
● It supports IPv4 and IPv6 addresses, and allows users to configure the IP address,
subnet mask, default gateway, or prefix length of an IPv6 address.
● The integrated Unified Extensible Firmware Interface (UEFI) improves setup,
configuration, and update efficiency and simplifies fault clearance.
● Supports the lockable server front bezel to ensure local data security.
● Supports chassis cover opening detection to enhance physical security.
● Intel Execute Disable Bit (EDB) function prevents certain types of malicious
buffer overflow attacks when working with a supported OS.
● Intel® Trusted Execution Technology defends against malicious software attacks
based on hardware, prevents the firmware on the device from being maliciously
modified, and prevents unauthorized boot block execution.
● Intel® Software Guard Extensions (SGX) technology allows applications to run in
their own independent space without being affected by other software running in
the system, thereby enhancing security.

● Supports secure boot based on the chip-level Root of Trust (RoT) and provides
the level-by-level verification function starting from the hardware trusted root,
building a complete secure boot chain.
● Supports the trusted platform module (TPM) and trusted password module
(TCM) to provide advanced encryption functions, such as digital signature and
remote authentication.
● Meets requirements in NIST SP 800-193.
● Meets the following requirements in NIST SP 800-147B:
– The BIOS firmware digital signature update mechanism is supported. During
the upgrade, the digital signature is verified to prevent unauthorized BIOS
firmware upgrade.
– The flash security protection mechanism is supported to prevent
unauthorized modification of the flash in the OS.
Energy Efficiency
● Provides 80 Plus Platinum/Titanium PSUs with different energy efficiency levels.
The efficiency of the PSUs reaches 96% when the load is 50%.
● Supports active/standby power supply and high-voltage DC power supply to
improve the efficiency of the power supply system.
● Efficient Voltage Regulator Down (VRD) power supplies for boards minimize the
energy loss from DC/DC power conversion.
● Area-based Proportional-Integral-Derivative (PID) intelligent fan speed
adjustment and intelligent CPU frequency scaling optimize heat dissipation and
reduce overall system power consumption.
● The improved thermal design with energy-efficient fans ensures optimal heat
dissipation and reduces system power consumption.
● The server is protected with power capping and power control measures.
● Staggered spinup of drives reduces the server boot power consumption.

Technical White Paper 3 Physical Structure
3 Physical Structure
Figure 3-1 Physical structure of a server with 12 x 3.5" drives (example)
1 I/O module 1 2 I/O module 2
3 PSU 4 Chassis
5 I/O module 3 6 Supercapacitor holder
7 Air duct 8 Intrusion sensor

NOTE
The air duct cannot be
installed on a server
configured with built-in drives
or built-in cards.
9 Front-drive backplane 10 Left mounting ear plate
11 Front drives 12 Right mounting ear plate

Technical White Paper 3 Physical Structure
13 Fan modules 14 Fan module brackets
15 Fan board 16 Processor heat sink
17 Processor 18 Cable organizer
19 Mainboard 20 Memory modules
21 TPM/TCM 22 OCP 3.0 NIC
23 BMC card - -

Technical White Paper 4 Logical Structure
4 Logical Structure
Figure 4-1 Logical structure
● The server supports one or two new-generation Intel® Xeon® Scalable

processors (Sapphire Rapids). It supports 32 DDR5 DIMMs. The processors
interconnect with each other through four UltraPath Interconnect (UPI) links at a
speed of up to 16 GT/s.
● The PCIe bus resources of the processor are connected to the PCIe riser card
through PCBs or cables. Different PCIe riser cards support PCIe slots of different
specifications. CPU 1 and CPU 2 each support one OCP 3.0 NIC. The PCIe slot
bandwidth is scalable to x16.
● The BMC management chip integrated on the mainboard supports ports such as
a video graphic array (VGA) port, a management network port, and a serial port.

Technical White Paper 5 Hardware Description
5 Hardware Description
5.1 Front Panel

5.2 Rear Panel
5.3 Processors
5.4 Memory
5.5 Storage
5.6 Network
5.7 I/O Expansion
5.8 PSUs
5.9 Fan Modules
5.10 LCD
5.11 Boards
5.1 Front Panel
5.1.1 Appearance
● 8 x 2.5" drive configuration
Figure 5-1 Front view

1 Drive 2 (Optional) LCD module
3 Slide-out label plate (with - -

an SN label)
● 12 x 2.5" drive configuration (4 x SAS/SATA + 8 x NVMe)
1 Drive 2 Slide-out label plate (with

an SN label)

an SN label)
● 24 x 2.5" drive configuration:


an SN label)
3 Drive slot filler panel - -

NOTE
Drives cannot be installed
in the slot.

an SN label)
5.1.2 Indicators and Buttons
Indicator and Button Positions

Figure 5-6 Indicators and buttons on the front panel
1 UID button/indicator 2 Health status indicator
3 Power button/indicator 4 Fault diagnosis LED
5 FlexIO card 1 presence 6 FlexIO card 2 presence

indicator indicator
7 iBMC direct connect - -

management port
indicator


indicator indicator

management port
indicator

indicator indicator

management port
indicator


indicator indicator

management port
indicator

indicator indicator

management port
indicator

Indicator and Button Description
Table 5-1 Indicators and buttons on the front panel

Silkscreen Indicator/ Description
Button
Fault ● ---: The device is operating properly.

diagnosis LED ● Error code: A component is faulty.
For details about fault codes, see the iBMC
Alarm Handling.
Health status ● Off: The device is powered off or faulty.

indicator ● Blinking red at 1 Hz: A major alarm has been
generated on the system.
● Blinking red at 5 Hz: A critical alarm has been
generated on the system.
● Steady green: The device is operating
properly.
FlexIO card Indicates whether the FlexIO card is detected.

presence ● Off: The FlexIO card is not detected.
indicator
● Blinking green at 0.5 Hz: The FlexIO card is
detected but is not powered on.
● Blinking green at 2 Hz: The FlexIO card is
detected and has just been inserted.
● Steady green: The FlexIO card is detected
and the power supply is normal.


Button
Power button/ Power indicator:

indicator ● Off: The device is powered off.
● Steady green: The device is powered on.
● Blinking yellow: The iBMC is starting. The
power button is locked and cannot be
pressed. The iBMC is started in about 1
minute, and then the power indicator is
steady yellow.
● Steady yellow: The device is in the standby
state.
Power button:
● When the device is powered on, you can
press this button to gracefully shut down the
OS.
NOTE
For different OSs, you may need to shut down the
OS as prompted.
● When the device is powered on, you can hold
down this button for 6 seconds to forcibly
power off the device.
● When the power indicator is steady yellow,
you can press this button to power on the
device.
UID button/ The UID button/indicator helps identify and

indicator locate a device.
UID indicator:
● Off: The device is not being located.
● Blinking or steady blue: The device is being
located.
UID button:
● You can control the UID indicator status by
pressing the UID button or using the iBMC.
● You can press this button to turn on or off the
UID indicator.
● You can press and hold down this button for 4
to 6 seconds to reset the iBMC.


Button
iBMC direct Indicates the status when the iBMC direct

connect connect management port connects to a
management terminal (local PC):
port indicator ● Off: No terminal is connected.
● Blinking green at short intervals for 3 seconds
and then off: The port is disabled.
● Steady green: The terminal is connected.
Indicates the status when the iBMC direct
connect management port connects to a USB
device:
● Blinking red at long intervals: The job fails or
an error is reported when the job is complete.
● Blinking green at short intervals: The job is
being executed.
● Blinking green at short intervals for 3 seconds
and then off: The port is disabled.
● Steady green: The server configuration file is
being copied from the USB device or the job
is successfully completed.
5.1.3 Ports
Port Positions
Figure 5-11 Ports on the front panel
1 USB 3.0 port 2 iBMC direct connect

management port
3 VGA port - -


management port
3 VGA port - -

management port
3 VGA port - -

management port
3 VGA port - -


management port
3 VGA port - -
Port Description
Table 5-2 Ports on the front panel

Port Type QuantityNote Description
VGA port DB15 1 Used to connect a display

terminal, such as a monitor or
KVM.
iBMC direct USB Type-C 1 Used to connect to a local PC

connect NOTE using a USB Type-C cable to
management The USB 2.0 monitor and manage the
port protocol is system.
supported.
NOTE
Only local PCs running Windows
10 are supported.
● To log in to the iBMC from a
local PC, enter https://IP
address of the iBMC
management network port in
the address box of the browser
on the local PC.
Used to connect to a USB
device.
NOTICE
● Before connecting an external
USB device, ensure that the
USB device functions properly;
otherwise, it may adversely
impact the server.
● For details about how to
connect a USB device to the
iBMC direct connect
management port, see the
iBMC User Guide.

Port Type QuantityNote Description
USB port USB 3.0 2 Used to connect to a USB 3.0

device.
NOTICE
impact the server.
● The USB 3.0 port can be used
to supply power to low-power
peripherals. However, the USB
3.0 port must comply with the
USB specifications. To run
advanced peripherals, such as
external CD/DVD drives, an
external power supply is
required.
Note: The number of ports varies depending on server configuration. This table
lists the maximum number of ports in different configurations.
5.2 Rear Panel
5.2.1 Appearance
● Server with a drive module or PCIe riser module on the rear panel
Figure 5-16 Rear view
1 I/O module 1 2 I/O module 2
3 I/O module 3 4 PSU 2
5 PSU 1 6 (Optional) FlexIO card 2

NOTE
The FlexIO card slots
support only OCP 3.0 NICs.

7 (Optional) FlexIO card 1 - -

NOTE
NO TE
● I/O module 1 and I/O module 2 each can be a PCIe riser module, 2 x 3.5" rear-drive
module, or a module with 2 x 2.5" rear drives and one PCIe riser module.
● I/O module 3 supports a PCIe riser module or 4 x 2.5" rear-drive module.
● For details about the OCP 3.0 NIC, see 5.6.1 OCP 3.0 NIC.
● The figure is for reference only. The actual configuration may vary.
● 4-GPU model
Figure 5-17 Rear view
1 Slot 1 2 Slot 4
3 Slot 7 4 Slot 9
5 PSU 2 6 PSU 1
7 (Optional) FlexIO card 2 8 Slot 6

NOTE
9 Slot 3 10 (Optional) FlexIO card 1

NOTE
NO TE
● For details about the OCP 3.0 NIC, see 5.6.1 OCP 3.0 NIC.
● The figure is for reference only. The actual configuration may vary.

5.2.2 Indicators and Buttons
Indicator Positions
● Server with a drive module or PCIe riser module on the rear panel
Figure 5-18 Indicators on the rear panel
1 Data transmission status 2 Connection status

indicator for the indicator for the
management network management network
port port
3 Serial port indicator 4 UID indicator

NOTE
Reserved and unavailable
currently
5 PSU indicator - -
● 4-GPU model
Figure 5-19 Indicators on the rear panel
1 Data transmission status 2 Connection status

indicator for the indicator for the
management network management network
port port
3 Serial port indicator 4 UID indicator

NOTE
Reserved and unavailable
currently

5 PSU indicator - -
Indicator Description
Table 5-3 Indicators on the rear panel

Silkscreen Indicator Description
- Data transmission ● Off: No data is being transmitted.

status indicator for ● Blinking yellow: Data is being
the management transmitted.
network port
- Connection status ● Off: The network is not connected.

indicator for the ● Steady green: The network port is
management properly connected.
network port
- PSU indicator ● Off: No power is supplied.

● Blinking green at 1 Hz:
– The input is normal, and the
server is in the standby state.
– The input is overvoltage or
undervoltage.
– The PSU is in deep hibernation
mode.
● Blinking green at 4 Hz: The firmware
is being upgraded online.
● Steady green: The input and output
are normal.
● Steady orange: The input is normal
but there is no output.
NOTE
The possible causes of no output are as
follows:
● Power supply overtemperature
protection
● Power output overcurrent or short-
circuit
● Output overvoltage
● Short-circuit protection
● Device failure (excluding failure of all
devices)

Silkscreen Indicator Description
UID indicator The UID indicator helps identify and

locate a device.
● Off: The device is not being located.
● Blinking or steady blue: The device is
being located.
NOTE
You can control the UID indicator status by
pressing the UID button or using the iBMC.
5.2.3 Ports
Port Positions
● Server with a drive module or PRM on the rear panel
Figure 5-20 Ports on the rear panel
1 Management network 2 Serial port

port
3 VGA port 4 USB 3.0 port
5 Socket for PSU 1 6 Socket for PSU 2
● 4-GPU model
Figure 5-21 Ports on the rear panel

1 Management network 2 Serial port

port
3 VGA port 4 USB 3.0 port
5 Socket for PSU 1 6 Socket for PSU 2
Port Description
Table 5-4 Ports on the rear panel
Port Type Quantity Description
Management RJ45 1 iBMC management network

network port port, which is used to manage
the server.
NOTE
The management network port is
a GE port that supports 100 Mbit/s
and 1000 Mbit/s auto-negotiation.
Serial port RJ45 1 A port used for debugging. By

default, it serves as the OS
serial port. You can also set it
as the iBMC serial port on the
iBMC CLI.
NOTE
The port is a 3-wire serial
communication port, and its
default baud rate is 115,200 bit/s.
VGA port DB15 1 Used to connect a display

terminal, such as a monitor or
KVM.
USB port USB 3.0 2 Used to connect to a USB 3.0

device.
NOTICE
● The maximum current is 1.3 A
for an external USB device.
impact the server.
● The USB 3.0 port can be used
to supply power to low-power
peripherals. However, the USB
3.0 port must comply with the
USB specifications. To run
advanced peripherals, such as
external CD/DVD drives, an
external power supply is
required.

