Supermicro Liquid Cooling Solutions

Superior Effectiveness of Liquid Cooling with Proven Deployments at Scale

More advanced data center cooling solutions are required to maintain the optimal
operating conditions for today’s data centers’ smooth and efficient operation. As
the rise of AI and big data requires massive amounts of data processing, heat is a
byproduct of the high processing power.
• Switching from Air Conditioning to More Effective Liquid Cooling Reduces
OPEX by more than 40%
- A Switch from Air Conditioners to Liquid Cooling Technology Saves Energy
- Additional power is saved by reducing system Fan Operation
- 1 Year Average Payback on Facility Investment increases the ROI
• Liquid Cooling Efficiency Dramatically Improves the PUE of Data Centers for
High Performance, High Power CPUs, and GPUs
- Liquid is fundamentally more efficient at removing heat by up to 1000X
- Future generations of CPUs and GPUs may require liquid Cooling as air
cooling capacity is exceeded
- The Highest performance and Highest Density servers can be supported,
increasing computing capacity per sq. ft.
• Reduces Costs and Environmental Impact
- Liquid cooling reduces power usage and lowers carbon emissions from fossil
fuel power plants. Reducing the environmental impact of today’s data
centers is becoming a corporate responsibility.

Supermicro’s Rack Integration Services works with customers to architect, design,

build, and test whatever type of liquid cooling is required. Supermicro engineers
work to optimize at the rack level to enable high performance workloads.

Types of Liquid Cooling for your Datacenter that Supermicro Offers:

Direct To Chip – Liquid passes directly

on the surface of a chip and draws heat
away. The liquid is then cooled through
a liquid to liquid heat exchanger, either
contained within the rack or externally.

Immersive Cooling – The entire system

is immersed in a liquid which cools all
components. The warm liquid is then
chilled and brought back into the tank.

Rear Door Heat Exchanger –

The rear door of a rack contains several
fans that draw hot air away from the
servers and cool the air before the air is
returned to the datacenter. The cooling
liquid is then chilled externally to the
door.

January 2023
Supermicro Liquid Cooling Solutions

BigTwin®
The Supermicro BigTwin represents flagship performance for the most demanding
applications and HCI environments. The innovative design supports up to four nodes
in a 2U enclosure with no-compromise support for processors, memory, and I/O. Each
node can support dual 4th Gen Intel® Xeon® Scalable processors, up to 20 DIMMs of
DDR4 memory/PMEM, and up to six high speed NVMe drives. AIOM (superset of OCP 3.0)
networking options include 10GbE, 25GbE, 100GbE, and InfiniBand (200 Gb HDR per port).
Shared power and cooling maximize the resource savings of the multi-node design. D2C
coolers are mounted on the processors within each BigTwin node and routed through a
CDM loop to the Liquid Cooling CDU.

SuperBlade®
A shared cooling, power, and networking infrastructure is key to the high density and server
efficiency offered by the SuperBlade. Supermicro’s high performance, density optimized, and
energy-efficient SuperBlade supports up to 20 blade servers in an 8U chassis, with a choice of the 4th
Gen Intel® Xeon® Scalable processors or 4th Gen AMD EPYC™ processors. With advanced networking
options, including 200G HDR InfiniBand, Supermicro’s new generation blade product portfolio has
been designed to optimize the TCO of critical criteria for today’s data centers, e.g., power efficiency,
node density, and performance. A D2C cooler is mounted on each processor within the SuperBlade
system and routed through a CDM loop to the Liquid Cooling CDU

Hyper
Supermicro Hyper servers are designed to deliver the Hyper Family – The X13 Hyper series
brings next-generation performance to Supermicro’s flagship range of rackmount servers,
built to take on the most demanding workloads along with the storage & I/O flexibility
that provides a custom fit for a wide range of application needs. Supermicro Hyper
systems are available in 1U or 2U versions, with up to 32 DIMM slots. With the cooling
capacity to accommodate the highest performing CPUs, the Supermicro Hyper product
family is optimized for maximum compute performance.

GPU
Supermicro GPU systems are at the heart of today’s AI and HPC excitement by
combining the fastest processors, memory, and GPUs in a family of systems for AI/
ML, Inferencing, and HPC. The 2U, 4U or 8U GPU systems support 4 or 8 NVIDIA®
H100 GPUs together with NVLink® and NVSwitch respectively and are powered by
up to the 4th Gen Intel® Xeon® Scalable processors or up to the AMD EPYC™ 9004
Series processors. In addition, up to 32 DIMMs of DDR4 memory can be installed,
providing an extremely compact and powerful AI or HPC system. Finally, D2C
coolers are mounted on each of the processors and GPUs within the GPU system
and routed through CDM loops to the Liquid Cooling CDU.
Supermicro Liquid Cooling Solutions
Supermicro’s Rack Integration Services, Turnkey Cluster Level Liquid Solutions

Supermicro’s Rack Integration Services leverage application-optimized motherboards, chassis, cooling subsystems, networking
components, cluster management tools, energy-efficient power supply technologies, and compact enclosures to design and develop
customized and enterprise solutions. Supermicro understands the importance of today’s fast pace business problems and customer
requirements; therefore, we offer an end-to-end integration service that helps customers reduce overhead, maximize efficiency and
quality, making this a competitive strategy and a quick go-to-market advantage.

Supermicro works with leading organizations in all geographies to design, install, and test various liquid cooling solutions. The
Supermicro process involves a rigorous set of phases that ensure the most optimized and tested solution for environments where
liquid cooling is required for maximum performance.

Working with Supermicro Experts

Validate your Optimize for Understand Confidence in

Solution Success and Learn the Solution

Proof of Design Technical Cloud/Testing

Concept Workshop Deep Dive Expertise

Five Phases of the Rack Integration Process



1 Design Application Power BOM Rack

Analysis Budget Creation Layout



2 Assembly Node
Assembly
Rack &
Stack
Cabling &
Labeling
Networking
& Power



3 Configuration BIOS Setting

Check
Firmware
Management
Switch & IP
Addresses
OS & Customer
Image



4 Testing Multi-Vendor
Interoperability
Full Rack
Burn-in & QA
Full Rack Test
Report
Performance
Report



5 Logistics Asset Labeling

& Docs
Crating Air-Ride
Trucking
White Glove
Services



Learn more at:

www.supermicro.com/liquidcooling

The information contained in this document is subject to change without notice.

Supermicro, the Supermicro logo, Building Block Solutions, We Keep IT Green, SuperServer, Twin, BigTwin, TwinPro, SuperBlade, SuperDoctor are trademarks and/or registered trademarks of Super Micro Computer, Inc.
All other brands names and trademarks are the property of their respective owners.
© Copyright 2021 Super Micro Computer, Inc. All rights reserved.

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