NZ9F2V4ST5G,

SZNZ9F2V4ST5G SERIES

Zener Voltage Regulators

250 mW SOD−923 Surface Mount
This series of Zener diodes is packaged in a SOD−923 surface
mount package. They are designed to provide voltage regulation http://onsemi.com
protection and are especially attractive in situations where space is at a
premium. They are well suited for applications such as cellular
phones, hand held portables, and high density PC boards.
1 2
Specification Features Cathode Anode
• Standard Zener Breakdown Voltage Range −2.4 V to 18 V
• Steady State Power Rating of 250 mW
• Small Body Outline Dimensions: MARKING
0.039″ x 0.024″ (1.00 mm x 0.60 mm) 2
DIAGRAM
• Low Body Height: 0.016″ (0.40 mm)
• ESD Rating of Class 3 (>16 kV) per Human Body Model 1
X MG
• Tight Tolerance VZ SOD−923
CASE 514AB
G
1 2
• SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable X = Specific Device Code
M = Month Code
• These are Pb−Free Devices G = Pb−Free Package
(Note: Microdot may be in either location)
Mechanical Characteristics
CASE: Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94, V−0
LEAD FINISH: 100% Matte Sn (Tin) ORDERING INFORMATION
MOUNTING POSITION: Any Device Package Shipping†
QUALIFIED MAX REFLOW TEMPERATURE: 260°C
NZ9FxxxST5G, SOD−923 8000/Tape & Reel
Device Meets MSL 1 Requirements SZNZ9FxxxST5G (Pb−Free)
†For information on tape and reel specifications,
MAXIMUM RATINGS including part orientation and tape sizes, please
Rating Symbol Max Unit refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Total Device Dissipation FR−5 Board, PD
(Note 1) @ TA = 25°C 250 mW
Derate above 25°C 2.0 mW/°C DEVICE MARKING INFORMATION
Thermal Resistance from RqJA 500 °C/W See specific marking information in the device marking
Junction−to−Ambient column of the Electrical Characteristics table on page 3 of
this data sheet.
Junction and Storage Temperature Range TJ, Tstg −65 to °C
+150
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. FR−4 Minimum Pad.

© Semiconductor Components Industries, LLC, 2014 1 Publication Order Number:

July, 2014 − Rev. 3 NZ9F2V4S/D
 NZ9F2V4ST5G, SZNZ9F2V4ST5G SERIES

ELECTRICAL CHARACTERISTICS
(TA = 25°C unless otherwise noted,
I
VF = 0.9 V Max. @ IF = 10 mA for all types)
IF
Symbol Parameter
VZ Reverse Zener Voltage @ IZT
IZT Reverse Current
ZZT Maximum Zener Impedance @ IZT VZ VR
V
IZK Reverse Current IR VF
IZT
ZZK Maximum Zener Impedance @ IZK
IR Reverse Leakage Current @ VR
VR Reverse Voltage
IF Forward Current
VF Forward Voltage @ IF
Figure 1. Zener Voltage Regulator
QVZ Maximum Temperature Coefficient of VZ
C Max. Capacitance @VR = 0 and f = 1 MHz

100

80
POWER DISSIPATION (%)

60

40

20

0
0 25 50 75 100 125 150
TEMPERATURE (°C)
Figure 2. Steady State Power Derating

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2
 NZ9F2V4ST5G, SZNZ9F2V4ST5G SERIES

ELECTRICAL CHARACTERISTICS (VF = 0.9 Max @ IF = 10 mA for all types)