Port Type Quantity Description
PSU socket - 2 Used to connect to a power

distribution unit (PDU) through
a power cable. You can select
the PSUs as required.
NOTE
When determining the PSUs,
ensure that the rated power of the
PSUs is greater than that of the
server.
5.3 Processors
● The server supports one or two processors.
● If only one processor is required, install it in socket CPU 1.
● Processors of the same model must be used in a server.
● For details about the optional components, consult the local sales representative
or see "Search Parts" in the compatibility list on the technical support website.
Figure 5-22 Positions of the processors
5.4 Memory

5.4.1 DDR5 Memory
5.4.1.1 Memory Identifier

You can determine the memory module properties based on the label attached to the
memory module.
Figure 5-23 Memory identifier
No. Description Example
1 Capacity ● 16 GB
● 32 GB
● 64 GB
● 128 GB
2 rank(s) ● 1R = Single rank

● 2R = Dual rank
● 4R = Quad rank
● 8R = Octal rank
3 Data width on the DRAM ● x4: 4-bit

● x8: 8-bit
4 Type of the memory interface ● PC5 = DDR5
5 Maximum memory speed ● 4800 MT/s
6 Memory latency parameters ● A = 34-34-34

(CL-nRCD-nRP) ● B = 40-40-40
● C = 42-42-42
7 DIMM type ● RD0: reference design for

version RDIMM D0

No. Description Example
8 SPD version ● 10: SPD version

● 10: SPD versions from Byte
192 to Byte 447
9 Temperature grade ● Extended temperature grade

(XT): 0°C to 95°C (32°F to
203°F)
● Normal temperature grade
(NT): 0°C to 85°C (32°F to
185°F)
5.4.1.2 Memory Subsystem Architecture

The server provides 32 memory slots. Each processor integrates eight memory
channels.
Install the memory modules in the primary memory channels first. If the primary
memory channel is not populated, the memory modules in secondary memory
channels cannot be used.
Table 5-5 Memory channels
CPU Channel Memory Slot
CPU 1 A (primary) DIMM000(A)
A DIMM001(I)
B (primary) DIMM010(B)
B DIMM011(J)
C (primary) DIMM020(C)
C DIMM021(K)
D (primary) DIMM030(D)
D DIMM031(L)
E (primary) DIMM040(E)
E DIMM041(M)
F (primary) DIMM050(F)
F DIMM051(N)
G (primary) DIMM060(G)
G DIMM061(O)
H (primary) DIMM070(H)

CPU Channel Memory Slot
H DIMM071(P)
CPU 2 A (primary) DIMM100(A)
A DIMM101(I)
B (primary) DIMM110(B)
B DIMM111(J)
C (primary) DIMM120(C)
C DIMM121(K)
D (primary) DIMM130(D)
D DIMM131(L)
E (primary) DIMM140(E)
E DIMM141(M)
F (primary) DIMM150(F)
F DIMM151(N)
G (primary) DIMM160(G)
G DIMM161(O)
H (primary) DIMM170(H)
H DIMM171(P)
5.4.1.3 Memory Compatibility

Observe the following rules when configuring DDR5 memory modules:
NO TICE
● A server must use DDR5 memory modules of the same part number (P/N code),
and the memory speed is the lower one of the following two speed values:
● Memory speed supported by a CPU
● Maximum operating speed of a memory module
● The DDR5 memory modules of different types (RDIMM and RDIMM-3DS) and
specifications (capacity, bit width, rank, and height) cannot be used together.
● The memory module can be used with the new-generation Intel® Xeon®
Scalable processors (Sapphire Rapids). The maximum memory capacity
supported by all processor models is the same.

● The calculation formula of total memory capacity supported is as follows: the

total memory capacity equals the capacity sum of all DDR5 memory modules.
● For details about the type of a single memory module, see "Search Parts" in the
compatibility list on the technical support website.
● The maximum number of memory modules supported depends on the memory
module type and number of ranks.
Table 5-6 DDR5 memory specifications
Parameter Specifications
Capacity per DDR5 DIMM 16 32 64 128

(GB)
Type RDIMM RDIMM RDIMM RDIMM-3D

S
Rated speed (MT/s) 4800 4800 4800 4800
Operating voltage (V) 1.1 1.1 1.1 1.1
Maximum number of 32 32 32 32
DDR5 DIMMs in a servera
Maximum DDR5 memory 512 1024 2048 4096

capacity of the server
(GB)
Actual 1 DPCb 4800 4800 4800 4800

speed
(MT/s) 2DPC 4400 4400 4400 4400
● a: The maximum number of DDR5 memory modules is based on dual-

processor configuration. The number is halved for a server with only one
processor.
● b: DIMM per channel (DPC) indicates the number of memory modules per
channel.
● The information listed in this table is for reference only. For details, consult the
local sales representatives.
5.4.1.4 DIMM Installation Rules

Observe the following rules when configuring DDR5 memory modules:
● At least one DDR5 memory module must be configured with SPR CPU
(excluding HBM CPU). SPR HBM CPU can be configured without memory
module.
● The memory modules configured must be DDR5 RDIMMs.
● The memory modules must be configured with the same number of ranks.
● Install filler memory modules in vacant slots.

5.4.1.5 Memory Installation Positions

A server supports up to 32 DDR5 memory modules.
Observe the memory module installation rules when configuring memory modules.
For details, see the memory configuration guide on the technical support website.
For details about DDR5 DIMM installation rules of HBM CPUs, see Figure 5-27 and
Figure 5-28.
For details about DDR5 DIMM installation rules of other CPUs, see Figure 5-25 and
Figure 5-25.
Figure 5-24 Positions of the memory modules

Figure 5-25 DDR5 memory module installation guidelines (one processor)

Figure 5-26 DDR5 memory module installation guidelines (two processors)

Figure 5-27 DDR5 memory module installation guidelines (one HBM processor)

Figure 5-28 DDR5 memory module installation guidelines (two HBM processor)
5.4.1.6 Memory Protection Technologies

DDR5 memory modules support the following memory protection technologies:
● ECC
● Memory Mirroring
● Memory Single Device Data Correction (SDDC)
● Failed DIMM Isolation
● Memory Thermal Throttling
● Command/Address Parity Check and Retry
● Memory Demand/Patrol Scrubbing
● Memory Data Scrambling

● Post Package Repair (PPR)

● Write Data CRC Protection
● Adaptive Data Correction - Single Region (ADC-SR)
● Adaptive Double Device Data Correction - Multiple Region (ADDDC-MR)
● Partial Cache Line Sparing (PCLS, HBM only)
5.5 Storage
5.5.1 Drive Configurations and Drive Numbering
5.5.1.1 8 x 2.5" Drive Pass-Through Configurations
Drive Configurations
Table 5-7 Drive configurations
Configuratio Front Drive Rear Drive Built-in Drive Drive

n Management
Mode
8 x 2.5" drive ● Front drive: ● I/O module - ● SATA drive:

pass-through 8 x 2.5" 3: 4 x 2.5" PCH pass-
configuration – Slots 0 – Slots 44 through
1 to 7 to 47 ● NVMe
support support drive: CPU
only only pass-
SATA NVMe through
drives. drivesa.
8 x 2.5" drive ● Front drive: ● I/O module - ● SAS/SATA

pass-through 8 x 2.5" 3: 4 x 2.5" drive: 1 x
configuration – Slots 0 – Slots 44 PCIe plug-
2 to 7 to 47 in RAID
support support controller
only only card
SAS/ NVMe The PCIe
SATA plug-in
drivesa.
drives. RAID
controller
card is
installed in
slot 3 by
default.
● NVMe
drive: CPU
pass-
through


n Management
Mode
8 x 2.5" drive ● Front drive: - - ● SATA drive:

pass-through 8 x 2.5" PCH pass-
configuration – Slots 0 through
3 to 7 ● NVMe
support drive: CPU
only pass-
SATA/ through
NVMe
drivesa.
8 x 2.5" drive ● Front drive: - - ● SAS/SATA

pass-through 8 x 2.5" drive: 1 x
configuration – Slots 0 PCIe plug-
4 to 7 in RAID
support controller
SAS/ card
SATA/ The PCIe
NVMe plug-in
RAID
drivesa.
controller
card is
installed in
slot 3 by
default.
● NVMe
drive: CPU
pass-
through
Configuration ● Front drive: - - ● PCH pass-

1: 8 x 2.5" 8 x 2.5" through
drives + 4 x – Slots 0
GPUs to 7
support
only
SATA
drives.


n Management
Mode
Configuration ● Front drive: - - ● 1 x PCIe

2: 8 x 2.5" 8 x 2.5" plug-in
drives + 4 x – Slots 0 RAID
GPUs to 7 controller
support card
only The PCIe
SAS/ plug-in
SATA RAID
drives. controller
card is
installed in
slot 3 by
default.
● a: NVMe drives are supported when CPU 2 is configured. A single-CPU server

does not support NVMe drives.
● For details about the optional components, consult the local sales
representative or see "Search Parts" in the compatibility list on the technical
support website.
Drive Numbering
NO TICE
The drive numbers identified by the RAID controller card vary depending on the
cabling of the RAID controller card. This section uses the drive numbers identified by
a RAID controller card that adopts the default cabling described in "Internal Cabling"
in the server Maintenance and Service Guide.
● Drive numbering of the 8 x 2.5" drive pass-through configuration 1 in Table 5-7
Figure 5-29 Drive numbering

Table 5-8 Drive numbering
Drive No. Drive Number Displayed on the

iBMC WebUI
0 0
1 1
2 2
3 3
4 4
5 5
6 6
7 7
44 44
45 45
46 46
47 47
Drive No. Drive Number Drive Number

Displayed on the iBMC Identified by the RAID
WebUI Controller Card
0 0 0
1 1 1
2 2 2


3 3 3
4 4 4
5 5 5
6 6 6
7 7 7
44 44 -
45 45 -
46 46 -
47 47 -

iBMC WebUI
0 0
1 1
2 2
3 3
4 4
5 5
6 6
7 7


0 0 0
1 1 1
2 2 2
3 3 3
4 4 4
5 5 5
6 6 6
7 7 7
● Drive numbering of the configuration 1: 8 x 2.5" drives + 4 x GPUs in Table 5-7

iBMC WebUI
0 0
1 1
2 2
3 3
4 4
5 5


iBMC WebUI
6 6
7 7
● Drive numbering of the configuration 2: 8 x 2.5" drives + 4 x GPUs in Table 5-7

0 0 0
1 1 1
2 2 2
3 3 3
4 4 4
5 5 5
6 6 6
7 7 7


n Management
Mode

pass-through 12 x 2.5" PCH pass-
1 (4 x SATA to 3 ● NVMe
+ 8 x NVMe) support drive: CPU
only pass-
SATA through
drives.
– Slots 4
to 7
support
only
SATA/
NVMe
drives.
– Slots 8
to 11
support
only
NVMe
drives.


n Management
Mode

(4 x SAS/ 12 x 2.5" drive: 1 x
SATA + 8 x – Slots 0 PCIe plug-
NVMe) pass- to 3 in RAID
through support controller
configuration only card
2 SAS/ The PCIe
SATA plug-in
drives. RAID
controller
– Slots 4 card is
to 7 installed in
support slot 3 by
SAS/ default.
SATA/
NVMe ● NVMe
drives. drive: CPU
pass-
– Slots 8 through
to 11
support
only
NVMe
drives.

(4 x SATA + 8 12 x 2.5" PCH pass-
x NVMe) + 4 x – Slots 0 through
GPU to 3 ● NVMe
configuration support drive: CPU
1 only pass-
SATA through
drives.
– Slots 4
to 7
support
only
SATA/
NVMe
drives.
– Slots 8
to 11
support
only
NVMe
drives.


n Management
Mode

(4 x SAS/ 12 x 2.5" drive: 1 x
SATA + 8 x – Slots 0 PCIe plug-
NVMe) + 4 x to 3 in RAID
GPU support controller
configuration only card
2 SAS/ The PCIe
SATA plug-in
drives. RAID
controller
– Slots 4 card is
to 7 installed in
support slot 3 by
SAS/ default.
SATA/
NVMe ● NVMe
drives. drive: CPU
pass-
– Slots 8 through
to 11
support
only
NVMe
drives.
For details about the optional components, consult the local sales representative or
see "Search Parts" in the compatibility list on the technical support website.
Drive Numbering
NO TICE
● Drive numbering of the 12 x 2.5" drive (4 x SATA + 8 x NVMe) pass-through

configuration 1 and 12 x 2.5" drive (4 x SATA + 8 x NVMe) + 4 x GPU
configuration 1 in Table 5-14.


iBMC WebUI
0 0
1 1
2 2
3 3
4 4
5 5
6 6
7 7
8 8
9 9
10 10
11 11
● Drive numbering of the 12 x 2.5" drive (4 x SATA + 8 x NVMe) pass-through

configuration 2 and 12 x 2.5" drive (4 x SATA + 8 x NVMe) + 4 x GPU
configuration 2 in Table 5-14.

0 0 0
1 1 1
2 2 2
3 3 3
4 4 4Note


5 5 5Note
6 6 6Note
7 7 7Note
8 8 -
9 9 -
10 10 -
11 11 -
Note: If the slot is configured with a SAS/SATA drive, the RAID controller card
can manage the drive and allocate a number to the drive.

n Management
Mode

pass-through 12 x 3.5" 1: 2 x PCH pass-
configuration – Slots 0 2.5"a/2 x through
1 to 11 3.5" ● NVMe
support – Slots 40 drive: CPU
only and 41 pass-
SATA support through
drives. only
SATA
drives.
● I/O module
3: 4 x 2.5"
– Slots 44
to 47
support
only
NVMe
drivesb.


n Management
Mode

pass-through 12 x 3.5" 1: 2 x 2.5"a drive: 1 x
– Slots 40
2 to 11 in RAID
and 41
support controller
support
only card
only
SAS/ The PCIe
SAS/
SATA plug-in
SATA
drives. RAID
drives.
controller
● I/O module card is
2: 2 x 3.5" installed in
– Slots 42 slot 3 by
and 43 default.
support ● NVMe
only drive: CPU
SAS/ pass-
SATA through
drives.
● I/O module
3: 4 x 2.5"
– Slots 44
to 47
support
only
NVMe
drivesb.
12 x 3.5" drive ● Front drive: ● I/O module ● Built-in ● SAS/SATA

pass-through 12 x 3.5" 3: 4 x 2.5" drive: 4 x drive: 1 x
configuration – Slots 0 – Slots 44 3.5" PCIe plug-
3 to 11 to 47 – Slots 36 in RAID
support support to 39 controller
only only support card
SAS/ NVMe only The PCIe
SATA SAS/ plug-in
drivesb.
drives. SATA RAID
drives. controller
card is
installed in
slot 3 by
default.
● NVMe
drive: CPU
pass-
through


n Management
Mode

pass-through 12 x 3.5" 1: 2 x 3.5" PCH pass-
1 (4 x NVMe) to 7 and 41 ● NVMe
only only pass-
SATA SAS/ through
drives. SATA
– Slots 8 drives.
to 11 ● I/O module
support 3: 4 x 2.5"
only – Slots 44
SATA/ to 47
NVMe support
drives. only
NVMe
drivesb.

pass-through 12 x 3.5" 1: 2 x 2.5"a drive: 1 x
– Slots 40
2 (4 x NVMe) to 7 in RAID
and 41
support controller
support
only card
only
SAS/ The PCIe
SAS/
SATA plug-in
SATA
drives. RAID
drives.
controller
– Slots 8 ● I/O module card is
to 11 2: 2 x 3.5" installed in
support slot 3 by
– Slots 42
SAS/ default.
and 43
SATA/
support ● NVMe
NVMe
only drive: CPU
drives.
SAS/ pass-
SATA through
drives.
● I/O module
3: 4 x 2.5"
– Slots 44
to 47
support
only
NVMe
drivesb.


n Management
Mode
● a: I/O module 1 (2 x 2.5") is configured with rear 2 x 2.5" drives and a PCIe riser
module.
● b: NVMe drives are supported when CPU 2 is configured. A single-CPU server
support website.
Drive Numbering
NO TICE
● Drive numbering of the 12 x 3.5" drive pass-through configuration 1 in Table

5-17
Figure 5-37 Drive numbering (I/O module 1 configured with 2.5" drives)
Figure 5-38 Drive numbering (I/O module 1 configured with 3.5" drives)


iBMC WebUI
0 0
1 1
2 2
3 3
4 4
5 5
6 6
7 7
8 8
9 9
10 10
11 11
40 40
41 41
44 44
45 45
46 46
47 47

5-17


0 0 0
1 1 1
2 2 2
3 3 3
4 4 4
5 5 5
6 6 6
7 7 7
8 8 8
9 9 9
10 10 10
11 11 11
40 40 12
41 41 13
42 42 14
43 43 15
44 44 -
45 45 -
46 46 -
47 47 -

5-17


0 0 0
1 1 1
2 2 2
3 3 3
4 4 4
5 5 5
6 6 6
7 7 7
8 8 8
9 9 9


10 10 10
11 11 11
36 36 12
37 37 13
38 38 14
39 39 15
44 44 -
45 45 -
46 46 -
47 47 -
● Drive numbering of the 12 x 3.5" drive pass-through configuration 1 (4 x NVMe)

in Table 5-17

iBMC WebUI
0 0
1 1
2 2
3 3
4 4


iBMC WebUI
5 5
6 6
7 7
8 8
9 9
10 10
11 11
40 40
41 41
44 44
45 45
46 46
47 47
● Drive numbering of the 12 x 3.5" drive pass-through configuration 2 (4 x NVMe)

in Table 5-17

0 0 0
1 1 1


2 2 2
3 3 3
4 4 4
5 5 5
6 6 6
7 7 7
8 8 8Note
9 9 9Note
10 10 10Note
11 11 11Note
40 40 12
41 41 13
42 42 14
43 43 15
44 44 -
45 45 -
46 46 -
47 47 -

5.5.1.4 12 x 3.5" Drive EXP Configurations

n Management
Mode

EXP 12 x 3.5" 1: 2 x 2.5"a drive: 1 x
– Slots 40
1 to 11 in RAID
and 41
support controller
support
only card
only
SAS/ The PCIe
SAS/
SATA plug-in
SATA
drives. RAID
drives.
controller
and 43 default.
support ● NVMe
only drive: CPU
SAS/ pass-
SATA through
drives.
● I/O module
3: 4 x 2.5"
– Slots 44
to 47
support
only
NVMe
drivesb.


n Management
Mode
12 x 3.5" drive ● Front drive: ● I/O module ● Built-in ● SAS/SATA

EXP 12 x 3.5" 1: 2 x 2.5"a drive: 4 x drive: 1 x
configuration – Slots 0 3.5" PCIe plug-
– Slots 40
2 to 11 – Slots 36 in RAID
and 41
support to 39 controller
support
only support card
only
SAS/ only The PCIe
SAS/
SATA SAS/ plug-in
SATA
drives. SATA RAID
drives.
drives. controller
and 43 default.
support ● NVMe
only drive: CPU
SAS/ pass-
SATA through
drives.
● I/O module
3: 4 x 2.5"
– Slots 44
to 47
support
SAS/
SATA/
NVMe
drivesb.
● a: I/O module 1 (2 x 2.5") is configured with rear 2 x 2.5" drives and a PCIe riser
module.
support website.
Drive Numbering
NO TICE

● Drive numbering of the 12 x 3.5" drive EXP configuration 1 in Table 5-23

0 0 0
1 1 1
2 2 2
3 3 3
4 4 4
5 5 5
6 6 6
7 7 7
8 8 8
9 9 9
10 10 10
11 11 11
40 40 12
41 41 13
42 42 14
43 43 15
44 44 -
45 45 -


46 46 -
47 47 -
● Drive numbering of the 12 x 3.5" drive EXP configuration 2 in Table 5-23

0 0 0
1 1 1
2 2 2


3 3 3
4 4 4
5 5 5
6 6 6
7 7 7
8 8 8
9 9 9
10 10 10
11 11 11
36 36 12
37 37 13
38 38 14
39 39 15
40 40 16
41 41 17
42 42 18
43 43 19
44 44 20Note
45 45 21Note
46 46 22Note
47 47 23Note


pass-through 24 x 2.5" 3: 4 x 2.5" drive: 3 x
(3 x RAID to 23 to 47 in RAID
controller support support controller
cards) only only cards
SAS/ NVMe The PCIe
SATA plug-in
drivesa.
drives. RAID
controller
cards are
installed in
slot 2, 3, or
6 by
default.
● NVMe
drive: CPU
pass-
through
● a: NVMe drives are supported when CPU 2 is configured. A single-CPU server

support website.
Drive Numbering
NO TICE
● Drive numbering of the 24 x 2.5" drive pass-through configuration (3 x RAID

controller cards) in Table 5-26


0 0 0
1 1 1
2 2 2
3 3 3
4 4 4
5 5 5
6 6 6
7 7 7
8 8 0
9 9 1
10 10 2
11 11 3
12 12 4
13 13 5
14 14 6
15 15 7
16 16 0
17 17 1
18 18 2
19 19 3


20 20 4
21 21 5
22 22 6
23 23 7
44 44 -
45 45 -
46 46 -
47 47 -

5.5.1.6 24 x 2.5" Drive NVMe Configurations

n Management
Mode

NVMe 24 x 2.5" PCH pass-
1 (8 x SATA to 3 ● NVMe
+ 16 x NVMe) support drive: CPU
only pass-
SATA through
drives.
– Slots 4
to 11
support
only
NVMe
drives.
– Slots 12
to 15
support
only
SATA
drives.
– Slots 16
to 23
support
only
NVMe
drives.


n Management
Mode

NVMe 24 x 2.5" drive: 1 x
2 (8 x SAS/ to 3 in RAID
SATA + 16 x support controller
NVMe) only card
SAS/ The PCIe
SATA plug-in
drives. RAID
controller
– Slots 4 card is
to 11 installed in
support slot 3 by
only default.
NVMe
drives. ● NVMe
drive: CPU
– Slots 12 pass-
to 15 through
support
only
SAS/
SATA
drives.
– Slots 16
to 23
support
only
NVMe
drives.

NVMe 24 x 2.5" 3: 4 x 2.5" PCH pass-
3 to 23 to 47 ● NVMe
only only pass-
NVMe SATA through
drives. drives.


n Management
Mode

NVMe 24 x 2.5" 3: 4 x 2.5" drive: 1 x
4 to 23 to 47 in RAID
support support controller
only only card
NVMe SAS/ The PCIe
drives. SATA plug-in
drives. RAID
controller
card is
installed in
slot 5 by
default.
● NVMe
drive: CPU
pass-
through
For details about the optional components, consult the local sales representative or
see "Search Parts" in the compatibility list on the technical support website.
Drive Numbering
NO TICE
● Drive numbering of the 24 x 2.5" drive NVMe configuration 1 (8 x SATA + 16 x

NVMe) in Table 5-28


iBMC WebUI
0 0
1 1
2 2
3 3
4 4
5 5
6 6
7 7
8 8
9 9
10 10
11 11
12 12
13 13
14 14
15 15
16 16
17 17
18 18
19 19
20 20
21 21
22 22
23 23
● Drive numbering of the 24 x 2.5" drive NVMe configuration 2 (8 x SAS/SATA

+ 16 x NVMe) in Table 5-28


0 0 0
1 1 1
2 2 2
3 3 3
4 4 -
5 5 -
6 6 -
7 7 -
8 8 -
9 9 -
10 10 -
11 11 -
12 12 4
13 13 5
14 14 6
15 15 7
16 16 -
17 17 -
18 18 -
19 19 -
20 20 -
21 21 -
22 22 -


23 23 -
● Drive numbering of the 24 x 2.5" drive NVMe configuration 3 in Table 5-28

iBMC WebUI
0 0
1 1
2 2
3 3
4 4
5 5
6 6
7 7
8 8
9 9
10 10
11 11
12 12
13 13
14 14


iBMC WebUI
15 15
16 16
17 17
18 18
19 19
20 20
21 21
22 22
23 23
44 44
45 45
46 46
47 47
● Drive numbering of the 24 x 2.5" drive NVMe configuration 4 in Table 5-28

0 0 -
1 1 -
2 2 -


3 3 -
4 4 -
5 5 -
6 6 -
7 7 -
8 8 -
9 9 -
10 10 -
11 11 -
12 12 -
13 13 -
14 14 -
15 15 -
16 16 -
17 17 -
18 18 -
19 19 -
20 20 -
21 21 -
22 22 -
23 23 -
44 44 0
45 45 1
46 46 2
47 47 3

5.5.1.7 25 x 2.5" Drive EXP Configurations

n Management
Mode
25 x 2.5" Drive ● Front drive: ● I/O module - ● SAS/SATA

EXP 25 x 2.5" 1: 2 x 2.5"a drive: 1 x
Configurations – Slots 0 PCIe plug-
– Slots 40
to 24 in RAID
and 41
support controller
support
only card
only
SAS/ The PCIe
SAS/
SATA plug-in
SATA
drives. RAID
drives.
controller
2: 2 x 2.5"a installed in
and 43 default.
support ● NVMe
only drive: CPU
SAS/ pass-
SATA through
drives.
● I/O module
3: 4 x 2.5"
– Slots 44
to 47
support
only
NVMe
drivesb.
● a: I/O module (2 x 2.5") is configured with rear 2 x 2.5" drives and a PCIe riser
module.
support website.

Drive Numbering
NO TICE
● Drive numbering of the 25 x 2.5" drive EXP configuration in Table 5-33.

0 0 0
1 1 1
2 2 2
3 3 3
4 4 4
5 5 5
6 6 6
7 7 7
8 8 8
9 9 9
10 10 10
11 11 11


12 12 12
13 13 13
14 14 14
15 15 15
16 16 16
17 17 17
18 18 18
19 19 19
20 20 20
21 21 21
22 22 22
23 23 23
24 24 24
40 40 25
41 41 26
42 42 27
43 43 28
44 44 -
45 45 -
46 46 -
47 47 -

5.5.2 Drive Indicators

SAS/SATA Drive Indicators
Figure 5-51 SAS/SATA drive indicators
Table 5-35 SAS/SATA drive indicator description

Activity Indicator Fault Indicator Description
(Green) (Red/Blue)
Off Off The drive is not detected.
Steady on Off The drive is detected.
Blinking at 4 Hz Off Data is being read or written properly, or

data on the primary drive is being
rebuilt.
Steady on Blinking blue at 4 The drive is being located.

Hz
Blinking at 1 Hz Blinking red at 1 Data on the secondary drive is being

Hz synchronously rebuilt.
Off Red steady on A drive in a RAID array is removed.
Steady on Red steady on The drive is faulty.

NVMe Drive Indicator
Figure 5-52 NVMe drive indicator
● If the VMD function is enabled and the latest VMD driver is installed, the NVMe
drives support surprise hot swap.
Table 5-36 NVMe drive indicator description (VMD function enabled)
Activity Fault Indicator Description

Indicator (Red/Blue)
(Green)
Off Off The NVMe drive is not detected.
Steady on Off The NVMe drive is detected and

operating properly.
Blinking at 4 Hz Off Data is being read from or written to

the NVMe drive.
Steady on/ Blinking blue at 4 The NVMe drive is being located.

blinking Hz
Blinking at 1 Hz Blinking red at 1 Data on the NVMe secondary drive is

Hz synchronously being rebuilt.
Steady on/Off Red steady on The NVMe drive is faulty.
● If the VMD function is disabled, the NVMe drives support only orderly hot swap.
Table 5-37 NVMe drive indicator description (VMD function disabled)

(Green)
Off Off The NVMe drive is not detected.
Steady on Off The NVMe drive is detected and

operating properly.


(Green)
Blinking at 4 Hz Off Data is being read from or written to

the NVMe drive.
Steady on/ Blinking blue at 4 The NVMe drive is being located.

blinking Hz
Off Blinking red at The NVMe drive has completed the

0.5 Hz hot swap process and is removable.
Off Blinking red at 2 The NVMe drive is being hot-

Hz swapped.
Steady on/Off Red steady on The NVMe drive is faulty.
5.5.3 RAID Controller Card

The RAID controller card supports RAID configuration, RAID level migration, and
drive roaming.
● For details about the RAID controller card, see the server RAID Controller Card
User Guide.
5.6 Network
5.6.1 OCP 3.0 NIC

OCP 3.0 NICs provide network expansion capabilities.
● The FlexIO slot supports an OCP 3.0 NIC, which can be configured as required.
● For details about OCP 3.0 NICs, see the OCP 3.0 NIC User Guide.
5.7 I/O Expansion
5.7.1 PCIe Cards

PCIe cards provide ease of expandability and connection.
● The server with a drive module or a PCIe riser module on the rear panel
supports up to eight standard PCIe expansion slots.
● The server with four GPUs on the rear panel supports up to six standard PCIe
expansion slots (four FHFL dual-slot GPUs and two FHHL standard PCIe cards).

● When IB cards are used to build an IB network, ensure that the IPoIB modes of
the IB cards at both ends of the network connection are the same. For details,
contact technical support.
5.7.2 PCIe Slots

Positions of PCIe Slots
● Server with drive modules or PCIe riser modules on the rear panel
Figure 5-53 PCIe slots
– I/O module 1 provides slots 1, 2, and 3. If the module with 2 x 2.5" drives
and one PCIe riser card is used, slots 1 and 2 are unavailable.
– I/O module 2 provides slots 4, 5, and 6. If the module with 2 x 2.5" drives
and one PCIe riser card is used, slots 4 and 5 are unavailable.
– I/O module 3 provides slots 7 and 8.
● 4-GPU model
Figure 5-54 PCIe slots

Figure 5-55 Built-in PCIe slots
– 4-GPU riser module provides slots 1, 4, 7, and 9.

– I/O module 1 provides slot 3.
– I/O module 2 provides slot 6.
– The built-in 4-card module provides slots 11, 12, 13, and 14.
PCIe Riser Cards (Applicable to the Server with a Drive Module or a PCIe
Riser Module on the Rear Panel)
● PCIe riser card 1 of I/O module 1/2
– Provides PCIe slots 1, 2, and 3 when installed in I/O module 1.
– Provides PCIe slots 4, 5, and 6 when installed in I/O module 2.

Figure 5-56 PCIe riser card 1

– Provides PCIe slots 1 and 2 when installed in I/O module 1.



– Provides PCIe slot 3 when installed in I/O module 1.


● PCIe riser card 1 of I/O module 3

Provides PCIe slots 7 and 8 when installed in I/O module 3.
● PCIe riser card 2 of I/O module 3

– Provides slots 7 and 8 when one PCIe riser card 2 is installed.
– Provides slots 7, 8, 9, and 10 when two PCIe riser cards 2 are installed.

● Built-in PCIe riser card 1

For details about PCIe built-in expansion slots, see Built-in 4-card module
adapter board when installed on the built-in 4-card module adapter board.
– Provides PCIe slots 11 and 12 when installed in the card slot-4CHP
connector (J12).
– Provides PCIe slots 13 and 14 when installed in the card slot-4CHP
connector (J10).