ZZT
Zener Voltage IZ = IZT ZZK IZ Max dVZ/dt (mV/k)
VZ Test @ 10% = 1.0 IR @ VR @ IZT1 = 5 mA CpF Max @
Device Current Mod W mA W IZK VR = 0
Device*** Marking Min Max Izt mA Max Max mA mA V Min Max f = 1 MHz
SZ, NZ9F2V4ST5G 2* 2.43 2.63 5 100 1000 1 50 1 −3.5 0 210
SZ, NZ9F2V7ST5G 3* 2.67 2.91 5 100 1000 1 20 1 −3.5 0 210
SZ, NZ9F3V0ST5G 4* 2.94 3.26 5 100 1000 1 10 1 −3.5 0 210
SZ, NZ9F3V3ST5G 5* 3.32 3.53 5 100 1000 1 10 1 −3.5 0 210
SZ, NZ9F3V6ST5G 6* 3.6 3.85 5 100 1000 1 10 1 −3.5 0 210
SZ, NZ9F3V9ST5G A** 3.89 4.16 5 100 1000 1 5 1 −3.5 −2.5 210
SZ, NZ9F4V3ST5G D** 4.17 4.43 5 100 1000 1 5 1 −3.5 0 210
SZ, NZ9F4V7ST5G E** 4.55 4.75 5 100 800 0.5 2 1 −3.5 0.2 150
SZ, NZ9F5V1ST5G F** 4.989 5.2 5 80 500 0.5 2 1.5 −2.7 1.2 130
SZ, NZ9F5V6ST5G J** 5.49 5.73 5 60 200 0.5 1 2.5 −2.0 2.5 115
SZ, NZ9F6V2ST5G K** 6.06 6.33 5 60 100 0.5 1 3 0.4 3.7 110
SZ, NZ9F6V8ST5G L** 6.65 6.93 5 40 60 0.5 0.5 3.5 1.2 4.5 105
SZ, NZ9F7V5ST5G P** 7.28 7.6 5 30 60 0.5 0.5 4 2.5 5.3 100
SZ, NZ9F8V2ST5G Q** 8.02 8.36 5 30 60 0.5 0.5 5 3.2 6.2 90
SZ, NZ9F9V1ST5G R** 8.85 9.23 5 30 60 0.5 0.5 6 3.8 7 80
SZ, NZ9F10VST5G T** 9.77 10.21 5 30 60 0.5 0.1 7 4.5 8 80
SZ, NZ9F11VST5G V** 10.76 11.22 5 30 60 0.5 0.1 8 5.4 9 80
SZ, NZ9F12VST5G Y** 11.74 12.24 5 30 80 0.5 0.1 9 6 10 80
SZ, NZ9F13VST5G 2** 12.91 13.49 5 37 80 0.5 0.1 10 7 11 75
SZ, NZ9F15VST5G 3** 14.34 14.98 5 42 80 0.5 0.1 11 9.2 13 70
SZ, NZ9F16VST5G 4** 15.85 16.51 5 50 80 0.5 0.1 12 10.4 14 65
SZ, NZ9F18VST5G 5** 17.56 18.35 5 50 80 0.5 0.1 14 12.4 16 60
*Rotated 90°.
**Rotated 180°.
***SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP
Capable.

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3
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS

SOD−923
CASE 514AB
ISSUE D
DATE 03 SEP 2020
STYLE 1 STYLE 2
SCALE 8:1
−X−
D NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
−Y− Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
E FINISH. MINIMUM LEAD THICKNESS IS THE
1 2 MINIMUM THICKNESS OF BASE MATERIAL.
2X b 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS.
0.08 X Y 5. DIMENSION L WILL NOT EXCEED 0.30mm.
TOP VIEW
MILLIMETERS INCHES
DIM MIN NOM MAX MIN NOM MAX
A A 0.34 0.37 0.40 0.013 0.015 0.016
b 0.15 0.20 0.25 0.006 0.008 0.010
c 0.07 0.12 0.17 0.003 0.005 0.007
D 0.75 0.80 0.85 0.030 0.031 0.033
E 0.55 0.60 0.65 0.022 0.024 0.026
HE 0.95 1.00 1.05 0.037 0.039 0.041
c HE L 0.19 REF 0.007 REF
L2 0.05 0.10 0.15 0.002 0.004 0.006
SIDE VIEW
GENERIC
2X L MARKING DIAGRAM*

XM XM

STYLE 1 STYLE 2
2X L2
BOTTOM VIEW X = Specific Device Code
M = Date Code
SOLDERING FOOTPRINT* *This information is generic. Please refer to
1.20 device data sheet for actual part marking.
2X
2X
Pb−Free indicator, “G” or microdot “ G”,
0.36 may or may not be present.
0.25
STYLE 1: STYLE 2:
PIN 1. CATHODE (POLARITY BAND) NO POLARITY
2. ANODE
PACKAGE
OUTLINE
DIMENSIONS: MILLIMETERS

See Application Note AND8455/D for more mounting details

*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

Electronic versions are uncontrolled except when accessed directly from the Document Repository.
DOCUMENT NUMBER: 98AON23284D Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

DESCRIPTION: SOD−923, 1.0X0.6X0.37, MAX HEIGHT 0.40 PAGE 1 OF 1

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