PCIe riser card (applicable to 4-GPU models)

● PCIe riser card 1 of the rear GPU module
For details, see 4-GPU built-in adapter board when installed on the 4-GPU
built-in adapter board.
– Provides PCIe slot 4 when installed in the card slot-4CHP connector (J10).
● PCIe riser card 2 of the rear GPU module

For details, see 4-GPU built-in adapter board when installed on the 4-GPU
built-in adapter board.

5.7.3 PCIe Slot Description

NO TE
● When CPU 2 is not detected, the corresponding PCIe slot is unavailable.

● The PCIe port numbers in table 1 correspond to CPUs. For details about the PCIe port
number displayed on the BIOS screen, see the Eagle Stream platform BIOS parameter
reference of the server.
Server with Drive Modules or PCIe Riser Modules on the Rear Panel
Table 5-38 PCIe slot description
PCIe PCIe PCIe PCIe CPU PCIe PCIe

Riser Riser Slot on Slot or Port Device
Card Card the PCIe Port Number Support
Installati Riser Descripti ed by
on Card on the PCIe
Position Slot or
Port
PCIe I/O Slot 1 PCIe 5.0 CPU 1 Port3A FHHL

riser card module 1 x16a
1 of I/O (x16)b
module
1/2 Slot 2 PCIe 4.0 CPU 1 Port 2A FHHL
x16 (x8)
Slot 3 PCIe 4.0 CPU 1 Port 2E FHHL

x16 (x8)


on Card on the PCIe
Position Slot or
Port
I/O Slot 4 PCIe 5.0 CPU 2 Port 2A FHHL

module 2 x16 (x
16)
Slot 5 PCIe 4.0 CPU 2 Port 1A FHHL

x16 (x8)
Slot 6 PCIe 4.0 CPU 2 Port 1E FHHL

x16 (x8)
PCIe I/O Slot 1 PCIe 5.0 CPU 1 Port 3A FHFL

riser card module 1 x16 (x
2 of I/O 16)
module
1/2 Slot 2 PCIe 5.0 CPU 1 Port 2A FHFL
x16 (x
16)
I/O Slot 4 PCIe 5.0 CPU 2 Port 2A FHFL

module 2 x16 (x
16)
Slot 5 PCIe 5.0 CPU 2 Port 1A FHFL

x16 (x
16)

riser card module 1 x16 (x
3 of I/O 16)
module
1/2 Slot 3 PCIe 5.0 CPU 1 Port 2A FHHL
x16 (x
16)
I/O Slot 5 PCIe 5.0 CPU 2 Port 2A FHFL

module 2 x16 (x
16)
Slot 6 PCIe 5.0 CPU 2 Port 1A FHHL

x16 (x
16)
PCIe I/O Slot 3 PCIe 4.0 CPU 1 Port 2A FHHL

riser card module 1 x16 (x16)
4 of I/O
module I/O Slot 6 PCIe 4.0 CPU 2 Port 1A FHHL
1/2 module 2 x16 (x16)


on Card on the PCIe
Position Slot or
Port

5 of I/O
module I/O Slot 5 PCIe 4.0 CPU 2 Port 1A FHFL
1/2 module 2 x16 (x16)
PCIe I/O Slot 7 PCIe 4.0 CPU 2 Port 5A FHHL

1 of I/O
module 3 Slot 8 PCIe 4.0 CPU 2 Port 4A FHHL
x16 (x16)
PCIe I/O Slot 7/ PCIe 4.0 CPU 2 Port 5A/ HHHL

riser card module 3 Slot 9 x16 (x8) Port 4A
2 of I/O
module 3 Slot 8/ PCIe 4.0 CPU 2 Port 5E/ HHHL
Slot 10 x16 (x8) Port 4E
Built-in Built-in 4- Slot 11/ PCIe 5.0 CPU 1 Port 5A/ HHHL
PCIe card Slot 12/ x16 (x8) Port 5E/
riser card module Slot 13/ Port 4A/
1 adapter Slot 14 Port 4E
board
- - FlexIO PCIe 4.0 - Port 1A OCP 3.0

card 1 x16 (x8, specificat
x16c, x8 ions
+ x8d)

x16e) ions


on Card on the PCIe
Position Slot or
Port
● a: PCIe 5.0 refers to the PCIe of the fifth generation, and x16 refers to the
physical slot width.
● b: The x16 in brackets indicates that the link bandwidth is x16.
● c: The default link bandwidth of FlexIO card 1 is x8. The link bandwidth can be
extended to x16 using cables.
● d: FlexIO card 1 supports the Socket Direct function when it is connected to the
two CPUs through high-speed cables.
● e: The default link bandwidth of FlexIO card 2 is x8. The link bandwidth can be
extended to x16 using cables. When FlexIO card 1 supports the Socket-Direct
function, FlexIO card 2 can only support x8.
● The PCIe x16 slots are compatible with PCIe x16, PCIe x8, PCIe x4, and PCIe
x1 cards. The bandwidth of the PCIe slot cannot be less than that of the
inserted PCIe card.
● The full-height full-length (FHFL) PCIe slots are compatible with FHFL PCIe
cards, full-height half-length (FHHL) PCIe cards, and half-height half-length
(HHHL) PCIe cards.
● The FHHL PCIe slots are compatible with FHHL PCIe cards and HHHL PCIe
cards.
● The maximum power supply of each PCIe slot is 75 W.
Server with Four GPUs on the Rear Panel
Table 5-39 PCIe slot description

on Card on the PCIe
Position Slot or
Port
PCle 4 x GPU Slot 1/ PCIe 4.0 CPU Port 2A/ FHFL

riser card built-in slot 7 x16 (x16) 1/CPU 2 Port 2A
1 of the adapter
rear GPU board
module


on Card on the PCIe
Position Slot or
Port
PCle 4 x GPU Slot 4/ PCIe 4.0 CPU Port 4A/ FHFL

riser card built-in slot 9 x16 (x16) 1/CPU 2 Port 4A
2 of the adapter
rear GPU board
module

x16c, x8 ions
+ x8d)

x16e) ions
- - Mezzanin PCIe 4.0 - Port 0C Custom

e RAID x8
controller
(x8f)
card
● a: PCIe 5.0 refers to the PCIe of the fifth generation, and x16 refers to the
physical slot width.
● b: The x16 in brackets indicates that the link bandwidth is x16.
● c: The default link bandwidth of FlexIO card 1 is x8. The link bandwidth can be
extended to x16 using cables.
● d: FlexIO card 1 supports the Socket Direct function when it is connected to the
two CPUs through high-speed cables.
● e: The default link bandwidth of FlexIO card 2 is x8. The link bandwidth can be
extended to x16 using cables. When FlexIO card 1 supports the Socket-Direct
function, FlexIO card 2 can only support x8.
● f: When the link bandwidth of FlexIO card 1 is x16, the mezzanine RAID
controller card cannot be inserted.
● The PCIe x16 slots are compatible with PCIe x16, PCIe x8, PCIe x4, and PCIe
x1 cards. The bandwidth of the PCIe slot cannot be less than that of the
inserted PCIe card.
● The full-height full-length (FHFL) PCIe slots are compatible with FHFL PCIe
cards, full-height half-length (FHHL) PCIe cards, and half-height half-length
(HHHL) PCIe cards.
● The FHHL PCIe slots are compatible with FHHL PCIe cards and HHHL PCIe
cards.
● The maximum power supply of each PCIe slot is 75 W.

Server Bus/Device/Function Number (B/D/F) Information

The server's B/D/F information may change with PCIe card configurations. You can
obtain the B/D/F information of the server using the following methods:
● SOL serial port information: If serial port information has been collected, search
the keyword RootBusBDF or DeviceBDF in systemcom.tar file to query the
B/D/F information of the server.
● You can obtain the B/D/F of the server using the pci command. Run the help pci
command to obtain the specific usage of the pci command.
– Linux OS: You can obtain the B/D/F information of the server using the lspci
-vvv command.
NO TE
If the OS does not support the lspci command by default, obtain the pci-utils
package from the yum source and install it to make the OS support the command.
– Windows OS: After installing the pci-utils package, run the lspci command
to obtain the B/D/F information of the server.
– VMware OS: The lspci command is supported by default. You can directly
obtain the B/D/F information of the server using the lspci command.
5.8 PSUs
● Supports one or two PSUs.
● Supports AC or DC PSUs.
● Supports hot swap.
● When two PSUs are configured, 1+1 redundancy is supported.
● PSUs of the same P/N code must be used in a server.
● Short-circuit protection is provided, and bipolar fuses are provided for PSUs that
support dual live wire input.
● If the DC power supply is used, purchase the DC power supply that meets the
requirements of the safety standards or the DC power supply that has passed
the CCC certification.
Figure 5-66 Positions of PSUs

5.9 Fan Modules

● Supports four fan modules.
● Supports hot swap.
● Supports N+1 redundancy. The server runs properly when one fan fails.
● Supports intelligent fan speed adjustment.
● Fan modules of the same part number (P/N code) must be used in a server.
Figure 5-67 Positions of the fan modules
5.10 LCD
NO TE
Only the 8 x 2.5" drive pass-through configuration supports the LCD.
Functions
The LCD displays the installation status and running status of server components
and enables users to set the IP address of the iBMC management network port on
the server.
The LCD and the server iBMC form an LCD subsystem. The LCD directly obtains
device information from the iBMC. The LCD subsystem does not store device data.

Figure 5-68 LCD subsystem working principle
UI
Figure 5-69 LCD main interface
Table 5-40 Parameters on the LCD home screen
Tab Functions
Status Displays the port 80 status, serial number, component

status, and component alarms of the server.
Monitor Displays the current power, CPU temperature, and inlet

temperature of the server.

Tab Functions
Info. Displays the IP address and Media Access Control

(MAC) address of the iBMC management network port,
device SNs, asset information, and firmware version.
Setting Sets the IP address of the iBMC management network

port.
5.11 Boards
5.11.1 Mainboard
Figure 5-70 Mainboard

1 Leakage detection 2 VROC key connector

connector (LIQUID CONN/ (VROC KEY/J6066)
J6078)a
3 Cell battery holder (U6222) 4 CPU 2 UBC DD connector

(UBCDD2-7/J6053)
5 OCP 3.0 NIC 2 connector 6 RAID & M.2 mezzanine

(OCP2 CONN/J6073) card signal connector
(RAID&M.2/J6063)
7 OCP 3.0 NIC 2 UBC 8 Built-in HDD backplane &

connector (UBC2-5/J6071) BBU signal connector
(INNER BP&BBU/J6084)
9 CPU1 UBC DD connector 10 Rear I/O module 2 power

(UBCDD1-8/J6052) connector (IO2 PWR/
J6091)
11 Connector with 2 x USB 12 TPM/TCM connector (TPM

3.0 ports (USB3.0 CONN/ CONN/J6065)
J88)
13 Front drive power 14 Rear VGA port (VGA

connector (HDD PWR/ CONN/J60)
J6105)a
15 Built-in USB 2.0 connector 16 Serial port (COM/J6020)

(INNER USB2.0/J6067)
17 BMC management port 18 BMC management board

(BMC_GE/J6019)
19 LCD connector (LCD 20 OCP 3.0 NIC 1 connector

CONN/J6025) (OCP1 CONN/J6072)
21 OCP 3.0 NIC 1 UBC 22 CPU1 UBC DD connector

connector (UBC1-5/J42) (UBCDD1-7/J6051)
23 PCH SATA connector 2 24 Rear I/O module 1 power

(SATA2/J6099) connector (IO1 PWR/
J6092)
25 PCH SATA port C 26 Right mounting ear

connector (PORTC/J6100) connector (J6060)
27 Fan board power 28 PCH SATA ports A and B

connector (FAN PWR/ connector (PORT A-B/
J6094) J6104)
29 CPU 1 northbound UBC 30 Fan board signal connector

connector (UBC1-6/J64) (FAN BOARD/J6077)
31 PCH SATA connector 1 32 NC-SI connector (NCSI

(SATA1/J6098) CONN/J31)

33 CPU 1 southbound UBC 34 CPU 1 southbound UBC

connector (UBC1-4/J38) connector (UBC1-3/J37)

37 Intrusion sensor connector 38 CPU 2 southbound UBC

(INTRUDER CONN/S2) connector (UBC2-4/J45)

41 CPU 2 southbound UBC 42 CPU 2 northbound UBC

43 Left mounting ear 44 BBU power connector

connector (J6081) (BBU PWR/J6079)a
45 Front-drive backplane 46 Front-drive backplane

signal connector (FRONT power connector (FRONT
HDD BP/J6082) HDD PWR/J6093)
47 Rear I/O module 3 drive 48 Rear I/O module 3 power

backplane signal connector connector (IO3 PWR/
(PSU HDD BP/J6087) J6089)
49 PSU 2 connector (PSU2/ 50 PSU 1 connector (PSU1/

J6096) J6095)
51 CPU 2 UBC DD connector 52 Built-in drive module power

(UBCDD2-8/J6054) connector (INNER PWR/
J6090)
a: The reserved connector is temporarily unavailable.

NOTE
● In single-CPU configuration, the OCP 3.0 NIC can be installed only in the slot of FlexIO
card 1.
● In dual-CPU configuration, the OCP 3.0 NICs can be installed in the slots of FlexIO card 1
and FlexIO card 2.
● The default operating bandwidth of the slot of FlexIO card 1 is x8. If you need to
expand the bandwidth to x16, use a 14270055 cable to connect the OCP 3.0 NIC 1
UBC connector (J42) to the CPU 1 northbound UBC connector (J64) of the mainboard.
To expand the bandwidth to x8 + x8, use a 14270055-006 cable to connect the OCP
3.0 NIC 1 UBC connector (J42) to the CPU 2 northbound UBC connector (J53) of the
mainboard. In this case, the slot of the FlexIO card 2 cannot be expanded to x16.
● The default operating bandwidth of the slot of FlexIO card 2 is x8. If you need to
expand the bandwidth to x16, use a 14270055-003 cable to connect the OCP 3.0 NIC 2
UBC connector (J6071) to the CPU 2 northbound UBC connector (J53).

5.11.2 Drive Backplanes

Front-Drive Backplanes
● 8 x 2.5" drive pass-through backplane
This backplane is supported by 8 x 2.5" drive pass-through configuration 1, 8 x
2.5" drive pass-through configuration 2, 8 x 2.5" drive + 4 x GPU configuration 1,
and 8 x 2.5" drive + 4 x GPU configuration 2 in section 5.5.1.1 8 x 2.5" Drive
Pass-Through Configurations.
Figure 5-71 8 x 2.5" drive pass-through backplane
No. Connector Managed Drive Slot
1 Backplane signal cable -

connector (HDD BP/
J12)
2 Power connector -
(HDD_POWER/J14)
3 mini-SAS HD connector Slots 0 to 3

(PORT A/J28)

(PORT B/J1)

This backplane is supported by 8 x 2.5" drive pass-through configuration 3 and 8
x 2.5" drive pass-through configuration 4 in section 5.5.1.1 8 x 2.5" Drive Pass-
Through Configurations.

1 UBC connector 4 Slots 6 and 7

(UBC4/J4)

(UBC3/J3)

(UBC2/J2)

connector (HDD_BP/
J20)

(UBC1/J1)
6 Power connector -
(HDD_POWER/J21)

(PORT A/J6)

(PORT B/J7)

● 12 x 2.5" drive pass-through configuration (4 x SAS/SATA + 8 x NVMe)

backplane
All drive configurations in 5.5.1.2 12 x 2.5" Drive Pass-Through
Configurations support this backplane.
Figure 5-73 12 x 2.5" drive pass-through configuration (4 x SAS/SATA + 8 x

NVMe) backplane

(UBC4/J4)

(UBC3/J3)

(UBC2/J2)

(UBC1/J1)
5 JTAG connector (J20) -
6 Backplane signal -
connector (HDD BP/
J19)
7 Power connector -
(HDD_POWER/J21)

(PORT A/J28)

(PORT B/J601)

All drive configurations in 5.5.1.3 12 x 3.5" Drive Pass-Through
Configurations support this backplane.

1 Indicator signal cable -

connector (REAR BP0/
J17)

(PORT C/J4)

(PORT B/J3)

(PORT A/J28)
5 Power connector -
(HDD_POWER/J21)

connector (HDD BP/
J19)
7 Indicator signal cable -

connector (REAR BP1/
J18)

(UBC1/J1)

(UBC2/J2)
● 12 x 3.5" drive EXP backplane

All drive configurations in 5.5.1.4 12 x 3.5" Drive EXP Configurations support
this backplane.

Figure 5-75 12 x 3.5" drive EXP backplane
1 Low-speed signal connector for I/O

module 1 (REAR BP0/J31)
2 High-speed signal connector for I/O

module 3 (REAR PORT IO3/J1201)
3 Built-in high-speed signal connector

(INNER PORT/J36)
4 Power connector (POWER/J2)
5 Backplane signal cable connector

(HDD BP/J1202)

module 2 (REAR BP1/J32)
7 High-speed signal connector for I/O

module 1/2 (REAR PORT IO1/2/J34)
8 UBC connector (J1)
● 24 x 2.5" drive NVMe backplane

All drive configurations in 5.5.1.6 24 x 2.5" Drive NVMe Configurations support
this backplane.
Figure 5-76 24 x 2.5" drive NVMe backplane

1 UBC connector 1-E Slots 20 and 21

(UBC1-E/J11)
2 UBC connector 1-D Slots 18 and 19

(UBC1-D/J10)
3 UBC connector 1-C Slots 16 and 17

(UBC1-C/J9)
4 UBC connector 1-B Slots 14 and 15

(UBC1-B/J8)
5 UBC connector 1-A Slots 12 and 13

(UBC1-A/J7)
6 UBC connector 2-F Slots 10 and 11

(UBC2-F/J6)
7 UBC connector 2-E Slots 8 and 9

(UBC2-E/J5)
8 UBC connector 2-C Slots 4 and 5

(UBC2-C/J3)
9 UBC connector 2-B Slots 2 and 3

(UBC2-B/J2)
10 UBC connector 2-A Slots 0 and 1

(UBC2-A/J1)

connector (HDD BP/
J40)
12 Power connector -
(HDD_POWER/J41)

(PORT A/J13)
14 UBC connector 2-D Slots 6 and 7

(UBC2-D/J4)

(PORT B/J14)
16 UBC connector 1-F Slots 22 and 23

(UBC1-F/J12)

This backplane is supported by the 24 x 2.5" drive pass-through configuration (3
x RAID controller cards) in 5.5.1.5 24 x 2.5" Drive Pass-Through
Configurations.

1 UBC connector 3 Slots 16 to 23

(UBC3/J601)

(UBC2/J501)

(UBC1/J401)
4 Power connector -
(HDD_POWER/J1)

connector (HDD_BP/J2)
● 25 x 2.5" drive EXP backplane

All drive configurations in 5.5.1.7 25 x 2.5" Drive EXP Configurations support
this backplane.
Figure 5-78 25 x 2.5" drive EXP backplane

module 1 (REAR_BP0/J2302)
2 UBC connector (J2201)

module 2 (REAR_BP1/J2301)

4 Backplane signal cable connector

(HDD BP/J302)
5 Power connector (HDD POWER/

J301)
6 mini-SAS HD connector (PORT B/

J2203)
7 mini-SAS HD connector (PORT A/

J2202)
Built-in Drive Backplanes

● 4 x 3.5" drive backplane
Figure 5-79 4 x 3.5" drive backplane
1 mini-SAS HD connector Slots 38 and 39

(PORT B/J401)
2 mini-SAS HD connector Slots 36 and 37

(PORT A/J28)

connector (HDD BP/
J19)
4 Power connector -
(HDD_POWER/J21)
Rear-Drive Backplanes

1 Power connector (HDD -

PWR/J21)

connector (HDD BP/
J17)
3 mini-SAS HD connector ● Management slot for

(PORT A/J28) I/O module 1: slots
40 and 41
● Management slot for
I/O module 2: slots
42 and 43


connector (HDD BP/
J17)
2 mini-SAS HD connector ● Management slot for

(PORT A/J28) I/O module 1: slots
40 and 41
● Management slot for
I/O module 2: slots
42 and 43

PWR/J21)
● 4 x 2.5" SAS/SATA/NVMe drive backplane


PWR/J21)

connector (HDD BP/
J1201)

(PORT A/J28)

(UBC2/J2)

(UBC1/J1)
● 4 x 2.5" NVMe drive backplane


(UBC2/J2)

(UBC1/J1)

connector (HDD BP/
J1201)

PWR/J21)
5.11.3 Fan Board

Figure 5-84 Fan board
1 Fan board signal connector 2 Reserved and unavailable

(FAN_BOARD/J3) currently
3 Fan board power 4 Reserved and unavailable

connector (J10 currently
GND_BLACK/J11
POWER_RED)
5 Reserved and unavailable 6 Fan connector (FAN1/J7)

currently
7 Fan connector (FAN2/J6) 8 Fan connector (FAN3/J5)
9 Fan connector (FAN4/J4) - -
5.11.4 Adapter Board

● Built-in 4-card module adapter board

Figure 5-85 Built-in 4-card module adapter board
1 Card slot-4CHP 2 Power connector

connector (Riser2/J10) (RETIMER_PWR/J17)
3 UBC connector 1 4 Card slot-4CHP

(UBC1/J3) connector (Riser1/J12)
5 UBC connector 3 6 UBC connector 4

(UBC3/J5) (UBC4/J6)
7 UBC connector 2 - -
(UBC2/J4)
● 4 x GPU built-in adapter board
Figure 5-86 4 x GPU built-in adapter board
1 Card slot-4CHP 2 Card slot-4CHP

connector (Riser4/J13) connector (Riser3/J12)
3 Power connector 4 Power connector

(PWR_3/J18) (PWR_4/J19)

5 Power connector 6 Power connector

(PWR_2/J17) (PWR_1/J16)
7 Card slot-4CHP 8 Card slot-4CHP

connector (Riser2/J11) connector (Riser1/J10)

(UBCDD1-8-1/J3) (UBCDD1-8-2/J4)

(UBC1-3/J5) (UBC1-4/J6)

(UBC2-3/J8) (UBC2-4/J7)

(UBCDD2-8-2/J20) (UBCDD2-8-1/J9)

Technical White Paper 6 Product Specifications
6 Product Specifications
6.1 Technical Specifications

6.2 Environmental Specifications
6.3 Physical Specifications
6.1 Technical Specifications

Table 6-1 Technical specifications
Category Specifications
Form factor 2U rack server
Chipset Emmitsburg PCH
Processor Supports one or two processors.

● New-generation Intel® Xeon® Scalable processors
(Sapphire Rapids)
● Built-in memory controller and eight memory channels
per processor
● Built-in PCIe controller, supporting PCIe 5.0 and 80
lanes per processor
● Four UltraPath Interconnect (UPI) buses between
processors, providing up to 16 GT/s transmission per
channel
● Up to 60 cores
● Max. 4.2 GHz turbo frequency
● Min. 1.875 MB L3 cache per core
● Max. 350 W thermal design power (TDP)
NOTE
The preceding information is for reference only. For details, see
"Search Parts" in the compatibility list on the technical support
website.

Memory 32 memory slots.

● Up to 32 DDR5 DIMMs
– RDIMM or RDIMM-3DS support
– Max. 4800 MT/s memory speed
– DDR5 memory modules of different types (RDIMM
and RDIMM-3DS) and specifications (capacity, bit
width, rank, and height) cannot be used together.
– A server must use DDR5 DIMMs of the same P/N
code.
NOTE
The preceding information is for reference only. For details,
see "Search Parts" in the compatibility list on the technical
support website.
Storage Supports a variety of drive configurations. For details,

see 5.5.1 Drive Configurations and Drive Numbering.
● Supports hot swap of SAS/SATA/NVMe U.2 drives.
NOTE
When NVMe drives are configured:
● Before using the VMD function, contact technical support
engineers of the OS vendor to check whether the OS
supports the VMD function. If yes, check whether the
VMD driver needs to be manually installed and check the
installation method.
● When the VMD function is enabled and the latest VMD
driver is installed, surprise hot swap is supported.
● When the VMD function is disabled, orderly hot swap is
supported.
● Support a variety of RAID controller cards. For
details,see "Search Parts" in the Compatibility List on
the support website.
– The RAID controller card supports RAID
configuration, RAID level migration, and drive
roaming.
– The RAID controller card supports a
supercapacitor for power-off protection to ensure
user data security.
– The PCIe RAID controller card occupies one PCIe
slot.
For details about the RAID controller card, see the
server RAID Controller Card User Guide.
NOTE
If the BIOS is in legacy mode, the 4K drive cannot be used as
the boot drive.

Network OCP 3.0 NICs provide network expansion capabilities.

● Supports two OCP 3.0 NICs, which can be configured
as required.
● Supports orderly hot swap.
NOTE
The OCP 3.0 NIC supports orderly hot swap only when the
VMD function is disabled.
● Supports a variety of OCP 3.0 NICs. For details, visit
the technical support website and see Search Parts
in the compatibility list.
I/O expansion Supports 16 PCIe slots.

● Supports two PCIe slots dedicated for OCP 3.0 NICs
and 14 standard PCIe slots.
For details, see 5.7.2 PCIe Slots and 5.7.3 PCIe Slot
Description.
NOTE
The preceding information is for reference only. For details,
see "Search Parts" in the compatibility list on the technical
support website.
Port Supports a variety of ports.

● Ports on the front panel:
– One USB Type-C iBMC direct connect
management port
– Two USB 3.0 ports
– One DB15 VGA port
● Ports on the rear panel:
– Two USB 3.0 ports
– One DB15 VGA port
– One RJ45 serial port
– One RJ45 management network port
● Built-in ports:
– One USB 2.0 port
– Two SATA ports
NOTE
You are not advised to install the OS on the USB storage media.

Video card An SM750 video chip with 32 MB display memory is

integrated on the mainboard. The maximum display
resolution is 1920 x 1200 at 60 Hz with 16M colors.
NOTE
● The integrated video card can provide the maximum display
resolution (1920 x 1200) only after the video card driver
matching the operating system version is installed.
Otherwise, only the default resolution supported by the
operating system is provided.
● If both the front and rear VGA ports are connected to
monitors, only the monitor connected to the front VGA port
displays information.
System management ● UEFI

● iBMC
● NC-SI
● Integration with third-party management systems
Security feature ● Power-on password

● Administrator password
● TPM (for China and outside China)/TCM (only for
China)
● Secure boot
● Front bezel (optional)
● Chassis cover opening detection

6.2 Environmental Specifications

Table 6-2 Environmental specifications
Temperature ● Operating temperature: 5ºC to 50ºC (41ºF to 122ºF)

(ASHRAE Classes A1 to A4 compliant)
● Storage temperature (within three months): –30°C to
+60°C (–22°F to +140°F)
● Storage temperature (within six months): –15°C to
+45°C (5°F to 113°F)
● Storage temperature (within one year): –10°C to
+35°C (14°F to 95°F)
● Maximum temperature change rate: 20°C (36°F) per
hour and 5°C (9°F) per 15 minutes
NOTE
The highest operating temperature varies depending on the
server configuration. For details, see A.3 Operating
Temperature Limitations.
Relative humidity (non- ● Operating humidity: 8% to 90%

condensing) ● Storage humidity (within three months): 8% to 85%
● Storage humidity (within six months): 8% to 80%
● Storage humidity (within one year): 20% to 75%
● Maximum change humidity rate: 20% per hour
Air volume 120 cubic feet per minute (CFM) to 320 CFM
Operating altitude ≤ 3050 m (10,006.56 ft)

● When the server configuration complies with ASHRAE
Classes A1 and A2 and the altitude is above 900 m
(2952.76 ft), the highest operating temperature
decreases by 1ºC (1.8°F) for every increase of 300 m
(984.25 ft).
Class A3 and the altitude is above 900 m (2952.76 ft),
the highest operating temperature decreases by 1ºC
(1.8°F) for every increase of 175 m (574.15 ft).
Class A4 and the altitude is above 900 m (2952.76 ft),
the highest operating temperature decreases by 1ºC
(1.8°F) for every increase of 125 m (410.10 ft).
● HDDs cannot be used at an altitude of over 3050 m
(10,006.56 ft).

Corrosive gaseous Maximum growth rate of the corrosion product thickness:

contaminant ● Copper corrosion rate test: 300 Å/month (meeting
level G1 requirements of the ANSI/ISA-71.04-2013
standard on gaseous corrosion)
● Silver corrosion rate test: 200 Å/month
Particle contaminant ● Meets the requirements of ISO 14664-1 Class 8.

● There is no explosive, conductive, magnetic, or
corrosive dust in the equipment room.
NOTE
It is recommended that the particulate pollution in the equipment
room be monitored by a professional agency.
Acoustic noise The declared A-weighted sound power levels (LWAd)

and declared average bystander position A-weighted
sound pressure levels (LpAm) listed are measured at
23°C (73.4°F) in accordance with ISO 7779 (ECMA 74)
and declared in accordance with ISO 9296 (ECMA 109).
● Idle:
– LWAd: 5.8 Bels
– LpAm: 42.3 dBA
● Operating:
– LWAd: 6.0 Bels
– LpAm: 44.6 dBA
NOTE
Actual sound levels generated during operation vary depending
on the configuration, load, and ambient temperature.
NO TE
SSDs and HDDs (including NL-SAS, SAS, and SATA) cannot be preserved for a long time in
the power-off state. Data may be lost or faults may occur if the preservation duration exceeds
the specified maximum duration. When drives are preserved under the storage temperature
and humidity specified in the preceding table, the following preservation duration is
recommended:
● Maximum preservation duration of SSDs:
● 12 months in power-off state without data stored
● 3 months in power-off state with data stored
● Maximum preservation duration of HDDs:
● 6 months in unpacked/packed and powered-off state
● The maximum preservation duration is determined according to the preservation
specifications provided by drive vendors. For details, see the manuals provided by drive
vendors.

6.3 Physical Specifications

Table 6-3 Physical specifications
Category Description
Dimensions (H x W x ● Chassis with 3.5" drives: 86.1 mm x 447 mm x 798

D) mm (3.39 in. x 17.60 in. x 31.42 in.)
● Chassis with 2.5" drives: 86.1 mm x 447 mm x 798
mm (3.39 in. x 17.60 in. x 31.42 in.)
Figure 6-1 Physical dimensions (example: a chassis with

3.5" drives)
NOTE
● See Figure 6-1 for methods in measuring physical
dimensions of the chassis.
● The measuring method for chassis with 3.5" drives and that
for chassis with 2.5" drives are the same. The chassis with
3.5" drives is used as an example.

Category Description
Installation space ● Requirements for cabinet installation:

Cabinet compliant with the International
Electrotechnical Commission (IEC) 297 standard
– Cabinet width: 482.6 mm (19.00 in.)
– Cabinet depth ≥ 1000 mm (39.37 in.)
● Requirements for guide rail installation:
– L-shaped guide rails: apply only to xFusion
cabinets.
– Adjustable L-shaped guide rails: apply to cabinets
with a distance of 543.5 mm to 848.5 mm (21.40
in. to 33.41 in.) between the front and rear
mounting bars.
– Ball bearing rail kit: applies to cabinets with a
distance of 609 mm to 950 mm (23.98 in. to 37.40
in.) between the front and rear mounting bars.
Weight in full ● Net weight:

configuration – Maximum weight for server with 8 x 2.5" front
drives: 22.5 kg (49.60 lb)
– Maximum weight for server with 12 x 2.5" front
drives: 23.5 kg (51.80 lb)
drives: 35.5 kg (78.26 lb)
drives: 25.5 kg (56.22 lb)
drives: 25.5 kg (56.22 lb)
● Packaging materials: 5 kg (11.03 lb)
Power consumption The power consumption parameters vary with hardware

configurations (including the configurations complying
with EU ErP). For details, see Power Calculator on the
technical support website.

Technical White Paper 7 Software and Hardware Compatibility
7 Software and Hardware Compatibility
For details about the OS and hardware, see the compatibility list on the technical
support website.
NO TICE
● If incompatible components are used, the device may be abnormal. Such a fault is
beyond the scope of technical support and warranty.
● The performance of servers is closely related to application software, basic
middleware software, and hardware. The slight differences of the application
software, middleware basic software, and hardware may cause performance
inconsistency between the application layer and test software layer.
● If the customer has requirements on the performance of specific application
software, contact technical support to apply for proof of concept (POC) tests
in the pre-sales phase to determine detailed software and hardware
configurations.
● If the customer has requirements on hardware performance consistency,
specify the specific configuration requirements (for example, specific drive
models, RAID controller cards, or firmware versions) in the presales phase.

Technical White Paper 8 Safety Instructions
8 Safety Instructions
8.1 Security
8.2 Maintenance and Warranty
8.1 Security
General Statement
● Comply with local laws and regulations when installing equipment. These safety
instructions are only a supplement.
● Observe the safety instructions that accompany all "DANGER", "WARNING",
and "CAUTION" symbols in this document.
● Observe all safety instructions provided on device labels.
● Operators of special types of work (such as electricians, operators of electric
forklifts, and so on.) must be certified or authorized by the local government or
authority.
WARNING
In a household scenario, operation of this device may cause radio interference.
Human Safety
● This device is not suitable for use in places where children may be present.
● Only certified or authorized personnel are allowed to install equipment.
● Discontinue any dangerous operations and take protective measures. Report
anything that could cause personal injury or device damage to a project
supervisor.
● Do not move devices or install cabinets and power cables in hazardous weather
conditions.
● Do not carry the weight that exceeds the maximum load per person allowed by
local laws or regulations. Before moving a device, check the maximum device
weight and arrange required personnel.

● Wear clean protective gloves, ESD clothing, a protective hat, and protective
shoes, as shown in Figure 8-1.
Figure 8-1 Safety work wear
● Before touching a device, wear ESD clothing and gloves (or wrist strap), and
remove any conductive objects (such as watches and jewelry). Figure 8-2
shows conductive objects that must be removed before you touch a device.
Figure 8-2 Removing conductive objects
Figure 8-3 shows how to wear an ESD wrist strap.

a. Secure the ESD wrist strap around your wrist.
b. Fasten the strap buckle and ensure that the ESD wrist strap is in contact
with your skin.
c. Insert the ground terminal attached to the ESD wrist strap into the jack on
the grounded cabinet or chassis.

Figure 8-3 Wearing an ESD wrist strap
● Exercise caution when using tools that could cause personal injury.
● If the installation position of a device is higher than the shoulders of the
installation personnel, use a vehicle such as a lift to facilitate installation. Prevent
the device from falling down and causing personal injury or damage to the
device.
● The equipment is powered by high-voltage power sources. Direct or indirect
contact (especially through damp objects) with high-voltage power sources may
result in serious injury or death.
● Ground a device before powering it on. Otherwise, high voltage leakage current
may cause personal injury.
● When a ladder is used, ensure that another person holds the ladder steady to
prevent accidents.
● Do not look into optical ports without eye protection when installing, testing, or
replacing optical cables.
Equipment Safety
● Use the recommended power cables at all times.
● Power cables are used only for dedicated servers. Do not use them for other
devices.
● Before operating equipment, wear ESD clothes and gloves to prevent
electrostatic-sensitive devices from being damaged by ESD.
● When moving a device, hold the bottom of the device. Do not hold the handles of
the installed modules, such as the PSUs, fan modules, drives, and the
mainboard. Handle the equipment with care.
● Exercise caution when using tools that could cause damage to devices.
● Connect the primary and secondary power cables to different power distribution
units (PDUs) to ensure reliable system operation.
● Ground a device before powering it on. Otherwise, high voltage leakage current
may cause device damage.
Transportation Precautions
Improper transportation may damage equipment. Contact the manufacturer for
precautions before attempting transportation.
Transportation precautions include but are not limited to:
● The logistics company engaged to transport the device must be reliable and
comply with international standards for transporting electronics. Ensure that the

equipment being transported is always kept upright. Take necessary precautions

to prevent collisions, corrosion, package damage, damp conditions and pollution.
● Transport each device in its original packaging.
● If the original packaging is unavailable, package heavy, bulky parts (such as
chassis and blades) and fragile parts (such as PCIe cards and optical modules)
separately.
NO TE
For details about components supported by the server, see "Search Parts" in the
compatibility list on the technical support website.
● Power off all devices before transportation.
Maximum Weight Carried by a Person
CAUTION
The maximum weight allowed to be carried by a single person is subject to local laws
or regulations. The markings on the device and the descriptions in the documentation
are for reference only.
Table 8-1 lists the maximum weight one person is permitted to carry as stipulated by
a number of organizations.
Table 8-1 Maximum weight carried per person
Organization Weight (kg/lb)
European Committee for 25/55.13

Standardization (CEN)
International Organization for 25/55.13

Standardization (ISO)
National Institute for Occupational 23/50.72

Safety and Health (NIOSH)
Health and Safety Executive (HSE) 25/55.13
General Administration of Quality ● Male: 15/33.08

Supervision, Inspection and Quarantine ● Female: 10/22.05
of the People's Republic of China
(AQSIQ)
For more information about security instructions, see the server Safety Information.
8.2 Maintenance and Warranty

For details about maintenance, see Customer Support Service.

For details on warranty, see Warranty.

Technical White Paper 9 System Management
9 System Management
This product integrates the new-generation Intelligent Baseboard Management

Controller (iBMC), which complies with Intelligent Platform Management Interface 2.0
(IPMI 2.0) specifications and provides reliable hardware monitoring and
management.
The iBMC intelligent management system has the following features:
● Various management interfaces.

The iBMC provides the following standard interfaces to meet various system
integration requirements:
– DCMI 1.5 interface
– IPMI 1.5/IPMI 2.0 interface
– Command-line interface
– Redfish interface
– Hypertext Transfer Protocol Secure (HTTPS) interface
– Simple Network Management Protocol (SNMP) interface
● Fault monitoring and diagnosis
The iBMC detects hidden risks and ensures stable, uninterrupted 24/7 system
operation by providing the following features:
– The last screenshot and video recording function when the system crashes
makes it impossible to analyze the cause of the system crash.
– Screen snapshots and screen recordings make scheduled inspection,
operation recording, and audit easy.
– The fault diagnosis & management (FDM) function supports component-
based precise fault diagnosis, facilitating component fault locating and
replacement.
– The iBMC supports the reporting of alarms through syslog packets, trap
packets, and emails, helping the upper-layer NMS platform to collect the
fault information about the server.
– If the server is configured with the LCD module, the LCD can directly obtain
device information from the iBMC.
● Security management methods

Technical White Paper 9 System Management
– Software image backup improves system security. Even if the running

software completely breaks down, the system can be started from the
backup image.
– Diversified user security control interfaces are provided to ensure user login
security.
– Multiple certificates can be imported and replaced to ensure data
transmission security.
● System maintenance interface
– Supports virtual keyboard, video, and mouse (KVM) and virtual media
functions to facilitate remote maintenance.
– Supports out-of-band RAID monitoring and configuration to improve RAID
configuration efficiency and management capabilities.
– Smart Provisioning implements DVD-free OS installation, RAID
configuration, and upgrades to simplify server installation and configuration.
● Diversified network protocols
– Supports NTP to improve the device time configuration capability and
synchronizes the network time.
– Supports domain management and directory services to simplify the server
management network.
● Intelligent power management
– Power capping technology makes it easy to increase deployment density.
– Dynamic energy saving helps reduce the operating expense (OPEX).
● License management
License management allows advanced features to be used by authorized users.
The advanced edition of the iBMC provides the following features:
– Use Redfish to deploy the OS.
– Use Redfish to collect raw data for intelligent diagnosis.

Technical White Paper 10 Certifications
10 Certifications
Country/Region Certification Standard
Europe CE Safety:
EN 62368-1:2014+A11:2017
EMC:
ETSI EN 300 386 V2.1.1:2016
ETSI EN 300 386 V1.6.1:2012
EN 55032:2015+A1:2020
CISPR 32:2015+A1:2019
EN IEC 61000-3-2:2019+A1:2021
EN 61000-3-2:2013+A2:2021
EN 61000-3-2:2014
EN 61000-3-3:2013
EN 55035:2017+A11:2020
CISPR 35:2016
EN 55024:2010+A1:2015
CISPR 24:2010+A1:2015
RoHS:
EN IEC 63000:2018
ErP:
Commission Regulation (EU) No
2019/424

Technical White Paper 10 Certifications
Country/Region Certification Standard
UK UKCA Safety:
EN 62368-1:2014+A11:2017
EMC:
ETSI EN 300 386 V2.1.1:2016
ETSI EN 300 386 V1.6.1:2012
EN 55032:2015+A1:2020
CISPR 32:2015+A1:2019
EN IEC 61000-3-2:2019+A1:2021
EN 61000-3-2:2013+A2:2021
EN 61000-3-2:2014
EN 61000-3-3:2013
EN 55035:2017+A11:2020
CISPR 35:2016
EN 55024:2010+A1:2015
CISPR 24:2010+A1:2015
RoHS:
BS EN IEC 63000:2018
ErP:
Commission Regulation (EU) No
2019/424
China CCC GB 17625.1-2022

GB 4943.1-2022
GB/T 9254.1-2021 (Class A)
US FCC FCC PART 15
Japan VCCI VCCI 32-1

Technical White Paper 11 Waste Product Recycling
11 Waste Product Recycling
If product users need product recycling service provided by xFusion after products
are scrapped, contact technical support for services.

Technical White Paper A Appendix
A Appendix
A.1 Chassis Label Information
A.1.1 Chassis Head Label
Figure A-1 Chassis head label
1 Nameplate 2 Certificate
3 Quick access tag 4 Product SN

NOTE
For details, see A.2 Product SN

5 Slide-out label plate 6 Product SN

NOTE NOTE
The location of the slide-out label For details, see Product SN.
plate varies depending on the
server model or configuration. For
details, see 5.1.1 Appearance.
7 Reserved space for customized 8 Pressure-proof label

label NOTE
NOTE This label warns users not to place
any objects on top of a rack-
mounted device.
A.1.1.1 Nameplate
Figure A-2 Sample nameplate
Table A-1 Nameplate description

No. Description
1 Server model
NOTE
For details, see A.4 Nameplate.
2 Device name
3 Power supply requirements
4 Enterprise standard number
5 Vendor information
6 Certification marks

A.1.1.2 Certificate
Figure A-3 Certificate example
Table A-2 Certificate description
No. Description
1 Order
2 No.
NOTE
For details, see Figure A-4 and Table A-3.
3 QC inspector
4 Production date
5 No. barcode
Figure A-4 Certificate number example
Table A-3 Certificate number description
No. Description
1 P: a fixed value for this digit
2 Z: a fixed value for this digit
3 ● Y: a server
● B: a semi-finished server
● N: a spare part

No. Description
4 0: a value for the reserved digit
5 Year (two characters)
6 Month (one character)

● Digits 1 to 9 indicate January to September respectively.
● Letters A to C indicate October to December respectively.
7 Day (one character)

● Digits 1 to 9 indicate the 1st to 9th.
● Letters A to H indicate the 10th to 17th.
● Letters J to N indicate the 18th to 22nd.
● Letters P to Y indicate the 23rd to 31st.
8 Hour (one character)

● Digits 0 to 9 indicate 0:00 to 9:00.
● Letters A to H indicate 10:00 to 17:00.
● Letters J to N indicate 18:00 to 22:00.
● Letters P to Q indicate 23:00 to 24:00.
9 Serial number (two characters)
10 Manufacturing serial number (five characters)
A.1.1.3 Quick Access Label
Figure A-5 Quick access label example
Table A-4 Quick access label description
No. Description
1 IP address of the iBMC management network port

No. Description
2 Subnet mask of the iBMC management network port
3 Default iBMC user name
4 Default iBMC password
5 Default BIOS password
6 Technical support website
7 P/N code
8 QR code
NOTE
Scan the QR code to obtain technical support resources.
A.1.2 Chassis Internal Label

Figure A-6 Chassis internal label
NO TE
● The quick start guide is located on the inside of the chassis cover. It describes how to
remove the mainboard components, important components of the chassis, precautions,
and QR codes of technical resources. The pictures are for reference only. For details, see
the actual product.
● The quick start guide is optional. For details, see the actual product.

A.1.3 Chassis Tail Label
Figure A-7 Chassis tail label
NO TE
For details about the warning label, see the server Safety Information.
A.2 Product SN
The serial number (SN) on the label plate uniquely identifies a server. The SN is
required when users contact xFusion technical support. There are two types of SNs,
as shown in SN example 1 and SN example 2.
● SN example 1
Figure A-8 SN example 1
Table A-5 SN description
No. Description
1 SN ID (two characters), which is 21.
2 Material identification code (eight characters), that is, the

processing code.
3 Vendor code (two characters), that is, the code of the

processing place.

No. Description
4 Year and month (two characters)

● The first character indicates the year.
– Digits 1 to 9 indicate years 2001 to 2009 respectively.
– Letters A to H indicate years 2010 to 2017 respectively.
– Letters J to N indicate years 2018 to 2022 respectively.
– Letters P to Y indicate years 2023 to 2032 respectively.
NOTE
The years from 2010 are represented by upper-case letters
excluding I, O, and Z because the three letters are similar to the
digits 1, 0, and 2.
● The second character indicates the month.
– Digits 1 to 9 indicate January to September respectively.
– Letters A to C indicate October to December
respectively.
5 Serial number (six characters)
6 RoHS compliance status (one character). Y indicates RoHS

compliant.
7 Internal model, that is, product name.
● SN example 2
Figure A-9 SN example 2
Table A-6 SN example 2

No. Description
1 SN ID (two characters), which is 21.
2 Material identification code (eight characters), that is, the

processing code.
3 Vendor code (two characters), that is, the code of the

processing place.

No. Description
4 Year and month (two characters)

● The first character indicates the year.
– Digits 1 to 9 indicate years 2001 to 2009 respectively.
– Letters A to H indicate years 2010 to 2017 respectively.
– Letters J to N indicate years 2018 to 2022 respectively.
– Letters P to Y indicate years 2023 to 2032 respectively.
NOTE
The years from 2010 are represented by upper-case letters
excluding I, O, and Z because the three letters are similar to the
digits 1, 0, and 2.
● The second character indicates the month.
– Digits 1 to 9 indicate January to September respectively.
– Letters A to C indicate October to December
respectively.
5 Serial number (six characters)
6 RoHS compliance status (one character). Y indicates RoHS

compliant.
7 Nameplate (six characters).
8 Serial number. The number of digits depends on the actual

product.

A.3 Operating Temperature Limitations

Table A-7 Operating temperature limitations
Configurat Maximum Maximum Maximum Maximum Maximum
ion Operating Operating Operating Operating Operating
Temperatu Temperatu Temperatu Temperatu Temperatu
re 30℃ re 35ºC re 40ºC re 45ºC re 50ºC
(86°F) (95°F) (104°F) (113°F) (118 °F)
8 x 2.5" ● 6434/64 ● 6434/64 ● CPUs ● CPUs ● CPUs

drive pass- 34H 34H with with with
through CPUs CPUs TDP TDP TDP
configuratio and and greater greater greater
n CPUs CPUs than 250 than 185 than 165
with with W are W are W are
TDP TDP not not not
greater greater supporte supporte supporte
than 205 than 205 d. d. d.
W are W are ● A40 ● GPU ● The rear
not not GPU cards GPU
supporte supporte cards are not cards
d when d when are not supporte are not
the built- the built- supporte d. supporte
in 4-card in 4-card d. d.
module module ● Rear
is is ● OCP 3.0 HDDs ● Rear
configur configur NICs and HDDs
ed. ed. whose NVMe and
rate is drives NVMe
greater are not drives
than 100 supporte are not
Gbit/s d. supporte
are not ● OCP 3.0 d.
supporte NICs ● OCP 3.0
d. whose NICs
● 6434/64 rate is whose
34H greater rate is
CPUs than 25 greater
and Gbit/s than 10
CPUs are not Gbit/s
with supporte are not
TDP d. supporte
greater ● PCIe d.
than 205 NICs ● PCIe
W are whose NICs
not rate is whose
supporte greater rate is
d when than 100 greater
the built- Gbit/s than 25


(86°F) (95°F) (104°F) (113°F) (118 °F)
in 4-card are not Gbit/s

module supporte are not
is d. supporte
configur ● Superca d.
ed. pacitors ● Superca
are not pacitors
supporte are not
d. supporte
● 6434/64 d.
34H ● 6434/64
CPUs 34H
and CPUs
CPUs and
with CPUs
TDP with
greater TDP
than 205 greater
W are than 205
not W are
supporte not
d when supporte
the built- d when
in 4-card the built-
module in 4-card
is module
configur is
ed. configur
ed.


(86°F) (95°F) (104°F) (113°F) (118 °F)
8 x 2.5" ● All ● All ● CPUs ● Not ● Not

drives + 4 x configur configur with supporte supporte
GPUs ations ations TDP d. d.
configuratio are are greater
n supporte supporte than 250
d. d. W are
not
supporte
d.
● GPU
cards
are not
supporte
d.
● OCP 3.0
NICs
whose
rate is
greater
than 100
Gbit/s
are not
supporte
d.


(86°F) (95°F) (104°F) (113°F) (118 °F)
12 x 2.5" ● All ● All ● 6434/64 ● CPUs ● Not

drive pass- configur configur 34H with supporte
through ations ations CPUs TDP d.
configuratio are are and greater
n (4 x SAS/ supporte supporte CPUs than 185
SATA + 8 x d. d. with W are
NVMe) TDP not
greater supporte
than 250 d.
W are ● GPU
not cards
supporte are not
d. supporte
● A40 d.
GPU
● Rear
cards
HDDs
are not
and
supporte
NVMe
d.
drives
● OCP 3.0 are not
NICs supporte
whose d.
rate is
● OCP 3.0
greater
NICs
than 100
whose
Gbit/s
rate is
are not
greater
supporte
than 25
d.
Gbit/s
are not
supporte
d.
● PCIe
NICs
whose
rate is
greater
than 100
Gbit/s
are not
supporte
d.
● Superca
pacitors
are not


(86°F) (95°F) (104°F) (113°F) (118 °F)
supporte
d.
12 x 2.5" ● All ● All ● CPUs ● Not ● Not

drives (4 x configur configur with supporte supporte
SAS/SATA ations ations TDP d. d.
+8x are are greater
NVMe) + 4 supporte supporte than 250
x GPUs d. d. W are
configuratio not
n supporte
d.
● GPU
cards
are not
supporte
d.
● OCP 3.0
NICs
whose
rate is
greater
than 100
Gbit/s
are not
supporte
d.


(86°F) (95°F) (104°F) (113°F) (118 °F)
12 x 3.5" ● A16/A40 ● Rear ● 6434/64 ● Not ● Not

drive pass- /A100 HDDs 34H supporte supporte
through GPU and CPUs d. d.
configuratio cards NVMe and
n are not drives CPUs
supporte are not with
d. supporte TDP
● 6434/64 d. greater
34H ● The A2 than 250
CPUs GPU W are
and cards not
CPUs are not supporte
with supporte d.
TDP d when ● Rear
greater the CPU HDDs
than 205 TDP is and
W are higher NVMe
not than 270 drives
supporte W. are not
d when supporte
● GPU
the built- d.
cards
in 4 x ● A2 GPU
are not
3.5" cards
supporte
drives or are not
d.
4-card supporte
module ● 6434/64
d.
are 34H
configur CPUs ● OCP 3.0
ed. and NICs
CPUs whose
with rate is
TDP greater
greater than 100
than 205 Gbit/s
W are are not
not supporte
supporte d.
d when ● PCIe
the built- NICs
in 4 x whose
3.5" rate is
drives or greater
4-card than 100
module Gbit/s
are are not


(86°F) (95°F) (104°F) (113°F) (118 °F)
configur supporte
ed. d.
● 6434/64
34H
CPUs
and
CPUs
with
TDP
greater
than 205
W are
not
supporte
d when
the built-
in 4 x
3.5"
drives or
4-card
module
are
configur
ed.


(86°F) (95°F) (104°F) (113°F) (118 °F)
12 x 3.5" ● A16/A40 ● Rear ● 6434/64 ● Not ● Not

drive EXP /A100 HDDs 34H supporte supporte
configuratio GPU and CPUs d. d.
n cards NVMe and
are not drives CPUs
supporte are not with
d. supporte TDP
● 6434/64 d. greater
34H ● The A2 than 250
CPUs GPU W are
and cards not
CPUs are not supporte
with supporte d.
TDP d when ● Rear
greater the CPU HDDs
than 205 TDP is and
W are higher NVMe
not than 270 drives
supporte W. are not
d when ● 6434/64 supporte
the built- 34H d.
in 4 x CPUs ● GPU
3.5" and cards
drives or CPUs are not
4-card with supporte
module TDP d.
are greater
configur ● OCP 3.0
than 205 NICs
ed. W are whose
not rate is
supporte greater
d when than 100
the built- Gbit/s
in 4 x are not
3.5" supporte
drives or d.
4-card
module ● PCIe
are NICs
configur whose
ed. rate is
greater
than 100
Gbit/s
are not


(86°F) (95°F) (104°F) (113°F) (118 °F)
supporte
d.
● 6434/64
34H
CPUs
and
CPUs
with
TDP
greater
than 205
W are
not
supporte
d when
the built-
in 4 x
3.5"
drives or
4-card
module
are
configur
ed.


(86°F) (95°F) (104°F) (113°F) (118 °F)
24 x 2.5" ● All ● A40 ● 6434/64 ● CPUs ● Not

drive NVMe configur GPU 34H with supporte
configuratio ations cards CPUs TDP d.
n (8 x SAS/ are are not and greater
SATA + 16 supporte supporte CPUs than 185
x NVMe) d. d. with W are
TDP not
greater supporte
than 250 d.
W are ● GPU
not cards
supporte are not
d. supporte
● A16/A40 d.
/A100 ● Rear
GPU drives
cards are not
are not supporte
supporte d.
d.
● OCP 3.0
● Rear NICs
HDDs whose
and rate is
NVMe greater
drives than 25
are not Gbit/s
supporte are not
d. supporte
● OCP 3.0 d.
NICs ● PCIe
whose NICs
rate is whose
greater rate is
than 100 greater
Gbit/s than 100
are not Gbit/s
supporte are not
d. supporte
d.
● Superca
pacitors
are not
supporte
d.


(86°F) (95°F) (104°F) (113°F) (118 °F)
24 x 2.5" ● A40 ● A40 ● CPUs ● CPUs ● Not

drive NVMe GPU GPU with with supporte
configuratio cards cards TDP TDP d.
n are not are not greater greater
supporte supporte than 250 than 185
d. d. W are W are
not not
supporte supporte
d. d.
● A16/A40 ● A16/A40
/A100 /A100
GPU GPU
cards cards
are not are not
supporte supporte
d. d.
● Rear ● Rear
HDDs drives
and are not
NVMe supporte
drives d.
are not ● OCP 3.0
supporte NICs
d. whose
● OCP 3.0 rate is
NICs greater
whose than 25
rate is Gbit/s
greater are not
than 100 supporte
Gbit/s d.
are not ● NICs
supporte whose
d. rate is
● PCIe 100
NICs Gbit/s
whose are not
rate is supporte
greater d.
than 100 ● Superca
Gbit/s pacitors
are not are not
supporte supporte
d. d.


(86°F) (95°F) (104°F) (113°F) (118 °F)
24 x 2.5" ● 6434/64 ● A40 ● 6434/64 ● CPUs ● Not

drive pass- 34H GPU 34H with supporte
through CPUs cards CPUs TDP d.
configuratio and are not and greater
n (3 x RAID CPUs supporte CPUs than 185
controller with d. with W are
cards) TDP ● 6434/64 TDP not
greater 34H greater supporte
than 205 CPUs than 250 d.
W are and W are ● GPU
not CPUs not cards
supporte with supporte are not
d when TDP d. supporte
the built- greater ● GPU d.
in 4-card than 205 cards
module ● Rear
W are are not
is drives
not supporte
configur are not
supporte d.
ed. supporte
d when ● Rear d.
the built- HDDs
in 4-card ● OCP 3.0
and
module NICs
NVMe
is whose
drives
configur rate is
are not
ed. greater
supporte
than 25
d.
Gbit/s
● OCP 3.0 are not
NICs supporte
whose d.
rate is
greater ● PCIe
than 100 NICs
Gbit/s whose
are not rate is
supporte greater
d. than 100
Gbit/s
● 6434/64 are not
34H supporte
CPUs d.
and
CPUs ● Superca
with pacitors
TDP are not
greater supporte
than 205 d.


(86°F) (95°F) (104°F) (113°F) (118 °F)
W are ● 6434/64
not 34H
supporte CPUs
d when and
the built- CPUs
in 4-card with
module TDP
is greater
configur than 205
ed. W are
not
supporte
d when
the built-
in 4-card
module
is
configur
ed.


(86°F) (95°F) (104°F) (113°F) (118 °F)
25 x 2.5" ● 6434/64 ● A40 ● 6434/64 ● CPUs ● Not

drive EXP 34H GPU 34H with supporte
configuratio CPUs cards CPUs TDP d.
n and are not and greater
CPUs supporte CPUs than 185
with d. with W are
TDP ● 6434/64 TDP not
greater 34H greater supporte
than 205 CPUs than 250 d.
W are and W are ● GPU
not CPUs not cards
supporte with supporte are not
d when TDP d. supporte
the built- greater ● GPU d.
in 4-card than 205 cards
module ● Rear
W are are not
is drives
not supporte
configur are not
supporte d.
ed. supporte
d when ● Rear d.
the built- HDDs
in 4-card ● OCP 3.0
and
module NICs
NVMe
is whose
drives
configur rate is
are not
ed. greater
supporte
than 25
d.
Gbit/s
● OCP 3.0 are not
NICs supporte
whose d.
rate is
greater ● PCIe
than 100 NICs
Gbit/s whose
are not rate is
supporte greater
d. than 100
Gbit/s
● 6434/64 are not
34H supporte
CPUs d.
and
CPUs ● Superca
with pacitors
TDP are not
greater supporte
than 205 d.


(86°F) (95°F) (104°F) (113°F) (118 °F)
W are ● 6434/64
not 34H
supporte CPUs
d when and
the built- CPUs
in 4-card with
module TDP
is greater
configur than 205
ed. W are
not
supporte
d when
the built-
in 4-card
module
is
configur
ed.
NO TE
● When a single fan is faulty, the highest operating temperature is 5ºC (9°F) lower than the
rated value.
● When a single fan is faulty, the system performance may be affected.
● It is recommended that servers be deployed at an interval of 1U to reduce server noise and
improve server energy efficiency.
● Liquid-cooled processors are not supported.
A.4 Nameplate
Certified Model Remarks
H22H-07 Global
2288H V7 Global
Note: The nameplate depends on the actual product.

A.5 RAS Features

The server supports a variety of Reliability, Availability, and Serviceability (RAS)
features. You can configure these features for better performance.
For details about RAS features, see the Sapphire Rapids Platform Server RAS
Feature Technical White Paper.
A.6 Sensor List

Sensor Description Component
Inlet Temp Air inlet temperature Right mounting ear
Outlet Temp Air outlet temperature BMC card
PCH Temp PCH bridge temperature Mainboard
PCH Status PCH chip fault diagnosis Mainboard

health status
1711 Core Temp Core temperature of the BMC card

BMC management chip
SSD Max Temp Maximum SSD SSD

temperature (reported by
BMA)
CPUN Core Temp CPU core temperature CPUN

N indicates the CPU
number. The value is 1 or
2.
CPUN DTS Difference between the CPUN

real-time CPU N indicates the CPU
temperature and the CPU number. The value is 1 or
core temperature 2.
threshold
CpuN Margin Difference between the CPUN

real-time CPU N indicates the CPU
temperature and the CPU number. The value is 1 or
Tcontrol threshold 2.
CPUN MEM Temp CPU memory module Memory module

temperature corresponding to CPU N
N indicates the CPU
2.

CPUN 12V 12 V voltage supplied by Mainboard

the mainboard to the CPU N indicates the CPU
2.
CPUN Status CPU status detection CPUN

N indicates the CPU
2.
CPUN Memory Status of the memory Memory module

corresponding to the CPU corresponding to CPU N
N indicates the CPU
2.
CPUN UPI Link CPU UPI link fault Mainboard or CPU N

diagnosis health status N indicates the CPU
2.
CPUN Prochot CPU Prochot CPUN

N indicates the CPU
2.
CPUN VCCIN CPU VCCIN voltage Mainboard

N indicates the CPU
2.
CPUN FIVRA CPU FIVRA voltage Mainboard or CPU N

N indicates the CPU
2.
CPUN INFAON CPU INFAON voltage CPUN

N indicates the CPU
2.
CPUN VCCFA CPU VCCFA voltage CPUN

N indicates the CPU
2.
CPUN VCCD CPU VCCD voltage CPUN

N indicates the CPU
2.

CPUN VRD Temp CPU VRD temperature Mainboard

N indicates the CPU
2.
CPUN FIVRA Temp CPU FIVRA temperature CPUN

N indicates the CPU
2.
CPUN INFAON Temp CPU INFAON CPUN

temperature N indicates the CPU
2.
CPUN VCCFA Temp CPU VCCFA temperature CPUN

N indicates the CPU
2.
CPUN VCCD Temp CPU VCCD temperature CPUN

N indicates the CPU
2.
PSN VIN PSU N input voltage PSU N

N indicates the PSU
2.
PS$ IIn PSU input current PSUs
PS$ IOut PSU output current PSUs
PS$ POut PSU output power PSUs
PS$ Temp Maximum internal PSUs

temperature of the PSU
PS$ Inlet Temp PSU air inlet temperature PSUs
PSN Status PSU fault status PSU N

N indicates the PSU
2.
PSN Fan Status PSU fan fault status PSU N

N indicates the PSU
2.

PSN Temp Status PSU presence status PSU N

N indicates the PSU
2.
PS Redundancy Redundancy failure due PSUs

to PSU removal
Power Server input power PSUs
Disks Temp Maximum drive Drive

temperature
PowerN PSU input power PSU N

N indicates the PSU
2.
FANN F Speed Fan speed Fan module N
FANN R Speed N indicates the fan

module number. The
value ranges from 1 to 11.
FANN F Status Fan fault status Fan module N
FANN R Status N indicates the fan

module number. The
FANN F Presence Fan presence Fan module N
FANN R Presence N indicates the fan

module number. The
DIMMN DIMM status DIMM N

N indicates the DIMM slot
number.
RTC Battery RTC battery status. An RTC battery on the

alarm is generated when mainboard
the voltage is lower than
1 V.
Power Button Power button pressed Mainboard and power

status button
Watchdog2 Watchdog Mainboard
Mngmnt Health Management subsystem Management module

health status
UID Button UID button status Mainboard
PwrOk Sig. Drop Voltage dip status Mainboard

PwrOn TimeOut Power-on timeout Mainboard
PwrCap Status Power capping status Mainboard
HDD Backplane Entity presence Drive backplane
HDD BP Status Drive backplane health Drive backplane

status
HDD BP$ Temp Drive backplane Drive backplane

temperature
RiserN Card Entity presence Riser card N

N indicates the riser card
slot number. The value
ranges from 1 to 5.
RiserN 12V 12 V voltage supplied by Mainboard

the mainboard to the riser N indicates the riser card
card slot number. The value is
1 or 2.
Riser$ Temp Riser card temperature Riser card
SAS Cable Entity presence SAS cable
LCD Status LCD health status LCD
LCD Presence LCD presence LCD
DISK$ Drive status Drive
RAID Presence RAID controller card RAID controller card

presence
RAID Temp Temperature of the RAID RAID controller card

controller card
Raid BBU Temp BBU temperature of the Supercapacitor of the

RAID controller card RAID controller card
PCIE Status PCIe status error PCIe card
PCIe$ OP Temp PCIe card optical module PCIe card

temperature
PCIe$ Temp PCIe card chip PCIe card

temperature
PCIe RAID$ Temp Temperature of the PCIe PCIe RAID controller card
RAID controller card
PCIe$ Card BBU BBU status of the PCIe PCIe RAID controller card
RAID controller card

PCIe NIC$ Temp PCIe card chip PCIe card

temperature
PCIe FC$ Temp PCIe card chip PCIe card

temperature
IB$ Temp IB NIC temperature IB card
M2 Adapter Temp M.2 adapter temperature M.2 adapter card
M2Disk1 Status of the M.2 drive on M.2 adapter card

the riser card
M2Disk2 Status of the M.2 drive on M.2 adapter card

the riser card
AreaIntrusion Listening to the Mainboard

unpacking action
OCP$ OP Temp OCP card optical module OCP 3.0 NIC

temperature
OCP$ Temp OCP card chip OCP 3.0 NIC

temperature
SSD Disk$ Temp SSD temperature SSD
EXP$ Temp EXP chip temperature Drive backplane
GPU$ Power GPU power GPU
GPU$ Temp GPU temperature GPU
GPU$ HBM Temp HBM chip temperature of GPU

the GPU
System Notice Hot restart reminder and N/A

fault diagnosis program
information collection
System Error System suspension or

restart. Check the
background logs.
ACPI State ACPI status
SysFWProgress Software processes and

system startup errors
SysRestart System restart causes
Boot Error Boot error
CPU Usage CPU usage
Memory Usage Memory usage

BMC Boot Up BMC startup event
BMC Time Hopping Time hopping
NTP Sync Failed NTP synchronization

failure and recovery
events
SEL Status SEL full or events being

cleared
Op. Log Full Operation log full or

events being cleared
Sec. Log Full Security log full or events

being cleared
Host Loss System monitoring

software (BMA) link loss
detection
ProductID Status Product identification

status

Technical White Paper B Glossary
B Glossary
B.1 A-E
B
BMC The baseboard management controller (BMC) complies
with the Intelligent Platform Management Interface
(IPMI). It collects, processes, and stores sensor signals,
and monitors the operating status of components. The
BMC provides the hardware status and alarm information
about the managed objects to the management system
so that the management system can implement unified
management of the devices.
E
ejector lever A part on the panel of a device used to facilitate
installation or removal of the device.
Ethernet A baseband local area network (LAN) architecture

developed by Xerox Corporation by partnering with Intel
and DEC. Ethernet uses the Carrier Sense Multiple
Access/Collision Detection (CSMA/CD) access method
and allows data transfer over various cables at 10 Mbit/s.
The Ethernet specification is the basis for the IEEE 802.3
standard.

B.2 F-J
G
Gigabit Ethernet (GE) An extension and enhancement of traditional shared
media Ethernet standards. It is compatible with 10 Mbit/s
and 100 Mbit/s Ethernet and complies with IEEE 802.3z
standards.
H
hot swap Replacing or adding components without stopping or
shutting down the system.
B.3 K-O
K
KVM A hardware device that provides public keyboard, video
and mouse (KVM).
B.4 P-T
P
panel An external component (including but not limited to
ejector levers, indicators, and ports) on the front or rear
of the server. It seals the front and rear of the chassis to
ensure optimal ventilation and electromagnetic
compatibility (EMC).
Peripheral A computer bus PCI, which uses the existing PCI

Component programming concepts and communication standards,
Interconnect Express but builds a faster serial communication system. Intel is
(PCIe) the main sponsor for PCIe. PCIe is used only for internal
interconnection. A PCI system can be transformed to a
PCIe system by modifying the physical layer instead of
software. PCIe delivers a faster speed and can replace
almost all AGP and PCI buses.

R
redundancy A mechanism that allows a backup device to
automatically take over services from a faulty device to
ensure uninterrupted running of the system.
redundant array of A storage technology that combines multiple physical

independent disks drives into a logical unit for the purposes of data
(RAID) redundancy and performance improvement.
S
server A special computer that provides services for clients over
a network.
system event log Event records stored in the system used for subsequent
(SEL) fault diagnosis and system recovery.
B.5 U-Z
U
U A unit defined in International Electrotechnical
Commission (IEC) 60297-1 to measure the height of a
cabinet, chassis, or subrack. 1U = 44.45 mm (1.75 in).
UltraPath A point-to-point processor interconnect developed by

Interconnect (UPI) Intel.

Technical White Paper C Acronyms and Abbreviations
C Acronyms and Abbreviations
C.1 A-E
A
AC alternating current
AES Advanced Encryption Standard New Instruction Set
ARP Address Resolution Protocol
AVX Advanced Vector Extensions
B
BBU backup battery unit
BIOS Basic Input/Output System
BMC baseboard management controller
C
CCC China Compulsory Certification
CD calendar day
CE Conformite Europeenne
CIM Common Information Model
CLI command-line interface

D
DC direct current
DDR5 Double Data Rate 5
DDDC double device data correction
DEMT Dynamic Energy Management Technology
DIMM dual in-line memory module
DRAM dynamic random-access memory
DVD digital video disc
E
ECC error checking and correcting
ECMA European Computer Manufacturer Association
EDB Execute Disable Bit
EID enclosure ID
EN European Efficiency
ERP enterprise resource planning
ETS European Telecommunication Standards
C.2 F-J
F
FB-DIMM Fully Buffered DIMM
FC Fiber Channel
FCC Federal Communications Commission
FCoE Fibre Channel over Ethernet
FTP File Transfer Protocol
G
GE Gigabit Ethernet

GPIO General Purpose Input/Output
GPU graphics processing unit
H
HA high availability
HBM high bandwidth memory
HDD hard disk drive
HPC high-performance computing
HTTP Hypertext Transfer Protocol
HTTPS Hypertext Transfer Protocol Secure
I
iBMC intelligent baseboard management controller
IC Industry Canada
ICMP Internet Control Message Protocol
IDC Internet Data Center
IEC International Electrotechnical Commission
IEEE Institute of Electrical and Electronics Engineers
IGMP Internet Group Message Protocol
IOPS input/output operations per second
IP Internet Protocol
IPC Intelligent Power Capability
IPMB Intelligent Platform Management Bus
IPMI Intelligent Platform Management Interface
C.3 K-O
K
KVM keyboard, video, and mouse

L
LC Lucent Connector
LRDIMM load-reduced dual in-line memory module
LED light emitting diode
LOM LAN on motherboard
M
MAC media access control
MMC module management controller
N
NBD next business day
NC-SI Network Controller Sideband Interface
O
OCP Open Compute Project
C.4 P-T
P
PCIe Peripheral Component Interconnect Express
PDU power distribution unit
PHY physical layer
PMBUS power management bus
POK Power OK
PWM pulse-width modulation
PXE Preboot Execution Environment

R
RAID redundant array of independent disks
RAS reliability, availability and serviceability
RDIMM registered dual in-line memory module
REACH Registration Evaluation and Authorization of Chemicals
RJ45 registered jack 45
RoHS Restriction of the Use of Certain Hazardous Substances

in Electrical and Electronic Equipment
S
SAS Serial Attached Small Computer System Interface
SATA Serial Advanced Technology Attachment
SCM supply chain management
SDDC single device data correction
SERDES serializer/deserializer
SGMII serial gigabit media independent interface
SMI serial management interface
SMTP Simple Mail Transfer Protocol
SNMP Simple Network Management Protocol
SOL serial over LAN
SONCAP Standards Organization of Nigeria-Conformity

Assessment Program
SSD solid-state drive
SSE Streaming SIMD Extension
T
TACH tachometer signal
TBT Turbo Boost Technology
TCG Trusted Computing Group
TCM trusted cryptography module
TCO total cost of ownership

TDP thermal design power
TELNET Telecommunication Network Protocol
TET Trusted Execution Technology
TFM TransFlash module
TFTP Trivial File Transfer Protocol
TOE TCP offload engine
TPM trusted platform module
C.5 U-Z
U
UBC Union Bus Connector
UBC DD Union Bus Connector Double Density
UDIMM unbuffered dual in-line memory module
UEFI Unified Extensible Firmware Interface
UID unit identification light
UL Underwriter Laboratories Inc.
UPI UltraPath Interconnect
USB Universal Serial Bus
V
VCCI Voluntary Control Council for Interference by Information
Technology Equipment
VGA Video Graphics Array
VLAN virtual local area network
VRD voltage regulator-down
VROC Virtual RAID on CPU
W
WEEE waste electrical and electronic equipment

WSMAN Web Service Management

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Issue 04 (2024-03-15) Copyright © xFusion Digital Technologies Co., Ltd. i

About This Document

Indicates a hazard with a high level of risk which, if not

Indicates a hazard with a medium risk which, if not

Indicates a low-level hazard which, if not avoided, could

Indicates a potentially hazardous situation which, if not

Supplements the important information in the main text.

Issue 04 (2024-03-15) Copyright © xFusion Digital Technologies Co., Ltd. ii

02 2023-11-30 Added 8 x 2.5" drive pass-through configuration

01 2023-06-21 This issue is the first official release.

Issue 04 (2024-03-15) Copyright © xFusion Digital Technologies Co., Ltd. iii

About This Document.........................................................................................................ii

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5.5.1.7 25 x 2.5" Drive EXP Configurations..................................................................................................... 71

6 Product Specifications................................................................................................ 109

7 Software and Hardware Compatibility....................................................................... 117

9 System Management................................................................................................... 123

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A.6 Sensor List...............................................................................................................................................151

C Acronyms and Abbreviations.................................................................................... 161

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FusionServer 2288H V7 is a new-generation 2U 2-socket rack server designed for

For details about the server nameplate, see A.4 Nameplate.

Figure 1-1 Server with 12 x 3.5" drives (example)

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Availability and Serviceability

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Manageability and Security

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Figure 3-1 Physical structure of a server with 12 x 3.5" drives (example)

1 I/O module 1 2 I/O module 2

5 I/O module 3 6 Supercapacitor holder

7 Air duct 8 Intrusion sensor

9 Front-drive backplane 10 Left mounting ear plate

11 Front drives 12 Right mounting ear plate

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13 Fan modules 14 Fan module brackets

15 Fan board 16 Processor heat sink

17 Processor 18 Cable organizer

19 Mainboard 20 Memory modules

21 TPM/TCM 22 OCP 3.0 NIC

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Figure 4-1 Logical structure

● The server supports one or two new-generation Intel® Xeon® Scalable

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5.1 Front Panel

5.1 Front Panel

Figure 5-1 Front view

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1 Drive 2 (Optional) LCD module

3 Slide-out label plate (with - -

● 12 x 2.5" drive configuration (4 x SAS/SATA + 8 x NVMe)

Figure 5-2 Front view